tango systems axcela introduction

Tango Systems, Inc Confidential Tango Systems, Inc Confidential

AXCELA™ 200/300/450

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Tango Systems “Cost-Effective Metallization Solutions”

Tango Systems, Inc Confidential

What is Tango Systems? •  PVD tool manufacturer incorporated in 2005 and located in San Jose, CA •  PVD Technology developed in 2002 from our sister company Hionix, a thin-

film deposition company •  Over 40 people with expertise in system/hardware design, source

technology, process technology and process integration •  Website: www.tangosystemsinc.com

*

Leading Innovator in PVD Equipment

Manufacturing

Tango tools in Asia and USA for

production and R&D


Tango’s Broad Applications

TSV

Panels

BSM

WLP

LEDs

Advanced Packaging

Thick Metal Depositions


Tango: PVD Products

AXCELA

SAPPHIRE

TOPAZ

Bumping, RDL, TSV, Barrier Seed layer

Reactive & Advanced PVD

Substrates, Panels, Integrated passives


Axcela: Unique Selling Points Flexible:

•  Easily adaptable to any size: <150mm à 200mm à 300mm à 450mm •  Productivity benefits of batch systems without the process limitations •  Cluster tool for best in class process performance

Extendable Technology: •  TSV, CIS, RDL, UBM and molded substrate processing

Integrated DeGas: •  To eliminate contact resistance issues •  Proven high vacuum transfer module •  Enables good adhesion and prevents out-gassing issues

Low Temperature Processing: •  Both PVD and Preclean chamber wafer platens can be cooled to -40C •  Temperature in Preclean will be below 120C •  Temperature in PVD will be below 150C for plated bump film stack


Architectural Advantages: Tango

Lowest CoO in Industry

High Throughput

Cost of Maintenance

Low CoC

Cost of Spares

Highly Reliable


AXCELA: Reliability

•  MTBF: >250 hours •  MTTR: <4 hours •  MTBC: 5000 wafers •  Up-time: >85%


Key Customers •  SMIC (China) •  SEMCO (Korea) •  Western Digital Corporation (USA) •  D-Wave Systems (USA) •  JCAP (China) •  Unisem (China/Malaysia) •  ChipMOS (Taiwan) •  Nepes (Korea/Singapore)


AXCELA™ Processes


300 mm TiW NU = 2.26%


300 mm Cu NU = 2.27%


43Å Ta/Ru/Ta Film Stack 0.2% Uniformity

A Look at Tango’s Excellent Thickness & Rs Control


Wafer ID : 1551-SLOT1 Test No. : 1 Test Date (M/D/Y): 06/08/2013

Notch

Contour Map Std. Dev. : 0.2077176 Contour Interval : 0.183%

8.1156108.1008668.0861238.0713808.056636 Mean8.0418928.0271488.0124057.997661

0.21% 1 sigma Rs U%

Test Date/Time 6/8/13 19:35 Mean 8.056635857 Std Devia:on (%) 0.207717597 Min 8.012399673 Max 8.096999168 Range 0.084599495


Wafer ID : 1551-SLOT9 Test No. : 1 Test Date (M/D/Y): 06/08/2013

Notch

Contour Map Std. Dev. : 0.2167682 Contour Interval : 0.1695%

8.1304158.1167268.1030388.0893508.075662 Mean8.0619748.0482858.0345978.020908

0.22% 1 sigma Rs U%

Test Date/Time 6/8/13 17:32 Mean 8.075661659 Std Devia:on (%) 0.216768161 Min 8.034600258 Max 8.104200363 Range 0.069600105


Lowest Contact Resistance


Customer Contact Resistance Data

PVD1 Ti 1000+Cu 3000 unit: mΩ

PVD1 T B L R Max Ave. Min

P.1 8.62 10.00 10.86 9.20 10.86 9.24 8.45

P.2 8.46 9.74 8.45 8.62

PVD2 Ti 1000+Cu 3000 unit: mΩ

PVD2 T B L R Max Ave. Min

P.1 9.20 10.69 11.31 8.41 11.31 9.17 6.10

P.2 9.04 10.15 6.10 8.43


10:1 Vias TSV Ti & Cu Step Coverage


~15% Continuous Ti + Cu Coverage in 5x50um Vias Field = 9000A (Ti ~ 2500A; Cu ~ 6500A)

Corner, 1050Å, ~11%

Conservative measurement

Bottom, 1360Å, ~14%


Demonstration of Continuous Ti/Cu Coverage in 5x50 um Vias by Conformal Cu Electroplating

Field = 9000A (Ti ~ 2500A; Cu ~ 6500A) Before Plating

Conformal Cu Plating on Wafer Pieces All the Way Down to the Via Bottom


Summary/Conclusions

•  Tango has shown a highly encouraging 15% continuous bottom step coverage process for high AR TSV structures – 10:1 in particular

•  Ti coverages are as high as 20% for only about 2000A metal on field!

•  The step coverage should be sufficient to ensure good filling by Cu electroplating - demonstrated by Cu electroplating on wafer pieces


Efficient Batch Degassing


Tango Degas Advantages

•  Longer degas process time due to batch processing –  Up to 24 wafers per Load Lock

•  Enhances ICP Preclean efficiency by reaching process start pressure quickly

•  Improves film adhesion •  Contact resistance data from field tool running

300mm UBM TiW/Cu: – Without degas: > 30 mOhm – With degas: < 19 mOhm


Efficient Degassing on Organic Substrates


Thank You for Your Time

“In Step with Technology”

Tango Systems

tango systems axcela introduction

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