wire bond process introduction. contents assembly flow of plastic ic wire bond 原理 m/c...
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WIRE BOND PROCESS INTRODUCTION
CONTENTSCONTENTS ASSEMBLY FLOW OF PLASTIC IC
Wire Bond 原理 M/C Introduction
Wire Bond Process
Material
SPEC
Calculator
DEFECT
封裝簡介封裝簡介
晶片 Die 金線 Gold Wire
導線架
Lead fram
Wafer Grinding Die BondingWafer Saw toaster
Wire Bonding Die Surface Coating
Molding Laser Mark
Solder Ball
Placement Singulation
Packing
封裝流程
Dejunk
TRIM
Solder
Plating
Solder
Plating
Dejunk
TRIM
TRIM/
FORMING
BGA
SURFACE
MOUNTPKG
THROUGH
HOLE PKG
Wire Bond 原理Wire Bond 原理
padpadleadlead
Gold wireGold wire
Ball BondBall Bond
( 1st Bond )( 1st Bond )
Wedge BondWedge Bond
( 2nd Bond )( 2nd Bond )
GLASS
CONTAMINATIONCONTAMINATION
VIBRATIONVIBRATION
SiO2
Si
GOLD BALL
PRESSUREPRESSURE
MOISTURE MOISTURE
AL2O3AL2O3
AlAl
B.PRINCIPLE
銲接條件銲接條件 HARD WELDING
Pressure (Force)
Amplify & Frequecy
Welding Time (Bond Time)
Welding Tempature (Heater)
THERMAL BONING
Thermal Compressure
Ultrasonic Energy (Power)
Bond Head ASSYBond Head ASSY• Low impact force
•Real time Bonding Force monitoring
• High resolution z-axis position with 2.5 micron per step resolution
• Fast contact detection
• Suppressed Force vibration
• Fast Force response
• Fast response voice coil wire clamp
X Y TableX Y Table•Linear 3 phase AC Servo motor
•High power AC Current Amplifier
•DSP based control platform
•High X-Y positioning accuracy of +/- 1 mm
•Resolution of 0.2 mm
W/H ASSYW/H ASSY• changeover
•· Fully programmable indexer & tracks
•· Motorized window clamp with soft close feature
•· Output indexer with leadframe jam protection feature
• Tool less conversion window clamps and top plate enables fast device
EagleEagle•Bonding System•Bonding Method Thermosonic (TS)•BQM Mode Constant Current, Voltage, Power and Normal (Programmable)•Loop Type Normal, Low, Square & J•XY Resolution 0.2 um•Z Resolution (capillary travelling motion)2.5 um•Fine Pitch Capability 35 mm pitch @ 0.6 mil wire•No. of Bonding Wires up to 1000•Program Storage 1000 programs on Hard Disk•Multimode Transducer System Programmable profile, control and vibration modes
MACHINE SPECIFICATIONS (I)MACHINE SPECIFICATIONS (I)
Eagle Eagle
•Vision System•Pattern Recognition Time 70 ms / point•Pattern Recognition Accuracy + 0.37 um•Lead Locator Detection 12 ms / lead (3 leads/frame)•Lead Locator Accuracy + 2.4 um•Post Bond Inspection First Bond, Second Bond Wire Tracing•Max. Die Level Different 400 – 500 um
•Facilities•Voltage 110 VAC (optional 100/120/200/210/•220/230/240 VAC
MACHINE SPECIFICATIONS (II)MACHINE SPECIFICATIONS (II)
Eagle Eagle
•Material Handling System•Indexing Speed 200 – 250 ms @ 0.5 “ pitch•Indexer Resolution 1um•Leadframe Position Accuracy + 2 mil•Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm
•Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum)•Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “)•Device Changeover < 4 minutes•Package Changeover < 5 minutes•Number of Buffer Magazine 3 (max. 435 mm)
MACHINE SPECIFICATIONS (III)MACHINE SPECIFICATIONS (III)
Bonding ProcessBonding Process
The Wire Bond Temp
The Wire Bond Temp
PREHEAT BONDSITEPREHEAT BONDSITE
CU L/F200+/-10 200+/-10CU L/F200+/-10 200+/-10
AL L/F210+/-10 230+/-10AL L/F210+/-10 230+/-10
BGA 150+/-10 160+/-10BGA 150+/-10 160+/-10
TFBGA150+/-10 160+/-10TFBGA150+/-10 160+/-10
LBGA 150+/-10 160+/-10LBGA 150+/-10 160+/-10
NOT INCLUDE DEDICATE LINENOT INCLUDE DEDICATE LINE
padpadleadlead
Free air ball is captured in the chamfer
padpad
leadlead
Free air ball is captured in the chamfer
SEARCH HEIGHT
padpadleadlead
Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
Free air ball is captured in the chamfer
padpadleadlead
SEARCH SPEED1
SEARCH TOL 1
Free air ball is captured in the chamfer
padpad leadlead
SEARCH TOL 1
SEARCH SPEED1
Free air ball is captured in the chamfer
padpad leadlead
SEARCH TOL 1
SEARCH SPEED1
Free air ball is captured in the chamfer
padpad leadlead
SEARCH TOL 1
SEARCH SPEED1
Formation of a first bond
padpad leadlead
SEARCH SPEED1
SEARCH TOL 1
Formation of a first bond
padpad leadlead
SEARCH SPEED1
SEARCH TOL 1
IMPACT FORCE
Formation of a first bondContact
padpad leadleadheatheat
PRESSUREPRESSURE
Ultra Ultra
Sonic Sonic
VibrationVibration
Formation of a first bondBase
padpad leadlead
Ultra Ultra
Sonic Sonic
VibrationVibration
heatheat
PRESSUREPRESSURE
Capillary rises to loop height position
padpad leadlead
Capillary rises to loop height position
padpad leadlead
Capillary rises to loop height position
padpad leadlead
Capillary rises to loop height position
padpad leadlead
Capillary rises to loop height position
padpad leadlead
Capillary rises to loop height position
padpad leadlead
RHRH
Formation of a loop
padpad leadlead
RD (Reverse Distance)
Formation of a loop
padpad leadlead
padpad leadlead
padpad leadlead
Calculated
Wire Length
WIRE CLAMP ‘CLOSE’
padpad leadlead
Calculated
Wire Length
padpad leadlead
SEARCH DELAY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
TRAJECTORY
padpad leadlead
2nd Search Height
Search Speed 2Search Tol 2
padpad leadlead
Search Speed 2Search Tol 2
padpad leadlead
Search Speed 2Search Tol 2
Formation of a second bond
padpad leadleadheatheat
Formation of a second bondContact
padpad leadleadheatheatheatheat
padpad leadleadheatheatheatheat
Formation of a second bondFormation of a second bondBaseBase
padpad leadlead
padpad leadlead
padpad leadlead
padpad leadlead
Tail length
padpad leadlead
padpad leadlead
padpad leadlead
Disconnection of the tail
padpad leadlead
Disconnection of the tail
padpad leadlead
Formation of a new free air ball
MaterialMaterial
Leadfram
Capillary
Gold Wire
Leadfram (I)Leadfram (I)
Leadfram ( II )Leadfram ( II )
CAPILLARY (I)CAPILLARY (I)
Capillary Manufacturer
(SPT, GAISER, PECO, TOTO…)
Capillary Data
( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)CAPILLARY (II)
CAPILLARY (III)
TIP ..…… Pad Pitch Pad pitch x 1.3 ~ TIPHole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = HCD………Pad size/open/1st Ball CD + 0.4 ~ 0.6 = 1st Bond Ball sizeFA & OR….Pad pitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15IC type …… loop type
Gold WireGold Wire
Gold Wire Manufacturer
(Nippon , SUMTOMO , TANAKA…. )
Gold Wire Data
( Wire Diameter , Type , )
SPECSPEC
Pad Open & Bond Pad Pitch
Ball Size
Ball Thickness
Loop height
Wire Pull
Ball short
Crater Test
BPO&BPPBPO&BPP 單位 : um or Mil
BPO : 是指 Pad 內層 X 方向及 Y 方向的 size, 一般是取最小值為 我們的 data
BPO : 是指 Pad 如左邊內層至右邊 Pad 左邊外層邊緣其它依此類推 ; 或著一個 Die 上出現不同 Pad 大小那就是以兩個Pad 中心距離為 BPP, 但是一般我們要取一個 Die 上最小的BPP
Bond Pad Pitch
Bond Pad Open
Bond Pad Open
Ball SizeBall Thickness
Ball Size & Ball Thickness 單位 : um , Mil
量測倍率 : 50X
Ball Thickness 計算公式 60 um BPP ≧ 1/2 WD=50%
60 um BPP ≦ 1/2 WD=40%~50%
Ball Size
Loop HeighLoop Heigh 單位 : um , Mil
量測倍率 : 20X
Loop Height
線長
Wire PullWire Pull 1 Lifted Bond (Rejected)
2 Break at neck (Refer wire-pull spec)
3 Break at wire ( Refer wire-pull spec)
4 Break at stitch (Refer stitch-pull spec)
5 Lifted weld (Rejected)
Ball ShortBall Short 單位 : gram or g/mil²
Ball Shear 計算公式 Intermetallic ( IMC )有 75% 的共晶 ,SHEAR STRENGTH 標準為> 6.0g/mil² 。
SHEAR STRENGTH = Ball Shear/Area (g/mil²)
Ball Shear = x; Ball Size = y; Area = π(y/2) ²
x/π(y/2) ² = z g/mil²
CBall bond
Test specimen
Specimen clamp
Shearing ram
Wire
Bond shoulder
Interfacial contactball bond weld area
Bonding padh
(A) Unsheared
CL CBall bond
CL
Test specimen
Specimen clamp
Bonding pad
Full ball attached towire-except for regionsof intermetallic voiding
Ball separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyedball and metal) on pad in bondinteraction area
(D) Ball bond-bonding pad interface separation (typical Au to Al)
C
Test specimen
Specimen clamp
Shearing ram
WireMinor fragment of ballattached to wire
Bonding padCL
Ball sheared too high(off line, etc.)only aportion of shoulder andball top removed
Interfacial contactball bond weld area
(B) Wire (ball top and/or side) shear
CBall bond
CL
Test specimen
Specimen clamp
Shearing ram
Bonding pad
Major portionof ball attached to wire
Interfacial contact-ball bond weld areaintact
(C) Below center line shear, ball sheared through (typically Au to Au)
CBall bond
CL
Test specimen
Specimen clamp
Bonding pad
Pad metallizationseparates fromunderlying surface
Residual pad on ballball-pad interfaceremains intact
(E) Bond pad lifts
Test specimen
Specimen clamp
CBall bond
CL Bonding pad
Bonding pad lifts,taking portion of underlyingsubstrate material with it
(F) Cratering
Residual pad and substrate attachedto ball,ball-pad interface remainsintact
Shear Failure Modes
Crater TestCrater Test
Calculate (I)Calculate (I) UP Time =
(Total Actual Production Times – Total Repair Time )
Total Actual Production Time
DOWN TIME RATE= Total Repair Time
Total Actual Production Times
Total Operator Actual Repair TimeTotal Operator Repair Frequency Stoppages
Total Actual Production Times – Total Operator Repair Time
Total Operator Repair Frequency Stoppages
Total Technical Actual Repair Times
Total Technical Repair Frequency Stoppages
MTTS (MEAN TIME TO STOP ) =
MTBS (MEAN TIME BETWEEN STOP)=
MTTA (MEAN TIME TO ASSISTANCE ) =
Calculate (II)Calculate (II) MTBA (Mean Time Between Assistance) =
Total Actual Production Times – Total Technican Repair Times
Total Technical Repair Frequency Stoppages
MTBF(Mean Time Between Failure)= Total Actual Production Times – Total Technician Repair Time
Total Change Parts Repair Frequency Stoppage
規格寬度 製程寬度
規格上限 - 規格下限 6 σ( 公差 )
( 上限 or 下限 ) - 平均值 三個公差
CP ( 製程能力指標 ) =
CPK =
=
QualityQuality 正常品 Material Problem
1st Bond issue
(Peeling , Ball Lift , Off Center)
2nd Bond issue
( 滑針,縫點脫, short tail )
Looping Fail
(wire snake wire , sweep wire
loop base bent )
正常品
Material Problem
With Ball Wire
Pad Size Missing Ball
Wire Broken
Bonding Ball Inspection
• Ball Detection
Ball Size
Pad Center
Ball Center
Ball Placement (X,Y)
Ball Off Pad
Bonding Ball Inspection (cont.)
• Ball Measurement
Peeling1st Bond Fail ( I )
Ball Lift
1st Bond Fail (II) Ball Lift
Neck Crack
1st Bond Fail ( III )
Off Center
1st Bond Fail (IV) Off Center Ball
1st Bond Fail (V)Smash Ball
Smash Ball
With Weld
Wire
Capillary Mark
Missing Weld Wire Broken
Lead
Bonding Weld Inspection
• Weld Detection
2nd Bond Fail ( I ) 滑針
2nd Bond Fail ( II ) 縫點脫落
縫點脫落
Looping Fail(Wire Short I)Wire Sweep
Wire Short
Looping Fail(Wire Short II)Loop Base Bend
Wire Short
Looping Fail(Wire Short III)Excessive Loop
Wire Short
THE ENDTHE END