1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Copyright 2003 Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.

Data sheet acquired from Harris SemiconductorSCHS115D – Revised September 2003

VOH

The CD4093B types are supplied in 14-lead

hermetic dual-in-line ceramic packages (F3A

suffix), 14-lead dual-in-line plastic packages (E

suffix), 14-lead small-outline packages (M, MT,

M96, and NSR suffixes), and 14-lead thin shrink

small-outline packages (PW and PWR suffixes).

PACKAGE THERMAL IMPEDANCE, θJA (See Note 1):E package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NOTE 1: Package thermal impedance is calculated in accordance with JESD 51-7.

VDD

VDD

VP

VN

VSSVOL

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio

Data Converters dataconverter.ti.com Automotive www.ti.com/automotive

DSP dsp.ti.com Broadband www.ti.com/broadband

Interface interface.ti.com Digital Control www.ti.com/digitalcontrol

Logic logic.ti.com Military www.ti.com/military

Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork

Microcontrollers microcontroller.ti.com Security www.ti.com/security

Low Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless

Video & Imaging www.ti.com/video

Wireless www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated

PACKAGING INFORMATION

Orderable Device Status (1) PackageType

PackageDrawing

Pins PackageQty

Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

7704602CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD4093BE ACTIVE PDIP N 14 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type

CD4093BEE4 ACTIVE PDIP N 14 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type

CD4093BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD4093BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

CD4093BM ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BM96 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BME4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BMG4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BMT ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BNSR ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BPW ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4093BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

PACKAGE OPTION ADDENDUM

www.ti.com 18-Sep-2008

Addendum-Page 1

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD4093B, CD4093B-MIL :

• Automotive: CD4093B-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

PACKAGE OPTION ADDENDUM

www.ti.com 18-Sep-2008

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1(mm)

W(mm)

Pin1Quadrant

CD4093BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

CD4093BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

CD4093BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD4093BM96 SOIC D 14 2500 346.0 346.0 33.0

CD4093BNSR SO NS 14 2000 346.0 346.0 33.0

CD4093BPWR TSSOP PW 14 2000 346.0 346.0 29.0

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE14 PINS SHOWN

0,65 M0,10

0,10

0,25

0,500,75

0,15 NOM

Gage Plane

28

9,80

9,60

24

7,90

7,70

2016

6,60

6,40

4040064/F 01/97

0,30

6,606,20

8

0,19

4,304,50

7

0,15

14

A

1

1,20 MAX

14

5,10

4,90

8

3,10

2,90

A MAX

A MIN

DIMPINS **

0,05

4,90

5,10

Seating Plane

0°–8°

NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.D. Falls within JEDEC MO-153