dt analysis report 0326 v2

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HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 1 U900 Trial Verification Drivetest GSM NETWORK – 2G TSEL NPI PROJECT JABODETABEK 26th March 2013

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DT Analysis Report 0326 v2

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Page 1: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 1

U900 TrialVerification Drivetest

GSM NETWORK – 2G TSEL NPI PROJECT JABODETABEK

26th March 2013

Page 2: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 2

Count of Bad Spots

Drive Test KPI

Bad Spots Summary

Drive Test KPI

DRIVE TEST SUMMARY

Drivetest Statistics

Page 3: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 3

CR Spot Number Target(NPI 2G)_CR_047_Henry_Area3_EDGETHRES and add neighbor Spot 1 and 5(NPI 2G)_CR_048_Henry_Area3_POWL Spot 8(NPI 2G)_CR_049_Henry_Area3_EDGETHRES and add neighbor Spot 10(NPI 2G)_CR_050_Henry_Area3_add missing neighbor Spot 14(NPI 2G)_CR_051_Henry_Area3_add missing neighbor Spot 1,2(NPI 2G)_CR_052_Henry_Area3_add missing neighbor Spot 5(NPI 2G)_CR_053_Henry_Area3_HTLLEMERIDIEMG1_PBGT Spot 4(NPI 2G)_CR_054_Henry_Area3_KEMPINSKYMG1_PBGT Spot 4(NPI 2G)_CR_055_Henry_Area3_KEMPINSKYMG1_MINOFFSET Spot 4(NPI 2G)_CR_056_Henry_Area3_MINOFFSET Spot 1,2,3,4(NPI 2G)_CR_057_Henry_Area3_EDGETHRES and POWL PRINCECENTREID1 Spot 12

(NPI 2G)_CR_059_Henry_Area3_EDGETHRES and POWL MEGATOSARIMD3 PBGTSpot 12, Spot 11, Spot 15, Other captured BS

(NPI 2G)_CR_060_Henry_Area3_add missing nbr- STDNMADYAMG2 Spot 7(NPI 2G)_CR_061_Henry_Area3_KARETSEMANGGMG1 minoffset Spot 5(NPI 2G)_CR_062_Henry_Area3_PANINMG3 Other captured BS

Summary of CR Raised

In general, badspots relative to locked GSM were optimized by MINOFFSET adjustments and additional neighbour. Other CR are related to limiting overshooting of IBC cells.

HCR raised

Page 4: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 4

GSM RXLEV IDLE

March 19 March 26

Page 5: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 5

GSM RXLEV DEDICATED

March 19 March 26

Page 6: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 6

GSM RXQUAL

Spot 5

Spot 8

Spot 7

Spot 6

Spot 1

Spot 2

Spot 3

Spot 4

Spot 8

Spot7

Spot 6

Spot 1

Spot 2

Spot 3

Spot 4

Spot 5

Improved

With Improvement

(NPI 2G)_CR_02_U900_Retune BCCH TCH_20130

(NPI 2G)_CR_047_Henry_Area3_EDGETHRES and

March 19 March 26

Page 7: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 7

GSM RXLEV IDLE GSM RXLEV DEDICATED

GSM RXQUAL

Page 8: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 8

SPOT 5:

No dominant server.

Root cause: Site distances from the spot affecting GSM service.

Page 9: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 9

SPOT 6:

No dominant server. Too many blockings. Found adjacent channels between SUDIRMANCBDMG1 and GOLFSENAYANMG2.

Root cause: For further optimization physical and parameter tunings.

Page 10: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 10

SPOT 7:

No dominant server. Poor coverage from GSM cells.

Page 11: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 11

DCS RXLEV IDLE

March 21March 19 March 26

Page 12: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 12

DCS RXLEV DEDICATED

March 19 March 26

Page 13: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 13

DCS RXQUAL

Spot 10

Spot 9

Spot 10

March 19 March 26

Page 14: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 14

DCS RXLEV IDLE DCS RXLEV DEDICATED

DCS RXQUAL

Page 15: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 15

UNLOCKED MODE RXLEV

Spot 9

March 19 March 26

Page 16: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 16

UNLOCK MODE RXQUAL

Improved

Spot 11

Spot 12

Spot 13

Spot 14

Spot 12

Spot 13

Spot 14

Spot 15

March 19 March 26

Spot 11

Spot 15

Page 17: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 17

FREE MODE RXLEV DEDICATED FREEMODE RXQUAL

Page 18: DT Analysis Report 0326 v2

HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 18