snapdragon platforms overview feat. msm7x30 chipset (v7)
TRANSCRIPT
Snapdragon platforms overview feat. MSM7x30 chipset
Maxim Birger
October 2010
Agenda
2
Terminology
Snapdragon family roadmap
MSM7230 chipset features and structure
MSM7230 Modem + PoP Memory
QTR8200 Transceiver
PM8058 PMIC
WCN1312 WLAN module
Design with MSM platform
Summary
Terminology
3
SnapdragonTM
Scorpion
Adreno™
- Family of mobile processors by Qualcomm
- Snapdragon Application processor core
- Designed by Qualcomm
- Licensed ARM core architecture
- Utilize ARMv7 instruction set
- 2D/3D Qualcomm’s Graphics technology
Snapdragon family roadmap
4
Snapdragon OS
5
1st Generation
6
Model Max CLK Frequency
Process Availability (ES)
Market
QSD8x50 1GHz 65nm Q4 2008 Nexus One HTC Desire HTC HD2 LG… Dell… Toshiba… Others
X=2 – GSM/GPRS/EDGE; UMTS/HSPA X=6 – GSM/GPRS/EDGE; UMTS/HSPA; CDMA2000 1xEV-DO Adreno 200 GPU
2nd Generation
7
Model Max CLK Frequency
Process Availability (ES)
Market
MSM7x30 800MHz 45nm Q4 2009
HTC Desire
MSM8255 1GHz 45nm Q4 2009 HTC Desire HD
X=2 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+ X=6 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+; CDMA2000 1xEV-DO Adreno 205 GPU
3rd Generation
8
Model Max CLK
Frequency
Process Availability (ES)
Market
MSM8x60 Dual 1.2GHz
45nm Q2 2010
MSM8x70 Dual 1.5GHz
28nm Q2 2011
QSD8672* Dual 1.5GHz
45nm Q4 2010
X=2 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+ X=6 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+; CDMA2000 1xEV-DO Adreno 220 GPU * Smartbooks/tablets oriented
MSM Roadmap
9
Chipset configurations
10
MODEM MSM7230 MSM8255 MSM8260 MSM8270 QSD8672
PMIC PM8058 PM8058 PM8058 + PM8901
PM8921
PM8058 + PM8901
RF QTR8200/ QTR8600/ QTR8601/ QTR8615/ QTR9215
QTR8200/ QTR8600/ QTR8601/ QTR8615/ QTR9215
QTR8615/ QTR9215
RTR8600/ RTR8600L
QTR8615
WLAN WCN1312/ WCN1314
WCN1312/ WCN1314
WCN1314
WCN3660
WCN1314
Other WCD9310
Package 904 NSP PoP, 14x14mm
904 NSP PoP, 14x14mm
976 NSP, 14x14mm
904 NSP PoP, 14x14mm
1249 NSP, 15x15mm
QTR8200 – GSM/UMTS operating bands; QTR8600 – GSM/UMTS/CDMA2000 operating bands; QTR8615 – Rx Diversity; QTR9215 – No Rx Diversity;
Market Milestones
11
Model Release OS Chipset Max CLK Flash RAM Screen Battery
HTC diamond
May 2008 WM6.1 MSM7201A 528MHz 256MB 192MB 2.8’’ 640x480
900mAH
Samsung Omnia
July 2008 WM6.1 Marvell PXA312
624MHz 256MB 128MB 3.2’’ 400x240
1440mAH
HTC Diamond2
Apr 2009 WM6.1 MSM7200A 528MHz 512MB 288MB 3.2’’ 800x480
1100mAH
iPhone 3GS
June 2009 Apple OS Samsung ARM Cortex A8
600MHz 16GB 256MB 3.5’’ 480x320
1220mAH
HTC HD2 Nov 2009 WM6.5 QSD8250 1GHz 512MB 448MB 4.3’’ 800x480
1230mAH
Nexus One Jan 2010 Android QSD8250 1GHz 512MB 512MB 3.7’’ 800x480
1400mAH
HTC Desire Apr 2010 Android QSD8250 1GHz 512MB 576MB 3.7’’ 800x480
1400mAH
iPhone 4 June 2010 Apple OS Samsung ARM Cortex A8
1GHz 16/32GB 512MB 3.5’’ 960x640
1420mAH
Samsung Galaxy
June 2010 Android Samsung ARM Cortex A8
1GHz 2GB 512MB 4’’ 800x480
1500mAH
HTC Desire HD
Oct 2010 Android MSM8255 1GHz 1.5GB 768MB 4.3’’ 800x480
1230mAH
HTC HD7 Oct 2010 WP7 QSD8250 1GHz 512MB 576MB 4.3’’ 800x480
1230mAH
Modu T Nov 2010 Brew QSC6270 230MHz 256MB 128MB 2.2’’ 320x240
500mAH
MSM7230 chipset
12
MSM7230 chipset
13
MSM7x30 chipset key features – Air Interface
14
Cellular radio technologies and standards
TDMA – GSM/GPRS/EDGE
WCDMA – UMTS/HSPA/HSPA+
CDMA/TDMA – CDMA2000 1x + 1xEV-DO releases (MSM7630)
WLAN 802.11 b/g/n
GNSS radio (Global Navigation Satellites Systems)
GPSCDMA_1575MHz (USA) and GLONASSFDMA/CDMA_1598-1610MHz (Russia)
Assisted and standalone mode supported
Bluetooth – compliant with BT 3.0, 2.1+EDR and earlier
FM radio Receiver and Transmitter
FM
MSM7230 chipset key features – Multimedia
15
Multimedia support
HXGA 1024×480 display via RGB interface
FWVGA 860×480 display via MDDI SerDes link
WQVGA 400×240 display via slow EBI2 interface
Analog S-Video output for driving PAL/NTSC TV standards
HDMI 720p (1280×720) video output (requires external HDMI bridge)
Wide variety of Audio and Video codecs
Up to 12MP camera (2-lane CSI SerDes link or parallel CAMIF)
Video Applications – Camcorder, Video player and Video telephony
Digital and Analog Audio ports
MSM7230 chipset key features – Multimedia
16
MSM7230 chipset key features – Connectivity
17
182x General Purpose I/O
3x I2C
4x SPI
2x High Speed UART
4x SDIO
1x HS USB with integrated PHY
1x UICC USB (Mega SIM)
4x Stereo I2S digital audio (including M-I2S: 4 DATA, common CLK/WS)
1x PCM digital audio
User Programmable Logic support 16-bit truth table (via PM8058)
MSM7230 chipset key features – Power & UI
18
Power features
Battery charger
Vibration motor driver
Backlight and Flash drivers
User Interface
Up to 8x8 keypad matrix scanner
5 function joystick
4-wire/5-wire resistive touch panel controller
Light pulse generator – flash/torch/UP modes for fun lights
MSM7230 Mobile Station Modem – Architecture
19
Baseband processing features
ARM1136JS™ embedded microprocessor modem (Up to 400MHz)
Scorpion™ application processor (Up to 800 MHz)
Modem DSP , Application DSP, Air Interface DSPs
Memory controllers
Single/Dual channel DDR1/2 SDRAM via EBI0/1 interfaces (192/333MHz)
8/16-bit NAND flash via 16-bit multiplexed EBI2 (runs at 80MHz)
High performance AHB/AXI on-chip interconnects
Adreno™ graphics GPU, video enc./dec. and A/V codecs
GPIOs and Peripherals
MSM7230 Mobile Station Modem – Architecture
20
PoP Mobile Memory
21
PoP Mobile Memory
22
MSM7x30-0 = MSM + Dual Ch. DDR2 MSM7x30-1 = MSM+DDR1+FLASH
14x14 package 904 NSP Bottom + 240 CSP Top = 1144 total pins
Dual channel DDR2 in PoP with external Flash Single channel DDR1 with Flash in PoP
Best in class multimedia+modem concurrencies Best in class PCB area – modem+AP+memory sys
Default configuration – 256MB LPDDR2 (2x128MB) Default configuration – 256MB LPDDR1 with 512MB NAND Flash
Only external Flash supported PoP flash can be supplemented by external flash
PoP Mobile Memory
23
PoP DRAM/Flash device support
1Gb (128MB) /2Gb (256MB) x32 LPDDR1 SDRAM
2Gb (256MB) /4Gb (512MB) /8 Gb (1GB) x32 LPDDR2 SDRAM per channel
2Gb (256MB) /4Gb (512MB) /8 Gb (1GB) x16 discrete flash
Prototyped by Qualcomm (Samsung)
MSM device Configuration Rank Memory specification
MSM7x30-0 Dual-channel LPDDR2
Single
1Gb (32M×32) LPDDR2 SDRAM + 1Gb (32M×32) LPDDR2 SDRAM
MSM7x30-1 Single-channel LPDDR1 + NAND flash
Single 2Gb (64M×32) LPDDR1 SDRAM + 4Gb (256M×16, NAND flash)
PoP Mobile Memory
24
Memory Channel/Rank possible configurations
PoP Mobile Memory
25
Non-reference memory parts availability (for May 2010)
PM8058 Power Management IC
26
Input power management
VBAT and VDD voltage/current regulation and protection
Charger block
Output power management
5x SMPS, 26x LDOs with different ratings, 1x Negative charge pump
House keeping functions
System Clocks + RTC
Analog multiplexing and scaling + ADC circuits
UI
LPG, Vibrator driver, Joystick + Keypad support, UPL, MIC bias
LEDs, Backlight and Flash current drivers
QTR8200 Transceiver IC
27
Multiband UMTS + quad band GSM operation
GSM/UMTS transmitters and receivers
UMTS bands: LB- 700/800/850/900MHz; HB- 1500/1700/1900/AWS/2100MHz
GSM bands: LB- GSM850/900; HB- DCS1800/PCS1900
GNSS receivers (GPS + GLONASS)
Bluetooth radio
Analog RF transceiver, Digital baseband modem, ARM7 core + memory
FM radio
Analog RF transmitter and receiver, Intel 8051 core + program/data memories
Analog audio input/output channels
Resistive touch panel controller
WCN1312 WLAN module
28
WLAN 802.11 b/g/n
WLAN RF transceiver
Digital baseband modem
Operates on PHY/MAC data packets
ARM9 core + memories
Used for control path processing, power save operations and housekeeping
Clock circuits and SDIO-to-host interface
WLAN/BT coexistence control
Internal power management
Design with MSM platform
29
Design, Manufacturing & Test Complexity
30
BGAs and other heavy parts must be located on one side due to
SMT process constraints
MSM + QTR + PM + WCN + NAND flash + (modu ASIC) + SIM & SD sockets
Complex PCB stack-up and routing
High-Density-Interconnect internal layer routing
Stacked/Staggered micro-vias
Via-In-Pad for most BGA pins
NSMD Land Patterns for best solder joints
PoP memory SMT process and verification
Difficult design validation
Lack of probe accessibility
0.4mm
0.4mm
0.4mm
0.5mm min
Power Consumption – FFA7x30 platform
31
Modem operation (all values in mA)
Non-modem operation (all values in mA)
Measured values from Sep. 2010 and subject to changes
Consumption is highly dependent on OS version and SW optimization
In parentheses () targeted values, after SW optimization, to Sep. 2010
Mode WCDMA CDMA TDMA
Sleep 1.19 1.18 1.19
Talk (2G @ 0dBm; 3G @ 5dBm)
145 (125)
131 (121)
104 (66)
Standby 2.4 (1.7)
2.1 (1.5)
3.3 (1.9)
GPS VGA HD MP3 2D 3D
62 (8.2)
78 (71)
124 (106)
43 (20)
87 (67)
148 (125)
PCB Area Estimation (with WLAN and HDMI)
32
PCB Area Estimation – modu T FF
33
Device D1 [mm]
D2 [mm]
S [mm2]
MSM7230-0 14 14 196
QTR8200 12.6 6.2 78.12
PM8058 7 7 49
WCN1312 7 7 49
NAND flash 195
MOSAIC 7 7 49
Total (major components) 616.12
Without consideration in: Orientation of components RFI/EMI shield areas occupancy Fine pitch BGA Fan-out
Summary
34
Summary
35
MSM7x30 is a powerful platform today!
In a year from now? Two years?
ModuT or small FF can be met under some conditions
Current 500mAH battery may be not enough
LCD size and Battery will determine the physical dimensions
MSM7x30-0 is more adequate choice than MSM7x30-1 when
performance come to mind
MSM8x60 and MSM8x70 platforms will operate high-end mobiles
and QSD8672 tablets, released during 2011-2012
Thank you