the development of ultra high-speed metal film deposition...
TRANSCRIPT
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Journal of the Korea Academia-Industrial cooperation SocietyVol. 18, No. 7 pp. 17-25, 2017
https://doi.org/10.5762/KAIS.2017.18.7.17ISSN 1975-4701 / eISSN 2288-4688
17
1, 2, 3, 2*1 , 2 ICT, 3 BT
The development of ultra high-speed metal film deposition system and process technology
for a heat sink in digital devices
Hyo Eun Yoon1, Seong Joon Ahn2, Dong Hwan Han3, Seungjoon Ahn2*1Department of Physics & Nano Science, Sun Moon University
2Division of Mechanical and ICT Convergence Engineering, Sun Moon University3Department of BT-Convergent Pharmaceutical Engineering, Sun Moon University
LED OLED heat sink . Cu m Cu . Cu heating . . Cu 1000 /s 100 m ~2.0% .
Abstract To resolve the problem of the temperaturerise in LED or OLED lighting, until now a thick metal film hasbeen used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as theheat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film witha thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated fromthe ceramic crucible,which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating alsocontributes to the high deposition rate. By tuning the various parameters, we obtained a 100-m thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as1000 /s.
Keywords : Heat sink, IVD, LED, Metal film, OLED, Ultra-high speed metal deposition
*Corresponding Author : Seungjoon Ahn(Sun Moon Univ.)Tel: +82-41-530-22617 email: [email protected] Received April 6, 2017Accepted July 7, 2017
Revised (1st June 20, 2017, 2nd July 6, 2017)Published July 31, 2017
1.
LED(Light-Emitting Diode)
major . LED ~40%
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shift
. (Organic Light Emitting Diode ; OLED) main stream OLED
[1-3].
. heat sink( ) substrate heat sink [4,5]. heat sink LED OLED
Fig. 1 . LED OLED substrate glass 1 W/mK glass substrate OLED display 86C [6,7]. substrate . OLED
.
AMOLED TFT LED ,
m Cu .
Fig. 1. The heat sinks of the LED lighting.
Cu 401 W/mK[8]
substrate .
CVD(Chemical Vapor Deposition) [9], sputtering [10], evaporation [11] quality ( nm/min) m Cu . [12] m
OLED [13]. IVD(Inductive-Vaporized
Deposition) m Cu , flexible OLED substrate 1000 /s .
2.
[14] source ( : 10-5 Torr) CVD sputtering (6 m/min ) [15]. IVD Cu heating ,
[16]. evaporator sputter 1~2 m/min 6~7 m/min [17]. 100
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19
m 10~15 min
OLED , .
Fig. 2. Design of the high-speed IVD-type deposition equipment.
Fig. 2 IVD source . source 1, 2 1 1 2 source .
heating . ~1000 /s . power power source melting
. Fig. 2 ceramic housing graphite heating block
power output output .
Source melting substrate substrate
. Source flange source substrate shutter
. process
.
cooling block . water line bellows . cooling block 220~230C heating substrate .
IVD source source .
. graphite . 2 graphite . Graphite( 100 ppm, 1.8 kg/m3) test
. graphite
.
source (W) .
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3.
3.1
parameter
Fig. 3 recipe , . OLED , 100 m 1000
parameter ~450 /s uniformity roughness . recipe parameter
.
-Base pressure : Torr-B 2 inch sapphire
-Source to wafer : 250~350 mm-Output power : source ramping up
Fig. 3. The basic recipe of the induction-heating high-speed deposition system.
~1000 /s source shutter low quality
. power(5.0~6.0 kW)
power source material melting
. , ceramic housing graphite heating block power output output .
Source wafer . Solid angle() ,
.
. source source target
. Source wafer quality . Z-motion manipulate
source substrate substrate substrate uniformity source substrate 200~250 mm . Z-motion manipulate Z-axis 140 mm . source substrate substrate . Table 1 source substrate substrate Fig. 4 Z-motion manipulate .
Table 1.Temperature of the substrate according to the distance from the source.
Distance (mm) Substrate Temperature(C)
300 209
220 265
200 340
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21
(a) (b)
Fig. 4. (a) Design of the Z-motion manipulate and (b) the photograph of the installed one.
Ceramic housing graphite heating block power output recipe 30 min ~173 m . Fig. 5 recipe 30 min .
2 inch sapphire . sapphire Cu adhesion . sample
. parameter .
-Base pressure : Torr
-Process pressure : Torr-A W 2 inch sapphire .
-Source to wafer : 200~220 mm
Fig. 5 ~1000 /s . source melting graphite
W carbon graphite sheet .
Fig. 5. The 173 m-thick film whose thickness being measured by digital micrometer. (deposition time : 30 min)
3.2
IVD
Fig. 6 recipe , .
Fig. 6. Standard deposition recipe of 95 m-thick film with deposition rate of 1000 /s.
base pressure
Torr, process pressure Torr . graphite W 4 inch Si wafer .
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Source wafer substrate source wafer
source wafer 200~220 mm setting . Fig. 6 1000 /s 30 m, 95 m . 1000 /s, 95 m sample 1(1019) recipe 16 min , 30 m sample 2(1102) recipe 5 min sample . ~60 m
.
95 m sample 1(1019) Olympus(MX61) [18].
Olympus(MX61) sample . sample resin( : EpoKwickTM, : Epoxy Resin 20-8136-128) hardener( : EpoKwickTM, : Epoxy Hardener 20-8138-032) 5:1 , 70C 2 . cutting polishing
alumina (1.0 m, 0.3 m) , polishing . sample 25~1000 . 95 m sample 1(1019)
Fig. 7 (a) wafer 5 point(Top, Center, Bottom, Left, Right) . uniformity () (-) (-) % 3% spec-in . Fig. 7 (b) sample 1(1019) . Fig. 7 (b)
T(95.01 m), C(96.41 m), B(95.01 m), L(95.86 m), R(95.27 m) 95.51 m uniformity 0.9% ~995 /s .
(a)
(b)
Fig. 7. (a) The points in a standard sample 1(1019) where the thickness were measured. (b) The photo of the thickness measurement using the Olympus(MX61) microscope.
(Dual-beam Focused Ion Beam System) source Ga tip . source 30~50 kV source extractor 2 image [19].
30 nm~60 m [20]. ~30 m sample 2(1102) sample
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23
1(1019) wafer 5 point . Fig. 8 sample 2(1102) T(30.79 m), C(30.70 m), B(29.57 m), L(29.42 m), R(30.69 m) 30.15 m uniformity 1.8% . Sample 2(1102) 5 min 1005 /s sample 2(1102) 1000 /s .
Fig. 8. Photos of the thickness measurement of the standard sample 2(1102) using the dual ion beam-focusing system.
test batch to batch uniformity 0.8% .
.
4.
LED , OLED Cu
. OLED/LED evaporator sputter AMOLED TFT
LED m Cu . Cu (, sputtering, e-beam) , OLED Cu IVD
.
, , . flexible target OLED (Organic LED) ,
1000 /s , 10 /s
. , OLED , ~80 m
.
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(Hyo Eun Yoon) []
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(Seong Joon Ahn) []
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(Dong Hwan Han) []
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