组装⼯艺中 ⾮ic电⼦元器件 的分级 - ansi webstore...eca/ipc/jedec j-std-075 cn 组装...
Post on 08-Mar-2021
3 Views
Preview:
TRANSCRIPT
ECA/IPC/JEDEC J-STD-075 CN
组装⼯艺中
⾮IC电⼦元器件
的分级
本标准由ECA S-1被动元器件委员会指导工作组、IPC塑料
芯片载体裂纹任务组（B-10a）和JEDEC JC-14.1封装器件
可靠性测试方法委员会联合开发。由IPC TGAsia B-10aCN
技术组翻译
鼓励本标准的使用者参加未来修订版的开发。
联系方式：
ECAElectronic ComponentsAssociation2500 Wilson BoulevardArlington, VA 22201-3834Phone: (703) 907-8022Fax: (703) 875-8908
IPCAssociation ConnectingElectronics Industries®3000 Lakeside Drive, Suite 309SBannockburn, IL 60015-1249Phone: (847) 615-7100Fax: (847) 615-7105
JEDECSolid State Technology Association3103 North 10th Street, Suite 240-SArlington, VA 22201Phone: (703) 907-7534Fax: (703) 907-7583
®
This is a preview of "IPC/JEDEC J-STD-075-...". Click here to purchase the full version from the ANSI store.
This is a preview of "IPC/JEDEC J-STD-075-...". Click here to purchase the full version from the ANSI store.
This is a preview of "IPC/JEDEC J-STD-075-...". Click here to purchase the full version from the ANSI store.
top related