레이저미세가공서비스 · 2017-07-01 · kortherm science co.,ltd. - advanced laser...

레이저 미세가공 서비스

KORTherm Science Co.,Ltd.- Advanced Laser Technology

Mass production

R&D

(Out Sourcing)

Customized OrderFeasibility test

Small volume

Order

➢ Mass production

Business Area 레이저미세가공 서비스 범위

기업이나 기관에서 표준화 된 제품 또는 시리즈 제품에 필요한 레이저 미세가공 공정을의뢰받아 당사 보유 레이저로 지속적이고 장기적인 가공서비스 제공

초미세 레이저 장비의 도입을 검토 중인 기업 또는 레이저를 이용한 가공 공정이 필요한기업이나 기관의 의뢰로 테스트 진행하여 적합한 solution 제공

레이저를 이용한 가공에 어려움을 겪고 있는 고객들의 다양한 가공의뢰에 대해 당사가보유한 가공기술을 최적의 요구조건에 맞추어 제공하는 1:1 맞춤형 서비스

레이저 가공의뢰에 있어 소량이고 단기적인 샘플 시범 테스트을 의뢰하는 대학,기업 등기타 연구소에 대해 당사의 풍부하고 전문화된 기술을 제공

➢ R&D Test (Feasibility Test)

➢ Customized Order

➢ Small volume Order

LaserMicro-Machining

레이저미세가공

(주)코썸사이언스레이저미세가공서비스

✓ 10년 이상 축적된 독자적이고 전문화된레이저 응용기술을 보유하고 있어 다양한application 제공.

✓샘플의 thermal expansion 극소화로최대의 가공 정밀도와 정확한 테스트결과 제공.

✓ 다양한 파장의 Laser (CO2, Nd-YAG, Fiber) 장비를 보유하고 있어 polymer, thin-film,ceramic, metal, glass 등 여러 가지 소재의가공 가능.

➢ Laser Processing Development

KORTherm Science Co.,Ltd.- Best choice for Laser Applications

Service Process 서비스 진행절차

1. 가공 의뢰 · 기술상담2. 가공 결과 중간 점검3. 비용 결제

1. 견적서 송부2. 가공물 (샘플) 수령3. 초기가공 · 중간보고4. 최종가공 · 결과물 송부5. 비용 청구

Customer

(주)코썸사이언스

Sample test procedures

Tested Sample(Output)

레이저응용기술연구소

축적된 데이타

OptimizedSolutions

연구기관

대학기업

Customer

KORTherm Science Co.,Ltd.- Advanced Laser Technology

❖ Cutting

❖ Hole Drilling

❖ ITO / FTO Patterning

❖ Scribing

❖ Marking & Engraving

❖ Film Cutting (Polymer 계열)

❖ Transparent materials such as Glass, Quartz, Sapphire, Fused Silica(CaF2, MgF2)

❖ ITO/PI, ITO/PET, ZnO/PI, ZnO/PET

Key Applications 레이저미세가공 응용범위

❖ Solar Cell

❖ Wafer

❖ Thin Film

❖ Polymer

✓ Flex Circuits

✓ Hydrogel

✓ Kapton

❖ Natural Materials

✓ Silicon

✓ Quartz

✓ Sapphire

✓ Silica

✓ Paper/Cardboard

✓ Wood

✓ Mica

❖ Glass

✓ Aerogel

✓ Fused Silica

Materials

❖ Ceramics

✓ Alumina

✓ Aluminum Nitride (ALN)

✓ Black Ceramic

✓ Ferrite

✓ Green Ceramic

✓ LTCC / HTCC

✓ Piezo Ceramic

✓ Yttria Stabilized Zirconia

❖ Thin Metals / Foils

✓ Aluminum Foil

✓ Brass Foil

✓ Copper Foil

✓ Gold Foil

✓ Molybdenum

✓ Nickel Foil

✓ Titanium Foil

❖ Metals

✓ Bronze

✓ Cobalt

✓ Cold Rolled Steel

✓ Germanium

✓ Hardened Steel

✓ Hot Rolled Steel

✓ Mild Steel

✓ Molybdenum

✓ Silver

✓ Stainless Steel

✓ Steel

✓ Tantalum

✓ Tungsten

❖ Plastics

✓ Acrylic

✓ Lexan

✓ Lucite

✓ Polycarbonate

✓ Styrene

❖ Laminates

✓ Duroid

✓ Flex Circuits

✓ Garrolite

❖ Expoxies

✓ Conductive Epoxy

✓ Epoxy Preforms

✓ Frozen Epoxy

❖ Alloys

✓ Kovar

✓ Mild Steel

✓ Molybenum

✓ Nitinol

✓ Stainless Steel

✓ Steel

✓ Superalloys

✓ Tantalum

✓ Zircaloy

❖ Adhesives


Samples 레이저미세가공 결과

Polymer

Scribing of IMI film on GlassWavelength: 532nm

Wavelength: 1064nmPulse energy: Rep rate: 40kHz

Film ReleaseWavelength: 532nm

Hole Drilling(on the PI film)Wavelength: 355nm

FTO Patterning (FTO on glass)Wavelength:1060nm

FTO Patterning(on the PI film)Wavelength: 1080nm

Polyimide FilmWavelength: 532nm

PET FilmWavelength: 355nm

PET FilmWavelength: 355nm

FTO Release (FTO on glass)Wavelength: 355nm

Polyimide Film CuttingWavelength: 355nm

ITO Scribing (Including Ag)Wavelength: 355nm

Hole DrillingWavelength: 355nmThickness: 2.8mm

Polaroid Film PatterningWavelength: 355nm

ITO Scribing (Ag Including)Wavelength: 355nm

PET Easy CutWavelength: 355nm

ITO Patterning (on the PET film)Wavelength: 355nm

PET Film Wavelength: 10.6 μm



Polymer

PMMA CuttingWavelength: 10.6 μm

Acrylic Resin PatterningWavelength: 10.6 μmThickness: 5mm

PI Film DrillingWavelength: 355nm

ITO Patterning Wavelength: 1,080nm(PICO Laser)

Ag Film Punching(Ag & Polymer Film)Wavelength: 10.6 μm

PI Film DrillingWavelength: 355nm

FTO ScribingWavelength: 532nm

Polymer Deposition Thin-film PatterningWavelength: 355nm

ITO Scribing Wavelength: 1,080nm



Wafer (Ceramics)

Ceramic Film PatterningWavelength: 532nm

Solar Cell Wafer DopingWavelength: 532nm

LED CELLWavelength: 532nm

Scribing of CeramicWavelength: 1080nm

Solar cell Wafer Edge isolation Wavelength : 532nm

Wafer DopingWavelength : 532nm

Drilling of Si-WaferWavelength: 1064nmPulse energy: Rep rate: 10kHz

Edge Isolation of Si SolarcellWavelength: 1064nmPulse energy: Rep rate: 500kHz

Removal of CIGS on Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHz

Removal of TCO on CIGS +Mo Glass

Wavelength: 1064nm

Si Wafer Round CuttingWavelength: 532nmThickness: 520 μm

Si Wafer Pattern CuttingWavelength: 532nm

Silicone SheetHole DrillingWavelength: 355nm

AIN Wafer HoleDrillingWavelength: 355nm

Si Wafer Pattern CuttingWavelength: 532nm

Ceramic HoleWavelength: 10.6 μm

Si Wafer DrillingWavelength : 532nm

Si Wafer Align Key MarkingWavelength: 355nm



Wafer (Ceramics)

Patterned Si-Wafer Cutting(Membrane Pattern)Wavelength: 355nm

ARC Ablation(Anti-Reflective Coating)Wavelength: 355nm

Si Wafer CuttingWavelength: 532nm

Green Sheet Scribing(Unfired Ceramic Sheet)Wavelength: 532nm

Si Wafer Full CuttingWavelength: 532nm

LGBC Scribing (Laser Grooved Buried Contracts)Wavelength: 355nm

Ceramic Cutting(Ni Oxide + YSZ)Wavelength: 1064nm

Si Wafer Round CuttingWavelength: 532nm

Si Wafer Cutting(Membrane Pattern)Wavelength: 532nm

Si Wafer Full Cutting(Cross-Section)Wavelength: 532nmThickness: 0.3mm

Ceramic Cutting(Ni Oxide + YSZ)Wavelength: 1064nm

Si Wafer Hatching PatterningWavelength: 355nm

Fired Ceramic Sheet (Via Hole)Wavelength: 355nm

Si Wafer PatterningWavelength: 532nm

Si Wafer ScribingWavelength: 532nm(Scanner Type)



Metal

Via HoleWavelength: 355nm

Ferrite CompoundCutting(Cross-Section)Wavelength: 355nmThickness: 150μm

Metal on PETWavelength: 10.6μm

SUS Thin Film Hole DrillingWavelength: 355nm

Metal Hole DrillingWavelength: 355nm

Cu Thin Film DrillingWavelength: 355nm

Tungsten-Carbide Hole Drilling(Via Hole)Wavelength: 355nm

Wafer DopingWavelength : 532nm

Gold Thin FilmPatterning(Inner PDMA Film)Wavelength: 532nm

Mo (Molybdenum)Thin Film Hole DrillingWavelength: 355nm

Tungsten-Carbide& Nickel Complex Hole Drilling(Via Hole)Wavelength: 355nm

Mg Surface PatterningWavelength: 355nm

Cu Wafer CuttingWavelength: 532nm

Aluminium Oxide Wafer Hole DrillingWavelength:355nm

Scribing of ZnOon glassWavelength: 532nm

Removing of ZnO on GlassWavelength: 355nmRep rate: 30kHz

Mo Scribing(Solar Cell Thin Film)Wavelength: 532nm

Tantalum (Ta)Hole DrillingWavelength: 532nm



Metal

SUS ScribingWavelength: 355nm

Cathode/Anode Electrode Cutting(Copper & Aluminium)Wavelength: 355nmThickness: 25μm

Invar Steel (Fe-NI) ScribingWavelength: 355nm

SUS420J2 ScribingWavelength: 355nm

Pure Mg Cutting(Magnesium)Wavelength: 355nm

Ag Coated GdBCO on STS Cutting(Cross-Section) Wavelength: 355nm

Au Pad Full ScribingWavelength: 355nm

Copper Foil Hole DrillingWavelength: 532nm

Back Electrode Film Ablation (ZnO on the Glass)Wavelength: 355nm

Ag Nano Wire Thin-film ScribingWavelength: 1064nm

Cu Hole DrillingWavelength: 355nmThickness: 0.1mm

SUS Hole DrillingWavelength: 355nmThickness: 0.1mm

Alumina Tube Hole DrillingWavelength: 10.6μm

SUS304 Hole DrillingWavelength: 355nm

Metal Film PatterningWavelength: 355nm

AluminiumThrough Line PatterningWavelength: 532nm

Si Wafer Metal Layer AblationWavelength: 355nm

Metal Oxide Film AblationWavelength: 532nm



Transparent Materials & Etc.

Graphite PatterningWavelength: 355nm

Artificial Diamond PatterningWavelength: 532nm

Scribing of GlassWavelength: 532nmRep rate: 30kHz

Hole Drillingon the AluminiumWavelength : 355nm

Glass PatterningWavelength: 355nm

Quartz PatterningWavelength: 355nm

Quartz Micro-HoleDrilling(Cross-Section)Wavelength: 355nm

Epoxy Resin PatterningWavelength: 10.6μm

Quartz ScribingWavelength: 10.6μm

Slide Glass CuttingWavelength: 355nm

Sapphire Micro-HoleDrillingWavelength: 355nmThickness: 420μm

Soda-Lime Glass HoleScribing (Via Hole)Wavelength : 355nm

Superconductor GdBCO Thin Film Scribing(Cross-Section)Wavelength: 355nm

Superconductor GdBCO Thin Film Hole Drilling(Through Hole)Wavelength: 355nm

Flexible Gorilla Glass CuttingWavelength: 355nm

Graphene CuttingWavelength: 355nm

Quartz Hole Patterning(Via Hole)Wavelength: 355nm

Carbon Disk Hole Drilling(100% Carbon)Wavelength: 355nm



Transparent Materials & Etc.

Sapphire Wafer Cutting(Cross-Section)Wavelength: 355nm

PMN-PT Patterning(Piezoelectric Element)Wavelength: 532nm

Gold/Pt/CVD Diamond Pattern Scribing(Using Edge Alignment)Wavelength: 355nm

Glass Full CuttingWavelength: 355nmThickness: 0.5T

Glass Microwire CuttingWavelength: 355nm

Quartz Thin Film CuttingWavelength: 355nm

Sapphire Wafer ScribingWavelength: 355nm

OLED Light Hole DrillingWavelength: 355nmThickness: 0.88mm

Glass Channel Patterning(Lab-on-a-chip)Wavelength: 355nm

Quartz Wafer Hole DrillingWavelength: 10.6μmThickness: 500μm

Glass Full Cutting Wavelength: 355nm

Quartz Wafer Round CuttingWavelength: 10.6μmThickness: 680μm

Transparent Electrode ScribingWavelength: 355nmThickness: 0.71mm


Laser Micro-Machining System 레이저미세가공 시스템

❖ Nd-YAG (DPSS) LASER

- 355nm / 532nm / 1064nm

❖ CO2 LASER

- 10.6㎛ / 9.35㎛ / 9.4㎛

❖ FIBER LASER

- 1080nm

❖ EXCIMER LASER

- 193nm / 248nm

레이저 미세가공 서비스

.

주 소 : 인천광역시 부평구 청천동 425 우림라이온스밸리 C동 1203B호

phone : 032) 623-6320~4 | fax : 032) 623-6325 | e-mail : [email protected]

032) 623-6326~7 [email protected]

(주)코썸사이언스

http://www.kortherm.co.kr

(주)코썸사이언스는 다양한 파장의 레이저를 보유하고 있습니다.

문의 주시면 다양한 응용분야에 맞는 샘플테스트를 실비로 이용 가능합니다.

We have wide range of selection for laser and we can provide the complete sample test work

corresponding to required applications.

레이저미세가공서비스 · 2017-07-01 · kortherm science co.,ltd. - advanced laser...

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