計画研究 b01 di!erence in pixel size or structure -> xrpix2 [3] - event-driven readout mode...
TRANSCRIPT
鶴 剛(京大)[email protected]
森浩二(宮崎大),幸村孝由(工学院),田中孝明(京大)中島真也,松村英晃(京大),武田彩希,新井康夫(KEK)
20131213_SOI新学術WS_B01_XRPIX_v0.key
計画研究 B01
宇宙最初期ブラックホールの探査研究を実現する衛星搭載
X線精密イメージングの開拓
1
Neal Jackson, STScI and NASA
電波
Chris Carilli and NRAO/AUI X線A. Wilson & A. Young, P. Shopbell, CXC, NASA
白鳥座A
50万光年
超巨大ブラックホール(太陽の100万倍から10億倍)
銀河の中心のブラックホール
銀河とブラックホールの共進化
銀河:地球BH :砂粒
2
最も暗いのが初期BH
SOIPIX
CCD
ざらざらは全て背景ノイズ
学術的背景 3宇宙初期
現在
宇宙最初期BH = 中質量BH
第1世代の星恒星質量BHや星の合体
原始BH
これを発見する
超巨大BH
Trajectory of particles inside the CCD
Irradiation of 1-MeV electrons onto the CCD
Non X-ray background of Suzaku XIS (BI)
Due to high energy particles on orbit.
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X線SOIPIX素子 (スタック)
視野
非X線バックグラウンド
(宇宙線が作る2次的放射線)
アクティブシールド
硬X線 軟X線
衛星搭載のFPGA・計算機 ● イベント駆動読み出し ● 非同時計数 (非X線BGDの除去) ● X線エネルギー・位置・時刻計測
1分
SOIPIX:イベント駆動読み出し型
• 反同時計数 ⇒ 背景ノイズ2桁下げる.
• X線が到達した瞬間にトリガ出力.
• アクティブシールドが同時に信号出力⇒宇宙線だと判断し,捨てる.
• アクティブシールドが同時に信号無し⇒X線だと判断し,アナログ信号処理
• 他の性能:撮像,分光(読み出しノイズ),検出感度はCCDと同等(以上).
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XRPIX Series - Road Map -6
XRPIX1 XRPIX1b
2.4 mm 2.4 mm
1.0mm1.0mm
XRPIX2b
4.5mm
6.0 mm
XRPIX2
6.0 mm
4.0mm
First ModelTrigger Output
2.9 mm 2.9 mm
XRPIX3 XRPIX3b
5A-R-Tec PROPRIETARY/CONFIDENTIAL
� �� ������������
2.4mm
2.4mm XRPIXΔΣ-type
ADC
2.4 mm
Middle Size ButtableCharge
Sensitive AMP
1.0mm 1.0mm
2010 2011 2012 2013 2014
10μsec
75年間の目標:衛星搭載品を直ちに製造開始項目 目標 現状 テクノロジ
超低BGD5e-5 c/s/
keV/10mm角
不明トリガ出力: OK
アクティブシールド: 未
広帯域 0.3 - 40keV 1.5 ? - 40keV>300μm: OK
裏面不感層0.1μm: 未
精密分光要求 <10e-
ゴール < 3e-
64e- (rms)XRPIX2 SmallPix
True-CDS: 未 プリアンプ: 未Built in ADC: 未 裏面のCCE
暗電流 <2pA/cm2200pA/cm2
(-40℃)回路からの(?)リークを下げる
精密撮像 30-60μm30.6μm, 61.2μm
ピクセル内のCCE
広視野 20mm角 3.9mm角モザイク可能(XRPIX2b)
デッド領域は出来るだけ小さく.
裏面CCE: A01班,二重活性層によるイベント駆動True-CDS: A02班
1分
チーム(cf. 申請書)• 全員X線天文分野,X線CCDの経験あり
• 鶴 剛(京大):総括,X線素子開発
• 森浩二(宮崎):硬X線性能評価
• 幸村孝由(工学院):軟X線性能評価
• 田中孝明(京大):イベントドリブン読み出し,バックグラウンド評価
• 中嶋大(阪大:連携):ADC
• FY2014から,KEK 武田彩希さんをPDとして雇用(京大)素子・回路等の設計・製作,性能評価
• 各大学での大学院生.修論1本/年(京大)を目指す.
• B01チームで,投稿論文2本/年を目指す.
8
1分
難しいと思っている事
• 最大の難関:低ノイズ化.要求=10e-(rms),ゴール=3e- (rms)
• 逐次読み出しではなく,イベントドリブン読み出しで実現.
• トリガも低い閾値ではなければいけない.目標 = 0.3keV.
• 裏面の不感層と電荷収集効率(CCE)
• いくつか有望な方法を試す
• 1keV以下のX線の評価
• 実験室で手軽に強く質の良い軟X線を得る方法.
• まだ手を付けていない事への不安(暗電流,BGD,大型化)
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XRPIXの紹介と現在
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XRPIX1: Pixel Circuit
STORE
CDS C100fF
Sample C100fF
Sensor
Triggeroutput
Trigger
CDS
Comparator
CDS _VRST VTH
VDD18
PD_VRST
COL_AMP OUT_BUFSF2
SF1
VDD18
GND18
GND18
Sample/Store
Sensor C
Analogoutput
Analog Readout
G=1 G=1
TEST_ECA EOXX
11ピクセル回路
XRPIX1b-CZ : Event Driven Readout
・
COL Hit Add. Resister
Row H
it Add.
Resister
COL Readout ADDRCOL Amp
ROW
Rea
dout
AD
DR
TRIG_OOR
TRIG_COL
TRIG_ROW
A_OUT
①① ②
X-ray !
FPGA
ADC
Takeda et al., IEEE Accepted (2012)
③
④
④
⑤
12イベント駆動
TRIG_OUT
SCLK
CA[151-0]
RA[151-0]
Trigger !
Address of Triggered Pixel
Trigger Address Readout Clock
Row Column
4μsec
Takeda et al., IEEE (2013)
- Event-driven mode basically operates.- Capacity of event rate >1kHz.- The gain is different. There is offset.- Due to interference between analog and digital circuits
XRPIX2b-CZ : Event-driven Readout Mode 13
Puls
e H
ight
(ch
)
X-ray Energy (keV)
Event-Driven5.4 μV/e-
Offset
Frame-Mode7.0 μV/e-
Fe-55 (5.9keV)
Pulse Hight (ch)
Note: Pixel gain is not calibrated.
Preliminary
Preliminary
22keV X-ray detectionCd-109
イベント駆動
XRPIX1b-FZ(2012)-FI (7kΩcm) : Depletion Depth
back_bias� 200V�
• Counting Rate of 22keV X-ray (Cd-109) as a function of VBB.(Attenuation Length = 1200μm > Physical Thickness = 500μm.)
• The data follow the expected slope of depletion ∝ VBB^1/2.
• Full Depletion of 500μm is reached at VBB=200V. 20130502_matsumura.pdf
Depletion ∝ VBB^1/2
14
Preliminary
Physical Thickness 500μm (not 260μm)Counting Rate of 22keV X-ray
200V
空乏層
QE of LBNL’s BI-SOIPIX / SOImager-2-CZ-BI
Deplation 73±2μm
Dead Layer 0.6±0.2μm
Battaglia+12 NIM-A
※ これは我々の素子ではなく,同じウェハを使用した別の素子です.
15LBNL “Pizza Process”裏面照射
XRPIX2-CZ-FI (Small Pixel) : Spectrum in the frame mode
Nakashima et al., 2012, NIM A submitted
0 2 4 6 8 10 12 14 16 18 200
20
40
60
80
100
120
140
0 20100
150
50
100
X-ray Energy (keV)
Puls
e H
ight
(ch)
XRPIX2 Gain 6.5 µV/e-
XRPIX1 Gain 3.6 µV/e-
Observed Readout Noise
FanoNoise
Pixel-Pixel GainDispersion 1%
Sum
Cu Kα 656 eV 548 eV (FWHM)64 e-(rms)
139 eV 255 eV 620 eV
Mo Kα 800 eV
548 eV (FWHM)64 e-(rms) 205 eV 553 eV 805 eV
PH [ADU]
40 60 80 100 120 140 160
PH [ADU]
40 60 80 100 120 140 1600
200
400
600
800
1000
1200
1400
1600
1800
40 80 120 160Pulse Hight (ch = 244 µV)
1000
500
1500
Cu C
ount
100
200
00
Mo
Coun
t
Cu Kα (8.0 keV) Mo Kα (17.4 keV)
Mo Kβ(19.6 keV)
656 eVFWHM
800 eVFWHM
Readout Noise 100→64e-
16エネルギー分解能
Charge AmpFeedback Capacitance 1fF
Sensor Node
Reset SW
XRPIX3/3b : Pre Amp in Each Pixel 17
• A charge sensitive amp (CSA) in every pixel in order to increase the
gain and improve energy resolution.
• CSA is basically the same that developed in another SOIPIX (PIXOR).
• Readout noise = 64e (rms) → ....
Protection Diode
エネルギー分解能
IEEE NSS/MIC2013ソウル前日... 2013/10/26 13:38
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Energy (keV)
Coun
ts55Fe Spectrum
5.9 keV
FWHM : 8 % (470 eV)
FWHM : 14 % (830 eV)
6.4 keVCSA Pixel
Normal Pixel
(solid) : fitting line(dot) : data.
Development of New Circuit for X-ray Astronomical SOI Pixel DetectorAyaki Takeda (SOKENDAI / KEK)
Y.Arai (KEK / IPNS)T.G.Tsuru, T.Tanaka, S.Nakashima, and H.Matsumura (Kyoto Univ.)
For X-ray AstronomySOI Pixel Detector (SOIPIX)
Design Specification of XRPIX3
2013 IEEE NSS @ COEX, Seoul, Korea - 2013.10.30 WED -
Summary- We have been developing SOIPIX for future X-ray astronomical satellite mission.- A new device, “XRPIX3” was designed in order to improve energy resolution.- By CSA pixel circuit, we succeeded in the improvement of energy resolution. Normal -> 14 % (FWHM) , CSA -> 8 % (FWHM) @ 5.9 keV (55Fe)- We will optimize CSA circuit for the next design.
Please contact us if you are interested. -> http://rd.kek.jp/project/soi/mail: yasuo.arai @ kek.jp (Yasuo Arai (PL)), atakeda @ post.kek.jp (Ayaki Takeda)
X-rays
New Circuit
First prototype of XRPIX CSA circuit. Comparison of Normal and CSA pixel.(Fabricated Jun, 2013)Components- Chip Size : 2.9 mm sq. (Effective Area : 1.0 mm sq. )- Pixel Size : 30 µm sq.- # of Pixel : 32 x 32 (= 1,024)- Thickness of Sensor Layer : 260 µm- Sensor Wafer : 700 Ω cm -> Czochralski (CZ)
The performance required of a future X-ray astronomical satellite is the following ...- FWHM ≤ 140 eV @ 6 keV (Readout Noise ≤ 10 e-)- ≤ 100 µm pitch pixel- ~10 µs per event readout- Wide energy range : 0.3 - 40 keVIn order to achieve these requirement,we have been developing the SOIPIXwith a trigger information output function.(Event-Driven Readout mode) -> XRPIX SeriesWe aim at realization with a spectroscopysystem as shown in the right figure.
- A monolithic pixel detector with silicon-on-insulator (SOI) Technology -> 0.2 µm fully-depleted (FD)-SOI pixel process Processed by LAPIS Semi. Co. Ltd.
NP02-124
SOIPIX Advantages- No mechanical bump bonding -> High density, Low parasitic capacitance, High sensitivity- Standard CMOS circuits can be built- Based on industrial standard technology
Basic Components -> Tr Si Layer : 40 nm, BOX : 200 nm, Sensor Layer : 100 ~ 725 µm
Column Amp. (COL_AMP)Column Address Decoder
Row
Addr
ess D
ecod
er
0
31 Column Shift Register (32 bit)
Row
Shift
Reg
ister
(32
bit)
TRIG
_OUT
OR
31
ANAL
OGOU
T
TRIG_ROW
TRIG
_COL
32 x 32 Pixel Array1Pixel = 30 µm x 30 µm
NormalCharge
Sensitive Amp.
0 5 10 15 20 25 300
50
100
150
200
250
300
350
400
450
500
Energy (keV)
Pulse
Hei
ght (
ADU)
Normal Pixel5.3 µV/e-
CSA Pixel18.2 µV/e-
Energy Calibration
Our Works with XRPIX
First Results of XRPIX with CSA
The difference between Normal and CSA pixel is a circuit configuration of preceding stage.- Normal : Source Follower (SF) by Common-Drain of a PMOS transistor- CSA : CSA by Common-Source of a NMOS transistor and a feedback capacitance (1 fF)The signal charge can overcome the circuit noiseof following stage electronics by CSA.Then, the readout noise decreases.
We have been developing 4 devices and shown some basic performances.- X-ray responsivity of XRPIX (SOIPIX) -> XRPIX1/1b [1], [2]- Difference in pixel size or structure -> XRPIX2 [3]- Event-Driven readout mode -> XRPIX1b [4]
The basic function of XRPIX is realized by our previous works.Next step is improvement in spectroscopy performance.
x 3.4Note : Pixel gain was not calibrated.
ANALOGOUT
VTH TRIG OUT
ROW_READ COL_READ
COL_AMP OUT_BUF
SF
CDS_
RST
CDS Cap.
Sam
ple
Cap.
STORE
SF
PD_R
ST
CDS_RSTVPD_RSTV
Prot
ectio
n Di
ode
VDD18VB_SF
PDSense-node
GND
Pixel Circuit
Column Readout
CDS + Trigger Circuit
TRIG_COL (SR)
TRIG_ROW (SR)
TRIG_OUT (OR)Trigger Info. Output
ComparatorGND
&
Normal Pixel
ANALOGOUT
CDS_RSTV
TRIGGERH/L OUT
ROW_READ COL_READ
COL_AMP OUT_BUF
SFCD
S_RS
T
CDS Cap.
Sam
ple
Cap.
STORE
AMP.
PD_R
STPr
otec
tion
Diod
e
VDD18VB_SF
PDSense-node
GND
Pixel Circuit
Column Readout
# AMP. # + CDS + Trigger Circuit
TRIG_COL (SR)
TRIG_ROW (SR)
TRIG_OUT (OR)Trigger Info. Output
GND
&
Feedback Cap.
VTH
Comparator
CSA
CSA Pixel Circuit
CSA Pixel LayoutMIM Cap. (comp. 1) MIM Cap. (comp. 2)
MIM Cap. (sample) MIM Cap. (CDS)
1 pi
xel a
rea
trigger circuittrigger circuit
trigger circuit
14 μm
30 µ
m
PD
BPW
Feedback Cap. (1 fF)
analog signal circuit
Charge sensitive amplifier (CSA) in each pixel in order to increase the gain and improve energy resolution.
Energy Calibration 55Fe Spectrum
(1 ADU = 244 µV)
Reference
[1] S.G.Ryu et. al., IEEE TNS., Vol.58, Issue:5, pp.2528-2536, 2011. [2] S.G.Ryu et. al., IEEE TNS., Vol.60, Issue:1 , pp.465-469, 2013.[3] S.Nakashima et. al., Phys. Procedia, Vol.37C, pp.1392-1399, 2013. [4] A.Takeda et. al., IEEE TNS., Vol.60, Issue:2, pp.586-591, 2013.
Our New Device -> “XRPIX3”
- The pixel circuit with CSA works good. (3.4 times higher gain) Gain (from left fig.) : Normal -> 5.3 µV/e- , CSA -> 18.2 µV/e-
- The CSA Pixel succeeded in improvement of energy resolution. Comparison of 55Fe energy spectrum at Normal and CSA (right fig.) @ 5.9 keV : Normal -> 14 % (FWHM) , CSA -> 8 % (FWHM)- However, the experimental value of a gain differs from a design value. Gain : Design value -> 50 µV/e- , Experimental value -> 18.2 µV/e- It has influence of parasitic capacitance.
(-50 oC)
These results are reflected on the next design.
X-rayhard soft cosmic ray
(non-X-ray BG)field of view
active shield
onboard processor・anti-coincidence (NXB rejection)
・hit-pattern selection (NXB rejection)
・direct pixel access (X-ray readout)
XRPIX
エネルギー分解能
18
IEEE NSS/MIC2013ソウル前日... 2013/10/27 05:30
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遂に時は来た!
33e (rms), 300eV (FWHM)
エネルギー分解能
19
さらなる展開
図4:製作するカメラの模式図.PINダイオードで構成するアンチカウンタの中にSOIPIXを入れる.高エネルギー粒子PINとSOIPIXの両方に同時に信号を作るので,非X線として除去可能(非同時計数).
2次元符号化マスク入射X線
SOIPIX
PINダイオード
PINダイオード
PINダイオード
非X線バックグラウンド(高エネルギー電子等)5cm
大立体角X線監視観測宇宙の爆発現象を捉え,即時通報する
暗黒物質探査実験
XRPIX 1kg
シンチレーター
1-10GeVの低質量 : 探査不十分
神戸大 身内さんと共同研究
20
まとめ
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SOI Pixel Project : General View�
Feb. 28, 2011
SOI International Review Meeting
Yasuo Arai, KEK
http://rd.kek.jp/project/soi/�
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ïSQ
•X線天文衛星用のX線SOIピクセル検出器(XRPIX)を開発.
•反同時計数による低非X線BGDを目指し,トリガ機能を持つ.
•4.5mm角の素子の開発に成功
•トリガ読み出しに成功
•空乏層厚み~500μm,裏面不感層~0.6μm
•読み出しノイズ33-(rms),ΔE=300eV @ 5.9keV (FWHM)
•5年間の目標:衛星搭載品を直ちに製造開始
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