dt analysis report 0326 v2
DESCRIPTION
DT Analysis Report 0326 v2TRANSCRIPT
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 1
U900 TrialVerification Drivetest
GSM NETWORK – 2G TSEL NPI PROJECT JABODETABEK
26th March 2013
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 2
Count of Bad Spots
Drive Test KPI
Bad Spots Summary
Drive Test KPI
DRIVE TEST SUMMARY
Drivetest Statistics
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 3
CR Spot Number Target(NPI 2G)_CR_047_Henry_Area3_EDGETHRES and add neighbor Spot 1 and 5(NPI 2G)_CR_048_Henry_Area3_POWL Spot 8(NPI 2G)_CR_049_Henry_Area3_EDGETHRES and add neighbor Spot 10(NPI 2G)_CR_050_Henry_Area3_add missing neighbor Spot 14(NPI 2G)_CR_051_Henry_Area3_add missing neighbor Spot 1,2(NPI 2G)_CR_052_Henry_Area3_add missing neighbor Spot 5(NPI 2G)_CR_053_Henry_Area3_HTLLEMERIDIEMG1_PBGT Spot 4(NPI 2G)_CR_054_Henry_Area3_KEMPINSKYMG1_PBGT Spot 4(NPI 2G)_CR_055_Henry_Area3_KEMPINSKYMG1_MINOFFSET Spot 4(NPI 2G)_CR_056_Henry_Area3_MINOFFSET Spot 1,2,3,4(NPI 2G)_CR_057_Henry_Area3_EDGETHRES and POWL PRINCECENTREID1 Spot 12
(NPI 2G)_CR_059_Henry_Area3_EDGETHRES and POWL MEGATOSARIMD3 PBGTSpot 12, Spot 11, Spot 15, Other captured BS
(NPI 2G)_CR_060_Henry_Area3_add missing nbr- STDNMADYAMG2 Spot 7(NPI 2G)_CR_061_Henry_Area3_KARETSEMANGGMG1 minoffset Spot 5(NPI 2G)_CR_062_Henry_Area3_PANINMG3 Other captured BS
Summary of CR Raised
In general, badspots relative to locked GSM were optimized by MINOFFSET adjustments and additional neighbour. Other CR are related to limiting overshooting of IBC cells.
HCR raised
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 4
GSM RXLEV IDLE
March 19 March 26
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GSM RXLEV DEDICATED
March 19 March 26
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 6
GSM RXQUAL
Spot 5
Spot 8
Spot 7
Spot 6
Spot 1
Spot 2
Spot 3
Spot 4
Spot 8
Spot7
Spot 6
Spot 1
Spot 2
Spot 3
Spot 4
Spot 5
Improved
With Improvement
(NPI 2G)_CR_02_U900_Retune BCCH TCH_20130
(NPI 2G)_CR_047_Henry_Area3_EDGETHRES and
March 19 March 26
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 7
GSM RXLEV IDLE GSM RXLEV DEDICATED
GSM RXQUAL
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 8
SPOT 5:
No dominant server.
Root cause: Site distances from the spot affecting GSM service.
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 9
SPOT 6:
No dominant server. Too many blockings. Found adjacent channels between SUDIRMANCBDMG1 and GOLFSENAYANMG2.
Root cause: For further optimization physical and parameter tunings.
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 10
SPOT 7:
No dominant server. Poor coverage from GSM cells.
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 11
DCS RXLEV IDLE
March 21March 19 March 26
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 12
DCS RXLEV DEDICATED
March 19 March 26
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 13
DCS RXQUAL
Spot 10
Spot 9
Spot 10
March 19 March 26
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 14
DCS RXLEV IDLE DCS RXLEV DEDICATED
DCS RXQUAL
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 15
UNLOCKED MODE RXLEV
Spot 9
March 19 March 26
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 16
UNLOCK MODE RXQUAL
Improved
Spot 11
Spot 12
Spot 13
Spot 14
Spot 12
Spot 13
Spot 14
Spot 15
March 19 March 26
Spot 11
Spot 15
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 17
FREE MODE RXLEV DEDICATED FREEMODE RXQUAL
HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 18