flash memory fault modeling and test algorithm development adviser: prof. cheng-wen wu 吳誠文...

Flash Memory Fault Modeling and Test Algorithm Development

Flash Memory Fault Modeling and Test Algorithm Development

Adviser: Prof. Cheng-Wen Wu 吳誠文教授Student: Jen-Chieh Yeh 葉人傑

May 06, 2004

LAB for Reliable ComputingDepartment of Electrical Engineering

National Tsing Hua UniversityHsinchu, Taiwan 30013

2/37

Outline Introduction

Flash Memory Overview

Flash Memory Testing Issues

Flash Disturb Fault Modeling

Flash Test Algorithm Development

Built-In Self-Test (BIST) Design

Experimental Results

Conclusions

3/37

Semiconductor Memory Market

Forecast of Web Feet Inc.

4/37

Introduction Flash memories are becoming widely used in m

any applications

High density, Low power, On-line update, Non-volatile …

Embedded Flash cores thus play an important role in the System-on-Chip (SoC) environment

Cell-phone

MP3 player MD

DSC

5/37

Flash Memory Applications

NAND

MCP

NOR

Se

rial A

cce

ssR

an

dom

Acc

ess

Low Density High Density

USB Drive

MP3

DSCPDA

G3 Phone

Cell Phone

PC BISO

Industrial Controls

DVD STB

SSD

Note: MCP = NOR or NAND based Flash devices including RAM in a Multi Chip Package

6/37

Two Major Architectures of FlashNOR (Code Flash) NAND (Data Flash)

Low DensityHigher Cost/BitFaster Random AccessNot ScalableSupplier Differences

Higher DensityLower Cost/BitFaster Sequential AccessScalableSingle Standard

B$

Forecast of Web Feet Inc.

7/37

NAND and NOR Architectures

NAND NOR

Bit-line

Word-line

Source line

8/37

Read Operation

VT_Erase VT_Program VGSVread

ID(“0”)

ID(“1”)

ID “1” “0”

VT

Decoder

Vread

V>0 GND GND

GND

SA

“0” or ”1”

9/37

Write Mechanism

Program Operation (μs) Erase Operation (m s)

Vwl>>0

GND Vbl>0

Channel Hot Electron (CHE)injection in the floating gate at

the drain side

Vwl<<0

Vs>0 Vbl>0

Vbody>0

Fowler-Nordheim (FN) electron tunneling current throughthe tunnel oxide from the floating

gate to the silicon surface

Erasure is usually performed over a complete block or chip, and hence the name “Flash” Different process technologies and even manufactures may differ in their choice of the program/erase mechanism

10/37

Flash Memory Testing Issues Reliability issues

Disturbances: inadvertent change of the cell content due to reading or programming another cell

Over-erasing: overstressed cell after erase, leading to unreliable program operation

Endurance: capability of maintaining the stored information within specified operation count

Retention: capability of maintaining the stored information within specified time limit

Long program/erase time

Difficult test access for embedded Flash memory

ATE price is high, and grows rapidly

11/37

Growth of Embedded Flash MemoryEmbedded Flash Memory Shipments(Worldwide, $ Millions)

Forecast of CISG (Cahners In-Stat Group)

20002001 2002

20032004

2005

$ 0

$ 100

$ 200

$ 300

$ 400

$ 500

$ 600

12/37

Approaches Reasonable fault models for reliability-related

defects

Efficient test algorithms to reduce test time and increase fault coverage

Built-in self-test (BIST) circuit for embedded Flash memoriesReplace or reduce the requirement of ATE

“Built-in self-test and built-in self-repair will be essential to test embedded Flash memories and to maintain production throughput and yield.” [Quoted ITRS 2003]

13/37

Contribution to Flash Memory Testing

Study of Flash Memories

Flash Disturb Fault Modeling

Test Algorithm Development

Proposed First Built-In Self-Test Design for Flash

Complete Experimental Results

Fault Simulator:RAMSES-FT

Test Algorithm Generation by

Simulation: TAGS

14/37

Fault Modeling Fault model is defined faulty cell behavior

Fault model makes analysis possible

Fault model makes effectiveness testing

Fault model limits the scope of test pattern

Defects in

Layout

Defects in

Layout

Defects in

Transistor

Defects in

Transistor

Faulty Cell

Behavior

Faulty Cell

Behavior

Fault

Model

Fault

Model

15/37

Flash Memory Specific Faults IEEE Standard 1005, “Definitions and

Characterization of Floating Gate Semiconductor Arrays”, defines the disturbance conditions

Flash memory functional fault modelsWord-line Program Disturbance (WPD)Word-line Erase Disturbance (WED)Bit-line Program Disturbance (BPD)Bit-line Erase Disturbance (BED)Over Erasing (OE)Read Disturbance (RD)

ProgramDisturb Fault

Erase Disturb Fault

Read Disturb Fault

16/37

Program Disturb Faults Word-line Program Disturbance (WPD)

A cell transits from 1 to 0 when another in the same word-line is being programmed (1 to 0)

Word-line Erase Disturbance (WED)A cell transits from 0 to 1 when another in the

same word-line is being programmed (1 to 0)

Bit-line Program Disturbance (BPD)A cell transits from 1 to 0 when another in the

same bit-line is being programmed (1 to 0)

Bit-line Erase Disturbance (BED)A cell transits from 0 to 1 when another in the

same bit-line is being programmed (1 to 0)

17/37

Word-line Program Disturbance WPD

V(H)

V(H)

V(L)

V(L)

V(Gd)

Conditions:

1.Victim cell initial value is a logic ‘1’

2.Aggressor “10” (program)

Victim “10” (program)Control Gate

Floating Gate

Source Drain

Substrate

G

S D

B

18/37

Word-line Erase Disturbance WED

Conditions:



Victim “01” (erase)Control Gate

Floating Gate

Source Drain

Substrate

G

S D

B

V(H)

V(H)

V(L)

V(L)

V(Gd)

19/37

Bit-line Erase Disturbance BED

Conditions:



Victim “01” (erase)Control Gate

Floating Gate

Source Drain

Substrate

G

S D

B

V(H)

V(H)

V(L)

V(L)

V(Gd)

20/37

Bit-line Program Disturbance BPD

V(H)

V(H)

V(L)

V(Gd)

During programming, erased cells on unselected

rows on a bit-line that is being programmed may

have a fairly deep depletion region formed under

them

Electrons entering this depletion region can be

accelerated by the electric field and injected over

the oxide potential barrier to adjacent floating

gates

Conditions:


2.Aggressor “10” (program) Victim “10” (program)

21/37

Read Disturbance and Over Erase RD

A cell transits from 0 to 1 during the read cyclesRelationship with read count (n)

<Rn0, 1> In here, we assumed n = 1

OEThe threshold voltage of a cell is low enough to

turn the cell into a depletion-mode transistor1.Cell can not be programmed correctly2.Reading a cell on the same bit line induces a

leakage current, resulting in an erroneous read

22/37

Conventional RAM Faults Several conventional RAM fault models are also

considered useful for testing Flash memoryStuck-At Fault (SAF)

Cell or line sticks at 0 or 1Transition Fault (TF)

Cell fails to transit from 0 to 1 or 1 to 0 Stuck-Open Fault (SOF)

Cell not accessible due to broken lineState Coupling Fault (CFst)

Coupled cell is forced to 0 or 1 if coupling cell is in given state

Address-Decoder Fault (AF) A functional fault in the address decoder

23/37

Test Algorithm Development for the sake of fault coverage (FC)

March algorithm often applies test to the SRAM and DRAMEx: {(w0); (r0,w1,r1);} bit-oriented

Ex: 0000 {(wa); (ra); (wb); (rb);} word-oriented

Fault

Model

Test

Algorithm

Built-In

Self-Test

Built-In

Self-Repair

Tester

0 0 0 0 0

0

0 0

0 0

0 0

0 1

0 0

1 1

0 1

1 1

1 1

1 1

24/37

Bit-oriented Flash Memory Test Conventional March tests can not detect all Flash

specific faults

No (w1) operation in Flash technology

Proposed March Flash Test (March-FT) {(f ); (r1,p0,r0); (r0); (f ); (r1,p0,r0); (r0);}Regular, easier to generate, covering more functional

faults and do not rely on the array geometry or layout topology

Notation Operations

f Erase

p0 Program

r1 or r0 Read 1 or 0

Notation Address Sequence

Ascending

Descending

Ascending or Descending

25/37

Word-oriented Flash Memory Test Word-oriented memory may have intra-word faults Add simple test with multiple standard backgrounds to

cover intra-word faults {(f ); (pa,ra); (f ); (pb,rb);}

Number of backgrounds is log2(m)+1m : word width1 : solid background

Example (m = 4):

0000 (f ); (rb,pa,ra); (ra); (f ); (rb,pa,ra); (ra);

0011 (f ); (pa,ra); (f ); (pb,rb); 0101 (f ); (pa,ra); (f ); (pb,rb);“0000” is solid background “0011” & “0101” are standard backgrounds

26/37

Flash Memory Fault Simulator RAMSES-FT

Detect all base fault & disturb faultUsed scaling techniqueSupport word-oriented FlashSupport physic-address for disturb fault

27/37

March-FT Simulation Result {(f); (r1,p0,r0); (r0); (f); (r1,p0,r0);

(r0)}This Flash memory is NOR type (STACK gate)

Memory size(N) : 65536

Test length : 2(chip erase time) + 131072(word program time) + 393216(word read time)

Test length time : 7.207173 sec

SAF : 100% (131072 / 131072) P.S.

TF : 100% (131072 / 131072) Flash Type = NOR

SOF : 100% (65536 / 65536) Gate Type = Stack

AF : 100% (4294901760 / 4294901760) Row Number = 256

CFst : 100% (17179607040 / 17179607040) Col Number = 256

WPD : 100% (16711680 / 16711680) Word Length = 1

WED : 100% (16711680 / 16711680) Chip erase time = 3 sec

BPD : 100% (16711680 / 16711680) Word program time = 9u sec

BED : 100% (16711680 / 16711680) Word read time = 70n sec

RD : 100% (65536 / 65536)

OE : 100% (65536 / 65536)

28/37

Flash March

[VTS2001]

WPD100%

WED100%

BPD100%

BED100%

OE100%

RD0%

SAF100%

TF100%

SOF50%

AF100%

CFst75%

Test Complexity2F + 2NP + 4NR

Test Time2.503 sec

Simulation Results Bit-oriented Flash memory tests simulation result

(128Kbits Flash memory)

March-FT(proposed

)

WPD100%

WED100%

BPD100%

BED100%

OE100%

RD100%

SAF100%

TF100%

SOF100%

AF100%

CFst100%


Test Time2.516 sec

Assumption: F=190ms, P=8us, R=50ns, and N=128K

29/37

Simulation Results (cont.) Word-oriented Flash memory tests simulation result

(128Kx4bits Flash memory, word width: 4)

Assumption: F=190ms, P=8us, R=50ns, and N=128K

March FT(With

standard backgrounds

)

WPD100%

WED100%

BPD100%

BED100%

OE100%

RD100%

SAF100%

TF100%

SOF100%

AF intra100%

AF inter100%

CFst intra

100%

CFst inter

100%Test Complexity6F + 6NP + 10NR

Test Time7.497 sec

March FT (Onlysolid

background)

WPD100%

WED100%

WPD100%

WED100%

OE100%

RD100%

SAF100%

TF100%

SOF100%

AF intra0%

AF inter100%

CFst intra

50%

CFst inter100%


Test Time 2.516 sec

30/37

Test Algorithm Generation by Simulation TAGS [VTS2000]

T(N)

March-like Tests

2N

3N

4N

5N

6N

7N

8N

9N

10N

(f); (r1)

(f); (p0); (r0)

(f); (r1,p0); (r0)

(f); (r1,p0,r0); (r0)

(f); (r1,p0,r0); (r0,p0)

(f); (r0); (r1,p0,r0); (r0,p0)

(f); (r1,p0); (f); (r1,p0,r0); (r0)

(f); (r1,p0); (r0); (f); (r1,p0,r0); (r0)

(f); (r1,p0,r0); (r0); (f); (r1,p0,r0); (r0)

31/37

TAGS Results

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

2N 3N 4N 5N 6N 7N 8N 9N 10N

SAF

TF

CFst

SOF

AF

WPD

WED

BPD

BED

RD

OE

32/37

BIST Advantages Functional test (Go / No go) Tester functional easily (Few Logic I/O) Test throughput increased (Pin Count Reductio

n) Test program simply (Engineer Mode) System-on-Chip (SoC) testing easily

Flash

coreBIST

CLK

BNSGo/NoGo

BMS

Normal Mode Signal

MUX

33/37

Built-In Self-Test Design Flash memory BIST block diagram

BSI: BIST serial input BSO: BIST serial output BMS: BIST mode selectBRS: BIST reset BNS: BIST/Normal select BCE: BIST commend endCLK: System clock

To FlashMemory

From FlashController

BMS

CLK

ERRCONT

DONEENA

EOP

Collar)(Test

CMD

TPG

BSOBSI

BRSBCE

MUX

BNS

CTR

DataAddress

Address

SignalsControl

DataData

SignalsControl

Address

Control Signals

34/37

Case I A typical 4Mbits (512K x 8) embedded Flash memory

core with BIST circuitry

Address Buffer

HV Generator

FlashCell Array

Y - Decoder &

Test Mode

Address

BIST

Control

BSIBSOBMSBRSBCECLKBNS

OEWE

CE

Address

Data

signalsControl

signalsControl

AddressData

DataTest Collar

Controlsignals

Test modesignals

Y - MUX

Sense Amp.I/O Buffer &

X - D

ecoder

Registers

Logic

35/37

Case II A commodity 1Mbits (128K x 8) Flash memory chip with

BIST circuitry

CommandData LatchCommandDecoder &State Reg.

ArrayFlash

X-D

ecoderY-D

ecoder GateY-Pass

I/O Buffer

PGM/ER HV

SenseAmp.

PGM

HVDATA

Test Collar

ControlInputLogic

CEOEWE

Address

Din/Dout

ControlSignals

Address

Data

BNS

BISTBSO

BRSBCECLK

BMS

ControlSignals

Address

Data

Reset

BSI

36/37

Experimental ResultsEmbedded Flash Core

Commodity Flash Chip

Memory Size 512K bytes 128K bytes

Mass Erase Time 200ms 190ms

Byte Program Time 20us 8us

Erase Penalty 2.5ms 1us

Program Penalty 21us 1us

Scrambling Type Data Address

Built-In Test Algorithm

March FT(Only solid

background)

March FT(With standard backgrounds)

Hardware Overhead 3.2% 2.28%

Testing Time 44.612 sec 13sec

37/37

Conclusions Bit-oriented and word-oriented Flash memory

tests are proposed

Implemented the BIST circuit for the embedded Flash memory core and commodity Flash memory chip

A Flash memory simulator has been developed to facilitate the analysis and generation of the tests

Developed March-like test methodology that can be used and reused for various Flash memories

Our future work is to support more Flash memory types and other realistic fault models, and to develop a diagnosis and repair methodology for Flash memories

Thank you for your attention!

flash memory fault modeling and test algorithm development adviser: prof. cheng-wen wu 吳誠文...

Documents