27th microelectronics workshop - jaxa27th microelectronics workshop 1 2 contents 1.部門紹介...

携帯電話における高密度実装High Density Assembly for Mobile Phone Use

October 23, 2014

Yuji Ishida

Communication Product Development Div.

Corporate Communication Equipment Group

27th Microelectronics Workshop

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Contents

1. 部門紹介Introduction of department

2. 製品紹介Product introduction

3. 技術要素の進化Evolution of the technical elements

4. 基板小型化の実施例Summary report of miniaturized PCB

5. 通信モジュールCommunication module

6. 今後の展望Future prospects

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Contents







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1. Introduction of department

・製造部門 Manufacturing sector北海道北見工場（基板実装/検査）Hokkaido Kitami Plant (PCB / inspection)

福島棚倉工場（完成組み立て）Fukushima Tanagura Plant (complete assembly)

マレーシア工場（主に海外出荷機種を生産）Malaysia Plant(Production of overseas shipping models)

・技術部門 Engineering sector横浜事業所：主に国内向け機種設計Yokohama Office: Design for domestic shipments models大東事業所：主に海外向け機種設計Daito Office: Design for shipments overseas models

・品質保証部門 Quality assurance sector横浜事業所：主に国内向け機種担当Yokohama Office: Responsible for domestic models大東事業所：主に海外向け機種担当Daito Office: Responsible for overseas models

・開発部門 Development sector横浜事業所：先行技術を開発Yokohama Office: Development of the technology of the future

YOKOHAMA

DAITO

KITAMI

TANAGURA

MalaysiaKTEM

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Contents







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2. Product introduction・携帯電話、スマートフォン、ＰＨＳCellular, smart phone, PHS

小型軽量 Compact and lightweight防水機能 Waterproof 耐衝撃性 Impact resistance簡単操作 Simple operation

・通信モジュールCommunication module

低価格 Low price長期信頼性 Long term reliability

・ＰＨＳ基地局PHS base station

Smartphone

Simple Cellular PHS

Communication ModulePHS base station Kids Cellular

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・1989年から携帯電話/PHSの生産を行っておりますWe have been engaged in the production of cellular/PHS since 1989.

The world'slightestcellular

59g

World's ThinnestCell type cellular 15mm

The world'slightest

Smartphone 94g

Integrated with Sanyo Cellular Division

production ofdigital cellular Overseas

productionProduction of

cellular module

production of analog cellular

production of PHS

World's most Rugged

Smartphone MIL-810G

Integration with Qualcomm production department

The

world's

First!

Cellular

joint

Iridium

phone

The

world's

First!Camerawith PHS

The

world's

First!Revolver

style

The

world's

First!2 screen

Smartphone

2. Product introduction

World's Thinnest

Slide type cellular 11.9mm

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・内部写真Photo of the internal part

3.Evolution of the technical elements

With

Internet

With

Camera

With

Very

Large

Screen

With

Android

With

Large

Screen

With

Large

Battery

10

Back light

Processor

RAM

Power Management

IC

RF Block

AudioCodec

IC

Receiver

MIC

Speaker

Earphone/Mic JackData JackCharge Pad

Battery

Base Band IC Flash Memory

Display

10KEYButton

Indicator

3. Evolution of the technical elements

・90年代携帯電話のブロック図Block diagram of cellular phones in the 1990’s

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Back light

Main Processor

RAMPower Management

IC

RF Block

FeliCa/NFC

Wi-Fi

Digital TV

AudioCodec

IC

Receiver

MIC

Speaker

Earphone JackUSB Jack Memory CardUIM CardCharge Pad

Battery

Base Band IC

Flash Memory

Display

Touchpanel

Driver IC

CameraIN/OUT

Processor IC

Button

Sensor

Indicator

Sensor IC

Blue Tooth


・スマートフォンのブロック図Block diagram of smartphone

・コアブロック（プロセッサー、メモリ、電源）Core Block: Processor, Memory, Power Management

<Processor>

12.8MHz

<Memory>

16MByte

Quad-CoreDual-Core

200MHz

32MByte

400MHz

256MByte

2.3GHz

32GByte

Ratio of ’20

* 180

Ratio of ’20

* 125,000

Single-CoreMCU

2GByte

LPDDR3LPDDR2LPDDR

Nand Flash eMMC

SRAM PSRAM

20MHz 400MHz

256KByte

Co-processor

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<Power Management>Lithium ion Battery

400mAh

Wireless charging

600mAh 1,000mAh 3,000mAh

Super Quick Charging

Ratio of ’20

* 7.5

Power management IC


Nor Flash

・コアブロック（無線、アンテナ、通信速度）Core Block: RF, Antenna, Speed Rate

<RF>

1Band

800M

2Elements

<Antenna>

Tunable Antenna

4Band800M/2G

GPS/BT

11Band700M/800M/900M/1.7G/2G/2.5G

BT/WLAN 2.4G/5G/GPS/Quad-GSM

Carrier

Aggregation

Multi Band Antenna

Multi Band WiFi

BluetoothFeliCa

DTV

2～3 Elements 4～5 Elements 4～5 Elements

Rod Antenna

Uni Band

GPS

1Band

1.5G2Band

800M/GPS

Diversity

Ratio of ’20

* 11

Ratio of ’20

* 2.5

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<Speed rate>

9600bps

4G

LTE

3G

CDMA1xWiMax

14.4Kbps 144Kbps 40Mbps

2.5G

cdmaone

2G

Digital

Ratio of ’20

* 15,000150Mbps

3.5G

CDMA2000

2.4Mbps 15Mbps


・マン－マシン（カメラ、表示/操作、センサー、オーディオ）Man-Machine Interface: Camera, Display/Operation, Sensor, Audio

<Camera>

<Display/

Operation>

<Audio>

Ringer

Melody IC

Stereo Speakers

Music Player3D Surround

0.11M pixel

Plastic LCD Organic LEDSTN LCD TFT LCD

CCDCMOS

Touch Panel10KEY

SMART SONIC

RECEIVER®

Backside‐illumination

CMOS

1M pixel 8M pixel 13M pixel

2inch/QQVGA

65kColor

5inch/FHD

16MColor

Jog KEY

<Sensor> Acceleration Pressure

Geomagnetism

Illuminance

Ratio of ’20

* 118

Ratio of ’20

* 960

CMOS

27×80 Dots

Mono

3inch/WQVGA

262KColor

4inch/WVGA

16MColor

Gyroscope

Proximity

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Flat Speakers

<Features>

・ディスプレー部が広範囲に振動するため、耳に当てる位置を気にせず通話することができます。Since the display unit vibrates extensively, you can talk over the phone without worrying about the position of putting the earpiece to your ear.

・耳を覆うようにディスプレー部を当てると周りの騒音を遮蔽できるので、駅のホームなどの雑踏の中でも相手の声が聞き取やすくなります。Putting the display part to your ear like covering it enables you to shield background noise. Thus, it is easier for you to hear the other party’s voice even in a place full of hustle and bustle such as a railway station.

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Voice

Piezo

Vibration

Sound

Vibrationof display part

No earpiece!

Piezo Device

受話口周辺が発音しますThe circumference

of the earpiece itself pronounces.

Conventional smartphones

Earpiece

“SMART SONIC RECEIVER®” supported model

®

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・構造（機構、電気、コネクタ、シールド）Structure :Mechanical, Electrical, Connector, Shield

<Mechanical Parts>

<Connector>

0.5mmPitch 0.4mmPitch

Connector Less

Magnesium Case Hinge structure

0.8mmPitch

Slide structure

Thin CoaxialBoard to Board

Double face structure

Ratio of ’20

* 1.8

Hi Speed Path

Waterproof

<Shield>Plastic Plating Shield Printing Shield FlameVapor Deposition


34 Elements 45 Elements 54 Elements 60 Elements

<Electric Parts>550pcs 700pcs 850pcs 1,200pcs Ratio of ’20

* 2.2

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・コネクタレス接続Connector-less Connections

<Feature>・ESC(Epoxy Encapsulated Solder Connection）技術を応用し、FPCとPCBを接続By applying ESC technology (Epoxy Encapsulated Solder Connection), connect the PCB and FPC.

・コネクタレスによる軽量化、省スペース化に貢献Contributing to lightweight and space saving.

Solder + Epoxy

Heat + Press


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・パッケージング（ＩＣ、電子部品、基板）Packaging : IC, Passive Device, Electric Parts, Printed Board

<IC>

<Passive Device>

QFP

0.5mmPitchTCP

0.3mmPitch

BGA

1.27mmPitchBGA

0.8mmPitch

BGA

0.5mmPitch

PoP/BGA

0.4mmPitch

1.6mmX0.8mm 1.0mmX0.5mm 0.6mmX0.3mm 0.4mmX0.2mm

Package on PackageBGATape Carrier

PackageQFP

Ratio of ’20

* 1/64

Ratio of ’20

* 8.3

<Printed Board> Any Layer(Pasted Via)

Embedded components

Any Layer(Plated Via)

Rigid FPC Build Up

8 Layer

100um/100um

10 Layer

75um/75um12 Layer

50um/50um

Ratio of ’20

* 7.810 Layer

40um/40um


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・部品内蔵基板Component embedded PCB

<Features>

・約250個の受動部品を内蔵し、従来機種比15％の基板小型化を実現About 250 passive components are built in to achieve the board miniaturization by 15% compared to conventional models.

・半田リフロー接続Solder reflow connection.

・樹脂封止による部品放熱ストレス軽減Stress reduction in the heat dissipation of parts by the resin sealing.

The solder connection

passive components

The interlayer connection with conductive paste

Inner layer photo


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Contents







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CY2013 development modelCY2012 development model

信頼性検証

Reliability verification

製造技術

Manufacturing technology

生産技術

Production technology

応力解析

Stress analysis

基板設計

PCB design

電源解析

Power Integrity

・基板小型化の実施例を紹介しますI will introduce an example of PCB miniaturization.

4.Summary report of miniaturized PCB

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・基板設計に大きく関わる信頼性規格Reliability standards crucially involved in PCB design

落下試験と温度試験 Drop test and temperature test

MIL-STD810G・温度試験Temperature tests動作環境：-21℃/50℃で各連続3時間の温度耐久試験を実施Operating Environment: Three-hour temperature endurance tests were conducted respectively at -21 ℃ / 50 ℃.保管環境：-30℃/60℃で各連続4時間の温度耐久試験を実施Storage Environment: Four-hour temperature endurance tests were conducted respectively at -30 ℃ / 60 ℃.

・落下試験Drop test高さ約1.22mから26方向で合板（ラワン材）に落下させる試験を実施A drop test was conducted in the situation when the subject was dropped on the plywood (lauan) from the height of 1.22m in 26 directions.

ダミーモデルで熱分布を事前検証

The advance verification of the heat distribution

with the dummy model

応力変移の破壊解析により事前検証

The advance verification by destructive analysis of stress transition


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・製造技術：実装マウンターの精度向上Manufacturing technology: Improvement of placement accuracy of a component mounter

部品の実装間隙を0.2mmから0.08mmに短縮Reduction of placement gap from 0.2mm to 0.08mm between parts

実装機の限界を維持し続けることで実現Realization by continuing to maintain the limit of a mounter

0.08mm0.2mm



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・生産技術：部品ランド形状の見直しProduction technology: Review of the parts land shape最小サイズ（フィレットレスランド）の採用Consider the minimum size of (fillet-less land)

・応力解析：フィレットレス半田部の応力解析Stress analysis： Stress analysis of the fillet-less solder portions.

→0.6mm×0.3mmサイズ以下であれば、従来の応力規定値をクリアIf the size is 0.6mm × 0.3mm, clear conventional stress specified values.


Verification for PCB

Solder Fillet

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・基板設計：基板仕様の見直しPCB design: Review of the PCB specificationビア径、ライン/スペースの最適化Optimization of via diameter, line / space基板面積削減により基板取り数を改善Improve the number of PCBs by the reduction of board area

Wiring SpecLine/space=40um/40umVia Hole/Via Land=100um/200um

For two wiring between BGA pinLayer1-lyer3,Layer8-Layer10

For GND Power wiringLayer4-Layer7

For RF wiring, high-speed signal wiring

400um


layer name layer typeFinished

Thickness (µm)

mask top Solder mask 20layer 1 Copper (base+plating) 20

46.6

layer 2 Copper (base+plating) 2046.6


layer 4 Copper (base) 1562.2

layer 5 Copper (base) 1088





layer 10 Copper (base+plating) 20mask bot Solder mask 20

vias

C- layer

ALIVHlayer

C- layer

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・電源解析：電源のバイパスコンデンサ最適化Power Integrity: Optimize bypass capacitor in the power line.

配線短縮による不要なコンデンサを解析The analysis of unnecessary capacitorby wiring shortening

電源品質を確保し、約１００個のコンデンサを削除Secure power quality and remove about 100Capacitors.

Improved Layout

Maintain the AC characteristics of the equivalent


29 pcs reduction

Original Layout

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基板小型化技術によって、セット小型化と新機能取り込みを両立By the substrate miniaturization technology,

support both capture set miniaturization and new features at the same time.

Battery capacity increase:2,520mAh to 2,700mAh

Thickness

10.8mm

Len

gth

134

mm

Width 66mm

成果：従来の回路構成で基板面積を３０％削減Result: The reduction of board space by 30 % with conventional circuit configuration.


Len

gth

134

mm

Width 65mm

Thickness

10.8mm


PCBPCB

Battery Battery

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Contents







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5. Communication module

M2M（Machine to Machine)用途の車載や産業機器向けの通信モジュールVehicles for M2M applications or communication module for industrial equipment.

携帯電話より長期間使用されるので、信頼性・品質基準が異なるBecause it is used for a longer period of time than the mobile phone, reliability and quality standards are different.

スマートグリッドSmart grid

運行管理Fleet

management

テレメタリングTelemeter

リモート監視Remote

monitoring

テレマティクスTelematics

様々な用途Various purposes

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5. Communication module

→基板サイズ変遷Board size transition

CY2005Model ⇒ CY2014Model90㎜x70㎜ 40㎜x40㎜

(Conventional ratio 25%)

→ＳＭＤタイプ(QFN)にして車載専用のコネクタを削除Remove connector only for vehicles by changing the SMD type.

→熱衝撃対策：基板の基材、はんだ、樹脂硬化剤の最適化Thermal shock measures: Optimized PCB material, solder, the resin curing agent.

Newest model

Conventional model

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Contents







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6.Future prospects

・更なる軽薄短小化 Further miniaturization→費用対効果を見極めるAssess cost effectiveness.

→基板の高密度化が必須

It is necessary to achieve PCB high densification.

→Ｘ－Ｙ方向の高密度化の次はＺ方向に高密度化(3次元実装）3D-Mounting: High densification in the Z direction following the densification of X-Y direction.

・ポストスマートフォン Post smartphone→ウエアラブル端末への応用Application to wearable terminals.

→通信モジュールへの応用Application to communication module.

0.2X0.1mm size

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ご清聴ありがとうございましたThank you for your attention!

27th microelectronics workshop - jaxa27th microelectronics workshop 1 2 contents 1.部門紹介...

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