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OLED

2008. 8. 26.

Sunic System, Ltd.#333-1, Wonchon-dong, Paldal-gu, Suwon, Korea

Tel.: +82-31-217-4477, Fax.:+82-31-217-4476

www.sunicsystem.com

Yeong-Ho Park

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Contents

I. OLED -. OLED Device & Products-. OLED Technology & Roadmap

II. OLED System & Issues of Next OLED System1) Patterning Method2) Deposition Method3) Glass(Mask) Moving Method4) Encapsulation Method5) Factory Automation

III. Summary

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OLED : OLED Products

Sony 11 OLED TV Mobile-phone ( CYON, )

- - Glass - - - ()- etc.

- Thin- Fast Response- Wide Viewing Angle- Natural Color- Low Power- etc.

OLED OLED

OLED Lighting

I. OLED

4

OLED : OLED Market

World wide OLED panel market

-

1,000

2,000

3,000

4,000

5,000

6,000

7,000

2006 2007 2008 2009 2010

Re

ve

nu

e (

Mili

US

$)

AM OLED

PM OLED

: 2008 OLED panel panel 15% , 2009 4.5, 2010 8.7 , .

OthersOthersOthersOthers3.2%3.2%3.2%3.2%JapanJapanJapanJapan28.9%28.9%28.9%28.9%

TaiwanTaiwanTaiwanTaiwan21.1%21.1%21.1%21.1% KoreaKoreaKoreaKorea46.8%46.8%46.8%46.8%O thersO thersO thersO thers2.9%2.9%2.9%2.9%

KoreaKoreaKoreaKorea52.8%52.8%52.8%52.8%JapanJapanJapanJapan24.3%24.3%24.3%24.3%TaiwanTaiwanTaiwanTaiwan20.0%20.0%20.0%20.0%OLED Panel Revenue

Q4 07 Q1 08

KOREA : World leading OLED Panel Player after next 3 year?

Q1 10

Korea OLED ? OLED ?

: 2008

I. OLED

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OLED : OLED Market 1. -. , OLED -2.5 100 ...

( 2008. 7. 23.)-. -, OLED ( 2008. 7. 11.)

, , (OLED) 10 . 35 . 2012 OLED TV 20, 300 . LCD TV 20% 5050, PDP TV 35% 880 .

-. OLED

2. - AM OLED ' '

CMO AM OLED . CMEL2.8 AM OLED 30 , 100 . ( 2008. 7. 1)

3. -. 2008 OLED -. 2008 Micro-Display -. in-line OLED manufacturing equipment and related Processes from UDT(Jilin) Co.(April 16, 2007)

4. -. OLED , Signage (OLLA Project)-. 08 OLED

I. OLED

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( , 2007) I. OLED

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OLED (I) (2007)I. OLED

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OLED Life Cycle (2007)I. OLED

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OLED Process Sequence (TFT, PM-OLED)

Pattern (VII)

ITO Pattern (VI)

ITO Depo

Via Pattern (V)

Interlayer Depo

LTPS-Si TFT

SiO2/-Si

Poly Si(ELA)

Poly-Si Pattern (I)

Gate Ox/Metal

Gate Pattern (II)

SiN

SiN Pattern (III)

S/D Metal

S/D Pattern (IV)

ELA

4th

i) ITO, Cr

substrateii) ITO, Cr

Patterning

iii) Insulator

formation

iv) Cathode

separator

ix) Metal Depo x) Encapsulation xi) Testing

v) Plasma Treatment

vi) HIL/ HTL Depo

viii) ETL/EIL Depo

vii) RGBBDepo

xii) Drive IC Bonding

Array Process : Photo-Etching

Depo & Encap. in OLED Equipment

Glass substrate

TFT AM-OLED PM-OLED

I. OLED

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Mono/Area Color

2000 ~ 2002

Full Color (1~5)

2006 ~

PMOLED/Pilot PMOLED/Mass AMOLED()

Sunics OLED R&D History

Full Color (1~10)

2003 ~ 2005

Full Color (>10)

2008 ~

AMOLED()

-. -. -. , -.

, -. -. -. -.

, -. Mobile-. ()-. -.

-. -. -. (, C/F )-. .

II. OLED System

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(OLED : SUNICPlus 200) from Sunic System

OLED System : R&D System : 200200 OLED systemII. OLED System

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High quality !High quality !High quality !High quality !High reducibility !High reducibility !High reducibility !High reducibility !High stability !High stability !High stability !High stability !

Low running cost ! Low running cost ! Low running cost ! Low running cost !

PMOLED AMOLED

(OLED : SUNICPlus 400) from Sunic System

OLED System : Mass Product System : Gen 2 OLED systemII. OLED System

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1. Process Chamber

& Vacuum System-. Chamber

-. Mechanical Pump

-. High Vac. Pump

-. Gate V/V

-. Shutter

2. Aligner-. CCD Camera

-. Lens

-. Lighting

-. PC w/ Grab Board

-. Shadow Mask

3. Evaporation Cell-. Host Cell

-. Dopant Cell

-. Power Supplier

4. Thickness Control System-. Crystal Sensor

-. Sensor Head

-. Thickness Controller

OLED System : FMM

Cryo

Pump

Mechanical Pump

CCD

Glass

Mask

Shutter

THK Monitor Sensor

Cell

Host Dopant

G/V

THK Sensor Contr

Motor

Aligner

ThicknessMonitor

Cell

Vacuum System

II. OLED System

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OLED System : OLED 1. OLED ,

, , RGB , line .

2. nm .: , Particle,

3. : , Plasma Thermal

4. 5. 6. 7. Photo Fine Metal Mask Patterning

: Auto-Aligning

II. OLED System

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Source Moving Source Moving

BufferBufferBufferBufferLoaderLoaderLoaderLoader TMTMTMTM(1)(1)(1)(1)HILHILHILHILP/TP/TP/TP/THTLHTLHTLHTL MASKMASKMASKMASKLoadiLoadiLoadiLoadingngngng BuffeBuffeBuffeBufferrrrTMTMTMTM(2)(2)(2)(2)GreenGreenGreenGreenRedRedRedRedMASKMASKMASKMASK BlueBlueBlueBlue TMTMTMTM(3)(3)(3)(3) BufferBufferBufferBufferEILEILEILEILBLBLBLBLMetal 1Metal 1Metal 1Metal 1 MASKMASKMASKMASK TMTMTMTM(4)(4)(4)(4) BufferBufferBufferBufferTCO 1TCO 1TCO 1TCO 1Metal 2Metal 2Metal 2Metal 2MASKMASKMASKMASK TCO 2TCO 2TCO 2TCO 2HIL HTL EML EML EML ETL EIL MetalP/TL/L U/L

Cluster : Gen2, Half Gen4 system- 2~4 -

In-line : Over Gen4 ?- 4

Next OLED System : Cluster vs. In-line

- 2 ~ 4 - - , - Fine Metal Mask Patterning

4G VerticalR&DANS

2, Half 3.5G

?2G VerticalApplied Films

> 5G2GULVAC> 5G2G, Half 4G> 5G2G, Half 4GTOKKI

II. OLED System

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Patterning : RGB Patterning TechnologyShadow mask

Red

ITO glass

Green Blue

Tolerance Design in Shadow Mask Patterning1) ITO Patterning(Photo/Etching)

2) Mask Tolerance during Making

3) Strain for Tensioning, Mask Design

4) Aligning Accuracy for Aligning

5) Magnet Design, Glass & Mask Distortion,

Shadow Effect for Deposition

6) Thermal Expansion Shadow Mask Shadow Mask Shadow Mask Shadow Mask MaskMaskMaskMask

1) Patterning Method

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((((Lens)Lens)Lens)Lens)

LightLightLightLight

((((CCD)CCD)CCD)CCD)

X,Y,T,Z,M

Maskaligner Key

GlassAligner Key

Shadow MaskShadow MaskShadow MaskShadow Mask GlassGlassGlassGlass Align KeyAlign KeyAlign KeyAlign Key Patterning : Auto-Aligning Module from Sunic OLED System

1) Patterning Method

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Half 4G Aligner

Auto-aligner : align accuracy test

Align accuracy : < 3.5 um (avg. 1.8 um) @ 100 times Align time : < 42 sec (avg. 30.5 sec)

Patterning : Auto-Aligning Module from Sunic OLED System1) Patterning Method

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Pixel Alignment Tolerance Factor Invar mask(2G) SUS mask(5G)Glass Patterning Tolerance (Position) 3 3 Patterning Mask Mask Slot Size Tolerance (Width) 5 5 Mask

Stretching Tolerance (Position) 10 15 Tension Machine Mask Aligning Tolerance (Position) 5 5 Auto-Aligner

Shadow mask Effect (Width) 4 8 * Mask Slope Mask Deformation (Position) 5 30 **

Total Pixel Alignment Tolerance 14 35

Mask Slot Mask Slot Mask Slot Mask Slot

Shadow Effect Shadow Effect Shadow Effect Shadow Effect Pattern Pattern Pattern Pattern

Glass

Mask

=i

TT

1. 2G invar Mask Invar 1~1.5 * 10E-6/Mask 10 -> 1.5E-6/ * 10 * sqrt(370^2+470^2)/2 = 4.5

2. 5.5G SUS 400 Mask SUS 400 10E-6/Mask 5 -> 10E-6/ * 5 * sqrt(1500^2+1850^2)/2 = 59 => => => => Patterning Patterning Patterning Patterning

* Mask Shadow Effect ** SUS 50% Pattering .=> => => => Mask Mask Mask Mask 30%30%30%30% SUSSUSSUSSUS Space Space Space Space 75757575 70707070ppippippippi MaskMaskMaskMask MaskMaskMaskMask Pattern Pattern Pattern Pattern ....

Patterning : Tolerance Design of FMM1) Patterning Method

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255

255 50 (?) 5035

205Pixel dimension = 33% Mask Deformation 20 .

Mask SUS Pattern .

Patterning : How to Make Large Fine Metal Mask

635

635 80 (?)80185

555Pixel dimension = 54%Mask SUS .

a) 40inch (40 ppi) b) 14inch (100 ppi)

1) Patterning Method

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Patterning :

(a) FMM

(c) Inkjet

(b) Laser Patterning

(d) White+C/F

1) Patterning Method

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worseworsenormalBest/polymerPolymer/smallSmallSmall-Molecularmaterial

Low (?)middle (?)middle (?)Expensive(?)CostworsenormalnormalgoodMiddleLowExcellent (?)High~60%70~80%~80%40-50%(Top)

? (Easy, but ?)? (Easy, but ?)< 2min (Fast)~ 4min (Slow)Tact TimeEasyMiddleEasyHard (?)

Linear : < 40%Linear : < 40%Linear : >30%~80%

Point 5%>Point : < 5%Point : < 4%Material usage~200ppi>200ppi>200ppi~150ppi+/- 15um+/- 2.5um+/- 2.5um+/- 20umGen 4 (R&D)Gen 4 (R&D)Gen 4 (R&D)Half Gen 4()()

Ink-jetLaser PatterningWhite+C/FFMM(Evaporation)

Patterning : 1) Patterning Method

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CS

PCR

Glass Ratation

Deposition : Single-point source- - 2 - - -

Multi-point source- - half 4 - - - - TOKKI half 4

Source Moving

Deposition Method

2) Deposition Method

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VerticalHorizontal

-. Difficult D/R Control -. High Temp Increment

-. Particle Issues

-. Doping Ratio

-. Charging Problem of EL Material -. Reliability -. Bad Uniformity along to Cell Direction-. Thermal Effect to Shadow Mask

to Short Distance btn Glass & mask

-. Many Cells for LargeSize

-. Difficult D/R Controlfor Multi-Cell

-. Low Materials Utilization

-. High D/R

-. Short Process Time

-. Good Uniformity

-. D/R : > 20 A/s

- .Easible to Large Size Glass

-. High Material Utilization

-. D/R : 5~20 A/s

-. Conformed forMass Production

-. Easy D/R Control

-. D/R : < 5 A/s

Area CellLinear Cell Point Cell

Deposition : Evaporation Source for Large Area Glass

Source/Glass MovingSource/Glass MovingNo Source/Glass Moving

2) Deposition Method

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370 x 470 mm2 Cell (Sunic System, Ulvac, YAS)

Deposition : Linear Source for Large Glass Size

KVIS by Kodak

VES 400 (Applied Films)

2) Deposition Method

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- Thickness Unif : < 5.0 % - Efficiency of material : 37.8%@ Test Condition : D/R : 7 A/s, CS :300mm

Deposition : Properties of Linear Cell from Sunic OLED System

- Dep. rate : host 3/s, dopant 0.015/s- Doping Ratio : 0.5%(200:1)

Doping uniformity test

T : 4.5 with cooling, T : 25 without cooling@ 3 hrs deposition, 13.2/smm, CS 100 mm

Mask temperature rising test

Center Center Center Center

EdgeEdgeEdgeEdge

-.Scan Shadow : * 3~ 4um -. Nozzle Shadow : * inside : ~9.5um

* Outside : 10~11um

2) Deposition Method

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Deposition : Material Utilization from Sunic OLED System

Cell Glass glass cell

Material Utilization

Glass Size

Distance from Source to Glass

Cell Type (Point, Linear, Area, etc)

Cell Design

Etc.

Linear cell : horizontal

2) Deposition Method

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Deposition : Metal Evaporation CellMetal source

- , - - , , -

Revolver () () Vertical Metal Cell

2) Deposition Method

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OVPD(Organic Vapor Pressure

Deposition)

-. Top-Down Type Deposition

-. No Glass Bending

-. Particle Issue

-. Thermal Damage

Ref. S. Hartmann, SID 06 Digest, P1563

Ref. OLEDs 2005 Conference

Deposition : Area Source for Large Glass Size 2) Deposition Method

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Glass

Mask

GlassGlassGlassGlass

MaskMaskMaskMask

Next OLED System :

- - - Align

3) Glass Moving

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Next OLED System : Cluster Tool System Configuration for FMM

MSMSMSMS

PTPTPTPT HILHILHILHIL

BFBFBFBF

HTLHTLHTLHTL

MSMSMSMS

GGGG

BBBBRRRR

BFBFBFBF

MSMSMSMS

EIL/MC# 1EIL/MC# 1EIL/MC# 1EIL/MC# 1ETLETLETLETL EIL/MC# 2EIL/MC# 2EIL/MC# 2EIL/MC# 2

BF#1BF#1BF#1BF#1 BF#2BF#2BF#2BF#2

32323232MMMM

11

11

11

11MM MM

BFBFBFBF BFBFBFBF

----. . . . Application : RGB Full Color

-. TACT Time : ~ 4min-. : min. 21ch-. Dimension (for 5G): 32 (L)x 11(W) x 3.5(H)

(1) Can Aligning by Fine Mask(2) Mask (for RGB)(3) Mask Aligning(4) Sequence .(5) Mask . (6) Mask .

(1) Type : Cluster Type(2) Horizontal or Vertical Moving (3) Vertical Deposition(4) TACT Time : ~ 4min(5) Dimension : 16M(L)*2M(W)

.

3) Glass Moving

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GULLGULLGULLGULLGULLGULLGULLGULLMask ReturnMask ReturnMask ReturnMask Return

PTPTPTPTPTPTPTPT HILHILHILHILHILHILHILHILLL(HV)LL(HV)LL(HV)LL(HV)LL(HV)LL(HV)LL(HV)LL(HV)LL(LV)LL(LV)LL(LV)LL(LV)LL(LV)LL(LV)LL(LV)LL(LV) HTLHTLHTLHTLHTLHTLHTLHTL EML(R)EML(R)EML(R)EML(R)EML(R)EML(R)EML(R)EML(R) OIC(N)OIC(N)OIC(N)OIC(N)OIC(N)OIC(N)OIC(N)OIC(N) OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))ETLETLETLETLETLETLETLETL HTLHTLHTLHTLHTLHTLHTLHTL EML(G)EML(G)EML(G)EML(G)EML(G)EML(G)EML(G)EML(G) OIC(N)OIC(N)OIC(N)OIC(N)OIC(N)OIC(N)OIC(N)OIC(N) OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))OIC(P))ETLETLETLETLETLETLETLETL HTLHTLHTLHTLHTLHTLHTLHTL EML(B)EML(B)EML(B)EML(B)EML(B)EML(B)EML(B)EML(B) ETLETLETLETLETLETLETLETL MCMCMCMCMCMCMCMC----. . . . Application : White Color Application : White Color Application : White Color Application : White Color ----. TACT Time : < 2min. TACT Time : < 2min. TACT Time : < 2min. TACT Time : < 2min----. . . . : : : : min 27chmin 27chmin 27chmin 27ch----. . . . Dimension : Dimension : Dimension : Dimension : (for 5G): 85 (L)x 2(W) x 3.5(H)

(1) TACT Time(2) Mask (for White)(3) Glass/Mask Moving

(4) Sequence (5) Mask / Tray moving (6)

(1) Type : In-Line (2) Vertical Moving (3) Vertical Deposition(Glass Scan)(4) TACT Time : < 2min(5) Dimension : 16M(L)*2M(W)(6) Glass Size .

.

3) Glass MovingNext OLED System : Inline System Configuration for White OLED

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( )

or or

VerticalVertical

- -Particle -Particle

-X

Face up

AxitronXX

Face up

or 100kg Robot Mask

- -Moving - Scale Up

- -, mask -Particle -

-, mask -

X Sunic, ANSNessTOKKI(730x460)

Particle

or Robot

Throughput

VerticalVertical

XMask/glass

( )Lay out

Face downHorizontal

In - LineCluster

Face downDep. MethodHorizontalMoving

Next OLED System : Cluster vs. In-line3) Glass Moving

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1. Metal or Glass CAN

Glass substrate

4. Thin Film Passivation

Glass substrate

3. Polymer Sheet

Glass substrate

Polymer

2. Glass Sheet

Glass substrate

Glass Sheet

OLED Encapsulation SystemEncapsulation

- top emission, OLED , - thin film encapsulation

4) Encapsulation

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DegasSealant

Dispensing

DesicantAttaching

Cover

Glass

Loading

N2

Replace

Plasma or

UV Cleaning

PanelBuffer

TM

Encap

Assy

Unload

Encap Glass Moving DirectionPanel Glass

Moving Direction

OLED Panel

OLED Encapsulation System : Encapsulation Process1. Substrate size : 370 x 470

2. Production type : Mass production

3. Customer : Korea PMOLED manufacturing company

4) Encapsulation

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OLED Encap System : next encapsulation technologies

Ceramic LayersIsolation Layers

Glass Substrate

Barix coatingActive OLED

System Configuration for Barix Encapsulation

Isolation Layers : stress release, planerization

Max Depo. Temp : < 80Ceramic Layers : protection from moisture, oxygen

Thin film encapsulation (Barix licensed from Vitex Co.)

4) Encapsulation

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TMC

CTC

PMCPMCPMC PMC

TMC TMC

TCP/ IP Network

TCP/ IP Network

PC for data real-time viewer

Automation : Computer control : user friendly system

CTC Screen TMC Screen

PMC Screen Config.Screen

5) Factory Automation

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Main Issues for Next Generation OLED Equipment1. Why to develop for Large Size OLED Equipment System

: Which is OLED Technical Direction & Method?-. RGB vs. White OLED-. Cluster Type vs. Inline Type-. Face Up/Down vs Vertical Deposition-. Encapsulation Method

2. What to obtain Profit for OLED Equipment-. High R&D Cost in competition area for Small Market Size-. High R&D Cost in Multi-Process (Organic Depo, Metal Depo, Encap, etc)-. Complicated System : Deposition + Aligner included Shadow Mask

+ Thickness Monitoring -. Component Cost & Reliability3. OLED Display and/or OLED Lighting

-. Whos Leader in OLED Display and/or OLED Lighting?-. Whats Next Technical?

4. Whos Frontier to develop in OLED Equipment -. Who(Whos company) can make the profit to develop in OLED Equipment?-. Who(How) is invest to develop Next OLED Equipment?

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Current Technology for OLED Mass Production1. Max Glass Size : 730*460 mm22. Reliable Equipment : 370*470 mm2 Glass Size

- Resolution : < 150 ppi (>150ppi : R&D Level)- TACT Time : 4~6min- Doping Level : 200:1- Panel Size : 1~5- EL material Efficiency : ~ 5%

Next Technology for OLED Mass Production1. Glass Size : > 1100*1300 mm2 (need New Concept H/W)2. Panel Size & Resolution : 1~40 QVGA, VGA

or White OLED3. TACT Time : 2 ~ 6min4. EL material Efficiency : over 30%5. RGB Shadow Mask Size : ? (strategic investment)

Summary

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Whos Success

in OLED Business ?

Thank you for your attention