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Industry Electronics Assembly
1
Industrial applications require materials
solutions that can meet the everchanging
demands for high reliability and improved
performance. With decades of materials
development expertise, Henkel offers a wide
range of assembly and protection materials
for challenging industrial and consumer
electronics environments. We also offer
advanced conformal coatings to be used in
protecting electronics circuits from moisture,
chemicals and other contaminants. But, we
haven’t stopped there, with an unyielding
commitment to sustainability, Henkel has
developed materials that not only deliver
the high reliability required, but also address
the needs of our environment. Halogen-
free, lead-free, solvent-free and low-VOC
materials are all part of our portfolio and
our ongoing promise to be environmentally
responsible. All these innovative solutions
will enable manufacturers to introduce
products faster to market and improve
production effi ciency.
Industry Electronics Assembly
Overview
OV
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VIE
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OV
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VIE
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Encapsulant
High Temperature
Resistant
ECCOBOND 104A/B
ECCOBONDA316-48
Thermal Conductivity
ECCOBOND282
LOCTITE384
ECCOBONDTE3530
LOCTITE 3873
LOCTITE 315
LOCTITE 3874
LOCTITE 5404
ECCOBONDA312-20
LOCTITE3129
ECCOBOND E3200
LOCTITE3128
LOCTITE3220
LOCTITE3905
Low Temperature
Curing
ECCOBOND2332
ECCOBONDG757
ECCOBONDG500
ECCOBONDG757HF
ECCOBONDG500HF
ECCOBONDG909
Ferrite Bonding
ECCOBOND UV300
LOCTITE3108
LOCTITE352
LOCTITE3523
LOCTITE3106
LOCTITE3552
LOCTITE3703
UV Curing
ABLEBOND 969-1
HYSOL QMI 529HT
ECCOBOND CT-4042-1 A/B
Crystal Oscillator
ThermalConductive
STYCAST 2851FT
Loctite 5406
General Purpose
HysolEO1016
STYCAST A312-20
STYCASTE1070
High Temperature
Resistant
STYCASTW66/CAT17M-1
ECCOBOND 104A/B
HYSOL EE1087/HD0243
Low Viscosity
HYSOL ES1901
HYSOL ES1902
HYSOL ES2500
HYSOL US2350
Low Dielectric Strength
STYCAST1090/CAT9
HYSOL ES1300
HYSOL ES1301
HYSOL ES2205
General Purpose
HYSOL EO1000
HYSOL EO1002
STYCAST2057/CAT9
STYCAST2651MM/CAT9
STYCAST2651-40/CAT9
ThermalConductive
HYSOL EE1087/HD3404
STYCAST1495K
STYCAST2850FT/CAT9
STYCAST5954
STYCASTE2534FR/
CAT11
Flame Retardancy
HYSOL EE1068/HD3404
HYSOL ES1004
STYCAST2651-40FR/
CAT9
STYCAST2850FT-FR/
CAT9
STYCASTXT5038-6A/
B100
HighTemperature
HYSOL EO1058
HYSOL EO1088
STYCAST906-1
STYCAST933-48
STYCASTA316-48
STYCASTG508-1
Catalyst
CATALYST 9
CATALYST 11
CATALYST 14
CATALYST 15
CATALYST 15LV
CATALYST 17
CATALYST 23LV
CATALYST 24LV
CATALYST 27-1
CATALYST 28
CATALYST 30
CATALYST 43
Adhesive
Conformal Coating
ECCOCOATPC355-1
ECCOCOATU7510-1
ECCOCOATUV7993
HYSOLPC18M
HYSOLPC28STD
HYSOLPC40-UM
HYSOLPC62
HYSOL3900
LOCTITE 5293
LOCTITE 5296
Industry Electronic Assembly
COB
HysolEO1086
HysolEO1016
HysolEO1061
ECCOBOND UV300
HysolE-214HP
Flexibility
HYSOL ES2207
HYSOL US1152
STYCAST5954
STYCASTU2500
Adhesives
Industry Electronics Assembly
1 2
AD
HE
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E
AD
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PRODUCTCURE
SCHEDULESVISCOSITY
(Cps)
THERMAL CONDUCTIVITY
(W/mK)
VOLUME RESISTIVITY
(OHM.CM)ONE-COMPONENT TWO-COMPONENT
CHEMISTRY CURING CONDITION
SELF-SHIMMINGEPOXY ACRYLIC SILICONE HEAT CURE
ROOM TEMP. CURE WITH ACTIVATOR
ECCOBOND282
30 min.@ 150oC 625,000 1.30 1.0x1015 • • •ECCOBOND
TE353030 min. @ 100oC 60,000 2.30 1.0x1015 • • •
LOCTITE 315
24-72 hrs. @ 20oC 605,000 0.81 1.3x1012 • • • •LOCTITE
38424-72 hrs. @ 20oC 550,000 0.76 1.3x1012 • • •
LOCTITE 3873
24-72 hrs. @ 20oC 400,000 1.25 4.3x1014 • • • •LOCTITE
387424-72 hrs. @ 20oC 325,000 1.25 4.3x1014 • • •
LOCTITE 5404
10 min. @ 150oC Paste 0.95 2.9x1014 • • • •
Adhesives for Thermal Conductivity Application Chart
PRODUCTCURE
SCHEDULESVISCOSITY
(Cps)OPERATING
TEMPERATURE
VOLUME RESISTIVITY
(OHM.CM)ONE-COMPONENT TWO-COMPONENT
CHEMISTRY CURING CONDITIONFOR Pb-FREE
REFLOW APPLICATIONEPOXY SILICONE HEAT CURE
ROOM TEMP. CURE WITH ACTIVATOR
ECCOBOND 104A/B
3 hrs. @ 150oC N/A -25 to 230oC 1x1015 • • • •ECCOBOND
A316-4830 min. @ 100oC 50,000 -40 to 180oC 1x1015 • • •
Adhesives for High Temperature Resistant Application Chart
Adhesives
Industry Electronics Assembly
3 4
AD
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AD
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PRODUCTCURE
SCHEDULESVISCOSITY
(Cps)
TENSILE LAP SHEAR
( N.mm-2 )APPEARANCE Tg(°C) CTE α 1 (ppm/°C) ONE-COMPONENT TWO-COMPONENT EPOXY LOW OUTGASSING HIGH RELIABILITY
ECCOBONDA312-20
30 min.@ 100°C 20,000 12 Al BLACK N/A N/A • •ECCOBOND
E320020 min.@ 100°C 150,000 N/A LIGHT TAN N/A N/A • •
LOCTITE3128
20 min.@ 80°C 17,0007
EpoxyglassBLACK 45 40 • • •
LOCTITE3129
5-10 min.@ 80°C 4,20015.4
EpoxyglassBLACK 35 47 • • •
LOCTITE3220
5-10 min.@ 80°C 2,50020.4
EpoxyglassBLACK 26 61 • • • •
LOCTITE3905
15 min. @ 100°C 18,50014.2
Epoxyglass BLACK 134 58 • • • •
Adhesives for Low Temperature Curing Application Chart
Adhesives for Crystal Oscillator Application Chart
PRODUCTCURE
SCHEDULESVISCOSITY
(mPa.s)DIE SHEAR STRENGTH
(Kg.f)Tg(°C) ONE-COMPONENT TWO-COMPONENT
FOR VERTICAL
TYPE
FOR HORIZONTAL
TYPE
LOW OUTGASSING
ABLEBOND 969-1
60 min. @ 200°C (oven) 15,000 1,700 psi Au/Au 236 • • •ECCOBOND
CT-4042-1 A/B5 min. @ 150°C 68,000 71 95 • •
HYSOL QMI 529HT
30 min. @ 200oC (oven) 18,500 57 Ag/Cu N/A • • •
Adhesives
Industry Electronics Assembly AD
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AD
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PRODUCTCURE
SCHEDULESVISCOSITY
(Cps)
TENSILE STRENGTH LAP SHEAR AL-AL
(PSI)
SHORE HARDNESS
ONE-COMPONENT
TWO-COMPONENT
CURING CONDITIONHALOGEN FREE FLEXIBILITY
HIGH ADHESION STRENGTH
THIN BOND LINE THICKNESS
UV FOR SMD TYPE
HEAT CUREUV PLUS HEAT
CURE
ECCOBOND2332
20 min. @ 150°C 75,000 2,960 75D • • •ECCOBOND
G50020 min. @ 150°C Paste 2,500 86D • •
ECCOBONDG500HF
5 min. @ 175°C Paste 2,558 85D • • •ECCOBOND
G75745 min. @ 140°C Paste 1,500 35D • • •
ECCOBONDG757HF
20 min. @ 160°C Paste 1,740 44D • • • •ECCOBOND
G90920 min. @ 150°C Paste 5,800 78D • • •
ECCOBOND UV300
20 min. @ 110°C + 5sec @
80W/cm² @ 365 nm5,000 2,755 80D • • •
HysolE-214HP
40 min. @ 120°C 1,150,000 4,880 85D • • •
Adhesives for Ferrite Bonding Application Chart
Adhesives
Industry Electronics Assembly AD
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AD
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PRODUCTVISCOSITY
(Cps)SHORE
HARDNESS
TENSILE LAP SHEAR
(PSI)
TACK FREE DEPTH OF CURE CHEMISTRY KEY SUBSTRATE CURE
FLEXIBILITY INLINE PROCESSINGTIME
(sec)CURING
CONDITION DEPTH(MM)
TIME AT CURING
CONDITION
ACRYLATED URETHANE
MODIFIED ACRYLATE
• EXCELLENT FOR SUBSTRATE MARKED○APPLICABLE FOR SUBSTRATE MARKED
UV VISIBLE LIGHT HEAT ACTIVATOR
POLYCARBONATE
THERMO PLASTIC
THERMOSET PLASTIC METAL GLASS
ECCOBOND UV300
6,000 80D19MPaAl-Al
580W/cm² @ 365 nm
2.55sec @
80W/cm² @ 365 nm
• • • ○ • ○ • •LOCTITE
35219,500 60D
2,400STEEL - GLASS
2050mW/cm² @ 365 nm
530sec @
50mW/cm² @ 365 nm
• ○ ○ ○ • • • • • •LOCTITE
31065,000 53D
3,392PC-PC
N/A N/A 220sec @
30mW/cm² @ 220 nm
• • • ○ ○ ○ • • •LOCTITE
31085,100 72A
2,090PC-PC
N/A N/A 420sec @
100mW/cm²@ 365 nm
• ○ • • ○ ○ • •LOCTITE
352320,000 70D
2,755STEEL - GLASS
20100mW/cm² @ 365 nm
215sec @
100mW/cm² • ○ ○ ○ • • • •LOCTITE
3552200 83D
4,800PC-PC
1085mW/cm² @ 400 nm
610sec @
200mW/cm² • • ○ ○ ○ ○ •LOCTITE
370325,000
2,600PC-PC
N/A N/A 425 sec @
30mW/cm² @ 365 nm
• • ○ ○ ○ ○ • • •
Adhesives for UV Curing Application Chart
Conformal Coatings
Industry Electronics Assembly
9 10
CO
NFO
RM
AL
CO
AT
ING
S
CO
NFO
RM
AL
CO
AT
ING
S
PRODUCTCURE
SCHEDULESVISCOSITY
(Cps)
DIELECTRIC STRENGTH
(V/mil)
TEMPERATURE RANGE
ONE-COMPONENT
TWO-COMPONENT
CHEMISTRY CUREVOC FREE
FLUORESCENCE
MIL STANDARD
UL CERTIFICATION
ACRYLICS POLYURETHANES SILICONESURETHANE ACRYLATES
HEAT UV RT
ECCOCOAT PC355-1
60 mins. @ 80°C 300 N/A @-40°C-130°C • • •ECCOCOAT
U7510-12.5 hrs. @ 25°C 2,750 N/A @-30°C-130°C • • •
ECCOCOAT UV7993
5 secs.UV + 4 days @ RT
120 1,200 @-40°C-105°C • • • • • 94 V-1
HYSOL PC18M
2 hrs @ 60°C 350 1,200Continuous up to
110°C • • • • •HYSOL
PC28STD2 hrs @ 60°C 35 1,500
Continuous up to 110°C • • •
HYSOL PC40-UM
30 secs.UV + 3 days @ RT
500 N/A @-40°C-135°C • • • • • 94 V-0
HYSOL PC62 45 mins. @ 75°C 50 2,000 @-40°C-125°C • • • • 94 V-0
HYSOL 3900
24 hrs. @ 22°C Aerosol 1,652 @-40°C-125°C • • • • 94 V-1
LOCTITE 529360 secs.UV +
7 days @ 22°C600 406 N/A • • • • 94 V-0
LOCTITE 5296 7 mins.@ 125°C 200 524 @-40°C-200°C • • • •
Conformal Coatings Application Chart
Encapsulants - One-Component
Industry Electronics Assembly
11 12
PRODUCT CURE SCHEDULES VISCOSITY(Cps) APPEARANCE SHORE HARDNESS ONE-COMPONENT TWO-COMPONENTCHEMISTRY
SMALL MASS POTTING UL CERTIFICATION EPOXY SILICONE
HYSOL EO1016 20 min.@ 150°C 58,000 BLACK 86D • • 94 V-0
STYCAST A312-20 30 min.@ 100°C 20,000 BLACK 80D • •STYCAST E1070 20 min.@ 150°C 3,000 BLACK 86D • • •
PRODUCT CURE SCHEDULE VISCOSITY(Cps) APPEARANCE SHORE HARDNESS THERMAL CONDUCTIVITY (W/m·K) ONE-COMPONENT TWO-COMPONENTCHEMISTRY
EPOXY SILICONE
STYCAST 2851FT 2 hrs. @ 100°C 85,000 BLACK 94D 1.44 • •LOCTITE 5406 1 week @ 22°C/40%RH PASTE OPAQUE WHITE 40A 0.70 • •
Encapsulants for General Purpose Application Chart
Encapsulants for Thermal Conductive Application Chart
Encapsulants for COB Application Chart
PRODUCT CURE SCHEDULES VISCOSITY(Cps)TENSILE LAP SHEAR(psi)
APPEARANCE SHORE HARDNESS Tg(°C) CTE α1(ppm/°C) ONE-COMPONENT TWO-COMPONENT EPOXY UL CERTIFICATION
HYSOL EO1016 30 mins. @ 100°C 58,000 3,660 BLACK 86D 126 46 • • 94 V-0
HYSOL EO1061 13 mins. @ 121°C (gel time) 32,500 N/A BLACK N/A 125 40 • •HYSOL EO1086 30 min.@ 150°C 45,000 N/A BLACK 90D 127 33 • •
PRODUCT CURE SCHEDULES VISCOSITY(Cps) COLORORERATING
TEMPERATURESHORE HARDNESS
THERMAL CONDUCTIVITY (W/m·K)
CTE α 1(ppm/°C) ONE-COMPONENT TWO-COMPONENT EPOXY PB-FREE UL CERTIFICATION
HYSOL EO1058 2 hrs. @ 140°C 50,000 BLACK -40 to 180°C 90D 0.42 24 • •HYSOL EO1088 30 mins. @ 150°C 62,000 BLACK -40 to 180°C 88D 0.60 35 • • •STYCAST 906-1 2 hrs. @ 125°C 190,000 BLACK -40 to 180°C 90D 0.86 N/A • •STYCAST 933-48 150 mins. @ 120°C 150,000 BLACK -40 to 180°C 85D N/A 38 • •
STYCAST A316-48 30 mins. @ 100°C 50,000 BLACK -40 to 180°C 86D 0.40 55 • •STYCAST G508-1 30 mins. @ 160°C 27,000 BLACK -40 to 180°C 85D 0.60 N/A • • 94 V-0
Encapsulants for High Temperature Resistant Application Chart
EN
CA
PS
ULA
NT
EN
CA
PS
ULA
NT
Encapsulants - Two-Component
Industry Electronics Assembly
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PRODUCT
VISCOSITY(Cps)CURE
SCHEDULE
THERMAL CONDUCTIVITY
(W/m·K)
SHOREHARDNESS
ONE-COMPONENT
TWO-COMPONENT
CHEMISTRYHALOGEN
FREEUL
CERTIFICATION RESIN HARDER MIXED EPOXY SILICONE
HYSOL EE1087/HD3404
50,000 25 29,000 24 hrs. @ 25°C 1.00 87D • •STYCAST
1495K/CAT23LV45,000 25 10,000 24 hrs. @ 25°C 1.00 90D • •
STYCAST 2850FT/CAT9
225,000 93 58,000 16-24 hrs. @ 25°C 1.25 96D • •STYCAST
595455,000 15,000 35,000 4 hrs. @ 65°C 1.15 85A • •
STYCAST E2534FR/CAT11
350,000 N/A N/A 16 hrs. @ 75°C 1.20 90D • • • 94 V-0
Encapsulants for Thermal Conductive Application Chart
Encapsulants for Flame Retardancy Application Chart
PRODUCT
VISCOSITY(Cps)CURE
SCHEDULES
THERMAL CONDUCTIVITY
(W/m·K)
SHORE HARDNESS
ONE-COMPONENT
TWO-COMPONENT
CHEMISTRYHigh Tg
UL CERTIFICATIONRESIN HARDER MIXED EPOXY URETHANES
HYSOL EE1068/HD3404
30,000 25 14,000 24 hrs. @ 25°C 0.40 90D • • 94 V-0
HYSOL ES1004
30,000 550 26,0002 hrs. @ 80°C + 2 hrs. @ 150°C
N/A 88D • • • 94 V-0
STYCAST 2651-40FR/CAT9
30,000 90 8,000 16-24 hrs. @ 25°C 0.55 87D • • 94 V-0
STYCAST 2850FT-FR/CAT11
200,000 35-60 @ 65°C 65,000 16 hrs. @ 80°C 1.23 94D • • 94 V-0
STYCAST XT5038-6A/B100
8,000 400 3,400 24 hrs. @ 25°C 0.43 85D • • 94 V-0
EN
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EN
CA
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ULA
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Encapsulants - Two-Component
Industry Electronics Assembly
15 16
Encapsulants for High Temperature Resistant Application Chart
Encapsulants for Flexibility Application Chart
PRODUCTCURE
SCHEDULESVISCOSITY
(Cps)ORERATING TEMPERATURE
SHORE HARDNESS
ONE-COMPONENT TWO-COMPONENT EPOXY PB-FREE
STYCAST W66/CAT17M-1
3 hrs. @ 100°C 15,000 -40 to 230°C 85D • •ECCOBOND
104A/B1 hrs. @ 200°C N/A -25 to 230°C 90D • • •
HYSOL EE1087/HD0243
2 hrs. @ 80°C+ 2 hrs. @ 150°C
25,000 UP TO 180°C 90D • •
PRODUCTVISCOSITY(Cps)
CURE SCHEDULES
DIELECTRIC STRENGTH
(V/mil)
THERMAL CONDUCTIVITY
(W/m·K)
SHORE HARDNESS
Tg(°C) CTE α 1 (ppm/°C)ONE-
COMPONENTTWO-
COMPONENTCHEMISTRY UL
CERTIFICATION RESIN HARDER MIXED EPOXY SILICONE URETHANESHYSOL ES2207
14,000 180 8,800 24 hrs. @ 25°C 1,000 N/A N/A N/A 66.3 • • 94 V-0
HYSOL US1152
60 650 45024 hrs. @ 22 to
30°C1,001(20mils) 0.18 30A -52 79 •
STYCAST 5954
55,000 15,000 35,000 4 hrs. @ 65°C 450 1.15 85A -120 150 • •STYCAST
U250012,500 50 6,000 24 hrs. @ 25°C N/A 0.50 70-75A -53 130-180 • •
PRODUCTVISCOSITY(Cps) CURE
SCHEDULE
DIELECTRIC STRENGTH
(V/mil)
THERMAL CONDUCTIVITY
(W/m·K)
SHORE HARDNESS
CTE α 1(ppm/°C)ONE-
COMPONENTTWO-
COMPONENTCHEMISTRY UL
CERTIFICATION RESIN HARDER MIXED EPOXY SILICONE URETHANES
HYSOL ES1000 45,000 9,000 25,000 36-48 hrs. @ 25°C 1,100 0.42 75D 95 • • 94 HB
HYSOL ES1002 28,000 6,300 19,500 36-48 hrs. @ 25°C 1,135 0.64 88D 66 • • 94 V-0
STYCAST 2057/CAT9 5,500 90 4,000 16-24 hrs. @ 25°C 400 0.64 85D 50 • •STYCAST 2651MM/CAT9 35,000 90 14,000 16-24 hrs. @ 25°C 450 0.60 88D 53 • •STYCAST 2651-40/CAT9 32,500 90 10,000 16-24 hrs. @ 25°C 450 N/A 80D 48.3 • •
Encapsulants for General Purpose Application Chart
EN
CA
PS
ULA
NT
EN
CA
PS
ULA
NT
Encapsulants - Two-Component
Industry Electronics Assembly
17 18
Encapsulants for Low Viscosity Application Chart
Encapsulants for Low Dielectric Stength Application Chart
PRODUCT
VISCOSITY(Cps)CURE
SCHEDULES
DIELECTRIC STRENGTH
(10 mils, V/mil)
SHORE HARDNESS
ONE-COMPONENT TWO-COMPONENTCHEMISTRY
UL CERTIFICATIONRESIN HARDER MIXED EPOXY URETHANES
HYSOL ES1901
1,900 2,800 2,400 24 hrs. @ 25°C N/A 55D • •HYSOL ES1902
4,700 50 290 24 hrs. @ 25°C 1,390 80D • •HYSOL ES2500
11,000 170 1,500 16 hrs. @ 25°C 410 70D • • 94 HB
HYSOL US2350
13,000 55 2,400 12-24 hrs. @ 23°C 954(20mils) 85A • •
PRODUCT
VISCOSITY(Cps)CURE
SCHEDULES
DIELECTRIC STRENGTH
(10 mils, V/mil)
DIELECTRIC CONSTANT (1kHz, 23°C)
SHORE HARDNESS
Tg(°C) CTE α 1(ppm/°C)ONE-
COMPONENTTWO-
COMPONENTEPOXY
CRACK RESISTANTRESIN HARDER MIXED
STYCAST 1090/CAT9
135,000 93 30,000 16-24 hrs. @ 25°C N/A 2.70 (1mHz) 80D N/A N/A • •HYSOL ES1300
220,000 36,000 85,000 3 hrs. @ 120°C 1,340 (20 mils) 3.81 94D 81 50 • • •HYSOL ES1301
10,500 750 1,6004 hrs. @ 110°C or
2 hrs. @ 125°C1,096 3.62 90-95D 112 67 • •
HYSOL ES2205
80,000 550 25,0002 hrs. @ 80°C + 2 hrs. @ 150°C
1,400 4.40 80-85D 132 54 • •
EN
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EN
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ULA
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Industry Electronics Assembly
19 20
Catalysts for Two - Component Encapsulants
CATALYST CURE SCHEDULESVISCOSITY
(mPa.s)
AMOUNT OF CATALYST USED IN RELATION TO
CATALYST 9
APPEARANCE POT LIFESERVICE TEMPERATURE (°C)
CHEMICAL RESISTANT
PHYSICAL STRENGTH
HIGH TEMPERATURE PERFORMANCE
THERMAL SHOCK
CONTINUOUS INTERMITTENT
CATALYST 9 16-24 hrs. @ RT 90 1.00 Amber 45 mins 130 150 • •
CATALYST 112 hrs. @ 100°C+ 4 hrs. @ 150°C
47 1.20 Tan to dark brown 4 hrs 180 200 • • • •
CATALYST 143 hrs. @ 150°C
+3-16 hrs @ 180°C
Powder 2.50 White 24 hrs 180 200 • •
CATALYST 15 16-24 hrs. @ RT 30 Pa.s 7.0-21.1 Black 2 hrs 90 120
CATALYST 15LV 16-24 hrs. @ RT 10 Pa.s 3.50-14.00 Black 2 hrs 65 90
CATALYST 173 hrs. @ 120°C+2 hrs @ 150°C+16 hrs @ 175°C
Slurry 2.80 Blue-grey 24 hrs 230 260 •
CATALYST 23LV 16-24 hrs. @ RT 25 2.00 Water-white to slight amber
1 hrs 105 120 •
CATALYST 24LV 8-16 hrs. @ RT 35 2.00 Water-white to slight amber
30 mins 105 120 •
CATALYST 27-1 4 hrs. @ 120°C 275 1.75 Brown 2 hrs 175 200 • • •
CATALYST 28 4 hrs. @ 120°C 275 1.75 Brown 2.5-3 hrs 175 200 • • •
CATALYST 30 24 hrs. @ RT 80 2.70 Slight amber 1 hrs 90 120
CATALYST 43 16-24 hrs. @ 65°C 50 0.75 Amber 40 mins 205 •
Catalysts
CA
TA
LYS
TS
CA
TA
LYS
TS