bridging the gap between power pcbs and bus bars … the gap between power pcbs and bus bars for...

Bridging the Gap Between Power PCBs and Bus Bars for Power

Electronics Applications

By Albert J Mastrangelo, Rogers Corporation, USA and

Koen Hollevoet, Rogers BVBA, Belgium

Motor, Drive & Automation Systems Conference, Orlando FL USA March 13, 2012.

Outline

• Power Distribution – PCBs and Busbars. • Current Technologies – Limitations. • Advanced Applications – Unmet Needs. • Defining Advantages. • Current Applications. • Future Work. • Conclusions.

Motor Drive & Automation Systems Conference 2

Current Solutions - Copper Thickness

Motor Drive & Automation Systems Conference

Copper Thickness (mm)

0.035

0.400

0.800

Power PCB’s

Conventional Busbars

3

Power PCB Basics: Add More Copper


“Iceberg Technology” – patented by KSG Leterplatten GmbH

Signal path

Filled milled gap

Copper inlays – patented by Korsten & Goosens GmbH

Wirelaid™ Technology – patented/trademarked by Jumatech Combi Board – Schweizer Electronics GmbH

There are several creative PCB technologies to increase copper thickness

4

Power PCB Issues in Power Electronics

• Supply issues – Not all PCB suppliers can handle thick copper.

• Reliability

– Thermal stress leads to delamination, cracking, measeling. • In application- due to high current density • In manufacturing- due to drilling thick copper

– Thick copper affects process window • PCB fabrication (soldermask application, HAL) • PCB assembly: e.g. soldering processes

– Compromised integrity mounting screwed components. • Cost

– PCB cost increases due to adding thicker copper. – Longer process time (e.g. etching), Higher material cost and waste

(copper), More tooling / more manual operations. – Impact on yield.

• Creative constraints – 2-D limits designs and reduces ability to optimize form factor.

FR4

Cu


Summary - Limitations of Power PCB


• Supply limitations - outside of standard processes. • Higher costs associated with selectively adding copper. • Potential for delamination, cracking, and measeling. • Insulation gaps - solder mask may not bridge steep

edges. • Mechanical integrity may be compromised upon

assembly. • Creative Constraints --- 2-D.

6

Power Distribution – PCBs and Bus Bars

• New Applications Require Intermediate Solutions. – Solar Inverters. – Low Voltage Drives. – EV and (H)EV Power Trains.

• Convergence - Common Requirements. – Thinner Conductors – Copper or Aluminum. – Form Factor Constraints – Size and Weight. – Increasing Complexity. – Higher Volumes.


Quantities Of Bus Bars By Application

8 Motor Drive & Automation Systems Conference

A New Circuit Technology - PowerCircuit™

10 100 1.000 10.000

Typical Current (Amperes)

Rail

Renewable

HVDC

LV drives

EV

0

?


Power PCB

Laminated Bus Bar

Circuit Technologies - Type


Cables

PCB

Laminated Busbars

Stacked Busbars

Current

Voltage

HIGH

HIGH

LOW

LOW

Thicker insulation

Low inductance Partial Discharge controlled 3D

Thic

ker

copp

er

RO-LINX® PowerCircuit™

Technology

2D

10

Defining Unmet Needs

• Provide added functionality - Current Carrying Capacity PLUS: – Active and Passive Components – Electronic Control Circuitry.

• 3-D Capability To Meet Form Factor Requirements • Active or Passive Thermal Management Opportunities. • Compatibility with Interconnection Processes • Compatibility with Component Mounting Processes. • Complexity Reduction


Circuit Technologies - Conductor Thickness


Conductor Thickness (mm)

0.035

0.500

1.000

Power PCB’s

Conventional Busbars

RO-LINX® PowerCircuit™ Technology

12

Advantages

• Meets Application Demand Without High Cost Additive Copper Process. • Thin copper solution – 0.5 mm to 1.0 mm and carries 100-500 A.

• Enables Added Functionality. • Active or Passive Components – capacitors, etc.

• Reduces Thermal Stress and Improves Thermal Performance. properties vs. PCBs.

• Enables 3-D Design. • Permitting creative solutions to meet form factor requirements and space/weight

limitations. – THINK OUT OF THE PLANE!

• Reduces Complexity. • Eliminates cabling, wiring, etc.

• Reduces Assembly Steps, Error Probability, and Costs. • Enables High Throughput Soldering and Component Assembly.

. Motor Drive & Automation Systems Conference 13

Interconnection Capabilities

Compatibility with various interconnection and component mounting technologies is critical for volume production.

Riveted Soldered Mechanical Fastened


Soldering Process Details

• Equipment : ERSA EWS 330 • Flux : Interflux IF2005 C • Solder Alloy : SnCu (Interflux®) at 269 C • Pre-heating : topside before wave. • Insulation : Polyimide • Solderpath : Patented design


Performance Characteristics

• Fabrication Technology – Proprietary Insulation Materials – High Performance Adhesives – Proven Assembly Technology

• >20 yrs lifetime in rail, off-road vehicle, and other demanding applications.

• Temperature – -40°C to +105°C continuous operating temperature.

• Reliability – Operational Life: >15 years. – Temperature Cycling: 1000 cycles (-40°C to +125°C).

Open mould Closed mould


Power Electronics Applications


(Hybrid) Electrical Vehicles

17

DC/DC Converter: Typical Products RO-LINX® PlanarPower™ RO-LINX® PowerCircuit™

Motor Drive / Power Electronics: Typical Products RO-LINX® PowerCircuit™

Energy Storage / Battery Packs: Typical Products RO-LINX® Hybrid™

Fast Battery Charger: Typical Products RO-LINX® PlanarPower™

Power Electronics Applications


Commercial Inverters • Wind Energy Inverters • Solar Inverters • 100-500 A Typical

LV Variable Frequency Drives • Voltage Inverter • Frequency Inverter • UPS

Grid Voltage 110 V 220 V 110 V 220 V1-phase 1-phase 3-phase 3-phase

5 kW 45 A 23 A10 kW 91 A 45 A25 kW 227 A 114 A 76 A 38 A35 kW 318 A 159 A 106 A 53 A

100 kW 909 A 455 A 303 A 152 A250 kW 2.273 A 1.136 A 758 A 379 A500 kW 4.545 A 2.273 A 1.515 A 758 A

1.000 kW 9.091 A 4.545 A 3.030 A 1.515 A

Power (kW) versus Current (A)

18

Future Work


RO-LINX® PowerCircuit™ Applciations • Explore Adjacent Technologies • Support Higher Service Temperatures to 125 C.

Battery Pack Applications - RO-LINX®Hybrid™ • Integrates Power Connection With Signal Lines:

– Flex circuit (replacing wires) – Various plating options (oxidation)

• Advantages: – Assembly time reduction – Error free connection – Smaller form factor – Ease of maintenance

19

RO-LINX® PlanarPower ™ contains a 10 kW planar transformer in a E64

core

(Patent Pending)

Future Work


Integrated Planar Transformers RO-LINX®PowerPlanar™ • Lower Losses

– Eliminate some of the connection losses (hot spots) – Reduces the leakage and stray inductance between the terminations

• Improved Thermal Management

– Reduced losses – Improved thermal transfer through busbar

• Reduced Stack Height

– >10% height reduction

• Improved Mechanical Tolerances – Easier mounting

20

Conclusions - PowerCircuit™ Technology


• New Multilayer Circuit System for Power Electronics.

• Add Funtionality – Power and Passives. • Compatible with High Volume Manufacturing

and Assembly Technologies. • 3D Capability Enables Compact Designs. • Thermal Management Opportunities. • Proven High Performance and Reliable

Technology. • Future Developments for Adjacent

Applications.

Bridging the Gap Between Electronics and Power Electronics

21

Let us help you build a better world.

Technology leaders in materials and components for breakthrough performance, efficiency, and reliability.

Thank You

Questions? Al Mastrangelo [email protected] +1 919 342 5687


mailto:[email protected]

bridging the gap between power pcbs and bus bars … the gap between power pcbs and bus bars for...

Documents