trumicro 5000 © trumpf - confidential tld272he - 25.04 · company presentation trumpf (e in euro)...

TLD272he - 25.04.2012TruMicro 5000 © TRUMPF - confidential

Disk based amplification ps lasers and theirDisk based amplification ps lasers and their applications

TRUMPF (China) Co.,Ltd.蔡伟军

Manager Low power laser division13913591512William.Cai@cn.trumpf.com

TruMicro 5000 © TRUMPF - confidential

About TrumpfAbout TrumpfWe are a high-tech company that focuses on manufacturing technology, laser technology and g gy, gymedical technology.

We offer our customers both innovative and high-quality products.

We are represented in all world markets, l t t ith 58 b idi iclose to our customers with 58 subsidiaries.

We are a family business established in 1923 and our goal is to stay economically independentgoal is to stay economically independent.

Company Presentation TRUMPF (E in Euro)

Our Products and CustomersOur Products and CustomersMachine Tools/Power Tools

Laser Technology/Electronics

MedicalTechnology

MedicalTechnologyElectronicsLaser

TechnologyMachine Tools

Hospitals andPlant engineering ofAutomotive and su-Metalworking industry (mechanical / Hospitals and clinics

Plant engineering of systems for the pro-duction of semicon-ductors, flat screens, solar cells, coating of

Automotive and su-ppliers, electronics /precision engine-ering, mechanical engineering, tool

Metalworking industry (mechanical / apparatus engineering, vehicle construction, electronics /switching cabinets)

, garchitectural glass

g g,and mold making

2012-05-16Company Presentation TRUMPF (E in Euro)

ContentsContents

• Why shorter than short?

• How to obtain ideal pulses - TruMicro 5000

• Applications

ContentsContents

• Applications

Nanosecond Pulse Laser Material InteractionNanosecond Pulse Laser - Material Interaction Absorption exceeds Electron-Phonon-Interaction-Time (EPIT) Thermal equilibrium between electrons and lattice q Melt phase + vapor phase (ablation) Absorption in vapor Plasma shielding

AbsorptionAbsorption

Ablation

0 1 ps 100 ps 10 ns 1 µs

Ultrashort Pulse Laser Material InteractionUltrashort Pulse Laser - Material Interaction Energy transfer from (pulsed) laser light to electrons (absorption) After Electron-Phonon-Interaction-Time (EPIT)( ) Energy transfer from electrons to phonons: Heat Ablation of material

AbsorptionAbsorption

Ablation

0 1 ps 100 ps 10 ns 1 µs

ContentsContents

• Applications

Obtaining ps PulsesObtaining ps-Pulsesps (and fs) Oscillators: Tens of MHz repetition rate (given by resonator length)p (g y g )

Laser Mediumase ed u

Obtaining ps PulsesObtaining ps-Pulsesps (and fs) oscillators: Tens of MHz repetition rate (given by resonator length)p (g y g ) Pulse selection to lower repetition rate

Pulse energies in nJ scale Amplification needed (5 orders of magnitude) Amplified

Pulses

y OscillatorPulse Train

SelectedPulses

En Pulse Train Pulses

PulseSelection Amplifier

Comparison of Concepts for AmplificationComparison of Concepts for Amplification Linear Amplifier (e.g. rod, fiber, slab)

Oscillator Amplifier Amplifier …

First pulse issues; rod laser: beam distortions accumulate

R ti lifi ( di k) Regenerative amplifier (e.g. disk)

Oscillator Amplifier External Modulator

No first pulse issues, TEM00 resonator guarantees beam quality

Osc ato Amplifier External Modulator

quality

Solid State Laser ConceptsLaser emission

Solid State Laser Concepts

pump light

Cooling through ground surface

Parabolic temperature profile Flat temperature profile Cooling and pumpingthrough lateral surface

Cooling throughlateral surface

Rod laser Disk laser Fiber laser

Cooling Mechanism: From Rod to DiskCooling Mechanism: From Rod to Disk

radial pumplight

radial cooling

frontal pumplight

area cooling into a heat sinkp p g g p p g

T T T T T

r r b li

r r r flat temperature

profile

Rod laser

parabolic temperature

profile

Disk laser

Rod laser Disk laser

Scaling the Average Power of ps LasersScaling the Average Power of ps Lasers Rod-type amplifiers:

- Limited in average power due to thermal effectsg p

Most promising technology: Disk- Trumpf demonstrated a picosecond regenerative amplifier

exceeding >100W (based on TruMicro 5000) already back in 2009

Ad t Advantages:- High surface to volume ratio - Superior heat management

High average powers with good beam quality- High average powers with good beam quality- No nonlinear effects / low intensities

DISK LaserDISK Laser

Scalability of Laser Output Power

PL ~ Dp2

a certain laser power can be extracted per

Scalability of Laser Output Power

PL Dppunit of area

Pumped spotTLS disk cavity

Pumped spotTLS disk - cavity

TruMicro 5000 Regenerative Thin Disk AmplifierTruMicro 5000 – Regenerative Thin Disk Amplifier

Thin DiskG i M di

OscillatorOscillator

Gain Medium

Hi h tOscillatorOscillator

Seed Lasert i d

Thin DiskAmplifier

HighestPeak

Powersl illi f ld P l S l ti

ExternalModulator

generates picosecondpulses at low energy

RingResonator

(modelocked Fiber laser)

pulses million foldamplified to many tens of Megawatts

Pulse Selection& Modulation

@ constant beam

18Ultrafast Disk Lasers and Amplifiers © TRUMPF - www.trumpf.com

TruMicro Series 5000 (compact) 100 cm x 60 cmTruMicro Series 5000 (compact) 100 cm x 60 cm

TruMicro 5025 TruMicro 5225

Max. Average Power 25 W 15 W

Wavelength 1030 nm 515 nmg

Pulse Duration < 10 ps < 10 ps

Max Pulse Energy 125 µJ 75 µJMax. Pulse Energy 125 µJ 75 µJ

Repetition Rate 200-800 kHz 200-800 kHz

B Q li M ² 1 3 M² 1 3Beam Quality M ² < 1.3 M² < 1.3

TruMicro 5350 / 5360TruMicro 5350 / 5360

Durchschnittsleistung 10 W 15 W

Wellenlänge 343 nm 343 nmg

Pulsdauer < 10 ps < 10 ps

Max Pulsenergie 50 µJ 37 5 µJMax. Pulsenergie 50 µJ 37.5 µJ

Repetitionsrate 200-400 kHz 400, 800 kHz

S hl li ä M² 1 3 M² 1 3Strahlqualität M² < 1.3 M² < 1.3

• specified UV crystal life-time of more than 10 thousand hours of operation ith t i i

without using a micro mover

External ModulatorExternal Modulator

F tFeatures: Transmission given by HV (analog signal) Pulses triggerable, (e.g. every 2nd pulse)

Advantages: No first pulse issues! No variation of output beam properties (diameter divergence) with power!

No variation of output beam properties (diameter, divergence) with power!

TruMicro 5050 Power and Pulse DurationTruMicro 5050 – Power and Pulse Duration

set point

1028 1030 1032 1034Inte

Wavelength (nm)

set point

A P > 50 W ( 65 W) Pulse Duration: 6 ps (sech2 Fit)

0Pump Power -50 -40 -30 -20 -10 0 10 20

Delay (ps)

Average Power: > 50 W (max. 65 W)

Optical Efficiency: 50%

Pulse Duration: 6 ps (sech2 Fit)

Spectral Width: 1 nm (FWHM)

Compact Laser Head Main ComponentsCompact Laser Head – Main Components

Electronics

Seed laser

AmplifierIR/Green/UV p(sealed)

IR/Green/UV module(sealed)

Externalmodulator

Safetyshutter

TruMicro Series 5000 (compact)TruMicro Series 5000 (compact)

TruMicro Ps Series Product roadmapTruMicro Ps Series Product roadmap Lower average power Ps laser ≤10WTruMicro2000

Higher average power Ps laser 150WIR Ps

Shorter pulse duration＜1Ps

ContentsContents

• Applications

Applications by IndustriesApplications by Industries Semicon

- Cutting/drilling of Si-, Ge-, GaAs-, Sa-, AlO-, AlN- Wafers - Thin-film ablation (e.g. low-k)

Flat Panel Displays- Cutting of thin glassCutting of thin glass

Photovoltaics- Thin film ablation (e.g. P1-P3 scribing for CIGS solar cells)

Cutting/scribing of Si- Cutting/scribing of Si

Medical- Stent cutting

Automotive- Drilling of injectors- Structuring of metal surfaces

- Cutting/Drilling of Si-, Ge-, GaAs-, Sa-, AlO-, AlN- Wafers - Thin-film ablation (e.g. low-k)

Semicon: Cutting of Silicon WafersSemicon: Cutting of Silicon WafersAdvantages:

Small cutting kerf (< 20 µm)

Negligible HAZ

High quality of cutting edge

Hi h d i i d hi h High productivity due to high average power

Applications: Waferdicing Applications: Waferdicing

Semicon: Cutting of Silicon WafersSemicon: Cutting of Silicon WafersAdvantages:

Small cutting kerf (< 20 µm)

Negligible HAZ

Applications: Waferdicing Applications: Waferdicing

Thinning for smaller space: Why to thin?Thinning for smaller space: Why to thin? Reduction of thickness by half provides

50% reduction in height and 30% in Sifootprint of packagingSi

Ultra-thin Silicon gets flexible!

Blade saw gets slow!H2

Laser gets fast! (100 mm/s cutting speed)

50 m wafer.

Semicon: Cutting / Scribing of CeramicsSemicon: Cutting / Scribing of CeramicsAdvantages:

Small kerf width (< 20 µm)

Negligible HAZ

Applications: Scribing / cutting of Applications: Scribing / cutting of ceramic PCBs

Semicon: Cutting/scribing of CeramicsSemicon: Cutting/scribing of CeramicsAdvantages:

Negligible HAZ

Applications: Scribing / cutting of Applications: Scribing / cutting of ceramic PCBs

FPD: Scribing and Cutting of Thin GlassFPD: Scribing and Cutting of Thin GlassAdvantages:

Negligible HAZ

Application: Scribing / cutting of Application: Scribing / cutting of thin glass for Flat-Panel-Displays

Display Glass CuttingDisplay Glass Cutting Chemically strengthenedglass for cover glassg gOne glass solutionSpeaker holesHome buttonNon strengthened glassfor displayUltra-thin glass

Christof SiebertLaser solutions for mobile devices © TRUMPF - confidential

Thin Film Ablation nsThin Film AblationLaser patterning of thin Mo on glass Melt/

Delamination

Burr free

Melt free Cracks

No delamination

I l t d h lps

Isolated channel

Application: P1 step for CIGS cell connectionconnection

Thin Film AblationThin Film AblationLaser patterning of thin films on Silicon

Direct patterning of SiO/SiN layers

Thickness of layers: 100 nm

Single shot ablation

S l ti l ith t ff ti Selective removal without affecting base material (Silicon)

Application: Cell connection for Silicon Application: Cell connection for Silicon solar cells, low-k dielectric grooving

PV: Thin Film Ablation nsPV: Thin Film AblationLaser patterning of thin Mo on glass Melt/

Delamination

Advantages:- Negligible burr- Negligible melt Cracks

- No delamination- High speed (> 4 m/s)

Application: P1 step for CIGS cell connection

Patterning of CIGS Solar CellsPatterning of CIGS Solar Cells P1: Patterning of back contact (Molybdenum) P2: Patterning of absorber (CIGS) g ( ) P3: Patterning of front contact and absorber

Connection of cells on a module

Advantage laser vs. mechanical scribe: Reduced „dead area“ higher efficiency

Absorber

Front Contact

P1 P2 P3

Cutting with picosecond pulsesCutting with picosecond pulsesCutting of Nitinol

Small cutting kerf (< 10-20 µm)

Negligible HAZ

No electro polishing!

High yield

High productivity due to high average High productivity due to high average power

Application: Cutting of Stents,

endoscopes

State of the art Stent CuttingState-of-the-art Stent Cutting

Fusion cutting with single mode fiber lasersOutput power 50 to 200 W (typically 100 W)- Output power 50 to 200 W (typically 100 W)

- Modulation: cw to 50 kHz- Cutting optics

Cutting result- Thermal cutting process- Burr formation- Heat affected zones- Spillings (metal splatters)

Expensive reworking required- mostly by hand

Stent Cutting with TruMicro Series 5000Stent Cutting with TruMicro Series 5000 Highest quality cutting process

- Negligible burr formationg g- Negligible HAZ

Materials (e.g.): - CrCo- Nitinol- Polymers

Ab b bl i l- Absorbable materials

Reduction of scrap at the beginning of the process chainbeginning of the process chain

Saving of expensive materialsSaving of expensive finishing

processes

SEM Pictures (1)SEM Pictures (1)

SEM Pictures (2)SEM Pictures (2)

Nitinol

Drilling with high Aspect RatioDrilling with high Aspect RatioHelical Drilling of MetalNo melt or debrisNo Heat Affected ZoneFree selection of taper (positive,

negative or zero) Diameters: 50 to 100 µm Material thickness: up to 2 mm Applications: cooling holes for

t bi bl dEntrance

turbine blades

Successful application - Injector drilling

Material: Stainless Steel Thickness: 1mm Min. Diameter: 50umAspect ratio: 1 : 20Roundness of the hole: > 95%Surface quality: No burrProduction speed: 1s/holeLaser: TruMicro 5250T h l h li l d illiTechnology: helical drilling

11/4/2013 52AMSM 2012

Structuring with Picosecond PulsesStructuring with Picosecond PulsesStructuring of tribological surfaces

Advantage TruMicro 5050:

Burr free processing

No postprocessing required

Hi h h h d hi h High throughput due to high average power and repetition rate

Applications: cylinder bore

Foto: Gehring

Applications: cylinder bore, punching tools, piston, …

Cutting of SapphireCutting of Sapphire

0.4 mm Sapphire Wafer Smallest feature size 0 2 mm 0.4 mm Sapphire Wafer Smallest feature size 0 2 mm Smallest feature size 0.2 mm ~5 s per small disc Smallest feature size 0.2 mm ~5 s per small disc

Drilling of PCBs PCB钻孔Drilling of PCBs PCB钻孔

Vias and blind holes down t l

Vias and blind holes down t lto copper layer盲孔和通孔

IR picosecond laser红外皮秒

to copper layer盲孔和通孔

IR picosecond laser红外皮秒

FR4 + glass fiber

红外皮秒

Percussion drilling脉冲冲击钻孔

40 µm diameter

红外皮秒

Percussion drilling脉冲冲击钻孔

40 µm diameter

µ直径40微米

~1 ms drilling time per hole每孔一个毫秒

µ直径40微米

~1 ms drilling time per hole每孔一个毫秒

high repeatability高重复性

Patents for Ultrafast MachiningPatents for Ultrafast Machining

• U.S. patent Nr. 5,656,186 protects cold machining with ultrashort laser pulses (< 10 ps)

• The patent was unsuccessfully challenged in 2007

• US-patent valid until 2014, outside the US until 2015

• TRUMPF holds a non exclusive license which is transferable to its customerstransferable to its customers

TruMicro Series 5000 (compact)TruMicro Series 5000 (compact)

High performance micro-machining with small footprint and low cost

g pe o a ce c o ac g t s a ootp t a d o cost

Thank You!谢谢大家！

通快中国有限公司 /TRUMPF China Co., Ltd通快中国有限公司 /TRUMPF China Co., Ltd 蔡伟军电话：13913591512邮箱：william.cai@cn.trumpf.com

trumicro 5000 © trumpf - confidential tld272he - 25.04 · company presentation trumpf (e in euro)...

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