클린룸 오염제어 및 성능평가 실무 기술
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4. 0.3 ()
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DRAM
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959697'9899000102030405 06 ~ 10 () 0.35 0.25 0.2~0.18 0.13 0.10DRAM 16M 64M 256M~1G 4G 16G 200mm 300mm 400mm 0.1 0.07 0.05 0.02 0.01 0.45 0.35 0.25 0.15 1X1010 / 2X109 /
1EA/ml (0.1 )1EA/ml (0.5 ) 1EA/ml (0.02 ) / () 1 2~2.5 1 2
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Clean Room level Wafer level WaferMicro contaminationControl Cluster C/R InfraC/R Total ContaminationControl SystemMINI - ENVIRONMENT - Contamination Free Manufacturing- - High yield300mm FAB CLEAN ROOM NEED
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198619891992199519982001200420072010(m)1.30.80.50.350.250.180.130.100.07(DRAM)1M 4M16M64M256M1G4G16G64G
(CTM) Clean Tunnel Module
FFU
SMIF
Intg Mini Enc.
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2.
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()()( ,,) 3. 2. [%]
1980 1985 1990 401010402030203010 404010
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() , 4 .
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-- - -- - - ---- - -
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Air ionization systemFan Filter UnitSMIF systemChemical air filterBoron clean filter Clean Tube System
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Mini-Environment
+
( ) ( )
Know-how
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5
Room layout , , cleaning (clean paper ) class clean bench , carrier box air shower pass box
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2.
( ) /
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1.
(dry etching, CVD ) () (PVD, CMD ) sputtering / , , /vent , , ( , )/ , , photoresist, , , , (cleaning)
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7.
CVD Sputter Photo lithography SEM Dry Etching SEM , Cleaning CVD Sputter . Water Mark Water Mark .
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8. /
0.10.5~0.1 0.2~0.3 45/61~3/60.2~1/6 QC ( ) ( )
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5. Wafer Surface ScannerISPM
capabilityWafer Surface ScannerIn Situ Particle MonitorOn-wafer (all defects)yesnoDefect locationOn waferyesno
Full cycleyesno
LocalnoyesReal-timenoyes
Continuousnoyes
productYes/noyes
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1. 2. * * *
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Fig. 2-9 Airflow velocity effect on the average deposition velocity
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FIGURE 5. Comparison of the model predictions With numerical and experimental data of Opiolka et al.(1990)FIGURE 6. Minimum temperature difference Required for = 10-4 and 10-5 cm/
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4. exhaust line ISPM 8. ISPM
ISPM . (non-sampling)Sheath air focusing Non-focusing100% 100%
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(a) Uniform case (20 Torr) Time (sec) (b)Non-Uniform case (5 Torr) Time (sec) Particle Count(#/sec)Particle Count(#/sec) 15. ISPM
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Figure 16. Aerodynamic Lens
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18. ISPM (aero-dynamic lens ) 18. ISPM (1 areo-dynamic lens )
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Figure 20. ISPM (3 aero-dynamic lens ) 5.
ParticleContaminantsMolecularContaminants 1G : ~ um2G : um~0.1um2~50 Hard particleMolecular Control with Air filterUPLA, HEPA, Chemical FilterNOT control withAir filter, Nitrogen, Visual ContaminationNon-Visual
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6. (ASS : Air Scrubbing System)
Short-TemMid-TemLong-Tem ASS Mini-ASSUV- Bulk Process
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