tdk sesub bluetooth module - system plus consulting · • embedded die market is still in an early...

©2017 System Plus Consulting | TDK SESUB Bluetooth Module 1

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Table of ContentsOverview / Introduction 3

o Executive Summaryo Reverse Costing Methodology

Company Profile 7o Embedded Die Marketo TDK Company Profileo SESUB Presentationo SESUB Supply Chaino SESUB Production Locationo SESUB Capacityo SESUB Roadmapo SESUB-PAN-D14580

Physical Analysis 20

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Module

Module Views & Dimensions

Module Opening

Module Delayering

o IC Die View, Dimensions & Marking Delayering & Main Blocks Identification Process Cross-Section

o Module Cross-Section Overview Complete PCB Vias Die Edges RDL Copper Reveal

Manufacturing Process Flow 51o Global Overviewo IC Processo IC Fab Unit Descriptiono SESUB Process Flowo SESUB Fab Unit Descriptiono Module Assembly Processo Module Assembly unit Description

Cost Analysis 65o Synthesis of the cost analysiso Yields Explanation & Hypotheses

o IC Die IC Front-End Cost IC Wafer Cost IC Die Cost & Price

o SESUB Packaging SESUB Panel Cost SESUB Panel Cost per process steps SESUB Cost per Module

o Module Passives Components Cost Final Assembly Cost Final Assembly Cost per process steps Final Assembly Cost per Module Module Cost

Estimated Price Analysis 83

o Manufacturer Financial Ratios

o Module Manufacturer Price

Company services 86


O V E R V I E WMETHODOLOGY


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• Embedded die market is still in an early phase, but in 2021 the revenues will reach 50 million dollars with a CAGRfor consumers applications in the range of 45% according to Yole Développement.

• With the SESUB-PAN-D14580 module, TDK released the world's smallest Bluetooth 4.1 low energy (LE). Withdimensions of 3.5mm x 3.5mm, it offers a footprint reduction of 60% compared to modules with discretescomponents. Thanks to its miniature size and low current consumption, the module is ideal for use in battery-powered wearable devices, where small size, light weight, and low power consumption are essentialrequirements.

• The module is packaged with TDK's SESUB (semiconductor embedded in substrate) technology, embedding aDialog Semiconductor DA14580 Bluetooth chip into a 4-layer PCB substrate and featuring an integrated DC-DCconverter. This technology extends the package size beyond the IC surface area and allows for mountingadditional passives components on top of the laminated module.

• SESUB is a Chip-First Face-Up process where all the packaging steps are realized internally at the panel-scale levelby TDK and more recently also by ASE since they announced a joint venture to support the Embedded Die SESUBtechnology. With this packaging approach, TDK considerably changed the conventional supply chain model, wherethe chip maker sells directly to the system maker. Here the module maker is taking a larger role by addingconsiderable value.

• The report includes an in-depth physical analysis of the Bluetooth module, and a complete description of themanufacturing process flow. For the first time, the cost estimation of the module has been realized in partnershipwith SavanSys Solution to provide an even more detailed cost analysis.


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary


Physical Analysis


Cost Analysis


About System Plus

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

The reverse costing analysis is conducted in 3 phases:

Reverse Costing Methodology

Cost analysis realized in partnership with SavanSys Solution


Overview / Introduction


Physical Analysis o Synthesiso Module Dimensionso Module Openingo Passives Componentso Package Delayeringo IC Die Viewo IC Die Processo IC Die Cross-Sectiono Module Cross-Section


Cost Analysis


About System Plus

Module View & Dimensions

Package Top View©2017 by System Plus Consulting

Package Bottom View©2017 by System Plus Consulting

Package Side View©2017 by System Plus Consulting

3.5mm

3.5

mm

1.0

mm

• Package: SESUB BGA 36-pin

• Dimensions: 3.5 x 3.5 x 1.0 mm

• Pin Pitch: 0.5mm

• Marking:

W0015

5AD776

7E

E68






Cost Analysis


About System Plus

Passives Components






Cost Analysis


About System Plus

Module Delayering






Cost Analysis


About System Plus

IC Die View & Dimensions






Cost Analysis


About System Plus

Module Cross-Section Overview

Cross-section – SEM View©2017 by System Plus Consulting

Cross-section plane






Cost Analysis


About System Plus

Module Cross-Section – Via 2




Physical Analysis

Manufacturing Process Flowo Global Overviewo Dialog DA14580 Processo IC Wafer Fabrication Unito SESUB Processo SESUB Fabrication Unito Final Assembly Processo Final Assembly Unit

Cost Analysis


About System Plus

SESUB – Process Flow (1/5)




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso IC Costo SESUB Costo Passives Costo Assembly Costo Module Cost


About System Plus

IC Front-End Cost




Physical Analysis




About System Plus

SESUB Panel Cost




Physical Analysis




About System Plus

SESUB Panel Cost per process steps (1/2)




Physical Analysis




About System Plus

Final Assembly Cost




Physical Analysis




About System Plus

Module Cost

tdk sesub bluetooth module - system plus consulting · • embedded die market is still in an early...

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