4. 0.3 ()

DRAM

959697'9899000102030405 06 ~ 10 () 0.35 0.25 0.2~0.18 0.13 0.10DRAM 16M 64M 256M~1G 4G 16G 200mm 300mm 400mm 0.1 0.07 0.05 0.02 0.01 0.45 0.35 0.25 0.15 1X1010 / 2X109 /

1EA/ml (0.1 )1EA/ml (0.5 ) 1EA/ml (0.02 ) / () 1 2~2.5 1 2

Clean Room level Wafer level WaferMicro contaminationControl Cluster C/R InfraC/R Total ContaminationControl SystemMINI - ENVIRONMENT - Contamination Free Manufacturing- - High yield300mm FAB CLEAN ROOM NEED

198619891992199519982001200420072010(m)1.30.80.50.350.250.180.130.100.07(DRAM)1M 4M16M64M256M1G4G16G64G

(CTM) Clean Tunnel Module

FFU

SMIF

Intg Mini Enc.

2.

()()( ,,) 3. 2. [%]

1980 1985 1990 401010402030203010 404010

() , 4 .

-- - -- - - ---- - -

- - - - - - - - - - - - -

- - -

Air ionization systemFan Filter UnitSMIF systemChemical air filterBoron clean filter Clean Tube System

Mini-Environment

+

( ) ( )

Know-how

5

Room layout , , cleaning (clean paper ) class clean bench , carrier box air shower pass box

2.

( ) /

1.

(dry etching, CVD ) () (PVD, CMD ) sputtering / , , /vent , , ( , )/ , , photoresist, , , , (cleaning)

7.

CVD Sputter Photo lithography SEM Dry Etching SEM , Cleaning CVD Sputter . Water Mark Water Mark .

8. /

0.10.5~0.1 0.2~0.3 45/61~3/60.2~1/6 QC ( ) ( )

5. Wafer Surface ScannerISPM

capabilityWafer Surface ScannerIn Situ Particle MonitorOn-wafer (all defects)yesnoDefect locationOn waferyesno

Full cycleyesno

LocalnoyesReal-timenoyes

Continuousnoyes

productYes/noyes

1. 2. * * *

Fig. 2-9 Airflow velocity effect on the average deposition velocity

FIGURE 5. Comparison of the model predictions With numerical and experimental data of Opiolka et al.(1990)FIGURE 6. Minimum temperature difference Required for = 10-4 and 10-5 cm/

4. exhaust line ISPM 8. ISPM

ISPM . (non-sampling)Sheath air focusing Non-focusing100% 100%

(a) Uniform case (20 Torr) Time (sec) (b)Non-Uniform case (5 Torr) Time (sec) Particle Count(#/sec)Particle Count(#/sec) 15. ISPM

Figure 16. Aerodynamic Lens

18. ISPM (aero-dynamic lens ) 18. ISPM (1 areo-dynamic lens )

Figure 20. ISPM (3 aero-dynamic lens ) 5.

ParticleContaminantsMolecularContaminants 1G : ~ um2G : um~0.1um2~50 Hard particleMolecular Control with Air filterUPLA, HEPA, Chemical FilterNOT control withAir filter, Nitrogen, Visual ContaminationNon-Visual

6. (ASS : Air Scrubbing System)

Short-TemMid-TemLong-Tem ASS Mini-ASSUV- Bulk Process