ECA/IPC/JEDEC J-STD-075 CN

组装⼯艺中

⾮IC电⼦元器件

的分级

本标准由ECA S-1被动元器件委员会指导工作组、IPC塑料

芯片载体裂纹任务组（B-10a）和JEDEC JC-14.1封装器件

可靠性测试方法委员会联合开发。由IPC TGAsia B-10aCN

技术组翻译

鼓励本标准的使用者参加未来修订版的开发。

联系方式：

ECAElectronic ComponentsAssociation2500 Wilson BoulevardArlington, VA 22201-3834Phone: (703) 907-8022Fax: (703) 875-8908

IPCAssociation ConnectingElectronics Industries®3000 Lakeside Drive, Suite 309SBannockburn, IL 60015-1249Phone: (847) 615-7100Fax: (847) 615-7105

JEDECSolid State Technology Association3103 North 10th Street, Suite 240-SArlington, VA 22201Phone: (703) 907-7534Fax: (703) 907-7583

®

This is a preview of "IPC/JEDEC J-STD-075-...". Click here to purchase the full version from the ANSI store.

This is a preview of "IPC/JEDEC J-STD-075-...". Click here to purchase the full version from the ANSI store.

This is a preview of "IPC/JEDEC J-STD-075-...". Click here to purchase the full version from the ANSI store.