1. 2006.8.15

2. SOCFEM FEM / IC FEM/PA IC/Module 2000IC(Design Service) GaAs RF RF MEMS RF 12 3. Brief Introduction of Maxwell Education:2002/09~2004/07: Master of Business Administration in Technology (MOT 91G), NationalChiao-Tung University, Taiwan1996/09~2000/06: Bachelor of Science in Electronics Engineering (EE 89G), National Chiao-Tung University , Taiwan1993/09~1996/09: Special class of Science, Hsinchu Senior High School. Experience:2004/09~2005/01Industry Analyst, Sasson International Holdings, Inc.2005/02~2005/12 Deputy Manger, Sasson International Holdings, Inc.2006/01~now Deputy Manger, Waterland Venture Capital Corp., a subsidiary of WaterlandFinancial Holdings Co., Ltd. Expertise: Technology Forecasting (3~5 years) & Foresight (5~20 years), Venture Capital,Business Incubation,, Entrepreneurship, China Law, Management of Technology PublicationsJournal: Yuan, B.J.C., Chen, M.S.F., Cheng, C.C. (2004), "Role of High-Tech BusinessIncubator on the Contribution towards Knowledge Innovation Systems in China andTaiwan", International Journal of Innovation and Incubation, 1(1), pp.91-116.Thesis: Chen, M.S.F. (2004), The Venture Creation Services- The Convergence ofVenture Capital and Business Incubation, National Chiao-Tung University, Thesis.3 papers on the yearbook of incubators of small and Medium enterprises, 2003. 4. (Handset)2G/2.5G/2.75G/3G/3.5G/4G (WLAN)Wi-Fi a/b/g/ MIMO/Mesh (WMAN)WiMAX/WiBro (WPAN)UWB (WUSB, W1394), Bluetooth, Zigbee (DAB)DAB/DMB /(DTV)DVB-T/S/H GPS / 5. FEM Baseband/MAC ICDigital ICCMOS Transceiver ICMixed-Signal ICRF CMOS, SiGe, GaAs Front-End ModuleAnalog ICPA, Switch,FilterIC RF CMOSICRF CMOS, SiGe, GaAs ICIC RF Transceiver ICRF 6. SOCFEM ICSOCFEM STI, 2006 7. FEM FEMASPBOM RF Package & Testing , RF MEMS FEM/PA Module , RF Passive Device SSkyworks, 2006SDeutsche Bank, Skyworks, 2006 8. IPN/AICRF Mixed- /ICmode SOC FEM/PA IC/Module IC ICIC GaAs RF MEMS GaAs RF MEMS RF IC/MEMS RF RF MEMS/ RF ICRF IP FEM/PA Wi-FiIntel / ICWi-FiIC Wi-Fi 9. / IC Time to Market, Time to Volume, Time to Profit IP IntegrationIC Rich Father (Handset)Via Telecom (CDMA 2000), Via Communication (2G/WCDMA), (WLAN)RalinkWi-Fi MIMO, (WMAN)N/A (WPAN)Bluetooth (DAB)Afatech /(DTV)Afatech N/A 10. FEM/PA IC/Module Low cost PartnershipIC Marketing CapabilityWi-Fi a/b/g (Handset) (WLAN)RFIC (WMAN)N/A (WPAN)Zigbee, BluetoothRFIC (Bluetooth) (DAB) /(DTV) N/A FEMWi-FiBluetoothFEM 11. 2000IC(Design Service)2000SOCIC ICSystem Co.IDM FoundryPost-Foundry< 1980s1980s1990safter 2000IBM, AT&TTITSMC Faraday, Global Unichip, SyntronixNECIntel UMCARM, MIPS, ARC, CEVABurroughsAMD SMIC Cadence, Synopsys, MagmaSiemens etc. Motorola etc. VIA, MediatekSystem Assembly Equipment System Spec.System Spec.IC Design IC DesignFabFab Package/ Package/TestingTesting Source: Shanghai Integrated Circuit Industry Associatio (2003), (2004) 12. (Global Unichip), , , 1998/01/22 www.globalunichip.com.tw47% 30010 03-564-6600 ICA, QMH.264 CodecIC 200 ////2006US$3452M 2006Q2~Q4 Turnkey Service UWB, BluetoothSOCRF CMOS (/) 2003 ASICTurnkey ServiceNRE 2004 IP)2006(f) IC2000 2004 NT$1B29% SOC200668%IC SOC 2005(f) IP2006IP US$2,150M NT$1.6B, YOY58%30%EPS NT$1 13. 14. (Syntronix), , , SOCIPIP8 Fabnow BluetoothIC RenesasTechnology 15. 16. (http://www.winfoundry.com/) 19991093 WLANPAHigh Linearity InGaPHBT 2um for PCS, WLAN/Wi-FiS, 2006 BVceo=15V, fT=35GHz, fmax=100GHzS, 2006 200530,0006200650,000 2002Raytheon(Fairchild)US$5M S, 2006 S, 2006 17. (AWSC), , 8086 -RFMDPA1998/12/30 http://www.awsc.com.tw/PASkyworks 606-5050999 220 ConexantKopin (/)Skyworks-2005/H1 (1)InGaP-WiFiPA56%(2)AlGaAs-GSM PA 3%-EPI43% 2002IDMSkyworksPA 2004NT$186M, 5%, (12)%, EPS NT$(1.10) 2005(f)NT$521M, 14.8%, GSM4%, EPS NT$0.5GSMPAWi-Fi PAWiMAXPAPANBNBWi-FiPA2007WiMaxPA3GPA 18. 19. (http://WWW.THEIL.COM), , , 19758 AEI, Anadigics, DDC,Delphi Automotive Systems, SiGe, NSC,Harris, Skyworks, Siemens, TexasInstrumentsAssembly, Package,Substrate , Laser Manufacturing, HDI (PCB)PCB 36555 78000 1155 (02)2679-0122 20. 21. (Giga Solution), , , 2000/03/04 3G/3.5G, Wi-Fiwww.giga-solution.comMIMO/Mesh, DTV, Mobile TV,65FBluetooth 3.0, UWB03-611-6168IC198RF/ (/)SOC (RF) IC(Mixed Signal) IC ()RFIC (1)Wi-FiPA/Switch ; (2) Handset RFICASPPA/Switch(3) Transceiver (4)OthersUWB, WiMAX,Bluetooth, GPSDTV, MobileTV, Silicon Tuner 22. (Giga Solution), , , RFIDM Skyworks, RFMD, Amkor/ ChipPac ICIDM 23. (APM), ,, 24. SIP 25. MEMSAPM S:Yole Developpement, 2006 S:Yole Developpement, 2006 26. (Viking Tech), , , ()()1997/10www.viking.com.twESD3037003-597-293192LED2006 NT$129.21242.37 (/)LED (1)AL2200422.3%AR3CS 90%2007 NT$300~4002006/01~05 27. LTCCMEMS PCB S, 2006 LTCCLTCC(Thick Film)1,000SIEK,2005S, 2006 PVDCVD0.011mS, 2006S, 2006 IPDS, 2006IPD S, 2006 28. US$10 cents, LTCCUS$8~12 cents ToleranceLTCC 29. 3~5FEM/PAModule/ICASP IC RF RF GaAs / IC RF MEMS / IP 30. Q&A