company profile - 台光電子材料股份有限公司 · company profile elite material co., ltd....
TRANSCRIPT
Innovation
Globalization
Diversification
Company Profile
Elite Material Co., Ltd.
EMC confidential, Mar 23, 2015 REV B
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 2
In 2013, EMC was the largest halogen-free laminator and the 6th largest overall laminate manufacturer in the world (Prismark, 2013)
EMC Group OutlineTAIEX listing code: 2383
Established: 1992 Manpower: 2,300+Capacity: 2.8 KK sheets/ month (CCL)
7.2 KK m/ month (PP)800 K SF/ month (Mass Lam) 40K panels/ month (MCCCL)
Stock capital: USD 103 million Revenue in 2014: USD 623 million Qualification: ISO-9001, ISO-14001,TS-16949,
QC080000 and Sony Green Partner UL file number: E150504
Global Footprint
Kunshan, China
Zhongshan, China
CA
Taiwan,
HQ
OH Korea
Japan
Production facility
Distributor
Germany, UK and France
Representative office
AL
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 3
Manufacturing Location and Capacity
EMC (KS)
Kunshan
CCL: 1.35kk sht/ mon
PP: 3.3kk meter/ mon
Manpower: 800+
EMC (TW)
Hsinchu
Mass Lam: 800k ft2
MCCCL: 40,000 pnls
(15 K panels/ day)
Manpower: 300+
EMC (TW)
Taoyuan
CCL: 500k sht/ mon
PP: 1.8kk meter/ mon
Manpower: 500+
EMC (ZS)
Zhongshan
CCL: 950k sht/ mon
PP: 2.1kk meter/ mon
Manpower: 600+
EMC monthly laminate capacity has reached 2.8 million sheets since July 2014.
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 4
Milestone
1992 1993 1998 1999 2002 2005 2009 2010 2011 2012 2013
EMC was
founded in
Taoyuan,
Taiwan
Mass production
with monthly CCL
capacity 100K
sheets
Kunshan plant
founded to serve
northern China
market
Having obtained
Sanmina-SCI
ZBC-2000 ®
license
IPO launched
successfully on
TAIEX with trading
code 2383
Licensed Halogen-
free material “EM-
280” from Hitachi
Chemical , Japan
Zhongshan plant
founded to serve
southern China
market
Hsinchu plant
founded to provide
Mass Lam service
in Taiwan
Having been
listed on MSCI ®
Global Small Cap.
Indices
Having completed SI
Lab with Cisco S3, IBM
SPP and Intel Set2DIL
measurement capability
Having been
awarded with
China High-Tech
Enterprise
certificate
Having been
ranked as the
world’s largest
Halogen-free
laminator by
Prismark®
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 5
65 72 82 87 84 105 114 132 116141 131
6081
101 110 120
169185
214 239
264 270
59 5875
136
163
162 165
185 196
3227
30
38
39
4240
33 40
0
100
200
300
400
500
600
700
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015E
Mass Lam
CCL-ZS
CCL-KS
CCL-TW+HK
Sales Revenue
Unit: USD million 623 million
USD 637 million
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 6
Global Ranking in Y2013Global Green Laminate Market
Global Laminate Market
Mass Lam sales is excluded.
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 7
M.I.S. Dept.
Finance Dept.
Human Resource
Strategy Development Office
President: Dr. Albert Tung
Y.R. Peng (Technical)
Vincent Choi (HTg/ Auto OEM)
Danny Yang (Mobile OEM) Purchasing
Zhongshan Plant
Gary Wang
R&D
Board of Directors
M/L Plant
Benny Chang
Manufacturing
Sales &
Marketing
Johnson Chiao
Administration
Manufacturing
Quality Assurance
Technical Dept.
Production Dept.
Engineering Dept.
Domestic Sales
Manufacturing
Administration
MPC Dept.
C.S.E Dept.
Domestic Sales
Sales &
Marketing
Honda Lin
CCL Manufacturing
Peter Huang
1st Production
Quality Assurance
Process Engineering
Facility Dept.
Chairman
F. L. Tsai Auditing
President
Dr. Albert Tung
Oversea Sales
Sales & Marketing
Danny Yang
MPC Dept.
Taiwan Plant
Gary Wang
Kunshan Plant
Kenny Kuan
EMC HK office
Account Dept.
Organization Chart
Administration
Benny Chang
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 8
Product BenchmarkingDf Scope by
Cisco S3 (@10 GHz)
Df Scope by
IBM SPP (@ 1 GHz)Tg
Benchmark
Materials
EMC
Proposed
Materials
Sample
Status
Production
Site
>/=
0.020High loss
0.020~
0.023
Standard
Loss
150 IS-400/ IT-158 EM-825 OK TWN+KS+ZS
170 370 HR EM-827 OK TWN+KS+ZS
0.015~
0.020
Standard
loss
0.015~
0.020
Upper Mid
Loss
150R-1566
EM-285
EM-370(5) OK TWN+KS+ZS
R-1555 EM-355(D)
170
NPG-170EM-370(Z)
EM-370OK
ZS
TWN+KS+ZS
Megtron 2
TU-862HF
EL-190T
EM-370(D) OK TWN+KS+ZS
0.010~
0.015
Mid Loss
0.012~
0.015
Lower Mid
Loss
150FR-408/ IS-415
EM-355(S)OK TWN+KS+ZS
170
EM-828G
0.008~
0.012Low Loss
408HR / I-Speed
N4000-13 EP
TU-872 SLK
Megtron 4
EM-888
EM-888(S)OK TWN+KS+ZS
0.005~
0.010Low loss
0.004~
0.008
Very Low
Loss170
Megtron 6
RO4350
EM-888K
EM-891
EM-890
OK
Q3, 2015
Q2, 2016
TWN+KS+ZS
TWN
TWN
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 9
Product Roadmap- High Speed Application
2014 2015 2016 2017
EM-828G low loss material Dk 3.9 / Df 0.008
Research Qualification Mass Production
EM-888 / EM-888(S) low loss material Dk 3.9 / Df 0.006
EM-370(D) mid. loss material Dk 4.1 / Df 0.011
* Except for EM-891, all above materials are halogen free material
** Dk/ Df data are measured with RC50% at 1 GHz
EM-891 Very low loss material
Dk 3.7 / Df 0.004
Feb 2015
EM-355(S) low loss material Dk 4.0 / Df 0.0085
EM-890 Very low loss material
Dk 3.7 / Df 0.004
EM-888K Very low loss material (low Dk glass) Dk 3.4 / Df 0.005
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 10
Product Roadmap- Hand Held Application
2014 2015 2016 2017All above materials are halogen free material* Dk/ Df data are measured with RC75% at 2 GHz
Feb 2015
Research Qualification Mass Production
EM-285B(L) dust free low flow Prepreg
EM-355(D) middle Tg with low Dk3.3*
EM-285 & EM-370(5) middle Tg
EM-355(S) with low Dk(3.3) and Df(0.010)*
EM-355B(L) middle Tg with low Dk3.3* low flow Prepreg
EM-355(D)K middle Tg with low Dk (Low Dk glass) Dk3.1*
EM-LX high Tg with low CTE core for HDI hybrid
application
Film material with low Dk(< 3.0)
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 11
Product Roadmap – Automotive Application
2014 2015 2016
Research Qualification Mass Production
EM-825 Middle Tg, CTE (3.2%)
EM-370(Z) Halogen free, high Tg
& Very low CTE (1.8%)
2017
EM-827 High Tg, Low CTE (2.6%)
Mar. 2015
11
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 12
Product Roadmap- IC Substrate
2014 2015 2016
*All above material are halogen free material, Tg measured by DMA
Research Qualification Mass Production
BN-EM Tg 240℃
BN-LX Low CTE 6 ppm/℃
2017
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 13
EM-285/ EM-370(5) Dk: 4.3 @1 GHz
Df: 0.011/ 0.013 @1 GHz
Mid. Tg
High Tg
EM-370Dk: 4.4 @1 GHz
Df: 0.015 @1 GHz
EM-370(D)Dk: 4.1 @1 GHz
Df: 0.011 @1 GHz
EM-370(Z)(NEW)Ultra Low CTE
EMC Product Line-up
Lead-free Halogen-free Mid Loss Low Loss VLL and Others
EM-285B(L)
EM-37B(L)
EM-355B(L)(NEW)
Dust-free Low-flow PP
Metal Core for IMS
EM-M1 (3W /m-K)
EM-MP (2W /m-K)
EM-827
Mid. Tg Phenolic Cured
High Tg Phenolic Cured
EM-825
Approved by Sanmina
EM-891
EM-890
Very Low Loss
IC Substrate
BN-EM
BN-LX
EM-888K (LDG)
Dk: 3.3@1 GHz
Df: 0.005 @1 GHz
Very Low Loss
ZBC
EM-355(D)Dk: 3.33 @1 GHz
Df: 0.013 @1 GHz
(under RC:75%)
ZBC
D+8.5 For critical DS Design
EM-355(S)(NEW)Dk: 4.0 @1 GHz
Df: 0.0085 @1 GHz
ZBC
EM-828GDk: 3.9 @1 GHz
Df: 0.008 @1 GHz
EM-888/ 888(S)Dk: 3.9 @1 GHz
Df: 0.006 @1 GHz
High Tg
ZBC
ZBCZBC
Very Low Loss
Mid. Tg
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 14
CCL Property (Halogenated Lead-free)
EMC Product/ UL Code EM-825 EM-827
Resin/Hardener system Dicy-free
Tg (ºC) DSC 150 175
T-260 (min) unclad >60 >60
T-288 (min) unclad >25 >30
Td (ºC), 2% Wt. loss 330 345
Td (ºC), 5% Wt. loss 340 350
CTE (%) (50~260 ºC)
3.2 2.6
1, before Tg2, after (ppm/°C)
50
260
45
225
Dielectric constant @ 1 GHz under RC:50% 4.3 4.2
Dissipation factor
@ 1 GHz under RC:50%0.016 0.019
Water absorption % 0.10 0.12
Conformance to IPC-4101C
slash sheet/99 /126
Equivalent Materials
IT-158
S1000
IS-400
370HR
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 15
CCL Property (Mid Tg Halogen-free)EMC Product/ UL Code EM-285 EM-370(5) EM-355(D) EM-355(S)
Resin/Hardener system
Halogen- free
Mid Loss Mid Loss Mid Loss Low Loss
Tg (ºC) DSC (TMA* or DMA**) 150* 150 150 150*/ 180**
T-260 (min) unclad >60 >60 >60 >60
T-288 (min) unclad >60 >60 >60 >30
Td (ºC), 5% Wt. loss 360 385 390 370
CTE (%) (50~260 ºC) 3.0 2.6 2.9 2.8
1, before Tg2, after (ppm/°C)
50
250
40
190
40
225
40
220
Dielectric constant @ 1 GHz under RC:50% 4.3 4.3
3.33
(RC: 75%)4.0
Dissipation factor
@ 1 GHz under RC:50%0.011 0.013
0.013
(RC: 75%)0.0085
Water absorption % 0.08 0.11 0.09 0.08
Conformance to IPC-4101C
slash sheet/128 /128 /128 /128
Equivalent Materials R1566
BE-67G
NPG150
R1566R1555 NA
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 16
CCL Property (HTg Halogen-free)EMC Product/ UL Code EM-370(Z) EM-370(D) EM-828G EM-888 EM-888(S) EM-888K
Resin/Hardener system
Halogen- free
Mid Loss Mid Loss Low Loss Low Loss Low LossVery Low
Loss
Tg (ºC) DSC (TMA* or DMA**) 175* 175 170 210** 210** 210**
T-260 (min) unclad >60 >60 >60 >60 >60 >60
T-288 (min) unclad >60 >60 >30 >60 >60 >60
Td (ºC), 5% Wt. loss 385 385 380 380 380 380
CTE (%) (50~260 ºC)
(* under RC:53%)
1.8 2.2 2.6 2.6 2.4 2.6*
1, before Tg2, after (ppm/°C)
35
155
40
200
50
250
50
240
45
230
55*
210*
Dielectric constant @ 1 GHz under RC:50% 4.5 4.1 3.9 3.9 3.9 3.3
Dissipation factor
@ 1 GHz under RC:50%0.015 0.011 0.008 0.006 0.006 0.005
Water absorption % 0.16 0.10 0.07 0.05 0.05 0.05
Conformance to IPC-4101C slash
sheet/130 /130 /130 /130 /130 /130
Equivalent Materials NAEL-190T
TU-862HF
FR-408
IS-415
HE-679G
M-4
N-13 EP
FR-408HR
TU-872 SLK
M-4SM-6
RO4350
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 17
IC Substrate Property (HTg Halogen-free)EMC Product/ UL Code BN-EM BN-LX
Resin/Hardener system
Halogen- free
Standard Loss Low Loss
Tg (ºC) DSC (TMA* or DMA**)
245** 280**
T-260 (min) unclad >60 >60
T-288 (min) unclad >60 >60
Td (ºC), 5% Wt. loss 430 490
CTE (%) (50~260 ºC)
2.1 0.7
1, before Tg2, after (ppm/°C)
30
150
20
60
Dielectric constant @ 1 GHz under RC:50% 5.1 4.2
Dissipation factor
@ 1 GHz under RC:50%0.017 0.009
Water absorption % 0.12 0.15
Young’s modulus (GPa) 27 30
Tensile modulus (MPa) 277 298
Flexural modulus (GPa) 27 30
Equivalent Materials MGC 832 NX-A MGC 832NS-(LC)
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 18
Material Property (AL Metal Core)
Material Property
Unit Test condition EM-M1 (film based)
EM-M1 (20)(film based)
EM-MP (prepreg based)
Core Thickness mil Micro-section 4 4 4
Tg ℃ DSC 170 125 (DMA) 120
Thermal Conductivity
W/mKASTM E 1461(Laser Flash)
3.0 2.8 2.0
Hi-pot Withstand KV AC/ DC 3/ 5 5/ 5 5/ 5
Thermal Resistance
℃/W ASTM D5470 0.105 0.11 0.130
CTI V Per UL Criteria 600 600 600
Peel strength(1 oz)
lb/in As received 5 8 8
Thermal stress min Solder float/ 288℃ 35-45 45-60 15-20
CTE (Z-axis) ppm/℃＜Tg 20 25 30
＞Tg 60 90 150
Td ℃ TGA (5% loss) 370 400 370
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 19
Product Selection Guide
EM-825, 827
EM-285, 370(5), 370, 370(Z)
RF, Antenna, High Speed
Digital, Super Computer
EM-888, 888(S), 888K
Server, Telecom, Base
Station, Router & Switch
EM-825, 827
EM-285, 370, 370(D)
EM-355(S), 828G
EM-888, 888(S), 888K
Back Panel and High
Performance Computing
EM-827, 370(D)
EM-828G, 888, 888(S), 888K
Heavy
CopperUp to 12 oz
EM-825, 285, 370(5), 355(D)
EM-285B(L), 37B(L), 355B(L)Mobile Communication
Rigid flex
Halogen
free
Consumer Electronics EM-825, EM-285, 370(5)
EM-370(D)
LED illumination,
Converter, Inverter,
Precision Motor
EM-MP
EM-M1 (20)
EM-M1
Automotive, Green Energy,
Industrial
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 20
TaoYuan, Taiwan (CCL)
Halogen-free: 77%
Lead-free
Mid Tg : 8%
Lead-free
HTg: 15%
KunShan, China (CCL)ZhongShan, China (CCL)
Lead-free
Mid Tg:18%
Halogen-free: 60%
EMC Group Overall
Halogen-free: 60%
Lead-free
Mid Tg: 25%
Lead-free
HTg: 15%
Lead-free
Mid Tg: 45%Halogen-free:48%
Lead-free HTg: 7%Lead-free
HTg:22%
Product Mix (CCL)
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 21
CCL Manufacturing Capability
Min. core
thickness
1.0 mil (25 um)
Ultra thin glass
1027/ 1017
Min. copper foil thickness
3um/ 5um with Cu carrier
Max. copper foil thickness
12 oz (410 um)
ZBC-2000
100% Hi-pot test
Prepreg Resin
Content
+/- 1.5%
(D+8.5) capability
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 22
EMC Technology Roadmap
Core thickness tolerance
Core thickness > 0.1mm (%)
Dimensional stability
Thickness ≧ 0.2mm (ppm)
Copper foil type
2015 2017
Min. core thickness
(mil, mm)
Minimum glass cloth type
Glass fabric typeLow Dk glass
HVLP
± 150± 100
± 6± 5
1.0/ 0.0251.0/ 0.025
10171000
± 180± 150
Dimensional stability
Thickness < 0.2mm (ppm)
Core thickness tolerance
Core thickness ≦ 0.1mm (%)± 8
± 7
Profile-free
Silica/ LCP glass
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 23
Manufacturing Equipment (CCL)
Taiwan Kunshan Zhongshan
Treater 8 15 10
Build-up &
break-down line
4 6 4
Vacuum press 11 (1-UP) 8 (1-UP)+9 (2-UP) 6 (2-UP) + 6 (1-UP)
Automatic storage
system
9 11 9
Diamond saw 1 3 3
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 24
Key Material Suppliers
Copper foil CCP
Furukawa
Mitsui
Glass fabric Asahi
Nanya
Nittobo
TGF
Resin CCP
DIC
Dow
Hitachi Chemical
Aluminum sheet (5052, 6061) C.S. Aluminium
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 25
Worldwide OEM Approval (1)
Telecom
EM-285, 825, 827
EM-370(D), 828G, 888
Server
EM-825, 827, 285
EM-370(D), 828G, 888
Network Storage
EM-825, 827, 370(D)
EM-828G, 888, 888K
E company
Datacom
EM-285, 827, 370(D)
EM-828G, 888, 888K
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 26
Worldwide OEM Approval (2)
Medical & others
EM-825, 827, 285
PC Peripheral
EM-825, 285
EM-370(5), 370(D)
Smart Phone/ Tablet
EM-825, 285, 370(5)
EM-355(D)
G company
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 27
Worldwide OEM Approval (3)
Automotive
EM-825, 827
EM-285, 370(5), 370, 370(Z)
(Class C+, D+)(Class C, D, E)
LED
EM-M1, EM-MP
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 28
Major Customer List (CCL) AT&S
(CN)
Boardtek Elec.
(TW)
Brain Power
(CN)
Chin-Poon
(TW, CN)
Compeq
(TW, CN)
Dynamic Elec.
(TW, CN)
Elvia
(FRA)
Elec & Eltek
(HK, CN)
Founder PCB
(CN)
Foxconn (ZDT)
(CN)
Fujitsu (FICT)
(JP)
Gold Circuit
(TW, CN)
GUL Tech.
(CN)
Hannstar
(TW, CN)
Hitachi Chemical
(SP)
Ibiden
(CN, MY)
ISU Group
(KR, CN)
Kyocera
(JP)
LG Innotek
(KR)
Meiko Elec.
(CN, VN)
Multek
(CN)
Samnina
(US, CN, SP)
Samsung
(KR, CN)
Shenzhen
Shennan (CN)
Simmtech
(KR)
Suntak
(CN)
Taiwan PCB
Techvest (TW)
Top Search
(CN)
Tripod
(TW, CN)
TTM Tech.
(US, CN, HK)
Unimicron
(TW, CN)
Unitech
(TW, CN)
Viasystems
(US, CN)
WUS
(TW, CN)
Yamamoto
(JP)
Young Poong
(KR)
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 29
Research and development
EMC devotes relentless efforts on new product development and technology innovation to create high quality and differentiated products for our customers.
World class quality
EMC, certified by TS-16949, ISO-9001, ISO-14001, QC 080000 and Sony GP, is renowned for its stable and consistent quality.
Rapid global response
EMC provides quick global response and on-site engineering service to our customers for effective trouble shooting.
Competitive pricing and short lead time
EMC is committed to offer competitive price and flexible delivery to our customers. .
Innovative Solutions for the PCB industry
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 30
EMC Contact Information
Taiwan HQ
Base Material Div.
Elite Material Co., Ltd.
18 Ta-Tung First Rd., Kuan-Yin
Industrial District, Taoyuan Hsien,
Taiwan 32849
Tel: 886-3-483-7937
Fax: 886-3-483-7949
E- mail: [email protected]
Mass Lamination Div.
Elite Material Co., Ltd.
(Hsinchu)
No. 14, Wunhua Rd., Hukou Hsiang,
Hsinchu Hsien, Taiwan 30352
Tel: 886-3-598-1688
Fax: 886-3-598-1556
E- mail: [email protected]
http://www.emctw.com/
Northern China(Kunshan)
Elite Electronic Material (Kunshan)
Co., Ltd.
368 Youbi Road, Zhoushi Town, Kunshan City,
Jiangsu Province, China 215337
Tel: 86-512-57860226
Fax: 86-512-5766-3558
E- mail: [email protected]
Southern China (Zhongshan)
Elite Electronic Material (Zhongshan)
Co., Ltd.
Science & Technology Avenue, Zhongshan
Torch Hi-Tech Industrial Development Zone,
Zhongshan City, Guangdong Province, China
Tel: 86-760-8297988
Fax: 86-760-8829-7989
E- mail: [email protected]
USA Liaison Office
64155 Morrison Road,
Cambridge,
Ohio 43725-9554
Tel: 740-439-5527
Cell : 740-502-2092
E-mail: [email protected]
2313 Meadowbrook Road SE,
Decatur, Alabama 35601
Cell : 256-642-1096
E-mail: [email protected]
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 31
EMC Global Distributor Network
EU
CCI Eurolam S.A.
9 rue marcelin berthelot
92160 ANTONY
FRANCE
Phone: +33 (0)1 46 74 47 53
Fax: +33 (0)1 46 66 63 13
France: Roland JACQUET
E-mail: [email protected]
Phone: +33 (0)472780190
Germany: Christian BACKHAUS
E-mail: [email protected]
Phone: +49 17610075802
United Kingdom: Mark GORDON
E-mail: [email protected]
Phone: +44 (0)1772 331964
http://www.ccieurolam.com/
Korea
Landmark International Corp.
3Ma-203, Shihwa Ind. Complex 1374-2,
Jungwang-Dong, Shiheung-City,
Kyungki-Do 429-854, Korea
Tel: 82-31-434-0606
Fax: 82-31-434-0868
E-mail: [email protected]
Japan
Imanaka Ltd.
5F Bancho Kaikan, 12-1 Gobancho
Chiyoda-ku, Tokyo 102-0076, Japan
Tel: 81-3-5213-2766
Fax: 81-3-5214-0540
E-mail: [email protected]
http://www.imanaka.co.jp/index.htm
USA
Techinca, USA
2431 Zanker Rd.,
San Jose, CA 95131
Tel: 1-408-240-5950
Fax: 1-408-943-8115
Tracey Rodriguez
Phone: 408-840-5942
Fax:408-755-3955
email: [email protected]
http://technica.com/
© 2006 Cisco Systems, Inc. All rights reserved. Cisco ConfidentialPresentation_ID 32
THANK YOU FOR YOUR ATTENTION.
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