sony imx400 tri-stacked image sensor - oic · company profile 6 o sony o cis market forecast o new...
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©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 1
Sony IMX400 Tri-Stacked Image SensorFirst stacked CIS with Logic, Memory and sensing die IMAGING report by Stéphane ELISABETHJuly 2017
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Sony
o CIS Market Forecast
o New generation of CIS?
o Sony XZs Teardown
Physical Analysis 14
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Module 17
Module Views & Dimensions
Module Opening:
Lenses, AF driver & Hall sensor, Plastic Filter
Module Opening: Wire Bonding, BSI, TSVs Process
Module Cross-Section :
Plastic Filter, Wire Bonding, PCB, FOV, Adhesives, FOV
o CIS Die 46
Pads, Pixels, Active Area Overview
Die View & Dimensions
Delayering:
Pixel Array, DRAM, Logic
Cross-Section:
Die Bonding, TSVs, Die Process
Process Characteristics
Physical Comparison 87
o History of Sony’s CIS
Module, Die area, PDAF, Pixel Area, TSVs
Manufacturing Process Flow 93
o Global Overview
o DRAM Front-End Process
o DRAM Wafer Fabrication Unit
o Logic Front-End Process
o Logic Wafer Fabrication Unit
o Pixel Array Front-End Process
o CIS Wafer Fabrication Unit
o DRAM/Logic Circuit Bonding Process Flow
o Pixel Circuit Process Flow
o Pixel Array/DRAM/Logic Circuit Bonding Process Flow
o Optical Process Flow
Cost Analysis 105
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o Circuits Wafer 110
Logic Circuit Front-End Cost
DRAM Circuit Front-End Cost
Pixel Array Circuit Front-End Cost
o Bonded Wafer 113
BSI & TSVs Front-End Cost
BSI & TSVs Front-End Cost per process steps
Color Filter & Microlenses Front-End Cost
Total Front-End Cost
CIS Back-End 0 : Probe Test & Dicing
CIS Wafer & Die Cost
Estimated Price Analysis 121
Company services 125
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodology
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturingcost and selling price of the Sony IMX400.
• This innovative CIS will be the next generation from Sony. The CIS included a 22 Mpixels array, a 1GbDRAM die and a Digital Signal Processing on the same die footprint. This is the first tri-layers stacked CISthat we can found on the market. In this configuration, Sony can provide a fast readout image sensor withno distortion when shooting fast-moving object thanks to the high capacity DRAM between the Pixel Arraycircuit and the DSP circuit.
• Using the Sony’s Exmor-RS and the Xperi’s Zibond technology, Sony managed to integrate the three dies ina single thin, small and cost-effective die sensor. Surprisingly, the die sensor a unique sort of TSV withmultiple level to interconnected the dies.
• This report includes a complete analysis of the Camera module from the Sony Xperia™ XZs, featuringcamera module disassembly and die analyses, processes and cross-section. It also includes a comparisonwith Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level,it compares the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, itcontains a complete cost analysis and a selling price estimation of the CIS die.
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 4
Overview / Introduction
Company Profile & Supply Chain o Sonyo Market Forecasto Next generation of CIS?o Sony XZs Teardown
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost AnalysisSony XZs Opened view
Sony XZs Teardown
Sony XZs Top Flex PCB – Bottom View
Front CameraAmbient Light Sensor
Rear camera Module
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Synthesis of the Physical Analysis
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Physical Analysis Methodology
• Module is analyzed and measured.
• The module is opened to get overall dies data: dimensions, main characteristics, device markings.
o Pictures of selected area are made in order to understand the connections of the CIS.
o Cross section of Module to measure thicknesses and understand the assembly
• The CIS is separated to get overall die data: dimensions, main blocks, pad number and pin out, die marking.
o Removal of metal layers (step by step) to identify the dies and measure the minimum dimensions.
o Pictures of selected areas to identify the nature of the transistors.
o SEM photographs to measure the transistors dimensions.
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Module with Flex View & Dimensions
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Module Opening – Plastic Filter
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Module Cross-Section – Lenses
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die – View & Dimensions
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die – DRAM
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die Cross-Section
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die Cross-Section – Pixel Array
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die Cross-Section – Pixel Array/DRAM Bonding
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die Cross-Section – TSVs DRAM
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
CIS Die Cross-Section – TSVs Recap.
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Moduleo Die Areao PDAFo Pixel Areao TSVs
Manufacturing Process Flow
Cost Analysis
History of Sony’s CIS – Module
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Moduleo Die Areao PDAFo Pixel Areao TSVs
Manufacturing Process Flow
Cost Analysis
History of Sony’s CIS – TSVs
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Wafers Front-End Processo Process Flow
Cost Analysis
Global Overview
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Wafers Front-End Processo Process Flow
Cost Analysis
DRAM/Logic Circuit Bonding Process Flow
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Wafers Front-End Processo Process Flow
Cost Analysis
Pixel Array/DRAM/Logic Circuit Bonding Process Flow
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Circuits Wafer Costo Bonded Wafer & Die Cost
Logic Circuit Front-End Cost
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Circuits Wafer Costo Bonded Wafer & Die Cost
CIS Wafer & Die Cost
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Circuits Wafer Costo Bonded Wafer & Die Cost
Component Cost