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Technology transfer and business development for innovation projects.
From local market to global industry.
www.zntc.ru
Well positioned for innovative business development Fab Lab
Multifunctional complex of microelectronics based on MEMS, CMOS Assembly line, 3D-assemly (TSV). Center for Testing and certification. Prototyping and technical expertise.
R&D Providing scientific and research development. Design center IC design, SoC, system on package, reverse design.
Technology company and start-up funding Business Development. Funding of innovation projects. Attracting of strategy and industrial partners. Integration development, international cooperation.
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MEMS sensors based on AMR
and GMR effect
Sensors and multifunctional
blocks, multichip assembly
Piezoresistive MEMS sensors
MEMS gyroscopes and accelerometers
Data processing
VLSI
.
NEW TECHNOLOGY SOLUTIONS FOR MODERN ELECTRONICS
TASKS AND OBJECTIVES
ROBOTECHNICS INTELLIGENT SENSORS
Development of infrastructure for production of special-purpose Electronic Component Base
Systems on a chip Speedup
1.52 times
Development of full dielectric isolation for high temperature
and radiation-resistant Electronic Component Base
3D multichip assembly,
Component density speedup 1.53 times
SMART-SYSTEMS MULTICHIP ASSEMBLY
ASSEMBLY LINE (SiP and 3D technology)
TESTING LINE
KEY TECHNOLOGY
LINES
IC DESIGN MEMS and NEMS R&D
FAB-LITE CMOS and MEMS
technology
PHOTOMASKS production line
(current technology level 180 nm, transition to 90 nm)
IC, MEMS and NEMS SoC and SiP manufacturing
Technology infrastructure
Integrated projects, licensed
production
Designing VLSI, MEMS
Systems on a chip
Production Microchips,
MEMS
Tests, control and
measurements
Design center :
- Designing of semi-custom compound LSI
- Development of magnetoresistive sensors
- Development of systems control blocks
- Reverse engineering
Tests of electrical and
functional parameters
Chip production:
- Feature size: - 0,25 m- 0,18 m - Capacity: 600 chips
pm. - CMOS- and MEMS-
technologies - Systems on a chip,
multifunctional blocks
High-accuracy assembling in ceramic-metal
frames.
Systems in Package, 3d TSV,
Packaging, 3D assembly
5 invention patents
Developed basic technologies for
production of sensors
Design and production of analog and compound integrated circuits and multifunctional blocks.
High-temperature electronics.
3d assembly. Functional Electronic Component Base products
Infrastructure for development and Production of Electronic Component Base
TECHNOLOGIES:
Center for Design and manufacturing of photomasks
PROSPECTIVE LINES OF DEVELOPMENT:
ALREADY DEVELOPED: COMPETENCIES:
Capacity of Center: 1500 photomasks per year.
Electron-beam generator
Minimum feature on photomask - 80 nm; Overlay accuracy of topological layers 30 nm; Defects 100 nm
Fragment of topology with OPC elements
Calculation and modeling of OPC elements
Fragment of 50 nm topological structure
Development of photomasks for IC production (130-65 nm technology node) (RET technologies)
65 nm technology node
Design and production of binary photomasks for projection contact lithography (up to 180 nm technology node).
Direct lithography of IC critical layers by electron beam.
CUSTOMERS AND PARTNERS:
EXPECTED RESULTS:
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Infrastructure for ECB development and production
Atomic force microscopy. Cell culture research Probe microscopy
IC chip assembly in frames. Sensors, MEMS assembly in ceramic-
metal frames. Multichip modules. 3D assembly (TSV).
Line characteristics
Certification and accreditation
Chip production (CMOS IC and MEMS)
Packaging, 3D assembly Research and analytical center
Test complex Photolithography: Projection photolithography: 0,25 m, Contact photolithography: 0,6 (double-sided
is available) Chemical treatment Diffusion/Deposition Thermal atmosphere equipment. Vapour deposition equipment LPCVD
PECVD. Atomic layer deposition.
Plasma-chemical etching: Plasma-chemical etching of dielectric layers, metal films, bosh-process; ion etching, sacrificing layer remove (SiO2). Metal films depositing PVD depositing of multilayer structures with
AMR and GMR effect. Magnetron deposition of multilayer metal
and dielectric layers Ion implantation
Qualification and periodic tests. Measurement and of electric and functional
parameters. Moisture content analysis
Production operations Technology line
Analytic investigation
Government Defense Standard Certificate 15.002-2003
Production up to 10 000 items per month.
Government Standard Certificate allows to test domestic and foreign ECB.
Certification and accreditation
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Spintronics Vacuum electronics Element base for integrated optics
ADVANCED PROJECTS:
AUTOMOBILE SENSORS SPECIALIZED APPLICATION
ECB DEFENSE TECHNOLOGY AND WEAPON:
ALREADY DEVELOPED:
COMPETENCE IN ECB DESIGN :
ANALYTIC INVESTIGATION
Elemental composition measurement: auger spectrometry, secondary ion mass-spectrometry, X-Ray analysis. Dimensions measurement: Dual Beam, raster electron microscopy, profilometry. Optical behavior measurement: ellipsometry.
magnetoresistive sensor
speed sensor encoder
position sensor
Electrooptical microsystem module for warning of external exposure.
Nano-column magnetic heterostructures for the development of microwave nanoscale generators
Development of magnetic materials for radiation-resistant memory elements.
Twinaxial sensor for navigation systems.
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physical magnitude MEMS sensors
Development of domestic inertial navigation system
Development of miniature position and orientation systems
High-accuracy micromechanical dip needles Precision micromechanical gyroscopes with null drift
1per hour
Precision micromechanical accelerometers, with null drift 10 ug.
Operating systems for autonomous robotic platforms
DEVELOPMENT PROSPECTS: ALREADY DEVELOPED:
COMPETENCE IN ELEMENT BASE DESIGN:
ITEMS EXAMPLES:
CUSTOMERS AND PARTNERS:
MEMS acceleromete
r
MEMS gyroscope
Multichip inertial navigation module
Fast-rotating inertial orientation system
MEMS accelerometers
MEMS dip needles
MEMS gyroscopes
Experimental model of fast-rotating inertial orientation system
Inertial sensor units
Stabilization systems
Orientation and navigation systems
Inertial sensor unit
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MEMS gyroscopes and accelerometers
ADDITIONAL FEATURES:
DEVELOPMENT:
IC Design center
CUSTOMERS AND PARTNERS:
Development of high temperature and radical use electronics. Development of VLSI for engine control.
DEVELOPMENT PROSPECTS:
VLSI for primary conversion of signals from optical, magnetic, capacitance, resistive sensors.
Smart sensors VLSI : o Capacitance sensors of speed-up and moving. o Resistive sensors of pressure and temperature. o Magnetic encoders of location and angular
displacement o Optical smoke sensor. o 16-bit microcontrollers
Staff training in design of electronic instrumentation with the use of CAD of leading global companies.
Ability to share CAD Cadence, Synopsys, Metntor Graphics according to license agreements
RESISTANT ECB FOR DEFENSE TECHNOLOGY AND WEAPON:
IC for development of small-sized meteorological stations, pressure/temperature sensors on the basis of resonant detector elements
IC for processing and signal transformation from gyroscopes and accelerometers
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ES Logic, didgital-analog 3D SiP / SoC
IC integration. Way to grouth
Well positioned for innovative business development
International partnerships
Special economic terms
Entrepreneurial spirit
Comprehensive facilities
Breakthrough projects
Exceptional team
Our Services: Infrastructure (office space, meeting room, lab facilities, research and
manufacturing equipment). Business services (help with registration, licenses, accounting, strategy advice,
market research, partner search, internationalization). Financing (equity investment, credit and guarantees). Participation in international cooperation programs and traineeships. People connectivity (coaching and interaction with fellow entrepreneurs (a micro-
cluster), market linkages.
Invest Department provides startups business support, assistance in commercializing results of their R&D
in the nanotechnology, microelectronic, biotech and cleantech and other technologies, attracts investors and industrial partners.
Funding of innovation companies
Nano- and microelectronics
New materials and structures Systems on the base of matrix micro-mirrors.
3D-technologies, manufacturing of micro- an