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AEC-Q100 & 101
ID Type of change
ANY
SEM-AN-01 Any change with impact on agreed upon contractual agreements
SEM-AN-02
Headings DATA SHEET
SEM-DS-01
SEM-DS-02 Correction of data sheet / errata
SEM-DS-03 Specification of additional parameters
Headings DESIGN
SEM-DE-01
For integrated circuits or discrete semiconductors select below:
Assessment of impact on Supply Chain regarding following aspects - contractual agreements - technical interface of processability/manufacturability of customer - form, fit, function, quality performance, reliability
Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below.
Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification
Design changes in active elements. 1)
Mark changes
with an "x"
SEM-DE-02
SEM-DE-03
SEM-DE-04 Firmware modification
Headings PROCESS - WAFER PRODUCTION
SEM-PW-01 New / change of wafer substrate material
SEM-PW-02 New wafer diameter
SEM-PW-03 New final wafer thickness
SEM-PW-04 Change of electrically active doping / implantation element
SEM-PW-05 Change of gate material / dielectrics
SEM-PW-06
SEM-PW-07
SEM-PW-08 New / change of passivation or die coating (without bare die)
SEM-PW-09
Design changes in routing . 2)
Die shrink 3)
New / change of backside operation (grinding / metallization)
New / change of metallization / vias / contacts
Change in process technology (e.g. process changes like lithography, etch, oxide deposition, diffusion, die back surface preparation/backgrind, ...)
SEM-PW-10 Process integrity: tuning within specification
SEM-PW-11 Change of wafer supplier.
SEM-PW-12
SEM-PW-13
SEM-PW-14 Lithography
SEM-PW-15 Oxide / Interlayer Dielectric
Headings BARE DIE
SEM-BD-01 New final wafer thickness
SEM-BD-02 New / change of frontside metallization
SEM-BD-03 New / change of backside metallization
SEM-BD-04 Change of wafer setup or number of possible good dies on wafer.
SEM-BD-05
SEM-BD-06 Die scribe or separation
Change of specified wafer process sequence (deletion and/or additional process step)
Move of all or part of wafer fab to a different location/site/subcontractor
Change of optical appearance of wafer edge region (like polyimid coverage or edge exclusion)
SEM-BD-07 Die Preparation / Clean
SEM-BD-08 New / change of passivation or die coating
Headings PROCESS - ASSEMBLY
SEM-PA-01 Change in critical dimensions of package
SEM-PA-02 Change of leadframe base material
SEM-PA-03 Change in leadframe dimensions
SEM-PA-04 Change of lead frame finishing material / area (internal)
SEM-PA-05 Change of lead and heat slug plating material/plating thickness (external)
SEM-PA-06 Bump Material / Metal System (internal)
SEM-PA-07 Die attach
SEM-PA-08 Change of wire bonding
SEM-PA-09 Substrate / Interposer
SEM-PA-10 Die Overcoat / Underfill
SEM-PA-11
SEM-PA-12
SEM-PA-13 Change of product marking
SEM-PA-14
SEM-PA-15 Process integrity: tuning within specification
SEM-PA-16 Change of direct material supplier
SEM-PA-17
SEM-PA-18 Move of all or part of assembly to a different location/site/subcontractor.
SEM-PA-19 Die scribe or separation
Change of mold compound / encapsulation material
Change of hermetic sealing
Change in process technology(e.g. sawing, die attach, bonding, molding, plating, trim and form, lead frame preparation, …)
Change of specified assembly process sequence (deletion and/or additional process step)
SEM-PA-20 Die Preparation / Clean
SEM-PA-21 Molding / Encapsulation process
Headings PACKING/SHIPPING
SEM-PS-01 Packing/shipping specification change
SEM-PS-02 Dry pack requirements change
SEM-PS-03 Change of carrier (tray, reel)
SEM-PS-04 Change of labelling
Headings EQUIPMENT
SEM-EQ-01
SEM-EQ-02
SEM-EQ-03 Change in final test equipment type that uses a different technology
TEST FLOW
SEM-TF-01
Headings Q-GATE
SEM-QG-01
Tests, which should be considered for the appropriate process change.
Tests, which should be considered for the appropriate process change after selection of condition table.
Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.
Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor
Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)
Suppliers performed tests (mark with an 'X' for done or 'G' for generic)
Reason for exception of tests:
Worked on:
PCN number
No Yes
P P Not relevant for technical evaluation.
P P
P P
I P
I P
P P
Remainingrisks onSupplyChain?
Understanding of semiconductors experts
Any change which is not covered in the matrix below, but risk assessment at customer is recommended.
Update of data sheet because of technical change of the product.No technical change of the product, only correction in description (wording, drawing, …).(I): In case of editorial changes. (P): In case of impact on product integrity.
Description of a new not previously covered parameter. No technical change of the product.(I): Definition of new parameter which was not documented before.(P): Not known as single change. Only in combination with other changes.
Any device relevant changes in design / layout of elements with effect on data sheet1) Not included: Modification to adjust product parameter within specified process window and design rules.
Comparison
Rev. 3 vs. 2
P P
P P
I P
P P New wafer material.
P P
P P Change in final wafer thickness.
P P
P P
P P
P P
P P
-- P
Any change of wiring between elements in chip design / layout with effect on data sheet.2) Not included: Modification to adjust product parameter within specified design rules.
Shrink of active area.3) Not included: sawing street/kerf/scribe line
Integrated software by design or memory as defined by supplier.(I): Firmware modification or update without effect of functional performance at the customer (bug fix).(P): Firmware modification or update with effect of functional performance at the customer.
Change of wafer diameter resulting in equipment and process changes.
Change in electrically active doping / implantation element resulting in a new technology.
Change of gate material and / or gate dielectric material.Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions necessary.Alternative see SEM-PW-09
Change in metallization of bondpads, material, layer thickness specifically for chip frontside and internal layers.
Change of top layer on die (between mold compound and die).
(--): If the change in process technology does not influence the integrity of the final product.(P): If the change in process technology can influence the integrity of the final product.
-- P
-- P
-- P
P P
-- P
-- P
P P Change in final wafer thickness.
P P
P P
I P
I P
I P
Variation within process specification(--): If tuning within process specification does not influence the integrity of the final product.(P): If remaining risk on product specification is anticipated.
(--): If no remaining risk in supply chain exist(P): If the change of wafer supplier can influence the integrity of the final product.
Any change which is not covered by another type of change. Risk is to be assessed.(--): No Risk for Supply chain.(P): Risk for Supply chain (influence on product integrity)
Wafer fab transition with additional changes (described above).
Change in process technique for lithographic process and material(--): If the change in process technology does not influence the integrity of the final product.(P): If the change in process technology can influence the integrity of the final product.
Change in process technique for oxide / interlayer dielectric process(--): If the change in process technology does not influence the integrity of the final product.(P): If the change in process technology can influence the integrity of the final product.
Change in bondpads, material, pad pitch, surface changes, layer thicknessChange of bottom layer of die. Change in process, material, or dimensions.
Needed information for pick & place machine.(I): amount of possible good dies on wafer(P): influence on wafer setup and wafer mapping
Selection of dies in wafer edge region which have full electrical functionality. (I): in case of wafer edge is affected only(P): in case of single die is affected
Needed information for sawing and pick & place machine.(I): If the change in sawing process does not influence the integrity of the final product.(P): in case if product is delivered on wafer
-- P
P P Change of top layer on die.
P P Change in dimensions of existing package.
P P New leadframe material in new composition.
P P
P P
P P
P P Stack die or die to substrate (flip chip)
P P
P P
P P Change of BGA substrate
-- P
Change in process technique for die preparation / cleaning(--): If the change in process does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
Change in leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)Not included: Variation within specification.
Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)
Change in material and / or process resulting in a new technology (e.g. pure tin).
Change of die attach material and / or process resulting in a new technology (e.g. soft solder, epoxy, etc.)
Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.
Supporting layers for complex packages like flip chip and / or change in process resulting in a new technology.(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
P P
P P
I P
-- P
-- P
-- P
-- P
P P Assembly transfer or relocation
-- P
Change of mold compound / encapsulation material.
Affected areas are material and process of hermetic (e.g. ceramic ) packages, capped die and sealed devices (e.g. pressure sensors)
Change of marking on device and / or change in process resulting in a new technology..(I): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
(--): If the change in process technology does not influence the integrity of the final product.(P): If the change in process technology can influence the integrity of the final product.
Variation within process specification(--): If tuning within process specification does not influence the integrity of the final product.(P): If impact on product specification is anticipated.
Change of suppliers for direct materials which are used in assembly process (BOM).(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
(--): no influence in final product integrity or specified sequence(P): influence in final product integrity or specified sequence
Separation process from single wafer to dies. (--): If the change in process does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
-- P
-- P
P P Packing/shipping specification change.
P P
P P Change of carrier (tray, reel)
I P
P P
-- P
P P
P P
-- P
Tests, which should be considered for the appropriate process change after selection of condition table.
Change in process technique for die preparation / cleaning(--): If the change in process does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
Change in process technique for molding / encapsulation.(--): If the change in process does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
Change of dry pack requirements (e.g. change of MSL)
Change of labelling also on reel.(I): Change of material label without impact on barcode.(P): Changes of material label information which affects data processing at customer.
Change in process technique which is not already covered above.
PCN required for dedicated equipment for sensitive component production.(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
Change of tester platform (Only in case of bare die: final test means wafer test.)
Tester transfer or relocation. Check impact on SEM-AN-01
e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.(--): If change does not influence the integrity of the final product.(P): If impact on product integrity is anticipated.
-- Not required.I Information Note required.P PCN required.
on:
Examples to explain
*
B
A
A
A
A
Eval
uatio
n le
vel
A /
B /
C
A: A
pplic
atio
n le
vel
B: B
oard
leve
l C
: Com
pone
nt le
vel
* :
Not
rele
vant
for
qual
ifica
tion
mat
rix
e.g. recommendations for pull-up/pull-down or NC pins, MSL
(I): e.g. correction of typo(P): e.g. data sheet correction because of new information about component behavior.
(I): e.g. adding new tested parameter.
e.g. change of ESD structuree.g. add / remove a transistor in layout
Comparison
Rev. 3 vs. 2
C
Typical shrink of die. A
A
C
C
e.g. change in final chip/die thickness C
A
A
e.g. change from Cr/NiV/Au to Cr/NiV/Ag C
C
e.g. addition of polyimide C
A
e.g. mask changes in metal fix for corrective action (based on external 8D report)
(I): e.g. addition of Firmware opportunities(P): e.g. bug fix with impact on functional performance
e.g. different wafer material to currently released material (like change from EPI material into non-EPI material)
e.g. change from AlSiCu to AlCue.g. change in over pad metallization
(--): e.g. change from wet to dry etching, e. g. change from horizontal to vertical oven for oxidation(P): e.g. change of layer thickness
C
C
C
e.g. dual source / fab strategy A
C
A
Change in final chip/die thickness A
B
e.g. change from Cr/NiV/Au to Cr/NiV/Ag A
B
B
B
(--): e.g. process control
(--): e.g. change of wafer supplier with same material composition.e.g. same material composition and does not influence electrical behavior.(P): e.g. new supplier with impact on substrate material and / or electrical behavior.
(--): e.g. change of cleaning process in wafer production(P): e.g. additional sinker implantation after standard implantation (to protect circuit against interference impulses).
(--): e.g. exchange of defect mask(P): e.g. change from E-beam process to X-ray processe.g. change from contact into projection mode
e.g. change from AlSiCu to AlCue.g. change in over pad metalization
(I): e.g. change from 350 to 240 good dies on wafer(P): e.g. information change for pick & place machine.
(I): e.g. appearance of wafer edge (rounded instead of square)(P): e.g. polyimide as new coating on die
(I): e.g. if product is delivered as known good die (in tape and reel)(P): e.g. information change for pick & place machine.e.g. information change for sawing machine.
B
B
B
B
e.g. change in lead frame geometry B
C
B
C
C
C
e.g. changes in routing B
C
(--): e.g. change of cleaning time.(P): e.g. change in cleaning procedure after change of sawing equipment.
e.g. addition of polyimidee.g. change of polyimide thickness
e.g. changes in package dimensions (further development).e.g. change from alloy42 to coppere.g. change between two different copper alloys
e.g. change from Ag flash to NiP protection layere.g. change from Ag spot to Au spote.g. increase of silver plating areae.g. change in heat slug stacke.g. change from Sn into Ni/Pd/Aue.g. change of layer thickness e.g. change to Pb-free materiale.g. change of copper pillars
e.g. change from Au to Cu materiale.g. change from 25µm to 23µm diametere.g. change from single to double bonde.g. change from stich bond to stich on ball bond.
(--): e.g. change of dispensing speed(P): e.g. change of underfill material
B
e.g. change of sealing material for RoHS B
B
B
C
C
C
C
C
e.g. change to green mold compounde.g. change of filler particles
(I): e.g. change of appearance (additional marking)(P): e.g. change from inked marking to laser markinge.g. marking of pin 1
(P): e.g. change from ball bond to stitch
(--): e.g. process control
(--): e.g. change of wire material supplier.(P): e.g. change to new mold compound suppliere.g. additional leadframe supplier with specific leadframe manufacturing technology
(--): e.g. additional cleaning step e.g. deletion of optical inspection(P): e.g. change lead finishing pre trim & form to post trim & form
e.g. dual source / fab strategy
(--): e.g. change of kerf width(P): e.g. change from sawing to laser cut
C
C
*
*
B
B
A
C
e.g. change tester equipment from LTX to Teradyne C
Dual source strategy C
C
(--): e.g. change of cleaning time.
(--): e.g. tuning within process specification
(I) e.g. additional information (RoHS stamp)(P) e.g. change of defined nomenclature for data processing
Change from single wafer to batch process (e.g. over pad metallization)e.g. dambar cutting (mechanical to laser cutting)
(--): e.g. extension of existing equipment pool for(P): e.g. extension of dedicated equipment in case basic technology still need to be proven
(--): e.g. test implemented without customer requirement(P): e.g. reduction from three temperature measurements to two temperature measurementse.g. change in burn in / run in process.
2016-12-19
Device evaluation
Further applicable conditions
AEC
- Q
100
Aut
ocla
ve o
r Unb
iase
d H
AS
T
Tem
pera
ture
Cyc
ling
Pow
er T
empe
ratu
re C
yclin
g
THB
AC
TC PTC
A2 A3 A4 A5
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
- ● - - ● ● M
Line
eva
luat
ion
(can
be
eval
uate
d by
dat
a or
aud
it/on
site
che
ck)
MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q100 Rev. H)includes integrated circuits (e.g. ASICs, µ-Controler, memories, voltage regulators, smart power devices, logic devices, analog devices,... )
Che
ck o
f spe
cific
atio
n (fo
r raw
mat
eria
l onl
y)
Tem
pera
ture
Hum
idity
Bia
s or
bi
ased
HA
ST
Please check if data sheet is affected (SEM-DS-01).
- ● - - - A M
- ● - ● ● - M
- - - - - - -
In case of Cu wire product please consider AEC-Q006. - - ● - - - -
● ● - - - E M
- ● - - - E M
- ● - - - - M
- ● - - - ● M
- ● - - - ● M
In case of Cu wire product please consider AEC-Q006. - ● - ● ● ● M
- ● - ● ● ● M
● ● - - - - -
A: Impact on EMC behavior cannot be evaluated / excluded on component level.A: If impact on electrical function is not excluded on component level.Please check if data sheet is affected (SEM-DS-01).
Please check if change in process technology (SEM-PW-09) is also affected.In case of Cu wire product please consider AEC-Q006.
Impact on changes in SEM-PW-09 and/or SEM-EQ-01.
A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)A: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.In case of Cu wire product please consider AEC-Q006.
A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)A: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.
Change of intrinsic mechanical stress might influence electrical function.In case of Cu wire product please consider AEC-Q006.
Please also check changes described under EQUIPMENT.Please check if change is described by specific type of change in this matrix.
- - - - - - -
- - ● - - - -
- - - - - - -
In case of Cu wire product please consider AEC-Q006. ● ● - ● ● ● M
- ● - ● - ● M
- ● - - - ● M
In case of Cu wire product please consider AEC-Q006. - ● - - - E M
In case of Cu wire product please consider AEC-Q006. - ● - ● ● ● M
- ● - - - ● M
- - - - - - -
- - - - - - -
- ● - ● ● ● M
Please check if DATA SHEET is affected. Please check if SEM-PW-09 is affected.
Not on component, tested on test structure (typical for IC).Interaction on component level for discrete components expected.In case of SOI substrate HF properties have to be qualified. Please check if SEM-PW-01 and SEM-DS-01 is affected.
Please also check changes described under EQUIPMENT.
Please also check changes described under EQUIPMENT.
Please check if SEM-BD-04 is affected.
- ● - ● ● - M
In case of Cu wire product please consider AEC-Q006. - ● - - - - -
- ● - ● ● ● M
In case of Cu wire product please consider AEC-Q006. - ● ● - ● ● M
- ● - - ● ● M
In case of Cu wire product please consider AEC-Q006. - ● ● ● ● ● M
- ● ● ● ● ● M
- ● ● ● ● ● M
- ● ● ● ● ● M
● ● ● ● ● ● Q
- ● ● ● ● ● M
- ● ● ● ● ● M
Please check if SEM-BD-06 is affected.
ESD investigations are only necessary if internal ground and power supply connection of leadframe is affected.A: If impact on EMC behavior cannot be evaluated / excluded on component level.In case of Cu wire product please consider AEC-Q006.
A: If impact on EMC behavior cannot be evaluated / excluded on component level (if die attach has impact on electrical conductivity).
In case of Cu wire product please consider AEC-Q006.
A: In case of bond diagram change and EMC cannot be evaluated on component level.
Please also check changes described under SEM-EQ-01.
In case of Cu wire bonding please consider AEC-Q006.
A: Impact on EMC behavior cannot be evaluated / excluded on component level.A: If impact on electrical function is not excluded on component level.
In case of Cu wire product please consider AEC-Q006.
- ● ● ● ● ● M
- ● ● - ● ● -
- ● - - - - -
- ● - - - - -
- - - - - - -
Please check if material is changed! - - ● - - - -
- - - - - - -
● ● - ● ● ● M
- ● - ● ● ● M
A: impact on thermo-mechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is evident anticipated (specific for Power Devices). A: in case of high frequency signals (> 3GHz) it should be assessed if possible changes in permeability of mold compound could affect signal behavior (e.g. digital signal processor).
In case of Cu wire product please consider AEC-Q006.
A: impact on EMC behavior cannot be evaluated / excluded on component level (if encapsulation / sealing has impact on electrical conductivity).
Please also check changes described under SEM-EQ-01.Please check if change is described by specific type of change in this matrix.
A or B: impact on other type of changes described under PROCESS ASSEMBLY and SEM-EQ-01.
In case of Cu wire product please consider AEC-Q006.
- ● - ● ● - M
- ● - ● ● ● M
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
● - - - - - -
- - - - - - -
- - - - - - -
● - - - - - -
● - - - - - -
Device evaluation
Hig
h Te
mpe
ratu
re S
tora
ge L
ife
Hig
h Te
mpe
ratu
re O
pera
ting
Life
Ear
ly L
ife F
ailu
re R
ate
Wire
Bon
d S
hear
Wire
Bon
d P
ull
Sol
dera
bilit
y
Phy
sica
l Dim
ensi
ons
Sol
der B
all S
hear
Lead
Inte
grity
Ele
ctro
mig
ratio
n
Hot
Car
rier I
njec
tion
Stre
ss M
igra
tion
HTS
L
HTO
L
ELFR
EDR
WB
S
WB
P
SD PD SBS
LI EM TDD
B
HC
I
NB
TI
SM
A6 B1 B2 B3 C1 C2 C3 C4 C5 C6 D1 D2 D3 D4 D5
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- ● ● D,J - - - - - - D D D D D
MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q100 Rev. H)includes integrated circuits (e.g. ASICs, µ-Controler, memories, voltage regulators, smart power devices, logic devices, analog devices,... )
NV
M E
ndur
ance
, Dat
a R
eten
tion,
an
d O
pera
tiona
l Life
Tim
e D
epen
ding
Die
lect
ric
Bre
akdo
wn
Neg
ativ
e B
ias
Tem
pera
ture
In
stab
ility
Comparison
Rev. 3 vs. 2
- - - - - - - - - - - - - - -
- ● ● DJ - - - - - - ● ● ● ● ●
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- ● ● - E E - - - - - - - ● -
- ● ● - E E - - - - - - - ● -
- ● G - - - - - - - - - - ● -
- ● - D,J - - - - - - - - - ● -
- ● - - - - - - - - - - - - -
- ● - - ● ● - - - - ● - - - ●
- ● G,N D,J ● ● - - - - - ● ● ● ●
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- ● ● J ● ● - - - - ● ● ● ● ●
- ● G - ● ● - - - - - - - ● -
- ● G D,J - ● - - - - - ● ● ● ●
- ● ● - E E - - - - - - - ● -
- ● - - - - - ● - - - - - - -
- ● - - - - ● ● - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- ● - - ● ● - - - - - - - - -
- - - - - - - - - - - - - - -
● ● ● - ● ● ● ● T ● - - - - -
● - - - - ● ● ● - ● - - - - -
- - - - - - ● ● - ● ● - - - -
● - - - - C ● - - ● - - - - -
● - - - - C ● - - ● - - - - -
● ● - - - - - ● ● - - - - - -
- ● - - - - - - - - ● - - - -
● - - - ● ● - - - - ● - - - -
● ● - - ● ● - - T - ● - - - -
● ● - - - - - - - - - - - - -
● ● ● - - - ● ● - ● - - - - -
● - - - - - - ● - ● ● - - - -
- - - - - - B - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- ● ● - ● ● ● ● T ● - - - - -
- - - - - - - - - - - - - - -
- ● - - ● ● - - - - - - - - -
● ● - - - - ● ● - ● - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - - - - - - - - - - - - - -
- - * - - - - - - - - - - - -
CONDITIONS YES NOA Only for peripheral routingB For symbol rework, new cure time, tempC If bond to leadfingerD Design rule changeE Thickness onlyF MEMS element onlyG Only from non-100% burned-in partsGe Generic Data availableH Hermetic onlyJ EPROM or EEPROMK Passivation onlyL For Pb-free devices onlyM For devices requiring PTCN Passivation and gate oxideQ Wire diameter decreaseT Only for Solder Ball SMD* For "burn in" changes IOL or ELFR recommended
=> Please mark 'YES' or 'NO' with a small 'x'
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change (acc. AEC-Q100).
Device evaluationLa
tch
up
Ele
ctric
al D
istri
butio
n
Cha
ract
eris
atio
n
Ele
ctro
mag
netic
Com
patib
ility
Sho
rt C
ircui
t Cha
ract
eriz
atio
n
Sof
t Err
or R
ate
Lead
free
Mec
hani
cal S
erie
s
Pac
kage
Dro
p
Lid
Torq
ue
Die
She
ar
Inte
rnal
Wat
er V
apor
HB
M
CD
M
LU ED CH
AR
EMC
SC SER
LF MEC
H
DR
OP
LT DS
IWV
E2 E3 E4 E5 E7 E9 E10 E11 E12 G1 -G 4 G5 G6 G7 G8
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
● ● ● ● ● ● ● ● - - F - - -
MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q100 Rev. H)includes integrated circuits (e.g. ASICs, µ-Controler, memories, voltage regulators, smart power devices, logic devices, analog devices,... )
Hum
an B
ody
Mod
el
Cha
rged
Dev
ice
Mod
el E
SDCompariso
n
Rev. 3 vs. 2
● ● ● ● ● ● ● - - - - - - -
● ● ● ● ● ● ● ● - - - - - -
- - - - - - - - - - - - - -
- - - ● ● - - - - - - - - -
E E E ● - - - - - - - - - -
E E E ● - - - - - - - - - -
● ● ● ● ● - - - - - - - - -
● ● ● ● ● - - - - - - - - -
M M ● - ● - - - - H - - H -
- - - ● ● - ● - - - - - - -
● ● ● ● ● - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - ● - - - - - - - - - -
- - - - - - - - - - - - - -
● ● ● ● - - - - - H - - H -
- - - ● - - - - - - - - - -
● ● ● ● ● - - - - - - - - -
E E E ● - - - - - - - - - -
- - - ● ● - ● - - - - - - -
- - - ● ● - ● - - - - - ● -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - H -
- - - - - - - - - - - - - -
● ● - ● - - ● - L H - - H H
- - - - - - ● - L H - - H -
- - - - - - ● - L H - - - -
- - - - - - - - L H - - H -
- - - - - - - - L H - - H -
- - - - - - - ● L - - - - -
- - - ● - - ● - L H - - H H
- - - M - - ● - - H - - - -
- - - - - ● - - L H - - H H
- - - - - - - ● - - - - - H
- - - - - - - ● L - - - - -
- - - - - - - - - ● - ● - ●
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - ● - - - - L H - - H H
- - - - - - - - - - - - - -
- - - - - - - - - - - - H -
- - - - - - - - L - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - - - - - - - - - - - -
- - - ● - - - - - - - - - -
- - - - - - - - - - - - - -
- - - ● - - - - - - - - - -
- - - ● - - - - - - - - - -
- - - ● - - - - - - - - - -
Device evaluation
AEC
- Q
101
Ext
erna
l Vis
ual
Par
amet
ric V
erifi
catio
n
Hig
h Te
mp.
Gat
e B
ias
Tem
pera
ture
Cyc
le
EV PV HTG
B
TC
3 4 5abc 6 7 7ab 8/alt
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - ● ● ● 3 - -
MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Rev. D1)includes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …
[Note: Affected devices are with the die molded in a plastic mold compound with metal leads for board attachment.]
Che
ck o
f spe
cific
atio
n (fo
r raw
mat
eria
l onl
y)
Hig
h Te
mpe
ratu
re R
ever
se B
ias
AC
blo
ckin
g vo
ltage
Hig
h Te
mpe
ratu
re F
orw
ard
Bia
sS
tead
y S
tate
Ope
ratio
nal
Tem
pera
ture
Cyc
ling
Hot
Tes
tTC
Del
amin
atio
n Te
stW
ire B
ond
Inte
grity
Unb
iase
d H
ighl
y A
ccel
erat
ed
Stre
ss T
est
Aut
ocla
ve
HTR
BA
CB
VH
TFB
SSO
P
TC H
otTC
D
elam
WB
I
UH
AST
A
C
● - - ● ● ● 3 - -
● - - ● ● - ● - -
- - - - - - - - -
- ● - ● ● - - - -
● - - ● ● ● - - -
● - - ● ● - ● ● -
● - - ● 5,6,0 ● - - 6
● - - ● ● ● ● - -
● - - ● - - ● - Z
● - - ● 8 - ● ● ●
● - - ● ● ● ● - ●
● - - - - - - - -
- - - - - - - - -
● ● - ● ● - - - -
- - - - - - - - -
● - - ● ● ● ● ● ●
● - - ● 4 4 - - -
● - - ● - ● - - 6
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
- - - - - - -
● - ● ● ● ● ● ● ●
● ● ● - - - ● ● ●
● - - - - - ● - -
● ● D - - - C - C
- ● ● - - - - - -
- ● - - - - - - -
● ● - ● - - ● - ●
● ● - ● - - ● ● -
- ● - - - - - - -
- - - - ● ● ● - ●
● ● ● ● ● ● ● ● ●
● ● H - - - H - H
● - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- ● - - - - - - -
- - - ● - - - - -
● - ● ● ● ● ● ● ●
● - - ● - - ● - -
● - - ● - - ● - ●
● - ● - ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - ● - - - - -
- - - ● - - - - -
● - - ● - - - - -
● - - ● - - - - -
Device evaluationE
SD
Cha
ract
eriz
atio
n
Des
truct
. Phy
. Ana
lysi
s
Phy
sica
l Dim
ensi
ons
Term
inal
Stre
ngth
Res
ista
nce
to S
olve
nts
Con
stan
t Acc
eler
atio
n
Vib
ratio
n V
aria
ble
Freq
uenc
y
ESD
DPA
PD TS RTS
CA
VVF
9/alt/a 10/alt 11 12 13 14 15 16 17
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- ● E 3 - - - - -
MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Rev. D1)includes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …
[Note: Affected devices are with the die molded in a plastic mold compound with metal leads for board attachment.]
Hig
hly
Acc
eler
ated
Stre
ss T
est
Hig
h H
umid
ity H
igh
Tem
p.
Rev
erse
Bia
sH
igh
Tem
pera
ture
Hig
h H
umid
ity
Bia
s
Inte
rmitt
ent O
pera
tiona
l Life
Pow
er a
nd T
empe
ratu
re C
ycle
HA
STH
3 TR
BH
THH
B
IOL
PTC
Comparison
Rev. 3 vs. 2
- ● E 3 - - - - -
- ● E ● - - - - -
- - - - - - - - -
● ● - - - - - - -
- - - - - - - - -
- ● - ● - - - - -
6 - ● 6 - - - - -
- - E ● - - - - -
● ● - - - - - - -
● ● E ● - - - - -
● ● ● ● - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - - - - - - -
- - - - - - - - -
● ● E ● - - - - -
6, 7 - - - - - - - -
6 ● E 6 - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● ● ● ● ● B H H
● ● - - ● ● - - -
● ● - - ● - - - -
C - - - D - D - -
- - - - ● - ● - -
- - - - - - - - -
● ● - - - - - - -
● ● - ● - - - - -
- - - - - - - - -
● ● - ● - - - - -
● ● - ● ● - B - -
H - - H - H - H H
- - - - - - B - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - ● ● ● ● - -
- ● - - - - - - -
● - - - - - - - -
● ● - ● ● B - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- * - - - - - - -
CONDITIONSA Acoustic MicroscopyB If not laser etchedC Only for Leadframe Plating changeD Only for Lead Finish changeE If ApplicableF Finite Element AnalysisG Glass Transition TemperatureGe Generic Data availableH Hermetic device onlyI Infant Mortality RateM Power MOS/IGBT devices onlyP CV Plot (MOS only)R Spreading Resistance ProfileS Steady State Mortality RateX X-RayZ For backside operation changes1 If bond pads are affected2 Verify #2 (package) post3 Only for changes at the periphery4 Only for oxide etches or etches prior to oxidation5 For source or channel region changes6 For field termination changes7 For passivation changes8 For contact changes9 For epitaxial changes0 Required for Schottky barrier changes.* For "burn in" changes IOL or ELFR recommended
'=> Please mark 'YES' or 'NO' with a small 'x'
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change (acc. AEC-Q101).
Device evaluation
Mec
hani
cal S
hock
Her
met
icity
Res
ist.
to S
olde
r Hea
t
Ther
mal
Res
ista
nce
Wire
Bon
d S
treng
th
Wire
Bon
d S
hear
Die
She
ar
Unc
lam
p.In
duct
.Sw
itch
MS
HER
RSH
SD TR WB
S
BS
DS
UIS
18 19 20 21 22 23 24 25 26
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - M
MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Rev. D1)includes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …
[Note: Affected devices are with the die molded in a plastic mold compound with metal leads for board attachment.]S
olde
rabi
lity
/ AE
C-Q
005
- - - - - - - - M
- - ● - ● - - ● M
- - - - - - - - -
- - - - ● - - - 9, M
- - - - - - - - -
- - X - ● ● ● - -
- - - - - - - - M
- - - - - - - - M
- - ● - ● - - ● -
- - ● - - ● ● - -
- - - - - ● - - -
- - - - - - - - -
- - - - - - - - -
- - - - ● - - - 9, M
- - - - - - - - -
- - - - ● ● ● ● M
- - - - - 1 - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
H H ● ● ● - - ● -
- H ● ● ● 2 - ● -
- H - - ● - - ● -
- H - - D C 2,C - C
- H - ● - - - - -
- - - - - - - - -
- H ● - ● - - ● -
- - ● - - ● ● - -
- - - - - - - - -
- H - - - ● - - -
- H ● ● ● - - - -
H H H - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
H H ● ● - ● ● ● -
- - - - - - - - -
- - - - - ● - ● -
- H ● ● - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
YES NO
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change (acc. AEC-Q101).
Device evaluation
Die
lect
ric In
tegr
ity
Lead
Fre
e
Not
es /
Rem
arks
DI
SCR
LF
27 28 29
- - - - - -
- - - - - -
- - - - - -
- - - - - -
- - - - - -
- ● - - - ●
additional to AEC-Q10x
Sho
rt C
ircui
t Rel
iabi
lity
Cha
ract
eriz
atio
n
Whi
sker
test
(IEC
600
68-T
2-82
, JE
DE
C
JES
D20
1)
Par
amet
er-A
naly
sis:
C
ompa
rison
of e
lect
rical
di
strib
utio
n
- ● - - - ●
- ● - F - ●
- - - - - -
- - - R - ●
- - - - - ●
- - - F - ●
- - - P, R - ●
● ● - P - ●
- - - - - ●
- ● - - - ●
- - - - - ●
- - - - - ●
- - - - - ●
- - - R - ●
- - - - - -
● - - - ●
- - - P - ●
● - - - - ●
- - - - - ●
- - - - - -
- - - - - ●
- - - - - -
- - - - - ●
- - - - - -
A,I,PR,S
- - - - - -
- - - - - ●
● ● - - - -
- ● - A,F,X Ge -
- ● - - - -
- - - - - -
- - - - - -
- - - - - -
- ● - A,X - ●
- ● - - - ●
- - - - - -
- - - - - -
● - - A,F,G - -
- - - - - -
- - - - - -
- - - - - -
- - - - - -
- - - - - -
- - - - - -
- - - A,G,I,S,X Ge ●
- - - - - -
- - - X - -
- - - A,G - -
- - - - - -
- - - - - -
- - - - - -
- - - - - -
- - - - - ●
- - - - - -
- - - - - ●
- - - - - ●
- - - - - ●
Remarks
Qualification effort acc. AEC-Q100: see diffusion/doping
AEQ-Q100: Applicable to all smart power devices.
Qualification effort depends on type of change.
AEC-Q100: "For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations."
Qualification for IC & µ-Controller difficult on product level. Characterisation on wafer level only on test structure.AEC-Q100: "For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 ofQ100, which allows for the selection of worst-case test vehicles to cover all the possible permutations."
AEC-Q100: "For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations."
For wire bond strengh test: Pre- & Post-process change comparison to evaluateprocess change robustness (AEC-Q101).
Parameter Analysis: Strictly required only for Power devices.In general: Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended.AEC-Q100: "For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations."
See change of material.
Qualification depends on specific change.
Whisker tests have to be done on monitoring basis!
AEC-Q100: "For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations."
Affected process change is to check.
Gage R&R / delta correlation
Gage R&R / delta correlation
Parameter Analysis: Delta correlation
* For "burn in" changes ELFR recommended
ID-Number
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
Selection of component
PAS-RES-AN-01
PAS-RES-AN-02
PAS-RES-DS-01
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
PAS-RES-DS-02
PAS-RES-DS-03
PAS-RES-MA-01
PAS-RES-MA-02
PAS-RES-MA-03
PAS-RES-MA-04
PAS-RES-MA-05
PAS-RES-MA-06
PAS-RES-DE-01
PAS-RES-DE-02
PAS-RES-PR-01
PAS-RES-PR-02
PAS-RES-PR-03
PAS-RES-PR-04
PAS-RES-PR-05
PAS-RES-PR-06
PAS-RES-PR-07
PAS-RES-PR-08
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
NETWORKS & RESISTORS
NETWORKS & RESISTORS Headings
NETWORKS & RESISTORS
INDUCTORS Headings
INDUCTORS Headings
INDUCTORS
PAS-RES-PN-01
PAS-RES-PN-02
PAS-RES-PN-03
PAS-RES-PV-01
PAS-RES-PV-02
PAS-RES-PV-03
PAS-RES-EQ-01
PAS-RES-EQ-02
PAS-RES-EQ-03
PAS-RES-PF-01
PAS-RES-PF-02
PAS-RES-QG-01
PAS-IND-AN-01
INDUCTORS
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS PAS-IND-MA-10
PAS-IND-AN-02
PAS-IND-DS-01
PAS-IND-DS-02
PAS-IND-DS-03
PAS-IND-MA-01
PAS-IND-MA-02
PAS-IND-MA-03
PAS-IND-MA-04
PAS-IND-MA-05
PAS-IND-MA-06
PAS-IND-MA-07
PAS-IND-MA-08
PAS-IND-MA-09
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
PAS-IND-DE-07
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS PAS-IND-PR-05
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS PAS-IND-PR-10
INDUCTORS Headings
INDUCTORS
PAS-IND-DE-01
PAS-IND-DE-02
PAS-IND-DE-03
PAS-IND-DE-04
PAS-IND-DE-05
PAS-IND-DE-06
PAS-IND-PR-01
PAS-IND-PR-02
PAS-IND-PR-03
PAS-IND-PR-04
PAS-IND-PR-06
PAS-IND-PR-07
PAS-IND-PR-08
PAS-IND-PR-09
PAS-IND-PN-01
INDUCTORS
INDUCTORS
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS Headings
INDUCTORS
INDUCTORS
INDUCTORS
INDUCTORS Headings
INDUCTORS
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
PAS-IND-PN-02
PAS-IND-PN-03
PAS-IND-PV-01
PAS-IND-PV-02
PAS-IND-PV-03
PAS-IND-EQ-01
PAS-IND-EQ-02
PAS-IND-EQ-03
PAS-IND-PF-01
PAS-IND-PF-02
PAS-IND-PF-03
PAS-IND-QG-01
PAS-CER-AN-01
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
PAS-CER-AN-02
PAS-CER-DS-01
PAS-CER-DS-02
PAS-CER-DS-03
PAS-CER-MA-01
PAS-CER-MA-02
PAS-CER-MA-03
PAS-CER-MA-04
PAS-CER-MA-05
PAS-CER-MA-06
PAS-CER-MA-07
PAS-CER-MA-08
PAS-CER-DE-01
PAS-CER-DE-02
PAS-CER-DE-03
PAS-CER-DE-04
PAS-CER-DE-05
PAS-CER-DE-06
PAS-CER-PR-01
PAS-CER-PR-02
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
PAS-CER-PR-03
PAS-CER-PR-04
PAS-CER-PR-05
PAS-CER-PR-06
PAS-CER-PR-07
PAS-CER-PR-08
PAS-CER-PN-01
PAS-CER-PN-02
PAS-CER-PN-03
PAS-CER-PV-01
PAS-CER-PV-02
PAS-CER-PV-03
PAS-CER-EQ-01
PAS-CER-EQ-02
PAS-CER-EQ-03
PAS-CER-PF-01
CERAMIC / TANTALUM
CERAMIC / TANTALUM Headings Headings
CERAMIC / TANTALUM
Film capacitors Headings Headings
Film capacitors Headings Headings
Film capacitors PAS-FLM-AN-01
Film capacitors PAS-FLM-AN-02
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors
PAS-CER-PF-02
PAS-CER-QG-01
PAS-FLM-DS-01
PAS-FLM-DS-02
PAS-FLM-DS-03
PAS-FLM-MA-01
PAS-FLM-MA-02
PAS-FLM-MA-03
PAS-FLM-MA-04
PAS-FLM-MA-05
PAS-FLM-MA-06
Film capacitors
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors
Film capacitors
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors
Film capacitors Headings Headings
PAS-FLM-MA-07
PAS-FLM-DE-01
PAS-FLM-DE-02
PAS-FLM-DE-03
PAS-FLM-DE-04
PAS-FLM-DE-05
PAS-FLM-DE-06
PAS-FLM-DE-07
PAS-FLM-PR-01
PAS-FLM-PR-02
PAS-FLM-PR-03
PAS-FLM-PR-04
PAS-FLM-PN-01
PAS-FLM-PN-02
PAS-FLM-PN-03
Film capacitors
Film capacitors
Film capacitors
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors
Film capacitors Headings Headings
Film capacitors
Film capacitors
Film capacitors Headings Headings
Film capacitors
PAS-FLM-QG-01
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
PAS-FLM-PV-01
PAS-FLM-PV-02
PAS-FLM-PV-03
PAS-FLM-EQ-01
PAS-FLM-EQ-02
PAS-FLM-EQ-03
PAS-FLM-PF-01
PAS-FLM-PF-02
PAS-QUA-AN-01
PAS-QUA-AN-02
PAS-QUA-DS-01
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
PAS-QUA-DS-02
PAS-QUA-DS-03
PAS-QUA-MA-01
PAS-QUA-MA-02
PAS-QUA-MA-03
PAS-QUA-MA-04
PAS-QUA-MA-05
PAS-QUA-MA-06
PAS-QUA-MA-07
PAS-QUA-MA-08
PAS-QUA-MA-09
PAS-QUA-MA-10
PAS-QUA-MA-11
PAS-QUA-MA-12
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
PAS-QUA-DE-01
PAS-QUA-DE-02
PAS-QUA-DE-03
PAS-QUA-DE-04
PAS-QUA-DE-05
PAS-QUA-DE-06
PAS-QUA-DE-07
PAS-QUA-PR-01
PAS-QUA-PR-02
PAS-QUA-PR-03
PAS-QUA-PR-04
PAS-QUA-PR-05
PAS-QUA-PR-06
PAS-QUA-PR-07
PAS-QUA-PR-08
PAS-QUA-PR-09
PAS-QUA-PR-10
PAS-QUA-PN-01
PAS-QUA-PN-02
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW
QUARTZ CRYSTAL / SAW Headings
QUARTZ CRYSTAL / SAWAl-Cap Headings Headings
Al-Cap Headings Headings
Al-Cap
Al-Cap
Al-Cap Headings Headings
PAS-QUA-PN-03
PAS-QUA-PV-01
PAS-QUA-PV-02
PAS-QUA-PV-03
PAS-QUA-EQ-01
PAS-QUA-EQ-02
PAS-QUA-EQ-03
PAS-QUA-PF-01
PAS-QUA-PF-02
PAS-QUA-QG-01
PAS-ALU-AN-01
PAS-ALU-AN-02
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
Al-Cap
PAS-ALU-DS-01
PAS-ALU-DS-02
PAS-ALU-DS-03
PAS-ALU-MA-01
PAS-ALU-MA-02
PAS-ALU-MA-03
PAS-ALU-MA-04
PAS-ALU-MA-05
PAS-ALU-MA-06
PAS-ALU-MA-07
PAS-ALU-MA-08
PAS-ALU-MA-09
PAS-ALU-DE-01
PAS-ALU-DE-02
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
PAS-ALU-DE-03
PAS-ALU-DE-04
PAS-ALU-DE-05
PAS-ALU-DE-06
PAS-ALU-DE-07
PAS-ALU-DE-08
PAS-ALU-DE-09
PAS-ALU-DE-10
PAS-ALU-PR-01
PAS-ALU-PR-02
PAS-ALU-PR-03
PAS-ALU-PR-04
PAS-ALU-PR-05
PAS-ALU-PR-06
PAS-ALU-PR-07
PAS-ALU-PR-08
PAS-ALU-PN-01
PAS-ALU-PN-02
PAS-ALU-PN-03
PAS-ALU-PV-01
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
Al-Cap
Al-Cap
Al-Cap Headings Headings
Al-Cap
NTC Headings Headings
NTC Headings Headings
NTC
NTC
NTC Headings Headings
NTC
PAS-ALU-PV-02
PAS-ALU-PV-03
PAS-ALU-EQ-01
PAS-ALU-EQ-02
PAS-ALU-EQ-03
PAS-ALU-PF-01
PAS-ALU-PF-02
PAS-ALU-PF-03
PAS-ALU-QG-01
PAS-NTC-AN-01
PAS-NTC-AN-02
PAS-NTC-DS-01
NTC
NTC
NTC Headings Headings
NTC
NTC
NTC
NTC
NTC
NTC
NTC Headings Headings
NTC
NTC
NTC
NTC
NTC
NTC
PAS-NTC-DS-02
PAS-NTC-DS-03
PAS-NTC-MA-01
PAS-NTC-MA-02
PAS-NTC-MA-03
PAS-NTC-MA-04
PAS-NTC-MA-05
PAS-NTC-MA-06
PAS-NTC-DE-01
PAS-NTC-DE-02
PAS-NTC-DE-03
PAS-NTC-DE-04
PAS-NTC-DE-05
PAS-NTC-DE-06
NTC
NTC Headings Headings
NTC
NTC
NTC
NTC
NTC
NTC
NTC
NTC Headings Headings
NTC
NTC
NTC
NTC Headings Headings
NTC
NTC
NTC
NTC Headings Headings
NTC
PAS-NTC-DE-07
PAS-NTC-PR-01
PAS-NTC-PR-02
PAS-NTC-PR-03
PAS-NTC-PR-04
PAS-NTC-PR-05
PAS-NTC-PR-06
PAS-NTC-PR-07
PAS-NTC-PN-01
PAS-NTC-PN-02
PAS-NTC-PN-03
PAS-NTC-PV-01
PAS-NTC-PV-02
PAS-NTC-PV-03
PAS-NTC-EQ-01
NTC
NTC
NTC Headings Headings
NTC
NTC
NTC Headings Headings
NTC
PTC Headings Headings
PTC Headings Headings
PTC
PTC
PTC Headings Headings
PTC
PTC
PTC
PTC Headings Headings
PTC
PTC
PAS-NTC-EQ-02
PAS-NTC-EQ-03
PAS-NTC-PF-01
PAS-NTC-PF-02
PAS-NTC-QG-01
PAS-PTC-AN-01
PAS-PTC-AN-02
PAS-PTC-DS-01
PAS-PTC-DS-02
PAS-PTC-DS-03
PAS-PTC-MA-01
PAS-PTC-MA-02
PTC
PTC
PTC
PTC
PTC Headings Headings
PTC
PTC
PTC
PTC
PTC
PTC
PTC
PTC Headings Headings
PTC
PTC
PTC
PTC
PTC
PTC
PTC
PTC Headings Headings
PTC
PAS-PTC-MA-03
PAS-PTC-MA-04
PAS-PTC-MA-05
PAS-PTC-MA-06
PAS-PTC-DE-01
PAS-PTC-DE-02
PAS-PTC-DE-03
PAS-PTC-DE-04
PAS-PTC-DE-05
PAS-PTC-DE-06
PAS-PTC-DE-07
PAS-PTC-PR-01
PAS-PTC-PR-02
PAS-PTC-PR-03
PAS-PTC-PR-04
PAS-PTC-PR-05
PAS-PTC-PR-06
PAS-PTC-PR-07
PAS-PTC-PN-01
PTC
PTC
PTC Headings Headings
PTC
PTC
PTC
PTC Headings Headings
PTC
PTC
PTC
PTC Headings Headings
PTC
PTC
PTC Headings Headings
PTC
VDR Headings Headings
VDR Headings Headings
VDR
VDR
VDR Headings Headings
PAS-PTC-PN-02
PAS-PTC-PN-03
PAS-PTC-PV-01
PAS-PTC-PV-02
PAS-PTC-PV-03
PAS-PTC-EQ-01
PAS-PTC-EQ-02
PAS-PTC-EQ-03
PAS-PTC-PF-01
PAS-PTC-PF-02
PAS-PTC-QG-01
PAS-VDR-AN-01
PAS-VDR-AN-02
VDR
VDR
VDR
VDR Headings Headings
VDR
VDR
VDR
VDR
VDR
VDR
VDR Headings Headings
VDR
VDR
VDR
VDR
VDR
VDR
PAS-VDR-DS-01
PAS-VDR-DS-02
PAS-VDR-DS-03
PAS-VDR-MA-01
PAS-VDR-MA-02
PAS-VDR-MA-03
PAS-VDR-MA-04
PAS-VDR-MA-05
PAS-VDR-MA-06
PAS-VDR-DE-01
PAS-VDR-DE-02
PAS-VDR-DE-03
PAS-VDR-DE-04
PAS-VDR-DE-05
PAS-VDR-DE-06
VDR
VDR
VDRPAS-VDR-DE-09
VDR Headings Headings
VDR
VDR
VDR
VDR
VDR
VDR
VDR
VDR Headings Headings
VDR
VDR
VDR
VDR Headings Headings
VDR
VDR
VDR
VDR Headings Headings
PAS-VDR-DE-07
PAS-VDR-DE-08
PAS-VDR-PR-01
PAS-VDR-PR-02
PAS-VDR-PR-03
PAS-VDR-PR-04
PAS-VDR-PR-05
PAS-VDR-PR-06
PAS-VDR-PR-07
PAS-VDR-PN-01
PAS-VDR-PN-02
PAS-VDR-PN-03
PAS-VDR-PV-01
PAS-VDR-PV-02
PAS-VDR-PV-03
VDR
VDR
VDR
VDR Headings Headings
VDR
VDR
VDR Headings Headings
VDR
Tests, which should be considered for the appropriate process change.
Tests, which should be considered for the appropriate process change after selection of condition table.
Suppliers performed tests (mark with an 'X' for done or 'G' for generic)
Reason for exception of tests:
--
I
PAS-VDR-EQ-01
PAS-VDR-EQ-02
PAS-VDR-EQ-03
PAS-VDR-PF-01
PAS-VDR-PF-02
PAS-VDR-QG-01
P
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.
ACBEFNRSWY
Note 1:
Based on ZVEI-DQM: Revision 2.2.4 - July 2015
HW-DQM Version 3_0_5
Type of change No
NETWORKS & RESISTORS
ANY
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
P
Assessment of impact on Supply Chain regarding following aspects - contractual agreements - technical interface of processability/manufacturability of customer - form, fit, function, quality performance, reliability
Remainingrisks onSupplyChain?
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Changes
rev3 vs. rev2
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
Change of supplier of material -
DESIGN
Changes of termination, surface finish, shape, color, appearance or dimension structure I
-
PROCESS
-
-
-
-
-
-
-
Process integrity: tuning within specification -
PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Change of material composition - Ink/Wire material of Resistor element
Change of material composition - Ink/Wire material of Terminal element
Change of material composition - Package/ Mold
Change of material composition - Passivation
Change of material composition - Substrate matreial
Changes of inner construction - Passivation
Changes in process technology or manufacturing methods - Ink Fire
Changes in process technology or manufacturing methods - Ink Print
Changes in process technology or manufacturing methods - Trim
Changes in process technology or manufacturing methods - Lead Form
Changes in process technology or manufacturing methods - Termination Attach
Changes in process technology or manufacturing methods - Marking
Changes in process technology or manufacturing methods - Molding
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
INDUCTORS
ANY
Any change with impact on special customer characteristics/contractual agreements P
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
P
DATASHEET
P
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
P
P
P
Change of supplier of material -
Change of material composition - Potting Material P
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Change of material composition - Bobbin Material
Change of material composition - Core Material
Change of material composition - Insulation Material
Change of material composition - Lead Material
Change of material composition - Mold Compound
Change of material composition - Solder Material
Change of material composition - Wire / Foil Material
Change of material composition - Glue
DESIGN
I
I
I
-
-
-
I
PROCESS
-
-
-
-
-
-
-
-
Process integrity: tuning within specification -
Changes in process technology or manufacturing methods - Potting -
PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Changes of termination, surface finish, shape, color, appearance or dimension structure - Bobbin
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead/Terminals
Changes of termination, surface finish, shape, color, appearance or dimension structure - Mold
Changes of inner construction - Core Construction
Changes of inner construction - Insulation System
Changes of inner construction - Wire / Foil Construction
Changes of termination, surface finish, shape, color, appearance or dimension structure - Potting Material
Changes in process technology or manufacturing methods - Insulation Strip
Changes in process technology or manufacturing methods - Lead Prep. / Plating
Changes in process technology or manufacturing methods - Terminal Attach
Changes in process technology or manufacturing methods - Marking
Changes in process technology or manufacturing methods - Molding
Changes in process technology or manufacturing methods - Soldering Internal Connections
Changes in process technology or manufacturing methods - Winding Insulation
Changes in process technology or manufacturing methods - Winding Wire
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
Elimination of final electrical measurement / test flow block I
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
CERAMIC / TANTALUM
ANY
Any change with impact on special customer characteristics/contractual agreements P
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
P
DATASHEET
P
Correction of data sheet I
Specification of additional parameters I
MATERIAL
PPP
P
P
P
P
Change of supplier of material -
DESIGN
I
I
I
-
-
-
PROCESS
-
-
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Change of material composition - Ceramic Binder
Change of material composition - Tantalum Binder
Change of material composition - Dielectric
Change of material composition - Electrode Attach
Change of material composition - Electrode Material
Change of material composition - Encapsulation
Change of material composition - Lead material / Termination
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead DiameterChanges of termination, surface finish, shape, color, appearance or dimension structure - Termination AreaChanges of termination, surface finish, shape, color, appearance or dimension structure - Termination Interface
Changes of inner construction - Electrode Thickness
Changes of inner construction - Layer Thickness
Changes of inner construction - Number of Layers
Changes in process technology or manufacturing methods - Dicing
Changes in process technology or manufacturing methods - Electrode apply
-
-
-
-
-
Process integrity: tuning within specification -PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Changes in process technology or manufacturing methods - Firing
Changes in process technology or manufacturing methods - Lamination
Changes in process technology or manufacturing methods - Particle Size
Changes in process technology or manufacturing methods - Screening/Printing
Changes in process technology or manufacturing methods - Termination
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
Film capacitors
Any
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
P
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
P
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Change of material composition - Sealing Compound
Change of material composition - Package
Change of material composition - Lead/Termination
Change of material composition - Metal Spray (Schoop)
Change of material composition - Film
Change of material composition - Metal Foil
Change of supplier of material -
DESIGN
I
I
-
I
-
-
I
PROCESS
-
-
-
Process integrity: tuning within specification -
PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter / Thickness
Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area
Changes of inner construction - Inner Connection
Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance
Changes of inner construction - Film/Foil
Changes of inner construction - Insulation System
Changes of termination, surface finish, shape, color, appearance or dimension structure - Package
Changes in process technology or manufacturing methods - Package
Changes in process technology or manufacturing methods - Terminal Attach
Changes in process technology or manufacturing methods - Winding
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPEMEMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
QUARTZ CRYSTAL / SAW
ANY
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
P
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
P
P
P
P
P
P
Change of supplier of material -
DESIGN
Change of material composition - Quartz Blank
Change of material composition - Base
Change of material composition - Lead / Termination
Change of material composition - Sealing
Change of material composition - Can / Cap
Change of material composition - Blank Support
Change of material composition - Overmold
Change of material composition - Case Sealing
Change of material composition - Electrode
Change of material composition - Insulator
Change of material composition - Marking
I
I
I
I
I
-
-
PROCESS
-
-
-
-
-
-
-
-
-
Process integrity: tuning within specification -
PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Changes of termination, surface finish, shape, color, appearance or dimension structure - Base
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead / Termination
Changes of termination, surface finish, shape, color, appearance or dimension structure - Can / Cap
Changes of termination, surface finish, shape, color, appearance or dimension structure - Package
Changes of termination, surface finish, shape, color, appearance or dimension structure - Insulator
Changes of inner construction - Quartz Blank
Changes of inner construction - Blank Support
Changes in process technology or manufacturing methods - Quartz Blank
Changes in process technology or manufacturing methods - Blank Etching / Cleaning
Changes in process technology or manufacturing methods - Electrode Formation
Changes in process technology or manufacturing methods - Trimming
Changes in process technology or manufacturing methods - Bonding / Annealing
Changes in process technology or manufacturing methods - Can / Cap Attaching
Changes in process technology or manufacturing methods - Molding
Changes in process technology or manufacturing methods - Marking
Changes in process technology or manufacturing methods - Aging
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
Aluminium Electrolytic CapacitorAny
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
P
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
P
P
P
Change of supplier of material -
DESIGN
I
I
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Change of material composition - Housing
Change of material composition - Sealing
Change of material composition - External Insulation
Change of material composition - Lead / Termination
Change of material composition - Internal Insulation / Paper
Change of material composition - Electrolyte
Change of material composition - Tape Material
Change of material composition - Base Plate
Changes of termination, surface finish, shape, color, appearance or dimension structure - Wire DiameterChanges of termination, surface finish, shape, color, appearance or dimension structure - Termination
I
I
-
-
-
-
-
-
PROCESS
-
-
-
-
-
-
-
Process integrity: tuning within specification -PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance
Changes of termination, surface finish, shape, color, appearance or dimension structure - Rubber Sealing
Changes of inner construction - Aluminum Foil
Changes of inner construction - Seperator
Changes of inner construction - Seperator Density
Changes of inner construction - Inner Connection
Changes of inner construction - Closing Tape
Changes of inner construction - Foil
Changes in process technology or manufacturing methods - Terminal Attach
Changes in process technology or manufacturing methods - Winding
Changes in process technology or manufacturing methods - Impregnation
Changes in process technology or manufacturing methods - Assembly
Changes in process technology or manufacturing methods - Aging / Testing
Changes in process technology or manufacturing methods - Trim & Form Leaded
Changes in process technology or manufacturing methods - Trim & Form SMD
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPEMEMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
Elimination of final electrical measurement / test flow block I
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
NTC
Any
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
P
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
Change of supplier of material -
DESIGN
I
I
I
I
-
-
Change of material composition - Ceramic Binder
Change of material composition - Ceramic
Change of material composition - Inner Electrode
Change of material composition - Encapsulation
Change of material composition - Lead material / Termination
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter
Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area
Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection
Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance
Changes of inner construction - Electrode
Changes of inner construction - Layer Thickness
-
PROCESS
-
-
-
-
-
-
Process integrity: tuning within specification -PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPEMEMENT
P
Changes of inner construction - Number of Layers
Changes in process technology or manufacturing methods - Lamination
Changes in process technology or manufacturing methods - Firing
Changes in process technology or manufacturing methods - Dicing
Changes in process technology or manufacturing methods - Termination
Changes in process technology or manufacturing methods - Electrode apply
Changes in process technology or manufacturing methods - Assembly
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
PTC
Any
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
P
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Change of material composition - Ceramic Binder
Change of material composition - Ceramic
P
P
P
Change of supplier of material -
DESIGN
I
I
I
I
-
-
-
PROCESS
-
-
-
-
-
-
Process integrity: tuning within specification -PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Change of material composition - Polymer
Change of material composition - Encapsulation
Change of material composition - Lead material / Termination
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter
Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area
Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection
Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance
Changes of inner construction - Electrode
Changes of inner construction - Layer Thickness
Changes of inner construction - Number of Layers
Changes in process technology or manufacturing methods - Lamination
Changes in process technology or manufacturing methods - Firing
Changes in process technology or manufacturing methods - Dicing
Changes in process technology or manufacturing methods - Termination
Changes in process technology or manufacturing methods - Electrode apply
Changes in process technology or manufacturing methods - Assembly
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPEMEMENT
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
VDR
Any
Any change with impact on special customer characteristics/contractual agreements P
P
DATASHEET
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.
P
Correction of data sheet I
Specification of additional parameters I
MATERIAL
P
P
P
P
P
Change of supplier of material -
DESIGN
I
I
I
I
-
-
Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification
Change of material composition - Ceramic Binder
Change of material composition - Ceramic
Change of material composition - Electrode
Change of material composition - Encapsulation
Change of material composition - Lead material / Termination
Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter
Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area
Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection
Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance
Changes of inner construction - Electrode
Changes of inner construction - Layer Thickness
-
-
-
PROCESS
-
-
-
-
-
-
Process integrity: tuning within specification -PACKING / SHIPPING - NEW MATERIAL, CRITICAL DIMENSIONS
Packing / shipping specification change (loosening of tolerances) P
Dry pack requirements change P
Change of carrier (tray, reel) P
PACKING / SHIPPING - VISUAL INSPECTION
Change of labelling I
Change of product marking I
Change of packing/shipping specification P
LOGISTICS / CAPACITY / TESTING - EQUIPEMEMENT
Changes of inner construction - Number of Layers
Changes of inner construction - Grain size
Changes of inner construction - Grain boundary size
Changes in process technology or manufacturing methods - Lamination
Changes in process technology or manufacturing methods - Firing
Changes in process technology or manufacturing methods - Dicing
Changes in process technology or manufacturing methods - Termination
Changes in process technology or manufacturing methods - Electrode apply
Changes in process technology or manufacturing methods - Assembly
P
-
Change in final test equipment type that uses a different technology P
LOGISTICS / CAPACITY / TESTING - PROCESS FLOW
P
Elimination or addition of a manufacturing process step -
LOGISTICS / CAPACITY / TESTING - Q-GATE
-
Tests, which should be considered for the appropriate process change.
Tests, which should be considered for the appropriate process change after selection of condition table.
Suppliers performed tests (mark with an 'X' for done or 'G' for generic)
Reason for exception of tests:
Not required
Information Note required
Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)
Manufacturing site transfer or movement of a part of production process to a different location/site
Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)
PCN required
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.
CONDITIONS NoTermination equipment only
Ceramics only
Comparative data (unchanged vs. changed) required
Capacitive trimmers only
Film products only
Networks only
Resistors only
SMD components only
Wirewound products only
Component not hermitically sealedFor parts marked with ink only. Laser and stamp marked parts shall be exempt.
=> Please mark 'NO' with 'x', default is 'YES'
Examples to explain
Yes
P Not relevant for technical evaluation.
P Technical interface means component terminals.
P e.g. tighten of electrical parameter distribution
Remainingrisks onSupplyChain?
Understanding of component experts
Change of application relevant information Not included: Editorial changes.
Changes
rev3 vs. rev2
P
P e.g. adding new (tested) parameter.
P Change of Ink / Wire material e.g. resistor paste, NiCr, resistor wire
P Change of Ink / Wire material
P Change of Package e.g. for chip res.: final coating, epoxy
P e.g. change of glass
P Change of substrate material
P e.g. for 2nd source purpose
P Change of package
P e.g. change of glass, laquer, epoxy, ...
P
P
P e.g. change from mill trimming to laser trimming
P Change of lead form process e.g. change from bending to punching
P
P e.g. change from tampon printing to laser marking
P
P Variation within process specification. e.g. process control
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
e.g. AgPd paste, Ag paste, lead wire , NiCr for side termination
Change of Passivation /Inner protection
Change to a new or additional material supplier at component manufacturer.
Change of passivation/Inner protection
Change of ink fire processe.g. change of firing profilee.g. change from normal atmospher to nitrogen atmospher
Change of ink print process
Change of trim process
Change of termination attach process e.g. chip resistors: electroplating processe.g. welding of leads for through put devices.
Change of marking process
Change of molding process
P Change of packing specification. e.g. number of pieces on reel.
P Change of dry pack requirements.
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
P
P
P e.g. change of tester platform
P
P
P Change of test coverage.
P Not relevant for technical evaluation.
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
e.g. new equipment supplier with different process concept
PCN required for dedicated equipment for sensitive component production.
e.g. additional equipment to increase production capacitye.g. replacement of same equipment
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
P Technical interface means component terminals.
P e.g. tighten of electrical parameter distribution
P
P e.g. adding new (tested) parameter.
P e.g. change from Thermoset to Thermoplastic
P e.g. change from NiZn into MnZn
P Change of insulation material
P Change of lead material
P Change of mold compound material
P e.g. change of SnAgCu composition
P e.g. change of Cu composition
P Change of glue material e.g. change from glue A into glue B
P e.g. for 2nd source purpose
P Change of potting material e.g. change from epoxy resin to silicon
Change of application relevant information Not included: Editorial changes.
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
Material without magnetic function ("Spulenkörper") typically made by plastic material
Change of core material, which is material with magnetic function
e.g. wire insulation, insulation tapes, …e.g. change from Polyurethane to Polyamide
e.g. change from tin coverd to non-coverd lead material
e.g. change to green mold
Change of solder material at internal connection.
Wire for wounded inductors.Foil for multilayer inductors (inner electrode).
Change to a new or additional material supplier at component manufacturer.
P e.g. construction / dimension change of bobbin
P Change of lead/terminals e.g. change from PTH terminals to SMD terminals
P Change of mold e.g. new mold material with different colour
P
P Change of insulation system
P Change of wire / foil dimensions
P Change of potting dimension e.g. change of potting (filling) height
P (Mechanical) removal of insulation.
P Change of lead prep. / plating e.g. change from hot dip tinning to electroplating
P
P e.g. change from ink marking to laser marking
P
P e.g. change from hot tip tinning to resistance welding
P Change of winding - insulation e.g. change from manual to automatic process
P Change of winding - wire
P Variation within process specification. e.g. process control
P Change of potting process
P Change of packing specification. e.g. number of pieces on reel.
Material without magnetic function ("Spulenkörper") typically made by plastic material
Change of core construction, which is material with magnetic function
e.g. change fromdrum core & shield core into pot core & cover plate core
e.g. wire insulation, insulation tapes, …e.g. change from Polyurethane to PTFE (Teflon)
e.g. change from round cross section to rectangular cross sectione.g. from single wire to litz wire
e.g. change from mechanical removal to laser removal
Connection of wire terminal and / orconnection of termination to core/bobbin.
e.g. chanfe from Manual winding to Semi-automtic winding (winding of wire on terminal)
Change of marking process
Change of molding process e.g. change from one component molding to two component molding (other technology needed)
Change of soldering internal connection
e.g. change from semi-automatic winding to full automatic winding
e.g. change from manual potting process to automatic potting process
P Change of drypack requirements.
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
P e.g. introduction of potting process
P e.g. duplication of existing winding machine
P e.g. change of tester platform
P
P
P e. g. elimination of High-voltage measurement
P Change of test coverage.
P Not relevant for technical evaluation.
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
PCN required for dedicated equipment for sensitive component production.
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
Reduction of final testing.PCN required for dedicated final test reductions for sensitive parameters.
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
P Technical interface means component terminals.
P e.g. tighten of electrical parameter distribution
P
P e.g. adding new (tested) parameter.
P Binder material (ceramic)
P Binder material (tantal) e.g. change from wax 1 to wax 2
P Dielectric change (ceramic only) e.g. change from ceramic A into ceramic B
P
P e.g. change from spehric to flake shape (Ni paste)
P Encapsulation e.g. change from epoxy1 into epoxy2
P Lead material / Termination e.g. change from SnPb to pure Sn
P e.g. for 2nd source purpose
P Lead diameter e.g. change from 0.8mm into 0.6mm
P Termination area
P Terminal interface e.g. additional layer in termination
P Electrode thickness (ceramic only) e.g. Ni layer change from 2.5µm into 3.5µm
P Layer thickness (dielectric thickness)
P see also layer thickness
P Change of dicing e.g. change from cutting to sawing
P Electrode apply (dielectric layer process) e.g. change from wet to dry process
Change of application relevant information Not included: Editorial changes.
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
Electrode attach (only tantal, glue, carbon, Ag)
e.g. change of Ag particle size in conductive adhesive
Electrode Material (only ceramic, inner elctrode)
Change to a new or additional material supplier at component manufacturer.
e.g. change in width of termination from 0.1 -0.3mm into 0.2 - 0.4 mm
e.g. Ceramic layer thickness changes from 3µm into 5µm.
Number of layers (ceramic only). Allways in combination with PAS-CER-DE-05.
P Change of firing profile e.g. seperation of decarbonization and firing profile.
P Change of lamination / press techinque e.g. standard pressing to iso static pressing.
P e.g. change D50 from 0.5µm into 0.4µm
P Change of screening / printing e.g. change from screen printing into offset printing
P
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
P Change of drypack requirements.
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
P e.g. change from wet to dry technology.
P e.g. elimination of manual handling processes
P e.g. change of tester platform
P
Change of powder particle size. Allways in combination with PAS-CER-MA-03.
Change for termination preparation like plating or apply of termination base layer.
e.g. change in plating technology (final termination)e.g. change from dip in paste to platimg (apply)
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
PCN required for dedicated equipment for sensitive component production.
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
P
P Change of test coverage.
P Not relevant for technical evaluation.
P Technical interface means component terminals.
P e.g. tighten of electrical parameter distribution
P
P e.g. adding new (tested) parameter.
P e.g. change of epoxy or PU composition
P Change material of package
P
P e.g. from Zn to Al
P
P e.g. change from Al to Al-Zn alloy
Change of manufacturing process sequence. e.g. washing / cleaning process
e.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
Change of application relevant information Not included: Editorial changes.
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
Typicaly change within epoxy or PU sealing without effect to mechanical properties.Note: Change from epoxy sealing into PU sealing (both direction) will lead to generate a new product.
Change material of package,e.g. change from PBT to PPSe.g. change of glas fiber ratio
Change of Lead/TerminationNote: If change of lead frame material leads to an ESR change, than change of data sheet (PAS-FLM-DS-01) has to be respected.
e.g. change of basis material from Cu to Fee.g. change of finishing from SnPb to Sn
Change of Metal Spray (Schoop): Use different material for metal spray process for boxed and naked typesChange of film material for boxed and naked types
e.g. change of additives (<1%) of film composition (same raw material)
Change of metal foil for inner electrode
P e.g. for 2nd source purpose
P Change of lead diameter thickness
P
P Change of inner connection
P e.g. change or adding of colour on component
P e.g. change to a different foil supplier.
P
P
P
P
P e.g. change of tempering temperature
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
P Change of drypack requirements.
P Change of carrier
Change to a new or additional material supplier at component manufacturer which are described above.
e.g. change lead diameter from 0.5 to 0.4 mme.g. change of thickness of terminal
Changes of termination area are changes which are affecting the area for connection of component and PCB
e.g. change of termination layer thicknesse.g. change in termination dimensions / shape
e.g. change from soldered connection to welded connection
Change of appearance.(I): Change in appaerance without impact on product integrity.(P): Change in appaerance with impact on product integrity. Note: Marking on device is defined as seperate change (PAS-FLM-PV-02).
Change of film or foil design
Change of inner insulation to protect winding element against housing.
e.g. change of potting materiale.g. change of number of inner insulation layers (depending of insulation material thickness)
Change of packaging e.g. change of dimension or shapee.g. change of surface
Change of resin filling or hardening process (relevant for boxed types only)
e.g. change in resin filling process (mixing, sequences, potting, …)e.g. change in hardening process (temperature, time, …)
Change Terminal Attach Process to winding element for boxed and nacked types
e.g. spraying and / or galvanic process,e.g. welding / soldering
Change of winding, flattening or tempering process
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
P Change of labelling, also on reel.
P Marking on device.
P
P e.g. implementation of new machines
P e.g. extension of existing machin capacity
P e.g. change of tester platform
P
P
P Change of test coverage.
P Not relevant for technical evaluation.
P Technical interface means component terminals.
P e.g. tighten of electrical parameter distribution
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Significant changes affecting the product not covered by the table require also a PCN.
PCN required for dedicated equipment for sensitive component production.
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
Change of application relevant information Not included: Editorial changes.
P
P e.g. adding new (tested) parameter.
P
P Changing of the material of the base. e.g. change from ceramic to epoxy
P Change of Lead/Termination e.g. change of plating finish. (eg:Au, AgPd,Sn)
P Change of Glass Seal
P Changing of the material of the can/cap
P Change of Blank Support
P Change of Overmold
P e.g. change from solder paste to adhesive glue
P e.g. change from Au to Ag
P
P Change of marking material
P e.g. for 2nd source purpose
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
A change of Quartz Blank is avery rare case. Mainly for SAW-Filter
e.g. change to lead free glass
e.g. change from metal to ceramic material
e.g. change of glue (Silicone to Epoxy)e.g. change metal holders (old types)
e.g. change to green mold compounde.g. change of filler particles
Change of Case Sealing. Change of material for seam weldingRelevant for components with ceramic base and metall cap.
Change of Electrode material on crystal blank.
Change of Insulator. Only for leaded typesNot relevant for typical SMD.
e.g. Insulating plate under crystale.g. Glass sealing for leads
e.g. change of inke.g. chemical to environmental friendly
Change to a new or additional material supplier at component manufacturer.
P Change of Base design e.g. due to miniaturization purpose.
P e.g. change lead design to improve reliability.
P Change of Can/Cap design e.g. due to miniaturization purpose.
P
P
P Change of Quartz Blank design
P Change of Blank Support design
P Change of Quartz Blank process e.g. change of cutting or lapping technology
P e.g. change from liquid etching to plasma etching
P Change of Electrode Formation process e.g. change from evaporation to sputtering
P e.g. change from evaporation to ion beam
P
P Change of Cap/Can attaching process
P
P Change of Marking process
P
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
P Change of drypack requirements.
Change of Lead/Termination design. Change geometry or terminal pad or lead form
Change of Package (Molded). Change the design of the package.Not relevant for typical SMD.
e.g. change from welded device to glued device (case sealing)
Change of Insulator design. Only for leaded types (old technology)Not relevant for typical SMD.
e.g. change dimension of blank, add phase, electrode design, …
e.g. change design of glue shapee.g. change design of metall supporter
Change of Blank Etch/Clean processUsing different / new technology
Change of Auto Trim process (Method of final frequency tuning)
Change of Blank bonding / annealing process. Change of method how apply conductive material to base or blank
e.g. change of the sealing methode.g. change from batch oven to reflow oven
Change of Overmolding process. Not relevant for typical SMD. e.g. change of overmold process parameter
e.g. change from inked marking to laser markinge.g. marking of pin 1e.g. change of appearance (additional marking)
Change of Aging process. Typically no aging done on quartz crystals.
If aging is done: e.g. change of times or temperatures
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
P
P
P e.g. change of tester platform
P
P
P Change of test coverage.
P Not relevant for technical evaluation.
P
e.g. change by material e.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
e. g. new equipment supplier with different process concept
PCN required for dedicated equipment for sensitive component production.
e.g. additional equipment to increase production capacitye.g. replacement of same equipment
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
Technical interface means component terminals.See processability on board level.
P e.g. tighten of electrical parameter distribution
P
P e.g. adding new (tested) parameter.
P Change of housing e.g. change Al alloy for housing
P Change of sealing
P Change of external insulation / sleeving
P Change of lead or outer termination.
P Change of paper type / internal insulation e.g. change of paper thickness 50 µm to 40µm
P Change of electrolyte e.g. change in formulation
P Change of closing tape material e.g. change of glue or basis material
P Change of base plate material e.g. change of used plastic material
P e.g. for 2nd source purpose
P Change of wire diameter e.g. change from 0.8 into 0.6 mm wire diameter.
P e.g. change from matt tin into bright tin.
Change of application relevant information Not included: Editorial changes.
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
e.g. change of rubber compounde.g. change of sealing disc material (axial, Snap in)
e.g. change from PVC into PETe.g. change of colour
e.g. change of leadframe from iron into coppere.g. change of leadframe finish from tin/lead into tin
Change to a new or additional material supplier at component manufacturer.
Change of termination appearanceFor welded Al capacitors only.
P
P e.g. change of profile / design
P Change of Al foil width e.g. change of width
P Change of seperator width e.g. change of width
P Change of seperator density e.g. change of seperator density/resistivity
P Change of inner connection e.g. change of shape/dimension
P Change of closing tape e.g. change of dimension
P Change of foil type
P Change of terminal attach process e.g. change of stitching / welding layout
P Change of winding process e.g. change of material disposition
P Change of impregantion
P Change of assembly process
P Change of aging/testing process
P Change of trim & form process (leaded) e.g. change of tooling shape or bending procedure
P Change of trim & form process (SMD) e.g. change of tooling shape or bending procedure
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
P Change of drypack requirements.
P Change of carrier
P Change of labelling, also on reel.
Change of appearanceNote: Marking on device is defined as seperate change (PAS-ALU-PV-02).
e.g. change of colour/appearancee.g. change of safety vent shape
Change of rubber sealing stand-off shape (for radial)
e.g. change of etching levele.g. change of thickness
e.g. change of bulk process into individual impregnation
e.g. change of sealing methode.g. change of assembly process sequence
e.g. change of timing, voltage or temperature of process
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
P Marking on device.
P
P
P
P e.g. change of tester platform
P
P
P e.g. elemination of additional impedance control
P Change of test coverage.
P Not relevant for technical evaluation.
P Technical interface means component terminals.
P e.g. tighten of electrical parameter distribution
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
e. g. new equipment supplier with different process concept
PCN required for dedicated equipment for sensitive component production.
e.g. additional equipment to increase production capacitye.g. replacement of same equipment
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
Reduction of final testing.PCN required for dedicated final test reductions for sensitive parameters.
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
Change of application relevant information Not included: Editorial changes.
P
P e.g. adding new (tested) parameter.
P
P Change of ceramic composition e.g. changes in additives amount
P e.g. change from AgPt material to AgPd material
P Change of encapsulation material.
P e.g. change from SnPb to pure Sn
P e.g. for 2nd source purpose
P Change of lead diameter e.g. change lead diameter from 0.5 to 0.4 mm
P Change of termination area
P Change of inner connection
P
P
P e.g. change from 1.5µm into 1.0µm
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
Change of Binder Material to bind ceramics.
Change of inner electrode material (ink material). Valid in case of multilayer structures only.
e.g. change of coatinge.g. change of additives in an insulation.
Change of lead or outer termination. Change of lead (finish) material, termination material or attachment material.
Change to a new or additional material supplier at component manufacturer.
e.g. change of termination layer thicknesse.g. change in termination dimensions
e.g. change from soldered connection to welded connection
Change of appearance.Note: Marking on device is defined as seperate change (PAS-FLM-PV-02).
e.g. change or adding of colour on componentMainly in combination with other changes!
Change of electrode layer thickness or geometry. For multi-layer technology only. e.g. change of electrode design
Change of ceramic layer thickness. For multi-layer technology only.
P see also layer thickness
P e.g. stamp press to isostatic press
P Change of firing / sintering profile
P Change of dicing / slicing e.g. change from cutting to sawing
P
P e.g. change of inner electrode lay down method.
P
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
P Change of drypack requirements.
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
P e. g. change from wet to dry technology.
Change of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-NTC-DE-06.
Change of lamination / press technique technology
e.g. temperature and / or time and / or atmosphere. e.g. from tunnel to batch kiln.
Change for termination preparation like plating or apply of termination base layer.
e.g. change in plating technology (final termination)e.g. change from dip in paste to platimg (apply)
Change of electrode apply. For multi layer technology only.
Change in assembly process for leaded or encapsulated devices.
e.g. soldering method for lead attach to element or coating / encapsulation process
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
P e.g. elimination of manual handling processes
P e.g. change of tester platform
P
P
P Change of test coverage.
P Not relevant for technical evaluation.
P
P e.g. tighten of electrical parameter distribution
P
P e.g. adding new (tested) parameter.
P
P Change of ceramic composition e.g. changes in additives amount
PCN required for dedicated equipment for sensitive component production.
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
Technical interface means component terminals.See processability on board level.
Change of application relevant information Not included: Editorial changes.
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
Change of Binder Material to bind ceramics.
P Change of polymer composition
P Change of encapsulation material.
P e.g. change from SnPb to pure Sn
P e.g. for 2nd source purpose
P Change of lead diameter e.g. change lead diameter from 0.5 to 0.4 mm
P Change of termination area
P Change of inner connection
P
P
P e.g. change from 1.5µm into 1.0µm
P see also layer thickness
P e.g. stamp press to isostatic press
P Change of firing / sintering profile
P Change of dicing / slicing e.g. change from cutting to sawing
P
P e.g. change of inner electrode lay down method.
P
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
e.g. change of coatinge.g. change of additives in an insulation.
Change of lead (finish) material, termination material or attachment material.
Change to a new or additional material supplier at component manufacturer.
e.g. change of termination layer thicknesse.g. change in termination dimensions
e.g. change from soldered connection to welded connection
Change of appearance.Note: Marking on device is defined as seperate change (PAS-PTC-PV-02).
e.g. change or adding of colour on componentMainly in combination with other changes!
Change of electrode layer thickness or geometry. e.g. change of electrode design
Change of ceramic layer thickness. For multi-layer technology only.
Change of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-PTC-DE-06.
Change of lamination / press technique technology
e.g. temperature and / or time and / or atmosphere. e.g. from tunnel to batch kiln.
Change for termination preparation like plating or apply of termination base layer.
e.g. change in plating technology (final termination)e.g. change from dip in paste to platimg (apply)
Change of electrode apply. For multi layer technology only.
Change in assembly process for leaded or encapsulated devices.
e.g. soldering method for lead attach to element or coating / encapsulation process
P Change of drypack requirements.
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
P e. g. change from wet to dry technology.
P e.g. elimination of manual handling processes
P e.g. change of tester platform
P
P
P Change of test coverage.
P Not relevant for technical evaluation.
P
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
PCN required for dedicated equipment for sensitive component production.
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
Technical interface means component terminals.See processability on board level.
P e.g. tighten of electrical parameter distribution
P
P e.g. adding new (tested) parameter.
P
P Change of ceramic composition e.g. changes in additives amount
P e.g. change from AgPt material to AgPd material
P Change of encapsulation material.
P e.g. change from SnPb to pure Sn
P e.g. for 2nd source purpose
P Change of lead diameter e.g. change lead diameter from 0.8 to 0.6 mm
P Change of termination area
P Change of inner connection
P
P
P e.g. change from 1.5µm into 1.0µm
Change of application relevant information Not included: Editorial changes.
No technical change of the product, only correction in description (wording, drawing, …)(I): In case of editorial changes.(P): In case of impact on product integrity.
e.g. data sheet correction because of new information about component behavior
Description of a new not previously covered parameter. No technical change of the product.(I): no influence(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)
Change of Binder Material to bind ceramics.
Change of inner electrode material. Valid in case of multilayer structures only.
e.g. change of coatinge.g. change of additives in an insulation.
Change of lead (finish) material, termination material or attachment material.
Change to a new or additional material supplier at component manufacturer.
e.g. change of termination layer thicknesse.g. change in termination dimensions
e.g. change from soldered connection to welded connection
Change of appearance.Note: Marking on device is defined as seperate change (PAS-VDR-PV-02).
e.g. change or adding of colour on componentMainly in combination with other changes!
Change of electrode layer thickness or geometry. e.g. change of electrode design
Change of ceramic layer thickness. For multi-layer technology only.
P see also layer thickness
P e. g. change of grain size.
P e.g. change of grain boundary size.
P e.g. pressures or temperature
P Change of firing / sintering profile
P Change of dicing e.g. change from cutting to sawing
P
P e.g. change of inner electrode lay down method.
P
P Variation within process specification. e.g. process control
P Change of packing specification. e.g. number of pieces on reel.
P Change of drypack requirements.
P Change of carrier
P Change of labelling, also on reel.
P Marking on device.
P
Change of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-VDR-DE-06.
Change of grain size. Grain size is a result of process and / or material change.
Change of grain boundary size. Grain boundary size is a result of process and / or material change.
Change of lamination / press technique method
e.g. temperature and / or time and / or atmosphere. e.g. from tunnel to batch kiln.
Change for termination preparation like plating or apply of termination base layer.
e.g. change in plating technology (final termination)e.g. change from dip in paste to platimg (apply)
Change of electrode apply. For multi layer technology only.
Change in assembly process for leaded or encapsulated devices.
e.g. soldering method for lead attach to element or coating / encapsulation process
e.g. change of MSLe.g. change in dry pack assurance (HIC, MBB)
e.g. change by materiale.g. change by geometry.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change of content of markinge.g. change of method of markinge.g. change of appearance of marking
Change in packing specification which does not described a change of dimensions or material of the packing.
e.g. change of documentation in packing specification
P e. g. change from wet to dry technology.
P e.g. elimination of manual handling processes
P e.g. change of tester platform
P
P
P Change of test coverage.
Tests, which should be considered for the appropriate process change.
Tests, which should be considered for the appropriate process change after selection of condition table.
Suppliers performed tests (mark with an 'X' for done or 'G' for generic)
Reason for exception of tests:
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
PCN required for dedicated equipment for sensitive component production.
Change of final test equipment which use different technology.PCN required for dedicated equipment for sensitive parameters.
Change of manufacturing site.Note: Reorganization inside one plant/site is not affected!
Movement or transfer of manufacturing site or process step(s) to a different location/site.
Change of manufacturing process sequence.
e.g. washing / cleaning processe.g. change of order of processes
e.g. change from 100% to sample inspectione.g. test flow block, reduction from three to two temperature measurementse.g. change in burn in/run in process.
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.
Device evaluationMATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Rev.D)
Further applicable conditionsA
EC-Q
200
Rev
isio
n D
Hig
h Te
mp
Exp
osur
e (S
tora
ge)
3
* - - - -
B - - - -
A - - - -
Eval
uatio
n le
vel
A /
B /
C
Line
eva
luat
ion
(can
be
eval
uate
d by
dat
a or
aud
it/on
site
che
ck)
Che
ck o
f spe
cific
atio
n (fo
r raw
mat
eria
l onl
y)
A: A
pplic
atio
n le
vel
B: B
oard
leve
l C
: Com
pone
nt le
vel
*:
Not
rele
vant
for q
ualif
icat
ion
mat
rix
Risk assessment depending on change for each application.
A - - - -
A - - - -
C - ● ● ●
B - ● ● ●
B - ● ● ●
C - ● ● ●
C - ● ● -
C - ● ● -
B - ● - ●C - ● - ●
C ● ● - -
C ● ● - ●C ● ● - -B ● ● - -B ● ● - -B ● ● - -B ● ● - ●C - - - -
B - - - -
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● ● - -
C ● ● - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
* - - - -
B - - - -
A - - - -
A - - - -
A - - - -
B - ● ● ●
A - ● ● ●
C - ● ● ●
B - ● - -
B - ● ● ●
B - ● ● -
B - ● ● ●
C - ● ● -
C - ● ● -
C - - ● -
Risk assessment depending on change for each application.
A: If influence on other connections on PCB or laquer expected.
B - ● - -
A - ● - -
B - ● - -
A - ● - -
C - ● - ●
B - ● - -
C - - - -
B ● ● - -
B ● ● - -
C ● ● - -
B ● ● - -B ● ● - ●
B ● ● - -B ● ● - ●C ● ● - ●C - - - -C ● - - -
B - - - -
If data sheet is affected (PAS-IND-DS-01)
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● - - -
C ● - - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
C - ● - -
* - - - -
B - - - -
A - - - -
A - - - -
A - - - -
C - ● ● -C - ● ● -C - ● ● ●C - ● ● ●
C - ● ● ●
C - ● ● -
C - ● ● -
C - ● ● ●
B - ● - -
B - ● - ●
B - ● - ●C - ● - ●C - ● - ●
C - ● - -
C ● ● - ●C ● ● - C
Risk assessment depending on change for each application.
C ● ● - -C ● ● - -
C ● ● - -
C ● ● - -
B ● ● - ●
C - - - -
B - - - -
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● ● - -
C ● ● - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
* - - - -B - - - -
A - - - -
A - - - -
A - - - -
C - ● ● ●
B - ● ● -
B - ● ● -
C - ● ● -
C - ● ● -C - ● ● -
Risk assessment depending on change for each application.
A: in combination with PAS-FLM-DS-01 or if change of sealing compound with effect to mechanical properties.
Check if PAS-FLM-DS-01 affected
B: for naked SMD
B: for naked SMD
C - ● ● ●
B - ● - -
B - ● - -
C - ● - -
B - ● - -
C - ● - -
C - ● - -
B - ● - -
C ● ● - ●
C ● ● - -
C ● ● - ●
C - - - -
B - - - -
B - - - -
B - - - -
Check if other PAS-FLM-MA is affected
Check if MATERIAL is affected.
Check if PAS-FLM-DS-01 affected
B: for naked SMD
B - - - -
B - - - -
* - - - -
C ● ● - -
C ● ● - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
* - - - -B - - - -
A - - - -Risk assessment depending on change for each application.
A - - - -
A - - - -
A - ● ● ●
A - ● ● -
B - ● ● -
B - ● ● ●
A - ● ● ●
C - ● ● ●
B - ● ● ●
C - ● ● ●
C - ● ● ●
B - ● ● ●
B - ● ● -
C - - - -
B - ● - ●
B - ● - -
A - ● - ●
B - ● - ●
B - ● - ●
C - ● - -
C - ● - ●
C ● ● - -C ● ● - -
C ● ● - -
C ● ● - -
C ● ● - ●
C ● ● - ●
C ● ● - ●
B ● ● - -
C ● ● - ●C - - - -
B - - - -
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● - - -
C ● - - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
* - - - -B - - - -
A - - - -
A - - - -
A - - - -
C - ● ● -
C - ● ● -
C - ● ● ●
B - ● ● -
C - ● ● -
C - ● ● ●
C - ● ● -B ● ● -
C - ● ● ●
B - ● - -
B - ● - -
Risk assessment depending on change for each application.
B: only if a cap holder holds the Capacitor body by pressing.
B: in case of external surface of sealing is changed.Evaluation only, if capacitor is gluedB: Only for glued capacitors.
A: Only if impedance increase (delta characterization). Check if datasheet is affected (PAS-ALU-DS-01).A: Only if impedance increase (delta characterization). Check if datasheet is affected (PAS-ALU-DS-01).
B - ● - -
A - ● - -
C - ● - -C - ● - -C - ● - -C - ● - -C - ● - ●
C - ● - ●
C ● ● - -
B ● ● - -
C ● ● - ●
C ● ● - -
C ● ● - -
B ● ● - -
B ● ● - -
C - - - -
B - - - -
B - - - -
B - - - -
B - - - -
A: only for HV application
B - - - -
* - - - -
C ● ● - -
C ● ● - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
C - - - -
* - - - -B - - - -
A - - - -Risk assessment depending on change for each application.
A - - - -
A - - - -
C - ● ● -
C - ● ● -
C - ● ● ●
B - ● ● ●
B - ● ● -
C - ● ● -
B - ● - -
B - ● - -
C - ● - -
B - ● - -
C - ● - -
C - ● - -
A: Risk assessment on application level, if interaction with other material expected.
Risk assessment needed to evaluate compatibility of soldering process.
C - ● - -
C ● ● - -
C ● ● - -
C ● ● - ●
B ● ● - -
C ● ● - ●
B ● ● - ●
C - - - -
B - - - -
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● - - -
C ● - - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
* - - - -
B - - - -
A - - - -
A - - - -
A - - - -
C - ● ● -
C - ● ● -
Risk assessment depending on change for each application.
C - - ● -
B - ● ● ●
B - ● ● -
C - ● ● -
B - ● - -
B - ● - -
C - ● - -
B - ● - -
C - ● - -
C - ● - -
C - ● - -
C ● ● - -
C ● ● - -
C ● ● - ●
B ● ● - -
C ● ● - ●
B ● ● - ●
C - - - -
B - - - -
A: Risk assessment on application level, if interaction with other material expected.
Risk assessment needed to evaluate compatibility of soldering process.
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● - - -
C ● - - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
* - - - -B - - - -
A - - - -
A - - - -
A - - - -
C - ● ● -
C - ● ● -
C - ● ● ●
B - ● ● ●
B - ● ● -
C - ● ● ●
B - ● - -
B - ● - -
C - ● - -
B - ● - -
C - ● - -
C - ● - -
Risk assessment depending on change for each application.
A: Risk assessment on application level, if interaction with other material expected.
Risk assessment needed to evaluate compatibility of soldering process.
C - ● - -
C - ● - -
C - ● - -
C ● ● - -
C ● ● - ●
C ● ● - ●
B ● ● - ●
C ● ● - ●
B ● ● - ●
C - - - -
B - - - -
B - - - -
B - - - -
B - - - -
B - - - -
* - - - -
C ● ● - -
C ● ● - -
C ● - - -
B ● ● - ●
C ● - - -
C - - - -
- - - -
- - - -
Device evaluationMATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Rev.D)
Tem
pera
ture
Cyc
ling
Des
truct
ive
Phy
sica
l Ana
lysi
s
Moi
stur
e R
esis
tanc
e
Bia
sed
Hum
idity
Ope
ratio
nal L
ife
Ext
erna
l Vis
ual
Phy
sica
l Dim
ensi
on
Term
inal
Stre
ngth
(Lea
ded)
Res
ista
nce
to S
olve
nts
4 5 6 7 8 9 10 11 12
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - ● - - W -
● - - - ● - - W -
● - ● ● - ● ● ● ●
● - ● ● ● - - - ●
● - ● ● ● - - ● -
● - ● - - - ● ● ●
● - ● ● - ● ● ● ●● - ● ● ● - - - ●
● - - - ● - - R -
● - - - ● - - R -- - - ● ● - - - -- - - ● - ● ● ● -
- - - ● - - - ● -
- - - - - ● - - ●● - ● ● - ● ● ● ●- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● - ● - - - -
● - ● - ● - - - -
- - - - - - - - -
● - ● ● ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - ● ● ● ● - -
● - - - ● ● - - -
● - - ● ● ● - - ●
- - - - ● ● - ● -
● - ● ● ● ● - - ●
● - - - - ● - ● -
- - ● ● ● ● - - -
● - - ● - ● - - -
● - ● ● - ● ● ● -
● - - ● - ● ● - -
● - - - - ● ● - -
- - - - - ● ● ● -
● - ● ● - ● ● - ●
● - - - - ● ● - -
- - - ● ● ● ● - ●
● - - - - ● ● - -
● - - - - ● ● - -
- - ● - - ● - - ●
● - - - - ● - ● -
● - ● ● - ● - ● -
- - - - - ● - - ●
● - - ● ● ● ● - ●
● - - - - ● - ● -
- - - ● ● ● - - ●
- - ● - ● ● - - -
- - - - - - - - -
● - - ● - ● ● - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● ● - - ● -
- - - - - - - - -
- - - - - - - - -
- - - - - ● ● - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - - - - - - -● ● - - - - - - -● ● - ● ● - - ● ●● - - - ● - - - -
● ● - ● ● - - ● ●
● - ● ● - ● ● - ●
● ● - - ● ● - ● -
● ● ● ● ● - - ● ●
● - ● ● ● ● ● ● -
- - ● - - ● ● - -
● ● ● ● ● - - ● -● ● - - ● - ● - -● ● - ● ● - ● ● -
C C - C C - C - -
● - ● ● - ● ● - ●- - - C - - - - -
● ● - - ● - - - -- ● - ● - - - - -
● - - ● - - - - -
- - - - C - - - -
● ● ● ● ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● ● - ● A -
● - ● ● ● - ● A -
- - - - - - - - -
● ● ● ● ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● ● ● ● ● ●
● - - ● ● ● ● ● ●
- - ● - - - ● ● -
● - ● - ● - - ● -
● - - ● ● ● ● - -● - - ● ● ● - - -
● - ● - ● - - ● ●
● - - - - ● ● ● -
● - - - - - - - -
● - - - ● ● - ● -
- - - - - - - - -
● - - ● ● - - - -
● - - - ● - - - -
● - ● - - ● ● - ●
● - - ● ● ● - - ●
● - ● - ● - - ● ●
- - - ● ● - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● ● ● ● ● -
● - ● ● ● ● ● ● -
- - - - - - - - -
● - ● ● ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - ● - - - -
● - ● ● - ● ● - ●
● - - - - ● ● ● ●
● ● ● ● ● ● - ● ●
● - ● ● ● ● ● - ●
● - Y Y ● - - - -
● ● ● ● ● ● ● - ●
● - Y ● - ● - - ●
● - Y Y ● - - - Y
● ● ● - ● ● ● - ●
- - - - - ● - - ●
- - - - - - - - -
● - ● ● - ● ● ● ●
● - - - - ● ● ● -
● ● ● ● - ● ● - ●
● ● ● ● ● ● ● ● ●
● ● ● - ● ● ● - ●
● - - - ● - - - -
● - Y Y ● - - - -
● - - - ● - - - -
- - - - - - - - -
● - - - ● - - - -
- - - - - - - - -
● ● Y Y ● - - - -
● ● Y ● ● ● ● - -
● ● ● ● ● ● ● ● -
- - - - - ● - - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● - - - ● - -
● - ● ● ● ● ● - ●
● - ● ● ● ● ● - ●
- - - - - - - ● -
● - - - ● - - - -
● - - - ● - - - -
● - - - ● - - - -● - - - - - - - -
● - ● ● - - - ● ●
- - - - - - - ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - ● - -
● - - - ● - - - -● - - - ● - - - -● - - - ● - - - -
● - - - - - - ● -
- ● - - - - - - -
● - - - ● - - - -
● - - - - - - ● -
● - - - ● - - - -
● - - - ● - - - -
● - - - - - ● - -
- - - - - - - - -
- - - - - - ● - -
- - - - - - ● - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - ● - ● ● -
● - - - ● - ● ● -
- - - - - - - - -
● ● ● ● ● ● ● ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - ● ● - - - -
● - ● - - - - - -
- - ● ● ● - - ● -
● - ● - ● - - ● ●
- - ● - - ● ● ● -
- - ● - - ● ● - -
- - ● ● ● - - ● -
- - - - - ● - - -
● ● - - - - ● - -
● ● - - - - ● - -
● ● - - - - ● - -
- ● - ● - - - - -
● ● - - ● - ● - -
● - ● ● - ● ● - ●
- - ● ● ● - - ● -
- - - ● - - - - -
● - - - - ● ● - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● - ● ● ● ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● - - - - - -
- - ● ● ● - - ● -
● - ● - ● - - ● ●
- - ● - - ● ● ● -
- - ● - - ● ● - -
- - ● ● ● - - ● -
- - - - - ● - - -
● ● - - - - ● - -
● ● - - - - ● - -
● ● - - - - ● - -
- ● - ● - - - - -
● ● - - ● - ● - -
● - ● ● - ● ● - ●
- - ● ● ● - - ● -
- - - ● - - - - -
● - - - - ● ● - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● - ● ● ● ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - ● ● - - - -
● - ● - - - - - -
- - ● ● ● - - ● -
● - ● - ● - - ● -
- - ● - - ● ● ● -
- - ● - - ● ● - -
- - ● ● ● - - ● -
- - - - - ● - - -
● ● ● - ● - ● - -
● ● ● - ● - ● - -
● ● ● - ● - ● - -
- - - - ● - - - -
- - ● - ● - - - -
- ● - ● - - - - -
● ● ● - ● - ● - -
● - ● ● - ● ● - ●
● - - - ● - ● ● -
- - - ● - - - - -
● - - - - ● ● - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● - ● - - ● -
● - ● - ● - - ● -
- - - - - - - - -
● - ● ● ● ● ● ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
Device evaluationMATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Rev.D)
Mec
hani
cal S
hock
Vib
ratio
n
Res
ista
nce
to S
olde
ring
Hea
t
Ther
mal
Sho
ck
Ele
ctro
stat
ic D
isch
arge
(ES
D)
Sol
dera
bilit
y
Ele
ctric
al C
hara
cter
izat
ion
Flam
mab
ility
Boa
rd F
lex
13 14 15 16 17 18 19 20 21
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - ● F - B - ●
- - - ● F - B - ●
- ● - ● ● - - ● ●
- - - ● - - - ● -
- - ● ● - ● B - ●
- - ● ● ● - B ● -
- ● ● ● ● ● - ● ●- - - ● - - - ● -
- - - - - - B - -
- - - ● - - B - R- - - - - - B - -- - - - - ● B - -
● - ● - - - B - -
- - - - - - - - -- ● - ● ● - - ● ●- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - ● ● - B - -
- - - ● ● - B - -
- - - - - - B - -
- - ● ● ● - B - ●
- - - - - - B - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - ● - - - ● -
● - - ● - - B ● -
- - ● ● A - B ● -
- ● ● - - ● - - ●
● - - ● - - B ● -
● ● ● ● - ● - - ●
- - - - A - B - ●
- ● ● - - ● B - -
- - - ● - - B - -
- ● ● - - ● B - -
● - - ● ● - B - -
- ● ● - ● ● - - ●
● - - ● - - B - -
● ● - ● - - B - -
- - ● - A - B - -
- ● - ● - - B - ●
- ● ● - - - B - -
- - ● - - ● - - -
- ● ● ● - ● - - ●
● ● A ● - ● - - -
- - - - - - - - -
● - - ● - - B ● -
- ● - ● - ● - - ●
- - ● - A - B - -
- - - - - - B - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - B - -
- - ● ● - - B - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- ● - ● - - - - -- ● - ● - - - - -● ● - ● ● - B - C- - C ● - - B - C
- ● - ● ● - B - -
- - - - - - - - -
- ● ● - - ● B - -
● ● ● ● ● ● B - ●
- ● - - - - - - -
- ● - - - - - - ●
● ● ● - - - B - ●● ● - ● ● - B - -● - - ● ● - B - -
C - - C C - B,C - -
● - - - - - B - -- - C C C - B,C - C
- - - ● ● - B - -- - ● ● - B - ●
- - ● - ● - B - ●
C - - - C - B,C - -
● ● ● - - ● B - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- ● - - ● ● B - -
- ● - - ● ● B - -
- - - - - - B - -
● ● ● ● ● ● B ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - - - - - ● -
● ● - - - ● - ● -
● - ● - - ● B - ●
● ● - - - ● - - -
- - ● - - - ● - -- - - - - - ● - -
- ● ● ● - ● - ● -
● ● - - - - ● - ●
- - - - - ● - - ●
● ● ● - - - ● - ●
- - - - - - - - -
- - - - ● - B - -
- - - - ● - B - -
● ● - - - - - ● -
- - - - - - - - -
- - - - - - B - ●
- - - - ● - B - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - ● ● - B - -
- - - ● ● - B - -
- - - - - - B - -
● ● ● ● ● ● B ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - ● - - B - ●
● ● ● ● - - - ● ●
- ● ● - - ● B - ●
● ● ● ● - - B - ●
● ● ● ● - - B - ●
● ● ● ● - - B - ●
● ● ● ● - - B ● ●
● ● ● ● - - B ● ●
- ● ● ● - - B - -
- ● ● ● - - B ● ●
- - ● - - - - - -
- - - - - - - - -
● ● ● ● - - - ● ●
● ● ● - - ● B - ●
● ● ● ● - - B - ●
● ● ● ● - - B ● ●
- ● ● ● - - B - ●
● ● - ● - - B - ●
● ● ● ● - - B - ●
● ● - ● - - B - ●
- ● - ● - - B - -
- ● - ● - - B - ●
● ● - ● - - B - ●
● ● - ● - - B - ●
● ● - ● - - B - ●
● ● - ● - - B ● ●
- - - - - - - - -
● ● - ● - - B - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - B - -
● ● ● ● - ● B ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - - - - - ● -
- ● S - - - - ● -
- - S - - - - ● -
- ● ● - - ● B - ●
- - - - ● - B - -
- - - - ● - B - -
- ● - - - - - - -- ● ● - - - - - -
● ● ● - - ● B ● ●
- ● - - - - - - ●
- - - - - ● - - -
- - - - - - - - -
- ● - - - - - - -
- ● - - ● - B - -- ● - - ● - B - -- - - - ● - B - -
● ● ● - - - B - ●
- ● - - - - - - -
- - - - - - B - -
● ● ● - - - B - ●
- ● - - - B - -
- - - - ● - B - -
- ● - - - - - - -
- - - - - - B - -
- - - - - - - - -
- ● - - - ● - - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● ● - - ● - B - -
● ● - - ● - B - -
- - - - - - B - -
● ● ● - ● ● B ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● - - - - -
● - ● ● - ● B ● S
- - - - ● - B - -
- - ● ● - - B ● -
● - - - ● ● B - ●
- - ● ● - ● B ● ●
- - - - - - B - ●
- - - - - ● B - ●
● - - - ● ● B - ●
- - - - - - - - -
- - ● ● - - - - ●
- - ● ● - - - - ●
- - ● ● - - - - ●
- - ● ● - - B - ●
- - - ● ● - B - -
● - - - - - B - -
● - - - ● ● B - ●
- - ● ● ● - B - ●
- ● ● - - ● - ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - B - -
● ● ● ● ● ● B ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● - - - - -
● - ● ● - ● B ● S
- - - - - - - - -
- - ● ● - - B ● -
● - - - ● ● B - ●
- - ● ● - ● B ● ●
- - - - - - B - ●
- - - - - ● B - ●
● - - - ● ● B - ●
- - - - - - - - -
- - ● ● - - - - ●
- - ● ● - - - - ●
- - ● ● - - - - ●
- - ● ● - - B - ●
- - - ● ● - B - -
● - - - - - B - -
● - - - ● ● B - ●
- - ● ● ● - B - ●
- ● ● - - ● - ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - B - -
● ● ● ● ● ● B ● ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - ● ● - - - - -
● - ● ● - ● B ● S
- - - - ● - B - -
- - ● ● - - B ● -
● - - - ● ● B - ●
- ● ● - ● ● B - ●
- - - - - - B - ●
- - - - - ● B - ●
● - - - ● ● B - ●
- - - - - - - - -
- - ● ● - - B - ●
- - ● ● - - B - ●
- ● ● ● - - - - ●
- - - - - - B - -
- - - - ● - B - -
- - ● ● - - B - ●
- - - ● ● - B - -
● - - ● - - B - ●
- ● ● ● - - B - ●
- - ● ● ● - B - ●
- ● ● - - ● - ● -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- ● - - ● - B - -
- ● - - ● - B - -
- - - - - - B - -
● ● ● ● ● ● B - ●
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
Device evaluationMATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Rev.D)
Term
inal
Stre
ngth
(SM
D)
Bea
m L
oad
Test
Flam
e R
etar
danc
e
Rot
atio
n Li
fe
Sur
ge V
olta
ge
Sal
t Spr
ay
Ele
ctric
al T
rans
ient
Con
duct
ion
She
ar S
treng
th
Faul
t Cur
rent
Dur
abili
ty22 23 24 25 27 29 30 31 32
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - R - - - - - -
● - R - - - - - -
● - R - - - - - -
- - R - - N - - -
● - - - - - - - -
- - R - - N - - -
● - R - - - - - -- - R - - N - - -
- - - - - - - - -
R - R - - - - - -- - - - - - - - -- - - - - N - - -
- - - - - N - - -
- - - - - - - - -● - R - - - - - -- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - R - - N - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - - - - - -
- - - - - - - - -
● - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -- - - - - - - - -- ● - - - - - - -● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
● C - - - - - - -
- - - - - - - - -
● - - - - - - - -
● - - - - - - - -- - - - - - - - -- C - - - - - - -
- C - - - - - - -
- C - - - - - - -- - - - - - - - -
- C - - - - - - -- C - - - - - - -
- - - - - - - - -
- C - - - - - - -
● - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- - - - - - - - -
- C - - - - - - -
- C - - - - - - -
- - - - - - - - -
● C - - - - - - -
- - - - - - - - -
- - - - - - - - -
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Device evaluationMATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Rev.D)
End
-of-L
ife M
ode
Ver
ifica
tion
Jum
p S
tart
End
uran
ce
Load
Dum
p E
ndur
ance
Remarks
33 34 35
- - - - -
- - - ● -
- - - - -
additional to AEC-Q200
Whi
sker
Tes
t(IE
C 6
0068
-T2-
82, J
ED
EC
JE
SD
201)
Par
amet
er-A
naly
sis:
C
ompa
rison
of c
urre
nt w
ith c
hang
ed d
evic
ech
arac
teriz
atio
n, e
lect
rical
dis
tribu
tion
- - - - -
- - - - -
- - - - ●
- - - - ●
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- - - - ●
- - - - ●
- - - - -- - - - -
- - - - ●
- - - - ●- - - - ●- - - - ●- - - - ●- - - - -- - - - -- - - - -
Check whether AOI at tier 1 can be affected.
Assumption material specification remains unchanged. Otherwise see change of material.
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - -
- - - - -
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
- - - ● -
- - - - -
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- - - - ●
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- - - - ●
- - - - ●
- - - - ●
Electrical function affected if mechanical stress distribution changes. AOI, wave soldering and board coating has to be assessed. MSL might change.
Considere in case of core-core glue the air gap.
Assumption material specification remains unchanged. Otherwise see change of material.
- - - - ●
- - - ● ●
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- - - - ●
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- - - - ●
- - - - ●
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- - - ● -
- - - ● - Increase of contact resistance.
- - - - -- - - - -- - - - -- - - - -- - - - ●- - - - -- - - - -
- - - - -
Effect regarding EMC relevant for high frequency only.
Parameter Analysis only for components where mold material has magnetic function
Mechanical damage of wire,impact on solderability in case of stripping process is affecting soldering area.
Influence regarding reliability of solder joint.
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- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - ●
- - - - -
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Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
Characterisation depends on impact of final test flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
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Check whether AOI at Tier 1 can be affected
Assumption material specification remains unchanged. Otherwise see change of material.
- - - - -- - - - -
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- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
- - - - ●
- - - - -
- - - - -- - - ● -
- - - - -
- - - - -
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- - - - - Consider vibration in application
- - - - - Consider AOI and processability
- - - ● -
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- - - - ●- - - - ●
Characterisation depends on impact of production flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
Change of base material: Consider ESR, high frequency parameter
Consider ESR.Solderability Test for naked SMD components.
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Assumption material specification remains unchanged. Otherwise see change of material.
Consider ESR.Solderability Test for naked SMD components.
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- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - -
- - - - -- - - ● -
- - -
Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -- - - - -
- - - - -
- - - - -
- - - - -
- - - - - Impedance my be influenced.
- - - - -
- - - - -
- - - - - AOI check necessary!
- - - - -
C0 may be influencedTemperature expansion coefficient may change
X-Ray inspection may be influenced when sealing is containing Pb
Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed.
Assumption material specification remains unchanged. Otherwise see change of material.
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- - - - -
- - - - -
- - - - -
- - - - -
- - - - -- - - - -
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- - - - -
- - - - -
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- - - - - AOI check necessary!
- - - - -- - - - -
- - - - -
- - - - -
C0 may be influencedReliabiliy of solder joints may be affected
Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed.
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - -
- - - - -- - - ● -
Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - ● -
- - - - ●
- - - - ●
- - - - -- - - - -
- - - - ●
- - - - -- - - ● -
Biased Humidity test can be done without applying voltage.
Test effort depends on final risk assessment.Performance test according to affected material.Assumption material specification remains unchanged. Otherwise see change of material.
- - - - -
- - - - -
- - - - ●- - - - -- - - - ●- - - - -- - - -- - - - ●
- - - - -
- - - - ●- - - - ●
- - - - - R: Depends on process change
- - - - ● R: Depends on process change
- - - - - Solderability may be influenced
- - - - - Solderability may be influenced
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
Terminal Strength (11) not for axial components without paddle tabs.
Terminal Strength (11) and Vibration (14) not for axial components without paddle tabs.
Surge voltage test for high voltage components only.
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - ●
- - - - -
- - - - -- - - ● -
- - - - -
Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
Characterisation depends on impact of final test flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ● SMD components only!
- - - - ●
- - - - -
- - - - -
- - - - -
Parameter analyse only necessary if an anticipated impact on electrical performance.S = SMD device only
Parameter analyse only necessary if an anticipated impact on electrical performance.
Assumption material specification remains unchanged. Otherwise see change of material.
- - - - -
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●Test effort depends on final risk assessment.Performance test according to affected process change.
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - ●
- - - - -
- - - ● -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
Characterisation depends on impact of test coverage.R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
Parameter analyse only necessary if an anticipated impact on electrical performance.S = SMD device only
- - - - -
- - - - ●
- - - -
- - - - ●
- - - - ●
- - - - ● SMD components only!
- - - - ●
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - -
- - - - -
- - - - -
Parameter analyse only necessary if an anticipated impact on electrical performance.
Assumption material specification remains unchanged. Otherwise see change of material.
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - ●
- - - - -- - - ● -
Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
Characterisation depends on impact of test coverage.R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ●
- - - -
- - - - ●
- - - - ●
- - - - ● SMD components only!
- - - - ●
- - - - -
- - - - ●
- - - - ●
Assumption material specification remains unchanged. Otherwise see change of material.
- - - - -
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - ●
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - -
- - - - ●
- - - - ●
- - - - ● Gage R&R / delta correlation
- - - ● ●
- - - - ●
- - - - -
- - - - -
- - - - -
Test effort depends on final risk assessment.Performance test according to affected process change.
Test effort depends on final risk assessment.Performance test according to affected process change.
Characterisation depends on impact of production flow.
R (electr. funct.): test coverage.R (reliability) only for change in burn in process.
ID
LED-AN-01
LED-AN-02
y1
LED-DS-01
LED-DS-02
Mark change with an "x"
LED-DS-03
y1
LED-DE-01
LED-DE-02
LED-DE-03
LED-DE-04
LED-DE-05
y1
LED-PW-01
LED-PW-02
LED-PW-03
LED-PW-04
LED-PW-05
LED-PW-13
y1
LED-BD-01
LED-BD-02
LED-BD-03
LED-BD-04
LED-BD-05
y1
LED-PA-01
LED-PA-02
LED-PW-06(former LED-PW-
07)
LED-PW-07(former LED-PW-
08)
LED-PW-08(former LED-PW-
09)
LED-PW-09(former LED-PW-
10)
LED-PW-10(former LED-PW-
11)
LED-PW-11(former LED-PW-
12)
LED-PW-12(former LED-PW-
06)
LED-PA-03
LED-PA-04
LED-PA-05
LED-PA-06
LED-PA-07
LED-PA-08
LED-PA-09
LED-PA-10
LED-PA-16
LED-PA-11(former LED-PW-
15)
LED-PA-12(former LED-PW-
11)
LED-PA-13(former LED-PW-
12)
LED-PA-14(former LED-PW-
13)
LED-PA-15(former LED-PW-
14)
LED-PA-17
LED-PA-18
y1
LED-PS-01
LED-PS-02
LED-PS-03
LED-PS-04
y1
LED-EQ-01
LED-EQ-02
LED-EQ-03
y1
LED-TF-01
y1
LED-QG-01
Tests, which should be considered for the appropriate process change.
Tests, which should be considered for the appropriate process change after selection of condition table.
Suppliers performed tests (mark with an 'X' for done or 'G' for generic)
Reason for exception of tests:
--IP
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.
ABCDEFHJKLMNOPQRSTUVWYZ12
IEC 60810IEC 60810
Type of change
ANY
Any change with impact on agreed upon contractual agreements
DATA SHEET
Correction of data sheet
Assessment of impact on Supply Chain regarding following aspects - contractual agreements - technical interface of processability/manufacturability of customer - form, fit, function, quality performance, reliability
Any change with impact on processability/manufacturabiliy of customer, which is not covered in the matrix below
Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification
Specification of additional parameters
DESIGN
Design changes in routing/layout.
Die shrink
Design of leadframe
PROCESS - WAFER PRODUCTION
New / change of wafer substrate or carrier material
Wafer diameter
New final wafer thickness
Change of electrically active doping/implantation element
Design changes in epitaxy.
LED package (except leadframe)
Change of stacking
New / change of metallization (specifically chip backside)
Process Integrity: Tuning within specification
Change of material supplier with no impact on agreed specifications
Change of specified wafer process sequence (deletion and/or additional process step)
BARE DIE DELIVERIES
New / change of front side metallization
New / change of backside metallization
Change of wafer setup or number of dies on wafer.
New final wafer thickness
Change in die coating or passivation
PROCESS - ASSEMBLY
Change of leadframe/carrier base material
Change of leadframe/carrier finishing material (internal)
New / change of metallization (specifically chip frontside)
Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)
Change in die coating or passivaton
New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor
Change of lead and heat slug plating material/plating thickness (external)
Bump Material / Metall System (internal)
Die attach material
Change of bond wire material
Die Overcoat / Underfill
Change of mold compound/encapsulation/sealing material
Change of conversion material
Change of direct supplier for converter material
Change of converter process technology
Change of product marking
Change in process technique (e.g., die attach, bonding, moulding, plating, trim and form, …)
Process Integrity: Tuning within specification
Change of direct material supplier with no impact on specification
Change in material for sub-components (excluding LED chip & LED package related items) with impact on agreed specifications
PACKING/SHIPPING
Inner Packing/shipping specification change
Outer Packing/shipping specification change
Change of labelling
Dry pack requirement change
EQUIPMENT
Production from a new equipment/tool which uses a different basic technology
Change in final test equipment type that uses a different technology
TEST FLOW
Q-GATE
Tests, which should be considered for the appropriate process change.
Tests, which should be considered for the appropriate process change after selection of condition table.
Suppliers performed tests (mark with an 'X' for done or 'G' for generic)
Change of specified assembly process sequence (additional and/or deletion of process step)
New assembly location or transfer of assembly to a different not previously released location/site/subcontractor
Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.
Move of all or part of electrical wafer test and/or final test to a different not previously released location/site/subcontractor
Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)
Reason for exception of tests:
Not required.Information Note required.PCN required.
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.
CONDITIONSNot for Ag plated devices applicable (Ag intended to fail for this test)Only if Bondarea/Wirebond is changed/affectedOnly if dopand/implantation material is changedOnly if Dimensions are changingOnly if min/max Values are changingSequence change onlyNon Epoxy Casted Devices onlyOnly for chip technology using wafer bondingNot for Au plated devicesOnly if Leadframe/Substrate Dimensions are changedOnly if metal composition is changed including sequenceOnly for glued chips Only if process is changingOnly if material properties are changedOnly if glue components are changingOnly if marking technology changesOnly if Floor Life is affectedOnly if Board Reliability is affectedOnly if underfill is affectedOnly for non-hermetic devicesOnly if risk of corrosion is increasingOnly for layer technologyOnly if conversion technology changesOnly if data sheet parameters are affectedOnly if outer dimensions are critical=> Please mark 'NO' with 'x', default is 'YES'
Bearbeitet durch / worked on:
No Yes
P P Not relevant for technical evaluation.
P P
P P
I P
Remainingrisks onSupplyChain?
Understanding of LED experts
See processability on board leveltechnical interface means component terminals
Change of application relevant information (e.g. maximum pulse current)Not included: Editorial changes.
Data sheet (editorial changes) has to check if application affectedI: In case of editiorial changesP:In case of impact on product integrity
Changes
rev3 vs. rev2
I P
P P
P P
P P
P P
P P
P P New wafer substrate material.
P P
P P Change in final wafer thickness
P P
Definition of an additional parameter which was not specified before I: if integrity of the device is not affectedP: If there is a risk on supply chain than at least one aditional other change category will apply - LED- DS-02 correction of data sheet
Any device relevant changes in design / layout of epitaxial layersNot included: Changes within design rules and design specification without affecting specified functions, parameters and reliability.
Any change in chip design / layout.Not included: Changes within design rules and design specification without affecting specified functions, parameters and reliability.
Shrink of active area.Not included: sawing street/kerf/scribe line
any change in housing thicknessany change in form or dimensions
any change of leadframe / carrier dimensionsany change of outer dimensions
change of wafer diameter resulting in equipment and process changes
Change in electrically active doping / implantation element resulting in a new technology.
P P change in layer sequence or thickness
P P
P P
-- P
-- P Variation within process specification
-- P
-- P
P P
P P
P P
P P
I P
P P
P P
P P New leadframe/carrier material (new in composition)
P P
Change in metallization of bondpads, material, layer thickness
Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions necessary.
Change from wet to dry etching, change from horizontal to vertical oven for oxidation, change from contact litho into stepper litho, …
Change of wafer supplier. Change of supplier for chemicals needed for wafer production.
Any change which is not covered by another type of change. Risk is to be assessed.
Change in material, thickness, and process for coating and passivation
New wafer propduction location or transfer of wafer production with possible additional changes.
Change in bondpads, material, pad pitch, surface changes, layer thicknessChange of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions.
Needed information for pick & place machine.I: only additional number of chipsP: change in spacing between chips and form of wafer
Changes in final Chip height (including carrier); very rare and usually combined with a material change (change of carrier material)Change in material, thickness, and process for coating and passivation
Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)
P P
P P Stack die or die to substrate
P P
P P Material, wire diameter, change in process technique
P P
-- P
P P
P P Change of material class.
-- P New supplier with same material specification
I P
I P
P P Any change in assembly process technique
-- P Variation within process specification
-- P
Change in material and process technique for final pin termination (e.g. pure tin). Herein package, processability and reliability on board level can be verified by generic data. Classification depends on impact of change.
Change of die attach material (e.g. soft solder, epoxy, etc). Thermal managment must be respected.
Change of sub-component supplier using different technology/materialsNote: Jump start test at OEMs might be necessary
Supporting layers for complex packages like flip chip.--: No change in product integrityP: change can influence the integrity of final product
Change of mold compound, encapsulation, or sealing material might be affected optical function in case of package related effect (e.g. browning). Component assembly and board coating has to be assessed. MSL might be changed.
new technology for converter productionI: no influence on e/o performance of productP: in case of impact on product integrity
Marking on device.I: change in appearance; readability not affectedP: change of content or change of appearance of data matrix code
Change of suppliers e.g. for lead frames, wire material, die attach, electronical components …
I P
P P
P P dimension change of direct product packing
I P
I P
P P Change of dry pack requirements (change in MSL)
P P
-- P
I P
P P Tester transfer or relocation.
-- P
Tests, which should be considered for the appropriate process change after selection of condition table.
Addition or deletion of a process step in assembly process sequence with potentially significant impact on the product performanceI: no influence on product integrityP: influence on product integrity expected
New assembly location, assembly transfer or relocation. Transfer of known technology and equipment.
dimension changes indirect product packingI: small changes in dimension or appearanceP: number of reels in the packing are changing
Change of labelling also on reel.I: additional information no change of previous informationP: change in content of previous information
Change in process technique which is not already covered above.Note: Major changes affecting the product not covered by the table require also a PCN.
PCN required for dedicated equipment for sensitive component production.
Change of tester platform (e.g. major test program changes , new tester interface, …).I: product specification is not affectedP: product specification is affected
Reduction or additional control steps, test coverage within the process flow
Reason for exception of tests:
A letter or "●" indicates that performance of that stress test should be considered for the appropriate process change.
No
am / on:
Examples to explain
*
B
A
e.g.. change of ESD level A
A: A
pplic
atio
n le
vel
B: B
oard
leve
l C
: Com
pone
nt le
vel
* : N
ot re
leva
nt fo
r qua
lific
atio
n m
atrix
Changes
rev3 vs. rev2
I: e.g.: adding new tested parameter C
C
C
Typical shrink of die. A
B
B
C
e.g. 4" to 6" C
e.g. change in final chip/die thickness C
e.g. change from Be to C as dopant C
e.g. change from Double-hetero to Quanten wellse.g. change of barrier thickness
e.g. change in layout of current spreader; thickness of current spreadere.g. reduction of bond pad size
e.g. change of dimensionse.g. change of x, y, or z dimension of the package
e.g. change in leadframe / carrier dimensions in x,y, or z directione.g. change inner design of the leadfeame not affecting the e/o performance & reliability of the device
e.g. different wafer material to currently released material (change from Sapphire to Silicon)
A
e.g. change in bond pad metallization thickness C
e.g. change from Au to Au/Ge C
C
e.g. process control C
e.g. Change of wafer supplier. C
e.g. additional cleaning process in wafer production C
e.g. change from SiO2 to SiN3 C
C
B
e.g. change from Au to Au alloy B
e.g. information change for pick & place machine. B
e.g. change on converter thickness B
e.g. change from SiO2 to SiN3 B
e.g. change from copper alloy to bare copper B
A
e.g. change of isolation layer thickness between n- and p-material
e.g. change from wet etch to dry etche.g. change from laser cutting (sawing) to plasma cutting (sawing)e.g. change from contact litho to stepper litho
e.g. change from Au to Au alloye.g. change in over pad metalization
e.g. change from Ag flash to NiPd protection layere.g. change from Ag spot to Au spot
B
e.g. change to Pb-free material A
e.g. change of Ag glue to Au glue; B
e.g. change from 30µ to 25µ A
A
B
e.g. PPA mold compound A
e.g. change from granats to nitrides C
C
C
e.g. marking of cathode; B
e.g. change die attached from gluing to soldering; B
e.g. process control C
C
e.g. change in heat slug stacke.g. change from Sn into Ni/Pd/Aue.g. change of layer thickness
e.g. using a different ESD-diode in technology and material than previously
P: e.g. change of underfill with change of thermal resistance
e.g. change from volume conversion to layer conversion; e.g. change from stamping to printing of layer
Change of suppliers e.g. for lead frames, wire material, ESD-diode …
e.g. additional or deletion plasma cleaning process C
e.g. Dual source strategy C
e.g. SMT pocket in tape changes B
e.g. pizza box *
B
e.g. change from MSL3 to MSL1 *
B
e.g. change from single site to multi site handler. C
e.g. change in test method from cd to lumen B
Dual source strategy C
C
Tests, which should be considered for the appropriate process change after selection of condition table.
(I) e.g. additional information (RoHS stamp)(P) e.g. change of customer specific information
e.g. change from single wafer to batch process e.g. over pad metalisatione.g. dambar cutting (mechanical to laser cutting)
e.g. test flow block like Final test / final clearance; visual inspection
Reason for exception of tests:
2016-11-24
MATERIAL PERFORMANCE TEST RESULTS (on the basis of IEC 60810)
Further applicable conditionsIE
C 6
0810
Hig
h Te
mpe
ratu
re O
pera
ting
Life
(HTO
L)
Tem
pera
ture
Cyc
ling
HTO
L
TC
- - - - -
- - - - T
- - - E E
- - - - -
Line
eva
luat
ion
(can
be
eval
uate
d by
dat
a or
aud
it/on
site
che
ck)
Check if LED-DS-01 is affectedProcessability should be assessed.
- - - - -
- ● - ● -
- ● - ● ●
- ● - ● ●
- ● - ● ●
- - ● ● ●
- ● ● ● P
● ● ● ● -
- ● - ● ●
- ● C ● -
A: change from Double hetero to Quanten wells --> spectrum is affected
A: change in layout of current spreader --> radiation pattern changes
Check if LED-DS-02 is affected which leads to a change of the elctrooptic parameters or distributions.
Check if LED-DS-02 is affected which leads to a change of the elctrooptic parameters or distributions.
Check if LED-DS-02 is affected which leads to a change of the elctrooptic parameters or distributions.
In case other type of changes are affected i.e equipment/process technology - they need to be identified in addition
Check if LED-DS-02 is affected which leads to a change of the elctrooptic parameters or distributions.
- - - ● F
- ● M ● ●
- ● M ● ●
- ● - - -
- - - - -
- ● - - -
- - - - -
- ● P ● ●
● ● - ● ●
- - M ● ●
- - M ● ●
- - - - -
- - P ● ●
- ● P ● ●
- ● ● P ●
- ● ● P ●
customer application needs to be checked due to potential sytem voltage differences
A: customer application needs to be checked due to potential sytem voltage differences
B: change from CVD dep to sputter dep for backside/frontside metallization.In case of new equipment please check if LED-PA-14 is also affected.
A or B: Impact on other type of changes described under PROCESS - WAFER PRODUCTION and EQUIPMENT categories of this DeQuMa
Check if LED-DS-02 is affected which leads to a change of the elctrooptic parameters or distributions.
Check if LED-DS-01 is also affected.
Check if LED-DS-01 is also affected.
Check if LED-DS-02 is affected which leads to a change of the elctrooptic parameters or distributions.
- - M P ●
- - ● ● ●
- ● ● ● ●
- ● ● ● ●
- - - - -
- ● P ● ●
- ● ● ● -
- ● ● ● Y
- - ● ● P
- ● - ● Y
- - - - O
- ● - - -
- - - - -
- - ● - -
Check if LED-DS-01 is also affected.
Check if LED-DS-01 is also affected.
Check if LED-DS-01 is also affected.
Check if LED-DS-01 is affected for optical/photometric parameters
Check if any change in electro-optical characteristics results in change of data sheet LED-DS-01
A or B: Please check if EQUIPMENT and other type of changes of material (LED-PA-04/05/06/07/08/09/10) are affected
Assumption that change material specification remains unchanged. Otherwise see change of material.
- - - - -
● ● - - -
- - P - -
- - - - -
- - - - -
- - - - -
- ● - - -
- ● - - -
- ● - - -
● - - B ●
- - - - -
Single case assessment necessary to identify possible interactions or risk.
A or B: Impact on other type of changes described under PROCESS ASSEMBLY and EQUIPMENT
Check if LED-DS-01 is also affected.
Check if LED-DS-02 is also affected.
Check if LED-DS-01 is also affected.Corrosion stability should be assessed.
MATERIAL PERFORMANCE TEST RESULTS (on the basis of IEC 60810)
Wet
Hig
h te
mpe
ratu
r Ope
ratin
g Li
fe
Pow
er T
empe
ratu
re C
yclin
g
ES
D C
hara
cter
izat
ion-
Hum
an B
ody
Mod
el
ES
D C
hara
cter
izat
ion-
Mac
hine
Mod
el
Phy
sica
l Dim
ensi
ons
Vib
ratio
n V
aria
ble
Freq
uenc
y
Mec
hani
cal S
hock
Res
ist.
to S
olde
r Hea
t
Sol
dera
bilit
y
Ther
mal
Sho
ck
Hyd
roge
n S
ulph
ide
Pul
se L
ife T
est
Dew
Tes
t
WH
TOL
PTC
ESD
-HB
M
ESD
-MM
PD VVF
MS
RSH
SD TMSK
H2S
PLT
Dew
- - - - - - - - - - - -
- - - - - - - S,T - - - - -
E - E E - - - S - - - E -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
● ● ● ● - - - - - - - ● H
● ● - - - - - ● - B,D,M M ● M
● ● ● ● - - - ● - - - ● -
● ● - - ● ● T - D - D
● ● ● ● ● V V ● T ● - - -
P ● P P - - - ● - P P ● P
● - P P - - - ● - - - ● -
P ● P P - - - - - - - ● -
C C ● ● - - - - - - - ● -
V,L V,L
● ● ● ● - - - - - - - ● F
● ● M,B M,B - - - - - B M ● M
● ● D,M D,M - - - ● - D,M D,M ● D,M
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
● P P P - - - - - - P - P
● - ● ● - - - ● - - - ● -
● ● M,B M,B - - - - - ● ● ● ●
● ● D,M D,M - - - ● - ● ● ● ●
- - - - - - - - - - - - -
P ● P P ● - - ● - - - ● -
● P P P - - - ● - - P - P
● - - - - - - ● ● - A - A
● ● - - - - - ● ● - A - A
K - - - 1 - - ● ● - A - A
● ● - - - - - ● - ● W - W
● ● - - - N N ● - N Q - N
P,D ● - - - D D ● - D P,D ● -
- - - - - - - - - - - - -
P ● - - - - P ● - P P ● -
● ● - - D D D ● T P P P P
● ● - - - Y Y ● - Y P P P
● ● - - - P P ● - P P P P
● ● - - - Y Y ● - Y Z Z Z
- - - - - - - T T - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - P P - - - - T - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - - - - - - - - - - - -
- - ● ● - - - - T - - - -
● B ● ● - - - ● T B - B -
- - - - - - - - - - - - -
MATERIAL PERFORMANCE TEST RESULTS (on the basis of IEC 60810)
Flow
Mix
ed G
as C
oros
ion
Ther
mal
Res
ista
nce
Wire
Bon
d S
treng
th
Wire
Bon
d S
hear
Die
She
ar
Not
es /
Rem
arks
FMG
C
TR WB
S
BS
DS
- - - - - - - -
- - - - - - - -
- E - - - - - E
- - - - - - - -
additional to IEC 60810
- - - - - - - ●
- - - - - - - ●
M - B B D,M - - ●
- ● B B ● - - ●
D L B B D - - ●
- ● B B D - 2 ●
P ● - - ● - - ●
- ● - - - - ●
- ● B B ● - - ●
- ● - - - - - ●
- - - - - - - ●
M - ● ● - - - ●
D,M D,M - - ● - - ●
- - - - - - - -
- - - - - - - _
- - - - - - - -
- - - - - - - -
P - P P - - - ●
- J ● ● ● - - ●
● ● ● ● - - - -
● ● - - ● - - -
- - - - - - - -
- ● B B ● - - ●
P - P P - - - ●
A P,1 ● ● ● - P -
A P,1 ● ● ● - - -
A P,1 - - - - K -
W ● - - ● - - -
Q ● - - ● - - -
P,D - ● ● - - - -
- - - - - - - -
P U - - U - - -
P P - - - - - -
P Y - - - - - ●
P P - - - - - ●
Z Y - - - - - ●
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - -
- - - - - - - ●
- - B B B - - ●
- - - - - - - ●
Remarks
TR might be considered for complex die bond technologies
Formalism since this is not a product change, ony addtional informationClassification: C
Qualification effort depends on type of change.
Qualification effort depends on type of change.
Explanation should be provided in case H2S test is not applicable
Qualification effort depends on type of change.PPAP has to be updated.
customer application needs to be checked due to potential system voltage differences
H2S test should be considered for automotive exterrior applications.explanation should be provided in case H2S test is not applicable
Explanation should be provided in case H2S test is not applicable
Qualification effort depends on type of change.
Qualification effort depends on type of change.
See change of material.
Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended.
Qualification effort depends on type of change.
Qualification effort depends on type of change.
Qualification effort depends on type of change.
Qualification effort depends on type of change.
Gage R&R / delta correlation
Gage R&R / delta correlation; addtional specification checkB should be considered for Wafer testing
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