freescale semiconductor selector guide. wireless rf...

SG46/DRev. 265/2004

Wireless RF Product.

Freescale Semiconductor Selector Guide.

1FREESCALE SEMICONDUCTORWIRELESS RF PRODUCT

SELECTOR GUIDE

Wireless RF ProductSelector Guide

Offering a broad portfolio of RF products, Freescale Semicon-ductor serves both the wireless infrastructure and subscribermarkets. Freescale RF Solutions is the leader in RF technolo-gy�today AND tomorrow�and is the answer for developerswho are creating innovative new products to meet theircustomers� need for wireless connections.(1) Freescale pio-neered RF technology and continues to drive future innova-tions, delivering significantly higher measurable performanceover our competitors�in most cases, 15 to 30 percent.Freescale RF Solutions supports developers through un-equaled integration, high terminal impedance, the mostcomprehensive RF toolkit in the industry, and access to ourglobal support team. Freescale is committed to the develop-ment of new products and expansion of our product offeringsto meet the increasing global demands of ISM band andpersonal communications systems, including cellular phone,broadband data, TV broadcast, land mobile and CATVsystems.

How to Use This Selector GuideThe RF Monolithic Integrated Circuits and the RF/IFIntegrated Circuits products in this guide are divided intothree major functional categories: RF Front End ICs, RF/IFSubsystem ICs and Frequency Synthesis. Each of thesecategories is further subdivided based on circuit functional-ity. This structure differentiates highly integrated subsystemICs from fundamental circuit building blocks and discretetransistors.

The Power LDMOS Transistors, Power GaAs Transistors,Power Amplifier ICs and Modules, General Purpose LinearAmplifier Modules and CATV Distribution Amplifier Modulesare FIRST divided into major categories by frequency band.SECOND, within each category, parts are listed by powerlevel. THIRD, within a frequency band, transistors are furthergrouped by operating voltage and, finally, output power.Applications AssistanceApplications assistance is only a phone call away � call thenearest Freescale Semiconductor Sales office or1-800-521-6274.Access Data On-Line!Use the Internet to access semiconductor product data ath t t p : / / w w w. m o t o r o l a . c o m / s e m i c o n d u c t o r s o rhttp://www.motorola.com/rf.T h i s w e b s i t e p r o v i d e s y o u w i t h i n s t a n t a c c e s s t oparametric search, part number search, product summarypages, data sheets, selector guide information, applicationinformation, design tools, package outl ines, on - l inetechnical support and much more.

Freescale Semiconductor, Inc. 2004

(1) The Semiconductor Products sector of Motorola, Inc. became FreescaleSemiconductor, Inc. in 2004.

Table of ContentsPage

On-Line Access to Freescale Semiconductor Data 3. . . . . Design Tools and Data 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Indices 99. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Front End ICs 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RFICs 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Downconverters 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Amplifiers 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Building Blocks 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Amplifiers 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packages 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF/IF Subsystems 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tranceivers 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Miscellaneous Functions 10. . . . . . . . . . . . . . . . . . . . . . . .

ADCs/DACs 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Encoders/Decoders 10. . . . . . . . . . . . . . . . . . . . . . . . .

Packages 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Frequency Synthesis 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Single PLL Synthesizers 14. . . . . . . . . . . . . . . . . . . . . . . . Packages 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Transistors 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF High Power LDMOS Transistors 16. . . . . . . . . . . . . .

Mobile - To 520 MHz 16. . . . . . . . . . . . . . . . . . . . . . . . TV Broadcast - To 1000 MHz 16. . . . . . . . . . . . . . . . . Cellular - To 1000 MHz 17. . . . . . . . . . . . . . . . . . . . . . PCS and 3G - To 2100 MHz 18. . . . . . . . . . . . . . . . . . MMDS - To 2600 MHz 18. . . . . . . . . . . . . . . . . . . . . . .

RF Power GaAs Transistors 21. . . . . . . . . . . . . . . . . . . . . 3.5 GHz - Linear Transistors 21. . . . . . . . . . . . . . . . .

RF Low Power Transistors 22. . . . . . . . . . . . . . . . . . . . . . RF High Power Amplifier Line-ups 23. . . . . . . . . . . . . . . Packages 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Amplifier ICs and Modules 33. . . . . . . . . . . . . . . . . . . . . Base Stations 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packages 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF General Purpose Linear Amplifier Modules 37. . . . . . . RF General Purpose Linear Amplifier Modules 38. . . . . Packages 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CATV Distribution Amplifier Modules 41. . . . . . . . . . . . . . . . Forward Amplifier Modules 42. . . . . . . . . . . . . . . . . . . . . . Reverse Amplifier Modules 45. . . . . . . . . . . . . . . . . . . . . . Packages 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FREESCALE SEMICONDUCTOR 2

WIRELESS RF PRODUCTSELECTOR GUIDE

Wireless RF ProductSelector Guide

Table of Contents - continuedPage

Tape and Reel Specifications 49. . . . . . . . . . . . . . . . . . . . . . Applications and Product Literature 57. . . . . . . . . . . . . . . . . Case Dimensions 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Indices 99. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Selector Guide Product Index 99. . . . . . . . . . . . . . . . . . . End of Life Product Index 103. . . . . . . . . . . . . . . . . . . . . . After Market Support Index 106. . . . . . . . . . . . . . . . . . . . .


SELECTOR GUIDE

ACCESS DATA ON-LINE!Available online are Part Number Search, Parametric

Search, the Product Library, Documentation Library, ToolsLibrary, Application sites, Product sites, TechnicalHelpline, Technical Training and Where to Buy at thefollowing URL: http://www.motorola.com/semiconductors.

See the RF and IF Design Resource site athttp://www.motorola.com/rf for specific Wireless RFProduct support information for:

• Data sheets

• Applications notes

• Selector guides

• Packaging information

• Application information

• Models

• Reference designs

• Reference design simulations

• Circuit board artwork

• Roadmaps

• Press releases

• Events

Design Tools and Data Available On-linefor Your Design-in Process

RF Reference DesignsRF Power Reference Designs provide:

• RF Performance Tuned for Specific StandardBroadcast Formats

• Low Cost Component Selection

• Complete BOM, Layout, PCB and All Design Infor-mation Available

• Integral Temperature Compensated Bias CircuitsIncluded

• Extensive RF Characterizations

Motorola is pleased to offer application-specificreference designs. These application-specificreference designs show some of the many possibleuses of our high power RF transistors. They provide thecustomer�s design engineers with a fast and accuratetool to both evaluate the performance envelope and fullycharacterize the devices under a variety of differentoperating conditions.

Low-cost component selection was chosen so thatthe end users could transition the design and its entire

Bill of Materials into a high volume base stationmanufacturing process and still be cost competitive withother competing technologies.

The circuit board is made of a recently developedceramic loaded thermoset plastic woven glass materialthat offers very low material costs, low PCB fabricationcost, and yet still has an exceptionally low dissipationfactor giving low RF loss. The dielectric constant of thismaterial is high enough to allow for compact, distributedelement matching structures, yet of a reasonable valueto make it relatively insensitive to fabrication andetching variations.

The circuit�s matching and decoupling capacitorsutilize a low-cost silicon dioxide dielectric processrather than the traditional porcelain multi - layeredassemblies, and they offer low ESRs, very high Q�s andtight capacitance value tolerances.

The reference design data sheet contains a wealthof information that customers can use to betterunderstand the range and capabilities of the FreescaleSemiconductor devices. Included on the data sheet aresuch basics as the intended end use application (GSM,W-CDMA, etc.), the typical performance level expected(2% EVM, -40 dBc ACP, etc.) and some device featuressuch as ESD protection and good thermal stability. Formore information, go to http://www.motorola.com/rf andselect Tools//Reference Designs.

RF LDMOS ModelsMotorola continues to populate its LDMOS Model

Library with the LDMOS MET models and with theLDMOS Root models. All product models available inthe RF LDMOS Model Library (Root and MET) includepackage, bond wire and internal matching networkeffects.

The MET model for RF LDMOS transistors is anonlinear model that examines both electrical andthermal phenomena and can account for dynamicself -heating effects of device performance. It isspecifically tailored to model high power RF LDMOStransistors used in wireless base station applications.

Implemented in the Agilent EEsof EDAAdvanced Design System, APLAC Analog DesignTool, Applied Wave Research Microwave Office,Ansoft Serenade Design Environment andEagleware GENESYS Microwave and RF DesignSuite, the MET LDMOS model is capable of performingsmall-signal, large-signal, harmonic-balance, noiseand transient simulations. Because of its ability tosimulate self -heating effects, the MET model is moreaccurate than existing models, enabling circuit designersto predict prototype performance more accurately andreduce design cycle time.



The current release of the MET LDMOS model isavailable for these tools:

• Agilent EEsof ADS (UNIX and PC) nonlinear cir-cuit simulator

• APLAC Analog Design Tool

• Applied Wave Research Microwave Office

• Ansoft Serenade Design Environment

• Eagleware GENESYS Microwave and RF DesignSuite

The LDMOS Model Library is available for all majorcomputer platforms supported by these simulators.

For more information and latest releasessupported, go to

http://www.motorola.com/rf/models.

RF Power Reference Design Simulations• Provides a link between Reference Designs and

MET models

• Example designs exist for a wide selection of Freescale Semiconductor RF high power devices

• Demonstrates how to design an amplifier using microwave stripline techniques in the AgilentADS environment

• Provides �real -world� tutorial on how to use nonlinear models

• Example designs for all major applications: GSM,CDMA, W-CDMA, TDMA

• Models provide examples of CW and 2- tone signalsimulation

• Simulation files are provided royalty- free to allowfor reuse and adaptation

• The device selection and applications are beingcontinually updated

• Provides feedback path from customers to improveusability and accuracy of models

Reference Design Simulations

In the past, Motorola has provided application-specific reference designs that are targeted to providea pre-designed circuit suitable for a specificapplication. Additionally, Motorola has also providedmodeling tools, specifically MET models, to facilitatedesign using Computer Aided Engineering (CAE)techniques. These two pieces of the puzzle areexcellent design tools; however, they are never linked toeach other, leaving the customer to figure out the bestway to blend the two tools to their advantage. ReferenceDesign Simulations are designed to provide the linkbetween these two tools.

Tools Provided

Reference Design Simulations provide an exampleapplication of MET models in a pre-designedapplication circuit. Motorola has taken the time tocharacterize specific reference design circuits in�software form.� The simulations have been chosen torepresent a wide selection of RF devices under many ofthe major communication standards, including GSM,CDMA, W-CDMA and TDMA.

Learning Tools

Reference Design Simulations provide examples ofhow to use nonlinear models of RF transistors.Specifically, the user will also learn how to design anamplifier using microwave stripline matchingtechniques. To provide the most accurate modelingresults, each simulation provides examples for CW,2- tone and modulated signals, as applicable.

Reference Design Simulation Availability

The Reference Design Simulation circuits areavailable as downloadable Agilent ADS projects fromthe Motorola web site. These simulation files areprovided royalty- free to allow for reuse and adaptationto other application requirements.

Go to http://www.motorola.com/rf and selectTools/Software Tools/Reference Design Simulations.

Literature CentersPrinted literature can be obtained from the

Literature Centers upon request. For those items thatincur a cost, the U.S. Literature Center will acceptMaster Card and Visa.

USA/EUROPE/Locations Not Listed:

Freescale Semiconductor Literature DistributionP.O. Box 5405Denver, Colorado 80217Phone: 1-800-521-6274 or 1-480-768-2130

JAPAN:

Freescale Semiconductor Japan Ltd.SPS, Technical Information Center3-20-1, Minami-Azabu. Minato-kuTokyo 106-8573 Japan Phone: 81-3-3440-3569

ASIA/PACIFIC:

Freescale Semiconductor H.K. Ltd.Silicon Harbour Centre2 Dai King Street, Tai Po Industrial EstateTai Po, N.T., Hong KongPhone: 852-26668334


SELECTOR GUIDE

RF Front End ICsFreescale Semiconductor�s RF Front End integrated circuitdevices provide an integrated solution for the personalcommunications market. These devices are available inplastic 7x7 mm Module, SOT-343R, SOT-363, or QFN-32packages.

Evaluation Boards

Evaluation boards are available for RF Front End IntegratedCircuits. For a complete list of currently available boards andones in development for newly introduced product, pleasecontact your local Freescale Semiconductor Distributor orSales Office.


RF Front End ICs 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RFICs 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Downconverters 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Amplifiers 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Building Blocks 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Amplifiers 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packages 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



RF Front End ICs

RFICs

Downconverters

ProductInput Freq.

MHzLO Freq.

VdcIF Freq.(MHz)

Gain(dB)

NF(dB)

IIP3(dBm)

SupplyCurrent Packaging

SystemApplicability

MC13770(42)

(LNA)2100 to 2170 n/a n/a 15

-5.01.55.0

020

3.0 mA10 µA

1345/QFN-12

W-CDMA, PCS,PDC

MC13770(43)

(Mixer)2110 to 2170 2300 to 2360

2490 to 2550190380

10.0 8.0 -3.0 5.0 mA 1345/QFN-12

W-CDMA, PCS,PDC

Power Amplifiers

Product

Freq.RangeMHz

SupplyVolt.

RangeVdc

SaturatedPout dBm

(Typ)PAE %(Typ)

GainPout/PindB (Typ) Packaging

SystemApplicability

MMM5063 880-9151710-17851850-1910

2.7 to 5.5 35.233.834

534443

36.231.831.0

1383/7x7 mm Module

GSM900, DCS1800,PCS1900

(18)Tape and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units;

g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units; l) T1 = 5,000 units; m) R2 = 2,000 units; n) R4 = 100 units;

o) R6 = 150 units; p) R5 = 50 units.(42)In LNA section, specifications are represented in High Gain Mode first and Bypass Mode second.(43)In Mixer section, LO frequency ranges are specified for 190 MHz and 380 MHz IF.


SELECTOR GUIDE

RF Building Blocks

Amplifiers

Product

RF Freq.RangeMHz

SupplyVolt.

RangeVdc

SupplyCurrent

mA(Typ)

StandbyCurrentµA (Typ)

SmallSignal

Gain dB(Typ)

OutputIP3 dBm

(Typ)

NFdB

(Typ) PackagingSystem

Applicability

MBC13720(18c) 400 to 2500 2.5 to 3.0 9.0 <20 14.5 @1900 MHz

24.5 @1900 MHz

1.38 @1900 MHz

419B/SOT-363

ISM900,2400, PCS,

CDMA

MBC13916(18c) 100 to 2500 2.7 to 5.0 4.7 � 19 @900 MHz

16.5 @900 MHz

0.9 @900 MHz

1404/SOT-343R

GeneralPurposeCascodeAmp forVCOs,

Buffers, &LNAs



o) R6 = 150 units; p) R5 = 50 units.



RF Front End Integrated Circuit Packages

CASE 419B

(SOT−363)

CASE 1345

(QFN−12)

SCALE 1:1

CASE 1383

(7x7 Module)

CASE 1404

(SOT−343R)


SELECTOR GUIDE

RF/IF Subsystems


Tranceivers 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Miscellaneous Functions 10. . . . . . . . . . . . . . . . . . . . . . . . . .

ADCs/DACs 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Encoders/Decoders 10. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packages 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



RF/IF Subsystems

TranceiversSupplyCurrent

�A

Product

SupplyVoltage

V

�ATyp

@ 1% DutyCycle

Freq.BandGHz

SensitivityTypdBM

SerialInterface

Data RateSpeckbps

Comm.Protocol

SystemApplicability Pkg

MC13192(46a) 2.0-3.4 500, Idle34, TX37, RX

2.4-2.5 -92@

1% PER

SP1 250 802.15.4 ZigBee, 2.4 GHz ISM

1311/QFN-32

MC13191(46a) 2.0-3.4 500, Idle34, TX37, RX

2.4-2.5 -91@

1% PER

SP1 250 DSSS 2.4 GHz ISM 1311/QFN-32

Miscellaneous Functions

ADCs/DACs

Number of

Product Function I/O Format Resolution

Number ofAnalog

ChannelsOn-ChipOscillator Other Features

Suffix/Packaging

MC144110 DAC Serial 6 Bits 6 n/a Emitter -FollowerOutputs

DW/751D

MC144111 DAC Serial 6 Bits 4 n/a Emitter -FollowerOutputs

DW/751G

Encoders/Decoders

Product Function

Number ofAddress

LinesMaximum Numberof Address Codes

Number of DataBits Operation

Suffix/Packaging

MC145026 Encoder Depends onDecoder

Depends onDecoder

Depends onDecoder

Simplex P/648, D/751B

MC145027 Decoder 5 243 4 Simplex P/648, DW/751G

MC145028 Decoder 9 19,683 0 Simplex P/648, DW/751G

(46)To be introduced: a) 2Q04; b) 3Q04; c) 4Q04; d) 1Q05


SELECTOR GUIDE

RF/IF Subsystems Packages

CASE 648

P SUFFIX

(DIP−16)

CASE 751D

DW SUFFIX

(SO−20L)

CASE 751B

D SUFFIX

(SO−16)

CASE 751G

DW SUFFIX

(SO−16W)

CASE 1311

(QFN−32)


SELECTOR GUIDE

Frequency Synthesis


Single PLL Synthesizers 14. . . . . . . . . . . . . . . . . . . . . . . . . . Packages 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



Frequency Synthesis

Single PLL Synthesizers

Product

MaximumFrequency

(MHz)

SupplyVoltage

(V)

NominalSupply

Current (mA) Features Packaging

MC145151-2 20 @ 5.0 V 3.0 to 9.0 7.5 @ 5 V Parallel Interface DW/751F

MC145152-2 20 @ 5.0 V 3.0 to 9.0 7.5 @ 5 V Parallel Interface, Uses External Dual-ModulusPrescaler

DW/751F

MC145170-2 100 @ 3.0 V185 @ 4.5 V

2.7 to 5.5 2 @ 3 V6 @ 5 V

Serial Interface, Auxiliary Reference Divider,Evaluation Kit - MC145170EVK

P/648,D/751B,DT/948C

Frequency Synthesis Packages

CASE 648

P SUFFIX

(DIP−16)

CASE 751B

D SUFFIX

(SO−16)

CASE 751F

DW SUFFIX

(SO−28L)

CASE 751G

DW SUFFIX

(SO−16W)

CASE 948C

DT SUFFIX

(TSSOP−16)


SELECTOR GUIDE

RF TransistorsFreescale Semiconductor(1) continues to be the industryleader in RF transistor technology. Our current portfolioranges from high gain and low noise devices at microwavefrequencies to high power devices for fixed RF and microwaveapplications. Technical innovation combined with world-classmanufacturing capability allows Freescale to offer world classproduct, service and support to its customers.From our LDMOS and GaAs portfolio, the user can choosefrom a variety of packages. They include plastic and ceramicthat are microstrip circuit compatible or surface mountable.Many are designed for automated assembly equipment.


RF High Power LDMOS Transistors 16. . . . . . . . . . . . . . . . . Mobile - To 520 MHz 16. . . . . . . . . . . . . . . . . . . . . . . . . . . TV Broadcast - To 1000 MHz 16. . . . . . . . . . . . . . . . . . . Cellular - To 1000 MHz 17. . . . . . . . . . . . . . . . . . . . . . . . . PCS and 3G - To 2100 MHz 18. . . . . . . . . . . . . . . . . . . . MMDS - To 2600 MHz 18. . . . . . . . . . . . . . . . . . . . . . . . .

RF Power GaAs Transistors 21. . . . . . . . . . . . . . . . . . . . . . . Linear Transistors - To 3500 MHz 21. . . . . . . . . . . . . . . .

RF Low Power Transistors 22. . . . . . . . . . . . . . . . . . . . . . . . . RF High Power Amplifier Line-ups 23. . . . . . . . . . . . . . . . . . Packages 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) The Semiconductor Products sector of Motorola, Inc. became FreescaleSemiconductor, Inc. in 2004.



RF Transistors

RF High Power LDMOS TransistorsFreescale Semiconductor LDMOS technology is ideally suited for RF power amplifier applications. Several families of productshave been targeted for specific markets including VHF and UHF portable/land mobile, 900 MHz linear cellular, GSM, TDMA andCDMA, digital television, GSM EDGE, PCS, UMTS, and W-CDMA.With the unique LDMOS characteristics, these parts offer superior thermal performance. This is due to the simplified packagedesign, which offers excellent Class AB intermodulation performance under medium peak- to-average ratios providing a superiordevice choice for advanced digital modulations formats or high gain applications.

Table 1. Mobile - To 520 MHz Designed for broadband VHF and UHF commercial and industrial applications. The high gain and broadband performanceof these devices make them ideal for large-signal, common-source amplifier applications in 12.5/7.5 volt mobile, portableand base station operation.

Frequency Gain ηBand(37) Pout Test VDD (Typ)/Freq. Eff. (Typ) θJC

Product MHz Watts Signal Volts dB/MHz % °C/W Pkg/Style

VHF & UHF, Land Mobile Radio, Class AB

MRF1513T1(18f) U 400-520 3 CW 1-Tone 7.5/12.5 11/520 55 4.0 466/1MRF1511T1(18f) U 135-175 8 CW 1-Tone 7.5 11.5/175 55 2.0 466/1MRF1517T1(18f) U 430-520 8 CW 1-Tone 7.5 11/520 55 2.0 466/1MRF1518T1(18f) U 400-520 8 CW 1-Tone 12.5 11/520 55 2.0 466/1MRF1535T1(18j) U 400-520 35 CW 1-Tone 12.5 10(Min)/520 50(Min) 0.90 1264/1MRF1535FT1(18j) U 400-520 35 CW 1-Tone 12.5 10(Min)/520 50(Min) 0.90 1264A/1MRF1550T1(18j) U 135-175 50 CW 1-Tone 12.5 10(Min)/175 50(Min) 0.75 1264/1MRF1550FT1(18j) U 135-175 50 CW 1-Tone 12.5 10(Min)/175 50(Min) 0.75 1264A/1MRF1570T1(18j) U 400-470 70 CW 1-Tone 12.5 10(Min)/470 50(Min) 0.75 1366/1MRF1570FT1(18j) U 400-470 70 CW 1-Tone 12.5 10(Min)/470 50(Min) 0.75 1366A/1

Table 2. TV Broadcast - To 1000 MHz

Frequency Gain ηBand (37) Pout Test VDD (Typ)/Freq. Eff. (Typ) θJC

Product MHz Watts Signal Volts dB/MHz % °C/W Pkg/Style

470 - 1000 MHz, Class AB

MRF373ALR1(18a) U 470-860 75 CW 1-Tone 32 18.2/860 60 0.89 360B/1MRF373ALSR1(18a) U 470-860 75 CW 1-Tone 32 18.2/860 60 0.63 360C/1MRF374A U 470-860 130 PEP 2-Tone 32 17.3/860 41.2 0.58 375F/1MRF372 I 470-860 180 PEP 2-Tone 32 17/860 36 0.5 375G/1MRF372R5(18p) I 470-860 180 PEP 2-Tone 32 17/860 36 0.5 375G/1MRF377 I/O 470-860 45 AVG OFDM 32 18.2/860 23 0.36 375G/1MRF377R3(18i) I/O 470-860 45 AVG OFDM 32 18.2/860 23 0.36 375G/1MRF377R5(18p) I/O 470-860 45 AVG OFDM 32 18.2/860 23 0.36 375G/1



o) R6 = 150 units; p) R5 = 50 units.(37)U = Unmatched; I = Input; I/O = Input/Output.


SELECTOR GUIDE

RF High Power LDMOS Transistors (continued)

Table 3. Cellular - To 1000 MHz

Frequency Pout Gain ηBand(37) (Typ) Test VDD (Typ)/Freq. Eff. (Typ) θJC Pkg/

Product MHz Watts Signal Volts dB/MHz % °C/W Style

800 - 1000 MHz, Class AB

MRF9002R2(18e) U 960 (3x) 2 PEP(41) 2-Tone 26 18/960 50 12 978/-MRF9030MBR1(18a) U 945 30 PEP 2-Tone 26 20/945 41 1.08 1337/1MRF9030MR1(18a) U 945 30 PEP 2-Tone 26 20/945 41 1.08 1265/1MRF9030LR1(18a) U 945 30 PEP 2-Tone 26 19/945 41.5 1.9 360B/1MRF9030LSR1(18a) U 945 30 PEP 2-Tone 26 19/945 41.5 1.5 360C/1MRF9045MBR1(18a) U 945 45 PEP 2-Tone 28 19/945 41 0.85 1337/1MRF9045MR1(18a) U 945 45 PEP 2-Tone 28 19/945 41 0.85 1265/1MRF9045LR1(18a) U 945 45 PEP 2-Tone 28 18.8/945 42 1.4 360B/1MRF9045LSR1(18a) U 945 45 PEP 2-Tone 28 18.8/945 42 1.0 360C/1MRF5S9070NR1(18a)★ U 880 14 AVG N-CDMA 26 17.8/880 30 0.80 1265/1MRF9060MBR1(18a) U 945 60 PEP 2-Tone 26 18/945 40 0.56 1337/1MRF9060MR1(18a) U 945 60 PEP 2-Tone 26 18/945 40 0.56 1265/1MRF9060LR1(18a) U 945 60 PEP 2-Tone 26 17/945 40 1.1 360B/1MRF9060LSR1(18a) U 945 60 PEP 2-Tone 26 17/945 40 0.8 360C/1MRF6522-70R3(18i) I 921-960 70 CW 1-Tone 26 16/921,960 58 1.1 465D/1MRF9080R3(18i) I 921-960 70 CW 1-Tone 26 18.5/921,960 52 0.7 465/1MRF9080LSR3(18i) I 921-960 70 CW 1-Tone 26 18.5/921,960 52 0.7 465A/1MRF9085R3(18i) I 880 90 PEP 2-Tone 26 17.9/880 40 0.7 465/1MRF9085LSR3(18i) I 880 90 PEP 2-Tone 26 17.9/880 40 0.7 465A/1MRF5S9100NR1(18a)★ I 880 20 AVG N-CDMA 26 19.5/880 28 0.52 1486/1MRF5S9100NBR1(18a)★ I 880 20 AVG N-CDMA 26 19.5/880 28 0.52 1484/1MRF5S9100MR1(18a)★ I 880 20 AVG N-CDMA 26 19.5/880 28 0.52 1486/1MRF5S9100MBR1(18a)★ I 880 20 AVG N-CDMA 26 19.5/880 28 0.52 1484/1MRF9100R3(18i) I/O 921-960 100 CW 1-Tone 26 17.2/960 60 1.0 465/1MRF9100SR3(18i) I/O 921-960 100 CW 1-Tone 26 17.2/960 60 1.0 465A/1MRF5S9101NR1(18a)★ I 869-960 100 CW 1-Tone 26 17.5/960 60 0.41 1486/1MRF5S9101NBR1(18a)★ I 869-960 100 CW 1-Tone 26 17.5/960 60 0.41 1484/1MRF5S9101MR1(18a)★ I 869-960 100 CW 1-Tone 26 17.5/960 60 0.41 1486/1MRF5S9101MBR1(18a)★ I 869-960 100 CW 1-Tone 26 17.5/960 60 0.41 1484/1MRF9120R3(18i) I 880 120 PEP 2-Tone 26 16.5/880 39 0.45 375B/1MRF9130LR3(18i) I 921-960 130 CW 1-Tone 28 16.5/921,960 48 0.6 465/1MRF9130LSR3(18i) I 921-960 130 CW 1-Tone 28 16.5/921,960 48 0.6 465A/1MRF9135LR3(18i) I 880 25 AVG N-CDMA 26 17.8/880 25 0.6 465/1MRF9135LSR3(18i) I 880 25 AVG N-CDMA 26 17.8/880 25 0.6 465A/1MRF9180R6(18o) I 880 170 PEP 2-Tone 26 17.5/880 39 0.45 375D/1MRF9200LR3(18i,46a) I/O 880 40 AVG N-CDMA 26 17.5/880 25 0.37 465B/1MRF9200LSR3(18i,46a) I/O 880 40 AVG N-CDMA 26 17.5/880 25 0.37 465C/1MRF9210R3(18i)★ I/O 880 40 AVG N-CDMA 26 16.5/880 25.5 0.31 375G/1



o) R6 = 150 units; p) R5 = 50 units.(37)U = Unmatched; I = Input; I/O = Input/Output.(41)Three individual transistors in a single package.(46)To be introduced: a) 2Q04; b) 3Q04; c) 4Q04; d)1Q05

★New Product




Table 4. PCS and 3G - To 2100 MHz



1805 - 1990 MHz, Class AB (GSM1800, GSM1900, GSM EDGE and PCS TDMA)

MRF18030ALR3(18i) I/O 1805-1880 30 CW 1-Tone 26 14/1805,1880 50 2.1 465E/1MRF18030ALSR3(18i) I/O 1805-1880 30 CW 1-Tone 26 14/1805,1880 50 2.1 465F/1MRF18030BLR3(18i) I/O 1930-1990 30 CW 1-Tone 26 14/1930,1990 50 2.1 465E/1MRF18030BLSR3(18i) I/O 1930-1990 30 CW 1-Tone 26 14/1930,1990 50 2.1 465F/1MRF6S18060N(46c) I/O 1800-2000 60 CW 1-Tone 26 15/1990 56 � 1486/1MRF6S18060NB(46c) I/O 1800-2000 60 CW 1-Tone 26 15/1990 56 � 1484/1MRF18060AR3(18i) I/O 1805-1880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465/1MRF18060ASR3(18i) I/O 1805-1880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465A/1MRF18060ALSR3(18i) I/O 1805-1880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465A/1MRF18060BR3(18i) I/O 1930-1990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465/1MRF18060BSR3(18i) I/O 1930-1990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465A/1MRF18060BLSR3(18i) I/O 1930-1990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465A/1MRF18085AR3(18i) I/O 1805-1880 85 CW 1-Tone 26 15/1805,1880 52 0.79 465/1MRF18085ALSR3(18i) I/O 1805-1880 85 CW 1-Tone 26 15/1805,1880 52 0.79 465A/1MRF18085BR3(18i) I/O 1930-1990 85 CW 1-Tone 26 12.5/1930,1990 50 0.79 465/1MRF18085BLSR3(18i) I/O 1930-1990 85 CW 1-Tone 26 12.5/1930,1990 50 0.79 465A/1MRF6S18090N(46d) I/O 1800-2000 90 CW 1-Tone 26 15/1990 52 � 1486/1MRF6S18090NB(46d) I/O 1800-2000 90 CW 1-Tone 26 15/1990 52 � 1484/1MRF18090AR3(18i) I/O 1805-1880 90 CW 1-Tone 26 13.5/1805,1880 52 0.70 465B/1MRF18090BR3(18i) I/O 1930-1990 90 CW 1-Tone 26 13.5/1930,1990 45 0.70 465B/1MRF18090BSR3(18i) I/O 1930-1990 90 CW 1-Tone 26 13.5/1930,1990 45 0.70 465C/1

1900 MHz, Class AB (2-CH N-CDMA and W-CDMA)

MRF19030LR3(18i) I/O 1930-1990 30 PEP 2-Tone 26 13/1990 36 2.1 465E/1MRF19030LSR3(18i) I/O 1930-1990 30 PEP 2-Tone 26 13/1990 36 2.1 465F/1MRF19045LR3(18i) I/O 1930-1990 9.5 AVG N-CDMA 26 14.5/1990 23.5 1.65 465E/1MRF19045LSR3(18i) I/O 1930-1990 9.5 AVG N-CDMA 26 14.5/1990 23.5 1.65 465F/1MRF6S19060N(46d) I/O 1930-1990 12 AVG N-CDMA 28 15/1990 26 � 1486/1MRF6S19060NB(46d) I/O 1930-1990 12 AVG N-CDMA 28 15/1990 26 � 1484/1MRF5S19060N(46b) I/O 1930-1990 12 AVG N-CDMA 28 14/1990 23 0.80 1486/1MRF5S19060NB(46b) I/O 1930-1990 12 AVG N-CDMA 28 14/1990 23 0.80 1484/1MRF19060R3(18i) I/O 1930-1990 60 PEP 2-Tone 26 12.5/1990 36 0.97 465/1MRF19060SR3(18i) I/O 1930-1990 60 PEP 2-Tone 26 12.5/1990 36 0.97 465A/1MRF19085R3(18i) I/O 1930-1990 18 AVG N-CDMA 26 13/1990 23 0.79 465/1MRF19085LR3(18i) I/O 1930-1990 18 AVG N-CDMA 26 13/1990 23 0.79 465/1MRF19085SR3(18i) I/O 1930-1990 18 AVG N-CDMA 26 13/1990 23 0.79 465A/1MRF19085LSR3(18i) I/O 1930-1990 18 AVG N-CDMA 26 13/1990 23 0.79 465A/1MRF5S19090LR3(18i) I/O 1930-1990 18 AVG N-CDMA 28 14.5/1990 25.8 0.67 465/1MRF5S19090LSR3(18i) I/O 1930-1990 18 AVG N-CDMA 28 14.5/1990 25.8 0.67 465A/1MRF19090R3(18i) I/O 1930-1990 90 PEP 2-Tone 26 11.5/1990 35 0.65 465B/1MRF19090SR3(18i) I/O 1930-1990 90 PEP 2-Tone 26 11.5/1990 35 0.65 465C/1MRF6S19100N(46d) I/O 1930-1990 22 AVG N-CDMA 28 14.5/1990 25.5 � 1486/1MRF6S19100NB(46d) I/O 1930-1990 22 AVG N-CDMA 28 14.5/1990 25.5 � 1484/1



o) R6 = 150 units; p) R5 = 50 units.(37)U = Unmatched; I = Input; I/O = Input/Output.(46)To be introduced: a) 2Q04; b) 3Q04; c) 4Q04; d)1Q05


SELECTOR GUIDE


Table 4. PCS and 3G - To 2100 MHz (continued)



1900 MHz, Class AB (2-CH N-CDMA and W-CDMA) (continued)

MRF5S19100HR3(18i)★ I/O 1930-1990 22 AVG N-CDMA 28 13.9/1990 25.5 0.64 465/1MRF5S19100HSR3(18i)★ I/O 1930-1990 22 AVG N-CDMA 28 13.9/1990 25.5 0.64 465A/1MRF6S19100H(46b) I/O 1930-1990 22 AVG N-CDMA 28 16/1990 28 � 465/1MRF6S19100HS(46b) I/O 1930-1990 22 AVG N-CDMA 28 16/1990 28 � 465A/1MRF19125R3(18i) I/O 1930-1990 24 AVG N-CDMA 26 13.5/1990 22 0.53 465B/1MRF5S19130R3(18i) I/O 1930-1990 26 AVG N-CDMA 28 13/1990 25 0.54 465B/1MRF5S19130SR3(18i) I/O 1930-1990 26 AVG N-CDMA 28 13/1990 25 0.54 465C/1MRF6S19140H(46c) I/O 1930-1990 29 AVG N-CDMA 28 16/1990 28 � 465B/1MRF6S19140HS(46c) I/O 1930-1990 29 AVG N-CDMA 28 16/1990 28 � 465C/1MRF5S19150R3(18i) I/O 1930-1990 32 AVG N-CDMA 28 14/1990 26 0.49 465B/1MRF5S19150SR3(18i) I/O 1930-1990 32 AVG N-CDMA 28 14/1990 26 0.49 465C/1MRF5P20180R6 I/O 1930-1990 38 AVG W-CDMA 28 14/1990 26 0.43 375D/1

2000 MHz, Class A, AB

MRF281SR1(18a) U 1930-2000 4 PEP 2-Tone 26 12.5/2000 33 5.74 458B/1MRF281ZR1(18a) U 1930-2000 4 PEP 2-Tone 26 12.5/2000 33 5.74 458C/1MRF282SR1(18a) U 1930-2000 10 PEP 2-Tone 26 11.5/2000 28(min) 4.2 458B/1MRF282ZR1(18a) U 1930-2000 10 PEP 2-Tone 26 11.5/2000 28(min) 4.2 458C/1MRF284LR1(18a) U 1930-2000 30 PEP 2-Tone 26 10.5/2000 35 2.0 360B/1MRF284LSR1(18a) U 1930-2000 30 PEP 2-Tone 26 10.5/2000 35 2.0 360C/1

2100 MHz, Class AB (2-CH W-CDMA, UMTS)

MRF21010LR1(18a) U 2110-2170 10 PEP 2-Tone 28 13.5/2170 35 5.5 360B/1MRF21010LSR1(18a) U 2110-2170 10 PEP 2-Tone 28 13.5/2170 35 5.5 360C/1MRF21030LR3(18i) I/O 2110-2170 30 PEP 2-Tone 28 13/2170 33 2.1 465E/1MRF21030LSR3(18i) I/O 2110-2170 30 PEP 2-Tone 28 13/2170 33 2.1 465F/1MRF21045LR3(18i) I/O 2110-2170 10 AVG W-CDMA 28 15/2170 23.5 1.65 465E/1MRF21045LSR3(18i) I/O 2110-2170 10 AVG W-CDMA 28 15/2170 23.5 1.65 465F/1MRF6S21060N(46d) I/O 2110-2170 14 AVG W-CDMA 28 15/2170 26 � 1486/1MRF6S21060NB(46d) I/O 2110-2170 14 AVG W-CDMA 28 15/2170 26 � 1484/1MRF21060R3(18i) I/O 2110-2170 60 PEP 2-Tone 28 12.5/2170 34 1.02 465/1MRF21060SR3(18i) I/O 2110-2170 60 PEP 2-Tone 28 12.5/2170 34 1.02 465A/1MRF21085R3(18i) I/O 2110-2170 19 AVG W-CDMA 28 13.6/2170 23 0.78 465/1MRF21085LSR3(18i) I/O 2110-2170 19 AVG W-CDMA 28 13.6/2170 23 0.78 465A/1MRF21085SR3(18i) I/O 2110-2170 19 AVG W-CDMA 28 13.6/2170 23 0.78 465A/1MRF21090R3(18i) I/O 2110-2170 90 PEP 2-Tone 28 11.7/2170 33 0.65 465B/1MRF21090SR3(18i) I/O 2110-2170 90 PEP 2-Tone 28 11.7/2170 33 0.65 465C/1MRF5S21090LR3(18i) I/O 2110-2170 19 AVG W-CDMA 28 14.5/2170 26 0.78 465/1MRF5S21090LSR3(18i) I/O 2110-2170 19 AVG W-CDMA 28 14.5/2170 26 0.78 465A/1MRF6S21100N(46c) I/O 2110-2170 23 AVG W-CDMA 28 14.5/2170 25.5 � 1486/1MRF6S21100NB(46c) I/O 2110-2170 23 AVG W-CDMA 28 14.5/2170 25.5 � 1484/1MRF5S21100HR3(18i)★ I/O 2110-2170 23 AVG W-CDMA 28 13.5/2170 26 0.57 465/1MRF5S21100HSR3(18i)★ I/O 2110-2170 23 AVG W-CDMA 28 13.5/2170 26 0.57 465A/1MRF6S21100HR3(18i)★ I/O 2110-2170 23 AVG W-CDMA 28 15.9/2170 27.6 0.45 465/1MRF6S21100HSR3(18i)★ I/O 2110-2170 23 AVG W-CDMA 28 15.9/2170 27.6 0.45 465A/1




★New Product




Table 4. PCS and 3G - To 2100 MHz (continued)



2100 MHz, Class AB (2-CH W-CDMA, UMTS) (continued)

MRF21120R6(3,18o) I/O 2110-2170 120 PEP 2-Tone 28 11.4/2170 34.5 0.45 375D/1MRF21125R3(18i) I/O 2110-2170 20 AVG W-CDMA 28 13/2170 18 0.53 465B/1MRF21125SR3(18i) I/O 2110-2170 20 AVG W-CDMA 28 13/2170 18 0.53 465C/1MRF5S21130HR3(18i)★ I/O 2110-2170 28 AVG W-CDMA 28 13.5/2170 26 � 465B/1MRF5S21130HSR3(18i)★ I/O 2110-2170 28 AVG W-CDMA 28 13.5/2170 26 � 465C/1MRF6S21140H(46c) I/O 2110-2170 30 AVG W-CDMA 28 16/2170 28 � 465B/1MRF6S21140HS(46c) I/O 2110-2170 30 AVG W-CDMA 28 16/2170 28 � 465C/1MRF5S21150R3(18i) I/O 2110-2170 33 AVG W-CDMA 28 12.5/2170 25 0.47 465B/1MRF5S21150SR3(18i) I/O 2110-2170 33 AVG W-CDMA 28 12.5/2170 25 0.47 465C/1MRF5P21180HR6(18o)★ I/O 2110-2170 38 AVG W-CDMA 28 14/2170 25.5 0.31 375D/1MRF21180R6(3,18o) I/O 2110-2170 38 AVG W-CDMA 28 12.1/2170 22 0.46 375D/1MRF6P21190H(46b) I/O 2110-2170 44 AVG W-CDMA 28 15.5/2170 27 � 375D/1MRF5P21240R6(18o) I/O 2110-2170 52 AVG W-CDMA 28 13/2170 24 0.35 375D/1

Table 5. MMDS � To 2600 MHz



2600-2700 MHz, Class AB

MRF6S27085H(46c) I/O 2600-2700 20 AVG N-CDMA 28 15.5/2655 25.5 � 465/1MRF6S27085HS(46c) I/O 2600-2700 20 AVG N-CDMA 28 15.5/2655 25.5 � 465A/1MRF6P27160H(46c) I/O 2600-2700 37 AVG N-CDMA 28 15/2655 23.5 � 375D/1

(3)Internal Impedance Matched Push-Pull Transistors(18)Tape and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units;



★New Product


SELECTOR GUIDE

RF Power GaAs TransistorsFreescale Semiconductor power GaAs transistors are made using an InGaAs PHEMT epitaxial structure for superior RF efficiencyand linearity. The FETs listed in this section are designed for operation in base station infrastructure RF power amplifiers and aregrouped according to frequency range and type of application. Parts are listed first by order of operating voltage, then by increasingoutput power.

Table 1. Linear Transistors � To 3500 MHz

Frequency Pout Gain Eff.Band(37) (Typ)/Freq Test VDD (Typ)/Freq. (Typ)/Freq. θJC Pkg/

Product MHz Watts/MHz Signal Volts dB/MHz %/MHz °C/W Style

3500 MHz, Class AB (WLL, BWA, W-CDMA)

MRFG35003MT1(18f)★ U DC-5800 0.3 AVG/3550

W-CDMA(44) 12 11.5/3550 25/3550 � 466/1

MRFG35003M6T1(18f) U DC-5800 0.45 AVG/3550

W-CDMA(44) 6 9/3550 24/3550 � 466/1

MRFG35005MT1(18f)★ U DC-5800 0.45 AVG/3550

W-CDMA(44) 12 11/3550 25/3550 � 466/1

MRFG35010 U DC-5800 1 AVG/3550

W-CDMA(44) 12 10/3550 30/3550 4.8(15) 360D/1

MRFG35010MT1(18f) U DC-5800 0.9 AVG/3550

W-CDMA(44) 12 10/3550 28/3550 � 466/1

MRFG35030R5(18p)★ I/O 3400-3600 3.5 AVG/3550

W-CDMA(44) 12 12/3550 21/3550 � 1490/1

(15)Class A = 5.3(18)Tape and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units;


o) R6 = 150 units; p) R5 = 50 units.(37)U = Unmatched; I = Input; I/O = Input/Output.(44)Peak-to-Average Power Ratio = 10 dB

★New Product



RF Low Power Transistors

Gain - Bandwidth NFmin @ f Gain @ f Maximum Ratings

Product

fτTyp

GHz

ICmA

TypdB GHz

TypdB GHz

V(BR)CEOVolts

ICmA Packaging

MBC13900(18c) 15 20 1.0 1.0 17 1.0 7.0 20 318M/

1.3 2.0 14 2.0 SOT-343



o) R6 = 150 units; p) R5 = 50 units.


SELECTOR GUIDE

RF High Power Amplifier Line-ups

Mobile - UHF 400 - 520 MHz

221 mW 35 W

MRF1513T1 MRF1535

238 mW 3 W

MRF1513T1

11 dB

11 dB 11 dB

Mobile - VHF 135 - 175 MHz

562 mW 100 W

MRF1511T1 MRF1550

566 mW 8 W

MRF1511T1

11.5 dB

11.5 dB 11 dB

Mobile - UHF 400 - 470 MHz

440 mW 70 W

MRF1518T1 MRF1570

635 mW 8 W

MRF1518T1

11 dB

11 dB 11 dB



RF High Power Amplifier Line-ups (continued)

Broadcast 470 - 860 MHz

5760 W

4 � MRF372

5.7 W

MRF372

4 � MRF372

1

•••8

180 W

15 dB

15 dB


4800 W

4 � MRF373A

4.8 W

MRF373A

4 � MRF373A

150 W

1

•••

16

MRF373A

15 dB

15 dB


SELECTOR GUIDE


4160 W

4 � MRF374A

4.2 W

4 � MRF374A

130 W

1

•••8


MRF374A

15 dB

15 dB

7680 W

4 � MRF377

7.7 W

4 � MRF377

240 W

1

•••8


MRF377

15 dB

15 dB




GSM and EDGE - 900 MHz

Ceramic MRF9030 MRF9045

MRF9060

MRF9100

MRF9080 MRF9130

MRF9180

MRF9200

MRF9135MRF9085

Plastic

MHVIC915R2

MW4IC915

MRF9045M

MRF9060M

MRF9120

MRF9210

MRF9002R2

MWIC930

MRF9030M

Hybrid MHL9838

MHL9236

MHL9318

MHVIC910HR2

MRF5S9070N

MRF5S9100N

MRF5S9101N


Ceramic MRF18060A

MRF18085A

MRF18090A

Hybrid

MRF18030A

MHL18336

MHL18926

Plastic MHVIC2114R2

MHPA18010

MW4IC2020M

MW5IC2030M

MRF6S18060N

MRF6S18090N


SELECTOR GUIDE



Ceramic MRF18060BMRF18030B

MRF18085B

MRF18090B

Hybrid MHPA19010

MHL19338

MHL19926

MHL19936

Plastic MHVIC2114R2

MW4IC2020M

MRF6S18060N

MRF6S18090N

N-CDMA - 1900 MHz

Ceramic MRF21010 MRF19030 MRF19060

MRF19045 MRF19085

MRF5S19090

Hybrid MHL19338

MRF19090 MRF19125

MRF5S19150

MRF5S19130

MHL19936

MHL19926

MRF5S19100

MRF5P20180

MHPA19010

Plastic MHVIC2114R2

MW4IC2020M

MRF5S19060N

MW4IC2230M

MRF6S19100

MRF6S19140

MRF6S19060N

MRF6S19100N




W-CDMA - 2200 MHz

Ceramic MRF21010 MRF21030 MRF21060

MRF21045 MRF21085

MRF5S21090

Hybrid MHL21336

MRF21090

MRF21120

MRF21125

MRF21180

MHPA21010

MRF5S21100

MRF5S21130

MRF5S21150

MRF5P21180

MRF5P21240

Plastic MHVIC2114R2

MW4IC2230M

MW5IC2030M

MRF6S21100

MRF6S21140

MRF6P21190

MRF6S21060N

MRF6S21100N

MMDS - 2700 MHz

Ceramic MRF6S27085 MRF6P27160


SELECTOR GUIDE


60 mW 60 W

WLL - 3500 MHz

Ceramic MRFG35010 MRFG35030R5

Plastic

MRFG35003M6T1

MRFG35005MT1

MRFG35010MT1

MRFG35003MT1

MMG3001T1

MMG3002T1

MMG3003T1



RF Transistor Packages

CASE 360B

STYLE 1

(NI−360)

CASE 360C

STYLE 1

(NI−360S)

CASE 375B

STYLE 1

(NI−860)

CASE 375D

STYLE 1

(NI−1230)

SCALE 1:1

CASE 360D

STYLE 1

(NI−360HF)

CASE 375F

STYLE 1

(NI−650)

CASE 375G

STYLE 1

(NI−860C3)

CASE 375H

STYLE 1

(NI−860S)

CASE 458B

STYLE 1

(NI−200S)

CASE 458C

STYLE 1

(NI−200Z)

CASE 465F

STYLE 1

(NI−400S)

CASE 465A

STYLE 1

(NI−780S)

CASE 466

STYLE 1

PLASTIC

(PLD−1.5)

CASE 465B

STYLE 1

(NI−880)

CASE 465C

STYLE 1

(NI−880S)

CASE 465D

STYLE 1

(NI−600)

CASE 465E

STYLE 1

(NI−400)

CASE 465

STYLE 1

(NI−780)

CASE 318M

(SOT−343)


SELECTOR GUIDE

RF Transistor Packages (continued)

SCALE 1:1

CASE 1366

STYLE 1

PLASTIC

(TO−272−8 Wrap)

CASE 1329A

STYLE 1

PLASTIC

(TO−272 WB−16 Gull)

CASE 1366A

STYLE 1

PLASTIC

(TO−272−8)

CASE 1329

STYLE 1

PLASTIC

(TO−272 WB−16)

CASE 1265

STYLE 1

PLASTIC

(TO−270−2)

CASE 1264

STYLE 1

PLASTIC

(TO−272−6 Wrap)

CASE 978

PLASTIC

(PFP−16)

CASE 1264A

STYLE 1

PLASTIC

(TO−272−6)

CASE 1337

STYLE 1

PLASTIC

(TO−272−2)

CASE 1484

STYLE 1

PLASTIC

(TO−272 WB−4)

CASE 1486

STYLE 1

PLASTIC

(TO−270 WB−4)

CASE 1490

STYLE 1

(HF−600)


SELECTOR GUIDE

RF Amplifier ICs andModulesFreescale Semiconductor�s RF portfolio includes manyhybrid designs optimized to perform in narrowband basestation transmitter applications and IC designs optimized forwideband applications. Freescale modules feature two ormore active transistors (LDMOS or GaAs die technology)and their associated 50 ohm matching networks. Circuitsubstrate and metallization have been selected for optimumperformance and reliability. For PA designers, IC driverdevices offer the benefits of multiple gain stages in onepackage with most of the decoupling and matching circuitryincorporated into a single low-cost plastic device.Freescale WLAN power amplifier ICs are designed to addressthe high efficiency, high linearity requirements of 802.11WLAN power amplifier applications. Supplied from a single3.3 V supply and featuring built - in detectors, these amplifiersoffer a range of gain and performance.


RF Amplifier ICs and Modules 33. . . . . . . . . . . . . . . . . . . . . Base Stations 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . WLAN Power Amplifiers 35. . . . . . . . . . . . . . . . . . . . . . . . Packages 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



RF Amplifier ICs and Modules Complete amplifiers with 50 ohm input impedances are available for all popular base station transmitter systems, includingGSM and CDMA, covering frequencies from 800 MHz up to 2.2 GHz.

Base StationsDesigned for applications such as macrocell drivers and microcell output stage, these Class AB amplifiers are ideal for base stationsystems with power requirements up to 30 watts.

Table 1. Base Station IC Drivers

SupplyFrequency P1dB Gain (Typ) Voltage System Die

Product MHz Watts dB Volts Class Application Technology Pkg/Style

MHVIC915R2(18e) 746-960 15 30 26 AB N-CDMA,GSM/GSM

EDGE

LDMOS 978/-

MWIC930R1(18a) 746-960 30 30 27 AB N-CDMA,GSM/GSM

EDGE

LDMOS 1329/-

MWIC930GR1(18a) 746-960 30 30 27 AB N-CDMA,GSM/GSM

EDGE

LDMOS 1329A/-

MW4IC915MBR1(18a) 860-960 15 30 26 AB N-CDMA,GSM/GSM

EDGE

LDMOS 1329/-

MW4IC915GMBR1(18a) 860-960 15 30 26 AB N-CDMA,GSM/GSM

EDGE

LDMOS 1329A/-

MW4IC001MR4(18n)★ 880-2170 0.85 13 28 AB N-CDMA,W-CDMA,GSM/GSM

EDGE

LDMOS 466/1

MHVIC910HR2(18e) 921-960 10 39 26 AB GSM900 LDMOS 978/-MW4IC2020MBR1(18a) 1805-1990 20 29 26 AB N-CDMA,

GSM/GSMEDGE

LDMOS 1329/-

MW4IC2020GMBR1(18a) 1805-1990 20 29 26 AB N-CDMA,GSM/GSM

EDGE

LDMOS 1329A/-

MW5IC2030MBR1(18a)★ 1930-1990 30 23 27 AB GSM/GSMEDGE,

W-CDMA,PHS

LDMOS 1329/-

MW5IC2030GMBR1(18a)★ 1930-1990 30 23 27 AB GSM/GSMEDGE,

W-CDMA,PHS

LDMOS 1329A/-

MHVIC2115R2(18e) 2110-2170 15 34 26 AB W-CDMA LDMOS 978/-MHVIC2114R2(18e,46a) 2110-2170 15 32 27 AB W-CDMA LDMOS 978/-MW4IC2230MBR1(18a) 2110-2170 30 31.5 28 AB W-CDMA LDMOS 1329/-MW4IC2230GMBR1(18a) 2110-2170 30 31.5 28 AB W-CDMA LDMOS 1329A/-



o) R6 = 150 units; p) R5 = 50 units.(46)To be introduced: a) 2Q04; b) 3Q04; c) 4Q04; d) 1Q05

★New Product


SELECTOR GUIDE

RF Amplifier ICs and Modules: Base Stations (continued)

Table 2. Base Station Module DriversDesigned for applications such as macrocell drivers and microcell output stage, these Class AB amplifiers are ideal for basestation systems with power requirements up to 10 watts.

SupplyFrequency P1dB Gain (Min) Voltage System Die

Product MHz Watts dB Volts Class Application Technology Pkg/Style

MHPA18010 1805-1880 10 24.5 28 AB N-CDMA LDMOS 301AP/3MHPA19010 1930-1990 10 24.5 28 AB PCS1900 LDMOS 301AP/3MHPA21010 2110-2170 10 23.7 28 AB W-CDMA LDMOS 301AP/3

Table 3. Base Station Module Pre-DriversThese 50 ohm amplifiers are recommended for modern multi - tone CDMA, TDMA and UMTS base station pre-driverapplications. Their high third-order intercept point, tight phase and gain control, and excellent group delay characteristics makethese devices ideal for use in high-power feedforward loops.

Ultra-Linear (for CDMA, W-CDMA, TDMA, Analog) - Class A (LDMOS Die) - Lateral MOSFETs

Gain 3rd OrderFrequency VDD IDD Gain Flatness P1dB Intercept NF

Band (Nom.) (Nom.) (Nom.) (Typ) (Typ) (Typ) (Typ) Pkg/Product MHz Volts mA dB dB dBm dBm dB Style

MHL9838 800 - 925 28 770 31 .1 39 50 3.7 301AP/1MHL9236 800 - 960 26 550 30.5 .1 34 47 3.5 301AP/1MHL9236M 800 - 960 26 550 30.5 .1 34 47 3.5 301AP/2MHL9318 860 - 900 28 500 17.5 .1 35.5 49 3.0 301AS/1MHL18336 1800 - 1900 26 500 30 .2 36 46 4.2 301AP/1MHL18926 1805 - 1880 26 1100 28.6 .3 40 50 4.2 301AY/1MHL19338 1900 - 2000 28 500 30 .1 36 46 4.2 301AP/1MHL19926 1930 - 1990 26 1000 29.4 .3 40 50 4.2 301AY/1MHL19936 1900 - 2000 26 1400 29 .2 41 49.5 4.2 301AY/1MHL21336 2110 - 2170 26 500 31 .15 35 45 4.5 301AP/1

WLAN Power AmplifiersThese devices are optimized for wireless LAN (WLAN) applications.

Table 1. Wireless LAN Power Amplifiers � Class AB � GaAs HBT

TotalQuiescent

Frequency VCC Current Itotal Gain P1dB EVMBand (Typ) (Typ) (Typ)/Pout (Typ)/Pout (Typ) (Typ)/Pout Pkg/

Product MHz Volts dBm mA/dBm dB/dBm dBm %rms/dBm Style

MMG2401 (46b) 2400-2500 3.3 156 210/19 27.5/19 26.5 3/19 1483/-MMG5004 (9) 4900-5900 3.3 115 200/18 24/18 25 3/18 1483/-

(9)In development.(46)To be introduced: a) 2Q04; b) 3Q04; c) 4Q04; d) 1Q05



RF Amplifier ICs and Modules Packages

CASE 301AP

STYLE 1, 2, 3

CASE 301AS

STYLE 1

CASE 301AW

STYLE 1

CASE 978

PLASTIC

(PFP−16)

CASE 301AY

STYLE 1

SCALE 1:1

CASE 1329A

STYLE 1

PLASTIC

(TO−272 WB−16 Gull)

CASE 1329

STYLE 1

PLASTIC

(TO−272 WB−16)

Case 466

Style 1

PLASTIC

(PLD−1.5)

CASE 1483

(QFN 3x3)

SCALE 4:1


SELECTOR GUIDE

RF General PurposeLinear Amplifier ICs andModulesFreescale Semiconductor general purpose linear amplifiermodules and ICs are designed to address a broad rangeof general purpose RF and IF applications where linearityand dynamic range are essential.


RF General Purpose Linear Amplifier ICs and Modules 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packages 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



RF General Purpose Linear Amplifier ICs and ModulesThese devices have been optimized for 50 ohm applications and are designed for multi -purpose applications where linearityand dynamic range are of primary concern.

Table 1. General Purpose Linear Amplifier ICs � Class A � InGaP HBT

Frequency VCC ICC Gain P1dB 3rd Order NFFrequency VCC ICC Gain P1dB 3rd Order NFBand (Nom) (Nom) (Nom)

@900 MHz

(Typ)@

900 MHz

Intercept(Typ)

(Typ)@

900 MHzProduct MHz Volts mA dB dBm dBm dB Pkg/Style

MMG3001NT1(18f)★ 40-3600 5.5 58 20 18.5 32 4 1514/1MMG3002NT1(18f)★ 40-3600 5.2 110 20 21 37 4 1514/1MMG3003NT1(18f)★ 40-3600 6.2 180 20 24 40.5 4 1514/1MMG3005T1(9) 400-2400 5 480 16* 30* 45* 6* 1543/-

*@ 2140 MHz *@ 2140 MHz *@ 2140 MHz *@ 2140 MHz

Table 2. General Purpose Linear Amplifier Modules � Class A � Silicon Bipolar

Frequency VCC ICC Gain Gain P1dB 3rd Order NFFrequency VCC ICC Gain Gain P1dB 3rd Order NFBand (Nom) (Nom) (Nom)

@100 MHz

Flatness(Typ)

(Typ)@

200 MHz

Intercept(Typ)

(Typ)@

200 MHzProduct MHz Volts mA dB dB dBm dBm dB Pkg/Style

MHW1345 10 - 200 24 310 34.5 1.0 28 44 3.8 1302/1

Note: Possible replacement for CA2830C.

(9)In development.(18)Tape and Reel Packaging Options: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units; f) T1 = 1,000 units;


o) R6 = 150 units; p) R5 = 50 units.

★New Product


SELECTOR GUIDE

RF General Purpose Linear Amplifier Module Package

CASE 1302

STYLE 1

SCALE 1:2 SCALE 2:1

CASE 1514

STYLE 1

PLASTIC

(SOT−89)

SCALE 2:1

CASE 1543

PLASTIC

(PQFN 5x5)


SELECTOR GUIDE

CATV DistributionAmplifier ModulesFreescale Semiconductor Hybrids are manufactured using thelatest CATV generation technology which has set newstandards for CATV system performance and reliability. Thesehybrids have been optimized to provide premium performancein all CATV systems up to 152 channels. Additions to our CATVproduct family include 40-870 MHz high output galliumarsenide (GaAs) power doublers as well as low distortion, lowpower consumption reverse amplifiers.


CATV Distribution Amplifier Modules 41. . . . . . . . . . . . . . . . Forward Amplifier Modules 42. . . . . . . . . . . . . . . . . . . . . . Reverse Amplifier Modules 45. . . . . . . . . . . . . . . . . . . . . . Packages 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



CATV Distribution Amplifier ModulesFreescale Semiconductor Hybrids are manufactured using the latest generation technology which has set new standards forCATV system performance and reliability. These hybrids have been optimized to provide premium performance in all CATVsystems up to 152 channels.

Forward Amplifier Modules40-1000 MHz Hybrids, VCC = 24 Vdc, Class A � Silicon Bipolar

HybridMaximum Distortion Specifications

NoiseHybridGain Output 2nd Composite Cross

NoiseFigureGain

(Nom) ChannelOutputLevel

2ndOrder

CompositeTriple Beat

CrossModulation DC

Figure@ 1000(Nom)

@ChannelLoading

Level OrderTest

Triple Beat Modulation DCCurrent

@ 1000MHz@

50 MHzLoadingCapacity

TestdBc dBc

Current MHz

Product dB

p y

dBmV/CH dBc 152 CH 152 CHmATyp

dBMax

Pkg/Style

Preamplifiers

MHW9182B 18.5 152 +38 -63(40) -61 -61 210 7.5 714Y/1MHW9242A 23.2 152 +38 -61(40) -58 -59 318 8.0 1302/1

40-870 MHz High Output Hybrids, VCC = 24 Vdc, Class A � GaAs



NoiseFigureGain


2ndOrder


CrossModulation DC

Figure@ 870(Nom)

@ChannelLoading

Level OrderTest


@ 870MHz@


TestdBc dBc

Current MHz

Product dB

p y


dBMax

Pkg/Style

Preamplifiers

MHW9146 14.3 132 +44 -60(36) -60 -55 245 5.5 1302/1MHW9186 18.5 132 +44 -60(36) -58 -52 250 5.0 1302/1MHW9206 20.2 132 +44 -59(36) -57 -51 245 4.5 1302/1MHW9236 23.8 132 +44 -60(36) -60 -50 255 6.5 1302/1MHW9276 27.9 132 +44 -60(36) -60 -53 250 6.5 1302/1

Power Doublers

MHW9187 20 132 +48 -62(34) -56 -55 425 4.5 1302/1MHW8188A★ 20.3 112 +48 -64(34) -58* -56* 425 4.5 (Typ) 1302/1MHW9188 20.3 132 +48 -62(34) -56 -55 425 4.5 1302/1MHW9188A★ 20.3 132 +48 -62(34) -56 -55 425 5.0 1302/1MHW9189(35) 20.3 132 +48 -62(34) -56 -55 425 4.5 1302/2MHW9189A★ 20.3 132 +48 -62(34) -56 -55 425 5.0 1302/2MHW8207A★ 21.3 112 +48 -62(34) -57* -55* 425 4.5 (Typ) 1302/2MHW9207A★ 21.3 132 +48 -62(34) -56 -55 425 5.0 1302/2MHW8227A★ 22.1 112 +48 -64(34) -58* -56* 425 4.5 (Typ) 1302/1MHW9227 22.1 132 +48 -62(34) -56 -55 425 4.5 1302/1MHW9227A★ 22.1 132 +48 -62(34) -56 -55 425 4.5 1302/1MHW8247A★ 24.9 112 +48 -62(34) -57* -55* 440 6.0 (Typ) 1302/1MHW9247 24.9 132 +48 -62(34) -56 -54 440 7.0 1302/1MHW9247A★ 24.9 132 +48 -62(34) -56 -54 440 7.0 1302/1MHW8267A★ 27.6 112 +48 -62(34) -57* -55* 440 6.0 (Typ) 1302/1MHW9267 27.6 132 +48 -60(34) -56 -54 440 7.0 1302/1MHW9267A★ 27.6 132 +48 -60(34) -56 -54 440 7.0 1302/1

*112 CH *112 CH

(34)Composite 2nd Order; Vout = +48 dBmV/ch(35)Mirror image of MHW9188(36)Composite 2nd Order; Vout = +44 dBmV/ch(40)Composite 2nd Order; Vout = +38 dBmV/ch

★New Product


SELECTOR GUIDE

CATV Distribution: Forward Amplifier Modules (continued)

40-870 MHz High Output MMIC, VCC = 24 Vdc, Class A � GaAs



NoiseFigureGain


2ndOrder


CrossModulation DC

Figure@ 870(Nom)

@ChannelLoading

Level OrderTest


@ 870MHz@


TestdBc dBc

Current MHz

Product dB

p y


dBMax

Pkg/Style

Preamplifiers

MMG1001R2(18e) 19 132 +44 -58 -56 -52 250 5.0 978/�

Power Doublers

MMG2001R2(18e) 21 132 +48 -60 -54 -53 425 4.5 978/�

40-870 MHz Hybrids, VCC = 24 Vdc, Class A � Silicon Bipolar



NoiseFigureGain


2ndOrder


CrossModulation DC

Figure@ 870(Nom)

@ChannelLoading

Level OrderTest


@ 870MHz@


TestdBc dBc

Current

A dB Pk /Product dB

p y


dBMax

Pkg/Style

Preamplifiers

MHW8202B 20.9 128 +38 -66(40) -63 -62 220 7.0 1302/1MHW8272A 27.2 128 +38 -64(40) -64 -62 310 7.0 1302/1


Maximum Distortion Specifications

HybridG i

Cross NoiseFi

yGain


2ndOrder


ModulationFM = 55 MHz DC

Figure@ 860(Nom)

@ChannelLoading

Level OrderTest

Triple Beat FM = 55 MHz DCCurrent

@ 860MHz@


TestdBc dBc

Current

A

MHz

dB Pk /Product dB

p y


dBMax

Pkg/Style

Preamplifiers

MHW8182B 18.5 128 +38 -64(40) -66 -65 220 7.5 714Y/1MHW8222B 21.9 128 +38 -60(40) -64 -63 220 7.0 1302/1MHW8242A 24 128 +38 -62(40) -64 -62 318 7.5 1302/1MHW8342★ 34 132 +44 -44(36) -46* -50* 325 6.5* 1302/1

*132 CH *132 CH *@ 870 MHz

Power Doublers

MHW8185L(21) 18.5 128 +40 -62(39) -63 -64 365 8.5* 714Y/1MHW8185 18.8 128 +40 -62(39) -64 -64 400 8.0 714Y/1MHW8205L(22) 19.5 128 +40 -60(39) -63 -64 365 8.5* 714Y/1MHW8205 19.8 128 +40 -60(39) -63 -64 400 8.0 714Y/1

*@ 870 MHz



o) R6 = 150 units; p) R5 = 50 units.(21)Low DC Current Version of MHW8185; Typical ICC @ Vdc = 24 V is 365 mA.(22)Low DC Current Version of MHW8205; Typical ICC @ Vdc = 24 V is 365 mA.(36)Composite 2nd Order; Vout = +44 dBmV/ch(39)Composite 2nd Order; Vout = +40 dBmV/ch(40)Composite 2nd Order; Vout = +38 dBmV/ch

★New Product



CATV Distribution: Forward Amplifier Modules (continued)


Maximum Distortion Specifications

HybridG i

Cross NoiseFi

yGain


2ndOrder


ModulationFM = 55 MHz DC

Figure@ 750(Nom)

@ChannelLoading

Level OrderTest

Triple Beat FM = 55 MHz DCCurrent

@ 750MHz@


TestdBc dBc

Current

A

MHz

dB Pk /Product dB

p y


dBMax

Pkg/Style

Preamplifiers

MHW7182B 18.5 110 +40 -63(39) -66 -64 220 6.5 714Y/1MHW7222B 21.9 110 +40 -60(39) -61 -60 220 6.5 1302/1MHW7242A 24 110 +40 -62(39) -63 -61 318 7.0 1302/1MHW7272A 27.2 110 +40 -64(39) -64 -60 310 6.5 1302/1MHW7292A 29 110 +40 -60(39) -60 -60 310 6.5* 1302/1MHW7342 ★ 34 112 +44 -50(36) -50 -53 325 6.0 1302/1

*@ 770 MHz

Power Doublers

MHW7185CL 18.5 110 +44 -64(36) -61 -63 370 7.5 714Y/1MHW7185C 18.8 110 +44 -64(36) -62 -63 400 7.5 714Y/1MHW7205CL 19.5 110 +44 -63(36) -61 -62 365 7.5 714Y/1MHW7205C 19.8 110 +44 -63(36) -61 -62 400 7.5 714Y/1




NoiseFigureGain


2ndOrder


CrossModulation DC

Figure@ 550(Nom)

@ChannelLoading

Level OrderTest

Triple Beat ModulationFM = 55 MHz

DCCurrent

@ 550MHz@


TestdBc

FM = 55 MHzdBc

Current

A dB Pk /Product dB

p y


dBMax

Pkg/Style

Forward Amplifiers

MHW6342T 34.5 77 +44 -57(36) -57 -57 310 6.5 1302/1

(36)Composite 2nd Order; Vout = +44 dBmV/ch(39)Composite 2nd Order; Vout = +40 dBmV/ch

★New Product


SELECTOR GUIDE

Reverse Amplifier Modules5 -200 MHz Hybrids, VCC = 24 Vdc, Class A � Silicon Bipolar

H b idMaximum Distortion Specifications

HybridGain

Composite Cross NoiseGain(Nom) Channel Output 2nd


CrossModulation

NoiseFigure(Nom)

@ChannelLoading

OutputLevel

2ndOrder

Triple Beat ModulationDC

Figure@ 175@


Level OrderTest dBc dBc

DCCurrent

@MHz

Product

10 MHz

dB

Capacity

dBmV/CH

Test

dBc22CH

26CH

22CH

26CH

mATyp

dBMax

Pkg/Style

MHW1244 24 22, 26 +50 -72(30) -68 -67.5(19) -61 -61(19) 210 5.0 1302/1MHW1346 ★ 35* 22, 26 +50 -72(31)* -68 -70(19) -60 -63(19) 325 5.0* 1302/1

*5 MHz *22 CH *@ 200 MHz

Low Current Amplifiers � 5 -200 MHz Hybrids, VCC = 24 Vdc, Class A � Silicon Bipolar


HybridGain

2nd Composite Cross NoiseGain(Nom) Channel Output

2ndOrder Test


CrossModulation

NoiseFigure(Nom)

@ChannelLoading

OutputLevel

Order Test Triple Beat ModulationDC

Figure@ 200@


LeveldBc dBc dBc

DCCurrent

@MHz

Product

5 MHz

dB

Capacity

dBmV/CH

6CH

10CH

6CH

10CH

6CH

10CH

mATyp

dBMax

Pkg/Style

MHW1223LA 22.7 6,10 +50 -68 -65 -75 -66 -65 -60 95 7.0 1302/1MHW1253LA 25.5 6,10 +50 -68 -66 -75 -66 -65 -61 95 6.5 1302/1MHW1303LA 30.8 6,10 +50 -68 -65 -74 -64 -64 -58 95 5.7 1302/1



HybridGain


2ndOrder Test


CrossModulation

NoiseFigure(Nom)

@ChannelLoading

OutputLevel


Figure@ 150@


LeveldBc dBc dBc

DCCurrent

@MHz

Product

5 MHz

dB

Capacity

dBmV/CH

6CH

10CH

6CH

10CH

6CH

10CH

mATyp

dBMax

Pkg/Style

MHW1353LA 35.2 6,10 +50 -68 -65 -73 -62 -63 -57 95 5.4 1302/1



HybridGain


2ndOrder Test


CrossModulation

NoiseFigure(Nom)

@ChannelLoading

OutputLevel


Figure@ 65@


LeveldBc dBc dBc

DCCurrent

@MHz

Product

5 MHz

dB

Capacity

dBmV/CH

6CH

10CH

6CH

10CH

6CH

10CH

mATyp

dBMax

Pkg/Style

MHW1224LA 22.7 6,10 +50 -68 -65 -75 -66 -65 -60 95 7.0 1302/1MHW1254LA 25.5 6,10 +50 -68 -66 -75 -66 -65 -61 95 6.5 1302/1MHW1304LA 30.8 6,10 +50 -68 -65 -74 -64 -64 -58 95 5.7 1302/1MHW1354LA 35.2 6,10 +50 -68 -65 -73 -62 -63 -57 95 5.4 1302/1

(19)Typical(30)Channels 2 and A @ 7(31)26 Ch. Composite Second Order Test

★New Product



CATV Distribution: Reverse Amplifier Modules (continued)

Low Current Amplifiers � 5-50 MHz Hybrids, VCC = 24 Vdc, Class A � Silicon Bipolar



NoiseFigureGain


2ndOrder


CrossModulation DC

Figure@ 50(Nom)

@ChannelLoading

Level OrderTest(30)


@ 50MHz@


Test( )

dBc dBcCurrent MHz

Product dB

p y


dBMax

Pkg/Style

MHW1254L 25 4 +50 -70 -70 -62 115 4.5 1302/1

(30)Channels 2 and A @ 7


SELECTOR GUIDE

CATV Distribution Amplifier Module Packages

CASE 714Y

STYLE 1

CASE 1302

STYLE 1, 2

SCALE 1:2


SELECTOR GUIDE

RF and IF Tape and Reel Specifications

Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as theshipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a securecavity for the product when sealed with the �peel -back� cover tape.

• Two Reel Sizes Available (7″ and 13″)• Used for Automatic Pick and Place Feed Systems• Minimizes Product Handling• EIA 481, -1, -2• SOT-363 in 8 mm Tape• Micro-8, QFN-32, PLD-1, PLD-1.5, NI-200S, NI-200Z

in 12 mm Tape• SO-16/16L, TSSOP-16 in 16 mm Tape

• SO-20L, SO-28L, TO-270-2 in 24 mm Tape• NI-360, NI-360S, NI-400, NI-400S, NI-600,

TO-270 WB-4 in 32 mm Tape• TO-272-2, TO-272-6 Wrap, TO-272-6, TO-272-8

Wrap, TO-272-8, TO-272 WB-4, TO-272 WB-16 in 44 mm Tape

• NI-780, NI-780S, NI-860, NI-880, NI-880S, NI-1230 in56 mm Tape

Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individualreels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size isone full reel for each line item, and orders are required to be in increments of the single reel quantity.

Micro-8SO-16/16L

PFP-16

PLD-1 PLD-1.5SO-20L, SO-28L

NI-200S, NI-200Z

(12 mm)

(24 mm) (12 mm) (12 mm)

(12 mm)

(16 mm)

(16 mm)

OF FEED

DIRECTION

TSSOP-16 (16 mm)

DRAINLEAD

PIN 1

GATELEAD

TO-270-2 (24 mm)

DRAINLEAD



OF FEED

DIRECTION

NI-600 (32 mm)

NI-360, NI-360S (32 mm) NI-400, NI-400S (32 mm)

NI-780, NI-780S (56 mm)

DRAINLEAD

DRAINLEAD

DRAINLEAD

DRAINLEAD

DRAINLEAD

TO-272 WB-4, TO-272 WB-16 (44 mm)

TO-272 WB-16 Gull (44 mm)

DRAINLEAD

DRAINLEAD

TO-272-2, TO-272-6 Wrap, TO-272-6,TO-272-8, TO-272-8 Wrap (44 mm)

TO-270 WB-4 (32 mm)

DRAINLEAD


SELECTOR GUIDE

OF FEED

DIRECTION

NI-880, NI-880S (56 mm)

NI-1230 (56 mm)

DRAINLEAD

NI-860 (56 mm)

DRAINLEAD

DRAINLEAD



RF and IF EMBOSSED TAPE AND REEL ORDERING INFORMATION

PackageTape Width

(mm)Pitch

mm (inch)Reel Size

mm (inch)

Devices Per Reeland Minimum

Order Quantity DeviceSuffix

Micro-8 12 8.0 ± 0.1 (.315 ± .003) 330 (13) 2,500 R2

NI-200S (458B) 12 12.0 ± 0.1 (.471 ± .004) 178 (7) 500 R1

NI-200Z (458C) 12 12.0 ± 0.1 (.471 ± .004) 178 (7) 500 R1

NI-360 (360B) 32 24.0 ± 0.1 (.945 ± .004) 330 (13) 500 R1

NI-360S (360C) 32 24.0 ± 0.1 (.945 ± .004) 330 (13) 500 R1

NI-400 (465E) 32 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-400S (465F) 32 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-600 (465D) 32 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-780 (465) 56 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-780S (465A) 56 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-860 (375B, 375G)NI-860 (375G)

5656

28.0 ± 0.1 (1.10 ± .004)28.0 ± 0.1 (1.10 ± .004)

330 (13)330 (13)

25050

R3R5

NI-880 (465B) 56 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-880S (465C) 56 32.0 ± 0.1 (1.26 ± .004) 330 (13) 250 R3

NI-1230 (375D) 56 32.0 ± 0.1 (1.26 ± .004) 330 (13) 150 R6

PLD-1 12 8.0 ± 0.1 (.315 ± .004) 178 (7) 1,000 T1

PLD-1.5 12 8.0 ± 0.1 (.315 ± .004) 178 (7) 1,000 T1

PFP-16 16 12.0 ± 0.1 (.472 ± .004) 330 (13) 1,500 R2

QFN-24 12 8.0 ± 0.1 (.315 ± .004) 178 (7) 2,500 R2

QFN-32 (5x5 mm) 12 8.0 ± 0.1 (.315 ± .004) 178 (7) 2,500 R2

SO-16/16L 16 8.0 ± 0.1 (.315 ± .004) 330 (13) 2,500 R2

SO-20L 24 12.0 ± 0.1 (.472 ± .004) 330 (13) 1,000 R2

SO-28L 24 12.0 ± 0.1 (.472 ± .004) 330 (13) 1,000 R2

SOT-363 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1

TO-270-2 (1265) 24 16.0 ± 0.1 (.631 ± .004) 330 (13) 500 R1

TO-270 WB-4 (1486) 32 24.0 ± 0.1 (.944 ± .004) 330 (13) 500 R1

TO-272-6 Wrap (1264), TO-272-6 (1264A)

44 16.0 ± 0.1 (.631 ± .004) 330 (13) 500 T1

TO-272-8 Wrap (1366),TO-272-8 (1366A)

44 20.0 ± 0.1 (.787 ± .004) 330 (13) 500 T1

TO-272-2 (1337) 44 16.0 ± 0.1 (.631 ± .004) 330 (13) 500 R1

TO-272 WB-16 (1329) 44 20.0 ± 0.1 (.788 ± .004) 330 (13) 500 R1

TO-272 WB-16 Gull(1329A)

44 16.0 ± 0.1 (.631 ± .004) 330 (13) 500 R1

TO-272 WB-4 (1484) 44 20.0 ± 0.1 (.788 ± .004) 330 (13) 500 R1

TSSOP-16 16 8.0 ± 0.1 (.315 ± .004) 330 (13) 2,500 R2


SELECTOR GUIDE

EMBOSSED TAPE AND REEL DATA FOR DISCRETES

CARRIER TAPE SPECIFICATIONS

P0K

t

B1 K0

Top Cover

Tape

Embossment

User Direction of Feed

Center Lines

of Cavity

DP2

10 Pitches Cumulative Tolerance on Tape

± 0.2 mm

(± 0.008″)

E

F W

P

B0

A0

D1

For Components

2.0 mm x 1.2 mm and Larger

* Top Cover Tape

Thickness (t1)

0.10 mm

(.004″) Max.

Embossment

Embossed Carrier

R Min

Bending Radius

Maximum Component Rotation

Typical Component

Cavity Center Line

Typical Component

Center Line

100 mm

(3.937″)

250 mm

(9.843″)

1 mm

(.039″) Max

1 mm Max

10°

Tape and Components

Shall Pass Around Radius �R"

Without Damage

Tap

e

For Machine Reference Only

Including Draft and RADII

Concentric Around B0

Camber (Top View)

Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm

See

Note 1

Bar Code Label



DIMENSIONS

TapeSize B1 Max

D1.5�+�0.1�mm D1 E1 F K P0 P2 R Min t Max W Max

12�mm 8.2�mm

1.5�+�0.1�mm

−�0.0

( 059 004 ″ 1.5�mm�Min 1.75�±�0.1�mm 5.5�±�0.05�mm 6.4�mm�Max 4.0�±�0.1�mm 2.0�±�0.1�mm 30�mm 0.4�mm 12�±�.30�mm12�mm 8.2�mm

(.323″)(.059�+�.004 ″

−0 0)

1.5�mm�Min

(.060″)

1.75�±�0.1�mm

(.069�±�.004″)

5.5�±�0.05�mm

(.217�±�.002″)

6.4�mm�Max

(.252″)

4.0�±�0.1�mm

(.157�±�.004″)

2.0�±�0.1�mm

(.079�±�.004″)

30�mm

(1.18″)

0.4�mm

(.016″)

12�±�.30�mm

(.470�±�.012″)

16�mm 12.1�mm

(.476″)

−�0.0)(.060 ) (.069�±�.004 )

7.5�±�0.10�mm

(.295�±�.004″)

7.9�mm�Max

(.311″)

(.157�±�.004 ) (.079�±�.004 ) (1.18 ) (.016 )

16.3�mm

(.642″)

24�mm 20.1�mm

(.791″)

11.5�±�0.1�mm

(.453�±�.004″)

11.9�mm�Max

(.468″)

24.3�mm

(.957″)

32�mm 23.0�mm

(.906″)

1.5�mm�Min

(.059″)

14.2�±�0.1�mm

(.559 ±�.004″)

4.6 mm

(.181″)

NI−360/S

50�mm

(1.969″)

0.6�mm

(.024″)

32.2�mm

(1.272″)

4.3 mm

(.169″)

NI−400/S

5.34 mm

(.210″)

NI−600/S

19.7�mm

(.776″)

TO−270

WB−4

2.0�mm�Min

(.079″)

3.5 mm

(.138″)

TO−270

WB−4

32.0�mm±�

0.3�mm

(1.260±� .012″)

TO−270

WB−4

44�mm 35.0 mm

(1.378″)

11.5�±�0.1�mm

(.453�±�.004″)

15.9�mm�Max

(.625″)

2.0�±�0.15�mm

(.079�±�.006″)

44�±�.30�mm

(1.732±� .012″)(.453�±�.004 ) (.625 ) (.079�±�.006 )

24.0 mm

(.946″)

TO−272

WB−4,

TO−272

WB−16

20.2±�0.15�mm

(0.796±.006″)

2.92 mm

(.115″)

TO−272

WB−4,

TO−272

WB−16

20.0±�0.1�mm

(.788�±�.004″)

TO−272

WB−4,

TO−272

WB−16

.318 mm

(.012″)

TO−272

WB−4,

TO−272

WB−16

23.77 mm

(.936″)

TO−272

WB−16

Gull

3.20 mm

(.126″)

TO−272

WB−16 Gull

16.0±�0.1�mm

(.630�±�.004″)

TO−272

WB−16 Gull

.343 mm

(.013″)

TO−272

WB−16

Gull

56�mm 34.7 mm

(1.366″)

26.2

� ±�0.15�mm

(1.031�±�.006″)

4.5�mm

(0.177″)

NI−780/S

4.0�±�0.1�mm

(.157�±�.004″)

0.6�mm

(.024″)

56�±�.30�mm

(2.205� ±� .012″)(1.031�±�.006 )

5.0 mm

(0.197″)

NI−860

� .012 )

5.23�mm

(0.206″)

NI−880/S

41.6 mm

(1.638″)

NI−1230

5.2�mm

(0.205″)

NI−1230

Metric dimensions govern � English are in parentheses for reference only.NOTE 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within .05 mm min. to .50 mm max.,NOTE 1: the component cannot rotate more than 10° within the determined cavity.NOTE 2: Pitch information is contained in the Embossed Tape and Reel Ordering Information on pg. 52.


SELECTOR GUIDE

EMBOSSED TAPE AND REEL DATA FOR DISCRETES

A

Full Radius

T Max

G

20.2 mm Min

(.795″)

1.5 mm Min

(.06″)13.0 mm ± 0.5 mm

(.512″ ± .002″)

50 mm Min

(1.969″)

Outside Dimension

Measured at Edge

Inside Dimension

Measured Near Hub

Size A Max G T Max

12 mm 330 mm(12.992″)

12.4 mm + 2.0 mm, - 0.0(.49″ + .079″, - 0.00)

18.4 mm(.72″)

16 mm 360 mm(14.173″)

16.4 mm + 2.0 mm, - 0.0(.646″ + .078″, - 0.00)

22.4 mm(.882″)

24 mm 360 mm(14.173″)

24.4 mm + 2.0 mm, - 0.0(.961″ + .070″, - 0.00)

30.4 mm(1.197″)

32 mm 360 mm(14.163″)

32.4 mm + 2.0 mm, - 0.0(1.276″+ 0.79″, - 0.00)

38.4 mm(1.512″)

44 mm 330 mm(12.992″)

44.4 mm + 2.0 mm, - 0.0(1.748″+ 0.79″, - 0.00)

50.4 mm(1.984″)

44 mmTO-272WB-4,

WB-16,WB-16

Gull

330 mm(12.992″)

45.3 mm + 0.5 mm, - 0.0(1.785″+ 0.02″, - 0.00)

50.4 mm(1.984″)

56 mm 330 mm(12.992″)

56.4 mm + 2.0 mm, - 0.0(2.220″+ 0.79″, - 0.00)

62 mm(2.441″)

Reel DimensionsMetric Dimensions Govern � English are in parentheses for reference only



Kraft Paper

Tape, Blue

Item 3.2

(Cathode)

Reel

Roll Pad

Container

Tape, White

Item 3.2

(Anode)

Item 3.1.1

Max Off

Alignment

E

Item 3.3.5

Both Sides0.250

Item 3.3.2

0.031

Item 3.3.5

D1 D2

A

Overall�LG

Item�3.1.2

Figure 1. Reel Packing Figure 2. Component Spacing

Optional Design

1.188

Item 3.4

3.5�Dia.

CD

Figure 3. Reel Dimensions

B


SELECTOR GUIDE

Applications and Product LiteratureApplication Notes, Engineering Bulletins and Article Reprints of special interest to designers of RF and RF/IF equipment are listedbelow. This technical documentation is available on the Freescale Semiconductor Product Sector Web site or is available throughthe Freescale Semiconductor Literature Distribution Center. Phone and fax numbers for ordering literature are listed on the backcover of this book and in our Accessing Data On- line section.

Application NotesAN211A Field Effect Transistors in Theory and PracticeAN419 UHF Amplifier Design Using Data Sheet

Design CurvesAN423 Field Effect Transistor RF Amplifier Design

TechniquesAN535 Phase-Locked -Loop Design FundamentalsAN548A Microstrip Design Techniques for UHF AmplifiersAN721 Impedance Matching Networks Applied to

RF Power TransistorsAN923 800 MHz Test Fixture DesignAN955 A Cost Effective VHF Amplifier for Land

Mobile RadiosAN1022 Mechanical and Thermal Considerations in Using

RF Linear Hybrid AmplifiersAN1024 RF Linear Hybrid AmplifiersAN1025 Reliability Considerations in Design and Use of

RF Integrated CircuitsAN1026 Extending the Range of an Intermodulation

Distortion TestAN1027 Reliability/Performance Aspects of CATV

Amplifier DesignAN1032 How Load VSWR Affects Non-Linear CircuitsAN1033 Match Impedances in Microwave AmplifiersAN1034 Three Balun Designs for Push-Pull AmplifiersAN1040 Mounting Considerations for Power

SemiconductorsAN1207 The MC145170 in Basic HF and VHF OscillatorsAN1253 An Improved PLL Design Method Without

ϖn and ζAN1526 RF Power Device Impedances: Practical

ConsiderationsAN1530 Advanced Amplifier Concept PackageAN1602 3.6 V and 4.8 V GSM/DCS1800 Dual Band PA

Application with DECT Capability Using Standard RFIC�s

AN1617 Mounting Recommendations for Copper Tungsten Flanged Transistors

AN1639 Phase Noise Measurement Using the Phase Lock Technique

AN1643 RF LDMOS Power Modules for GSM Base Station Application: Optimum Biasing Circuit

AN1670 60 Watts, GSM 900 MHz, LDMOS Two-StageAmplifier

AN1671 MC145170 PSpice Modeling KitAN1696 Broadband Intermodulation Performance

Development Using the Rohde & Schwarz Vector Network Analyzer ZVR

AN1697 GSM900/DCS/1800 Dual-Band 3.6 V PowerAmplifier Solution with Open Loop Control Scheme

AN1907 Surface Mount Solder Attach Method for theMRF9045MR1 in the TO-270 Plastic RF Package

AN1908 Solder Mounting Method for the MRF19090Sand Similar Packages

AN1923 Mounting Method with Mechanical Fastenersfor the MRF19090 and Similar Packages

AN1938 Sensitivity of High Power RF Transistors to Source and Output Loads

AN1941 Modeling Thermal Effects in RF LDMOS Transistors

AN1944 Generating Temperature -Dependent IV Curves Using ADS

AN1949 Mounting Method for the MHVIC910HR2 (PFP-16) and Similar Surface Mount Packages

AN1955 Thermal Measurement Methodology of RF PowerAmplifiers

AN1987 Quiescent Current Control for the RF IntegratedCircuit Device Family

AN4005 Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package

Article ReprintsAR164 Good RF Construction Practices and TechniquesAR254 Phase-Locked Loop Design ArticlesAR510 VSWR Protection of Solid State RF Power

AmplifiersAR511 Biasing Solid State Amplifiers to Linear OperationAR579 CAD of a Broadband, Class-C 65 Watt

UHF Power AmplifierAR581 Procedure Performs Thermal Measurements

on Pulsed DevicesAR612 Plastic Packages Hold Power RF MOSFETsAR624 Aluminum-Based Metallization Enhances Device

ReliabilityAR628 Impedance Measurements for High Power RF

Transistors Using the TRL MethodAR629 Digital Predistortion Techniques for RF Power

Amplifiers with CDMA Applications



Engineering BulletinsEB38 Measuring the Intermodulation Distortion of

Linear AmplifiersEB105 A 30 Watt, 800 MHz Amplifier DesignEB209 Mounting Method for RF Power Leadless Surface

Mount TransistorsEB211 Thermal Management and Solder Mounting

Method for the MRF286, 60 Watt Power Device in a CuW (Copper Tungsten) Base Package

EB213 Surge-Ringing Wave Clamp for GaAs CATV Module Protection

Product LiteratureDL110/D Wireless RF Product Device Data LibraryDL209/D CATV Distribution Amplifier Module

Device Data BookSG46/D Wireless RF Product Selector Guide


SELECTOR GUIDE

Case Dimensions

NOTES:1. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION "F" TO CENTER OF LEADS.

STYLE 1:PIN 1. RF INPUT

2. VDD13. VDD24. RF OUTPUT

CASE: GROUND

G

W

N

L

H

R

K

J

AM0.020 (0.51) T M

M0.020 (0.51) T

1 2 3 4

FE

C

SEATING

PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.760 1.780 44.70

B 1.370 1.390 34.80 35.31

C 0.245 0.265 6.22 6.73

D 0.017 0.023 0.43 0.58

E 0.080 0.100 2.03 2.54

F 0.086 BSC 2.18 BSC

G 1.650 BSC 41.91 BSC

H 1.290 BSC 32.77 BSC

J 0.266 0.280 6.76 7.11

K 0.125 0.165 3.18 4.19

L 0.990 BSC 25.15 BSC

0.390 BSC 9.91 BSCN

P

0.118 0.132 3.00 3.35Q

R 0.535 0.555 13.59 14.10

S 0.445 0.465 11.30 11.81

W

45.21

CASE 301AP-02ISSUE C

BM0.020 (0.51) T M

MSM0.008 (0.20) A MT

0.090 BSC 2.29 BSC

0.008 0.013 0.20 0.33

STYLE 2:PIN 1. RF OUTPUT

2. VDD23. VDD14. RF INPUT

CASE: GROUND


2. VBIAS3. VDD4. RF OUTPUT

CASE: GROUND

D4X

Q2X

B

A

S

S

A

T

P4X

CASE 301AS-01ISSUE A

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION F TO CENTER OF LEADS.


2. VDD3. RF OUTPUT

CASE: GROUND

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.760 1.780 44.70 45.21

B 1.370 1.390 34.80 35.31

C 0.245 0.265 6.22 6.73

D 0.017 0.023 0.43 0.58

E 0.080 0.100 2.03 2.54

F 0.086 BSC 2.18 BSC

G 1.650 BSC 41.91 BSC

H 1.290 BSC 32.77 BSC

J 0.266 0.280 6.76 7.11

K 0.125 0.165 3.18 4.19

N 0.390 BSC 9.91 BSC

P 0.008 0.013 0.20 0.33

Q 0.118 0.132 3.00 3.35

R 0.535 0.555 13.59 14.10

S 0.445 0.465 11.30 11.81

W 0.090 BSC 2.29 BSC

G

3 PL

J

K

R

-A-

D

2 PLQ

MAM0.51 (0.020) T

1 2 3

H

W

3 PLP

EF

CSEATING

PLANE

MSM0.20 (0.008) T

-B-

MA

-S-

N

-T-

MBM0.51 (0.020) T

M0.51 (0.020) T



CASE DIMENSIONS (continued)

CASE 301AY-01ISSUE O

NOTES:1. CONTROLLING DIMENSION: MILLIMETER.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ANSI Y14.5M, 1982.3. DIMENSION F TO CENTER LINE OF LEADS.

0.2 (0.008) M T S M

0.51 (0.020) M T A M

R

B

G

1 2 3 4

M

E

C

SEATING PLANE

Q2X


2. VDD1 3. VDD2 4. VDD3 5. RF OUTPUT

CASE: GROUND

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 44.7 45.21 1.760 1.780

B 34.8 35.31 1.370 1.390

C 6.22 6.73 0.245 0.265

D 0.43 0.58 0.017 0.023

E 2.03 2.54 0.080 0.100

F 2.18 BSC 0.086 BSC

G 41.91 BSC 1.650 BSC

H 32.77 BSC 1.290 BSC

J 6.76 7.11 0.266 0.280

K 3.18 4.19 0.125 0.165

L 25.15 BSC 0.990 BSC

M 7.37 BSC 0.290 BSC

N 9.91 BSC 0.390 BSC

P 0.2 0.33 0.008 0.013

Q 3 3.35 0.118 0.132

R 13.59 14.1 0.535 0.555

S 11.3 11.81 0.445 0.465

W 2.29 BSC 0.090 BSC

J

K5X

5

W

NL

HD5X

A

A M

S

0.51 (0.020) M T B M

A

B S

F

T

P5X

0.51 (0.020) M T B M


SELECTOR GUIDE


CASE 318M-01ISSUE O

ÉÉÉÉÉÉÇÇÇÇÇÇ

ÉÉÉÉÉÉ

A−BM0.10 DC

A

NOTES:1. DIMENSIONS ARE IN MILLIMETERS.2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.3. DIMENSION D DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,PROTRUSIONS OR GATE BURRS SHALL NOTEXCEED 0.15mm PER END. DIMENSION E1 DOESNOT INCLUDE INTERLEAD FLASH ORPROTRUSION. INTERLEAD FLASH OR PROTRUSIONSHALL NOT EXCEED 0.15mm PER SIDE.

4. DIMENSIONS D AND E1 ARE DETERMINED AT THEOUTMOST EXTREMES OF THE PLASTIC BODYEXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,GATE BURRS AND INTERLEAD FLASH, BUTINCLUDING ANY MISMATCH BETWEEN THE TOPAND BOTTOM OF PLASTIC BODY.

5. DATUMS A, B AND D TO BE DETERMINED 0.10mmFROM THE LEAD TIP.

6. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

7. THESE DIMENSIONS APPLY TO THE FLAT SECTIONOF THE LEAD BETWEEN 0.08mm AND 0.15mm FROMTHE LEAD TIP.

0.15 C

0.20 C

0.10 C

E1/2

L2

E/2

E1

VIEW CB

B

b1

c1

b

c

SECTION B-B(SEE NOTE 7)

BASE METAL

WITH PLATING

3X

�4X

E D

D

2X b

B

PIN 1 IDENTIFIERIN THIS ZONE

2X

1

3

4

2

A2A1

A

4X

SE

AT

ING

PL

AN

E

1

�4X 1

�

(L1)

C

SEATING PLANE

GAUGE PLANE

L

VIEW C

DIM MIN MAX

MILLIMETERS

A − − − 1.10

A1 0.00 0.10

A2 0.80 1.00

b 0.25 0.40

b1 0.25 0.35

B 0.55 0.70

B1 0.55 0.65

c 0.10 0.25

c1 0.08 0.20

D 2.00 BSC

E 2.10 BSC

E1 1.25 BSC

e1 1.30 BSC

e2 0.65 BSC

e3 1.15 BSC

e4 0.50 BSC

L 0.26 0.46

L1 0.425 REF

L2 0.15 BSC

� 0 8

� 4 10 1

e2

e1

e4B (

B1)

e3

� �

� �

0.15

C

2X

SOT-343




CASE 360B-05ISSUE FNI-360

G

E C

SEATING

PLANE

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.795 0.805 20.19 20.45

INCHES

B 0.225 0.235 5.72 5.97

C 0.125 0.175 3.18 4.45

D 0.210 0.220 5.33 5.59

E 0.055 0.065 1.40 1.65

F 0.004 0.006 0.10 0.15

G 0.562 BSC 14.28 BSC

H 0.077 0.087 1.96 2.21

K 0.220 0.250 5.59 6.35

M 0.355 0.365 9.02 9.27

Q 0.125 0.135 3.18 3.43

STYLE 1:PIN 1. DRAIN

2. GATE 3. SOURCE

1

2

3

Q2X

MAMaaa B MT NOTES:1. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M−1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.

R 0.227 0.233 5.77 5.92

S 0.225 0.235 5.72 5.97

N 0.357 0.363 9.07 9.22

aaa 0.005 REF 0.13 REF

bbb 0.010 REF 0.25 REF

ccc 0.015 REF 0.38 REF

MAMbbb B MT

D2XK2X

B

B(FLANGE)

HF

MAMccc B MT

MAMbbb B MT

A

M(INSULATOR)

A

T

N(LID)

MAMccc B MT

R(LID)

S(INSULATOR)

MAMaaa B MT

CASE 360C-05ISSUE DNI-360S


2. GATE3. SOURCE

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.375 0.385 9.53 9.78

INCHES

B 0.225 0.235 5.72 5.97

C 0.105 0.155 2.67 3.94

D 0.210 0.220 5.33 5.59

E 0.035 0.045 0.89 1.14

F 0.004 0.006 0.10 0.15

H 0.057 1.45

K 0.085 0.115 2.16 2.92

M 0.355 0.365 9.02 9.27EC

SEATING

PLANE

2

0.067 1.70

1



FROM PACKAGE BODY.

S 0.225 0.235 5.72 5.97




HF

MAMccc B MT

R(LID)

S(INSULATOR)

MAMaaa B MT

MAMbbb B MT

D2X

B

B(FLANGE)

MAMccc B MT

MAMbbb B MT

M(INSULATOR)

T

N(LID)

A(FLANGE)

A

K2X

PIN 3

N 0.357 0.363 9.07 9.22

R 0.227 0.23 5.77 5.92


SELECTOR GUIDE


CASE 360D-02ISSUE B

G

E

N (LID)

C

SEATING

PLANE

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.795 .805 20.19 20.45

INCHES

B .225 .235 5.72 5.97

C .125 .176 3.18 4.47

D .034 .044 0.89 1.12

E .055 .065 1.40 1.65

F .004 .006 0.10 0.15

G .562 BSC 14.28 BSC

H .077 .087 1.96 2.21

K .085 .115 2.16 2.92

M .355 .365 9.02 9.27

N .355 .365 9.96 10.16

STYLE 1:PIN 1. GATE

2. DRAIN 3. SOURCE

1

2

3

Q2 x

MAMbbb B MT

NOTES:1. CONTROLLING DIMENSION: INCH.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M−1994.3. DIMENSION H IS MEASURED .030 (0.762) AWAY

FROM PACKAGE BODY.

Q .125 .135 3.18 3.43

R .225 .235 5.72 5.97S .225 .235 5.72 5.97

aaa

bbb

ccc

.005 0.13

.010 0.25

.015 0.38

MAMbbb B MT

S(INSULATOR)

K2 x

B(FLANGE)

D2 x

MAMbbb B MT

B

MAMccc B MT

H

R (LID)

FMAMccc B MT

T

AA

M

MAMaaa B MT

(INSULATOR)

NI-360HF

CASE 375B-04ISSUE ENI-860

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.335 1.345 33.91 34.16

B 0.380 0.390 9.65 9.91

C 0.180 0.224 4.57 5.69

D 0.325 0.335 8.26 8.51

E 0.060 0.070 1.52 1.78

F 0.004 0.006 0.10 0.15

G 1.100 BSC 27.94 BSC

H 0.097 0.107 2.46 2.72

K 0.085 0.115 2.16 2.92

L 0.425 BSC 10.80 BSC

N 0.851 0.869 21.62 22.07

Q 0.118 0.138 3.00 3.51

R 0.395 0.405 10.03 10.29



FROM PACKAGE BODY.4. RECOMMENDED BOLT CENTER DIMENSION OF

1.140 (28.96) BASED ON M3 SCREW.


2. DRAIN 3. GATE 4. GATE 5. SOURCE

G

L

K

1 2

3 4

EC

SEATING

PLANE

5

4X

S 0.394 0.406 10.01 10.31

M 0.852 0.868 21.64 22.05



HF

MAMccc B MT

R(LID)

S(INSULATOR)

MAMbbb B MT

Q2X

MAMbbb B MT

MAMbbb B MT

D4X

B

A

B (FLANGE)

A

MAMccc B MT

MAMbbb B MT

M(INSULATOR) T

N(LID)

PIN 5

4




CASE 375D-05ISSUE DNI-1230







DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.615 1.625 41.02 41.28

B 0.395 0.405 10.03 10.29

C 0.150 0.200 3.81 5.08

D 0.455 0.465 11.56 11.81

E 0.062 0.066 1.57 1.68

F 0.004 0.007 0.10 0.18

G 1.400 BSC 35.56 BSC

H 0.082 0.090 2.08 2.29

K 0.117 0.137 2.97 3.48

L 0.540 BSC 13.72 BSC

N 1.218 1.242 30.94 31.55

Q 0.120 0.130 3.05 3.30

R 0.355 0.365 9.01 9.27

A

G

L

DK4X

Q2X

1 2

43

M 1.219 1.241 30.96 31.52

S 0.365 0.375 9.27 9.53



ccc 0.020 REF 0.51 REFSEATING

PLANE

N

C

E

M

MAMaaa B MT

B

B(FLANGE)

HF

MAMccc B MT

R(LID)

S(INSULATOR)

MAMbbb B MT

4X

A

T

MAMbbb B MT

(INSULATOR)

MAMccc B MT

(LID)

PIN 5

MAMbbb B MT

4


SELECTOR GUIDE


CASE 375F-04ISSUE DNI-650


Y14.5M, 1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.

D

F

EH

2

3

1

R (LID)

Q2X

C

SEATING

PLANE

K4 PL


2. DRAIN3. GATE4. GATE5. SOURCE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.135 1.145 28.80 29.10

B 0.225 0.235 5.72 5.97

C 0.135 0.178 3.43 4.52

D 0.210 0.220 5.33 5.59

E 0.055 0.065 1.40 1.65

F 0.004 0.006 0.11 0.15

G

H 0.077 0.087 1.96 2.21

K

L

N 0.638 0.650 16.20 16.50

Q

R 0.227 0.233 5.77 5.92

4

0.900 BSC

0.220 0.2500.260 BSC

22.86 BSC

5.59 6.356.60 BSC

G

BMbbb MLMAMbbb B MT

B

B(FLANGE)

M

N

T

MAMbbb B MT

(INSULATOR)MAMccc B MT

(LID)

A(FLANGE)

A M

S (INSULATOR)

MAMbbb B MT

MAMccc B MT

5

A

M 0.643 0.657 16.33 16.69

S 0.225 0.235 5.715 5.97

.125 .135 3.175 3.43

bbb 0.010 BSC 0.254 BSC

ccc 0.015 BSC 0.381 BSC

T

CASE 375G-04ISSUE ENI-860C3

1 2

3 4

5

D

QGL

K

2X

HE

F

CSEATING

PLANE


PER ASME Y14.5M−1994.3. DIMENSION H TO BE MEASURED 0.030 (0.762)

AWAY FROM PACKAGE BODY.4. RECOMMENDED BOLT CENTER DIMENSION

OF 1.140 (28.96) BASED ON 3M SCREW.

4X

B

A

T

DIM

A

MIN MAX MIN MAX

MILLIMETERS

1.335 1.345 33.91 34.16

INCHES

B 0.380 0.390 9.65 9.91

C 0.180 0.224 4.57 5.69

D 0.325 0.335 8.26 8.51

E 0.060 0.070 1.52 1.78

F 0.004 0.006 0.10 0.15

G

H 0.097 0.107 2.46 2.72

K 0.135 0.165 3.43 4.19

L

N 0.851 0.869 21.62 22.07

Q 0.118 0.138 3.00 3.30

R 0.395 0.405 10.03 10.29



1.100 BSC

0.425 BSC

27.94 BSC

10.8 BSC

J 0.2125 BSC 5.397 BSC

M 0.852 0.868 21.64 22.05

S 0.394 0.406 10.01 10.31

bbb 0.010 REF 0.25 REFccc 0.015 REF 0.38 REF

MAMbbb B MT

MAMbbb B MT

B (FLANGE)

4X

MAMbbb B MT

MAMccc B MT

R (LID)

S (INSULATOR)

J

MAMbbb B MT

MAMccc B MT

N(LID)

M(INSULATOR)

A

4




CASE 419B-01ISSUE G


Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.

DIM

A

MIN MAX MIN MAX

MILLIMETERS

1.80 2.200.071 0.087

INCHES

B 1.15 1.350.045 0.053

C 0.80 1.100.031 0.043

D 0.10 0.300.004 0.012

G 0.65 BSC0.026 BSC

H − − − 0.10− − −0.004

J 0.10 0.250.004 0.010

K 0.10 0.300.004 0.012

N 0.20 REF0.008 REF

S 2.00 2.200.079 0.087

V 0.30 0.400.012 0.016

B0.2 (0.008) M M

1 2 3

A

GV

S

H

C

N

J

K

6 5 4

-B-

D 6 PL

S0T-363

CASE 458B-03ISSUE D

CF

E

H

K2X

1

2

3

NOTES:1. CONTROLLING DIMENSIONS: INCHES.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.3. ALL DIMENSIONS ARE SYMMETRICAL ABOUT

CENTERLINE UNLESS OTHERWISE NOTED.


2. GATE 3. SOURCE

D2X

Z4X

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.180 0.190 4.572 4.83

INCHES

B 0.140 0.150 3.556 3.81

C 0.082 0.116 2.083 2.946

D 0.047 0.053 1.194 1.346

E 0.004 0.010 0.102 0.254

F 0.004 0.006 0.102 0.152

H 0.025 0.031 0.635 0.787

K 0.060 0.110 1.524 2.794

M 0.197 0.203 5.004 5.156

N 0.177 0.183 4.496 4.648

R 0.147 0.153 3.734 3.886

S 0.157 0.163 3.988 4.14

Z − − − 0.020 − − − 0.508

bbb 0.010 REF 0.254 REF

ccc 0.015 REF 0.381 REF

MAMbbb B MT

MAMccc B MT

MAMccc B MT

R (LID)

S (INSULATOR)

SEATING

PLANET

MAMccc B MT

N(LID)

A A(FLANGE)

M(INSULATOR)

MAMccc B MT

B

B(FLANGE)

NI-200S


SELECTOR GUIDE


CASE 458C-03ISSUE D

CE

K2X

1

2

3

NOTES:1. CONTROLLING DIMENSIONS: INCHES.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.3. DIMENSION H (PACKAGE COPLANARITY): THE

BOTTOM OF LEADS AND REFERENCE PLANE TMUST BE COPLANAR WITHIN DIMENSION H.


2. GATE 3. SOURCE

D2X

Z4X

YF

H

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.180 0.190 4.572 4.830

INCHES

B 0.140 0.150 3.556 3.810

C 0.082 0.116 2.083 2.946

D 0.047 0.053 1.194 1.346

E 0.004 0.010 0.102 0.254

H 0.000 0.004 0.000 0.102

F 0.004 0.006 0.102 0.152

K 0.050 0.090 1.270 2.286

M 0.197 0.203 5.004 5.156

N 0.177 0.183 4.496 4.648

R 0.147 0.153 3.734 3.886

S 0.157 0.163 3.988 4.140

Z − − − R .020 − − − R .508

MAMbbb B MT

MAMccc B MT

MAMccc B MT

R (LID)

S (INSULATOR)B

(FLANGE)

MAMccc B MT

N(LID)

SEATING

PLANETA A

(FLANGE)

M(INSULATOR)

MAMccc B MT

B

Y 0.020 0.040 0.508 1.016

bbb .010 REF 0.254 REF

ccc .015 REF 0.381 REF

NI-200Z

CASE 465-06ISSUE FNI-780


Y14.5M−1994.2. CONTROLLING DIMENSION: INCH.3. DELETED4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.335 1.345 33.91 34.16

B 0.380 0.390 9.65 9.91

C 0.125 0.170 3.18 4.32

D 0.495 0.505 12.57 12.83

E 0.035 0.045 0.89 1.14

F 0.003 0.006 0.08 0.15

G 1.100 BSC 27.94 BSC

H 0.057 0.067 1.45 1.70

K 0.170 0.210 4.32 5.33

N 0.772 0.788 19.60 20.00

Q .118 .138 3.00 3.51

R 0.365 0.375 9.27 9.53


2. GATE 3. SOURCE

1

3

2

D

G

K

C

E

H

S

FS 0.365 0.375 9.27 9.52

M 0.774 0.786 19.66 19.96

aaa 0.005 REF 0.127 REF

bbb 0.010 REF 0.254 REF

ccc 0.015 REF 0.381 REF

Q2X

MAMbbb B MT

MAMbbb B MT

B

B(FLANGE)

SEATING

PLANE

MAMccc B MT

MAMbbb B MT

A A(FLANGE)

T

N (LID)

M (INSULATOR)

MAMaaa B MT

(INSULATOR)

R

MAMccc B MT

(LID)




CASE 465A-06ISSUE FNI-780S


Y14.5M−1994.2. CONTROLLING DIMENSION: INCH.3. DELETED4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.805 0.815 20.45 20.70

B 0.380 0.390 9.65 9.91

C 0.125 0.170 3.18 4.32

D 0.495 0.505 12.57 12.83

E 0.035 0.045 0.89 1.14

F 0.003 0.006 0.08 0.15

H 0.057 0.067 1.45 1.70

K 0.170 0.210 4.32 5.33

M 0.774 0.786 19.61 20.02

R 0.365 0.375 9.27 9.53


2. GATE5. SOURCE

1

2

D

K

C

E

H

F3

U(FLANGE)

4X

Z(LID)

4X

bbb 0.010 REF 0.254 REF

ccc 0.015 REF 0.381 REF

aaa 0.005 REF 0.127 REF

S 0.365 0.375 9.27 9.52

N 0.772 0.788 19.61 20.02

U − − − 0.040 − − − 1.02

Z − − − 0.030 − − − 0.76

MAMbbb B MT

B

B(FLANGE)

2X

SEATING

PLANE

MAMccc B MT

MAMbbb B MT

A A(FLANGE)

T

N (LID)

M (INSULATOR)

MAMccc B MT

MAMaaa B MT

R (LID)

S (INSULATOR)

CASE 465B-03ISSUE CNI-880


Y14.5M−1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY



DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.335 1.345 33.91 34.16

B 0.535 0.545 13.6 13.8

C 0.147 0.200 3.73 5.08

D 0.495 0.505 12.57 12.83

E 0.035 0.045 0.89 1.14

F 0.003 0.006 0.08 0.15

G 1.100 BSC 27.94 BSC

H 0.057 0.067 1.45 1.70

K 0.175 0.205 4.44 5.21

N 0.871 0.889 19.30 22.60

Q .118 .138 3.00 3.51

R 0.515 0.525 13.10 13.30


2. GATE 3. SOURCE

1

3

2

D

G

K

C

E

H

F

Q2X

MAMbbb B MT

MAMbbb B MT

B

B(FLANGE)

SEATING

PLANE

MAMccc B MT

MAMbbb B MT

A A(FLANGE)

T

N (LID)

M (INSULATOR)

S

MAMaaa B MT

(INSULATOR)

R

MAMccc B MT

(LID)

S 0.515 0.525 13.10 13.30

M 0.872 0.888 22.15 22.55

aaa 0.007 REF 0.178 REF

bbb 0.010 REF 0.254 REF

ccc 0.015 REF 0.381 REF

4


SELECTOR GUIDE


CASE 465C-02ISSUE A


Y14.5M−1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.905 0.915 22.99 23.24

B 0.535 0.545 13.60 13.80

C 0.147 0.200 3.73 5.08

D 0.495 0.505 12.57 12.83

E 0.035 0.045 0.89 1.14

F 0.003 0.006 0.08 0.15

H 0.057 0.067 1.45 1.70

K 0.170 0.210 4.32 5.33

N 0.871 0.889 19.30 22.60

R 0.515 0.525 13.10 13.30


2. GATE 3. SOURCE

1

SEATING

PLANE

2

D

K

C

E

H

F

MAMbbb B MT

B

B(FLANGE)

MAMccc B MT

MAMbbb B MT

A A(FLANGE)

T

N (LID)

M (INSULATOR)

MAMccc B MT

MAMaaa B MT

R (LID)

S (INSULATOR)

S 0.515 0.525 13.10 13.30

M 0.872 0.888 22.15 22.55

bbb 0.010 REF 0.254 REF

ccc 0.015 REF 0.381 REF

aaa 0.007 REF 0.178 REF

NI-880S

CASE 465D-05ISSUE DNI-600

D

G

1

2

3

K

A

C

HE SEATING

PLANE

F


PER ANSI Y14.5M−1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 1.065 1.075 27.05 27.30

B 0.380 0.390 9.65 9.91

C 0.160 0.205 4.06 5.21

D 0.425 0.435 10.80 11.05

E 0.060 0.070 1.52 1.78

F 0.004 0.006 0.10 0.15

G 0.870 BSC 22.10 BSC

H 0.096 0.106 2.44 2.69

K 0.190 0.223 4.83 5.66

M 0.594 0.606 15.09 15.39

Q 0.124 0.130 3.15 3.30

R 0.394 0.404 10.01 10.26


2. GATE 3. SOURCE

Q2X

MAMbbb B MT

MAMbbb B MT

B

B(FLANGE)

MAMccc B MT

MAMbbb B MT

A

T

N (LID)

M (INSULATOR)

S

MAMaaa B MT

(INSULATOR)

R

MAMccc B MT

(LID)S 0.395 0.405 10.03 10.29

N 0.591 0.601 15.01 15.27







CASE 465E-04ISSUE ENI-400


PER ASME Y14.5M, 1994.3. DIMENSION H IS MEASURED 0.030 (0.762)

AWAY FROM PACKAGE BODY.4. INFORMATION ONLY: CORNER BREAK (4X) TO

BE .060±.005 (1.52±0.13) RADIUS OR .06±.005(1.52±0.13) x 45° CHAMFER.


2. GATE 3. SOURCE

SEATING

PLANE

2X D

N (LID)

ER (LID)

F

2X K

A

T

C

MBMbbb A MT

H

B

B

G

A

MAMccc B MT

MAMbbb B MT

1

2

3

2X Q

M(INSULATOR)

S(INSULATOR)

MAMccc B MT

MAMaaa B MT

MAMaaa B MT

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.795 .805 20.19 20.44

INCHES

B .380 .390 9.65 9.9

C .125 .163 3.17 4.14

D .275 .285 6.98 7.24

E .035 .045 0.89 1.14

F .004 .006 0.10 0.15

G

H .057 .067 1.45 1.7

K .092 .122 2.33 3.1

M .395 .405 10 10.3

N .395 .405 10 10.3

Q .120 .130 3.05 3.3

R .395 .405 10 10.3

S .395 .405 10 10.3

aaa

bbb

ccc

.600 BSC 15.24 BSC

.005 BSC 0.127 BSC

.010 BSC 0.254 BSC

.015 BSC 0.381 BSC

SEE NOTE 4

CASE 465F-04ISSUE CNI-400S


PER ASME Y14.5M−1994.3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY

FROM PACKAGE BODY.


2. GATE 3. SOURCE

1

SEATING

PLANE

2

E F

2X K

MAMbbb B MT

A T

C

H

B

A

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.395 .405 10.03 10.29

INCHES

B .395 .405 10.03 10.29

C .125 .163 3.18 4.14

D .275 .285 6.98 7.24

E .035 .045 0.89 1.14

F .004 .006 0.10 0.15

H .057 .067 1.45 1.70

K .092 .122 2.34 3.10

M .395 .405 10.03 10.29

S .395 .405 10.03 10.29

aaa .005 REF 0.127 REF

2X D

MAMccc B MT

bbb .010 REF 0.254 REFccc .015 REF 0.38 REF

N .395 .405 10.03 10.29

R .395 .405 10.03 10.29

MAMccc B MT

MAMaaa B MT

N (LID)

M (INSULATOR)

(FLANGE)

3

B(FLANGE)

R (LID)

S (INSULATOR)

MAMaaa B MT


SELECTOR GUIDE


CASE 466-03ISSUE CPLD-1.5PLASTIC

0.115

2.92

0.020

0.51

0.115

2.92

mm

inches

0.095

2.41

0.146

3.71

SOLDER FOOTPRINT


PER ASME Y14.5M, 1984.2. CONTROLLING DIMENSION: INCH3. RESIN BLEED/FLASH ALLOWABLE IN ZONE V, W,

AND X.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.255 0.265 6.48 6.73

B 0.225 0.235 5.72 5.97

C 0.065 0.072 1.65 1.83

D 0.130 0.150 3.30 3.81

E 0.021 0.026 0.53 0.66

F 0.026 0.044 0.66 1.12

G 0.050 0.070 1.27 1.78

H 0.045 0.063 1.14 1.60

K 0.273 0.285 6.93 7.24

L 0.245 0.255 6.22 6.48

N 0.230 0.240 5.84 6.10

P 0.000 0.008 0.00 0.20

Q 0.055 0.063 1.40 1.60

R 0.200 0.210 5.08 5.33

S 0.006 0.012 0.15 0.31

U 0.006 0.012 0.15 0.31

ZONE V 0.000 0.021 0.00 0.53

ZONE W 0.000 0.010 0.00 0.25

ZONE X 0.000 0.010 0.00 0.25


2. GATE 3. SOURCE 4. SOURCE

J 0.160 0.180 4.06 4.57

ÉÉÉÉÉÉÉÉÉÉÉÉ

ÉÉÉÉÉÉÉÉÉÉÉÉ

ÉÉÉÉÉÉÉÉ

A

B D

F

LR

3

4

21

KN

ZONE V

ZONE W

ZONE XGS

HU

�10 DRAFT

P

CE

0.35 (0.89) X 45 5�

Y Y

Q

VIEW Y-Y

� �

4

21

3




CASE 648-08ISSUE RDIP-16


Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.5. ROUNDED CORNERS OPTIONAL.

-A-

B

F C

S

HG

D

J

L

M

16 PL

SEATING

1 8

916

K

PLANE-T-

MAM0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55

B 0.250 0.270 6.35 6.85

C 0.145 0.175 3.69 4.44

D 0.015 0.021 0.39 0.53

F 0.040 0.70 1.02 1.77

G 0.100 BSC 2.54 BSC

H 0.050 BSC 1.27 BSC

J 0.008 0.015 0.21 0.38

K 0.110 0.130 2.80 3.30

L 0.295 0.305 7.50 7.74

M 0 10 0 10

S 0.020 0.040 0.51 1.01��


SELECTOR GUIDE


CASE 714Y-04ISSUE E

2


PER ASME Y14.5M, 1994.2. CONTROLLING DIMENSION: INCH.


2. GROUND3. GROUND4. DELETED5. VDC6. DELETED7. GROUND8. GROUND9. RF OUTPUT

1 5 8 9

1.085 MAX

1.500

.1682X

4X

2X

3 7

A1.775 MAX

F

Z

.156

.250MAX

.600MAX

.148

AM0.010 T F

.325

.300

T

.165

.0227X

.510

.465

.840MAX

.018

EM0.010 T A

.100.163

2X .152

AM0.010 T F

.200

.400

1.000

#6-32 UNC-2B

AM0.010 Z T

E

.156

.355

.315.435MIN




CASE 751B-05ISSUE JSO-16


Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.

1 8

16 9

SEATING

PLANE

F

JM

R X 45�

G

8 PLP-B-

-A-

M0.25 (0.010) B S

-T-

D

K

C

16 PL

SBM0.25 (0.010) A ST

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.80 10.00 0.386 0.393

B 3.80 4.00 0.150 0.157

C 1.35 1.75 0.054 0.068

D 0.35 0.49 0.014 0.019

F 0.40 1.25 0.016 0.049

G 1.27 BSC 0.050 BSC

J 0.19 0.25 0.008 0.009

K 0.10 0.25 0.004 0.009

M 0 7 0 7

P 5.80 6.20 0.229 0.244

R 0.25 0.50 0.010 0.019

� � � �

20

1

11

10

B20X

H10X

C

L

18X A1

A

SEATING

PLANE

h X 45�

CASE 751D-06ISSUE G

E

D

M0.25 MB

M0.25 A BT

eT

B

A

DIM MIN MAX

MILLIMETERS

A 2.35 2.65

A1 0.10 0.25

B 0.35 0.49

C 0.23 0.32

D 12.65 12.95

E 7.40 7.60

e 1.27 BSC

H 10.05 10.55

h 0.25 0.75

L 0.40 1.00

� 0 7

NOTES:1. DIMENSIONS ARE IN MILLIMETERS.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALLBE 0.13 TOTAL IN EXCESS OF B DIMENSION ATMAXIMUM MATERIAL CONDITION.

� �

M

SO-20L


SELECTOR GUIDE


A1

CASE 751F-05ISSUE F

1

15

14

28

BSAM0.025 B SC

M0.

25B

M

SEATING

PLANE

A


PER ASME Y14.5M, 1994.3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSIONS.4. MAXIMUM MOLD PROTRUSION 0.015 PER SIDE.5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.13 TOTAL IN EXCESSOF B DIMENSION AT MAXIMUM MATERIALCONDITION.

DIM MIN MAX

MILLIMETERS

A 2.35 2.65

A1 0.13 0.29

B 0.35 0.49

C 0.23 0.32

D 17.80 18.05

E 7.40 7.60

e 1.27 BSC

H 10.05 10.55

L 0.41 0.90

� 0 8 � �

L

�

C

PIN 1 IDENT

A

B

DE H

e

0.10

C

SO-28L

CASE 751G-04ISSUE C

D

14X

B16X

SEATING

PLANE

AM0.25 BT

16 9

81

h X 45�

MBM0.25

H8X

E

B

A

eT

A1

A

L

C


PER ASME Y14.5M, 1994.3. DIMENSIONS D AND E DO NOT INLCUDE MOLD

PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.13 TOTAL IN EXCESSOF THE B DIMENSION AT MAXIMUM MATERIALCONDITION.

DIM MIN MAX

MILLIMETERS

A 2.35 2.65

A1 0.10 0.25

B 0.35 0.49

C 0.23 0.32

D 10.15 10.45

E 7.40 7.60

e 1.27 BSC

H 10.05 10.55

h 0.25 0.75

L 0.40 1.00

0 7 ��M

M

SO-16W




CASE 948C-03ISSUE B

A

B

PIN 1IDENTIFICATION

L

1 8

916

D

C

SEATING

G H

F

M

DIM

A

MIN MAX MIN MAX

INCHES

− − − 5.10 − − − 0.200

MILLIMETERS

B 4.30 4.50 0.169 0.177

C − − − 1.20 − − − 0047

D 0.05 0.25 0.002 0.010

F 0.45 0.55 0.018 0.022

G 0.65 BSC 0.026 BSC

H 0.22 0.23 0.009 0.010

J 0.09 0.24 0.004 0.009

K 0.16 0.32 0.006 0.013

L 6.30 6.50 0.248 0.256

M 0 10 0 10


Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.MOLD FLASH OR GATE BURRS SHALL NOTEXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASHOR PROTRUSION SHALL NOT EXCEED 0.25(0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTALEXCESS OF THE K DIMENSION AT MAXIMUMMATERIAL CONDITION.


7. DIMENSIONS A AND B ARE TO BE DETERMINEDAT DATUM PLANE −U−.

° ° ° °

J1 0.09 0.18 0.004 0.007

K1 0.16 0.26 0.006 0.010

KK1

J

J1

SECTION A-A

A

A

16x REFK

0.100 (0.004) M

0.200 (0.008) M T

PLANE

-P-

-T-

-U-

TSSOP-16


SELECTOR GUIDE


CASE 978-03ISSUE BPFP-16

PLASTIC

DIM MIN MAX

MILLIMETERS

A 2.000 2.300

A1 0.025 0.100

A2 1.950 2.100

D 6.950 7.100

D1 4.372 5.180

E 8.850 9.150

E1 6.950 7.100

E2 4.372 5.180

L 0.466 0.720

L1 0.250 BSC

b 0.300 0.432

b1 0.300 0.375

c 0.180 0.279

c1 0.180 0.230

e 0.800 BSC

h − − − 0.600

� 0 7

aaa 0.200

bbb 0.200

ccc 0.100

NOTES:1. CONTROLLING DIMENSION: MILLIMETER.2. DIMENSIONS AND TOLERANCES PER ASME

Y14.5M, 1994.3. DATUM PLANE −H− IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEADWHERE THE LEAD EXITS THE PLASTIC BODY ATTHE BOTTOM OF THE PARTING LINE.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE PROTRUSION IS0.250 PER SIDE. DIMENSIONS D AND E1 DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

5. DIMENSION b DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION IS 0.127 TOTAL IN EXCESS OF THEb DIMENSION AT MAXIMUM MATERIALCONDITION.

6. DATUMS −A− AND −B− TO BE DETERMINED ATDATUM PLANE −H−.

BOTTOM VIEW

D1

E2

16

98

1

� �

e/2

SBMbbb C

D

X 45�

he

14 x

E1

8X E

A2A

SEATING

PLANE

DATUM

PLANE

GAUGE

L1

PLANE

1.000

LW

W

0.039

A1

ccc C

DETAIL Y

SECT W-W

c c1

b1

b

ÇÇÇÇÇÇÇÇÇÉÉ

SAMaaa C

�

A

B

H

C

Y




TO-272-6 Wrap

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

CASE 1264-09ISSUE J

NOTES:1. CONTROLLING DIMENSION: INCH .2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD

AND IS COINCIDENT WITH THE LEAD WHERETHE LEAD EXITS THE PLASTIC BODY AT THETOP OF THE PARTING LINE.

4. DIMENSION D AND E1 DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE PROTRUSION IS0.006 PER SIDE. DIMENSION D AND E1 DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

5. DIMENSIONS b1 AND b3 DO NOT INCLUDEDAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.005 TOTAL IN EXCESSOF THE b1 AND b2 DIMENSIONS AT MAXIMUMMATERIAL CONDITION.

6. CROSSHATCHING REPRESENTS THE EXPOSEDAREA OF THE HEAT SLUG.

L A1

�

c1

H

D

C

A

B

Maaa D

SEATING

PLANE

DATUM

PLANE

SEATING

PLANE

2X b1

AE1

r1

DRAIN ID

e4X

D

4X b2

D1

A

Maaa D A

Maaa D A

E

DRAIN ID

YY

A2

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.098 0.108 2.49 2.74

INCHES

A1 0.000 0.004 0.00 0.10

A2 0.100 0.104 2.54 2.64

D 0.928 0.932 23.57 23.67

D1 0.806 0.814 20.47 20.68

E 0.296 0.304 7.52 7.72

E1 0.248 0.252 6.30 6.40

L 0.060 0.070 1.52 1.78

b1 0.193 0.199 4.90 5.05

b2 0.078 0.084 1.98 2.13

c1 0.007 0.011 0.18 0.28

e

r1 0.063 0.068 1.60 1.73

0 6 0 6

aaa

1

2

3

4

5

6

3

2

1

6

5

4

VIEW Y-Y

0.193 BSC

�

0.004� �

4.90 BSC

0.10� �

STYLE 1:PIN 1. SOURCE (COMMON)

2. DRAIN3. SOURCE (COMMON)4. SOURCE (COMMON)5. GATE6. SOURCE (COMMON)

4X

b3

b3 0.088 0.094 2.24 2.39

NOTE 6

E2

E2

E2 0.241 0.245 6.12 6.22

PLASTIC


SELECTOR GUIDE


CASE 1264A-02ISSUE B

TO-272-6

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ


PER ASME Y14.5M, 1994.3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS0.006 PER SIDE. DIMENSIONS D AND E1 DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.



6. DIMENSION A2 APPLIES WITHIN ZONE J ONLY.

D

A

B

Maaa D

SEATING

PLANE

2X b1

AE1

DRAIN ID

e4X

D

4X b2

D1

A

Maaa D A

Maaa D A

E

DRAIN ID

YY

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.098 0.106 2.49 2.69

INCHES

A1 0.038 0.044 0.96 1.12

D 0.926 0.934 23.52 23.72

D1

D2

E 0.492 0.500 12.50 12.70

E1 0.246 0.254 6.25 6.45

E2

P 0.126 0.134 3.20 3.40

b1 0.193 0.199 4.90 5.05

b3 0.088 0.094 2.24 2.39

e

c1 0.007 0.011 0.178 0.279

bbb

1

2

3

4

5

6

3

2

1

6

5

4

VIEW Y-Y

0.193 BSC

0.008

4.90 BSC

0.20


2. DRAIN3. SOURCE (COMMON)4. SOURCE (COMMON)5. GATE6. SOURCE (COMMON)

4X

b3

b2 0.078 0.084 1.98 2.13

NOTE 5

aaa 0.004 0.10

0.170 BSC 4.32 BSC

0.608 BSC 15.44 BSC0.810 BSC 20.57 BSC

D2

E2

Abbb BC

A1

c1

2X PMaaa D A B

ZONE "J"

F

F 0.025 BSC 0.64 BSC

A2 0.040 0.042 1.02 1.07

A26

PLASTIC




TO-270-2

CASE 1265-08ISSUE G

DATUM

PLANE

BOTTOM VIEW

A1

2X

E

D1

E4

E1

D2

E3

A2

EXPOSEDHEATSINK AREA

A

B

D

H

PIN ONE ID

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

D

AMaaa D

AMaaa D2Xb1

2XD3


PER ASME Y14.5M−1994.3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD


4. DIMENSIONS �D1" AND �E1" DO NOT INCLUDEMOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .006 PER SIDE. DIMENSIONS �D1" AND �E1" DOINCLUDE MOLD MISMATCH AND ARE DETER−MINED AT DATUM PLANE −H−.

5. DIMENSION b1 DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE .005 TOTAL IN EXCESSOF THE b1 DIMENSION AT MAXIMUM MATERIALCONDITION.


7. DIMENSION A2 APPLIES WITHIN ZONE �J" ONLY.8. DIMENSIONS �D" AND �E2" DO NOT INCLUDE

MOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .003 PER SIDE. DIMENSIONS �D" AND �E2" DOINCLUDE MOLD MISMATCH AND ARE DETER−MINED AT DATUM PLANE −D−.

NOTE 7

c1F

ZONE J

E22X

A

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.078 .082 1.98 2.08

INCHES

A1 .039 .043 0.99 1.09

A2 .040 .042 1.02 1.07

D .416 .424 10.57 10.77

D1 .378 .382 9.60 9.70

D2 .290 .320 7.37 8.13

D3 .016 .024 0.41 0.61

E .436 .444 11.07 11.28

E1 .238 .242 6.04 6.15

E2 .066 .074 1.68 1.88

E3 .150 .180 3.81 4.57

E4 .058 .066 1.47 1.68

F

b1 .193 .199 4.90 5.06

c1 .007 .011 0.18 0.28

aaa

.025 BSC

.004

0.64 BSC

0.10

PIN 1PIN 2

PIN 3


2. GATE 3. SOURCE

E5

E5

E5 .231 .235 5.87 5.97

PLASTIC


SELECTOR GUIDE


CASE 1302-01ISSUE B

2


2. GROUND3. GROUND4. DELETED5. VDC6. DELETED7. GROUND8. GROUND9. RF OUTPUT

1 5 8 9

J

BS

RV

Q2X

MFM0.010 A MT

MAM0.020 T

N

G

U

C

LMAM0.010 Z T

MAM0.010 Z T

6−32UNC−2B2X

W

P

K

3 7

X

A

F

F

A

Z

Y2X

2X

D7X4X

E

E

T X

Z

NOTES:1. DIMENSIONS ARE IN INCHES.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

X

DIM

A

MIN MAX MIN MAX

MILLIMETERS

− − − 1.775 − − − 45.085

INCHES

B − − − 1.085 − − − 27.559

C − − − 0.840 − − − 21.336

D 0.015 0.021 0.381 0.533

E 0.465 0.510 11.811 12.954

F 0.300 0.325 7.62 8.255

G

J

K 0.315 0.355 8.001 9.017

L

N

P

Q 0.148 0.168 3.759 4.267

R − − − 0.600 − − − 15.24

S

U

V − − − 0.250 − − − 6.350

W 0.435 − − − 11.049 − − −

X

Y 0.152 0.163 3.861 4.140

Z 0.009 0.011 0.229 0.279

0.100 BSC

0.156 BSC

0.400 BSC

1.000 BSC

0.165 BSC

0.100 BSC

1.500 BSC

0.200 BSC

2.540 BSC

3.962 BSC

10.160 BSC

25.400 BSC

4.191 BSC

2.540 BSC

38.100 BSC

5.080 BSC




CASE 1311-03ISSUE E

QFN-32, 5x5 mm

N

PIN 1INDEX AREA

EXPOSED DIEATTACH PAD

2.95

25

8

1

32

3.25

32X 0.18

G

5

B

C0.1

2X

2X

C0.1

A 5

24

17

16 9

0.5

M0.1 C

M0.05 C

A B

32X0.5

C0.1 A B

C0.1 A B

M

M

VIEW M-M

NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS.2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.3. THE COMPLETE JEDEC DESIGNATOR FOR THIS

PACKAGE IS: HF−PQFP−N.4. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES ARE FORREFERENCE ONLY.

5. COPLANARITY APPLIES TO LEADS, CORNERLEADS, AND DIE ATTACH PAD.

6. FOR ANVIL SINGULATED QFN PACKAGES,MAXIMUM DRAFT ANGLE IS 12°.

0.25

28X

DETAIL MPIN 1 INDEX

1.0 1.00

0.05

C0.1

C0.05

C SEATING PLANE

5

DETAIL GVIEW ROTATED 90 CLOCKWISE°

(0.5)(0.25)

0.8 0.75

0.00

2.95

3.25

0.300.3

(1.73)

4

PREFERRED CORNER CONFIGURATIONDETAIL N

(0.25)

4

DETAIL NCORNER CONFIGURATION OPTION

0.60

DETAIL MBACKSIDE PIN 1 INDEX OPTION

DETAIL T

DETAIL TBACKSIDE PIN 1 INDEX OPTION

(90 )

2X

°

DETAIL MBACKSIDE PIN 1 INDEX OPTION

0.06532X

(45 )°

0.015

2X 0.390.31

0.24

0.10.0

1.6

0.4750.425

1.5 BACKSIDEPIN 1 INDEX

0.250.15R

0.600.24

DETAIL MPREFERRED BACKSIDE PIN 1 INDEX

DETAIL S

DETAIL SPREFERRED BACKSIDE PIN 1 INDEX

0.2170.137

(0.25)

0.2170.137

(0.1)


SELECTOR GUIDE


TO-272 WB-16

.224 BSC

CASE 1329-09ISSUE J

NOTES:1. CONTROLLING DIMENSION: INCH.2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M−1994.3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD

AND IS COINCIDENT WITH THE LEAD WHERE THELEAD EXITS THE PLASTIC BODY AT THE TOP OFTHE PARTING LINE.

4. DIMENSIONS "D" AND "E1" DO NOT INCLUDEMOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .006 (0.15) PER SIDE. DIMENSIONS "D" AND "E1"DO INCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

5. DIMENSIONS "b", "b1", "b2" AND "b3" DO NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE .005 (0.13)TOTAL IN EXCESS OF THE "b", "b1", "b2" AND "b3"DIMENSIONS AT MAXIMUM MATERIAL CONDITION.

6. HATCHING REPRESENTS THE EXPOSED AREA OFTHE HEAT SLUG.

7. DIM A2 APPLIES WITHIN ZONE "J" ONLY.

C

H

A

SEATING

PLANE

DATUM

PLANE

YY

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.100 .104 2.54 2.64

INCHES

M .600 − − − 15.24 − − −

N .270 − − − 6.86 − − −

D .928 .932 23.57 23.67

D1

E .551 .559 14.00 14.20

E1 .353 .357 8.97 9.07

b .011 .017 0.28 0.43

b1 .037 .043 0.94 1.09

b2 .037 .043 0.94 1.09

c1 .007 .011 .18 .28

e

r1 .063 .068 1.6 1.73

aaa

.054 BSC

.004

1.37 BSC

.10

e1 .040 BSC 1.02 BSC

e2 5.69 BSC

b3 .225 .231 5.72 5.87

c1

B

b3

AE1

r1

eD

4X b1

D1

E

10X b

PIN ONEINDEX

6Xe1

4Xe2

b2Maaa C A

Maaa C A

Maaa C A

Maaa C A

Maaa C A

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

M

N

VIEW Y-Y

.150 BSCe3 3.81 BSC

2Xe3

A1

A1 .038 .044 0.96 1.12

.810 BSC 20.57 BSC

NOTE 62X

B

ZONE "J"

A27

F .025 BSC 0.64 BSC

F

E1

E2 .346 .350 8.79 8.89

A2 .040 .042 1.02 1.07

E2

PLASTIC




TO-272 WB-16 Gull

ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ

.224 BSC

CASE 1329A-03ISSUE B




4. DIMENSIONS "D" AND "E1" DO NOT INCLUDEMOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .006 (0.15) PER SIDE. DIMENSIONS "D" AND "E1"DO INCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

5. DIMENSIONS "b", "b1", "b2" AND "b3" DO NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE .005 (0.13)TOTAL IN EXCESS OF THE "b", "b1", "b2" AND "b3"DIMENSIONS AT MAXIMUM MATERIAL CONDITION.

6. HATCHING REPRESENTS THE EXPOSED AREA OFTHE HEAT SINK.

DATUM

PLANE

YY DIM

A

MIN MAX MIN MAX

MILLIMETERS

.100 .104 2.54 2.64

INCHES

M .600 − − − 15.24 − − −

N .270 − − − 6.86 − − −

D .928 .932 23.57 23.67

D1

E .429 .437 10.90 11.10

E1 .353 .357 8.97 9.07

b .011 .017 0.28 0.43

b1 .037 .043 0.94 1.09

b2 .037 .043 0.94 1.09

c1 .007 .011 .18 .28

e

r1 .063 .068 1.6 1.73

aaa

.054 BSC

.004

1.37 BSC

.10

e1 .040 BSC 1.02 BSC

e2 5.69 BSC

b3 .225 .231 5.72 5.87

B

b3

AE1

eD

4X b1

D1

E

10X b

PIN ONEINDEX

6Xe1

4Xe2

b2Maaa C A

Maaa C A

Maaa C A

Maaa C A

Maaa C A

M

N

VIEW Y-Y

.150 BSCe3 3.81 BSC

2Xe3

A1 .001 .004 0.02 0.10

L1

LA1

GAGEPLANE

t

DETAIL Y

t 2 8 2 8

L .018 .024 4.90 5.06

L1

A2 .099 .110 2.51 2.79

.01 BSC 0.25 BSC

A2

C

H

c1

A

DETAIL Y

SEATINGPLANE

° ° ° °

.810 BSC 20.57 BSC

NOTE 6

2X r1B

E2

E2

E2 .346 .350 8.79 8.89

PLASTIC


SELECTOR GUIDE


TO-272-2

ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ

CASE 1337-03ISSUE B


PER ASME Y14.5M, 1994.3. DATUM PLANE −H− IS LOCATED AT THE TOP OF

LEAD AND IS COINCIDENT WITH THE LEADWHERE THE LEAD EXITS THE PLASTIC BODY ATTHE TOP OF THE PARTING LINE.

4. DIMENSIONS "D" AND "E1" DO NOT INCLUDEMOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .006 PER SIDE. DIMENSIONS "D" AND "E1" DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

5. DIMENSION "b1" DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE .005 TOTAL IN EXCESSOF THE "b1" DIMENSION AT MAXIMUM MATERIALCONDITION.


7. DIMENSION A2 APPLIES WITHIN ZONE "J" ONLY.8. CROSSHATCHING REPRESENTS THE EXPOSED

AREA OF THE HEAT SLUG.

H

C

A

B

SEATING

PLANE

DATUM

PLANE

2X b1

AE1

r1

DRAINLEAD

D

D1

E

NOTE 8

YY

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.100 .104 2.54 2.64

INCHES

A1 .039 .043 0.99 1.09

A2 .040 .042 1.02 1.07

D .928 .932 23.57 23.67

D1

E .438 .442 11.12 11.23

E1 .248 .252 6.30 6.40

F

b1 .193

c1 .007 .011 .18

r1 .063 .068 1.60

aaa

1

VIEW Y-Y

.810 BSC

.004

20.57 BSC

.10


2. GATE3. SOURCE

.025 BSC

.28

1.73

PIN 3

A1

A2

F

ZONE "J"

7

Baaa M C A

aaa M C A

2X

.199 4.90

0.64 BSC

5.05

c1

2

DRAIN ID

GATELEAD

E2

E2

E2 .241 .245 6.12 6.22

PLASTIC




CASE 1345-01ISSUE AQFN-12

LASER MARK FOR PIN 1IDENTIFICATION INTHIS AREA

G

1.0 1.00

0.05

3

B

C0.1

2X

2X

C0.1

A3 M

M

C0.1

C0.05

C SEATING PLANE

5

DETAIL GVIEW ROTATED 90 CLOCKWISE°


PER ASME Y14.5M, 1994.3. THE COMPLETE JEDEC DESIGNATOR FOR THIS

PACKAGE IS: HF−PQFP−N.4. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES ARE FORREFERENCE ONLY.

5. COPLANARITY APPLIES TO LEADS, CORNERLEADS, AND DIE ATTACH PAD.

(0.5)(0.24)

PIN 1 BACKSIDE IDENTIFIERDETAIL M

DETAIL S

DETAIL SPIN 1 BACKSIDE IDENTIFIER

(90 )

2X

2X

4

CORNER CONFIGURATIONDETAIL N

(0.18)

N


10

3

1

12

0.95

8X 0.5

9

7

6 4

M0.1 C

M0.05 C

A B

12X 0.75

C0.1 A B

VIEW M-M

DETAIL MPIN 1 IDENTIFIER

1.25

0.951.25 C0.1 A B

0.5

12X 0.30.18

(1.177)

(45 )

0.0650.015

(R0.09)3X

4X

8X

4X

12X

°

0.8 0.75

0.00

0.390.31

0.10.0

8X (0.777)

4X (0.25)

°


SELECTOR GUIDE


TO-272-8 Wrap

CASE 1366-04ISSUE C

NOTES:1. CONTROLLING DIMENSION: INCH .2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD


4. DIMENSION D AND E1 DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE PROTRUSION IS0.006 PER SIDE. DIMENSION D AND E1 DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.



L A1

�

c1

D

C

A

A

Maaa D

SEATING

PLANE

SEATING

PLANE

BE1

P

e4X

D

4X b2

D1

B

Maaa D B

Maaa D A

E

YY

A2

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.098 0.108 2.49 2.74

INCHES

A1 0.000 0.004 0.00 0.10

A2 0.100 0.104 2.54 2.64

D 0.928 0.932 23.57 23.67

D1

E 0.296 0.304 7.52 7.72

E1 0.248 0.252 6.30 6.40

L 0.060 0.070 1.52 1.78

b1 0.088 0.094 2.24 2.39

b2 0.066 0.072 1.68 1.83

c1 0.007 0.011 0.178 0.279

e

e1

0 6 0 6

aaa

1

2

3

5

6

7

0.104 BSC

�

0.004� �

2.64 BSC

0.10� �

4X

b1

b3 0.067 0.073 1.70 1.85

0.810 BSC 20.57 BSC

bbb 0.008 0.20

0.210 BSC 5.33 BSC

P 0.126 0.134 3.20 3.40

D2 0.608 BSC 15.44 BSC

E2 0.170 BSC 4.32 BSC

HDATUM

PLANE


4

2

1

6

5

7

VIEW Y-Y

3

8

bbb C

E2

D2A

DRAIN ID

B

48

B

2X

e14X

2X

b3(b1)


2. DRAIN3. DRAIN4. SOURCE (COMMON)5. SOURCE (COMMON)6. GATE7. GATE8. SOURCE (COMMON)

NOTE 6

E3

E3

E3 0.241 0.245 6.12 6.22

PLASTIC




CASE 1366A-02ISSUE A

TO-272-8


PER ASME Y14.5M, 1994.3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD PROTRUSION. ALLOWABLE PROTRUSIONIS 0.006 PER SIDE. DIMENSIONS "D" AND "E1" DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

4. DIMENSIONS "b" AND "b1" DO NOT INCLUDEDAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.005 TOTAL IN EXCESSOF THE "b1" AND "b2" DIMENSIONS AT MAXIMUMMATERIAL CONDITION.


6. DIMENSION A2 APPLIES WITHIN ZONE "J" ONLY.

A

Maaa D

B

E1

P

e4X

D

4X b2

D1

B

Maaa D B

Maaa D A

E

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.098 0.106 2.49 2.69

INCHES

A1 0.038 0.044 0.96 1.12

D 0.926 0.934 23.52 23.72

D1

E 0.492 0.500 12.50 12.70

E1 0.246 0.254 6.25 6.45

b 0.105 0.111 2.67 2.82

b1 0.088 0.094 2.24 2.39

c1 0.007 0.011 0.178 0.279

e

e1

aaa

1

2

3

5

6

7

0.104 BSC

0.004

2.64 BSC

0.10

4X

b1

b2 0.066 0.072 1.68 1.83

0.810 BSC 20.57 BSC

bbb 0.008 0.20

0.210 BSC 5.33 BSC

P 0.126 0.134 3.20 3.40

D2 0.608 BSC 15.44 BSC

E2 0.170 BSC 4.32 BSC


4

2

1

6

5

7

VIEW Y-Y

3

8

bbb C

E2

D2

A

DRAIN ID

B

48

B

2X

e14X

2X

b3


2. DRAIN3. DRAIN4. SOURCE (COMMON)5. SOURCE (COMMON)6. GATE7. GATE8. SOURCE (COMMON)

NOTE 5

D

A

SEATING

PLANE

YYA1

c1

e2 0.229 BSC 5.82 BSC

b3 0.067 0.073 1.70 1.85

b4 0.077 0.083 1.96 2.11

(b1)

3X b

Maaa D B

e23X

4X

ZONE "J"

6

F

A2A2 0.040 0.042 1.02 1.07

F 0.025 BSC 0.64 BSC

b4

PLASTIC


SELECTOR GUIDE


CASE 1383-02ISSUE A

7

B

0.1

A7

NOTES:1. CONTROLLING DIMENSION: MILLIMETERS.2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.3.

APPLIES TO ALL PAD LOCATIONS.

A

0

0.1

1.01 ± 0.1

0.5±0.05

03±0.05

BOTTOM VIEWB0.1 L CA

0.7 ± 0.05

2.37±0.05

0.5±0.05

0.5±0.050.8±0.05

1.2±0.05

2.9

0.97

2.4

3.152.4

1.65

1.032.8

2.4

2.55

0.07

1.02

1.77

2.52

3.15

2.2

0.3

0.7

2.24

3.15

2.215

0.5±0.05 SQ

0.8±0.05

9X

PIN ONEIDENT

1±0.05

0.5±0.05

2.45±0.052.95±0.05

7x7 mm Module




CASE 1404-01ISSUE OPlastic

SOT-343R

ÉÉÉÉÉÉÇÇÇÇÇÇ

ÉÉÉÉÉÉ

AM0.10 BC

A

NOTES:1. DIMENSIONS ARE IN MILLIMETERS.2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.3. DIMENSION AT DATUM A AND B DOES NOT

INCLUDE MOLD FLASH, PROTRUSIONS OR GATEBURRS.

4. DIMENSION AT DATUM A AND B ARE DETERMINEDAT THE OUTMOST EXTREMES OF THE PLASTICBODY EXCLUSIVE OF MOLD FLASH, TIE BARBURRS, GATE BURRS AND INTERLEAD FLASH, BUTINCLUDING ANY MISMATCH BETWEEN THE TOPAND BOTTOM OF PLASTIC BODY.


6. THESE DIMENSIONS APPLY TO THE FLAT SECTIONOF THE LEAD BETWEEN 0.08mm AND 0.15mm FROMTHE LEAD TIP.

0.10 C

1.15

0.15

1.3

VIEW CB

B 0.35

0.080.40

0.25

SECTION B-B(SEE NOTE 6)

BASE METAL

WITH PLATING

3X4X

2X 2 TIPS

0.35B

PIN 1 IDENTIFIERIN THIS ZONE

3

2

1

4

1.0

0.1

1.1 MAX4X

SEATING PLANE

10

(0.425)

C

SEATING PLANE

0.46/0.26

VIEW C

2.2

4°°

80

°°

4X104

°°

0.10

0.200.25

0.25

0.0

0.8

0.25

AM0.15 BC

0.65

0.5

2.0

0.65/0.55(0.70/0.55 WITH PLATING)

AM0.10 BC

1.351.15

2.11.9


SELECTOR GUIDE


B

3

3

A

2X

0.1 C

C0.1

2X

PIN 1 INDEXAREA


10 12

6 4

9

7

1

3

0.10

8X 0.512X

9

DETAIL G

M

M

1.551.25

1.551.25

0.300.18

12X

DETAIL M

DETAIL N

PIN 1 INDEX

0.750.50

C A B

VIEW M - M

M

NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS.2. INTERPRET DIMENSIONS AND

TOLERANCES PER ASME Y14.5M, 1994.3. THE COMPLETE JEDEC DESIGNATOR FOR

THIS PACKAGE IS: HF−PQFP−N.4. FOR ANVIL SINGULATED QFN PACKAGES,

MAXIMUM DRAFT ANGLED IS 12 .5. PACKAGE WARPAGE MAX 0.05 MM.6. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES AREFOR REFERENCE ONLY.

7. CORNER LEADS CAN BE USED FORTHERMAL OR GROUND AND ARE TIED TOTHE DIE ATTACH PAD. THESE LEADS ARENOT INCLUDED IN THE LEAD COUNT.

8. COPLANARITY APPLIES TO LEAD, CORNERLEADS, AND DIE ATTACH PAD.

9. THIS DIMENSION APPLIES TO PLATEDTERMINAL AND IS MEASURED BETWEEN0.20 MM AND 0.25 MM FROM TERMINAL TIP.

�

CASE 1483-01ISSUE OQFN 3x3 Page 1 of 3




CASE 1483-01ISSUE OQFN 3x3

6

DETAIL NPREFERRED CORNER CONFIGURATION

6

DETAIL NCORNER CONFIGURATION

�(45 )

(0.25) (0.25)

0.600.24

0.600.24

Page 2 of 3

8

DETAIL GVIEW ROTATED 90 CW

1.00.8

�

1.000.75

0.050.00 SEATING

PLANEC

0.1

0.05

C

C


SELECTOR GUIDE


CASE 1483-01ISSUE OQFN 3x3

Page 3 of 3

�(45 )

DETAIL MPREFERRED BACKSIDE PIN 1 INDEX

0.650.30

TIE BAR MARK OPTION7

PIN 1 ID

4X 0.230.13

4X

(0.35)

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

DETAIL S

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

(0.45)

PIN 1 IDR0.2

DETAIL SBACKSIDE PIN 1 INDEX

0.2170.137

(0.25)

0.2170.137

(0.1)

(0.25)




ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ

CASE 1484-02ISSUE A




4. DIMENSIONS "D" AND "E1" DO NOT INCLUDEMOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .006 PER SIDE. DIMENSIONS "D" AND "E1" DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE −H−.

5. DIMENSION "b1" DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE .005 TOTAL IN EXCESSOF THE "b1" DIMENSION AT MAXIMUM MATERIALCONDITION.


7. DIMENSION A2 APPLIES WITHIN ZONE "J" ONLY.8. HATCHING REPRESENTS THE EXPOSED AREA OF

THE HEAT SLUG.

DATUM

PLANE

YY

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.100 .104 2.54 2.64

INCHES

D2 .600 − − − 15.24 − − −

E2 .270 − − − 6.86 − − −

D .928 .932 23.57 23.67

D1

E .551 .559 14 14.2

E1 .353 .357 8.97 9.07

b1 .164 .170 4.17 4.32

c1 .007 .011 .18 .28

e

r1 .063 .068 1.60 1.73

aaa

.106 BSC

.004

2.69 BSC

.10

BA

E1

D

4X b1

D1

E

GATE LEAD

Maaa C A

Maaa C A

D2

E2

VIEW Y-Y

4Xe

A1 .039 .043 0.99 1.09

F

A2 .040 .042 1.02 1.07

.025 BSC 0.64 BSC

A1

C

H

c1

A

ZONE J

SEATINGPLANE

.810 BSC 20.57 BSC

PIN 5

2X r1B

DRAIN LEAD

F

A2

7

NOTE 8

1

2

3

4



E3

E3

E3 .346 .350 8.79 8.89

TO-272 WB-4PLASTIC


SELECTOR GUIDE


CASE 1486-03ISSUE B

DATUM

PLANE

BOTTOM VIEW

A1

2X

D1

E3

E1

D3

E4

A2

PIN 5

NOTE 8

AB

C

H

DRAIN LEAD

D

AMaaa C

4Xb1

2XD2


PER ASME Y14.5M−1994.3. DATUM PLANE −H− IS LOCATED AT THE TOP OF

LEAD AND IS COINCIDENT WITH THE LEADWHERE THE LEAD EXITS THE PLASTIC BODY ATTHE TOP OF THE PARTING LINE.

4. DIMENSIONS �D" AND �E1" DO NOT INCLUDEMOLD PROTRUSION. ALLOWABLE PROTRUSIONIS .006 PER SIDE. DIMENSIONS �D" AND �E1" DOINCLUDE MOLD MISMATCH AND ARE DETER−MINED AT DATUM PLANE −H−.

5. DIMENSION �b1" DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE .005 TOTAL IN EXCESSOF THE �b1" DIMENSION AT MAXIMUM MATERIALCONDITION.


7. DIMENSION A2 APPLIES WITHIN ZONE �J" ONLY.8. HATCHING REPRESENTS THE EXPOSED AREA

OF THE HEAT SLUG.

c1F

ZONE J

E22X

A

DIM

A

MIN MAX MIN MAX

MILLIMETERS

.100 .104 2.54 2.64

INCHES

A1 .039 .043 0.99 1.09

A2 .040 .042 1.02 1.07

D .712 .720 18.08 18.29

D1 .688 .692 17.48 17.58

D2 .011 .019 0.28 0.48

D3 .600 − − − 15.24 − − −

E .551 .559 14 14.2

E1 .353 .357 8.97 9.07

E2 .132 .140 3.35 3.56

E3 .124 .132 3.15 3.35

E4 .270 − − − 6.86 − − −

F

b1 .164 .170 4.17 4.32

c1 .007 .011 0.18 0.28

e

.025 BSC

.106 BSC

0.64 BSC

2.69 BSC

1



aaa .004 0.10

GATE LEAD

4Xe

2XE

SEATING

PLANE

4

23

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

NOTE 7

E5

E5

E5 .346 .350 8.79 8.89

TO-270 WB-4PLASTIC





Y14.5M, 1994.2. CONTROLLING DIMENSION: INCH.3. DIMENSION H IS MEASURED .030 (0.762) AWAY

FROM PACKAGE BODY.

DIM

A

MIN MAX MIN MAX

MILLIMETERS

0.948 0.958 24.08 24.33

INCHES

B 0.680 0.690 17.27 17.53

C 0.147 0.182 3.73 4.62

D 0.055 0.065 1.40 1.65

E 0.035 0.045 0.89 1.14

F

G 0.803 BSC 20.40 BSC

H

0.315 BSC 8.00J

0.057 0.067 1.45 1.70

K 0.095 0.125 2.41 3.18

M

N

Q 0.092 0.112 2.34 2.84

R 0.678 0.692 17.22 17.58

S 0.680 0.690 17.27 17.23

aaa 0.004 0.10

bbb 0.015 0.38

STYLE 1:PIN 1. GATE

2. DRAIN 3. SOURCE

CASE 1490-01ISSUE O

0.003 0.006 0.08 0.15

0.595 0.605 15.11 15.37

0.594 0.606 15.09 15.39

G

1

2

3

JB(FLANGE)

K

S (INSULATOR)

R (LID)

F

M (INSULATOR)

N (LID)

A(FLANGE)

C

HE

aaa M T A M

B

B M

D2X

Q4X

aaa M T A M B M

A

aaa M T A M B M

T SEATING

PLANE

bbb M T A M B M

aaa M T A M B M

bbb M T A M B M

HF-600


SELECTOR GUIDE


2X 4 TYPE.P.

2X R0.20

SEATING PLANE

4X

C

0.10 C

1.50

1.50

0.460.40

1.701.40

2X 4 TYP

1.351.25

0.650.55

1.651.55

CASE 1514-01 ISSUE A

°

°

3

0.15 M AC B

3 4

A4.704.40

0.600.40

B

2.702.40

1.300.70

4

5

0.480.38

0.580.48

1 2 3

0.480.38

4.503.70

2X

2X R0.15 TYP

1.871.79

0.15 M AC B

0.15 M AC B

0.20 M C B

BOTTOM VIEW


5. GROUND 6. RF OUTPUT

STYLE 2:PIN 1. GATE

2. SOURCE 3. DRAIN

NOTES:1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2. ALL DIMENSIONS ARE IN MILLIMETERS.3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS

OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATEBURRS SHALL NOT EXCEED 0.5MM PER END. DIMENSION DOESNOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEADFLASH OR PROTRUSION SHALL NOT EXCEED 0.5MM PER SIDE.

4. DIMENSIONS ARE DETERMINED AT THE OUTMOST EXTREMESOF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BARBURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDINGANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THEPLASTIC BODY.

5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.

0.15 M AC B

SOT-89




B

5

2.5

5

0.15 C

2X

0.15 C

2X

PIN 1 INDEX

DETAIL G

M

M

2.21.8

AM0.1 BC

1

13

14 16

9

8 6

5

1

8X0.8

2.21.8

AM0.1 BC

1.2012X0.95

0.1 M AC B

0.05 M C

0.6212X0.48

1


DETAIL M

C

0.05 C

16X

4

SEATING PLANE

0.1 C

2.22.0

2.201.95

2.201.95 (0.8)

(0.55)

0.70.3

0.1 M AC B

0.05 M C

0.920.78

(0.2)(0.2)

0.1 M AC B

0.05 M C

0.920.78

0.3712X0.23

0.70.3

(0.05)12X

NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. DIMENSIONING AND TOLERANCING PER ASMEY14.5M, 1994.

3. THE COMPLETE JEDEC DESIGNATOR FOR THISPACKAGE IS: HF−PQFP−N.

4. COPLANARITY APPLIES TO LEADS AND DIEATTACH PAD.

5. MINIMUM METAL GAP SHOULD BE 0.25MM

VIEW M - M

DETAIL MCORNER CONFIGURATION

DETAIL GVIEW ROTATED 90� CLOCKWISE

CASE 1543-02ISSUE A

PQFN 5x5


SELECTOR GUIDE

SELECTOR GUIDE PRODUCT INDEX

PageDevice Number Number

MBC13720 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MBC13900 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MBC13916 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC13191 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC13192 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC13770 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC144110 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC144111 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC145026 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC145027 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC145028 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC145151-2 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC145152-2 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC145170-2 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL18336 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL18926 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL19338 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL19926 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL19936 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL21336 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL9236 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL9236M 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL9318 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHL9838 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHPA18010 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHPA19010 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHPA21010 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHVIC2114R2 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHVIC2115R2 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHVIC910HR2 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHVIC915R2 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1223LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1224LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1244 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1253LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1254L 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1254LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1303LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1304LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1345 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1346 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


MHW1353LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW1354LA 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW6342T 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7182B 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7185C 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7185CL 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7205C 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7205CL 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7222B 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7242A 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7272A 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7292A 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW7342 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8182B 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8185 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8185L 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8188A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8202B 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8205 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8205L 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8207A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8222B 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8227A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8242A 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8247A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8267A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8272A 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW8342 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9146 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9182B 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9186 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9187 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9188 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9188A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9189 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9189A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9206 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9207A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9227 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9227A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9236 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



Selector Guide Product Index (continued)


MHW9242A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9247 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9247A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9267 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9267A 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MHW9276 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG1001R2 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG2001R2 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG2401 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG3001NT1 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG3002NT1 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG3003NT1 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG3005T1 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMG5004 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMM5063 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1511T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1513T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1517T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1518T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1535FT1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1535T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1550FT1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1550T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1570FT1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF1570T1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18030ALR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18030ALSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18030BLR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18030BLSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18060ALSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18060AR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18060ASR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18060BLSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18060BR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18060BSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18085ALSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18085AR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18085BLSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18085BR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18090AR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18090BR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF18090BSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


MRF19030LR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19030LSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19045LR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19045LSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19060R3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19060SR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19085LR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19085LSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19085R3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19085SR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19090R3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19090SR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF19125R3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21010LR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21010LSR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21030LR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21030LSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21045LR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21045LSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21060R3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21060SR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21085LSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21085R3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21085SR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21090R3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21090SR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21120R6 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21125R3 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21125SR3 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF21180R6 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF281SR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF281ZR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF282SR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF282ZR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF284LR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF284LSR1 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF372 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF372R5 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF373ALR1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF373ALSR1 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF374A 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF377 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


SELECTOR GUIDE



MRF377R3 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF377R5 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5P20180R6 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5P21180HR6 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5P21240R6 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19060N 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19060NB 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19090LR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19090LSR3 18. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19100HR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19100HSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19130R3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19130SR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19150R3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S19150SR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21090LR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21090LSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21100HR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21100HSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21130HR3 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21130HSR3 20. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21150R3 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S21150SR3 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9070NR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9100MBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9100MR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9100NBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9100NR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9101MBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9101MR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9101NBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF5S9101NR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6522-70R3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6P21190H 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6P27160H 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S18060N 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S18060NB 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S18090N 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S18090NB 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19060N 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19060NB 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19100H 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


MRF6S19100HS 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19100N 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19100NB 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19140H 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S19140HS 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21060N 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21060NB 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21100HR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21100HSR3 19. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21100N 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21100NB 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21140H 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S21140HS 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S27085H 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF6S27085HS 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9002R2 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9030LR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9030LSR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9030MBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9030MR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9045LR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9045LSR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9045MBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9045MR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9060LR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9060LSR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9060MBR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9060MR1 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9080LSR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9080R3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9085LSR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9085R3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9100R3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9100SR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9120R3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9130LR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9130LSR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9135LR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9135LSR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9180R6 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9200LR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRF9200LSR3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .




PageDevice Number NumberMRF9210R3 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRFG35003M6T1 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRFG35003MT1 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRFG35005MT1 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRFG35010 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRFG35010MT1 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MRFG35030R5 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MW4IC001MR4 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MW4IC2020GMBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . .

PageDevice Number NumberMW4IC2020MBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MW4IC2230GMBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . .

MW4IC2230MBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MW4IC915GMBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . .

MW4IC915MBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MW5IC2030GMBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . .

MW5IC2030MBR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MWIC930GR1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MWIC930R1 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


SELECTOR GUIDE

END OF LIFE PRODUCT INDEX

Freescale Semiconductor follows the industry standard�EIA-724 Product Life Cycle Data Model� to track the life cycleof its product. This model tracks the product�s life cycle from�Product Newly Introduced� to �Product Phase Out.� Productscan be phased for a variety of reasons: improved productperformance, change in technology roadmap, processobsolescence, market decline, etc. When products are

discontinued, a suggested possible replacement device or analternative source of supply for discontinued devices aremade available when possible.

For a list of discontinued devices with possible alternativesuppliers, please contact your local Freescale sales office orauthorized distributor, or visit the following URL:

http://www.motorola.com/rf

Wireless Infrastructure RF Products

Product Last Order Date Last Ship Date Possible Replacement

Not Recommended for New Design

MHW1224 � � MHW1224LA

MHW1304L � � MHW1304LA

MRF18090ASR3 � � MRF18085ALSR3

MRF19120 � � MRF5S19130R3

MRF19125SR3 � � MRF19125R3 or MRF5S19130SR3

End of Life

CA2810C Past Past MHW6342T

CA2830C Past Past MHW6342T

CA2832C Past Past None

CA901 Past Past MHW8182B

CA901A Past Past MHW8182B

CA922 Past Past MHW8185

CA922A Past Past MHW8185

MHL8018 Past Past None



MHVIC1905R2 � � MW4IC2020GMBR1

MHW1810-001 Past Past MW4IC2020MBR1



MHW5182A Past Past MHW7182B

MHW5222A Past Past None

MHW6181 Past Past MHW7182B

MHW6182 Past Past MHW7182B

MHW6272 Past Past MHW7272A

MHW7222A Past Past MHW7222B

MHW7292 Past Past None

MHW8185LR Past Past None

MHW8185R Past Past None

MHW8205R Past Past None


MHW910 Past Past MHVIC910HR2



END OF LIFE PRODUCT INDEX � continued


End of Life - continued


MRF1507T1 Past Past MRF1511T1 or MRF1517T1

MRF182 Past Past MRF9030LR1

MRF182R1 1/31/04 7/31/04 MRF9030LR1

MRF182LSR1 1/31/04 7/31/04 MRF9030LSR1

MRF182SR1 Past Past MRF9030LSR1


MRF183R1 1/31/04 7/31/04 MRF9045LR1

MRF183S Past Past MRF9045MR1 or MRF9045LSR1

MRF183SR1 Past Past MRF9045MR1 or MRF9045LSR1

MRF183LSR1 1/31/04 7/31/04 MRF9045MR1 or MRF9045LSR1


MRF184SR1 Past Past MRF9060LSR1 or MRF9060MR1

MRF184R1 1/31/04 7/31/04 MRF9060LR1

MRF184LSR1 1/31/04 7/31/04 MRF9060LSR1 or MRF9060MR1

MRF185 1/31/04 7/31/04 MRF9080R3

MRF186 1/31/04 7/31/04 MRF9120R3

MRF187 1/31/04 7/31/04 MRF9085R3

MRF187S Past Past MRF9085LSR3

MRF187SR3 1/31/04 7/31/04 MRF9085LSR3

MRF1946 Past Past MRF1535T1

MRF1946A Past Past MRF1535T1

MRF18090AS 12/31/03 6/30/04 MRF18085ALSR3

MRF19120S � � MRF5S19130SR3

MRF19125S 12/31/03 6/30/04 MRF19125R3 or MRF5S19130SR3

MRF20030R Past Past MRF19030LR3

MRF20060R Past Past MRF19060R3

MRF20060RS Past Past MRF19060R3

MRF21120S Past Past MRF21120R6

MRF21180S � � MRF21180R6 or MRF5P21180HR6


MRF2628 Past Past None

MRF373 1/31/04 7/31/04 MRF373ALR1

MRF373R1 1/31/04 7/31/04 MRF373ALR1

MRF373S Past Past MRF373ALSR1

MRF373LSR1 1/31/04 7/31/04 MRF373ALSR1

MRF374 1/31/04 7/31/04 MRF374A






SELECTOR GUIDE

END OF LIFE PRODUCT INDEX � continued


End of Life - continued





MRF6522-060 1/31/04 7/31/04 MRF9060LR1

MRF6522-10R1 1/31/04 7/31/04 MRF282SR1

MRF6522-5R1 1/31/04 7/31/04 MRF282ZR1 or MRF9002R2

MRF652S Past Past MRF1518T1


MRF857S Past Past MRF9002R2

MRF897 Past Past MRF9045LSR1

MRF897R Past Past MRF9045LR1


MRF899 Past Past MRF9180R6

MRF9120S � � MRF9120R3 or MRF9130LR3

MRF9180S � � MRF9180R6

MRFIC1501R2 1/9/04 7/9/04 None

TPV8100B Past Past None

For information on Wireless RF and IF handset products, see After Market Support at the following URL:http://www.motorola.com/rf



AFTER MARKET SUPPORT

For a list of discontinued devices with possible alternativesuppliers, please contact your local Freescale Semiconductorsales office or authorized distributor, or visit the following URL:

http://www.motorola.com/rfFor Wireless Infrastructure products transferred to another

manufacturer, see the list of Wireless Infrastructure RF

products below. After market support on these parts isavailable through M/A-COM. For additional information,contact M/A-COM Customer Service at (310) 320-6160 x354 (voice), [email protected] (email) or (310)618-9191 (FAX).

2N6439 MRF137 MRF171A MRF317

MRF10005 MRF140 MRF173 MRF321

MRF1000MB MRF141 MRF173CQ MRF323

MRF10031 MRF141G MRF174 MRF327

MRF1004MB MRF148A MRF175GU MRF392

MRF10120 MRF150 MRF175GV MRF393

MRF10150 MRF151 MRF175LU MRF421

MRF10350 MRF151G MRF176GU MRF422

MRF10502 MRF154 MRF176GV MRF426

MRF1090MA MRF157 MRF177 MRF428

MRF1090MB MRF158 MRF275G MRF429

MRF1150MA MRF160 MRF275L MRF448

MRF1150MB MRF16006 MRF3104 MRF454

MRF134 MRF16030 MRF313 MRF455

MRF136 MRF166C MRF314 MRF587

MRF136Y MRF166W MRF316


SELECTOR GUIDE

How to Reach Us:

USA/Europe/Locations Not Listed:Freescale Semiconductor Literature Distribution CenterP.O. Box 5405Denver, Colorado 802171-800-521-6274 or 480-768-2130

Japan:Freescale Semiconductor Japan Ltd.Technical Information Center3-20-1, Minami-Azabu, Minato-kuTokyo 106-8573, Japan81-3-3440-3569

Asia/Pacific:Freescale Semiconductors Hong Kong Ltd.Silicon Harbour Centre2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong852-26668334

Home Page:http://motorola.com/semiconductors

Information in this document is provided solely to enable system andsoftware implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to designor fabricate any integrated circuits or integrated circuits based on theinformation in this document.

Freescale Semiconductor reserves the right to make changes withoutfurther notice to any products herein. Freescale Semiconductor makes nowarranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductorassume any liability arising out of the application or use of any product orcircuit, and specifically disclaims any and all liability, including withoutlimitation consequential or incidental damages. ìTypicalî parameters that may be provided in Freescale Semiconductor data sheets and/orspecifications can and do vary in different applications and actualperformance may vary over time. All operating parameters, includingìTypicalsî, must be validated for each customer application by customerístechnical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductorproducts are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, orother applications intended to support or sustain life, or for any otherapplication in which the failure of the Freescale Semiconductor productcould create a situation where personal injury or death may occur. ShouldBuyer purchase or use Freescale Semiconductor products for any suchunintended or unauthorized application, Buyer shall indemnify and holdFreescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages,and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges thatFreescale Semiconductor was negligent regarding the design or manufacture of the part.

Freescaleô and the Freescale logo are trademarks ofFreescale Semiconductor, Inc. All other product or service namesare the property of their respective owners.

© Freescale Semiconductor, Inc. 2004

xxxxxx/DRev. 0xx/2004

FOR USE BEFORE IPO

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