fpc technical guide - 山下マテリアル株式会社 · pdf filefpc technical guide 1. fpc...

FPC Technical Guide

1. FPC quick delivery course2. YFC Cable(Yamashita Flexible Circuit Cable)3. Low-loss FPC(GHz band)4. LCP-FPC suitable for high-speed transmission5. High temperature resistant FPC6. Conduction noise controlling FPC7. Impedance control FPC8. Impedance control FPC(GND mesh)9. Flexible high heat dissipation FPC10. Radiation heat dissipation Printed Wiring Board11. COMPANY OUTLINE

・Contents

Technology friendly to people and the earth

Characteristic

Example of use application

Standard materials

How to estimate and payment

Payment by “PayPal” is possible.Request a quote from the following URL.http://www.yamashita-net.co.jp/en/contact/estimate_yfc.html

・Base material [polyimide] ：12.5μ m～50μ m・Copper foil：9μ m～35μ m（Electrolytic or Rolled）・Cover material ： Coverlay、Solder resist・Surface finishing：Electrolytic gold plating、

Electroless gold plating、Solder plating etc

Single sided FPC

Double sided FPC

・This product is the highly economical FPC that utilizes the characteristics of FPC at a maximum for standard configuration.

・More complex wiring is available than single sided FPC.

Multi-layer FPC ・As the harness part can be folded or inflected, three-dimensional allocation in chassis and use for operation part are available.

[Contact for inquiries about this document]

Yamashita Materials Corporation Circuitec Company Sales Department[TEL] : 046-251-3722 [FAX] : 046-251-3725 [HP] : http://www.yamashita-net.co.jp [E-mail] : [email protected]


http://www.yamashita-net.co.jp/

Standard layer configuration

Characteristic

・The response by small lot is enabled by our FPC production know-how.・Even the FPC can be responded without drawing with high flexibility, the product is good for repeated bending.・The product with requested length, number of cores and terminal pitch can be produced without initial cost.・This product is superior in corrosion resistance and contact stability.・Correspond to the 1.0mm pitch, 0.5mm pitch, and 0.3mm pitch (zigzag connection) .・ The gold plating specification can support lead-free product..


・Thickness of coverlay (Polyimide / adhesive )：25µm/25µm・Thickness of copper foil：18µm or 35µm・Thickness of base polyimide：25µm・Thickness of adhesive of stiffening plate：40µm・Polyimide stiffening plate：75µm or 180µm and more.

0.3mm pitch terminal area

standard pattern size (mm)

How to estimate and payment

Payment by “PayPal” is possible.

Request a quote from the following URL.http://www.yamashita-net.co.jp/en/contact/estimate_yfc.html


Yamashita Materials Corporation Circuitec Company Sales Department[TEL] : 046-251-3722 [FAX] : 046-251-3725 [HP] : http://www.yamashita-net.co.jp [E-mail] : [email protected]



Characteristics of each type／layer structure

S21 measurement results

Note, Data are measured values, it is not a guaranteed value

【 Under development：PTFE-based and Low dielectric cover-

lay 】

・PTFE-based FPC of 100μm thickness

・Insulation cover with low dielectric cover-lay

・This is Structure of most low-loss

-12

-11

-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

0 5 10 15 20 25 30 35 40

S21

[ d

B/1

00

mm

]

Frequency [ GHz ]

【Evaluation sample specification】

Impedance： single 50 ohm

Signal length： 100mm

Measurement probe： GSG250um pitch

【LCP-based and Low dielectric cover-lay】

・LCP-based FPC of 50μm thickness

・Insulation cover with low dielectric cover-lay

・ This low-loss FPC is possible mass production

【LCP-based and General cover-lay】

・LCP-based FPC of 50μm thickness

・Bending resistance and heat resistance is excellent

in the range of LCP-based

In development：PTFE-based and Low dielectric cover-lay

LCP-based

and low dielectric cover-lay

LCP-based

and General cover-lay

Reference：PI-based

and General cover-lay

Product image

Product image

Product image

Thickness 【 μm 】

12 Polyimide

25 Low dielectric adhesive

RF line 28 Conductor

100 Poly tetra fluoro ethylene

GND 28 Conductor


12 Polyimide


12 Polyimide



50 Liquid crystal polymer

GND 28 Conductor


12 Polyimide


12 Polyimide

25 Adhesive


50 Liquid crystal polymer

GND 28 Conductor

25 Adhesive

12 Polyimide

Features of the product

It is possible to perform characteristic impedance with the high-precision pattern formation technology.

Low dielectric material is used for the insulating layer, and low-roughness foil is used for the conductor, and it is possible to

manufacture FPC suitable for high-speed transmission.

Since it is a stripline structure with countermeasure for shielding, the role as an alternative to a coaxial cable may be expected.

By using LCP for insulation and the adhesive layer, changes in the transmission loss by moisture absorption can be controlled.

By using 100μm-thick LCP as the base material, it becomes possible to set a wide range of characteristic impedance.

Schematic diagram of layers and the result of TDR measurement


Comparison and evaluation of the transmission loss in the normal state and after

moisture absorption treatment

0

25

50

75

100

-0.108 0.1869 0.4818 0.7767 1.0716

Imp

ed

an

ce

[Ω]

Time [ns]

TDR[μm]

15 Copper plating

18 Copper foil

50 LCP

18 Copper foil

18 Copper foil

15 Copper plating

GND

GND

100 LCP

100 LCP

RF line

-60

-50

-40

-30

-20

-10

0

0 1000 2000 3000 4000 5000 6000

S11

[d

B/1

00

mm

]

Frequency [MHz]

S11 (reflection) measurement result

Normal state

After moisture absortion

-1.8

-1.6

-1.4

-1.2

-1

-0.8

-0.6

-0.4

-0.2

0

0 1000 2000 3000 4000 5000 6000

S21

[d

B/1

00

mm

]

Frequency [MHz]

S21 (loss) measurement result

Normal state

After moisture absorption

Transmitter of FPC


Yamashita Materials Corporation Circuitec Company Sales Department

[TEL] : 046-251-3722 [FAX] : 046-251-3725

[HP] : http://www.yamashita-net.co.jp [E-mail] : [email protected]



Since LCP, which has a lower dielectric property than polyimide, also has a low dielectric dissipation factor, signals

hardly damp even in a long circuit, and it is possible to transfer signals precisely.

All LCP substrates also have excellent long-term heat resistance and comply with MOT of UL Standards (796F).

Test method: Check the state after a 240-hour degradation test at 230C by winding around a pin gage whose

diameter is 6.275mm 5 times.

After testing the all LCP Cracks in the adhesive after testing the polyimide FPC

Examples of product layer configuration



[TEL] : 046-251-3722 [FAX] : 046-251-3725



Pictures of the product LCP general characteristics

Test item Processing conditionsLCP50μm,

Cu18μUnit

Relative

dielectric

constant

2GHｚ10GHｚ

3.0

3.0

-

-

Dielectric

dissipation

factor

2GHｚ10GHｚ

0.0008

0.0016

-

-

Water

absorption

Immersion at 25C for

50h

0.04 %

Dimension

al stability

After etching MD

direction

After etching TD

direction

0.001

-0.005

%

%

単位（μ ｍ）50 LCPカバーレイ L1 液レジ

33 L1 銅箔+銅メッキ50 L1　ベース　LCP　

40 接着剤 50 L2 LCP カバーレイ180 補強板 18 L2 銅箔

50 ベース　LCP　18 L3 銅箔　50 L3 LCP カバーレイ　50 L4ベース　LCP　33 L4　銅箔+銅メッキ50 L4　LCP カバーレイ

402

L1 liquid resist

L1 copper foil+copper plating

L1 pace LCP

L2 LCPcover lay

L2 copper foil

Base LCP

L3 copper foil

L3 LCPcover lay

L4 base LCP

L4 copper foil+copper plating

L4 LCPcover lay

Unit (μm)

LCP cover lay

Adhesive

Reinforcing sheet

L4 LCPcover lay



This is an FPC which incorporates a noise controlling film "SPINPEDA®" manufactured by Shin-Etsu

Polymer Co., Ltd. into the cover layer.

It is effective for reducing crosstalk between wirings such as the power source and signals.

It is effective in a wide range of high-frequency band, and utilization as an alternative to a bypass capacitor.

Crosstalk evaluation

Examples of the purposes of use

Cable for hi-speed communication

S41 result of far end crosstalk

SPINPEDA® without a cover

0.1μF with a capacitor

SPINPEDA® with a cover

dB

GHz

Port allocation

Layer configuration

-100

-80

-60

-40

-20

00.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0


RF line, virtual power line

Ground plane

Thickness [μm]

Image of the actual product

Virtual power line

The effect is verified with and without

"SPINPEDA" here.0.1μ F capacitor mounted position

Port1

Port3 Port4

Port2

50Ω line (RF line) Line-to-line gap1mm

* The terminals of the ports 2 and 3 are 50Ω.

* The ports 1 and 4 are for the measurement terminalGSG250μm.



[TEL] : 046-251-3722 [FAX] : 046-251-3725



Characteristics of product

- The characteristic impedance control is enabled by high-accuracy pattern forming technology.

- The reflection of electric signal in a pattern is prevented and the high-speed transmission circuit can be

also supported by interfacing the characteristic impedance.

Actual performance

Earth and People-friendly technology

Microstrip

line

Coplanar

waveguideStrip line

Single end 25, 50, 75 Ω 50 Ω 50 Ω

Differential 100 Ω 100 Ω 100 Ω

Tolerance ±10 % ±10 % ±10 %

Measurement of characteristic impedance

- The characteristic impedance can be measured

by creating a test coupon in a work piece.

[ INFORMATION ]

Yamashita Materials Corporation. Circuitec Company Sales Department

TEL : +81-46-251-3722 FAX : +81-46-251-3725

HP : http://www.yamashita-net.co.jp/en/ E-mail : [email protected]


- Optical communication module

- LVDS communication cable

- Hard disk inspection device

Used materials

- Polyimide (PI)

- Liquid crystal polymer (LCP)

Measurement frequency [GHz]

Tra

nsm

issio

n lo

ss [

dB

]

[ Microstrip line : Single]

[Coplanar waveguide : Differential ]

[Strip line : Single ]

Characteristics of product

- Increase flexibility by mesh the GND of the microstrip line.

Actual performance

Earth and People-friendly technology

Comparison of transmission loss S21 * This data is a measured value, it is not a guaranteed value.

Microstrip line

Single end 50, 75 Ω

Differential 100 Ω

Tolerance ±10 %

Photo of the test sample

Result

GND : Mesh 22 g

GND : Solid 54 g

7 mm

Scales

Height

gauge

Repulsion

Spring-back measurement

- Mesh size is 0.1mm × 0.1mm.

- Measuring the repulsive force in

a state such as that in FIG.

S21 by GND : Solid S21 by GND : Mesh

[ INFORMATION ]

Yamashita Materials Corporation. Circuitec Company Sales Department

TEL : +81-46-251-3722 FAX : +81-46-251-3725

HP : http://www.yamashita-net.co.jp/en/ E-mail : [email protected]

Flexible high heat dissipation FPC


FPC uses "ECOOL-F", a thick copper foil flexible copper-clad epoxy laminate manufactured by Panasonic.

With the copper foil and the polyimide film, it has heat dissipation equivalent of metal substrate (1.0t).

Bent formation is possible like normal flexible substrate.

3 types of copper foil thicknesses, 75μm, 105μm and 150μm are available.

Heat dissipating characteristics

JPCA-TMC-LED02T 10.6.1 "plane-direction thermal resistance measurement method"

In the state the sample is contained in the container for measurement hanged from the top plate, after turning out the

LED, apply DC voltage 9.20.5V, and turn on the LED. When the temperature of the thermocouple is stabilized, the

measurement is finished.

Examples of product layer configuration

20

40

60

80

100

120

FPC (single-side copper foil) Result of temperature measurement

FPC（片面銅箔）(Single-sided copper foil)

Measurement sampleUnit (μm)

Cover lay polyimide 12.5Cover lay adhesive layer 25Copper foil 35Polyimide base 25Copper foil 75 105 150Layer thickness 172.5 202.5 247.5

A

CD

B

Measurement of the back

side of the measurement

sample

Copper thickness 75μm

Result of temperature measurement





A [front

LED side]

B [LED

back]

A [front

LED side]

B [LED

back]

A [front

LED side]

B [LED

back]



[TEL] : 046-251-3722 [FAX] : 046-251-3725


C (Right side

of table)

D (Left side

of table)

C (Right side

of table)

D (Left side

of table)

C (Right side

of table)

D (Left side

of table)


Radiation heat dissipation

Printed Wiring Board


This is an FPC which uses white heatproof resist ink, which realizes high optical reflectance and heat

resistance.

As an FPC, it has excellent flexibility and resistance to bending.

It is possible to apply to high-definition resist apertures suitable for mounting on component.

Heat resistance test

Heat dissipation test by radiation



[TEL] : 046-251-3722 [FAX] : 046-251-3725


spacer

FPC（PI/Cu:25/18μm)

Resist 20μm

Pressurization

Continuous heating in bent state

temperature:150℃×1000Hr

Bending heating

initial stateAfter heating

(150℃×1000Hr)

Currvature

radius(R=0.3)

No crack No crackThermal discoloration

Heating temperature:125℃

1000Hr750Hr500Hr250Hrinitial

Evaluation conditions

-Measuring instrument：KONICA MINOLTA CM-3600d

-Method :SCI

-Thickness :20μm

-Base material :Glass

Normal FPC Heat radiation FPCHeat conduction

+ Heat radiation FPC

87.8℃ 83.6℃ 52.4℃

Base(Pi)

Resist

Copper

Resist

Copper

Base(Pi)Copper

Base(Pi)

Resist

Copper

Temperature difference

between the normal FPC-4.2℃ -35.4℃

Adding the heat radiationAdding the heat radiation

element by the copper foil


Company name Yamashita Materials Corporation

Head quarters 3-5-13,Minami Shinagawa,Shinagawa-ku,Tokyo,140-0004,Japan

President Hiroki Yamashita

[TEL]：+81-3-3474-0611 [FAX]：+81-3-3474-0984

Establishment June 15, 1965

Capital fund 2５０ million yen


Yamashita Materials Corporation Circuitec Company

Sales Department

[TEL] : 046-251-3722 [FAX] : 046-251-3725

[HP] : http://www.yamashita-net.co.jp

[E-mail] : [email protected]

201706J-E

fpc technical guide - 山下マテリアル株式会社 · pdf filefpc technical guide 1. fpc...

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