ティナデスⓇシリーズ鉛フリー対応電気Snめっき液

Tin Electroplating bath

TYNADES®Series

Liquidlevel

ウイスカ対策浴ラック～リール・ツー・リール用酸性すずめっき液（使用電流密度2～20A/dm2）TYNADESⓇGRX-70 is the acidic Sn plating solution to get the film which reduced whisker in rack and reel-to-reel plating. (Cathode current density:2-20A/dm2)

GRX-70皮膜は、微細で特長のある結晶構造をもち、均一な金属間化合物層（IMC）を形成するためウイスカ抑制に有効です。GRX-70 film has fine and unique crystal structure. Therefore whisker formation is reduced so that uniform IMC is formed between copper and tin film.

高電流密度対応浴リール・ツー・リール用酸性すずめっき液（使用電流密度5～40A/dm2）TYNADESⓇGHS-51 is high speed acidic Sn plating solution for reel-to-reel plating. (Cathode current density: 5-40A/dm2)

GHS-51は広い電流密度範囲で高い電流効率を維持することができ、また消泡性にも優れています。GHS-51 bath has high current efficiency in the wide current density and excellent defoaming character.

Samples ： C194 lead framesThickness of deposit ： 10μmCathode current density ： 30A/dm2

Cathode current density :30A/dm2

●析出形態　Surface morphology

●液面制御性　Liquid level control

●陰極電流効率　Cathode current efficiency

●析出形態と結晶構造　Surface morphology and Crystal structure

●はんだ濡れ性評価例（メニスコグラフ）　Solderability (Wetting Balance)

1.0

0.5

0.0Initial After PCT8 Initial After PCT8 Initial After PCT85A/dm2 10A/dm2 20A/dm2

Instrument : SWET-2100（Tarutin Kester）Method : Wetting Balance MethodSolder : Sn-3Ag-0.5Cu（Senju Metal lndustry/M705）Flux : CF-110VH-2A（Tamura Kaken）Temperature : 255℃Immersion Depth : 2mm, Immersion Speed : 2mm/sec.

Zero Cross Time [sec]

GHS-51Conventional

120

100

80

60

40

20

00 10 20 30 40 50C

athode current efficiency [%]

Cathode current density [A/dm2]

ティナデスⓇ GHS-51TYNADESⓇ GHS-51

ティナデスⓇ GRX-70TYNADESⓇ GRX-70

Samples ： C194 lead framesThickness of deposit ： 10μm

Accelerated conditionsPCT ： 105ºC/100%RH/8hrs

Samples ： C194 lead framesThickness of deposit ： 10μmCathode current density ： 20A/dm2

Surface morphology Crystal structure （Cross section）

2mm