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INTERNATIONAL ORGANISATION FOR STANDARDISATION ORGANISATION INTERNATIONALE DE NORMALISATION ISO/IEC JTC 1/SC 29/WG 11 CODING OF MOVING PICTURES AND AUDIO ISO/IEC JTC 1/SC 29/WG 11 N13021 Shanghai, CN – October 2012 Sourc e: Leonardo Chiariglione Title : Report of 102 nd meeting Statu s Report of 102nd meeting Annex A – Attendance list...................................21 Annex B – Agenda............................................39 Annex C – Input contributions...............................43 Annex D – Output documents..................................71 Annex E – Requirements report...............................77 Annex F – Systems report....................................81 Annex G – Video report.....................................130 Annex H – JCT-VC report....................................131 Annex I – JCT-3V report....................................284 Annex J – Audio report.....................................395 Annex K – 3DG report.......................................425 Draft Systems Agenda 1

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INTERNATIONAL ORGANISATION FOR STANDARDISATION

ORGANISATION INTERNATIONALE DE NORMALISATION

ISO/IEC JTC 1/SC 29/WG 11

CODING OF MOVING PICTURES AND AUDIO

ISO/IEC JTC 1/SC 29/WG 11 N13021

Shanghai, CN October 2012

Source:

Leonardo Chiariglione

Title:

Report of 102nd meeting

Status

Report of 102nd meeting

21AnnexA Attendance list

39AnnexB Agenda

43AnnexC Input contributions

71AnnexD Output documents

77AnnexE Requirements report

81AnnexF Systems report

130AnnexG Video report

131AnnexH JCT-VC report

284AnnexI JCT-3V report

395AnnexJ Audio report

425AnnexK 3DG report

1 Opening

The 102nd MPEG meeting was held at Convention Center of the Zhangjiang Semiconductor Industry, No. 3000 LongDong Avenue, Pudong New Area, 201203 Shangha, China 2012/10/15-21.

2 Roll call of participants

The attendance list is given in Annex 1.

3 Approval of agenda

The adopted agenda is given in Annex 2.

4 Allocation of contributions

The list of input documents is given in Annex 3.

5 Communications from Convenor

There was no specific communication.

6 Report of previous meeting

This was approved

12836

Report of 101st meeting

7 Processing of NB Position Papers

The following documents from the National Bodies of KR, FI, CA, FR, IT, JP and US were introduced, discussed and responses provided where appropriate.

8 Work plan management

8.1 Media coding8.1.1 Frame Packing Arrangement Signalling for Quincunx Pattern

The following document was approved

13132

Text of ISO/IEC 13818-2:201X/FDAM1 Frame Packing Arrangement Signalling for Quincunx Pattern

8.1.2 New Level for AAC Profiles

The following document were approved

13191

Request for Amendment to 14496-3

13192

ISO/IEC 14496-3:2009/PDAM 4, New Level for AAC Profiles

8.1.3 Additional profiles and SEI messages

The following document were approved

13135

Disposition of Comments on ISO/IEC 14496-10:2012/DAM1

13136

Text of ISO/IEC 14496-10:2012/FDAM1 Additional profiles and SEI messages

8.1.4 MPEG Frame Compatible

The following document were approved

13137

Working Draft of Multi-resolution Frame Compatible Stereo (MFC)

13165

Report of Results of the CfP on MFC

8.1.5 MVC extension for inclusion of depth maps

The following document was approved

13140

Study Text of ISO/IEC 14496-10:2012/DAM2 MVC extension for inclusion of depth maps

8.1.6 AVC compatible video with depth information

The following document were approved

13141

Request for ISO/IEC 14496-10:2012/Amd.3

13142

Text of ISO/IEC 14496-10:2012/PDAM3 AVC compatible video-plus-depth extension

13143

3D-AVC Test Model 4

8.1.7 Additional Colour Space and Tone Mapping Descriptors

The following document was approved

13138

Working Draft of Additional Colour Space and Tone Mapping Descriptors

8.1.8 Multi-resolution 3D mesh coding

The following document were approved

13176

ISO/IEC 14496-16/DAM2 Multi-resolution 3D mesh compression

13177

Core Experiments Description for 3DG

8.1.9 Pattern Based 3D Mesh Compression

The following document was approved

13178

WD for Pattern Based 3D Mesh Compression

8.1.10 Composite Font Representation

The following document was approved

13037

WD 2.0 of ISO/IEC CD 14496-22 3rd edition

8.1.11 OFF Additional script and language tags

The following document was approved

13037

WD 2.0 of ISO/IEC 14496-22 3rd edition

8.1.12 Contract Expression Language

The following document were approved

13042

DoC on ISO/IEC DIS 21000-20 Contract Expression Language

13043

Text of ISO/IEC FDIS 21000-20 Contract Expression Language

8.1.13 Media Contract Ontology

The following document were approved

13098

Request for subdivision of ISO/IEC 21000-21 Media Contract Ontology

13099

Text of ISO/IEC FDIS 21000-21 Media Contract Ontology

8.1.14 CAL Extensions

The following document were approved

13147

Disposition of Comments on ISO/IEC 23001-4:2011/DAM1

13148

Text of ISO/IEC 23001-4:2011/FDAM1 CAL Language Extensions

8.1.15 Reconfigurable Media Coding

The following document was approved

13149

Text of ISO/IEC FDIS 23001-4:201x 3rd Ed. Codec Configuration Representation

8.1.16 Media Tool Library

The following document was approved

13153

Text of ISO/IEC FDIS 23002-4:201x 2nd Ed. Media Tool Library

8.1.17 Graphics Tool Library

The following document was approved

13186

Study Text of ISO/IEC 23002-4/PDAM3, Graphics Tool Library (GTL) for Reconfigurable Multimedia Coding (RMC) Framework

8.1.18 Unified Speech and Audio Coding

The following document was approved

13215

Verification Test Report on USAC Common Encoder, JAME

8.1.19 Media Context and Control Control Information

The following document were approved

13056

DoC on ISO/IEC DIS 23005-2 2nd edition Control Information

13057

Text of ISO/IEC FDIS 23005-2 2nd edition Control Information

8.1.20 Media Context and Control Sensory Information

The following document were approved

13058

DoC on ISO/IEC DIS 23005-3 2nd edition Sensory Information

13059

Text of ISO/IEC FDIS 23005-3 2nd edition Sensory Information

8.1.21 Media Context and Control Virtual World Object Characteristics

The following document were approved

13060

DoC on ISO/IEC DIS 23005-4 2nd edition Virtual World Object Characteristics

13061

Text of ISO/IEC FDIS 23005-4 2nd edition Virtual World Object Characteristics

8.1.22 Media Context and Control Data Formats for Interaction Devices

The following document were approved

13062

DoC on ISO/IEC DIS 23005-5 2nd edition Data Formats for Interaction Device

13063

Text of ISO/IEC FDIS 23005-5 2nd edition Data Formats for Interaction Device

8.1.23 Media Context and Control Common Types and Tools

The following document were approved

13064

DoC on ISO/IEC DIS 23005-6 2nd edition Common Data Format

13065

Text of ISO/IEC FDIS 23005-6 2nd edition Common Data Format

8.1.24 High-Efficiency Video Coding

The following document were approved

13154

High Efficiency Video Coding (HEVC) Test Model 9 (HM 9) Encoder Description

13155

Study Text of ISO/IEC DIS 23008-2 High Efficiency Video Coding

13156

Working Draft of HEVC Full Range Extensions

8.1.25 HEVC Scalable Extensions

The following document was approved

13158

Report of Results of the Joint Call for Proposals on Scalable High Efficiency Video Coding (SHVC)

8.1.26 3D Audio

The following document were approved

13194

Draft Call for Proposals on 3D Audio

13196

Calibration of 22.2 Multichannel Sound Reproduction

13198

Encoder Input Format for MPEG-H 3D Audio

13199

Test Material for 3D Audio

13201

Draft Listening Room Evaluation for 3D Audio

13203

Workplan for 3D Audio

8.1.27 3D Video Coding

The following document were approved

13159

Multi-view HEVC Working Draft Text 2

13160

3D-HEVC Test Model 2

13161

Work Plan in 3D Standards Development

8.1.28 Internet Video Coding

The following document were approved

13162

Internet Video Coding Test Model (ITM) v 3.0

13163

ITM 3.0 Software Description

13164

Description of Core Experiments in Internet Video Coding

8.1.29 Multimedia Preservation

The following document was approved

13125

Evaluation report of CfP responses

8.1.30 Coding independent media description

The following document was approved

13051

Editors study of ISO/IEC DIS 23001-8 coding-independent codepoints

8.1.31 Web 3D Graphics Coding

The following document were approved

13179

Request for ISO/IEC 14496-16:2011/Amd.3 Web3DG coding

13180

WD of ISO/IEC 14496-16:2011/Amd.3 Web3DG coding

8.2 Composition coding

8.2.1 Advanced User Interaction

The following document were approved

13200

Request for ISO/IEC 23007-2 2nd Edition

13075

WD of ISO/IEC 23007-2 2nd Edition

13202

Technologies under consideration

8.3 Description coding

8.3.1 Compact Descriptors for Visual Search

The following document were approved

13144

Text of Working Draft 2: Compact Descriptors for Visual Search

13145

Test Model 4: Compact Descriptors for Visual Search

13146

Core Experiments in Compact Descriptors for Visual Search

8.3.2 User Description

The following document were approved

13222

Draft Requirements on MPEG User Descriptions

13223

Draft Use Cases for MPEG User Description (Ver. 4.0)

13224

Draft Call for Proposals on MPEG User Descriptions

8.3.3 Codec description for efficiency

The following document was approved

13221

Requirements on Green MPEG

8.4 Systems support

8.4.1 Support for raw audio-visual data

The following document were approved

13029

DoC on ISO/IEC 14496-1:2010/PDAM 2 Support for raw audio-visual data

13030

Text of ISO/IEC 14496-1:2010/DAM 2 Support for raw audio-visual data

8.4.2 Signalling of Transport profiles, signalling MVC stereo view association and MIME type registration

The following document was approved

13024

Text of ISO/IEC 13818-1:201X/AMD 2 Signalling of Transport profiles, signalling MVC stereo view association and MIME type registration

8.4.3 Support of DASH event signalling in MPEG-2 TS

The following document were approved

13027

Request for ISO/IEC 13818-1:201X/AMD 4 Support of DASH event signalling in MPEG-2 TS

13028

Text of ISO/IEC 13818-1:201X/PDAM 4 Support of DASH event signalling in MPEG-2 TS

8.4.4 Sensor and actuator communication with BIFS

The following document were approved

13174

Request for ISO/IEC 14496-11:201x/Amd.1 Sensor and actuator communication with BIFS

13175

WD of ISO/IEC 14496-11:201x/Amd.1 Sensor and actuator communication with BIFS

8.5 IPMP

8.5.1 Common Encryption Format for MPEG-2 Transport Stream

The following document were approved

13052

Request for subdivision of ISO/IEC 23001-9 Common Encryption format for MPEG-2 Transport Stream

13053

Text of ISO/IEC CD 23001-9 Common Encryption format for MPEG-2 Transport Stream

8.6 Digital Item

8.6.1 Digital Item Linking

The following document was approved

13041

Text of ISO/IEC 21000-3:2003 AMD 2 Digital item semantic relationships

8.7 Transport and File formats

8.7.1 Carriage of HEVC

The following document were approved

13025

DoC on ISO/IEC 13818-1:201X/PDAM 3 Carriage of HEVC

13026

Text of ISO/IEC 13818-1:201X/DAM 3 Carriage of HEVC

8.7.2 Carriage of timed text

The following document were approved

13033

Request of ISO/IEC 14496-12:201X/AMD 2 & ISO/IEC 15444-12:201X/AMD 2 carriage of timed text

13034

Text of ISO/IEC 14496-12:201X/PDAM 2 & ISO/IEC 15444-12:201X/PDAM 2 carriage of timed text

8.7.3 Timed Text and Other Visual Overlays in ISO Base Media File Format

The following document were approved

13039

Request for subdivision of ISO/IEC 14496-30 Timed Text and Other Visual Overlays in ISO Base Media File Format

13040

Text of ISO/IEC CD 14496-30 Timed Text and Other Visual Overlays in ISO Base Media File Format

8.7.4 Carriage of HEVC in ISO Base Media File Format

The following document were approved

13035

DoC on ISO/IEC 14496-15:2010/PDAM 2 Carriage of HEVC

13036

Text of ISO/IEC 14496-15:2010/DAM 2 Carriage of HEVC

8.7.5 Support for Event Messages and Extended Audio Channel Configuration in DASH

The following document were approved

13079

DoC on ISO/IEC 23009-1:2012 PDAM 1 Support for Event Messages and Extended Audio Channel Configuration

13080

Text of ISO/IEC 23009-1:2012 DAM 1 Support for Event Messages and Extended Audio Channel Configuration

13081

Technologies under Consideration

13082

Descriptions of Core Experiments on DASH amendment

8.7.6 MPEG-DASH Implementation Guidelines

The following document was approved

13087

Study of ISO/IEC PDTR 23009-3 DASH Implementation Guidelines

8.7.7 Format independent segment encryption and authentication

The following document was approved

13088

Study of ISO/IEC DIS 23009-4 Segment encryption and authentication

8.7.8 MPEG Media Transport

The following document were approved

13089

Study of ISO/IEC CD 23008-1 MPEG Media Transport

13090

Description of Core Experiments on MPEG Media Transport

8.8 Multimedia architecture

8.8.1 MXM API

The following document were approved

13067

DoC on ISO/IEC CD 23006-2 2nd edition MXM API

13068

Text of ISO/IEC DIS 23006-2 2nd edition MXM API

8.8.2 MPEG-M Elementary Services

The following document were approved

13071

DoC on ISO/IEC 2nd DIS 23006-4.2 2nd edition Elementary services

13072

Text of ISO/IEC FDIS 23006-4 2nd edition Elementary services

8.8.3 MPEG-M Service Aggregation

The following document were approved

13073

DoC on ISO/IEC 2nd DIS 23006-5 Service aggregation

13074

Text of ISO/IEC IS 23006-5 Service aggregation

8.8.4 MPEG-V Architecture

The following document were approved

13054

Technologies under consideration

13055

Study of ISO/IEC DIS 23005-1 2nd edition Architecture

8.9 Application formats

8.9.1 Surveillance Application Format

The following document was approved

13045

Text of ISO/IEC IS 23000-10 2nd edition Surveillance Application Format

8.9.2 Support of movie fragment structure for SVAF

The following document were approved

13097

Request of ISO/IEC 23000-11:2012/AMD 3 Support of movie fragment structure for SVAF

13049

ISO/IEC 23000-11:2012/PDAM3 Support of movie fragment structure for SVAF

8.9.3 Augmented Reality AF

The following document was approved

13182

DIS of ISO/IEC 23000-13, Augmented Reality Application Format

8.9.4 Augmented Reality Reference Model

The following document was approved

13185

DTR of ISO/IEC 23000-14, Augmented reality reference model

8.10 Reference implementation

8.10.1 Reference software multi-resolution 3D mesh compression

The following document was approved

13173

ISO/IEC 14496-5/PDAM32 Multi-resolution 3D mesh compression reference software

8.10.2 Contract Expression Language Reference Software

The following document was approved

13044

Workplan for the reference software of CEL

8.10.3 IMAF Reference Software

The following document were approved

13047

Workplan for Conformance and Reference Software for IMAF AMD2

13048

Study of ISO/IEC 23000-12:2010/PDAM 3 Conformance and Reference Software

8.10.4 ARAF Reference Software

The following document were approved

13183

Request for ISO/IEC 23000-13:201x/Amd.1 ARAF reference software and conformance

13184

WD of ISO/IEC 23000-13:201x/Amd.1 ARAF reference software and conformance

8.10.5 Graphics Tool Library Reference Software

The following document was approved

13187

ISO/IEC 23002-5/PDAM1 Graphics Tool Library Reference Software and Conformance

8.10.6 USAC Reference Software

The following document were approved

13212

DoC ISO/IEC 23003-3:2012/PDAM 2, USAC Reference Software

13213

ISO/IEC 23003-3:2012/DAM 2, USAC Reference Software

8.10.7 MPEG-DASH Reference Software

The following document were approved

13083

DoC on ISO/IEC CD 23009-2 DASH Conformance and reference software

13084

Text of ISO/IEC DIS 23009-2 DASH Conformance and reference software

13085

Work plan for development of DASH Conformance and reference software

8.10.8 MPEG-U Reference Software

The following document was approved

13076

Text of ISO/IEC 23007-3 DAM 1 Conformance and Reference Software for widget extension and AUI

8.10.9 MPEG-M Reference Software

The following document were approved

13069

DoC on ISO/IEC CD 23006-3 2nd edition Conformance and Reference Software

13070

Text of ISO/IEC DIS 23006-3 2nd edition Conformance and Reference Software

8.11 Conformance

8.11.1 MVC plus Depth Conformance

The following document was approved

13134

Working Draft of MVC plus Depth Conformance

8.11.2 Multiresolution 3D mesh coding Conformance

The following document was approved

13181

ISO/IEC 14496-27/PDAM5 Multi-resolution 3D mesh compression conformance

8.11.3 Surveillance AF Conformance

The following document was approved

13046

Study of ISO/IEC 23000-10:201x PDAM 1 Conformance and Reference Software

8.11.4 IMAF Conformance

The following document were approved

13047

Workplan for Conformance and Reference Software for IMAF AMD2

13048

Study of ISO/IEC 23000-12:2010/PDAM 3 Conformance and Reference Software

8.11.5 ARAF Conformance

The following document were approved

13183

Request for ISO/IEC 23000-13:201x/Amd.1 ARAF reference software and conformance

13184

WD of ISO/IEC 23000-13:201x/Amd.1 ARAF reference software and conformance

8.11.6 Graphics Tool Library Conformance

The following document was approved

13187

ISO/IEC 23002-5/PDAM1 Graphics Tool Library Reference Software and Conformance

8.11.7 USAC Conformance

The following document were approved

13210

DoC ISO/IEC 23003-3:2012/PDAM 1, USAC Conformance

13211

ISO/IEC 23003-3:2012/DAM 1, USAC Conformance

8.11.8 MPEG-DASH Conformance

The following document were approved

13083

DoC on ISO/IEC CD 23009-2 DASH Conformance and reference software

13084

Text of ISO/IEC DIS 23009-2 DASH Conformance and reference software

13085

Work plan for development of DASH Conformance and reference software

8.11.9 MPEG HEVC Conformance

The following document was approved

13157

Working Draft of HEVC Conformance

8.11.10 MPEG-M Conformance

The following document were approved

13069

DoC on ISO/IEC CD 23006-3 2nd edition Conformance and Reference Software

13070

Text of ISO/IEC DIS 23006-3 2nd edition Conformance and Reference Software

8.12 Maintenance

8.12.1 Systems coding standards

The following document were approved

13126

Defect report of ISO/IEC 14496-12

13050

Text of ISO/IEC 23001-7 DCOR 1

13086

Text of ISO/IEC 23001-7/AMD1 DCOR 1

13077

Study of ISO/IEC 23009-1:2012 DCOR. 1

13078

Defects under investigation

8.12.2 Video coding standards

The following document were approved

13133

Defect Report on 14496-2/Cor.4 regarding a rounding operation

13139

Defect Report on 14496-10 regarding substream extraction in MVC

13150

Text of ISO/IEC 23002-1:2006/Amd.1:2008 COR1

13151

Disposition of Comments on ISO/IEC 23002-4/Amd.2 DCOR1

13152

Text of ISO/IEC 23002-4/Amd.2 COR1

8.12.3 Audio coding standards

The following document were approved

13190

ISO/IEC 14496-3:2009/Cor 4, BSAC Corrections

13118

DoC on ISO/IEC 14496-5:2001/AMD 24:2009/DCOR 1, LD AAC V2 Profile and BSAC Corrections

13119

ISO/IEC 14496-5:2001/AMD 24:2009/Cor 1, LD AAC V2 Profile and BSAC Corrections

13187

Defect Report on 14496-5:2001/AMD 6, DRC Corrections

13193

Defect Report on ISO/IEC 23003-1:2007, MPEG Surround

13188

ISO/IEC 23003-1:2007/AMD 1:2008/COR 2 MPEG Surround Conformance

13214

Defect Report of ISO/IEC 23003-3:2012, USAC Corrections

9 Organisation of this meeting

9.1 Tasks for subgroup

The following tasks were assigned

Group

Std

Pt

Amd

Title

Requirements

H

2

HEVC Profiles

Still picture profile

Interlace

Lossless

2

Amd1

HEVC Extensions

3

3D Audio

MFC

Preservation

User description

Systems

2

3

HEVC carriage

4

1

2

Support of raw audio-visual data

5

?

SVC FF RS

11

2E

Nodes for AR and collaborative applications

12

2

Carriage of timed text

15

2

Carriage of HEVC

22

3E

Open Font Format

28

C

Composite Font Format

21

20

CEL

A

10

2nd Ed.

Surveillance AF

12

2

IMAF RS

B

7

1

AES CBC 128 and key rotation

8

Codec independent code points

H

1

1st Ed.

MMT

M

1

2nd Ed

Architecture

2

2nd Ed

MXM API

3

2nd Ed

RS & C

4

2nd Ed

Elementary Services

5

Aggregated Services

6

Use cases

DA

1

1

Various extensions

2

DASH C&RS

3

Implementation guidelines

4

Format independent segment encryption

V

1

2nd Ed

Architecture

2

2nd Ed

Control Information

3

2nd Ed

Sensory information

4

2nd Ed

Virtual world object characteristics

5

2nd Ed

Data representation for interaction devices

6

2nd Ed

Common types and tools

7

1st Ed

Conformance and reference software

U

3

1

Widget extensions C&RS

Video

2

2

1

Frame packing arrangement

4

10

1

Some SEI messages, Scalable no B-picture profile

29

Web Video Coding

7

13

Compact Descriptors for Visual Search

B

4

1

CAL extensions

?

?

Internet Video Coding

VC

H

2

1st Ed.

HEVC

HEVC professional profile

HEVC still picture

HEVC scalable extension

3V

4

10

2

MVC+depth

MHVC

AVC+depth

HEVC+depth

Workplan

Audio

4

24

Amd1

Audio-systems interaction

D

2

Cor1

Spatial Audio Object Coding

3

Amd1

USAC C

Amd2

USAC RS

H

3

1st Ed.

3D Audio

3DG

4

16

1

Multiresolution 3DMC

2

Pattern-based 3DMC

5

Amd3?

Multiresolution 3DMC RS

27

Amd5

Multiresolution 3DMC C

A

13

ARAF

14

ARRM

C

4

3

Graphics Tool Library

5

1

GTL RS & C

Web 3DG coding

Communication

A

Technology page

M

Technology page

V

Technology page

U

Technology page

DASH

Technology page

Introduction of standards in progress

N12903

Press Release

White Paper on State of the Art in 3D Video

9.2 Joint meetings

The following joint meetings were held

Groups

What

Day

Time1

Time2

Where

R, S

Preservation

Mon

17:00

18:00

R

3, S

MPEG-V

Tue

09:00

11:00

3

3, S

AR

Tue

11:00

18:00

3

A, R

3D Audio

Tue

16:00

17:00

A

3, S

MPEG-V

Thu

09:00

10:00

3

3, S

AR

Thu

10:00

13:00

3

3, S

Raw data support in FF

Thu

16:00

17:00

S

9.3 Other meetings

The following other meetings were held

Groups

What

Day

Time1

Time2

Where

MP, VC

Profiles, SHVC, MFC, etc.

Tue

09:00

10:30

R

MP, VC, JP

Still Picture, etc.

Tue

14:00

15:30

R

Commun.

Wed

11:30

13:00

R

Processing

Wed

16:00

17:00

R

MP, VC, JP

Still Picture, etc.

Wed

15:00

16:00

R

V, JP

JPSearch, CDVS

Thu

14:00

15:00

V

10 WG management

10.1 Terms of reference

The following document was approved

13100

Terms of reference

10.2 Liaisons10.2.1 Incoming liaisons

The following incoming liaisons were received

#

Title

Source

Gr.

26475

IEC CDV 62379-5-2 Ed.1.0

IEC TC 100

S

26476

IEC CDV 61883-8/Amd.1

IEC TC 100

V

26477

IEC CDV 61937-6 Ed.2.0 Amd.1

IEC TC 100

A

26478

IEC CDV 61883-6/Ed.2 Amd.1

IEC TC 100

A

26479

Liaison Statement

WG 1

V

26480

Liaison Statement

IETF

A

26481

Liaison Statement

ITU-R SG 6

A

26866

Request for establishment of liaison

Iraj Sodagar DASH-IF

S

26899

Liaison from DECE

Michael Dolan

S

26963

Liaison Statement

ITU-T SG 16

R

27061

Liaison Statement from

EBU

R

27062

Liaison Statement

SCTE

R

27119

Provision of information on Use Cases

James Kutzner, Walt Husak

R

10.2.2 Outgoing liaisons

The following liaisons were sent

13220

Liaison to EBU on Green MPEG

13225

Liaison to EBU on Interlace

13114

Liaison statement to DASH-IF on repository and conformance software

13115

Liaison statement to DECE on DASH software

13116

Liaison statement to ATSC on use cases

13120

Liaison template on Surveillance AF 2nd edition

13121

Liaison statement to SC6/WG7 on MMT

13122

Liaison statement template on support of timed text and other visual overlays in ISO/IEC 14496

13123

Liaison statement template on Multimedia Preservation AF

13124

Liaison statement to NDL on Multimedia Preservation AF

13248

Liaison statement to ISO/IEC JTC1 DCMP (Digital Content and Management Protection) Incubator Group

13117

Liaison Statement to ITU-T Q6/16 (VCEG)

13167

Liaison Statement to IETF

13168

Liaison Statement template to various organizations re MFC

13166

Liaison Statement to WG1 (JPEG)

13171

Liaison Statement to DVB re HEVC development

13172

Liaison Statement to EBU re range extensions and test material

13169

Liaison Statement to Qualinet

13216

Response to EC CDV 61937-6 Ed.2.0 Amd.1 (m26477)

13217

Response to IEC CDV 61883-6/Ed.2 Amd.1 (m26478)

13218

Response to Liaison Statement from IETF (m26480)

13219

Response to Liaison Statement from ITU-R SG 6 (m26481)

13204

Liaison to WG1 on ARAF (DIS) and ARRM (DTR)

13205

Liaison to SC24 on ARAF (DIS) and ARRM (DTR)

13206

Liaison to SWG3 on ARAF (DIS) and ARRM (DTR)

13207

Liaison to Khronos and OGC on ARAF (DIS) and ARRM (DTR)

13209

Liaison to Web3D on ARAF (DIS) and ARRM (DTR)

13245

Liaison to OMA on ARAF (DIS) and ARRM (DTR)

13230

Liaison statement to ITU-T SG 16 on meeting schedule

10.2.3 New liaisons

The following document was approved

13113

Statement of benefits from establishing a Category C liaison with DASH Industry Forum (DASH-IF)

10.2.4 List of liaison organisations

The following document was approved

13111

List of Organisations with which MPEG entertains liaisons

10.3 Responses to National Bodies

The following responses were sent

13112

Responses to FRNB on MMT

13208

Response to KNB comment on 3D Audio

10.4 Ad hoc groups

The following ahgs were established

13093

AHG on 3D Audio and Audio Maintenance

13238

AHG on Application Format

13233

AHG on Augmented Reality

13128

AHG on Compact Descriptors for Visual Search

13241

AHG on Dynamic Adaptive Streaming over HTTP

13226

AHG on Energy Efficient MPEG

13239

AHG on Font Format Representation

13130

AHG on Internet Video Coding

13131

AHG on MFC

13237

AHG on MPEG File Formats

13242

AHG on MPEG Media Transport

13234

AHG on MPEG SVN

13127

AHG on MPEG-7 Visual

13240

AHG on MPEG-M and CEL

13235

AHG on MPEG-V

13243

AHG on Multimedia Preservation Application Format (MP-AF)

13231

AHG on Multi-Resolution and Pattern-Based 3D Mesh Coding

13232

AHG on Reconfigurable Media Coding

13094

AHG on Responding to Industry Needs on Adoption of MPEG Audio

13229

AHG on Still Image Coding using MPEG HEVC

13228

AHG on Study of interlace coding in MPEG HEVC

13227

AHG on User Descriptions

13129

AHG on Web Video Coding

10.5 Asset management

The following documents were approved

13105

Schema assets

13106

Software assets

13107

Conformance assets

13108

Content assets

13109

URI assets

10.6 IPR management

The following document was approved

13110

Call for patent statements related to standards under development

11 Work plan and time line

The following documents were approved

13101

MPEG Standards

13102

Table of unpublished FDISs

13103

Work plan and time line

12 Administrative matters

12.1 Schedule of future MPEG meetings

The following meeting schedule was approved

#

City

Country

yy

mm

dd-dd

JPEG

102

Shanghai

CN

12

10

15-19

X

103

Geneva

CH

13

01

21-25

X

104

Incheon

KR

13

04

22-26

X

105

Vienna

AT

13

07-08

29-02

106

Geneva

CH

13

10-11

28-01

107

San Jos

US

14

01

13-17

X

108

Valencia

ES

14

03-04

31-04

109

Geneva

CH

14

06

23-27

110

Strasbourg

FR

14

10

20-24

111

?

?

15

01

19-23

12.2 Promotional activities

The following documents were approved

13095

White Paper on State of the Art in compression and transmission of 3D Video (Draft)

13096

Technical pages of MPEG-A/V/U/H (Draft)

13170

White Paper on Compact Descriptors for Visual Search

13091

Short descriptions

13092

FAQ on MMT

13 Resolutions of this meeting

These were approved

14 A.O.B.

There was no other business

15 Closing

Meeting closed at 2012/10/19T20:00

AnnexA Attendance list

No.

Name

Email

Affiliation

Country

216

Christopher Rosewarne

[email protected]

CiSRA / Canon

Australia

316

Mohamad Raad

[email protected]

RaadTech Consulting

Australia

125

Werner Bailer

[email protected]

JOANNEUM RESEARCH

Austria

360

Christian Timmerer

[email protected]

Alpen-Adria-Universitt Klagenfurt

Austria

223

Peter Schelkens

[email protected]

Vrije Universiteit Brussel - IBBT

Belgium

224

Heng Chen

[email protected]

Vrije Universiteit Brussel - ETRO

Belgium

249

Glenn Van Wallendael

[email protected]

Ghent University - IBBT - Multimedia Lab

Belgium

251

Jan De Cock

[email protected]

Ghent University - IBBT - Multimedia Lab

Belgium

252

Sebastiaan Van Leuven

[email protected]

Ghent University - IBBT - Multimedia Lab

Belgium

50

Martin-Cocher Gaelle

[email protected]

research in motion ltd

Canada

117

Xin Guo

[email protected]

Vixs Systems

Canada

145

Ali Begen

[email protected]

Cisco

Canada

178

Dake He

[email protected]

Research In Motion Ltd.

Canada

357

Indra Laksono

[email protected]

ViXS Systems

Canada

358

Jean-Francois Ridel

[email protected]

Sensio

Canada

441

Spencer Cheng

[email protected]

MorpbiusTechnology

Canada

1

Tiejun Huang

[email protected]

Peking University

China

42

Wenhao Zhang

[email protected]

Intel China Research Center Ltd.

China

43

Yu Han

[email protected]

Intel Corp.

China

44

Xiaoxia Cai

[email protected]

Intel Corp.

China

45

Zhipin Deng

[email protected]

Intel Corp.

China

78

Chunhui Cui

[email protected]

Hong Kong Applied Science and Technology Research Institute (ASTRI)

China

86

Peiyu YUE

[email protected]

Huawei Technologies Co., Ltd

China

123

Ming LI

[email protected]

ZTE Corporation

China

135

Hongwei Li

[email protected]

ZTE Corporation

China

165

Oscar Au

[email protected]

Hong Kong University of Science and Technology

China

219

Chenchen Gu

[email protected]

Tencent Technology (Beijing) Company Limited

China

221

Xiaofeng Yang

[email protected]

Huawei Technologies Co., LTD

China

222

wen zhang

[email protected]

tencent

China

231

Bin Li

[email protected]

Dept. of EEIS, University of Science and Technology of China

China

241

Xin Jin

[email protected]

Graduate School at Shenzhen, Tsinghua Univ.

China

260

Li Song

[email protected]

Shanghai Jiao Tong University

China

262

Haitao Yang

[email protected]

Huawei Technologies

China

263

Hongbo Zhu

[email protected]

None

China

266

Zheng Liu

[email protected]

Huawei Software Technologies Co., Ltd.

China

267

Hui Liu

[email protected]

CCATG of Cisco

China

268

Tao Lin

[email protected]

Tongji University

China

270

Yuanyuan Zhang

[email protected]

Huawei Technologies Co., Ltd.

China

271

Xin Zhao

[email protected]

Qualcomm Wireless Communication Technologies (China) Limited

China

274

weizhong Chen

[email protected]

Huawei Technology

China

301

Bert Greevenbosch

[email protected]

Huawei

China

310

Junyan Huo

[email protected]

Xidian University

China

325

Siwei Ma

[email protected]

Peking University

China

326

Xiaoran Cao

[email protected]

Tsinghua University

China

327

Weiran Li

[email protected]

Tsinghua University

China

329

Yongbing Lin

[email protected]

China

334

Lu Yu

[email protected]

Zhejiang University

China

335

Yin Zhao

[email protected]

Zhejiang University

China

336

Yichen Zhang

[email protected]

Zhejiang University

China

342

Yue Wang

[email protected]

Cisco Systems (china) Research and DevelopmentCo., Ltd.

China

343

James Zhu

[email protected]

Cisco Systems (China) Research and DevelopmentCo., Ltd.

China

344

Xianghui Wei

[email protected]

Huawei Technologies Co., Ltd.

China

359

Rui Fan

[email protected]

Beihang University

China

361

Yongfei Zhang

[email protected]

Beihang University

China

368

Yibo FAN

[email protected]

Fudan University

China

375

Ronggang Wang

[email protected]

Peking University Shenzhen Gruaduate Schook

China

389

LINGYU DUAN

[email protected]

Peking University

China

391

Jie Chen

[email protected]

Peking University

China

395

Jie Lin

[email protected]

Peking University

China

403

Cheng Huang

[email protected]

ZTE Corporation

China

404

ChengDong Lan

[email protected]

Fuzhou University

China

408

Xiaozhen Zheng

[email protected]

Huawei Technologies

China

418

Ping An

[email protected]

Shanghai University

China

419

Jizheng Xu

[email protected]

Microsoft

China

420

Jing Wu

[email protected]

Zoom

China

422

Jianhua Zheng

[email protected]

Hisilicon Technologies Co., LTD.

China

425

Feng Shao

[email protected]

Faculty of Information Science and Engineering, Ningbo University

China

426

Xingyu Liu

[email protected]

Faculty of Information Science and Engineering, Ningbo University

China

428

Hongzhang Yang

[email protected]

Freescale

China

432

Xiulian Peng

[email protected]

Microsoft Research Asia

China

433

Shaobo Zhang

[email protected]

Huawei Technologies Co. Ltd

China

434

Guangtao Ge

[email protected]

Zhejiang University

China

445

Gaofeng Zhu

[email protected]

Faculty of Information Science and Engineering, Ningbo University

China

448

Yun He

[email protected]

Tsinghua University

China

130

Jani Lainema

[email protected]

Nokia

Finland

166

Miska Hannuksela

[email protected]

Nokia Corporation

Finland

168

Dmytro Rusanovskyy

[email protected]

Nokia

Finland

181

Justin Ridge

[email protected]

Nokia

Finland

290

Kemal Ugur

[email protected]

Nokia

Finland

10

Mickael Raulet

[email protected]

IETR/INSA Rennes

France

25

Pierrick Philippe

[email protected]

Orange Labs

France

60

Felix Henry

[email protected]

Orange Labs

France

65

PALLONE Gregory

[email protected]

Orange

France

80

NASSOR Eric

[email protected]

CANON Research Centre France SAS

France

81

LE LEANNEC Fabrice

[email protected]

CANON Research Centre France SAS

France

82

ONNO Patrice

[email protected]

CANON Research Centre France SAS

France

83

FRANCOIS Edouard

[email protected]

CANON Research Centre France SAS

France

88

Joel Jung

[email protected]

Orange Labs

France

124

Madec Gerard

[email protected]

Telecom Bretagne

France

148

Mohamed-Chaker LARABI

[email protected]

University of Poitiers

France

179

DUCLOUX XAVIER

[email protected]

Thomson Video Networks

France

184

BORDES Philippe

[email protected]

Technicolor

France

186

GUEZ VUCHER Marc

[email protected]

IFPI

France

207

Mary-Luc Champel

[email protected]

Technicolor

France

209

KANGYING CAI

[email protected]

Technicolor (China) Technology Co. Ltd.

France

236

Preda Marius

[email protected]

Institut MINES TELCOM

France

237

Mihai Petru Mitrea

[email protected]

Institut Mines-Telecom ; Telecom SudParis

France

238

Bojan Joveski

[email protected]

Institut Mines-Telecom, Telecom SudParis

France

246

Christian Tulvan

[email protected]

Institut Telecom

France

255

Sylvain KERVADEC

[email protected]

Orange Labs

France

309

Guionnet Thomas

[email protected]

IRISA / INRIA Rennes

France

383

Jean Le Feuvre

[email protected]

Telecom ParisTech

France

385

Cyril Concolato

[email protected]

Telecom ParisTech

France

414

PRETEUX Francoise

[email protected]

MINES ParisTech

France

4

Thomas Stockhammer

[email protected]

Qualcomm Incorporated

Germany

15

Juergen Herre

[email protected]

Fraunhofer IIS

Germany

17

Joachim Keinert

[email protected]

Fraunhofer IIS

Germany

24

Grill Bernhard

[email protected]

Fraunhofer IIS

Germany

35

Robert Steffens

[email protected]

IOSONO GmbH

Germany

40

Julien Robilliard

[email protected]

Fraunhofer IIS

Germany

46

Terentiv Leon

[email protected]

Fraunhofer IIS

Germany

47

Neuendorf Max

[email protected]

Fraunhofer IIS

Germany

48

Fischer Daniel

[email protected]

Fraunhofer IIS

Germany

49

Giovanni Cordara

[email protected]

Huawei Technologies - Eruopean Research Center

Germany

58

Fersch Christof

[email protected]

Dolby Germany GmbH

Germany

61

Karsten Mueller

[email protected]

Fraunhofer HHI

Germany

64

Steffen Kamp

[email protected]

Panasonic

Germany

79

Ohm Jens-Rainer

[email protected]

RWTH Aachen University

Germany

94

Peter Amon

[email protected]

Siemens AG

Germany

97

Oliver Wuebbolt

[email protected]

Technicolor

Germany

111

Thomas Wedi

[email protected]

Panasonic

Germany

112

Matthias Narroschke

[email protected]

Panasonic R&D Center Germany

Germany

129

Boehm Johannes

[email protected]

Technicolor, Deutche Thomson OHG

Germany

139

Niko Rettelbach

[email protected]

Fraunhofer Institut IIS

Germany

140

Zhijie Zhao

[email protected]

Leibniz Universitaet Hannover

Germany

141

Ingo Hofmann

[email protected]

Fraunhofer Institut IIS

Germany

182

Fabian Jger

[email protected]

RWTH Aachen University

Germany

183

Bross Benjamin

[email protected]

Fraunhofer HHI

Germany

193

Gero Baese

[email protected]

Siemens

Germany

198

Thomas Sporer

[email protected]

Fraunhofer IDMT

Germany

208

Schierl Thomas

[email protected]

Fraunhofer HHI

Germany

210

Hellge Cornelius

[email protected]

Fraunhofer HHI

Germany

225

Robert Skupin

[email protected]

Fraunhofer Heinrich Hertz Institute

Germany

234

Jrn Ostermann

[email protected]

Leibniz Universitt Hannover, Institut fr Informationsverarbeitung

Germany

247

Andreas Silzle

[email protected]

Fraunhofer IIS

Germany

253

Nguyen Tung

[email protected]

Fraunhofer HHI

Germany

254

Plogsties Jan

[email protected]

Fraunhofer IIS

Germany

280

Hinz Tobias

[email protected]

Fraunhofer Heinrich-Hertz-Institute

Germany

311

Philipp Merkle

[email protected]

Fraunhofer HHI

Germany

331

Detlev Marpe

[email protected]

Fraunhofer HHI

Germany

350

Haricharan Lakshman

[email protected]

Fraunhofer HHI

Germany

356

Peter List

[email protected]

Deutsche Telekom, Labs

Germany

381

Sumit Johar

[email protected]

STMicroelectronics Pvt. Ltd.

India

33

Eyal Farkash

[email protected]

NDS technologies

Israel

2

Danilo Pau

[email protected]

STMicroelectronics

Italy

12

Diego Gibellino

[email protected]

Telecom Italia

Italy

30

Alessandra Mosca

[email protected]

Sisvel Technology

Italy

32

Massimo Mattelliano

[email protected]

Sisvel Technology

Italy

74

Vittorio Giovara

[email protected]

Sisvel Technology

Italy

75

Giovanni Ballocca

[email protected]

Sisvel Technology

Italy

114

Gianluca Francini

[email protected]

Telecom Italia

Italy

115

Leonardo Chiariglione

[email protected]

CEDEO

Italy

170

Massimo Balestri

[email protected]

Telecom Italia

Italy

171

Laurent Boch

[email protected]

RAI - Radiotelevisione Italiana

Italy

173

Sabino Metta

[email protected]

RAI - Radiotelevisione Italiana

Italy

185

Marco Arena

[email protected]

RAI

Italy

21

Masato Shima

[email protected]

Canon Inc.

Japan

26

Takayuki Nakachi

[email protected]

NTT

Japan

27

Kazuyoshi Suzuki

[email protected]

Nagoya Industrial Science Research Institute

Japan

29

Masayuki Tanimoto

[email protected]

Nagoya Industrial Science Research Institute

Japan

36

Akio Ando

[email protected]

NHK Science and Technology Research Laboratories

Japan

39

TK Tan

[email protected]

NTT DOCOMO, Inc.

Japan

66

Takanori Senoh

[email protected]

National Institute of Information and Communications Technology

Japan

68

Keiichi Chono

[email protected]

NEC

Japan

85

Shuichi Aoki

[email protected]

NHK

Japan

104

Kazuo Sugimoto

[email protected]

Mitsubishi Electric Corporation

Japan

105

Akira Minezawa

[email protected]

Mitsubishi Electric Corporation

Japan

106

Shinya Shimizu

[email protected]

NTT Corporation

Japan

109

Tokumichi Murakami

[email protected]

Mitsubishi Electric Corporation

Japan

122

Takeshi Norimatsu

[email protected]

Panasonic Corporation

Japan

138

TOMOO YAMAKAGE

[email protected]

TOSHIBA Corporation

Japan

142

KENTA TOKUMITSU

[email protected]

NEC

Japan

143

Kota Iwamoto

[email protected]

NEC

Japan

149

Takeshi Chujoh

[email protected]

Toshiba Corporation

Japan

155

Shigeru Fukushima

[email protected]

JVC KENWOOD Corporation

Japan

158

Hiroya Nakamura

[email protected]

JVC KENWOOD Corporation

Japan

162

Takehiro Sugimoto

[email protected]

NHK

Japan

163

Hisao Sasai

[email protected]

Panasonic

Japan

176

Jumpei Koyama

[email protected]

FUJITSU LABORATORIES LTD.

Japan

177

Itaru Kaneko

[email protected]

Tokyo Polytechinic University

Japan

189

Tomoya Kodama

[email protected]

Toshiba Corporation

Japan

190

Atsuro Ichigaya

[email protected]

NHK (Japan Broadcasting Corporation)

Japan

191

Yasuko Sugito

[email protected]

NHK

Japan

195

Tomoyuki Yamamoto

[email protected]

SHARP Corporation

Japan

196

Tomohiro Ikai

[email protected]

Sharp Corporation

Japan

199

Yasuaki Tokumo

[email protected]

Sharp Corporation

Japan

214

Takuya Iwanami

[email protected]

Sharp corporation

Japan

235

Kei Kawamura

[email protected]

KDDI Corp. (KDDI R&D Labs.)

Japan

245

Cong-Thang Truong

[email protected]

University of Aizu

Japan

248

Ohji Nakagami

[email protected]

Sony Corporation

Japan

264

Shuo Lu

[email protected]

Sony Corporation

Japan

273

Dajiang Zhou

[email protected]

Waseda University

Japan

276

Kazushi Sato

[email protected]

Sony Corp.

Japan

287

Teruhiko Suzuki

[email protected]

Sony corporation

Japan

299

Shinobu Hattori

[email protected]

Sony Corporation

Japan

305

Toshiyasu Sugio

[email protected]

Panasonic Corporation

Japan

378

Satoshi Goto

[email protected]

Waseda Univeristy

Japan

384

Zhu Jiayi

[email protected]

The Research Center of Information,Production and Systems,Waseda University

Japan

410

Noboru Harada

[email protected]

NTT

Japan

411

Kohtaro Asai

[email protected]

Mitsubishi Electric Corporation

Japan

417

Yoshihide Tonomura

[email protected]

NTT

Japan

427

Toru Chinen

[email protected]

Sony Corporation

Japan

429

Masayuki Nishiguchi

[email protected]

Sony Corporation

Japan

446

Yosuke Funahashi

[email protected]

Tomo-Digi Corporation

Japan

54

Yong Han Kim

[email protected]

The University of Seoul

Korea

67

Sang-Kyun Kim

[email protected]

Myongji University

Korea

95

Yong-Soo Joo

[email protected]

Myongji University

Korea

100

Jae Yung Lee

[email protected]

Sejong University

Korea

101

Kwanghyun Choi

[email protected]

Sejong University

Korea

102

Yeon Kyeong Jeong

[email protected]

sejong university

Korea

103

MINHO LEE

[email protected]

Sejong University

Korea

107

Taejin Lee

[email protected]

ETRI

Korea

108

Jin Young Lee

[email protected]

ETRI

Korea

110

Yung-Lyul Lee

[email protected]

Sejong University

Korea

121

Yongju Cho

[email protected]

ETRI

Korea

136

Junwoo Lee

[email protected]

INHA university

Korea

164

Byeungwoo Jeon

[email protected]

Sungkyunkwan University

Korea

180

Miran Choi

[email protected]

ETRI

Korea

187

Jaejoon Lee

[email protected]

Samsung Electronics

Korea

188

JEONGIL SEO

[email protected]

ETRI

Korea

197

Jihun Cha

[email protected]

ETRI

Korea

200

Dong Nam Kang

[email protected]

Nexstreaming

Korea

201

Euee S. Jang

[email protected]

Hanyang University

Korea

202

Kiho Choi

[email protected]

Hanyang University

Korea

203

Young Su Heo

[email protected]

Kyung Hee University

Korea

204

Li Cui

[email protected]

Hanyang University

Korea

205

Hosung Hwang

[email protected]

Kyung Hee University

Korea

215

Sunyoung Lee

[email protected]

Pantech

Korea

217

IN SU WON

[email protected]

Inha University, South Korea

Korea

218

Soongi Hong

[email protected]

Yonsei University

Korea

229

Jaeyeon Song

[email protected]

Director

Korea

230

Hyungyu Kim

[email protected]

Hanyang University

Korea

233

Yongwoo Cho

[email protected]

Kyung Hee University

Korea

242

Hokyom Kim

[email protected]

ETRI

Korea

243

Sunhyoung Kwon

[email protected]

ETRI

Korea

244

JAESEOB SHIN

[email protected]

PIXTREE, INC.

Korea

250

Sunghan Kim

[email protected]

ETRI

Korea

261

YO SUNG HO

[email protected]

GIST

Korea

265

JIN HEO

[email protected]

LG Electronics

Korea

272

Moonmo Koo

[email protected]

LG Electronics

Korea

282

Doug Young Suh

[email protected]

Kyung Hee University

Korea

283

Minwoo Jo

[email protected]

KyungHee University

Korea

284

Kugjin Yun

[email protected]

ETRI

Korea

285

Joonyoung Park

[email protected]

LG eletronics

Korea

286

Hendry

[email protected]

LG Electronics

Korea

288

ByeongMoon Jeon

[email protected]

LG Electronics

Korea

289

Won-Sik CHEONG

[email protected]

ETRI

Korea

292

Chul Keun Kim

[email protected]

LG electronics

Korea

293

Chang-ki Kim

[email protected]

ETRI(Electronics and Telecommunications Research Institute)

Korea

295

Seokjin Lee

[email protected]

Advanced Technology & System Team, LG Electronics

Korea

296

Byeongdoo Choi

[email protected]

Samsung Electronics Co., Ltd.

Korea

297

Jin Young Lee

[email protected]

Samsung Electronics

Korea

298

Sehoon Yea

[email protected]

LG Electronics

Korea

300

Elena Alshina

[email protected]

Samsung Electronics

Korea

303

Kyuheon Kim

[email protected]

KyungHee University

Korea

306

Kyungwon Kim

[email protected]

KETI

Korea

307

Jung Won Kang

[email protected]

ETRI

Korea

308

Jinho Lee

[email protected]

ETRI

Korea

317

In-Su Jang

[email protected]

Electronics and Telecommunications Research Institute

Korea

319

Seung Wook Lee

[email protected]

ETRI

Korea

320

Namsuk Lee

[email protected]

Samsung Electronics Co., Ltd

Korea

321

Sunmin Kim

[email protected]

Samsung Electronics Co.Ltd

Korea

322

Kwan-Jung Oh

[email protected]

Samsung Electronics

Korea

323

Hoyoung Lee

[email protected]

Sungkyunkwan University

Korea

324

Dongkyu Lee

[email protected]

Kwangwoon University (KWU)

Korea

330

Hahyun Lee

[email protected]

ETRI

Korea

332

Tae-Beom Lim

[email protected]

KETI

Korea

338

Byeongho Choi

[email protected]

KETI

Korea

339

Je-Woo Kim

[email protected]

KETI

Korea

341

Minsu AHN

[email protected]

Samsung Electronics Co. Ltd

Korea

345

Seoung Jun Oh

[email protected]

Kwangwoon University (KWU)

Korea

346

Sung-Chang Lim

[email protected]

ETRI

Korea

352

Hui Yong Kim

[email protected]

ETRI

Korea

353

Joohyeok Kim

[email protected]

Hanyang University

Korea

354

Kibaek Kim

[email protected]

Hanyang university

Korea

355

Sang-il Na

[email protected]

ETRI

Korea

363

EUNMI OH

[email protected]

samsung

Korea

364

Seungju Han

[email protected]

Samsung Electronics

Korea

367

sumi kim

[email protected]

chips & media

Korea

370

Henney Oh

[email protected]

WILUS STRC

Korea

371

Youngseop Kim

[email protected]

Dankook university

Korea

372

Je-Ho Park

[email protected]

Dankook univerity

Korea

373

Yong-Hwan Lee

[email protected]

Dankook university

Korea

374

Haechul Choi

[email protected]

Hanbat National University

Korea

380

Hae Kwang KIM

[email protected]

Sejong University

Korea

390

Jong-Yeul Suh

[email protected]

LG Electronics

Korea

393

Kyoungsoo Moon

[email protected]

LG Electronics

Korea

394

JINPIL KIM

[email protected]

LG Electronics

Korea

396

Changkyu Lee

[email protected]

ETRI (Electronics and Telecommunications Research Institute)

Korea

397

Deock Gu Jee

[email protected]

ETRI

Korea

398

Jiyeon Kim

[email protected]

ETRI

Korea

399

Kwang Roh Park

[email protected]

ETRI

Korea

401

jae joon han

[email protected]

Samsung Electronics

Korea

402

Seung Han HAN

[email protected]

Korea Electronics Association(KEA)

Korea

415

Brian Choi

[email protected]

ETRI

Korea

423

Seong-Jun Bae

[email protected]

Electronics and Telecommunications Research Inst.

Korea

424

Kyoungro Yoon

[email protected]

Konkuk University

Korea

430

Jeong Do Kim

[email protected]

Hoseo University

Korea

435

Youngsun Ryu

[email protected]

Samsung Electronics

Korea

436

Sungoh Hwang

[email protected]

Samsung Electronics

Korea

437

Hyun Koo Yang

[email protected]

Samsung Electronoics Co., Ltd.

Korea

438

Sungryeul Rhyu

[email protected]

Samsung Electronics

Korea

439

Sunghee Hwang

[email protected]

Samsung Electronics

Korea

440

Kyungmo Park

[email protected]

Samsung Electronics Co., Ltd.

Korea

442

Byoung-Dai Lee

[email protected]

Kyonggi Univrsity

Korea

443

HAE RYONG LEE

[email protected]

ETRI

Korea

444

Sanghyun Joo

[email protected]

ETRI

Korea

447

Cheong Ghil Kim

[email protected]

Namseoul University

Korea

304

Arild Fuldseth

[email protected]

Cisco Systems

Norway

63

Marek Domanski

[email protected]

Poznan University of Technology

Poland

70

Krzysztof Wegner

[email protected]

Poznan University of Technology

Poland

71

Olgierd Stankiewicz

[email protected]

Poznan University of Technology

Poland

351

Mikhail Mishurovskiy

[email protected]

Samsung Moscow Research Center

Russia

59

Kaushik Anantharaman

[email protected]

Panasonic R & D Center, Singapore

Singapore

213

Chuo Hao Yeo

[email protected]

Institute for Infocomm Research

Singapore

294

Yih Han Tan

[email protected]

Institute for Infocomm Research

Singapore

318

Sue Mon Thet Naing

[email protected]

Panasonic R&D Center Singapore

Singapore

348

Huan Zhou

[email protected]

I2R

Singapore

349

ChongSoon Lim

[email protected]

Panasonic Singapore

Singapore

11

Ruben Tous

[email protected]

Universitat Politecnica de Catalunya. BarcelonaTech (UPC)

Spain

56

Francisco Morn Burgos

[email protected]

Universidad Politcnica de Madrid

Spain

127

Jaime Delgado

[email protected]

DMAG-UPC

Spain

89

Per Frjdh

[email protected]

Ericsson AB

Sweden

113

Jonatan Samuelsson

[email protected]

Ericsson

Sweden

133

Andrey Norkin

[email protected]

Ericsson

Sweden

137

Thomas Rusert

[email protected]

Ericsson

Sweden

167

Kenneth Andersson

[email protected]

Ericsson

Sweden

194

Rickard Sjoberg

[email protected]

Ericsson

Sweden

96

Clemens Par

[email protected]

swissaudec GmbH

Switzerland

239

Christine Perey

[email protected]

PEREY Research & Consulting

Switzerland

376

Marco Mattavelli

[email protected]

EPFL

Switzerland

379

Kouadio Adi Raymond

[email protected]

EBU - European Broadcasting Union

Switzerland

407

Niko Stefanoski

[email protected]

Disney Research Zurich

Switzerland

413

Touradj Ebrahimi

[email protected]

EPFL

Switzerland

69

Werner Oomen

[email protected]

Philips

Netherlands

126

Fons Bruls

[email protected]

Philips

Netherlands

7

Ken McCann

[email protected]

Samsung/ZetaCast

United Kingdom

57

Stavros Paschalakis

[email protected]

Visual Atoms

United Kingdom

144

Adrian Wise

[email protected]

Ericsson

United Kingdom

192

Marta Mrak

[email protected]

BBC R&D

United Kingdom

206

David Flynn

[email protected]

RIM

United Kingdom

220

Abdellatif Benjelloun Touimi

[email protected]

Huawei Technologies (UK) Co., Ltd.

United Kingdom

232

Gerard Fernando

[email protected]

ZTE Corporation

United Kingdom

259

Ping Wu

[email protected]

ZTE (UK) Ltd

United Kingdom

337

Panagiotis Koudoumakis

[email protected]

Queen Mary University of London

United Kingdom

382

Miroslaw Bober

[email protected]

University of Surrey

United Kingdom

3

Ankur Saxena

[email protected]

Samsung Telecommunications America

USA

5

Iraj Sodagar

[email protected]

Microsoft

USA

6

Robert Cohen

[email protected]

Mitsubishi Electric

USA

8

Zhan Ma

[email protected]

Samsung Electronics

USA

9

Felix Fernandes

[email protected]

Samsung

USA

13

Schuyler Quackenbush

[email protected]

Audio Research Labs

USA

14

Wade Wan

[email protected]

Broadcom Corporation

USA

16

Andrew Tescher

[email protected]

Microsoft

USA

18

Minhua Zhou

[email protected]

Texas Instruments Inc.

USA

19

Do-Kyoung Kwon

[email protected]

Texas Instruments

USA

20

Vivienne Sze

[email protected]

Texas Instruments

USA

22

Vladimir Levantovsky

[email protected]

Monotype Imaging Inc.

USA

23

Huifang Sun

[email protected]

Mitsubishi Electric Research Labs

USA

28

Xin Wang

[email protected]

Huawei Technologies, USA

USA

31

David Singer

[email protected]

Apple, USA

USA

34

Pankaj Topiwala

[email protected]

FastVDO LLC

USA

37

Krasimir Kolarov

[email protected]

Apple Inc.

USA

38

Alexandros Tourapis

[email protected]

Apple Inc

USA

41

Athanasios Leontaris

[email protected]

Apple Inc.

USA

51

Ajay Luthra

[email protected]

Motorola Mobility

USA

52

Frank Bossen

[email protected]

DOCOMO Innovations

USA

53

Gwo Giun Lee

[email protected]

ITRI (USA)

USA

55

Chad Fogg

[email protected]

Harmonic

USA

62

Sam Narasimhan

[email protected]

Motorola

USA

72

BZ (Bazhong) Shen

[email protected]

Broadcom

USA

73

Weimin Zeng

[email protected]

Real Communications, Inc.

USA

76

Arianne Hinds

[email protected]

Cable Television Laboratories

USA

77

Mukta Kar

[email protected]

Cable Television Laboratories

USA

84

Taoran Lu

[email protected]

Dolby Laboratories Inc.

USA

87

Peng Yin

[email protected]

Dolby Laboratories, Inc.

USA

90

Anthony Vetro

[email protected]

Mitsubishi Electric

USA

91

Ozgur Oyman

[email protected]

Intel Corporation

USA

92

Yu-Wen Huang

[email protected]

MediaTek Inc.

USA

93

Yu-Lin Chang

[email protected]

MediaTek Inc.

USA

98

Shan Liu

[email protected]

MediaTek USA Inc.

USA

99

Jun Xin

[email protected]

Zenverge Inc.

USA

116

Ye-Kui Wang

[email protected]

Qualcomm Incorporated

USA

118

Qunshan Gu

[email protected]

Google, Inc.

USA

119

Adarsh Krishnan Ramasubramonian

[email protected]

Qualcomm Inc., USA

USA

120

Ying Chen

[email protected]

Qualcomm Inc.

USA

128

Peisong Chen

[email protected]

Broadcom Corporation

USA

131

Geert Van der Auwera

[email protected]

Qualcomm

USA

132

Yasser Syed

[email protected]

Comcast Cable

USA

134

Jian-Liang Lin

[email protected]

MediaTek Inc.

USA

146

Munsi Alaul Haque

[email protected]

Sony Electronics, Inc.

USA

147

Rajan Joshi

[email protected]

Qualcomm

USA

150

Yeshwant Muthusamy

[email protected]

Samsung Telecommunications America

USA

151

Yan Ye

[email protected]

InterDigital Communications, LLC

USA

152

Jie Dong

[email protected]

InterDigital Communications, LLC

USA

153

Joel Sole

[email protected]

Qualcomm

USA

154

Liwei Guo

[email protected]

Qualcomm

USA

156

Li Zhang

[email protected]

Qualcomm Incorporated

USA

157

in suk chong

[email protected]

qualcomm

USA

159

Jianle Chen

[email protected]

Qualcomm Incorporated

USA

160

Xiang Li

[email protected]

Qualcomm Inc.

USA

161

PoLin(wang) LAI

[email protected]

Samsung

USA

169

Yong Yu

[email protected]

Broadcom Corp

USA

172

Krishnakanth Rapaka

[email protected]

Qualcomm Inc

USA

174

Wendell Sun

[email protected]

Motorola

USA

211

Ali Tabatabai

[email protected]

Sony Electronics Inc.

USA

212

Cheung Auyeung

[email protected]

Sony Electronics Inc

USA

226

Alexander Giladi

[email protected]

Huawei Technologies

USA

227

Bill Zou

[email protected]

DTS

USA

228

Kilroy Hughes

[email protected]

Microsoft

USA

240

Eric Chai

[email protected]

Real Communications, Inc.

USA

256

Xiaosong Zhou

[email protected]

Apple Inc.

USA

257

Andrew Segall

[email protected]

Sharp

USA

258

Sachin Deshpande

[email protected]

Sharp Electronics

USA

269

Peter Vajda

[email protected]

Stanford University

USA

275

Vijay Chandrasekhar

[email protected]

Stanford University

USA

277

Haoping Yu

[email protected]

Huawei Technologies (USA)

USA

278

Yong HE

[email protected]

InterDigital Communication LLC

USA

279

Wen Gao

[email protected]

Huawei Technologies

USA

281

Louis Kerofsky

[email protected]

Sharp Labs of America

USA

291

Gary Hughes

[email protected]

Motorola Mobility

USA

302

Yi-Shin Tung

[email protected]

MStar Semiconductor, Inc. / ITRI International

USA

312

Michael Dolan

[email protected]

Microsoft

USA

313

Jill Boyce

[email protected]

Vidyo, Inc.

USA

314

Chung-Hao Wu

[email protected]

ITRI / NCTU

USA

315

Dong Tian

[email protected]

Mitsubishi Electric Research Labs

USA

328

Shawmin Lei

[email protected]

MediaTek

USA

333

Aleksei Dolgoborodov

[email protected]

Vanguard Software Solutions, Inc.

USA

340

Tzu-Der Chuang

[email protected]

MediaTek Inc.

USA

347

WEN-HSIAO PENG

[email protected]

ITRI/NCTU

USA

362

Arturo Rodriguez

[email protected]

Cisco Systems, Inc

USA

365

Gary Sullivan

[email protected]

Microsoft

USA

366

Zhu Li

[email protected]

Samsung Telecom America

USA

369

Wo Chang

[email protected]

NIST

USA

377

Imed Bouazizi

[email protected]

Samsung Telecommunications America

USA

386

Kevin Streeter

[email protected]

Adobe Systems Inc.

USA

387

Deep Sen

[email protected]

Qualcomm

USA

388

Walter Husak

[email protected]

USNB/SMPTE

USA

392

Yi-Wen Chen

[email protected]

MediaTek Inc.

USA

400

Jesus Sampedro

[email protected]

Polycom Inc.

USA

405

Yue Yu

[email protected]

Motorola Mobility

USA

406

Jian Lou

[email protected]

Motorola Mobility Inc.

USA

409

Chun-Lung Lin

[email protected]

ITRI

USA

412

Noblet Ludovic

[email protected]

Dolby Laboratories Inc

USA

416

Alberto Duenas

[email protected]

NGCODEC

USA

421

Lulin Chen

[email protected]

Huawei Technologies, USA

USA

431

Yiting Liao

[email protected]

Intel Corporation

USA

175

Youngkwon Lim

[email protected]

Samsung Electronics

USA/Korea

AnnexB Agenda

#

#

#

Item

1

Opening

2

Roll call of participants

3

Approval of agenda

4

Allocation of contributions

5

Communications from Convenor

6

Report of previous meeting

7

Processing of NB Position Papers

8

Work plan management

1

Media coding *

1

Frame Packing Arrangement Signalling in MPEG-2 Video *

2

Frame Packing Arrangement Signalling for Quincunx Pattern *

3

New SEI message on MVC view and additional signaling in frame packing SEI signaling *

4

Additional profiles and SEI messages *

5

MPEG Frame Compatible *

6

MVC extension for inclusion of depth maps *

7

AVC compatible video with depth information *

8

MVC extension for inclusion of depth map *

9

Multi-resolution 3D mesh coding *

10

Pattern Based 3D Mesh Compression *

11

Composite Font Representation *

12

OFF Additional script and language tags *

13

Web Video Coding *

14

Contract Expression Language *

15

CAL Extensions *

16

Reconfigurable Media Coding *

17

Media Context and Control Control Information *

18

Media Context and Control Sensory Information *

19

Media Context and Control Virtual World Object Characteristics *

20

Media Context and Control Data Formats for Interaction Devices *

21

Media Context and Control Common Types and Tools *

22

High-Efficiency Video Coding *

23

3D Audio *

24

3D Video Coding *

25

Internet Video Coding *

26

Multimedia Preservation *

27

Codec independent media description *

28

Web 3D Graphics Coding *

2

Composition coding *

1

Scene Description Based Collaborative Applications *

2

Advanced User Interaction *

3

Description coding *

1

Audio-visual description profile *

2

Compact Descriptors for Visual Search *

3

Social Metadata *

4

AVDP Profiles *

5

User Description *

6

Codec description for efficiency

4

Systems support *

1

Audio Systems Interaction *

2

Support for raw audio-visual data *

5

IPMP *

1

Common Encryption Format for ISO Base Media File Format *

6

Digital Item *

1

Digital Item Linking *

7

Transport and File formats *

1

MPEG-2 Systems DASH support *

2

Simplified carriage of MPEG-4 over MPEG-2 TS *

3

Carriage of HEVC *

4

Signalling of Transport profiles and MVC stereo view association, and MIME type registration *

5

Various enhancements including support for large metadata *

6

Carriage of HEVC in ISO Base Media File Format *

7

MPEG-DASH Implementation Guidelines *

8

Format independent segment encryption and authentication *

9

MPEG Media Transport *

8

1

Multimedia architecture *

2

MPEG-M Architecture *

3

MXM API *

4

MPEG-M Elementary Services *

5

MPEG-M Service Aggregation *

6

MPEG-M Usage guidelines *

7

MPEG-V Architecture *

9

Application formats *

1

Surveillance Application Format *

2

Professional Archival Application Format *

3

Stereoscopic Video AF DASH support *

4

Augmented Reality AF *

5

Augmented Reality Reference Model *

10

Reference implementation *

1

Efficient representation of 3D meshes with multiple attributes Reference Software *

2

Reference software multi-resolution 3D mesh compression *

3

Audio-visual Description Profile Reference Software *

4

IMAF Reference Software *

5

Media Tool Library Reference Software *

6

SAOC Reference Software *

7

USAC Reference Software *

8

MPEG-DASH Reference Software *

9

MPEG-U Reference Software *

10

MPEG-M Reference Software *

11

MPEG-V Reference Software *

11

Conformance *

1

3D Efficient representation of 3D meshes with multiple attributes Conformance *

2

Multiresolution 3D mesh coding Conformance *

3

IMAF Conformance *

4

Media Tool Library Conformance *

5

MPEG Surround conformance for Low Delay AAC v2 profile *

6

SAOC Conformance *

7

USAC Conformance *

8

MPEG-DASH Conformance *

9

MPEG-U Conformance *

10

MPEG-M Conformance *

11

MPEG-V Conformance *

12

Maintenance *

1

Systems coding standards *

2

Video coding standards *

3

Audio coding standards *

4

3DG coding standards *

5

Systems description coding standards *

6

Visual description coding standards *

7

Audio description coding standards *

8

MPEG-21 standards *

9

MPEG-A standards *

9

Organisation of this meeting

1

Tasks for subgroups

2

Joint meetings

10

WG management

1

Terms of reference

2

Officers

3

Editors

4

Liaisons

5

Responses to National Bodies

6

Work item assignment

7

Ad hoc groups

8

Asset management

1

Reference software

2

Conformance

3

Test material

4

URI

9

IPR management

10

Work plan and time line

11

Administrative matters

1

Schedule of future MPEG meetings

2

Promotional activities

12

Resolutions of this meeting

13

A.O.B.

14

Closing

AnnexC Input contributions

#

Source

Title

26367

Alex Giladi, Wendell Sun, Mandayam Narasimhan

Carriage of event message box in MPEG-2 TS

26368

Alex Giladi

Updates to DIS 23009-4

26369

Markus Waltl, Christian Timmerer

Revision of ISO/IEC 23009-2 CD

26370

Markus Waltl, Christian Timmerer, on behalf of the Austrian NB

Austrian NB comments on MPEG-DASH

26371

Sunghee Hwang

Coordinator proposal for AL-FEC Chaptering

26372

Sunghee Hwang

Coordinator proposal for Clarification

26373

Sunghee Hwang

Coordinator proposal for Discussion

26374

Sunghee Hwang, Seho Myung, Hyunkoo Yang

Samsung Proposal for FEC Packet Block Format

26375

Sunghee Hwang, Seho Myung, Hyunkoo Yang

Samsung Proposal for S Layer FEC Message

26376

Jawahar Arumugam, Sudhakar Jayanty, Takuya Iwanami, Shuichi Watanabe, Takashi Kaneko, Seetharaman Nataraja

MMT: CE Response on solution of User Controls in E-CI

26377

B. Bross, G. J. Sullivan, T. K. Tan, Y.-K. Wang

Proposed Editorial Improvements for High efficiency video coding (HEVC) Text Specification Draft 8

26378

Takayuki Nakachi, Yoshihide Tonomura, Daisuke Shirai, Tatsuya Fujii

MMT D1-FEC: Layered LDGM Codes for MMT

26379

Cornelius Hellge, Yago Sanchez de la Fuente, Thomas Schierl

MMT D1-FEC: Evaluation approach of LA-FEC UI for MMT

26380

S. Quackenbush

Draft Verification Test Report on USAC Common Encoder, JAME

26381

Sunghee Hwang (on behalf of D1-FEC CE)

MMT D1-FEC CE Report

26382

Danilo Pau, Emanuele Plebani

Test Model 3.1 performance evaluation

26383

P. Kapsenberg, W. Zhang (Intel)

Line Buffer Cleanup

26384

Clemens Par

Thoughts on Evaluation Procedures Regarding the Oncoming Call for Proposals for 3D Audio

26385

Clemens Par

Thoughts on the Oncoming Call for Proposals for 3D Audio

26386

B. Li, H. Li (USTC)

HM-8.0 code speedup

26387

B. Li, H. Li, L. Li, J. Zhang (USTC)

Rate control by R-lambda model for HEVC

26388

M. Zhou (TI)

Cross-verification of JCTVC-K0101 on line buffer cleanup

26389

Schuyler Quackenbush

101st MPEG Audio Report

26390

Schuyler Quackenbush

3D Audio Test Items

26391

Clemens Par, Wilfried Van Baelen

Test Items for 3D Audio work

26392

O. Nakagami (Sony), T. Suzuki (Sony), G. Ballocca (Sisvel Technology), V. Giovara (Sisvel Technology), P. Sunna (RAI), M. Arena (RAI), J. F. Travers (TDF), K. Illgner (IRT), M. Pellegrinato (Mediaset)

FPA SEI message modification

26393

Schuyler Quackenbush

3D Audio Issues for 102nd MPEG meeting

26394

A. G. Tescher for USNB

HEVC Issues

26395

A. G. Tescher for USNB

AVC Issues

26396

P. Kapsenberg (Intel), W. Zhang (Intel)

On Tile Processing Order

26397

X. Zhang, S. Liu, M. Guo, Z. Chen, T.-D. Chuang, Y.-W. Huang, S. Lei (MediaTek), C. Kim, J. Park, J. Kim, Hendry, B. Jeon (LG)

Simplification of differential coding in JCTVC-K0033

26398

M. Kim, D. Kim, K. Kim, W. W. Ro (Yonsei Univ.), C. Kim, Y. Park, K. Choi (Samsung)

On parallel decoding with SEI message containing Reference Dependency Tree

26399

A. Duenas, A. Malamy (NGcodec), B. Olofsson (BSkyB), A. Ichigaya, S. Sakaida (NHK), S. Pejhan (DirecTV), L. Haglund (SVT), A. Luthra (Motorola Mobility), P. Andrivon, P. Bordes (Technicolor), T. Jones (Ericsson), X. Ducloux, P. Gendron (Thomson Video Networks), M. Mrak (BBC), A. Cofler (ST), J.-M. Thiesse (Ateme), A. Rodriguez (Cisco), P. Sunna (RAI), I. Laksono (ViXS Systems)

On a 10-bit consumer-oriented profile in High Efficiency Video Coding (HEVC)

26400

Bert Greevenbosch

New Gestures

26401

Bert Greevenbosch

MPEG-U postures and gestures as BIFS events

26402

P. Sunna, M. Arena (RAI)

Comparison of Compression Performance of HEVC with AVC at different resolutions

26403

T. Suzuki, A. Tabatabai (Sony)

AHG5: On HEVC conformance testing

26404

G. Van der Auwera, R. Joshi, M. Karczewicz, P. Kapsenberg (Intel)

DQP Buffering Fix

26405

D. Singer, T. Leontaris, A. Tourapis (Apple)

The general structure and syntax of the slice extension

26406

D. Singer, T. Leontaris, A. Tourapis (Apple)

Specific Uses of the Slice Extension

26407

P. Kapsenberg (Intel)

Crosscheck for JCTVC-K0138 - non-CE1:Deblocking of Large Block Artifacts

26408

X. Yang, P. Yue, Y. Zhang (Huawei)

2D compatible frame packing stereo 3D video

26409

X. Yang, P. Yue, Y. Zhang (Huawei)

Parameter ID change information SEI for bitstream splicing

26410

X. He, G. Zhong, Y. Li, L. Qing, D. Wu (Sichuan Univ.)

Encoding complexity reduction by removal of some unnecessary CU segmentations and partition types based on spatial and temporal correlation

26411

Y.-K. Wang (Qualcomm)

AHG9: Indication of frame-packed or interlaced video

26412

Y.-K. Wang (Qualcomm)

AHG9: High-level syntax clean-ups

26413

Y. Chen, Y.-K. Wang (Qualcomm)

AHG9: NAL unit header design for support of multi-standard extensions

26414

Y.-K. Wang (Qualcomm)

AHG9: On CRA and BLA pictures

26415

A. K. Ramasubramonian, Y.-K. Wang (Qualcomm)

AHG9: Reference picture set clean-ups

26416

A. K. Ramasubramonian, Y. Chen (Qualcomm)

AHG9: Reference picture list modification with truncation

26417

Y.-K. Wang, Y. Chen (Qualcomm)

AHG9: On video parameter set

26418

Y.-K. Wang (Qualcomm)

AHG9: On HRD and related general issues

26419

Y.-K. Wang, A. K. Ramasubramonian (Qualcomm)

AHG9: Signalling of bitstream and elementary stream properties

26420

Y.-K. Wang (Qualcomm)

AHG9: Signalling of regions of interest and gradual decoding refresh

26421

Kaushik Saha, Emanuele Plebani, Danilo Pau

Test Model performances with OpenCL-GPU accelerated SIFT extraction

26422

Emanuele Plebani, Danilo Pau, Arcangelo Bruna

Quantitative evaluation of CDVS extraction and pairwise matching

26423

Hey

26424

A. Tourapis (Apple)

Support of weighted prediction in the HEVC deblocking filter

26425

A. Tourapis, A. Leontaris (Apple)

Deblocking filter display preference SEI message

26426

C.-W. Hsu, T.-D. Chuang, Y.-W. Huang, S. Lei (MediaTek)

Unified coefficient scan for 8x8 TU

26427

T. Lin, S. Wang, P. Zhang, K. Zhou (Tongji U)

AHG7: Full-chroma (YUV444) dictionary+hybrid dual-coder extension of HEVC

26428

P. Zhang, T. Lin, X. Chen, K. Zhou, X. Jin (Tongji U)

AHG7: HM software implementation and source code for JCTVC-K0133

26429

T.-D. Chuang, C.-W. Hsu, Y.-W. Huang, S. Lei (MediaTek)

AHG4: Independent parsing for WPP substreams

26430

C.-Y. Chen, C.-Y. Tsai, C.-W. Hsu, Y.-W. Huang, S. Lei (MediaTek)

AHG9: High-level syntax cleanups

26431

J. Wen, D. Guang, P. Tao (Tsinghua Univ.)

Parallelize encoder of HM reference software for Multi-Core/Cluster Environment

26432

G. Van der Auwera, R. Joshi, M. Karczewicz (Qualcomm)

Non-CE1: Deblocking of Large Block Artifacts

26433

T.K. Tan, Y. Suzuki (NTT DOCOMO)

Contouring artefact and solution

26434

K. Kazui, J. Koyama, S. Shimada, A. Nakagawa (Fujitsu)

AHG9: Simple HEVC stream editing

26435

K. Kazui, J. Koyama, S. Shimada, A. Nakagawa (Fujitsu)

AHG9: Low delay display hint SEI

26436

K. Kazui, J. Koyama, S. Shimada, A. Nakagawa (Fujitsu)