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http://www.nonmet.mat.ethz.ch/research/onebatWP 3: Thermal SystemStrictly Confidential 1
Workpackage 3: Thermal System
Project Meeting, May 11, 2006
P. Müller, A. Bolleter, M. Roos, A. Bernard
NTBINTERSTAATLICHE HOCHSCHULEFÜR TECHNIK BUCHS
NMW
http://www.nonmet.mat.ethz.ch/research/onebatWP 3: Thermal SystemStrictly Confidential 2
Outline
▪ Overview Work Package and Concept
▪ Thermal Demonstrator and measured Temperature Distribution
▪ Comparison with Simulation
▪ Modified Concept
▪ New Power Ranges
▪ Next Steps and Summary
http://www.nonmet.mat.ethz.ch/research/onebatWP 3: Thermal SystemStrictly Confidential 3
Overview Workpackage 3
Thermal System
concept, fabrication &measurement
concept, simulation
NMW
NTBINTERSTAATLICHE HOCHSCHULEFÜR TECHNIK BUCHS
design, simulation, measurement design, fabricationdesign, fabrication
CathodeElectrolyte
Anode
Air
Fuel
Reformer
Heat exchangerPost
combustion
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Project Management
Thermal System
Fuel Cell
Gas Processing
WP 3: Year 1 Milestones
• performance 200 mW/cm2 @ 550°C• external electrical connections
• thermal insulation concept with Tinside 550°C, Toutside 50°C, <10 cm3
• structures for validation critical points• thermal system demonstrator with simulated 2 W heat source
• butane conversion rate > 90%• post-combustor with gas oxidation
> 98%
• battery expert• industrial partner
http://www.nonmet.mat.ethz.ch/research/onebatWP 3: Thermal SystemStrictly Confidential 5
Main Achievements
Simulation validated with Thermal Demonstrator.
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Overview Concept and Simulation
Thickness of Stack [mm]
Sta
ck t
em
pe
ratu
re [
°C]
Stack
Heat Exchanger
Insulation
Stack Heat Exchanger
Insulation
Thickness heat exchanger (Mica) [mm]
Sta
ck R
ad
ius
[mm
]
Distribution Heat Flow
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Demonstrator with Resistance Heat SourceFoturan Dummy-Stack
MICA
Insulation Element
Contact Heater
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Measured Temperature distribution
Insulation thickness: Microtherm 6 mmConstant Heating Power: 2 W
350°C
40°C
7 min for constant temperature
Stack temperature 350 °C and 40°C in surrounding area
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Temperatures with different Insulations
Aerogel 10 mm, Mica 70 µm
Microtherm 21 mm, Mica 50 µm
Microtherm 6 mm , Mica 50 µm [°C]
Thicker insulation does not change the stack temperature
With transparent Aerogel lower stack temperature
40
43
38
30
23
35
295
369
349
Constant Heating Power: 2 W
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Simulation of Demonstrator: Temperature Distribution 1
Microtherm thickness 6 mm with radiation and MICA 0.5 W/mK
Microtherm thickness 6 mm no radiation and MICA 0.5 W/mK
395 °C 750 °C
40°C 40°C
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Simulation of Demonstrator: Temperature Distribution 2
Microtherm thickness 6 mm with radiation and MICA 0.5 W/mK
Microtherm thickness 6 mm with radiation and MICA 4 W/mK
364 °C395 °C
40°C 40°C
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Comparing Demonstrator with Concept
Difference of demonstrator to thermal concept- Channel height- Radiation in concept along channel not considered- Gas flow in the channels (Manufacturing)
Conclusion- Measurement correlates with simulation (demonstrator)- Thermal conductivity of mica has influence on stack temperature- Radiation along channel has strong influence on stack temperature
Modification of concept needed
Demonstrator Thermal Concept µSOFC
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Modification of Concept
Advantages:- Fabrication, mica no bonding needed- Reduced thermal strain- Reduced thermal radiation
Disadvantages:- Heat exchanger performance lower- Pressure drop higher
Stack
Fuel Supply
MICA Heat Exchanger Air
Temperature Distribution
550°C 220°C
40°C
First result, research going on
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New Power-Range
Basic Scaling Properties (first design approach)
• Stack structure is modular
• Stacking of units is “Milli”-scopic (=conventional technology)
• Thermal System not scalable: Adaptation of concept necessary
• Thermal Management comparably simpler (surface to power ratio)
Main Issues to be solved
• Adapted concepts of insulation for each power range
• Fabrication: concept of “modular” system (planar technology)
• Layout and Manufacturing of gas and air channels, electric connection
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Validation of Milestones and Deliverables
• WP 3.2 Fabrication Concept of Thermal System
Month 6: test structures for validation of critical points of the concept (T
diff. 500°C) (NTB)
Month 12: thermal system design demonstrator with simulated heat sources
(dummy stack, reformer, post-combustor) (NTB)
• WP 3.1 Thermal System Design
Month 3: thermal insulation concept (Tinside = 550°C, Toutside = 50°C) (ZHW)
Month 12: system integration concept incl. thermal management concept heat
exchanger design compatible with GPU designs and micro-fabrication (ZHW)
Deliverables:
Month 3: design from ZHW NTB for fabrication
Deliverables:
Month 6: first samples of GPU from NTB LTNT for testing
Specification to be revised
Specification to be revised
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Summary
▪ Thermal Demonstrator shows 350 °C with 2 W
▪ Consistent between Simulation and Measurement
▪ Modification and Adaptation of Thermal Concept
▪ First Approach for New Power Ranges
▪ Revision of Specification needed (Reformer)
▪ Initiation of new Work Package System Development
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Next steps (Year 2)
WP 4.1
• System Concept development
WP 4.2
• Concept First order packaging
• Concept Second order packaging
WP 3.1
• Proof of modified Concept
• Concept adaptation to new power range
• Integration of reformer and PC into hot module
WP 3.2
• Validation of adapted concept
Thermal Management
System Development
NMWNTB
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Next steps (Year 3 / 4)NMW
NTB
WP 3.1
• Transient simulation of thermal system
• Analyze system design for thermal stress
• Increase the level of detail in the thermal mode
Thermal Management
System Development
WP 4.1
• System Control definition
• System Design development
WP 4.2
• Manufacturing strategy development
• Build up a System Demonstrator