ir presentation 3q ir...confidential and proprietary 240 opo-ro, opo-eup, gwangju-si gyeonggi-do,...

Confidential and Proprietary

www.jusung.com

240 Opo-ro, Opo-eup, Gwangju-si

Gyeonggi-do, Korea

World 1St Technology

Only 1 In The World

IR Presentation

September, 2015

0


1

Table of Contents

1. 회사 소개

2. Market Trend 및 미래 경쟁력

3. 재무 현황


1-1. Vision

Culture Spirit

Innovate Technology!

Create New Industry!

Make Happiness!

2


1-2. Mission

First Mover & Market Developer

Semiconductor, Display, Solar Cell Technology Integration

World’s 1 Technology

Only 1 in the World

st

3


1-3. Spirit & Culture

Think for the First !

Work for the No.1 !

Make New Records !

1. 창조·혁신적 사람

4

2. 성공 공유의 문화

고객의 성공을 통한

동반성장과 행복 창출


5

1-4. Campus Map

창조적 혁신기술로 명품을 만드는 기업!


1-5. 성장 동력

지속 성장 동력 = 창조적 R&D

46.0% 47.9% 46.4% 41.8%

66.0%

10%15%20%25%30%35%40%45%50%55%60%65%70%

2010 2011 2012 2013 2014

R&D 인력 비율 R&D 투자 금액 (누적 합계)

0

1000

2000

3000

4000

5000

6000

'95

'96

'97

'98

'99

'00

'01

'02

'03

'04

'05

'06

'07

'08

'09

'10

'11

'12

'13

'14

5,074 억원

등록 특허 수

1,573 1,667 1,723 1,739

1,875

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2,000

2010 2011 2012 2013 2014

6


1-6. 차세대 핵심기술 융합 경쟁력

4대 핵심 산업의 융합 기술 경쟁력

1. Semiconductor

(Core Technologies)

2. Display(LCD & OLED)

3. Solar Cell 4. OLED Lighting

Light Emitting PV Electricity

Technology

7


8개의 세계 최초 기술 & 제품 !

Korea First

1995 2001 2002 2005 2006 2009 2010 2011 2012 2014 2013

World’s First

Warm Wall Type

UHV- CVD

Korea First

Dry Etcher

& Asher

World’s First

Selective EPI

PE-CVD

World’s First

SD-CVD (ALD)

World’s First

Local Space

Plasma Tech.

Korea First

LED MO-CVD

World’s First

IGZO-CVD

OLED Lighting

Total Solution

World’s First

SDP-CVD

World’s First

LSP-CVD

World’s First

TSD-CVD

Business Area

Solar Total

Solution

(c-Si, J-Cell, TF)

Only One Only One

1-7. 세계 최초 기술 & 제품

8


1-8. 세계 최초∙1등 기술로 고객과 성공 공유

■ 세계 최초∙최고 기술로 전세계 16개국 78개 고객과 동반성장

Outstanding

Contribution Award 우수협력사 감사패 Best Partner Award

Best Supplier

Award 우수협력사 감사패 Outstanding Contribution Award

우수협력사 감사패

◆

◆

◆

우수협력업체상

본사(HQ)

해외 현지 법인

지역 판매 대리점

영업 에이전트

9


10

Table of Contents

1. 회사 소개


3. 재무 현황


2-1. 반도체_Tech Roadmap

11

반도체 디바이스 미세화에 따른 DPT 스텝의 증가 반도체 디바이스 미세화 → 2Xnm ~ 1Xnm

Source : Gartner Source : Gartner

2012 2013 2014 2015 2016

1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q

28 25 20 1X

29 25 21

30 25 20 2

4

5

7

9

0

1

2

3

4

5

6

7

8

9

10

30nm 2Xnm 2Ynm 2Znm 1Xnm

DPT Steps

Number of DPT steps

with DRAM Tech Migration

Tech Migration Roadmap of DRAM

Manufacturers


NAND Tech (2D → 3D) : ALD Step ( 3~4 layer → 12~13 layer)

0 0.4 5.2

30.2

49.8

65.2

0

20

40

60

80

100

2012 2013 2014 2015 2016 2017

3D

Ma

rke

t S

ha

re (

%)

Source : 2013.10 IHS Inc. Source : 2013.08 Flash Memory Summit

2-1. 반도체_3D NAND Flash Era for Future

NAND Flash Technology Trend Global Forecast

3D NAND’s Share of Total NAND Flash

12


Defects Control

*TAT 감소

공정 스텝 단순화

Customer Requirement JUSUNG System

1. Defects Control

1) In Chamber Native Oxide Control

2) Incubating Time Control

3) Interface Control

4) Cross Contamination Zero

5) Particle Zero

6) Thermal & Plasma Damage Zero

7) Stress Control

2. TAT 감소

3. 공정 스텝 단순화

Inn

ov

ati

ve

Tech

no

log

y

2-1. 반도체_Customer Challenges

*TAT : Turn Around Time

13


14

2-1. 반도체_주성 LSP Technology

SDP System (Space Divided Plasma)

:Semi-Batch Type

TSD System (Time Space Divided)

: Single Type

LSP Technology (Local Space Plasma)

① Interface Control

② Incubation Time Control

③ Thermal & Plasma Damage Free

④ Easy System / Process Integration

⑤ Source/Reactant 공간 분리 주입


UHV-CVD

& OEC (Warm Wall Type )

LSP Technology Dry Etcher

Hidden Champion First Mover

SDP-CVD TSD-CVD SD-CVD MO-CVD

2-1. 반도체_주성엔지니어링 반도체 장비

15

Future Transistor Tech.

- Si SEG ; Elevated

Source Drain

- SiGe, SiC

- a-Si, Poly Si

- OEC (Oxide Elimination Chamber)

- High-K

- Metal

- ULTO

Defect Free Tech.

- High-K

- Metal

- SiO / SiOC / SiON

- SiN / SiBN

- Oxidation

- Nitridation

- High-K

- Metal

Defect Free Tech.

- DPT Partition Etch

- STI & Gate Etch

- Hard Mask Etch

- Poly Etch Back

- MTJ Etch

Defect Free Tech.

- High-K

- Metal

- SiO / SiOC / SiON

- SiN / SiBN

- Oxidation

- Nitridation


2-2. 디스플레이 & OLED 산업 성장성

16

LTPS and Oxide TFT Backplane

Manufacturing Capacity Display Panel Maker CAPEX Forecast

Source : HIS, 유진투자증권

Oxide TFT 기술이 미래 Flexible, Wearable 디스플레이 주도

Source : DisplaySearch


Only One for the Future Technology

a-Si TFT LCD IGZO TFT LCD IGZO

AMOLED

Bendable/ Flexible

AMOLED

Transparency

AMOLED

Tech.

Trend

KPI

JUSUNG

Tech.

(up to 8G) : a-Si, SiNx

OLED Encapsulation : Thin Film Encap. (SiON, SiOC, Al2O3)

Touch panel sensor : Insulator, TCO, Index matching (Al2O3, BZO, SiN/SiO)

LTPS

AMOLED

LSP

CVD

CCP PE-CVD

Thin Film Transistor : Active, GI, ESL, PAS(a-Si, IGZO, SiO2, SiNx, Al2O3)

Plastic OLED : Barrier (SiO2, Al2O3)

1. Mobility 0.5cm2/Vs 2. Well Known

1. Mobility >50cm2/Vs 2. Anneal Unif.

3. Cost Reduction

4. Scale Up

1. Mobility >50cm2/Vs 2. Reliability

3. Repeatability

4. Stability

1. Mobility >50cm2/Vs 2. Encap. Reliability

3. Repeatability

4. Stability

1. Mobility > 50cm2/Vs 2. Isolated Thin Film

3. Encap. Reliability

4. Repeatability

5. Stability

1. Mobility >50cm2/Vs 2. Black Light Unit Control 3. Transparency

4. Reliability

5. Repeatability

6. Stability

2-2. 디스플레이 & OLED_ Trend vs. JUSUNG

17


Innovative Technology for New FPD

TV Panel

High Speed

High resolution

Good uniformity

Large size

Particle free

Very Thin Film

IT Panel

High Quality

New material

Flexible

Transparent

Up to Gen. 10

Inn

ov

ati

ve

Tech

no

log

y

Low Power

Consumption

Main Product Requirements Key parameters

Local

Space

Plasma

Advantage of LSP

1) Low Plasma Damage

2) Low Falling Particle

3) Zero Arcing

Core Requirement

1) Brightness

2) Speed

3) Reliability

Technology

2-2. 디스플레이 & OLED_ FPD Key Requirements and Solution

18


LCD OLED

First Mover & Market Developer

TSP LED

2-2. 디스플레이 & OLED_ 디스플레이 & 조명 장비

R2R

19

- Index matching

(SiNx/SiO2)

- TCO layer

(ITO, ZnO)

- Encapsulation

(Al2O3, SiNx)

- LED

(GaN on Sapphire)

(GaN on Si)

- Power Device (GaN on Si)

(SiC)

TFT

- a - Si

- SiN

- SiO

- IGZO

- AlO

- Etcher

Passivation

- AlO

- SiN

- SiO

Barrier

- SiOX

- SiOC

- Al2O3

TFT

- IGZO

- Al2O3

- SiO

- SiN

Encap-

sulation

- SiOX

- SiOC

- Al2O3

- PECVD

- MOCVD

- ALD

- Sputter

Lighting

Flexible Solar

TSP

Display


20

Table of Contents

1. 회사 소개


3. 재무 현황


3-1. Financial Highlights(별도 기준)

21

2015.2Q Earnings Review

매출액

매출총이익

영업이익

당기순이익

412 (전년대비 26%)

172 (매출액 대비 42%)

20 (매출액 대비 4.8%, 전년대비 304%)

4.4 (전년대비 104%)

(단위:억원)

매출액 추이 (단위:억원)

FY 2012 FY 2013 FY 2014 2015.1H

영업이익 (812) 21 99 28

당기순이익 (1,146) (369) (208) (3)

768

1,516

1,404

408 378

832

578

231

976

422

101 129

162

150

71

0

200

400

600

800

1000

1200

1400

1600

FY 2012 FY 2013 FY 2014 2015 1H

Solar Cell FPD SEMI

750


3-2. 3개년 매출현황(별도 기준)

(단위 : 억원, %)

22

제품별 매출 현황 지역별 매출 비율

53%

26%

59%

77%

30%

64%

30%

13%

17% 10% 11% 9%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

FY 2012 FY 2013 FY 2014 2015 1H

Solar Cell FPD Semi

65% 61%

55%

69%

2% 2%

6%

1%

18% 30% 33%

26% 3%

1% 3% 0% 12%

6% 3% 4%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

FY 2012 FY 2013 FY 2014 2015 1H

US(ROW) Europe China Taiwan Korea

(단위 : %)

768 1,516 1,404 750


SEMI FPD Solar Cell

3-3. 수주잔고 & 제품별 향후 예상매출 (2015.6.30)

(단위: 백만원, %)

23

6,896

(22.7%)

20,793

(68.4%)

2,719

(8.9%)

TOTAL

30,407

총 수주잔고

51%

44%

5%

제품별 향후 예상 매출 비율


매출 및 이익 회복에 따른 차입금 감소와 부채비율 개선

(단위:억원,%)

3-4. 차입금 및 부채비율

24

2,213

2,065

1,431

197%

273%

183%

1,267

178%

0%

50%

100%

150%

200%

250%

300%

0

500

1,000

1,500

2,000

2,500

FY 2012 FY 2013 FY 2014 2015. 1H

차입금(좌) 부채비율(우)


25

Appendix.


Appendix 1.손익계산서(별도기준)

(단위: 백만원)

26

구분 2Q '14 1Q '15 2Q '15 QoQ YoY 2014 1H 2015 1H YoY

1.매출액 32,694 100.0% 33,814 100.0% 41,177 100.0% 21.8% 25.9% 65,898 100% 74,991 100.0% 13.8%

Solar cell FPD Semiconductor

5,146 6,926

20,622

15.7% 21.2% 63.1%

5,025 2,024

26,765

14.9% 6,0%

79,2%

2,076 8,125

30,976

5.0% 19.7% 75.2%

-58.7% 301.4% 15.7%

-59.7% 17.3% 50.2%

6,639 16290 42,969

10.1% 24.7% 65.2%

7,101 10,149 57,741

9.5% 13.5% 77.0%

7.0% -37.7% 34,4%

2.매출원가 19,981 61.1% 19,827 58.6% 23,953 58.2% 20.8% 19.9% 41,184 62.5% 43,780 58.4% 6.3%

3.매출총이익 12,714 38.9% 13,986 41.4% 17,224 41.8% 23.2% 35.5% 24,715 37.5% 31,210 41.6% 26.3%

4.판관비 12,227 37.4% 13,170 38.9% 15,261 37.1% 15.9% 24.8% 24,016 36.4% 28,431 37.9% 18.4%

경상연구개발비 7,404 22.6% 7,214 21.3% 7,402 18.0% 2.6% 0.0% 14,262 21.6% 14,616 19.5% 2.5%

5.영업이익 486 1.5% 816 2.4% 1,963 4.8% 140.6% 303.9% 698 1.1% 2,779 3.7% 298.1%

6.기타영업손익 (2,432) -7.4% 412 1.2% 489 1.2% 18.7% 120.1% (2,090) -3.2% 901 1.2% 143.1%

7.금융손익 (270) -0.8% (2,011) -5.9% (1,997) -4.8% -0.7% 639.6% (12,135) -18.4% (4,008) -5.3% 67.0%

8.법인세차감전순익 (10,621) -32.5% (783) -2.3% 455 1.1% 158.1% 115.7% (13,526) -20.5% (328) -0.4% 97.6%

9.법인세비용 127 0.4% (11) 0.0% 16 0.0% 260.0% 87.3% 1,072 1.6% 6 0.0% 100.4%

10.당기순이익 (10,748) -32.9% (772) -2.3% 439 1.1% 156.9% 104.2% (14,599) -22.2% (334) -0.4% 97.8%


Appendix 2. 요약 재무상태표(별도기준)

구분 2015.1H FY 2014 FY2013

유동자산 116,921 116,181 171,139

당좌자산

현금 및 현금등가물 단기금융상품 매출채권 기타유동자산 재고자산

4,034 61

54,042 6,647

52,137

14,376 55

49,609 4,136

48,005

24,050 337

84,562 7,489

54,701

비유동자산 183,599 188,419 200,300

투자자산 유형자산 무형자산 기타비유동자산

23,162 136,451 12,712 11,274

23,165 140,190 12,819 12,245

43,787 134,154 7,044 15,315

자산총계 300,520 304,600 371,439

유동부채 179,738 177,251 262,318

매입채무 단기차입금 유동성장기부채 기타유동부채

44,194 105,566

6,000 23,978

30,944 119,027

6,000 21,280

47,024 120,395 22,000

72,899

비유동부채 12,789 18,893 9,666

장기차입금 전환사채 기타비유동부채

5,100 0

7,689

8,100 0

10,793

0 0

9,666

부채총계 192,528 196,144 271,984

자본금 24,125 24,125 20,625

자본잉여금 기타자본 기타포괄손익누계액 이익잉여금

146,227 317

11,808 -74,485

145,952 591

11,946 -74,158

130,024 591 253

-52,038

자본총계 107,992 108,456 99,455

부채와 자본총계 300,520 304,600 371,439

(단위: 백만원)

27

ir presentation 3q ir...confidential and proprietary 240 opo-ro, opo-eup, gwangju-si gyeonggi-do,...

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