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Found CHROMA TAIWAN Work Experience

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  • FoundCHROMA

    TAIWANWork Experience

  • 1984ICPXI

  • 1984ICPXI

    1

  • 2

  • Semiconductor

    3

  • 3110

    IC/4

  • 3110

    IC/5

  • Record

    RD: Lance/Angus/Hank/Rory/Bobson IE: Bow/Freeman QA: Dean

    3110

    100 08 08 () 14 30 16 30

    100 01 05 bobson wii

    1 New 3110

    3260 : 1.Empty STACK 2.Input STACK 3.Output STACK 4.perherter 5.CCD 6.Tary change 7.Floating Block 8.Hot Block 9.Arm y

    New 3110 (for 55*55):

    6

  • RD: Lance/Angus/Hank/Rory/Bobson IE: Bow/Freeman QA: Dean

    3110

    100 08 08 () 14 30 16 30

    100 01 05 bobson wii

    1 New 3110

    3260 : 1.Empty STACK 2.Input STACK 3.Output STACK 4.perherter 5.CCD 6.Tary change 7.Floating Block 8.Hot Block 9.Arm y

    New 3110 (for 55*55):

    7

  • Consensus

    :1098mm :1165mm

    8

  • Consensus

    :1098mm :1165mm

    Frame

    9

  • Design

    10

  • 11

  • 2012 12 14

    1 1

    3110 SLT SOP

    001

    F-09-32 Ver.04

    1.

    SLT

    2. 5mm M6X20 13 M6 13

    3. SLT

    3.1 SLT ()

    SLT

    P2

    12

  • 2012 12 14

    1 1

    3110 SLT SOP

    001

    F-09-32 Ver.04

    1.

    SLT

    2. 5mm M6X20 13 M6 13

    3. SLT

    3.1 SLT ()

    SLT

    P2

    13

  • BOM

    1 2

    L10 001644 3110 (Arm X) CASE ASSEMBLY

    A39 000012 ,SMC PS1100-RO6L,DC12-24V 2 EA 1150 2300 A93 000050 6001ZZ 1 EA 37 37 G32 003683 (sensor) 3110-A01-006 1 EA 150 150 G32 003684 (Holder) 3110-A01-014B 1 EA 1200 1200 G32 003685 () 3110-A01-022 1 EA 140 140 G32 003686 () 3110-A01-023 1 EA 120 120 G32 003696 (X) 3110-A01-001 1 EA 600 600 G32 003699 (Y) 3110-A01-004 1 EA 1600 1600 G32 003704 (X) 3110-A01-005 1 EA 550 550 G32 003707 (X) 3110-A01-007 1 EA 350 350 G32 003709 (X) 3110-A01-002 1 EA 350 350 G32 003714 () 3110-A01-024 2 EA 100 200 G32 003715 (X) 3110-A01-003 1 EA 500 500 G32 003716 () 3110-A01-018A 1 EA 350 350 G32 003718 () 3110-A01-017 1 EA 350 350 G32 300100 3240-S1-027 2 EA 26 52 G32 385400 (Y) 3240-A1-006B 2 EA 350 700 G55 055400 C GR-30 1 EA 3 3 G59 010900 AN101-01 2 EA 60 120 G59 020300 PC4-M5M,Pisco 4 EA 25 100 PISCOG61 000229 ,THK SHS30R1QZSS-690L(G=25/25 1 EA 11950 11950 G62 000700 6200ZZ NSK 2 EA 48 96 G62 000800 6203ZZ 1 EA 34 34 G63 000439 E16.3.075.0 25 EA 28 700 G63 000440 117.3.12PZ 1 SET 255 255 G63 000442 20x1900mm200-S5M-OPEN(1900) 1 EA 1300 1300 G63 000448 3110-A01-020 1 EA 1310 1310 G63 009200 (XPulley) 3240-A1-012 1 EA 400 400 G63 009800 () 150-S5M-320-CLOSE,15x320 1 EA 180 180 G64 000340 PEG4-6M 2 EA 50 100 PISCOG64 000343 ZX1102-K15LOZ-F 2 EA 3000 6000 G64 005700 UQ04-4F-100M-B 900 EA 0.47 423 PISCOG71 014000 Timing Pulley 3240-A1-003A 1 EA 490 490 H82 631002 M6- 6.3x10.3x1.6D-SUS 3 EA 0.4 1.2 H82 851400 M8- 8.5x14.2x1.7D-SUS 24 EA 0.78 18.72 M92 002000 MHMD 042P1S,Panasonic 400W 1 EA 5450 5450 W23 451002 #28AWGx4C, 4P-CN-14+/500CM 2 EA 93.3 186.6 W23 481080 MFMCA0050EED,PANSONIC 172159-1+170366-1/5M 1 EA 250 250 W23 481082 MFECA0050EAM,PANASONIC 55100-0670+172160-1,5M 1 EA 400 400

    39316.5

    14

  • 1 2

    L10 001644 3110 (Arm X) CASE ASSEMBLY

    A39 000012 ,SMC PS1100-RO6L,DC12-24V 2 EA 1150 2300 A93 000050 6001ZZ 1 EA 37 37 G32 003683 (sensor) 3110-A01-006 1 EA 150 150 G32 003684 (Holder) 3110-A01-014B 1 EA 1200 1200 G32 003685 () 3110-A01-022 1 EA 140 140 G32 003686 () 3110-A01-023 1 EA 120 120 G32 003696 (X) 3110-A01-001 1 EA 600 600 G32 003699 (Y) 3110-A01-004 1 EA 1600 1600 G32 003704 (X) 3110-A01-005 1 EA 550 550 G32 003707 (X) 3110-A01-007 1 EA 350 350 G32 003709 (X) 3110-A01-002 1 EA 350 350 G32 003714 () 3110-A01-024 2 EA 100 200 G32 003715 (X) 3110-A01-003 1 EA 500 500 G32 003716 () 3110-A01-018A 1 EA 350 350 G32 003718 () 3110-A01-017 1 EA 350 350 G32 300100 3240-S1-027 2 EA 26 52 G32 385400 (Y) 3240-A1-006B 2 EA 350 700 G55 055400 C GR-30 1 EA 3 3 G59 010900 AN101-01 2 EA 60 120 G59 020300 PC4-M5M,Pisco 4 EA 25 100 PISCOG61 000229 ,THK SHS30R1QZSS-690L(G=25/25 1 EA 11950 11950 G62 000700 6200ZZ NSK 2 EA 48 96 G62 000800 6203ZZ 1 EA 34 34 G63 000439 E16.3.075.0 25 EA 28 700 G63 000440 117.3.12PZ 1 SET 255 255 G63 000442 20x1900mm200-S5M-OPEN(1900) 1 EA 1300 1300 G63 000448 3110-A01-020 1 EA 1310 1310 G63 009200 (XPulley) 3240-A1-012 1 EA 400 400 G63 009800 () 150-S5M-320-CLOSE,15x320 1 EA 180 180 G64 000340 PEG4-6M 2 EA 50 100 PISCOG64 000343 ZX1102-K15LOZ-F 2 EA 3000 6000 G64 005700 UQ04-4F-100M-B 900 EA 0.47 423 PISCOG71 014000 Timing Pulley 3240-A1-003A 1 EA 490 490 H82 631002 M6- 6.3x10.3x1.6D-SUS 3 EA 0.4 1.2 H82 851400 M8- 8.5x14.2x1.7D-SUS 24 EA 0.78 18.72 M92 002000 MHMD 042P1S,Panasonic 400W 1 EA 5450 5450 W23 451002 #28AWGx4C, 4P-CN-14+/500CM 2 EA 93.3 186.6 W23 481080 MFMCA0050EED,PANSONIC 172159-1+170366-1/5M 1 EA 250 250 W23 481082 MFECA0050EAM,PANASONIC 55100-0670+172160-1,5M 1 EA 400 400

    39316.5

    15

  • Release16

  • 17

  • Assembly18

  • 19

  • Design Verification

    3110 2/17

    1. ............................................................................................................................... 32. Device Pick and Place ............................................................................................ 3

    2.1 ...................................................................................................................... 32.2 ...................................................................................................................... 3

    2.2.1 Stack Clamp Tray ........................................................ 32.2.2 Delay time for Stack ............................................................ 42.2.3 Tray () carrier ............................................... 52.2.4 Arm Z alignment ......................................................... 72.2.5 Gear Ratio .......................................................................................... 82.2.6 Shuttlle in kit ................................................................... 82.2.7 Rotator Preguide ................................................................................. 9

    2.3 Pick and Place ............................................................................................. 102.3.1 ........................................................................................... 102.3.2 ....................................................................................... 10

    3. Tray Tansfer ......................................................................................................... 123.1 .................................................................................................................... 123.2 Tray Transfer ............................................................................................... 12

    3.2.1 Tray Transfer ............................................................................. 133.2.2 Tray Transfer ............................................................................. 133.2.3 Tray Transfer for Change Kit style ............................................................. 14

    3.3 ..................................................................................................................... 153.3.1 Tray Transfer ..................................................................................... 153.3.2 Tray Transfer ..................................................................................... 153.3.3 Tray Transfer () ............................................................... 163.3.4 ............................................................................................... 16

    4. ................................................................................................................................ 17

    20

  • 3110 2/17

    1. ............................................................................................................................... 32. Device Pick and Place ............................................................................................ 3

    2.1 ...................................................................................................................... 32.2 ...................................................................................................................... 3

    2.2.1 Stack Clamp Tray ........................................................ 32.2.2 Delay time for Stack ............................................................ 42.2.3 Tray () carrier ............................................... 52.2.4 Arm Z alignment ......................................................... 72.2.5 Gear Ratio .......................................................................................... 82.2.6 Shuttlle in kit ................................................................... 82.2.7 Rotator Preguide ................................................................................. 9

    2.3 Pick and Place ............................................................................................. 102.3.1 ........................................................................................... 102.3.2 ....................................................................................... 10

    3. Tray Tansfer ......................................................................................................... 123.1 .................................................................................................................... 123.2 Tray Transfer ............................................................................................... 12

    3.2.1 Tray Transfer ............................................................................. 133.2.2 Tray Transfer ............................................................................. 133.2.3 Tray Transfer for Change Kit style ............................................................. 14

    3.3 ..................................................................................................................... 153.3.1 Tray Transfer ..................................................................................... 153.3.2 Tray Transfer ..................................................................................... 153.3.3 Tray Transfer () ............................................................... 163.3.4 ............................................................................................... 16

    4. ................................................................................................................................ 17

    21

  • P3

    5

    ModulizeDesigneessseeuup DrsAirFlownoondenseeionp

    22

  • 5 ModulizeDesigneessseeuup DrsAirFlownoondenseeionp

    23

  • P4

    1 2 P1

    2.1 PLM 2.2 (F-01-25)2.3 2.4 (F-09-33)2.5 ()2.6 2.7 Product Information (F-09-63)2.8

    3 C1

    4 P2 4.1 (Kick-off Meeting)4.2

    4.2.1 System Block4.2.2 Timing & Flow Chart

    4.3 Project Management Plan (F-09-64)4.4 Project Management Plan 4.5 4.6 /

    4.6.1 (CKM )4.6.3 (CKM )4.6.4 (CKM )

    4.7 4.7.1

    4.7.1.2 4.7.1.3 DFMEA (F-09-52)

    4.7.2 ()4.7.2.1 4.7.2.2 4.7.2.3 I/O 4.7.2.4 DFMEA (F-09-52)

    4.7.3 ()4.7.3.1 UI 4.7.3.2 4.7.3.3 4.7.3.4 Tester Interface4.7.3.5 DFMEA (F-09-52)

    4.8 (C-09-16)

    4.9 DFMEA (C-09-27) (F-09-52)4.10 (F-09-30)

    4.10.1 4.10.2 4.10.3 4.10.4

    5 C2

    6 P3 6.1

    6.1.1 (C-09-06 / C-09-07)6.1.1.1 6.1.1.2 6.1.1.3 /6.1.1.4 6.1.1.5 /6.1.1.6 6.1.1.7 Calibration Procedure (F-09-31)6.1.1.8 (F-09-32)

    6.1.2 6.1.2.1 6.1.2.2 /6.1.2.3 6.1.2.4 Drive 6.1.2.5 6.1.2.6 /6.1.2.7 Calibration Procedure (F-09-31)6.1.2.8 (F-09-32)

    6.1.3 (C-09-14)6.1.3.1 6.1.3.2 /6.1.3.3 IPC Ghost Image6.1.3.4 ()

    6.1.4 /6.1.4.1 6.1.4.2

    6.1.5 (C-09-16)6.2 /6.3 E-BOM (C-09-11)6.4 Spare Parts List6.5 PFMEA (C-09-27) (F-09-52)6.6 6.7

    24

  • P4

    4.9 DFMEA (C-09-27) (F-09-52)4.10 (F-09-30)

    4.10.1 4.10.2 4.10.3 4.10.4

    5 C2

    6 P3 6.1

    6.1.1 (C-09-06 / C-09-07)6.1.1.1 6.1.1.2 6.1.1.3 /6.1.1.4 6.1.1.5 /6.1.1.6 6.1.1.7 Calibration Procedure (F-09-31)6.1.1.8 (F-09-32)

    6.1.2 6.1.2.1 6.1.2.2 /6.1.2.3 6.1.2.4 Drive 6.1.2.5 6.1.2.6 /6.1.2.7 Calibration Procedure (F-09-31)6.1.2.8 (F-09-32)

    6.1.3 (C-09-14)6.1.3.1 6.1.3.2 /6.1.3.3 IPC Ghost Image6.1.3.4 ()

    6.1.4 /6.1.4.1 6.1.4.2

    6.1.5 (C-09-16)6.2 /6.3 E-BOM (C-09-11)6.4 Spare Parts List6.5 PFMEA (C-09-27) (F-09-52)6.6 6.7

    6.7.1 6.7.2 (F-03-32)6.7.3

    6.7.3.1 vs 6.7.3.2 6.7.3.3 6.7.3.4 6.7.3.5 /6.7.3.6 6.7.3.7 (,,)

    6.7.4 6.7.4.1 6.7.4.2 / 6.7.4.3 6.7.4.4 6.7.4.5 6.7.4.6 I/O 6.7.4.7

    6.8 Design Verification (C-09-22)6.8.1

    6.8.1.1 6.8.1.2 6.8.1.3

    6.8.2 6.8.2.1 6.8.2.2 6.8.2.3 6.8.2.4 (ESD) 6.8.2.5 Grounding Test 6.8.2.6 6.8.2.7

    6.8.3 6.8.3.1 6.8.3.2

    6.8.4 6.8.5 6.8.6 6.8.7 MTBF

    6.9 Design Validation (C-09-17)6.9.1 // 6.9.2 Site

    6.9.2.1 (F-09-62)6.9.2.2

    6.10 (C3 )

    6.11 Engineer Document Check List (F-09-65)6.12 (C-09-20)

    6.12.1 (F-09-19)6.12.2 ()6.12.3 ()

    7 C3

    8 P4 8.1 (C-09-24)8.2 Configured BOM (F-09-43)8.3 (CKM )

    25

  • 3110

    Model Hybrid Single Site Test Handler26

  • 27

  • 3110Key Features:Reliable high-speed Pick & Place handlerAuto Tray Load/unload & Device Sorting capabilityTester Zero waiting timeWithout socket damage issueAir damper for good contact balanceSocket remain IC check functionCamera for real time system monitoringTri-temp IC test function (optional)High power cooling function (optional)Diskless download function (optional)

    28

  • 3110Key Features:Reliable high-speed Pick & Place handlerAuto Tray Load/unload & Device Sorting capabilityTester Zero waiting timeWithout socket damage issueAir damper for good contact balanceSocket remain IC check functionCamera for real time system monitoringTri-temp IC test function (optional)High power cooling function (optional)Diskless download function (optional)

    29

  • 3280

    Model SD Card Tester and Handler30

  • 31

  • 3280Key FeaturesTester & Handler Integration Test 120pcs micro SD in parallel Test-in-Tray, no pick & place arm before sorting UPH = 5400 with 70 sec test time SD Protocol Aware Tester DC Measurements 32MB Buffer Memory per site Microsoft Windows XP OS Software provides tray map and binning information Compact Size: 164cm X 79cm X 180cm Options: - 3rd party test tools - Change Kits for mini SD, SD and MMC - Loading Content

    32

  • 33

  • 3160

    Model Final Test Handler34

  • 35

  • 3160Key FeaturesFlexible DUT Configuration Adjustable P&P Interval Air damper buffer to reduce contact force impact Intelligent socket IC leftover check Auto Contact Force Learning Color Tray Mode availability Yield Monitor (per contact dead) Yield Control (average yield rate of socket) Compatible change kits with NS-5000 / 6000 / 6040

    36

  • 37

  • 58601

    Model Optoelectronic Source Measurement System38

  • 39

  • 58601Key FeaturesFor Burn-In, Reliability and Life Testing Up to 800 channels Up to 40A per device (preliminary) Up to 150 C Batch processing via device carriers Conversion Kit Interface - change kit for adaption to multiple products

    40

  • 41

  • 3270

    Model Miniature IC Handler42

  • 43

  • 3270Key FeaturesHign throughtput got IC testing Reliable high-speed pick & place handler 3x3 mm miniature device handling capability Air damper for contact balance Auto contact force learning Socket damage free

    44

  • 45

  • 3260

    Model Automatic System Function Tester 46

  • 47

  • 3260Key FeaturesReliable high-speed pick & place handler Tester zero waiting time Gull wing package capability No socket damage Air damper for contact balance IC-in-socket protection Invention patent 190373, 190377, 1227324 & 125307

    48

  • 49

  • Found CHROMA TAIWAN

    20121216 / 3338366 http://www.chroma.com.tw/

    50