2011. 05. 20

New Technology for

Soldering & Wire Bonding

- 2 -

Soft ENIG (/)

ENEPIG (//)

Soft ENEPIG (//)

- 3 -

1.

- 4 -

1999. 02. 11

46

670-10 91B-11L

PCB,

-. Soft ENIG ( -)

-. ENEPIG ,

-. Fine Pattern D/F

-. ITO

-.

PCB

ITO

- 5 -

1999. 02 2002. 08 ISO 9001 2004. 03 2004. 05 ( : 20041610 ) 2004. 11 ISO 14001 2005. 06 , , 2005. 06 INNO-BIZ ( 5071-0198 ) 2005. 07 (10), 1,1422005. 09 ( 2561 )2005. 12 NT (DUOTOP process) ( N107 )2006. 07 2007. 02 ()2007. 02

1999. 02 Mass-Lam 2000. 10 Half etching 2001. 04 Photoresist stripper 2002. 04 D Ram Free ()2002. 08 ()2002. 09 (, )2003. 01 ( )2003. 09 ()2004. 09 / (DUOTOP process)2005. 12 DUOTOP process ()2006. 05 ()2007. 10 - 2007. 11 ()2008. 04 / (Ag/Pd) 2009. 01 - 2010. 12

- 6 -

(PCB) Si Wafer Lead Frame

Display

(, ), Micro etching

, Photoresist

Mass-LAM (, )

Desmear

/

//

Metal stripper (, , ), PSR stripper

, ,

Polyimide etching (Laser drilling )

MASP D/F

Metal PCB Etchant

(SMT) wire bonding

Spot silver

Alloy 42 micro etching

Silver (, )

EBO (Epoxy Bleed-Out )

Final Rinse

flash

Capping Material

( )

Kovar

Buff

EMI

TSP ITO , ,

-. Cu selective etchant (ITO attck-free)

-. Cu + ITO etchant

-. ITO D/F

- 7 -

2.

- 8 -

HASL

-. (RoHS WEEE)

-.

-.

OSP-.

-.

Immersion Tin-. Whisker

-. Cavity (copper attack)

-. Pb-free solder (1.2)

Direct Immersion Gold

-. Cu

solderability

-.

-. Au max. 0.2

Direct Gold

-. -. Kirkendall void

-. Tombstone defect

-.

-. Au min. 0.5

Immersion Silver-. -. Ion migration

-. Solderability -. Galvanic Attack

ENIG-. Black pad

-. Bending crack

Au

Cu

Copper Oxide

Soft ENIG Process

/

Crack-free

Soldering

- 10 -

I.

II.

III.

1.

2.

3. crack

4.

5. (Dome Test)

6.

7.

8.

9.

- 11 -

PCB Ni Crack LCD

- PCB LCD Bonding

Ni Crack

-

PCB Crack

Low Cost

Slide Cable

Direct Gold ()

Au Spec. 0.6um

LCD

LCD

LCD

-. Au

-.

-.

I.

- 12 -

ENIG- ()

Ni

Crack Free Low Cost

D/G(0.6um)

Soft ENIG(min.0.03um)

Ni crack Ni.

Ni () () .

.

* Ni

?

(RA copper)

Soft ENIG- ()

100

- 13 -

ZIF connector typeDirect Gold

Soft-Gold

Hard Gold

ENIG

Soft-ENIG

Cable connector type

Soft-Gold

Direct Gold

Soft-Gold

Hard Gold

II. - 1

- 14 -

OLB (Display Module)

The FPCB Substrate or connector for a Display Module (LCD, PDP, OLED etc.)

Normal ENIG

Direct Gold

Soft Gold or Hard Gold

Normal ENIG

Simple Process & Cost Reduction :(ENIG + Direct Gold) or (+ Soft Gold) or (+Hard Gold) => Soft-ENIG

Soft Gold or Hard Gold

II. - 2

- 15 -

Dome type

Other type (Camera Module)

Normal ENIG (Ni : Min 4um)

Soft ENIG

Ni: 1~3um

Soft-Gold or Direct Au

II. - 3

- 16 -

1.

Pre-dip

Post-dip

III.

- 17 -

Pb-free Electroless Nickel Solution

YMT (Pb) RoHS .

( (Pb) .)

CF-300A

CF-300M

CF-300C

CF-300B

2.

- 18 -

3.

Crack

X 200 X 500 X 5,000 X 20,000

ENIG

3 size

(Soft ENIG)

1627 size

- 19 -

- MIT Type

Coupon

-. : PI 25, Cu (ED) 12

-. 100 x 100

-. : 250 g

-. : 0.38mm

-. : 175 cpm

-. : 270 ( 135)

-. Mode : C ()

(MIT Type Folding Endurance Tester)

-. : TOYOSEIKI

-. Model : MIT-DA

() ( )

()

Ni Au

Soft ENIG

(CF-300)

0 MTO 200

2 0.04

1 MTO 222

2 MTO 210

3 MTO 239

ENIG 3

Direct Gold 220 - 0.5

Bare Cu ( ) 200 - -

0

50

100

150

200

250

300

200 200222

210

239

3

220

Cu Soft ENIG Soft ENIG Soft ENIG Soft ENIG Normal Direct 0 MTO 1 MTO 2 MTO 3 MTO ENIG Gold

4.

- 20 -

30 45 60 90

ENIG

Crack Fail Fail Fail Fail

Direct Gold

Crack OK OK OK Fail

Soft ENIG

Crack OK OK OK Fail

: ZIF pad

-. ZIF pad 1~10 socket .-. 1 .

-. ZIF connector crack .

-. ENIG : 30 .-. Direct Gold : 60 (45 ). -. : 60 (45 ).

-> Direct Gold .

- 21 -

MODEL PCB

LIFE 100,000~600,000 times

SPEED 1cycle/1sec

DOME SPEC 4 5DP

FORCE 20020gf

ACTUATION TYPE 2.0 A/L ACTUATOR

LOADING 500g

DESCRIPTION METAL DOME TESTER

ENIG

-. 10 Ni crack .

Soft ENIG

-. Ni , crack ..

-. Cu crack .

5. (Dome Test)

- 22 -

100,000 200,000 300,000 400,000 500,000 600,000

ENIG

Soft

ENIG

( ENIG, Soft ENIG)

100,000 200,000 300,000 400,000 500,000 600,000

ENIG

Soft

ENIG

ENIG : Ni layer crack

Soft ENIG : Ni layer crack , Cu crack ()

- 23 -

0 MTO 1 MTO 2 MTO 3 MTO

X 3,000

X 5,000

P 7.62 8.45 8.82 9.11

SEM EDS

TESCAN BRUKER

Model VEGA//LSH Xflash

Photo

:

6. (SEM/EDS)

- 24 -

0

1000

2000

3000

4000

0 MTO 1 MTO 2 MTO 3 MTO

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Ave.

0 2817 2990 3449 2985 3153 2822 3184 3164 3418 3220 2878 2511 3602 3882 3810 3362 3092 3449 3989 3810 3279

1 2909 3006 3444 3291 3281 2292 2226 2608 3464 3051 2542 2950 3607 3887 3204 3714 2522 3495 4065 2618 3109

2 2736 3403 3428 2323 2567 2955 3133 2506 2618 3637 3169 4096 4264 3765 2415 3714 2746 3530 3540 3220 3188

3 2980 3113 3754 3240 2878 3464 2374 2461 3388 3067 2894 3174 3296 4356 2909 2262 2756 3286 4142 3810 3180

3185 2874 2594 3251 3455 2252 3068 3169 3256 3898 3868 3664 2864 2762 2568 3195 3134 3154 3307 3246 3138

Ball Pull Strength (gf)Sample

Soft ENIG

Conventional ENIG

-. Pad 1.2 reflow .-. .-. Spec. : min. 1.0 kgf.

-. MTO 3kgf .-. pad .-. MTO .

Soft ENIGConventional

ENIG

Ba

ll P

ull

Str

en

gth

(g

f)

pad

7.

- 25 -

Type E Type E

: Soft ENIG ENIG 10% .

Type A Type B Type C Type D Type E

Type A = Ball lift percentage between 100%Type B = Ball lift percentage between 50 100%Type C = Ball lift percentage between 1 49%Type D = Ball lift percentage between 0%Type E = Pad peel

Failure Mode

Conventional ENIG Soft ENIG

Rigid Flexible Rigid Flexible

Ave. 1124 738 1165 786

Min. 1043 635 1075 703

Max. 1205 821 1250 870

0

300

600

900

1200

1500

Ba

ll S

he

ar

Str

en

gth

(g

f)

Rigid Flexible

C : Conventional ENIG

S : Soft ENIG

C

C

S

S

8.

- 26 -

Direct Gold ENIG

Soft ENIG (CF-300)

1. .

2. FPC maker process

(Lead )

3.

Connector

Crack-Free SMT

Crack-Free +

SMT Crack SMT

SMT

Cost

9. Table

ENEPIG Process

Electroless Nickel / Electroless Palladium / Immersion Gold

Soldering & Wire Bonding

- 28 -

/ / .

, .

.

; (R/F, RIGID), .

- 29 -

Application (Camera Module: R/F, Rigid, CSP etc.)

- 30 -

(Pre-dip)

(Post-dip)

- 31 -

Cu

Substrate

Au

Pd-P

Min 0.05

0.050.15

ENEPIG(Electroless Nickel +Electroless Palladium + Immersion Gold)

XRF

Cu

Substrate

Au

Ni-P

0. 30.7

58

(Electroplating Nickel + Gold)

Ni 58

- 32 -

- 33 -

ENEPIG

- 34 -

Ni

Pd Au layer .

Ni Pd

Au

Ni

S Spec.

- 36 -

K&S 1488 plus Dage 4000

1. Test

2-1. Test equipments

- Wire Bonding : K&S 1488plus

- Peel Off : Dage 4000

2-2. Test board : ENEPIG Plating

2. ENEPIG Wire Bonding Parameters

First (ball parameter)

Tip Offset 80 tenth-mils

Bond Velocity 30 h-mils/msec

Bond Time 30 msecs

Bond Power 70 mwatts

Bond Force 45 grams

Second (stitch parameter)

Tip Offset 80 tenth-mils

Bond Velocity 30 h-mils/msec

Bond Time 50 msecs

Bond Power 140 mwatts

Bond Force 90 grams

Bond temperature 150 Ball size Ratio 2.50 Wire size 1 mil

CapillaryMaker Kulicke & Soffa

Diameter 1 mil size

Wire Bonding

- 37 -

0

4

8

12

16

#1-1 #1-2 #1-3 #2-1 #2-2 #2-3 #3-1 #3-2 #3-3

Sample No.Thickness ()

Ni Pd Au

#1

1

6~7

0.05

0.05

2 0.10

3 0.15

#2

1

0.1

0.05

2 0.10

3 0.15

#3

1

0.15

0.05

2 0.10

3 0.15

Wir

e P

ull

Str

en

gth

(g

f)

Sample

Wire Pull Strength

1 2 3 4 5 6 7 8 9 10 11 12 13 Ave.

#1-1 10.868 11.889 11.217 11.322 11.456 11.842 11.617 11.797 12.144 12.008 11.711 11.740 11.701 11.639

#1-2 12.277 11.566 11.461 11.475 12.064 12.252 11.534 11.818 11.890 11.528 12.069 11.690 12.110 11.826

#1-3 11.238 11.551 11.233 11.605 11.544 11.113 11.115 11.843 11.416 11.484 11.752 11.753 11.541 11.476

#2-1 11.742 11.629 11.899 11.586 11.165 11.677 11.870 11.774 11.487 11.732 11.865 12.128 12.061 11.740

#2-2 11.492 11.060 11.685 11.109 11.794 11.532 12.180 12.562 11.290 11.540 11.488 12.146 11.589 11.651

#2-3 12.253 11.317 11.641 12.065 11.890 11.583 11.390 12.066 12.390 11.906 12.432 11.253 12.506 11.899

#3-1 11.788 11.412 11.429 11.476 11.508 12.064 10.688 11.590 11.659 11.477 11.394 11.544 11.790 11.525

#3-2 11.807 11.015 12.027 12.052 11.727 11.899 11.192 11.797 11.537 11.746 12.240 11.114 12.024 11.706

#3-3 11.262 11.203 11.818 11.280 11.241 11.293 12.119 11.832 11.402 11.222 11.611 11.390 11.215 11.453

SampleWire Pull Strength (gf)

Wire Pull

- 38 -

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Ave.

0.76mm 1937.1 1902.5 1919.7 1872.0 1924.1 1989.2 1966.2 1925.9 1951.2 1978.4 1975.0 1966.5 1982.6 1980.4 1951.2 1982.0 1950.3

0.6mm 1027.3 1118.7 1094.5 1101.5 1146.4 1122.7 1198.5 1101.0 1253.1 1163.7 1197.3 1148.2 1164.0 1193.4 1048.9 1105.5 1136.5

0

500

1000

1500

2000

2500

0.76mm 0.6mm

Test Ball Shear Test

Point 1 Point 2 Point 3

Reflow Machine Multi-bond Tester

HELLER / 1809UL Dage / Dage 4000

Sn-3.0Ag-0.5Cu (Pb-free)

Flux Sparkle WF-1600 Stats P/N CH067

Ba

ll S

he

ar

Str

en

gth

(g

f)

Solder Ball Size

Solder Ball Ball Shear Strength

- 39 -

0

500

1000

1500

2000

Solder Ball S/M Open Size 35030

Solder Ball Size 0.5mm

S/B Compound Sn-3.0Ag-0.5Cu (Pb-free)

Flux Sparkle WF-1600 Stats P/N CH067

Reflow Machine

Model 1809UL (HELLER)

Power 3, 380V, 60Hz

Heating Method Hot Air

Heating Zone 9 Zone

Option N2 gas purging

Ball Shear Machine

Model PTR-1000 (RHESCA)

Full Scale 2000gf

Speed 1.00mm/s

Locate 15.0

Ba

ll S

he

ar

Str

en

gth

(g

f) Before Aging After Aging

-. Aging Conditions : 85/85%, 168 hrs.-. Spec : min 1,000g

Aging

- 40 -

Soft Gold ENEPIG

(x 5,000) Soft Gold

- 41 -

0

4

8

12

16

20

Soft Gold ENEPIG

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Ave.

Soft Gold 14.606 15.770 15.341 14.936 15.254 12.859 15.783 16.545 14.066 15.625 14.969 14.631 13.922 12.351 14.328 14.599 14.872 14.733

ENEPIG 15.919 16.994 12.800 15.907 16.124 12.731 16.041 16.445 15.357 14.248 14.301 13.041 13.147 13.009 14.622 14.550 12.688 14.584

A

B

1 2 3 4 5 6 7 8 9

10 12 13 1411 15 16 17

A

BW

ire

Pu

ll S

tre

ng

th (

gf)

Wire Bonding Machine Multi-bond Tester

K&S / 1488 Plus Dage / Dage 4000

Wire Pull Strength

- 42 -

ENEPIG

Soft Gold

ENEPIG

soft gold

Wire Bonding

- 43 -

Soft Gold

Soft GoldENEPIG

1. PCB

2. ->

-.

lead wire etch back

-.

3. Noise

Ni 5~8

Au 0.3~0.7

Ni 5~8

Pd 0.050.15

Au min. 0.05

Wire bonding

Wire BondingWire Bonding

SolderingCamera module, PKG (BGA, CSP)

- 44 -

-. Ni: 6.4, Pd: 0.09, Au: 0.11

:

-. 1005 Chips SMT

-. Equipment : Dage 4000

-. Push Height : 150

Chip Shear Strength

1005 Chip

0

500

1000

1500

2000

2500

3000

Ch

ip S

he

ar

Str

en

gth

(g

)

ENIG ENEPIG

Application Ave. Min. Max.

1584 1312 1477 1579 1393 1519 1409 1398 1433 1642

2154 1431 1501 1375 1386 1806 2328 1992 1411 2211

1474 1509 1329 1465 1925 1344 1533 2287 1467 1633

1566 1637 1398 1520 1705 1328 1684 2039 1978 1755

ENIG

ENEPIG

1617 1312 2328

1629 1328 2287

Point

- 45 -

- Maker : Fein Focus (Germany)

- Model : U-CT FOX

- ENIG, ENEPIG

- Chip size : 1608, 1005

- BGA size : 0.5

Microvoid

- 46 -

Pd

ENIG ENEPIG

1608 chip 0.5mm ball 1608 chip 0.5mm ball

#1 #2 #3 #4 #5

Ni 4.52

Pd 0.05

Au 0.07

Ni 4.23

Pd 0.11

Au 0.07

Ni 4.40

Pd 0.16

Au 0.09

Ni 4.21

Pd 0.23

Au 0.04

Ni 4.30

Pd 0.30

Au 0.06

Soft ENEPIG Process

High Ductile Electroless Nickel / Electroless Palladium / Immersion Gold

Crack-free,

Crack-free, Soldering & Wire Bonding (FPCB, RF)

- 48 -

, , .

crack-free .

Punching, Routing bending crack .

Soldering wire bonding .

- 49 -

First (Ball) Second (Stitch)

Temperature 150

Tip Offset 80 tenth-mils

Velocity 30 h-mils/ msec

Time 15 msecs 30 msecs

Power 70 mwatts 140 mwatts

Force 45 grams 90 grams

Items Ball Pull Wire Pull

Speed 700 / s 700 / s

Load 50 g 5 g

Size

Pad : 0.45mm

Ball : 0.6mm

(Pb-free Solder)

(96.5Sn-3Ag-0.5Cu)

Au Wire : 1 mil

-. Wire/ Ball Pull Test Machine Condition -. Wire Bonding Parameter

-. (:)

Ni Pd Au

Soft ENEPIGSMT 3.5 0.05 0.05

Wire Bonding 5.5 0.12 0.11

ENEPIG 5.5 0.08 0.10 (MIT test)

- 50 -

No.

1 SEM / EDS

OK

/ OK

2 Ball Pull Reflow

* Pb-free Solder Ball : Sn 96.5 / Ag 3.0 / Cu 0.5Customer Spec. OK

3 Wire Pull Reflow wire pull

* Au wire : 1 mil

Customer Spec.

( A Mode min. 5gf.)

OK

4

(MIT Folding Endurance)

crack

* : R 0.38 / 250g

- 270(135 ) / : 175 cpm

Customer Spec. OK

5 (Porosity) 12% (HNO3), 35, 15 min. , OK

6

2N HCl (2 mol/ ), 5 min.

OK

2N NaOH (2 mol/ ), 5 min. OK

IPA, 5 min. OK

7 Taping Test (3M Tape) OK

8 Solderability

Solder Pot

2455, Solder Pot (Pb-Free), 3 sec. Min. 95% wetting. OK

Ball Reflow

* Pb-free Solder Ball : 0.5mm (Sn 96.5/Ag 3.0/Cu 0.5)Customer Spec. OK

- 51 -

MIT Data ( )

Min Max#1 #2 #3 #4 #5

Soft ENEPIG

SMT 189 175 147 145 186 168 145 189

Wire Bonding 48 80 34 31 34 45 31 80

ENEPIG 0 0 1 0 0 1 0 1

Bare Cu 203 174 201 154 191 185 154 203

0

50

100

150

200

250

168

45

1

185(T

ime

s u

ntil D

isco

nn

ectio

n)

Soft ENEPIG (SMT) Soft ENEPIG (W/B) ENEPIG Bare Cu

MIT Bending Counts ( )

- 52 -

x 5,000 x 3,000 x 1,000

SMT

W/B

- 53 -

-. Solder ball -> Reflow -> l

->

Pb-Free Solder Ball (96.5Sn-3Ag-0.5Cu)

Pad Size : 0.45mm

Ball Size : 0.6mm

pad pad

SMT wire bonding reflow .

[ Ball Pull : 2,500 gf ]

Reflow Machine Ball Pull Test Machine 3-D Microscope

HELLER / 1809UL Dage / Dage-4000 HIROX / KH-7700

Solder Ball Pull

- 54 -

2,566.6 2,630.9 2,611.8 2,509.8 2,415.5 2,409.5

2,288.6 2,142.1

2,714.4

2,899.4 2,829.9 2,892.4

0

1,000

2,000

3,000

4,000

Ba

ll P

ull

Str

en

gth

(g

f)

0 Reflow 5 Reflow

SMT

0 Reflow 5 Reflow

Wire Bonding

1 2 3 4 5 6 7 8 9 10

11 12 13 14 15 16 17 18 19 20

2,425.6 2,622.2 2,516.9 2,672.3 2,615.8 2,559.2 2,672.5 2,472.7 2,569.1 2,536.6

2,486.1 2,494.8 2,617.5 2,481.6 2,415.5 2,591.9 2,624.8 2,644.8 2,714.4 2,598.1

2,669.4 2,641.7 2,662.8 2,544.1 2,482.2 2,423.6 2,790.2 2,478.0 2,473.3 2,724.7

2,817.7 2,560.2 2,470.1 2,656.9 2,746.9 2,602.0 2,899.4 2,812.4 2,409.5 2,753.6

2,796.8 2,829.9 2,288.6 2,580.7 2,705.4 2,477.0 2,608.6 2,738.4 2,627.7 2,805.3

2,640.0 2,763.9 2,299.7 2,580.9 2,657.8 2,382.4 2,680.8 2,703.1 2,591.5 2,478.4

2,552.7 2,892.4 2,579.4 2,387.9 2,440.3 2,151.6 2,476.9 2,254.1 2,442.5 2,580.9

2,346.2 2,551.2 2,142.1 2,840.1 2,375.9 2,614.5 2,423.9 2,666.3 2,742.4 2,734.9

0

5

WireBonding

2,566.6

2,611.8

SMT

0

5

2,415.5 2,714.4

2,630.9 2,409.5 2,899.4

2,288.6 2,829.9

2,509.8 2,142.1 2,892.4

Min Max Reflow Average

Solder Ball Pull

- 55 -

Wire Bonding Machine Wire Pull Test Machine

K&S / 1488 Plus Dage / Dage-4000

-. Wire Bonding -> Wire Pull Test.

Au Wire : 1 mil

SMT wire bonding reflow .

Wire Pull

- 56 -

Wire Pull Strength

9.301 9.390

10.096 9.941

8.7588.348

9.653 9.5969.7329.996

10.301 10.175

0.0

3.0

6.0

9.0

12.0

15.0

Wir

e P

ull S

trength

(gf)

0 Reflow 5 Reflow

SMT

0 Reflow 5 Reflow

Wire Bonding

#1 #2 #3 #4 #5 #6 #7 #8 #9 #10

0 9.566 8.758 9.401 9.012 9.732 9.436 9.390 9.477 9.407 8.827 9.301 8.758 9.732

5 9.515 9.649 9.119 9.996 9.776 9.494 9.504 8.796 9.699 8.348 9.390 8.348 9.996

0 10.263 10.065 9.653 10.201 10.248 10.235 10.301 9.764 10.090 10.139 10.096 9.653 10.301

5 9.934 10.102 10.102 9.856 10.011 9.596 9.715 9.932 10.175 9.987 9.941 9.596 10.175

SMT

WireBonding

Application ReflowPoint

Average Min Max

- 57 -

Soft Gold ENEPIG Soft ENEPIG

1. ENEPIG .

2. Soft ENEPIG

.

Wire

bonding only

SMT

&

Wire bonding

Crack-Free+

SMT & Wire bonding

Crack-free, SMT wire bonding

.

SMT

- 58 -

!!!

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KPCA-2011.pptx