Stacked heterogeneous integration (MEMS on LSI)

and open collaboration

Masayoshi Esashi (江刺正喜)

MEMS Core Co. Ltd. (CTO)

Micro System Integration Center (μSIC), Tohoku Univ.

1. Introduction

2. Heterogeneous integration (MEMS on LSI)

3. Open collaboration

(Hands-on access fabrication facility and MEMS showroom)

SITRI Day

(2019/11/12) 1

2

ISFET (Ion Sensitive Field Effect Transistor)(wafer process for reliable assembly)

(M.Esashi & T.Matsuo, Supplement to the J.J.A.P.,44 (1975) 339)

（T.Matsuo, M.Esashi, K.Iinuma, Tohoku

region meeting of Electrical Eng.(1971)）

50µm

10th Heritage, IEEJ(2017)

3Catheter pH, PCO2

monitor (Kurare, Nihon Kohden) (1983)

(K. Shimada (Kurare), M. Esashi

and T. Matsuo et.al.: Application of

catheter-tip I.S.F.E.T. for continuous

in vivo measurement, Med. & Biol.

Eng. & Comput., Vol.18, No.11,

pp.741-745 (1980))

4

Mask aligner Double-side aligner

Oxidation, diffusion furnace Selective etching of Si3N4 and Si

Home-made semiconductor facility in 1975

5

(M.Esashi, Experiences of LSI design, prototyping and education, Convention of IEEJ (1984))

(M.Esashi & M.Ohtomo, Fabrication of functional tester for LSI, Tohoku convention of IEEJ (1984))

Graphic editor programed using

Fortran (I learned programming)

Functional tester

was made in house

(I learned digital

circuit)

Text book, M.Esashi “Fundamentals

of integrated circuit design” (1986)

(in Japanese)

Implantable telemetry CMOSIC(H.Seo, M.Esashi and T.Matsuo, Frontiers of

Medical and Biological Engineering, 1 (1989) 319) 6

(M.Esashi et.al., Technical report on semiconductor and transistor, IEC,SSD85-51, (1985))

Parallel image processor using custom made IC for 2D barrel shifter

Example of parallel image processing

(M.Esashi et.al., Technical report on semiconductor and

transistor, IEC,SSD85-51,(1985))

7

8

MEMS process facility for 20 mm waferMany process equipment have been made in house.

Simple and basic equipment are suitable for training people who have experiences of all the process steps and for developing new devices taking advantages of process flexibility.

The facility has been shared by many laboratories.

130 companies dispatched researchers (full time, 2years).

Unique facility like toy

for MEMS prototyping

9

Dispatched researchers from company (1991-2002),

130 companies (1990-2013)

10

Resonating gyroscope (yaw rate sensor) and

accelerometer for vehicle stability control

1992-1997

Two researchers from Toyota

stayed in Tohoku University for

collaborative development of

vibrating gyroscope

(M.Nagao et.al.,SAE World Congress, Detroit, (2004) 2004-01-1113)

Yaw rate sensor has been produced in Toyota since 2003

and used in more than 1 million cars.

11

Resonating gyroscope

fabricated using Si deep RIE

Si deep RIE system(M.Takinami, K.Minami and M.Esashi, 11th Sensor symposium, (1992),15-18)

(J.Choi, K.Minami and M.Esashi, Microsystem

Technologies, 2, 4 (1996) 186-199)

12

Rotational gyroscope levitated

electrostatically using high speed

digital signal control

MESAG-100 (Micro Electrostatically Suspended Accelerometer Gyro)(Simultaneous measurement of 2 axes rotation and 3 axes acceleration)

(T.Murakoshi, Y.Endo, K.Sigeru, S.Nakamura and M.Esashi, Jpn. J. Appli. Phys., 42, Part1

No.4B (2003) 2468-2472)

Rotor diameter1.5mm 74,000rpm

13

Application of the electrostatically levitated gyro

to motion logger used for subways in Tokyo

14

Ranging imager for

safety systems and

other applications

(T.Ishikawa,H.Inomata : Japan Signal

Technical Report, 33, 1 (2009) 41)

２-axes optical scanner (Nippon

Signal)

(N.Asada (Nippon signal), M.Esashi et.al.,

IEEE Trans. on Magnetics, 30 (1994) 4647)

Ebisu station (platform doors

using the ranging imager)

3D imager (LIDAR)

for autonomous

drive

15

(Y.Matsumoto, S.Shoji, M.Esashi, 22nd Conf. on Solid State Devices and Materials (1990) 701)

Integrated capacitive pressure sensor (Toyoda Machine Works)

Wafer level

packaging

16

Integrated capacitive pressure sensor(Y.Matsumoto, S.Shoji, M.Esashi, 22nd Conf. on Solid State Devices and Materials (1990) 701)

17

Diaphragm vacuum gage (Canon ANELVA)

Vacuum packaging

(H. Miyashita and Y. Kitamura : Micromachined capacitive diaphragm, gauge,

ANELVA Technical Report, 11, pp.37-41 (2005) (in Japanese))

Canon Anelva Inc.

The getter absorbs oxygen gas generated by

an electrochemical decomposition of glass

during anodic bonding process.

18

MEMS switch factory(Advantest components (Sendai))

MEMS switch for LSI tester(Advantest)

(A.Nakamura (Advantest), M.Esashi et.al.,

Advantest Technical Report, 22 (2004), 9-16)

Immune to electrostatic discharge up to 1000V

Wide frequency range (DC~10GHz)

19

MEMS have moving parts → Direct

molding with plastics can not be

done.

Wafer level packaging

→ small size (chip size encapsulation,

suitable for surface mounting)

→ high yield (protection of MEMS

structures during dicing)

→ high reliability (hermetic sealing)

→ low cost (minimal investment for

assembly, no use of expensive

ceramic packages etc.)

⇒ 70% cost reduction

(M.Esashi, J of Micromechanics and Microengineering,18 (2008) 073001)

20

(S.Kobayashi & M.Esashi, Technical Digest of the 9th Sensor Symposium,(1990),137)

Common 2 wires tactile sensor array (polling type)

(1,000 Tr./chip in our lab., 1,000,000 Tr./chip in company in 1990, 10,000,000,000

Tr./chip in 2018)

21

1. Introduction

2. Heterogeneous integration (MEMS on LSI)

3. Open collaboration

(Hands-on access fabrication facility and MEMS showroom)

Tactile sensor network for robot (event driven type)

(M.Muroyama, M.Makihata, M.Esashi et al., Smart Systems Integration (SSI) 2014, (2014))

2.4mm

22

LSI wafer shared by 16

companies and 10 laboratories

23

(M.Muroyama, M.Makihata et al., Smart Systems Integration (SSI) 2014, Vienna, Austria (2014, March 26))

Tactile sensor network(Collaborators, Toyota, Toyota

Central Res. Lab.)

Real time system using packet communication

24

Concept of the heterogeneous integration by the wafer-level transfer

(M.Esashi and S.Tanaka : Stacked Integration of MEMS on LSI, Micromachines

2016, 7(8), 137; doi: 10.3390/mi7080137]

25

Heterogeneous integration

(a) Surface

micromachining

(Limitation in

MEMS process)

(b) Assembly of

packaged MEMS and LSI

(Limitation in

interconnection)

(c) Transfer of MEMS

on LSI

(d) Interconnection

Between MEMS and

LSI with Through Si Via

(TSV)

(M.Esashi and S.Tanaka, Micromachines 2016, 7(8), 137; doi: 10.3390/mi7080137)

26

Multi SAW (Surface Acoustic Wave) filters on LSI by selective transfer

(S. Tanaka, M. Yoshida, H. Hirano and M. Esashi, 2012 IEEE International Ultrasonics

Symposium (2012) p.1047 ).

Selective transfer process by laser debonding

Selective laser de-bonding

(H.Hirano, T.Kimura, I.P.Koutsaroff, M.Kodato, K.Hashimoto, M.Esashi and S.Tanaka, J. of

Micromech. Microeng., 23 (2013) 025005)

Tunable SAW filter using ferroelectric varactor

27

Film transfer

BST : Barium Strontium Titanate

Cs ↑Cp ↓⇒

⇒

Multi SAW filters

on LSI

Piezoelectric (PZT) MEMS

switch on LSI

Multiband wireless communication system to be

available in disaster (Tsunami) using white spaces of digital TV

Tunable SAW filter

using BST varactor

5 ⇔ 11 ⇔ 22MHz

28

FBAR on LSI for voltage

controlled oscillator

TV white space cognitive radio (IEEE 802.11af)29

(Collaborators : NICT, Murata Manufac.,Taiyo Yuden, Asahikasei electronics, Denso, Chiba Univ. ...)

30

(A.Kochhar, T.Matsumura, G.Zhang, R.Pokharel, K.Hashimoto,

M.Esashi, S.Tanaka, 2012 IEEE Ultrasonics Symp., 5E-3)

CMOS-FBAR voltage controlled oscillator

31

PZT MEMS Switch on LSI

(K.Matsuo, M.Moriyama, M.Esashi and S.Tanaka, IEEE MEMS 2012, 1153-1156)

Displacement : 5μm / 10V

PZT : Lead Zirconate Titanate Piezoelectric material

32

Boron doped diamond (BDD) electrode array (20×20) on LSI for amperometric

biosensor (Bio-LSI)

(T.Hayasaka, S.Yoshida, K.Y.Inoue, M.Nakano, T.Matsue, M.Esashi, and S.Tanaka,

J. of Microelectromechanical Systems, 24, 4 (2015) 958-967)

33

Screening of medicine for cancer cells

by measuring oxygen reduction current

2D imaging of histamine diffusion

(K.Y.Inoue, M.Esashi, T.Matsue et.al., Lab on a

chip, 15 (2015) 848 – 856)

Application of the Bio-LSI for

measuring histamine concentration

34

100×100 active matrix

nc-Si emitter array

10 beams

Concept of massive parallel electron beam exposure system using nc-Si emitter

10 Tr. / wafer

=10 times / 10 beams

12

8 4

4

(M.Esashi, A.Kojima, N.Ikegami, H.Miyaguchi and N.Koshida, Microsystems & Nanoeng. , 1 (2015) 15029)

Nano crystaline (nc) Si emitter

(A.Kojima et.al., Proc. SPIE Alternative Lithography

Technologies V, 8680 (2013) 868001-868017) 35

36

nc-Si emitter array with

TSV and 100×100 active

matrix LSI

(N.Ikegami, T.Yoshida, A.Kojima,

H.Miyaguchi, M.Muroyama,

S.Yoshida, K.Totsu, N.Koshida,

M.Esashi, IEEE NEMS (2016) C2L-B-

5)

(H.Miyaguchi, A.Kojima, N.Ikegami,

M.Muroyama, S.Yoshida,

N.Koshoida and M.Esashi,

IEEE NEMS (2016) A1L-B-2)

37

Driver circuit for 1

electron source in

100×100 array

(M.Esashi, A.Kojima, N.Ikegami,

H.Miyaguchi and N.Koshida,

Microsystems &

Nanoengineering (2015) 1,

15029(1-8))

38

Book “Development of massive

parallel electron beam drawing

- for digital fabrication of LSI”

published in June 6, 2018

Prototype of EB write system with 100×100 active matrix emitter array

39

1. Introduction

2. Heterogeneous integration (MEMS on LSI)

3. Open collaboration

(Hands-on access fabrication facility and MEMS showroom)

Semiconductor Research Institute (1961~2008)

Prof. emeritus

Jun-ich Nishizawa

40Nishizawa memorial research center

41

Shared facility for industry to prototype MEMS devices (4 / 6 inch)

Hands-on-access fab.

Companies which can not

prepare their own facility

dispatch their employees to

operate equipment by

themselves for development

and small volume production.

Assoc. Prof. K.Totsu

Companies are

allowed to sell

MEMS devices

produced in the fab.

(since July 2013)

Layout of the Hands-on access fab. for 4/6 inch wafer

Equipment used

for transistor

production until

2008 (Tokin)

Newly

Installed

Donated by

industry

Transferred

from other

lab

42

43Users of the Hands-on-access fab.

Hands-on-access fab. users44

45

Pulse quantum cascade laser developed

using the Hands-on-access fab.

(Hamamatsu Photonics)

Commercialized MEMS using

the Hands-on-access fab.

46

47

Sendai MEMS showroomHistorical museum of technology

Business matching room

Process equipment display room

Exhibition rooms in Jun-ichi Nishizawa Memorial Research Center

http://www.mu-sic.tohoku.ac.jp/nishizawa/

Historical Museum of Technologyhttp://www.music.tohoku.ac.jp/museumE/index.html

48

49

Desk J : Infrared imager, Range imager using optical scanner

Case A : Imaging and optical mems, RF MEMS

Case B : Pressure sensor, Microphone, Accelerometer

Case C : Gyroscope, Micro-nanomachining

Rack K : Design and fabrication of CMOSLSI

Desk L : Semiconductor ion sensor (ISFET)

Case D : Micro sensors for medical applications

Case E : Micro fluidics, Heterogeneous integration, Harsh

environment devices

Case F : Power MEMS, Actuators

Case G : Fraunhofer institute

Desk M : iCAN (MEMS application contest)

Desk N : 8×8 Infrared sensor arry

Case H : Open collaboration with MEMS PC and μSIC

Case I : IMEC

Rack O : Awards

http://www.mu-

sic.tohoku.ac.jp/showroom_e/index.html

Sendai MEMS showroom

(MEMS Park Consortium (MEMSPC))

50

Filed papers which can be retrieved by key words

Total 500 files

51

Parts which can be retrieved by key words

52

MEMS Seminar in Tokyo (Aug. 23-25, 2006) 280 attendees

MEMS Seminar in Sendai (Aug. 22-24, 2007) 75 attendees

MEMS Seminar in Fukuoka (Aug.20-22, 2008) 150 attendees

MEMS Seminar in Nagoya (Aug.4-6, 2009) 100 attendees

MEMS Seminar in Tsukuba (Aug.5-7, 2010) 211 attendees

MEMS Seminar in Kyoto (Aug.9-11, 2011) 175 attendees

MEMS Seminar in Tokyo (Aug.22-24, 2012) 226 attendees

MEMS Seminar in Tsukuba Univ.(Aug.7-9, 2013)110 attendees

MEMS Seminar in Osaka (Aug.5-7, 2014) 140 attendees

MEMS Seminar in Toyohashi (Aug.5-7, 2015) 161 attendees

MEMS Seminar in Sendai (Aug.3-5, 2016) 116 attendees

MEMS Seminar in Kawasaki (July 31 - Aug.2, 2017) 181 attendees

MEMS Seminar in Toyota Inst. of Tech. (Aug.2 - 4, 2018) 72 attendees

MEMS Seminar in Kawasaki (July 29-31, 2019)

MEMS intensive course (Free)

11th MEMS Engineer Forum (April 25-26, 2019) (Ryogoku, Tokyo) 829 attendees in 2 days

12th MEMS Engineer Forum (April 22-23, 2020) (Ryogoku, Tokyo) http://www.m-e.-f.info/

MEMS Park Consortium (MEMSPC) （http://www.memspc.jp）

53

MEMS Training Program in Sendai MEMS PC

Since Apr.2007. Fee 1 million yen. Trainee participate with own subject.

16 companies participated.

Planning,

design

Fabrication

(4 inch process)Testing

Presentation,

report

10 ~ 20 d 30 ~ 60 d ~ 10 d 3 d

Lectures on Internet

School

3 months

Design Training of Fabrication Example of

development and

commercialization

(Pressure sensor)

FhG Germany – Sendai city partnership

signing ceremony in Munich (July15,2005)

FhG Germany – WPI-AIMR Tohoku Univ.

partnership signing ceremony in Sendai

(Nov. 8, 2011)

FhG Project center in WPI-AIMR, Tohoku

Univ. (April 1, 2012)

Collaboration with FhG

(Fraunhofer Institute) in

Germany

1st Fraunhofer Symposium in Sendai

“Doing Worldwide Business via MEMS

technology” (Oct.19, 2005)

13th Fraunhofer Symposium in Sendai

(April 15, 2019)

54

55

(J.Froemel et.al. (ENAS, Fh.G), J. of Microelectromechanical Systems, 24 (2015) 1973)

50℃

Low temperature SLID (Solid-Liquid Inter-Diffusion) bonding with Cu- Ga

Old method to fill an eroded tooth (amalgam method)

(UV curable resin at present)

Cu powder + Hg → Solidify (Metallic compound)

Electroplating of Ga

Cu

GaCuGa2

Signing ceremony (2012/6/11)

Strategic PartnerTohoku U ⋅ Stanford U ⋅ EPFL

Tohoku U

Stanford U“your lab and imec are very

complementary” Rudy Lauwereins,

Vice-President of IMEC

56

2012/6/21 Seminar at IMEC 2013/11/8 Seminar in Sendai 2014/11/12 Seminar at IMEC

(IMEC M.Yoneyama 2012/6/12)

2015/11/12 Seminar in Sendai

Collaboration with IMEC

MEMS core Co.Ltd.

(Contract development)

Advantest component Co.Ltd.

(Contract production)

Micro System Integration Center

(Tohoku Univ.) (Hands-on access fab.) Faculty of Eng. (Tohoku Univ.)

(Initial stage prototyping)

MEMS Park

Consortium

(MEMSPC)

57

Company

Open collaboration by MEMSPC in Sendai

58

“3D and IC integration of MEMS” Wiley-VCH (2020)

Introduction

1 Overview (M. Esashi (Tohoku Univ.(Japan)))

System on chip

2. Bulk micromachining (X. X. Li (SIMIT(China)))

2 supplementary. Packaging-stress-suppressed suspension technology (X. X. Li (SIMIT(China)))

3. Poly Si surface micromachining and integrated inertia sensor (M. Judy (Analog Devices (USA)))

3 supplementary. Epitaxial poly Si micromachining (M. Esashi (Tohoku Univ.(Japan)))

4. Poly SiGe surface micromachining (C. Low (InSense Inc. (USA)))

5. Metal surface micromachining (M. Sasaki (Toyota Tech. Inst. (Japan)))

6. MEMS using CMOS wafer (W. Fang (Nat. Tsing Hua Univ.(Taiwan)))

7. Wafer transfer (M. Esashi (Tohoku Univ.(Japan)))

8. Piezoelectric MEMS (T. Kobayashi (AIST(Japan))))

8 supplementary. Heterogeneously Integrated Aluminum Nitride MEMS

Resonators and Filters (G. Piazza (Carnegie Mellon Univ. (USA)))

Bonding, sealing and interconnection

9. Anodic bonding (M. Esashi (Tohoku Univ.(Japan)))

10. Direct bonding, (Hideki Takagi (AIST (Japan))

11. Metal bonding (J. Froemel (Tohoku Univ. (Japan)))

11 supplementary 1. Reactive bonding (J. Froemel (Tohoku Univ. (Japan)))

11 supplementary 2. Soldering by local heating (L. Lin (U. C. Berkeley (USA)))

12. Polymer bonding (F. Niklaus (KTH (Sweden)))

13. Episeal (A. Prtridge (SiTIME (USA)))

14. Buried channels in monolithic Si (K. Maenaka (Univ. of Hyogo (Japan))

15. Through-Substrate-Vias (Z. Wang (Tsinghua University (China))

16. Packaging, sealing and interconnection (M. Esashi (Tohoku Univ.(Japan)))

16 supplementary. Vacuum packaging (M. Esashi (Tohoku Univ.(Japan)))

59

Prof. Prof. Prof. Assos.Prof. Assos.Prof. Assos.Prof.

Takahito Shuji Yoichi Kentaro Masanori Shinya

Ono Tanaka Haga Totsu Muroyama Yoshida

(NEMS) (RF MEMS) (Medical (Open (LSI design)(Piezo MEMS)

applications) collaboration)

Acknowledgment to collaborators

Asso. Prof.

Jörg Frömel

(Fraunhofer

project center)

Basics of MEMSby M.Esashi (Morikita

shuppan, 2009)

Future MEMS -

Fusion with LSI -by M.Esashi and T.Ono

(Morikita shuppan,

May, 2016)

(in Japanese)