mitac gp 資料之 審核原則與零件承認標準說明
DESCRIPTION
MiTAC GP 資料之 審核原則與零件承認標準說明. Agenda. GP 資料審核步驟及方法 基本資料 零件拆解資訊 上傳證明文件 宣告化學物質數據 化學物質使用說明. GP 資料審核步驟及方法. 基本資料: 首先檢查供應商是否已經提交下列產品基本資料: WEEE 資料 零件過錫爐的耐溫資料 零件拆解資訊: 是否提供符合均質拆解定義的零件拆解資訊 上傳證明文件: 是否在各零件拆解部位,根據列表的待宣告化學物質,上傳參考文件以提供數據的審核證明。 - PowerPoint PPT PresentationTRANSCRIPT
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MiTAC GP
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AgendaGP
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GPWEEE
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Waste Electrical and Electronic Equipment Directive 2002/96/EC, WEEE
WEEE () WEEE
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WEEE
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SMT DIP
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BLCOK1SMT IPC/JEDEC J-STD-020C /MSDIPC/JEDEC J-STD-020C YES NO?? Mm?? Mm^3 NOJ-STD-020CE
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SMT IPC/JEDEC J-STD-020C MSDIPC/JEDEC J-STD-020C YES NO NOJ-STD-020CE(PEAK TEMPERATURE) 260 10 SEC YES NO NOJ-STD-020CE(MELT TEMPERATURE-TL) 217 ,60 sec
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DIP NOJ-STD-020CE
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MiTAC / ( PCBA) (Module Declaration) (BOM)
REACH SVHC REACH SVHC (Article)
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eGP (Part Number)(Subpart Name)(Subpart Name)(Raw Material Name)(Raw Material Name)(Raw Material Name)(Raw Material Name)
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eGP / / (P)(S1)(S2)(R1)(R2)(R3)(R4) (P) = (S1+S2) (S1) = (R1+R2) (S2) = (R3+R4)
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[] (1) DIP(DIP Resistor)(RES123)(RES123 / )(RES123 / )(RES123 / )(RES123 /)
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[] (2) DIP(DIP Resistor) (RES123)(XS / )(XS / )(XS / )(XS / )XS (RES456)(XS / )(XS / ){0.2 g}[0.3 g]{0.15 g}{0.05 g}[0.23 g][0.07 g]{0.008 g}[0.016 g]{0.002 g}[0.004 g]{0.14 g}[0.21 g]{0.05 g}[0.07 g]{RES123 } [RES456]
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[] (3) (Cover123)(Cover456)(Cover123 / )(Cover456 / )(Cover456 / )(Cover123 / )
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[] (4) PCB(PCB123)(PCB456)(IT-158&PP)()()()(PCB456)(PCB123)
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[] (5) PCBA (Module Declaration)(Sub-System123)(PCBA123 / )(PCBA123 / )()()
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[] (6) (HDD) REACH (HDD123)(HDD123 / )(HDD123 / )REACH SVHC eGP
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(MSDS / SDS) MiTAC (MiTAC Declaration of Conformity)MiTAC
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ISO17025 SGSIntertek() CTI() BVCPS() ETC() (Report Number) (Report Issued Date)(MDL)
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()RoHS IEC-62321
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(MSDS / SDS)CAS (CAS Number) () MSDS (MSDS / SDS)
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(MSDS / SDS) MSDS
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MiTAC 12 BOM 3
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MiTAC 12
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3 (Prohibited & Restricted )
(Reportable)
(Survey)
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4 /
MSDS / MSDS MSDS
/ " PPM "
," PPM " (1)(2)(3) (4)
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/ 1 2 3 4 5 6 1 2 4
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A WA B WB SVHC
A SA CA ( SA = (CA * WA) / 1000000 )
B SB CB ( SB = (CB * WB) / 1000000 )
= SA + SB[ 1] : ppm ()[ 2] :