ansys docs (1)

Upload: bitconcepts9781

Post on 07-Apr-2018

219 views

Category:

Documents


0 download

TRANSCRIPT

  • 8/6/2019 Ansys Docs (1)

    1/7

    Dimensions are in inches [mm]

    SnapTac Series

    3 / 111www.hypertronics.com

    Miniature RectangularConnectors

    HyperSpring spring loaded contacts, self-cleaningwiping action

    12 or 21 contact configurations

    Combine robust environmental performancewith compact size and light weight

    Easy and fast push-pull locking mechanism

    Full line EMI shielding

    IP67 sealing when mated and unmated

    D-shape hardware coding to avoid mismatching

    4 position key coding available on request

    Overmolding solutions

    Upgrade commercial high speed Fast Ethernet, USB,IEEE 1394 interconnect to Mil Spec performances

    General Specifications

    General

    Number of Contacts 12, 21

    Receptacle Terminations Solder Cup, Dip Solder

    Plug Termination Solder Cup

    Cable Diameter Range 0.315 [8.00] max.

    AWG Contact 26 - 30

    HyperSpring Force 5.5 oz. max. per contact

    Connector Mating Force 12 Contacts: 180.0 oz., 21 Contacts: 215.0 oz.

    Connector Unmating Force 36.0 oz. (after locking system release)

    Electrical and Mechanical Characteristics

    EMI Shielding Yes

    Current Rating 3 Amps at 25 C

    Breakdown Voltage 625V

    Dielectric Withstanding Voltage (between contacts) 500V

    Contact Resistance (low level) < 15 milliohms

    Insulation Resistance 5000 Megohms at 500VDC - EIA364.21

    Vibration EIA364.28 Condition III

    Shock EIA364.27 Condition G

    Weight (Plug and Receptacle with contacts without cabl ing) 12 Contacts: 0.8 oz., 21 Contacts: 1.0 oz.

    Materials and PlatingHousing

    Material

    Plating

    Aluminium alloy

    Zinc cobalt conductive RoHS compliant

    Plug Overmolding Thermoplastic hotmelt

    Contact

    Material

    Plating

    Brass, beryllium copper

    Gold

    Environmental Characteristics

    Temperature Range -65 C to 80 C

    Salt Spray EIA364.26 Condition A (mated connectors)

    Humidity EIA364.31 Method IV

    IP Level 67 mated and unmated

  • 8/6/2019 Ansys Docs (1)

    2/7

    SnapTac Series

    3 / 112 www.hypertronics.com

    Dimensions are in inches [mm]

    12 Contact Plug With Overmolding and Cabling

    12 Contact Plug - Solder Cup Termination

  • 8/6/2019 Ansys Docs (1)

    3/7

    Dimensions are in inches [mm]

    SnapTac Series

    3 / 113www.hypertronics.com

    12 Position Receptacle - Dip Solder Termination

    12 Contact Receptacle - Solder Cup Termination

    Panel Cut-out

    D L

    A0.124[3.15]

    0.551[14.00]

  • 8/6/2019 Ansys Docs (1)

    4/7

    SnapTac Series

    3 / 114 www.hypertronics.com

    Dimensions are in inches [mm]

    21 Contact Plug - With Overmolding and Cabling

    21 Contact Plug - Dip Solder Termination

  • 8/6/2019 Ansys Docs (1)

    5/7

    Dimensions are in inches [mm]

    SnapTac Series

    3 / 115www.hypertronics.com

    21 Contact Receptacle - Dip Solder Termination

    21 Contact Receptacle - Solder Cup Termination

    Panel Cut-out

  • 8/6/2019 Ansys Docs (1)

    6/7

    SnapTac Series

    3 / 116 www.hypertronics.com

    Dimensions are in inches [mm]

    21 Contact Flange

    Optional for Rear Panel Mounting

    12 Contact Flange

    Optional for Rear Panel Mounting

  • 8/6/2019 Ansys Docs (1)

    7/7

    Dimensions are in inches [mm]

    SnapTac Series

    3 / 117www.hypertronics.com

    Ordering Information

    Numberof Contacts

    12, 21

    ConnectorType

    R = Rectangular

    CablingScheme

    CH01, CH02, CH03(According to customer spec)

    TerminationStyle

    S = Solder cupD = Dip solder, 0.124 [3.15]L = Dip solder, 0.551 [14.00]

    ConnectorStyle

    P = PlugR = Receptacle

    ConnectorSeries

    SnapTac

    HardwareCode

    C00 = Not codifiedC01-C16 = Codified

    SNAPTAC SP C01 CH0121R