4 49654043 49654047 49654058 49654111 49654112

4.2.1~4.2.6 4.2.7~4.2.11 4.3 PowerPoint

4.2.1 :()()

4.2.2 :(1)(2)(3)

(Chemical Machining CHM)(Chemical Etching)

4.2.3 :()(Plasma Etching)(Physical Bomboard)(Active Radical)()(Chemical Reaction) (1) (Sputter Etching) (2) (Ion Beam Etching) (Plasma Etching) (Reactive Ion Etching RIE)

(etchant)(selectivity)(isotropic etching)(undercut)3.a(anisotropic etching)3.c(Radical)

(a).(b).(c).

4.2.4 / :

: ()

4.2.5 : (PVD)(CVD)(Plasma)(Plasma)

4.2.6 :

:

:

4.2.7 :Optical Emission

4.2.8

4.2.9 ()

4.2.10 (Profile)

4.2.11 (Passivative Gas)(Under layer Selectivit)

4.3

(IC)IC;IC

1121420

(Si)(Ge) (GaAs)

1.2()

()

()

1

RIE

(Micro loading Effect)