hev/ev inverter solutionautomotive market experiences can realize highly efficient inverter ecus....

© 2016 Renesas Electronics (China) Co., Ltd. All rights reserved.

YU ZONGYUAN

RENESAS ELECTRONICS CHINA

APRIL 2016

瑞萨电子新能源汽车主驱电机控制器方案 HEV/EV Inverter Solution

© 2016 Renesas Electronics (China) Co., Ltd. All rights reserved. 2

Contents

RENESAS Introduction

EV/HEV Motor Control Solution

Devices Solution


Renesas Electronics Introduction


World’s Top Automotive Semiconductor Supplier

Note: Ranking data includes the influence of exchange rate fluctuations. Source: Strategy Analytics

Auto. Semiconductor W/W

Company CY14

1 Renesas Electronics 12.0%

2 Infineon 10.5%

3 ST 7.8%

4 Freescale 7.5%

5 NXP 6.8%

Auto. Processor （MCU,SOC） W/W

Company CY14


2 Freescale 20.8%

3 Infineon 8.7%

4 TI 7.6%

5 Microchip 4.8%

＊Auto. Analog & Power = “Non-power Analog”+“Power”

Company CY14

1 Infineon 15.5%

2 ST 13.8%

3 NXP 9.2%

4 TI 8.6%


Auto. Analog & Power* WW

4


Solutions for Automotive Renesas semiconductors lead to higher functionality for automobiles

MCU High performance and low power through 40 nm process

Multi-core, functional safety, and security

Lineup covering eight application fields

Analog High-precision, low-loss drivers

High-precision, high-voltage sensor interfaces

Battery management ICs for HEV/EV SoC

Good track record with car information systems

R-Car covers high-end, mid-range, and entry-level

High-performance graphics engine and image recognition

technology

Power Low voltage power MOSFET

IPDs (intelligent power devices) for car body

IGBTs for HEV/EV

Automotive

Powertrain Safety Chassis Body Network Infotainment Driver assistance

(ADAS)

HEV/EV

*Share estimated by Renesas. BiCD: Bipolar CMOS DMOS, IPD: Intelligent Power Device, IGBT: Insulated Gate Bipolar Transistor

#1 world share

#1 world share

#1 world share

5

http://techon.nikkeibp.co.jp/article/CAR/20080218/147591/?SS=imgview&FD=948951453


Powertrain

Chassis Cluster

Safety Body

Domain Controller I/O Controller

■16bit Ultra Low-Power MCU - Product variation as low-end MCU

- Ultra low power consumption(70uA/MHz)

- Reduce system cost with built-in Analog

Audio Gage

Switch Light Window

Mirror Door

Wiper

Display Tier Steering

Sensor Camera Key

Fan

Switch

Injector Starter Pump

Pedal Break

Automotive MCU Product Series

6

Individual product lineup that is consistent with the platform method on the flash memory tip, contribute

to improving our customers' competitiveness

■32bit High-performance MCU

- High-performance/Large Flash Memory

- Wide Product Line to cover Various ECUs

- Scalable ECU Architecture with Multi-Core

32bit High-performance MCU 16bit Ultra Low-Power MCU

6


All Line Up of Leading 40nm Automotive MCUs

First and only chip firm ready to begin mass production of Automotive MCUs at 40nm process

Expanding design-in worldwide – High Speed, Large Memory, Ultra Low Power

40nm

MONOS

flash Powertrain Display Body EV/HEV Airbag Safety

Lower power solution for

more fuel-efficient cars

Functional safety solution for

safe driving

High reliability and global

support capability

7


Power saving technology contributing to energy savings

Competitor

(90nm) (40nm)

Lower Power

1.00

0.38

0.28

Renesas

(90nm)

-26%

-62%

mW/

MHz ‐ World’s first 40nm flash MCU

developed through scalable

MONOS* process technology

‐ Low power system technology

cultivated by MCUs and A&P

8

Renesas Advantages

8


Continue to improve Quality toward

ZERO DEFECT for Automotive Industry

1ppm

Toward ZERO DEFECT

9

Renesas Electronics Advantages

High Reliability, Safe and Secure technology

- High reliability and quality lead the automotive and industrial fields

- Functional safety technology cultivated by the automotive field

- Security technology to prevent attack by hackers and viruses

9


EV/HEV Motor Control Solution


Energy Efficiency for Next Generation Green Car

2005 2010 2015 2020

100

150

200

(g/km) 220

150

140

130

95

115

137

101

@2025

(170)

(161)

CO2 emission control

in major countries

Japan U.S.

E.U.

Green Vehicle

/ Fuel Efficiency Engine

Next-generation fuel

efficient engine

Next-generation

HEV/EV

11


Executive Summary

Renesas developed world’s smallest class size of reference inverter kit solutions for

hybrid electric vehicle and electric vehicle.

Renesas products such as MCUs, Pre-Driver ICs and IGBTs proven by extensive

automotive market experiences can realize highly efficient Inverter ECUs.

Renesas provides not only motor application Software

but also embedded testing software

and wide range of EDA libraries for

designing ECU system specification/validations.


Reference Design of Inverter System

20

Reference design as Kit Solution for Smaller, lighter, more efficient inverter in next HEV/EV

Electromechanical air-cooled motor inverter Drive real size IPM/SR motor

World’s Smallest size EV Motor Inverter Various IPM/SR Motor reference design

13


Motor Generator MCU for EV/HEV Systems

*Renesas reference design capacity ratio

World Wide

72% Share

Global Market Share of MCUs

for EV/HEV Systems

RH850/C1H

Inverter

RDC2 Resolver

Motor EMU2

CPU

Inverter

RDC2 Resolver

Motor EMU2

CPU

RH850/C1M

Inverter

RDC2 Resolver

Motor EMU2

CPU

RH850/C1H for Dual Motor System

RH850/C1M for Single Motor System

RH850/C1H 240MHz, DCLS, 2 RDC

Motor IP (EMU2)

RH850/C1M 240MHz, SCLS, 1 RDC

Motor IP (EMU2)

V850E2/PG4-S 512KB, 1 RDC

SH72AW 768KB, 1 RDC

SH72AY 768KB, 1 RDC

Motor IP (EMU)

MG (Motor Generator) MCU Roadmap

40nm Flash MCU

Process

20

Leading Motor Generator MCU for Global EV/HEV Inverter Systems by 40nm Flash MCU

14


Renesas IGBT Advantage for Inverter Systems

20

Renesas IGBT technology is best in the class of 650V/300A for Motor Inverter Systems. We will

enhance to 900V/1200V products.

AE４

AE3

Competitor A

High Performance

IGBT 650V/300A Class

350A/cm2 Competitor B

Sw-loss -20%

15


Kit solution of Motor MCU + μ isolator + IGBT reduces inverter size & weight and adds tremendous

value for next generation HEV/EV

HEV/EV Motor ECU’s Reduction in Size and Weight

ECU’s Reduction in Size and Weight

*Renesas reference design capacity ratio

EV/HEV

motor

Resolver

Motor Control

(+Functional Safety)

Temperature

Accuracy

Improvement

Calibration

High-speed

breaker

CPU

core

Motor

Control IP

R/D converter

Pre Driver

IGBT Motor control MCU

μ isolator

Vector

Engine

Capacity: 4.9L Capacity : 2.9L Capacity: 0.9L

(-80%+α）

Process Innovation of Flash MCU

16


Technology for Smaller Inverter System

20

High performance IGBT and Micro Isolator controlled by Motor MCU for next generation inverter

2.9L

600A

4.9L

400A

11.25L

200A

0.9L

400A

New

2011 2013 2014 2015

Efficiency

Power

Density

2.5 times

Power

Density

2 times

Power

Density

4.6 times

Size

Output

- Photo-coupler

- 6th Generation IGBT

- High Current High Density Technology

- Thermal Management Technology

- Micro-Isolator Technology

- 7th Generation IGBT

CY

Renesas Inverter Reference Design Experience

17


Offering Various Kit Solutions for EV Systems

18


Miniaturized Motor Distribution

19


Inverter Kit Solution Menu

Depending on customer’s requirement , 3 type of menu is prepared for each.

MCU

Driver

IC

Fast

shut-

down

Driver

IC IGB

T Power

Kit

Inverter

Kit

MG

Kit

Down-sizing (High performance

power devices)

System design

support

Demo

inverter

system

unit

Dev tool for

motor control

Value

Test procedure

reduction

Down-sizing

High accuracy temp

calibration by

utilizing driver

software

Configuration Tool

Down-sizing

Menu

Support- IC

High accuracy

temperature

measurement

High accuracy

temp calibration MCU

Driver

IC IGB

T

Support-IC

IC Motor control

(+FuSa)

High Temp control

accuracy

High accuracy

temperature

measurement

Fast

shut-

down

Fast

shut-

down

Test procedure

reduction

High Temp control

accuracy

PMIC

Power rail

design

Heat-sink design

Production test

time

Entire ECU development

Focus

on

Motor

Generator

20


Kit Devices

N S

U V

W

A

C B

S

N N

Motor

IGBT+FRD

Drive

r

IC

MCU

Drive

r

IC

Driver

IC

Drive

r

IC

Drive

r

IC

Driver

IC

EMU

RDC Resolver

PMIC

RAA270000KFT

RH850/C1H

(RH850/C1M)

Temp.

sensor

EMU:Enhanced Motor Control Unit

RDC:Resolver to Digital Converter

IGBT:Insulated Gate Bipolar Transistor

FRD:Fast Recovery Diode

Power

Management

IC

RAJ293001

R2A25110KSP

© 2016 Renesas Electronics Corporation. All rights reserved.

Temperature Management Tech. (Use Temp. Sensor in IGBT)

Heat-sink

Heat-sink

Predict delay and temp. for IGBT Measure direct hot source in IGBT

Sensor Deviation Control margin

Sensor Deviation

Control margin

Predict delay of Thermistor

Temp.

Time

Temp.

Time

Chip maximum Chip maximum

Predict chip temp.

Heat-sink IGBT

IGBT

IGBT

IGBT

[Legacy] External temp. sensor (Thermistor) Temp. sensor

IGBT IGBT IGBT IGBT

Predict

Downsize heat-sink is feasible

by temperature measurement control

software using IGBT’s temp. sensor

Big size heat-sink is needed due to

over margin design by prediction

IGBT WITHOUT Temp. Sensor IGBT WITH Temp. Sensor

(20~30%)

Down

Size

Measurement temp.

Real temp.

Predict temp.

Motor Drive

Operate range

Motor Drive

Operate range High track ability

High Accuracy

22

Th

erm

isto

r


Model Base Design Environment

MILS: Model In the Loop Simulation

SILS: Software In the Loop Simulation

PILS: Processor In the Loop Simulation

HILS: Hardware In the Loop Simulation

Modeling

Simulation

(Virtual)

Prototyping

Software

Development

Software

Coding

Test (Unit)

Verification

Calibration

Validation MILS

SILS

PILS

HILS

Test (Integration)

MILS (for functional confirmation)

Standard APIs

Proposal

Model-base

Auto Code Gen.

Confirmation

with

Silicon Chip

PILS

(for performance/algorithm confirmation)

(for performance confirmation)

Controller(MCU)

Controller(MCU) Inverter + Motor

SILS

Under Development

23


Device Solution


MCU Road Map for HEV/EV

*

MG (Motor Generator)

DCLS: Dual core with lock step

SCLS: Single core with lock step

DC/DC, Charger

V850E2/FF4-Motor

RH850/P1x

RH850/F1x*

SH72A0

2011 2014 2016 2020

V850E2/PG4-S 512KB, 1 RDC

RH850/C1H 240MHz, DCLS, 2 RDC

Motor IP (EMU2)

RH850/C1M 240MHz, SCLS, 1 RDC

Motor IP (EMU2)

for

2 motor

RH850/C1x-A 320MHz, DCLS

1&2 Next RDC

Next Motor IP

SH72AW 768KB, 1 RDC

SH72AY 768KB, 1 RDC

Motor IP (EMU)

RL78/F1x

RL78/F1y

RH850/P1x-Next

RH850/F1x*

* Same Solution

for

1 motor

New

MCU

25


System 32-bit CPU

Memory

4MB Flash

Interfaces

4 x RS-CAN

3 x SCI

2 x CSIH

3 x LIN

Analog SAR A/D

2 x modules

2 x FPU

Motor Control Subsystem

2 x MPU

GPIO

RH850 Core with Lock-Step

G3M@240 MHz 1.25/3.3/5.0 V

-40 to +125°C

DMA (16ch/128ch) DMA (16ch/128ch)

Interrupt Controller

Error Control Module

Main OSC

Clock Monitor

CRC

Debug Nexus Class 3+

AUD, LPD

Timer

3 x OS Timer

2 x WDT

2 x TAUD

2 x TAUJ EMU2 2 x RDC2

2 x TSG3

2 x TAPA 2 x ENCA

240KB RAM

(TOTAL)

32KB

Data

Flash

2 x I-Cache

RH850 Core

G3M@240 MHz 1.25/3.3/5.0 V

-40 to +125°C

RH850/C1H Outline for 2 Motor MG MCU

26

MCU


RH850/C1M Outline for 1 Motor MG MCU

System 32-bit CPU

Memory

2MB Flash

Interfaces

4 x RS-CAN

3 x SCI

2 x CSIH

Analog SAR A/D

2 x modules

1 x FPU

Motor Control Subsystem

1 x MPU

GPIO

DMA (16ch/128ch) DMA (16ch/128ch)

Interrupt Controller

Error Control Module

Main OSC

Clock Monitor

CRC

Debug Nexus Class 3+

AUD, LPD

Timer

2 x OS Timer

1 x WDT

2 x TAUD

1 x TAUJ EMU2 1 x RDC2

2 x TSG3

2 x TAPA 2 x ENCA

128KB RAM

(TOTAL)

32KB

Data

Flash

1 x I-Cache

RH850 Core with Lock-Step

G3M@240 MHz 1.25/3.3/5.0 V

-40 to +125°C

27

MCU


Motor Control Technology for EV/HEV

Advantage:

Built-In Resolver to Digital Converter (RDC)

Reduce Noise influence

Strong Collaboration with TAMAGAWA SEIKI Co.

Built-in Enhanced Motor Control Unit (EMU)

Low CPU Load with built-in Motor Control hardware

RH850/C1H

Inverter

RDC2 Resolver

Motor EMU2

CPU

Inverter

RDC2 Resolver

Motor EMU2 CPU

(w/LS)

RH850/C1M

Inverter

(IGBTs

+FRDs)

RDC2 Resolver

Motor EMU2 CPU

(w/LS*)

LS:Lockstep (support safety function)

MCU


Drastically Part numbers reduced (12p→6p)

Advantage to Photo coupler

Photo coupler Pre-Driver

Power Module （IGBT)

PD #1

PD #2

PD #3

PD #4

PD #5

PD #6

PC #1

PC #2

PC #3

PC #4

PC #5

PC #6

MCU

Power Supply IC

Trans former

Micro Isolator + Pre-Driver

Power Module （IGBT)

MI+PD#1

MI+PD#2

MI+PD#3

MI+PD#4

MI+PD#5

MI+PD#6

MCU

Power Supply IC

Trans former

Tx Rx

120um

135um

225um

225um 230um

Output driver

transformer

Renesas unique design : Smaller transformer size than competitor(1/4~1/8)

29

Isolator Coupler

Delay time ~60ns ~500ns

Current

Consumption

Trans 0.1mA

Receiver 1.2mA

Trans 10mA

Receiver 1mA

Operation temp 125degC 105degC

IGBT drive

config

1 package

1pcs

Driver IC 1pcs

Coupler 1~2pcs

Small Micro Isolator Technology (Pre-Driver IC) Pre-Driver


IGBT Process Trend IGBT

On

Vo

lta

ge

x S

w lo

ss(E

off

) In

de

x(N

orm

aliz

ed

)

2008 2010 2012 2014

0.9

0.8

2016

* FS ： Field Stop

1.0 AE2

FS type*

AE3

Adv. FS type

AE4

Fine cell

FS Type AE5

(concept)

2018

↑

Development

Start

0.7

↑

1stWS

( for test-sample

Only )

HiGT : High conductivity IGBT

30


High Efficiency IGBT Device Technology (600V to1200V)

(*1) AE4 loss is estimate value.

AE４

AE3

Maker A

650V/300A Class

350A/cm2 Maker B

Sw-loss -20%*1 4.7kV/us(AE3)

dv/dt=

6.5kV/us(AE4)

di/dt=5.0kA/us

Switching

P

N-

P

AL

Gate Emitter

Floating

Ｐ

Floating

Ｐ

Fine pitch trench HiGT*2 structure

and Low Gate Capacitance structure

Emitter

Gate

(*2) Renesas own structure HiGT: High conductivity Gate Bipolar Transistor

AE2

31

IGBT


IGBT Coverage in HEV/EV System

Voltage Rating (V)

IGBT

HVAC: Heating, Ventilation, and Air Conditioning

1

10

100

1000

100 200 2000

Small EV

Mild HEV

Full - HEV

Large EV

(Image)

Under planning

High Current Package

Recommend packaged

IGBT for less than 30kW

power

Current Coverage

650V ~600A

900V ~400A

1200V ~300A

(Image)

Bare die

1200 650 900 Standard Voltages

650V

200A

32


Reference Integrated Motor


HEV/EV Inverter (SR Motor)

Real 20kW SR*1 motor drive

Max 650V/400A output IGBT

Downsizing Inverter 2.9L 0.9L

Temperature Calibration for

Kit solution

Renesas device solution

MCU: RH850/C1M

PMIC: RAA270000

Driver IC: R2A25110

Power: IGBT/FRD with sensor

Collaboration

with Sumitomo Shoji Machnex.

34

IGBT Temp.

Module Temp.

20kW

SR Motor

Inverter

Accelerate

Pedal

Power Supply

*1 SR : Switched Reluctance


Mechanical Configuration Diagram

35

Air-cooled Motor

Inverter

Inverter cover

Connector

Cover

IGBT / DI board

Pre-driver board

MCU / PMIC board

Heat-sink


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hev/ev inverter solutionautomotive market experiences can realize highly efficient inverter ecus....

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