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Deutsche Bank 2007 Technology ConferenceLondon

Franki D’HooreDirector Investor Relations14 September, 2007

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Safe Harbor

“Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are

subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor

equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the

principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product

development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and

critical manufacturing equipment, trade environment, and other risks indicated in the risk factors included in ASML’s Annual

Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission.

/ Slide 3

ASML overview - The world’s leading provider of lithography systems for the semiconductor industry

Established: 1984Headquarters: Veldhoven, the NetherlandsMarket cap ~ €10 BEmployees ~ 6,200Customers: Serving 17 of the top 20 semi mfg.Equity Listing: Nasdaq and Euronext

Key facts

Key financials

€ million 2005 2006 H1 2007

Market share (based on revenue) 57% 63% 66%

Net sales 2,529 3,597 1895

Gross profit 974 1,462 777

EBIT 449 871 405

Leaders in InnovationASML TWINSCAN

Ranked in the top 3 for customer satisfaction for the

5th consecutive year

/ Slide 4

Sources: ASML MCC, VLSI Research, iSuppli, SIA

Industry growth drives Lithography tool consumption - NAND Flash fastest growing

DRAM

LOGIC

NAND

NOR

ANALOGMICRO

Other

00

10

20

30

40

50

60

0 5 10 15 20 25 30CAGR Exposure Area 06-09 [%]

Expo

sure

are

a 20

06 [S

I*10^

9]

Segment size: 20 Bio. US$

/ Slide 5

NAND Flash

Customer Roadmaps drive Lithograph tool development

Jan-00 Jan-02 Jan-04 Jan-06 Jan-08 Jan-10 Jan-12

Hal

f Pitc

h (n

m)

200

100

80

60

40

Logic

DRAM

Half Pitch status : Half Pitch status : Logic = 65~90nm Logic = 65~90nm DRAM = 60~80nm DRAM = 60~80nm NAND = 55~65nmNAND = 55~65nm

/ Slide 6

ASML Lithography Roadmap 300mm λ Res. NA

32nm 0.25 40nm 0.25

<40nm >1.5

45nm 1.20 57nm65nm 70nm 0.85 80nm 0.93 90nm110nm130nm 0.70 XT:760F

XT:1000H

XT:870FXT:875F

XT:450GXT:450F

2011

1.35

XT:1700Fi

XT:1400FXT:1450G

XT:1250D

EUV 13 nm

i-Line 365 nm 350nm

ADT

XT:875GXT:870G

0.65

>1.5 NA?

220nm

2006 2007XT:400F

0.93

0.80

201020092008XT:400G

KrF 248 nm

ArFi 193 nm

ArF 193 nm

Hi Index

40nm NextXT:1900Gi

PPT

Decision point

/ Slide 7

ASML TWINSCAN™ Product Specifications

λ System Res. 300mm Throughput [WPH) & Overlay Roadmap

Next <40nmXT:1900 40nm G 131 , 6nm

XT:1700i 45nm F 122 , 7nm

XT:1450 57nm G 145 , 6nm

XT:1400 65nm F 133 , 6nm

XT:1250 70nm D 120 , 8nm

XT:1000 80nm H 165 , 6nm

XT:875 90nm F 135 , 8nm G 150 , 6nm

XT:870 110nm F 135 , 8nm G 150 , 6nm

XT:760 130nm F 130 , 12nm

Year

XT:450XT:400

>131 <6nm

KrF 248nm

ArFi 193nm

ArF 193nm

FF 135 ,25nm

2010200920082006 2007

220nmi-Line 365nm 350nm

131 ,12nm G 141 ,12nm149 ,25nmG

2011

ContinuousContinuousImprovementImprovement

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ASML roadmap enables shrink for Logic, DRAM, and NAND flash at time required

Source: Various customers, dates determine production start/qualification

10 12

200

100

80

60

40

1107 090804 060501 030200Res

olut

ion/

half

pitc

h “S

hrin

k”[n

m]

Year

ASML Product Introduction

XT:1400

XT:1700i

AT:1200

AT:850

XT:1900i

k1=0.4

k1=0.27

LogicDRAM

R&DR&D

R&DR&D

NAND

To enable continued shrink for

memory: EUV is needed, Double

Patterning to bridge gap until

EUV mature

Litho technology will allow Logic

to shrink

XT:1450Double Patterning

/ Slide 9

0%

20%

40%

60%

80%

84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06

Technology in Time helps grow market share

Total market: €4,800 millionTotal market: €463 million

ASML market share (revenue) – Nearly tripled in 10 years

1984 2006Perkin Elmer

Canon

GCA

Ultratech

EatonNikon

ASET

Hitachi

ASML63%

Canon16%

Nikon21%

Source: SEMI, Gartner Dataquest

8” & i-line6” & early i-line

KrF & Step & Scan

12” & ArF Immersion

/ Slide 10

Immersion - Leadership continues

Over 50 systems shipped to date to all applications and geographies in the world25 immersion machines in backlog valued at € 728 M Received repeat orders from major Japanese customers including multiple XT:1900i machinesASML plans to ship about 35 immersion machines in 2007

Backlog in value

i-line 6%KrF 15%

ArF dry 37 %ArF Immersion

is 42% of backlog

/ Slide 11

First TWINSCAN XT:1900i shipped on schedule early July

First tool in the world capable of printing features below 40 nmin volume production

/ Slide 12

Over 2 Million wafers processed on ASML immersion systems with steep production ramp since April 2007

0

500

1000

1500

2000

2500Ja

n-05

Feb-

05

Mar

-05

Apr

-05

May

-05

Jun-

05

Jul-0

5

Aug

-05

Sep-

05

Oct

-05

Nov

-05

Dec

-05

Jan-

06

Feb-

06

Mar

-06

Apr

-06

May

-06

Jun-

06

Jul-0

6

Aug

-06

Sep-

06

Oct

-06

Nov

-06

Dec

-06

Jan-

07

Feb-

07

Mar

-07

Apr

-07

May

-07

Jun-

07

cumulative

Expo

sed

waf

ers

(x10

00)

Wafers exposed on ASML immersion equipment

/ Slide 13

180nm

130nm

90nm

65nm

The layout designers draw, is not quite what gets printed by scanners

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Why is this happening? Because the litho process is not an error-free transfer function

Mask-writing Wafer exposure Resist development Etch

H ≠ 1

/ Slide 15

What can we do about it? Software compensation for the distortion

H

…… …

~1/H

/ Slide 16

Mask(with correction,or “RET/OPC”)

Silicon Image w/o correction

Design Layout

Mask(no correction)

Silicon Image with RET/OPC

In practice…

/ Slide 17

What does Brion do?

Mask-writing Wafer exposure Resist development Etch

H ≠ 1

Accurate mathematical model of “H”

Designers drawingSimulated wafer,

before you print anything

/ Slide 18

With an accurate mathematical model of H, we can do two things:

Compensateon design

Compensateon scanner

i.e. Approximate 1/H

i.e. Find H’ so distortion is lessand/or easier to compensate for

Brion’s Tachyon OPC+ product line

Scanner tuning

/ Slide 19

Through accurate model, we can fine tune many system settings for optimum exposure of each device pattern, reticle & wafer

LensLens

IlluminatorIlluminator

SigmaPupicomPSEsDOEsDoseUnicomEtc.

StagesStages

LaserLaser

Bandwidth

NAManipulators

FocusTilt XTilt YReticle heightSynchronization

/ Slide 20

Synergies of owning the scanner and the litho model for scanner-tuning

System setting ranges : NA range Illumination option/ranges standard & custom DoseMapper correction rangeetc.

Actual system dataLens heating characteristics Aberration dataStray light Laser bandwidthetc.

Wafer metrology & exposure data:Focus & Leveling & focus hot spot dataDose error, Laser dataetc.

Optimum system settings :NA Illumination setting (standard, custom)Focus, Dose settingsetc.

Real time system optimisation :Lens manipulator settings Exposure dose & DoseMapper offsets Focus & tilt by shot / waferLaser bandwidthAlignment & wafer grid offsets / field/waferOther

/ Slide 21

The holy-grail of optimisation: today, only ASML can do this

Optimized

Scanner (e.g. Illumination)

Non - Optimized

Mask

Top-downphotoresist

Optimize both the scanner and

the mask, together, as a

unified optimization

problem

/ Slide 22

With Brion, ASML now can… (1/2)

Leverage a whole new dimension of possibilities for optimizing imaging performance (mask optimization, RET/OPC) as an integral part of its solution package

Use an accurate model of the lithography process to tune the dozens of scanner knobs available so to further optimize imaging performance (scanner tuning)

Through the two points above, enable faster shrink and higher yield for our customers

/ Slide 23

With Brion, ASML now can… (2/2)

Further secure the ArF roadmap until EUV is ready

Prevent value-migration to EDA by capturing software solutions to printability

Penetrate a new and growing market at the interface with EDA, capturing new value streams and enabling growth beyond “hardware”

/ Slide 24

1

10

100

1985 1990 1995 2000 2005 2010

Year

Lithography System costs will continue to riseR

elat

ive

List

Pric

e

ii--line line

300mm300mm200mm200mm150mm150mm

KrF KrF ArF ArF ArFi ArFi EUV? EUV?

Wafer SizeWafer SizeWafer Size

WavelengthWavelengthWavelengthStepper Stepper

Platform Platform Platform

Step & Scan Step & Scan

Dual Stage Dual Stage

0.4 0.4 0.5 0.5 0.6 0.6

0.7 0.7 0.8 0.8

0.93 0.93 1.2 1.2

1.35 1.35

ApertureApertureAperture

/ Slide 25

Average Selling Price (ASP) grows

0

2

4

6

8

10

12

14

16

mill

ion

Euro

1997 1998 1999 2000 2001 2002 2003 2004 2005 2006

ASML ASP new systems

KrF &Step & Scan

300mm & ArF

ArF volume& ArFi

/ Slide 26

Are lithography systems becoming unaffordable?

1

10

100

1,000

10,000

1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008

150mm 200mm 300mm

Relative price increase = 40% / generation

Relative price increase Relative price increase = 40% / generation = 40% / generation

Relative productivity increase (mm2/hour) = 30% / generation

Relative productivity Relative productivity increase (mmincrease (mm22/hour) /hour) = 30% / generation = 30% / generation

Relative shrink increase (pixels/field) = 100% / generation

Relative shrink Relative shrink increase (pixels/field) increase (pixels/field) = 100% / generation = 100% / generation

Relative cost reduction (pixels/hour/MEuro) = 60% / generation

Relative cost reduction Relative cost reduction (pixels/hour/(pixels/hour/MEuroMEuro) ) = 60% / generation = 60% / generation

/ Slide 27

Lithography Affordability for Future Shrink R

elat

ive

Perf

orm

ance

00.20.40.60.8

11.21.41.61.82.0

AT:1150C XT:1400E XT:1900i NEXTi EUVL90nm 65nm 40nm 28* 22

2003 2005 2007 2009 20114GB 8GB 16GB 32GB 64GB

Relative System CostRelative System WPHRelative Cost / Function / Hour

ModelResolution

YearNAND Flash

2.6

2.22.4

* Double Patterning

/ Slide 28

ASML Competitive Advantage

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

2004 2005 2006 2007 2008

ASML ArFCompetition ArFASML ArFiCompetition ArFi

Pixe

ls p

er H

our p

er M

illio

n Eu

ro

/ Slide 29

Summary

Shrinking design rules have been the economical driver of the ICindustry. Lithography remains the key enabler

Providing the right product at the right time allows market share gains for ASML

Shrinking design rules require increasingly more sophisticated lithography systems resulting in a steady growth in their cost and resulting ASP’s

ASML insures that the increasing cost of advanced lithography systems remain acceptable by developing solutions that result inmaximum usable shrink while driving increased productivity to ensure steady improvement in cost per function

Future lithography technologies will likely ensure that the economics of shrink will remain attractive for at least several more generations

/ Slide 30

Commitment