MicroprocessorLecture 1: 마이크로프로세서 소개 및 설명

Hong Jong-Phil

School of Electrical EngineeringChungbuk National University

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Course Administration

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담당교수 : 홍종필 jphong@chungbuk.ac.kr

교수연구실 : 46-362

수업자료 : http://icat.cbnu.ac.kr

학점 : 출석 및 태도 : 20%

결과보고서 : 10%

기말시험 : 40%

프로젝트 : 30%

프로젝트 제안서 10%

작품시현 및 발표 20%

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Course Contents 주차 내용 주차 내용

1주 마이크로 프로세서 강의 소개 8주 제12장 AD 컨버터, DA 컨버터

2주

HBE-AVR-ISP v3.0(MK ll) 설치

제1장 AVR 마이크로컨트롤러

제2장 AVR 마이크로컨트롤러 개발환경

제3장 GPIO 입출력 제어

9주제13장 Buck 컨버터 제어

제14장 Boost 컨버터 제어

3주

제4장 Internal Memory의 이해

제5장 외부 인터럽트

작품초안, 재료 리스트 보고서 제출

10주제15장 인버터의 구형파 제어

제16장 인버터의 PWM 제어

4주 제6장 TC를 이용한 타이머 11주 작품 제작 및 코드 수정 실습1

5주제7장 TC를 이용한 PWM

제8장 TC를 이용한 외부 입력 받기12주 작품 제작 및 코드 수정 실습2

6주제9장 UART 통신

제10장 외부메모리 인터페이스13주 작품 제작 및 코드 수정 실습3

7주

과제 중간 발표

추가 재료 구매

제11장 시리얼 인터페이스

14주 과제 발표 및 시현 (1조당 20분)

15주 기말시험

The Computer Revolution

• Progress in computer technology– Underpinned by Moore’s Law

• Makes novel applications feasible– Computers in automobiles– Cell phones– Human genome project– World Wide Web– Search Engines

• Computers are pervasive

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Classes of Computers

• Desktop computers– General purpose, variety of software– Subject to cost/performance tradeoff

• Server computers– Network based– High capacity, performance, reliability– Range from small servers to building sized

• Embedded computers– Hidden as components of systems– Stringent power/performance/cost constraints

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Growth in Cell Phone Sales (Embedded)

From 2012, Mobile SOC (Smartphone) > PC (Notebook +Desktop)

* IDL (Gartner, Morgan Stanley Research estimates]

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Where else are embedded processors found?

Below Your Program

• Application software– Written in high-level language

• System software– Compiler: translates HLL code to

machine code– Operating System: service code

• Handling input/output• Managing memory and storage• Scheduling tasks & sharing resources

• Hardware– Processor, memory, I/O controllers

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Levels of Program Code• High-level language program (in C)

swap (int v[], int k)(int temp;

temp = v[k];v[k] = v[k+1];v[k+1] = temp;

)

• Assembly language program (for MIPS)swap: sll $2, $5, 2

add $2, $4, $2lw $15, 0($2)lw $16, 4($2)sw $16, 0($2)sw $15, 4($2)jr $31

• Machine (object, binary) code (for MIPS)000000 00000 00101 0001000010000000000000 00100 00010 0001000000100000

. . .

C compiler

assembler

one-to-many

one-to-one

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Components of a Computer

Same components forall kinds of computer Desktop, server,

embedded Input/output includes

User-interface devices Display, keyboard, mouse

Storage devices Hard disk, CD/DVD, flash

Network adapters For communicating with

other computers

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Inside the Processor (CPU)

Datapath: performs operations on data Control: sequences datapath, memory, ... Cache memory

Small fast SRAM memory for immediate access to data

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Anatomy of a Computer

Output device

Input device

Input device

Network cable

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Opening the Box

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AMD’s Barcelona Multicore Chip

Core 1 Core 2

Core 3 Core 4

Northbridge51

2KB

L2

512K

B L

2 51

2KB

L2

512K

B L

2

2MB

sha

red

L3 C

ache

Four out-of-

order cores on one chip

1.9 GHz clock rate

65nm technology

Three levels of caches (L1, L2, L3) on chip

Integrated Northbridge

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A Safe Place for Data

Volatile main memory Loses instructions and data when power off

Non-volatile secondary memory Magnetic disk Flash memory Optical disk (CDROM, DVD)

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Networks

Communication and resource sharing Local area network (LAN): Ethernet

Within a building Wide area network (WAN: the Internet Wireless network: WiFi, Bluetooth

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Abstractions

Abstraction helps us deal with complexity Hide lower-level detail

Instruction set architecture (ISA) The hardware/software interface

Application binary interface The ISA plus system software interface

Implementation The details underlying and interface

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Technology Scaling Road Map (ITRS)

Year 2004 2006 2008 2010 2012Feature size (nm) 90 65 45 32 22

Intg. Capacity (BT) 2 4 6 16 32

Fun facts about 45nm transistors 30 million can fit on the head of a pin You could fit more than 2,000 across the width of a human

hair If car prices had fallen at the same rate as the price of a

single transistor has since 1968, a new car today would cost about 1 cent

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Technology Trends

Electronics technology continues to evolve Increased capacity

and performance Reduced cost

Year Technology Relative performance/cost1951 Vacuum tube 11965 Transistor 351975 Integrated circuit (IC) 9001995 Very large scale IC (VLSI) 2,400,0002005 Ultra large scale IC 6,200,000,000

DRAM capacity

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Power Trends

In CMOS IC technology

FrequencyVoltageload CapacitivePower 2 ××=

×1000×30 5V → 1V

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Uniprocessor Performance

Constrained by power, instruction-level parallelism, memory latency 20

Multiprocessors The power challenge has forced a change in the design

of microprocessors

Multicore microprocessors– More than one processor per chip

Product AMD Barcelona

Intel Nehalem

IBM Power 6 Sun Niagara 2

Cores per chip 4 4 2 8Clock rate 2.5 GHz ~2.5 GHz? 4.7 GHz 1.4 GHzPower 120 W ~100 W? ~100 W? 94 W

Hard to doProgramming for performanceLoad balancingOptimizing communication and synchronization

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Manufacturing ICs

Yield: proportion of working dies per wafer22

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AMD Opteron X2 Wafer

• X2: 300mm wafer, 117 chips, 90nm technology• X4: 45nm technology