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Da Vinci On Site TraningCourses

Service Operation Department, China

Confidential StatementThis material is intended for use only by Honeywell Measurex and Customer personnel in connection with Honeywell Measurex products. It is strictly prohibited to copy this material or any part thereof to any non-Honeywell Measurex person or entity, except Customer personnel for use in connection with Honeywell Measurex products. Persons employed by a third party services company shall not have access to this material.

Any inquiries regarding usage or content should be directed to:

Shanghai OfficeHoneywell Measurex

Tian Mu Xi LUShanghai, 200070, China

注意：本手册及所附的参考材料仅为培训用途，不应作为系统操作手册使用，若本手册描述内容与现场系统不一致或与系统随机资料不符，应以实际系统和系统随机资料为准。

Davinci Training Course Customer: Rev 2

Contents101. Introduction...........................................................................................6

101.1. Purpose and Schedule.....................................................................6101.2. Intended Audience..........................................................................6101.3. Student Materials............................................................................6101.4. 什么是DAVINCI (达芬奇) 系统..................................................7

102. Electrostatic Discharge.......................................................................11

103. Davinci Server......................................................................................12103.1. Hardware Overview.....................................................................12103.2. Dell Power Sever & Operator Station..........................................12103.3. Power On Procedures...................................................................12103.4. Power Off Procedures.................................................................13

104. Real Time Application Environment (RAE).....................................14104.1. Overview:.....................................................................................14104.2. Introduction..................................................................................15104.3. Developer level Operation............................................................17104.4. Using Database Browser..............................................................17104.5. Permanents Browser.....................................................................17104.6. RTDR DSR – Data Storage and Retrieval...................................17

104.6.1. Recipe details......................................................................18104.6.2. Manipulating Data...............................................................18104.6.3. Recipe retrieve and load......................................................18104.6.4. Recipe Backup and Restore.................................................18

104.7. Shortcut Introduction:...................................................................19

105. Documents shipped with system........................................................20105.1. Production Release.......................................................................20105.2. Engineering Drawings..................................................................20105.3. Sensors calibration sheets.............................................................20105.4. System Manuals...........................................................................20

106. System Preventative Maintenance 系统预防性维护 (每日).........21

107. SDP Failure Modes - Protection and Recovery................................22107.1. Copy of all environment variables..............................................23

108. Software Management Activities.......................................................24108.1. Introduction:.................................................................................24

108.1.1. Site Software Maintenance..................................................25108.2. Resource Monitoring....................................................................25

108.2.1. Task Manager......................................................................25108.3. Performance Monitor...................................................................25

108.3.1. Event Viewer.......................................................................25108.4. Reference:.....................................................................................25

109. Da Vinci Scanner 4022-20...................................................................26109.1. Hardware Familiarization.............................................................26

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109.1.1. Scanner................................................................................26109.1.2. 4604 PMP (Precision Measurement Processor)..................26

109.2. Scanner Operation........................................................................28109.3. Scanner modes 工作方式.............................................................29109.4. Scanner Setup and Alignment......................................................29109.5. Profile Correction横幅曲线校正................................................42

109.5.1. Procedures to perform a profile correction:........................42

110. Da Vinci Sensors General...................................................................47110.1. Da Vinci™ Precision Measurements...........................................47110.2. Basic Concepts.............................................................................47110.3. Background, Reference Operations..............................................47110.4. Standardize...................................................................................47

111. Basis Weight Sensors...........................................................................48111.1. Basis Weight Sensor Fundamentals.............................................48

111.1.1. Basis Weight Sensor Positioning........................................48111.1.2. Basis Weight Sensor Principles...........................................48111.1.3. Sensor Signal.......................................................................49

111.2. BW Sensors Electrical Alignment and Sensor Operations..........50111.2.1. Electrical Alignment............................................................50

111.2.1.1. Preliminary Checks and Preparation.......................50111.2.1.2. Source Assembly 放射源........................................50111.2.1.3. Receiver Assembly 接收.........................................50

111.2.1.3.1. Verify Test Point Voltages............................................50111.2.1.3.2. Background Signal and Amplifier Gain Adjustment....51

111.3. BW sensor calibration data...........................................................52

112. Infrand Moisture Sensor.....................................................................53112.1. Measurement Physical Principles and Design Overview.............53

112.1.1. Introduction.........................................................................53112.1.2. Check-off each of the following sub-assemblies................55

112.1.2.1. Source Assembly.....................................................55112.1.2.2. Receiver Assembly..................................................55

112.2. 4205 Moisture Sensor Hardware Alignment and Sensor Operation55112.2.1. Hardware Alignment...........................................................55

112.2.1.1. Preliminary Check and preparation.........................55112.2.1.2. Source Assembly Checks........................................56

112.2.1.2.1. Power Supply Adapter PCB (P/N 0533300).................56112.2.1.2.2. Tuning Fork Driver PCB (P/N 05341600) 音叉驱动板

56112.2.2. Receiver Assembly Checks.................................................57

112.2.2.1. Unigauge Backplane Assembly Type II (P/N 05401100)....................................................................57

112.2.2.2. Temperature control PCB (P/N 05298102).............57112.2.2.3. Fastcard PCB (05413200) 单通道放大板..............58

112.2.2.3.1. Verify Fastcard / SCA Input..........................................58112.2.2.3.2. Verify Fastcard / SCA Phasing.....................................58

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112.2.2.3.3. Verify Fastcard / SCA Output.......................................58112.2.2.3.4. Verify Fastcard Background Operation........................58

112.2.2.4. Edge Detection Alignment......................................59112.2.3. Background, Sample, and Standardize Operations.............59

112.2.3.1. Preliminary Checks.................................................59112.2.3.2. Perform a Standardize Operation............................60

112.3. Moisture Sensor Calibration data.................................................60112.4. Opacity Sensor.............................................................................61

113. HMX I/O..............................................................................................62113.1. Field Point I/O Enclosure.............................................................62

114. Performance MD Control...................................................................63114.1. MD Control Package....................................................................63114.2. VIO...............................................................................................63114.3. DDC Control................................................................................63114.4. Supervisory Control.....................................................................63114.5. Engineering catagory....................................................................64

115. Appendix A AC Tech Motor Controller Info...................................65

116. Appendix B Offline Backp..................................................................70116.1. Purpose.........................................................................................70116.2. Procedure:.....................................................................................70

117. Appendix C Offline Restore...............................................................73117.1. Purpose:........................................................................................73117.2. Procedure:.....................................................................................73

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101. Introduction

101.1. Purpose and Schedule1st Day, System Introduction and Operation1st Day, software2nd Day, Scanner & PMP3rd Day, Sensors4th Day, Field Point I/O

101.2. Intended AudienceChapter 101 to 102 are for Operators and Maintenance EngineersOther Chapters are only for Maintenance Engineers

101.3. Student MaterialsFollowing is a list of materials provided to each student as part of the course.

Materials Issued to Each StudentItem MX P/N CommentAC TECH Motor Controller Information Manual NAField Point I/O Information Manuals NADavinci system on site training course Manual Volume 1 NA

NA

Available in Your Site Library (Here is Bao Ding Bank Notes) Radiation Safety Training Manual 44071500 Basis Weight Sensor User Manual 46000730InfrandPLUS Moisture Sensor User's Manual 46000314MANUAL , MOD 2252/2256 44080200MANUAL, MOD 2215 SHEET WIDTH SENSOR 44081500

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101.4. 什么是DAVINCI (达芬奇) 系统

达分奇服务器由主机和显示器/键盘/鼠标器组成.

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系统硬件概缆

5002 SDP Server

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It provides the hardware platform to run the model 5900 RAE Real-time Application Environment software. It utilizes a high-speed Intel® Pentium® III processor to provide the compute power to run the current application packages including the new, processor intensive advanced data analysis tools.

5095 GUS Operator Station

The Global User Station (GUS) Operator Station for Da Vinci provides a powerful and intuitive interface to the Honeywell-Measurex Da Vinci system. This Microsoft Windows NT-based station makes plant-wide information easily accessible, so users have the production and quality information they need to better make products and increase profits.

4022-20 Precision Platform

O-frame of steel I-beams that span the process, welded to steel end-supports, provides rigid support for accurate, reliable scanning measurement.

Fast scanning, fast sensor response and true edge-to-edge measurement provide a complete and accurate picture of sheet quality and fast resolution of profile changes.

“Pultruded” fiberglass / resin composite track ensures precise sensor alignment and reliable lifetime operation.

EnviroPak sensor enclosures provide an ideal operating environment for the sensors, and allow wide access for service with easy cover removal.

Remote Precision Measurement Processor (Remote PMP) provides signal conditioning, signal digitization and allocation to measurement zones, as well as power conditioning and scanner control in an enclosure that can be located remotely from the scanner in less hostile or easier access location.

LAN communications from the Remote PMP to the Da Vinci Applications Server provide fast, easy, low-cost scanner installation.

AC motors, digital drive

4604 PMP

The 4604 Da Vinci Precision Measurement Processor PMP provides the interface to 4022-20 scanners, it comes in wall-mount enclosure. The enclosure houses a 233-MHz Pentium-based computer that communicates scanner sensor measurements over 10BaseT Ethernet to the Da Vinci Application Server, also houses the AC motor controller that controls the scanner drive motor.

2900 Filed Point I/O

The 2900 FieldPoint IO Enclosure is a wall-mountable IP65 (NEMA 4) rated enclosure housing one FieldPoint communications module and FieldPoint IO modules. It is used for interfacing the PM processing signals.

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4570 Printer

The Model 4570 Black and White Network Printer is a standard, Hewlett-Packard (HP) LaserJet printer capable of printing at speeds up to 17 pages-per-minute. The printer is located on the Open LAN and can communicate at 10 or 100 Mbaud (auto switching).

Sensor Layout

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102. Electrostatic Discharge

measurex corporation

SERVICE BULLETIN

ISSUED: June 9, 1994 NUMBER 213

INFORMATION: ESD REMINDER ELECTRO STATIC DISCHARGESince implementing the ESD program in Cupertino, we have seen a significant reduction in PCB failures at System Test. Following ESD procedures will also improve field performance. You should provide additional protection by following the guidelines listed below: When removing or replacing circuit boards in a system you should wear a wrist strap which is grounded to the enclosure. Two wrist straps are shipped with each system spares kit (P/N 54000200). You should also be properly grounded with a wrist strap when removing and replacing circuit boards in a static shielding bag. Boards should always be stored and shipped in conductive bags even though considered failed. This will prevent additional damage from static discharge . Personal safety requires you use a properly designed wrist strap. A proper strap will present a very high resistance and impede current flow should you come into contact with dangerous voltage. Approved replacement wrist straps can be ordered through Customer Service.Originator: Annette Behnke

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103. Davinci Server

103.1. Hardware Overview

Power Distribution Box 配电盘UPSDell SeverDell Operator StationField Point I/O PrinterPMPHubs 集线器，(测量网，工厂网)Ethernet LAN connections 以太网连接(10Base T)

103.2. Dell Power Sever & Operator Station866 MHz Intel® Pentium® III processor133 MHz front side bus32 kB Level 1 cache (16kB instruction cache and 16 kb two-way write-back data cache)256 kB integrated Level 2 cache512 MBytes of PC700 ECC Rambus Dynamic RAM (RDRAM)10 GB EIDE hard drive (7200 RPM)2 x 10/100 auto-switching RJ45 Ethernet ports 20/48X CD-ROM10/20 GB Travan TR5 EIDE Tape Back-up Drive1.44 MB 3.5" High-density Floppy Diskette drive56K v.90 Modem for remote diagnosticsQuietkey KeyboardMouse Pointing Device 200 W power supply

103.3. Power On Procedures

1 合上UPS交流电源开关2 打开柜内的UPS，等待UPS自检完毕3 合上相应的空气断路器4 打开主机显示器5 打开服务器的电源开关，服务器操作系统Windows NT开始起动6 登录窗口出现后，按 ctl+alt+del, 输入密码：mxoper 登录为操作员用户

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7 系统达分奇应用程序自动启动8 当显示器上出现操作画面后，调入将要使用的纸种9 然后重复步骤 3到 6，启动系统操作站10 启动 PMP11 “Scanner DOWN” 的报警消失后，系统主机启动结束

103.4. Power Off Procedures

1 在主机上登录为“DEVELOPER”用户，PASSWORD：**********2 关闭系统应用程序3 SHUTDOWN NT 操作系统4 关闭服务器电源5 关闭主机显示器6 重复步骤 1到 5，关闭系统操作站7 关闭 PMP8 关闭控制柜交流电源开关9 关闭UPS10 系统关机结束

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104. Real Time Application Environment (RAE)

Reference:Real-Time Application Environment (RAE)Common Platform User’s Manual (46017900)

104.1.Overview:

MSSOperating system: Nucleus OSMSS Ethernet Card ID must be recorded in the appropriate SDP database: RTDR-remember if you change your MSS Ethernet Card, you must change the physical ID in RTDR

SDP

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Operating system: NT4 with Service Packs Applications: Real Time Application Environment (RAE)

Labview + updatesPC Anywhere

` No MS OfficeNo GamesNo Screen Savers

104.2.Introduction

A shared foundation that provides system and application services common to all application groups

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Important DirectoryC： NT4.0 &Labview 5.1 D:\HMXD:\HMX\RAE\BIN [mxroot] .VI filesD:\Database

D:\copy of database

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104.3.Developer level Operation

3 security level: Operator, Engineer and Developer

Developer Level: the highest level, Under Developer level, what we can do?

Set up the view of profile display

Add trend variables

Scanner and Sensor maintenance

Recipe maintenance

Engineering

And more

104.4.Using Database BrowserDatabase Browser: To load and navigate RTDR To start Database Browser, click “system maintenance and debug” of vertical dispatcher.Database Browser View: Table and HierarchyAll data in the repository can be viewed according to its hierarchical view, and cross section of the data can be seen in a table view.Never try “Database Modification”Scalar Trend configurationArray trend configuration

104.5.Permanents BrowserTo start Permanents Browser, click “system maintenance and debug” of vertical dispatcher.To examine what is saved in the permanents Access database without having to use Microsoft Access.The data in this database only is loaded when RAE is started first time, any recipe loading could overwrite the data loaded from permanents database.

104.6.RTDR DSR – Data Storage and Retrieval

Reference: 46019600DSR to retrieve tuning, calibration and set up values. All DSR data is stored and organized in a Access Database which normally named Recipeyyyy.mdf, for instance, Recipe9814.mdf.

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Recipe maintenance displays are used to modify Recipe data, and to create codes (grades), also the recipe data can be modified from the various applications, such as sensor maintenance.

104.6.1. Recipe details

Group of Production codes

Production code, such as PM11_90

Data Group, including main code table

DSR variable

104.6.2. Manipulating Data

Data group selection, get data for display

Change the data in the “current data” field display, the value could be a Numeric value or a pointer(指针).

Save – updating data in the Recipe

Save as – adding new data to the Recipe

Delete –deleting data from the recipe, but does not allow deletion of the last record from any data group.

104.6.3. Recipe retrieve and load

Retrieve recipe

Load recipe

Recipe start

Simple Recipe change will complete these 3 steps automatically. It is done from the vertical dispatcher.

104.6.4. Recipe Backup and Restore

There are 2 buttons in Recipe Maintenance page:

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Backup

Restore

104.7.Shortcut Introduction:

Check the Environment Variable [MXRoot] = D:\Hmx ?

[MXRoot]\Rae\Bin\Startup.cmd

[MXRoot]\Rae\Bin\ShutDownRTDR.exe

[MXRoot]\Rae\LabView Vis\Operator Interface\Debug.vi

[MXRoot]\Rae\Bin\Databasebrowser.exe

[MXRoot]\Rae\Bin\RaeBrowser\RaeBrowser.exe

[MXRoot]\Rae\Bin\CfgBrowser.exe

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105. Documents shipped with system

105.1.Production Release

Reference:System Production Release.

A production release contains useful information about the system. It documents the configuration of the system as it originally shipped.

System Number History of revisions or changes Layout of components Drawings of layouts Model Numbers

Each system has a production release. This document contains useful information. Keep track of it. We will take a look at the production release for one of the training systems.

105.2.Engineering Drawings

Reference:

System Engineering Drawings

To be familiar with Engineering Drawings.

105.3.Sensors calibration sheets

105.4.System Manuals

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106. System Preventative Maintenance 系统预防性维护 (每日)

控制柜日期：

控制柜密封良好，清洁无尘如有滤网：滤网清洁，摆放到位接线整齐, 接线和各种插头没有松动所有指示灯显示正常控制柜内的温度在要求范围内所有的模块，电路板等没有松动

扫描架检查冷却水流量并记录：检查水过滤器是否清洁冷却水流量是否符合要求检查压缩空气压力并记录空气过滤器是否清洁并能继续使用压缩空气的质量和流量是否符合要求使用无水酒精清洗扫描头扫描架轨道是否清洁，否则清洗扫描头轨道刷是否清洁，否则清洗扫描头轨道轮转动正常检查上下扫描头是否对齐，间隙是否均匀所有指示灯显示正常检查传感器标准化数据是否正常检查扫描速度检查扫描头移动是否平稳检查扫描头温度是否符合要求

操作站图像质量 (尺寸,颜色,对比度等)屏幕是否清洁外壳是否清洁鼠标器和键盘是否工作正常If the unit is water cooled, record the flow here.If the unit is water cooled are the filters clean.If the unit is an environmental unit (EOS) is it sealed properly, and clean inside.

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打印机打印机是否正常工作打印质量墨盒是否有足够的打印纸

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107. SDP Failure Modes - Protection and Recovery

Reference: Real-Time Application Environment (RAE)Common Platform User’s Manual (46017900) This document and ideas are still under development. Prepare a similar document for the Operator Stations.Location of Failure Backup Protection RestoreSystem RTDR Database corrupted

RAE Ver 1.1:Backup/Copy of \DATABASE\BUILD and sub-directories

RAE Ver 1.1:Restore of \DATABASE\BUILD and sub-directories

System RTDR Database corrupted

RAE Ver 1.01: and 1.02Backup/Copy of \HMX\DATABASE\BUILD and sub-directories

RAE Ver 1.01: and 1.02Restore of \HMX\DATABASE\BUILD and sub-directories

A permanents “.MDB” file corrupted

RAE Ver 1.1:Backup/Copy of \DATABASE\*.MDB

Restore all permanent files.

A permanents “.MDB” file corrupted

RAE Ver 1.01 and 1.02:Backup/Copy of \HMX\DATABASE\*.MDB

Restore all permanent files.

RAE Environment Failure Copy of all environment variables. See following pages,

Restore all environment variables using the

One of the two SCSI Drives in the RAID

RAID Drive Mirroring Get a new drive and install.(Develop the New Drive Install Procedures)

Limited to D Drive Files Copy of D Drive files Restore Drive D from tape backup

NT Operating System Failure Backup of C Drive including registry filesOnLineOffLine

Restore of C Drive including registry files.OnLineOffLine

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Location of Failure Backup Protection RestoreLabVIEW Failure Backup of C Drive including

registry filesBackup of RAE LabView VI Files

Restore of C Drive including registry filesRestore of RAE LabView VI Files

A DELL Server The original disk drives Error: Reference source not found

Total RAID drives failure(Redundant Array of Inexpensive Disks)

Procedures available and testedFull System Backup

Run the Dell configuration utility correctly.Generate a required 16MB Disk Partition RAID ConfigurationInstall NTRestore From Tape Backup

107.1.Copy of all environment variables

May vary with different systems

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108. Software Management Activities

Reference:

108.1.Introduction:

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108.1.1. Site Software Maintenance

108.2.Resource Monitoring

108.2.1. Task ManagerCTRL+SHIFT+ESC

108.3.Performance MonitorStart Menu > Programs > Administrative Tools > Performance Monitor

108.3.1. Event ViewerStart Menu > Programs > Administrative Tools > Event ViewerRAE reports errors to the “Application log”

108.4.Reference:

Offline SDP Backup to a New Tape

Offline SDP Restore from a Full Tape Backup

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109. Da Vinci Scanner 4022-20

Reference:

109.1. Hardware Familiarization

109.1.1. Scanner

Limit switchs, Preset Switchs

Endbell Termination Board, Diagnostic LEDs

AC Motor

Cooling Fan of AC motor

Encoder

…

109.1.2. 4604 PMP (Precision Measurement Processor)

2 AC Breakers

2 Power Suppliers

CPU

Network card

Frame Controller

DAQ

AC motor Logic

AC motor controller

…

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109.2.Scanner Operation

Start up the system1. Locate the Breakers and turn power on.2. At SDP server:

Power on server monitor Power on SDP server (RAE software starts loading) Log on to Windows NT Start RAE software

3. At PMP: Switch on main breaker

(the MSS will start auto loading, if it comes ready before the SDP is online then the MSS will wait for the SDP to start communicating)

4. At Scanner Switch on DC switch

Turn on scanner enable switchSwitch on AC switch*

5. At the Operator Station:Power on monitorPower on ComputerLog on to Windows NT Start RAE software

6. Log on as Developer 以下步骤 6-12检查MSS是否在线 Click on key icon Click on Operator Click Developer enter password + “enter”

7. Click Up Arrow8. Click “Scanner/Sensor”9. Click “MSS Setup Diagnostics”10. Click “MSS Monitor”11. Click “MSS Remote” 12. Below the MSS Remote button, “Process DR Events” should be displayed, when

system is done starting up.

Shutdown the system1. Press Offsheet button on Scanner Frame2. Go to Server Station3. From the RAE display, log on as developer:

Click on the key icon Click on Operator Click on Developer Enter password + “enter”

4. Click on the “checked box“ icon5. Click on “STOP SYSTEM”

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6. Click “OK”7. Shutdown Windows NT

Click “START” Click “SHUTDOWN” Click “YES”

8. Wait for SDP Server to shut down9. Press recessed power button on Dell server10. Turn off the AC Breakers

109.3.Scanner modes 工作方式 Background 背景测试 Standardize 标准化 Reference 参考(手动对单个传感器做标准化) Sample 取样 Scan Offsheet Fixed Point 定点扫描 Offline 离线

When E Stop，碰撞开关，现场离纸开关 is pressed the scanner indicates OFFLINE.

Measurement Maintenance 维护方式必须进入维护方式后才能进行参考，标准化，取样等操作。此方式下不能扫描。

109.4.Scanner Setup and Alignment

进入MSS Diagnostics 画面1. Setup the torque (Precision Platform Installation and setup manual page 5-11)Reference: AC Tech Motor Controller – 3 Digit Display2. Setup the scanner Speed (Da Vinci System Installation and Setup Manual page 4-21 to 4-49)

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2.1 Setup the scan speeds

Scan Speed: If this scanner frame is synchronized to a lead scanner frame then the leaders speed is used.

Single Point Speed: This will be the speed of the frame while going to single point position.

Off Sheet Speed: This will be the speed of the frame while going off sheet to the park position.

Nearest Side Speed: This will be the speed of the frame while going off sheet to the nearest side. Nearest side is the closest limit switch from the current head position. This speed is used when there is lump signal and the frame is not parked.

Calibrate Speed: This will be the speed of the frame while searching for limit switches. This speed is used when the MSS starts up and is trying to preset the head position encoder. The speed is also used when running a scanner calibration. If there is a crash switch close to the limit switch on the frame, and the frames coasts past the limit switch when the MSS starts up, lower the calibrate speed.

Maximum Speed: All speeds requested of the frame will be limited to this value.

Minimum Speed: All speeds requested of the frame will be limited to this value. This speed is used when coming out of limit switches, (for preset encoder and calibrate modes) and creeping into position dead band. Low minimum speeds are desirable for accuracy of the limit switch positions, and to reduce hunting and to allow a smaller position dead band to be used.

Break Speed: This will be the speed of the frame while going to the break position. This speed is used when there is a break signal. If you want the scanner to stop moving when a break occurs, set this speed to zero.

2.2 Setup the scanner Line Tachs

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Tach 1 Pulses / DU is frame controller tachometer 1. When testing for same spot, set this to 1000, and set a frequency generator to 1 kHz. This will give one distance unit per second. The delay in seconds is then equal to the distance to the lead scanner frame. (This is currently the machine direction line speed at the lead scanner frame.) Tachometer 1 and 2 should be wired together on the frame controller of the lead scanner.

Tach 2 Pulses / DU is frame controller tachometer 2. Follow the same procedure as for Tach 1 Pulses / DU.

Tach 1 Filter TC is the Tachometer 1 speed filter time constant. For the best same spot performance this filter should be zero and a high-resolution tachometer used for line speed input to the frame controller. If the line speed is noisy, then the scanner frame speed will be noisy during same spot.

Tach 2 Filter TC is the Tachometer 2 speed filter time constant. Same as for Tach 1 Filter TC.

2.3 Setup the scanner Ramp & PID

Acceleration. If this scanner frame is a same spot follower, then the acceleration used will come from the leader. If you have different kinds of frames to same spot together use the lowest acceleration rate for the lead scanner. Values should be 1/3 of the maximum, if you have a lot of large speed changes during same spot scanning.

Deceleration. If this scanner frame is a same spot follower, then the deceleration used will come from the leader. If you have different kinds of frames to same spot together use the lowest deceleration rate for the lead scanner.

Max Acc or Dec is the maximum acceleration or deceleration. This is used when the frame is in same spot, and tracking line speed changes. If the acceleration and deceleration rates are close to the maximum, then you won't have room for control when the line speed changes.

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Min Acc or Dec is the minimum acceleration or deceleration. This is used when the frame is in same spot, and tracking line speed changes. If the acceleration and deceleration rates are close to the minimum, then you won't have room for control when the line speed changes.

Velocity Control Enabled will try to maintain the frame speed by adjusting the frame controller motor voltage. Velocity control allows a lower minimum speed for the MSS. This helps in the calibration of the frame. If you have a current mode controller you will need velocity control. If velocity control is disabled, the frame controller voltage is ramped from the acceleration and deceleration values and scaled using the speed in millimeters per volt.

Velocity P Gain is the velocity control proportional grain. When there are delays between a control voltage move and control response, lower the gain.

Velocity I Gain is the velocity control integral gain; normally not needed.

Velocity D Gain is the velocity control derivative gain. This gain can be a low value or 0.0 if the motor control is linear in response. You need a higher value (0.3 to 0.6 ) if you have a current mode controller.

Position Control Enabled will try to minimize the head position errors in the cross direction. This is needed if you want good same spot control. This also requires that velocity control be enabled.

Position P Gain is the position control proportional grain. Gains between 0.05 and 0.025 are normal. If the rate of the position control job set is lowered then a lower value will be needed here.

Position I Gain is the position control integral gain; normally not needed.

Position D Gain is the position control derivative gain. This gain can be a low value (0.05) or 0.0 if the motor control is linear in response.

2.4 Setup the scanner Dead Band

Creep: is an adjustment to calculation that determines when to start deceleration. The units are in mm, a positive number will trigger deceleration sooner.

Speed Filter TC: is the speed filter time constant (mm/sec). This is normally zeroed, unless the head position encoders has a low resolution.

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Position Dead Band (mm/sec): When the frame is being positioned, its head position needs to be within the target plus or minus the dead band & its speed less than the stopped dead band. If the frame is hunting, then the position dead band is too small, or the minimum speed for the frame is too high.

Stopped Dead Band (mm/sec): If the speed of the frame is less than this value, the frame is considered stopped. When the frame is being positioned, its head position needs to be within the target plus or minus the dead band & its speed less than the stopped dead band. If the frame is hunting, then the position dead band is too small, or stopped dead band is too high or the minimum speed for the frame is too high.

Release Delay ms: is applied at the beginning of a scan. This is beneficial for same spot frames, especially when they are close to each other in time. (The time to transmit the release information to a down stream frame is greater than process delay between the frames.) This value also gives the down stream frames time to stage them selves, for the next release. If this frame is a same spot follower then the delay is not used when this scanner is synchronized to its leader.Move Time Out ms: is used to determine when the frame is stalled. If the motor on digital output is enabled and the head position encoder doesn't change within the time out period the frame is considered stalled. The frame will go to emergency stopped mode (place sensors in a safe state), and you will need to press off sheet to get out of the emergency stopped mode.

Speed Buffer Size: determines the size of the buffers in the MSS for collecting speed control information. The sample time is the rate of the position control job set. The buffers are sent up from the MSS after position commands have been completed.

Backlash Distance (mm): This is the amount of backlash in the drive assembly and the belt stretch at nominal scan speed. Ideally scanning forward is without backlash and scanning reverse the backlash is applied. The problem comes when turning around, it is not good to remove a large compensation. The MSS will ramp up and down the backlash compensation, when the frame changes direction. Scanning in reverse will build up backlash compensation to the backlash distance and scanning forward will decrease backlash compensation to zero. The backlash compensation is added to the head position encoder indication.

Backlash Dis Step is the backlash step distance (mm). It is the amount to correct the head position encoder each time it is read until the backlash distance is consumed. Scanning in reverse will build up backlash and scanning forward will decrease backlash.

2.5 Setup the scanner Motor Voltage

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Scanner Speed Per Volt: is in millimeters per second per volt. If the motor controller response is not linear, use the highest value calculated for different scanning speeds. This will reduce oscillations.

Average Speed Per Volt: is calculated using the voltage and velocity graphs. This value will be updated at end of scan. The data that is sampled for this calculation is selected using the two entries below, Start Sample #, and # of Samples to Avg. You can use this value to adjust the balance on the motor controller. You will want to see the same voltage calculated for both scan directions. Then adjust the speed gain to match the scanner speed per volt.

Start Sample #: is used in the calculation of the average speed per volt. The start sample number can be found by looking at the velocity graph to find the x-axis sample number where steady scan velocity begins.

# of Samples to Avg: is used in the calculation of the average speed per volt. Number of samples to average can be determined by looking at the velocity graph to find the x-axis sample number where steady scan velocity ends and subtracting the start sample number.Minimum Control Volts: This is the lowest voltage passed to the motor controller interface for speed control.

Maximum Control Volts: This is the highest voltage passed to the motor controller interface for speed control.

Minimum DAC Volts: This is the lowest voltage that the DAC hardware can output.

Maximum DAC Volts: This is the highest voltage that the DAC hardware can output.

Copy Avg. Speed Per Volt: button copies the calculated average speed per volt to scanner speed per volt.2.6 Setup the scanner Same Spot

Distance Units From Leader: This is the distance from this scanner frame to its leader. Note: This value is calculated by GSP.

Distance Units From Stretch: This is the distance from the follower to the stretch point between the follower and leader scanner frames. Note: This value comes from the recipe for this MSS.

Tachometer Sync Every X Sec: The internal default is 300 seconds. Time in seconds to synchronize the leader tachometer with its follower's tachometers. A tachometer synchronize message is sent to MSSLink, to trigger the MSS's to read their common

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tachometer signals. The leader then will send out its value so that the followers can adjust their tachometers. This keeps the tachometer signals from walking away from each other, when the tachometer signals are noisy.

Synchronizing Threshold: in scans. When the follower has an option to scan without synch events, it will look to see what events are coming due. If there is time to scan across the sheet, it will do so. If there isn't enough time, then the scanner frame will wait for the synch event before releasing.

Synchronized Threshold Sec: Time after a missed release event, which the scanner frame is still considered synchronized. Usually position control can catch up for small time errors during the acceleration phase of the scan.

Min Sync Speed: in distance units per second is a lower limit for allowing same spot release to occur. This is currently different than the one that GSP uses.

Sheet Flipped From Leader: i.e. between the leader and the follower. This frame should be releasing from the opposite end to be considered synchronized. Note: This value is calculated by GSP.

Synchronized Requested: this frame should track line speed changes to maintain the correct scan angle across the sheet. Note: This value is set by GSP.

Synchronize Needed: indicates that the scanner should always wait for the leaders release event before scanning. This value comes from the MSS recipe. If this is not set, then it is OK for this scanner to scan and collect readings without a leader release event that is close enough to synchronize to.

3. Setup the scanner Standardize

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3.1 Setup Edge detection

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One data point below the threshold will trigger the edge detector. If the Beam half width, Delay, Offset are correct, do not expect very much asymmetry when detecting edges going on and coming the sheet. The threshold voltages should be close to each other; (about 0.1 volts) so that the on and off limits are also close and provide a similar voltage, and therefore position.

The items listed on the display are:

Turn Around Distance: is the distance in millimeters past the edge of sheet (or scan position if no edge is detected) where the head will turn around during scan mode.

X Edge Signal FF: filters the sensor readings before they are used for threshold testing. This is an exponential filter for the edge detection signal. Filter factors range from 1.0 to 0.0 where 1.0 provides no filtering. A filter of 0.8 will use 80% of the new reading and 20% of the previous reading to calculate a filtered new reading.

X Edge FF: filters the edge position, after the threshold tests indicate and edge has been detected. This is an exponential filter factor for the edge position. Filter factors range from 1.0 to 0.0, where 1.0 provides no filtering. A filter of 0.8 will use 80% of the new reading and 20% of the previous reading to calculate a filtered new reading.

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X Edge Move Bypass FF: is a distance in millimeters. If the edge position moves a distance greater than this distance then the filtering will be bypassed.

X Max Edge Detect Pos: is the position in millimeters referenced from the low end of the scanner frame, where you will accept edges. Use this value if product characteristics in the center of the sheet trigger false detection of the edge. This can also be set from MSS setup maintenance recipe display.

X Min Edge Detect Pos: is the position in millimeters referenced from the low end of the scanner frame, where you will accept edges. Use this value if product characteristics in the center of the sheet trigger false detection of the edge. This can also be set from MSS setup maintenance recipe display.

X ½ Beam Width mm: is the width of the edge detection signal. If the edge detection signal is the same as a sensor measurement analog input, use that beam half width.

X Offset mm: is the edge detector offset from the centerline of the primary sensor. If the edge detection signal is the same primary sensor's analog input, 0.0 for the edge detector offset.

X Delay ms: is the edge detector signal delay in milliseconds in the electronics. Typical value for an out board edge detector is 3ms. X Edge Enabled: Requests that edge detection be used to determine how far the scanner should scan. This can also be set from MSS setup

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maintenance recipe display.

X Detected: back lights when edge detection is valid, will be set if an edge was detected for the scan across the sheet. This value is sent at end of scan from the MSS.

X Detect Edge Going On Sheet: Applies when the scanner goes on the sheet, the start of scan. This option is not normally used. If your edge detector is tuned correctly you should be able to leave this option on along with the detect while scanning offsheet option to reduce the time that both edges are updated.

X Detect Edges Gong Off Sheet: Applies when the scanner goes off the sheet, the end of scan. This option is usually set, when edge detection is used, as the sheet may be curled at the edges.

X Edge Position: in millimeters is referenced to the low end of the scanner frame. This value is either the detected edge position or the scan position when an edge has not been detected. This value is sent at end of scan from the MSS.

X Max Signal Threshold: is in volts if the edge detection is from an analog input signal. If the input is from a digital input, then this value needs to be set to 0.0. This forces the starting value of the edge detector input to be 1.0, i.e. the digital input is true. This can also be set from MSS setup maintenance recipe display. Some sensors can be configured tocalculate this value, over-riding the recipe value.

X Min Signal Threshold: is in volts if the edge detection is from an analog input signal. If the input is from a digital input then this value needs to be set to 1.0. This forces the transition value of the edge detector input to be 0.0, i.e. the digital input is false. This can also be set from MSS setup maintenance recipe display. Some sensors can be configured to calculate this value, over-riding the recipe value.

X Scan Position: is the position the heads will scan to, in cases when the edge detection is disabled or inoperative. This value is in millimeters referenced from the low end of the scanner frame. This can also be set from MSS setup maintenance recipe display.

4. Setup the Scanner Calibration

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The calibration distances and frame length need to be measured very accurately, within 1 to 2 millimeters. Scanner speed control needs to be smooth, and be able to crawl out of the limit switches slowly. With a tape measure handy (preferably metric), use the following procedure to calibrate the scanner:

1. Review the calibrate distance and calibrate buckets frame displays.2. Go to the Scanner Calibration display, under the Scanner & Sensors selection.

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3. Select the frame that you want to calibrate.4. Press "Select Position Control"; the light next to the button will turn on.5. Go out to the frame.6. Measure the length of the frame using the inside of the end bells as your end points.7. Press the Sample button on the frame. This will cause the scanner to tag the low-end limit switch.8. Wait until the Sample light is flashing.9. Measure from the primary sensor's centerline to the inside of the end bell, at the same end that the sensor head is sitting. This will be your low-end calibration distance.10. Press the Sample button on the frame. This will cause the scanner to tag the high-end limit switch.11. Wait until the Sample light is flashing.12. Measure from the primary sensor's centerline to the inside of the end bell, at the same end that the sensor head is sitting. This will be your high-end calibration distance.13. Press the Sample button on the frame. This will send the scanner offsheet.14. Enter the frame length and the two calibrate distances in millimeters on the Scanner Calibration display.15. Look at the expected and calibration position deltas to see that they are close to each other. If they are not close to each other, press Calculate New Encoder Pulses.16. Fill in the Bucket Width, Low End Offset and Maximum Sheet Width.18. Press the red "Save" button.19. Press "Save and Reboot MSS" button.20. Wait for the MSS to reboot; "MSS status is process DR Events" will be displayed.

Recheck the calibrate positions as follows:

1. Press the Sample button on the display. This will cause the scanner to tag the high-end limit switch.2. Wait until the head position quits moving.3. Press the Sample button on the display. This will cause the scanner to tag the high-end limit switch.4. Wait until the sensor head quits moving.5. Press the Sample button on the display. This will send the scanner offsheet.6. See if the calibration positions are close to the calibration distances. They should be less than one millimeter apart.

5. Align the Scanner to the headbox

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Buckets / Bins are measurement zones.The bucket width is a constant value in mm.Only two display zones are available.Hi-Res bins.

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Lo-Res binsStored in RTDR at: ./scanner X/sensor common/Hi res per lo res slices

ItemMXOpen Da Vinci

Slice width relative to the headbox Slice Width at the scanner LoRes BinAlignment to the headbox Offset to pre-set switch location Low Edge Offset

There is no one procedure to align the scanner to the machine headbox slice actuators. The following pages contain an example and an exercise.Using the physical dimensions of the headbox, slice actuators, trim squirt positions:calculate high edge slice positioncalculate low edge slice positioncalculate the number of slices between Trim Squirtscalculate the sheet width at the squirtscalculate slice width at the scanner relative to the headboxcalculate overall shrinkage

Using the scannerRead the sheet width from the scanner using the “Scanner / Sensor” > “Scanner Positioning”

Convert the slice width at the scanner relative to the headbox to a LoRes Bin widthHi res per lo res = calculated slice width at the scanner / Bucket Width (HiRes)

Calculate the Bucketized Sheet Width.Bucketized Sheet Width = maximum width of interior headbox * (100 - calculated overall shrinkage) / 100

Calculate the “Low End Offset” for a Bucketized Sheet Width.Low End Offset = distance from sheet to interior endbell – ((calculated front edge - 0.5) * calculated slice width at scanner)

Alignment is successful when:The Lo Res Profile display’s front and back edge sheet positions are equal to:Calculated high edge slice positionCalculated low edge slice position

Scanner Alignment setupMax sheet width on the papermachine=6500 Calculate from headbox measurements

Bucketized Sheet Width =Max sheet width on the paper machine – (Max sheet width on the paper machine * Min % shrinkage on the paper machine)Maximum percent sheet wander should be applied to Bucketized Sheet Width, if sheet wander is present. Eample: using 3% shrinkage 6500 – (6500*0.03) = 6305

Low End Offset = distance from sheet to interior endbell – ((calculated front edge - 0.5) * calculated slice width at scanner)Low End Offset could also be calculated in the lab from; Low Cable end to middle of sheet - (Bucketized sheet width/2)

Example: 5000-(6305/2)=1847.5

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So:Bucketized Sheet Width = 6305 Low End Offset = 1847.5

To get a filtered (less noisy) profile set the HiRes to LoRes to Example: 10Then Bin number 1 in the LoRes Profile is an average of Bin number 1 to 10 in the HiRes profileLoRes Bins = HiRes Bins / HiRes to LoRes Example: 1261/10=126

The HiRes Profile is sent to the CD Control package.The alignment to all the CD controls are made in the CD Control package.So the only place you are going to see the profile aligned to a CD control is at the display for the selected CD control.

You are going to get this many binsBucket width=5 Take it from the production releaseNumber of bins = Bucketized sheet width/Bucket width Calculated by the systemExample: 6305/5=1261Number of bins = 1261LoRes Bins = HiRes Bins / HiRes to LoRes

109.5.Profile Correction横幅曲线校正Profile Correction is a procedure that is used to generate a set of correction arrays for the selected sensors now profile. Profile correction consists of an array that is added to the now array in the forward direction and one in the reverse direction. The profile correction removes small measurement errors induced by X and Y-axis variations in the scanner frame. Z-correction should be enabled while building the profile correction arrays.

109.5.1. Procedures to perform a profile correction:

The steps involved in generating the arrays are as follows:

Select “Scanner/Sensor” > “Profile Correction”

Select “Modes & Recipes”. (Upper Right Corner)

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From the Pop-up Window, select the grade that you want to check.

Press “Retrieve”.

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Select “Enter Maint.”

Close the pop-up window using the large X in the upper left corner.

Enter the number of scans to build the correction with. Usually 20-40 in even increments.

Enter the smooth width if desired. This can also be changed after the profile correction profiles are built.

Enter the tolerance clamp if desired.

Select “Enable Build Profile Corr.”.

Perform Background.

Perform Reference.

Perform Sample. The program will sample on the product that you have selected to do the profile correction on. If you select a production grade then the sample in the gap should be near that weight. If you use a grade that was made to insert the standardize flag then it will sample and scan on the flag. This is not the recommended method. A sample in the gap is the preferred method.

For profile corrections, make sure that the Z Sensor corrector is enabled before you press the “Scan” button to build the profile correction.

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Press Scan.

The system will display the raw and smoothed correction arrays if selected.

After the correct number scans have been completed, the system will send the scanner offsheet.

When array generation and smoothing are acceptable, name and store these arrays for DSR usage. Choose a short name (e.g., BW11) since many characters are appended to this in DSR. The system creates various pointers from this name to access the forward and reverse Profile Correction arrays.

Note the difference between the sample value and the uncorrected profile average. This offset should be small, if not, investigate the reason before proceeding into Production mode. Repeat steps 1 – 15 if necessary.

After a satisfactory set of profile correction arrays has been generated, they can be saved to disk for use on a recipe dependant basis, however most recipes should point to the same array. The name entered here (without extension) will become the key field used to retrieve the pointers and data associated with this set of correction arrays. As noted in step 17. When this option is selected, the pointers and array data are written to the Access recipe database. If the record with that name exists, the data is overwritten. If the record does not exist, a new record is appended and the data written to it.

The runtime DSR database is read at startup and modified whenever the operator manually enters or changes a value in the product maintenance display. In this case, the data (hundreds of points in many cases) is generated by the profile correction utility. The operator is not responsible for entering the data. For this reason, DSR is not aware that new records have been created in the profile correction table.

The system can either be restarted to read the new records, or the "builddb" option can be selected from the product maintenance display.

Remove all samples and pins from the gap prior to placing the scanner back on sheet.

Restore the system to normal production mode.

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110. Da Vinci Sensors General

110.1.Da Vinci™ Precision MeasurementsIn order for the sensor to perform its role in the measurement process the following type of support activity is required.

Correct physical location of the sensor relative to the product.Correct electronic setup and alignment of the sensor.Stability: Verification of the sensor’s ability to repeat the same output value in response to the same physical state of the product.Static Calibration: Setup the computer software so that an output value from the sensor indicates the correct value of the physical characteristic of a calibration standard.Dynamic Calibration: Product manufacture is a continually varying process. It is said to be dynamic. Da Vinci systems measure product characteristics during the manufacturing process. That is referred to as continuous measurement.

Dynamic Calibration is matching the measurement results from the Da Vinci system to the plant’s testing results.

110.2.Basic ConceptsTime Zero，传感器工厂标定时数据Flag 标准样 What is Background?What is Reference and standardize?Slope 斜率Intercept 截距Static Calibration 静态标定Dynamic Calibration 动态标定110.3.Background, Reference Operations

必须登录为 developer 或 engineer 用户，选择 sensor maintenance 画面，进入传感器维护模式才能进行操作。

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110.4.Standardize

第一次扫描开始前和扫描若干次后，由系统自动进行操作。

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111. Basis Weight Sensors Reference: PrecisionPLUS Basis Weight Sensor User's Manual (46000730)

111.1.Basis Weight Sensor Fundamentals

111.1.1. Basis Weight Sensor PositioningThe basis weight sensors to be covered all have a source assembly and a receiver assembly. The source and receiver are placed on opposite sides of the product being measured. This placement is achieved by putting each in a head assembly. The design of the heads determines where the source and receiver are placed. Some designs place the source in the upper head and the receiver in the lower head. Some designs place the source in the lower head and the receiver in the upper head. In your system, it is PrecisionPLUS Basis Weight Sensor (Model 4201-XX; Source 9)

111.1.2. Basis Weight Sensor PrinciplesThe basis weight sensors to be covered all rely on the emission and detection of beta particles. Beta particles are emitted from the source. Beta particles are electrons. The receiver collects them. This collection produces a low current flow. The current is amplified to voltage typically greater than 4 vdc and 8 vdc.

Beta particles do not each have the same energy.

Figure 1 Example Energy Spectrum of Beta Rays

Figure 1 shows the energy of the particles when they leave the source. Now lets consider the energy that reaches the receiver.

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First of all the energy of a beta particle decreases with the square of the distance from the source. Second, anything in the path of the beta particles that has mass will reduce the energy of the beta particles.

111.1.3. Sensor SignalFigure 2 Basic Basis Weight Sensor illustrates the relationship of the receiver current output signal to variations in basis weight. Remember the source will not always be on the bottom and receiver on the top.

Figure 2 Basic Basis Weight Sensor

As Figure 2 shows the output current will decrease along a curve as the BW of the product increase.

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111.2.BW Sensors Electrical Alignment and Sensor Operations

111.2.1. Electrical Alignment

111.2.1.1. Preliminary Checks and Preparation

1. Check and record the 24V from the scanner power supply unit

2. Ensure that the shutter is closed by observing that the green lamps are lighted.

3. Verify head alignment

4. Remove the head covers

111.2.1.2. Source Assembly 放射源There are no test points to read or adjustments to make to the source assembly during this lab. You should however understand the operating principles of the basis weight source in your training system. Locate the reference material relevant to the source in your system and become familiar with its features.

Warning: Always observe Radiation Safety precautions. You should stand back from the head when the shutter is open and avoid looking directly into the gap. To verify that the shutter is closed: The Green lamps should be lighted. Check the indicator. Background counts should read normal.

111.2.1.3. Receiver Assembly 接收111.2.1.3.1. Verify Test Point Voltages

5. Locate the row of test points on the receiver backplane

6. Using a DVM万用电表 measure between TP1 and TP2, verify that the voltage is +24vdc +/-1vdc.

7. Measure between TP3 and TP4, verify that the voltage is +12vdc +/-0.6vdc.

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8. Measure between TP3 and TP5, verify that the voltage is -12vdc +/-0.6vdc

9. Measure between TP3 and TP6, verify that the voltage is -350vdc +/-20vdc.

10. Measure between TP3 and TP4, verify that the voltage is +12vdc +/-0.6vdc.

111.2.1.3.2. Background Signal and Amplifier Gain Adjustment

Remove the metal cover from the detector amplifier housing and from the PCB record the current gain setting in the table below.

Note: Do not handle the detector amplifier PCB unless you are wearing a plastic glove provided for that purpose. Remove power before removing or inserting this board.

052775XX R1 Gain JumpersXX = ______ ______ M

Background Adjustment

1. Place the probes of the DVM across TP3 (RTN) and TP7 (BW Out) and with the shutter closed verify that the voltage is +15mv +/- 5mv,

2. Adjust R4 on the detector amplifier if the background voltage is not within specification.

3. Replace the cover on the detector amplifier housing.

Basis Weight Sensor Output

4. Leave the probes of the DVM connected across TP3 and TP7 and perform a reference on the Basis Weight sensor, you may press the Reference button on the scanner or from the SDP or an operator station.

5. There will be two phases to the reference operation, first the shutter will open, and the sensor will read the air counts for several seconds, then the flag will be inserted, and the flag counts read for the remainder of the reference. Verify that the reading is in the range of 4 – 9 vdc.

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Note: If the air voltage falls below 4 vdc, it may be necessary to re-strap the gain setting on the detector amplifier until it reads approximately 8 vdc.

6. Check the air voltage and flag voltage

7. Calculate the Flag/Air ratio using the sample formula below.

111.3.BW sensor calibration data

Time Zero Constants

Dynamic Intercept 动态截距

Dynamic Slope 动态斜率, 这两个数据位于纸种文件 NSP11(21，31) calibration table90

Correctors 系统校正量，包括温度校正等，可以人为设定是否使用这些校正量，设定在纸种文件 NSP11(21，31) configuration table00

Limits, 设定在纸种文件 NSP11(21，31) limits table00

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112. Infrand Moisture Sensor

112.1.Measurement Physical Principles and Design Overview

Reference: InfrandPLUS Moisture Sensor User's Manual ， 46000314

112.1.1. Introduction

To understand the physical principles pertaining to the design of a moisture sensor utilizing infrared light.

Figure 3: Selective Absorption of Infrared Light by Paper Type and Moisture Content

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4205 InfrandPlus Moisture Sensor

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112.1.2. Check-off each of the following sub-assemblies

112.1.2.1. Source Assembly

1. Source Power Assembly, P/N:

2. Lamp Assembly, P/N: 39000201

3. Tuning Fork

4. Quartz Plates (you need to separated the heads)

112.1.2.2. Receiver Assembly

5. Unigauge Backplane 底板6. PBS Detector Assembly 光电池检测装置7.

Beam splitter assembly 分光组件Channel A assembly Channel B assemblyChannel C assembly(if used)

8. Moisture Reciever Amplifiers: Fast Card，单通道放大板9. Temperature Control Card ，温度控制板

112.2. 4205 Moisture Sensor Hardware Alignment and Sensor Operation

Reference: InfrandPLUS Moisture Sensor User’s manual, 46000314

112.2.1. Hardware Alignment

112.2.1.1. Preliminary Check and preparation

1. Check that the 24V from the scanner power supply is present.

2. Verify head alignment

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3. Remove the head covers

112.2.1.2. Source Assembly Checks

112.2.1.2.1. Power Supply Adapter PCB (P/N 0533300)

Refer to InfrandPLUS Moisture Sensor User’s Manual (P/N 46000314) section 4.1.1 (Pg. 21) and Figure 4.1.2 (Pg.28).

4. From the terminals indicated in the manual, make sure that the 24 0.5 VDC is within specification.

Note:The scanner power supply unit might indicate higher than 24 volts to compensate for the line loss in the power track.

5. Check the lamp voltage.

112.2.1.2.2. Tuning Fork Driver PCB (P/N 05341600) 音叉驱动板Refer to InfrandPLUS Moisture Sensor User’s Manual (P/N 46000314), section 4.1.2 for procedures, Figure 4.1.3 for diagram, and if necessary the schematic drawing.

6. Use the oscilloscope to check the Phase Sense and Fork Drive, ground should be at TP1.

7. Check that the Phase Reference signal is within specification

8. Power down the sensor then power it up again. The tuning fork should oscillate without chattering. Refer to section 4.1.2.1, check the voltage on TP 6(+) and TP 2(-). It should read -0.3 to +0.1 VDC. Scope TP3, TP4, and TP5. Proceed to adjust the Receiver Assembly, if not continue to the next step.

9. Proceed to section 4.1.2.2 in order to obtain stable oscillation.

The final adjustment indicates that the fork is vibrating under stable oscillation.

10. Proceed to Section 4.1.2.3. Follow the steps for adjusting the tuning fork.

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Note: Do not leave the fork chattering for too long as it may get damaged.Gain R1 adjusts the attenuation the input signal and can be measured at TP5. Gain R2 adjusts the bias of the AGC circuit.

11. Follow section 4.1.2.4 to test for a clean start without any chattering.

112.2.2. Receiver Assembly Checks

112.2.2.1. Unigauge Backplane Assembly Type II (P/N 05401100)

Refer to InfrandPLUS Moisture Sensor User’s Manual (P/N 46000314) section 4.3.1. (Pg23) for procedures and Figure 4.3.6. (Pg37) for diagram.

12. Confirm the following power supply below.

24 ± 0.5 VDC

8.0 ± 0.5 VDC

250.0 ± 5 VDC

15.0 ± 0.2 VDC

112.2.2.2. Temperature control PCB (P/N 05298102)

Refer to InfrandPLUS Moisture Sensor User’s Manual (P/N 46000314) section 4.3.2. (Pg24) for measurement and Figure 4.3.3. (Pg34) for diagram.

13. Ensure that the voltages are all within range.

Note: For each channel, verify that the voltage is in the range of 0.4 to 0.8 VDC. This voltage should not vary more than +/- 0.2 mV for 5 to 10 seconds.

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112.2.2.3. Fastcard PCB (05413200) 单通道放大板Refer to InfrandPLUS Moisture Sensor User’s Manual (P/N 46000314) section 4.3.4. (Pg25) for procedures and Figure 4.3.3. (Pg34) for diagram.

14. Make sure that the jumpers on the Fastcard have been configured correctly for the required High (H)/Standard (L) sensor.

112.2.2.3.1. Verify Fastcard / SCA Input

15. Check the input to Fastcard / SCA (output from the Detector Pre-Amp). Adjust the source lamp position as needed to maximize all signals without exceeding 3V pk-pk. Ensure that all signals are a 570 Hz sine wave (170 Hz for HPIR) within the .3 – 3V pk-pk voltage range.

112.2.2.3.2. Verify Fastcard / SCA Phasing

16. Connect the voltmeter across TP9 (+) and TP1 (Gnd) and adjust resistor R1 so that the meter reading is in 4-8VDC. Perform this step for all channels.

17. Connect the scope probes to TP 7A and TP7B. Check the voltages for the half-sine wave on each channel. Measure from either TP7A or TP7B.

18. Adjust R2 to balance the phase, use Figure 4.3.5 (Pg36) as a reference. Perform this step for all channels. Sketch the waveforms at TP7A and TP7B for the Reference Channel in the space provided.

19. Verify that the waveforms are 180 degrees out of phase.

112.2.2.3.3. Verify Fastcard / SCA Output

20. Use the voltmeter to measure the output voltage from the Fastcard / SCA across TP9 (+) and TP1 (Gnd). Adjust R1 to obtain a meter reading of 7.5 +/- 0.1 VDC.

112.2.2.3.4. Verify Fastcard Background Operation

21. Initiate background operation from the Sensor Verify display.

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22. Measure the voltage across TP9 (+) and TP1 (Gnd) for each Fastcard / SCA during phase 1 of the background.

Note:Typically the voltage should drop to 0.45 – 0.6 VDC for the Fastcard or 0.03 – 0.12 VDC for the SCA during the first phase of the background.

23. Check the different voltages as observed during the four phases of the background operation. You might have to issue a few background operations to complete the record.

112.2.2.4. Edge Detection Alignment

Refer to InfrandPLUS Moisture Sensor User’s Manual (P/N 46000314) section 4.3.5 for procedures and Figure 4.3.6 for jumper settings.

24. Measure the voltage at TP 6 (Edge Level, use TP1 as Gnd) of the Unigauge Backplane. Adjust R23 to match the average voltage

25. Finally, check at the voltage at TP 7, it should measure:

a. Low (0- 1 Vdc) with a sample in the gap.

b. High (13 to 15 Vdc) when no sample is in the gap.

112.2.3. Background, Sample, and Standardize Operations

Dark

Gain1

Gain2

ATTenuation

112.2.3.1. Preliminary Checks

26. Verify proper head alignment.

27. Verify that the heads are offsheet.

28. Verify proper operation of the cooling system and that the sensor is thermally stable.

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29. Perform a Background Operation

30. Perform a Reference Operation

31. Perform a sample operation

112.2.3.2. Perform a Standardize Operation

32. Initiate a scan.

c. Press the scan control button from the scanner Or

d. Press the scan button from the keypad from the operator station (only when the scanner is in OFFSHEET mode)

33. The heads will go to the standardize position.Note: The heads may scan once and then go to the standardize position if the scanner is starting from LIMBO WAIT mode. A background operation will be performed automatically at this time and every 8 hours (default setup).

34. A STANDARDIZE message will appear on the display.

35. The operation will be the same as the Reference operation except that it is initiated by the software and reports from each enabled sensor.

Note: The software schedules standardization, the schedule is set via Scanner Setup displays.

36. Upon completion of the operation, press the OFFSHEET button from the scanner frame.

112.3.Moisture Sensor Calibration dataTime Zero Costants

(当前单通道输出电压-背景输出电压)/出厂时单通道输出净电压，比值应等于 1 AAA 静态斜率DDD 静态截距Dynamic Intercept 动态截距，注意：反方向修正这 3个数据位于纸种文件 MOIP11(21，31) calibration table90

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Correctors 系统校正量，包括温度校正等，可以人为设定是否使用这些校正量，设定在纸种文件 MOIP11(21，31) configuration table00

Limits, 设定在纸种文件 MOIP11(21，31) limits table00

112.4.Opacity Sensor

与水分传感器使用同一个红外线传感器，但它使用第四通道。其信号放大板的调整方法亦与水分传感器一样。Opacity Sensor calibration data, in OPCP11 Calibraton table

Opac slope

Opac intercept

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113. HMX I/O

113.1.Field Point I/O EnclosureEnclosure Layout8678PulsedOutputModule

Pand

uit f

or C

able

Rou

ting

8550DiscreteInputModule

24 VDC Power Supply

8549AnalogOutputModule

8560CounterInputModule

ACLine Filter

8545AnalogInputModule

Circuit Breaker

1600Communi-cation Module

PowerIn Terminal Blocks

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114. Performance MD Control

114.1.MD Control PackageMD control and Cascade control variablesDrystockHeadbox controlSteam reduction packageMulti-ply controlRatio controlBias controlMidrange controlFeedforward control

Crepe control

114.2.VIO

Virtual I/O

114.3.DDC Control

DDC Loops

Gain

Reset Time

Control Deadband

DSR File

114.4.Supervisory Control

Supervisory Loops

Gain

Time Constant

Alpha

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DSR file

A example of control loops:SUPV Loopname SUPV Tagname DDC Loopname DDC Tagname FeedFwd Loop Useful Info.

Reel Basis Weight Thick Stock Flow None DDC H/W Req.Dry Stock Drystock NoneReel Moisture Dryer 1 Steam NoneReel Ash Filler Flow NoneJ/W ratio NoneTotal head Fan Pump None

114.5.Engineering catagory

Control monitor

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115. Appendix A AC Tech Motor Controller Info

Program Procedure (3-digit display model)

1. Press Mode: The display will read “0.0”.2. Enter Password: Use upper arrow to get to “22.5” and press mode.3. “P01” is now displayed. Press Mode: You are now viewing the value of parameter

01. Use the arrows to change the value displayed to that of table 1 for the 3-digit display model.

4. Press Mode again: This saves the value you just entered and takes you back to the speed display mode if you are scanning or stop mode if not scanning.

5. Press Mode again: This takes you from the speed or stop display to display the last parameter you viewed.

6. Press the up arrow to get to the next parameter and repeat steps 3-6 for all parameters.

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Parameter3-digit display setting

1 0.22 0.33 0.14 0.35 0.36 0.88 0.19 0.110 0.511 0.112 0.613 0.114 0.115 0.216 0.217 0.218 N/A19 3.020 0.721 0.022 0.023 0.024 45.025 9.026 7.527 80.028 0.029 0.030 0.031 0.032 0.033 0.034 0.035 0.036 0.037 0.038 0.039 0.040 60.041 20.042 20.043 0.144 22.547 0.148 0.1

Table 1

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AC TECH MOTOR CONTROLLER WIRING

TB1 TB2 TB3 B- B+ 3 Phase AC Motor 33

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L1 L2 N

208/240 VAC Single Phase Input

1 2 5 6 11 12 2 14 13A 13B 13C 15 2 30 31 TXA TXB

AC Breaker


AC TECH MOTOR CONTROLLER FAULT CODESThe table below lists the fault conditions that will cause the drive to shut down, as well as some possible causes. Please contact the factory for more information on troubleshooting faults.

FAULT MESSAGESFAULT DESCRIPTION POSSIBLE CAUSESAF High Temperature Fault Ambient temperature too high.

Fan failure (If equipped). CF* Control Fault A blank EPM, or and EPM with incompatible data has been

installed. Perform Factory reset on Parameter 48.cF* Incompatibility fault: An EPM with a different parameter version has been installed.

Either remove the EPM or perform a factory reset, (Parameter 48) to change the parameter version of the EPM to match the parameter version of the drive.

dF Dynamic Braking Fault: The drive has sensed that the dynamic braking resistors are overheating and shuts down to protect the resistors.

EF External Fault TB-13A and/or TB-13C is set as an External Fault input and TB13A and/or TB-13C is open with respect to TB-2. Refer to Parameter 10.

GF Data Fault User data and OEM defaults in the EPM are corrupted.HF High DC Buss Voltage Fault High Line Voltage.

Overhauling load.Deceleration rate set too fast.

LF Low DC Bus Voltage Fault Low line voltageOF Output Transistor Fault Phase to phase or phase to ground short.PF Current Overload Fault VFD may be undersized.

Problem with driven equipment.UF Start Fault Start command was present when drive was powered up. Must

wait 2 seconds after power-up to apply Start command if START METHOD is set to NORMAL.

F1 EPM Fault The EPM module is missing or damaged.F2-F0,Fo Internal Faults Control board has sensed a problem – consult factory.

*The Installation and Operation Manual that comes with the new AC Tech Variable Speed AC Motor Drive provides some more details on what each parameter's function is.

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Voltages for Forward scan between common (Pin 2 TB-2) andStop (Pin 1 TB-2) = 0VVDC Input (Pin 5 TB-2) = 0-10VForward (Pin 12 TB-2) = 21VReverse (Pin 13A TB-2) = 0VVoltages for Reverse scan between common (TB-2) andStop (Pin 1 TB-2) = 0VVDC Input (Pin 5 TB-2) = 0-10VForward (Pin 12 TB-2) = 0VReverse (Pin 13A TB-2) = 21VVoltages for Offsheet position between common (TB-2) andStop (Pin 1 TB-2) = 0VVDC Input (Pin 5 TB-2) = 0VForward (Pin 12 TB-2) = 21VReverse (Pin 13A TB-2) = 21VVoltages for Crash switch position between common (TB-2) andStop (Pin 1 TB-2) = 21VVDC Input (Pin 5 TB-2) = 0VForward (Pin 12 TB-2) = 21VReverse (Pin 13A TB-2) = 21V

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116. Appendix B Offline Backup

116.1.PurposeThis procedure is used to perform a full backup of a Da Vinci Server’s NTFS and /or FAT drives to a new or empty tape. It will not backup the unique Dell partition.The tape will backup at the rate of approximately 60MB / Minute.

116.2.Procedure:1. Get a DAT Tape for the backup.

2. Insert DAT tape in drive.

3. Shutdown NT and restart NTThis will write all current changes to the registry files and start up with those changes in effect.

4. Logon as administrator

5. Go to Control Panel

6. Open Services, choose Open File Manager, click start button, make sure the status becomes started.

7. Close Control Panel

8. Perform the NT backup by following these steps:

8.1. From the Start icon, select Programs, select Administrative Tools, and select Backup.

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8.2. Select check boxes for your local hard drives.

8.3. Click on the Backup button on the toolbar.

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8.4. On the Backup Information Dialog screen, check the boxes for

8.4.1. Accept the default tape name or change the name according to your site standard.8.4.2. Enter “Backup Set Information” as desired or according to your site standard.8.4.3. Hardware Compression, 8.4.4. Verify After Backup, 8.4.5. Backup Local Registry.8.4.6. Select Replace as the Operation Mode. If you want to delete any existing backup sets

from the tape.8.4.7. Select Full Detail for the Log Information to obtain a full list of all files backed up.8.4.8. Name the log file to the next name in the sequence or according to your site standard.8.4.9. When you click the OK button the backup will start.

9. After Backup, Go to Control Panel

10. Open Services, choose Open File Manager, click stop button, make sure the status becomes nothing.

11. Close Control Panel

12. Close administrator or restart to logon as mxoper

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117. Appendix C Offline Restore

117.1.Purpose:The purpose of this procedure is to fully restore the NTFS and/or FAT hard drives of a DA Vinci Server, including NT operating system. It will not restore the unique Dell partition.

117.2.Procedure:

1. Locate the “Dell PowerEdge Expandable RAID Controller 2/SC User’s Guide, Dell part Number 2781E

2. Turn to page 10-2 and follow the procedure “ Making PERC 2/SC Primary Controller in Windows NT”2.1. Step 1 no comment OK as is2.2. Step 2 no comment OK as is2.3. Step 3 no comment OK as is2.4. Step 4 the driver disk we used was labeled PERC NT Driver

the driver name was PERC NT Driver3. Follow on screen instructions selecting the quickest options. The objective is a minimal install to

access the tape drive.3.1. Page down through the licensing pages and press F8 to accept.3.2. Verify on the appropriate screen that the 16MB Dell partition exists

3.2.1. Choose C drive for NT installation3.2.2. Format NTFS3.2.3. Directory \WINNT

3.3. Verify on the appropriate screen that the PERC Driver is listed.3.4. Do not make a repair disk3.5. Do not install network

4. Install Service Packs5. Add the 4mm DAT tape driver

5.1. Control Panel5.2. Tape Devices

6. Before starting a Restore, all applications and services must be shut down.7. From the Start icon, select Programs, select Administrative Tools, and select Backup8. Double-click on the Tapes icon.9. Only the C: drive on the tape is displayed, even though there are savesets for other drives.

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10. Double-click on C: saveset to catalog the tape for all savesets.

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11. Once cataloging is done, all savesets are displayed.

12. Select the drives to be restored.13. Click on the Restore button on the toolbar.

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14. In the dialog box

14.1. Select the Restore Local Registry Option.14.2. Select the Restore file Permissions14.3. Select the Verify After Restore14.4. Enter Log File: name according to your site standards14.5. Select the Full Detail

15. Click on the OK button.

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16. If a dialog box appears

Answer Yes to All.17. When complete,

17.1. Verify that there were no skipped or corrupt files.17.2. Press OK17.3. Close the Backup Program

18. Remove the Tape and store it.Note:

In the Following step it says POWER DOWN the SDP. Do not do a SHUTDOWN first. This will keep the restored registry intact.

19. Press the power button to power down the SDP. Do NOT SHUTDOWN WINDOWS NT first.20. Power Up the SDP21. Perform some tests to verify the restore.

21.1. Network is now correctly setup?21.2. Display resolution now correct/21.3. Start RAE

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