· 2019-11-19 · 12 selection guide meder electronic &’") ˘ˇˆ˙˝˛˛˚˚ˇ˘...

12

SELECTION GUIDE MEDER electronic&'")

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MEDER electronic SELECTION GUIDE&'")

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SELECTION GUIDE MEDER electronic&'")

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MEDER electronic SELECTION GUIDE&'")

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30

Pull-In (PI) is described as that point where thecontacts close. Using a magnet, it is usuallymeasured as a distance from the Reed Switch tothe magnet in mm (inches) or in field strength AT,mTesla, or Gauss. In a coil, the Pull-In is measuredin volts across the coil, mA flowing in the coil, orampere-turns (AT). Generally, this parameter isspecified as a maximum. No matter how well thereed blades are annealed, they will still have a slightamount of retentivity (a slight amount of magnetismleft in the blades after the magnetic field is removedor eliminated from the Reed Switch). To obtainconsistent Pull-In and Drop-out results, saturatingthe Reed Switch with a strong magnetic field first,before taking the Pull-In measurement will producemore consistent results. (see Figure #5).

When measured in a coil, or specifically, a ReedRelay, the Pull-in is subject to changes at differenttemperatures, and is usually specified at 20 oC (seeFigure #6)

Pull-in/Drop-out Temperature Effects

-40-30-20-10

0

1020304050

-60 -10 40 90 140

Temperature (C)

Rate of

change (%)

(Figure #6. The Pull-in and Drop-out points will change withtemperature at the rate of 0.4%/oC.)

Here, because the copper coil wire expands andcontracts with temperature, the Pull-In or operatepoint will vary with temperature by 0.4% oC. Welldesigned relays usually take this parametric changeinto consideration in the design and specification.

Figure #5. For most accurate results, saturate the contacts with a magnetic field first, before testing for Pull-in and Drop-out.

Basic Electrical Parameters of Reed SwitchProducts

REED SWITCH CHARACTERISTICS MEDER electronic

www.meder.comGermany # ++49-(0)7733-94870, USA # 800-870-5385

31

Drop-Out (DO) is described as that point wherethe contacts open and has similar characteristicsas the Pull-In above. It is also described as releaseor resetvoltage current or AT.

Hysteresis exists between the Pull-In and Drop-Out and is usually described in the ratio DO/PIexpressed in %. The hysteresis can vary dependingupon the Reed Switch design, (see Figure #7),where variations in plating or sputtering thickness,blade stiffness, blade overlap, blade length, gapsize, seal length, etc. will all influence this parameter.See Figure #29 for example of hysteresis whenusing a magnet to handle a Reed Switch.

Drop-out vs. Pull-in

0

10

20

30

40

0 10 20 30 40 50

Pull-in (AT)

Dro

p-o

ut

(AT

)

(Figure #7. The Pull-in and Drop-out ranges are shown.Note that variation in hysteresis is for low ampere turns (AT)

is very small and increases with higher AT.)

Contact Resistance is the DC resistancegenerated by the reed blades (bulk resistance) andthe resistance across the contact gap. Most of thecontact resistance resides in the nickle / iron reedblades. Their resistivity is 7.8 x 10

-8 Ω-m and

10.0 x 10-8 Ω-m , respectively. These are relatively

high when compared to the resistivity of copper,which is 1.7 x 10

-8 Ω-m . Typical contact resistance

for a Reed Switch is approximately 70 mΩ, 10 to25 mΩ of which is the actual resistance across thecontacts. In a Reed Relay, many times the relaypins will be nickel/iron improving the overall

magnetic efficiency but adding bulk resistance tothe contact resistance. This increase can be in theorder of 25 mΩ to 50 mΩ (See Figure #8).

(Figure #8. A representation of the bulk resistance andresistance across the contacts making up the contact

resistance value in Ohms for a Reed Switch.)

Dynamic Contact Resistance (DCR) is a truemeasure of the disposition of the contacts. Asalready described, the contact resistance is mostlymade up of bulk resistance or lead resistance.Measuring the resistance across the Reed Switchonly gives gross indication that the contacts arefunctional. To give a better indication of the contactsfunctionality, one must look at the contacts underdynamic conditions.

Opening and closing the contacts at frequencies inthe range of 50 Hz to 200 Hz can reveal much moreinformation. Switching 0.5 Volts or less withapproximately 50 mA will allow enough voltage andcurrent to detect potential problems. This testingcan be carried out using an oscilloscope or may beeasily digitized for more automatic testing. Oneshould avoid test voltages greater than 0.5 Volts toavoid ‘break-over’. If a Reed Switch is not properlycleaned during its manufacture, potential non-conductive films may exist that may only be of theorder of a few Angstroms thick. This extremely thinfilm will look like an open circuit if one is switchingvery low signals or in currentless closing of the ReedSwitch (closing the contacts before any voltage orcurrent is applied across the contacts). Using ahigher voltage while testing the contact resistance,one might miss this potential quality problem. SeeFigure #9.

MEDER electronic REED SWITCH CHARACTERISTICS


32

(Figure #9. A schematic diagram of a typical circuit used formeasuring the dynamic contact resistance across the

contacts of a Reed Switch.)

Applying the frequency described above to a coil,the contacts will operate and close in approximately½ mA. The contacts may then bounce for about100µs and undergo a period of dynamic noise foras much as ½ ms. This dynamic noise is generatedby the contacts continuing to bounce but notopening, whereby the contact resistance varieswidely where the force or pressure on the contactsvaries harmonically, critically dampening in about½ ms or less. See Figure #10. Once this dynamicnoise dissipates, the contacts will then undergo a‘‘wavering period’. Here the contacts have closed,but will waver while closed for up to 1 ms or more.This wavering of the contacts in the coil’s magneticfield generates a current through the contacts.Once this effect dissipates the contacts enter theirstatic condition.

(Figure #10. A typical dynamic contact resistance portrayalshowing the first closure, bouncing, dynamic noise and

pattern generated by wavering contacts.)

Observing the electrical pattern produced by thisdynamic test can reveal much about the quality ofthe Reed Switch. Generally speaking, once the coilvoltage has been applied, the dynamic contactactivity should settle down by 1 ½ ms. If the contactscontinue to bounce more than 250 µs, the closingforce may be weak, which may result in a shortenedlife, particularly if one is switching a load of any size.(See Figure #11)



33

(Figure #11. A dynamic contact resistance pattern showingexcessive contact bounce.)

If the dynamic noise or the wavering contactscontinue for periods longer than indicated, it maymean the Reed Switch seals are weak or perhapsoverstressed. This could result in capsule crackingor breaking. Also, if the wavering produced hasexcessive amplitude, this could represent acondition of capsules having added stress whichcould produce leaking seals. In this case, outsideair and moisture may seep into the capsuleproducing unwanted contamination on the contacts.See Figure #12 & Figure #13.

(Figure #12. A dynamic contact resistance pattern portray-ing excessive dynamic noise indicating potential stressed or

cracked glass seal.)

(Figure #13. A dynamic contact resistance pattern withindicated excessive contact wavering often indicates a

stressed or cracked glass seal.)



34

Also, when the contact resistance varies by a smalldegree with successive closures, contamination, aleaking seal, particles, loose or peeling plating mayexist, potentially shortening life expectations (SeeFigure #14). Varying the frequency applied to thecoil sometimes produces more subtle awarenessof resonance related problems. This will alsomanifest itself with higher amplitude or longer timesof dynamic noise or contact wavering.

(Figure #14. A dynamic contact resistance pattern showingcontact resistance changing in each successive operation

indicating contact contamination.)

Any time long life, stable contact resistance, andfault free operation are conditions in yourapplication, dynamically testing the contacts andhaving tight testing limits are a must.

Switching Voltage, usually specified as amaximum in units of Volts DC or Volts peak, is themaximum allowable voltage capable of beingswitched across the contacts. Switching voltagesabove the arcing potential can cause some metaltransfer. The arc potential generally occurs over 5Volts. Arcing is the chief cause of shorted life acrossthe contacts. In the 5 V to 12 V range most contactsare capable of switching well into the tens of millions

of operations depending on the amount of currentswitched. Most pressurized Reed Switches can notswitch more than 250 Volts, principally because theycan not break the arc occurring when one tries toopen the contacts. Generally, switching above 250Volts requires evacuated Reed Switches, where upto 10,000 Volts is possible. Switching below 5 Volts,no arcing occurs and therefore no blade wearoccurs, extending Reed Switch lifetimes well intothe billions of operations. Properly designed ReedRelays can switch and discern voltages as low as10 nanoVolts.

Switching Current refers to that current measuredin Amperes DC (peak AC), switched at the point ofclosure of the contacts. The higher the level ofcurrent the more sustained the arcing at openingand closing and therefore the shorter the life of theswitch.

Carry Current, also measured in Amperes DC(peak AC), is specified as the maximum currentallowed when the contacts are already closed.Since the contacts are closed, much higher currentsare allowed. No contact damage can occur, sincethe only time arcing occurs is during the openingand closing transitions. Surprisingly high pulsedcurrents can be specified over short durations whenthe contacts are closed. Conversely, unlikeelectromechanical armature style relays, the ReedRelay can switch or carry currents as low asfemptoAmperes (10-15 Amperes).

Stray Capacitance measured in microFarads orPico Farads is always present, to some degree,when switching any voltage and current. Whenswitching a given voltage and current, the first 50nanoSeconds are the most important. This is wherethe arcing will occur. If there is a significant amount(depending on the amount of voltage switched) ofstray capacitance in the switching circuit, a muchgreater arc may occur, and thereby reducing life.



35

When switching any sizable voltage, it is always asmart idea to place a fast current probe in the circuitto see exactly what one is switching in the first 50nanoSeconds. Generally speaking, when switchingvoltages over 50 Volts, 50 picoFarads or more canbe very significant to the expected life of the switch.

Common Mode Voltage is also another parameterthat can have a significant effect on the life of aReed Switch. Depending upon the circuit and theenvironment, common mode voltages can in effect,charge stray capacitances in the switching circuitand dramatically reduce Reed Switch life in anunexpected manner. Again, a fast current probecan reveal a startling voltage and current switchedin that first 50 nanoSeconds, having no bearing onone’s actual load. When line voltages are presentin or near sensitive circuits, be cautious. Thosevoltages can be coupled into the circuit creatinghavoc with your life requirements. Typically, a faultyReed Switch is blamed for this reduced life, whenin actuality, it is a product of unforeseen conditionsin the circuit.

Switching Wattage is the combined voltage andcurrent switched at the time of closure. Sometimesthere is confusion with this parameter. For a givenswitch, with a switching rating of 200 Volts, 0.5Amperes and 10 Watts, any voltage or currentswitched, when multiplied together, can not exceed10 Watts. If you are switching 200 Volts, then youcan only switch 50 milliAmperes. If you areswitching 0.5 Amperes, then you can only switch20 Volts.

Breakdown Voltage (Dielectric Voltage) generallyis higher than the switching voltage. Reed Switchesstand off higher voltages because unlike theswitching voltages, breaking the arc on opening isnot a consideration. On larger evacuated ReedSwitches, ratings as high as 15,000 Volts DC arenot uncommon. Some smaller evacuated reedscan stand off up to 4000 Volts DC. Small

pressurized reed switches generally withstand 250to 600 Volts DC.

Insulation Resistance is the measure of isolationacross the contacts and is probably one of the mostunique parameters that separate Reed Switchesfrom all other switching devices. Typically, ReedSwitches have insulation resistances averaging 1x 1014 ohms. This isolation allows usage in extrememeasurement conditions where leakage currentsin the picoAmpere or femptoAmpere range wouldinterfere with the measurements being taken.When testing semiconductors, one may haveseveral gates in parallel where the switching deviceshave combined leakage currents that becomesignificant in the test measurement circuit.

Dielectric Absorption describes the effect differentdielectrics have on very small currents. Currentsbelow 1 nanoAmpere are affected by the dielectric’stendency to slow or delay these currents.Depending upon how low a current one ismeasuring, these delays can be on the order ofseveral seconds. MEDER engineers have designedReed Relays and circuits to minimize dielectricabsorption. For specific requirements call forapplications help.



36

Operate Time is the time it takes to close thecontacts and stop bouncing. Except for mercurywetted contacts, when the reed blades close, theyclose with enough force to set them in harmonicmotion. This critically damped motion dissipatesrapidly due to the relatively strong spring force ofthe reed blades. One generally sees one or twobounces occurring over a 50 µs to 100 µs period.Most small Reed Switches operate, includingbounce, in the range of 100 µs to 500 µs. SeeFigure #15.

Operate Time

0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0 10 20 30 40 50

Pull-in (AT)

Op

era

te T

ime

(m

s

(Figure #15. A typical graph of the operate time forincreasing Pull-in AT values. With higher Pull-in AT the ReedSwitch gap increases taking a longer time for the contacts to

close.)

Release Time is the time it takes for the contactsto open after the magnetic field is removed. In arelay, when the coil turns off, a large negativeinductive pulse (‘kick’) occurs causing the reedblades to open very rapidly. This release time maybe in the order of 20 µs to 50 µs. If a diode is placedacross the coil to remove this inductive voltage spike(which can be 100 Volts to 200 Volts), the contactopening time will slow to about 300 µs. Somedesigners require the fast release time, but cannothave the high negative pulses potentially beingcoupled into sensitive digital circuity. So they add a12 Volt to 24 Volt zener diode in series with a diode,all of which is in parallel across the coil. Here, whenthe coil is turned off, the voltage is allowed to gonegative by the zener voltage value, which issufficient to cause the contacts to open generallyunder 100 µs. See Figure #16.

Release Time

0

5

10

15

0 10 20 30 40

Drop-out (AT)

Re

lea

se

tim

e

(µ(µ(µ(µs)

(Figure #16. A graph of the release time for increasingDrop-out AT. With increasing Drop-out AT the restoring force

increases causing even faster release time.)



37

Resonant Frequency for a Reed Switch is thatphysical characteristic where all reed parametersmay be affected at the exact resonance point ofthe Reed Switch. Reed capsules 20 mm long willtypically resonate in the 1500 to 2000 Hz range;reed capsules on the order of 10 mm will resonatein the 7000 to 8000 range. Avoiding these specificresonance areas will insure a fault free environmentfor the Reed Switch. Parameters typically affectedare the switching voltage and the breakdown volt-age. See Figure #17.

Resonant Frequency

0.110.120.130.140.150.160.170.180.190.1

6500 7000 7500 8000 8500 9000

Resonant frequency (Hz)

Cu

mu

lati

ve

fr

eq

ue

nc

y p

erc

en

(Figure #17. A depiction of a group of 10 mm ReedSwitches and its resonant frequency distribution.)

Capacitance across the contacts is measured inpicoFarads and ranges from 0.1 pF to 0.3 pF. Thisvery low capacitance allows switching usage, wheresemiconductors having 100’s of picoFarads, cannot be considered. In semiconductor testers, thislow capacitance is absolutely critical. See Figure#18

Contact Capacitance (gap)

0

0.1

0.2

0.3

0 10 20 30 40

Pull-in AT

Ele

ctr

os

tati

c c

ap

ac

ita

nc

(PF

)

(Figure #18. As the Pull-in AT increases its gap increases,therefore reducing the capacitance across the Reed Switch.)



48

In a Reed Relay, the Reed Switch uses anelectromagnetic coil for activation and is shown inits simplest form in Figure #38. Reed Relaysrequire relatively little power to operate and aregenerally gated using transistors, TTL directly orcmos drivers. Reed Relay contacts, when switcheddry, (currentless closure or less than 5 Volts @ 10mA), will literally operate well into the billions ofoperations. In areas like automatic test equipment,where Reed Relays may be called upon to switchtens of millions of operations per year, the ReedRelay rises to the challenge.

(Figure #38. A Reed Relay consists of a copper insulatedwire wound coil with a Reed Switch traditionally mounted on

its center axis.)

Using the proper design, materials, placing anelectrostatic shield around the Reed Switch internalto the coil and driving the shield, will allow couplingor passage of very small signals (nanoVolt signalsor femptoAmpere currents) through the relay withlittle or no interference. See Figure #39. This isvirtually impossible with other technologies exceptat very high cost.

(Figure #39. Depiction of a Reed Relay showing the coil,Reed Switch, and shield (coaxial) placement.)

Using a coaxial shield internal to the coil, the ReedRelay looks like a transmission line to high frequenysignals. With Reed Switches becoming smaller andsmaller, overall Reed Relay packages have shrunkto less than 8 mm long, reducing the distributedcapacitance (switch to shield) to less than 0.8 pF.See Figure #40. This has allowed Reed Relays tocarry frequencies up to 6 GigaHz without seriousloss of signal strength (3 dB down). Typically,insertion losses as low as 0.2 dB and VSWR of 1.1out to 2 GHz are now realizable. Reed Relays’ RFcharacteristics rival the gallium arsinide mosfets andat 1 GHz and above are very cost competitive. ReedRelays are now commonly used in semiconductortest equipment and cellular telecommunicationequipment because of their superior better RFcharacteristics.

(Figure #40. A Reed Switch mounted internal to a coaxialshield provides and excellent RF path for Giga Hertz

frequencies.)

Numerous applications for Reed Relays exist todayand are increasing every day. Please see ourapplications section for more detailed Reed Relayusage.

SWITCHES AS REED RELAYS MEDER electronic

The Reed Switch used as a Reed Relay


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MEDER electronic RELAY APPLICATIONS

Functional PCB Testers Require HighQuality SIL Relays

Functional printed circuit board testers require veryhigh quality Reed Relays because each tester mayhave up to 20,000 relays in a fully loaded system.Here, one failure constitutes a 50 PPM failure rate,so the quality level of the relays used must be betterthan 50 PPM otherwise every tester will have afailure.

To produce this quality level, the Reed Relays mustbe made on an automated/mechanized line whereevery manufacturing detail is taken intoconsideration, and the relays are tested dynamicallyfor early failure type potential defects.

Two relay series are made to meet these criticalrequirements: our SIL series and MicroSil (MS)series. Both series are made on high volumeautomated/mechanized lines with very low failurerates. These relays have been time tested to meetthe critical requirements in a PCB test environment.Increasingly more popular, the MS series is a newerseries requiring only half the board space ascompared to the SIL parts. This cuts expensivePCB costs in half. Both relays have isolationstypically greater than the 1012 Ω.

Integrated Circuit (IC) Testers RequireHigh Speed Components in their

Testers

Integrated circuit testers have become more and morecomplex with the requirement of faster and fasterprocessor clock speeds being unveiled each year.New precessors soon to be released will have clockspeeds up to 1 GHz. Since digital pulses areconstructed with 5 harmonics of a sine wave, a digitalclock operating at 1 GHz will require components tohave a 5 GHz bandpass in its signal path to handlethe fast digital pulses.

To properly test integrated circuits, millions of gatesneed to be tested with various signals sent to the ICall requiring switching devices. These switchingdevices must have high isolation (1012 Ω typical),excellent RF switching capability, 50 Ωcharacteristic impedance, coaxial shielding and theability to switch low level signals for hundreds ofmillions of operations. The Reed Relay is ideallysuited for this requirement.

Our coaxially shielded LP series, having a 50 Ωcharacteristic impedance, is an excellent choice forIC testers using digital pulses with rise times in theorder of 150 ps or larger.

A new series is under construction that will have theability to switch digital pulses with rise times in theorder of 40 to 50 ps.

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Not too surprisingly, high voltage Reed Switches withhermetically sealed Tungsten contacts can serveas the best solution for these kinds of applications.The switching time of a Reed Switch is below 6 msec.and breakdown voltage levels up to 15 kVDC(depending on type of switch) are standard. The HEseries relay is available in PCB mount or axial leads.The series offers a variety of contact configurations.

Industrial and Robotics

The use of Reed Relays as the switching elementsfor robotic technology in industrial applications hasbeen gaining wider appeal on the technical front.The Reed Relay is ideal because of its high reliability,long life (>109 operations), and ability to switch anassortment of AC and DC loads having various signalstrengths.

Especially important is the ability to switch analogsignals having mico-volt or pico-amp signal levels.Here the low stable contact resistance offers an idealsolution without losing signal strength over life. Also,if RF is used in the circuitry, the Reed Relay offersvery low insertion loss and very good isolation wellbeyond 1 GHz.

For industrial applications the DIL, DIP, MS, LP andSMD series are excellent.

Radio Transmitters for RF Power

With RF power conducted along the outer perimeterof a conductor (skin effect), a copper clad ReedSwitch is an ideal switching component whenswitching relatively low RF power ( 6 Amps or less).The Reed Switch in the Reed Relay must use aferromagnetic reed blade (usually nickel/iron) forproper magnetic coupling. The nickel/iron is veryresistive to high RF power. By plating a heavy layerof copper over the nickel/iron, the RF characteristicof ‘skin effect’ is neutralized by offering a lowresistance conductive path.

Our BE and HF Series can be used for the abovedescribed requirements depending on the frequency,current and dielectric strength. The HF series has aspecially designed shield to reduce heat buildup,allowing higher power pass through.

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98

RELAY APPLICATIONS MEDER electronic

Here the interaction effects will be reduced by a factorof two. This same effect will be observed with fasterand faster ramp speeds (approximately a stepfunction) if the relays are still energizedsimultaneously.

Figure 4. Alternative Pairs Relay Test Configurations.

This reduction in interaction occurs because of thereduced surrounding magnetic fields present at thetime of contact closure, where the actual pull-involtages are typically half the nominal voltage.

Special Matrix Applications

Under certain conditions, the consistent direction inwhich the coils are wound and terminated, particularlywhen mounted close together, can reduce themagnetic influence.

The matrix shown in Figure 4 uses the opposingmagnetic polarities and consistent coil manufactureto reduce interaction without the added cost ofmagnetic shielding. This effect (Figure 5) is achievedby wiring the matrix as shown in Figure 4.

The data presented in Figure 5 can be compared tothe data presented in Figure 3 for a similarnonmagnetically shielded SIL matrix of 15 where thepolarities are in the same direction. The improvementor reduced interaction is 2.5 % in Figure 5 comparedto 6% in Figure 3.

Checklist for Designing a Relay Matrix

These items should be considered:The applied coil voltage for each relay.The temp. characteristics.Available PC board space.Distance between adjacent relays.Scheme for energizing the relays in the matrix.Added cost required for shielding.Relay life characteristics.

A Relay Matrix Design Example

Using the checklist, an example of a 50-relay SILmatrix design is presented. This analysis presentsmost of the factors affecting magnetic influence thatshould be considered during the design phase.

1) Applied Voltage. The power supply undermaximum load and at 50 0C can be as low as 4.9 Vminimum. Under some circumstances, the loadvoltage may be in series with transistor/diode dropsof 0.6 V maximum over the operating temperaturerange. The working voltage of the power supply isreduced to 4.3 V, the actual voltage applied to therelay coil.

99


Figure 5. Alternate Pairs Matirx.

2) Temperature Effects. If the maximum systemoperating temperature is 50 0C and the specified relaypull-in voltage is 3.6 V maximum at 25 0C for a 5-Vnominal coil voltage, a rise in voltage from 3.6 V to3.96 V maximum at 50 0C can be expected.3) Amount of PC Board Space Required. A 5 x10 relay matrix (50 relays) is required. To fit the relayson the board, a crowded arrangement must beemployed (only 7.75 in.2 of board space is available).4) Distance Between Adjacent Relays. The relaysmust be placed on 0.20" centers, five rows of 10relays each.5) Energizing the Matrix. In this application, amaximum of three relays is energizedsimultaneously. Figure 3a presents the interactiondata required for this application. Here the worst caseoccurs for the nonmagnetically shielded 0.20"separation and is 7.5 %. By using equation 2, theinteraction effects are calculated as a worst-casepull-in voltage increase of 0.38 V.6) Magnetic Shielding. It is decided not to usemagnetic shielding.7) Life Characteristics. In general, when switchingintermediate to high- level loads, the coil voltageoverdrive should be about or equal to 100% (about

or equal to two times the actual pull-in voltage) forbest-life characteristics. Here the relay coil over- driveis small; however, only low-level switching isexpected. Therefore, the life characteristics shouldnot be affected.8) Design Analysis. If the results found in item 5were added to the results in item 2, the maximumpull-in voltage will rise to 4.34 V under interactiveconditions. This exceeds the minimum voltage of4.3 V. Probably the two simplest approaches at thispoint are increasing the power supply voltage orlowering the initial maximum pull-in voltage ratingfrom 3.6 V to at least 3.2 V maximum. This wouldleave sufficient added overdrive under worst-caseconditions.

Summary

Magnetic interaction effects on Reed Relays canrepresent a significant problem if ignored. Manysolutions are possible.

The foundation for determining worst- case scenarioson the basic matrix types is presented in this article.A systematic approach to designing a relay matrixcan be achieved by referring to the checklist provided.

It is strongly suggested that the user consult withthe relay manufacturer early in the design process.Following this methodology will greatly diminish thepotential for unpredictable relay matrix performance.

References

1. Stickley, B.C., “Magnetic Characteristics ofMiniature Reed Relays,” 14th Annual NARMConference (1966).

2. MEDER Specification Sheets SIL-Series3. Evaluation Engineering, May 1989.

101

MEDER electronic 7 GHz RF Reed Relay

Introduction

For years engineers had thought the best way toswitch high frequencies and very short fast digitalpulses was to use special semiconductors designedto handle the high frequencies – namely galliumarsenide mosfets. Today, however, gallium arsenideis not the only option; new semiconductor materialsare being developed that are less expensive and goodfor RF. Also, in fact, the Reed Relay is making avery big impact in the world of high frequency andfast digital pulses.

The Reed Relay by its basic geometry resembles acoaxial cable (see Figure 1). The magnetic reedsmake up the center conductor with a glass envelopesetting the spacing from the center conductor to thecoaxial shield, and therefore, its characteristicimpedance (typically 50 ohms). Generally the RFcharacteristics were not considered significant in theearly years of Reed Relays because the ReedSwitches were too big and the corresponding ReedRelays were too large having a long signal pathlength. However, in the 1980’s the Reed Switchesbegan to shrink in size offering shorter and shortersignal path lengths. It was here that the all importantsignal to shield capacitance began to drop below1.0 picofarad and hence the improved RFperformance. Today, with 5 mm or less Reed Switchlengths the signal to shield capacitance has droppedto 0.5 pf when the reed is in the open state.

Figure #1. Shows the similarities of a Reed Relay with acoaxial shield to that of a RF transmission line. Since the coil iseffectively screened by the coaxial shield, it has no effect onthe transmission of RF signals along the center lead conductor.

Characterization of Reed Relays capable of handling frequenciesup to 10 GHz

When designing in the frequency domain withsemiconductors, one has to deal with special addedcircuitry to reduce or eliminate inter-modulationdistortion (also a potential problem with fast digitalcircuits). By its nature, no inter-modulation distortionexists in a Reed Relay and therefore, no specialcircuitry is required. This is particularly useful inattenuator networks constructed from Reed Relays.

Form C Reed Relays (single pole double throw) havethe potential added advantage when in its normallyclosed state, they require no external power. In T/R (Transmit/Receive) requirements this can be ofreal value, particularly if the receive mode represents99% of the duty cycle and the device is batteryoperated. No battery power is drawn 99% of the time.Here extended battery life is a clear benefit oversemiconductor switching devices where power isrequired all the time.

In test and measurement, particularly IC (IntegratedCircuit) testers, with parallel high switch point counts,leakage current becomes a real problem. ReedRelays specially designed to handle fast digitalpulses will also offer leakage currents on the orderof 0.1 pico-amps or less, a clear requirement andbenefit with this technology. No other technologycurrently offers anything close to this combination.

Frequency Domain vs Time Domain

Today, the use of RF components has dramaticallyincreased, where only a few years ago, they wereprimarily used in military requirements andspecialized test equipment. With the cell phonerevolution coupled with dramatic increases incomputer processor speeds, requirements werecreated to run high frequencies and high speed digitalpulses through a host of different components. Theneed to run bigger and bigger software programsnecessitated the need for faster processor speeds,

102

7 GHz RF Reed Relay MEDER electronic

as well as increased efficiency in signal processing,when converting analog signals to digital. The clearneed to process large amounts of informationrequired increased and faster memory. A few yearsago processor speed exceeded the 1 GHz level andhas not slowed, as each year processor speedscontinue to increase. With this increase allelectronic components need to increase their abilityto switch or pass these fast signals.

To adequately compare the time domain to thefrequency domain one has to recognize the fact thatit takes at least 5 harmonics of the base frequencyto construct a square wave (digital pulse). Equation# 1. represents this mathematically. Therefore,circuitry processing or distributing a digital clockrunning at 1 GHz will require components in thesignal path to have a bandwidth up to 5 GHz on aCW (continuous wave) basis.

Equation 1. This equation is the generalized formrepresenting a square wave or pulse depending on the

boundary conditions. It takes at least five terms (or five oddharmonics) to start approximating a square wave.

Transmission Line Review

High frequency systems have a source of powerwhether digital or analog that is delivered to a load,usually through a series of components by meansof transmission lines. Figure 2. represents thissimplest form where Z

s is the impedance of the line;

and ZL is the impedance of the load. The power,

whether a digital pulse or a wave, travels both waysas shown. A portion of the incident wave will bereflected back to the source, where it may bereflected again. If Z

L = Z

s, there will be standing

waves.

Figure 2. A simplified transmission line

In Figure 3 below represents an instantaneous pointalong a transmission line. R is the DC resistance;L is the inductance; C the capacitance and G theadmittance per unit length. In a loss-less line thecharacteristic impedance (Z

o ) would be defined as

Zo = (L/C)1/2. For microwave circuits, 50 ohms has

become the standard in most cases.

Figure #3. An instantaneous look at what a signal sees ata given point on a transmission line in terms of passive

physical measurements.

With this basic view of transmission lines, there areseveral ways to express and develop relationshipsthat define what happens to signals as they travelthrough them. Probably the most popular is throughthe use of scattering parameters and a two portnetwork.

8

ννννν(t) = V/2 Σ Σ Σ Σ Σ 2V/(πππππn) sin (2πππππnt)n = odd

103


S – Parameters Measurements

Scattering Parameters or S-Parameters are aparameter set related to four variables associatedwith the model of a linear two-port network. Theydefine the small signal gain and the input/outputproperties of a linear two-port network. S-Parametersare forward and reverse insertion gains, and inputand output reflection coefficients taken with drivenand non-driven ports both terminated in equalimpedance, usually 50 Ω real. They differ from otherparameter sets because of this termination (e.g., Y-Parameters or Short Circuit Admittance Parametersare found by exciting one port and short circuitingthe other).

To develop the S-parameters we start with a twoport approach. The beauty of a two port analysis iswe need only consider what is between the two portsas a black box, where knowledge of the black box isimmaterial to the development of the S-parameterequations. You need not know anything about theinternal circuitry to make use of the two port concept.

Using this approach, we will first develop a simplematrix representation of the internal circuitry. InFigure #4., a two port network is shown, which caneasily be represented by a two by two matrix asgiven in Eqn. 2 using Z-parameter representation.Here V

1 and V

2 represent the input/output voltages of

the two port network; Z11

, Z12

, Z21

, and Z22

representthe impedances entering the nodes, and i

1 and i

2

represent two node currents.

Figure 4. presents a two port network that can completelydescribe external functionality. One can treat any circuit as

a two port network if you can select two pairs of nodes.

Equation. 2. Matrix representation of a two port networkin a Z-Parameter representation.

Here the matrix is presented in Z-parameterrepresentation to show the parametric conceptusing the two port network approach. As can beseen, knowing some of these parameters throughmeasurement the others can be calculated.However, when dealing with higher frequencies it ismuch harder to measure voltages and currents, butmuch easier to measure power.

In a similar manner the S-parameters are developed.The equations become a little more complicated thansimple algebraic equations generated by the abovematrix. Manipulating Eqn 2, we can write:

I = z-1v Eqn 3

where z-1 is the inverse of the matrix Z. From this,we can further represent the equation in terms ofpower. However, obtaining the inverse of a matrix isvery tedious without the use of computers orcalculators which can easily calculate the matrixcofactors and determinants as well as transposition.However, now canned computer programs are veryeasy to use with simple inputs and quick internalcalculations yielding fast results. For this reasonand the bountiful amount of information generated,we now look into how S-parameters are developed.

V1 Z11 Z12 i1V2 Z21 Z22 i2

=

b1 S11 S12 a1

b2 S21 S22 a2=

Eqn 4

104


In Figure #5 below, we now look at a two port networkwhere we can construct the following matrix:

Figure #5. Two port transmission matrix

From the matrix we can write the following set ofequations

b1 = S11 a1 + S12 a2 Eqn 5

b2 = S21 a1 + S22 a2 Eqn 6

Here a1 and a

2 represents the incident waves at ports

1 and 2 respectively; b1 and b

2 represent the reflected

waves as shown in Figure #5. Just as the Z-parameter set relates total voltages and total currentsat the network ports, S-parameters relate travelingwaves. Here the incident waves a

1 and a

2 are the

independent variables, and the reflected waves b1

and b2 are the dependent variables.

For the S matrix, the off-diagonal terms representvoltage wave transmission coefficients, while thediagonal terms represent the reflection coefficients.If the network is reciprocal, it will have the sametransmission characteristics in either direction, i.e.

S12 = S21 Eqn 7

If the network is symmetrical, then

S11

= S22 Eqn 8

For a matched two-port, the reflection coefficientsare zero and

S11 = S22 = 0 Eqn 9

The input reflection coefficient (Γ) can be expressedin terms of the S - parameters and the load Z

L as

ΓΓΓΓΓi = E1r / E1i or

ΓΓΓΓΓi = b1 / a1

= S11 + (S12 S21 ΓΓΓΓΓL) / (1 - S22 ΓΓΓΓΓL) Eqn 10Where

ΓΓΓΓΓ0 = ( Z L - Z 0 ) / ( Z L + Z 0 ) Eqn 11

Also, the output reflection coefficient, with E1 = 0,can be expressed in terms of the generatorimpedance Z1 and the S - parameters as

ΓΓΓΓΓL = b2 / a2 ( for E1 = 0)= S22 + ( S12 S21ΓΓΓΓΓ1) / (1 – S11 ΓΓΓΓΓ1) 11

Eqn 12where

ΓΓΓΓΓ1 = ( Z 1 - Z 0 ) / ( Z 1 + Z 0 ) Eqn 13

Now for the case where Z 1 = Z 0 where Z0 =Characteristic Impedance = 50 Ω and E1, E2 =Electrical Stimuli @ Port 1, Port 2 respectively, wecan write the following equations in the form of power:

a1 = (Incoming power @ Port 1) 1/2 Eqn 14

b1 = (Outgoing power @ Port 1) 1/2 Eqn 15

a2 = (Incoming power @ Port 2) 1/2 Eqn 16

b2 = (Outgoing power @ Port2) 1/2 Eqn 17

105


Now, for E2 = 0, then a

2 = 0 and we have the

following:

S11 = b1/a1 Eqn 18

= [Outgoing Input Power / Incoming Input Power] 1/2

= Reflected Voltage / Incident Voltage

= Input Reflection Coefficient

S21 = b2/a1 Eqn 19

= [Outgoing Output Power / Incoming Input Power] 1/2

= [Forward Transducer Gain] 1/2

And for E1 = 0, then a1 = 0

S12 = b1 / a2 Eqn 20

= [Outgoing Input Power / Incoming Output Power] 1/2

= Reverse Transducer Gain

S22 = b2 / a2 Eqn 21

= [Outgoing Output Power / Incoming Output Power] 1/2

= Output Reflection Coefficient

And finally, for the case of a linear two-port passivedevice these equations reduce to the following:

S11 = Input Reflection Coefficient

= VSWR Eqn 22

S21 = Forward Gain

= Insertion Loss Eqn 23

20 log 10 (S11)

= Return Loss in dB Eqn 24

The Value of the S-parameters

S-parameters have a magnitude and an angleassociated with them, and are easily obtained froma suitable network analyzer when testingcomponents or circuits. To take full advantage ofthe S-parameters taken from a network analyzer andthe accompanying results above, we can reasonablyaccurately reproduce the Insertion Loss, the VSWRand Return Loss in conjunction with a suitableMMICAD program. Here we can establish the effecton an RF circuit with the addition of a componentwithout ever having to physically insert thecomponent into the circuit. Development of anequivalent circuit for a Reed Relay for both its openand closed contact states will yield more accurateresults when added to the MMICAD program. Theseequivalent circuits are shown in Figures 6 and 7below. By applying the S-parameters to the softwareprogram, an engineer can immediately find how theReed Relay (or any other component) will interact inhis circuit with other components.

106


Smith Charting

In a likewise manner, the S-parameters can be plottedon a Smith chart revealing further informationconcerning the characteristic impedance over a widefrequency range. Here the exact impedance for agiven frequency is plotted, and whether thatimpedance has a net inductive or capacitivereactance.

This information can be most helpful when trying totune a given RF circuit, particularly, if there is a netinductive or capacitive reactance. The engineer willknow what to add or subtract and where.

Figure # 6. The equivalent circuit of the closed contacts of a coaxially shielded Reed Relay with two ground terminals onboth the input and output of the Relay.

Figure # 7. The equivalent circuit of the open contacts of a coaxially shielded Reed Relay with two ground terminals onboth the input and output of the Relay.

107


RF Parameters defined for usage in theTime Domain and Frequency Domain

The following define the parameters we want tomeasure on a Reed Relay, whether the relay is usedin the time domain or the frequency domain.

Time Domain RF Parameters or TDR

To measure time domain parameters, Time DomainReflectometry (TDR) is employed. Time domainreflectometry allows one to characterize atransmission line or series of components by thereflections or discontinuities occurring when sendinga pulse of known amplitude and rise time into theline or circuitry. A transmission line terminated byits characteristic impedance appears as an infinitelylong line (no reflections). No termination (open circuit)gives reflections due to mismatches. Detection ofrelative position of discontinuities, whether inductiveor capacitive, depend upon the polarity of thereflected signal. However, knowing the polarity ofthe reflection, redesign of the component to eliminatethat capacitive or inductive point in the signal path ofthe component can yield a smoother signal with lessreflections and better transmission characteristics.Also, characterizing the component on an ‘as is’basis, allows the user the ability to addcompensation circuitry quickly and easily byknowing ahead of time, the type of compensationneeded.

Rise Time is the time between 10% and 90% ofthe full amplitude of the leading edge of a pulse. Apulse incident upon a relay with a perfect rise time(0) will be altered once it exits the relay with a risetime stated as the Relay Rise Time. Any systemdealing with fast digital pulses must consider therise time through the components where roundingoff and/or distortion of the square wave can occur.

Characteristic Impedance (Z) (50 ohms).Represents the distributed impedance at anyinstantaneous point at the entry, through and exiting

the relay. A pulse or signal traveling through thepath of the relay seeing any impedance changeswill reflect some of its signal strength. Standingwaves can occur at these reflection points.

Frequency Domain RF Parameters

Isolation (open circuit transmission loss). Isolationrepresents the energy loss stated in dB when energyis transmitted through the open contacts.

Isolation Loss = E Transmission Eqn 25

Insertion Loss (closed circuit transmission):Indicates device losses or reflections occurring whenenergy is incident on the relay and is reflected backrather than transmitted through the relay.

Insertion Loss = E Incident - E Transmission

Eqn 26

Voltage Standing Wave Ratio (VSWR)

Figure #8. VSWR

VSWR = (EI + ER) / (EI - ER)

= (1 + ρρρρρ) / (1 - ρρρρρ)

Eqn 27where the Reflection Coefficient Γ = ρ∠φIdeal conditions: ρ = 0, VSWR = 1

Return Loss:

20 log 10 (VSWR) = Return Loss in dB

Eqn 28

108


Introduction of the first new Reed Relay actuallydesigned from its inception for high frequency andfast pulse requirements will now be presented.

For many component designs, the application eitherbacks into the design, or the application is made to‘fit’ an existing design. Here, our design incorporatesfrom the beginning, key design features improvingpath length, capacitance, distributed characteristicimpedance, high conductivity, and extremely lowleakage currents to all points.

CRF Ceramic Relay Characteristics

Ceramic Base

We start with a ceramic substrate with very short,high conductivity, gold signal paths. The ceramicwas chosen for several reasons: inexpensive, greatmaterial for plating patterns onto the substrate, hardrobust packaging, thermal coefficient of expansionmatching the thermoset overmolding, and extremelygood thermal conductivity. The thermal conductivityserves to dissipate any heat very efficiently reducingany potential thermal offset voltages from beinggenerated when thermal gradients are present. Italso can aid in the removal of the component from aPCB by heating only one area, the substrate conductsthe heat to all areas of the substrate allowing forease of removal. The ceramic also eliminates theneed of a costly, capacitive lead frame, and the circuitconnections are made on the bottom of the ceramicwith a ball grid solder array eliminating the qualitysensitive coplanarity and lead skewing issues.

No Internal Solder Joints

No internal solder joints are used, eliminating thetemperature restrictions when trying to solder reflowcomponents to a PCB. All internal connections arewelded and have been qualification tested for severalIR reflow cycles. This approach adds to the

robustness of the relay design increasing its reliabilityand reducing its susceptibility to environmentalconditions.

RF Capability

Early samples tested to 6 GHz had insertion lossunder 1 dB. With a few minor improvements, weexpect usage to 10 GHz a real achievable goal. Thelow switch to shield capacitance is a key ingredientto achieve this exceptional RF performance.

Very Small Size

Customary relays in the past have been much larger.This design was predicated on small size to takefull advantage of the clear benefits associated withsize – less PCB space, shorter signal paths andbetter performance in high frequency and fast pulseapplications. Also, its low profile allows for tighterspacing when stacking PCBs very close together,or in tight areas where a low profile is critical suchas in PDAs and Cell Phones.

Thermoset Epoxy Over-mold

Thermoset epoxy over-mold added to the ceramicbase gives a very rugged final package capable ofwithstanding almost all environmental conditions.This relay series has the ability to withstandtemperatures as low as –65 oC to as high as 155 oCunder steady state nonoperating conditions. Thispackage, having no internal solder connections iscapable of withstanding vapor phase and IR reflowwith temperatures up to 260oC without anydegradation in performance. The relays passedqualification testing of 5 repeated IR reflowimmersions with temperatures reaching up to270 oC with no performance reduction.

Introduction of the First Patent Pending Ceramic Reed Relay

109


TCE Matching

Probably the most important property of this designover other relay designs is the attention paid to thematching of the thermal coefficients of expansion(TCE). Here the ceramic and thermoset epoxy’sTCEs are closely matched to prevent any stressbuildup on the fragile Reed Switch and fine copperwire making up the energizing coil. Most of the failuremodes associated with Reed Relays, particularly inthe field, are associated with stress induced on theReed Switch and stretching of the fine copper wireto its elastic limit. This usually occurs during boardmounting of the Relay or under changingenvironmental conditions. Stress may induce afine crack on the Reed Switch that may not manifestitself for an extended period of time. Air will slowlyleak into the capsule, oxidizing the metal reedsproducing faulty closure of the contacts.

This TCE matching is probably the single mostimportant part of the design that dramaticallyincreases its quality and reliability. Particularly, whenusing large populations of relays in one system, thisrelay would be ideal for achieving fault free operationover a long period of time. Switching signal levelloads, this Reed Relay is designed to achieve over abillion operations.

Ball Grid Array

No lead frame is used in this design eliminatingskewing and coplanarity issues. The solder ballapproach, now used extensively in more and moresurface mount applications, clearly offers exceptionalcoplanarity with fewer soldering issues during thesoldering process.

Matching the TCE internal to the Reed Relayproduces the negative result of not matching to aPCB, where TCE’s for many types of PCB’s rangein the 50 to 100 parts per million per unit length.The TCE for ceramic is approximately 10 parts permillion per unit length. This mismatch in TCEs isnot a major problem if, once the Reed Relay is

mounted to the PCB, there is relatively smalltemperature variation over the life of the product. If,however, there are daily temperature excursions inthe equipment, associated with turning on and turningoff the equipment, or if the equipment is used in anoutside environment where natural temperatureexcursions occur, the mismatch will eventuallyfatigue the solder connection. Here the use of solderballs is the great equalizer. The solder being verymalleable absorbs the mismatch eliminating thispotential problem. This has been qualification testedover several temperature cycles and many productsto find it works very well.

Gold has been used to improve the RF signal pathand offers high conductivity. However, care has beenplaced in its thickness. Gold, like copper, tends tomigrate in tin/lead and can form an intermetallic.This intermetallic is essentially un-solderable. Thethickness we use is well below the thickness wherethis potential problem could occur. In fact, in andaround the solder joint the amount of gold is safelyabsorbed into the solder joint. Pull testing on thesolder joints under qualification testing has verifiedthis. No degradation of the solder joint was observedwith each solder joint able to withstand greater than5 lbs. of pull force.

Internal Magnetic Shielding

All Reed Relays in this series are internallymagnetically shielded eliminating the need for costlyexternal magnetic shields. These relays, being assmall as they are, users will want to take advantageof its size by mounting them as close as possible toother components; they can/will mount them on bothsides of the board; and in large systems, adjacentPCBs may be mounted as close together aspossible. When these adjacent components areother Reed Relays or magnetic components, thelikelihood of interaction occurring becomes veryprobable. This is particularly true if the relays areoperated together or operated when adjacent relaysare already closed. With our internal magnetic shieldthis problem is eliminated. Our qualification testinghas confirmed this.

110


APPLICATIONS

Automated Test Equipment

CRR for functional test systems. Functional testsystems continue to grow in size, pin count andcomplexity. Each pin usually requires 3 to 5 testconnections. Each test connection needs to beisolated from all the others. Introducing any leakagepaths thwarts the signals under test potentiallyshunting them to the point where they lose theirfunctionality.

Because of the high pin counts, the number of testconnections grows dramatically. Here the need tosatisfy these test connections with an ultra smallsurface mounted relay (CRR series) becomes idealfor the following reasons:

1. Extremely small size2. Ability to mount the Reed Relays on both

sides of the board3. Standard internal magnetic shielding

eliminating any magnetic interaction evenin the tightest matrices

4. Insulation resistance to all points typically1014 ohms.

5. Over 200 volts isolation across the contacts.6. A minimum of 1500 volts isolation between

switch and coil.7. Thermal offset voltage across the contacts

in the one microvolt or less range8. Contact capacitance less than 0.2 pf

CRF for wafer, memory, and integrated circuit testsystems. Integrated circuit and wafer testers havecontinued to take on an ever more complex formatwith the need for faster and faster clock rates. Withclock rates in the 2 GHz range, components mustbe able to pass continuous wave signals withfrequency responses in the 8 to 10 GHz range. Thesefast switching high speed digital signals require thesenew frequency responses so that signals are notslewed or reflected going through the switchingcomponents in these systems. With the pin countsstill going up on integrated circuits, the need for ahigh number of switching points continues to grow.The CRF Reed Relay represents an ideal switch inthese component testers for the following reasons:

1. The frequency response of 7 GHz or greateris a current critical need.

2. Rise time change through the relay of 40picoseconds typical.

3. 50 ohms characteristic impedance.4. Insertion loss less than 1 dB at 6 GHz.5. Extremely small size.6. Ability to mount the Reed Relays on both

sides of the board (with internal magneticshielding eliminating any magneticinteraction).

7. Insulation resistance to all points typically10

14 ohms.

8. Over 200 volts isolation across the contacts.9. A minimum of 1500 volts between switch

and coil.10. Thermal offset voltage across the contacts

in the one microvolt or less range.11. Contact capacitance less than 0.2 pf.12. Open contacts to shield capacitance 0.6

pf.

111


Instrumentation (CRR and CRF)

1. On the front end of multimeters wherevoltage isolation is required, low voltageoffsets (on the order of 1 microvolt or less)and very low sub-picoamp leakages areneeded.

2. Feedback loops where high frequency, lowleakage, and voltage isolation are required

3. In Attenuators where a high frequencyresponse is required, low leakage paths areessential, long life (in excess of 100 millionoperations), and elimination of any inter-modular distortion is a clear need.

The CRF can also be used in cell phone applications,TX/RX switching, two way pagers, and PDAs.

Multi-pole Configurations

When circuits require common points tied together,capacitance becomes a real problem. Trying toreduce this capacitance can be a real effort with noclear solution. Using our new relay approach multi-pole relays with common tie points are no problemconfiguring with resulting reduced capacitance.Relay drivers, connectors, etc. can be easily addedforming RF switching modules, RF attenuators, T/Rswitches, ‘T’ switches, etc.

Height: max.

*All dimensions in mm (inches)

DIMENSIONS

PIN OUT POST REFLOWPAD LAYOUT

Figure # 9 Mechanical outlays with Ball Grid Array (BGA).

112


Most important in the testing of any component forfrequency response over 100 MHz is a good NetworkAnalyzer and carefully designed test fixtures forcalibration as well as for the actual testing. Thesame is true when testing in the time domain. Inthe time domain, when measuring rise timecharacteristics, one must be aware of overshoot andundershoot of the rise time pulse that maycompromise measurements. These overshoots orundershoots if real, may compromise thecomponents function in actual test systems. Socare must be taken to determine whether thisphenomena is real or fixture related.

Fixture design starts with suitable SMA connectorson high frequency board material. There are severalmaterials suitable for this including FR-4, G-Techmaterials, and several Rogers PCB materials. Manyfeel FR-4 material is suitable since the fixture zeroingprocess will eliminate its high frequency losscharacteristics. As a general rule, below 6 GHz isokay; above 6 GHz use of Rogers high frequencycircuit materials such as, RO3203 or RO4350 willimprove the test performance. Rogers has severalother materials available depending upon the TCEmatching of the component/s or performancerequirements. Most of these materials are ceramicfilled.

Figures 10, 11, 12 and 13 below show calibrationboard layouts for a shorted to ground, and opencircuit, through line transmission, a 50 ohmimpedance termination, and the layout used to testthe device. As many ground points as possible wereused along with avoiding and sharp corners. All signalpath transitions were made as gradual as possible.

Once the calibration testing was completed, our testprocess was as follows using an Agilent NetworkAnalyzer Model number 8720ES (See test layoutin Figure #14).

All calibration boards were entered into the networkanalyzer and stored. The relay under test was thenmeasured and stored. The calibration data was thenentered and the losses due to the board under thevarious configurations was extracted yielding theresults shown below. This was compared with dataextracted from a MIMICAD program using theequivalent circuit presented and the S parameters;and it was found both tracked very closely. See theresults from the data shown below taken fromnetwork analyzer. Included are the isolation,insertion loss, and VSWR. Also, included below isa Smith chart indicating the impedance for a givenfrequency over the entire frequency range.

RF Testing both in the Frequency and Time Domain

113


Fixture Design

Definition of the exact geometry your test fixture willtake is the first key step. Listed below are fourgeometries and their corresponding equations forcalculating the characteristic impedance. Theseequations are approximations where fringe fieldeffects were neglected for ease of calculation. Finetuning of the geometry may be required to obtainthe most desired effect. However, these equationspresent a good starting point.

Figure # 10. Coaxial cable geometry

Zo = 60/(√√√√√ (εεεεεr)) ln ((2h)/d) Eqn 29

for a coaxial cable

where h and d are defined above and εεεεεr is thedielectric constant for the material betweenconductors.

Figure # 11. Round wire over a ground geometry.

Zo = 60/(√√√√√ (εεεεεr)) ln ((4hkp)/d) Eqn 30

for a round wire over ground

Here kp is the proximity factor for round wire over

ground, which is near unity when the ratio h/d islarge; but for close spacing is approximately

kp = ½ + (√√√√√ (4h2 – d2))/4h Eqn 31

kp is reduced to ½ when the round wire touches the

ground at d = 2h. The proximity effect results fromthe same mechanism as skin effect. Mutualrepulsion drives like currents to the extreme outeredges of individual conductors carrying current inthe opposite direction. This crowds the current inround wires toward the side nearest a ground planeor the return conductor. As is the case while signalis going through the relay, the proximity effect andskin effect are indistinguishable for a coaxial linebecause the entire surface of the round centerconductor is at the same distance from the shield.Proximity effect is not normally considered for thinrectangular conductors, but skin effect does drivethe currents toward the edges of the conductors.

114


Figure # 12. Buried microstrip geometry.

Zo = 60/(√√√√√ (εεεεεr)) ln ((5.98h)/(0.8w + t)) Eqn 32

buried microstrip over ground

Figure # 13. Stripline geometry.

Zo = 60/(√√√√√ (εεεεεr)) ln (3.8(h +0.5t)/(0.8w + t))

Eqn 33

Stripline between ground planes

Test Setup and Test Fixtures

Key to the proper testing of a component in an RFcircuit is the proper use of test fixtures.

Figure #14. Test Setup

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115


Calibration Approach Critical

The fixtures were constructed to serve as calibrationboards to allow for better characterization of therelays. All the fixture boards used to test the relaysunder test (RUT) used SMA connectors forconnection to and from the test equipment and forterminations. The following are the makeup of theboards under test:

- RUT calibrated with a 50 ohm line and opentermination- RUT calibrated with a 50 ohm line and shortedtermination- RUT calibrated with a 50 ohm line and 50 ohmtermination- RUT calibrated with a 50 ohm through line

Figure #15. 50 Ohm termination board

Figure #16. Open/short termination board

Figure #17. Through line transmission termination board

Figure #18. Relay under test termination board

OPEN SHORT

116


Insertion Loss:

Figure #19 Insertion loss tested to 7 GHz for theReed Relay shown in Figure # 9. Horizontal fullscale: 7.0 GHz. Vertical scale: 10 dB/divreferenced from the 0 mark.

Copper Wire Insertion Loss:

Figure # 20 Insertion loss tested to 7 GHz forthe Reed Relay shown in Figure # 9 but with theinternal Reed Switch replaced with a bare copperwire. Horizontal full scale: 7.0 GHz. Verticalscale: 10 dB/div referenced from the 0 mark.

117


VSWR:

Isolation:

Figure # 21. Voltage Standing Wave Ratio(VSWR) tested to 6.5 GHz for the Reed Relayshown in Figure # 9. Horizontal full scale: 6.5GHz. Vertical scale: 1.0/div referenced from thebottom line 1.0 mark.

Figure # 22. Isolation tested to 7 GHz for theReed Relay shown in Figure # 9. Horizontal fullscale: 7.0 GHz. Vertical scale: 10 dB/divreferenced from the 0 mark.

118


Figure # 23. Return loss tested to 6.5 GHz forthe Reed Relay shown in Figure # 9. Horizontalfull scale: 6.5 GHz. Vertical scale: 10 dB/divreferenced from the 0 mark.

Return Loss:

Characteristic Impedance:

Figure # 24. Represents the characteristicimpedance going through the Reed Relay shownin Figure # 9. Waves 1 through 5 depict calibrationpoints. Horizontal full scale: 750 ps. Verticalscale: 150 milliUnit/div referenced from the 0 unitmark. The vertical scale measures the reflectioncoefficient.

1 - Short Before Relay

2 - Open Contacts

3 - Close Contacts

4 - Closed Contacts - Shorted

5 - Closed Contacts - 50 Ohm

119


Figure # 25. Shows a Smith Chart plotted forfrequencies to 4 GHz. The second dotted circlestarting from the right is the 50 Ohm impedancepoint.

Smith Chart:

120


Test Results

Figures # 19 through 25 represent the results of ourtesting using the procedures previously describedand the fixtures presented. The fixtures used weremade from FR-4 printed circuit board material.Improvements to the fixturing, using some of theRogers PCB material may improve the results.

Insertion Loss

As explained earlier, insertion loss is the loss ofpower going through the relay. Insertion loss is oneof the most important measurements in RF becauseit is simply a measure of the loss of the signal goingthrough the component (Reed Relay). Minimizingthis loss is a key interest.

First, it can be clearly seen that the insertion losslooks excellent up to 7 GHz, as shown in Figure #19. As shown, the insertion loss curve is very flatand begins to tail off at 7 GHz. Clearly, this indicatessignals, whether digital or analog, will fare very wellwhen switched and passing through this CRFceramic Reed Relay. When using semiconductorsas a switching element, inter- modulation distortionmay sometimes occur, giving rise to distortions inthe frequency response. With a passive device suchas the Reed Relay, no inter-modulation distortionexists, resulting in a very flat insertion loss up to 7GHz. Having this very flat insertion loss allows theuser the ability to switch, carry or deal with a multitudeof different frequencies or different width digitalpulses, without having to worry about having differentswitches to handle the different frequencies.

At higher and higher frequencies, it has beenproposed that a Reed Relay, because it uses nickel/iron as its center conductor, will not have very goodperformance characteristics. Skin effect is often theproposed culprit, because nickel and iron, beingferromagnetic, have a high magnetic permeability µ.However, this is not the case as shown in Figure #20, where the Reed Switch in Figure # 9 was

replaced with a pure copper wire. Comparing Figures#19 and # 20, one sees little or no difference. Underhigh power transmission conditions, a differencewould probably be seen. But as is the case in manyapplications, the power being switched is very low;and therefore, we only see a negligible effect up toseven GHz.

VSWR

VSWR represents the effects of the transmission ofpower due to standing waves. When standing wavesare present on a line, some power is being reflectedback on the line and re-reflecting again from thesource. This back and forth reflection producesstanding waves. These standing waves interfere withthe transmission of the original signals from thesource because they are continuously present andcontinually absorb power. Figure # 21 presents theVSWR for the Reed Relay shown in Figure # 9.While still an important RF characteristic for analogcontinuous wave analysis, insertion loss is lookedon more for RF characteristics.

Isolation

Isolation is the ability of a component to isolate theRF signal from propagating further in a circuit. For aReed Relay, the isolation is a measure of the abilityto halt further progress of the signal when it is in theopen state. We all think of a switch in the openstate as meaning no signal passes beyond thoseopen contacts. However, with RF we know an opencircuit is not totally open because the capacitanceacross the contacts represents a leakage path; andindeed with high enough frequencies, that’s exactlywhat occurs. Presented in Figure # 22 one cansee isolation of –50 dB or greater at low RFfrequencies which drops to –15 dB at 3 GHz andcontinues to a level of –10 dB at 7 GHz. Contributingto this drop off in isolation is the contact gap.Increasing the gap on the Reed Switch is very difficultto do because it would require a larger capsule, whichwould increase the package size. Also, a largergap will make the switch less sensitive for closure,

121


requiring more coil power. If the isolation is a criticalparameter in an application, stringing more than oneReed Relay together will help. Also using a ‘T’ switchor half ‘T’ switch will yield much higher isolations.

Return Loss

Return loss is also an RF parameter that is not usedas much as the insertion loss or isolation. As stated,it is a measure of the power of the RF signal beingreflected back to the source. As can be seen inFigure # 23, the return loss has only 35 db ofreflected signal at the lower frequencies and about10 db reflected back at 6.5 GHz. Here the larger thedB level the lower the percentage of the signal beingreflected.

Characteristic Impedance

To gain most information from a characteristicimpedance measurement of the relay it is fruitful tomake measurements of the signal up to certainpoints while going through the relay. Since thismeasurement is a spatial measurement, the actualimpedance at each point of the relay can bemeasured. The following points of reference weremade as shown in Figure # 24:

1. A short before the relay defining when the signal enters the relay;2. Open contacts define the signal up to the middle of the relay;3. Closed contacts define the signal path up to the end of the relay;4. Closed contacts with the relay shorted; and5. Closed contacts with the relay terminated in 50 ohms.

Superimposing the 5 traces on the actual tracethrough the relay, a full picture of the characteristicimpedance can be seen at each point though therelay. This is very valuable particularly if the relay orcomponent is slightly off the 50 ohm impedance.As shown in the trace in Figure # 24, the relay is

slightly above 50 ohms. With the trace being high,this indicates a slightly inductive entrance into andout of the relay. Compensating with a littlecapacitance on each end of the relay will tune theimpedance to the desired level. This will in turnimprove the performance of the relay in a given circuitand increase its performance at higher RF frequenciesas well.

Smith Chart

If one is looking at different RF frequencies in a givenapplication or at a specific frequency, a Smith Chartcan help by presenting the characteristic impedanceover a given frequency range. The Smith Chartpresents a plot of the response of frequencies every50 KHz up to 4 GHz. Shown in Figure # 25, theplot of points is centered around the 50 ohm realpoint. To better understand this Smith Chart, thesecond dotted circle starting from the right centerpoint of the large circle is the 50 ohm impedancecircle. The center line of the circle runninghorizontally, is the real axis. Plots above this lineare inductive and plots below this line are capacitive.As shown, the plot of the CRF relay is in a tightcircle around the real axis, and centered around the50 ohm circular axis.

Summary

As can be seen the CRF Reed Relay is an excellentReed Relay for switching and carrying RF signals atleast up to 7 GHz and beyond. Our current effortsare to improve its characteristics up to 10 GHz andbeyond. This is a reachable goal as we try tocontinually develop new RF relays, pushing thecurrent bandwidth and current ‘state of the art’. Ashigher and higher frequencies are used andcomponents are needed to develop these circuits,the need for Reed Relays like the CRF series andsubsequent improvements on performance overexisting data will be needed. Our engineers are upfor this challenge.

242

Reed Relay Specification SectionIn the following section, our standard Reed Relaysare described and their specifications presented.These specifications present only a small amountof the Reed Relays we offer. They give a relativelygood idea of our capabilities, however, most of ourReed Relays are specials designed to our customers’special requirements. We have engineers locatedinternationally in strategic locations able to help youon any relay application. If you do not see somethingclose to your needs in our data book, please callour applications department in any one of ourinternationally located offices.

Examining our pictorial overview of our products andour selection chart first, will help you narrow downyour requirement rapidly where, between the two,the main characteristics of each Reed Relay seriesare specified. To become completely familiar withthe Reed Relay specifications, please feel free toread our Reed Switch characteristics introductorysection in the beginning of this book. Valuable insightinto Reed Switch and Reed Relay characteristicsare presented.

The ordering information for a given Reed Relay ispresented in each specification. The particular ReedSwitch models are indicated for each Relay seriesused, and the particular life expectations under loadare presented at the end of the Reed Switchspecifications section. If a particular Reed Switchis not called out in a given relay series that might beapplicable to your application, consult ourapplications department to see if that particular ReedSwitch could be designed into your relayrequirement.

SERIES Page

BE Series 243BT Series 248CRF Series 251CRR Series 256DIL Series 259DIL-CL Series 264DIP Series 267H Series 272HE Series 276HF Series 280HI Series 283HM Series 286LI Series 290LP Series 293MS Series 296NP Series 299NP-CL Series 302SIL Series 305

TOLERANCESThe tolerances are on overall package dimensions +/- 0.25mm [+/- 0.010 inches]. Pin to pin dimensionsare +/- 0.01mm [+/- 0.005 inches] unless otherwise specified.

RELAY INDEX MEDER electronic

InstrumentationBE, BT, CR, DIL, DIP, HI, LI, LP, MS, SILGeneral PurposeBE, DIL, DIP, LI, LP. MS, NP, SILCurrent SensingDIL-CL, NP-CL, SIL-CLHigh Voltage / High IsolationH, HE, HI, HM, LI, MS, SILRF and Fast Digital PulseApplicationsCRF, CRRHigh Power RF SwitchingHF

243

• Large assortment of pin out schemes• High life expectancy• Low thermal versions available

• Telecommunications• Medical equipment• Test and Measurement• General applications

DIMENSIONS

DESCRIPTION

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MEDER electronic BE Series

All dimensions in mm [inches]

FEATURES

• 6 Volt coil option• Up to 5 switches in a package (Consult factory)• Normally closed option• Insulation resistance up to 1014 Ω available• Metal and Plastic casings available• Mercury wetted switch available• Latching version available• EX approved version (Intrinsically safe)• 4.5 kVDC (3.0 kVRMS) contact to coil option• High contact to coil voltage

244

BE Series MEDER electronic !"

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21 61 054 005 055 9.1 4.8 8.1 3.8 092

42 03 0441 0061 0671 7.3 8.61 6.3 7.61 063

.Cseergedrep%4.0foetarehttaegnahclliwecnatsiserliocdnaegatlovtuo-pord/ni-llupehT*.evitisopsiowtniP.devresboebtsumBmroFnoytiraloplioC.dedeecxesiegatlov.xamehtfiruccoyamBmroFehtfoerusolceR**

.stcatnocehthctallliwegatlovlanimonhtiwenorebmunliocoteslupsm2agniylppA.devresboebtsumytiraloplioC***.stcatnocehthctalnulliwowtrebmunliocoteslupsm2agniylppA

248

• Test, measurement and control technology• High precision measuring devices• Change-over switch for measuring points of thermoelectric elements and resistance thermometers• Recorder inputs• Scanners• Data Acquisition systems

The BT series are low thermal relays with 2 Form Aswitches having a thermal offset voltage of 1µVmax. with a 100% duty cycle. This extremely lowthermal voltage is achieved through an optimizedtemperature balance between the Reed Switchesand minimum coil power. This enables the relays ofthe BT series to switch signals in the low µV level.

$ % & '(!

BT05 - 2A66

05 is the nominal voltage

DESCRIPTION

DIMENSIONS

APPLICATIONS

ORDER INFORMATION

AlAl


PIN OUT

FEATURES

• Form B available• Very low offset voltages

) *+

# #"

BT Series MEDER electronic

SEIRES LANIMONEGATLOV

TCATNOCMROF

HCTIWSLEDOM

TB -XX A2 66

SNOITPO 42,21,50

249

) *+

# #"

MEDER electronic BT Series

RELAY DATA


66hctiwSAmroF2

sgnitaRtcatnoC snoitidnoC .niM .pyT .xaM stinU

rewoPgnihctiwS tonA&VfonoitanibmocCDynAs'.xamlaudividniriehtdeecxeot 01 W

egatloVgnihctiwS CAkaeproCD 002 V

tnerruCgnihctiwS CAkaeproCD 5.0 A

tnerruCyrraC CAkaeproCD 52.1 A

ecnatsiseRtcatnoCcitatS Am05&V5.0/w 051 mΩ

ecnatsiseRtcatnoCcimanyD sm5.1Am05&V5.0/wderusaeMerusolcretfa 002 mΩ



01 01

01 2101 21

01 41 Ω


5220051 CDV

ecnuoB.lcni,emiTetarepO evirdrevo%001/wderusaeM 5.0 sm

emiTesaeleR noisserppusliocon/wderusaeM 1.0 sm


2.00.4 Fp

tesffOlamrehT egapgniwollofnocitamehcseeS 1 µV

seicnatcepxEefiL

[email protected] .pacyartsFp01<&ylnoCD 0001 01 6


.151egapno

ataDlatnemnorivnE

ecnatsiseRkcohS sm11noitarudevawenis2/1 05 g

ecnatsiseRnoitarbiV zH0002-01morF 02 g

erutarepmeTtneibmA 01 0 elbawolla.xametunim/C 02- 07 0C

erutarepmeTegarotS 01 0 elbawolla.xametunim/C 04- 501 0C

erutarepmeTgniredloS llewd.ces5 062 0C

250

) *+

# #"

BT Series MEDER electronic

View on component side

COIL DATA

MEASURING SCHEMATIC

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A2 66

5 5.7 018 009 099 58.0 5.3 57.0 4.3 03

21 61 0954 0015 0165 9.1 4.8 8.1 3.8 03

42 03 05481 00502 05522 7.3 8.61 6.3 7.61 03

rep%4.0foetarehttaegnahclliwecnatsiserliocdnaegatlovtuo-pord/ni-llupehT* 0 .C

251

MEDER electronic CRF Series ,- ,./+ 01 #

# 2 ΩΩΩΩΩ 3!

DESCRIPTION

• Test and measurement• Medical Equipment• Telecommunications• High frequency applications

The MEDER CRF Series Reed Relay is a low-profiledevice made with a ceramic case that exactly matchesthe thermal coefficient of expansion of the reed switchglass and the reed lead to eliminate any potentialpackaging stress. Capable of switching up to 7 GHzwith <40 ps rise times for digital operations, this leadless50 Ohm reed relay is the smallest in the industry andswitches into the billions of operations.

Capable of withstanding reflow-soldering operationsup to 260°C, the relay uses no internal solder and has 1µV typical thermal offset. Measuring only 8.6 mm x 4.4mm x 3.4 mm, the leadless design eliminates skewing ofleads and co-planarity issues.


APPLICATIONS

DIMENSIONS (Non-BGA)

•Ceramic / thermoset molded package•Patent pending•Smallest in the industry•No lead frame surface mount design eliminates skewing of leads and coplanarity issues•No internal solder connections•Minimum path length for RF•Up to 7 GHz switching frequencies•Ability to switch fast pulses with rise times of 40 pico seconds or less•Available with BGA•Internal magnetic shield standard•Very low profile•Gold plated leads for high conductivity RF path•Low thermal offset typical 1 µV•TCE matching of all internal components•Insulation resistance typical 1014 ohms•3 Volt option available

FEATURES

PIN OUT PAD LAYOUT (Top View) (Bottom View)

252

CRF Series MEDER electronic ,- ,./+ 01 #

# 2 ΩΩΩΩΩ 3!

ORDER INFORMATION

$ % & '(!

CRF05 - 1AS

05 is the nominal voltage1A is the contact formS is the solder ball option


DIMENSIONS (with BGA)

PIN OUT POST REFLOW

Height: max.


TCATNOCMROF NOITPO

FRC -50 A1 X

SNOITPO *S

)A1-50FRCsirebmuNtraPAGB-noN(noitpOllaBredloS*

Ω

!! " # #! $#!%&'$( '!!&)

CR COIL DATA

PAD LAYOUT (Top View) (Bottom View)

253


# 2 ΩΩΩΩΩ 3!


08tcatnoCAmroF


gnitaRtcatnoC tonA&VfonoitanibmocCDynAs'.xamlaudividniriehtdeecxeot 01 W




ecnatsiseRkluB nolairetamdetalpllahguorhTetartsbus 002 053 mΩ


ecnatsiseRtcatnoCcimanyD Am05&V5.0/wderusaeM 001 051 mΩ


stcatnocssorcAdleihsdnaliocottcatnoC

01 01

01 3101 21

01 41 Ω

egatloVnwodkaerB stcatnocssorcAdleihsdnaliocottcatnoC

0120051 CDV


emiTesaeleR noisserppusoN 20.0 sm

)zHk01@(ecnaticapaC stcatnocssorcAdleihsdnaliocottcatnoC

1.07.0 Fp

seicnatcepxEefiL

Am01@stloV5gnihctiwS .pacyartsFp01<&ylnoCD 0001 01 6


.151egapno

ataDlatnemnorivnE






esaCfolairetaM cimareC/tesomrehT

sdapfolairetaM detalPgA

RELAY DATA

254

CRF Series MEDER electronic ,- ,./+ 01 #

# 2 ΩΩΩΩΩ 3!

Insertion Loss:

Insertion loss tested to 7 GHz for the CRF ReedRelay. Horizontal full scale: 7.0 GHz. Vertical scale:10 dB/div referenced from the 0 mark.

Copper Wire Insertion Loss:

Insertion loss tested to 7 GHz for the CRFReed Relaybut with the internal Reed Switch replaced with abare copper wire. Horizontal full scale: 7.0 GHz.Vertical scale: 10 dB/div referenced from the 0 mark.

VSWR:

Voltage Standing Wave Ratio (VSWR) tested to 6.5GHz for the CRF Reed Relays. Horizontal full scale:6.5 GHz. Vertical scale: 1.0/div referenced fromthe bottom line 1.0 mark.

Isolation:

Isolation tested to 7 GHz for the CRF Reed Relay.Horizontal full scale: 7.0 GHz. Vertical scale: 10dB/div referenced from the 0 mark.

255


# 2 ΩΩΩΩΩ 3!

Return Loss:

Return loss tested to 6.5 GHz for the CRF ReedRelay. Horizontal full scale: 6.5 GHz. Vertical scale:10 dB/div referenced from the 0 mark.

Characteristic Impedance:

Represents the characteristic impedance goingthrough the CRF Reed Relay. Waves 1 through 5depict calibration points. Horizontal full scale: 750ps. Vertical scale: 150 mUnit/div referenced fromthe 0 unit mark. The vertical scale measures thereflection coefficient.

1 - Short Before Relay

2 - Open Contacts

3 - Close Contacts

4 - Closed Contacts - Shorted

5 - Closed Contacts - 50 Ohm

Smith Chart:

Shows a Smith Chart plotted for frequencies to 4GHz. The second dotted circle starting from theright is the 50 Ohm impedance point.

256

CRR Series MEDER electronic* # #"

DESCRIPTION

The MEDER CRR Series Reed Relay is a low-profiledevice made with a ceramic case that exactly matchesthe thermal coefficient of expansion of the reed switchglass and the reed lead to eliminate any potentialpackaging stress. This reed relay is the smallest in theindustry and switches into the billions of operations.

Capable of withstanding reflow-soldering operationsup to 260°C, the relay uses no internal solder and has 1µV typical thermal offset. Measuring only 8.6 mm x 4.4mm x 3.4 mm, the leadless design eliminates skewing ofleads and co-planarity issues. Insulation resistancetypical to all points is >1014 Ohms.


DIMENSIONS (Non-BGA)

•Test and measurement•Medical equipment•Telecommunications

APPLICATIONS

FEATURES

•Ceramic / thermoset molded package•Patent pending•Smallest in the industry•No lead frame surface mount design eliminates skewing of leads and coplanarity issues•No internal solder connections•Available with BGA•Internal magnetic shield standard•Very low profile•Gold plated leads•Low thermal offset typical 1 µV•TCE matching of all internal components•Insulation resistance typical 1014 ohms•3 Volt option available

PIN OUT PAD LAYOUT (Top View) (Bottom View)

257

CR COIL DATA

ORDER INFORMATION


DIMENSIONS (with BGA)

$ % & '(!

CRR05 - 1AS

05 is the nominal voltage1A is the contact formS is the solder ball option

Height: max.

PIN OUT POST REFLOWPAD LAYOUT (Top View) (Bottom View)


TCATNOCMROF NOITPO

RRC -50 A1 X

SNOITPO *S

)A1-50RRCsirebmuntrapAGB-noN(noitpOllaBredloS*

Ω

!! " # #! $#!%&'$( '!!&)

MEDER electronic CRR Series* # #"

258

RELAY DATA

CRR Series MEDER electronic* # #"


08tcatnoCAmroF


gnitaRtcatnoC tonA&VfonoitanibmocCDynAs'.xamlaudividniriehtdeecxeot 01 W




ecnatsiseRkluB nolairetamdetalpllahguorhTetartsbus 002 053 mΩ


ecnatsiseRtcatnoCcimanyD Am05&V5.0/wderusaeM 001 051 mΩ


stcatnocssorcAdleihsdnaliocottcatnoC

01 01

01 3101 21

01 41 Ω

egatloVnwodkaerB stcatnocssorcAdleihsdnaliocottcatnoC

0120051 CDV


emiTesaeleR noisserppusoN 20.0 sm

)zHk01@(ecnaticapaC stcatnocssorcAliocottcatnoC

1.07.0 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






esaCfolairetaM cimareC/tesomrehT

sdapfolairetaM detalPgA

259

DESCRIPTION

Several pin out options are possible with the 14 pinDIL series. Suitable for telecommunicationapplications where breakdown voltages up to 4.25kVDC and the EN60950 approval are required.

• Compatible with DIL socket• Coil resistance up to 11 kΩ• Diode option

43) 5". 6 ! $ 7

8549 :8 5$/ ;!$.

CHARACTERISTICS


MEDER electronic DIL Series

DIMENSIONS

ORDER INFORMATION

Part Number Example

DIL12 - 1A81 - 10LHR

12 is the nominal voltage1A is the contact form81 is the switch model10 is the pin outL is the optionHR is the high resistance version

FEATURES

• EN60950 approved• 1 Form C available• High resistance available• Up to 4 Form A switches available• Magnetic shield available• 4.25 kVDC breakdown voltage available• High power switching available

!"#"!$%&$!'%(")!"%!#!$*%'+%(*', -$%.'%(")!"%!#!/

")!"%!#!$*% !"#"!$%&$0+"**% $'1 0$!*-$%.'%(")!"%!#!/

2"$'+%(*0$!

$%.3/4

260

DIL Series MEDER electronic 43) 5". 6 ! $ 7

8549 :8 5$/ ;!$.

OPTIONS

Please note: Any option can affect the coil resistance, the breakdown voltage or otherelectrical data. Please contact us.

Special performance: The following special options are available on request:

• Low height versions available (5 and 8 mm)• Other pinning layouts• Other coil resistance values• Other switches available

PIN OUT

( ) Versions with magnetic shield

261

43) 5". 6 ! $ 7

8549 :8 5$/ ;!$.


COIL DATA

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

662757

5 5.7 504 054 594 58.0 5.3 57.0 4.3 55

21 61 0261 0081 0891 9.1 4.8 8.1 3.8 08

42 03 0504 0054 0594 7.3 8.61 6.3 7.61 031

gH88dettew

5 5.7 351 071 781 58.0 5.3 57.0 4.3 541

21 61 036 007 077 9.1 4.8 8.1 3.8 502

42 03 0351 0071 0781 7.3 8.61 6.3 7.61 043

185 5.7 0072 0003 0033 58.0 5.3 57.0 4.3 01

21 61 0009 00001 00011 9.1 4.8 8.1 3.8 511

A2

662757

5 5.7 081 002 022 58.0 5.3 57.0 4.3 521

21 61 216 086 847 9.1 4.8 8.1 3.8 012

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

gH88dettew

5 5.7 45 06 66 58.0 5.3 57.0 4.3 514

21 61 513 053 583 9.1 4.8 8.1 3.8 014

42 03 5121 0531 5841 7.3 8.61 6.3 7.61 524

C1

09

5 5.7 081 002 022 58.0 5.3 57.0 4.3 521

21 61 009 0001 0011 9.1 4.8 8.1 3.8 541

42 03 0072 0003 0033 7.3 8.61 6.3 7.61 091

C2

5 5.7 711)541(

031)051(

341)561( 58.0 5.3 57.0 4.3 091

)561(

21 61 774)216(

035)086(

385)847( 9.1 4.8 8.1 3.8 072

)012(

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

rep%4.0foetarehttaegnahclliwecnatsiserliocdnaegatlovtuo-pord/ni-llupehT* 0 .C.36tuoniproferasisehtnerapniseulaV)(

262

DIL Series MEDER electronic 43) 5". 6 ! $ 7

8549 :8 5$/ ;!$.

RELAY DATA


66hctiwSAmroF

27hctiwSAmroF

18hctiwSAmroF

sgnitaRtcatnoC snoitidnoC .niM .pyT .xaM .niM .pyT .xaM .niM .pyT .xaM stinU

rewoPgnihctiwS tonA&VfonoitanibmocCDynAs'.xamlaudividniriehtdeecxeot 01 02 5 W

egatloVgnihctiwS CAkaeproCD 002 002 09 V

tnerruCgnihctiwS CAkaeproCD 5.0 0.1 5.0 A

tnerruCyrraC CAkaeproCD 52.1 52.1 0.1 A

ecnatsiseRtcatnoCcitatS Am05&V5.0/w 051 051 002 mΩ

ecnatsiseRtcatnoCcimanyD sm5.1Am05&V5.0/wderusaeMerusolcretfa 002 002 002 mΩ



01 01

01 2101 21

01 2101 9

01 21 Ω


5225.1

023*5.1

0015.1

CDVCDVk

ecnuoB.lcni,emiTetarepO evirdrevo%001/wderusaeM 5.0 5.0 5.0 sm

emiTesaeleR noisserppusliocon/wderusaeM 1.0 1.0 1.0 sm


2.00.4

2.00.4

2.00.4 Fp

seicnatcepxEefiL

Am01@stloV5gnihctiwS .pacyartsFp01<&ylnoCD 0001 0001 001 01 6


.151egapno

ataDlatnemnorivnE

ecnatsiseRkcohS sm11noitarudevawenis2/1 05 05 03 g

ecnatsiseRnoitarbiV zH0002-01morF 02 02 01 g

erutarepmeTtneibmA 01 0 elbawolla.xametunim/C 02- 07 02- 07 02- 07 0C

erutarepmeTegarotS 01 0 elbawolla.xametunim/C 52- 58 52- 58 52- 58 0C

erutarepmeTgniredloS llewd.ces5 062 062 062 0C

.51dna31stuoniprofSMRVk0.3/CDVk52.4*

263

43) 5". 6 ! $ 7

8549 :8 5$/ ;!$.


RELAY DATA


57hctiwSAmroF

88hctiwSgH/AmroF

dettew

09hctiwSCmroF










01 01

01 2101 01

01 2101 9

01 21 Ω


00515.1

0051*5.1

0025.1

CDVCDVk


emiTteseR noisserppusliocon/wderusaeM 1.0 0.2 5.1 sm


4.00.4

4.00.4

0.10.4 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






.51dna31tuoniprofSMRVk0.3/CDVk52.4*

264

• Line Sense Relay• Breakdown voltage coil-contact up to 4.25 kVDC / 3.0 kVRMS• Approved according to EN60950• Low profile version only 5.8 mm high• UL approval

The DIL-CL series is used for line sensing in manymodems, fax machines, private branch exchanges(PBX) and other telecommunication devices. It issuperior to semiconductor solutions regardingflashover and impulse strength. The DIL-CL seriesis approved according to EN60950.

$ % & '(!

DIL - CL - 1A81 - 9 - 13M

9 is the coil resistance in Ω13M is the pin out

DIMENSIONS

DESCRIPTION

CHARACTERISTICS

ORDER INFORMATION


• Pull-In current < 15 mA possible

FEATURES

DIL-CL Series MEDER electronic). "./

# #"

Ω

#0

##

$(%"*)#

1*()## Ω $!&!

265

). "./

# #"

MEDER electronic DIL-CL Series

PIN OUT

COIL DATA

tt

TCATNOCMROF

HCTIWSLEDOM TUONIP LIOC

ECNATSISERNI-LLUPTNERRUC

TUO-PORDTNERRUC

ECNATCUDNItazHk1ta LIOC1

*( ta )SLIOCHTOB

02taatadllA 0C tΩ Am Am Hm

.moN .pyT .xaM .niM .xaM .niM .xaM .niM .pyT .xaM

mm8.5thgieH

A1 18 M3159 01 11 1.5 51 5 9.41 6.1 0.2 4.2

41 51 71 1.5 51 5 9.41 88.2 6.3 23.4

mm6.01thgieH

A1 18

M31M51 8 9 01 1.5 51 5 9.41 65.2 2.3 29.3

M31 41 51 71 1.5 51 5 9.41 25.3 4.4 82.5

M81 tt 6.3 4 4.4 1.5 51 5 9.41 46.0*65.2

8.0*2.3

69.0*48.3

t rep%4.0foetarehttaegnahclliwecnatsiserliocdnatnerructuo-pord/ni-llupehT 0 .Ctt .gnidiaseiresnisliocroferadetneserpseulaV

266

RELAY DATA

DIL-CL Series MEDER electronic). "./

# #"


18hctiwSAmroF










01 9

01 01 Ω

egatloVnwodkaerBstcatnocssorcAliocottcatnoC

00152.40.3

CDVCDVkSMRVk




2.00.4 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






267

• Low profile package• Standard pin configurations• IC-pin compatible• 4.25 kVDC breakdown voltage for pin out 13• UL approval

DESCRIPTION

DIMENSIONS

MEDER electronic DIP Series

The DIP series is a very compact design having alow profile package and a high profile package.This series is compatible with all DIP relays.

CHARACTERISTICS


FEATURES

• High resistance option available• SMD version available• Diode option available• Mercury wetted switch option available

!"#$$

268

DIP Series MEDER electronic

PIN OUT

%&'()*+

DIP12 - 1A72 - 13L

12 is the nominal voltage1A is the contact form72 is the switch model13 is the pin outL is the option

ORDER INFORMATION

!"#$$

YALER

SEIRES

LANIMON

EGATLOV

TCATNOC

MROF

HCTIWS

LEDOMTUONIP

NOITPO

HTIWNOISREV)(

DLEIHSCITENGAM

PID -XX XX -XX XX X

SNOITPO

,51,21,5042

A1

57,27

*31,11

E,)Q(D,)M(L)S(F,)R(

B1 91

A2 12

21,50 C1 09 15

.liocottcatnocegatlovnwodkaerb)SMRVk0.3(CDVk52.4stceleS*

269


( ) Versions with magnetic shield

OPTIONS

L = No optionD = With Diode between pin 2 and 6 (Pin 2 is positive)E = Internal shield on pin 9F = With Diode between pin 2 and 6 (Pin 2 is positive)

and Internal shield on pin 9M = External magnetic shieldQ = External magnetic shield

and diode between pin 2 and 6 (Pin 2 is positive)R = External magnetic shield

and internal shield on pin 9S = External magnetic shield

and with diode between pin 2 and 6 (Pin 2 is positive) and internal shield on pin 9

!"#$$

OPTIONS DEPENDENCE ON CASE SIZES

TCATNOCMROF

EGAKCAPEZIS TUONIP

SNOITPO

L D E F M Q R S

A1

eliforPwoL11 X X

31 X

eliforPhgiH11 X X X X X

31 X X X

B1 eliforPhgiH 91 X X X X

A2 eliforPhgiH 12 X X X X X X X X

C1eliforPwoL

15X

eliforPhgiH X X X X X X X

270

RELAY DATA

DIP Series MEDER electronic

!"#$$


27tcatnoCB/AmroF

57tcatnoCB/AmroF

09tcatnoCCmroF










01 21

01 2101 01

01 2101 9

01 21 Ω


023*0051

**0001*0051

0020051 CDV




2.00.2

4.00.2

0.10.3 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






.yrotcaftlusnocesaelpstnemeriuqeregatlovrehgihroF**.liocottcatnocegatlovnwodkaerb)SMRVk0.3(CDVk52.4dna31tuonipstceleS*

271


COIL DATA

!"#$$

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

2757

5 5.7 054)081(

005)002(

055)022( 58.0 5.3 57.0 4.3 05

21 61 009 0001 0011 9.1 4.8 8.1 3.8 541

51 02 0081 0002 0022 3.2 5.01 2.2 4.01 511

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

**B1

5 5.7 054)081(

005)002(

055)022( 58.0 5.3 57.0 4.3 05

21 61 009 0001 0011 9.1 4.8 8.1 3.8 541

51 02 0081 0002 0022 3.2 5.01 2.2 4.01 511

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

A2

5 5.7 081)621(

002)041(

022)451( 58.0 5.3 57.0 4.3 521

21 61 054 005 055 9.1 4.8 8.1 3.8 092

51 02 0081 0002 0022 3.2 5.01 2.2 4.01 511

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

C1 09

5 5.7 081 002 022 58.0 5.3 57.0 4.3 521

21 61 054 005 055 9.1 4.8 8.1 3.8 092

51 02 0081 0002 0022 3.2 5.01 2.2 4.01 511

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

.dleihscitengamhtiwsnoisrev)(rep%4.0foetarehttaegnahclliwecnatsiserliocdnaegatlovtuo-pord/ni-llupehT* 0 .C

.evitisopsiowtniP.devresboebtsumBmroFnoytiraloplioC.dedeecxesiegatlovlioc.xamehtfiruccoyamBmroFehtfoerusolceR**

272

• Coil covered with a thermoplastic that meets UL94V-0

High voltage relay having up to 10 kVDC switchingand 15 kVDC breakdown voltage contact to coil.

DIMENSIONS

DESCRIPTION

CHARACTERISTICS


FEATURES

• Form A and B options• Switching up to 10 kVDC• 1000 Gigaohm between coil and contact• Breakdown voltage of 15 kVDC

H Series MEDER electronic,-./0%.

!"#$$

273

MEDER electronic H Series,-./0%.

!"#$$

%&'()*+

H24 - 1A83

24 is the nominal voltage1A is the contact form83 is the switch model

ORDER INFORMATION

DIMENSIONS



TCATNOCMROF

HCTIWSLEDOM

H -XX X1 XX

SNOITPO 42,21,50 B,A 38,77,96

274

RELAY DATA

H Series MEDER electronic,-./0%.

!"#$$


96hctiwSB/AmroF

77hctiwSB/AmroF

38hctiwSB/AmroF



egatloVgnihctiwS CAkaeproCD 01 5.3 5.7 Vk







01 01

01 2101 01

01 2101 9

01 21 Ω


5151

5151

0151 CDVk




8.08

8.08

8.08 Fp

seicnatcepxEefiL

Am01@stloV5gnihctiwS .pacyartsFp01<&ylnoCD AN 002 05 01 6


.151egapno

ataDlatnemnorivnE






275

MEDER electronic H Series,-./0%.

!"#$$

COIL DATA

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1967738

5 5.7 54 05 55 58.0 5.3 57.0 4.3 005

21 61 603 043 473 9.1 4.8 8.1 3.8 524

42 03 0531 0051 0561 7.3 8.61 6.3 7.61 583

**B1

5 5.7 95 56 27 58.0 5.3 57.0 4.3 583

21 61 842 572 303 9.1 4.8 8.1 3.8 525

42 03 585 056 517 7.3 8.61 6.3 7.61 588

rep%4.0foetarehttaegnahclliwecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0 .CsidaeldeR.devresboebtsumBmroFnoytiraloplioC.dedeecxesiegatlovlioc.xamehtfiruccoyamBmroFehtfoerusolceR**

.evitisop

276

,-./0%.

1 23

'%-.

HE Series MEDER electronic

!"#$$

• High voltage test sets• Cable testers• Medical equipment (RF surgery)

High voltage Reed Relays for PCB mounting suitablefor switching up to 7.5 kVDC and breakdownvoltage up to 10 kVDC. This series is available withhigh voltage cables. Standard relays available in 1Form A and 1 Form B switching configurations. 2Form A and 1 Form C with a switching voltage of upto 2500 VDC are available, please consult factory.

DESCRIPTION

DIMENSIONS

APPLICATIONS


FEATURES

• Power switching up to 100 W available• Special pin outs available• 1 Form A and 1 Form B are standard• Various case sizes and cable lengths available• 32 mm spacing between contact and coil available

High Voltage ReedRelays for PCBMounting


Part Number Example

HE12 - 1A83 - 02

12 is the nominal voltage1A is the contact form83 is the switch model02 is the pinout

ORDER INFORMATION

PIN OUT



TCATNOCMROF

HCTIWSLEDOM TUONIP

EH -XX XX -XX **xXX

SNOITPO 42,21,50*A1

38051,20

B1

elbaliavaA2*A1rofelbacilppaylnostuoniP**

DIMENSIONSAll dimensions in mm [inches]

278

,-./0%.

1 23

'%-.


!"#$$

RELAY DATA


38hctiwSB/AmroF



egatloVgnihctiwS CAkaeproCD 5.7 Vk






01 01

01 21 Ω


0101 CDVk


emiTteseR noisserppusliocon/wderusaeM 5.1 sm


8.00.5 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






279

COIL DATA

MEDER electronic HE Series,-./0%.

123

'%-.

!"#$$

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

38

5 5.7 54 05 55 58.0 5.3 57.0 4.3 005

21 61 522 052 572 9.1 4.8 8.1 3.8 575

42 03 009 0001 0011 7.3 8.61 6.3 7.61 575

**B1

5 5.7 09 001 011 58.0 5.3 57.0 4.3 052

21 61 063 004 044 9.1 4.8 8.1 3.8 063

42 03 0531 0051 0561 7.3 8.61 6.3 7.61 583

rep%4.0foetarehttaegnahclliwsecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0 .CtuOniPeeS.devresboebtsumBmroFnoytiraloplioC.dedeecxesiegatlovlioc.xamehtfiruccoyamBmroFehtfoerusolceR**

.nipevitisopehtrofgniwarD

280

%&'()*+

HF05 - 1A54 - 6

05 is the nominal voltage1A is the contact form6 is the breakdown voltage (6 kVDC)

High voltage RF Reed Relays use a patented coilencapsulation, external electrostatic shields, andmagnetic shields. For this series we use a specialcopper-plated Form A switch with a breakdownvoltage up to 10 kVDC. The contacts are suitablefor carrying current up to 3 Amps (5 Ampsavailable) at 30MHz.

DESCRIPTION

APPLICATIONS


DIMENSIONS

ORDER INFORMATION

• Radio frequency technology• Antenna tuning units• Transmit / receive requirements

FEATURES

• Normally open contacts (Normally closed contacts are available)• 5 Amps available

HF Series MEDER electronic,-./45'

,-./

!"#$$


TCATNOCMROF

HCTIWSLEDOM

NWODKAERBEGATLOV)CDVkni(

FH -XX X1 -45 X

SNOITPO 42,21,50 B,A 01,9,8,7,6,5

281

,-./45'

,-./

MEDER electronic HF Series

!"#$$

COIL DATA

PIN OUT

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

45

5 5.7 63 04 44 58.0 5.3 57.0 4.3 526

21 61 522 052 572 9.1 4.8 8.1 3.8 575

42 03 009 0001 0011 7.3 8.61 6.3 7.61 575

**B1

5 5.7 72 03 33 58.0 5.3 57.0 4.3 538

21 61 351 071 781 9.1 4.8 8.1 3.8 058

42 03 216 086 847 7.3 8.61 6.3 7.61 058

* rep%4.0foetarehttaegnahclliwecnatsiserliocdnasegatlovtuo-pord/ni-llupehT 0 .C.evitisopsievifniP.devresboebtsumBmroFnoytiraloplioC.dedeecxesiegatlovlioc.xamehtfiruccoyamBmroFehtfoerusolceR**

282

RELAY DATA

HF Series MEDER electronic,-./45'

,-./

!"#$$


45hctiwSB/AmroF



egatloVgnihctiwS zHM03otzHM1 005 V

tnerruCgnihctiwS zHM03otzHM1 5.1 A

tnerruCyrraC zHM03otzHM1 0.3 A





dleihsotlioC

01 01

01 01

01 01Ω


dleihsotlioC

*015.0

CDVk



ecnaticapaCstcatnocssorcAliocottcatnoC

dleihsotlioC

5.20102

Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






tlusnocesaelP.detcelesnoitpoegatlovnwodkaerbehtnotnadnepedelbissopsiCDVk01otpU*.yrotcaf

283

,-./ '%-

• Measurement equipment• Test systems• Control systems• Medical equipment

%&'()*+

HI12 - 1A66

12 is the nominal voltage66 is the switch model

A high insulation resistance of up to 1000 Gigaohmwith low dielectric constant is achieved by using ahigh insulation plastic for the coil form. The HI series’space requirements is only 34 x 7.5 x 7.9 mm.

MEDER electronic HI Series

DESCRIPTION

DIMENSIONS

APPLICATIONS


PIN OUT

ORDER INFORMATION

FEATURES

• Rated power up to 50 Watts• Switching up to 1000 VDC• Breakdown up to 1500 VDC

!"#$$


TCATNOCMROF

HCTIWSLEDOM

IH -XX A1 XX

SNOITPO 42,21,50 57,66,13

284

RELAY DATA

,-./ '%-

HI Series MEDER electronic

!"#$$


13hctiwSAmroF

66hctiwSAmroF

57hctiwSAmroF










01 01

01 2101 01

01 2101 01

01 21 Ω


00515.20.1

5225.20.1

*00015.20.1

CDVCDVkSMRVk




4.00.3

2.00.3

4.00.3 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






.yrotcaftlusnocesaelpstnemeriuqeregatlovrehgihroF*

285

MEDER electronic HI Series,-./ '%-

COIL DATA

!"#$$

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP

02taatadllA 0CCDV Ω CDV CDV Wm


A1

6657

5 5.7 044 006 066 58.0 5.3 57.0 4.3 04

21 61 0072 0003 0033 9.1 4.8 8.1 3.8 05

42 03 0045 0006 0066 7.3 8.61 6.3 7.61 59

13

5 5.7 441 061 671 58.0 5.3 57.0 4.3 551

21 61 099 0011 0121 9.1 4.8 8.1 3.8 031

42 03 0423 0063 0693 7.3 8.61 6.3 7.61 061

rep%4.0foetarehttaegnahclliwecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0C.

286

,-./0%.

1 23

'%-.

HM Series MEDER electronic

!"#$$

• High voltage test sets• Cable testers• Medical equipment (RF surgery)

High voltage Reed Relays for PCB mounting suitablefor switching up to 10 kVDC and breakdown voltageup to 15 kVDC. This series is available with highvoltage cables. Standard relays available in 1 FormA and 1 Form B switching configurations. 2 Form Aand 1 Form C with a switching voltage of up to2500 VDC are available, please consult factory.

DESCRIPTION

DIMENSIONS

APPLICATIONS


FEATURES

• Power switching up to 100 W available• Special pin outs available• 1 Form A and 1 Form B are standard• Various case sizes and cable lengths available• 32 mm spacing between contact and coil available

287

%&'()*+

HM12 - 1A83 - 02

12 is the nominal voltage1A is the contact form83 is the switch model02 is the pinout

ORDER INFORMATION

PIN OUT

MEDER electronic HM Series,-./0%.

123

'%-.

!"#$$


TCATNOCMROF

HCTIWSLEDOM TUONIP

MH -XX XX -XX **xXX

SNOITPO 42,21,50*A1 38,96 ,40,30,20

051,80,60

B1 38

elbaliavaA2*A1rofelbacilppaylnostuoniP**

288

,-./0%.

1 23

'%-.

HM Series MEDER electronic

!"#$$

RELAY DATA


96hctiwSAmroF

38hctiwSB/AmroF



egatloVgnihctiwS CAkaeproCD 01 5.7 Vk






01 01

01 2101 01

01 21 Ω


5151

0151 CDVk




8.00.5

8.00.5 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






289

COIL DATA

MEDER electronic HM Series,-./0%.

123

'%-.

!"#$$

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

38

5 5.7 54 05 55 58.0 5.3 57.0 4.3 005

21 61 522 052 572 9.1 4.8 8.1 3.8 575

42 03 009 0001 0011 7.3 8.61 6.3 7.61 575

**B1

5 5.7 09 001 011 58.0 5.3 57.0 4.3 052

21 61 063 004 044 9.1 4.8 8.1 3.8 063

42 03 0531 0051 0561 7.3 8.61 6.3 7.61 583

rep%4.0foetarehttaegnahclliwsecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0 .C.devresboebtsumBmroFnoytiraloplioC.dedeecxesiegatlovlioc.xamehtfiruccoyamBmroFehtfoerusolceR**

290

DESCRIPTION

DIMENSIONS

• High voltage test systems• Cable and in-circuit test equipment• Battery operated high voltage test equipment

%&'()*+

LI12 - 1A66

12 is the nominal voltage66 is the switch model

The LI series offers the maximum distance betweencoil and switch in the smallest possible housing.APPLICATIONS


PIN OUT

ORDER INFORMATION

• High coil resistance version available• Breakdown voltage greater than 4.3 kVDC

FEATURES

LI Series MEDER electronic,-./0%.

123'%-.

!"#$$


TCATNOCMROF

HCTIWSLEDOM

IL -XX A1 XX

SNOITPO 42,21,50 58,66

291

,-./0%.

123'%-.

MEDER electronic LI Series

!"#$$

RELAY DATA


66hctiwSAmroF

58hctiwSAmroF










01 01

01 2101 01

01 21 Ω


5223.40.3

00043.40.3

CDVCDVkSMRVk


emiTesaeleR noisserppusliocon/wderusaeM 1.0 1.0 sm


2.00.2

2.05.2 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






292

COIL DATA

LI Series MEDER electronic,-./0%.

123'%-.

!"#$$

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1 6658

5 5.7 081 002 022 58.0 5.3 57.0 4.3 521

21 61 216 086 847 9.1 4.8 8.1 3.8 012

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

rep%4.0foetarehttaegnahclliwecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0 .C

293

MEDER electronic LP Series

DESCRIPTION

DIMENSIONS

• Sealed with epoxy resin• Magnetic shield• High reliability• Very small housing

LP12 - 1A66 - 80V

12 is the nominal voltage1A is the contact form66 is the switch model80 is the pin outV is the option

The LP series of miniature Reed Relays offers theideal solution for high density, high frequencyswitching. With a coaxial shield the LP series iscapable of switching signals up to 1 GHz. Usingonly high reliability Reed Switches, one is insuredof long life when switching low level signals.


CHARACTERISTICS

ORDER INFORMATION

FEATURES

• Versions with 1 Form A or 1 Form C available• Electrostatic and coaxial shield options• High power switching up to 50 Watts

• RF communications• Video switching• ATE

APPLICATIONS

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

294

LP Series MEDER electronic

COIL DATA

PIN OUT

OPTIONS

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A113

5 5.7 09 001 011 58.0 5.3 57.0 4.3 052

21 61 054 005 055 9.1 4.8 8.1 3.8 092

665 5.7 072 003 033 58.0 5.3 57.0 4.3 58

21 61 009 0001 0011 9.1 4.8 8.1 3.8 541

C1 095 5.7 081 002 022 58.0 5.3 57.0 4.3 521

21 61 027 008 088 9.1 4.8 8.1 3.8 081


295

MEDER electronic LP Series

RELAY DATA

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0


13hctiwSAmroF

66hctiwSAmroF

09hctiwSCmroF










01 01

01 2101 01

01 2101 9

01 21 Ω


00510051

5220051

0020051 CDV




2.05.2

2.05.2

0.15.2 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






296

DESCRIPTION

MICRO SIL is a single-in-line Reed Relay using only15.2 x 3.81 mm of board space which is half thestandard SIL requirement.

• Contact Form 1A• Internal magnetic shield

• ATE systems• Measurement equipment• Telecommunications• Security systems

MS12 - 1A87 - 75L

12 is the nominal voltage87 is the switch modelL is the option

APPLICATIONS

CHARACTERISTICS

ORDER INFORMATION

L = No diode (with internal shield)D = With diode and internal magnetic shieldHR = High resistance version (5 Volt option only)

OPTIONS

DIMENSIONS PIN OUTAll dimensions in mm [inches]

FEATURES• New rugged molded design• Diode option available• High coil resistance option

MS Series MEDER electronic12314

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0


TCATNOCMROF

HCTIWSLEDOM TUONIP SNOITPO

HGIHECNATSISER

NOISREV

-SM XX A1 -XX 57 X *XX

SNOITPO 21,50 78,13 D,L *RH

ylnohctiws78ehthtiwelbaliavasinoisrevRH*

With external magnetic shield

297

MEDER electronic MS Series12314

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

RELAY DATA


13hctiwSAmroF

78hctiwSAmroF










01 01

01 2101 11

01 3101 21

01 41 Ω


00510002

5220051 CDV


emiTesaeleR noisserppusoN 7.0 1.0 sm


3.00.2

2.00.2 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






298

COIL DATA

MS Series MEDER electronic12314

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

135 5.7 09 001 011 58.0 5.3 57.0 4.3 052

21 61 513 053 583 9.1 4.8 8.1 3.8 014

**78

5 5.7 052 082 013 58.0 5.3 57.0 4.3 09

**RH5 5.7 054 005 055 58.0 5.3 57.0 4.3 05

21 61 036 007 077 9.1 4.8 8.1 3.8 502

rep%4.0foetarehttaegnahclliwecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0 .Cylnohctiws78noisrevecnatsiseRhgiH**

299

DESCRIPTION

The NP series offers a wide range of switch andpin out options in a package of only 10.2 x 22 mm.

• Magnetic shield• Small size• UL approved• Approval according to EN60950

MEDER electronic NP Series


CHARACTERISTICS

DIMENSIONS

APPLICATIONS• Alarm systems• Computer peripherals• Measuring equipment

• High resistance coil up to 3000 Ω at 4 VDC• Contact Forms 1A, 2A, 1C• Various standard switch options• Plastic case available

FEATURES

PIN OUT

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

300

NP Series MEDER electronic

COIL DATA

NP12 - 1A66 - 2500 - 213

12 is the nominal voltage1A is the contact form66 is the switch model2500 is the coil resistance213 is the pin out

ORDER INFORMATION

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A166

5 5.7 054 005 055 58.0 5.3 57.0 4.3 05

21 61 0522 0052 0572 9.1 4.8 8.1 3.8 06

42 03 0054 0005 0055 7.3 8.61 6.3 7.61 511

184 6 0072 0003 0033 7.0 8.2 6.0 7.2 01

21 61 0009 00001 00011 9.1 4.8 8.1 3.8 51

A2 66

5 5.7 054 005 055 58.0 5.3 57.0 4.3 05

21 61 0531 0051 0561 9.1 4.8 8.1 3.8 59

42 03 0072 0003 0033 7.3 8.61 6.3 7.61 091

C1 09

5 5.7 054 005 055 58.0 5.3 57.0 4.3 05

21 61 0522 0052 0572 9.1 4.8 8.1 3.8 06

42 03 0054 0005 0055 7.3 8.61 6.3 7.61 511


301

MEDER electronic NP Series

RELAY DATA

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0


66hctiwSAmroF

18hctiwSAmroF

09hctiwSCmroF










01 01

01 0101 9

01 0101 9

01 01 Ω


5220.25.1

0010.25.1

0020.25.1

CDVCDVkSMRVk




2.00.4

2.00.4

0.10.4 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE





erutarepmeTgniredloS llewdces5 062 062 062 0C

302

DESCRIPTION

The NP-CL Reed Relays are used for line sensing inmany modems, fax machines, PBX systems andother telecommunication systems. The 1 coil versionis approved according to EN60950 and offerssufficient distance in air and creepage paths.

• Line Sense Relay• Approved according to EN60950• Magnetic shield• UL approved under E 156887 (M)• Small size• Washable

NP-CL - 1A81 - 9 - 213

9 is the coil resistance213 is the pin out

CHARACTERISTICS


DIMENSIONS

ORDER INFORMATION

PIN OUT

NP-CL Series MEDER electronic4

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

APPLICATIONS

• Line systems in phones and faxes• Telecommunications

YALER

SEIRES

TCATNOC

MROF

HCTIWS

LEDOM

LIOC

ECNATSISERTUONIP

-LC-PN A1 -18 -X XXX

SNOITPO9 312

4/4 812

303

MEDER electronic NP-CL Series4

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

RELAY DATA


18hctiwSAmroF










01 9

01 9 Ω


0010001 CDV




4.05.2 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE






304

COIL DATA

NP-CL Series MEDER electronic4

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

TCATNOCMROF

HCTIWSLEDOM TUONIP LIOC

ECNATSISERNI-LLUPTNERRUC

TUO-PORDTNERRUC

1TAECNATCUDNI kHzLIOCENOta

( ta* )SLIOCHTOB

02taatadllA 0 **CΩ Am Am Hm

.niM .pyT .xaM .niM .xaM .niM .xaM .niM .pyT .xaM

A1 18312 1.8 9 9.9 1.5 51 5 41 27.2 4.3 80.4

***812 6.36.3 4/4 4.4

4.4 1.5 51 5 41 46.0*65.2

8.0*2.3

69.0*48.3

rep%4.0foetarehttaegnahclliwecnatsiserliocdnastnerructuo-pord/ni-llupehT** 0 .C.gnidiaseiresnisliocroferadetneserpseulaV***

305

CHARACTERISTICS

MEDER electronic SIL Series&1&4

Single-In-Line Reed Relays reduce the requiredspace to a minimum. The SIL series is available asboth voltage and current driven (line sense) ReedRelays. Requiring only half the PCB area of the DIPor DIL series, the SIL relays offer all the advantagesof Reed Technology. The SIL series is approvedaccording to EN60950 and offers sufficient distancein air and creepage paths.

• Approved according to EN60950• High resistance coils of up to 2000 Ω at 12 VDC• Line sense relay with pull-in current = 15 mA• Breakdown voltage coil / contact of up to 4.25 kVDC


DESCRIPTION

DIMENSIONSPIN OUT

FEATURES• NEW Breakdown voltage of 4200 VDC• Magnetic shield available• High resistance version• Other coil resistances available• Form B available

L = No optionM = With magnetic shieldD = With diode and

no magnetic shieldQ = With diode and

with magnetic shield

SIL12 - 1A72 - 71L

12 is the nominal voltage1A is the contact form72 is the switch modelL is the option

ORDER INFORMATION

OPTIONS

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

!"!!#$

!"%&'

306

SIL Series MEDER electronic&1&4

RELAY DATA

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0


13hctiwSAmroF

27hctiwSAmroF

57hctiwSAmroF










01 01

01 21 01 31 01 21

01 21 01 31 01 01

01 21 01 31 Ω


00510024

0230024

*00010024 CDV




4.00.2

2.00.2

4.00.2 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE





erutarepmeTgniredloS llewdces5 062 062 062 0C

.yrotcaftlusnocesaelpstnemeriuqeregatlovrehgihroF*

307

MEDER electronic SIL Series&1&4

RELAY DATA

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0


18hctiwSAmroF

48hctiwSAmroF










01 9

01 21 01 31 01 11

01 21 01 31 Ω


0010024

0070024 CDV




4.00.2

7.00.2 Fp

seicnatcepxEefiL



.151egapno

ataDlatnemnorivnE





erutarepmeTgniredloS llewdces5 062 062 0C

308

SIL Series MEDER electronic&1&4

SIL-CL LINE SENSE RELAY COIL DATA

COIL DATA

!"##$%&'()**++&%$,*(-./",((&,*(&0+,0

TCATNOCMROF

HCTIWSLEDOM

LIOCEGATLOV

LIOCECNATSISER

NI-LLUPEGATLOV

TUO-PORDEGATLOV

LANIMONLIOCREWOP



A1

13

5 5.7 27 08 88 67.0 5.3 57.0 4.3 013

21 61 092 023 053 9.1 4.8 8.1 3.8 054

42 03 0711 0031 0341 7.3 8.61 6.3 7.61 044

275748

5 5.7 054**)081(

005)002(

055)022( 67.0 5.3 57.0 4.3 05

)521(

21 61 009 0001 0011 9.1 4.8 8.1 3.8 541

51 5.7 0081 0002 0022 3.2 5.01 2.2 4.01 011

42 03 0081 0002 0022 7.3 8.61 6.3 7.61 092

18RH5 5.7 009 0001 0011 67.0 5.3 57. 4.3 52

RH21 61 0081 0002 0022 9.1 4.8 8.1 3.8 07

rep%4.0foetarehttaegnahclliwecnatsiserliocdnasegatlovtuo-pord/ni-llupehT* 0 .C ,57,13ledomhctiwsrofdilavera)(niataD**48dna

TCATNOCMROF

HCTIWSLEDOM

LIOCECNATSISER

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MEDER electronic SIL SeriesSingle-In-LineReed Relays

RELAY DATA


All data at 20 0C Switch Model -->Contact Form -->

Contact 81Form A

Contact 84Form A

Contact Ratings Conditions Min. Typ. Max. Min. Typ. Max. Units

Contact RatingsAny DC combination of V & A notto exceed their individual max.'s

5 10 W

Switching Voltage DC or peak AC 90 400 V

Switching Current DC or peak AC 0.5 0.5 A

Carry Current DC or peak AC 1.0 1.0 A

Static Contact Resistance w/ 0.5V & 50mA 200 150 mΩ

Dynamic Contact ResistanceMeasured w/ 0.5V & 50mA 1.5 msafter closure

200 200 mΩ

Insulation Resistance (100 Voltsapplied)

Across contactsContact to coil

109

1012 1013 1011

1012 1013 Ω

Breakdown VoltageAcross contactsContact to coil

1001500

7001500

VDC

Operate Time, incl. Bounce Measured w/ 100% overdrive 0.5 2.0 ms

Reset Time Measured w/ no coil suppression 0.1 0.1 ms

CapacitanceAcross contactsContact to coil

0.42.0

0.72.0

pF

Life Expectancies

Switching 5 Volts@ 10mA DC only & <10 pF stray cap. 100 200106

Cycles

For other load requirements please see our life test section locatedon page 125.

Environmental Data

Shock Resistance 1/2 sine wave duration 11ms 50 50 g

Vibration Resistance From 10 - 2000 Hz 20 20 g

Ambient Temperature 10 0C/ minute max. allowable -20 70 -20 70 0C

Storage Temperature 10 0C/ minute max. allowable -35 95 -35 95 0C

Soldering Temperature 5 sec dwell 260 260 0C

SIL Series MEDER electronicSingle-In-LineReed Relays

SIL-CL LINE SENSE RELAY COIL DATA

COIL DATA


CONTACTFORM

SWITCHMODEL

COILRESISTANCE

PULL-INCURRENT

DROP-OUTCURRENT

INDUCTANCEAT 1 kHz

All data at 20 0C *Ω mA mA mH

Min. Typ. Max. Min. Max. Min. Max. Min. Typ. Max.

1A 81 13.5 15 18 5.1 15 5 14.9 2.76 3.45 4.14

* The pull-in / drop-out currents and coil resistance will change at the rate of 0.4% per 0C.

CONTACTFORM

SWITCHMODEL

COILVOLTAGE

COILRESISTANCE

PULL-INVOLTAGE

DROP-OUTVOLTAGE

NOMINALCOIL

POWER

All data at 20 0C *VDC Ω VDC VDC mW

Nom. Max. Min. Typ. Max. Min. Max. Min. Max. Typ.

1A

31727584

5 7.5450

(180)**500

(200)550

(220)0.76 3.5 0.75 3.4

50(125)

12 16 900 1000 1100 1.9 8.4 1.8 8.3 145

15 7.5 1800 2000 2200 2.3 10.5 2.2 10.4 110

24 30 1800 2000 2200 3.7 16.8 3.6 16.7 290

815 HR 7.5 900 1000 1100 0.76 3.5 .75 3.4 25

12 HR 16 1800 2000 2200 1.9 8.4 1.8 8.3 70

* The pull-in / drop-out voltages and coil resistance will change at the rate of 0.4% per 0C.**Data in () are valid for switch model 31, 75,

and 84

309

MEDER electronic GLOSSARY

Glossary of Commonly Used Terms Relatingto Reed Switch Products

The following definitions refer to the generally used terms relating to Reed Switches, Reed Sensors, ReedRelays and Electromechanical Relays. Some of the definitions have multiple names. The most popularname was chosen for this listing and is listed under that name. However, we have tried to list those othercommon names under the most popular name.

Actuation Time is the time from initial energization to the first closing of open contact or opening of aclosed contact, not including any bounce.

Ampere Turns (AT or NI) is the product of the number of turns in an electromagnetic coil winding times thecurrent in amperes passing through the winding. AT usually defines the opening and closing points ofcontact operate conditions.

Armature is the moving magnetic member of an electromagnetic relay structure.

Bias Magnet is a steady magnetic field (permanent magnet) applied to the magnetic circuit of a relay orsensor to aid or impede operation of the contacts.

Bias, Magnetic is a steady magnetic field applied to the magnetic circuit of a switch.

Blade is used to define the cantilever portion of the reed switch contained within the glass envelope.

Bobbin is a spool, coil form or structure upon which a coil is wound.

Bobbinless Coil (self supporting coil) is a coil formed without the use of a bobbin.

Bounce, Contact is the intermittent opening of closed contacts occurring after initial contact actuation orclosure of the contacts due to mechanical rebound, or mechanical shock or vibration transmitted throughthe mounting.

Break defines the opening of closed contacts.

Breakdown Voltage is that voltage at which an arc or break over occurs between the contacts.

Breakdown Voltage, Pre-ionized is the voltage level at which the voltage breaks down across thecontacts, after which, the voltage had been recently broken down across the contacts, creating an ionizedstate in the glass capsule. Usually the breakdown voltage in the pre-ionized state is a lower value andmore repeatable. It is a truer measure of the breakdown voltage level.

310

GLOSSARY MEDER electronic

Bridging is the undesired closing of open contacts caused by a metallic bridge or protrusion developed byarcing causing the melting and resolidifying of the contact metal.

Changeover Contact (also referred to as a Form C or single pole double throw (SPDT)) has three contactmembers, one of them being common to the two contacts. When one of these contacts is open, the otheris closed and vice versa.

Coaxial Shield is an electrostatic shield grounded at both the input and output.

Coil is an electromagnetic assembly consisting of one or more windings of copper insulated wire usuallywound on a bobbin or spool. When current is applied to the coil, a magnetic field is generated, operatingthe contacts of a Reed Relay or Electromechanical Relay.

Common Mode Voltage usually refers to a voltage level as measured between one or more lines andground (common) or a current flowing between one or more lines and ground (ground).

Contact refers to the contact blades making up a Reed Switch or Electromechanical Relay.

Contact, Bifurcation is a forked, or branching of contacting member so formed or arranged, as to providesome degree of independent dual contacting.

Contact, Break-before-make (Form C) defines the sequence in which one contact opens its connectionto another contact and then closes its connection to a third contact.

Contact Force is the force which two contact points exert against each other in the closed position underspecified conditions.

Contact Form describes the type of contacts used for a given design or applications (ex. 1 Form A, 1Form B, etc.)

Contact, Form A is a single pole single throw (SPST) normally open (N.O.) switch.

Contact, Form B is a single pole single throw (SPST) normally closed (N.C.) switch.

Contact, Form C is a single pole double throw (SPDT) where a normally closed contact opens before anormally open contact closes.

Contact, Form D is a single pole double throw where the normally open contact closes before normallyclosed contact opens (continuity transfer).

Contact, Form E is a bistable contact that can exist in either the normally open or normally closed state.Reversing the magnetic field causes the contacts to change their state.

Contact, Current Rating is the current which the contacts are designed to handle for their rated life.

311


Contact, Gap is the gap between the contact points when the contacts are in the open state.

Contact, Make-before-break (Form D) defines the sequence in which one contact remains connected toa second contact while closing on a third contact and then the second contact opens its connection.

Contact, Rating refers to the electrical load-handling capability of relay contacts under specified conditionsfor a prescribed number of operations.

Contact, Reed defines a Reed Switch whereby a glass enclosed, magnetically operated contact usingthin, flexible, magnetic conducting leads or blades as the contacting members.

Contact Resistance is the electrical resistance of closed contacts; measured at their associated contactterminals after stable contact closure.

Contact Seal refers to a contact assembly sealed in a compartment separate from the rest of the relay.

Contact Separation is the distance between mating contacts when the contacts are open.

Contact, Snap Action describes the crisp closure and opening of contacts at or around the operate pointswhere the contact resistance remains constant and stable.

Contact, Stationary is a member of a contact combination that is not moved directly by the actuatingsystem.

Contact Tip is the point at the end of a contact where the contacts come together when closed.

Contact Transfer Time (in a Form C switch) is the time during which the moving contact first opens froma closed position and first makes with the opposite throw of the contact.

Contact Weld is a fusing of contacting surfaces to the extent that the contacts fail to separate whenintended.

Contact Wipe occurs when a contact is making the relative rubbing movement of contact points after theyhave just touched.

Contacts, Mercury Wetted are contacts that make closure via a thin film of mercury maintained on one orboth contact surfaces by capillary action.

Control Voltage is another name for the voltage applied across the coil of a relay and refers to that pointwhere the relay will operate.

Crosstalk is the electrical coupling between a closed contact circuit and other open or closed contacts onthe same relay or switch, expressed in decibels down from the signal level.

Current is the rate of flow of electrons in a circuit measured in amperes (unit A).

312


Current, AC is alternating current flow from positive to negative.

Current, DC is current flow in one direction.

Current, Carry is the amount of current that can safely be passed through closed switch contacts.

Current, Inrush is the surge of current a load may draw at initial turn on and may be many timesgreater than the steady current draw.

Current Leakage is that parameter measuring the unwanted leakage of current across open contactsand/or leakage current between the coil and contacts.

Current Rated Contact is the current which the contacts are designed to handle for their rated life.

Currentless Closure refers to contacts closing with no voltage existing or current flowing at the time ofclosure.

Cycling refers to the minimum number of hours during which a relay may be switched between the offstate and the on state at a fixed, specific cycle rate, load current, and case temperature without failure.

De-energize is the act of removing power from a relay coil.

Dielectric Strength or Breakdown Voltage is the maximum allowable voltage, usually measured in DCVolts or Peak AC, which may be applied between two specified test points such as input-output, input-case, output-case and between current-carrying and non-current-carrying metal members.

Dropout refers to maximum value of coil current or voltage at which a Reed Switch or Relay resumes itsnatural condition.

Dropout Value is the measured current, voltage or distance when the contacts open.

Duty Cycle is the percentage of time on versus time off or duty cycle = Ton

/Toff

.

Dynamic Contact Resistance is the repetitive measurement of contact resistance measured 1ms to 3ms after contact closure.

Electrostatic Shield is a copper alloy material terminated to one or more pins and located between twoor more mutually insulated elements within a relay which minimizes electrostatic coupling between thecoil and Reed Switch in a Reed Relay.

Energization is the application of power to a coil winding of a relay.

Frequency, Operating represents the rate or frequency at which contacts be switched on and off.

313


Frequency Response is the frequency at which the output signal decreases by 3 dB from the inputsignal.

Gap, Magnetic describes the nonmagnetic portion of a magnetic circuit.

Hermetic Seal is an encapsulation process where the contacts are sealed in a glass to metal seal inthe case of a Reed Switch. In the case of a relay, the contacts and coil are sealed.

Holding Current is the minimum current required to maintain closed contacts.

Holding voltage is the minimum voltage required to maintain closed contacts.

Hysteresis1. The lag between the value of magnetism in a magnetic material, and the changing magnetic forceproducing it; magnetism does not build up at the same rate as the force, and some magnetism remainswhen the force is reduced to zero. Also, the difference in response of a device or system to anincreasing and a decreasing signal.2. Hysteresis is also referred to the difference between the operate voltage and the release voltage andcan be expressed as a percentage of release/operate.

I/0 Capacitance is the capacitance between the input and output terminals or between the coil andcontacts.

I/0 Isolation Voltage refers to the voltage value before voltage breakdown occurs. It is the same asbreakdown voltage.

Impedance refers to the resistance in ohms composed of DC resistance, inductive reactance, andcapacitive reactance added vectorally in an RF circuit.

Insulation Resistance is the DC resistance in ohms measured from input to output or across thecontacts. Measurement is usually done by applying 100 Volts to one of the points to be measured andthe other is connected to a picoameter.

Latching Relay is a relay that maintains its contacts in the last assumed position without needing tomaintain coil energization. To change the state of the contacts, the magnetic field must be reversed.

Leakage Current is the current flow from input to output or across the contacts when the contacts arein the open state.

Load, Contact is the electrical power encountered by a contact set in any particular application.

Load Power Factor is the phase angle (cos) between load voltage and load current in an electricalcircuit caused by the reactive component of the load.

Load Voltage refers to the supply voltage range at the output used to normally operate the load.

314


Low thermal Relay is a Reed Relay designed specifically to switch very low microvolt or nanovoltssignals without distorting their signal level.

Magnetic Flux is the total magnetic induction, or lines of force, through a given cross section of amagnetic field.

Magnetic Interaction is the undesired effect when relays are mounted in close proximity, the flux producedwhen the coils are energized affects the pickup and dropout values of the adjoining relays. This eitherincreases or decreases both pickup and dropout values. The direction of the parameter shift is determinedby whether the stray flux aids or bucks the flux produced by the coil of the relay under consideration.Problems may result from bucking flux raising the pickup voltage close to the coil drive voltage or by aidingthe flux of sufficient magnitude that the relay will not drop out when its drive is removed. To calculate thechange in pull-in voltage and dropout voltage, multiply the percent change shown by the relay’s nominalvoltage. For example, if the percent change in pull-in voltage is 14% for a 5V nominal relay, the pull-involtage will increase by 0.7 volts (see relay application notes).

Magnetic Pole is the end of a magnet, where the lines of the flux coverage, and the magnetic force isstrongest (north or south pole).

Magnetic Shield is a thin piece of ferromagnetic metal surrounding a relay to enhance its magnetic fieldinternally while reducing the stray magnetic field external to the relay.

Magnetostrictive Force usually refers to the force produced on the contacts with current flowing and thecoil energized. Here the magnetic field of the coil and the magnetic field produced by the current flowingthrough the contacts interact with each other producing a torsional force.

Make refers to the closure of open contacts.

Mechanical Shock, Nonoperating is the mechanical shock level (amplitude, duration and wave shape)to which the relay or sensor may be subjected without permanent electrical or mechanical damage (usuallyduring storage or transportation).

Mechanical Shock, Operating is the mechanical shock level (amplitude, duration and wave shape) towhich the relay or sensor may be subjected without permanent electrical or mechanical damage during itsoperating mode.

Miss, Contact is the failure of a contact mating pair to close in a specified time or with a contact resistancein excess of a specified maximum value.

MOV (Metal Oxide Varistor) is a voltage-sensitive, nonlinear resistive element. MOV’s are clamp-typedevices that exhibit a decrease in resistance as the applied voltage increases. They are usually characterizedin terms of the voltage drop across the device while it is conducting one milliamp of current. This voltagelevel is the conduction threshold. The voltage drop across an MOV increases significantly with devicecurrent. This factor must be taken into consideration when determining the actual protection level of thedevice in response to a transient.

315


Normally Closed (N.C.) Contacts (Form B) represents a state of contacts before any magnetic field isapplied to them in which they exist in the closed state.

Normally Open (N.O.) Contacts (Form A) represents a state of contacts before any magnetic field isapplied to them in which they exist in the open state.

OHM’s Law the following is a table of common electrical conversions

Operate Time or (contact operate time or Pull-in time) is the total elapsed time from the instant power isapplied to the energizing coil until the contacts have operated and all contact bounce has ended.

Operating Temperature Range is the normal temperature range in which a Reed Switch, Sensor, orRelay will successfully operate.

Output is the portion of a relay which performs the switching function required.

Output Capacitance is capacitance across the contacts.

316


Output Offset Voltage or thermal offset usually measured in microvolts is voltage existing across closedcontacts in the absence of any signals. The voltage which appears at the output of the isolation amplifierwith the input grounded.

Overdrive is the amount of voltage or ampere turns applied after the exact point of closure of contacts isreached. Contact resistance is usually measure with 100 % overdrive.

Permeability is a characteristic of a magnetic material which describes the ease of which it can conductmagnetic flux.

Pickup Value refers to the measure of current or voltage applied to a relay when the contacts just close.

Pickup Pulse is a short, high-level pulse applied to a relay; usually employed to obtain faster operatetime.

Pole, Double is a term applied to a contact arrangement to denote two separate contact combinations,that is, two single-pole contact assemblies.

Pole, Single is a term applied to a contact arrangement to denote that all contacts in the arrangementconnect in one position or another to a common state.

Pressure, Contact refers to the force per unit area on the contacts.

Rating, Contact is the maximum rating of the allowable voltage and current that a particular contact israted to switch.

Reed Relay is a relay that uses a glass-enclosed hermetically sealed magnetic reed as the contactmembers.

Reed Switch or Reed Sensor is a switch or relay using glass-enclosed magnetic reeds as the contactmembers which includes mercury-wetted as well as dry contact types.

Relay, Antenna switching is a special RF relay used to switch antenna circuits.

Relay, Close Differential is a relay having its dropout value specified close to its pickup value.

Relay, Crystal Can defines a relay housed in a hermetically sealed enclosure that was originally used toenclose a frequency control type of quartz crystal.

Relay, Current Sensing is a relay that functions at a predetermined value of current typically used intelecommunications as a line sense relay.

Release Time or Dropout Time refers to the time from initial de-energization to the first opening of aclosed contact time.

317


Reluctance is the resistance of a magnetic path to the flow of magnetic lines of force through it.

Reset refers to the return of the contacts to their normal state (initial position).

Resonant Frequency is the tendency of the contacts to resonate at certain frequencies determined bytheir size and makeup.

Retentivity is the capacity for retaining magnetism after the magnetizing force is removed.

Saturation exists when an increase of magnetization applied to a magnetic material does not increasethe magnetic flux through that material.

Sensitivity refers to the pull-in of a Reed Switch usually expressed in ampere-turns.

Shield, Electrostatic is the grounded conducting member located between two or more mutually insulatedelements to minimize electrostatic coupling.

Slew Rate is the rate of change in output voltage with a large amplitude step function applied to the input.

Small Signal Bandwidth is the frequency range from DC to a frequency where the signal strength isdown 3 dB from its original signal strength.

Thermal Offset usually measured in microvolts is the voltage existing across closed contacts in theabsence of any signals.

Thermal Shock Nonoperating is the temperature shock induced into a group of Relays, Switches orSensors to determine their robustness.

Turn Off or Dropout Time refers to the time from initial de-energization to the first opening of a closedcontact time.

Turn On or (contact operate time or Pull-in time) is the total elapsed time from the instant power is appliedto the energizing coil until the contacts have operated and all contact bounce has ended.

Varistor see MOV.

Vibration, Nonoperating is the vibration level and frequency span to which the relay may be subjectedwithout permanent electrical or mechanical damage.

Voltage, Nominal is the typical voltage intended to be applied to the coil or input.

318


Voltage, Peak AC is the maximum positive or negative voltage swing of an alternating current signal orpower supply.

Voltage, Peak to Peak AC is the maximum positive threw negative voltage swing of an alternating currentsignal or power supply. V

p-p =2V

p when no DC offset is present.

Voltage, RMS is the Root Mean Square of the positive and negative voltage swing of an alternating currentsignal or power supply.

Winding refers to the electrically continuous length of insulated wire wound on a bobbin, spool or form.

Winding, Bifilar represents two windings with the wire of each winding alongside the other, matching turnfor turn.

Wipe, Contact refers to the sliding or tangential motion between two mating contact surfaces as theyopen or close.

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