electric properties of dielectrics -...
TRANSCRIPT
Electric Properties of
Dielectrics
吳瑞北
Rm. 340, Department of Electrical Engineering
E-mail: [email protected]
url: cc.ee.ntu.edu.tw/~rbwu
S. H. Hall et al., High-Speed Digital Designs, Chap.6
R. B. Wu
What will you learn
• How varies with frequency?
• Can ’ and ” be arbitrarily defined?
• What is the physical constraint?
• How to set suitable model for ’ and ” ?
• How to measure it?
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Tx-Line Losses
• Polarization of Dielectrics
• Dielectric losses
• Environmental & Localization Effects
• Measurements
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Nonideal Effects in Dielectrics
• Dielectric working well for lower frequencies
becomes difficult to design since
– Frequency-dependent permittivity and loss tangents
– Environmental factors
– Localized interactions (fiber weave effect)
• Improper model results in inaccurate phase delay
and signal losses, even nonphysical behaviors
• Dielectric loss in PCB is significant at >3 GHz.
• Simulation-based bus design at >3GHz is possible
only if with suitable model for dielectric material.
R. B. Wu
Freq.-Dependent Dielectric Constants & Losses
• Loss tangent
• Dielectric constant
;2
tan
fd
112 fCG
From R, L, C, then
Ref.: S. Mumby, “Dielectric properties of FR-4 laminates as a function of thickness and the electrical
frequency of measurement (IPC-IP-749), Inst. Interconnect. & Packag. Electron. Circuits, 1988.
;glsglsrsnrsn VVr
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Dielectric Loss vs. Conductor Loss
ac dominant
1:1
2:1
W. Humann, Proc. ITC 2002
ac
ad
loss) dielectricf
loss)conductor f
d
c
a
a
Polarization of Dielectrics
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Electronic Polarization
• When electric field applied,
electron cloud is displaced until
force between +/- charges equal
the force of applied field.
• Electric inside electron cloud:
• Electric dipole moment:
electronic polarizability:
• Polarization vector:
3
0
ˆ ; 4
er r
e
q rE rE E
r
e e rp q r p Ea
3
04e era
; : # atoms per unit volumeP Np N
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Other Polarizations
• Orientational (dipole)
polarization
• Ionic (molecular)
polarization
ip Ea
op Ea
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Relative Permittivity
• Usually measured rather than calculated.
• Polarizability
• Electric flux density:
( )e o i totP N Ea a a
0 0 0
0 0
0 0 0 0 0
) ; (
(1 )
st
r
E E E E P P E
D E P
f
D E E E
: electric susceptibility
: relative dielectric permittivityr
Dielectric Loss
R. B. Wu 12 Interconnect: Adv
Classic model of dielectric losses derived from damped oscillations of electric dipoles in the material aligning with the applied fields
• Dipoles oscillate with the applied time varying field – this takes energy
Dielectric constant becomes complex with losses
PCB board manufacturers specify this was a parameter called “Loss Tangent” or Tan
''' ''
'j Tan
12 ''dielectric
dielectric
f
The real portion is the typical dielectric constant, imaginary portion represents losses, or conductivity of the dielectric
Dielectric Losses
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DC Dielectric Losses
• Due to conduction electrons in dielectric
• Do not confuse d discussed here with dielectric,which is
due to the energy it takes to polarize the electric dipoles in
dielectric.
• The term d is small and usually neglected.
dJ E
0
0
( )
d
dr r
H J j E E j j E
j j j E
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Single-Pole Model
• Mechanical spring model analogy
2002 2
0
; = q E m k
mx bx kx F xj b m m
2
0
2 2
0 0 0
r
N q mPP Nqx
E j b m
2 2 2
0 0
2 22 2
0
2
0
2 22 2
0
1r
r
N q m
b m
N q m b m
b m
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Multipole Model
• Several resonance:
• A more pragmatic approach
2
0
2 21
1n
i i
r
i i i i
N q m
j b m
2
1 01, 2,1
ni d
r
ii i
jj
1 2,
Damping factor dominant
Debye equation:
1
ni
r
i ij
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PCB Example
• Model can be fit empirically
2 2
2 21 32 4
1 2 peaks two poles: 1 1
r rj j
2 4
1 2
1 3
, : 19, 32GHz
3.8
variations near peaks
0.0163, 0.012
damping tuned for match
, : 20, 63GHz
Only suitable 15-35GHz
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Infinite-Pole Model • One freq. only model?
2
1
1 2
1 2 12,
22 1
2 1 2 1 2 1
1
ln ln 11
lnln ( ) ( ) 2
ln ln ln
ni
r r
i i
r
dy
j y yj
j jj
11
2 1
Ex. : / tan 3.9 / 0.0073@1G
choose 10 , 10
r
3.9 0.0073 0.028
0.417
3.9@1
3.85
G
11
11
0.028
3.85 0.0178ln 10
3.85 0.0178ln 10( )
tan =
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’ vs. ” in Debye Model
• ’ decreases with a corresponding increase in losstan.
0
Debye equation: 1
jj
2
0
0
2
0
1
1
0
1
00
tan 1
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Causality
• Kramers-Kronigs relations,
– between real and imaginary parts of any complex function that is
analytic in the upper half-plane:
2 20
2 20
2 ( )( ) 1
2 1 ( )( )
x xdx
x
xdx
x
* Analytic functions:
( ) Re Im
Re Im Re Im ;
* Reality
( ) ( )
r i
r i i r
j j
0
0 0
2 2
0
0
2 2
0
0
1
Ex.: Debye model:
1
Re( )=
Im( )=
r i
i
i r
r
i r
j j
j
0( ) ( ) ( )
K.K. relation ( ) 0 0
P t t E d
t t
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Improve 3-dB BW on Lossy Lines
• Use more copper
• Don’t go as far,
otherwise using
repeaters
• Use a higher-
impedance trace
• Add equalization
• Use a better
dielectric material
Environmental & Localization
Effects
R. B. Wu 22
Resin
Material
Glass
Material
9 0 6 3
9 6 3
Fiber Weaves in FR4
• Woven fiberglass bundles in FR4
• Bulk dielectric constant
• Spatially dependent r, eff will
deteriorate differential lines
significantly.
, fiber r, resin6; 3;r
, fiber fiber r, resin resinr r V V V
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Fiber-Weave Effects & Mitigation
• Worse-case difference
• It can be larger for
thinner microstrips.
• May cause severe
impact for differential
lines @ 5 to 10 Gb/s
• One way to mitigate
this effect is to route
the lines 450 to the
direction of weave.
,eff 0.23r
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• 2D fiber-weave modeling
– Trace between bundles
– Trace over a bundle
Model of Fiber-Weave Effects
,eff 3.5 4.6r r
,eff 3.72 4.95r r
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Humidity & Temperature Effects
• Material: FR4-7628
• Effects:
– Large increase in losstan
(+50% from 15-95% RH)
– Small increase in r
(+5% from 15-95% RH)
Malaysia (95% RH, 95oF)
Arizona (15% RH, 60oF)
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Have you learned?
• What is physical model for dielectric loss?
• Do you know dielectric polarization,
oriental polarization, and ionic polarization?
• Do you know the common models: signal-
pole model, multi-pole model, infinite-pole
model, and Debye model?
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Further Reading
• T. Chretiennot, et al., "A microwave and microfluidic planar resonator
for efficient and accurate complex permittivity characterization of
aqueous solutions,” IEEE T-MTT, vol. 61, Feb. 2013.
• E. Piuzzi, et al., "A comparative analysis between customized and
commercial systems for complex permittivity measurements on liquid
samples at microwave frequencies,” IEEE T-IM, vol. 62, May 2013.
• M. Hofmann, et al., "Microwave-based noninvasive concentration
measurements for biomedical applications,” IEEE T-MTT, vol. 61,
May 2013.
• J. Roelvink, et al., "A planar transmission-line sensor for measuring
the microwave permittivity of liquid and semisolid biological
materials,“ IEEE T-IM, vol. 62, 2012.
• G. Hislop, “Permittivity estimation using coupling of commercial
ground penetrating radars,” IEEE T-GRG, vol. 53, Aug. 2015
28
Measurement of Dielectric Constants
Student: Chia-Hao Chang
Adviser: Ruey-Beei Wu
Date : 06/27 2009
R. B. Wu 29
Waveguides
• Measuring S-parameters of filled waveguides to derive
propagation constant
• Costly, available above fcutoff
Square WaveguideSquare Waveguide
Dielectric sample
l
ConnectorConnector
W. B. Weir, “Automatic measurement of complex dielectric constant and permeability
at microwave frequencies,” Proc. IEEE, vol. 62 no. 1 pp. 33-36, Jan 1974.
0
2
rk
r
cutoffa
cf
2
kck
β
a
R. B. Wu 30
Substrate-Integrated Waveguide
• Two SIW (Substrate-Integrated Waveguide) to calculate
FDEW (Freq.-Dependent Equivalent Width)
• Unknown conductive attenuation
• Available above fcutoff
Wave
Propagation a'
a
Wave Propagation
ain
s
C. H. Tseng and T. H. Chu, “Measurement of frequency-dependent equivalent width of substrate
integrated waveguide,” T-MTT, pp. 1431-1437, Apr. 2006.
2
0
2
2
2
41
r
a
2
0
2
2
2
41
r
a
Wave
Propagation a"
aa
R. B. Wu 31
Cavity Resonance
• Observing resonant frequencies and Q factors
• Edge effect
• Bad resolution at higher modes
A. Namba, et al., and T. Watanabe, “A simple method for measuring the relative
permittivity of printed circuit board materials,” T--EMCpp. 515-519, Nov. 2001.
Dielectric
Metal 2
Metal 1
2 2
2 2mn
r
c m nf
a b
222
22 b
n
a
m
f
c
mn
r
a
b
R. B. Wu 32
Ring Resonator
• Periodical resonance
• Difficult feeding and coupling loss
a
Feeding
LineFeeding
Line
P. A. Bernard and J. M. Gautray, “Measurement of dielectric constant using
microstrip ring resonator,” T-MTT, Mar. 1991
,2
n
r eff
c nf
a
2 2
,2
r eff
n
c n
f a
R. B. Wu 33
T-stub
J.-H. Liu, Y.-C. Lin, J.-T. Lue, and C.-J. Wu, “Resistivity measurements of
layered metallic films at various microwave frequencies and
temperatures using the micro-strip T-junction method,” Meas. Sci.
Technol. 13, pp.1132-1137, Apr. 2002.
)(4
)12(
fP
cnf
eff
res
0
212
2
ZZ
ZS
in
in
• Periodical resonance
• Acquiring attenuation constant from |S21|
• Drawbacks of resonance method:
– Limited by the fixture dimension
– Sensitive to determination of resonant freq.
ZinZ0 Z0
, 0in resZ Z Pa
Zin
P
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Time
TDT
Delay
AttenuationIncident
Pulse Transmitted
Pulse
34
Time-Domain Tx-Line Measurement
• Observing the TDT pulse response
• Require perfect match
A. Deutsch, G. Arjavalingam, G. V. Kopcsay, M.J. Degerstrom, “Short-pulse
propagation technique for characterizing resistivepackage
interconnections,” T-CHMT, pp. 1034-1037 , Dec. 1992
Ground
Dielectric
Microstrip Line
ProbeProbe
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Ground
Dielectric
Microstrip Line
ProbeProbe
35
• Applying transmission line property
• Measuring S-parameters to derive propagation constant
effr ,00
a j
dc aaa
Freq.-Domain Tx-Line Measurement
T S le
a j
2
00
,
effr
a d
eff
2tan
M. Cauwe and J. De Baets, “Broadband material parameter characterization for
practical high-speed interconnects on printed circuit board,“ T-AdvP,
pp.649-656 Aug 2008
R. B. Wu 36
Pros & Cons of Tx-Line Method
• Pros:
– Broadband
– Easy fabrication
– Conductor effect can be calculated
• Cons:
– Inhomogeneous microstrip line requires data conversion
– Accuracy of empirical formula and manufacturing tolerance is uncertain
Ground
Dielectric
Microstrip Line
ProbeProbe
W
T
H
Adapt stripline structure to avoid data conversion
M.N.O. Sadiku, S.M. Musa, S.R. Nelatury, “Comparison of dispersion formulas
for microstrip lines,” 2004 IEEE SoutheastCon. Proc., pp. 378-382, Mar. 2004.
R. B. Wu 37
G. F. Engen, and C. A. Hoer, “’Thru-Reflect-Line’: An improved technique
for calibrating the dual six-port automatic network analyzer,“ T-MTT,
pp. 987-993, Dec. 1979.
1. S-parameter Measurement
• Use VNA built-in TRL calibration to capture scattering
parameters of an ideal tx-line
• All connectors are assumed identical
P1
P2
TR
L
DUT
S11 S22
S21
S12
DUT
a1
b1
Sx11 Sx22
Sx21
Sx12
a2
b2
Sy11 Sy22
Sy21
Sy12
Error Box X Error Box Y
Connector
X
Connector
YDUT
R. B. Wu 38
TRL calibration
• TRL works well except
when q ~ /2,
• P is chosen /4 of max.
freq. to minimize higher
order wave
VNA
port 1
VNA
port 2ROpen
or
Short
|Γ|=1 |Γ|=1
Reference Plane
T
Reference Plane
|Γ|=0 |Γ|=0VNA
port 1
VNA
port 2
L
Reference Plane
|Γ|=0 |Γ|=0
p
VNA
port 1
VNA
port 2
q
a
sin2
1,
R. B. Marks, “A multiline method of network analyzer calibration,” T-MTT,
pp. 1205-1215, Jul. 1991.
VNA
port 1
p
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2. Transmission Matrix • The S-parameters can be transformed to ABCD
transmission matrix
• It describes the cascading relation of voltage and current
• Theoretically, [T] satisfies:
2112221121122211
2112221121122211
21)1)(1()1)(1(
)1)(1()1)(1(
2
1
SSSSSSSS
SSSSSSSS
ST
DUTV1 V2
I1 I2
+
-
+
-
2
2
1
1
I
VT
I
V
ll
Z
lZl
T
coshsinh1
sinhcosh
0
0
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Re{λ}
Im{λ}
θ θ+2π
λ
40
3. Propagation Constant Solution
• Solving complex eigenvalue for [T], they are
fx. of propagation constant & line length:
let
• By selecting correct root and phase,
propagation constant is obtained:
le 21,
a lnl
n
2
a j
ll
Z
lZl
T
coshsinh1
sinhcosh
0
0
le
2
1
1
2
1
R. B. Wu 42
Simulation: Parallel Plate Cavity
• Simulating a parallel plate PCB with feeding port at center,
default relative dielectric constant=4, loss tangent=0.02
50 mm
50 mm
25 mm
25 mm
Port
Zero point
(2,0)(0,2)
(2,2)
(4,0)(0,4)
(4,2)(2,4)
(4,4)
(6,0)(0,6)
(6,2)(2,6)
(6,4)(4,6)
(8,0)(0,8)
(8,2)(2,8)
(6,6)
(8,4)(4,8)
Simulation software: Ansoft HFSS v11
R. B. Wu 43
Simulation -Ring Resonator
• Simulating a ring resonator with radius a=13mm, default
relative dielectric constant=4, loss tangent=0.02
1
23 4 5 6
a
Simulation software: Ansoft HFSS v11
R. B. Wu 44
Simulation -Stripline
• Results fit with each other but suffer from
plate mode and finite conductivity
W
H T
L
Abnormal ripple due to plate resonance
R. B. Wu 45
Stripline with Via Fence
• In order to suppress plate mode,
use ground via fence to force the
two ground layers of zero
potential difference Signal
Radiation
Signal
line
Ground
Ground
Feeding Port
Ground Vias
Stripline
R. B. Wu 46
Stripline with Via Fence
• The S-parameters of a 1mm txline on
a 45mm square board
Freq. limit of via
protection D=4mm,
f~17GHz
Simulation software: Ansoft SIwave v3.0
D
S
H
W
y
x
z
R. B. Wu 47
Via Fence Design Guide
• Calibration standards and DUT
should be surrounded by ground vias:
• Ground layers and vias form a SIW
structure. To avoid SIW mode, D shall
satisfy
rm
m
f
cD
2
1
2
D
S
H
W
y
x
z
r
cutoffD
cf
2
1
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48
Via Fence Design Guide (2/3)
• Small D lowering characteristic impedance is
unfavorable in transmission
• 80% ground current are concentrated in ±3h region
below signal line, H=2h, it is better choose that:
D
S
H
W
y
x
z
W
h
0 1h 2h 3h-1h-2h-3h
D
Ground Plane
WD 3HD 3
2
1
1
h
DI gs
S. H. Hall, G. W. Hall, and J. A. McCall, High-Speed Digital System Design,
New York: Wiley, 2000.
R. B. Wu 49
Via Fence Design Guide (3/3)
• To form a effective wall for avoiding resonance,
S shall satisfy
rm
m
f
cS
4
1
4
D
S
H
W
y
x
z
H. Uchimura, T. Takenoshita and M. Fujii, “Development of a laminated
waveguide” T-MTT, pp.2438-2443, Dec. 1998.
R. B. Wu
50
Conductor Internal Inductance
• The current flowing inside the conductor contributes to
inductance effect
• Determined by W
rather than H
Hexternal
Hinternal
w
tL freqlow
4
0int
acR
L int
R L
G C
LC
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51
Modified Tx-Line Model
• the transmission line model should be modified as
• The phase constant without Lint effect is
R Lext
G C
Lint
intLLL ext
ext
ext
extext L
LCLj
L
LGZ
L
L
Z
R
21
21
221
2
intint0int
0
C
LZ ext
0
0 0
int 2
r ext
ext
L C
L C
L
extext
cL
CL
L
L
Z
R
221
2
intint
0
a
ext
dL
LGZ
21
2
int0a
ca
ext
extL
LCL
21 int
2
00
1
r
R. B. Wu 52
Internal Inductance Effect
R. B. Wu 53
Attenuation Ratio (1/2)
• Simulating for loss ratio
rather than exact loss value
• Two sets of tx-line made with
different conductive
attenuation
• Simulate for the attenuation
ratio:
dc aaa 11 dc aaa 22
2
1
c
c
a
a
W1 W2H
1
H2
d2
d1
R. B. Wu 54
Attenuation Ratio (2/2)
• Then acquire dielectric attenuation:
• The drawback is that it amplifies error
• should be kept away from 1 by increasing difference in
line resistance or impedance
aaa
1
21d
a d2
tan dc aaa 11
dc aaa 22
r
111 aa
r
122 aa
1dd aa
1
1r
R. B. Wu 55
Experiment Setting
• Striplines on typical FR4 PCB, NP-140
• Two sets of line T1, T2
• p=25.4mm (~0.25λ@1.48GHz)
• q=30.48mm (~0.5λ@2.46GHz)
• D=4mm, S=2mm (~0.25λ@18GHz)
• VNA: Agilent 8510B
Stripline
S = 2 mm
D = 4mm
Vias
t=17.78 μm
H=
728.98 μm
W=150 μm
d=406.4 μm
T1
T=17.78 μmH=
728.98 μm
W=150 μm
d=101.6 μm
T2
L
Reference Plane
|Γ|=0 |Γ|=0
p
VNA
port 1
VNA
port 2
q
R. B. Wu 56
Measured S-parameters
• Resonance suppressing is design to 18 GHz but the
results stay valid only until 14GHz
R. B. Wu 57
Measured Phase and Attenuation
• Use loss ratio to split conductive attenuation and
dielectric attenuation Kappa=1.67,
error amp. =4
Conductive
att. =1.2
Conductive
att. =2
R. B. Wu 58
Experimental Result
• The slight difference in
dielectric constant
attributes to error of
internal inductance
estimation
• Increase in loss tangent
implies loss growth with
frequency more than 1
degree, making it
unsuitable at high
frequencies
R. B. Wu 59
Conclusions (1/2)
• A characterization method using stripline with via fence is
presented. It is suitable for investigate multi-layer PCBs
properties
• Via fence design should satisfy
but
while S is as small as possible
• Internal inductance effect in phase constant can be eliminated
as
rm
m
f
cD
2
1
2
D
S
H
W
y
x
z
WD 3
HD 3
ca 2
00
1
r
R. B. Wu
60
Conclusions (2/2)
• The smaller substrate thickness and line width, the lager
internal inductance and corresponding effect in dielectric
constant. It is small, but may be no longer negligible in
advanced process
• Calculating attenuation by simulating loss ratio is
applicable in material under special process or treatment
aaa
1
21d
a d2
tan
dc aaa 11
dc aaa 22
2
1
c
c
a
a