112/04/18 The Micro-Systems & Control Lab. 1
A NOVEL FABRICATION OF IONIC POLYMER-METAL COMPOSITES (IPMC)
ACTUATOR WITH SILVER NANO-POWDERS
Reporter : Song-En Gong(龔頌恩 )
Adviser : Cheng-Hsien Liu(劉承賢 )
C. K. Chung, Y. Z. Hong, P. K. Fung, M. S. Ju1, C. C. K. Lin, and T. C. WuDepartment of Mechanical Engineering, Center for Micro/Nano Technology Research,
National Cheng Kung University, Taiwan, ROCDepartment of Neurology, National Cheng Kung University, Taiwan, ROC
Industrial Technology Research Institute, Taiwan, ROCTRANSDUCERS’05 Seoul, Korea, June 5-9, 2005, pp.217-220
112/04/18 The Micro-Systems & Control Lab. 2
Outline
Introduction
Fabrication and Result
Discussion and Conclusion
112/04/18 The Micro-Systems & Control Lab. 3
Introduction
Nafion®
112/04/18 The Micro-Systems & Control Lab. 4
Introduction
Ref:Kwangmok Jung,2003
Introduction
112/04/18 Multimedia & Database Lab. 5
Actuated by 3 V dc; sample moves continuously towards the anode and forms nearly a circle after 3.5 min with no sign of electrolysis
Ref:Sia Nemat-Nasser,2003
Novel Fabrication
112/04/18 The Micro-Systems & Control Lab. 6
112/04/18 The Micro-Systems & Control Lab. 7
ResultThe appearance of IPMC actuator with casting Ag nano-powders method
The actuation result of IPMC sample bysupplying DC voltage of 3 V from 0-12 sec
Discussion
112/04/18 The Micro-Systems & Control Lab. 8
AdvantageLarge deformations
Low driving voltage
Actuating force about mN
Faster than other fabrication(4hr)
Biological compatibility
Good repeatability
HandicapRepeatability?
Short durability in dry conditions
Unmatched with other fabrication technique
Electrolysis at higher voltage
Not function high T
Hard top down
Conclusion
112/04/18 Multimedia & Database Lab. 9
Biomimetic sensors
Actuators
Transducers
Artificial muscles
END
Thanks for your attention
112/04/18 The Micro-Systems & Control Lab. 10
112/04/18 The Micro-Systems & Control Lab. 11
112/04/18 The Micro-Systems & Control Lab. 12
First, we send out the SOI wafer for ion implantation (Fig.5(a)). After getting the wafer back, a short drive-in is performed and at the same time a thin layer of oxide is formed to serve as theinsulation layer. Then we open the contact windows to the dopedsilicon (Fig. 5(b)). Electrical connection is formed using gold on titanium deposition and lift-off (Fig. 5(c)). The paddle-likecantilevers are then defined by front side DRIE (Fig. 5(d)). Following that the bulk backside etching is also performed using DRIE to get the cantilevers ready for release (Fig. 5(e)). A singlelayer of SU-8 2075 is then spun to achieve thickness of approximately 700μm (Fig. 5(f)). For pre-exposure bake, the samples are ramped up to 105oC at 150 oC/hr ramp rate and soakedat 105oC. After a total bake time of 13 hours the samples are then ambient cooled to room temperature. The photolithography is doneusing a Karl Suss contact aligner at 365nm. A high-wavelength pass optical filter with cutoff frequency of 300nm is used duringexposure to eliminate the “T-topping” effect of the SU-8 structures (Fig. 6). The exposure dose is 3000mJ/cm2. For post-exposure bake, the samples are again ramped up to 105oC at 150 oC/hr ramp rate and soaked at 105oC for half an hour. The samples are thenramped down to room temperature at a controlled rate of 15 oC/hr.The development is done using designated SU-8 developer withIPA as the end point indicator. After the cilia assembly, thedevices are released in BHF to free the cilium-on-cantileverstructures (Fig. 5(g)).
112/04/18 Multimedia & Database Lab. 13
Strain max=z/=zM/EI
Resistive noisekTRf4
L-x
M(x)M0
F
y(x)
EI
sM
s
)(
)(
1
摟 =曲率半徑
12
3baI
EI
M
x
y
2
2
2
2
2/32
2
2
])(1[)(
1
x
y
x
yx
y
x
]2
)3(6
[1
)(2
02 xM
xLFx
EIxy
])2
([1
)( 0xMx
LFxEIx
yx
112/04/18 Multimedia & Database Lab. 14
]23
[1
)(2
03 LMFL
EILy ]
2[
1)( 0
2
LMFL
EIL
3
3
3 4
3),,(
L
bEa
L
EILbak 懸臂樑 K
2max
)(3)1(
L
Ly
EI
FL
2max 2
)(3
L
aLy
112/04/18 Multimedia & Database Lab. 15
0])21(1[)1()1(
)1(R
ba
LR
ab
LR
0
0/ RR
Gguage
max)2
1( L
Lgave
22
3)
21(
L
ya
L
LG
R
R ggauge
]43
[]23
[1
)(2323
pbbbbb
LLL
EI
FMLFL
EILy
112/04/18 Multimedia & Database Lab. 16
Ve
V+ V-
R
R
R+R
R+R eeee VR
RVRR
RVRR
RRVRR
RVVV
2222
)12(
)]2
)([()
21(
)2
1(
)2
1(
3
max
max
baE
LL
maz
L
LG
EI
zM
L
LG
L
LGG
R
R
bp
aceg
gauge
ggauge
ggaugegauge