techshanghai2016 - 高可靠性pcb – 从设计到制造

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Your Key Component NCAB GROUP CHINA © | CORPORATE PRESENTATION | 6.5

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Page 1: TechShanghai2016 - 高可靠性PCB – 从设计到制造

Your Key Component™

NCAB GROUP CHINA © | CORPORATE PRESENTATION | 6.5

演示者
演示文稿备注
Your Key Component We produce our customers' most important component (Your Key Component); the PCB. Our target group is customers for whom the PCB is a strategic product throughout the entire product life cycle.
Page 2: TechShanghai2016 - 高可靠性PCB – 从设计到制造

45 市场

13 公司

18 在中国工厂

283 专家

VISION

The Number 1 PCB Producer wherever we are

MISSION

PCBs for demanding customers, on time with zero defects and at the lowest total cost

演示者
演示文稿备注
Our mission PCBs for demanding customers, on time with zero defects and at the lowest total cost Our ongoing goal is to assist our customers achieve the best possible time to market and competitive advantage by producing PCBs at the lowest total cost through our competence, delivery precision and product quality. Our vision The Number 1 PCB Producer – wherever we are Our vision is simple. Being number one doesn’t necessarily mean being biggest, even if size provides leverage that is important for us. In our case, number one also means being able to lead the market in terms of expertise, quality of service, technology etc. Being number one attracts not only the best customers, with the most attractive and important projects, but also the best factories. We should also be number one on each market we are at and decide to be at Global player/A leading player in Europe “Glocal” strength Our presence on many markets gives us strong purchasing power – which you can benefit from. At the same time, it provides security in the form of a long term perspective and stability. You achieve success through all the production volume the “others” buy along with you. NCAB Group is where you are We currently have companies in Denmark, the United Kingdom, Finland, China, Macedonia, Norway, Poland, Russia, Spain, Sweden, Germany France and USA. Continual expansion Our strategy is to continually investigate new markets in order to achieve even greater purchasing power and benefits for our customers. Transfers without disruption Our presence on many markets makes it easy to follow a part number along with its demands and specifications. Explanation for number of factories 12 factories in Asia from which 10 are Partners/Challengers in our PSL and 2 are for special projects above 1MuSD/year 6 in Europa and 2 in the US - the ones we have regular business with
Page 3: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性PCB--设计与制造

Page 4: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性

NCAB看DFX

NCAB设计和制造

Page 5: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性

必要性

价值观

Page 6: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性? 1% =100%

Page 7: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性?安全红线

Page 8: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性?信誉生命线

Page 9: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性?商业中的价值观

Page 10: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性?产品的灵魂“一丑可遮百俊”

Page 11: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性? -产品无时不刻地透射着生产者精神及社会责任

Page 12: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性—渗透雕琢精品的匠人精神 高可靠性—承载安全责任和价值观 高可靠性—给产品注入灵魂的过程

Page 13: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性

NCAB看DFX

NCAB设计&制造

Page 14: TechShanghai2016 - 高可靠性PCB – 从设计到制造

电子产品高可靠性的PCB设计,英文简称: DFX---Design for X 。 DFX与产品研发同步进行,在关键节点进把关,

•包括:工艺性分析、制造合理性评估等等, •最终目的:完成产品,缩短研发周期,创造品质及成本优势。

在PCB设计时主要考虑的核心为: DFM, DFA , DFT, DFR

DFM

DFA

DFR

DFT

DFP

DFS

DFE

DFX

DFM(可制造性)

DFA(可组装性)

DFT(可测试性)

DFR(可靠性)

高可靠性—我们如何看?

Page 15: TechShanghai2016 - 高可靠性PCB – 从设计到制造

有统计表明:

60% 的生产总成本取决于产品最初的设计

75% 的制造成本取决于设计的规范与说明

80% 的生产缺陷可由设计端改善

电子产品发展趋势,体现为高密度、小型化、智能化的方向,制造端面临的问题将会越来越多。

在研发设计早期中加入DFM分析,就能更早发现并纠正问题。发现问题越晚,成本和周期都将大量的增加。

DFM的价值体现就是在设计阶段预见并解决大部分的可制造问题。

设计阶段

生产阶段

交付阶段

Page 16: TechShanghai2016 - 高可靠性PCB – 从设计到制造

如果未考虑DFM的产品设计,制造阶段的风险不可控,特别是复杂的设计。 如果设计者对制造了解不多,不熟悉后端生产各个工厂设备的常规与极限能力。设计就难以符合最佳生产要求 ---- 通常问题体现在报废率上升、板材利用率低、周期延长、生产效率低、返修和调试不便等等。

DFM整体解决方案

周期

成本 工艺

Page 17: TechShanghai2016 - 高可靠性PCB – 从设计到制造

合理运用DFM,能将大部分生产缺陷,在设计端提前解决掉

比如,以下常见的一些不良: ->设计产品工艺要求高,生产难度大,成品率低 ->孔铜镀层太薄,不均匀,影响产品生命周期 ->装贴阻容小件容易返修 ->板翘

孔铜镀层太薄

外形公差太大 焊接不良

电容立碑 板翘

Page 18: TechShanghai2016 - 高可靠性PCB – 从设计到制造

高可靠性

NCAB看DFX

NCAB设计&制造

Page 19: TechShanghai2016 - 高可靠性PCB – 从设计到制造

设计阶段

生产阶段

交付阶段

高可靠性保障的 三个阶段

Page 20: TechShanghai2016 - 高可靠性PCB – 从设计到制造

1. 电子产品PCB设计阶段的过程步骤检查 从资料准备到生产的每阶段,都有DFM检查项,包括最终的加工说明书

• 资料预审及初步建议 资料准备

• 初核可焊及可制造性 器件布局

• 初核可靠性及可焊性 信号布线

• 初核可焊及可测试性 丝印装配

• 初审后的全面性审核 评审检查

• 审核加工需求完整性 生成光绘

NCAB也会规范到每一个细节, 包括孔铜厚、翘曲度、蓝胶、离子污染度等细致要求,以确保生产问题完全可控。这本身也是DFM的重要一环。

Page 21: TechShanghai2016 - 高可靠性PCB – 从设计到制造

PCB设计的6个阶段检查 我们把PCB设计,从DFM角度上细化成6个阶段, 每个阶段都有相应的初审,再通过开发的自动化系统去管控每个步骤。

我们严格执行DFM的“流程化检查”,经过每阶段的初审,到项目终审时,已经最大限度消除DFM问题。而非依赖项目最后的整体检查---这需要很大工作量,而且效果难以理想。

Page 22: TechShanghai2016 - 高可靠性PCB – 从设计到制造

2. 不同产品的差异定制检查 不同项目类型,不同的检查项。 • 比如HDI、FPC类的产品,生产关注的重点与普通设计不同。而民用和军用产品的标准也不同。 • 比如我们针对轨道交通类设计,因使用环境不同,会有一套专门的标准,包括特殊的DFM和EMC要求。我们会不定期跟进客户调试情况,以及我们内部讨论,持续改进检查表。 这样的定制检查,能更有效的发现问题,同时避免许多多余检查,提高效率。

Page 23: TechShanghai2016 - 高可靠性PCB – 从设计到制造

3. 3D模式辅助检查 3D封装库平台,模拟产品组装情况,及时发现器件装配,干涉的问题。 步骤检查过程在3D模式下进行,效果更直观。很容易早期发现组装问题。后期还可以提供Step与CAD在3D软件进行对接。

Page 24: TechShanghai2016 - 高可靠性PCB – 从设计到制造

4. NCAB 独立的DFM报告服务 对于不在我司设计的生产客户,也经常让我们做生产前的DFM评估。 以减少生产带来的风险。 报告结果都是自动+人工处理后,清晰、关键的修改意见,包括风险类型、风险等级、如何修改等,避免软件直接生成的庞大数据去面对客户,且不存在误报,能帮助客户比较清晰高效的做出决策。

NCAB DFM 报告截图

Page 25: TechShanghai2016 - 高可靠性PCB – 从设计到制造

我们的检查列表共有76条针对DFM的检查条例,其中有9条是NCAB独有,7条是高于IPC标准。我们确保每个项目都经过严格的DFM审查才能进入生产环节,帮助客户把风险控制到最小。

76

9 7

Page 26: TechShanghai2016 - 高可靠性PCB – 从设计到制造

具体检查分类(PCB) 主要针对PCB及PCBA两个方面: 带有NCAB UNIQUE标识是NCAB 针对该项有制定了特殊要求。 带有BEYOND IPC标识是NCAB在 高于IPC标准的基础上做了参数优化。 在我司生产及验收的PCB,全部必须 符合上述指标要求。 经过多年验证,这些特殊的要求对PCB的质 量(特别是可靠性)改善有很大帮助(即DFR) 有些问题在产品使用一段时间后才会暴露, 如果没有特殊要求,板厂在生产时并不会特意 考虑。为了给客户提供始终如一的可靠品质, 我们在关键点上始终坚持自己的严格标准。

PC

B

板材 NCAB UNIQUE

孔铜 NCAB UNIQUE BEYOND IPC

阻焊 NCAB UNIQUE

蓝胶 NCAB UNIQUE

丝印

布线

蚀刻

镀层

布局

Page 27: TechShanghai2016 - 高可靠性PCB – 从设计到制造

具体检查分类(PCBA) 以下是DFM针对PCBA的具体检查类别 基于DFM考虑的 良好设计以及质量可靠的PCB, 能

大大减小焊接难度,

提高良品率。

PCBA

基准点 返修 回流焊 波峰焊

工艺要求 器件方向 拼板

器件安装 焊盘

Page 28: TechShanghai2016 - 高可靠性PCB – 从设计到制造

NCAB DFM检查方法 在实际检查的过程中, 纯粹的DFM自动检查也有弊端,比如误报,数据量大,分析费时等等。 NCAB采用以下方式进行检查,让DFM更加高效,实用。 1. 每个阶段的针对检查 2. 不同产品的定制检查 3. 3D模式辅助检查 4. NCAB独立DFM报告

阶段性检查

自动+人工筛选式检查

Page 29: TechShanghai2016 - 高可靠性PCB – 从设计到制造

设计阶段

生产阶段

交付阶段

Page 30: TechShanghai2016 - 高可靠性PCB – 从设计到制造

NCABGROUP © | CORPORATE PRESENTATION | SE | 2.0 xxxx-xx-xx Firstname Lastname

NCAB制造

Page 31: TechShanghai2016 - 高可靠性PCB – 从设计到制造

NCAB 在PCB制造的每个工艺环节,都有自己的管控规范和流程,这一切都是为了确保PCB成品的优良品质和高可靠性。

Page 32: TechShanghai2016 - 高可靠性PCB – 从设计到制造

NCAB的制作规范整体高于IPC标准,特别是针对产品可靠性相关的重要参数。 示例如下: 孔壁铜厚

演示者
演示文稿备注
DESCRIPTION This relates to the amount of copper that is plated into the drilled hole. Necessary for good electrical continuity between all layers. WHAT DOES IPC SAY? IPC class 2 copper plating (standard acceptance criteria within most PCB factories) demands 20um nominal copper thickness through the hole, with low spots of 18um. NCAB Group and our factories work to IPC class 3 copper through hole as standard. This provides 25um nominal thickness, with low spots of 20um. We are putting 20% more copper through the hole of the PCB. This has been our way of working for a long time as it quite simply offers greater reliability and therefore is #1 on this list.
Page 33: TechShanghai2016 - 高可靠性PCB – 从设计到制造

PCB表面离子污染

演示者
演示文稿备注
DESCRIPTION This relates to the amount of copper that is plated into the drilled hole. Necessary for good electrical continuity between all layers. WHAT DOES IPC SAY? IPC class 2 copper plating (standard acceptance criteria within most PCB factories) demands 20um nominal copper thickness through the hole, with low spots of 18um. NCAB Group and our factories work to IPC class 3 copper through hole as standard. This provides 25um nominal thickness, with low spots of 20um. We are putting 20% more copper through the hole of the PCB. This has been our way of working for a long time as it quite simply offers greater reliability and therefore is #1 on this list.
Page 34: TechShanghai2016 - 高可靠性PCB – 从设计到制造

PCB阻焊厚度

演示者
演示文稿备注
DESCRIPTION This relates to the amount of copper that is plated into the drilled hole. Necessary for good electrical continuity between all layers. WHAT DOES IPC SAY? IPC class 2 copper plating (standard acceptance criteria within most PCB factories) demands 20um nominal copper thickness through the hole, with low spots of 18um. NCAB Group and our factories work to IPC class 3 copper through hole as standard. This provides 25um nominal thickness, with low spots of 20um. We are putting 20% more copper through the hole of the PCB. This has been our way of working for a long time as it quite simply offers greater reliability and therefore is #1 on this list.
Page 35: TechShanghai2016 - 高可靠性PCB – 从设计到制造

PCB过孔塞孔深度的要求

演示者
演示文稿备注
DESCRIPTION This relates to the amount of copper that is plated into the drilled hole. Necessary for good electrical continuity between all layers. WHAT DOES IPC SAY? IPC class 2 copper plating (standard acceptance criteria within most PCB factories) demands 20um nominal copper thickness through the hole, with low spots of 18um. NCAB Group and our factories work to IPC class 3 copper through hole as standard. This provides 25um nominal thickness, with low spots of 20um. We are putting 20% more copper through the hole of the PCB. This has been our way of working for a long time as it quite simply offers greater reliability and therefore is #1 on this list.
Page 36: TechShanghai2016 - 高可靠性PCB – 从设计到制造

类似这样NCAB独有的可靠性相关的参数管控有100多项, 我们品质管理团队的日常工作就是深入生产线,查核设备状态,确认生产参数和生产记录… 确保我们的产品完全满足NCAB产品规范。

演示者
演示文稿备注
DESCRIPTION This relates to the amount of copper that is plated into the drilled hole. Necessary for good electrical continuity between all layers. WHAT DOES IPC SAY? IPC class 2 copper plating (standard acceptance criteria within most PCB factories) demands 20um nominal copper thickness through the hole, with low spots of 18um. NCAB Group and our factories work to IPC class 3 copper through hole as standard. This provides 25um nominal thickness, with low spots of 20um. We are putting 20% more copper through the hole of the PCB. This has been our way of working for a long time as it quite simply offers greater reliability and therefore is #1 on this list.
Page 37: TechShanghai2016 - 高可靠性PCB – 从设计到制造

设计阶段

生产阶段

交付阶段

Page 38: TechShanghai2016 - 高可靠性PCB – 从设计到制造

NCAB的交付标准—存放,包装,物流

Storage time and date codes: Maximum 3 date codes in one shipment following the FIFO principle (First In First Out) and storage time limitations below: LF HASL, HASL, ENIG: 6 months Semi-plugged ENIG: 3 months Immersion Tin: 1 month Immersion Silver: 1 month OSP: 3 months Flash gold plating: 3 months

Stack of boards shall be covered by ESD plastic by vacuum. The plastic used shall be ESD (Electrostatic Discharged) plastic. The plastic shall fulfill the demands in IEC 61340-5-3 and required “A static dissipative material shall meet have a surface resistance ≥1 × 10^4 Ω and <1 × 10^11 Ω”.

Page 39: TechShanghai2016 - 高可靠性PCB – 从设计到制造

Packing and Labeling of Boxes 1. NCAB boxes shall be used for final packing (of the stacks). Box design according to instruction “NCAB_Wrap.pdf”. 2. The packing shall be done in a way to prevent movement and damage of the goods. Only ESD safe material can be used as packing material. If the boards/stacks do not fit into the NCAB box size, neutral box can be used (neutral box = no logotype, no pattern allowed on the box). 3. Each article (product) shall be packed separately, only one article number in each box. 4. The weight of each box shall never exceed 20 kg. 5. No commercial documents are allowed inside or outside the box. Only Test reports, coupons, cross sections and solder tests are allowed to be packed in the box

NCAB的交付标准—存放,包装,物流

Page 40: TechShanghai2016 - 高可靠性PCB – 从设计到制造

准时交货

演示者
演示文稿备注
DELIVERY PRECISION The graph shows the number of orders delivered on time to the customer´s site.�Through forecasts and buffer stocks, 100% delivery accuracy is achieved.
Page 41: TechShanghai2016 - 高可靠性PCB – 从设计到制造

总结: NCAB在设计端做大量DFM的目的是–

让设计和生产无缝接合,为客户提供高可靠性PCB板。 PCB在生产环节难度更低、周期更短,缺陷更少。 最终实现总成本最低。

Page 42: TechShanghai2016 - 高可靠性PCB – 从设计到制造

Thanks!