nterpretations - jsztcy.com · code cases 规范案例 the boiler and pressure vessel code...

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NTERPRETATIONS 条款解释

Interpretations of the Code have historically been posted in January and Ju152ly at http://cstools.asme.org/inter-pretations.cfm. Interpretations issued during the previous two calendar years are included with the publication of the applicable Section of the Code in the 2017 Edition. Interpretations of Section III, Divisions 1 and 2 and Section III

Appendices are included with Subsection NCA. 各历史版本之规范条文解释已于1 月和7 月公布在

http://cstools.asme.org/interpretations.cfm 网页上。在过去的两年内发布的解释包含在2017版规范之相应卷

中。第III 卷第1 、第2 册和第III卷附录的《条款解释》，含在NCA 分卷中。

Following the 2015 Edition, interpretations will not be included in editions; they will be issued in real time in ASME's Interpretations Database at http://go.asme.org/Interpretations. Historical BPVC interpretations may also be

found in the Database. 于2015年版之后，所有的条文解释将不在收录于各版次中。ASME之所有条文解释将

实时发布于 http://go.asme.org/Interpretations 网页上。各历史版本之BPVC 条款解释都将收录在此数位库

中。

CODE CASES 规范案例

The Boiler and Pressure Vessel Code committees meet regularly to consider proposed additions and revisions to the Code and to formulate Cases to clarify the intent of existing requirements or provide, when the need is urgent, rules for materials or constructions not covered by existing Code rules. Those Cases that have been adopted will appear in the appropriate 2017 Code Cases book: “Boilers and Pressure Vessels” or “Nuclear Components.” Sup-plements will be sent or made available automatically to the purchasers of the Code Cases books up to the publica-

tion of the 2019 Code. 锅炉及压力容器委员会(BPVC)定期召开会议研究对规范增补和调整的建议，制定规范

案例，阐明现行规范要求的意图，当有急迫需求时，则可提供现行规范所未涵盖之材料或建造规则以向

BPVC提出规范案例申请，凡经采纳之规范案例，均将汇编在2017 版的规范案例：“锅炉及压力容器”和

“核能部件” 两书中刊出。《规范案例汇编》的增补，将及时寄给该书的订户，直到2019 版规范出版时为

止。

http://go.asme.org/Interpretations

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FOREWORD 前言*

(This Foreword is provided as an aid to the user and is not part of the rules of this Code.)

(前言仅作为用户在采用规范时之帮助，并不属于规范规则的一部分)

* The information contained in this Foreword is not part of this American National Standard (ANS) and has not been pro-

cessed in accordance with ANSI's requirements for an ANS. Therefore, this Foreword may contain material that has not been

subjected to public review or a consensus process. In addition, it does not contain requirements necessary for conformance to

the Code. 在本前言中之信息并不属于美国国家标准(ANS)的一部分且未遵循ANSI规程的要求。因此 , 前言可能含有未

经征求公众意见或共识规程之题材。另本前言亦不包含符合本规范所必需的要求。

In 1911, The American Society of Mechanical Engineers established the Boiler and Pressure Vessel Committee to formulate standard rules for the construction of steam boilers and other pressure vessels. In 2009, the Boiler and

Pressure Vessel Committee was superseded by the following committees：美国机械工程师学会(ASME) 在1911

年为制定蒸汽压力锅炉和其他压力容器的标准建造规则，成立了锅炉及压力容器委员会。在2009 年，锅炉

及压力容器委员会由以下委员会所替代：

(a) Committee on Power Boilers (I) 动力锅炉委员会(I)

(b) Committee on Materials (II) 材料委员会(II)

(c) Committee on Construction of Nuclear Facility Components (III)

核能部件建造委员会(III)

(d) Committee on Heating Boilers (IV) 采暖锅炉委员会(IV)

(e) Committee on Nondestructive Examination (V) 无损栓测委员会(V)

(f) Committee on Pressure Vessels (VIII) 压力容器委员会(VIII)

(g) Committee on Welding, Brazing, and Fusing (IX) 焊接、钎焊接和熔接委员会(IX)

(h) Committee on Fiber-Reinforced Plastic Pressure Vessels (X)

纤维增强塑料压力容器(X)

(i) Committee on Nuclear Inservice Inspection (XI) 核能部件在役检验委员会(XI)

(j) Committee on Transport Tanks (XII) 运输罐委员会(XII)

Where reference is made to “the Committee” in this Foreword, each of these committees is included individually

and collectively. 在本前言中举凡涉及"委员会"处，都分别或整体地包含以上各委员会。

The Committee's function is to establish rules of safety relating only to pressure integrity, which govern the con-

struction** of boilers, pressure vessels, transport tanks, and nuclear components, and the inservice inspection of nuclear components and transport tanks. The Committee also interprets these rules when questions arise regarding their intent. This Code does not address other safety issues relating to the construction of boilers, pressure vessels, transport tanks, or nuclear components, or the inservice inspection of nuclear components or transport tanks. Users of the Code should refer to the pertinent codes, standards, laws, regulations, or other relevant documents for safety issues other than those relating to pressure integrity. Except for Sections XI and XII, and with a few other excep-tions, the rules do not, of practical necessity, reflect the likelihood and consequences of deterioration in service re-lated to specific service fluids or external operating environments. In formulating the rules, the Committee consid-ers the needs of users, manufacturers, and inspectors of pressure vessels. The objective of the rules is to afford rea-sonably certain protection of life and property, and to provide a margin for deterioration in service to give a reason-ably long, safe period of usefulness. Advancements in design and materials and evidence of experience have been

recognized. 委员会的职能仅涉及压力完整性安全规则的制定，这些规则管辖了锅炉、压力容器、运输罐和

核能单元的建造**，以及核能单元和运输罐的在役检查。委员会还在涉及这些规则之意图有提出的询问时

*

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亦会进行解释。本本规范不涉及与锅炉、压力容器、运输罐或核能单元构造有关的其他安全问题，或核能

单元或运输罐的在役检查。与压力完整性有关的安全问题，本规范用户应参考有关安全问题之相关规范、

标准、法律、法规或其他相关文件。除XI和第XII卷，以及另外一些例外情况外，对特定服务流体或外部操

作环境相关之运转中恶化问题的可能性和后果的实际必要性在这些规则中亦不作出反映。在制订规则时，

委员会审议压力容器用户，制造商和检验员的需要。制定规则的目的是为生命和财产提供合理的某种保

护，并为运行中之恶化问题提供了裕度，以做出一个相当安全又长期间的可用期。规范对先进的设计、材

料以及得到验证的实践经验都得到了认可。

** Construction, as used in this Foreword, is an all-inclusive term comprising materials, design, fabrication, examination,

inspection, testing, certification, and pressure relief. 本前言中所采用之建造一词是将材料、设计、制造、检测、检验、试

验、认证和泄压等全包括在内的一个术语。

This Code contains mandatory requirements, specific prohibitions, and nonmandatory guidance for construction activities and inservice inspection and testing activities. The Code does not address all aspects of these activities and those aspects that are not specifically addressed should not be considered prohibited. The Code is not a handbook and cannot replace education, experience, and the use of engineering judgment. The phrase engineering judgement refers to technical judgments made by knowledgeable engineers experienced in the application of the Code. Engi-neering judgments must be consistent with Code philosophy, and such judgments must never be used to overrule

mandatory requirements or specific prohibitions of the Code. 本规范包含了用之于建造活动、在役检查和检测

活动等有关的强制性要求、特定禁令和非强制性指引。规范本身并未涉及这些活动的所有方面，然对于那

些没有具体涉及到之见地是不应被视为是被禁止的。由于本规范本身并不是手册，所以它不能用来取代教

育、经验和工程判断上的采用。术语 “工程判断” 是指在应用本规范时由经验丰富又知识渊博之工程师所

做出的技术判断。工程判断必须符合规范宗旨，并且这种判断不得用于否定强制性要求或规范中的特定禁

令。

The Committee recognizes that tools and techniques used for design and analysis change as technology pro-gresses and expects engineers to use good judgment in the application of these tools. The designer is responsible for complying with Code rules and demonstrating compliance with Code equations when such equations are manda-tory. The Code neither requires nor prohibits the use of computers for the design or analysis of components con-structed to the requirements of the Code. However, designers and engineers using computer programs for design or analysis are cautioned that they are responsible for all technical assumptions inherent in the programs they use and

the application of these programs to their design. 委员会承认，用之于设计、分析工具和技术伴随着技术发展

而不断地再改变，因此期望工程师们在应用这些工具时能作出可靠的论断。设计师之责任是遵守规范要

求，以及证明其计算都是遵循强制性规范方程式的。按“规范”要求所构建之物项，就规范之立场而言，

它既不要求也不禁止采用计算器进行设计或分析。然而，采用计算器编程进行设计或分析之设计者和工程

师们应意识到，对自己所采用之编程中的所有固有假设技术以及将这些编程应用到其设计上的所应负起之

责任。

The rules established by the Committee are not to be interpreted as approving, recommending, or endorsing any proprietary or specific design, or as limiting in any way the Manufacturer's organization's freedom to choose any

method of design or any form of construction that conforms to the Code rules. 由委员会所制定之规章不得被解释

为对任何专利或特定设计的认可(批准)、建议或保证，或者以任何方式限制组织自由选用任何符合规范规

定的设计方法或结构形式。

The Committee meets regularly to consider revisions of the rules, new rules as dictated by technological devel-opment, Code Cases, and requests for interpretations. Only the Committee has the authority to provide official inter-pretations of this Code. Requests for revisions, new rules, Code Cases, or interpretations shall be addressed to the Secretary in writing and shall give full particulars in order to receive consideration and action (see Submittal of Technical Inquiries to the Boiler and Pressure Vessel Standards Committees). Proposed revisions to the Code result-ing from inquiries will be presented to the Committee for appropriate action. The action of the Committee becomes effective only after confirmation by ballot of the Committee and approval by ASME. Proposed revisions to the Code approved by the Committee are submitted to the American National Standards Institute (ANSI) and published

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athttp://cstools.asme.org/csconnect/public/index.cfm?PublicReview=Revisions to invite comments from all inter-ested persons. After public review and final approval by ASME, revisions are published at regular intervals in Edi-

tions of the Code. 委员会定期召开会议并对规章的修订、配合技术上的开发制定新规定、规范案例以及对条

款解释的请求文进行审议。只有委员会有权对本规章提供正式解释。修订、新规则、规范案例或请求解释

都应以书面形式提交给秘书处，并应提供详细数位，以便接受审议和采取行动 [见向锅炉及压力容器委员会

提交技术咨询]。由于询问而拟议之规范修订将提交给委员会，以便采取适当行动。委员会之行动必须经委

员会投票确认和ASME批准后方能生效。将委员会所批准之拟议规范修订提交给美国国家标准学会

(ANSI)，并发布在http://cstools.asme.org/csconnect/public/index.cfm?PublicReview=Revisions 网页上，以便邀

请所有对规范修订有意见之人士共同参与审查。在公众审查和最终经ASME批准后，修订版本会在规范版

本中定期进行出版。

The Committee does not rule on whether a component shall or shall not be constructed to the provisions of the Code. The scope of each Section has been established to identify the components and parameters considered by the

Committee in formulating the Code rules. 委员会不对是否应按照“守则”的规定构建一个物项作出裁决。对

已制定之各卷适用范围可作为委员会在制定规范规章时所审议物项及参数的识别。

Questions or issues regarding compliance of a specific component with the Code rules are to be directed to the ASME Certificate Holder (Manufacturer). Inquiries concerning the interpretation of the Code are to be directed to the Committee. ASME is to be notified should questions arise concerning improper use of an ASME Certification

Mark. 有关符合规范规章之特定单元的质疑或问题应被导向ASME证书持有者(制造商)。关于规范解释之询

问应提交委员会。一旦发生有关ASME认证标记不当采用问题时，ASME应被通知。

When required by context in this Section, the singular shall be interpreted as the plural, and vice versa, and the

feminine, masculine, or neuter gender shall be treated as such other gender as appropriate. 当本卷中的上下文需要

时，应把单数理解为为复数，反之亦然，并且把阴、阳或中性当作其他合宜性别对待。

STATEMENT OF POLICY ON THE USE OF THE CER-

TIFICATION MARK AND CODE AUTHORIZATION IN

ADVERTISING 关于在宣传中采用认证标记和规范授权之政策声明

ASME has established procedures to authorize qualified organizations to perform various activities in accord-ance with the requirements of the ASME Boiler and Pressure Vessel Code. It is the aim of the Society to provide recognition of organizations so authorized. An organization holding authorization to perform various activities in

accordance with the requirements of the Code may state this capability in its advertising literature. ASME对按

〝ASME 锅炉及压力容器规范〞要求从事各项活动之认可组织已制定了一套授权规程。协会旨在对如此授

权之组织提供认可(识别)。持有根据规范要求执行各种活动之授权组织可在其广告文献中陈述此能力。

Organizations that are authorized to use the Certification Mark for marking items or constructions that have been constructed and inspected in compliance with the ASME Boiler and Pressure Vessel Code are issued Certifi-cates of Authorization. It is the aim of the Society to maintain the standing of the Certification Mark for the benefit of the users, the enforcement jurisdictions, and the holders of the Certification Mark who comply with all require-

ments. 惟有已取得ASME证书之授权组织方能对已按ASME BPVC建造和检验的物项或结构进行标记。本协

会之目的是在维护用户、执行管辖权单位和符合所有要求的认证标记持有者在利益上应有的认证标记地

位。

Based on these objectives, the following policy has been established on the usage in advertising of facsimiles of the Certification Mark, Certificates of Authorization, and reference to Code construction. The American Society of

http://cstools.asme.org/csconnect/public/index.cfm?PublicReview=Revisions

http://cstools.asme.org/csconnect/public/index.cfm?PublicReview=Revisions

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Mechanical Engineers does not“approve,”“certify,”“rate,”or “endorse”any item, construction, or activity

and there shall be no statements or implications that might so indicate. An organization holding the Certification Mark and/or a Certificate of Authorization may state in advertising literature that items, constructions, or activities

“are built (produced or performed) or activities conducted in accordance with the requirements of the ASME

Boiler and Pressure Vessel Code,”or“meet the requirements of the ASME Boiler and Pressure Vessel Code.”

An ASME corporate logo shall not be used by any organization other than ASME. 基于这些标杆，就认证标记、

授权证书和参考规范建造之传真广告影印本之采用已制定了以下方针。ASME不作出“批准”、“证

明”、“定级”或 “认可” 任何物项、建造或活动，且不作出具有暗示含意之陈述或推断。持有认证标记

和/或授权证书组织可以在广告文献中声明物项、建造或活动是〝根据ASME BPVC建造而成的(生产或执行)

或在满足ASME BPVC要求下所执行的各项活动〞。任何ASME以外的组织不得采用ASME〝协会标记〞。

The Certification Mark shall be used only for stamping and nameplates as specifically provided in the Code. However, facsimiles may be used for the purpose of fostering the use of such construction. Such usage may be by an association or a society, or by a holder of the Certification Mark who may also use the facsimile in advertising to show that clearly specified items will carry the Certification Mark. General usage is permitted only when all of a

Manufacturer's organization's items are constructed under the rules. 认证标记仅适用于本规范中具体规定之打印

和铭牌。然而，摹本可用于鼓励采用此类建造之标杆上。可藉由协会、学会或可藉由认证标记持有者在广

告中采用摹本以显示所明确指定之物项将具有认证标记符做出此类运用。所有组织之物项只有在规章(规

定)下构建完成时，综合运用才被允许。

STATEMENT OF POLICY ON THE USE OF ASME MARKING TO IDENTIFY MANUFACTURED ITEMS

采用 ASME 标记识别制造物项之政策声明

The ASME Boiler and Pressure Vessel Code provides rules for the construction of boilers, pressure vessels, and nuclear components. This includes requirements for materials, design, fabrication, examination, inspection, and stamping. Items constructed in accordance with all of the applicable rules of the Code are identifieded with the offi-

cial Certification Mark described in the governing Section of the Code. ASME BPVC为锅炉构造、压力容器构造

和核能单元构造分别做出了相应条款。这包括材料、设计、制造、检测、检验和打钢印等应用上的要求。

根据规范适用条款所建造完成之物项，应采用规范相应执掌卷所述之官方认证标记予以识别。

Markings such as“ASME,”“ASME Standard,”or any other marking including“ASME”or the Certifica-

tion Mark shall not be used on any item that is not constructed in accordance with all of the applicable requirements

of the Code. 诸如“ASME”、“ASME标准” 标记，或包括“ASME”在内的任何其他标记，或者是认证

标记都不被应用在不符合本规范所有适用要求之任何物项上。

Items shall not be described on ASME Data Report Forms nor on similar forms referring to ASME that tend to imply that all Code requirements have been met when, in fact, they have not been. Data Report Forms covering items not fully complying with ASME requirements should not refer to ASME or they should clearly identify all

exceptions to the ASME requirements. 不符合规范不管是ASME 数位报告表格还是参照ASME的类似格式若意

味着物项在事实上尚未满足所有“规范”适用要求之倾向时则不应作出任何的描述。涵盖不完全符合

ASME要求之物项的数位报告表格不应参考ASME，或者应清楚地标识出所有ASME所要求之例外情况。

VI

SUBMITTAL OF TECHNICAL INQUIRIES TO THE

BOILER AND PRESSURE VESSEL STANDARDS COM-

MITTEES 向锅炉和压力容器委员会提交技术咨询之方式

1 INTRODUCTION 引言

(a) The following information provides guidance to Code users for submitting technical inquiries to the com-mittees. See Guideline on the Approval of New Materials Under the ASME Boiler and Pressure Vessel Code in Section II, Parts C and D for additional requirements for requests involving adding new materials to the Code. Technical inquiries include requests for revisions or additions to the Code rules, requests for Code Cases, and re-

quests for Code Interpretations, as described below. 以下信息为规范用户向委员会提交技术咨询提供了指导。

涉及将新材料追加到规范中的请求，其所需之辅助要求可参见在ASME BPVC第二卷 C篇和D篇中的新材料

审批指南。技术查询包括对规范规章调整或增补请求、规范案例请求和规范解释请求，如下所述。

(1) Code Revisions. Code revisions are considered to accommodate technological developments, address

administrative requirements, incorporate Code Cases, or to clarify Code intent. 规范调整。规范调整是为迎合技

术发展、满足行政管理要求、纳入规范案例或澄清规范含意而对规范内容进行修订的。

(2) Code Cases. Code Cases represent alternatives or additions to existing Code rules. Code Cases are written as a question and reply, and are usually intended to be incorporated into the Code at a later date. When used, Code Cases prescribe mandatory requirements in the same sense as the text of the Code. However, users are cau-tioned that not all jurisdictions or owners automatically accept Code Cases. The most common applications for

Code Cases are: 规范案例。规范案例代表现有规范规章的替代或增补。规范案例写成问题和答复，并往往

在稍后的日期里就会纳入规范。在采用时，规范案例具有与规范文本相同意义上的强制性要求。但是，用

户应注意的是：并非所有行政辖区或业主都会自动接受规范案例。规范案例最常见的应用是：

(-a) to permit early implementation of an approved Code revision based on an urgencyt need 许可早

期基于新材料用于规范建造之急迫性所批准的规范调整

(-b) to permit the use of a new material for Code construction 允许新材料用于规范建造中

(-c) to gain experience with new materials or alternative rules prior to incorporation directly into the

Code 在直接纳入规范之前取得新材料或替代规章的经验

(3) Code Interpretations. Code Interpretations provide clarification of the meaning of existing rules in the Code, and are also presented in question and reply format. Interpretations do not introduce new requirements. In cases where existing Code text does not fully convey the meaning that was intended, and revision of the rules is re-

quired to support an interpretation, an Intent Interpretation will be issued and the Code will be revised. 规范解释。

规范解释阐明了规范中现有条款的含义，并以问答形式提出。解释不引入新的要求。如果现有规范本文没

有充分表达意图的含义，而需要修订规范以支持解释时，则会发布意图解释，并修订规范。

(b) The Code rules, Code Cases, and Code Interpretations established by the committees are not to be consid-ered as approving, recommending, certifying, or endorsing any proprietary or specific design, or as limiting in any way the freedom of manufacturers, constructors, or owners to choose any method of design or any form of construc-

tion that conforms to the Code rules. 由委员会所确立之规范条款、规范案例和规范解释不得视为批准、建

议、保证或支持任何专利权或特定设计，还是以任何方式限制制造商、建造商，或业主选用任何符合规范

规章的设计方法或任何形式的建造。

(c) Inquiries that do not comply with these provisions or that do not provide sufficient information for a com-

mittee,s full understanding may result in the request being returned to the inquirer with no action. 不符合这些规定

之查询，或不能为委员会提供足够的信息，以让委员会充分了解而导致请求退回给询问者，此时无需采取

VII

任何行动。

2 INQUIRY FORMAT 询问的格式

Submittals to a committee shall include: 向委员会提交的报告应包括：

(a) Purpose. Specify one of the following: 目的。指定以下选项之一：

(1) revision of present Code rules 修订现有规范条款

(2) new or additional Code rules 新的或其它的规范条款

(3) Code Case 规范案例

(4) Code Interpretation 规范解释

(b) Background. Provide the information needed for the committee,s understanding of the inquiry, being sure to include reference to the applicable Code Section, Division, Edition, Addenda (if applicable), paragraphs, figures,

and tables. Preferably, provide a copy of the specific referenced portions of the Code. 背景。为委员会对询问的

理解提供所需信息，对查询的理解，该询问必须包括所引用的规范卷、册、版本、增补(如有)、段落、图

和表号。最好是提供规范具体引用部分之副本。

(c) Presentations. The inquirer may desire or be asked to attend a meeting of the committee to make a formal presentation or to answer questions from the committee members with regard to the inquiry. Attendance at a com-mittee meeting shall be at the expense of the inquirer. The inquirer's attendance or lack of attendance at a meeting

shall not be a basis for acceptance or rejection of the inquiry by the committee. 陈述。询问者可能希望或被要求

参加委员会之会议，以进行正式陈述或回答委员会成员关于询问上的相关问题。参加委员会会议应由询问

者自行承担费用。询问者出席或缺席出席会议不得作为委员会接受或拒绝询问的依据。

3 CODE REVISIONS OR ADDITIONS 修订版本或或增补

Requests for Code revisions or additions shall provide the following: 规范调整请求或其它的规范请求均应

提供以下内容：

(a) Proposed Revisions or Additions. For revisions, identify the rules of the Code that require revision and submit a copy of the appropriate rules as they appear in the Code, marked up with the proposed revision. For addi-

tions, provide the recommended wording referenced to the existing Code rules. 拟议调整或增补。对于调整，应

确定要求调整规范条文，并提交在规范中所出现知适当条文副本，副本并标有"拟议的调整" 字样。对于增

补，请提供引用现有规范规章的建议措词。所需之陈述。简要解释调整或增补的需要性。

(b) Statement of Need. Provide a brief explanation of the need for the revision or addition. 所需之陈述。简

要解释调整或增补的需要性。

(c) Background Information. Provide background information to support the revision or addition, including any data or changes in technology that form the basis for the request that will allow the committee to adequately evaluate the proposed revision or addition. Sketches, tables, figures, and graphs should be submitted as appropriate. When applicable, identify any pertinent paragraph in the Code that would be affected by the revision or addition

and identify paragraphs in the Code that reference the paragraphs that are to be revised or added. 背景讯息。提供

背景讯息以支持调整或增补，包括作为请求基础的任何数位或技术变更，以便委员会能够充分评估拟议的

调整或增补。草图、表号、图号和图表号应酌情提交。在适用时，确定规范中将受调整或增补影响的任何

相关段落，并确定规范中被提及将要调整或增补所引用段落的段落号。

VIII

4 CODE CASES 规范案例

Requests for Code Cases shall provide a Statement of Need and Background Information similar to that de-fined in 3(b) and 3(c), respectively, for Code revisions or additions. The urgency of the Code Case (e.g., project un-derway or imminent, new procedure, etc.) must be defined and it must be confirmed that the request is in connection with equipment that will bear the Certification Mark, with the exception of Section XI applications. The proposed Code Case should identify the Code Section and Division, and be written as a Question and a Reply in the same for-mat as existing Code Cases. Requests for Code Cases should also indicate the applicable Code Editions and Ad-

denda (if applicable) to which the proposed Code Case applies. 规范案例请求应提供类似于3(b)和3(c)中所定义

之规范调整或增补的需求声明和背景信息。必须定义规范案例的紧迫性(例如，正在进行或即将到来的物

项、新规程等)，并且必须确认该请求与背负认证标记之设备相关，但第XI卷申请的例外。拟议规范案例应

确定相应之规范卷和册，并以与现有规范案例相同的格式写成问题和应答。对规范案例请求还应指明适用

拟议规范案例之适用规范版本和附录(如适用)。

5 CODE INTERPRETATIONS

规范解释

(a) Requests for Code Interpretations shall provide the following: 请求规范解释应提供询问。提供一个简

明扼要的问题，省略多余的背景资料，并在可能的情况下，以“是”或“否”答复，如果需要简短但书，

是可以接受的。此问题在技术上和编辑上都是正确的。

(1) Inquiry. Provide a condensed and precise question, omitting superfluous background information and, when possible, composed in such a way that a “yes” or a “no” Reply, with brief provisos if needed, is accepta-

ble. The question should be technically and editorially correct. 询问。提供一个简明扼要的问题，省略多余的背

景资料，并在可能的情况下，以“是”或“否”答复，如果需要简短但书，是可以接受的。此问题在技术

上和编辑上都是正确的。

(2) Reply. Provide a proposed Reply that will clearly and concisely answer the Inquiry question. Prefera-

bly, the Reply should be “yes” or “no,” with brief provisos if needed. 答复。对询问的问题提出一个清楚简明的

答复建议，宜为"是"或"否时，可加上简单的前提条件。

(3) Background Information. Provide any background information that will assist the committee in

understanding the proposed Inquiry and Reply. 背景信息。提供任何有助于委员会理解拟议的询问和应答的背

景信息。

(b) Requests for Code Interpretations must be limited to an interpretation of a particular requirement in the

Code or a Code Case. The committee cannot consider consulting type requests such as the following: 规范解释须

仅限于规范或规范案例中对特定规定的解释。委员会不能考虑询问类型请求，例如：

(1) a review of calculations, design drawings, welding qualification, or descriptions of equipment or

parts to determine compliance with Code requirements; 审查计算、设计图纸、焊接资格或对设备或物项的描

述，以确定是否符合规范要求；

(2) a request for assistance in performing any Code-prescribed functions relating to, but not limited to,

material selection, designs, calculations, fabrication, inspection, pressure testing, or installation;协助执行任何与规

范有关的(但不限于)材料选用、设计、计算、制造、检验、压力试验或安装；

(3) a request seeking the rationale for Code requirements. 寻求规范规定的请求理由。

6 SUBMITTALS 提交

Submittals to and responses from the committees shall meet the following: 提交和各委员会的答复应满足以

IX

下要求：

(a) Submittal. Inquiries from Code users shall be in English and preferably be submitted in typewritten form; however, legible handwritten inquiries will also be considered. They shall include the name, address, telephone

number, fax number, and e-mail address, if available, of the inquirer and be mailed to the following address: 提交。

规范用户的询问应为英文，最好以打字形式提交；然而，清晰的手写询问也会予以考虑。它们应包括询问

者的姓名、地址、电话号码、传真号码和电子邮箱地址(如有的话) ，并邮寄到以下地址：

Secretary ASME Boiler and Pressure Vessel Committee Two Park Avenue New York, NY 10016-5990

As an alternative, inquiries may be submitted via e-mail to: [email protected] or via our online tool at http://go.asme.org/InterpretationRequest.

(b) Response. The Secretary of the appropriate committee shall acknowledge receipt of each properly pre-pared inquiry and shall provide a written response to the inquirer upon completion of the requested action by the

committee. 答复。相应委员会之秘书处应确认收到每项适当准备的询问，并在委员会要求采取的行动完成

后，向询问者提供书面答复。

X

CROSS-REFERENCING AND STYLISTIC CHANGES IN

THE BOILER AND PRESSURE VESSEL CODE 锅炉及压力容器的交叉引用和格式变化

There have been structural and stylistic changes to BPVC, starting with the 2011 Addenda, that should be noted

to aid navigating the contents. The following is an overview of the changes: 从2011 年增补开始，锅炉及压力容

器规范在结构上和格式上都产生了变化，以使采用者能方便地查看内容。对这些变动全面描述如下：

Subparagraph Breakdowns/Nested Lists Hierarchy 段落分层/段落排列层次

First-level breakdowns are designated as (a), (b), (c), etc., as in the past. 第一层段落的标记编序和以前相

同为(a) 、(b) 、(c) 等。

Second-level breakdowns are designated as (1), (2), (3), etc., as in the past. 第二层段落的标记编序和以前

相同为(1)、(2) 、(3) 等。

Third-level breakdowns are now designated as (-a), (-b), (-c), etc. 第三层段落的标记编序现为(a) 、(b) 、

(c) 等。

Fourth-level breakdowns are now designated as (-1), (-2), (-3), etc. 第四层段落的标记编序现为(-1) 、(-

2) 、(-3) 等。

Fifth-level breakdowns are now designated as (+a), (+b), (+c), etc. 第五层段落的标记编序现为(+ a) 、

(+b) 、(+c) 等。

Sixth-level breakdowns are now designated as (+1), (+2), etc. 第六层段落的标记编序现为(+ 1) 、(+2) 、

(+3) 等。

Footnotes 注脚

With the exception of those included in the front matter (roman-numbered pages), all footnotes are treated as

endnotes. The endnotes are referenced in numeric order and appear at the end of each BPVC section/subsection. 除

正文前(页次以罗马数位编序的部分) 的内容中包含的脚注外，所有的脚注都编为后注，具体内容按照数位

编号在锅炉及压力容器各卷册的未页出现。

Submittal of Technical Inquiries to the Boiler and Pressure Vessel Standards Committees 向锅炉及压力容器

委员会提交技术咨询书的方式

Submittal of Technical Inquiries to the Boiler and Pressure Vessel Standards Committees has been moved to the

front matter. This information now appears in all Boiler Code Sections (except for Code Case books). "向锅炉及压

力容器委员会提交技术咨询书的方式" 已经移至正文前。这个信息现已发布在所有锅炉规范卷册(除 "规范

案例" 卷外)中。

Cross-References 交叉引用

It is our intention to establish cross-reference link functionality in the current edition and moving forward. To

facilitate this, cross-reference style has changed. Cross-references within a subsection or subarticle will not include

the designator/identifieder of that subsection/subarticle. Examples follow: 为方便地在现行和以后版本中制定起

规范交叉引用的链接功能，对规范交叉引用的模式做了变动。在同一章节或同一篇中的交叉引用时，将述

明引用章节时，将不再含有本章节/本分篇的编号。如：

XI

(Sub-)Paragraph Cross-References. The cross-references to subparagraph breakdowns will follow the hier-

archy of the designators under which the breakdown appears. (分)段内交叉引用。在本节内的下层次分段引用将

按照要引用分段的层次来述说。

– If subparagraph (-a) appears in X.1(c)(1) and is referenced in X.1(c)(1), it will be referenced as (-a). 如

X.1 (c) (1)段中的(a) 分段，在X.1 (c) (1)段内引用，则引用时注明为(a) 。

– If subparagraph (-a) appears in X.1(c)(1) but is referenced in X.1(c)(2), it will be referenced as (1)(-a). 如

X.1 (c) (1)段中的(a) 分段，在X.1 (c) (2) 段内引用，则引用时需注明为(1) (a) 。

– If subparagraph (-a) appears in X.1(c)(1) but is referenced in X.1(e)(1), it will be referenced as (c)(1)(-a).

如X.1 (c) (1)段中的(a) 分段，在X.1 (e) (2) 段内引用，则引用时需注明为(c) (1) (-a) 。

– If subparagraph (-a) appears in X.1(c)(1) but is referenced in X.2(c)(2), it will be referenced as

X.1(c)(1)(-a). 如X.1 (c) (1) 放中的(a) 分段，在X.2 (c) (2) 段内引用，则引用时需注明为X.1 (c) (1) (a) 。

Equation Cross-References. The cross-references to equations will follow the same logic. For example, if

eq. (1) appears in X.1(a)(1) but is referenced in X.1(b), it will be referenced as eq. (a)(1)(1). If eq. (1) appears in

X.1(a) (1) but is referenced in a different subsection/subarticle/paragraph, it will be referenced as eq. X.1(a)(1)(1).

方程式交叉引用。方程式交叉引用按照相同的条理注述。例如X.1 (a) (1)段中方程式(1)在X.1 (b) 段中引用，

则引用时注明为方程式(a) (1) (1) 。如X.1 (a) (1)段中方程式(1)在其他分卷/分篇/章节中引用时，则引用时注

明为方程式X.1 (a) (1) (1)。

1

SUBSECTION A NONDESTRUCTIVE METHODS OF

EXAMINATION A 分卷无损检测方法

ARTICLE 1 GENERAL REQUIREMENTS 第 1 章通用要求

T-110 SCOPE 适用范围

This Section of the Code contains requirements and methods for nondestructive examination (NDE), which are Code requirements to the extent they are specifically referenced and required by other Code Sections or referencing document. These NDE methods are intended to detect surface and internal imperfections in materials, welds, fabri-cated parts, and components. They include radiographic examination, ultrasonic examination, liquid penetrant ex-amination, magnetic particle examination, eddy current examination, visual examination, leak testing, and acoustic emission examination. See Nonmandatory Appendix A of this Article for a listing of common imperfections and

damage mechanisms, and the NDE methods that are generally capable of detecting them. 本规出范卷所包含之无

损检测要求和方法之所以被引用乃是出至于其他规范､其他建造卷或参照中特别提到和要求的关系。这些

无损检测方法是用于检测材料、焊缝和加工零物项表面和内部瑕疵的，其中它们包括了射线照相检测、超

声波检测、液渗透检测、磁粉检测、涡流检测、目视检验、泄漏检测和声发射检测。在本章非强制性附录

A 中已列出了各种无损检测方法通常应用所能检测之一般瑕疵和机械损伤。

For general terms such as Inspection, Flaw, Discontinuity, Evaluation, etc., refer to Mandatory Appendix I. 对

于检测、缺陷、不连续，评估等通用术语，请参见强制性附录 I。

T-120 GENERAL 通则

(a) Subsection A describes the methods of nondestructive examination to be used if referenced by other Code

Sections or referencing documents. 当其他规范卷或参考文献引用而采用无损检测方法时，在小组 A 做出了这

些检测方法之相关描述。

(b) Subsection B lists Standards covering nondestructive examination methods which have been accepted as standards. These standards are nonmandatory unless specifically referenced in whole or in part in Subsection A or as indicated in other Code Sections or referencing document.

在小组 B 中所列出标准涵盖了被接受为应用准则之无损检测方法。这些准则是非强制性的，除非在小组A

中全部或部分具体提及或在其他规范卷或参考文献中指出。

(c ) Any reference to a paragraph of any Article in Subsection A of this Section includes all of the applicable rules in the paragraph.1 In every case, reference to a paragraph includes all the subparagraphs and subdivisions un-

der that paragraph. 任何对本卷小组A 中任一章节段落之引用，应包括该章节中所有适用的规则 1。在每一

情况下，只要提及某一章节即表示包括该章节之下的所有分段和小节。

(d) Reference to a standard contained in Subsection B is mandatory only to the extent specified.2 只有在规定

的范围内，提及小组 B 所引用之标准才是强制性的 2 。

(e ) For those documents that directly reference this Article for the qualification of NDE personnel, the qualifi-cation shall be in accordance with their employer's written practice which shall be in accordance with one of the

following documents: 对于直接参考本段落中之那些文件以进行无损检验人员资格评定时，应根据其雇主之

书面作法进行并具有以下文件其中之一种：

(1) SNT-TC-1A,3 Personnel Qualification and Certification in Nondestructive Testing; or NT-TC-1A3

2

《Personnel Qualification and Certification in Nondestructive Testing》；或

(2) ANSI/ASNT CP-189, 3 ASNT Standard for Qualification and Certification of Nondestructive Testing

Personnel ANSI/ ASNT CP-1893《ASNT Standard for Qualification and Certification of Nondestructive Testing

Personnel》。

(f ) National or international central certification programs, such as the ASNT Central Certification Program (ACCP) or ISO 9712:2012-based programs, may be alternatively used to fulfill the training, experience, and exami-

nation requirements of the documents listed in (e) as specified in the employer's written practice. 可选用采用国家

或国际中央认证规程，如ASNT中心认证计划(ACCP)或 ISO 9712:2012基础计划，以满足在雇主之书面作

法中所规定(e)中所列文件的培训、经验和检测等要求。

(g) In addition to the requirements described in (e) or (f) above, if the techniques of computed radiography (CR), digital radiography (DR), phased-array ultrasonic technology (PAUT), or ultrasonic time-of-flight diffraction (TOFD) are to be used, the training, experience, and examination requirements found in Article 1, Mandatory Ap-

pendix II shall also be included in the employer's written practice for each technique as applicable. 除了上列(e) 或

(f) 所述之要求外，如果计算机射线照相术(CR)、数位射线照相术(DR)、超声相控阵技术(PAUT)，或超声衍

射时差(TOFD)被采用时，在强制性附录 II 第 1 条款中对于每种适用技术之训练､经验，和检测要求也应包

括在雇主的书面实施系细则中。

(h) When the referencing Code Section does not specify qualification or does not reference directly Article 1 of this Section, qualification may simply involve a demonstration to show that the personnel performing the nonde-

structive examinations are competent to do so in accordance with the organization's established procedures. 当所引

用之建造规范(卷)章节中未规定资格评定或不直接引用本卷第 1章时，资格评定可根据组织的既定规程进

行合宜地无损检测已证实人员是具有能力的。

(i ) The user of this Article is responsible for the qualification and certification of NDE Personnel in accordance with the requirements of this Article. The organization's4 Quality Program shall stipulate how this is to be accom-plished. Qualification in accordance with a prior edition of SNT-TC-1A, or CP-189 are valid until recertification. Recertification or new certification shall be in accordance with the edition of SNT-TC-1A or CP-189 specified in endnote.3 When any of the techniques included in (g) above are used, the additional requirements of that paragraph

shall also apply. 本章用户对根据本章要求取得相对资格和认证之NDE人员是要负起其所有活动之相对责任

的。组织 4之质量计划应规定如何实现这一标杆。根据 SNT-TC-1A或 CP-189先前版本所取得之资格仍是

有效，直到其重新认证。重新认证或新认证应符合脚注 3中所规定之 SNT-TC-1A或 CP-189版本。当采用

上述(g)中所包括知任一技术时，该段落之额外要求也适用。

(j ) Limited certification of nondestructive examination personnel who do not perform all of the operations of a nondestructive method that consists of more than one operation, or who perform nondestructive examinations of limited scope, may be based on fewer hours of training and experience than recommended in SNT-TC-1A or CP-189. Any limitations or restrictions placed upon a person's certification shall be described in the written practice and

on the certification. 对于取得有限认可资格或执行范围有限之无损检测人员来说，是不能执行由多于一个无

损检测所组成操作方法中的所有检测操作，而这些检测人员可根据 SNT-TC-1A 或 CP-189中所规定之较少

推荐培训、经验时间来获取相对资格。在个人认证上所设置之任何限度或限制都应在书面做法和认证中做

出描述。

(k ) Either U.S. Customary Units or SI Units may be used for compliance with all requirements of this edition,

but one system shall be used consistently throughout for all phases of construction. 美国习惯单位制或国际单位制

均能满足此本版之所有要求，但在整个建造阶段应仅采用一个单位系统，以求在整体单位上的一制性。

(1) Either the U.S. Customary Units or SI Units that are listed in Mandatory Appendix II are identifieded in the text, or are identifieded in the nomenclature for equations shall be used consistently for all phases of construc-tion (e.g., materials, design, fabrication, and reports). Since values in the two systems are not exact equivalents,

each system shall be used independently of the other without mixing U.S. Customary Units and SI Units. 在强制性

附录II中所列出之美国习惯单位或SI单位已在文本中做出识别，或者在方程式术语中被识别，然在所有构造

阶段应采用一致性单位制(例如材料、设计、制造和报告)。由于两个单位系统中的值不是精确的当量值，

所以每单位系统应单独于其他系统采用，而不将美国惯常单位和SI单位混合采用。

3

(2) When SI Units are selected, U.S. Customary values in referenced specifications that do not contain SI Units shall be converted to SI values to at least three significant figures for use in calculations and other aspects of

construction. 当选用SI单位时，不包含SI单位之参考规范中的美国习惯单位应至少转换为三个有效数位的SI

值，以用于计算和其他结构方面上。

T-130 EQUIPMENT 设备

It is the responsibility of the Code User to ensure that the examination equipment being used conforms to the

requirements of this Code Section. 规范用户有责任确保所采用之检测设备符合本规范卷要求。

T-150 PROCEDURE 规程

(a) When required by the referencing Code Section, all nondestructive examinations performed under this Code Section shall be performed following a written procedure. A procedure demonstration shall be performed to the satisfaction of the Inspector. When required by the referencing Code Section, a personnel demonstration may be used to verify the ability of the examiner to apply the examination procedure. The examination procedure shall comply with the applicable requirements of this Section for the particular examination method. Written procedures shall be made available to the Inspector on request. At least one copy of each procedure shall be readily available to

the Nondestructive Examination Personnel for their reference and use. 当引用相关建造规范(卷)章节之要求时，

根据本规范卷所进行之所有无损检测应按照书面规程执行。规程演示应满足检验员之要求。当引用规范章

节要求时，可让人员进行演示，以证实检验员备有检测规程的应用能力。检测规程应符合本卷相应检测方

法之要求。书面规程应根据要求提供给检验员。每一规程应至少有一副本随时可供无损检测人员参考及采

用。

(b) The nondestructive examination methods and techniques included in this Section are applicable to most geometric configurations and materials encountered in fabrication under normal conditions. Whenever special configurations or materials require modified methods and techniques, the organization shall develop special proce-dures which are equivalent or superior to the methods and techniques described in this Code Section, and which are capable of producing interpretable examination results under the special conditions. Such special procedures may be modifications or combinations of methods described or referenced in this Code Section. A procedure demonstration shall be performed to verify the technique is capable of detecting discontinuities under the special conditions equal to the capabilities of the method when used under more general conditions. These special procedures shall be sub-mitted to the Inspector for acceptance when required by the referencing Code Section, and shall be adopted as part

of the Manufacturer's organization's▲

quality control program. 在正常条件下，在本卷中所涵盖之无损检测方法

和技术可适用于制作中所碰到之大多数几何轮廓和材料。每当特殊轮廓或材料需要修改方法和技术时，组

织应制定与本规范卷所述方法和技术相当或优于它，并且能够在特殊条件下产生可解释的检测结果。此类

特殊规程有可能源至于本规范卷所述或引用方法的修定或组合，且应对此特殊规程进行演示，以验证该技

术在特殊条件下所检测出之不连续性能力具有与在一般条件下所采用方法的等同能耐。当引用规范章节相

关章节之要求时，这些特殊规程应提交给检验员认可，并作为组织所采用的一部。

(c ) When a referencing Code Section requires an examination to be performed in accordance with the re-quirements of this Section, it shall be the responsibility of the organization to establish nondestructive examination

procedures and personnel qualification and certification procedures conforming to the referenced requirements. 当

引用规范章节相关章节之要求时，应根据本卷之要求进行检测时，组织有责任制定符合引用要求的无损检

测规程、人员资格与鉴定规程。

(d) When qualification of the written examination procedure is required by the referencing Code Section, it

shall be qualified by performing a demonstration examination which shall be performed 当引用规范章节要求书面

检测规程评定时，应通过进行演示检测来取得认可资格。

4

(1) under the control and supervision of a Level III Examiner who is qualified and certified for per-forming the examination method and technique specified by the procedure, and shall be witnessed by the Inspector.

The supervising Level III may be an employee of the qualifying organization or a subcontractor organization. 为本

规程所规定之检测方法和技术的认可和授权应在三级检测人员之控制和监督下进行书面编制，并在此检测

人员之见证下完成认可与授权规程。监督三级可以是合格组织之雇员或分包商组织的雇员。

(2) on a minimum of one test specimen having flaws whose size, location, orientation, quantity, and characterization have been determined prior to the demonstration and are known only by the supervising Level III

Examiner. 试样至少具有一个缺陷，此缺陷之尺寸､位置､取向､数量和特性已在演示前确定，并仅让监督

III级检测员知道。

(-a) The maximum acceptable flaw size, required flaw orientation, and minimum number of flaws

shall be as specified by the referencing Code Section. 最大可接受缺陷尺寸､所需缺陷取向和最小缺陷数应符

合引用规范章节之规定。

(-b) Natural flaws are preferred over artificial flaws whenever possible. 只要有可能的话，天然

瑕疵比手工瑕疵更可取。

(3) by a Level II or Level III Examiner (other than the supervising Level III) who is qualified and certi-

fied to perform the examination method and technique specified by the written procedure. II级或III级检测员(除监

督III级以外)，他们有资格进行书面规程编制，和所规定检测方法和技术的授权。

The procedure shall be considered qualified when the supervising Level III and the Inspector are satis-fied that indications produced by the demonstrated procedure effectively reveal the size, location, orientation, quan-

tity, and characterization of the flaws known to be present in the examined test specimen. 当监督III级和检验员对

演示规程所产生之指示能有效地显示已知受检检测样中缺陷的尺寸、位置、取向、数量和特性等结果感到

满意时，则该规程应被视为是认可的。

The qualification demonstration shall be documented as required by the referencing Code Section and by this Section, as set forth in the applicable Article for the examination method and the applicable Appendix for the specified examination technique. The qualification document shall be annotated to indicate qualification of the written procedure, and identify the examined test specimen. The name and/or identity and signature of the supervis-ing Level III and the witnessing Inspector shall be added to indicate their acceptance of the procedure qualification.

检测人员之资格证明应遵照引用规范章节和本卷之要求予以文件化，如下所述之适用章节的检测方法和适

用附录中所指定检测查技术。检测人员之资格文件应注明书面规程编号及检检测样之样号。应增加监督三

级和见证检验员的名称和/或身份以及他们的签名，以表示他们是接受此规程资格的。

T-160 CALIBRATION 校验

(a) The organization shall assure that all equipment calibrations required by Subsection A and/or Subsection

B are performed. 组织应确保本卷小组A和/或小组B所要求之所有设备校准被如期执行。

(b) When special procedures are developed [see T-150(a)], the Code User shall specify what calibration is

necessary, when calibration is required. 在制定特殊规程[见T-150(a)]时，规范用户应规定在需要校准时那些项

目需要进行校准。

T-170 EXAMINATIONS AND INSPECTIONS 检测和检验

(a) The Inspector concerned with the fabrication of the vessel or pressure part shall have the duty of verify-ing to his satisfaction that all examinations required by the referencing Code Section have been made to the require-ments of this Section and the referencing document(s). He shall have the right to witness any of these examinations to the extent stated in the referencing document (s). Throughout this Section of the Code, the word Inspector means

the Authorized Inspector who has been qualified as required in the various referencing Code Sections. 与压力容器

5

或压力物项制造有关之检验员有责任证实其检测都是遵照引用规范章节要求和引用文件进行，且所有检测

结果都能满足本卷和引用文件的要求。该检验员应有权在引用文件中所规定之范围内见证任何这些检测。

在本规范卷中只要显示检验员此一术语时即表示为各引用规范章节中所要求之授权检查员。

(b) The special distinction established in the various Code Sections between inspection and examination and the personnel performing them is also adopted in this Code Section. In other words, the term inspection applies to the functions performed by the Authorized Inspector, but the term examination applies to those quality control func-tions performed by personnel employed by the organization. One area of occasional deviation from these distinc-tions exists. In the ASTM Standard Methods and Recommended Practices incorporated in this Section of the Code by reference or by reproduction in Subsection B, the words inspection or Inspector, which frequently occur in the text or titles of the referenced ASTM documents, may actually describe what the Code calls examination or exam-iner. This situation exists becauseASTM has no occasion to be concerned with the distinctions which the Code makes between inspection and examination, since ASTM activities and documents do not involve the Authorized Inspector described in the Code Sections. However, no attempt has been made to edit the ASTM documents to con-form with Code usage; this should cause no difficulty if the users of this Section recognize that the terms inspection, testing, and examination in the ASTM documents referenced in Subsection B do not describe duties of the Author-

ized Code Inspector but rather describe the things to be done by the organization's examination personnel. 在各规

范卷业已针对检验和检测制定特定区分，以及执行检验和检测之人员也在本规范卷中亦采用此特殊区别。

换句话说，术语检验适用于由授权检验员所执行之功能，但术语检测则适用于为组织执行的那些质量控制

功能之雇用人员。存在偶然偏离这些区别的范围。在本规范卷小组B之ASTM标准方法和建议措施中，检验

或检验员(经常出现在所引用ASTM文件之本文或标题中)在实际上可能描述为“什么是规范所称的检测或检

测员"。之所以存在这种情况是因为ASTM没有太多时间关注检验和检测间的区别，因为ASTM活动和文件

不涉及规范卷中描述的授权检查员。然而，ASTM从未尝试对文件内容进行编辑以符合BPVC规范在采用上

的实际需求；如本卷用户能认知到：《小组B所引用之ASTM文件中的检验、检测和检测术语对授权检查员

职责是没有做出描述的，而是描述组织检测人员所要做的事情》，如此一来用户对此问题应就不会造成困

扰了。

T-180 EVALUATION 评估

The acceptance criteria for the NDE methods in this Section shall be as stated in the referencing Code Section, and where provided in the Articles of this Section. Acceptance criteria in the referencing Code Section shall take

precedence. 本卷中NDE方法之允收准则应参照引用规范章节，而不是在本卷之相关章节中做出规定。引用

规范章节中的允收准则应第一优先。

T-190 RECORDS/DOCUMENTATION 纪录/文件

(a) Documentation and records shall be prepared as specified by the referencing Code Section and the appli-

cable requirements of this Section. Examination records shall include the following information as a minimum: 文

件和记录应遵照引用规范章节和本卷之相关适用要求进行编制。检测记录至少应包括以下信息：

(1) date of the examination 检测日期

(2) name and/or identity and certification level (if applicable) for personnel performing the examination

执行检测之人员姓名和/或证书号和认证级别(如适用时)

(3) identification of the weld, part, or component examined including weld number, serial number, or

other identifieder 所检测之焊缝、物项或物项编号，其中包括焊缝数量、序列号或其他标识符

(4) examination method, technique, procedure identification, and revision 检测方法、技术、规程文

件编号和修订版号

(5) results of the examination 检测结果

6

(b) Personnel qualification and procedure performance demonstrations performed in compliance with the re-

quirements of T-150(a) or T-150(b) shall be documented as specified by the referencing Code Section. 按照T-

150(a)或T-150(b)要求所进行之人员资格和规程性能演示应遵照引用规范章节的相应规定进行记录。

(c ) When documentation requirements for personnel qualification and procedure performance demonstrations performed in compliance with the requirements of T-150(a) or T-150(b) are not specified by the referencing Code

Section, the following information shall be recorded as a minimum: 当引用规范章节未规定遵照T-150(a)或T-

150(b)所规定进行人员资格和规程性能演示文件要求时，以下信息至少应记录为：

(1) name of organization responsible for preparation and approval of the examination procedure 负责

准备和批准检测规程之组织名称

(2) examination method applied 所应用之检测方法

(3) procedure number or designation 规程文件编号或抬头名称

(4) number and date of most recent revision 最新修订版次和日期

(5) date of the demonstration 演示日期

(6) name and/or identity and certification level (if applicable) of personnel performing demonstration

进行演示人员之姓名和/或证书号和认证级别(如适用)

(d) Retention of examination records and related documentation (e.g., radiographs and review forms, ultra-

sonic scan files, etc.) shall be as specified by the referencing Code Section. 保留检测记录和相关文件(例如，X线

胶片和审查表格、超声波扫查文件等)应符合相应引用规范章节之规定。

(e ) Digital images and reviewing software shall be retained under an appropriate record retention system that

is capable of securely storing and retrieving data for the time period specified by the referencing Code Section. 数

位图像和审查软件应保留在适当的记录保存系统中，该记录保存系统能够在相应引用规范章节指定之时间

段内安全地贮存和检索数位。

MANDATORY APPENDIX I GLOSSARY OF TERMS FOR NONDESTRUCTIVE EXAMINATION

强制性附录 I 无损检测术语汇总

I-110 SCOPE 适用范围

This Mandatory Appendix is used for the purpose of establishing standard terms and the definitions of those

terms for Section V. 本本强制性附录旨在用于制定第BPVC第V卷之标准术语和这些术语的定义。

I-120 GENERAL REQUIREMENTS 通用要求

The terms and definitions provided in this Appendix apply to the nondestructive examination methods and techniques described in Section V. Some terms are identical to those provided in ASTM E1316, while others are Code specific. The terms are grouped by examination method, in the order of the Articles contained in Section V.

在本附录中所提供之术语和定义适用于BPVC第V卷中所描述的无损检测方法和技术。某些术语是与ASTM

E1316相同的，而其他术语是规范特有的。这些术语按照检查方法分组，按照第V节中的条款顺序排列。

I-121 GENERAL TERMS通用术语併入 SE 1316 – 17 Standard Terminology for Nondestructive Examinations 中

7

MANDATORY APPENDIX II SUPPLEMENTAL PERSONNEL QUALI-FICATION REQUIREMENTS FOR NDE CERTIFICATIONNDE

强制性附录 II 人员资格鉴定辅助要求

II-110 SCOPE 适用范围

This Appendix provides the additional personnel qualification requirements that are mandated by Article 1, T-120(g), and which are to be included in the employer’s written practice for NDE personnel certification, when any of the following techniques are used by the employer: computed radiography (CR), digital radiography (DR),

Phased Array Ultrasonic Technology (PAUT), and ultrasonic Time of Flight Diffraction (TOFD). 本附录提供了第

1章节 T-120(g)规定的附加人员资格要求，并且在雇主采用以下任何技术时，应包括在雇主的无损检测人员

认证书面实践中：计算机射线照相术(CR)、数位射线照相术(DR)、相控阵超声技术(PAUT)和超声衍射时差

法(TOFD)。

II-120 GENERAL REQUIREMENTS 一般要求

The requirements of Article 1 and this Mandatory Appendix, when applicable, shall be included in the em-

ployer’s written practice. 第 1章节和本强制性附录要求(如适用)应包括在雇主的书面实践中。

II-121 LEVEL I AND LEVEL II TRAINING AND EXPERIENCE REQUIREMENTS

一级和二级培训和经验要求

The following tables shall be used for determining the minimum hours for personnel without prior qualifica-tion in film, CR or DR techniques in radiography, and PAUT and TOFD techniques in ultrasonics to be included in

the employer’s written practice. See Tables II-121-1 and II-121-2. 下表格将用于确定在放射照相中的胶片放射

照相、CR或 DR技术，和在超声波中的 PAUT和 TOFD技术不具资格人员在雇主书面实践中所需之最小培

训时间。见表 II-121-1和 II-121-2。

II-122.1 In addition to the written examinations specified in Table II-122.1, all CR and DR technique qualifica-

tion shall include practical examinations consisting of, as a minimum除了表 II-122.1规定的书面考试外，所有

CR和 DR技术资格应包括实践考试，最低限度为：

(a) Level I practical examinations shall require five test 一级实践考试需操作五次检测

(b) Level II practical examinations shall require at least two test specimens, with each specimen con-

taining a minimum of two discontinuities. 二级实践考试应至少需要两个试样，每一试样至少包含两个不连续

性。

(c) The employer’s written practice shall define the grading criteria for all written and practical exami-

nations. 在雇主之书面实践中应对所有书面和实际考试的分级准则作出规定。

II-122.2 In addition to the written examinations specified in Table II-122.2, all ultrasonic technique certifications

shall include practical examinations consisting of, as a minimum除表 II-122.2所规定之书面考试外，所有超声

波技术鉴定应包括实际检测操作，至少为

(a) Level II practical examinations shall require at least two test specimens, with each specimen con-

taining a minimum of two discontinuities. 二级实践考试应需两个试样，每一试样至少包含两个不连续点。

(b) The employer's written practice shall define the grading criteria for all written and practical exami-

nations. 在雇主之书面实践中应对所有书面和实际考试的分级准则作出规定。

8

II-122 LEVEL III REQUIREMENTS 三级要求

Level III personnel shall be responsible for the training and qualification of individuals in the NDE techniques described in this Mandatory Appendix. As a minimum, the requirements of Level III personnel shall include each of

the following: III级人员应负责本强制性附录中所描NDE技术中的个人培训和资格。III级人员最低要求应

包括以下各项：

(a) hold a current Level III certification in the Method在方法中持有目前的 III级认证

(b) meet the Level II requirements per II-121 (training and experience) and II-122 (examinations) in the

technique 在该技术中符合 II-121(训练和经验)和 II-122(检测)的 II级要求

(c) have documented evidence in the preparation of NDE procedures to codes, standards, or specifica-

tions relating to the technique 在编制无损检验规程与该技术方面有关的之规范，标准或说明书应有文件证据

(d) demonstrate proficiency in the evaluation of test results in the technique 证明能熟练掌握技术中检

测结果的评价

(e) A Level III who fulfills the above requirements may perform examinations in the applicable tech-

nique. 满足上述要求的 III级人员可以在适用的技术中进行考试。

II-124 TRAINING OUTLINES 训练大纲

II-124.1 Computed Radiography (CR) Topical Train ing Outlines. Topical training outlines appropriate for the training of Level I and Level II personnel in computed radiography may be found in ANSI/ASNT CP-105 (2011

edition)3 and should be used as a minimum. 计算机射线照相术(CR)专题训练大纲。适用于计算器射线照相中

一级和二级人员培训之局部训练大纲可在 ANSI / ASNT CP-105(2011年版)3中找到，并应作为所采用之最

低限度。

II-124.2 Digital Radiography (DR) Topical Training Outlines. Topical training outlines appropriate for the training of Level I and Level II personnel in digital radiography may be found in ANSI/ASNT CP-105 (2011 edi-tion)3 and should be used as a minimum. For individuals holding a valid Level I or Level II film certification, the “Basic Radiography Physics” segment of the topical outlines referenced in II-124.1 and II-124.2 need not be re-

peated, as described in the employer’s written practice. 数位符射线照相(DR)局部训练大纲。在 AN-SI / ASNT

CP-105(2011年版)3中可以找到适合数位射线照相中一级和二级人员培训的适当培训大纲，并应作为所采

用之最低限度。对于持有有效 I级或 II级胶片射线照相认证之个人，则不需要重复 II-124.1和 II-124.2中引

用如雇主书面实践之“基本放射学物理学” 部分。

II-124.3 Phased Array UT. Topical training outlines appropriate for the training of Level II personnel can be

found in ANSI/ASNT CP-105 (2011 edition)3 and should be used as a minimum. 相控阵 UT。适用于 II级人员培

训的局部训练大纲可在ANSI / ASNT CP-105(2011年版)3中找到，应作为最低限度采用。

II-124.4 Time of Flight Diffraction (TOFD). Topical training outlines appropriate for the training of Level II

personnel can be found in ANSI/ASNT CP-105 (2011 edition)3 and should be used as a minimum. 超声衍射时差

法(TOFD)。适用于 II级人员培训的局部训练大纲可在ANSI / ASNT CP-105(2011年版)3中找到，应作为最

低限度采用。

9

Table II-121-1 Initial Training and Experience Requirements for CR and DR Techniques

表 II-121-1 对 CR和 DR技术之首次培训和经验要求

Examination Method

检测方法

NDE Level

NDE等级

Technique

技术

Training Hours

培训时数

Experience 经验

Minimum Hours in

Technique

Todal NDE Hours

总 NDE培训时数

Radiography 射线照相 I CR 40 210 400

II CR 40 630 1,200

Radiography 射线照相 I DR 40 210 400

II DR 40 630 1,200

GENERAL NOTES: 一般注意事项：

(a ) For individuals currently certified in a Radiography technique (e.g., film) and a full-course format was used

to meet the initial qualification in that technique, the minimum additional training hours to qualify in another tech-

nique at the same level shall be 对于目前在放射技术(例如胶片)中获得认证之个人，并且采用全课程格式来满

足该技术的首要资格，如雇主的书面实践中对同一级别具备其他技术资格之最低额外培训时间定义为：

(1) Level I, 24 hr I 级，24小时

(2) Level II, 40 hr II 级，40小时

as defined in the employer’s written practice.

(b) In addition to the training specified in Table II-121-1, a minimum 16 hr of manufacturer-specific hard-

ware/software training shall also be required for each system/software to be used. The employer’s written practice

shall describe the means by which the examiner’s qualification shall be determined. 除在表 II-121-1中所规定之培

训外，每个所采用之系统/软件还需针对制造商特定硬件/软件至少有 16小时培训。如雇主的书面实践中之

规定，在雇主书面实践中应对检测人员资格做出确定方法的相关描述。

(c ) For individuals currently certified in a Radiography technique (e.g., film) and a fu ll-course format was used

to meet the initial qualification in that technique, the minimum additional experience to qualify in another technique

at the same level shall be 对于目前在射线技术(例如胶片)中获得认证之个人，并且采用全课程格式来满足该

技术的首要资格，在同一级别考试另一种技术的最低额外经验应为：(1)(2)

(1) Level I, 105 hr I级，105小时

(2) Level II, 320 hr II 级，320小时

as defined in the employer’s written practice.

(d) For individuals currently certified as a Level II in a Radiography technique (e.g., film) and a full-course for-

mat was used to meet the initial qualification in that technique and whom are seeking a Level II certification in an-

other technique, but have not fully met the additional training hours specified in (a) and (b) above, certification may

be accomplished by increasing the number of practical examination test specimens. In these cases the number of

specimens required in II-122.1(b) shall be increased from five to ten, each containing at least one discontinuity. 对

于目前在放射技术(例如胶片)中被认证为 II级之个人，采用全课程格式来满足该技术的首要资格，并且正

在寻求另一种技术的 II级认证，但是不完全符合上述(a)和(b)中规定的额外培训时间下，可通过增加实际检

检测样数量来完成鉴定。在这些情况下，II-122.1(b)中所要求的试样数目应从五个增加到十个，每一试样中

至少包含一个不连续性。

10

Table II-121-2 Additional Training and Experience Requirements for PAUT and TOFD Ultrasonic Techniques 表 II-121-2 对控阵超声技术和超声衍射时差技术之培训和经验的额外要求

Examination

Method 检测方法

NDE Level

NDE等级

Technique

技术

Training Hours

培训时数

Experience 经验

Minimum Hours in

Technique 技术最少时

数

Todal NDE Hours 总 NDE培训时数

Ultrasonic 超声波 II PAUT 80 320 UT Level I and Level II training and

experience required as a prerequisite

[Note (1)], [Note (2)] [注(1)]，[注(2)]

具有等同于 UT I 级和 II级培训和

经验所需之先决条件

Ultrasonic 超声波 II TOFD 40 320

NOTES: 注

(1) Level II personnel holding a current Ultrasonic method certification are eligible for certification in the PAUT and TOFD

techniques. 持有当前超声波二级认证资格之人员在 PAUT 和 TOFD技术即视同已获得资格。

(2) In addition to the training specified in Table II-121-2, supplemental specific hardware and software training shall be

required for automated or semi-automated technique applications. The employer’s written practice shall fully describe the nature

and extent of the additional training required for each specific acquisition or analysis software and instrument/system used. The

employer’s written practice shall also describe the means by which the examiner’s qualification will be determined for automated

and semi-automated techniques. 除表 II-121-2所规定知培训外，自动化或半自动化技术应用尚需对对特定的硬件和软件给

予辅助培训。在雇主之书面实践中应对各项特定捕捉或分析软件和仪器/系统之所需的额外培训性质和范围作出充分描

述。在雇主之书面实践中还应对检测员做出自动化和半自动化技术资格之确定方法的有关描述。

Table II-122.1 Minimum CR and DR Examination Questions

表 II-122.1 CR和 DR之最少出题数

Technique

技术

General一般试题 Specific 专业试题

Level I Level II Level I Level II

CR 40 40 30 30

DR 40 40 30 30

Table II-122.2 Minimum Ultrasonic Technique Examination Questions 表 II-122.2 超声波技术检测之最少出题数

Technique 技术 General一般试题 Specificc 专业试题

Level I Level II Level I Level II

CR

DR

40

40

40

40

30

30

30

30

NONMANDATORY APPENDIX A IMPERFEC-

TION VS TYPE OF NDE METHOD

非强制性附录 A 瑕疵与无损检测方法对照表

A-110 SCOPE 适用范围

Table A-110 lists common imperfections and the NDE methods that are generally capable of detecting them.

11

表 A-110 列出了无损检测方法通常能检测的一般瑕疵。

CAUTION: Table A-110 should be regarded for general guidance only and not as a basis for requiring or prohibiting a particular type of NDE method for a specific application. For example, material and product form are factors that could result in differences from the degree of effectiveness implied in the table. For service-induced im-perfections, accessibility and other conditions at the examination location are also significant factors that must be considered in selecting a particular NDE method. In addition, Table A-110 must not be considered to be all inclu-sive; there are several NDE methods/techniques and imperfections not listed in the table. The user must consider all

applicable conditions when selecting NDE methods for a specific application. 注意：表A-110 应仅仅看作是一般

性的指导，而不是在一种特定应用中对某种无损检测方法的要求和禁用。例如，材料和产品成型是一种因

素，它能使表中暗指的有效性程度产生不同的结果。对于由于采用引起的瑕疵，检测部位的可接近性和条

件也是重要因素和考虑采用某种无损检测方法的因素。另外，表 A-110 不能把全部无损检测都包括进去，

而表中还有好几种无损检测方法／技术和瑕疵没有列出。采用者在一种特定的应用中选用无损检测方法

时，必须考虑所有有关的条件。

12

Table A-110 Imperfection vs Type of NDE Method

瑕疵与无损检测方法对照表

Surface [Note (1)]

表面(见注1)

Subsurface [Note (2)]

近表面(见注 2)

Volumetric [Note (3)]

容积式(见注 3) UTT

VT PT MT ET RT UTA UTS AE

Service-Induced Imperfections 工况所引起之瑕疵

Abrasive Wear (Localized) 磨损(局部)

Baffle Wear (Heat Exchangers) 挡板磨损(热交换器)

Corrosion-Assisted Fatigue Cracks 加速腐蚀的断裂裂缝

⦿

⦿

⦾

⊛

. . .

⊛

⊛

. . .

⦿

. . .

⊛

. . .

⦿

. . .

⦾

⊛

. . .

⦿

⊛

. . .

. . .

. . .

. . .

⦿

⊛

. . .

. . .

Corrosion 腐蚀

-Crevice 裂隙腐蚀

-General / Uniform 通常/均匀的腐蚀

-Pitting 凹坑腐蚀

-Selective 局部腐蚀

⦿

. . .

⦿

⦿

. . .

. . .

⦿

⦿

. . .

. . .

⦾

⦾

. . .

⦾

. . .

. . .

. . .

⊛

⦿

. . .

. . .

. . .

⦾

. . .

. . .

⊛

⦾

. . .

. . .

. . .

⊛

. . .

⦾

⦿

⦾

⦾

Creep (Primary) [Note (4)] 蠕变(诱发阶段)［见注 4] . . . . . . . . . . . . . . . . . . . . . . . . . . .

Erosion 侵蚀 ⦿ . . . . . . . . . ⦿ ⦾ ⊛ . . . ⊛

Fatigue Cracks 疲劳龟裂 ⦾ ⦿ ⦿ ⊛ ⊛ ⦿ . . . ⦿ . . .

Fretting (Heat Exchanger Tubing) 徽振磨损(热交换器管子) ⊛ . . . . . . ⊛ . . . . . . . . . . . . ⊛

Hot Cracking 热龟裂 . . . ⊛ ⊛ . . . ⊛ ⦾ . . . ⊛

Hydrogen-Induced Cracking 氢龟裂 . . . ⊛ ⊛ . . . ⦾ ⊛ . . . ⊛ . . .

Intergranular Stress-Corrosion Cracks 晶间应力腐蚀龟裂 . . . . . . . . . . . . . . . ⦾ . . . . . . . . .

Stress-Corrosion Cracks (Transgranular) 应力腐蚀龟裂(穿晶的) ⦾ ⊛ ⦿ ⦾ ⊛ ⊛ . . . ⊛ . . .

Welding Imperfections 焊接瑕疵

Burn Through 烧穿 ⦿ . . . . . . . . . ⦿ ⊛ . . . . . . ⦾

Cracks 龟裂 ⦾ ⦿ ⦿ ⊛ ⊛ ⦿ ⦾ ⦿ . . .

Excessive/Inadequate Reinforcement 余高过高／不足 ⦿ . . . . . . . . . ⦿ ⊛ ⦾ . . . ⦾

Inclusions (Slag/Tungsten) 夹杂(渣／鸽) . . . . . . ⊛ ⊛ ⦿ ⊛ ⦾ ⦾ . . .

Incomplete Fusion 未熔合 ⊛ . . . ⊛ ⊛ ⊛ ⦿ ⊛ ⊛ . . .

Incomplete Penetration 未焊透 ⊛ ⦿ ⦿ ⊛ ⦿ ⦿ ⊛ ⊛ . . .

Misalignment 错边 ⦿ . . . . . . . . . ⦿ ⊛ . . . . . . . . .

Overlap 焊瘤 ⊛ ⦿ ⦿ ⦾ . . . ⦾ . . . . . . . . .

Porosity 气孔 ⦿ ⦿ ⦾ . . . ⦿ ⊛ ⦾ ⦾ . . .

13



Surface [Note (1)]

表面(见注1)

Subsurface [Note

(2)] 近表面(见注2)

Volumetric [Note (3)]

容积式(见注 3) UTT

VT PT MT ET RT UTA UTS AE

Root Concavity 根部凹陷 ⦿ . . . . . . . . . ⦿ ⊛ ⦾ ⦾ ⦾

Undercut ⦿ ⊛ ⊛ ⦾ ⦿ ⊛ ⦾ ⦾ . . .

Product Form Imperfections 产品成型引起的瑕疵

Bursts (Forgings) 爆裂(锻件) ⦾ ⦿ ⦿ ⊛ ⊛ ⊛ ⊛ ⦿ . . .

Cold Shuts (Castings) 冷夹(铸件) ⦾ ⦿ ⦿ ⦾ ⦿ ⊛ ⊛ ⦾ . . .

Cracks (All Product Forms) 龟裂(所有产品成型) ⦾ ⦿ ⦿ ⊛ ⊛ ⊛ ⦾ ⦿

Hot Tear (Castings) 热撕裂(铸件) ⦾ ⦿ ⦿ ⊛ ⊛ ⊛ ⦾ ⦾ . . .

Inclusions (All Product Forms) 夹杂(所有产品成型) . . . . . . ⊛ ⊛ ⦿ ⊛ ⦾ ⦾ . . .

Lamination (Plate, Pipe) 夹层(板材，管材) ⦾ ⊛ ⊛ . . . . . . ⦾ ⦿ ⦾ ⦿

Laps (Forgings) 重迭(锻件) ⦾ ⦿ ⦿ ⦾ ⊛ . . . ⦾ ⦾ . . .

Porosity (Castings) 气孔(铸件) ⦿ ⦿ ⊛ . . . ⦿ ⦾ ⦾ ⦾ . . .

Seams (Bar, Pipe) 裂缝(棒材，管材) ⦾ ⦿ ⦿ ⦾ ⦾ ⊛ ⊛ ⦾ . . .

Legend: 上表之说明：

AE — Acoustic Emission 声发射

ET — Electromagnetic (Eddy Cur-

rent) 电磁(涡流)

MT — Magnetic Particle 磁粉

PT — Liquid Penetrant 液体渗透

RT — Radiography 射线照相

UTA — Ultrasonic Angle Beam斜射超

声

UTS — Ultrasonic Straight Beam直射超

声

UTT — Ultrasonic Thickness Measure-

ments 超声测厚

VT — Visual目视

⦿ — All or most standard techniques will detect this imperfection under all or

most conditions. 在所有的或大多数的条件下，所有的或大多数的标准技术都

能检测这种瑕疵。

⊛ — One or more standard technique(s) will detect this

imperfection under certain conditions. 在某种条件下，一种或多种标准技术将

能检测这种瑕疵。

⦾ — Special techniques, conditions, and/or personnel qualification are required

to detect this imperfection. 检测这种瑕疵要求专用技术，条件和/或人员资格。

14



GENERAL NOTE: Table A-110 lists imperfections and NDE methods that are capable of detecting them. It must be kept in

mind that this table is very general in nature. Many factors influence the detectability of imperfections. This table assumes that

only qualified personnel are performing nondestructive examinations and good conditions exist to permit examination (good

access, surface conditions, cleanliness, etc.). 总注：表 A-110列出了缺陷和能检测到它们的 NDE方法。应记住的是，这

个表在实际应用上是非常笼统的。许多因素影响缺陷的可检测性。而本表之创建系先行假设无损检测事由合格人员

所进行的，且存在着被允许检测(良好的可接近性，表面条件，清洁度等)的良好条件。

NOTES: 注：

(1) Methods capable of detecting imperfections that are open to the surface only. 仅对开放性缺陷检测之可行方法。

(2) Methods capable of detecting imperfections that are either open to the surface or slightly subsurface. 对开放性放或

次表面缺陷检测之可行方法。

(3) Methods capable of detecting imperfections that may be located anywhere within the examined volume. 对缺陷可能

位于受检测实体内任何位置的可行检测方法。

Various NDE methods are capable of detecting tertiary (3rd stage) creep and some, particularly using special techniques, are

capable of detecting secondary (2nd stage) creep. There are various descriptions/definitions for the stages of creep and a pa rtic-

ular description/definition will not be applicable to all materials and product forms. 对第三级(第 3级)蠕变检测而言，各种

NDE方法均可应用(除目视外)，但第二级(第 2级)蠕变检测则仅有某些特殊技术可被应用。对蠕变形成阶段存在着众

说纷纭的描述与定义，且特定描述/定义就不适用于所有材料和产品形式。。

ARTICLE 2 RADIOGRAPHIC EXAMINATION 第 2 章射线照相检测


The radiographic method described in this Article for examination of materials including castings and welds shall be used together with Article 1, General Requirements. Definitions of terms used in this Article are in Article

1 , Mandatory Appendix I, I-121.1, RT — Radiography. 当本章中所述之射线照相检测方法用于材料(包括铸件

和焊缝)检测时，则本章应与第 1 章之《通用要求》一起并用。本章所采用之定义都在第 1章、强制性附录

I中之 I-121.1节 RT-射线检测中做出。

Certain product-specific, technique-specific, and application-specific requirements are also given in other Man-datory Appendices of this Article, as listed in the table of contents. These additional requirements shall also be com-

plied with when an Appendix is applicable to the radiographic or radioscopic examination being conducted. 在章节

之表中已列出了对某种特殊产品、特殊技术和特殊应用的要求，同时也在本章节之其他强制性附录中做出

附加要求。当一附录是适用于所要执行之射线照相或射线透照检测时，则这些附加要求亦应被遵守。

T-220 GENERAL REQUIREMENTS 通用要求

T-221 PROCEDURE REQUIREMENTS 规程要求

T-221.1 Written Procedure. Radiographic examination shall be performed in accordance with a written proce-

dure. Each procedure shall include at least the following information, as applicable: 书面规程。射线照相检测应

按照书面规程进行；每一种规程应至少包括以下信息(如适用)：

(a) material type and thickness range 材料类型及厚度范围

(b) isotope or maximum X-ray voltage used 所采用之同位素或最高 X 射线电压

(c ) source-to-object distance (D in T-274.1) 射源至物件的距离(即 T-274. 1 中的 D值)

(d) distance from source side of object to film (d in T-274.1) 物件射源侧至胶片的距离(即 T-274.1

中的 d值)

(e ) source size (F in T-274.1) 线源的尺寸(即 T-274.1 中的 F值)

(f ) film brand and designation 胶片牌号及标记

(g) screens used 所采用之增感屏

T-221.2 Procedure Demonstration. Demonstration of the density and image quality indicator (IQI) image re-quirements of the written procedure on production or technique radiographs shall be considered satisfactory evi-

dence of compliance with that procedure. 规程演示。按照在产品上或技能所摄制之胶片，其要求达到该规程

的要求，应作为与规程符合的满意凭证。书面规程之黑度和像质计成像要求，就射线胶片之摄制或技术演

示来说，应将其视为符合该规程的充分凭证。

T-222 SURFACE PREPARATION 表面制备

T-222.1 Materials Including Castings. Surfaces shall satisfy the requirements of the applicable materials specifi-cation or referencing Code Section, with additional conditioning, if necessary, by any suitable process to such a de-gree that the images of surface irregularities cannot mask or be confused with the image of any discontinuity on the

resulting radiograph. 包括铸件在内之材料。表面应满足所适用知材料规范或引用规范章节的要求，如需要

时，可藉由任何合适的工艺进行表面修整，以使表面不规则性程度不至于对射线线胶片上所显示之任何不

连续性被掩饰掉或混淆不连续性的解释。

T-222.2 Welds. The weld ripples or weld surface irregularities on both the inside (where accessible) and outside

shall be removed by any suitable process to such a degree that the images of surface irregularities cannot mask or be

confused with the image of any discontinuity on the resulting radiograph. 焊缝。存在于内表面(可接近的)和外表

面之焊缝波纹或焊缝外观的不规则性应藉由任何合宜工艺予以去除，直到射线胶片所显示之不连续性图像

不会因表面不规则性而被掩饰掉或混淆不连续性解释性的程度。

The finished surface of all butt-welded joints may be flush with the base material or may have reasonably uni-

form crowns, with reinforcement not to exceed that specified in the referencing Code Section. 所有已加工完成之

对接焊接接头表面可与母材平齐或具有相当平顺的余高，但余高不应超过引用规范章节中之规定。

T-223 BACKSCATTER RADIATION背散射辐射

A lead symbol “B,” with minimum dimensions of 1/2 in. (13 mm) in height and 1/16 in. (1.5 mm) in thick-

ness, shall be attached to the back of each film holder during each exposure to determine if backscatter radiation is

exposing the film. 在每次曝光过程中，每一胶片夹之背面应贴上一个高度为 1/2 in. (13 mm)，厚度为/16 in.

(1.5 mm))的 “B”字样铅符号，以确定是否有因背散射辐射而造成胶片感光。

T-224 SYSTEM OF IDENTIFICATION 识别系统

A system shall be used to produce permanent identification on each radiograph traceable to the contract, component, weld or weld seam, or part numbers, as appropriate. In addition, the organization’s symbol or name and the date of the radiograph shall be plainly and permanently included on the radiograph. This identification system does not necessarily require that the information appear as radiographic images. In any case, this information shall

not obscure the area of interest. 在每一射线胶片上，应采用一套能做出永久性识别标记的系统，藉以可追溯

到合同编号、物项编码、焊缝编号或焊接接头号，或酌情采用的物项简码。此外，组织标记或名称和放射

胶片日期都应清楚和永久地被包括在射线胶片上，而该识别系统并不一定要求系统信息需表现出射线照相

图像。在任何情况下，此信息都不应让受检测区域造成混淆。

T-225 MONITORING DENSITY LIMITATIONS OF RADIOGRAPHS 监测射线胶片黑度之限度

Either a densitometer or step wedge comparison film shall be used for judging film density. 应采用黑度计或

阶度比较片来判断胶片之黑度。

T-226 EXTENT OF EXAMINATION 检测范围

The extent of radiographic examination shall be as specified by the referencing Code Section. 射射线检测程度

应符合引用规范章节之规定。

T-230 EQUIPMENT AND MATERIALS 设备与材料

T-231 FILM 胶片

T-231.1 Selection. Radiographs shall be made using industrial radiographic film. 挑选。射线胶片应采用工业

射线照相胶片。

T-231.2 Processing. Standard Guide for Controlling the Quality of Industrial Radiographic Film Processing, SE-999, or Sections 23 through 26 of Standard Guide for Radiographic Examination, SE-94, may be used as a guide for

processing film, except that Section 8.1 of SE-999 is not required. 工艺过程。SE -999《Standard Guide for

Controlling the Quality of Industrial Radiographic Film Processing》或“射线照相检查标准指南”SE-94之第

23至 26节《Standard Guide for Radiographic Examination》可用作处理胶片的指南，但 SE-999之第 8.1节不

适用。

T-232 INTENSIFYING SCREENS 增感屏

Intensifying screens may be used when performing radiographic examination in accordance with this Article.

当按本章节执行放射照相检测时，可以采用增感屏。

T-233 IMAGE QUALITY INDICATOR (IQI) DESIGN 像质计(IQI)图样

T-233.1 Standard IQI Design. IQIs shall be either the hole type or the wire type. Hole-type IQIs shall be manu-factured and identifieded in accordance with the requirements or alternates allowed in SE-1025. Wire-type IQIs shall be manufactured and identifieded in accordance with the requirements or alternates allowed in SE-747, except that the largest wire number or the identity number may be omitted. ASME standard IQIs shall consist of those in

Table T-233.1 for hole type and those in Table T-233.2 for wire type. 标准 IQI图样。IQI应为孔洞型或线型，

其中孔洞型 IQI应根据 SE-1025中所许可之要求或其他替代品来制造和识别。线型 IQI除最大线号或标识

符可省略外，应根据 SE-747中所许可之要求或其他替代品来制造和识别。 ASME标准 IQI应由表 T-233.1

中的孔洞型和表 T-233.2中的线型所组成。

T-233.2 Alternative IQI Design. IQIs designed and manufactured in accordance with other national or interna-tional standards may be used provided the requirements of either (a) or (b) below, and the material requirements of

T-276.1 are met. 其他替代型像质计图样。只要满足以下(a)或(b)的要求，并满足 T-276.1的材料要求，可以

采用根据其他国家或国际标准图样和制造的 IQI。

(a) Hole-Type IQIs. The calculated Equivalent IQI Sensitivity (EPS), per SE-1025, Appendix X1, is equal

to or better than the required standard hole-type IQI. 孔洞型像质计。根据 SE-1025附录 X1所计算出之等效

IQI灵敏度(EPS)应等于或优于所需标准孔洞型 IQI之灵敏度。

(b) Wire-Type IQIs. The alternative wire IQI essential wire diameter is equal to or less than the required

standard IQI essential wire. 线型像质计。备用 IQI之基本线应等于或小于所需标准 IQI的基本线。

Table T-233.1 Hole-Type IQI Designation, Thickness, and Hole Diameters

孔洞型像质计的代码、厚度和孔径

IQI Designation

像质计代码

IQI Thickness, in.

(mm) 像质计厚度

1T Hole Diameter, in.

(mm) IT 孔直径

2T Hole Diameter, in.

(mm) 2T 孔直径

4T Hole Diameter, in. (mm)

4T 孔直径

5 0.005 (0.13) 0.010 (0.25) 0.020 (0.51) 0.040 (1.02)

7 0.0075 (0.19) 0.010 (0.25) 0.020 (0.51) 0.040 (1.02)

10 0.010 (0.25) 0.010 (0.25) 0.020 (0.51) 0.040 (1.02)

12 0.0125 (0.32) 0.0125 (0.32) 0.025 (0.64) 0.050 (1.27)

15 0.015 (0.38) 0.015 (0.38) 0.030 (0.76) 0.060 (1.52)

17 0.0175 (0.44) 0.0175 (0.44) 0.035 (0.89) 0.070 (1.78)

20 0.020 (0.51) 0.020 (0.51) 0.040 (1.02) 0.080 (2.03)

25 0.025 (0.64) 0.025 (0.64) 0.050 (1.27) 0.100 (2.54)

30 0.030 (0.76) 0.030 (0.76) 0.060 (1.52) 0.120 (3.05)

35 0.035 (0.89) 0.035 (0.89) 0.070 (1.78) 0.140 (3.56)

40 0.040 (1.02) 0.040 (1.02) 0.080 (2.03) 0.160 (4.06)

45 0.045 (1.14) 0.045 (1.14) 0.090 (2.29) 0.180 (4.57)

50 0.050 (1.27) 0.050 (1.27) 0.100 (2.54) 0.200 (5.08)

60 0.060 (1.52) 0.060 (1.52) 0.120 (3.05) 0.240 (6.10)

70 0.070 (1.78) 0.070 (1.78) 0.140 (3.56) 0.280 (7.11)

80 0.080 (2.03) 0.080 (2.03) 0.160 (4.06) 0.320 (8.13)

100 0.100 (2.54) 0.100 (2.54) 0.200 (5.08) 0.400 (10.16)

120 0.120 (3.05) 0.120 (3.05) 0.240 (6.10) 0.480 (12.19)

140 0.140 (3.56) 0.140 (3.56) 0.280 (7.11) 0.560 (14.22)

160 0.160 (4.06) 0.160 (4.06) 0.320 (8.13) 0.640 (16.26)

200 0.200 (5.08) 0.200 (5.08) 0.400 (10.16) . . .

240 0.240 (6.10) 0.240 (6.10) 0.480 (12.19) . . .

280 0.280 (7.11) 0.280 (7.11) 0.560 (14.22) . . .

T-234 FACILITIES FOR VIEWING OF RADIOGRAPHS 看片设备

Viewing facilities shall provide subdued background lighting of an intensity that will not cause reflections, shad-ows, or glare on the radiograph that interfere with the interpretation process. Equipment used to view radiographs for interpretation shall provide a variable light source sufficient for the essential IQI hole or designated wire to be visible for the specified density range. The viewing conditions shall be such that light from around the outer edge of

the radiograph or coming through lowdensity portions of the radiograph does not interfere with interpretation. 观察

设施应提供柔和的背景照明，其强度不会造成干扰射线胶片解释过程的反射，阴影或眩光。用于观察射线

胶片解释之设备应提供足够的可变光源，以使 IQI基本孔或指定线在指定黑度范围内可见。观察条件应使

得来自射线胶片的外边缘周围或来自射线照相的低密度部分的光不干扰解释。

Table T-233.2 Wire IQI Designation, Wire Diameter, and Wire Identity

线型像质计的名称、线径和线号

Set A A 组 Set B B组

Wire Diameter, in. (mm)线径 Wire Identity 线号 Wire Diameter, in. (mm)线径 Wire Identity 线号

0.0032 (0.08) 1 0.010 (0.25) 6

0.004 (0.10) 2 0.013 (0.33) 7

0.005 (0.13) 3 0.016 (0.41) 8

0.0063 (0.16) 4 0.020 (0.51) 9

0.008 (0.20) 5 0.025 (0.64) 10

0.010 (0.25) 6 0.032 (0.81) 11

Set C C组 Set D D组

Wire Diameter, in. (mm)线径 Wire Identity 线号 Wire Diameter, in. (mm)线径 Wire Identity 线号

0.032 (0.81) 11 0.100 (2.54) 16

0.040 (1.02) 12 0.126 (3.20) 17

0.050 (1.27) 13 0.160 (4.06) 18

0.063 (1.60) 14 0.200 (5.08) 19

0.080 (2.03) 15 0.250 (6.35) 20

0.100 (2.54) 16 0.320 (8.13) 21

T-260 CALIBRATION 校验

T-261 SOURCE SIZE 射源尺寸

T-261.1 Verification of Source Size. The equipment manufacturer’s or supplier’s publications, such as technical manuals, decay curves, or written statements documenting the actual or maximum source size or focal spot, shall be

acceptable as source size verification. 射源尺寸证明。设备制造商或供货商之刊物 (如技术手册，衰减曲线或

记录实际或最大射源尺寸或焦点) 的书面声明应作为源尺。

T-261.2 Determination of Source Size. When manufacturer’s or supplier’s publications are not available, source

size may be determined as follows: 射源尺寸的确定。当制造商或供货商之刊物不可用时，射源尺寸可如下确

定：

(a) X-Ray Machines. For X-ray machines operating at 500 kV and less, the focal spot size may be deter-

mined by the pinhole method,5 or in accordance with SE-1165, Standard Test Method for Measurement of Focal

Spots of Industrial X-Ray Tubes by Pinhole Imaging. X 射线机：对于在 500kV 和以下操作的X 射线机，可藉

由针孔法 5 或根据 SE-1165《Standard Test Method for Measurement of Focal Spots of Industrial X-Ray Tubes by

Pinhole Imaging.》来确定。

(b) Iridium-192 Sources. For Iridium-192, the source size may be determined in accordance with SE-1114,

Standard Test Method for Determining the Focal Size of Iridium-192 Industrial Radiographic Sources. 铱 192 射源：铱 192 射源尺寸可根据 SE-1114 《Standard Test Method for Determining the Focal Size of Iridium-192 In-

dustrial Radio-graphic Sources》来确定。

T-262 DENSITOMETER AND STEP WEDGE COMPARISON FILM 黑度计和梯度比较片

T-262.1 Densitometers. Densitometers shall be calibrated at least every 90 days during use as follows: 黑度计。

黑度计在 90 天之采用期间内进行如下校准：

(a) A national standard step tablet or a step wedge calibration film, traceable to a national standard step tablet and having at least five steps with neutral densities from at least 1.0 through 4.0, shall be used. The step

wedge calibration film shall have been verified within the last year by comparison with a national standard step tab-let unless, prior to first use, it was maintained in the original light-tight and waterproof sealed package as supplied by the manufacturer. Step wedge calibration films may be used without verification for one year upon opening, pro-

vided it is within the manufacturer’s stated shelf life. 应采用可溯源至国家标准之阶变图或梯度校准片，其中并

具有至少 1.0至 4.0的 5个中性黑度梯度。除非在第一次采用之前梯度校准片被保存在制造商所提供之首要

不透光又防水密封包装中，否则梯度校准片应每一年度内与国家标准阶变图进行比对。只要其在制造商规

定的保质期内，梯度校准片在打开后之一年内而不需进行校验。

(b) The densitometer manufacturer’s step-by-step instructions for the operation of the densitometer shall

be followed. 应遵循黑度计制造商有关黑度计之操作步骤说明书。

(c ) The density steps closest to 1.0, 2.0, 3.0, and 4.0 on the national standard step tablet or step wedge

calibration film shall be read. 应可读取国家标准阶变图或阶变图上最接近 1.0, 2.0, 3.0和 4.0的黑梯度。

(d) The densitometer is acceptable if the density readings do not vary by more than ±0.05 density units

from the actual density stated on the national standard step tablet or step wedge calibration film. 如果实际黑度读

数与国家标准阶变图或梯度校准片上所述黑度之相对差异不超过±0.05的黑单位，则该黑度计是可接受的。

T-262.2 Step Wedge Comparison Films. Step wedge comparison films shall be verified prior to first use, unless

performed by the manufacturer, as follows: 梯度校准片。除非已由制造商进行，否则梯度校准片应在第一次采

用前进行如下校准：

(a) The density of the steps on a step wedge comparison film shall be verified by a calibrated densitom-

eter. 梯度校准片上的梯度黑度应通过已校准过之黑度计来予以验证。

(b) The step wedge comparison film is acceptable if the density readings do not vary by more than ±0.1

density units from the density stated on the step wedge comparison film. 如果黑度读数与梯度校准片上所述黑度

之相对差异不超过±0.1黑度单位，则该阶梯楔形比较胶片是可接受的。

T-262.3 Periodic Verification. 校验周期

(a) Densitometers. Periodic cablibration verification checks shall be performed as described in T-262.1 at

the beginning of each shift, after 8 hr of continuous use, or after change of apertures, whichever comes first. 黑度

计。在每次换班开始时，连续采用 8小时后，或光圈改变时，以先到者为准，应如 T-262.1所述进行定期的

校对验证检查。

(b) Step Wedge Comparison Films. Verification checks shall be performed annually per T-262.2. 梯度校准片。应按照 T-262.2每年进行验证检查。

T-262.4 Documentation. 文檔

Densitometers. Densitometer calibrations required by T-262.1 shall be documented, but the actual readings for each step do not have to be recorded. Periodic densitometer verification checks required by T-262.3(a) do not have

to be documented. 黑度计。应记录 T-262.1要求的密度计校准，但不必记录每个步骤的实际读数。 T-

262.3(a)所要求之定期黑度计验证检测亦不需记录。

(a) Step Wedge Calibration Films. Step wedge calibration film verifications required by T-262.1(a)

shall be documented, but the actual readings for each step do not have to be recorded. 阶变图。必须记录 T-

262.1(a)要求的步进楔校准胶片验证，但不必记录每个步骤的实际读数。

(b) Step Wedge Comparison Films. Step wedge comparison film verifications required by T-262.2 and

T-262.3(b) shall be documented, but the actual readings for each step do not have to be recorded. 梯度校准片。应

记录 T-262.2和 T-262.3(b)所要求之阶变图验证，但不必记录每个步骤的实际读数。

T-270 EXAMINATION 检测

T-271 RADIOGRAPHIC TECHNIQUE6 射线照相技术 6

A single-wall exposure technique shall be used for radiography whenever practical. When it is not practical to use a single-wall technique, a double-wall technique shall be used. An adequate number of exposures shall be made

to demonstrate that the required coverage has been obtained. 实用时，应采用单壁曝光技术进行射线照相。当采

用单壁技术不实用时，应采用双壁技术。应进行足够次数的暴光以证明已获得所需的涵盖范围。

T-271.1 Single-Wall Technique. In the single-wall technique, the radiation passes through only one wall of the

weld (material), which is viewed for acceptance on the radiograph. 单壁技术。在单壁技术中，辐射仅穿过焊缝

(材料)的一个壁厚，这在辐射胶片上是可接受的。

T-271.2 Double-Wall Technique. When it is not practical to use a single-wall technique, one of the following

double-wall techniques shall be used. 双壁技术。当采用单壁技术不实用时，应采用以下双壁技术之其中一

种：

(a) Single-Wall Viewing. For materials and for welds in components, a technique may be used in which the radiation passes through two walls and only the weld (material) on the film-side wall is viewed for acceptance on the radiograph. When complete coverage is required for circumferential welds (materials), a minimum of three ex-

posures taken 120 deg to each other shall be made. 单壁观察技术。对于材料和物项中之焊缝，可采用这样的技

术，其中辐射线穿过两壁并且仅能观察到在胶片侧壁上、在观察上可被接受的射线胶片焊缝(材料)图像。

当整个环向焊缝(材料)范围被要求时，应至少进行三次彼此相隔 120º的曝光。

(b) Double-Wall Viewing. For materials and for welds in components 3-1/2 in. (89 mm) or less in nominal outside diameter, a technique may be used in which the radiation passes through two walls and the weld (material) in both walls is viewed for acceptance on the same radiograph. For double-wall viewing, only a source-side IQI

shall be used. 双壁观察技术。对于公称外径为 3-1/2 in. (89 mm)或更小物项中之材料和焊缝，可采用此种技

术，其中辐射线穿过两壁并且可同时观察到两壁中的、在观察上可被接受的射线胶片焊缝(材料)图像。对

于双壁观察技术来说，只能将 IQI放在射源侧。

(1) For welds, the radiation beam may be offset from the plane of the weld at an angle sufficient to separate the images of the source-side and film-side portions of the weld so that there is no overlap of the areas to be interpreted. When complete coverage is required, a minimum of two exposures taken 90 deg to each other shall

be made for each joint. 用于焊缝时，射束线可从焊缝所在平面偏移出足够角度，从而使射源侧和胶片侧焊缝

图像得以错开来，以避免待解释分区图像产生重迭。当需要整个范围时，应对每一接头至少进行两次彼此

错开 90º的曝光。

(2) As an alternative, the weld may be radiographed with the radiation beam positioned so that the images of both walls are superimposed. When complete coverage is required, a minimum of three exposures taken

at either 60 deg or 120 deg to each other shall be made for each joint. 另一种替代方法是将射线束定位于某个位

置对焊缝进行射线照相，而使两壁之图像重迭在一起。当需要整个范围时，每个接头至少要进行 3 次彼此

错开 60 º或 120º的曝光。

(3) Additional exposures shall be made if the required radiographic coverage cannot be obtained us-

ing the minimum number of exposures indicated in (1) or (2) above. 如果不能采用上述(1)或(2)中所示的最小曝

光量来获得所需之射线照射范围，则应进行额外曝光。

T-272 RADIATION ENERGY 辐射能

The radiation energy employed for any radiographic technique shall achieve the density and IQI image require-

ments of this Article. 任何射线照相技术所采用的辐射能量必须达到本章的黑度和像质计的影像要求。

T-273 DIRECTION OF RADIATION 辐射方向

The direction of the central beam of radiation should be centered on the area of interest whenever practical. 在

任何可行情况下，应让射线束之中心对准受检区域的中心。

T-274 GEOMETRIC UNSHARPNESS 几何模糊度

T-274.1 Geometric Unsharpness Determination. Geometric unsharpness of the radiograph shall be determined

in accordance with: 几何模糊度测定。射线胶片之几何模糊度应根据以下标准确定：

𝑈𝑔 = 𝐹𝑑 𝐷⁄

where 式中

D = distance from source of radiation to weld or object being radiographed 辐射源至射线照相

焊缝或物项的距离

d = distance from source side of weld or object being radiographed to the film 从射线照相焊缝

或物项到胶片射源侧的距离

F = source size: the maximum projected dimension of the radiating source (or effective focal

spot) in the plane perpendicular to the distance D from the weld or object being radiographed 射源尺寸：在与辐射

源(或有效焦点)所在平面相距 D距离处之平面中的射源最大垂直投影尺寸

𝑈𝑔 = geometric unsharpness 几何模糊度

D and d shall be determined at the approximate center of the area of interest. D 和 d应在受检测区

域之近中心处确定。

NOTE: Alternatively, a nomograph as shown in Standard Guide for Radiographic Examination SE-94

may be used. 注：或者，可采用 SE-94《Standard Guide for Radiographic Examination》中的列线图。

T-274.2 Geometric Unsharpness Limitations. Recommended maximum values for geometric

unsharpness are as follows: 几何模糊度限度。所推荐之几何模糊度的最大值如下：

Material Thickness 材料厚度 ,

in. (mm)

𝑈𝑔 Maximum最大值 ,

in. (mm)

Under 2 (50) 0.020 (0.51)

2 through 3 (50–75) 0.030 (0.76)

Over 3 through 4 (75–100) 0.040 (1.02)

Greater than 4 (100) 0.070 (1.78)

NOTE: Material thickness is the thickness on which the IQI is based.

注：材料厚度是以 IQI所在位置处之厚度为基准的。

T-275 LOCATION MARKERS 位置标记

Location markers (see Figure T-275), which are to appear as radiographic images on the film, shall be placed on the part, not on the exposure holder/cassette. Their locations shall be permanently marked on the surface of the part being radiographed when permitted, or on a map, in a manner permitting the area of interest on a radio-graph to be accurately traceable to its location on the part, for the required retention period of the radiograph. Evi-dence shall also be provided on the radiograph that the required coverage of the region being examined has been

obtained. Location markers shall be placed as follows. 在胶片上显示为放射照相图像之位置标记(见图 T-275)应

定位在物项上，而不是定位在曝光夹/暗匣上。在允许情况下，其位置应永久标记在被放射照相物项之表面

上，或者在映射图上，以允许在射线胶片所需之保留期限中，能让射线胶片上之受检测区域准确地追溯到

该物项的相应位置。在射线胶片上还应提供证据，以证明所需之检测范围均已被涵盖。位置标记之定位方

式，应按如下所述。

T-275.1 Single-Wall Viewing. 单壁观察

(a) Source-Side Markers. Location markers shall be placed on the source side when radiographing the fol-

lowing: 射源侧标记。当在下列条件进行射线照相时，位置标记应定位在射源侧：

(1) flat components or longitudinal joints in cylindrical or conical components; 圆柱形或圆锥形物

项中之扁平物项或纵向接头;

(2) curved or spherical components whose concave side is toward the source and when the “source-

tomaterial” distance is less than the inside radius of the component; 曲面或球形物项，其凹侧面朝向射源并且当

射源至材料之距离小于物项内半径时;

(3) curved or spherical components whose convex side is toward the source.凸形侧面朝向射源之

曲面或球形物项。

(b) Film-Side Markers 胶片侧标记

(1) Location markers shall be placed on the film side when radiographing either curved or spherical components whose concave side is toward the source and when the “source-to-material” distance is greater than the

inside radius. 当凹面朝向射源之曲面或球形物项进行射线照相时以及当射源至材料之距离大于内半径时，应

将位置标记定位在胶片侧。

(2) As an alternative to source-side placement in T-275.1(a)(1), location markers may be placed on the film side when the radiograph shows coverage beyond the location markers to the extent demonstrated by Fig-

ure T-275, sketch (e), and when this alternate is documented in accordance with T-291. 当射线照相所涵盖的范围

超出图 T-275中简图(e)的位置标记范围时，可采用胶片侧标记来替代 T-275.1(a)(1)中的射线源一侧的标

记；而此种替代方式是需按 T-291 的规定纪录在案的。

(c ) Either Side Markers. Location markers may be placed on either the source side or film side when radi-ographing either curved or spherical components whose concave side is toward the source and the “source-to-

material” distance equals the inside radius of the component. 任一侧标记。当凹面朝向射源之曲面或球形物项进

行射线照相，且射源至材料之距离等于物项内半径时，位置标记可以定位在源侧或底侧。

T-275.2 Double-Wall Viewing. For double-wall viewing, at least one location marker shall be placed adjacent to

the weld (or on the material in the area of interest) for each radiograph. 双壁观察。对于双壁观察，应至少有一

个位置标记应定位在每一射线胶片的焊缝附近(或在受检测区域之材料上)。

T-275.3 Mapping the Placement of Location Markers. When inaccessibility or other limitations prevent the placement of markers as stipulated in T-275.1 and T-275.2, a dimensioned map of the actual marker placement shall

accompany the radiographs to show that full coverage has been obtained. 映像位置标记的位置。当不可接近性或

其他限制妨碍定位 T-275.1和 T-275.2中所规定之标记时，实际标记定位的尺寸图应与放射胶片一起显示，

以显示已获得整个所需涵盖之范围。

T-276 IQI SELECTION IQI选用

T-276.1 Material. IQIs shall be selected from either the same alloy material group or grade as identifieded in SE-1025, or SE-747, as applicable, or from an alloy material group or grade with less radiation absorption than the ma-

terial being radiographed. 材料。 IQI应选自与 SE-1025或 SE-747(如适用)中所具有相同合金组或等级之材

料，或选自合金材料组或具有比放射线照相材料更低辐射吸收的等级

T-276.2 Size. The designated hole IQI or essential wire shall be as specified in Table T-276. A thinner or thicker hole-type IQI may be substituted for any section thickness listed in Table T-276, provided an equivalent IQI sensi-

tivity is maintained. See T-283.2. 尺寸。IQI指定孔或基本线应符合表 T-276的规定。如果能保持等效的 IQI

灵敏度，可以用更薄或更厚的孔洞型 IQI来代替表 T-276中列出之任何截面厚度。见 T-283.2。

(a) Welds With Reinforcements. The thickness on which the IQI is based is the nominal single-wall thick-ness plus the estimated weld reinforcement not to exceed the maximum permitted by the referencing Code Section. Backing rings or strips shall not be considered as part of the thickness in IQI selection. The actual measurement of

the weld reinforcement is not required. 有余高之焊缝。 IQI所基于的厚度是公称单壁厚度加上不超过引用规

范章节所许可之最大预计焊缝余高。背衬环或背衬带不应被认为是在 IQI选用厚度中的一部分。不需要实

际测量焊缝余高。

(b) Welds Without Reinforcements. The thickness on which the IQI is based is the nominal single-wall

thickness. Backing rings or strips shall not be considered as part of the weld thickness in IQI selection. 无余高的焊

缝。 IQI所基于的厚度是公称单壁厚度。在 IQI选用中，背衬环或背衬带不应被认为是焊缝厚度的一部

分。

T-276.3 Welds Joining Dissimilar Materials or Welds With Dissimilar Filler Metal. When the weld metal is

of an alloy group or grade that has a radiation attenuation that differs from the base material, the IQI material selec-tion shall be based on the weld metal and be in accordance with T-276.1. When the density limits of T-282.2 cannot be met with one IQI, and the exceptional density area(s) is at the interface of the weld metal and the base metal, the

material selection for the additional IQIs shall be based on the base material and be in accordance with T-276.1. 以

焊缝连接之不同材料或带不同填充金属之焊缝。当焊缝金属是具有异于母材辐射衰减之合金组或等级时，

IQI材料应按焊缝金属并在符合 T-276.1之规定下进行选用。当 T-282.2的黑度极限不能满足一个 IQI，并且

特殊黑度区域在焊缝金属和母材之界面处时，其他的 IQI材料应根据母材并在符合 T-276.1之规定下进行选

用。

T-277 USE OF IQIs TO MONITOR RADIOGRAPHIC EXAMINATION 采用 IQIs监测射线照相检测

T-277.1 Placement of IQIs. IQI之定位

(a) Source-Side IQI(s). The IQI(s) shall be placed on the source side of the part being examined, except

for the condition described in (b). 射源侧 IQI。除(b)中描述的条件外， IQI应定位在受检测物项之射源侧。

When, due to part or weld configuration or size, it is not practical to place the IQI(s) on the part or weld, the IQI(s) may be placed on a separate block. Separate blocks shall be made of the same or radiographically similar materials (as defined in SE-1025) and may be used to facilitate IQI positioning. There is no restriction on the

separate block thickness, provided the IQI/area-of-interest density tolerance requirements of T-282.2 are met. 当由

于物项或焊接结构或尺寸，将 IQI定位在物项或焊缝上是不切实际的时，IQI可定位在单独模块上。单独模

块应由具有相同或射线照相相似的材料(如 SE-1025中定义的)制成，并容于于 IQI定位。对单独模块厚度并

无限制，只要满足 T-282.2的 IQI /受检测区域黑度公差要求即可。

(1) The IQI on the source side of the separate block shall be placed no closer to the film than the

source side of the part being examinated radiographed. 单独模块之射源侧上的 IQI应定位在不比受检测物项的

射源侧更接近于胶片。

(2) The separate block shall be placed as close as possible to the part being examinated radi-

ographed. 单独模块应定位在尽可能靠近受检测物项。

(3) When hole-type IQIs are used, the block dimensions shall exceed the IQI dimensions such that

the outline of at least three sides of the IQI image shall be visible on the radiograph. 当采用孔洞型 IQI时，单独

模块尺寸应超过 IQI尺寸，以使至少有 IQI三条图像之边源轮廓可在射线胶片上可看得见。

(b) Film-Side IQI(s). Where inaccessibility prevents hand placing the IQI(s) on the source side, the IQI(s) shall be placed on the film side in contact with the part being examined. A lead letter “F” shall be placed ad-

jacent to or on the IQI(s), but shall not mask the essential hole where hole IQIs are used. 胶片侧 IQI。当不可接近

性阻止将 IQI定位在源侧时，IQI应定位在与受检测物项接触的胶片侧。引线字母“F”应定位在 IQI附近或

上面，但不应掩盖了孔洞型 IQI的基本孔。

(c ) IQI Placement for Welds — Hole IQIs. The IQI(s) may be placed adjacent to or on the weld. The identification number(s) and, when used, the lead letter “F,” shall not be in the area of interest, except when geo-

metric configuration makes it impractical. 焊缝之 IQI定位 - 孔洞型 IQI。 IQI可定位在焊缝附近或焊缝上。当

采用时，标识号和铅字母“F” 不应在受检测区域中，除非当几何形状不切实际时。

(d) IQI Placement for Welds — Wire IQIs. The IQI(s) shall be placed on the weld so that the length of the wires is perpendicular to the length of the weld. The IQI identification and, when used, the lead letter “F,” shall

not be in the area of interest, except when geometric configuration makes it impractical. 焊缝之 IQI定位线型IQI。 IQI应放在焊缝上，并使指示线之长度垂直于焊缝长度。 IQI标识和所采用之引号“F”不应在受检测

区域，除非几何形状不切实际时。

(e ) IQI Placement for Materials Other Than Welds. The IQI(s) with the IQI identification and, when

used, the lead letter “F,” may be placed in the area of interest. 不同于焊缝之材料的 IQI定位。具有 IQI识别的

IQI(当采用时，铅字母“F”)可以定位在受检测区域中。

Figure T-275 Location Marker Sketches

位置标记示意图

Flat component or longitudinal seam [See T-

275.1(a)(1)] [See sketch (e) for alternate] 平面物项或纵焊缝 [见T-275.1 (a) (1)][替代方法

见示意图(e)]

(a)

Curved components with radiation source to

film distance less than radius of component [See T-275.1(a)(21] 具有射线源到胶片距离小于物

项半径之曲面物项 [见T-275.1 (a) (2)]

(b)

Curved components with convex surface towards radiation source [See T-275.1(a)(3)] 曲面物项凸

面朝向射线源[见T-275.1(a)(3)]

(c)

Curved components with radiation source to film distance greater than radius of curvature [See T-275. 1(b)(1)] 具有射线源到胶片距离大于曲率半径之曲面物项，见[T-275.1 (b)

(1)]

(d)

Source side marker alternate射线源侧标记的替代办

法 Flat component or logitudinal seam平面物项或纵焊缝

x = (t / D) (Mf / 2) x = additional required coverage beyond film side

location marker 额外要求超过胶片侧位置标记的涵盖之范围

t = component thickness 物项厚度 𝑀𝑓 = film side location marker interval 胶片侧位置

标记间距 D = source to component distance [See T-275.

1(b)(2)] 射线源到物项的距离[见T-275.1 (b) (2)]

(e)

Curved components with radiation source at cen-ter curvature [See T-275.1(c)] 射线源在曲率中

心之曲面物项，见[T-275.1 (c)]

(f)

Film side unacceptable定位在胶片侧是不能接受的

Source side ac-ceptable定位在射圆测是可接受的







Either side location marker is accepta-ble任一侧之位置标记均可接受

D

x x 𝑀𝑓

LEGEND: 图例 Radiation source 射线源 marker 位置标记 •

Component center 物项中心 +

Table T-276 IQI Selection

像质计(IOI)的选用

Nominal Single-Wall Material Thickness Range

单壁材料的标称厚度范围 , in. (mm)

IQI像质计

Source Side 射源侧 Film Side 胶片侧

Hole-Type

Designation

孔洞型代码

Essential Hole

基本孔

Wire-Type

Essential Wir

线型像质计基本线

Hole-Type

Designation

孔洞型代码

Essential Hole

基本孔

Wire-Type

Essential Wir

线型像质计基本线

Up to 0.25, incl. (6.4) 12 2T 5 10 2T 4

Over 0.25 through 0.375 (6.4 through 9.5) 15 2T 6 12 2T 5














T-277.2 Number of IQIs. When one or more film holders are used for an exposure, at least one IQI image shall appear on each radiograph except as

outlined in (b) below IQI 数。当一个或多个胶片夹用于曝光时，至少一个 IQI图像应出现在每张放射胶片上，除非如下面(b)所述。

(a) Multiple IQIs. If the requirements of T-282 are met by using more than one IQI, one shall be representative of the lightest area of interest and

the other the darkest area of interest; the intervening densities on the radiograph shall be considered as having acceptable density. 多个 IQI。如果采用能满

足 T-282要求之一个以上的 IQI，则一个代表受检测区之最亮区域，另一个即代表受检测区之最暗区域；射线胶片上之中间黑度应视为具有可接

受的黑度。

(b) Special Cases7 特殊情况 7

(1) For cylindrical components where the source is placed on the axis of the component for a single exposure, at least three IQIs, spaced

approximately 120 deg apart, are required under the following conditions: 对于采用单次曝光之圆柱形物项，将射源定位在物项轴在线，在以下条件下

需至少有三个 IQI，且彼此间隔 120度(约略即可)：

(-a) When the complete circumference is radiographed using one or more film holders, or; 当对整个环向采用一或多胶片夹以进行

射线照相时；

(-b) When a section or sections of the circumference, where the length between the ends of the outermost sections span 240 or more deg, is radiographed using one or more film holders. Additional film loca-

tions may be required to obtain necessary IQI spacing.当采用一或多胶片夹对最外区段端部间的长度跨越 240

度或更大角度之环向的一或多区段进行射线照相时，可能需要更多的胶片位置以取得所需的 IQI间距。

(2) For cylindrical components where the source is placed on the axis of the component for a sin-gle exposure, at least three IQIs, with one placed at each end of the span of the circumference radiographed and one

in the approximate center of the span, are required under the following conditions: 对于射源被定位在物项轴在线

以作为圆柱形物项单次曝光用时，在以下条件下需至少有三个 IQI，其中在环向跨度之每一端各定位一

个，并且一个定位在跨度的近似中心。

(-a) When a section of the circumference, the length of which is greater than 120 deg and

less than 240 deg, is radiographed using just one film holder, or; 当一环向区段之长度 ≦ 120度时，可采用一个

片夹来进行射线照相，或；

(-b) When a section or sections of the circumference, where the length between the ends of

the outermost sections span less than 240 deg, is radiographed using more than one film holder. 当最外区段端部间

之长度跨度小于 240度的一个或多个环向区段时，可采用一个以上的胶片夹来进行射线照相。

(3) In (1) and (2) above, where sections of longitudinal welds adjoining the circumferential weld are radiographed simultaneously with the circumferential weld, an additional IQI shall be placed on each longitudi-nal weld at the end of the section most remote from the junction with the circumferential weld being radiographed.

在上述(1)和(2)中，当环向焊缝相邻之纵向焊缝区段与环向焊缝同时进行射线照相时，应在最远离接合处之

每一纵向焊缝末端处定位一个额外的 IQI。

(4) For spherical components where the source is placed at the center of the component for a sin-gle exposure, at least three IQIs, spaced approximately 120 deg apart, are required under the following conditions:

对进行单次曝光之射源若位于球形物项中心时，在下列条件下需至少有三个 IQI，且彼此间须间隔 120度

(大约)：

(-a) When a complete circumference is radiographed using one or more film holders, or; 当

采用一或多个胶片夹对整个圆周进行射线照相时，或；

(-b) When a section or sections of a circumference, where the length between the ends of the outermost sections span 240 or more deg, is radiographed using one or more film holders. Additional film locations

may be required to obtain necessary IQI spacing. 当最外区段端部间之长度跨越 240度或更大角度，且采用一

或多个胶片夹对一或多个环向区段进行射线照相时，可能需要额外的胶片位置以获取所需之 IQI间距。

(5) For spherical components where the source is placed at the center of the component for a sin-gle exposure, at least three IQIs, with one placed at each end of the radiographed span of the circumference radi-

ographed and one in the approximate center of the span, are required under the following conditions: 当射源被定位

在物项中心以用于单次曝光之球形物项时，在以下条件下需至少有三个 IQI，其中在射线照相跨度之两端

各定位一个，另一个定位则定位在跨距的近似中心处。

(-a) When a section of a circumference, the length of which is greater than 120 deg and less

than 240 deg, is radiographed using just one film holder, or;当采用在一环向区段大于 120度且小于 240度时，

仅须采用一个胶片夹来进行射线照相，或；

(-b) When a section or sections of a circumference, where the length between the ends of the

outermost sections span less than 240 deg is radiographed using more than one film holder. 当圆周的一个或多个

部分进行射线照相时，且其中最外区段之长度跨度小于 240度时，可采用一个以上的胶片夹来进行。

(6) In (4) and (5) above, where other welds are radiographed simultaneously with the circumferen-

tial weld, one additional IQI shall be placed on each other weld. 在上述(4)和(5)中，当其他焊缝与环向焊缝同时

进行射线照相时，每一其他焊缝上应定位一个额外的 IQI。

(7) For segments of a flat or curved (i.e., ellipsoidal, torispherical, toriconical, elliptical, etc.) com-ponent where the source is placed perpendicular to the center of a length of weld for a single exposure when using

more than three film holders, at least three IQIs, one placed at each end of the radiographed span and one in the ap-

proximate center of the span, are required. 对于扁平或曲面(即，椭圆形，球形，圆锥形，椭圆形等)物项区

段，其中当采用多于三个胶片夹时，光源垂直于焊缝长度之中心点处定位以进行一次曝光时，需至少三个

IQI，在射线照相跨度的两端部各定位一个，一个定位在跨度的近似中心处。

(8) When an array of components in a circle is radiographed, at least one IQI shall show on each

component image.当对环状物中之大量物项进行射线照相时，在每一物项图像上应至少显示一个 IQI。

(9) In order to maintain the continuity of records involving subsequent exposures, all radiographs

exhibiting IQIs that qualify the techniques permitted in accordance with (1) through (7) above shall be retained.为

保持涉及后续曝光记录的连续性，应保留符合上述(1)至(7)项所认可之 IQIs显示技术所摄取的所有放射胶

片。

T-277.3 Shims Under Hole-Type IQIs. For welds, a shim of material radiographically similar to the weld metal shall be placed between the part and the IQI, if needed, so that the radiographic density throughout the area of inter-est is no more than minus 15% from (lighter than) the radiographic density through the designated IQI adjacent to

the essential hole. 孔洞型 IQIs下之垫片。对于焊缝，如果需要，应将在放射学上类似于焊缝金属之材料所

制成的垫片定位在物项和 IQI之间，以使整个受检测区域的射线照相黑度不超过通过相邻于基本孔之指定

IQI射线照相黑度减掉 15％后的值。

The shim dimensions shall exceed the IQI dimensions such that the outline of at least three sides of the IQI

image shall be visible in the radiograph.垫片尺寸应超过 IQI尺寸，以使 IQI图像至少有三边轮廓在放射胶片

中可见。


T-281 QUALITY OF RADIOGRAPHS 射线胶片质量

All radiographs shall be free from mechanical, chemical, or other blemishes to the extent that they do not mask and are not confused with the image of any discontinuity in the area of interest of the object being radiographed.

Such blemishes include, but are not limited to: 所有射线胶片都不应具有使射线线底片受检测区域内之任何不

连续图像受到掩饰或造成解释被混淆的机械、化学或其他污损。。这样污损包括但不限于：

(a) fogging; 灰雾；

(b) processing defects such as streaks, watermarks, or chemical stains;加工缺陷，例如条纹、水痕或化

学污渍；

(c ) scratches, finger marks, crimps, dirtiness, static marks, smudges, or tears; 划痕、指痕、皱痕、污

垢、静电痕迹、污迹或撕裂；

(d) false indications due to defective screens. 由于有缺陷的屏幕而导致的错误指示。

T-282 RADIOGRAPHIC DENSITY 射线照相之黑度

T-282.1 Density Limitations. The transmitted film density through the radiographic image of the body of the des-ignated hole-type IQI adjacent to the essential hole or adjacent to the essential wire of a wire-type IQI and the area of interest shall be 1.8 minimum for single film viewing for radiographs made with an X-ray source and 2.0 mini-mum for radiographs made with a gamma ray source. For composite viewing of multiple film exposures, each film of the composite set shall have a minimum density of 1.3. The maximum density shall be 4.0 for either single or

composite viewing. A tolerance of 0.05 in density is allowed for variations between densitometer readings. 黑度限

度。就以X射线源所制成之射线胶片而言，通过与相邻于基本孔或与相邻于线型 IQI基本线之指定孔洞型

IQI主体之放射线照相图像黑度和受检测区域的透射胶片黑度，在单片观察时黑度最小值应为 1.8；若采用

γ射线源所制成之射线胶片时，对多胶片曝光之叠片观察则最小值为 2.0。复合组之每一胶片应具有 1.3的

最小黑度。单片观察或叠片观察之最大黑度应为 4.0。黑度计读数之间的变数允许有± 0.05的黑度公差。

T-282.2 Density Variation. 黑度变数

(a) The density of the radiograph anywhere through the area of interest shall not 通过受检测区域之任何地

方的射线胶片黑度不应：

(1) vary by more than minus 15% or plus 30% from the density through the body of the designated hole-

type IQI adjacent to the essential hole or adjacent to the essential wire of a wire-type IQI, and 通过相邻于基本孔

之指定孔洞型 IQI本体或相邻于线型 IQI基本线的黑度变数超过负 15％或正 30％，以及

(2) exceed the minimum/maximum allowable density ranges specified in T-282.1 超过 T-282.1所规定

之最小/最大允许黑度范围

When calculating the allowable variation in density, the calculation may be rounded to the nearest 0.1

within the range specified in T-282.1. 当计算黑度允许变化时，可按 T-282.1 所规定之范围内将计算值四舍五

入到最接近 0.1的精确度上。

When the requirements of (a) above are not met, then an additional IQI shall be used for each excep-

tional area or areas and the radiograph retaken. 当不能满足上述(a)之要求时，则应为每一异常区域增加一个

IQI，并重拍射线胶片。

(b) When shims are used with hole-type IQIs, the plus 30% density restriction of (a) above may be exceeded, and the minimum density requirements of T-282.1 do not apply for the IQI, provided the required IQI sensitivity of

T-283.1 is met. 当垫片与孔洞型 IQI一起采用时，可能超过上述(a)之正 30％黑度限度，并且 T-282.1的最小

黑度要求不适用于 IQI，其前提条件是：所需之 IQI灵敏度能满足 T-283.1之规定。

T-283 IQI SENSITIVITY IQI灵敏度

T-283.1 Required Sensitivity. Radiography shall be performed with a technique of sufficient sensitivity to display the designated hole-type IQI image and the essential hole, or the essential wire of a wire-type IQI. The radiographs shall also display the IQI identifying numbers and letters. If the designated hole-type IQI image and essential hole, or essential wire of a wire-type IQI, do not show on any film in a multiple film technique, but do show in composite

film viewing, interpretation shall be permitted only by composite film viewing. 所需之灵敏度。射线照相应以足

够灵敏度之技术进行，以显示所指定之孔洞型 IQI图像和基本孔，或线型 IQI的基本线。射线胶片还应显

示 IQI识别数位和字母。如果所指定的孔型 IQI图像和基本孔或线型 IQI的基本线在多层胶片技术中不显示

在任何胶片上，而是以复合胶片观察显示，则仅允许复合胶片查看。

T-283.2 Equivalent Hole-Type IQI Sensitivity. A thinner or thicker hole-type IQI than the designated IQI may be substituted, provided an equivalent or better IQI sensitivity, as listed in Table T-283, is achieved and all other requirements for radiography are met. Equivalent IQI sensitivity is shown in any row of Table T-283 which con-tains the designated IQI and hole. Better IQI sensitivity is shown in any row of Table T-283 which is above the equivalent sensitivity row. If the designated IQI and hole are not represented in the table, the next thinner IQI row

from Table T-283 may be used to establish equivalent IQI sensitivity. 等效孔洞型 IQI灵敏度。如果达到表 T-

283中所列 5 等效或更好的 IQI灵敏度，并满足放射成像的所有其他要求，则可以用比指定 IQI更薄或更厚

的孔洞型 IQI代替。等效 IQI灵敏度显示在表 T-283中之任一行中，其包含指定的 IQI和孔。更好的 IQI灵

敏度显示在表 T-283之任一行中，其灵敏度高于等效灵敏度行。如果所指定之 IQI和孔未在表中列出，则

表 T-283中的下一个较薄的 IQI行可用于制定等效的 IQI灵敏度。

T-284 EXCESSIVE BACKSCATTER 过量背散射

If a light image of the “B,” as described in T-223, appears on a darker background of the radiograph, protec-

tion from backscatter is insufficient and the radiograph shall be considered unacceptable. A dark image of the

“B” on a lighter background is not cause for rejection. 如果如T-223中所述之“B” 亮图像出现在射线胶片的

较暗背景上，则表示防止背向散射做得不够充分，并且射线胶片被视为是不可接受的。在较亮背景上的

“B” 暗图像是不会被拒绝的。

Table T-283 Equivalent Hole-Type IQI Sensitivity

等效孔洞型 IQI灵敏度

Hole-Type Designation 2T Hole

孔洞型识别码 2T 孔

Equivalent Hole-Type Designations

等效孔洞型识别码

1T Hole 1T 孔 4T Hole 4T 孔

10 15 5

12 17 7

15 20 10

17 25 12

20 30 15

25 35 17

30 40 20

35 50 25

40 60 30

50 70 35

60 80 40

80 120 60

100 140 70

120 160 80

160 240 120

200 280 140

T-285 EVALUATION BY MANUFACTURER 由制造商所进行之评估

The Manufacturer shall be responsible for the review, interpretation, evaluation, and acceptance of the com-pleted radiographs to assure compliance with the requirements of Article 2 and the referencing Code Section. As an aid to the review and evaluation, the radiographic technique documentation required by T-291 shall be completed prior to the evaluation. The radiograph review form required by T-292 shall be completed during the evaluation. The radiographic technique details and the radiograph review form documentation shall accompany the radiographs. Acceptance shall be completed prior to presentation of the radiographs and accompanying documentation to the In-

spector. 制造商应负责审查、解释、评估和接受完整的射线胶片，以确保符合第2章节和引用规范章节的要

求。为有助于审视和评估，评估前应完成T-291 所要求之射线照相技术文件应在评估之前完成。在T-292中

亦要求放射胶片审查表应在评估期间完成。射线照相技术细节和射线照相审查窗体文件应包括在射线胶片

中。在射线照相胶片和随附文件交给检验员之前，全部数位都应允收完成。

T-290 DOCUMENTATION文件

T-291 RADIOGRAPHIC TECHNIQUE DOCUMENTATION DETAILS

射线技术文文件细节

The organization shall prepare and document the radiographic technique details. As a minimum, the following

information shall be provided. 制造厂应将射线技术文文件细节编制成案，其中至少应提供下列讯息：

(a) the requirements of Article 1, T-190(a) 第 1章 T-190(a)之要求；

(b) identification as required by T-224 T244 所要求之识别码；

(c ) the dimensional map (if used) of marker placement in accordance with T-275.3 按 T-275.3之规定

所绘制之标记定位尺寸图(如采用时)

(d) number of radiographs (exposures) 胶片(曝光)的数量

(e ) X-ray voltage or isotope type used 所采用之X 射线电压或同位素类型

(f ) source size (F in T-274.1) 射源尺寸(T-274.1 中的 F)

(g) base material type and thickness, weld thickness, weld reinforcement thickness, as applicable 所适

用之母材类型和厚度､焊缝厚度､焊缝余高

(h) source-to-object distance (D in T-274.1) 射源至物项之距离(T-274.1 中的 D)

(i ) distance from source side of object to film (d in T-274.1) 物项射源侧至胶片之距离(T 274.1 中的d)

(j ) film manufacturer and their assigned type/ designation 胶片制造厂和和他们的指定类型/名称

(k ) number of film in each film holder/cassette 每一胶片夹/暗匣中的胶片数量

(l ) single or double-wall exposure 单壁或双壁曝光

( m) single or double-wall viewing 单壁或双璧观察

T-292 RADIOGRAPH REVIEW FORM 射线检查表

The Manufacturer shall prepare a radiograph review form. As a minimum, the following information shall be

provided. 制造商应准备一张放射胶片审查表，至少应提供以下信息：

(a) a listing of each radiograph location 每一射线胶片的位置列表

(b) the information required in T-291, by inclusion of the information on the review form or by reference

to an attached radiographic technique details sheet T-291中所要求之信息，包括了有关审查表的信息，或所参

考之其他放射照相术技术详情表

(c ) evaluation and disposition of the material(s) or weld(s) examined 对所检测之材料或焊缝进行评估

和处置

(d) identification (name) of the Manufacturer’s representative who performed the final acceptance of the

radiographs 执行最终接受射线胶片之制造商代表身份(姓名)

(e ) date of Manufacturer’s evaluation 制造商评估日期

MANDATORY APPENDIX I IN-MOTION RADIOGRAPHY 强制性附录 I 移动式射线照相法


In-motion radiography is a technique of radiography where the object being radiographed and/or the source of

radiation is in motion during the exposure. 移动式放射线照相术是一种放射线照相术的技术，其中被放射线照

相之物项和/或辐射源在曝光期间是处于移动状态的。

In-motion radiography may be performed on weldments when the following modified provisions to those in Ar-

ticle 2 are satisfied. 当满足第 2章节中之修改条款时，可以对焊件进行移动式射线照相。

I-220 GENERAL REQUIREMENTS 通用要求

I-223 BACKSCATTER DETECTION SYMBOL LOCATION 背散射探测符号位置

(a) For longitudinal welds the lead symbol “B” shall be attached to the back of each film cassette or at ap-

proximately equal intervals not exceeding 36 in. (914 mm) apart, whichever is smaller. 对于纵向焊缝，引线符号

“B”应连接到每一胶片暗匣之背面，或以大约相等的间距连接且间隔不得超过 36英寸(914 mm)，取其中

两者之较小者。

(b) For circumferential welds, the lead symbol “B” shall be attached to the back of the film cassette in each

quadrant or spaced no greater than 36 in. (914 mm), whichever is smaller. 对于环向焊缝，引线符号“B”应在每

一像限中连接到胶片暗匣背面，或间隔不大于 36英寸(914 mm)，取较小者。

I-260 CALIBRATION 校准

I-263 BEAM WIDTH射束波宽度

The beam width shall be controlled by a metal diaphragm such as lead. The diaphragm for the energy selected

shall be at least 10 half value layers thick. 射束波宽度应由金属光圈(如铅)控制。所选用之光圈能量应至少为

10个半值层厚。

The beam width as shown in Figure I-263 shall be determined in accordance with: 如图 I-263 所示之射束波宽

度应根据以下方规程进行确定：

𝑤 =𝑐(𝐹+𝑎)

𝑏+ 𝑎

where 式中

a = slit width in diaphragm in direction of motion 移动方向之光圈狭缝宽度

b = distance from source to the weld side of the diaphragm 由射源至光圈之焊缝侧的距离

c = distance from weld side of the diaphragm to the source side of the weld surface 由光圈之焊缝侧

至焊缝表面近射源一侧的距离

F = source size: the maximum projected dimension of the radiating source (or focal spot) in the plane

perpendicular to the distance b + c from the weld being radiographed 射源大小：在与辐射源(或焦点)所在平面

相距 b + c 处之平面中的最大垂直投影尺寸

w = beam width at the source side of the weld measured in the direction of motion 在移动方向上测

量所得之焊缝射源侧的射束波宽度

NOTE: Use consistent units. 注：采用一致的单位。

I-274 GEOMETRIC AND IN-MOTION UNSHARPNESS 几何形状和移动中的模糊度

I-274.1 Geometric Unsharpness. Geometric unsharpness for in-motion radiography shall be determined in ac-

cordance with T-274.1. 几何模糊度。移动式放射线照相之几何模糊度应根据 T-274.1确定。

I-274.2 In-Motion Unsharpness. In-motion unsharpness of the radiograph shall be determined in accordance with:

运动中之模糊度。移动式放射线照相之模糊度应根据以下标准确定：

𝑈𝑀 =𝑤𝑑

𝐷

where 式中

D = distance from source of radiation to weld being radiographed射源至受检测焊缝间的距离

d = distance from source side of the weld being radiographed to the film受检测之焊缝射源侧至

胶片间的距离

𝑈𝑀 = in-motion unsharpness 移动模糊度

w = beam width at the source side of the weld measured in the direction of motion determined as

specified in I-263 按 I-263中所指定之移动方向时，在焊缝射源侧所测量到的焊缝宽度

NOTE: Use consistent units. 注：采用一致的单位。

I-274.3 Unsharpness Limitations. Recommended maximum values for geometric unsharpness and inmotion un-

sharpness are provided in T-274.2. 模糊度限度。 T-274.2对几何模糊和移动模糊度做出了最大推荐值。

I-275 LOCATION MARKERS 位置标记

Location markers shall be placed adjacent to the weld at the extremity of each film cassette and also at approxi-

mately equal intervals not exceeding 15 in. (381 mm). 位置标记应定位在每个胶片按匣末端处之焊缝附近，并

大约等间距但不超过 15 in. (381 mm)之方式定位。

I-277 PLACEMENT AND NUMBER OF IQIs IQIs 的位置和数量

(a) For longitudinal welds, hole IQIs shall be placed adjacent to and on each side of the weld seam, or on the weld seam at the beginning and end of the weld seam, and thereafter at approximately equal intervals not exceeding

36 in. (914 mm) or for each film cassette. 对纵向焊缝来说，孔洞型像质计应定位在焊缝的两侧附近，或定位

在在焊缝的起始端和结束端，此后应以不超过 36in. (914mm) 之大致相等的间距定位，或每一胶片盒定位一

个像质计。

Wire IQIs, when used, shall be placed on the weld seam so that the length of the wires is perpendicular

to the length of the weld and spaced as indicated above for hole IQIs. 当采用线型 IQIs时，应定位在焊缝上，以

使线之长度方向垂直于焊缝轴线，并如上对孔洞型 IQI所述方式相互间隔开来。

(b) For circumferential welds, hole IQIs shall be placed adjacent to and on each side of the weld seam or on

the weld seam in each quadrant or spaced no greater than 36 in. (914 mm) apart, whichever is smaller. 对于环向焊

缝，孔洞型 IQI应邻近焊缝之每一侧或在每个像限之焊缝上、或彼此间隔不大于 36 in. (914 mm)，取其中之

最小者。

Wire IQIs, when used, shall be placed on the weld seam so that the length of the wires is perpendicular

to the length of the weld and spaced as indicated above for hole IQIs. 当采用线型 IQIs时，应定位在焊缝上，以

使线之长度方向垂直于焊缝轴线，并如上对孔洞型 IQI所述方式相互间隔开来。

I-229 REPAIRED AREA 返修区

When radiography of a repaired area is required, the length of the film used shall be at least equal to the length

of the original location marker interval. 当需对返修区进行射线照相时，所采用胶片之长度应至少等于初期位

置标记间隔的长度。

Figure I-263 Beam Width Determnation

射束波宽度确定方法示意图

Motion 移动

Diaphragm

光圈

MANDATORY APPENDIX II REAL-TIME RADIO-

SCOPIC EXAMINATION 强制性附录 II 实时射线透视检测法


Real-time radioscopy provides immediate response imaging with the capability to follow motion of the in-spected part. This includes radioscopy where the motion of the test object must be limited (commonly referred to as

near real-time radioscopy). 实时射线透视检测法提供了具有追踪受检查物项移动能力之实时反应成像；这也

包括了射线透视检测，其中检测物项之移动速度必须被限制(通常称为近实时射线透视检测)。

Real-time radioscopy may be performed on materials including castings and weldments when the modified pro-visions to Article 2 as indicated herein are satisfied. SE-1255 shall be used in conjunction with this Appendix as indicated by specific references in appropriate paragraphs. SE-1416 provides additional information that may be

used for radioscopic examination of welds. 当本文第 2章节所指出之修改条款能被满足时，以可对材料(包括

铸件和焊件) 进行实时射线透视检测。正如在适当段落中之具体参考文献所示， SE-1225 应本附录结合一

起采用。 SE-1416 为焊缝提供了射线透视检测时所需之附加信息。

II-220 GENERAL REQUIREMENTS 一般要求

This radioscopic methodology may be used for the examination of ferrous or nonferrous materials and weld-

ments. 此放射成像方法可用于检测铁材料、非铁材料和焊件。

II-221 PROCEDURE REQUIREMENTS 规程要求

A written procedure is required and shall contain as a minimum the following (see SE-1255, 5.2): 所需之书面

规程应至少包含以下内容(见 SE-1255, 5.2)：

(a) material and thickness range 材料和厚度范围

(b) equipment qualification 设备资格

(c ) test object scan plan 检测物项审视计划

(d) radioscopic parameters 射线参数

(e ) image processing parameters 图像处理参数

(f ) image display parameters 图像显示参数

(g) image archiving 图像归档

II-230 EQUIPMENT AND MATERIALS 设备和材料

II-231 RADIOSCOPIC EXAMINATION RECORD 射线检测记录

The radioscopic examination data shall be recorded and stored on videotape, magnetic disk, or optical disk. 射

线检测数位应记录并贮存在录像带，磁盘或光盘上。

II-235 CALIBRATION BLOCK校准块

The calibration block shall be made of the same material type and product form as the test object. The calibra-tion block may be an actual test object or may be fabricated to simulate the test object with known discontinuities.

校准块应由与检测物项具有相同材料类型和产品形式所制造而成的，而校准块可能是一个实际检测物项，

或者是一个具有已知缺陷的模拟检测规块。

II-236 CALIBRATED LINE PAIR TEST PATTERN AND STEP WEDGE 已校准线

对检测图像和阶梯块

The line pair test pattern shall be used without an additional absorber to evaluate the system resolution. The step

wedge shall be used to evaluate system contrast sensitivity. 在没有其他吸收体之情况下，可采用线对检测图像

对系统分辨率进行评估，而阶梯块则应用于系统对比灵敏度上的评估。

The step wedge must be made of the same material as the test object with steps representing 100%, 99%, 98%, and 97% of both the thickest and the thinnest material sections to be inspected. Additional step thicknesses are per-

missible upon agreement between the purchaser and the supplier of radioscopic examination services.. 阶梯块必

须由与待测物项相同材料所制成，其各级阶梯意指待检测材料断面之最厚和最薄的 100％，99％，98％和

97％。按买方和提供射线透视检测之组织间的商定，其他厚度阶梯是允许采用的。

II-237 EQUIVALENT PERFORMANCE LEVEL等效性能水平

A system which exhibits a spatial resolution of 3 line pairs per millimeter, a thin section contrast sensitivity of

3%, and a thick section contrast sensitivity of 2% has an equivalent performance level of 3% — 2% — 3 lp/mm. 對

能显示 3 lp/mm的空间分辨率、3％的薄截面对比灵敏度、2％的断面厚度对比灵敏度之系统来说，即表示

该系统具有 3％-2％-3lp / mm的等效性能水平。

II-260 CALIBRATION 校准

System calibration shall be performed in the static mode by satisfying the line pair test pattern resolution, step wedge contrast sensitivity, and calibration block discontinuity detection necessary to meet the IQI requirements of

T-276. 系统校验应在静态进行，应能满足线对图形的分辨力要求和感光级谱的对比灵敏度要求，校验规块

的缺陷检测须满足 T-276 中对 IQI 的要求。

II-263 SYSTEM PERFORMANCE MEASUREMENT 系统性能测定

Real-time radioscopic system performance parameters shall be determined initially and monitored regularly with the system in operation to assure consistent results. The system performance shall be monitored at sufficiently scheduled intervals to minimize the probability of time-dependent performance variations. System performance

tests require the use of the calibration block, line pair test pattern, and the step wedge. 系统校准应在静态模式下藉

由线对检测图像分辨率，阶梯块对比灵敏度和校准块不连续性检测来满足T-276对 IQI所需之要求

System performance measurement techniques shall be standardized so that they may be readily duplicated at the

specified intervals. 系统性能测定技术应标准化，以便在指定的时间间隔内容易地被重复应用。

II-264 MEASUREMENT CALIBRATION WITH A CALIBRATION BLOCK具有校准块之测定校准

The calibration block shall also be placed in the same position as the actual object and manipulated through the same range and speed of motions as will be used for the actual object to demonstrate the system’s response in the

dynamic mode. 校准块亦应定位在与实体之相同位置上，并通过与实体相同的一度范围和速度进行操作，以

演示系统在动态模式下的感应。

II-270 EXAMINATION 检测

II-278 SYSTEM CONFIGURATION 系统配置

The radioscopic examination system shall, as a minimum, include the following: 放射检测系统应至少包括以

下内容：

(a) radiation source 辐射源

(b) manipulation system 操纵系统

(c ) detection system 检测系统

(d) information processing system 讯息处理系统

(e ) image display system 图像显示系统

(f ) record archiving system 记录存盘系统

II-280 EVALUATION 评估

II-286 FACTORS AFFECTING SYSTEM PERFORMANCE系统性能影晌因素

The radioscopic examination system performance quality is determined by the combined performance of the

components specified in II-278, See SE-1255, 6.1. 放射检测系统之性能质量系由 II-278中所规定组件的综合性

能所决定，见 SE-1255 6.1。

When using wire IQIs, the radioscopic examination system may exhibit asymmetrical sensitivity, therefore, the

wire diameter axis shall be oriented along the axis of the least sensitivity of the system. 当采用线型 IQI时，放射

检测系统可能表现出不对称的灵敏度，因此，线径轴应沿着系统最小灵敏度之轴线定向。

II-290 DOCUMENTATION 文件

II-291 RADIOSCOPIC TECHNIQUE INFORMATION 放射性技术信息

To aid in proper interpretation of the radioscopic examination data, details of the technique used shall accom-pany the data. As a minimum, the information shall include the items specified in T-291 when applicable, II-221,

and the following: 为了帮助正确解释放射检测数位，所采用之技术细节将伴随数位。信息应至少包括T-291

中所适用之项目、II-221和以下内容：

(a) operator identification 操作者标识符

(b) system performance test data 系统性能检测数位

II-292 EVALUATION BY MANUFACTURER 由制造商所进行之评估

Prior to being presented to the Inspector for acceptance, the examination data shall be interpreted by the Manu-facturer as complying with the referencing Code Section. The Manufacturer shall record the interpretation and dis-position of each weldment examined on a radiographic interpretation review form accompanying the radioscopic

data. 在提交检验员验收之前，检测数位应由制造商解释为已符合引用规范章节。制造商应伴随放射线数位

将每一已检测焊件之解释和处置记录在射线照相解释审查表

MANDATORY APPENDIX III DIGITAL IMAGE ACQUISI-

TION, DISPLAY, AND STORAGE FOR RADIOGRAPHY AND

RADIOSCOPY 强制性附录 III 射线照相和射线透视之数位图像摄取、显示和贮存

Radiography vs Radioscopy What's the difference?

Radiography: the process of making radiographs, and the science of analyzing them.

Radioscopy: examination of objects by the use of X-rays; radiology, see also fluoroscopy.

III-210 SCOPE 适用范围

Digital image acquisition, display, and storage can be applied to radiography and radioscopy. Once the analog image is converted to digital format, the data can be displayed, processed, quantified, stored, retrieved, and con-

verted back to the original analog format, for example, film or video presentation. 数位图像摄取､显示和贮存可

应用于射线照相术和射线透视法中。一旦模拟图像被转换成数位格式，便可显示、处理、量化、贮存、检

索数位并将其转换回首要模拟格式，例如胶片或影像显示。

Digital imaging of all radiographic and radioscopic examination test results shall be performed in accordance

with the modified provisions to Article 2 as indicated herein. 所有射线照相和射线透视检测结果之数位图形化应

按照本文所述第 2章节之修改规定进行。

III-220 GENERAL REQUIREMENTS 一般要求

III-221 PROCEDURE REQUIREMENTS 规程要求

A written procedure is required and shall contain, as a minimum, the following system performance parameters:

需有一本书面规程，其中应至少包含以下系统性能参数：

(a) image digitizing parameters — modulation transfer function (MTF), line pair resolution, contrast sen-

sitivity, and dynamic range 图像数位化参数调节传递函数(MTF)、线对分辨率、对比灵敏度和动态范围

(b) image display parameters — format, contrast, and magnification 图像显示参数格式、对比度和放

大率

(c ) image processing parameters that are used 所采用之图像处理参数

(d) storage — identification, data compression, and media (including precautions to be taken to avoid

data loss) 贮存识别、数位压缩和影像(包括为避免数位丢失而采取的预防措施)

(e ) analog output formats 模拟输出格式

III-222 ORIGINAL IMAGE ARTIFACTS 首要图像伪影

Any artifacts that are identifieded in the original image shall be noted or annotated on the digital image. 在首要

图像中所进行之任何伪影都应在数位图像上注释或评注。

III-230 EQUIPMENT AND MATERIALS 设备和材料

III-231 DIGITAL IMAGE EXAMINATION RECORD 数位图像检测记录

The digital image examination data shall be recorded and stored on video tape, magnetic disk, or optical disk. 应

记录数位图像检测数位并将之贮存在录像带、磁盘或光盘上。

III-234 VIEWING CONSIDERATIONS 看片注意事项

The digital image shall be judged by visual comparison to be equivalent to the image quality of the original im-

age at the time of digitization. 数位图像与数位化时首要图像应通过目视比较以判定两者之图像质量是否等

同。

III-236 CALIBRATED OPTICAL LINE PAIR TEST PATTERN AND OPTICAL

DENSITY STEP WEDGE 已校准光学线对检测图案和光学黑度阶梯块

An optical line pair test pattern operating between 0.1 and 4.0 optical density shall be used to evaluate the mod-ulation transfer function (MTF) of the system. The optical density step wedge shall be used to evaluate system con-

trast sensitivity. 在 0.1和 4.0光学黑度之间操作的光学线对检测图案应用于系统调整传递函数(MTF)之评估

上；而光学黑度阶梯块则应用于系统对比灵敏度之评估上。

III-250 IMAGE ACQUISITION AND STORAGE 图像摄取和贮存

III-255 AREA OF INTEREST 受检测区域

Any portion of the image data may be digitized and stored provided the information that is digitized and stored

includes the area of interest as defined by the referencing Code Section. 只要被数位化和贮存之信息包括了由引

用规范章节所定义之受检测区域，则图像数位之任何部分均可被数位化和贮存。

III-258 SYSTEM CONFIGURATION 系统配置

The system shall, as a minimum, include the following: 该系统应至少包括以下内容：

(a) digitizing system 数位化系统

(b) display system 显示系统

(c ) image processing system 图像处理系统

(d) image storage system 图像贮存系统

III-260 CALIBRATION 校准

The system shall be calibrated for modulation transfer function (MTF), dynamic range, and contrast sensitivity.

应对系统之调节传递函数(MTF)、动态范围和对比敏感度进行校准。

III-263 SYSTEM PERFORMANCE MEASUREMENT 系统性能测量

System performance parameters (as noted in III-221)▲

shall be determined initially and monitored regularly

with the system in operation to assure consistent results. The system performance shall be monitored at the begin-

ning and end of each shift to minimize the probability of time-dependent performance variations. 应首先确定系统

性能参数(如 III-221中所述)，并在系统运行时定期监测，以确保结果一致。在每个班次的开始和结束时应

监视系统性能，以使系统性能随时间变化之概率最小化。▲应为"II-263" 之误。译注

III-280 EVALUATION 评估

III-286 FACTORS AFFECTING SYSTEM PERFORMANCE 影晌系统性能的因素

The quality of system performance is determined by the combined performance of the components specified in

III-258. 系统性能质量是由 III-258中所指定组件之综合性能所确定的。

III-287 SYSTEM-INDUCED ARTIFACTS 系统所诱发之伪影

The digital images shall be free of system-induced artifacts in the area of interest that could mask or be confused

with the image of any discontinuity in the original analog image. 数位图像应在受检测区域中没有系统所诱导之

伪像，其可能对首要模拟图像中之任何不连续图像造成掩饰或解释的混淆。

III-290 DOCUMENTATION 文件

III-291 DIGITAL IMAGING TECHNIQUE INFORMATION 数位成像技术信息

To aid in proper interpretation of the digital examination data, details of the technique used shall accompany the data. As a minimum, the information shall include items specified in T-291 and II-221 when applicable, III-221, III-

222, and the following: 为对正确解释数位检测数位有所帮助，所采用之技术细节应伴随着数位，其中，信息

应至少包括 T-291和 II-221中所适用之项目、III-221、III-222和以下内容：

(a) operator identification 操作者识别码


III-292 EVALUATION BY MANUFACTURER 由制造商所进行之评估

Prior to being presented to the Inspector for acceptance, the digital examination data from a radiographic or ra-dioscopic image shall have been interpreted by the Manufacturer as complying with the referencing Code Section.

在提交给检查员认可之前，制造商应将来自射线照相或透视图像的数位检测数位解释为已符合引用规范章

节。

The digital examination data from a radiograph that has previously been accepted by the Inspector is not re-

quired to be submitted to the Inspector for acceptance. 对先前已由检查员所认可之放射胶片数位检测数位则不

需要再次提交给检查员认可。

MANDATORY APPENDIX IV INTERPRETATION,

EVALUATION, AND DISPOSITION OF RADIOGRAPHIC

AND RADIOSCOPIC EXAMINATION TEST RESULTS

PRODUCED BY THE DIGITAL IMAGE ACQUISITION

AND DISPLAY PROCESS 强制性附录 IV 对用数位成像和显示处理法所得的射线照相和射线透视检

测结果的解释、评估和处理

IV-210 SCOPE 适用范围

The digital image examination test results produced in accordance with Article 2, Mandatory Appendix II, and Article 2, Mandatory Appendix III, may be interpreted and evaluated for final disposition in accordance with the

additional provisions to Article 2 as indicated herein. 根据第 2章节、强制性附录 II和第 2条强制性附录 III所

制作之数位图像检检测结果，可按本文所述之第 2章节的附加规定进行解释和评估，以进行最终处置。

The digital information is obtained in series with radiography and in parallel with radioscopy. This data collec-

tion process also provides for interpretation, evaluation, and disposition of the examination test results. 数位信息是

与射线检测相关联的并可与射线透视检测同时获得。该数位摄取过程还对检查检测结果提供了解释、评估

和处置。

IV-220 GENERAL REQUIREMENTS 一般要求

The digital image shall be interpreted while displayed on the monitor. The interpretation may include density and contrast adjustment, quantification, and pixel measurement, including digital or optical density values and lin-

ear or area measurement. 当数位图像显示在显示器时级应进行解释。解释可包括密度、对比度调整、量化和

像素测量，其中也包括数位或光学黑度值和线性或面积测量。

The interpretation of a digitized image is dependent upon the same subjective evaluation by a trained interpreter as the interpretation of a radiographic or radioscopic image. Some of the significant parameters considered during interpretation include: area of interest, image quality, IQI image, magnification, density, contrast, discontinuity

shape (rounded, linear, irregular), and artifact identification. 数位化图像解释取决于那些已训练过之解释人员对

放射照相或透视检测图像解释的相同主观评价。在解释期间所需考虑的一些重要参数包括：受检测区域、

图像质量、IQI图像、放大率、黑度、对比度、不连续形状(圆形，线性，不规则)和伪影识别。

The digital image interpretation of the radiographic and radioscopic examination test results shall be performed

in accordance with the modified provisions to Article 2 as indicated herein. 放射照相和透射检测结果之数位图像

解释应按照本文所述第 2章节中的修改规定进行。

After the interpretation has been completed, the interpretation data and the digital image, which shall include the unprocessed original full image and the digitally processed image, shall be recorded and stored on video tape, mag-

netic tape, or optical disk. 在解释完成后，解释数位和数位图像(包括未处理的首要全图像和数位处理图像)应

被记录并贮存在录像带，磁带或光盘上。

IV-221 PROCEDURE REQUIREMENTS 规程要求

A written procedure is required and shall contain, as a minimum, the following system performance parameters:

需有一份书面规程，其内容应至少应包括以下系统性能参数：

(a) image digitizing parameters modulation transfer function (MTF), line pair resolution, contrast sensi-

tivity, dynamic range, and pixel size; 图像数位化参数调整转换功能(MTF)、线对分辨力、对比灵敏度、动态

范围及像素尺寸；

(b) image display parameters monitor size including display pixel size, luminosity, format, contrast, and

magnification; 图像显示参数包括显示像素大小、亮度、格式、对比度和放大率的监视器大小；

(c ) signal processing parameters including density shift, contrast stretch, log transform, and any other techniques that do not mathematically alter the original digital data, e.g., linear and area measurement, pixel sizing,

and value determination; 信号处理参数包括密度偏移、对比度拉伸、对数变换以及不在数学上改变首要数

位数位之任何其它技术，例如线性和面积测量、像素尺寸和其数值的确定；

(d) storage identification, data compression, and media (including precautions to be taken to avoid data loss). The non-erasable optical media should be used for archival applications. This is frequently called the WORM (Write Once Read Many) technology. When storage is accomplished on magnetic or erasable optical media, then procedures must be included that show trackable safeguards to prevent data tampering and guarantee data integrity.

贮存标记、数位压缩、媒体(介质)(包括避免数位丢失所采取的预防措施)。贮存识别，数位压缩和媒体(介

质)(包括为避免数位丢失而采取的预防措施)。不可删除的光学媒体(介质)应用于存盘应用上，这通常被称

为 WORM(仅能写入一次却可多次索引查看)技术。当在磁性或可被删除光学媒体(介质)上完成贮存时，必

须包括可跟踪保护显示以防止数位被篡改和保证数位完整性的过程。

IV-222 ORIGINAL IMAGE ARTIFACTS 首要伪影图像

Any artifacts that are identifieded shall be noted or annotated on the digital image. 所识别之任何伪影都应在

数位图像上注明或注释。

IV-230 EQUIPMENT AND MATERIALS 设备和材料

IV-231 DIGITAL IMAGE EXAMINATION RECORD 数位图像检查记录

The digital image examination data shall be recorded and stored on video tape, magnetic disk, or optical disk. 数

位图像检测数位应记录并贮存在录像带，磁盘或光盘上。

IV-234 VIEWING CONSIDERATIONS 看片注意事项

The digital image shall be evaluated using appropriate monitor luminosity, display techniques, and room light-

ing to insure proper visualization of detail. 应采用适当的监视器亮度､显示技术和室内照明来评估数位图像，

以确保正确显示细节。

IV-236 CALIBRATED OPTICAL LINE PAIR TEST PATTERN AND OPTICAL

DENSITY STEP WEDGE 已校准光学线对检测图案和光学黑度阶梯块

An optical line pair test pattern operating between 0.1 and 4.0 optical density shall be used to evaluate the mod-ulation transfer function (MTF) of the system. High spatial resolution with 14 line-pairs per millimeter (lp/mm) translates to a pixel size of 0.0014 in. (0.035 mm). Lesser spatial resolution with 2 lp/mm can be accomplished with a pixel size of 0.012 in. (0.3 mm). The optical density step wedge shall be used to evaluate system contrast sensitiv-

ity. Alternatively, a contrast sensitivity gage (step wedge block) in accordance with SE-1647 may be used. 在 0.1和

4.0光学黑度之间所操作之光学线对检测图案可作为系统节传递函数(MTF)之评估应用上。具有每毫米 14

线对(lp/mm)高空间分辨率可转换为 0.0014 in. (0.035 mm)像素大小。利用 0.012 in. (0.3 mm)的像素尺寸可实

现具有 2lp/mm较小空间的分辨率。光学黑度阶梯块可作为系统对比灵敏度之评估应用上，或者，可采用根

据 SE-1647的对比灵敏度量规(阶梯楔块)。

IV-250 IMAGE ACQUISITION, STORAGE, AND INTERPRETATION

图像摄取、贮存和解释

IV-255 AREA OF INTEREST 受检测区域

The evaluation of the digital image shall include all areas of the image defined as the area of interest by the ref-

erencing Code Section. 数位图像之评估应包括被引用规范章节定义为检测区域之图像的所有区域。

IV-258 SYSTEM CONFIGURATION 系统配置

The system shall, as a minimum, include: 该系统应至少包括：

(a) digital image acquisition system 数位图像摄取系统

(b) display system 显示系统

(c ) image processing system 图像处理系统

(d) image storage system 图像贮存系统

IV-260 CALIBRATION 校准

The system shall be calibrated for modulation transfer function (MTF), dynamic range, and contrast sensitivity.

The electrical performance of the hardware and the quality of the digital image shall be measured and recorded. 系

统应对调节传递函数(MTF)、动态范围和对比敏感度进行校准。应测量并记录硬件之电气性能和数位图像

质量。

IV-263 SYSTEM PERFORMANCE MEASUREMENT 系统性能量测

System performance parameters (as noted in IV-221) shall be determined initially and monitored regularly with the system in operation to assure consistent results. The system performance shall be monitored at the beginning

and end of each shift to minimize the probability of time-dependent performance variations. 系统性能参数(如 IV-

221中所述)应首先确定，并在系统运行时定期监测，以确保结果一致。应在每个班次的开始和结束时进行

系统性能监测，以使系统性能随时间变化之概率最小化。

IV-280 EVALUATION 评估

IV-286 FACTORS AFFECTING SYSTEM PERFORMANCE 影晌系统性能之因素

The quality of system performance is determined by the combined performance of the components specified in

IV-258. 系统性能质量是由 IV-258中所指定组件之综合性能所确定的。

IV-287 SYSTEM-INDUCED ARTIFACTS 系统所诱发之伪影

The digital images shall be free of system-induced artifacts in the area of interest that could mask or be confused

with the image of any discontinuity. 数位图像应在受检测区域中应没有系统所诱导之伪影，而该伪影可能会

造成任何不连续性被掩饰掉或混淆不连续性的解释。

IV-290 DOCUMENTATION 文件

IV-291 DIGITAL IMAGING TECHNIQUE INFORMATION 数位成像技术信息

To aid in proper interpretation of the digital examination data, details of the technique used shall accompany the data. As a minimum, the information shall include items specified in T-291 and II-221 when applicable, III-221, III-

222, IV-221, IV-222, and the following: 为对正确解释数位检测数位有所帮助，所采用之技术细节应伴随着数

位，其中讯息应至少包括 T-291和 II-221中所适用之项目、III-221、III-222、IV-221、IV-222和以下项目：

(a) operator identification 操作者标识符


(c ) calibration test data 校准检测数位

IV-292 EVALUATION BY MANUFACTURER 制造厂所进行之评估

Prior to being presented to the Inspector for acceptance, the digital examination data from a radiographic or ra-dioscopic image shall have been interpreted by the Manufacturer as complying with the referencing Code Section.

在提交给检查员认可之前，制造商应将来自射线照相或透视图像的数位检测数位解释为已符合引用规范章

节。

The digitized examination data that has previously been accepted by the Inspector is not required to be submit-

ted to the Inspector for acceptance. 对先前已由检查员所认可之放射胶片数位检测数位则不需要再次提交给检

查员认可。

MANDATORY APPENDIX V GLOSSARY OF TERMS

FOR RADIOGRAPHIC EXAMINATION 强制性附录 V 射线照相检测术语汇总

Deleted; terms and definitions in this Appendix have been incorporated into Article 1, Mandatory Appendix I, I-

121.1. 已删除；于本章节中之术语和其定义已并入第 1 章，强制性附录 I，I-121.1中。

MANDATORY APPENDIX VI ACQUISITION, DIS-

PLAY, INTERPRETATION, AND STORAGE OF DIGI-

TAL IMAGES OF RADIOGRAPHIC FILM FOR NU-CLEAR APPLICATIONS

强制性附录 VI 核应用上之射线胶片的数位图像摄取，显示，解释和贮存

VI-210 SCOPE 适用范围

Digital imaging process and technology provide the ability to digitize and store the detailed information con-tained in the radiographic film (analog image), thus eliminating the need to maintain and store radiographic film as

the permanent record. 数位成像过程和技术提供了对包含在射线胶片(模拟图像)中之详细信息进行数位化和

贮存能力，因此消除了将射线胶片保持和贮存为永久记录的需求。

VI-220 GENERAL REQUIREMENTS 一般要求

VI-221 SUPPLEMENTAL REQUIREMENTS 辅助要求

VI-221.1 Additional Information. Article 2, Mandatory Appendices III and IV, contain additional infor-mation that shall be used to supplement the requirements of this Appendix. These supplemental requirements shall

be documented in the written procedure required by this Appendix. 附加信息。本附录辅助要求于第 2章节、强

制性附录 III和 IV中所包含之附加信息做出，而这些辅助要求应记录在本附录所要求之书面规程中。

VI-221.2 Reference Film. Supplement A contains requirements for the manufacture of the reference film. 参

考胶片。辅助 A包含了制造参考胶片的要求。

VI-222 WRITTEN PROCEDURE 书面规程

A written procedure is required. The written procedure shall be the responsibility of the owner of the radio-graphic film and shall be demonstrated to the satisfaction of the Authorized Nuclear Inspector (ANI). When other enforcement or regulatory agencies are involved, the agency approval is required by formal agreement. The written

procedure shall include, as a minimum, the following essential variables: 需要书面规程。书面规程应是射线胶片

持有者之责任，并应证明授权核检验员(ANI)对所提出书面规程内容是满意的。当涉及其他执法或监管机构

时，应藉由正式协议为该机构所批准。书面规程应至少包括以下基本变数：

VI-222.1 Digitizing System Description. 数位化系统说明

(a) manufacturer and model no. of digitizing system; 数位化系统之制造商和型号；

(b) physical size of the usable area of the image monitor; 图像显示器可用区域之实际尺寸；

(c ) film size capacity of the scanning device; 扫描装置之胶片尺寸容量；

(d) spot size(s) of the film scanning system; 胶片审视系统的焦点尺寸

(e ) image display pixel size as defined by the vertical/ horizontal resolution limits of the monitor; 由显

示器之垂直/水平分辨率极限所限定之图像显示像素大小；

(f ) luminance of the video display; and 视频显示器的亮度；和

(g) data storage medium. 数位贮存媒体(介质)。

VI-222.2 Digitizing Technique. 数位化技术

(a) digitizer spot size (in microns) to be used (see VI-232); 采用的数位化仪焦点尺寸(微米)(见 VI-

232)；

(b) loss-less data compression technique, if used; 无损数位压缩技术(如果采用)；

(c ) method of image capture verification; 图谱采集验证方法；

(d) image processing operations; 图像处理操作；

(e ) time period for system verification (see VI-264); 系统验证周期 (见 VI-264) ；

(f ) spatial resolution used (see VI-241); 所采用之空间分辨率(见 VI-241)

(g) contrast sensitivity (density range obtained) (see VI-242); 对比灵敏度(所获得之黑度范围)(见 VI-

242)

(h) dynamic range used (see VI-243); and 所采用之动态范围(见 VI-243)；和

(i ) spatial linearity of the system (see VI-244). 系统之空间线性(见 VI -244)。

VI-223 PERSONNEL REQUIREMENTS 人员要求

Personnel shall be qualified as follows: 人员应按如下鉴定：

(a) Level II and Level III Personnel. Level II and Level III personnel shall be qualified in the radio-graphic method as required by Article 1. In addition, the employer’s written practice shall describe the specific training and practical experience of Level II and Level III personnel involved in the application of the digital imag-ing process and the interpretation of results and acceptance of system performance. Training and experience shall be

documented in the individual’s certification records. II 级和 III 级人员。II 级和 III 级人员应按照第 1章节之要

求在放射照相方法方面取得资格。此外，参与数位成像过程应用培训之 II 级和 III 级人员应于雇主之书面

实践中做出具体培训和实践经验之描述，以及对结果的解释和系统性能的允收的描述。培训和经验应记录

在个人之鉴定记录中。

(b) As a minimum, Level II and III individuals shall have 40 hours of training and 1 month of practi-

cal experience in the digital imaging process technique. II 级和 III 级人员应至少在数位成像过程技术方面接受

40小时的培训和 1个月的实践经验。

(c ) Other Personnel. Personnel with limited qualification performing operations other than those re-quired for the Level II or Level III shall be qualified in accordance with Article 1. Each individual shall have speci-

fied training and practical experience in the operations to be performed. 其他人员。执行除 II 级和 III 级以外之其

他有限操作资格之人员，应按照第 1章节进行资格鉴定。每人应具有指定的操作培训和实践经验。

VI-230 EQUIPMENT AND MATERIALS 设备和材料

VI-231 SYSTEM FEATURES 系统特性

The following features shall be common to all digital image processing systems: 以下特性对所有数位图像处

理系统都是通用的：

(a) noninterlaced image display format; 逐行图像显示格式；

(b) WORM — write-once/read-many data storage; and WORM 一次写入/多次读取数位贮存；和

(c ) fully reversible (loss-less) data compression (if data compression is used). 完全可逆(无损)数位压

缩(如果采用数位压缩)

VI-232 SYSTEM SPOT SIZE 系统焦点尺寸

The spot size of the digitizing system shall be: 数位化系统之焦点尺寸应为：

(a) 70 microns or smaller for radiographic film exposed with energies up to 1 MeV; or 用在高达

1MeV能量曝光之射线照相时为 70微米或更小；要么

(b) 100 microns or smaller for radiographic film exposed with energies over 1 MeV. 在超过 1MeV能

量曝光之射线照相时为则为 100微米或更小。

VI-240 SYSTEM PERFORMANCE REQUIREMENTS 系统性能要求

System performance shall be determined using the digitized representation of the reference targets (images). No adjustment shall be made to the digitizing system which may affect system performance after recording the refer-

ence targets. 系统性能应采用参考标标杆(图像)的数位化表示来予以确定。不应对数位化系统进行调整，这

可能在记录参考标标杆后影响系统性能。

VI-241 SPATIAL RESOLUTION 空间分辨率

Spatial resolution shall be determined as described in VI-251. The system shall be capable of resolving a pattern of 7 line pairs/millimeter (lp/mm) for systems digitizing with a spot size of 70 microns or less, or 5 lp/mm for spot

sizes greater than 70 microns. 空间分辨率应按VI-251所述确定。对于焦点尺寸为 70微米或更小之数位化系

统，该系统应能够分辨 7点线对/毫米(lp / mm)之图案；当大于 70微米光斑尺寸时，则为 5 lp / mm。

VI-242 CONTRAST SENSITIVITY 对比敏感度

Contrast sensitivity shall be determined as described in VI-252. The system shall have a minimum contrast sen-

sitivity of 0.02 optical density. 对比灵敏度应按照VI-252中之规定来予以确定。该系统应具有 0.02光学黑度

的最小对比灵敏度。

VI-243 DYNAMIC RANGE 动态范围

Dynamic range shall be determined as described in VI-253. The system shall have a minimum dynamic range of

3.5 optical density. 动态范围应按VI-253中之所述来予以确定。系统应具有 3.5光学黑度的最小动态范围。

VI-244 SPATIAL LINEARITY 空间线性

Spatial linearity shall be determined as described in VI-254. The system shall return measured dimensions with

3% of the actual dimensions on the reference film. 空间线性应按 VI-254中之所述来予以确定。系统应将所测

量尺寸恢复到参考胶片上实际尺寸的 3％。

VI-250 TECHNIQUE 技术

The reference film described in Supplement A and Figure VI-A-1 shall be used to determine the performance of the digitization system. The system settings shall be adjusted to optimize the display representation of the reference targets (images). The reference film and all subsequent radiographic film shall be scanned by the digitization system

using these optimized settings. 在附录 A和图VI-A-1中对应用于确定数位化系统性能参考胶片的做出了描

述。应调整系统设置以优化参考标标杆(图像)的显示图像。参考胶片和所有后续的射线照相片应由具有这

些优化设置之数位化系统进行扫描。

VI-251 SPATIAL RESOLUTION EVALUATION 空间分辨率评估

At least two of the converging line pair images (0 deg, 45 deg, and 90 deg line pairs) shall be selected near the opposite corners of the digitizing field and one image near the center of the digitized reference film. The spatial res-olution in each position and for each orientation shall be recorded as the highest indicated spatial frequency (as de-termined by the reference lines provided) where all of the lighter lines are observed to be separated by the darker lines. The system resolution shall be reported as the poorest spatial resolution obtained from all of the resolution

images evaluated. 应当在数位化场中的相对角附近至少选用两个会聚线对图像(0度和 45度线对)，并在数位

化参考胶片中心附近选用一个图像(90度线对)。在所有被观察到较亮线与较暗线分开处之每一位置和每一

方向的空间分辨率应记录为最高指示空间率(是由所提供之参考线来予以确定的)。系统分辨率应报告为对

所有分辨率图像进行评估时所获得的最差空间分辨率。

VI-252 CONTRAST SENSITIVITY EVALUATION 动态范围评估

Using the contrast sensitivity images and the digitized stepped density scale images to evaluate the detectability of each density step (the observed density changes shall be indicative of the system’s capability to discern 0.02 den-sity differences), the detectability of each density step and the difference in density between steps shall be evalu-

ated. 采用对比敏感度图像和数位化阶梯黑度标度图像来评估每一黑度等级的可检测性(所观察到之黑度变化

即表示该系统具有辨别 0.02黑度差异的能力)，在各黑度梯度间之每一黑度梯度的可检测性和黑度差异应进

行评估。

VI-253 DYNAMIC RANGE EVALUATION 动态范围评估

The dynamic range of the digitization system shall be determined by finding the last visible density step at both

ends of the density strip. The dynamic range shall be measured to the nearest 0.50 optical density. 数位化系统之动

态范围应通过在黑度带两端可找到之最后可见黑度梯度来做出确定。动态范围应测量到最接近 0.50的光学

梯度。

VI-254 SPATIAL LINEARITY EVALUATION 空间线性评估

The digitization system shall be set to read the inch scale on the reference film. The measurement tool shall then be used to measure the scale in a vertical direction and horizontal direction. The actual dimension is divided by the

measured dimension to find the percentage of error in the horizontal and vertical directions. 数位化系统应设置为

读取参考胶片上的英寸刻度。然后采用测量工具在垂直方向和水平方向上测量刻度，再以实际尺寸除以测

量尺寸来作为所找出水平和垂直方向上的误差百分比。

VI-260 DEMONSTRATION OF SYSTEM PERFORMANCE 系统性能演示

VI-261 PROCEDURE DEMONSTRATION规程演示

The written procedure described in VI-222 shall be demonstrated to the ANI and, if requested, the regulatory agency, as having the ability to acquire, display, and reproduce the analog images from radiographic film. Evidence

of the demonstration shall be recorded as required by VI-291. 在 VI-222中所描述之书面规程应向ANI及监管机

构(如果需要的话)取得具有从射线胶片获取显示和再现模拟图像能力之证明。演示证据应按 VI-291之要求

进行记录。

VI-262 PROCESSED TARGETS 处理标杆

The digitizing process and equipment shall acquire and display the targets described in Supplement A. The digi-

tally processed targets of the reference film shall be used to verify the system performance. 数位化工艺规程和设

备应获取在辅助A中所述之显示标杆。参考胶片之数位处理标杆应用于系统性能之验证上。

VI-263 CHANGES IN ESSENTIAL VARIABLES 重要变数改变时

Any change in the essential variables identifieded in VI-222 and used to produce the results in VI-250 shall be

cause for reverification of the System Performance. 在 VI-222中所验证定之重要变数如被应用在 VI-250所有关

技术应用结果上时，此时若重要变数有产生任何改变都将导致系统性能需重新验证。

VI-264 FREQUENCY OF VERIFICATION 验证频率

The System Performance shall be initially verified in accordance with VI-262 at the beginning of each digitizing

shift. Reverification in accordance with VI-262 shall take place at the end of each shift or at the end of 12 continu-

ous hours, whichever is less, or at any time that malfunctioning is suspected. 系统性能应在每次数位化转换开始

时根据 VI-262进行首要验证。根据 VI-262的重新验证应在每个班次结束时或在 12个连续小时结束时(以较

小者为准)进行，或在怀疑发生故障之任何时候随时进行验证。

VI-265 CHANGES IN SYSTEM PERFORMANCE 系统性能改变

Any evidence of change in the System Performance specified in VI-240 shall invalidate the digital images pro-

cessed since the last successful verification and shall be cause for reverification. 当 VI-240所规定之系统性能如

有任何被改变之证据存在时，凿将使自上次成功验证以来所处理之数位图像无效，且是重新验证的原因。

VI-270 EXAMINATION 检测

VI-271 SYSTEM PERFORMANCE REQUIREMENTS 系统性能要求

The digitizing system shall meet the requirements specified in VI-240 before digitizing radiographic film. 数位

化系统在将射线胶片扫描成数位图像之前应先满足VI-240中所规定之要求。

VI-272 ARTIFACTS 伪影

Each radiographic film shall be visually examined for foreign material and artifacts (e.g., scratches or water

spots) in the area of interest. Foreign material not removed and artifacts observed shall be documented. 每个射线胶

片应目视检查受检测区域中的外来物质和伪影(例如，划痕或水斑)。未清除的外来物质和所观察到的伪影

都应记录在案。

VI-273 CALIBRATION 校准

The calibration for a specific set of parameters (i.e., film size, density range, and spatial resolution) shall be con-

ducted by following VI-240 and Supplement A. The results shall be documented. 对于一组特定参数(即胶片尺

寸，黑范围和空间分辨率)的校准应按照VI-240和辅助A进行，且结果应记录下来。

VI-280 EVALUATION 评估

VI-281 PROCESS EVALUATION 过程评估

The Level II or Level III Examiner described in VI-223(a) shall be responsible for determining that the digital imaging process is capable of reproducing the original analog image. This digital image shall then be transferred to

the write-once-read-many (WORM) optical disc. 如(a)所述之 II级或 III级检测人员应负责确认数位成像过程是

否具有再现首要模拟图像的能力。然后将该数位图像传送到一次写入多次读取(WORM)的光盘上。

VI-282 INTERPRETATION 解释

When interpretation of the radiographic film is used for acceptance, the requirements of Article 2, Mandatory

Appendix IV and the Referencing Code Section shall apply. 当采用射线照相胶片之解释是用于接受该结果时，

则第 2章节、强制性附录 IV和引用规范章节之要求应适用。

When radiographic films must be viewed in composite for acceptance, then both films shall be digitized. The

digital images of the films shall be interpreted singularly. 当射线照相胶片必须以复合材料观察以便接受该结果

时，则两种胶片都应数位化。数位媒体(介质)图像应单独进行解释。

VI-283 BASELINE 基线

Digital images of previously accepted radiographic film may be used as a baseline for subsequent in-service in-

spections. 先前所接受之射线照相胶片的数位图像可作为随后在役检查之基线。

VI-290 DOCUMENTATION 文件

VI-291 REPORTING REQUIREMENTS 报告要求

The following shall be documented in a final report: 以下内容应记录在最终报告中：

(a) spatial resolution (VI-241); 空间分辨率(VI-241)；

(b) contrast sensitivity (VI-242); 对比灵敏度(VI-242)

(c ) frequency for system verification; 系统验证频率；

(d) dynamic range (VI-243); 从首要物项到胶片再到显示数位图像的可追溯性技术，包括首要放射

学报告。

(e ) Traceability technique from original component to film to displayed digital image, including original

radiographic report(s). (The original radiographic reader sheet may be digitized to fulfill this requirement); 从首要

物项到胶片再到显示数位图像的可追溯性技术，包括首要放射学报告。 (透过阅读卡可将首要放射线照相片

数位化以达到此一要求)；

(f ) condition of original radiographic film (VI-281); (首要射线照相胶片(VI-281)之状态；

(g) procedure demonstration (VI-261); 规程演示(VI-261)；

(h) spatial linearity (VI-244); 空间线性(VI-244)；

(i ) system performance parameters (VI-241); and 系统性能参数(VI-241)；和

(j ) personnel performing the digital imaging process (VI-223). 执行数位成像处理(VI-223)的人员。

VI-292 ARCHIVING 存档

When the final report and digitized information are used to replace the radiographic film as the permanent rec-ord as required by the referencing Code Section, all information pertaining to the original radiography shall be doc-umented in the final report and processed as part of the digital record. A duplicate copy of the WORM storage me-

dia is required if the radiographic films are to be destroyed. 当最终报告和数位化信息被用于替代射线照相胶片

以作为引用规范章节所要求之永久记录时，所有与首要射线照相有关之信息应记录在最终报告中并作为数

位记录的一部分进行处理。如果要破坏射线照射胶片，则需要WORM贮存媒体的副本。

MANDATORY APPENDIX VI SUPPLEMENT A 强制性附录 VI 一辅助资料 A

VI-A-210 SCOPE 适用范围

The reference film described in this supplement provides a set of targets suitable for evaluating and quantifying the performance characteristics of a radiographic digitizing system. The reference film is suitable for evaluating

both the radiographic film digitization process and the electronic image reconstruction process. 在本辅助内容中所

描述之参考胶片为射线照相数位化之系统性能特性提供了一组适合于评估和量化的标竿。参考胶片适用于

射线照相胶片数位化过程和电子图像重建过程之评估上。

The reference film shall be used to conduct performance demonstrations and evaluations of the digitizing sys-tem to verify the operating characteristics before radiographic film is digitized. The reference film provides for the

evaluation of spatial resolution, contrast sensitivity, dynamic range, and spatial linearity. 参考胶片可应用于数位

化系统的性能所进行之演示和评估上，以验证放射线胶片数位化之前的操作特性。参考胶片提供了空间分

辨率、对比灵敏度、动态范围和空间线性的评估。

VI-A-220 GENERAL 通则

VI-A-221 REFERENCE FILM 参考胶片

The reference film shall be specified in VI-A-230 and VI-A-240. 参考胶片应在 VI-A-230和 VI-A-240中做出

规定。

VI-A-230 EQUIPMENT AND MATERIALS 设备和材料

VI-A-222 REFERENCE TARGETS 参考标杆

The illustration of the reference film and its targets is as shown in Figure VI-A-1. 参考胶片及其标杆图示如图

VI-A-1所示。VI-A-232空间分辨率标杆。参考胶片应包含如下空间分辨率标杆：

VI-A-223 SPATIAL RESOLUTION TARGETS 空间分辨率标杆

The reference film shall contain spatial resolution targets as follows: 参考胶片应包含如下空间分辨率标杆：

VI-A-232.1 Converging Line Pair Targets. Converging line pairs shall consist of 3 identical groups of no less than 6 converging line pairs (6 light lines and 6 dark lines). The targets shall have a maximum resolution of no less than 20 line pairs per millimeter (lp/mm) and a minimum resolution of no greater than 1 lp/mm. The 3 line pair groups shall be oriented in the vertical, horizontal, and the last group shall be 45 deg from the previous two groups. The maximum resolution shall be oriented toward the corners of the film. Reference marks shall be provided to in-dicate spatial resolution at levels of no less than 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, and 20 lp/mm. The spatial resolution

targets shall be located in each corner of the needed film sizes. 聚合线对应由不少于 6个聚合线对(6个光线和 6

个暗线)之相同 3组所组成。标杆应具有不小于每毫米 20线对(lp / mm)的最大分辨率和不大于 1lp / mm的最

小分辨率。 3个线对组应在垂直和水平方向上定向，且最后一组应与前两组相差 45度。最大分辨率应朝向

胶片角落。应提供参考标记，以表示空间分辨率不小于 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15和 20 lp / mm水平。空

间分辨率标杆应位于所需之胶片尺寸的每一角落上。

VI-A-232.2 Parallel Line Pair Targets. Parallel line pairs shall consist of parallel line pairs in at least the vertical direction on the reference film. It shall have a maximum resolution of at least 20 lp/mm and a minimum resolution of no less than 0.5 lp/mm. It shall have distinct resolutions of 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, and 20

lp/mm and have the corresponding reference marks. It shall be located near the middle of the reference film. 并行线

对标杆。并行线对应至少由在参考胶片之垂直方向上之并行线对所组成。它应具有至少 20lp / mm之最大分

辨率和不小于 0.5lp / mm的微小分辨率。它应具有 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15和 20lp / mm的不同分辨

率，并具有相应的参考标记。它应位于参考胶片的中间附近。

VI-A-231 CONSTRAST SENSITIVITY TARGETS 对比灵敏度标杆

Contrast sensitivity targets shall consist of approximately 0.4 in. × 0.4 in. (10 mm × 10 mm) blocks centered in 1.6 in. × 1.6 in. (40 mm × 40 mm) blocks of a slightly lower density. Two series of these step blocks shall be used with an optical density of approximately 2.0 on a background of approximately 1.95, an optical density change of 0.05. The second block series will have an optical density of approximately 3.5 on a background of approximately 3.4, an optical density change of 0.10. The relative density change is more important than the absolute density. These images shall be located near the edges and the center of the film so as to test the contrast sensitivity through-

out the scan path. 对比灵敏度标杆应是位于略低黑度之 1.6 in. × 1.6 in. (40 mm × 40 mm) 阶梯块中心处近似

0.4 in. × 0.4 in. (10 mm × 10 mm)之阶梯块所组成的。应采用两个此类梯度规快系痛，其中在大约 1.95的背

景且光学黑度变化为 0.05的情况下，应采用一个具有光学黑度大约为 2.0的阶梯块系列。第二块系列在约

3.4的背景上具有约 3.5的光学黑度且各光学黑度梯度为 0.10。相对黑度变化比绝对黑度为更重要。这些图

像应位于胶片之边缘和中心附近，以便检测整个扫描路径的对比灵敏度。

VI-A-232 DYNAMIC RANGE TARGETS 动态范围标杆

Stepped density targets shall consist of a series of 0.4 in. × 0.4 in. (10 mm × 10 mm) steps aligned in a row with densities ranging from 0.5 to 4.5 with no greater than 0.5 optical density steps. At four places on the density strip (at approximately 1.0, 2.0, 3.0, and 4.0 optical densities), there shall be optical density changes of 0.02 which shall also be used to test the contrast sensitivity. These stepped density targets shall be located near the edges of the film and

near the center so as to test the dynamic range throughout the scan path.阶梯黑度标杆应由一具有在 0.5至 4.5黑

度范围且不大于 0.5光学黑度梯度成连续梯度排列之近似 0.4 in. × 0.4 in. (10 mm × 10 mm)阶梯块上所组

成。在黑度带上的四个位置(约 1.0, 2.0, 3.0和 4.0光学黑度)，应当具有 0.02的光学黑度变化，其也将用于

检测对比灵敏度。这些阶梯黑度标杆应位于胶片之边缘附近和中心附近，以便检测整个扫描路径的动态范

围。

VI-A-233 SPATIAL LINEARITY TARGETS 空间线性标杆

Measurement scale targets shall be located in the horizontal and vertical dimensions. The measurement scale

targets shall be in English and/or metric divisions. 标测量尺度标杆应位于水平和垂直尺寸。测量尺度标杆应分

类为英制和/或公制。

VI-A-240 MISCELLANEOUS REQUIREMENTS 杂项要求

Manufacturing specifications shall be minimum requirements necessary for producing the reference film. The

reference film shall have a unique identification which appears as an image when digitized.制造规格应是生产参考

胶片所需的最低要求。参考胶片应具有唯一的标识并在数位化时显示为图像。

VI-A-241 MATERIAL材料

The reference film shall be a fine grain, industrial type film. The film used will be of high quality so the re-

quired specifications in VI-A-230 are met. 参考胶片应为细颗粒、工业型胶片。所采用之胶片应为满足VI-A-

230中所需规格之高质量胶片。

VI-A-242 FILM SIZE 胶片尺寸

The film size shall be sufficient to accommodate the largest area of interest to be digitized. 胶片尺寸应足以容

纳被数位化之最大受检测区域。

VI-A-243 SPATIAL RESOLUTION 空间分辨率

The spatial resolution shall be a minimum of 20 lp/mm. 空间分辨率应至少为 20 lp / mm。

VI-A-244 DENSITY黑度

The relative densities stated in VI-A-233 and VI-A-234 shall be ±0.005 optical density. VI-A-233和 VI-A-234

中所述之相对黑度应为±0.005的光学黑度。

(a) The tolerance for the optical density changes stated in VI-A-233 and VI-A-234 shall be ±0.005. VI-

A-233和 VI-A-234中规定之光学黑度变化公差应为±0.005。

(b) The measured densities shall be ±0.15 of the values stated in VI-A-233 and VI-A-234. The actual

densities shall be recorded and furnished with the reference film. 测量黑度应为VI-A-233和 VI-A-234中所规定

值之±0.15。应记录实际黑度并提供参考胶片。

(c ) Density requirements shall be in accordance with ANSI IT-2.19. 黑度要求应符合ANSI IT-2.19。

(d) The background density, where there are no images located, shall have a 3.0 optical density ±0.5.

没有图像位置的背景黑度应具有 3.0光学黑度的±0.5。

Figure VI-A-1 Reference Film 参照胶片

VI-A-245 LINEARITY线性

The measurement scale targets shall be accurately electronically produced to ±0.05 in. (±1.3 mm). 测量刻度标

竿之电子精度应确地制造为±0.05 in.(±1.3 mm)。

MANDATORY APPENDIX VII RADIOGRAPHIC EX-AMINATION OF METALLIC CASTINGS

强制附录 VII 金属铸件之射线照相检测

VII-210 SCOPE 适用范围

Metallic castings, due to their inherent complex configurations, present examination conditions that are unique

to this product form.金属铸件由于其固有的复杂构造，因此对该产品形式提供了独特的检测条件。

Radiographic examination may be performed on castings when the modified provisions to Article 2, as indi-

cated herein, are satisfied. 当满足如本文所示之第 2条修改规定时，即可对铸件进行射线照相检查。

VII-220 GENERAL REQUIREMENTS 一般要求

VII-224 SYSTEM OF IDENTIFICATION 识别系统

A system shall be used to produce permanent identification on the radiograph traceable to the contract, compo-nent, or part numbers, as appropriate. In addition, each film of a casting being radiographed shall be plainly and per-manently identifieded with the name or symbol of the Material Manufacturer, Certificate Holder, or Subcontractor, job or heat number, date, and, if applicable, repairs (R1, R2, etc.). This identification system does not necessarily require that the information appear as radiographic images. In any case, this information shall not obscure the area

of interest.系统应采用一套能按射线胶片上之永久性标识就能追溯到合同号、组件或物项编号(视情况而定)

的系统。此外，正在进行射线照相之铸件的每张胶片应清楚、永久地标明材料制造商、证书持有人或分包

商之名称或商标、工件号或炉号、日期，修理(如果适用时，以 R1， R2标示等)。该识别系统不一定要求

需以放射线照相图像来呈现信息。在任何情况下，此信息不得遮盖受检测区域。

VII-270 EXAMINATION 检测

VII-271 RADIOGRAPHIC TECHNIQUE 射线技术

VII-271.2 Double-Wall Viewing Technique. A double-wall viewing technique may be used for cylindri-

cal castings 3-1/2 in. (88 mm) or less in O.D. or when the shape of a casting precludes single-wall viewing. 双壁观

察技术。双壁观察技术可用于外径为 3-1/2 in. (88 mm)或更小的圆柱形铸件，或者因铸件形状而无法采用单

壁观察时。

VII-276 IQI SELECTION IQI选用

VII-276.3 Additional IQI Selection Requirements. The thickness on which the IQI is based is the single-

wall thickness. IQI 选用之额外要求。根据厚度选用 IQI所指的是单壁厚度。

(a) Casting Areas Prior to Finish Machining. The IQI shall be based on a thickness that does not exceed the finished thickness by more than 20% or 1/4 in. (6 mm), whichever is greater. In no case shall an IQI size

be based on a thickness greater than the thickness being radiographed. 精加工前之铸造区域。 IQI选用基准不应

超过成品厚度之 20％或 1/4 in. (6 mm) 之较大者。在任何情况下，IQI尺寸选用基准都不应以大于进行射线

照相时之实际厚度。

(b) Casting Areas That Will Remain in the As-Cast Condition. The IQI shall be based on the thick-

ness being radiographed. 铸造状态下仍将保留之铸造区域。 IQI尺寸应以实际射线照相时之厚度作为选用基

准。

VII-280 EVALUATION 评估

VII-282 RADIOGRAPHIC DENSITY放射照相之胶片黑度

VII-282.1 Density Limitations. The transmitted film density through the radiographic image of the body of the appropriate hole IQI or adjacent to the designated wire of a wire IQI and the area of interest shall be 1.5 mini-mum for single film viewing. For composite viewing of multiple film exposures, each film of the composite set shall have a minimum density of 1.0. The maximum density shall be 4.0 for either single or composite viewing. A

tolerance of 0.05 in density is allowed for variations between densitometer readings.黑度限度。透射过特定孔洞

IQI或相邻于线型 IQI指定金属线和受检测区域等本体之放射线照相图像，其透射胶片上之黑度于单胶片观

察时应至少为 1.5；如为多胶片曝光之叠片观察时，则叠片组中之每一胶片应具有 1.0的最小黑度。不论是

单片或叠片，其最大密度应为 4.0。黑度计之读数允许变动公差为 0.05。

VII-290 DOCUMENTATION 文件

VII-293 LAYOUT DETAILS8详细资料

To assure that all castings are radiographed consistently in the same manner, layout details shall be provided. As

a minimum, the layout details shall include:为确保所有铸件以相同方式一致地进行射线照相，因此应提供布置

细节。布局细节应至少包括：

(a) sketches of the casting, in as many views as necessary, to show the approximate position of each

location marker; and铸件草图，尽可能地草绘出所需之多个视图，以显示每衣位置标记的大慨位置；和

(b) source angles if not perpendicular to the film. 射源不垂直于胶片时之射源角度。

MANDATORY APPENDIX VIII RADIOGRAPHY USING PHOSPHOR IMAGING PLATE

强制附录 VIII 采用荧光成像屏之射线照相术

VIII-210 SCOPE 适用范围

This Appendix provides requirements for using phosphor imaging plate (photostimulable luminescent phosphor)

as an alternative to film radiography.对以荧光成像屏(光激发光荧光粉)来替代放射成像胶片，在本附录中做出

了相关要求。

Radiography using phosphor imaging plate may be performed on materials including castings and weldments when the modified provisions to Article 2 as indicated herein and all other requirements of Article 2 are satisfied. The term film, as used within Article 2, applicable to performing radiography in accordance with this Appendix, refers to phosphor imaging plate. ASTM E2007, Standard Guide for Computed Radiography, may be used as a guide for general tutorial information regarding the fundamental and physical principles of computed radiography

(CR), including some of the limitations of the process. 当满足本文第 2章节中之所有要求(含修改规定)时，可

以对含有铸件和焊件之材料进行荧光成像屏射线照相术。在第 2条中所采用之胶片术语亦适用于根据本附

录所进行之射线照相术，在本附录中胶片所指的是荧光成像屏。 ASTM E2007《Standard Guide for Com-

puted Radiography》可作为计算机射线照相术(CR)之基本和实体原理的一般教程信息指南，其中也包括此

过程的一些限度。

VIII-220 GENERAL REQUIREMENTS 一般要求

VIII-221 PROCEDURE REQUIREMENTS规程要求

VIII-221.1 Written Procedure. A written procedure is required. In lieu of the requirements of T-221.1, each pro-

cedure shall include at least the following information, as applicable:书面规程。需要书面规程以代替 T-221.1之

要求，每一规程应至少包括以下所适用之信息：

(a) material type and thickness range 材料类型和厚度范围

(b) isotope or maximum X-ray voltage used所采用之同位素或最大X射线电压

(c ) minimum source-to-object distance (D in T-274.1) 射源到物项的最小距离(在 T-274.1中的 D)

(d) distance from source side of object to the phosphor imaging plate (d in T-274.1) 从物体射源侧到荧

光成像屏的距离(在 T-274.1中的 d)

(e ) source size (F in T-274.1) 射源尺寸(在 T-274.1中的 F)

(f ) phosphor imaging plate manufacturer and designation荧光成像屏的制造商和名称

(g) screens used所采用之增感屏

(h) image scanning and processing equipment manufacturer and model图像扫描和处理设备之制造商

和型号

VIII-221.2 Procedure Demonstration. Demonstration of image quality indicator (IQI) image requirements of the written procedure on production or technique radiographs using phosphor imaging plate shall be considered satis-

factory evidence of compliance with that procedure. 规程演示。一旦图像等效性能评估完成并确定足够，射线

胶片或技术之产品书面规程可作为对荧光成像屏所要求之演示是符合规程要求的凭证。

VIII-225 MONITORING DENSITY LIMITATIONS OF RADIOGRAPHS

监测辐射剂量浓度限度

The requirements of T-225 are not applicable to phosphor imaging plate radiography. T-225之要求不适用于

放射照相荧光成像屏。

VIII-230 EQUIPMENT AND MATERIALS 设备和材料

VIII-231 PHOSPHOR IMAGING PLATE 荧光成像屏

VIII-231.1 Selection. Radiography shall be performed using an industrial phosphor imaging plate capable of

demonstrating IQI image requirements. 选用。放射成像应采用能够显示 IQI图像要求之工业用荧光成像屏进

行。

VIII-231.2 Processing. The system used for processing a phosphor imaging plate shall be capable of acquiring,

storing, and displaying the digital image. 处理。用于处理荧光成像屏之系统应能够摄取、贮存和显示数位图

像。

VIII-234 FACILITIES FOR VIEWING OF RADIOGRAPHS 观察射线胶片之设施

Viewing facilities shall provide subdued background lighting of an intensity that will not cause reflections,

shadows, or glare on the monitor that interfere with the interpretation process. . 观察设施应提供柔和的背景光，

其在显示器上的强度不会在解释过程造成干扰反射、阴影或眩光。

VIII-260 CALIBRATION 校准

VIII-262 DENSITOMETER AND STEP WEDGE COMPARISON FILM

The requirements of T-262 are not applicable to phosphor imaging plate radiography. 黑度计和梯度比较片 T-

262之要求不适用于放射成像荧光成像屏。

VIII-270 EXAMINATION 检测

VIII-277 USE OF IQIs TO MONITOR RADIOGRAPHIC EXAMINATION

采用 IQIs 以监测射线照相检测

VIII-277.1 Placement of IQIs. IQI之定位

(a) Source-Side IQI(s). When using separate blocks for IQI placement as described in T-277.1(a), the thickness of the blocks shall be such that the image brightness at the body of the IQI is judged to be equal to or greater than the image brightness at the area of interest for a negative image format. If verified by measurement, pixel intensity variations up to 2% are permitted in the determination of “equal to.” This image brightness require-

ment is reversed for a positive image format. 射源侧 IQI。当如 T-277.1(a)中所述在各单独模块上定位 IQI时，

每一块之厚度应使得 IQI本体处之图像亮度被判断为等于或大于该区域受检测图像之负图像格式。如果通

过测量验证，则在所确定之〝等于〞中允许高达 2％的像素强度变化。对于图像亮度要求则正好是正图像

格式的相反。

(b) All other requirements of T-277.1 shall apply. T-277.1之所有其他要求均适用。

VIII-277.2 Number of IQIs. IQI之数量

(a) Multiple IQIs. An IQI shall be used for each applicable thickness range in Table T-276 spanned by the

minimum-to-maximum thickness of the area of interest to be radiographed. 复合 IQI。在表 T-276中之每一适用

厚度范围应是藉由射线照相受检测区域之最小到最大厚度间来选用相应的 IQI厚度。

As an alternative to (a) above, a minimum of two IQIs representing the minimum and maximum

thicknesses of the area of interest may be used, provided the requirements of VIII-288 are met. 只是满足VIII-288

的要求，可在受检测区域至少采用两个 IQI以分别替代上述(a)之最小和最大厚度。

(b) All other requirements of T-277.2 shall apply. T-277.2之所有其他要求均适用。

(c ) Comparators such as digitized film strips, gray scale cards, etc., may be used to aid in judging dis-played image brightness. When comparators are used to judge areas within the image, they need not be calibrated.

Pixel intensity values may also be used to quantify image brightness comparisons. 诸如数位化录像带，灰度色卡

等比较器可用于帮助判断所显示之图像亮度。当比较器用于判断图像中的某一区域时，它们是不需要校准

的。像素强度值还亦可用于量化图像亮度之比较上。

VIII-277.3 Shims Under Hole IQIs. For welds with reinforcement or backing material, a shim of material radio-graphically similar to the weld metal and/or backing material shall be placed between the part object and the IQIs, such that the image brightness at the body of the IQI is judged to be equal to or greater than the image brightness at the area of interest for a negative image format. If verified by measurement, pixel intensity variations up to 2% are permitted in the determination of “equal to.” This image brightness requirement is reversed for a positive image for-

mat. 在孔洞型 IQI之下的垫片。对于具有余高或背衬材料之焊缝，在放射学上具有与焊缝金属和/或背衬材

料相类似之垫片材料应定位在物项和 IQI之间，以使 IQI主体处之图像亮度被判断为是等于或大于用作负

图像格式之受检测区域处的图像亮度。如果通过测量验证，则在所确定之〝等于〞中允许高达 2％的像素

强度变化。对于图像亮度要求则正好是正图像格式的相反。

The shim dimensions shall exceed the IQI dimensions such that the outline of at least three sides of the IQI

shall be visible in the radiograph.垫片尺寸应超过 IQI尺寸，以使 IQI至少有三侧之轮廓在射线胶片中可被看

到。

VIII-280 EVALUATION 评估

VIII-281 SYSTEM-INDUCED ARTIFACTS 由系统所诱发之伪影

The digital image shall be free of system-induced artifacts in the area of interest that could mask or be confused

with the image of any discontinuity. 数位图像应在受检测区域中应没有系统所诱导之伪影，而该伪影可能会

造成任何不连续性被掩蔽或混淆。

VIII-282 IMAGE BRIGHTNESS 图像亮度

The image brightness through the body of the hole-type IQI or adjacent to the designated wire of the wire-type IQI, shall be judged to be equal to or greater than the image brightness in the area of interest for a negative image format. If verified by measurement, pixel intensity variations up to 2% are permitted in the determination of “equal to.” This image brightness requirement is reversed for a positive image format. Additionally, the requirements of T-

282 are not applicable to phosphor imaging plate radiography. 通过孔洞型 IQI主体或线型 IQI附近之指定金属

线的图像亮度应被判断为是等于或大于用作负图像格式之受检测区域处的图像亮度。。如果通过测量验

证，则在所确定之〝等于〞中允许高达 2％的像素强度变化。对于图像亮度要求则正好是正图像格式的相

反。此外，T-282的要求不适用于放射照相荧光成像屏。

VIII-283 IQI SENSITIVITY IQI灵敏度

VIII-283.1 Required Sensitivity. Radiography shall be performed with a technique of sufficient sensitivity to dis-play the designated hole-type IQI image and the essential hole, or the essential wire of a wire-type IQI. The radio-graphs shall also display the IQI identifying numbers and letters. Multiple film technique is not applicable to phos-

phor imaging plate radiography. 所需之灵敏度。射线照相应采用具有足够灵敏度的技术进行，以显示所指定

之孔洞型 IQI图像和基本孔，或线型 IQI的基本线。放射胶片还应显示 IQI识别号和字母。多胶片技术不适

用于射线照相荧光成像屏。

VIII-284 EXCESSIVE BACKSCATTER背散射过度

For a negative image format, the requirements of T-284 shall apply. For a positive image format, if a dark image of the “B,” as described in T-223, appears on a lighter background of the image, protection from backscatter is in-sufficient and the radiographic image shall be considered unacceptable. A light image of the “B” on a darker back-

ground is not cause for rejection. T-284之要求应适用于负图像格式。对于正图像格式，如果 T-223中描述的

“B”的暗图像出现在图像的较亮背景上，则表示对背散射之防护不够充分，并且该放射摄影图像将被认

为是不可接受的。处在较暗背景上的“B”光图像不是被拒绝的原因。

VIII-285 DIMENSIONAL MEASURING 尺寸测量

VIII-287.1 Measuring Scale Comparator. The measuring scale used for interpretation shall be capable of provid-

ing dimensions of the projected image. The measurement scale tool shall be based on one of the following: 刻度式

测量比较器。当测量标尺被应用于解释时，应具有提供所有投影图像尺寸之能力。测量标尺应按以下之一

作为采用准则：

(a) a known dimensional comparator that is placed on the cassette prior to exposure 在曝光之前，把已

知尺寸之比较器定位在暗盒上

(b) a known dimensional comparator that is inscribed on the imaging plate prior to processing 在处理之

前，把已知尺寸比较器内接在成像屏上

(c ) a known comparator scale placed on the imaging plate prior to processing 在处理之前，把已知比较

器标尺定位在成像屏上

VIII-287.2 Alternative Comparator. As an alternative to a measuring scale comparator, a dimensional calibration

of the measuring function based upon a verifiable scanned pixel size may be used. 其他之比较器。可验证扫描像

素大小之测量函数尺寸校准器可用为测量尺比较器的替代。

VIII-288 INTERPRETATION解释

Final radiographic interpretation of the area of interest shall be performed within the identifieded IQI image contrast and brightness values or, if multiple IQIs are used, the overlapping portions of the identifieded contrast and brightness values for the intervening thickness ranges. The IQI and the area of interest shall be of the same image

format (positive or negative). Additionally, where applicable 应以在所识别的 IQI图像对比度、亮度值或者如果

采用多个 IQI之情况下针对中间厚度范围所识别出之对比度和亮度值的重迭部分来作为受检测区域的最终

射线照相解释。 IQI和受检测区域应具有相同的图像格式(正或负)。此外，适用时：

(a) the contrast and brightness range that demonstrates the required IQI sensitivity shall be used for inter-pretation. When more than one IQI is used to qualify multiple thicknesses, the overlapping portions of each IQI’s determined contrast and brightness range shall be considered valid for interpretation of intervening thicknesses. Pixel intensity values may also be used to quantify image brightness comparisons in accordance with VIII-277.1,

VIII-277.3, and VIII-282. 用于演示所需 IQI灵敏度之对比度和亮度范围应用于解释。当采用一个以上之 IQI

来鉴定多种厚度时，由每一 IQI重迭部分所确定之对比度和亮度范围对中间厚度的解释应是有效的。像素

强度值也适用于根据 VIII-277.1、VIII-277.3和 VIII-282量化图像亮度的比较上。

(b) the digital image may be viewed and evaluated in a negative or positive image format. 数位图像可采

负或正图像格式进行观察和评估。

(c ) independent areas of interest of the same image may be displayed and evaluated in differing image for-

mats, provided the IQI and the area of interest are viewed and evaluated in the same image format. 只要以相同图

像格式观察和评估 IQI和受检测区域，则具有相同图像之各单独受检测区域可以不同图像格式显示并进行

评估。

VIII-290 DOCUMENTATION 文件

VIII-291 DIGITAL IMAGING TECHNIQUE DOCUMENTATION DETAILS 数位成像技术文件之详细信息


information shall be provided: 组织应制备和记录射线照相技术细节，其中应至少提供以下信息：

(a) the requirements of Article 1, T-190(a) 第 1章节 T-190(a)之要求

(b) identification as required by T-224 T-224所要求之识别

(c ) the dimensional map (if used) of marker placement in accordance with T-275.3 根据 T-275.3所定位

之标记尺寸图(如果采用时)

(d) number of exposures 曝光次数

(e ) X-ray voltage or isotope used 所采用之 X射线电压或同位素

(f ) source size (F in T-274.1) 射源尺寸(即 T-274.1中之 F值)

(g) base material type and thickness, weld reinforcement thickness, as applicable 母材所适用之类型、厚

度和焊缝余高

(h) source-to-object distance (D in T-274.1) 射源到物件之距离(即 T-274.1中之 D值)

(i ) distance from source side of object to storage phosphor media (d in T-274.1) 从物项源侧到贮存荧光

媒体(介质)的距离(即 T-274.1中之 d值)

(j ) storage phosphor manufacturer and designation 贮存荧光媒体(介质)之制造商和名称

(k ) image acquisition (digitizing) equipment manufacturer, model, and serial number 图像摄取(数位化)

设备制造商名称、型号和序号

(l ) singleor double-wall exposure 单壁或双壁暴光

( m) singleor double-wall viewing 单壁或双壁观察

(n) procedure identification and revision level 规程识别号和修订版次

(o) imaging software version and revision成像软件版本和修订版次

(p) numerical values of the final image processing parameters, i.e., filters, window (contrast), and level

(brightness) for each view 最终图像处理参数数值即为用于每次观察的滤镜，屏幕可视见区(对比度)和水平

(亮度)

The technique details may be embedded in the data file. When this is performed, ASTM E1475, Standard Guide for Data Fields for Computerized Transfer of Digital Radiological Test Data, may be used as a guide for establish-

ing data fields and information content. 技术细节可嵌入在数位文件中。当如此执行时，ASTM E1475《Stand-

ard Guide for Data Fields for Computerized Transfer of Digital Radiological Test Data》可作为制定数位字段和

信息内容的指南。

MANDATORY APPENDIX IX APPLICATION OF DIGI-

TAL RADIOGRAPHY 强制性附录 IX 数位射线照相术之应用

IX-210 SCOPE 适用范围

This Appendix provides requirements for using digital radiography (DR) techniques as an alternative to film radiography. This Appendix addresses techniques where the image is transmitted directly from the detector as a dig-ital image rather than using an intermediate process for conversion of an analog image to a digital format. This Ap-pendix addresses applications in which the radiation detector and the source of the radiation may or may not be in

motion during exposure. 在本附录中对以数位射线照相(DR)技术来取代胶片射线照相术做出了相关要求。本

附录亦对 CR做出了论述，CR是直接将检测器所传输之图像转换为数位格式而非将模拟图像转换为数位之

中间过程技术。本附录讨论了辐射探测器和射源在曝光期间是可移动或者是不移动之相关应用。

Digital radiography may be performed on materials, including castings and weldments when the modified provi-

sions to Article 2 as indicated herein and all other applicable requirements of Article 2 are satisfied. 当满足本文第

2章节所修改之条款和第 2章节所有其他所适用之要求时，即可对材料(包括铸件和焊件)进行数位射线照

相。

IX-220 GENERAL REQUIREMENTS 一般要求

IX-221 PROCEDURE REQUIREMENTS 规程要求

IX-221.1 Written Procedure. A written procedure is required. In lieu of the requirements of T-221.1, each proce-

dure shall contain the following requirements as applicable: 书面规程。需书面规程。为代替 T-221.1的要求，

每一规程应包含以下所适用的要求：

(a) material type and thickness range 材料类型和厚度范围

(b) source type or maximum X-ray voltage used 所采用之射源类型或最大X射线电压

(c ) detector type 检测器类型

(d) minimum source-to-object distance (D in T-274.1) 射源到物项之最小距离(即 T-274.1中之 D值)

(e ) distance between the test object and the detector (d in T-274.1) 检测物项和检测器之间的距离(即 T-

274.1中之 d值)


(g) test object scan plan (if applicable) 检测物项扫描布置图(如果适用)

(h) image display parameters 图像显示参数

(i ) equipment manufacturer and model 设备制造商和型号

(j ) storage media 贮存媒体(介质)

IX-221.2 System Qualification and Procedure Demonstration. Qualification of the digital radiographic system requires a demonstration of the image quality indicator (IQI). When a wire-type IQI is used, the system shall be evaluated for asymmetrical sensitivity by using two placements with the wire diameter axes 90 deg apart. If the sys-tem exhibits asymmetrical sensitivity, the wire diameter axis shall be oriented along the system’s axis of least sensi-tivity for production radiography. Once the image equivalent performance evaluation is complete and determined to be sufficient, the demonstration of the IQI image quality requirements of the written procedure on production radio-

graphic images shall be considered satisfactory evidence of compliance with the procedure. 系统鉴定和规程演

示。通过像质计(IQI)的演示以鉴定数位放射摄影系统。当采用线型 IQI时，应藉由将两线轴定位成 90度以

评估系统的不对称灵敏度。如果系统表现出不对称灵敏度，则线轴应沿着用于产品射射照相之系统最小灵

敏度轴线定向。一旦图像等效性能评估完成并确定足够，产品放射图像之书面规程可作为对 IQI图像质量

所要求之演示是符合规程要求的凭证。

IX-225 MONITORING DENSITY LIMITATIONS OF RADIOGRAPHS 监测放射性密度之黑度限度

The requirements of T-225 are not applicable to digital radiography. T-225的要求不适用于数位射线照相。

IX-230 EQUIPMENT AND MATERIALS 设备和材料

IX-234 FILM 胶片


IX-235 INTENSIFYING SCREENS 增感屏


IX-236 FACILITIES FOR VIEWING OF RADIOGRAPHS 用于射线观察之设施

Viewing facilities shall provide subdued background lighting of an intensity that will not cause reflections,

shadows, or glare on the monitor that interfere with the interpretation process. 观察设施应能提供柔和的背景光，

其在显示器上的强度不会在解释过程造成干扰反射，阴影或眩光。

IX-260 CALIBRATION 校准

IX-262 DENSITOMETER AND STEP WEDGE COMPARISON FILM 黑度计和阶梯比较片


IX-270 EXAMINATION 检测

IX-277 USE OF IQIS TO MONITOR RADIOGRAPHIC EXAMINA-

TION 采用 IQIs 监测放射性检测

IX-277.1 Placement of IQIs. IQIs 的定位

(a) Source-Side IQI(s). When using separate blocks for IQI placement as described in T-277.1(a), the thick-ness of the blocks shall be such that the image brightness at the body of the IQI is judged to be equal to or greater than the image brightness at the area of interest for a negative image format. If verified by measurement, pixel in-tensity variations up to 2% are permitted in the determination of “equal to.” This image brightness requirement is

reversed for a positive image format. 射源侧 IQI。当如 T-277.1(a)中所述在各单独模块上定位 IQI时，每一块

之厚度应使得 IQI本体处之图像亮度被判断为等于或大于该区域受检测图像之负图像格式。如果通过测量

验证，则在所确定之〝等于〞中允许高达 2％的像素强度变化。对于图像亮度要求则正好是正图像格式的

相反。

(b) All other requirements of T-277.1 shall apply. T-277.1之所有其他要求应适用

IX-277.2 Number of IQIs. IQIs 之数量

(a) Multiple IQIs. An IQI shall be used for each applicable thickness range in Table T-276 spanned by the

minimum-to-maximum thickness of the area of interest to be radiographed. 复合 IQIs。在表 T-276中之每一适用

厚度范围应是藉由射线照相受检测区域之最小到最大厚度间来选用相应的 IQI厚度。

(b) As an alternative to (a) above, a minimum of two IQIs representing the minimum and maximum thick-

nesses of the area of interest may be used, provided the requirements of IX-288 are met. 只是满足VIII-288的要

求，可在受检测区域至少采用两个 IQI以分别替代上述(a)之最小和最大厚度。

(c ) All other requirements of T-277.2 shall apply. T-277.2之所有其他要求应适用。

(d) Comparators such as digitized film strips, gray scale cards, etc., may be used to aid in judging displayed image brightness. When comparators are used to judge areas within the image, they need not be calibrated. Pixel

intensity values may also be used to quantify image brightness comparisons. 诸如数位化录像带，灰度色卡等比

较器可用于说明判断所显示之图像亮度。当比较器用于判断图像中的某一区域时，它们是不需要校准的。

像素强度值还亦可用于量化图像亮度之比较上。

IX-277.3 Shims Under Hole IQIs. For welds with reinforcement or backing material, a shim of material radio-graphically similar to the weld metal and/or backing material shall be placed between the part and the IQIs such that the image brightness at the body of the IQI is judged to be equal to or greater than the image brightness at the area of interest for a negative image format. If verified by measurement, pixel intensity variations up to 2% are permitted in the determination of “equal to.” This image brightness requirement is reversed for a positive image format.

The shim dimensions shall exceed the IQI dimensions such that the outline of at least three sides of the IQI is

visible in the radiograph. 在孔洞型IQI之下的垫片。对于具有余高或背衬材料之焊缝，在放射学上具有与焊

缝金属和/或背衬材料相类似之垫片材料应定位在物项和IQI之间，以使IQI主体处之图像亮度被判断为是等

于或大于用作负图像格式之受检测区域处的图像亮度。如果通过测量验证，则在所确定之〝等于〞中允许

高达2％的像素强度变化。对于图像亮度要求则正好是正图像格式的相反。

IX-280 EVALUATION 评估

IX-281 QUALITY OF RADIOGRAPHS 放射照相之质量

IX-281.1 Nonfunctional Pixel Display. A nonfunctional pixel display shall be generated in accordance with the

manufacturer’s instructions and recommended frequency as a system check. 非功能性像素显示。非功能性像素

显示应根据制造商之采用说明书和所推荐之系统检测频率产生。

IX-281.2 System-Induced Artifacts. The relevance of nonfunctional pixels shall be evaluated. The digital image shall be free of system-induced artifacts, such as nonfunctional pixels in the detector in the area of interest that

could mask or be confused with the image of any discontinuity. 由系统所诱发之伪影。数位图像应在受检测区

域中没有系统诱导的伪像，其可能对首要模拟图像中的任何不连续图像造成蒙蔽或混淆。

IX-282 IMAGE BRIGHTNESS 图像亮度

The image brightness through the body of the hole-type IQI or adjacent to the designated wire of the wire-type IQI, shall be judged to be equal to or greater than the image brightness in the area of interest for a negative image format. If verified by measurement, pixel intensity variations up to 2% are permitted in the determination of “equal to.” This image brightness requirement is reversed for a positive image format. Additionally, the requirements of T-

282 are not applicable to digital radiography. 通过孔洞型 IQI主体或线型 IQI附近之指定金属线的图像亮度应

被判断为是等于或大于用作负图像格式之受检测区域处的图像亮度。。如果通过测量验证，则在所确定之

〝等于〞中允许高达 2％的像素强度变化。对于图像亮度要求则正好是正图像格式的相反。此外，T-282的

要求不适用于数位射线照相上。

IX-283 IQI SENSITIVITY IQI灵敏度

IX-283.1 Required Sensitivity. Radiography shall be performed with a technique of sufficient sensitivity to dis-play the designated hole-type IQI image and the essential hole, or the essential wire of a wire-type IQI. The radio-graphs shall also display the IQI identifying numbers and letters. Multiple film technique is not applicable to digital

radiography. 所需之灵敏度。射线照相应采用具有足够灵敏度的技术进行，以显示所指定之孔洞型 IQI图像

和基本孔，或线型 IQI的基本线。放射胶片还应显示 IQI识别号和字母。多胶片技术不适用于数位射线照

相上。

IX-284 EXCESSIVE BACKSCATTER 背散射过度

For a negative image format, the requirements of T-284 shall apply. For a positive image format, if a dark im-age of the “B,” as described in T-223, appears on a lighter background of the image, protection from backscatter is insufficient and the radiographic image shall be considered unacceptable. A light image of the “B” on a darker

background is not cause for rejection. T-284之要求应适用于负图像格式。对于正图像格式，如果 T-223中描

述的“B”的暗图像出现在图像的较亮背景上，则表示对背散射之防护不够充分，并且该放射摄影图像将被

认为是不可接受的。处在较暗背景上的“B”光图像不是被拒绝的原因。

IX-287 DIMENSIONAL MEASURING 尺寸测量

IX-287.1 Measuring Scale Comparator. The measur ing scale used for interpretation shall be capable of provid-ing dimensions of the projected image. The measurement scale tool shall be based upon a known dimensional com-parator that is placed on or adjacent to the detector side of the part cassette near the area of interest during exposure.

刻度式测量比较器。当测量标尺被应用于解释时，应具有提供所有投影图像尺寸之能力。测量标尺工具应

在曝光期间，把已知尺寸之比较器定位在或受检测区域附近之检测器侧的暗盒上。

IX-287.2 Alternative Comparator. As an alternative to a measuring scale comparator, a dimensional calibration

of the measuring function based upon the detector pixel size may be used. 其他之比较器。可验证扫描像素大小

之测量函数尺寸校准器可用为测量尺比较器的替代。

IX-288 INTERPRETATION 解释

Final radiographic interpretation of the area of interest shall be performed within the identifieded IQI image contrast and brightness values or, if multiple IQIs are used, the overlapping portions of the identifieded contrast and brightness values for the intervening thickness ranges. The IQI and the area of interest shall be of the same image

format (positive or negative). Additionally, where applicable 应以在所识别的 IQI图像对比度、亮度值或者如果

采用多个 IQI之情况下针对中间厚度范围所识别出之对比度和亮度值的重迭部分来作为受检测区域的最终

射线照相解释。 IQI和受检测区域应具有相同的图像格式(正或负)。此外，适用时：

(a) the contrast and brightness range that demonstrates the required IQI sensitivity shall be used for inter-pretation. When more than one IQI is used to qualify multiple thicknesses, the overlapping portions of each IQI’s determined contrast and brightness range shall be considered valid for interpretation of intervening thicknesses. Pixel intensity values may also be used to quantify image brightness comparisons in accordance with IX-277.1, IX-

277.3, and IX-282. 用于演示所需 IQI灵敏度之对比度和亮度范围应用于解释。当采用一个以上之 IQI来鉴定

多种厚度时，由每一 IQI重迭部分所确定之对比度和亮度范围对中间厚度的解释应是有效的。像素强度值

也适用于根据 VIII-277.1、VIII-277.3和 VIII-282量化图像亮度之比较上。

(b) the digital image may be viewed and evaluated in a negative or positive image format. 数位图像可采

负或正图像格式进行观察和评估。

(c ) independent areas of interest of the same image may be displayed and evaluated in differing image for-

mats, provided the IQI and the area of interest are viewed and evaluated in the same image format. 只要以相同图

像格式观察和评估 IQI和受检测区域，则具有相同图像之各单独受检测区域可以不同图像格式显示并进行

评估。

IX-290 DOCUMENTATION 文件

IX-291 DIGITAL IMAGING TECHNIQUE DOCUMENTATION DETAILS 数位成像技术文件之详细信息


information shall be provided: 组织应制备和记录射线照相技术细节，其中应至少提供以下信息：

(a) the requirements of Article 1, T-190(a) 第 1章节 T-190(a)之要求

(b) identification as required by T-224 T-224所要求之识别

(c ) the dimensional map (if used) of marker placement in accordance with T-275.3 根据 T-275.3所定位

之标记尺寸图(如果采用时)

(d) the specific scan plan used for the test object 用之于检测物项的特定扫描布置图

(e ) X-ray voltage or isotope used 所采用之 X射线电压或同位素


(g) base material type and thickness, weld reinforcement thickness, as applicable 母材所适用之类型、厚

度和焊缝余高

(h) source-to-object distance (D in T-274.1) 射源到物件之距离(即 T-274.1中之 D值)

(i ) distance from source side of object to the detector (d in T-274.1) 从物件源侧到检测器的距离(即 T-

274.1中之 d值)

(j ) detector manufacturer, designation, and serial number 检测器制造商名称和序列号

(k ) image acquisition (digitizing) equipment and manufacturer, model, and serial number 图像摄取(数位

化)设备制造商名称、型号和序号

(l ) singleor double-wall exposure 单壁或双壁暴光

( m) singleor double-wall viewing 单壁或双壁观察

(n) procedure identification and revision level 规程识别号和修订版次

(o) imaging software version and revision 成像软件版本和修订版次

(p) numerical values of the final image processing parameters, i.e., filters, window (contrast), and level

(brightness) for each view 最终图像处理参数数值即为用于每次观察之滤镜，屏幕可视见区(对比度)和水平

(亮度)

(q) nonfunctional pixel evaluation for each image 每一图像之非功能性像素评估

(r) computer monitor resolution 计算器显示器之分辨率

The technique details may be embedded in the data file. When this is performed, ASTM E1475, Standard Guide for Data Fields for Computerized Transfer of Digital Radiological Test Data, may be used as a guide for es-

tablishing data fields and information content. 技术细节可嵌入在数位文件中。当如此执行时，ASTM E1475

《Standard Guide for Data Fields for Comput-erized Transfer of Digital Radiological Test Data》可作为制定数位

字段和信息内容的指南。

NONMANDATORY APPENDIX A RECOMMENDED RADIOGRAPHIC TECHNIQUE SKETCHES FOR PIPE

OR TUBE WELDS 非强制性附录 A 公称管或管子焊缝之推荐射线照相技术

A-210 SCOPE 适用范围 The sketches in Figures A-210-1 and A-210-2 of this Appendix illustrate techniques used in the radiographic

examination of pipe or tube welds. Other techniques may be used. 本附录之草图中对公称管或管子焊缝射钱探

伤检查中采用的技术做出了相关描述。亦可以采用其他技术。

Figure A-210-1 Single-Wall Radiographic Techniques 单壁射线照相术

Pipe

O.D.

管外

径

Exposure

Technique

曝光技术

Radiograph

Viewing射

线胶片观

察

Source-Weld Film Arrangement 射源-焊缝胶片之布置 IQI Location

Maker Place-

ment 位置标

记之定位 End View端部观察 Side View侧视观察

Selection

选用

Placement

定位

Any

Single-

Wall T-

271.1

Single-Wall

单壁

Film 胶片

Exposure Arrangement – A 曝光布置(A)

T-276

and Ta-

ble T-276

Source

Side T-

277.1(a)

按 T-

277.1(a)之

规定定位在射源侧

Either Side T-

275.3 T-

275.1(c) 按

T-275.3、T-

275.1(c)之规

定可定位在

任一侧

Film Side

T277.1(b)

按 T-

277.1(b)

之规定定

位在胶片

侧

Any

Single-

Wall T-

271.1

Single-Wall

单壁

Film胶片

Exposure Arrangement – B曝光布置(B)

T-276

and Ta-

ble T-276

Source Side T-

277.1(a)

按 T-

277.1(a)之规定定位

在射源侧

Film Side

T275.1(b)(1)

按 T-

277.1(b)(1)之

规定定位在

胶片侧

Film Side

T277.1(b)

按 T-

277.1(b)

之规定定

位在胶片

侧

Any

Single-

Wall T-

271.1

Single-Wall

Exposure Arrangement – C曝光布置(C)

T-276

and Ta-

ble T-276

Source Side T-

277.1(a)

按 T-

277.1(a)之

规定定位

在射源侧

Source Side

T-275.1(a)(3)

按 T-

275.1(a)(3)之规定定位在

射源侧

Film Side

T277.1(b)

按 T-

277.1(b)

之规定定

位在胶片侧

(Continue) (续下一页)

Source 射源

Figure A-210-2 Double-Wall Radiographic Techniques

图 A-210-2 (续上一页) 双壁射线透照技术

Pipe O.D.

管外径

Exposure Technique

曝光技术

Radiograph Viewing

射线胶片观察

Source-Weld-Film Arrangement 射源-焊缝胶片之布置 IQI Location Marker Placement

位置标记之定位 End View端部观察 Side View侧视观察 Selection选用 Placement 定位

Any

DoubleWall: 双壁

T-271.2(a) at Least 3 Exposures

120 deg to Each Other for Com-

plete Coverage 需至少进行 3

次曝光且互成 120度以涵

盖整个环焊缝，见 T-

271.2(a)

Single-Wall单壁

Film胶片

Exposure arrangement — D 曝光布置(E)

T-276 and Table

T-276

Source Side T-277.1(a)

定位在射源侧，见 T-

277.1(a)

Film Side T-275.1(b) (1) 定

位在胶片侧，见 T-

277.1(b)(1)

Film Side T-277.1(b) 定位

在胶片侧，见 T-277.1(b)

Any

DoubleWall: 双壁

T-271.2(a) at least 3 Exposures

120 deg to Each Other for Com-

plete Coverage 需至少进行 3

次曝光且互成 120度以涵


271.2(a)

Single-Wall单壁

Film胶片

Exposure arrangement — E 曝光布置(E)

T-276 and Table T-276

Source Side T-277.1(a)

定位在射源侧，见 T-

277.1(a)

Film Side T-275.1(b) (1) 按

T-277.1(b)(1)之规定定位

在胶片侧

Film Side T-277.1(b) 定位

在胶片侧，见 T-277.1(b)


Optional

source location

Optional

source location

Figure A-210-2 (Continue) Double-Wall Radiographic Techniques

图 A-210-2 (续上一页) 双壁射线透照技术

Pipe O.D.

管外径

Exposure Technique

曝光技术

Radiograph Viewing

射线胶片观察

Source-Weld-Film Arrangement 射源-焊缝胶片之布置 IQI Location Marker Place-

ment 位置标记之定位 End View端部观察 Side View侧视观察 Selection选用 Placement 定位

31/2 in. (88

mm) or Less

Double-Wall: 双壁

T-271.2(b)(1) at Least 2 Ex-

posures at 90 deg to Each

Other for Complete Coverage

需至少进行 2次曝光且

互成 90度以涵盖整个环

焊缝，见 T-271.2(b)(1)

Double-Wall (El-

lipse): Read Offset Source Side and Film

Side Images双壁

(椭圆)：观察偏移

射源侧和胶片侧

之图像

Source 射源

Film胶片

Exposure arrangement — F 曝光布置(F)

T-276 and Table

T-276

Source Side T-

277.1(a) 定位在射

源侧，见 T-

277.1(a)

Either Side T-275.2可

定位在任一侧，见 T-

275.2

31/2 in. (88

mm) or Less

Double-Wall: 双壁

T-271.2(b)(2) at Least 3 Ex-

posures at 60 deg or 120 deg

to Each Other for Complete

Coverage 需至少进行 3次

曝光且互成 120度以涵


271.2(b)(2)

Double-Wall: Read

Superimposed Source

Side and Film Side

Images 双壁：观察

射源侧和胶片侧

之迭加图像

Source射源

Film胶片

Exposure arrangement — G 曝光布置(G)

T-276 and Table

T-276

Source Side T-

277.1(a) 定位在射

源侧，见 T-

277.1(a)

Either Side T-275.2可

定位在任一侧，见 T-

275.2

NONMANDATORY APPENDIX C HOLE-TYPE IQI

PLACEMENT SKETCHES FOR WELDS 非强制性附录 C 用于焊缝之孔洞型 IQI布置草图

C-210 SCOPE 适用范围

Figures C-210-1 through C-210-4 of this Appendix demonstrate typical IQI (hole type) placement for welds. These sketches are tutorial to demonstrate suggested locations of IQIs and are not intended to cover all configura-tions or applications of production radiography. Other IQI locations may be used provided they comply with the

requirements of Article 2. Wire IQIs shall be placed in accordance with the requirements of Article 2. 本附录中之

图 C-210-1至 C-210-4显示了焊缝的典型 IQI(孔类型)定位方式。这些草图是对演示推荐之 IQI位置时的辅

助教程，并无意涵盖所有产品射线照相的配置或应用。只要它们符合第 2章节之要求，其他的 IQI位置是

可被采用的。线型 IQI应按照第 2章节之要求定位。

Figure C-210-1 Side and Top Views of Hole-Type IQI Placements

图C-210-1 孔洞型IQI定位的侧视观察和俯视观察

(a) Single Wall, No Reinforcement, No Back-Up Strip 单壁、无余高、无衬垫

(b) Single Wall, Weld Reinforcement, No Back-Up Strip 单壁、有焊缝余高、无衬垫


Radiation 射线

胶片

胶片

Radiation 射线

Film胶片

Film胶片

Figure C-210-1(Cont'd) Side and Top Views of Hole-Type IQI Placements

图C-210-1 (续上一页) 孔洞型IQI定位的侧视观察和俯视观察

(c) Single Wall, Weld Reinforcement, Back-Up Strip 单壁、有焊缝余高、有衬垫

(d) Single Wall, Integral Backing Ring, Weld Reinforcement 单壁、有整体背衬环、有焊缝余高

Legend: 插图说明

P = IQI placement 像质计定位位置 𝑇𝑁 = nominal wall thickness 公称壁厚

𝑃1 = alternate IQI placement 备用IQI定位位置

SH= shim 薄垫片 𝑇𝑠 = total thickness including backing strip and/or reinforcement when not

removed包括衬垫和/或余高未移除时的总厚度

T = weld thickness upon which the IQI is based IQI以焊缝厚度做基准

GENERAL NOTE: P and 𝑃1 are suggested placements of IQis and are not intended to cover all geometric con-

figurations or applications of production radiography. 通注：P和𝑃1是IQI之推荐定位，其无意涵盖所有产品射线照相的

配置或应用。

Film胶片

Radiation 射线

胶片

胶片

Radiation 射线

Film胶片

Figure C-210-2 Side and Top Views of Hole-Type IQI Placements 图C-210-2 孔洞型IQI定位的侧视观察和俯视观察

(a) Double-Wall Technique, Double-Wall Viewing, With Weld Reinforcement and Back-Up Strip

(b) Double-Wall Technique, Double-Wall Viewing, With Weld Reinforcement and No Back-Up Strip

Legend: 插图说明

P = IQI placement像质计定位位置 T = weld thickness upon which the IQI is based IQI以焊缝厚度做基准

𝑃1 = alternate IQI placement备用IQI定位位置 𝑇𝑁 = nominal wall thickness公称壁厚

SH = shim薄垫片 𝑇𝑠 = total thickness including backing strip and/or reinforcement

when not removed包括衬垫和/或余高未移除时的总厚度

GENERAL NOTE: P and 𝑃1 are suggested placements of IQI is and are not intended to cover all geometric configu-

rations or applications of production radiography. 通注：P和𝑃1是IQI之推荐定位，其无意涵盖所有产品射线照相的配置或应用。

Radiation 射线

Film胶片

Radiation 射线

Bac

k o

f w

led

焊缝

背面

Film胶片 Film胶片

胶片

Bac

k-u

p s

trip

垫板


图C-210-3 孔洞型IQI定位的侧视观察和俯视观察

(a) Double-Wall Technique, Single-Wall Viewing, Back-Up Strip

(b) Double-Wall Technique, Single-Wall Viewing, Wall Reinforcement, No Back-Up Strip

Legend:

P = IQI placement T = weld thickness upon which the IQI is based 𝑃1 = alternate IQI placement SH = shim

𝑇𝑁 = nominal wall thickness 𝑇𝑠 = total thickness including backing strip and/or reinforcement when not removed

GENERAL NOTE: P and 𝑃1 are suggested placements of IQis and are not intended to cover all geometric configurations or applications of production

radiography.

Film胶片

Back

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(a) Double-Wall Technique, Double-Wall Viewing, With Weld Reinforcement and Back-Up Strip

(b) Double-Wall Technique, Double-Wall Viewing, With Weld Reinforcement and No Back-Up Strip

Legend:

P = IQI placement T = weld thickness upon which the IQI is based 𝑃1 = alternate IQI placement 𝑇𝑁 = nominal wall thickness

SH = shim 𝑇𝑠 = total thickness including backing strip and/or reinforcement when not removed

GENERAL NOTE:

(a) P and 𝑃1 are suggested placements of IQis and are not intended to cover all geometric configurations or applications of production rad iography.

(b) IQI is based on the single-wall thickness plus reinforcement.

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NONMANDATORY APPENDIX D NUMBER OF IQIS

(SPECIAL CASES) 非强制性附录 D IQI数量(特殊情况)

D-210 SCOPE 适用范围

Figures D-210-1 through D-210-8 of this Appendix illustrate examples of the number and placement of IQIs that may be used in the special cases described in T-277.2(b). These figures are not intended to cover all configurations or

applications of production radiography. 对于在T-277.2(b)中所述之特殊情况，于本附录中之图D-210-1至D-210-8

示出了可采用的IQI数量和定位位置示例。这些图无意涵盖所有产品射线照相的配置或应用。

Figure D-210-1 Complete Circumference Cylindrical Component

图D-210-1 整圈环向焊缝之圆筒形物项

GENERAL NOTE: See T-277.2(b)(1)(-a) and T-277.2(b)(3)

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Figure D-210-2 Section of Circumference 240 deg or More Cylindrical Component (Exam-

ple is Alternate Intervals)

图D-210-2 240度或以上之圆筒形物项焊缝区段(错开间隔摄取之示例)

GENERAL NOTE: See T-277.2(b)(1)(-b) and T-277.2(b)(3).

Figure D-210-3 Section(s) of Circumference Less than 240 deg Cylindrical Component

图D-210-3 240度以下之圆筒形物项各焊缝区段

GENERAL NOTE: See T-277.2(b)(2)(-b).

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Figure D-210-4 Section(s) of Circumference Equal to or More than 120 deg and Less

than 240 deg Cylindrical Component Option

图D-210-4 等于或大于120度(不含) 之圆筒形物项各焊缝取舍区段

GENERAL NOTE: See T-277.2(b)(2)(-b).

Figure D-210-5 Complete Circumferential Welds Spherical Component

图D-210-5 整圈环焊缝之球形物项

GENERAL NOTE: See T-277.2(b)(4)(-a) and T-277.2(b)(6).

Figure D-210-6 Welds in Segments of Spherical Component

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图D-210-6 球形物项各区段中之焊缝

GENERAL NOTE: See T-277.2(b)(5), T-277.2(b)(5)(-b), and T-277.2(b)(6).

Figure D-210-7 Plan View A-A

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Figure D-210-8 Array of Objects in a Circle

图D-210-8 围成一圈之对像数组组

GENERAL NOTES:

(a) Special cases IQI locations are typical in all figures.

(b) See T-277.2(b)(8).

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ARTICLE 4 ULTRASONIC EXAMINATION METHODS

FOR WELDS 第 4 章超声波检测法


This Article provides or references requirements for weld examinations, which are to be used in selecting and de-veloping ultrasonic examination procedures when examination to any part of this Article is a requirement of a referenc-ing Code Section. These procedures are to be used for the ultrasonic examination of welds and the dimensioning of indications for comparison with acceptance standards when required by the referencing Code Section; the referencing

Code Section shall be consulted for specific requirements for the following: 当引用规范章节要求焊缝检测须按本

章中之任何条款进行检测时，本章为超声波检测规程之选用和制定提供了或加注了有关讯息。当参考规范部

门要求时，用之于焊缝超声波检测和指示尺寸的这些规程，可便于与允收准则进行比较；至于下列之具体要

求，应参考引用规范章节之相对规定：

(a) personnel qualification/certification requirements 人员资格及认证要求

(b) procedure requirements/demonstration, qualification, acceptance 规程要求/演示、鉴定、认可

(c) examination system characteristics 鉴测系统特征

(d) retention and control of calibration blocks 校准试块之保存和管制

(e) extent of examination and/or volume to be scanned 检测范围和/或额扫查

(f) acceptance standards 允收准则

(g) retention of records 记录保存

(h) report requirements 报告要求

Definitions of terms used in this Article are contained in Article 1 , Mandatory Appendix I, I-121.2, UT — Ultra-

sonics. 于本章中所采用之术语定义载于第 1章，强制性附录 I 第 I-121.2节中之 UT 超声波术语汇编里。

T-420 GENERAL 总则

The requirements of this Article shall be used together with Article 1, General Requirements. Refer to: 本章之相

关要求应与第一章之总则一起并用，并参照：

(a) special provisions for coarse grain materials and welds in T-451; T-451中粗晶体粒和焊缝之特殊规

定；

(b) special provisions for computerized imaging techniques in T-452; T-452中之计算机成像技术的具

体规定；

(c) Mandatory Appendix III for Time of Flight Diffraction (TOFD) techniques; 用于时差衍射(TOFD)技

术之强制性附录 III；

(d) Mandatory Appendix IV for phased array manual rastering techniques. 用于相控阵手动光栅扫查技

术之强制性附录 4。

T-421 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

T-421.1 Requirements. Ultrasonic examination shall be performed in accordance with a written procedure which shall, as a minimum, contain the requirements listed in Table T-421. The written procedure shall establish a single

value, or range of values, for each requirement. 要求项目。超声波检测应按照书面规程进行，其中应至少涵盖表

T-421中所列出要求，且书面规程应为每项要求制定单一值或各项相应值的允收范围。

T-421.2 Procedure Qualification. When procedure qualification is specified by the referencing Code Section, a change of a requirement in Table T-421 identified as an essential variable from the specified value, or range of values,

shall require requalification of the written procedure. A change of a requirement identified as a nonessential variable from the specified value, or range of values, does not require requalification of the written procedure. All changes of essential or nonessential variables from the value, or range of values, specified by the written procedure shall require

revision of, or an addendum to, the written procedure. 规程鉴定。当引用规范妆节要求进行规程鉴定，且超出表

T-421中被要求为重要变量项目之具体值或各项值的规定范围时，则需重新鉴定书面规程，然，若非重要变量

超出具体值或各项值的规定范围时，是不需重新对书面规程进行鉴定的。书面规程所规定的值或各项值的规

定范围，不管是重要变量还是非重要变量，只要有所变更都需对书面规程进行改版或补遗。


T-431 INSTRUMENT REQUIREMENTS 仪器要求

A pulse-echo-type of ultrasonic instrument shall be used. The instrument shall be capable of operation at frequen-cies over the range of at least 1 MHz to 5 MHz and shall be equipped with a stepped gain control in units of 2.0 dB or less. If the instrument has a damping control, it may be used if it does not reduce the sensitivity of the examination. The reject control shall be in the “off” position for all examinations, unless it can be demonstrated that it does not af-

fect the linearity of the examination. 应采用脉冲回波型超声波仪器，且该仪器应至少能在 1 MHz至 5 MHz范围

内的频率下操作，并应配备有能以 2.0 dB 或更小步进值之增益旋钮。只要具有带阻滤波器调整功能之仪器能

不降低检测灵敏度，则可采用该仪器。除非能证明不影响检测的线性，否则在进行任何检测时，dB 调整钮都

应处于不可调整状态下之“关闭”位置。

The instrument, when required because of the technique being used, shall have both send and receive jacks for

operation of dual search units or a single search unit with send and receive transducers. 当出于采用技术需求，而须

具有收发换能器之装置可各自独立进行单或双扫查操作时，则该仪器上应具有双插座。

T-432 SEARCH UNITS 探头

T-432.1 General. The nominal frequency shall be from 1 MHz to 5 MHz unless variables, such as production mate-rial grain structure, require the use of other frequencies to assure adequate penetration or better resolution. Search units

with contoured contact wedges may be used to aid ultrasonic coupling. 通则。除非产品材料晶体粒结构等变量需

采用其他频率以确保足够的穿透率或更好的分辨率，否则标称频率应为 1 MHz至 5 MHz。探头可采用具有轮

廓相配之接触楔块以有效提升超声波耦合率。

T-432.2 Weld Metal Overlay Cladding — Search Unit.9 Dual element, straight beam search units using an angled pitch-catch technique shall be used. The included angle between the search unit’s elements shall be such that the effec-

tive focal spot distance is centered in the area of interest. 用于焊缝金属堆焊层之探头。双晶体直束波探头应采用

有角度之收发技术。换能器间之夹角应使有效焦点距离集中在被检测范围内。

T-433 COUPLANT 耦合剂

T-433.1 General. The couplant, including additives, shall not be detrimental to the material being examined. T-

432.2 通则。混合物，其中含有不会对被检测材料造成不利影响之添加剂。

T-434 CALIBRATION BLOCKS 校准试块

T-434.1 General 通则

T-434.1.1 Reflectors. Specified reflectors (i.e., side-drilled holes, flat bottom holes, notches, etc.) shall be used to establish primary reference responses of the equipment. An alternative reflector(s) may be used provided that the alternative reflector(s) produces a sensitivity equal to or greater than the specified reflector(s) (e.g., side-drilled

holes in lieu of notches, flat bottom holes in lieu of side-drilled holes). 反射体。应采用所指定之反射体(即横孔、

平底孔、槽口等)来建立设备的首要参照电平。可以使用替代的反射器，只要其他反射体能产生等于或大于指

定反射体的灵敏度(例如代替槽口之横孔、代替横孔之平底孔)。

T-434.1.2 Material 材料

(a) Similar Metal Welds. The material from which the block is fabricated shall be of the same product

form and material specification or equivalent P-Number grouping as one of the materials being examined. For the pur-

poses of this paragraph, P-Nos. 1, 3, 4, 5A through 5C, and 15A through 15F materials are considered equivalent. 类

似金属焊缝。制造试块之材料应与受检测材料之一具有相同的产品型式和材料规格或等效P-No.。本节之目的

是将 P-N. 1、3、4、5A 至 5C、15A 至 15F等都视为是等效材料。

(b) Dissimilar Metal Welds. The material selection shall be based on the material on the side of the weld from which the examination will be conducted. If the examination will be conducted from both sides, calibration re-

flectors shall be provided in both materials. 异种金属焊缝。材料应以受检测焊缝侧之材料为选用基准。若由焊

缝两侧进行检测时，则应同时提供此两种材料之校准反射体。

Table T-421 Requirements of an Ultrasonic Examination Procedure

表 T-421 超声波检测规程之要求项目

Requirement 要求 Essential Variable

重要变量

Nonessential Variable

非重要变量

Weld configurations to be examined, including thickness dimensions and base mate-

rial product form (pipe, plate, etc.) 所要检测之焊缝构造，包括厚度尺寸和母材之产品形式(管、板等)

X . . .

The surfaces from which the examination shall be performed 进行检测之表面 X . . .

Technique(s) (straight beam, angle beam, contact, and/or immersion) 技术(直束波，

斜束波，接触法和/或液浸法) X . . .

Angle(s) and mode(s) of wave propagation in the material声波在材料中之传播角度和方式

X . . .

Search unit type(s), frequency(ies), and element size(s)/shape(s) 探头类型、频率和光闸、焦距、入射角等要素之之大小/形状

X . . .

Special search units, wedges, shoes, or saddles, when used 特设之探头、试块、衬垫

或衬块(当采用时) X . . .

Ultrasonic instrument(s) 超声波仪器 X . . .

Calibration [calibration block(s) and technique(s)] 校准[校准试块和技术] X . . .

Directions and extent of scanning扫查方向和范围 X . . .

Scanning (manual vs. automatic) 扫查(手工与自动) X . . .

Method for discriminating geometric from flaw indications 指示几何与缺陷之鉴别

方法 X . . .

Method for sizing indications 量测指示之方法 X . . .

Computer enhanced data acquisition, when used 计算器增强数据采集(使用时) X . . .

Scan overlap (decrease only) 扫查重迭率(仅减少时) X . . .

Personnel performance requirements, when required 人员资格要求(当要求时) X . . .

Personnel qualification requirements 人员资格要求 . . . X

Surface condition (examination surface, calibration block) 表面状况(检测面，校准

试块) . . . X

Couplant: brand name or type耦合剂：品牌名称或类型 . . . X

Post-examination cleaning technique检测后之清洁技术 . . . X

Automatic alarm and/or recording equipment, when applicable自动警报器和/或记录设备(如适用时)

. . . X

Records, including minimum calibration data to be recorded (e.g., instrument settings)

记录，包括所要记录之最小校准数据(例如仪器设置关键帧) . . . X

T-434.1.3 Quality. Prior to fabrication, the block material shall be completely examined with a straight beam search unit. Areas that contain an indication exceeding the remaining back-wall reflection shall be excluded from the

beam paths required to reach the various calibration reflectors. 品质。在制造试块之前，其所采用之材料应先以直

束探头进行全面检测。对超出残余背反射之指示区域应使包含超出其剩余背反射之指示区域不能在各种校准

反射体所需声程中出现。

T-434.1.4 Cladding 堆焊层

(a) Block Selection. The material from which the block is fabricated shall be from one of the following:

试块之选用。制造试块之材料应来至下列之一：

(1) nozzle dropout from the component 物项接管余料

(2) a component prolongation 物项延长段

(3) material of the same material specification, product form, and heat treatment condition as the

material to which the search unit is applied during the examination 与探头在检测期间所要扫查材料具有相同的材

料规格，产品型式和热处理条件之材料

(b) Clad. Where the component material is clad and the cladding is a factor during examination, the block shall be clad to the component clad nominal thickness ±1/8 in. (3 mm). Deposition of clad shall be by the same method (i.e., roll-bonded, manual weld deposited, automatic wire deposited, or automatic strip deposited) as used to clad the component to be examined. When the cladding method is not known or the method of cladding used on the

component is impractical for block cladding, deposition of clad may be by the manual method. 堆焊。在物项材料进

行堆焊且堆焊层是检测变量之情况下，该试块应堆焊至物项标称厚度之±1/8 in. (3 mm)内。堆焊层沉积物应采

与用于待检测物项相同的堆焊沉积方法(即辊压、手工焊接沉积，自动焊丝沉或自动带状电极焊接法)。当堆焊

方法是未知的或者物项所采用之堆焊方法对产生块状堆焊层是不切实际时，则堆焊层之沉积物可采用手工方

法。

When the parent materials on opposite sides of a weld are clad by either different P-, A-, or F-num-bers or material designations or methods, the calibration block shall be clad with the same P-, A-, or F-numbers or ma-terial designations using the same method used on the side of the weld from which the examination will be conducted. When the examination is conducted from both sides of the weld, the calibration block shall provide for calibration for both materials and methods of cladding. For welds clad with a different material or method than the adjoining parent materials, and it is a factor during the examination, the calibration block shall be designed to be representative of this

combination. 当在焊缝两侧母材以不同的 P-No.、A-No.、F-No.、材料号或方法进行堆焊时，校准试块应由相

同的 P-No.、A-No.、F-No.、采用与待检测焊缝侧具有相同堆焊方法之材料号。当从焊缝两侧进行检测时，校

准试块应同时具有对材料和堆焊方法提供校准之功能。对具有不同于相邻母材之材料或方法之堆焊层，且其

在检测期间是一项变量时，则校准试块之设计应能象征该组合。

T-434.1.5 Heat Treatment. The calibration block shall receive at least the minimum tempering treatment re-quired by the material specification for the type and grade. If the calibration block contains welds other than cladding, and the component weld at the time of the examination has been heat treated, the block shall receive the same heat

treatment. 热处理。校准试块应至少承受材料技术规格书中对材料类型和等级所要求之最低回火处理。若校准

试块上除具有堆焊层以外的焊缝，且在实际检测时对物项焊缝进行过热处理时，则该试块应承受相同的热处

理。

T-434.1.6 Surface Finish. The finish on the scanning surfaces of the block shall be representative of the scan-

ning surface finishes on the component to be examined. 表面处理。在试块扫表面上之光洁度应能代表受检测物

项扫查面上的光洁度。

T-434.1.7 Block Curvature. 试块曲率

T-434.1.7.1 Materials With Diameters Greater Than 20 in. (500 mm). For examinations in mate-rials where the examination surface diameter is greater than 20 in. (500 mm), a block of essentially the same curvature,

or alternatively, a flat basic calibration block, may be used. 材料直径 > 20 in. (500 mm)时。对材料表面直径 > 20

in. (500 mm)之检测，可采用具有相同曲率之试块，或可采用平面标准校准试块来取代具曲率之试块。

T-434.1.7.2 Materials With Diameters 20 in. (500 mm) and Less. For examinations in materials where the examination surface diameter is equal to or less than 20 in. (500 mm), a curved block shall be used. Except where otherwise stated in this Article, a single curved basic calibration block may be used for examinations in the range of curvature from 0.9 to 1.5 times the basic calibration block diameter. For example, an 8 in. (200 mm) diameter block may be used to calibrate for examinations on surfaces in the range of curvature from 7.2 in. to 12 in. (180 mm to 300 mm) in diameter. The curvature range from 0.94 in. to 20 in. (24 mm to 500 mm) in diameter requires six curved

blocks as shown in Figure T-434.1.7.2 for any thickness range. 材料直径 ≦ 20 in. (500 mm) 时。对材料表面直径

≦ 20 in. (500 mm)所进行之检测，应采用弧形试块；除在本章另有规定外，单曲弧形基校准试块可应用之检测

曲率范围为标准校准试块直径的 0.9至 1.5倍，例如：直径为 8 in. (200 mm)之试块可应用于曲面直径在 7.2 in.

至 12 in. (180 mm 至 300 mm) 范围内之检测校准上。直径在 0.94 in. 至 20 in. (24 mm 至 500 mm)之曲率范围

内，对任何厚度范围而言都需如图 T-434.1.7.2所示具有六块弧形试块。

T-434.1.7.3 Alternative for Convex Surface. As an alternative to the requirements in T-434.1.7.1 when examining from the convex surface by the straight beam contact technique, Nonmandatory Appendix G may be

used. 凸面之替代方案。当采用直束波直接接触技术在凸面上进行检测时，可采用非强制性附录 G来取代 T-

434.1.7.1之要求。

T-434.2 Non-Piping Calibration Blocks. 非管道用校准试块

T-434.2.1 Basic Calibration Block. The basic calibration block configuration and reflectors shall be as shown in Figure T-434.2.1. The block size and reflector locations shall be adequate to perform calibrations for the beam an-

gle(s) and distance range(s) to be used. 标准校准试块。标准校准试块之外形和反射体应如图 T-434.2.1所示。对

所要采用之探头波束角度和扫查距离范围，试块尺寸和反射体位置应能提供所要进行的校准功能。

T-434.2.2 Block Thickness. The block thickness (T) shall be per Figure T-434.2.1. 试块厚度。试块厚度

(T)应符合图 T-434.2.1之规定。

T-434.2.3 Block Range of Use. When the block thickness ±1 in. (25 mm) spans two weld thickness ranges as shown in Figure T-434.2.1, the block’s use shall be acceptable in those portions of each thickness range covered by 1 in. (25 mm) of the calibration block’ s thickness. As an example, a calibration block with a thickness of 1-1/2 in. (38

mm) could be used for weld thicknesses of 0.5 in. (13 mm) to 2.5 in. (64 mm). 试块应用范围。如图 T-434.2.1所

示，当试块厚度±1 in. (25 mm)横跨两个焊缝厚度范围时，则该试块可应用在被校准试块厚度±1 in. (25 mm)

所涵盖之每一厚度范围内的那些焊缝厚度。例如：1-1/2 in. (38 mm)厚度之校准试块可用于 0.5 in. (13 mm) 至

2.5 in. (64 mm)之焊缝厚度上。

T-434.2.4 Alternate Block. Alternatively, the block may be constructed as shown in Nonmandatory Appen-

dix J, Figure J-431. 替代试块。替代试块可如非强制性附录 J，图 J-431中所示构造。

T-434.3 Piping Calibration Blocks. The basic calibration block configuration and reflectors shall be as shown in Fig-ure T-434.3-1 or the alternate provided in Figure T-434.3-2 where curvature and/or wall thickness permits. The basic calibration block curvature shall be in accordance with T-434.1.7. Thickness, T , shall be ±25% of the nominal thick-ness of the component to be examined. The block size and reflector locations shall be adequate to perform calibrations

for the beam angle(s) and distance range(s) to be used. 管道专用校准试块。参照校准试块之外形和反射体应如图

T-434.3-1所示或在图 T-434.3-2中被所示曲线和/或壁厚之相应关系所许可的替代试块。管道基校准试块曲率

应符合 T-434.1.7的要求。厚度 T 应为受检测物项之标称厚度的±25％。对所要采用之探头波束角度和扫查距

离范围，试块尺寸和反射体位置应能提供所要进行的校准功能。

T-434.4 Weld Metal Overlay Cladding Calibration Blocks.10

焊缝金属上具有堆焊层时之专用校准试块

T-434.4.1 Calibration Blocks for Technique One. The basic calibration block configuration and reflectors shall be as shown in Figure T-434.4.1. Either a side-drilled hole or flat bottom hole may be used. The thickness of the weld metal overlay cladding shall be at least as thick as that to be examined. The thickness of the base material shall be

at least twice the thickness of the weld metal overlay cladding. 技术一所采用之校准试块。标准校准试块之外形和

反射体应如图 T-434.4.1所示可采用横孔或平底孔。焊缝金属上之堆焊层厚度应至少与被测厚度一样。母材厚

度应至少为焊缝金属堆焊层厚度的两倍。

T-434.4.2 Alternate Calibration Blocks for Technique One. Alternately, calibration blocks as shown in Fig-ure T-434.4.2.1 or Figure T-434.4.2.2 may be used. The thickness of the weld metal overlay cladding shall be at least as thick as that to be examined. The thickness of the base material shall be at least twice the thickness of the weld metal

overlay cladding. 技术一所采用之替代校准试块。可采用图 T-434.4.2.1或图 T-434.4.2.2所示的替代校准试

块。焊缝金属上之堆焊层厚度应至少与被检测厚度一样。母材厚度应至少为焊缝金属堆焊层厚度的两倍。

T-434.4.3 Calibration Block for Technique Two. The basic calibration block configuration and reflectors shall be as shown in Figure T-434.4.3. A flat bottom hole drilled to the weld/base metal interface shall be used. This hole may be drilled from the base material or weld metal overlay cladding side. The thickness of the weld metal over-lay cladding shall be at least as thick as that to be examined. The thickness of the base metal shall be within 1 in. (25 mm) of the calibration block thickness when the examination is performed from the base material surface. The thick-ness of the base material on the calibration block shall be at least twice the thickness of the weld metal overlay clad-

ding when the examination is performed from the weld metal overlay cladding surface. 技术二之校准试块。标准校

准试块之外形和反射体应如图 T-434.4.3所示，其中平底孔应钻孔至焊缝/母材之交界面处，而此平底孔可从母

材底侧或焊缝金属上之堆焊层侧钻出，且焊缝金属上之堆焊层厚度应至少与受检测厚度相同。当从母材面进

行检测时，母材厚度应在校准试块厚度的 1 in. (25 mm)以内，而当从焊接金属之堆焊层面进行检测时，校准试

块上之母材厚度应至少为焊缝金属堆焊层厚度的两倍。

Figure T-434.1.7.2 Ratio Limits for Curved Surfaces 图 T-434.1.7.2 弧形曲面之比例限制

Examination Surface Diameter 检测面直径, in. (mm)

T-434.5 Nozzle Side Weld Fusion Zone and/or Adjacent Nozzle Parent Metal Calibration Blocks. 用于焊缝熔

接区接管侧和/或接管周围之母材金属的校准试块

T-434.5.1 Calibration Block. 校准试块

(a) Configuration. The calibration block configuration shall be as shown in Figure T-434.5.1. The block size and reflector locations shall be adequate to perform calibrations to cover the nozzle side weld fusion zone and/or the adjacent nozzle parent metal. If the internal surface of the nozzle is clad before the examination, the ID sur-

face of the calibration block shall be clad. 外形。校准块外形如图 T-434.5.1所示。涉及焊缝熔接区之接管侧和/或

接管周围之母材金属的校准试块，其尺寸和反射体位置应足可胜任校准执行之所需。若接管内表面在检测前

进行了堆焊，则校准试块之 ID面亦应进行相应堆焊。

(b) Block Thickness. The calibration block shall be the maximum thickness of the nozzle wall adjacent

to the nozzle weld plus 3/4 in. (19 mm). 试块厚度。校准试块厚度应为与接管焊缝相邻之接管壁最大厚度再加上

3/4 in. (19 mm)的值。

(c ) Curvature. For examinations of nozzles with an inside diameter (I.D.) equal to or less than 20 in. (500 mm), the contact surface of the calibration block shall have the same curvature or be within the range of to 1.5

times the diameter as detailed in Figure T-434.1.7.2. 曲率。当内径(ID) ≦ 20 in. (500 mm)之接管进行检测时，校

准试块之接触面应具有相同的曲率，或如图T-434.1.7.2所示在直径的 1.5倍范围内。

Basic

Calib

rati

on

Blo

ck E

xam

inati

on

S

urf

ace D

iam

e-

ter基校准试块

检测面直径

, in

(m

m)

Figure T-434.2.1 Nonpiping Calibration Blocks

图 T-434.2.1 非管道用校准块

Notch Dimensions 槽口尺寸, in. (mm)

Notch depth 槽口深度 = 1.6% T to 2.2% T

Notch width 槽口宽度 = 1/4 (6) max.最大 1/4 (6)

Notch length 槽口长度 = 1(25) min.

Weld Thickness 焊缝厚度 (t)

, in. (mm)

Calibration Block Thickness

校准试块厚度 (T), in. (mm) Hole Diameter 孔径

, in. (mm)

Up to 1(25) 3/4 (19) or t 3/32 (2.5)

Over 1(25) through 2 (50) 1-1/2 (38) or t 1/8 (3)

Over 2 (50) through 4 (100) 3 (75) or t 3/16 (5)

Over 4 (100) t ±1 (25) [Note (2)]

GENERAL NOTES: 总注：

(a) Holes shall be drilled and reamed 1.5 in. (38 mm) deep minimum, essentially parallel to the examination surface. 钻孔深度应至小为 1.5 in. (38 mm)，且孔轴线与检测面相平行。

(b) For components equal to or less than 20 in. (500 mm) in diameter, calibration block diameter shall meet the re-

quirements of T-434.1.7.2. Two sets of calibration reflectors (holes, notches) oriented 90 deg from each other shall be

used. Alternatively, two curved calibration blocks may be used. 对直径 ≦ 20 in. (500 mm)之物项进行检测时，校准试块

之直径应符合 T-434.1.7.2 要求。应采用两组取向相互成 90 度之校准反射体(孔、槽口)，或可用两个弧形校准试块来

取代。

(c) The tolerance for hole diameter shall be ±%2 in. (0.8 mm). The tolerance for hole location through the calibration block

thickness (i.e., distance from the examination surface) shall be ±1/8 in. (3 mm). 孔径公差应为±％2 in。(0.8 mm)。贯穿校准块厚度之横孔位置(即孔轴线距检测表面间的距离)的几何公差应为±1/8 in. (3 mm)。

(d) For blocks less than 3/4 in. (19 mm) in thickness, only the 1/2T side-drilled hole and surface notches are required. 对于厚度小于 3/4 in. (19 mm)之试块，仅需 1/2 T 处之横孔和表面槽口。

(e) All holes may be located on the same face (side) of the calibration block, provided care is exercised to locate all the

reflectors (holes, notches) far enough apart to prevent one reflector from affecting the indication from another reflector dur-

ing calibration. Notches may also be in the same plane as the inline holes (see Nonmandatory Appendix J, Figure J -431). As

in Figure J-431, a sufficient number of holes shall be provided for both angle and straight beam calibrations at the 1/4 T,1/2

T, and 3/4 T depths. 只要能保证将所有反射体(孔，槽口)彼此间之距离定位得足够远，以防止一反射体在校准期间受

到另一反射体指示的影响时，则所有孔都可位于校准试块之同一面 (侧面)上。槽口也可能与内联孔处于同一平面(见

非强制性附录 J，图 J-431)。如图 J-431 所示，在 1/4 T，1/2 T 和 3/4 T 深度之斜束和直束校准中，应提供足够的孔数量。

3 T [Note (1)]

6 in. [Note (1)] (150 mm)

1/2 T

[Note (1)]

D [Note (1) ]

1/4 T

1/2 T [Note (1)]

3/4 T

CT

1/2 T

1/2 T [Note (1)]

D [Note (1)] 1/2 T

[Note (1)]

1/2 T

T

Cladding (if present) 堆焊层(若存在的话)

Figure T-434.2.1 (Cont'd) Nonpiping Calibration Blocks

图 T-434.2.1(续)非管道用校准块

GENERAL NOTES (Cont'd):

(f) When cladding is present, notch depth on the cladding side of the block shall be increased by the cladding thickness,

CT (i.e., 1.6% T + CT minimum to 2.2% T + CT maximum). 当存在堆焊层时，试块堆焊层侧的槽口深度应随堆焊层厚

度(CT)(即，1.6％T + CT 最小值至 2.2％T + CT 最大值)而增加。

(g) Maximum notch width is not critical. Notches may be made by EDM or withend mills up to 1/4 in. (6.4 mm) in di-

ameter. 最大槽口宽度并非是关键尺寸。槽口可由 EDM (electric discharge machine 放电加工机)或直径达 1/4 in. (6.4

mm)的立铣刀所铣制而成。

(h) Weld thickness, t, is the nominal material thickness for welds without reinforcement or, for welds with reinforce-ment, the nominal material thickness plus the estimated weld reinforcement not to exceed the maximum permitted by the ref-

erencin Code Section. When two or more base material thicknesses are involved, the calibration block thickness, T, shall be

deter mined by the average thickness of the weld; alternatively, a calibration block based on the greater base material thicknes

may be used provided the reference reflector size is based upon the average weld thickness. 焊缝厚度 t 是不带余高焊缝的

标称材料厚度，至于带余高焊缝，标称材料厚度加上预估余高 (计算有效强度)后之总值不得超过引用规范章节所许

可最大值。当涉及两种或多种母材厚度时，校准试块厚度 T 应由焊缝的平均厚度决定，或者只要参考反射体尺寸是以焊缝厚度平均值为基准时，则亦可采用较厚母材所制作而成的校准试块。

NOTES: 注：

(1) Minimum dimension. 最小尺寸。

(2) For each increase in weld thickness of 2 in. (50 mm) or fraction thereof over 4 in. (100 mm), the hole diameter shall

increase 1/16 in. (1.5 mm). 焊缝厚度每增加 2 in. (50 mm)，孔径应增加 1/16 in. (1.5 mm)，至于其超过 4 in. (100

mm)之分数部分则按比例计算。

(d) Calibration Reflectors. The calibration reflectors shall be side-drilled hole(s) that are in accordance

with the requirements of Figure T-434.2.1 for the nozzle wall thickness. 校准反射体。校准反射器应为符合图 T-

434.2.1接管壁厚度要求之横孔。

(e ) Alternative Blocks. Alternative calibration blocks may be used for similar types of examinations provided the sound path distance(s) to the block’s reflector(s) is (are) within 1/4 in. (6 mm) of what is required and the

side drilled hole(s) is (are) the same or a smaller diameter than what is required. 替代试块。只要试块反射体之声程

(s)在所需要求的 1/4 in. (6 mm)内且横孔(s)与所需直径相同或更小，则替代校准试块可用于相似类型之检测

上。

T-440 MISCELLANEOUS REQUIREMENTS 杂项要求

T-441 IDENTIFICATION OF WELD EXAMINATION AREAS 焊缝检侧区域之标识符

(a) Weld Locations. Weld locations and their identification shall be recorded on a weld map or in an identifi-

cation plan. 焊缝位置。焊缝位置及其标识符应记录在焊缝详图或识别示意图上。

(b) Marking. If welds are to be permanently marked, low stress stamps and/or vibratooling may be used.

Markings applied after final stress relief of the component shall not be any deeper than 3/64 in. (1.2 mm). 标记。若

焊缝要永久标记时，可采用低应力钢印和/或振动压印。物项最终应力消除后所施加之标记不应超过 3/64 in.

(1.2 mm)深。

(c ) Reference System. Each weld shall be located and identified by a system of reference points. The system shall permit identification of each weld center line and designation of regular intervals along the length of the weld. A general system for layout of vessel welds is described in Article 4, Nonmandatory Appendix A; however, a different

system may be utilized provided it meets the above requirements. 参考系统。每一焊缝应通过参考点系统进行定

位和标识。该系统应可识别每一条焊缝中心线，并可沿焊缝长度方向识别正则区间。在第 4章，非强制性附

录 A 中对用于容器焊缝的通用布局系统给出了描述了，然而，若能满足上述要求，则亦可采用不同的系统。

T-450 TECHNIQUES 技术

The techniques described in this Article are intended for applications where either single or dual element search

units are used to produce: 本文中所述技术适用于使用单晶体或双晶体探头所生成的应用程序：

(a) normal incident longitudinal wave beams for what are generally termed straight beam examinations or

纵波垂直入射通常称之为直束波检测法，或

(a) angle beam longitudinal waves, where both refracted longitudinal and shear waves are present in the material un-der examination. When used for thickness measurement or clad examination, these examinations are generally considered to be straight beam examinations. When used for weld examinations, they are generally termed angle

beam examinations or 纵波斜入射时会在被检测材料中折射出纵波和切变波。当用于厚度测量或堆焊层检

测时，这些检测通常被视为是直射束检测。当用于焊接检测时，则通常被称为斜射束检测，或

(b) angle beam shear waves, where incident angles in wedges produce only refracted shear waves in the

material under examination are generally termed angle beam examinations. 在试块中之斜束切变波入射角仅在被检

测材料中折射出切变波时，此现象通常称之为斜束检测。

Figure T-434.3-1 Calibration Block for Piping

图 T-434.3-1 管道用校准试块


(a) The minimum calibration block length, L, shall be 8 in. (200 mm) or 8T, whichever is greater. 最短校准试块长度(L)应为 8 in.

(200 mm)或 8T，以较大者为准。

(b) For O.D. 4 in. (100 mm) or less, the minimum arc length shall be 75% of the circumference. For O.D. greater than 4 in. (100 mm),

the minimum arc length shall be 8 in. (200 mm) or 3T, whichever is greater. 当外径 ≦ 4 in. (100 mm)时，最短弧长应为圆周的

75％。若外径 > 4 in. (100 mm)时，则最短弧长应为 8 in. (200 mm)或 3T，以较大者为准。

(c ) Notch depths shall be from 8% T minimum to 11% T maximum. When cladding is present, notch depths on the cladding side of the block shall be increased by the cladding thickness, CT (i.e., 8% T + CT minimum to 11% T + CT maximum). Notch widths shall be

1/4 in. (6 mm) maximum. Notch lengths shall be 1 in. (25 mm) minimum. 槽口深度应至少为 8％T 至最大 11％T。当有堆焊层时，试

块堆焊层侧之槽口深度应随堆焊层厚度 CT(即，8％T + CT 最小值到 11％T + CT 最大值)之增加而增加。槽口宽度最大为 1/4 in.

(6 mm)。槽口长度最短为 1 in. (25 mm)。

(d) Maximum notch width is not critical. Notches may be made with EDM or withend mills up to 1/4 in. (6 mm) in diameter. 最大槽口宽度并非关键值。槽口可以用 EDM 或直径达 1/4 in. (6 mm)的立铣刀制铣而成。

(e ) Notch lengths shall be sufficient to provide for calibration with a minimum 3 to 1 signal-to-noise ratio. 槽口长度应足以提供至少具有 3:1 信噪比之校准。

(f) Two blocks shall be used when a weld joining two different thicknesses of material is examined and a single block does not sat-

isfy the requirements of T-434.3. 检查当焊缝由两种不同厚度之材料所连接而成时，应采用两块试块，若仅采用单试块是无法符

合 T-434.3之要求的。

(g) When a flat block is used as permitted by T-434.1.7.1, the two axial notches may be omitted and the block width may be reduced

to 4 in. (100 mm), provided the I.D. and O.D. notches are placed on opposite examination surfaces of the block. When cladding is not

present, only one notch is required provided each examination surface is accessible during calibrations. 在 T-434.1.7.1允许之情况下，

且内径和外径槽口均被放置在试块的相反检测面上时，则所采用之平试块可省略两个轴向槽口，并试块宽度可减小到 4 in. (100

mm)；当无堆焊层且在校准期间每个检测面俊是可接近性时，则仅需要一个槽口。

NOTE: 注：

(1) Notches shall be located not closer than 1/2 T or 1/2 in. (13 mm), whichever is greater, to any block edge or to other notches. 槽口不应被定位在距离任何试块边缘或其他槽口小于 1/2 T 或/2 in. (13 mm)(以较大者为准)之范围内。

Contact or immersion techniques may be used. Base materials and/or welds with metallurgical struc-tures producing variable attenuations may require that longitudinal angle beams are used instead of shear waves. Addi-

tionally, computerized imaging techniques may enhance the detectability and evaluation of indications. 当母材和/或焊

Nominal wall thickness

(T) 公称壁厚(T)

Arc length弧长

Note

(1)

Note

(1)

Note (1)

Note (1)

L

Cladding (if present) 堆焊层(如果存在)

缝具有可变衰减冶金结构时，可能需要采用接触式或液浸法技术之纵向射束来替代切变波；此外，计算器化

成像技术可提高指示的可检测性和评估。

Figure T-434.3-2 Alternate Calibration Block for Piping

图 T-434.3-2 管道用替代校准试块


(a) For blocks less than 3/4 in. (19 mm) in thickness, only the 1/2T side drilled hole is required. 试块厚度小于 3/4 in. (19 mm)时，

仅需 1/2T 的横孔。

(b) Inclusion of notches is optional. Notches as shown in Figure T-434.3-1 may be utilized in conjunction with this calibration

block. 所包括之槽口都是非强制性可供选择的。如图 T-434.3-1所示槽口均可与本校准试块结合使用。

(c ) Notch depths shall be from 8% T minimum to 11% T maximum. Notch widths shall be 1/4 in. (6 mm) maximum. Notch lengths

shall be 1 in. (25 mm) minimum. 槽口尺寸限定：深度应在最小 8％T 至最大 11％T 范围内、宽度最大为 1/4 in. (6 mm)、长度最小

为 1 in. (25 mm)。

(d) Notches may be made witheDM or withend mills up to 1/4 in. (6 mm) in diameter. 切口可用 EDM 或直径达 1/4 in. (6 mm)的

立铣刀所铣制而成。

(e ) Notch lengths shall be sufficient to provide for calibration with a minimum 3 to 1 signal-to-noise ratio. 槽口长度应足以提供至

少具有 3:1 信噪比之校准。

(f) Notches shall be located not closer than T or 1-1/2 in. (38 mm), whichever is greater, to any block edge or to other notches. 槽口

不应被定位在距离任何试块边缘或其他槽口小于 T 或 1-1/2 in. (38 mm)(以较大者为准)之范围内。

1/2 T axial hole轴向孔 Circumferential notch环向槽口

3/4 T tangential hole切向孔

[Note (2)]


[Note (2)]

1.5 in. (38 mm) min.

Axial notch 轴向槽口

Length长度 [Note (1)]

1.0 in. (25 mm) min.

1.5 in. (38 nim) niin.

1/4 T axial hole轴向孔 3/4 T axial hole轴向孔


[Note (2)]

1.0 in. (25 mm) or T

堆焊层(如果存在)

Figure T-434.3-2 (Cont'd) Alternate Calibration Block for Piping 管道用替代校准试块

NOTES: 注：

(1 ) Length and arc shall be adequate to provide required angle beam calibration. 长度和弧度应足以提供所需之斜束波校

准。

(2 ) Side-drilled hole diameter, length, and tolerance shall be in accordance with T-434.2.1, as permitted by T-464.1.2. Tangential

side-drilled holes at 1/4T , 1/2T , and 3/4T positions or locations are to have the depth confirmed at one-half of their length. The radius of the

side-drilled hole shall be added to the measured depth to ensure the correct depth. Where thickness does not permit, the required depth of the

side-drilled hole and the location of the tangential position shall be indicated on the block surface. 横孔直径、长度和公差应符合 T-434.2.1

和 T-464.1.2的要求。在 1/4 T、1/2 T 和 3/4 T 位置或切向孔位置应具有其长度的一半深度。横孔半径应加到所测量之深度，以确保

正确的深度。在厚度不允许的情况下，在切向位置所需横孔之深度和位置应显示在试块表面上。

Other techniques or technology which can be demonstrated to produce equivalent or better examination sensitivity and detectability using search units with more than two transducer elements may be used. The demonstra-

tion shall be in accordance with Article 1, T-150(a). 具有两个以上换能器组件之探头的其它方法或技术只要经演

示证明其可产生等效或更佳检测灵敏度和可检测性时，则该方法或技术是可采用的，其中演示要求应符合第 1

章 T-150(a)之规定。

Figure T-434.4.1 Calibration Block for Technique One 图 T-434.4.1 技术一所用之校准试块

T-451 COARSE GRAIN MATERIALS 粗晶体粒材料

Ultrasonic examinations of high alloy steels and high nickel alloy weld deposits and dissimilar metal welds between carbon steels and high alloy steels and high nickel alloys are usually more difficult than ferritic weld examinations. Difficulties with ultrasonic examinations can be caused by an inherent coarse-grained and/or a directionally-oriented structure, which can cause marked variations in attenuation, reflection, and refraction at grain boundaries and velocity changes within the grains. It usually is necessary to modify and/or supplement the provisions of this Article in accord-ance with T-150(a) when examining such welds in these materials. Additional items, which may be necessary, are weld mockups with reference reflectors in the weld deposit and single or dual element angle beam longitudinal wave trans-

ducers.碳钢和高合金钢之焊缝沉积，以及碳钢与高合金钢、高镍合金间之异种焊缝金属的超声波检测通常比铁

素体焊缝检测更加困难；之所以造成超声波检测上之困难度可能是固有的粗晶体粒化和/或定向结构而引起

的，而这些结构可能导致晶体粒边界处的衰减，致使反射和折射以及晶体粒内之声速变化有着显着变化。在

检测此类材料中之焊缝时，通常需根据 T-150(a)对本章之规定进行修改和/或辅助，其中可能需要的附加项目

是对焊缝沉积物中之参考反射体和单晶体或双晶体斜射束纵波换能器的焊接模型。

Axis of weld beads焊道轴

1-1/2 in. (38 mm) min. depth

深度至少为 1-1/2 in. (38 mm)

Weld metal overlay cladding焊缝金属上之堆焊层

1/8 in. (3 mm) flat-bottom hole drilled to weld/base metal interface. 钻至焊缝/母材金属界面处之 1/8 in. (3 mm)平底孔。tolerance公差 = ±1/64 in. (0.4 mm)

1/16 in. (1.5 mm) side-drilled hole's re-

flecting surface at weld/base metal inter-

face. 1/16 in. (1.5 mm)侧横孔在焊缝/

母材金属界面处的反射面。

tolerance 公差 = ±1/64 in. (0.4 mm)

T-452 COMPUTERIZED IMAGING TECHNIQUES 计算机成像技术

The major attribute of Computerized Imaging Techniques (CITs) is their effectiveness when used to characterize and evaluate indications; however, CITs may also be used to perform the basic scanning functions required for flaw detection. Computer-processed data analysis and display techniques are used in conjunction with automatic or semi-automatic scanning mechanisms to produce two and three-dimensional images of flaws, which provides an enhanced capability for examining critical components and structures. Computer processes may be used to quantitatively evalu-ate the type, size, shape, location, and orientation of flaws detected by ultrasonic examination or other NDE methods.

Descriptions for some CITs that may be used are provided in Nonmandatory Appendix E. 计算器成像技术(CIT)之主

要属性是用于描述和评估指示的有效性；然而，CIT 还具有检测缺陷上所需的基本扫查功能。将计算器所处理

之数据分析和显示技术与自动或半自动扫查机制一起使用，以为关键部件和结构之检测缺陷提供二维和三维

图像的放大功能。计算器工艺可通过超声波或其他 NDE 方法所检测到之缺陷类型、大小、形状、位置和方向

进行尺寸评估。在非强制性附录 E 中对一些可能采用到之 CIT 给出了说明。

T-460 CALIBRATION 校准

T-461 INSTRUMENT LINEARITY CHECKS 仪器线性校对

The requirements of T-461.1 and T-461.2 shall be met at intervals not to exceed three months for analog type in-

struments and one year for digital type instruments, or prior to first use thereafter.模拟式与数位式仪器之校对周期应

分别不超过 T-461.1和 T-461.2所要求的三个月和一年，或在第一次使用之前的校对。

T-461.1 Screen Height Linearity. The ultrasonic instrument’s screen height linearity shall be evaluated in accord-

ance with Mandatory Appendix I. 屏幕高线性。超声波仪器的屏幕高度线性度应根据强制性附录 I 进行评估。

T-461.2 Amplitude Control Linearity. The ultrasonic instrument’s Amplitude control linearity shall be evaluated in

accordance with Mandatory Appendix II. 振幅增幅器控制类型之线性度。超声波仪器之振幅增幅器控制类型之

线性度应根据强制性附录 II 进行评估。

T-462 GENERAL CALIBRATION REQUIREMENTS 通用校准要求

T-462.1 Ultrasonic System. Calibrations shall include the complete ultrasonic system and shall be performed prior to

use of the system in the thickness range under examination. 超声波系统。校准应将整个超声波系统计入，且系统

在使用之前应在检测厚度范围内进行校对。

T-462.2 Calibration Surface. Calibrations shall be performed from the surface (clad or unclad; convex or con-

cave) corresponding to the surface of the component from which the examination will be performed. 校准面。应从与

所要进行检测之物项表面相对应的表面(堆焊层或未堆焊层；凸面或凹面)开始进行校准。

T-462.3 Couplant. The same couplant to be used during the examination shall be used for calibration.

耦合剂。应将检测期间所采用之相同耦合剂块应用在校准上。

T-462.4 Contact Wedges. The same contact wedges to be used during the examination shall be used for cali-

bration. 接触试块。应将检测期间所采用之相同接触试块应用在校准上。

T-462.5 Instrument Controls. Any control which affects instrument linearity (e.g., filters, reject, or clipping)

shall be in the same position for calibration, calibration checks, instrument linearity checks, and examination. 仪器调

整。对仪器线性(例如滤波器、带阻滤波器或消波滤波器)产生影响之任何调整都应与检测处于相同的位置来进

行校准，校准校对，仪器线性校对和检查。

T-462.6 Temperature. For contact examination, the temperature differential between the calibration block and examination surfaces shall be within 25°F (14°C). For immersion examination, the temperature difference between the examination and calibration couplants shall not exceed 25°F (14°C) the couplant temperature for calibration shall be

within 25°F (14°C) of the couplant temperature for examination. 温度。在接触式检测时，校准试块和检测面间的

温差应在 25°F (14°C)以内。至于检测和校准耦合剂间之温差不应超过 25°F (14°C)。

Figure T-434.4.2.1 Alternate Calibration Block for Technique One

图 T-434.4.2.1 技术一之替代校准试块

GENERAL NOTE: All flat-bottom holes are 1/8 in. (3 mm) diameter. Tolerances for hole diameter and depth with respect to the weld

metal overlay cladding side of the block are ±1/64 in. (0.4 mm). 总注：所有平底孔之直径为 1/8 in. (3 mm)；而试块堆焊侧之孔直径

公差和深度公差均为±1/64 in. (0.4 mm)。

T-462.7 Distance–Amplitude Correction (DAC). No point on the DAC curve shall be less than 20% of full screen height (FSH). When any portion of the DAC curve will fall below 20% FSH, a split DAC shall be used. The first calibration reflector on the second DAC shall start at 80% ± 5% FSH. When reflector signal-to-noise ratio pre-cludes effective indication evaluation and characterization, a split DAC should not be used. (Article 4, Nonmandatory

Appendix Q provides an example.) 距离 - 振幅校正(DAC)。 DAC 曲线上的点不应小于全屏幕高度(FSH)的

20％。当 DAC 曲线上之任何部分都将低于 20％FSH 时，即应采用分割式 DAC 曲线，并将第二条 DAC 曲线

上的第一次校准反射体应从 80％±5％FSH 开始。当反射体信噪比对有效指示评估和描述产生防碍时，则不应

采用分割式 DAC 曲线(在第 4章，非强制性附录 Q中提供了一个例子)。

T-463 CALIBRATION FOR NONPIPING 非管道校准

T-463.1 System Calibration for Distance–Amplitude Techniques. 采距离 - 振幅法之系统校准

T-463.1.1 Calibration Block(s). Calibrations shall be performed utilizing the calibration block shown in

Figure T-434.2.1. 校准试块。应采用图 T-434.2.1所示之校准试块进行校准。

In cases such as single sided access welds (see T-472.2), the calibration block detailed in Figure T-434.2.1 may not provide the necessary sound path distances to the reference reflectors to provide distance–Amplitude correction (DAC) that will fully cover the area of interest for the straight beam technique. In these cases, a second cali-bration block is required whose thickness (T) and reference reflector locations are based on the sound path distance that

provides for coverage of the area of interest. 在诸如单面有限接近度之焊缝(参见 T-472.2)情况下，在图 T-434.2.1

中所详述之校准试块不能提供到达参考反射体所必要的声程距离，以制备能完整涵盖直束法受检区域之距离

幅度校正曲线(DAC)。在此情况下，第二校准试块是必需的，且其厚度(T)和参考反射体的位置是以能提供完

全涵盖住被检区域条件下之所需声程距离为基准的。

T-463.1.2 Techniques. Nonmandatory Appendices B and C provide general techniques for both angle

beam shear wave and straight beam calibrations. Other techniques may be used. 方法。非强制性附录 B和 C提供了

斜束切变波和直束波两者的通用校准工艺，其他技术也可采用。

The angle beam shall be directed toward the calibration reflector that yields the maximum response

2 in. (50 mm)

CT

3/4 CT 1/2 CT 1/4 CT

2 CT min.

1 in. (typ) [25 mm (typ)]

1 in. (typ)

[25 mm (typ)]

Weld metal overlay cladding 焊缝金属上之堆焊层

Axis of weld beads 焊道轴

in the area of interest. The gain control shall be set so that this response is 80% ± 5% of full screen height. This shall be the primary reference level. The search unit shall then be manipulated, without changing instrument settings, to obtain the maximum responses from the other calibration reflectors at their beam paths to generate the distance–Amplitude correction (DAC) curve. These calibrations shall establish both the distance range calibration and the distance–Ampli-

tude correction. 应让斜束波直接朝向能使校准反射体产生最大灵敏度之方位上。应藉由增益旋钮来进行调整，

以使该灵敏度可达到满屏高度的 80％±5％，并以此作为首要参照灵敏度，然后，为在其声程处获得来自其他

校准反射体之最大灵敏度，探头应在不改变仪器所设置之关键帧下进行扫查，以生成距离-幅度校正(DAC)曲

线。这些校准应对扫描范围校准和距离 - 振幅校正进行验证。

Figure T-434.4.2.2 Alternate Calibration Block for Technique One

图 T-434.4.2.2 技术一之替代校准试块

GENERAL NOTE: All side-drilled holes are 1/16 in. (1.5 mm) diameter. Tolerances for hole diameter and depth with respect to the weld

metal overlay cladding side of the block are ±1/64 in. (0.4 mm). All holes drilled to a minimum depth of 1.5 in. (38 mm). 总注：所有横

孔之直径为 1/16 in. (1.5 mm)。相对在试块堆焊侧之孔直径、深度公差为±1/64 in. (0.4 mm)。最小钻孔深度均为 1.5 in. (38

mm)。

Figure T-434.4.3 Calibration Block for Technique Two

图 T-434.4.3 技术二所采用之校准试块

3/4 CT 1/2 CT 1/4 CT



Axis of weld beads 焊道轴

2 CT min.

CT

2 in. (50 mm)

Weld metal over-lay cladding 焊缝金属上之堆焊层


Weld metal over-lay cladding 焊缝金属上之堆焊层

3/8 in. (10 mm) diameter flat-bottom hole machined to weld/ base metal in-terface, tolerance = ± 1/64 in. (0.4 mm) 3/8 in. (10 mm)直径之平底孔加工至焊缝/母材交界处，直径公差 = ± 1/64 in. (0.4 mm)

Figure T-434.5.1 Calibration Block for Straight Beam Examination of Nozzle Side Weld

Fusion Zone and/or Adjacent Nozzle Parent Metal

图 T-434.5.1焊缝熔接区接管侧和/或接管周围母材金属之直束波检测用校准试块


(a) The thickness, T, of the calibration block (O.D. – I.D.)/2 shall be selected for the maximum nozzle wall

thickness under the nozzle attachment weld. 校准试块厚度 (T = O.D. – I.D.)/2)应是根据接管连接焊缝处所选

择的最大接管壁厚。

(b) Side-drilled holes shall be drilled and reamed the full height, H, of the block. 横孔应是试块在全高状态

下所钻/绞出来的。

(c) The diameter of the side-drilled holes shall be selected for the maximum nozzle wall thickness per (a)

above and Figure T-434.2.1. 应根据上述(a)和图 T-434.2.1 之最大接管壁厚选用横孔直径。

(d) For nozzle side examinations, when the wall thickness of the calibration block exceeds 2 in. (50 mm), ad-

ditional side-drilled holes shall be placed in the block as required in the table below. 对于接管侧检测，当校准

试块之厚度超过 2 in. (50 mm)时，应根据下表要求将另外的横孔放置在试块中。

Calibration Block Wall Thickness 校准

试块之厚度, in. (mm)

Hole Location

孔位置, 5/8T

Hole Location

孔位置, 3/4T

Hole Location

孔位置, 7/8T

> 2 (50) through 3 (75) X

> 3 (75) X X X

T-463.1.3 Angle Beam Calibration. As applicable, the calibration shall provide the following measure-

ments (Nonmandatory Appendices B and M contain general techniques): 斜束波校准。适用时，校准应提供以下测

量(非强制性附录 B 和 M包含了通用技术)：

(a) distance range calibration; 距离范围校准；

(b) distance–Amplitude; 距离 - 振幅；

(c) echo Amplitude measurement from the surface notch in the basic calibration block. 标准校

准试块中之表面槽口回波振幅测量。

When an electronic distance–Amplitude correction device is used, the primary reference responses

𝑂𝐷−𝐼𝐷

2 = T

𝑂𝐷 − 𝐼𝐷

4

Flat block surface for diameters ≧ 20 in. (500 mm) 直径 ≥ 20 in. (500 mm)时所采用之平试块表面

ID Nozzle接管 OD

1-1/2 in. (38 mm) [H]

Clad thickness 堆焊厚度 (if present 若存在时)

3/4 in. (19 mm) minimum

1 in. (25 mm) minimum



from the basic calibration block shall be equalized over the distance range to be employed in the examination. The re-

sponse equalization line shall be at a screen height of 40% to 80% of full screen height. 当使用电子式距离 - 振幅校

正装置时，源自标准校准试块所建立之首要参照电平应以检测中所采使用之距离范围进行等量化，以使灵敏

度补偿线在屏幕所显示之高度达到满屏高度的 40％至 80％之范围间。

T-463.1.4 Alternative Angle Beam Calibration. When a vessel or other component is made with a thick-ness of 1/2 in. (13 mm) or less and a diameter equal to or less than 20 in. (500 mm), the angle beam system calibrations

for distance–Amplitude techniques may be performed using the requirements of T-464.1.1 and T-464.1.2.另一种斜束

波校准替代方法。当容器或其他物项以 1/2 in. (13 mm)或更小厚度所制成，且直径 ≦ 20 in. (500 mm)时，距离

- 振幅法之的斜束波系统校准可采用 T-464.1.1和 T-464.1.2之要求进行。

T-463.1.5 Straight Beam Calibration. The calibration shall provide the following measurements (Non-

mandatory Appendix C gives a general technique): 直束波校准。校准应提供以下测量(非强制性附录 C 给出了通

用技术)：

(a) distance range calibration; and 被检测范围；和

(b) distance–Amplitude correction in the area of interest. 距离 - 振幅校正。

When an electronic distance–Amplitude correction device is used, the primary reference responses from the basic calibration block shall be equalized over the distance range to be employed in the examination. The re-

sponse equalization line shall be at a screen height of 40% to 80% of full screen height. 当使用电子式距离 - 振幅校

正装置时，源自标准校准试块所建立之首要参照电平，应以检测中所采使用之距离范围进行等量化，以使灵

敏度补偿线在屏幕所显示之高度为满屏高度的 40％至 80％之范围间。

T-463.2 System Calibration for Nondistance–Amplitude Techniques. Calibration includes all those actions re-quired to assure that the sensitivity and accuracy of the signal Amplitude and time outputs of the examination system (whether displayed, recorded, or automatically processed) are repeated from examination to examination. Calibration may be by use of basic calibration blocks with artificial or discontinuity reflectors. Methods are provided in Non-mandatory Appen- dices B and C. Other methods of calibration may include sensitivity adjustment based on the exami-

nation material, etc. 无延时振幅法之系统校准。为确保检测系统(无论是显示、记录还是自动处理)之输出讯号

振幅和时间的灵敏度和精度，所有涉及这些操作之校准，其在整个检测过程中都要是可反复的。校准可采用

具有人造的或具有不连续反射体之标准校准试块，校准方法在非附录 B 和 C 中给出；可能因涉及检测材料之

灵敏度调整等而采用其他校准方法。

T-464 CALIBRATION FOR PIPING 管道校准

T-464.1 System Calibration for Distance–Amplitude Techniques. 采距离 - 振幅法之系统校准。

T-464.1.1 Calibration Block(s). Calibrations shall be performed utilizing the calibration block shown in

Figure T-434.3-1 or the alternate provided in Figure T-434.3-2. 校准试块。应采用图 T-434.3-1所示校准试块或图

T-434.3-2中所提供之替代试块进行校准。

T-464.1.2 Angle Beam Calibration With Notches (Figure T-434.3-1). The angle beam shall be directed toward the notch that yields the maximum response. The gain control shall be set so that this response is 80% ± 5% of full screen height. This shall be the primary reference level. The search unit shall then be manipulated, without chang-ing instrument settings, to obtain the maximum responses from the calibration reflectors at the distance increments nec-essary to generate a three-point distance–Amplitude correction (DAC) curve. Separate calibrations shall be established for both the axial and circumferential notches. These calibrations shall establish both the distance range calibration and

the distance–Amplitude correction. 带槽口之斜束波校准(图 T-434.3-1)。应让斜束波直接朝向能使槽口产生最大

回波响应讯息之方位上。应藉由增益旋钮来进行设定，以使该灵敏度可达到满屏高度的 80％±5％，并以此作

为首要参照灵敏度，然后，为获得来自校准反射体的最大回波响应讯息，探头应在不改变仪器所设置之关键

帧下进行扫查，以生成三点距离幅度校正(DAC)曲线所需的距离增量。应分别为轴向和环向槽口建立各自的

校准曲线。这些校准应对扫描范围校准和距离 - 振幅校正进行验证。

T-464.1.3 Calibration With Side-Drilled Holes (Figure T-434.3-2). The angle beam shall be directed toward the side-drilled hole that yields the maximum response. The gain control shall be set so that this response is 80% ±5% of full screen height. This shall be the primary reference level. The search unit shall then be manipulated,

without changing the instrument settings, to obtain the maximum responses from the calibration reflectors at the dis-tance increments necessary to generate up to a 3T distance–Amplitude correction (DAC) curve, where T is the thick-ness of the calibration block. Next, position the search unit for the maximum response for the surface notch positions and mark the peaks on the screen for consideration when evaluating surface reflectors. Separate calibrations shall be established for both the axial and circumferential scans. These calibrations shall establish both the distance range cali-

bration and the distance–Amplitude correction. 带横孔之校准(图 T-434.3-2)。应让斜束波直接朝向能使横孔产生

最大灵敏度之方位上。应藉由增益旋钮来进行调整，以使该灵敏度可达到满屏高度的 80％±5％，并以此作为

首要参照灵敏度，然后，为获得来自校准反射体的最大灵敏度，探头应在不改变仪器所设置之关键帧下进行

扫查，以生成高达 3T 距离幅度校正(DAC)曲线所需的距离增量，其中 T是校准试块之厚度；接下来，将探头

定位在表面槽口具有最大响应灵敏度处，并在屏幕上标出峰值，以便在评估表面反射体时进行补偿。应分别

为轴向和环向扫查建立各自的校准曲线。这些校准应对扫描范围校准和距离 - 振幅校正进行验证。

T-464.1.4 Straight Beam Calibration. When required, straight beam calibrations shall be performed to the requirements of Nonmandatory Appendix C using the side-drilled hole alternate calibration reflectors of T-434.1.1.

This calibration shall establish both the distance range calibration and the distance–Amplitude correction. 直束法校

准。当需要时，直束法校准应按非强制性附录 C 之要求，采用 T-434.1.1之横孔备用校准反射体来进行。该校

准应对扫描范围校准和距离 - 振幅校正进行验证。

T-464.2 System Calibration for Nondistance–Amplitude Techniques. Calibration includes all those actions re-quired to assure that the sensitivity and accuracy of the signal Amplitude and time outputs of the examination system (whether displayed, recorded, or automatically processed) are repeated from examination to examination. Calibration may be by use of basic calibration blocks with artificial or discontinuity reflectors. Methods are provided in Non-mandatory Appen- dices B and C. Other methods of calibration may include sensitivity adjustment based on the exami-

nation material, etc. 无延时振幅法之系统校准。为确保检测系统(无论是显示、记录还是自动处理)之输出讯号

振幅和时间的灵敏度和精度，所有涉及这些操作之校准，其在整个检测过程中都要是可反复的。校准可采用

具有人造的或具有不连续反射体之标准校准试块，校准方法在非附录 B 和 C 中给出；可能因涉及检测材料之

灵敏度调整等而采用其他校准方法。

T465 CALIBRATION FOR WELD METAL OVERLAY CLADDING

焊缝金属堆焊层之校准

T-465.1 Calibration for Technique One. Calibrations shall be performed utilizing the calibration block shown in Fig-ure T-434.4.1. The search unit shall be positioned for the maximum response from the calibration reflector. When a side-drilled hole is used for calibration, the plane separating the elements of the dual element search unit shall be posi-tioned parallel to the axis of the hole. The gain control shall be set so that this response is 80% ± 5% of full screen

height. This shall be the primary reference level. 校准技术一。应使用图 T-434.4.1所示之校准试块进行校准。探

头应定位在校准反射体具有最大灵敏度处。当横孔用于校准时，双晶体探头之单元分割面应以与孔轴线相平

行之方式定位。应藉由增益旋钮来进行调整，以使该灵敏度可达到满屏高度的 80％±5％，并以此作为首要参

照灵敏度

T-465.2 Calibration for Technique Two. Calibrations shall be performed utilizing the calibration block shown in Fig-ure T-434.4.3. The search unit shall be positioned for the maximum response of the first resolvable indication from the bottom of the calibration reflector. The gain shall be set so that this response is 80% ± 5% of full screen height. This

shall be the primary reference level. 校准技术二。应采用图 T-434.4.3所示之校准试块进行校准。探头应定位在

能从校准反射体底部获得第一次可辨识讯号之最大灵敏度处。应调整增益以使该灵敏度可达到满屏高度的

80％±5％，并以此作为首要参照灵敏度。

T-465.3 Alternate Calibration for Technique One. Calibrations shall be performed utilizing the calibration blocks

shown in Figure T-434.4.2.1 or Figure T-434.4.2.2. The calibration shall be performed as follows: 校准技术一之替代

方案。应用用图 T-434.4.2.1或图 T-434.4.2.2所示之校准试块进行校准。校准应执行如下：

(a) The search unit shall be positioned for maximum response from the reflector, which gives the highest Am-

plitude. 探头应定位在能使反射体振幅具有最大灵敏度处。

(b) When the block shown in Figure T-434.4.2.2 is used, the plane separating the elements of the dual element

search unit shall be positioned parallel to the axis of the holes. 当采用图 T-434.4.2.2所示之试块时，双晶体探头之

单元分割面应平行于孔轴线。

(c) The gain shall be set so that this response is 80% ± 5% of full screen height. This shall be the primary refer-

ence level. Mark the peak of the indication on the screen. 应调整增益以使该灵敏度可达到满屏高度的 80％±5％，

并以此作为首要参照灵敏度。将指示峰值标记在屏幕上。

(d) Without changing the instrument settings, position the search unit for maximum response from each of the

other reflectors and mark their peaks on the screen. 探头在不改变仪器所设置之关键帧下进行扫查，以获得每一替

代反射体的最大灵敏度，并在屏幕上标记其峰值。

(e) Connect the screen marks for each reflector to provide a DAC curve. 连接每一反射体之屏幕标记以制备

成 DAC 曲线。

T-466 CALIBRATION FOR NOZZLE SIDE WELD FUSION ZONE AND/OR ADJA-

CENT NOZZLE PARENT METAL 用于焊缝熔接区接管侧和/或接管周围母材金属之

校准

The number of calibration holes used depends upon the requirements for the examination. If only the nozzle side

fusion zone is to be examined, then only a single side-drilled hole at the nozzle wall thickness needs to be used. 校准孔

之使用数量取决于检测要求。若仅检测接管侧溶合区，则在采用接管壁厚处仅需一个单一的横孔。

(a) Single Hole. The response from a single side drilled hole shall be set at 80% ± 5% of full screen height.

This is the primary reference level. 单孔。来自单横孔的回波灵敏度应设置为满屏高度的 80％±5％，并以此作

为首要参照灵敏度。

(b) Multiple Holes. The straight beam shall be directed toward the calibration reflector that yields the max-imum response. The gain control shall be set so that this response is 80% ± 5% of full screen height. This shall be the primary reference level. The search unit shall then be manipulated, without changing instrument settings, to obtain the maximum responses from the other hole position(s) to generate a distance–Amplitude correction (DAC) curve.

多孔。应让直束波直接朝向能使校准反射体产生最大灵敏度之方位上。应藉由增益旋钮来进行设定，以使该

灵敏度可达到满屏高度的 80％±5％，并以此作为首要参照灵敏度；然后，为获得来自另一孔位置的最大灵敏

度，探头应在不改变仪器所设置之关键帧下进行扫查，以生成距离 - 振幅校正(DAC)曲线。

T-467 CALIBRATION CONFIRMATION 校准确认

T-467.1 System Changes. When any part of the examination system is changed, a calibration check shall be made on the basic calibration block to verify that distance range points and sensitivity setting(s) satisfy the requirements of T-

467.3. 系统变化。当检测系统之任何部分产生改变时，应在标准校准试块上进行校准校对，以验证距离范围

基本点和灵敏度设置是否满足 T-467.3的要求。

T-467.2 Calibration Checks. A calibration check on at least one of the reflectors in the basic calibration block or a check using a simulator shall be performed at the completion of each examination or series of similar examinations, and when examination personnel (except for automated equipment) are changed. The distance range and sensitivity

values recorded shall satisfy the requirements T-467.3. 校准校对。在每次检测或一系列类似检测完成时，以及检

测人员(自动化设备除外)更换时，应对标准校准试块中之至少一个反射体进行校准校对或采用模拟试件进行校

对。所记录之距离范围和灵敏度值应满足 T-467.3的要求。

NOTE: Interim calibration checks between the required initial calibration and the final calibration check may be performed. The decision to perform interim calibration checks should be based on ultrasonic instrument stability (analog vs. digital), the risk of having to conduct reexaminations, and the benefit of not performing interim calibration

checks. 注：可在首次校准和最进一次校准之间执行所需的临时校准。决定是否执行临时校准校对应根据超声

仪器的稳定性(模拟与数位)、进行再检测的风险，以及不进行临时校准校对的好处来确认。

T-467.2.1 Simulator Checks. Any simulator checks that are used shall be correlated with the original calibra-tion on the basic calibration block during the original calibration. The simulator checks may use different types of cali-bration reflectors or blocks (such as IIW) and/or electronic simulation. However, the simulation used shall be identifia-

ble on the calibration sheet(s)▲. The simulator check shall be made on the entire examination system. The entire system

does not have to be checked in one operation; however, for its check, the search unit shall be connected to the ultra-sonic instrument and checked against a calibration reflector. Accuracy of the simulator checks shall be confirmed, us-ing the basic calibration block, at the conclusion of each period of extended use, or every three months, whichever is

less. 模拟试件校对。在首要校准过程中所采使用之任何模拟试件校对应与标准校准试块上的首要校准相关

联；模拟试件校对可采用不同类型之校准反射体、试块(例如 IIW)和/或电子仿真，然而，所采用之模拟应在校

准片上进行识别。仿真试件校对应在整个检测系统上进行，但不需在一个操作中校对整个系统，然而，为了

校对，应将探头连接到超声波仪器上并对校准反射体进行校对。在延长使用期间或每三个月结束时，以较小

者为准，模拟试件校对的准确性应采用标准校准试块确认。

▲ Every spectrometer with a calibration sheet listing the wavelength calibration coefficients (four float-ing-point values which can be used to derive the wavelength associated with each pixel on the detector), as well as a summary of the spectral lines used to generate those coefficients.

T-467.3 Confirmation Acceptance Values. 确认允收值

T-467.3.1 Distance Range Points. If any distance range point has moved on the sweep line by more than 10% of the distance reading or 5% of full sweep, whichever is greater, correct the distance range calibration and note the correction in the examination record. All recorded indications since the last valid calibration or calibration check shall

be reexamined and their values shall be changed on the data sheets or re-recorded. 距离范围基本点。如果任何距离

范围基本点在扫描在线之移动若超过距离读数的 10％或全个扫查扫描线的 5％(以较大者为准)时，则更正距离

范围校准，并注释检测记录的勘误表。自上次有效校准或校准校对以来之所有记录在案之指示应重新检测，

并在数据单上更改其值或重新记录。

T-467.3.2 Sensitivity Settings. If any sensitivity setting has changed by more than 20% or 2 dB of its Ampli-tude, correct the sensitivity calibration and note the correction in the examination record. If the sensitivity setting has decreased, all data sheets since the last valid calibration check shall be marked void and the area covered by the voided data shall be reexamined. If the sensitivity setting has increased, all recorded indications since the last valid calibration

or calibration check shall be reexamined and their values shall be changed on the data sheets or re-recorded. 灵敏度设

置关键帧。若任何灵敏度所设置之幅度变化超过 20％或 2 dB 时，请更正灵敏度校准，并将该修正注释在检测

记录中之勘误表上。若灵敏度设置关键帧下降，则自上次有效校准校对以来的所有数据单都应被标记为无

效，并且重新检测无效数据所涉及的区域。若灵敏度设置增加，自上次有效校准或校准校对以后之所有记录

在案指示应重新检测，并在数据表上重新记录其新值。


T-471 GENERAL EXAMINATION REQUIREMENTS 通用检测要求

T-471.1 Examination Coverage. The volume to be scanned shall be examined by moving the search unit over the

scanning surface so as to scan the entire examination volume for each required search unit. 检测范围。为使每ㄧ所需

探头得以扫查到整个额，因此额扫查应藉由探头在扫查表面上的移动来进行检测。

(a) Each pass of the search unit shall overlap a minimum of 10% of the transducer (piezoelectric element) dimension parallel to the direction of scan indexing. As an alternative, if the sound beam dimension parallel to the di-rection of scan indexing is measured in accordance with Nonmandatory Appendix B, B-466, Beam Spread measure-

ment rules, each pass of the search unit may provide overlap of the minimum beam dimension determined. 探头在每

次扫查行程中，应至少有换能器(压电组件)尺寸在平行于扫描索引法方向之投影尺寸的 10％重迭率。作为替

代方案，若平行于扫描索引法方向之声束尺寸是按非附录 B《B-466波束扩展测量规则》进行测量时，则探头

在其每次扫查行程即可提供所规定之最小重迭波束尺寸。

(b) Oscillation of the search unit is permitted if it can be demonstrated that overlapping coverage is provided.

若探头之演示结果能证明可提供足够的重迭率，则探头在其行程中的摆动是可被允许的。

T-471.2 Pulse Repetition Rate. The pulse repetition rate shall be small enough to assure that a signal from a reflector located at the maximum distance in the examination volume will arrive back at the search unit before the next pulse is

placed on the transducer. 脉冲反复速率。脉冲反复速率应小至足以确保在额检测中最远距离处之反射体回波讯

号在下一次脉冲发生器所产生的电脉冲施加到换能器之前已返回到探头。

T-471.3 Rate of Search Unit Movement. The rate of search unit movement (scanning speed) shall not exceed 6 in./s

(150 mm/s), unless: 探头移动速率。探头之移动速率(扫描速度)不应超过 6 in./s (150 mm/s)，除非：

(a) the ultrasonic instrument pulse repetition rate is sufficient to pulse the search unit at least six times within the time necessary to move one-half the transducer (piezoelectric element) dimension parallel to the direction of the

scan at maximum scanning speed; or, 超声波仪器之脉冲反复速率足以使探头在平行于扫描方向上以最大扫查速

度移动二分之一换能器(压电组件)尺寸下之所需时间内至少能产生六次脉冲；要么，

(b) a dynamic calibration is performed on multiple reflectors, which are within 2 dB of a static calibration and

the pulse repetition rate meets the requirements of T-471.2. 对多个反射体进行动态校准，而这些反射体在静态校

准下是在 2 dB 内的，且脉冲反复速率符合 T-471.2的要求

T-471.4 Scanning Sensitivity Level. 扫查灵敏度水平

T-471.4.1 Distance–Amplitude Techniques. The scanning sensitivity level shall be set a minimum11 of 6 dB higher than the reference level gain setting or, when a semi-automatic or automatic technique is used, it may be set at

the reference level.距离-幅度技术。扫查灵敏度电平设定应至少比参照电平设定高出 6 dB，或者在采用半自动

或自动技术时，可将扫查灵敏度设定在参照电平处。

T-471.4.2 Nondistance–Amplitude Techniques. The level of gain used for scanning shall be appropriate for the configuration being examined and shall be capable of detecting the calibration reflectors at the maximum scanning

speed. 无延时幅度法。用于扫查之增益水平应适用于受检轮廓，并且应具有以最大扫查速度显示各校准反射体

之能力。

T-471.5 Surface Preparation. When the base material or weld surface interferes with the examination, the base mate-

rial or weld shall be prepared as needed to permit the examination. 表面制备。当母材或焊缝表面会对检测产生干

扰时，应根据实际需求制备母材或焊缝表面，以便进行检测。

T-471.6 Recording of Ultrasonic Data. The ultrasonic data for the semi-automatic and automatic techniques shall be recorded in an unprocessed form with no thresholding. Gating of the data solely for the recording of the examination

volume is permitted, provided a scan plan is utilized to determine the gate settings to be used. 记录超声波数据。半自

动和自动化技术之超声波数据应记录在未经处理之无阈值格式中。只要扫查计划能被用来确定所要采用的选

通电路设置关键帧，则仅做为了检测额记录之选通电路数据是可允许的。

T-472 WELD JOINT DISTANCE–AMPLITUDE TECHNIQUE 焊接接头距离 - 振幅技术

When the referencing Code Section specifies a distance–Amplitude technique, weld joints shall be scanned with an angle beam search unit in both parallel and transverse directions (4 scans) to the weld axis. Before performing the angle beam examinations, a straight beam examination shall be performed on the volume of base material through which the angle beams will travel to locate any reflectors that can limit the ability of the angle beam to examine the weld volume. Nonmandatory Appendix I describes a method of examination using multiple angle beam search units.

当引用规范章节指定距离 - 振幅技术时，焊接接头应在与焊缝轴相平行和横切之两方向(4次扫描)中以斜束波

探头进行扫查。在进行斜束波检测之前，斜束波在母材上之扫查移动行程过程中，任何会对斜束波焊缝检测

能力造成影响或限制之反射体，应以直束波对该额母材进行检测，以对所述反射体先行定位。非强制性附录

附录 I 对采用斜束波探头之检测方法给出了相关描述。

T-472.1 Angle Beam Technique. 斜束波技术

T-472.1.1 Beam Angle. The search unit and beam angle selected shall be 45 deg or an angle appropriate for the configuration being examined and shall be capable of detecting the calibration reflectors, over the required angle beam

path. 波束角度。所选用之探头和波束角度应为 45º或适用于被检测轮廓之角度，且应具有在所要求之斜束波

声程下检出校准反射体的能力。

T-472.1.2 Reflectors Parallel to the Weld Seam. The angle beam shall be directed at approximate right angles to the weld axis from both sides of the weld (i.e., from two directions) on the same surface when possible. The search unit shall be manipulated so that the ultrasonic energy passes through the required volume of weld and adjacent base

material. 平行于焊缝轴之反射体。在可能的情况下，斜束波应在相同面上由焊缝两侧(即从两个方向)以约与焊

接轴线成垂直之方式操控探头，以使超声波能量通过所需的额焊缝和相邻母材。

T-472.1.3 Reflectors Transverse to the Weld Seam. 与焊缝轴线成横切向之反射体

(a) Scanning With Weld Reinforcement. If the weld cap reinforcement is not machined or ground flat, the examination shall be performed from the base material on both sides of the weld cap reinforcement. While scanning parallel to the weld axis, the angle beam shall be directed from 0 deg to 60 deg with respect to the weld axis in both

axial directions, with the angle beam passing through the required examination volume. 有焊缝余高之扫查。若焊缝

余高未加工或磨平，则应从焊缝余高两侧之母材进行检测；且当以平行于焊缝轴线之方式进行扫查时，斜束

波应在(焊缝两侧之阴阳轴向)两个轴向上相对于焊缝轴线从 0度指向 60度，使斜束波通过所需的额检测范

围。

(b) Scanning Without Weld Reinforcement. If the weld cap reinforcement is machined or ground flat, the examination shall be performed on the weld. While scanning, the angle beam shall be directed essentially parallel to the weld axis in both axial directions. The search unit shall be manipulated so that the angle beam passes through the

required examination volume. 无焊缝余高之扫查。如若焊缝余高被加工或磨平，则应在焊缝上进行检测，扫查

时，斜束波应在两个轴向上以大致与焊缝轴线成平行之定位方式操控探头，以使斜束波通过所需的额检测范

围。

T-472.2 Single-Sided Access Welds. Welds that can not be fully examined from two directions per T-472.1.2 using the angle beam technique shall also be examined to the maximum extent possible with a straight beam technique ap-plied from an adjacent base material surface. This may be applicable to vessel corner and tee joints, nozzle and man-way manhole neck to shell or head joints, pipe to fittings, or branch connections. The area(s) of single-sided access

and, if applicable, the extent of the limit coverage shall be noted in the examination report. 仅能从单侧接近之焊缝。

按 T-472.1.2采用斜束波技术却无法从两个方向完全检侧之焊缝也应通过从相邻母材面所施加之直束波技术进

行最大程度的检测；这可适用于容器的偶角处、T-接头、接管和人孔焊颈部至壳体或封头接头处、公称管至

配件或支管之连接处。单侧可接近区域(如适用)，其有限涵盖范围应在检查报告中注明。

T-472.3 Inaccessible Welds. Welds that cannot be examined from at least one side (edge) using the angle beam tech-nique shall be noted in the examination report. For flange welds, the weld may be examined with a straight beam or

low angle longitudinal waves from the flange face provided the examination volume can be covered. 无法接近之焊

缝。从至少一侧(边缘)采用斜束波技术而无法检测之焊缝应在检查报告中注明；至于法兰焊缝，只要额检测范

围可被涵盖，则可采用直束波或小角度纵波技术从法兰面进行检测。

T-473 WELD METAL OVERLAY CLADDING TECHNIQUES 焊缝金属堆焊层技术

The techniques described in these paragraphs shall be used when examinations of weld metal overlay cladding are required by the referencing Code Section. When examination for lack of bond and weld metal overlay cladding flaw indications is required, Technique One shall be used. When examination for lack of bond only is required, Technique

Two may be used. 当引用规范章节要求对焊缝金属堆焊层进行检测时，应采用下列段落中所述技术。若需对焊

接不良和焊缝金属堆焊层缺陷指示进行检测时，应采用技术一；而仅需检测缺陷时，则可采用技术二。

T-473.1 Technique One. The examination shall be performed from the weld metal overlay clad surface with the plane separating the elements of the dual element search unit positioned parallel to the axis of the weld bead. The

search unit shall be moved perpendicular to the weld direction. 技术一。双晶体探头之单元分割平面应定位在与焊

道轴相平之位置上，并从焊缝金属堆焊层表面进行检测。探头应在与焊缝轴成垂直之方向上移动。

T-473.2 Technique Two. The examination may be performed from either the weld metal overlay clad or unclad sur-

face and the search unit may be moved either perpendicular or parallel to the weld direction. 技术二。可从焊接缝金

属堆焊层表面或未堆焊表面进行检测，且探头可在与焊缝轴成垂直或平行于焊接之方向上移动。

T-474 NONDISTANCE–AMPLITUDE TECHNIQUES 无延时振幅技术

The number of angles and directions of the scans, for reflectors both parallel and transverse to the weld axis, shall demonstrate the ability to detect the minimum size rejectable discontinuities in the referencing Code Section ac-ceptance standards. The detailed techniques shall be in conformance with the requirements of the referencing Code

Section. 对平行于和横切于焊接轴线的反射体，扫查角度和方向之数值应对引用规范章节允收准则中可拒收不

连续性之最小尺寸进行演示，以证实具有检出该最小尺寸的能力。详细技术应符合引用规范章节的要求。

T-475 NOZZLE SIDE WELD FUSION ZONE AND/ OR ADJACENT NOZZLE PAR-

ENT METAL 焊缝熔接区接管侧和/或接管周围母材金属

T-475.1 Search Unit Location. When the referencing Code Section specifies that an ultrasonic examination be per-formed to examine either the nozzle side weld fusion zone and/or the adjacent nozzle parent metal, a straight beam ex-

amination shall be conducted from the inside nozzle surface. T-475.1探头定位。当引用规范章节要求进行超声波检

测以对焊缝熔接区接管侧和/或接管周围母材金属进行检测时，应从接管内表面以直束波进行检测。

T-475.2 Examination. The general examination requirements of T-471 are applicable. The full circumference of the nozzle shall be scanned to cover the entire nozzle side fusion zone of the weld plus 1 in. (25 mm) beyond the weld toes. The search unit may be moved either circumferentially around or axially across the examination zone. The screen range shall cover as a minimum, 1.1 times the full thickness of the nozzle wall. Nozzles that cannot be fully examined

(e.g., restricted access that prevents hand placement of the search unit) shall be noted in the examination report. 检测。

T-471之通用检测要求是适用的。应对接管的整个周长进行扫查，以覆盖整个焊缝熔接区以及超过焊缝焊趾 1

in. (25 mm)之母材，而探头可以沿着检测区域之环向或轴向移动；屏幕范围应至少能涵盖接管壁全厚度的 1.1

倍；在检测报告中应批注无法完全检测之接管(例如，阻碍探头手动安置的禁止进入区)。

T-477 POST-EXAMINATION CLEANING 检测后清洁

When post-examination cleaning is required by the procedure, it should be conducted as soon as practical after

evaluation and documentation using a process that does not adversely affect the part. 当要求进行检测后清洁时，应

在评估和文件编制之后以不会对物项产生不利影响之方法尽快进行清洁。



It is recognized that not all ultrasonic reflectors indicate flaws, since certain metallurgical discontinuities and geo-metric conditions may produce indications that are not relevant. Included in this category are plate segregates in the heat-affected zone that become reflective after fabrication. Under straight beam examination, these may appear as spot or line indications. Under angle beam examination, indications that are determined to originate from surface conditions (such as weld root geometry) or variations in metallurgical structure in austenitic materials (such as the automatic-to-manual weld clad interface) may be classified as geometric indications. The identity, maximum Amplitude, location, and extent of reflector causing a geometric indication shall be recorded. [For example: internal attachment, 200% DAC, 1 in. (25 mm) above weld center line, on the inside surface, from 90 deg to 95 deg] The following steps shall be

taken to classify an indication as geometric: 由于某些冶金不连续性和几何条件可能会产生不相关的指示，因此

所有的超声波反射体回波讯号并非都表示是一种缺陷，在此类别中的反射体包括了在热影响区域中的钢板夹

层，其在制造后转为反射；在直束波检测下，这些反射体可能会显示为斑点状或线条状指示；在斜束波检测

下，由表面条件(例如焊缝根部几何形状)或奥氏体材料(例如自动手动焊接包层界面)冶金结构变化所引起之指

示可将之分类为几何指示。应记录引起几何指示之反射体的识别、最大振幅、位置和程度[例如：内部附件，

200％ DAC，在内表面焊缝中心线上方之 1 in. (25 mm)处，90度至 95度]。应采取以下步骤将指示分类为几何

指示：

(a) Interpret the area containing the reflector in accordance with the applicable examination procedure. 根据

所适用之检测规程对对含有反射体之区域进行解释。

(b) Plot and verify the reflector coordinates. Prepare a cross-sectional sketch showing the reflector position

and surface discontinuities such as root and counterbore. 绘制并验证反射体坐标。制备一个横截面示意图，以显

示反射体的位置和表面不连续性(如焊缝根部和沈孔)。

(c) Review fabrication or weld preparation drawings. Other ultrasonic techniques or nondestructive exami-

nation methods may be helpful in determining a reflector’s true position, size, and orientation. 审查制造或焊接制备

图纸。其他超声技术或无损检测法能有助于确定反射体的真实位置、大小和方向。

T-482 EVALUATION LEVEL 评估等级

T-482.1 Distance–Amplitude Techniques. All indications greater than 20% of the reference level shall be investi-

gated to the extent that they can be evaluated in terms of the acceptance criteria of the referencing Code Section. 距离 -

振幅技术。对所有大于参照电平 20％以上之指示应进行调查，其方法是根据引用规范章节之允收准则来进行

评估的。

T-482.2 Nondistance–Amplitude Techniques. All indications longer than 40% of the rejectable flaw size shall be investigated to the extent that they can be evaluated in terms of the acceptance criteria of the referencing Code Section.

无延时振幅技术。对所有长度大于可拒收缺陷尺寸 40％之指示应按照引用规范章节之允收准则来进行评估。

T-483 EVALUATION OF LAMINAR REFLECTORS 层状反射体之评估

Reflectors evaluated as laminar reflectors in base material which interfere with the scanning of examination vol-umes shall require the angle beam examination technique to be modified such that the maximum feasible volume is

examined, and shall be noted in the record of the examination (T-493). 在于母材中被评估为层状之反射体，若对额

检测之扫描会产生干扰时，就应对斜束波检测技术进行调整，并应在检测记录中加以批注(T-493)。

T-484 ALTERNATIVE EVALUATIONS 其他评估方案

Reflector dimensions exceeding the referencing Code Section requirements may be evaluated to any alternative

standards provided by the referencing Code Section. 超过引用规范章节要求之反射体尺寸可被评估为是按引用规

范章节所规定之任何其他标准来进行评估的。

T-490 DOCUMENTATION 文件

T-491 RECORDING INDICATIONS 记录指示

T-491.1 Nonrejectable Indications. Nonrejectable indications shall be recorded as specified by the referencing Code

Section. 不可拒收之指示。不可拒收之指示应按照参引用规范章节之要求进行记录。

T-491.2 Rejectable Indications. Rejectable indications shall be recorded. As a minimum, the type of indication (i.e., crack, nonfusion, slag, etc.), location, and extent (i.e., length) shall be recorded. Nonmandatory Appendices D and K

provide general recording examples for angle and straight beam search units. Other techniques may be used. 可拒收之

指示。应对可拒收之指示进行记录，其中至少应记录指示的类型(即裂纹、非溶合、夹渣等)、位置和范围(即

长度)。非强制性附录 D和 K 为斜束波和直束波探头提供了通用记录示例。亦可采用其他方法。

T-492 EXAMINATION RECORDS 检测记录

For each ultrasonic examination, the following information shall be recorded: 对每次超声波记录，应记录以下

信息：

(a) procedure identification and revision; 规程识别号和修订版次；

(b) ultrasonic instrument identification (including manufacturer’s serial number); 超声波仪器标识符(含制

造商序列号)；

(c) search unit(s) identification (including manufacturer’s serial number, frequency, and size); 探头标识符

(包括制造商的序列号，频率和大小)；

(d) beam angle(s) used; 所采用之波束角度；

(e) couplant used, brand name or type; 所采用耦合剂之品牌名称或类型；

(f) search unit cable(s) used, type and length; 所采用探头之电缆类型和长度；

(g) special equipment when used (search units, wedges, shoes, automatic scanning equipment, recording

equipment, etc.); 特设之设备(当采用时，诸如：探头、试块、衬垫、自动扫描设备、记录设备等)

(h) computerized program identification and revision when used; 计算器软件标识符和修订版次(当采使

时)

(i) calibration block identification; 校准试块标识符；

(j) simulation block(s) and electronic simulator(s) identification when used; 仿真试块和电子仿真器之标

识符(当采使时)；

(k) instrument reference level gain and, if used, damping and reject setting(s); 仪器参照电平(若采用阻尼

和带阻滤波器设定时)；

(l) calibration data [including reference reflector(s), indication Amplitude(s), and distance reading(s)]; 校准

数据[包括参考反射体、讯号振幅和距离读数]；

(m) data correlating simulation block(s) and electronic simulator(s), when used, with initial calibration; 与仿

真试块和电子仿真器相关联之数据(当采使时)；

(n) identification and location of weld or volume scanned; 所扫查焊缝或所扫查之额范围的标识符和位

置；

(o) surface(s) from which examination was conducted, including surface condition; 进行检测之表面，包

括表面状况；

(p) map or record of rejectable indications detected or areas cleared; 被检测为可拒收指示或无关指示消除

范围之示意图或记录；

(q) areas of restricted access or inaccessible welds; 禁止进入之区域性或无法焊接的区域；

(r) examination personnel identity and, when required by referencing Code Section, qualification level; 检

测人员身份，和资格级别 (当引用规范章节要求时)；

(s) date of examination.

Items (b) through (m) may be included in a separate calibration record provided the calibration record identifica-

tion is included in the examination record. ；检测日期只要校准记录标识码包括在检测记录中，则(b)至(m)项可被

包括在单独的校准记录中。

T-493 REPORT 报告

A report of the examinations shall be made. The report shall include those records indicated in T-491 and T-492.

The report shall be filed and maintained in accordance with the referencing Code Section. 应出具检测报告。报告中

应包括 T-491和 T-492中所指出之各项记载项目。报告应根据引用规范章节进行归档和保存。

T-494 STOR AGE MEDIA 贮存媒体

Stor age media for computerized scanning data and viewing software shall be capable of securely storing and re-

trieving data for the time period specified by the referencing Code Section. 用于计算器化扫查数据和查看软件之贮

存媒体应能够在引用规范章节所指定之保存期限内安全地贮存和检索数据。

MANDATORY APPENDIX I SCREEN HEIGHT

LINEARITY 强制性附录 I 屏幕高度线性


This Mandatory Appendix provides requirements for checking screen height linearity and is applicable to ultrasonic

instruments with A-scan displays.此强制性附录对查对屏幕高度线性提供了有关的要求，并适用于带 A 扫查显示

之超声波仪器。

I-440 MISCELLANEOUS REQUIREMENTS 杂项要求

Position an angle beam search unit on a calibration block, as shown in Figure I-440 so that indications from both the 1/2T and 3/4T holes give a 2:1 ratio of Amplitudes between the two indications. Adjust the sensitivity (gain) so that the larger indication is set at 80% of full screen height (FSH). Without moving the search unit, adjust sensitivity (gain) to successively set the larger indication from 100% to 20% of full screen height, in 10% increments (or 2 dB steps if a fine control is not available), and read the smaller indication at each setting. The reading shall be 50% of the larger Amplitude, within 5% of FSH. The settings and readings shall be estimated to the nearest 1% of full screen. Alterna-tively, a straight beam search unit may be used on any calibration block that provides Amplitude differences, with suf-

ficient signal separation to prevent overlapping of the two signals. 如图 I-440所示，将斜束波探头放置在校准试块

上，以便来自 1 / 2T 和 3 / 4T 孔之指示给出两指示间成 2：1的振幅比。调整灵敏度(增益)，以使较大的指示被

设定在满屏高度(FSH)的 80％处。在不移动探头的情况下，以 10％的增量(若无法采用精细控制，则以 2 dB 步

进)调整灵敏度(增益)将较大的指示从满屏高度的 100％逐步降低至 20％，并在每ㄧ增益调整处读取较小的指

示。读数应为较大振幅的 50％以上，且振幅应在 FSH±5％内变动。设置关键帧和读数均应至最接近满屏的

1％内进行估算，或者，在可提供振幅差之任何校准试块上采用具有足够讯号分离度之直束波探头，以防止两

讯号间的相互重迭。

Figure I-440 Linearity 线性度

MANDATORY APPENDIX II AMPLITUDE CON-

TROL LINEARITY 强制性附录 I 振幅增幅器控制类型之线性度


This Mandatory Appendix provides requirements for checking Amplitude control linearity and is applicable to ul-

trasonic instruments with A-scan displays. 此强制性附录对查对振幅增幅器控制类型之线性度提供了有关的要

求，并适用于带 A 扫查显示之超声波仪器。

II-440 MISCELLANEOUS REQUIREMENTS 杂项要求

Position an angle beam search unit on a basic calibration block, as shown in Figure I-440 so that the indication from the 1/2T side-drilled hole is peaked on the screen. Adjust the sensitivity (gain) as shown in the following table. The indication shall fall within the specified limits. Alternatively, any other convenient reflector from any calibration

block may be used with angle or straight beam search units. 如图 I-440所示，将斜束波探头放置在标准校准试块

上，以便来自 1 / 2T 侧横孔指示在屏幕上达到峰值。如下表所示，调整灵敏度(增益)，以让指示在所规定之限

度内；或者，来自任何校准试块之任何其他合宜的反射体均可与斜束波或直束波搜索探头一起并用。

Indication Set at % of Full Screen

指示设定为满屏(％)的多少百分比

dB Control Change

dB 控制器变化量

Indication Limits % of Full Screen

指示范围之满屏百分比

80% −6 dB 35% to 45%

80% −12 dB 15% to 25%

40% +6 dB 65% to 95%

20% +12 dB 65% to 95%

The settings and readings shall be estimated to the nearest 1% of full screen. 设置关键帧和读数应在最接近全屏

的 1％内进行估算。

MANDATORY APPENDIX III TIME OF FLIGHT

DIFFRACTION (TOFD) TECHNIQUE

强制性附录 III 时差衍射(TOFD)技术


This Mandatory Appendix describes the requirements to be used for a Time of Flight Diffraction (TOFD) exami-

nation of welds. 本强制性附录对焊缝进行时差衍射(TOFD)检测给出了有关要求之描述。

III-420 GENERAL 通则

The requirements of Article 4 apply unless modified by this Appendix. 除非经本附录所修改过，否则均运用第

4章之规定。

III-422 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

III-422.1 Requirements. TOFD shall be performed in accordance with a written procedure which shall, as a mini-mum, contain the requirements listed in Tables T-421 and III-422. The written procedure shall establish a single value,

or range of values, for each requirement. 要求。 TOFD 应按照书面规程执行，该规程应至少包含有表 T-421和

III-422中所列出的要求。书面至少应为每项要求制定单一值或各值的范围。

III-422.2 Procedure Qualification. When procedure qualification is specified, a change of a requirement in Table T-421 or Table III-422 identified as an essential variable shall require requalification of the written procedure by demon-stration. A change of a requirement identified as a nonessential variable does not require requalification of the written procedure. All changes of essential or nonessential variables from those specified within the written procedure shall

require revision of, or an addendum to, the written procedure. 规程鉴定。当规定规程鉴定时，举凡在表 T-421或表

III-422中所要求项被确定为重要变量产生改变时，均需通过演示方式重新认可书面规程。被确定为非重要变

量之要求项的改变是不需重新鉴定书面规程的。在书面规程中所要求之重要变量或非重要变量有任何的变更

时，都应要求对书面规程内容进行相对的修定或补遗。

Table III-422 Requirements of a TOFD Examination Procedure

表 III-422 TOFD 检测规程之要求

Requirement (as Applicable) 要求(按适用性) Essential Variable

重要变量


非重要变量

Instrument manufacturer and model仪器制造商和型号 X …

Instrument software仪器软件 X …

Directions and extent of scanning扫查方向和范围 X …

Method for sizing flaw length 瑕疵长度之测定方法 X …

Method for sizing flaw height 瑕疵高度之测定方法 X … Data sampling spacing (increase only) 数据采样间距(仅

对增加时)

X …

III-430 EQUIPMENT 设备

III-431 INSTRUMENT REQUIREMENTS 仪器要求

III-431.1 Instrument. The instrument shall provide a linear “A” scan presentation for both setting up scan parameters and for signal analysis. Instrument linearity shall be such that the accuracy of indicated Amplitude or time is ±5% of the actual full-scale Amplitude or time. The ultrasonic pulser may provide excitation voltage by tone burst, unipolar, or bipolar square wave. Pulse width shall be tunable to allow optimization of pulse Amplitude and duration. The band-width of the ultrasonic receiver shall be at least equal to that of the nominal probe frequency and such that the −6dB bandwidth of the probe does not fall outside of the −6dB bandwidth of the receiver. Receiver gain control shall be available to adjust signal Amplitude in increments of 1dB or less. Pre-amplifiers may be included in the system. Ana-log to digital conversion of waveforms shall have sampling rates at least four times that of the nominal frequency of the probe. When digital signal processing is to be carried out on the raw data, this shall be increased to eight times the

nominal frequency of the probe. 仪器。仪器应提供线性 A-扫描以建立扫查参数和用于讯号分析。仪器线性度应

使指示振幅或时间之精度满足实际满量程振幅或时间的±5％内的条件。超声波脉冲发生器可以通过音频脉

冲、单极性或双极矩形波来提供激磁电压。脉冲带宽应是可调的，以优化脉冲振幅和持续时间。超声波接收

器的带宽应至少等于标称探头频率的带宽，并满足探头-6dB 误差不会超出接收器-6dB 的误差条件。接收器增

益旋钮可用于以 1dB 或更小的增量调整讯号振幅。前置增幅器可包括在系统中。波形的模数转换器应至少具

有探头标称频率 4倍的取样率。当对首要数据进行数位讯号处理时，应将转换增加到探头标称频率的 8倍。

III-431.2 Data Display and Recording. The data display shall allow for the viewing of the unrectified A-scan so as to position the start and length of a gate that determines the extent of the A-scan time-base that is recorded. Equipment shall permit stor age of all gated A-scans to a magnetic or optical stor age medium. Equipment shall provide a sectional view of the weld with a minimum of 64 gray scale levels. (Stor age of just sectional images without the underlying A-scan RF waveforms is not acceptable.) Computer software for TOFD displays shall include algorithms to linearize cur-sors or the waveform time-base to permit depth and vertical extent estimations. In addition to stor age of waveform data including Amplitude and time-base details, the equipment shall also store positional information indicating the relative position of the waveform with respect to the adjacent waveform(s), i.e., encoded position.

数据显示和记录。为定位选通电路的起始位置和长度，数据显示应能观察非整流的 A-扫查，以确定所记录之

A-扫描时间轴范围。设备应具有磁性或光学贮存媒体以将所有选通电路的A-扫描贮存起来。设备应提供至少

具有 64位灰度级别的焊缝剖视图(仅贮存截面图像而无目标 A-扫描 RF讯号波形的是不可接受的)。用于

TOFD 显示器之计算器软件应包括线性化光标或讯号波形时间轴以提供深度和反射体之垂直范围的运算法则。

除了贮存讯号波形数据(包括振幅和时间轴细节)之外，设备应还具备能将讯号波形相互间之相对位置的位置信

息进行贮存的功能，例如编码位置。

III-432 SEARCH UNITS 探头

III-432.1 General. Ultrasonic probes shall conform to the following minimum requirements: 通则。超声波探头应符

合以下最低要求：

(a) Two probes shall be used in a pitch-catch arrangement (TOFD pair). 在一发一收布置(TOFD 探头对)中

应采用两个探头。

(b) Each probe in the TOFD pair shall have the same nominal frequency. TOFD 探头对中的每个探头应具

有相同的标称频率。

http://terms.naer.edu.tw/detail/1058751/?index=1

(c ) The TOFD pair shall have the same element dimensions. , i.e., aperture size, focal length and incident an-

gle. TOFD 探头对应具有光闸、焦距、入射角等要素在内之相同尺寸。

(d) The pulse duration of the probe shall not exceed 2 cycles as measured to the 20dB level below the peak

response. 在低于峰值灵敏度 20dB 位准下所测量到之探头之脉冲持续时间不应超过两个周期。

(e ) Probes may be focused or unfocused. Unfocused probes are recommended for detection and focused

probes are recommended for improved resolution for sizing. 探针可以示聚焦型或非聚焦型探头。进行检测时推荐

采用非聚焦型探头，为改善分辨率之测定则建议采用聚焦型探头。

(f ) Probes may be single element or phasedarray. 探针可以是单一单元或相控阵。

(g) The nominal frequency shall be from 2 MHz to 15 MHz unless variables, such as production material

grain structure, require the use of other frequencies to assure adequate penetration or better resolution. 标称频率应为 2

MHz至 15 MHz，除非诸如生产材料晶体粒结构等变量需采用其他频率以确保充分地穿透力或较佳的分辨率。

III-432.2 Cladding — Search Units for Technique One. The requirements of T-432.2 are not applicable to the

TOFD technique. 堆焊层用于技术一之探头。 T-432.2之要求不适用于 TOFD 技术。

III-434 CALIBRATION BLOCKS 校准试块

III-434.1 General. 通则

III-434.1.1 Reflectors. Side-drilled holes shall be used to confirm adequate sensitivity settings. 反射体。侧

横孔应用于确认灵敏度设置关键帧的充分度。

III-434.1.7 Block Curvature. Paragraph T-434.1.7 shall also apply to piping. I 试块曲率。 T-434.1.7应

也适用于管道。

III-434.2 Calibration Blocks. Paragraph T-434.2 shall also apply to piping. 校准试块。 T-434.2应也适用于管

道。

III-434.2.1 Basic Calibration Block. The basic calibration block configuration and reflectors shall be as shown in Figure III-434.2.1(a). A minimum of two holes per zone, if the weld is broken up into multiple zones, is re-quired. See Figure III-434.2.1(b) for a two zone example. The block size and reflector location shall be adequate to

confirm adequate sensitivity settings for the beam angles used. 标准校准块。标准校准试块配置和反射体应如图

III-434.2.1(a)所示。若焊缝分成多个区域，则每个区域至少需要两个孔。对于两个区域示例，参见图 III-

434.2.1(b)。试块尺寸和反射体位置应足以确认灵敏度设置关键帧对所采用之斜束波角度是否具有充分性。

III-434.2.2 Block Thickness. The block thickness shall be at ±10% of the nominal thickness of the piece to be examined for thicknesses up to 4 in. (100 mm) or ± 0 .4 in. (10 mm) for thicknesses over 4 in. (100 mm). Alterna-tively, a thicker block may be utilized provided the reference reflector size is based on the thickness to be examined

and an adequate number of holes exist to comply with T-434.2.1 requirements. 试块厚度。对厚度达 4 in. (100 mm)

之待测物项，试块厚度为该物项标称厚度±10%或者物项厚度大于 4 in. (100 mm)时，试块厚度为物项标称厚

度±0.4 0 .4 in. (10 mm)；只要参考反射体尺寸是按待检测厚度，且孔数量符合 T-434.2.1之要求时，则较厚试

块亦可采用。

III-434.2.3 Block Range of Use. The requirements of T-434.2.3 are not applicable to the TOFD technique.

试块使用范围。 T-434.2.3之要求不适用于 TOFD 技术。

III-434.2.4 Alternate Block. The requirements of T-434.2.4 are not applicable to the TOFD technique. 替代

试块。 T-434.2.4之要求不适用于 TOFD 技术。

III-434.3 Piping Calibration Block. The requirements of T-434.3 are not applicable to the TOFD technique. 管道校

准试块。 T-434.3之要求不适用于 TOFD 技术。

III-434.4 Cladding Calibration Blocks. The requirements of T-434.4 are not applicable to the TOFD technique. 堆

焊层校准试块。 T-434.4之要求不适用于 TOFD 技术。

III-435 MECHANICS 构成法

Mechanical holders shall be used to ensure that probe spacing is maintained at a fixed distance. The mechanical

holders shall also ensure that alignment to the intended scan axis on the examination piece is maintained. Probe motion may be achieved using motorized or manual means and the mechanical holder for the probes shall be equipped with a

positional encoder that is synchronized with the sampling of A-scans. 应采用机械式夹具以确保探头间距在检测期

间能维持在一固定不变的距离上。机械式夹具还应确保探头与检测物项上之预期扫查轴线对准。探头移动可

藉由电动或手动装置的采用来达到，探头的机械式夹具应配备与 A-扫描取样同步的位置编码器。



III-463.1 Calibration Block. Calibration shall be performed utilizing the calibration block shown in Figure III-

434.2.1(a) or Figure III-434.2.1(b), as applicable. 校准试块。应使用图 III-434.2.1(a)或图 III-434.2.1(b)所示之校准

试块进行校准。

III-463.2 Calibration. Set the TOFD probes on the surface to be utilized for calibration and set the gain control so that the lateral wave Amplitude is from 40% to 90% of the full screen height (FSH) and the noise (grass) level is less than 5% to 10% FSH. This is the reference sensitivity setting. For multiple zone examinations when the lateral wave is

not displayed, or barely discernible, set the gain control based solely on the noise (grass) level. 校准。将 TOFD探头

定位在要用于校准之表面上，并藉由增益旋钮进行调整，以使横向波振幅在满屏高度(FSH)的 40％至 90％范

围之间，且噪声(噪音细条)位准小于 5％至 10％FSH，此即是首要参照电平之设定值。对于不显示横向波或几

乎无法识别之多波段检测，则增益仅根据噪声(噪音细条)位准来进行设定上之调整。

III-463.3 Confirmation of Sensitivity. Scan the calibration block’s SDHs with them centered between the probes, at the reference sensitivity level set in III-463.2. The SDH responses from the required zone shall be a minimum of 6 dB

above the grain noise and shall be apparent in the resulting digitized grayscaledisplay. 灵敏度确认。按照 III-463.2中

所设定之首要参照电平为准，以在探头之间扫查校准试块的 SDH。来至所要求区域之 SDH 回波振幅高度应至

少比晶体粒杂波高出 6 dB，并在所获得之数位化灰度显示中显而易见。

III-463.4 Multiple Zone Examinations. When a weld is broken up into multiple zones, repeat III-463.2 and III-

463.3 for each TOFD probe pair. In addition, the nearest SDH in the adjoining zone(s) shall be detected. 多区段检

测。当焊缝分成多个区段时，对每一 TOFD 探头对反复 III-463.2和 III-463.3所需之校准和灵敏度确认。此

外，应检测到各相邻区域中最接近之侧横孔。

III-463.5 Width of Coverage Confirmation. Two additional scans per III-463.3 shall be made with the probes offset to either side of the applicable zone’s weld edge ±1/2 in. (13 mm). If all the required holes are not detected, two addi-tional offset scans are required with the probes offset by the distance(s) identified above. See Figure III-463.5 for an

example. 覆盖范围之宽度确认。应使用探头偏置到各适用区段之焊缝边缘± 1/2 in. (13 mm)的两侧，按 III-

463.3另作两次扫查，若未检测到所有所需的孔，则将探头偏置到上述距离处，以再次进行两次另外的偏置扫

查(参见图 III-463.5之示例)。

III-463.6 Encoder. Encoders shall be calibrated per the manufacturer’s recommendations and confirmed by moving a

minimum distance of 20 in. (500 mm) and the displayed distance being ±1% of the actual distance moved. 编码器。应

根据制造商之建议进行编码器校准，并通过至少移动 20 in. (500 mm)的距离进行确认，显示距离之误差度需在

实际移动距离的±1％内。

III-464 CALIBRATION FOR PIPING 管道校准

The requirements of T-464 are not applicable to the TOFD technique. T-464之要求不适用于 TOFD 技术。

III-465 CALIBRATION FOR CLADDING 堆焊层校准

The requirements of T-465 are not applicable to the TOFD technique. T-465之要求不适用于 TOFD 技术

III-467 ENCODER CONFIRMATION 编码器确认

A calibration check shall be performed at intervals not to exceed one month or prior to first use thereafter, made by moving the encoder along a minimum distance of 20 in. (500 mm) and the displayed distance being ±1% of the acutal

distance moved. 校准校对应以不超过一个月的时间间隔或在第一次使用之前进行校对，通过将编码器沿 20 in.

(500 mm)的最小移动距离。所显示之距离误差在实际移动距离的±1％内。

Figure III-434.2.1(a) TOFD Reference Block

图 III-434.2.1(a) TOFD 基本试块

Weld Thickness焊缝厚度, in. (mm) Hole Diameter孔径, in. (mm)

Up to 1 (25) 3/32 (2.5)

Over 1 (25) through 2 (50) 1/8 (3)

Over 2 (50) through 4 (100) 3/16 (5)

Over 4 (100) 1/4 (6)

GENERAL NOTES: 总注： (a) Holes shall be drilled and reamed 2 in. (50 mm) deep minimum, essentially parallel to the examination surface and the scanning

direction. 各孔应是钻铰出来的，孔深度至小为 2 in. (50 mm)，且平行于检测面和扫查方向。 (b) Hole Tolerance. The tolerance on diameter shall be ±1/32 in. (±0.8 mm). The tolerance on location through the block thickness

shall be ±1/8 in. (±3 mm). 孔容差。直径公差为±1/32 in. (±0.8 mm)。贯通试块厚度之位置公差应为±1/8 in. (±3 mm)。 (c) All holes shall be located on the same face (side) of the block and aligned at the approximate center of the face (side) unless the

indication from one reflector affects the indication from another. In these cases, the holes may be located on opposite faces (sides) of the block所有孔应位于试块的相同面(侧)上，并且在面(大约)的大致中心处排成一行，除非来自一个反射体的指示而对另一个反射体指示造成影响，在此种情况下，孔可位于试块的相对面(侧面)上。

(d) When the weld is broken up into multiple zones, each zone shall have a 𝑇𝑧 /4 and 𝑇𝑧 (3/4) side drilled hole, where Tz is the zone

thickness. 当焊缝分成多个区段时，每区段应具有𝑇𝑧 /4和𝑇𝑧 (3/4)侧横孔，其中𝑇𝑧是区段的厚度。

(e) For components : ≦20 in. (500 mm) in diameter, calibration block diameter shall meet the requirements of T-434.1.7.2. 对于直

径 ≤ 20 in. (500 mm)之物项，校准块直径应符合 T-434.1.7.2的要求。

III-470 EXAMINATION 检测

III-471 GENERAL EXAMINATION REQUIREMENTS 通用检测要求

III-471.1 Examination Coverage. The volume to be scanned shall be examined with the TOFD probe pair centered on and transverse to the weld axis and then moving the probe pair parallel to and along the weld axis. If offset scans are required due to the width of the weld, repeat the initial scan with the probes offset to one side of the weld axis and

again with the offset to the opposite side of the first offset scan. 检测范围。将横跨焊缝两侧之 TOFD探头对中心对

准焊缝轴线，然后将探头对以平行于焊缝轴线且沿焊缝轴线移动之方式对所要扫查之额进行检测。若因焊缝

宽度而需进行偏置扫查时，先将探头偏置到焊缝轴线一侧反复原来的扫查，并再次偏置到第前一次偏移扫描

的相对侧反复原来的扫查。

III-471.4 Overlap. The minimum overlap between adjacent scans shall be 1 in. (25mm). 重迭。相邻扫查间的最小

重迭量应为 1 in. (25mm)。

III-471.5 Multiple Zone Examination. When a weld is broken down into multiple zones, repeat III-471.1 for each weld zone.

III-471.6 Recording Data (Gated Region). The unrectified (RF waveform) A-scan signal shall be recorded. The A-scan gated region shall be set to start just prior to the lateral wave and, as a minimum, not end until all of the first back-wall signal with allowance for thickness and mismatch variations, is recorded. Useful data can be obtained from mode-converted signals; therefore, the interval from the first back-wall to the mode-converted back-wall signal shall also be

Cladding (when present)

堆焊层(当有时) T

T/4 3T/4

included in the data collected when required by the referencing Code. 记录数据(选通电路范围)。应记录未调整过的

(RF波形)A-扫查讯号。 A-扫查选通电路范围应设定为刚好在横波之前开始，且至少在所有具有厚度和失配变

化的第一次底面回波讯号已被记录下来的情况下才能结束。可从经模式转换后的讯号获取有用的数据；因此

当引用规范要求时，从第一次底面讯号到经模式转换后的底面回波数据的时间也应包含在所收集的数据中。

III-471.8 Reflectors Transverse to the Weld Seam. An angle beam examination shall be performed in accordance with T-472.1.3 for reflectors transverse to the weld axis unless the referencing Code Section specifies a TOFD exami-nation. In these cases, position each TOFD probe pair essentially parallel to the weld axis and move the probe pair along and down the weld axis. If the weld reinforcement is not ground smooth, position the probes on the adjacent

plate material as parallel to the weld axis as possible. 与焊缝横切之反射体。除非引用规范章节规定横切于焊接轴

的反射体须以 TOFD 进行检测，否则应按照 T-472.1.3进行斜束波检测；在 TOFD 进行检测之情况下，将每个

TOFD 探头对以平行于焊缝轴线之方式进行定位，并将探头沿着沿焊缝轴线一路移动。若缝轴余高不磨平，则

将探头对放置在平行于焊缝轴线的相邻板材上。

III-471.9 Supplemental I.D. and O.D. Near Surface Examination. Due to the presence of the lateral wave and back-wall indication signals, flaws occurring in these zones may not be detected. Therefore, the I.D. and O.D. near sur-faces within the area of interest shall be examined per Article 4. This examination may be performed manually or

mechanized; if mechanized, the data may be recorded in conjunction with the TOFD examination. 内径和外径近表面

检测之辅助说明。由于存在横向波和底面回波指示讯号，因此出现在这些区段中之缺陷可能无法被检测到，

所以因此，在检测区域内之内径和外径近表面应根据第 4章进行检测。在第 4章之检测技术中可用手动或机械

化来进行，其中若采用机械化时，数据可结合 TOFD检测技术进行记录。

Figure III-434.2.1(b)Two-Zone Reference Block Example

双区段基本试块示例

Legend: 图说：

𝑇1 = thickness of the upper zone 上半部区段的厚度 𝑇2 = thickness of the lower zone 下半部区段的厚度

III-472 WELD JOINT DISTANCE–AMPLITUDE TECHNIQUE 焊接接头距离 - 振幅技术


III-473 CLADDING TECHNIQUE 堆焊层技术


III-475 DATA SAMPLING SPACING 数据取样间距

A maximum sample spacing of 0.040 in. (1 mm) shall be used between A-scans collected for thicknesses under 2

in. (50 mm) and a sample spacing of up to 0.080 in. (2 mm) may be used for thicknesses greater than 2 in. (50 mm). 厚

Cladding (when present) 堆焊层(当有时)

T

3𝑇1 4⁄

𝑇1 4⁄

𝑇2 4⁄

3𝑇2 4⁄

度在 2 in. (50 mm)以内之 A-扫描最大取样间距为 0.040 in. (1 mm)，而厚度大于 2 in. (50 mm)时，取样间距可高

达 0.080 in. (2 mm)。

Figure III-463.5 Offset Scans 偏置扫查

III-480 EVALUATION 评估

III-485 MISSING DATA LINES 无显示之数据线

Missing lines in the display shall not exceed 5% of the scan lines to be collected, and no adjacent lines shall be

missed. 屏幕中无显示之行数不应超过所要采集之扫查线的 5％，且在任何相邻的数据线均不应遗失其中一行

的数据线。

III-486 FLAW SIZING AND INTERPRETATION 缺陷大小之量测方法和解释

When height of flaw sizing is required, after the system is calibrated per III-463, a free run on the calibration block shall be performed and the depth of the back-wall reflection calculated by the system shall be within 0.04 in. (1 mm) of the actual thickness. For multiple zone examinations where the back wall is not displayed or barely discernible, a side-drilled hole or other known depth reference reflector in the calibration block may be used. See Nonmandatory Appen-

dices L and N of this Article for additional information on flaw sizing and interpretation. 当需要缺陷高度大小之测定

方法时，再根据 III-463对系统进行校准后，应在试块上任意移动探头且由系统所计算之背反射回波深度应在

实际厚度的 0.04 in. (1 mm) 内。对于不显示背反射或几乎不可辨别的多个区段检测，可采用校准试块中的侧横

孔或其他已知深度的基性反射体。有关缺陷大小之量测方法和解释的更多信息，请参阅本章之非强制性附录 L

和 N。

Final interpretation shall only be made after all display parameter adjustments (i.e., contrast, brightness, lateral and

backwall removal and SAFT processing, etc.) have been completed. 仅在所有显示参数调整(即对比度、亮度、消

除侧向和底部回波以及 SAFTS (synthetic-aperture focusing technique)处理等)已经完成之后才能进行最终解释。

SCAN #3 PCS offset + 1/2 of applicable zone width +1/7 in. [13 mm] 扫查＃3 探头中心距之偏置量+适用区段

宽度的 1/2 + 1/7 in. [13 mm]

SCAN #1 PCS centered on weld axis

扫查＃1 探头中心距对准在焊缝轴线

Applicable zone width + 1/2 in.[13 rnm] 适用区段之宽度+ 1/2 in.[13 mm] +

-

SCAN #2 PCS offset 1/2 of applicable zone width +1/2 in. [13 mm] 扫查＃2 PCS 偏置量 = 适用区段宽度的 1/2 + 1/2 in.

[13 mm]


III-492 EXAMINATION RECORD 检测记录

For each examination, the required information in T-492 and the following information shall be recorded: 对每次

检查，都应记录 T-492中所需之信息和以下信息：

(a) probe center spacing (PCS) 探头中心间距(PCS)

(b) data sampling spacing数据取样间隔

(c ) flaw height, if specified缺陷高度(若有规定时)

(d) the final display processing levels 最终显示处理位准

III-493 REPORT 报告

A report of the examination shall be made. The report shall include those records indicated in T-491, T-492, and

III-492. The report shall be filed and maintained in accordance with the referencing Code Section. 出具检测报告。报

告中应包括有 T-491、T-492和 III-492中所指出的那些记录项目。报告应根据引用规范章节之要求进行归档及

保存。

MANDATORY APPENDIX IV PHASED ARRAY

MANUAL RASTER EXAMINATION TECHNIQUES USING

LINEAR ARRAYS

强制性附录 IV 采用线性数组之相控阵手动光栅检测技术


This Mandatory Appendix describes the requirements to be used for phased array, manual raster scanning, ultra-

sonic techniques using linear arrays. The techniques covered by this Appendix are single12 (fixed angle), E-scan13

(fixed angle), and S-scan14 (sweeping multiple angle).15 In general, this Article is in conformance with SE-2700,

Standard Practice for Contact Ultrasonic Testing of Welds Using Phased Arrays. SE-2700 provides details to be con-

sidered in the procedures used. 本强制性附录对采用线性数组手动光栅扫查之相控阵超声波技术给出了有关要求

的描述。本附录所涉及的技术是单角度(固定角度)，E-扫查(固定角度)和 S-扫描(多角度扫查)。通常情况下，

本章是符合 SE-2700《使用相控阵对焊缝进行接触法超声检测的标准操作方法》。在 SE-2700中对所采用之

规程提供了所要考虑的细节。

IV-420 GENERAL 通则

The requirements of Article 4 apply except as modified by this Appendix. 除本附录另有规定外，否则采用第 4

章之规定。

IV-422 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

IV-422.1 Requirements. The requirements of Table T-421 and Table IV-422 shall apply. 要求。应采用表 T-421和

表 IV-422之要求。

IV-422.2 Procedure Qualification. The requirements of Table T-421 and Table IV-422 shall apply. 规程鉴定。应

采用表 T-421和表 IV-422之要求项目。

IV-460 CALIBRATION 校准

IV-461 INSTRUMENT LINEARITY CHECKS 仪器线性度校对

IV-461.2 Amplitude Control Linearity. The ultrasonic instrument’s Amplitude control linearity shall be evaluated

in accordance with Mandatory Appendix II for each pulser-receiver circuit. 振幅增幅器控制类型之线性度。超声波

仪器的振幅增幅器控制类型之线性度应根据强制性附录对每个脉冲发生器接收器电路进行评估。

IV-462 GENERAL CALIBRATION REQUIREMENTS 通用校准要求

IV-462.7 Focal Law.16 The focal law to be used during the examination shall be used for calibration. 焦点法。检

测期间所采用之焦点法则应用于校准。

IV-462.8 Beam Calibration. All individual beams used in the examination shall be calibrated to provide measure-ment of distance and Amplitude correction over the sound path employed in the examination. This shall include appli-

cable compensation for wedge sound path variations and wedge attenuation effects. 波束校准。检测中所采用之所有

波束应单独进行校准，以为检测中所采用之声程提供在距离和振幅校正上的测量，其中应包括楔形声程变化

和楔形衰减效应的适用补偿。

Table IV-422 Requirements of a Phased Manual Raster Scanning Examination Procedure Using

Linear Arrays

表 IV-422 采用线性数组之相控阵手动光栅检测程序的要求

Requirements (as Applicable)

要求(适用时)

Essential Variable

重要变量


非重要变量

Search unit (element size and number, and pitch and gap dimensions) 探头 (换能器组

件之大小及数量，以及探头对之间距与间距尺寸) X ...

Focal range (identify plane, depth, or sound path) 焦距(鉴别平面、深度或声程) X ...

Virtual aperture size (i.e., number of elements, effective height, and element width) 虚拟光闸大小(即入射波的数量、有效高度和宽度)

X ...

Wedge angle楔角 X ...

Additional E-scan requirements E-扫查之附加要求

Range of element numbers used (i.e., 1–126, 10–50, etc.) 所使用数组数组的范围(即

1-126,10-50等) X ...

Element incremental change (i.e., 1,2, etc.) 数组组数之增量变化(即 1,2等) X ...

Additional S-scan requirements S-扫查之附加要求

Angular range used (i.e., 40 deg to 50 deg, 50 deg to 70 deg, etc.) 所采用之波束角度

范围(即 40度至 50度，50度至 70度等) X ...

Angle incremental change (i.e., 1/2 deg , 1 deg, etc.) 波束角度之增量变化(即 1/2

度，1度等) X ...


IV-492 EXAMINATION RECORD 检测记录

For each examination, the required information of T-492 and the following information shall be recorded: 对每次

检测都应将 T-492中所需信息和以下信息给记录下来：

(a) search unit type, element size and number, and pitch and gap dimensions 扫查装类型、换能器组件尺

寸和数量，以及头对之间距与间距尺寸

(b) focal law parameters, including, as applicable, angle, focal depth, element numbers used, range of ele-

ments, element incremental change, angular range, and angle incremental change 焦点法律参数(当适用时)，包括有

角度、焦点深度、所采用之数组数组、数组数组的范围、数组组数之增量、波束角度范围和波束角度增量变

化

(c ) wedge angle 楔角

MANDATORY APPENDIX V PHASED ARRAY E-

SCAN AND S-SCAN LINEAR SCANNING EXAMINATION

TECHNIQUES

强制性附录 V 相阵控 E-扫查和 S-扫描之线性扫查检测技术

V-410 SCOPE 适用范围

This Mandatory Appendix describes the requirements to be used for phased array E-scan13 (fixed angle) and S-

scan14 encoded linear17 scanning examinations using linear array search units. 本强制性附录对采用线性相数组搜探

头之相控阵 E-扫描(固定角度)和 S-扫描编码线性扫查检测之要求给出有关描述。

V-420 GENERAL 通则

The requirements of Article 4 apply except as modified by this Appendix. 除本附则另有规定外，否则采用第 4

章之规定。

V-421.1 Requirements. The requirements of Table T-421 and Table V-421 shall apply. 要求。应采用表 T-421和表

V-421之要求。

V-421.2 Procedure Qualification. The requirements of Table T-421 and Table V-421 shall apply. 规程鉴定。应采

用表 T-421和表 V-421的要求。

V-422 SCAN PLAN 扫查计划

A scan plan (documented examination strategy) shall be provided showing search unit placement and movement that provides a standardized and repeatable methodology for the examination. In addition to the information in Table V-421, the scan plan shall include beam angles and directions with respect to the weld axis reference point, weld joint

geometry, and number of examination areas or zones. 应为检测之标准化和可反复性方法提供一套能显示探头之位

置和移动的扫描计划(文件化之检测对策)。除了表 V-421中的讯息之外，扫查计划应包括相对于焊缝轴线基准

点的波束角度和方向、焊接接头几何形状、检测区域或区段的数量。

V-460 CALIBRATION 校准

V-461 INSTRUMENT LINEARITY CHECKS 振幅增幅器控制类型之线性校对

V-461.2 Amplitude Control Linearity. The ultrasonic instrument’s Amplitude control linearity shall be evaluated

in accordance with Mandatory Appendix II for each pulser-receiver circuit. 振幅增幅器控制类型之线性度。超声波

仪器之振幅增幅器控制类型之线性度应根据强制性附录 II 中对每种脉冲发生器接收器电路之规定的进行评

估。

V-462 GENERAL CALIBRATION REQUIREMENTS 通用校准要求

V-462.7 Focal Law.16 The focal law to be used during the examination shall be used for calibration. 焦点法。检测期

间所采用之焦点法则应用于校准。

V-462.8 Beam Calibration. All individual beams used in the examination shall be calibrated to provide measurement

of distance and Amplitude correction over the sound path employed in the examination. 波束校准。检测中所采用之

所有波束应单独进行校准，以为检测中所采用之声程提供在距离和振幅校正上的测量。

V-467 ENCODER CALIBRATION 编码器校准

A calibration check shall be performed at intervals not to exceed one month or prior to first use thereafter, by moving the encoder a minimum distance of 20 in. (500 mm). The display distance shall be within 1% of the actual dis-

tance moved. 校准校对应以不超过一个月的时间间隔或在第一次使用之前进行校对，通过将编码器沿 20 in.

(500 mm)的最小移动距离。所显示之距离误差在实际移动距离的±1％内。

Table V-421 Requirements of a Phased Array Linear Scanning Examination Procedure Using Linear Arrays

表 V-421 使用线性数组之相控阵线性扫查检测规程之要求

Requirements (as Applicable)

要求(适用时)

Essential Variable

重要变量


非重要变量

Search unit(s) (element pitch, size, number, and gap dimensions) 探头(探头对之间距、大

小、数量和间隙尺寸) X . . .

Focal range(s) (identify plane, depth, or sound path as applicable) 探头(探头对之间距、大

小、数量和间隙尺寸) X . . .

Virtual aperture size(s) (number of elements, element width, and effective height) [Note (1)]

虚拟光闸大小 (即入射波的数量、宽度和有效高度) [注(1)] X . . .

Wedge natural refracted angle楔块之固有折射角 X . . .

Scan plan扫查计划 X . . .

Weld axis reference point marking焊缝轴线基准点标记 . . . X

Additional E-scan requirements: E-扫查之附加要求：

Rastering angle(s) 光栅扫查角度 X . . .

Aperture start and stop element numbers 光圈隔膜和场停止组件的编号 X . . .

Aperture incremental change(s) (number of elements stepped) 光阑孔径增量变化(灵敏度

调整步进数) X . . .

Additional S-scan requirements: S-扫查之附加要求：

Sweep angular range(s) 扫查角度范围 X . . .

Angular sweep increment (incremental angle change, deg) 角度扫查增量(增量角度变

化，º) X . . .

Aperture element numbers (first and last) 光圈大小编号(第一次和最后一个) X . . .

NOTE: 注：

(1) Effective height is the distance measured from the outside edge of the first to last element used in the focal law. 有效高度是从焦点定律中所采用扫查分析组件时之第一点(Start Value)至最后一点(Stop Value)之外侧端所测量到的距离。

V-470 EXAMINATION 检测

V-471 GENERAL EXAMINATION REQUIREMENTS 通用检测要求

V-471.1 Examination Coverage. The required volume of the weld and base material to be examined shall be scanned using a linear scanning technique with an encoder. Each linear scan shall be parallel to the weld axis at a constant

standoff distance with the beam oriented perpendicular to the weld axis. 检测范围。对要检测焊缝和母材额应采用

带有编码器之线性扫查技术进行扫查。每个线性扫描应在与焊缝轴线成平行之固定间隔距离处，以波束取向

垂直于焊接轴之方式进行。

(a) The search unit shall be maintained at a fixed distance from the weld axis by a fixed guide or mechanical

means. 探头应通过固定导轨或机械装置与焊接轴线保持固定距离。

(b) The examination angle(s) for E-scan and range of angles for S-scan shall be appropriate for the joint to be

examined. E-扫查和 S-扫描之角度范围应适用于所要检测之接头。

(c ) Scanning speed shall be such that data drop-out is less than 2 data lines per inch (25 mm) of the linear

scan length and that there are no adjacent data line skips. 扫查速度应使得每 in. (25 mm)线性扫查长度所丢失之数

据线小于两条，且在任何相邻的数据线均不应遗失其中一行的数据线。

(d) For E-scan techniques, overlap between adjacent active apertures (i.e., aperture incremental change) shall

be a minimum of 50% of the effective aperture height. 对于 E-扫描技术，相邻光栅间的重迭率(即光栅凹槽的增量

变化)应为有效光栅凹槽高度之最小值的 50％。

(e ) For S-scan techniques, the angular sweep incremental change shall be a maximum of 1 deg or sufficient to

assure 50% beam overlap. 对于 S-扫描技术，波束扫查角度增量变化最大值应为 1度或足以确保 50％的波束重

迭率。

(f ) When multiple linear scans are required to cover the required volume of weld and base mate-rial, overlap between adjacent linear scans shall be a minimum of 10% of the effective aperture height for E-scans or beam width

for S-scans. 当需要多线性扫查以覆盖焊缝和母材材料所需的额范围时，相邻线性扫查之间的重迭率应至少为

E-扫描的有效有效光栅凹槽高度的 10％或 S-扫描的波束宽度。

V-471.6 Recording. A-scan data shall be recorded for the area of interest in an unprocessed form with no threshold-ing, at a minimum digitization rate of five times the examination frequency, and recording increments of a maximum

of 记录。被检测区域之 A-扫查数据应以无阈值处理格式进行记录，最小数位化速率为检测频率的 5倍，并记

录如下最大增量：

(a) 0.04 in. (1 mm) for material < 3 in. (75 mm) thick 厚度 < 3 in. (75 mm)的材料为 0.04 in. (1 mm)

(b) 0.08 in. (2 mm) for material ≥ 3 in. (75 mm) thick 厚度 ≥ 3英寸(75毫米)的材料为 0.08 in. (2 mm)

V-471.7 Reflectors Transverse to the Weld Seam. As an alternate to line scanning, a manual angle beam examina-

tion may be performed for reflectors transverse to the weld axis. 横切于焊缝轴线之反射体。对横切于焊接轴线之

反射体可采用手动斜束波检测来取代线性扫查。

V-490 DOCUMENTATION 文件

V-492 EXAMINATION RECORD 检测记录

For each examination, the required information of T-492 and the following information shall be recorded: 每次检测

都应将 T-492之所需信息和以下信息予以记录下来：

(a) search unit element size, number, and pitch and gap dimensions 探头组件的大小、数量、间距和间隙

尺寸

(b) focal law parameters, including, as applicable, angle or angular range, focal depth and plane, element

numbers used, angular or element incremental change, and start and stop element numbers or start element number 焦

点定律参数，其中包括有角度或角度范围、焦点深度和聚焦面、所采用之元素编号、角度或数组组数之增量

变化、光圈隔膜和场停止组件的编号

(c ) wedge natural refracted angle 楔块之固有折射角

(d) scan plan扫描计划

A-scan recorded data need only be retained until final flaw evaluation has been performed. A-扫查所记录之数据

仅在进行最终缺陷评估时才需进行归档保存。

MANDATORY APPENDIX VII ULTRASONIC EX-

AMINATION REQUIREMENTS FOR WORKMANSHIP BASED

ACCEPTANCE CRITERIA

强制性附录 IIV 以工艺可接受准则为基准之超声波检测必要条件

VII-410 SCOPE 适用范围

This Mandatory Appendix provides requirements when an automated or semi-automated ultrasonic examination is

performed for workmanship based18 acceptance criteria. 此强制性附录位以工艺可接受准则为基准进行自动或半自

动超声波检查提供了有关规定。

VII-420 GENERAL 通则

The requirements of Article 4 apply except as modified by this Appendix. 除本附则另有规定外，否则应采用第 4

章之规定。

VII-421 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

VII-421.3 Written Procedure and Procedure Qualification. The requirements of Table T-421 and Table VII-421

shall apply. 书面规程和程规程鉴定。应采用在表 T-421和表 VII-421中之要求。

VII-423 PERSONNEL QUALIFICATION 人员资格

Only qualified UT personnel trained in the use of the equipment and who have demonstrated the ability to properly acquire examination data, shall conduct production scans. Personnel who analyze and interpret the collected data shall

be a Level II or III who have documented training in the use of the equipment and software used. 只有接受过设备应

用培训，并已经证明能够正确获取检测数据之合格 UT 人员，才能进行物项扫查。对所采集数据进行分析和解

读之人员应具有对所采用之设备和软件接受过文件培训之 II 级或 III 级人员。

The training and demonstration requirements shall be addressed in the employer’s written practice. 培训和演示要

求应在雇主之书面实践中给出论述。

Table VII-421 Requirements of an Ultrasonic Examination Procedure for Workmanship Based Ac-ceptance Criteria

表 VII-421 基于工艺允收准则之超声波检测规程要求 Requirements (as Applicable)

要求(适用时)

Essential Variable

重要变量

Nonessential Variable 非重要变量


Computer software revision计算器软件版次 X . . .

Scanning technique (automated vs. semi-automated) 扫查技术(自动化与半自动化) X . . .

Flaw characterization methodology 缺陷特征分类法 X . . .

Flaw sizing (length) methodology 缺陷大小(长度)之测定方法 X . . .

Search unit mechanical fixturing device (manufacturer and model) 探头机械式夹具(制造

商和型号) X . . .

Scanner and adhering and guiding mechanism扫查器、联轴器和导向装置 X . . .

VII-430 EQUIPMENT 设备

VII-431 INSTRUMENT REQUIREMENTS 仪器要求

The ultrasonic examination shall be performed using a system employing automated or semi-automated scanning with computer based data acquisition and analysis abilities. The examination for transverse reflectors may be per-formed manually per T-472.1.3 unless the referencing Code Section specifies it also shall be by an automated or semi-

automated scan. 应采用具有计算器数据采集和分析能力之自动或半自动扫查系统来进行超声波检测。对横向

反射体可按照 T-472.1.3.3进行手动检测，除非在引用规范章节中亦指定横向反射体要通过自动或半自动扫

查。

VII-434 CALIBRATION BLOCKS 校准试块

VII-434.2.4 Scanner Block. A block shall be fabricated meeting the requirements of T-434.1 and Figure T-434.2.1 except that its thickness, T , shall be within the lesser of 1/4 in. (6 mm) or 25% of the material thickness to be examined and the number and position of the side-drilled holes shall be adequate to confirm the sensitivity setting of each probe, or probe pair in the case of a TOFD setup, as positioned per the scan plan in the scanner. The scanner block is in addition to the calibration block required per Article 4, unless the scanner block also has all the specified reference

reflectors required per Figure T-434.2.1. 扫描仪试块。除试块厚度(T)应在 1/4 in. (6 mm)或待检测材料厚度的

25％两者值中所取之较小值内外，应按照 T-434.1和 T-434.2.1之要求来制造试块，且侧横孔之数量和位置应

足以确认每一探头的灵敏度或在 TOFD配置探头对的灵敏度，其中探头或探头对是根据扫查计划进行定的。

除非扫描仪试块亦具有图 T-434.2.1所要求之所有指定参考反射体，否则扫查仪试块可替代除了第 4章所要求

的校准规。

VII-440 MISCELLANEOUS REQUIREMENTS 杂项要求

VII-442 SCANNING DATA 查数据

The original scanning data, unprocessed, shall be saved electronically (e.g., magnetic, optical, flash memory, etc.).

扫未经处理的首要扫查数据应以电子方式保存(例如，磁性，光学，闪存等)。

VII-460 CALIBRATION 校准

VII-466 CALIBRATION FOR NOZZLE SIDE WELD FUSION ZONE AND/OR AD-

JACENT NOZZLE PARENT METAL 对接管焊缝溶合和/或邻近接管母材金属所

进行之校准

VII-466.1 System Confirmation Scan. The scanner block shall be scanned and the reference reflector indications rec-orded to confirm system calibration prior to and at the completion of each examination or series of similar examina-tions, when examination personnel (except for automated equipment) are changed, and if the scan plan is required to be

modified (i.e., VII-483) to satisfy the requirements of T-467.3. 系统确认扫查。在更换检测人员(自动化设备除外)

且需要修改扫查计划(即 VII-483)时，在每次检测或一系列类似检测完成之前，应对扫描仪试块进行扫描并记

录参考反射体指示，以确认所完成之系统校准已满足 T-467.3的要求。

VII-466.2 Calibration Checks. The requirements of T-467.2 are not applicable to this Appendix. 校准校对。 T-

467.2之要求不适用于本附录。

VII-466.2.1 Simulator Checks.The requirements of T-467.2.1 are not applicable to this Appendix. 模拟试件

校对。T-467.2.1之要求不适用于本附录。

VII-470 EXAMINATION 检测

VII-471 GENERAL EXAMINATION REQUIREMENTS 通用检测要求

VII-471.1 Examination Coverage. The volume to be scanned shall be examined per the scan plan. 检测范围。所要

扫描之额范围应根据扫查计划进行检测。


VII-483 EVALUATION OF LAMINAR REFLECTORS 层状反射体之评估

Reflectors evaluated as laminar reflectors in the base material which interfere with the scanning of the examina-tion volume shall require the scan plan to be modified such that the maximum feasible volume is examined and shall be

noted in the record of the examination (T-493). 在于母材中被评估为层状之反射体，若对额检测之扫描会产生干

扰时，就应对扫查计划进行修改，以便获得最大可行额检测，并应在检测记录中加以批注(T-493)。


Final flaw evaluation shall only be made after all display parameter adjustments (e.g., contrast, brightness, and, if

applicable, lateral and backwall removal and SAFT processing, etc.) have been completed. 仅能在完成所有显示参

数调整(例如对比度、亮度，若适用时的侧向和底部回波的消除以及 SAFT 处理等)之后才能进行最终解释。

VII-486 SUPPLEMENTAL MANUAL TECHNIQUES 手动辅助技术

Flaws detected during the automated or semi-automated scan may be alternatively evaluated, if applicable, by

supplemental manual techniques. 若适用的话，在自动或半自动扫查期间被检测到之瑕疵可辅以手动技术来取代

自动或半自动评估。

VII-487 EVALUATION BY MANUFACTURER 由制造商所进行之评估

The Manufacturer shall be responsible for the review, interpretation, evaluation, and acceptance of the completed scan data to assure compliance with the requirements of Article 4, this Appendix, and the referencing Code Section. Acceptance shall be completed prior to presentation of the scan data and accompanying documentation to the Inspec-

tor. 制造商应对所完成之扫查数据进行审视、解释、评估与接受，以确保符合第 4章、本附录和引用规范章节

的要求。在将扫查数据和所随附之文件提交给检查员之前，应完成可接受之评估结果。

VII-490 文件

VII-492 EXAMINATION RECORD 检测记录

The required information of T-490 and the following information shall be recorded: 对 T-490所需的信息和以下

信息应进行记录：

(a) scan plan扫查计划

(b) scanner and adhering and guiding mechanism扫查仪、联轴器和导向装置

(c ) indication data [i.e., position in weld, length, and characterization (e.g., crack, lack of fusion, lack of

penetration, or inclusion)] 指示数据 [即在焊缝中之位置、长度和表征(例如裂纹、溶合不良、渗透不良或夹渣)]

(d) the final display processing levels 最终显示处理水平

(e ) supplemental manual technique(s) indication data, if applicable [same information as (c)] 手动辅助技

术的指示数据(如适用)[与(c)相同的信息]

MANDATORY APPENDIX VIII ULTRASONIC

EXAMINATION REQUIREMENTS FOR A FRACTURE ME-

CHANICS BASED ACCEPTANCE CRITERIA

强制性附录 VIII 允收准则以断裂力学为基准时之超声波检测要求

VIII-410 SCOPE 适用范围

This Mandatory Appendix provides requirements when an automated or semi-automated ultrasonic examination is

performed for fracture mechanics based19 acceptance criteria. 本强制性附录对以断裂力学作为允收准则基准之自

动或半自动超声波检测提供相关要求。

VIII-420 GENERAL 通则

The requirements of Article 4 apply except as modified by this Appendix.除本附则另有规定外，应采用第 4章

之规定。

VIII-421 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

VIII-421.1 Procedure Qualification. Procedure qualification is required per Mandatory Appendix IX.

规程鉴定。规程鉴定按强制性附录 IX之要求进行。

VIII-421.2 Written Procedure and Procedure Qualification. The requirements of Table T-421 and Table VIII-421

shall apply. 书面规程和规程鉴定。应采用表 T-421和表 VIII-421之要求。

VIII-423 PERSONNEL QUALIFICATION 人员资格

Only qualified UT personnel trained in the use of the equipment and who have demonstrated the ability to properly acquire examination data, shall conduct production scans. Personnel who analyze and interpret the collected

data shall be a Level II or Level III who have documented training in the use of the equipment and software used. 只有

接受过设备应用培训，并已经证明能够正确获取检测数据之合格 UT 人员，才能进行物项扫查。对所采集数据

进行分析和解读之人员应具有对所采用之设备和软件接受过文件培训之 II 级或 III 级人员。

The training and demonstration requirements shall be addressed in the employer’s written practice. 培训和演示要

求应在雇主之书面实践中给出论述。

VIII-430 EQUIPMENT 设备

VIII-431 INSTRUMENT REQUIREMENTS 仪器要求

The ultrasonic examination shall be performed using a system employing automated or semi-automated scanning with computer based data acquisition and analysis abilities. The examination for transverse reflectors may be per-formed manually per T-472.1.3 unless the referencing Code Section specifies it also shall be by an automated or semi-

automated scan. 应采用具有计算器数据采集和分析能力之自动或半自动扫查系统进行超声波检测。对于横向

反射体可按 T-472.1.3.3以手动方式进行检测，除非引用规范章节规定是要通过自动或半自动扫查。

VIII-432 SEARCH UNITS 探头

VIII-432.1 General. The normal frequency shall be the same as used in the qualification. 通则。标称频率应与鉴定

中所采用之频率相同。

VIII-434 CALIBRATION BLOCKS 校准试块

VIII-434.2 Nonpiping Calibration Blocks 非管道校准试块

VIII-434.2.4 Scanner Block. A block shall be fabricated meeting the requirements of T-434.1 and Figure T-434.2.1 except that its thickness, T , shall be within the lesser of 1/4 in. (6 mm) or 25% of the material thickness to be exam-ined and the number and position of the side-drilled holes shall be adequate to confirm the sensitivity setting of each probe, or probe pair in the case of a TOFD setup, as positioned per the scan plan in the scanner. The scanner block is in addition to the calibration block required per Article 4, unless the scanner block also has all the specified reference re-

flectors required per Figure T-434.2.1. 扫查仪试块。应按 T-434.1和 T-434.2.1之要求制造试块，但其所要检测

之厚度 T 应在材料厚度的 1/4 in。(6 mm)或 25％之较小者内，且侧横孔数量和位置对根据扫查计划定位之探头

的或在 TOFD 整备情况下之每一探头对的灵敏度设置应需提供足够的可确认性。非扫描仪试块也具有图 T-

434.2.1所要求之所有指定参考反射体，否则扫查仪试块可取代第 4章所要求之校准试块除。

Table VIII-421 Requirements of an Ultrasonic Examination Procedure for Fracture Mechanics

Based Acceptance Criteria

表 VIII-421 以断裂力学为基准之超声波检测规程序之允收准则要求 Requirements (as Applicable)

要求(适用时)

Essential Variable

重要变量


非重要变量


Computer software revision计算器软件版次 X . . .

Scanning technique (automated vs. semi-automated) 扫查技术(自动化与半自

动化) X . . .

Flaw sizing (length) methodology 缺陷大小(长度) 之测定方法 X . . .

Search unit mechanical fixturing device (manufacturer and model) 搜查装置之

机械式夹具(制造商和型号) X . . .

Scanner and adhering and guiding mechanism扫查仪、联轴器和导向装置 X . . .

VIII-440 MISCELLANEOUS REQUIREMENTS 杂项要求

VIII-442 SCANNING DATA 扫查数据

The original scanning data, unprocessed, shall be saved electronically (e.g., magnetic, optical, flash memory, etc.).

未经处理过的首要扫查数据应运用电子仪器进行保存(例如，磁性，光学，闪存等)。

VIII-460 CALIBRATION 校准

VIII-466 CALIBRATION FOR NOZZLE SIDE WELD FUSION ZONE AND/OR AD-

JACENT NOZZLE PARENT METAL 接管焊缝溶合区和/或邻近接管母材金属之

校准

VIII-466.1 System Confirmation Scan. The scanner block shall be scanned and the reference reflector indications recorded to confirm that prior to and at the completion of each examination or series of similar examinations, when examination personnel (except for automated equipment) are changed, and if the scan plan is required to be modified

(i.e., VIII-483) to satisfy the requirements of T-467.3. 系统确认扫查。在更换检测人员(自动化设备除外)且需要修

改扫查计划(即 VIII-483)时，在每次检测或一系列类似检测完成之前，应对扫描仪试块进行扫描并记录参考反

射体指示，以确认所完成之系统校准已满足 T-467.3的要求。

VIII-466.2 Calibration Checks. The requirements of T-466.2 are not applicable to this Appendix. 校准校对。 T-

466.2之要求不适用于本附录。

VIII-466.2.1 Simulator Checks. The requirements of T-467.2.1 are not applicable to this Appendix. 模拟试件

校对。T-467.2.1之要求不适用于本附录。

VIII-470 EXAMINATION 检测

VIII-471 GENERAL EXAMINATION REQUIREMENTS 通用检测要求

VIII-471.1 Examination Coverage. The volume to be scanned shall be examined per the scan plan. 检测范围。所

要扫描之额应根据扫查计划进行检测。

VIII-471.3 Rate of Search Unit Movement. The rate of search unit movement shall not exceed that qualified. 探头

移动速率。探头之移动速率(扫描速度)不应超过已鉴定认可之范围。

VIII-471.4 Scanning Sensitivity Level. The scanning sensitivity level shall not be less than that qualified. 扫查灵敏

度水平。扫查灵敏度水平不应低于已鉴定认可水平。

VIII-480 EVALUATION 评估

VIII-482 EVALUATION LEVEL 评估水平

VIII-482.2 Nondistance–Amplitude Techniques. All indication images that have indicated lengths greater than the

following shall be evaluated in terms of the acceptance criteria of the referencing Code Section: 无延时振幅技术。所

有大于下列长度之指示图像应根据引用规范章节进行评估：

(a) 0.15 in. (4 mm) for welds in material equal to or less than 1-1/2in. (38 mm)thick在材料中之焊缝厚

度 ≦ 1-1/2in. (38 mm)时为 0.15 in. (4 mm)。

(b) 0.20 in. (5 mm) for welds in material greater than 1-1/2 in. (38 mm) thick but less than 4 in. (100

mm) thick在材料中之焊缝厚度 > 1-1/2in. (38 mm)但 < 1-1/2in. (38 mm)时为 0.20 in. (5 mm)。

(c ) 0.05T or 3/4 in. (19 mm), whichever is less, for welds in material greater than 4 in. (100 mm). (T =

nominal material thickness adjacent to the weld.) 在材料中之焊缝厚度 > 4 in. (100 mm)时为 0.05T 或 3/4 in. (19

mm)，以较小者为准。 (T =邻近焊缝之标称材料厚度)

For welds joining two different thicknesses of material, material thickness shall be based on the thinner of the

two materials. 两种不同材料厚度之连接焊缝，材料厚度应已两种材料之较薄者为基准。

VIII-483 EVALUATION OF LAMINAR REFLECTORS 层状反射体之评估

Reflectors evaluated as laminar reflectors in the base material which interfere with the scanning of the examina-tion volume shall require the scan plan to be modified such that the maximum feasible volume is examined and shall be

noted in the record of the examination (T-493). 在于母材中被评估为层状之反射体，若对额检测之扫描会产生干

扰时，就应对扫查计划进行修改，以便获得最大可行额检测，并应在检测记录中加以批注(T-493)。

VIII-485 EVALUATION SETTINGS 评估设置关键帧

Final flaw evaluation shall only be made after all display parameter adjustments (e.g., contrast, brightness, and, if

applicable, lateral and backwall removal and SAFT processing, etc.) have been completed. 仅能在完成所有显示参数

调整(例如对比度、亮度，若适用时的侧向和底部回波的消除以及 SAFT 处理等)之后才能进行最终解释。

VIII-486 SIZE AND CATEGORY 尺寸和分类

VIII-486.1 Size. The dimensions of the flaw shall be determined by the rectangle that fully contains the area of the

flaw. 尺寸。缺陷尺寸应由完全包含缺陷区域的矩形来进行确定。

(a) The length of the flaw shall be the dimension of the rectangle that is parallel to the inside pressure-re-

taining surface of the component. 缺陷长度应为平行于物项内侧承压面的矩形尺寸。

(b) The height of the flaw shall be the dimension of the rectangle that is normal to the inside pressure-retain-

ing surface of the component. 缺陷高度应为与物项内侧承压面垂直的矩形尺寸。

VIII-486.2 Category. Flaws shall be categorized as being surface or subsurface based on their separation distance

from the nearest component surface. 分类。应根据与物项表面间之最接近的间隔距离，将裂纹分为表面或次表

面。

(a) If the space is equal to or less than one-half the height of the flaw, then the flaw shall be categorized as a

surface flaw.20 若距离 ≦ 缺陷高度的一半，则该缺陷应归为表面缺陷。

(b) If the space is greater than one-half the height of the flaw, then the flaw shall be categorized as a subsur-

face flaw. 如果距离 > 缺陷高度的一半，则该缺陷应归类为次表面缺陷。

VIII-487 SUPPLEMENTAL MANUAL TECHNIQUES 手动辅助技术

Flaws detected during the automated or semi-automated scan may be alternatively evaluated, if applicable, by sup-

plemental manual techniques. 若适用的话，在自动或半自动扫查期间被检测到之瑕疵可辅以手动技术来取代自

动或半自动评估。

VIII-488 EVALUATION BY MANUFACTURER 由制造商所进行之评估

The Manufacturer shall be responsible for the review, interpretation, evaluation, and acceptance of the completed scan data to assure compliance with the requirements of Article 4, this Appendix, and the referencing Code Section. Acceptance shall be completed prior to presentation of the scan data and accompanying documentation to the Inspec-

tor. 制造商应对所完成之扫查数据进行审视、解释、评估与接受，以确保符合第 4章、本附录和引用规范章节

的要求。在将扫查数据和所随附之文件提交给检查员之前，应先完成可接受之评估结果。

VIII-490 DOCUMENTATION 文件

VIII-492 EXAMINATION RECORDS 检测记录

The required information of T-490 and the following information shall be recorded: 对 T-490所需的信息和以下

信息应进行记录：

(a) scan plan扫查计划

(b) scanner and adhering and guiding mechanism扫查仪、联轴器和导向装置

(c ) indication data [i.e., position in weld, length, and characterization (e.g., crack, lack of fusion, lack of

penetration, or inclusion)] 指示数据 [即在焊缝中之位置、长度和表征(例如裂纹、溶合不良、渗透不良或夹渣)]

(d) the final display processing levels 最终显示处理水平

(e ) supplemental manual technique(s) indication data, if applicable [same information as (c)] 手动辅助技

术的指示数据(如适用)[与(c)相同的信息]

MANDATORY APPENDIX IX PROCEDURE

QUALIFICATION REQUIREMENTS FOR FLAW SIZING AND

CATEGORIZATION 强制性附录 IX 用于瑕疵大小之测定方法及分类之书面规程鉴定要求

IX-410 SCOPE 适用范围

This Mandatory Appendix provides requirements for the qualification21 of ultrasonic examination procedures when flaw sizing (i.e., length and through-wall height) and categorization (i.e., surface or subsurface) determination are spec-

ified for fracture mechanics based acceptance criteria. 为确认以断裂力学为允收准则为基准时对所规定之缺陷大小

(即长度和整个壁厚之高度) 之测定方法和分类(即表面或次表面)，本强制性附录对超声波检测规程提供了鉴定

要求。

IX-420 GENERAL 通则

The requirements of Article 4 apply except as modified by this Appendix. 除非本附录另有规定，否则应采用第

4章之规定。

IX-430 EQUIPMENT 设备

IX-435 DEMONSTRATION BLOCKS 演示试件

IX-435.1 General. The following Article 4 paragraphs apply to demonstration blocks: T-434.1.2, T-434.1.3, T-

434.1.4, T-434.1.5, T-434.1.6, and T-434.1.7. 通则。下列第 4章中之段落适用于演示试件：T-434.1.2、T-

434.1.3、T-434.1.4、T-434.1.5、T-434.1.6和 T-434.1.7。

IX-435.2 Preparation. A demonstration block shall be prepared by welding or, provided the acoustic properties are

similar, the hot isostatic process (HIP) may be used. 制备。演示试件应以焊接方式进行制备，或者只要声学特性

相似，则亦可采用热等静压制程(HIP)之材料所制成。

IX-435.3 Thickness. The demonstration block shall be within 25% of the thickness to be examined. For welds join-ing two different thicknesses of material, demonstration block thickness shall be based on the thinner of the two materi-

als. 厚度。演示试件应在被检查厚度的 25％以内。对于由两种不同厚度材料连接而成之焊缝，演示试件厚度

应以两种材料中之较薄者为准。

IX-435.4 Weld Joint Configuration. The demonstration block’s weld joint geometry shall be representative of the production joint’s details, except when performing TOFD examinations of equal thickness butt welds in accordance

with Mandatory Appendix III. 焊接接头之几何形状。根据强制性附录 III 进行等厚度对接焊缝之 TOFD 检测除

外，不然演示试件之焊接接头几何形状应为产品接头细节之代表。

IX-435.5 Flaw Location. Unless specified otherwise by the referencing Code Section, the demonstration block shall contain a minimum of three actual planar flaws or three EDM notches oriented to simulate flaws parallel to the produc-tion weld’s axis and major groove faces. The flaws shall be located at or adjacent to the block’s groove notche’s faces

as follows: 缺陷位置。除非引用规范章节另有规定，否则演示试件应至少包含三个真实的平面缺陷或三个由

放电加工所制成之槽口，以仿真平行于产品焊缝轴线和较大范围坡口面之缺陷。应按如下所示将缺陷定位于

或相邻于演示试件的槽口面：

(a) one surface flaw on the side of the block representing the component O.D. surface 将一表面缺陷

定位在能代表物项外表面之试件侧面上。

(b) one surface flaw on the side of the block representing the component I.D. surface 将一表面缺陷

定位在能代表物项内表面之试件侧面上。

(c ) one subsurface flaw( 一个次表面缺陷

When the scan plan to be utilized subdivides a weld into multiple examination zones, a minimum of one flaw

per zone is required. 当所要采用之扫查计划将焊缝细分为多个检测段时，则每一检测段至少需要一个缺陷。

IX-435.6 Flaw Size. Demonstration block flaw sizes shall be based on the demonstration block thickness and shall be

no larger than that specified by the referencing Code Section. 缺陷尺寸。演示试件之缺陷尺寸应基于演示试件厚

度，且不得大于引用规范章节所规定的尺寸。

(a) maximum acceptable flaw height for material less than 1 in. (25 mm) thick, or 材料厚度 < 1 in. (25 mm)

时的最大可接受瑕疵高度，或

(b) 0.25 aspect ratio acceptable flaw for material equal to or greater than 1 in. (25 mm) thick based on the

demonstration block thickness. 演示试件材料厚度 ≧ 1 in. (25 mm)时，缺陷纵横比的可接受值为 0.25。

IX-435.7 Single I.D./O.D. Flaw Alternative. When the demonstration block can be scanned from both major sur-faces during the qualification scan [e.g., joint I.D. and O.D. have a similar detail, diameter of curvature is greater than

20 in. (500 mm), no cladding or weld overlay present, etc.], then only one surface flaw is required.单个内/外侧缺陷的

替代方式。当在鉴定扫查期间可从两个较大范围表面对演示试件进行扫查时[例如，具有类似细节之接头内和

外侧，曲率直径大于 20 in. (500 mm)，无堆焊层或焊接堆焊层等]，则仅需一个表面缺陷。

IX-435.8 One-Sided Exams. When, due to obstructions, the weld examination can only be performed from one side of the weld axis, the demonstration block shall contain two sets of flaws, one set on each side of the weld axis. When the demonstration block can be scanned from both sides of the weld axis during the qualification scan (e.g., similar

joint detail and no obstructions), then only one set of flaws is required. 单侧检测。当由于障碍物的存在致使焊缝检

测仅能从焊缝轴线的一侧进行时，则演示试件应包含两组缺陷分别定位在焊接轴线的两侧。当在鉴定扫查期

间(例如，类似的联合细节和无障碍物)可从焊接轴线之两侧对演示试件进行扫描时，则仅需一组缺陷即可。

IX-440 MISCELLANEOUS REQUIREMENTS 杂项要求

IX-442 QUALIFICATION DATA 鉴定数据

The demonstration block shall be scanned and the qualification data saved per the procedure being qualified and

shall be available to the Inspector and Owner/User along with a copy of any software necessary to view the data. 应扫

描演示试件，并按照书面规程保存鉴定数据，且向检查员和拥有人/用户提供查看数据所需的任何软件的拷贝

版。

IX-480 EVALUATION 评估

IX-481 SIZE AND CATEGORY 尺寸和分类

Flaws shall be sized and categorized in accordance with the written procedure being qualified. 缺陷应按照已鉴定

认可之书面程序进行尺寸量测和分类。

IX-482 AUTOMATED AND SEMI-AUTOMATED ACCEPTANCE PERFORMANCE

CRITERIA 演示自动和半自动之可接受准则

Acceptable performance, unless specified by the User or referencing Code, is defined as the detection of all the

flaws in the demonstration block and 除非用户或引用规范中另有规定时，否则可被接受之演示是被定义为演示

试件中的所有缺陷和：

(a) recorded responses or imaged lengths, as applicable, exceed the specified evaluation criteria of the pro-

cedure 所记录之灵敏度或成像长度(如适用时)超过书面规程所规定的评估准则

(b) the flaws are sized as being equal to or greater than their actual size (i.e., both length and height)

所量测到之瑕疵尺寸 ≧ 其实际尺寸(即长度和高度)

(c ) the flaws are properly categorized (i.e., surface or subsurface) 经适当分类之瑕疵(即表面或次表面)

IX-483 SUPPLEMENTAL MANUAL TECHNIQUE(S) ACCEPTABLE PERFOR-

MANCE 手动辅助技术被接受之所需演示

Demonstration block flaws may be sized and categorized by a supplemental manual technique(s) outlined in the procedure, only if the automated or semi-automated flaw recorded responses meet the requirements of IX-482(a) and/or it is used for the detection of transverse reflectors. Acceptable performance, unless specified by the User or ref-

erencing Code, is defined as the demonstration block’s flaws being 仅当所记录之自动或半自动化检出缺陷，其灵

敏度若符合 IX-482(a)的要求和/或用于横向反射体之检测时，演示试件缺陷可通过书面规程中所述之手动辅助

技术来进行尺寸测量和分类。除非用户或引用规范另有规定，否则可被接受之演示是被定义为如下之演示试

件缺陷：

(a) sized as being equal to or greater than their actual size (i.e., both length and height) 所量测到之尺寸

≧ 其实际尺寸(即长度和高度)

(b) properly categorized (i.e., surface or subsurface) 经适当分类之瑕疵(即表面或次表面)

IX-490 DOCUMENTATION 文件

IX-492 DEMONSTRATION BLOCK RECORD 演示试件之记录

The following information shall be recorded: 应记录以下信息：

(a) the information specified by the procedure being qualified 经鉴定认可之书面规程中所要求的信息

合

(b) demonstration block thickness, joint geometry including any cladding or weld overlays, and flaw data [i.e., position in block, size (length and height)], separation distance to nearest surface, category (surface or subsurface)

演示试件厚度、包括任何堆焊层或焊接堆焊层之接头几何形状、缺陷数据(即，在试件中之位置，尺寸(长度和

高度)]、至表面的最短距离、分类(表面或次表面)

(c ) scanning sensitivity and search unit travel speed 扫查灵敏度和探头之移行速度

(d) qualification scan data 鉴定时之扫查数据

(e ) flaw sizing data [same information as flaw data in (b)] 缺陷测定数据[与(b)中的缺陷数据具有相同

的信息]

(f ) supplemental manual technique(s) sizing data, if applicable [same information as flaw data in(b)] 手动

辅助技术之测定数据[如适用时，与(b)中的缺陷数据具有相同的信息]

MANDATORY APPENDIX X ULTRASONIC EXAMI-

NATION OF HIGH DENSITY POLYETHYLENE 强制性附录 X 高密度聚乙烯之超声波检测

X-410 SCOPE 适用范围

This Appendix describes requirements for the examination of butt fusion welds in high density polyethylene (HDPE) pipe using encoded pulse echo, phased array, or time of flight diffraction (TOFD) ultrasonic techniques.

本附录对采用编码脉冲回波、相控阵或时差衍射(TOFD)超声波技术检测高密度聚乙烯(HDPE)管中之对接链接

要求给出了相关描述。

X-420 GENERAL 通则

The requirements of Article 4, Mandatory Appendix III and Mandatory Appendix V, apply except as modified by

this Appendix. 除非本附录另有规定，否则采用第 4章、强制性附录 III 和强制性附录 V中之规定。

X-421 WRITTEN PROCEDURE REQUIREMENTS 书面规程之规定

X-421.1 Requirements. The examination shall be performed in accordance with a written procedure which shall, as a minimum, contain the requirements of Table T-421, Table X-421, and as applicable, Table III-422 or Table V-421. The

written procedure shall establish a single value, or range of values, for each requirement. 要求。应按照书面规程进行

检测，而书面规程应至少包含表 T-421、表 X-421以及相应所适用之表 III-422或表 V-421的要求；书面规程

应为每项要求确定单一值或一系列值的范围。

X-421.2 Procedure Qualification. When procedure qualification is specified, a change of a requirement in Table T-421, Table X-421, and as applicable, Table III-422 or Table V-421 identified as an essential variable shall require requalification of the written procedure by demonstration. A change of a requirement identified as a nonessential varia-ble does not require requalification of the written procedure. All changes of essential or nonessential variables from

those specified within the written procedure shall require revision of, or an addendum to, the written procedure. 书面

规程之鉴定。当规定书面规程被指定需进行鉴定时，在表 T-421、表 X-421和相应所适用之表 III-422或表 V-

421中被认定为重要变量之要求项目若有产生变动时，则书面规程应透过演示重新认可。被认定为非重要变量

之要求项目的更改是不需重新鉴定书面规程的。书面规程中所规定之重要变量或非重要变量的所有变更均需

对书面规程进行修定或补遗。

X-422 SCAN PLAN 扫描计划

A scan plan (documented examination strategy) shall be provided showing search unit placement and movement that provides a standardized and repeatable methodology for the examination. In addition to the information in Table T-421, and as applicable, Table III-422 or Table V-421, the scan plan shall include beam angles and directions with

respect to the weld axis reference point, weld joint geometry, and examination area(s) or zone(s). 应为检测之标准化

和可反复性方法提供一套能显示探头之位置和移动的扫描计划(文件化之检测对策)。除了表 T-421中的讯息之

外，扫查计划应包括相对于焊缝轴线基准点的波束角度和方向、焊接接头几何形状、检测区域或区段的数

量。

X-430 EQUIPMENT 设备

X-431 INSTRUMENT REQUIREMENTS 仪器要求

X-431.1 Instrument. When performing phased array ultrasonic examination, T-431 and the following requirements

shall apply: 仪器。进行相控阵超声波检测时，应采用 T-431及下列之要求：

(a) An ultrasonic array controller shall be used. 应采用超声波数组显示适配器。

(b) The instrument shall be capable of operation at frequencies over the range of at least 1 MHz to 7 MHz and shall be equipped with a stepped gain control in units of 2 dB or less and a maximum gain of at least 60 dB.

该仪器应能在至少 1 MHz至 7 MHz的频率范围内运行，并应配备能以等于和小于 2 dB 刻度之步进式增益旋

钮，且至少为 60 dB 之最大增益。

(c ) The instrument shall have a minimum of 32 pulsers. 该仪器应至少具有 32个脉冲输出。

(d) The digitization rate of the instrument shall be at least 5 times the search unit center frequency. 该仪

器之数位化速率应至少为探头中心频率[也称之为陷波频率(notch frequency)或零频率(null frequency) ]的 5倍。

(e ) Compression setting shall not be greater than that used during qualification of the procedure. 压缩调

定不应大于书面规程于鉴定期间所采用之压缩设定值。压缩调定不应大于书面规程于鉴定期间所采用之压缩

设定值。

When the center frequency is changed, the VSA changes the measurement start and stop frequencies, but does not change the span. For example, in the following picture, changing the center frequency causes the span to "slide" up or down the x axis.

When the center frequency is changed, the VSA automatically sets Time Data to Zoom. For information on other ways to set the Center Frequency, see Changing Frequency Settings.

X-431.2 Data Display and Recording. When performing phased array ultrasonic examination, the following shall

apply: 数据显示和记录。在进行相控阵超声波检测时，应采用下列规定：

(a) The instrument shall be able to select an appropriate portion of the time base within which A-scans

are digitized. 该仪器应具有选用 A-扫描数位化时基线中适当部分的功能。

(b) The instrument shall be able to display A-, B-, C-, D-, and S-scans in a color palette able to differenti-

ate between Amplitude levels. 该仪器应具有能够区分不同振幅水平间在调阶盘中显示A-、B-、C-、D-和 S-扫描

之功能。

(c ) The equipment shall permit stor age of all A-scan waveform data, with a range defined by gates, in-

cluding Amplitude and time-base details. 该设备应能贮存所有 A-扫描波形数据，其范围由选通电路所限定，包

括振幅和时基之具体内容。

(d) The equipment shall store positional information indicating the relative position of the waveform

with respect to adjacent waveform(s), i.e., encoded position. 该设备应贮存位置，以显示相邻两波形间的相对位置

(即编码位置)。

X-432 SEARCH UNITS▲

探头

When performing phased array ultrasonic examination, the following shall apply: 在进行相控阵超声波检测时，

应采用如下规定：

(a) The nominal frequency shall be from 1 MHz to 7 MHz unless variables, such as production crystalline

microstructure, require the use of other frequencies to assure adequate penetration or better resolution. 除非产品材料

晶体粒结构等变量需采用其他频率以确保足够的穿透力或更好的分辨率，否则标称频率应为 1 MHz至 5

MHz。

Table X-421 Requirements of an Ultrasonic Examination Procedure for HDPE Techniques

表 X-421 用于 HDPE技术之超声波检测规程要求 Requirements (as Applicable)

要求(适用时)

Essential Variable

重要变量


非重要变量


Examination technique(s) 检测技术 X . . .

Computer software and revision 计算器软件和版次 X . . .

Scanning technique (automated versus semi-automated) 扫描技术(自动化与半自

动化) X . . .

Flaw characterization methodology 缺陷特性记述法 X . . .

Flaw sizing (length) methodology 缺陷大小(长度)之测定方法 X . . .

Scanner (manufacturing and model) and adhering and guiding mechanism扫查仪(制造和模型)、联轴器和导向装置

X . . .

(b) Longitudinal wave mode shall be used. 应采用纵波模式。

(c ) The number of elements used shall be between 32 and 128. 所采用之入射波数应在 32至 128之间。

(d) Search units with angled wedges may be used to aid coupling of the ultrasound into the inspection area. 可

采用具有轮廓接触楔之探头以协助将超声波耦合到检验区域。

▲ Scanning technique (auto vs. semi auto) = Flaw sizing methodology = Search unit mechanical fixturing de-vice = Scanner and adhering and guiding mechanism

X-434 CALIBRATION BLOCKS 校准试块

X-434.1 General 通则

X-434.1.1 Reflectors. The reference reflector shall be a side-drilled hole (SDH) with a maximum diameter of 0.080 in.

(2 mm). 反射体。参考反射体应是带有最大直径为 0.080 in. (2 mm)之侧横孔(SDH)。

X-434.1.2 Material. The block shall be fabricated from pipe of the same material designation as the pipe material to

be examined. 材质。该试块应由具有相同材料名称之检测管材所制成。

X-434.1.3 Quality. In addition to the requirements of T-434.1.3, areas that contain indications that are not attributable

to geometry are unacceptable, regardless of Amplitude. 质量。除 T-434.1.3之要求以外，无论振幅如何，凡存在

不能归因于几何形状所引起的迹象是不可接受的。

X-434.3 Piping Calibration Blocks. The calibration block as a minimum shall contain 1/4T and 3/4T SDHs where T is the calibration block thickness. The calibration block shall be at least as thick as the pipe being examined. The block

size and reflector locations shall allow for the calibration of the beam angles used that cover the volume of interest. 管

道校准试块。校准试块至少应包含 1 / 4T 和 3 / 4T 侧横孔，其中 T 是校准试块之厚度，而校准试块应至少与被

检管道一样的厚度。试块尺寸和反射体位置应适用于所采用之斜束波角度的校准操作，以涵盖整个受检额。

X-460 CALIBRATION 校准

X-462 GENERAL CALIBRATION REQUIREMENTS 通用校准要求

X-462.6 Temperature. The temperature differential between the original calibration and examination surfaces shall

be within 18°F (10°C). 温度。首要校准和检测面间的温差应在 18°F (10°C) 以内。

X-464 CALIBRATION FOR PIPING 管道校准

X-464.1 System Calibration for Distance–Amplitude Techniques 距离 - 振幅技术之系统校准

X-464.1.1 Calibration Block(s). Calibrations shall be performed utilizing the calibration block refer-

enced in X-434.3. 校准试块。应采用 X-434.3中所引用之校准试块来进行校准。

X-464.1.2 Straight Beam Calibration. Straight beam calibration is not required. 直束波校准。不需要

直束波校准。

X-464.2 System Calibration for Non-Distance Amplitude Techniques. Calibrations include all those actions re-quired to assure that the sensitivity and accuracy of the signal Amplitude and time outputs of the examination system (whether displayed, recorded, or automatically processed) are repeated from examination to examination. Calibration

shall be by use of the calibration block specified in X-434.3. 无延时振幅技术之系统校准。为确保检测系统之讯号

振幅和时间输出(无论是显示，记录还是自动处理)的灵敏度和精度之所有必须措施，都是源至于在检测期间反

复所需校准。校准应采用 X-434.3中所规定之校准试块。

X-467 CALIBRATION CONFIRMATION 校准确认

X-467.1 System Changes. When any part of the examination system is changed, a calibration check shall be made on the calibration block to verify that distance range point and sensitivity setting(s) of the calibration reflector with the

longest sound path used in the calibration satisfy the requirements of X-467.3. 系统变化。当检测系统之任何部分产

生改变时，应在标准校准试块上进行校准校对，以验证反射体距离范围基本点和在校准中具有最大声道之反

射体灵敏度设置是否满足 X -467.3的要求。

X-467.2 Calibration Checks. A calibration check on at least one of the reflectors in the calibration block or a check using a simulator shall be performed at the completion of each examination or series of similar examinations, and when examination personnel (except for automated equipment) are changed. The distance range and sensitivity values rec-

orded shall satisfy the requirements of X-467.3. 校准校对。在每次检测或一系列类似检测完成时，以及检测人员

(自动化设备除外)更换时，应对标准校准试块中之至少一个反射体进行校准校对或采用模拟试件进行校对。所

记录之距离范围和灵敏度值应满足 X-467.3的要求。

X-467.2.1 Material Verification. When examining material from a different production lot from that of the calibration block, a verification of the material velocity shall be made using a machined radius on a block manufac-tured from the new lot and any difference in the results be compensated for in both velocity and gain level.

材料验证。当所要检测之材料不同于制造校准试块所采用生产批次的材料时，应在采用新批量材料所制成试

块上的加工半径来进行材料声速的验证，且在结果上之任何差异将在速度和增益水平中获得补正。

X-467.2.2 Temperature Variation. If during the course of the examination, the temperature differential be-tween the calibration block used during the most recent calibration and examination surface varies by more than 18°F

(10°C), recalibration is required. 温度变化。若在检测过程中发生上一次所校准之温度与目前所要检测表面之温

差大于 18°F(10°C)时，则需重新进行校准。

NOTE: Interim calibration checks between the required initial calibration and the final calibra-tion check may be performed. The decision to perform interim calibration checks should be based on ultrasonic instru-ment stability (analog vs. digital), the risk of having to conduct reexaminations, and the benefit of not performing in-

terim calibration checks. 注：可在首次校准和最进一次校准之间执行所需的临时校准。决定是否执行临时校准

校对应根据超声仪器的稳定性(模拟与数位)、进行再检测的风险，以及不进行临时校准校对的好处来确认。

X-467.3 Confirmation Acceptance Values 确认允收值

X-467.3.1 Distance Range Points. If the distance range point for the deepest reflector used in the calibra-tion has moved by more than 10% of the distance reading or 5% of full sweep, whichever is greater, correct the dis-tance range calibration and note the correction in the examination record. All recorded indications since the last valid calibration or calibration check shall be reexamined and their values shall be changed on the data sheets or rerecorded.

距离范围基本点。若校准中所采用之最远反射体的距离范围点移动超过距离读数的 10％或全扫描的 5％(以较

大者为准)，则校正距离范围校准，并将该修正注释在检测记录中之勘误表上。自上次有效校准或校准校对以

来之所有记录在案之指示应重新检测，并在数据表中之勘误表上注释该修正或重新记录。

X-467.3.2 Sensitivity Settings. If the sensitivity setting for the deepest reflector used in the calibration has changed by less than 4 dB, compensate for the difference when performing the data analysis and note the correc-tion in the examination record. If the sensitivity setting has changed by more than 4 dB, the examination shall be re-

peated. 灵敏度设置关键帧。若校准中所采用之最远反射体灵敏度设置关键帧已降低 4 dB，则在执行数据分析

时补偿此差异，并将该修正注释在检测记录中之勘误表上。若灵敏度设置关键帧变化超过 4 dB，则应再次进

行检测。

X-470 EXAMINATION 检测

X-471 GENERAL EXAMINATION REQUIREMENTS 通用检测要求

X-471.1 Examination Coverage. The examination volume shall be as shown in Figure X-471.1below. 检测范围。整

个检测额如下图 X-471.1所示。

X-471.6 Recording. A-scan data shall be recorded for the area of interest in a form consistent with the applicable

Code Section requirement, and recording increments with a maximum of 纪录。被检测区域之 A-扫查数据应以与

适用规范章节要求一致的格式进行，并记录如下最大增量：记录。被检测区域之 A-扫查数据应以无阈值处理

格式进行记录，最小数位化速率为检测频率的 5倍，并记录如下最大增量：

(a) 0.04 in. (1 mm) for material less than 3 in. (75 mm) thick 厚度 < 3 in. (75 mm)的材料为 0.04 in. (1 mm)

(b) 0.08 in. (2 mm) for material greater than 3 in. (75 mm) thick 厚度 ≥ 3英寸(75毫米)的材料为 0.08 in. (2 mm)

X-490 DOCUMENTATION

X-492 EXAMINATION RECORD

A-scan recorded data need only be retained until final flaw evaluation has been performed or as specified by the referencing Code Section.

Figure X-471.1 Fusion Pipe Joint Examination Volume

图 X-471.1 熔接管接头检测额

NONMANDATORY APPENDIX A LAYOUT OF

VESSEL REFERENCE POINTS

非强制性附录 A 容器各参考点的布局

A-410 SCOPE 适用范围

This Appendix provides requirements for establishing vessel reference points. 本附录提供了在建立容器各参考

点时之相关要求。

A-440 MISCELLANEOUS REQUIREMENTS 杂项要求

The layout of the weld shall consist of placing reference points on the center line of the weld. The spacing of the reference points shall be in equal increments (e.g., 12 in., 3 ft, 1 m, etc.) and identified with numbers (e.g., 0, 1, 2, 3, 4, etc.). The increment spacing, number of points, and starting point shall be recorded on the reporting form. The weld

Area of interest 受检测区域

A-B-C-D

1/4 in. [8 mm] 1/4 in. [8 mm]

center line shall be the divider for the two examination surfaces. 焊缝布局应包括将各参考点布置在焊缝轴在线。

各参考点间之间距应为相等的增量(例如以 2 in.、3 ft、1 m增量等)，并用数位(例如，0、1、2、3、4等)方式

标别各参考点。增量间距、各参考点之数位码和起始点应记录在报表上。焊缝轴线应是两个检测面的分界

线。

A-441 CIRCUMFERENTIAL (GIRTH) WELDS 周向(环向)焊缝

The standard starting point shall be the 0 deg axis of the vessel. The reference points shall be numbered in a clock-wise direction, as viewed from the top of the vessel or, for horizontal vessels, from the inlet end of the vessel. The ex-

amination surfaces shall be identified (e.g., for vertical vessels, as being either above or below the weld). 标准起始点

应是容器的 0度轴。各参考点应按顺时针方向进行编码，如从容器之顶部或卧式容器从容器之入口端之所

示。检测面应有可被清楚进行核对之标识符(例如，垂直容器、位于焊缝的上方或下方)。

A-442 LONGITUDINAL WELDS 纵向焊缝

Longitudinal welds shall be laid out from the center line of circumferential welds at the top end of the weld or, for horizontal vessels, the end of the weld closest to the inlet end of the vessel. The examination surface shall be identified as clockwise or counterclockwise as viewed from the top of the vessel or, for horizontal vessels, from the inlet end of

the vessel. 纵向焊缝应从在焊缝最顶端处之环向焊缝轴线一路而下布置，或卧式容器则从最靠近容器入口端之

焊缝端部沿水平轴线一路朝出口端布置。检测面应从容器顶部或从卧式容器入口端关看之视图沿顺时针或逆

时针方向作出可被清楚进行核对之标识符。

A-443 NOZZLE-TO-VESSEL WELDS 接管焊至容器壳之焊缝

The external reference circle shall have a sufficient radius so that the circle falls on the vessel’s external surface be-yond the weld’s fillet. The internal reference circle shall have a sufficient radius so that the circle falls within 1/2 in. (13 mm) of the weld center-line. The 0 deg point on the weld shall be the top of the nozzle. The 0 deg point for welds of veritcally oriented nozzles shall be located at the 0 deg axis of the vessel, or, for horizontal vessels, the point closest to the inlet end of the vessel. Angular layout of the weld shall be made clockwise on the external surface and counter-clockwise on the internal surface. The 0 deg, 90 deg, 180 deg, and 270 deg lines will be marked on all nozzle welds examined; 30 deg increment lines shall be marked on nozzle welds greater than a nominal 8 in. (200 mm) diameter; 15 deg increment lines shall be marked on nozzle welds greater than a nominal 24 in. (600 mm) diameter; 5 deg increment

lines shall be marked on nozzle welds greater than 48 in. (1 200 mm) diameter. 接管焊至容器壳之焊缝外部参考圆

应具有足够的半径，以使最外端之角焊缝可投影在容器外表面所构成之圆形平面内。内部参考圆应具有足够

的半径，以使容器壳内侧角焊缝轴线在朝容器中心点之 1/2 in. (13 mm)范围内可投影在其所构成之圆形平面

内。焊缝上的 0度点应为接管之顶端。垂直定向接管之焊缝 0度点应位于容器的 0度轴上，或位于最接近容器

入口端之卧式容器中。在外表面上之焊缝角度布局应为顺时针，且在内表面上为逆时针。在所有受检接管焊

缝上应标示出 0度、90度、180度和 270度线；应在标称直径大于 8 in. (200 mm)之接管焊缝上以每 30度增量

方式定出各标记线；应在标称直径大于 24 in. (600 mm)之接管焊缝上以每 15度增量方式定出各标记线；应在

标称直径大于 48 in. (1 200 mm)之接管焊缝上以每 5度增量方式定出各标记线。

NONMANDATORY APPENDIX B GENERAL

TECHNIQUES FOR ANGLE BEAM CALIBRATIONS

非强制性附录 B 斜束波通用校准技术

B-410 SCOPE 适用范围本

This Appendix provides general techniques for angle beam calibration. Other techniques may be used.附录为斜束

波提供了通用校准技术。不在本附录中之其他技术亦可采用。

Descriptions and figures for the general techniques relate position and depth of the reflector to eighths of the V-

path. The sweep range may be calibrated in terms of units of metal path,22 projected surface distance or actual depth to the reflector (as shown in Figures B-461.1, B-461.2, and B-461.3). The particular method may be selected according to

the preference of the examiner. 通用技术之描述和图形将反射体之位置和深度与V-声程的八分之一相关联。以

金属声程之投影表面距离或反射体实际深度(如图 B-461.1、B-461.2和 B-461.3所示)为单位来对扫查范围进行

校准。可根据检测者之偏好来选用特定方法。

B-460 CALIBRATION 校准

B-461 SWEEP RANGE CALIBRATION 扫描范围校准

B-461.1 Side Drilled Holes (See Figure B-461.1) 侧横孔(见图 B-461.1)

B-461.1.1 Delay Control Adjustment. Position the search unit for the maximum first indication from the

1/4T side-drilled hole (SDH). Adjust the left edge of this indication to line 2 on the screen with the delay control. 藉由

延时控制旋钮所进行之调整。将探头定位在来至 1 / 4T 侧横孔(SDH)之最大第一次回波讯号指示处，以延时控

制旋钮将该指示讯号的左前缘被调整到屏幕扫查线的第 2行。

B-461.1.2 Range Control Adjustment.23 Position the search unit for the maximum indication from the

3/4T SDH. Adjust the left edge of this indication to line 6 on the screen with the range control. 藉由范围控制旋钮所

进行之调整。将探头定位在来至 3/4T SDH 回波讯号的最大指示位置处。利用范围控制旋钮将该指示的左前缘

被调整到屏幕扫查线的第 6行。

B-461.1.3 Repeat Adjustments. Repeat delay and range control adjustments until the 1/4T and 3/4T SDH

indications start at sweep lines 2 and 6. 重复调整。以控制旋钮对延时和扫查范围进行反复调整，直到将 1/4T 和

3/4T SDH 之回波指示讯号分别被调整到屏幕扫查线 2和扫查线 6开始。

B-461.1.4 Notch Indication. Position the search unit for maximum response from the square notch on the

opposite surface. The indication will appear near sweep line 8. 槽口指示。将探头定位在来至底面方形槽口之最大

灵敏度处，而此讯号会出现在扫查线 8附近。

B-461.1.5 Sweep Readings. Two divisions on the sweep now equal 1/4T. 扫查读数。现在在扫查在线的

两组读数均等于 1/4T。

B-461.2 IIW Block (See Figure B-461.2). IIW Reference Blocks may be used to calibrate the sweep range displayed on the instrument screen. They have the advantage of providing reflectors at precise distances that are not affected by side-drilled hole location inaccuracies in the basic calibration block or the fact that the reflector is not at the side-drilled hole center line. These blocks are made in a variety of alloys and configurations. Angle beam range calibrations are provided from the 4 in. (100 mm) radius and other reflectors. The calibration block shown in Figure B-461.2 provides an indication at 4 in. (100 mm) and a second indication from a reflection from the vertical notches at the center point 8 in. (200 mm) back to the radius and returning to the transducer when the exit point of the wedge is directly over the center point of the radius. Other IIW blocks provide signals at 2 in. (50 mm) and 4 in. (100 mm) and a third design pro-

vides indications at 4 in. (100 mm) and 9 in. (225 mm). IIW试块(见图 B-461.2)。 IIW 参考试块可用于校准仪器屏

幕上所显示之扫查范围，IIW 参考试块之优点是其中各反射体均在精确的距离处，因此不受标准校准块中侧横

孔位置的不精确性或反射体不在侧钻孔中心在线的影响。这些试块可由不同种类之合金和构造所制成。可利

用 4 in. (100 mm)半径之圆弧面和其他反射体提供来校准斜束波范围。当楔块反射点直接在半径之中心点时，

则图 B-461.2所示之校准块提供了 4 in. (100 mm)的回波指示，且来至垂直槽口之第二回波指示先反射到楔块

圆弧面然后再折射到换能器，而第二指示之中心点显示在 8 in. (200 mm)处；第二种 IIW 试块可提供回波讯号

在 2 in. (50 mm)和 4 in. (100 mm)处，而第三种设计之 IIW 试块可提供回波指示在 4 in. (100 mm)和 9 in. (225

mm)处。

Figure B-461.1 Sweep Range (Side-Drilled Holes) 图 B-461.1 扫查范围(侧横孔)

Sweep range 扫查范围

B-461.2.1 Search Unit Adjustment. Position the search unit for the maximum indication from the 4 in.

(100 mm) radius while rotating it side to side to also maximize the second reflector indication. 探头调整。将探头定

位在可从 4 in. (100 mm)半径圆弧面获得最大回波讯号指示处，同时将探头从一侧转动到另一侧那也可得到第

二个最大反射体回波指示。

B-461.2.2 Delay and Range Control Adjustment. Without moving the search unit, adjust the range and

delay controls so that the indications start at their respective metal path distances. 藉由延时和范围控制旋钮之调整。

在不移动探头下，藉由范围和延时控制旋钮进行调整，以使指示起始于各自的金属声程距离。

B-461.2.3 Repeat Adjustments. Repeat delay and range control adjustments until the two indications are

at their proper metal path on the screen. 反复调整。反复操作旋钮以对延时和范围进行调整，直到两个指示在屏

Delay 延时 Range 范围

In-line holes and notches will be used for angle beam calibration. 用于斜束波校准

之成一直线布置的各孔和槽口

Reflectors moved into beam 已移动到反射体

中之波束

幕上显示出他们的正确金属声程。

Figure B-461.2 Sweep Range (IIW Block)

图 B-461.2 扫查范围(IIW块)

B-461.2.4 Sweep Readings. Two divisions on the sweep now equal 1/5 of the screen range selected. 扫查

读数。现在在扫查在线的两组读数均等于所选用屏幕范围的五分之一。

B-461.3 Piping Block (See Figure B-461.3). The notches in piping calibration blocks may be used to calibrate the distance range displayed on the instrument screen. They have the advantage of providing reflectors at precise dis-

tances to the inside and outside surfaces. 管道试块(见图 B-461.3)。管道校准试块中之槽口可用于校准仪器屏幕上

所显示的距离范围，管道试块之优点是其中各反射体均向向内表和外表面提供精确的距离。

B-461.3.1 Delay Control Adjustment. Position the search unit for the maximum first indication from the inside surface notch at its actual beam path on the instrument screen. Adjust the left edge of this indication to its metal

path on the screen with the delay control. 藉由延时控制旋钮所进行之调整。将探头定位在来至内表面槽口的最大

第一指示定位之最大第一次回波讯号指示处，以延时控制旋钮将该指示讯号的左前缘被调整到其在屏幕上的

金属路径。

B-461.3.2 Range Control Adjustment. Position the search unit for the maximum second indication from the outside surface notch. Adjust the left edge of this indication to its metal on the screen with the range control or ve-

locity control. 藉由范围控制旋钮所进行之调整。将探头定位在来至外表面缺口之最大第二回波讯号指示处，

以藉由制旋钮对范围或速度进行调整，直到将该指示的左前缘被调整到其在屏幕上的金属路径。

Figure B-461.3 Sweep Range (Notches)

图 B-461.3 扫查范围(槽口)

Full Vee Path 全 V-声程 Half Vee Path 半 V-声程

Delay 延时

Range 范围

B-461.3.3 Repeat Adjustments. Repeat delay and range control adjustments until the two indications are

at their proper metal paths on the screen. 反复调整。反复操作旋钮以对延时和范围进行调整，直到两个指示在屏

幕上显示出他们的正确金属声程。

B-461.3.4 Sweep Readings. Two divisions on the sweep now equal one-fifth of the screen range selected.

扫查读数。现在在扫查在线的两组读数均等于所选用屏幕范围的五分之一。

B-462 DISTANCE–AMPLITUDE CORRECTION 距离-振幅校正

B-462.1 Calibration for Side-Drilled Holes Primary Reference Level From Clad Side (See Figure B-462.1)

从堆焊层侧校准侧横孔之首要参照电平(参见图 B-462.1)

(a) Position the search unit for maximum response from the SDH, which gives the highest Amplitude. 将

探头定位在能获得最大振幅之 SDH 所显示的最大灵敏度处。

(b) Adjust the sensitivity (gain) control to provide an indication of 80% (±5%) of full screen height

(FSH). Mark the peak of the indication on the screen. 以控制旋钮对灵敏度(增益)进行调整，以提供所显示之讯号

可达到全屏高度(FSH)的 80％(±5％)，且在屏幕上标记该指示之峰值。

(c) Position the search unit for maximum response from another SDH. 将探头定位在能获得来自第二

个 SDH 所显示之最大灵敏度处。

(d) Mark the peak of the indication on the screen. 在屏幕上标记第二个 SDH 指示的峰值。

(e) Position the search unit for maximum Amplitude from the third SDH and mark the peak on the

screen. 将探头定位在能获得第三个 SDH 所显示之最大振幅处，并在屏幕上标出第三个 SDH 的峰值。

(f) Position the search unit for maximum Amplitude from the 3/4T SDH after the beam has bounced from the opposite surface. The indication should appear near sweep line 10. Mark the peak on the screen for the 3/4T

position. 在波束从背反射后，探头定位在来至 3/4T SDH 所显示之之最大幅度处，且指示应出现在扫描线 10附

近，然后在屏幕上标记 3 / 4T 位置的峰值。

(g) Connect the screen marks for the SDHs to provide the distance–Amplitude curve (DAC). 联结在屏幕

上所标记之 SDH 峰值以获得距离 - 振幅曲线(DAC)。

(h) For calibration correction for perpendicular reflectors at the opposite surface, refer toB-465. 在底面

处之垂直反射体的校准校正，请参阅 B-465

B-462.2 Calibration for Side-Drilled Holes Primary Reference Level From Unclad Side (See Figure B-

462.1) 侧横孔首要参照电平之校准(见图 B-462.1)

(a) From the clad side of the block, determine the dB change in Amplitude between the 3/4T and 5/4T

SDH positions. 从试块之堆焊侧确定在 3/4T 和 5/4T SDH 位置间的振幅 dB 变化。

(b) From the unclad side, perform calibrations as noted in B-462.1(a) through B-462.1(e). 从非堆焊侧

进行 B-462.1(a)至 B-462.1(e)所述的校准。

(c) To determine the Amplitude for the 5/4T SDH position, position the search unit for maximum Am-plitude from the 3/4T SDH. Decrease the signal Amplitude by the number of dB determined in (a) above. Mark the

height of this signal Amplitude at sweep line 10 (5/4T position). 为确定 5/4T SDH 位置之振幅，将探头定位在能获

得来至 3/4T SDH 之最大振幅处。将该讯号振幅减去在(a)中所确定的 dB 数。标记该讯号在扫描线 10(5/4T 位

置)处的振幅高度。

(d) Connect the screen marks to provide the DAC. This will permit evaluation of indications down to the

clad surface (near sweep line 8). 联结屏幕上之各标记以获得 DAC，可利用这条线所能评估之范围可直到堆焊层

表面(靠近扫查线 8附近)。

(e) For calibration correction for perpendicular planar reflectors near the opposite surface, refer toB-465.

对邻接底面附近之垂直反射体所进行校准校正，请参阅 B-465。

B-462.3 Calibration for Piping Notches Primary Reference Level (See Figure B-462.3) 管道槽口首要参照

电平之校准(见图 B-462.3)

(a) Position the search unit for maximum response from the notch which gives the highest Amplitude. 将

探头定位在能获得来至槽口最大振幅之最大灵敏度处。

(b) Adjust the sensitivity (gain) control to provide an indication of 80% (±5%) of full screen height

(FSH). Mark the peak of the indication on the screen. 藉由控制旋钮对灵敏度(增益)进行调整，以使所显示之讯号

达到满屏(FSH)的 80％(±5％)，同时在屏幕上标记出此指示之峰值。

(c) Without changing the gain, position the search unit for maximum response from another notch. 在不

改变增益的情况下，将探头定位在能获得来至第二个槽口的最大灵敏度处。

(d) Mark the peak of the indication on the screen. 在屏幕上标记出二个槽口之峰值。

(e) Position the search unit for maximum Amplitude from the remaining notch at its Half Vee, Full Vee

or 3/2 Vee beam paths and mark the peak on the screen. 将探头定位在半-V、全-V、3/2-V 波束声程中各自所能保

持之最大槽口回波振幅处，并屏幕上标记各峰值。

(f) Position the search unit for maximum Amplitude from any additional Vee Path(s) when used and

mark the peak(s) on the screen. 当采用 V 形波束时，将探头定位在能获得来至任何其他 V 形波束定声程之最大

幅度处，并屏幕上标记各峰值。当采用 V 形波束时，将探头定位在能获得来至任何其他 V形波束定声程之最

大幅度处，并屏幕上标记各峰值。

(g) Connect the screen marks for the notches to provide the distance–Amplitude curve (DAC). 联接在

屏幕上所标记之各槽口回波峰值以作出距离 - 振幅曲线(DAC)。

(h) These points also may be captured by the ultrasonic instrument and electronically displayed. 这些点

亦可被超声波仪器所探测到并可用电子可视方式被显示出来。

Figure B-462.1 Sensitivity and Distance–Amplitude Correction (Side-Drilled Holes)

图 B-462.3 灵敏度和距离-振幅校正(侧横孔)

Sensitivity 灵敏度 Distance Amplitude 距离振福

B-463 DISTANCE–AMPLITUDE CORRECTION INNER 1/4 VOLUME (SEE NON-

MANDATORY APPENDIX J, FIGURE J-431 VIEW A) 内部四分之一额之距离-振

幅校正(见非强制性附录 J，图 J-431 中之视图 A)

B-463.1 Number of Beam Angles. The 1/4 volume angle calibration requirement may be satisfied by using one

or more beams as required to calibrate on 1/8 in. (3 mm) maximum diameter side-drilled holes in that volume. 波束角

度。可以通过采用一个或多个波束来满足 1/4额角度校准要求，以便在该额上之 1/8 in. (3 mm)最大直径横孔侧

上进行校准。

Sensitivity

Reflectors moved

into beam

Reflectors moved into beam已移动到反射体

中之波束 In-line holes and notches

will be used for angle beam calibration. 用于斜

束波校准之成一直线布置

的各孔和槽口

In-line holes and notches

will be used for angle

beam calibration.

Figure B-462.3 Sensitivity and Distance–Amplitude Correction (Notches)

图 B-462.3 灵敏度和距离-振幅校正(槽口)

B-463.2 Calibration From Unclad Surface. When the examination is performed from the outside surface, cali-brate on the 1/8 in. (3 mm) diameter side-drilled holes to provide the shape of the DAC from 1/2 in. (13 mm) to 1/4T depth. Set the gain to make the indication from 1/8 in. (3 mm) diameter side-drilled hole at 1/4T depth as determined in B-462.1 or B-462.2 above. Without changing the gain, determine the screen height of the other near surface indica-tions from the remaining 1/8 in. (3 mm) diameter side-drilled holes from 1/2 in. (13 mm) deep to the 1/8 in. (3 mm) diameter side-drilled hole just short of the 1/4T depth. Connect the indication peaks to complete the near surface DAC

curve. Return the gain setting to that determined in B-462.1 or B-462.2. 从非堆焊层表面所进行之校准。当从外部

表面进行检测时，在 1/8 in. (3 mm)直径之侧横孔上进行校准，以获得 1/2 in. (13 mm)至 1/4T 深度之 DAC 外

形。将增益设定为与 B-462.1或 B-462.2中在 1 / 4T 深度处对来至 1/8 in. (3 mm)直径侧横孔讯号所确定之指示

振幅高度。在不改变增益的情况下，从 1/2 in. (13 mm)深到 1/8 in. (3 mm)直径侧横孔，1/8 in. (3 mm)直径侧横

孔对近表面指示所能保持近表面指示的屏幕高度刚好在 1/4T 深度之外。联接各指示峰值点以完成近表面 DAC

曲线。反复调整增益设置直到能获得B-462.1或 B-462.2中所确定的状况。从非堆焊层表面所进行之校准。当

从外部表面进行检测时，在 1/8 in. (3 mm)直径之侧横孔上进行校准，以获得 1/2 in. (13 mm)至 1/4T 深度之

DAC 外形。将增益设定为与 B-462.1或 B-462.2中在 1 / 4T 深度处对来至 1/8 in. (3 mm)直径侧横孔讯号所确定

之指示振幅高度。在不改变增益的情况下，从 1/2 in. (13 mm)深到 1/8 in. (3 mm)直径侧横孔，1/8 in. (3 mm)直

径侧横孔对近表面指示所能保持近表面指示的屏幕高度刚好在 1/4T 深度之外。联接各指示峰值点以完成近表

面 DAC 曲线。反复调整增益设置直到能获得 B-462.1或 B-462.2中所确定的状况。

B-463.3 Calibration From Clad Surface. When the examination is performed from the inside surface, cali-brate on the 1/8 in. (3 mm) diameter side-drilled holes to provide the shape of the DAC and the gain setting, as per B-

463.2 above. 从堆焊层表面校准。当从内表面进行检查时，在 1/8 in. (3 mm) 直径之侧横孔上进行校准，以作出

如 B-463.2所示之 DAC 外形和增益设置。

B-464 POSITION CALIBRATION (SEE FIGURE B-464) 位置校准(见图 B-464)

The following measurements may be made with a ruler, scale, or marked on an indexing strip.24 可用直尺、比

例尺或在索引条上之标记来进行以下测量：

B-464.1 1/4T SDH Indication. Position the search unit for maximum response from the 1/4T SDH. Place one end of the indexing strip against the front of the search unit, the other end extending in the direction of the beam. Mark the number 2 on the indexing strip at the scribe line which is directly above the SDH. (If the search unit covers the

scribe line, the marks may be made on the side of the search unit.) 来至 1/4T SDH讯号之指示。将探头定位在可获

得来自 1/4T SDH 之最大灵敏度处。将索引条之一端靠在探头的前部，另一端沿波束方向延伸。在直接位于

SDH 正上方之划片槽处于索引条上标记数位 2。 (若探头涵盖了该划片槽，则可将该数位符号标记在探头之侧

面上)。

B-464.2 1/2T and 3/4T SDH Indications. Position the search unit for maximum indications from the 1/2T and 3/4T SDHs. Keep the same end of the indexing strip against the front of the search unit. Mark the numbers 4 and 6 on

the indexing strip at the scribe line, which are directly above the SDHs. 来至 1/2T和 3/4T SDH 讯号之指示。将探

头定位在可获得来自 1/2T 和 3/4T SDH 讯号之最大指示处。将索引条的同一端保持在探头的正面。在直接位

于 SDH 正上方之划片槽处于索引条上标记数位 4和 6。

B-464.3 5/4T SDH Indication. If possible, position the search unit so that the beam bounces from the opposite surface to the 3/4T SDH. Mark the number 10 on the indexing strip at the scribe line, which is directly above the SDH.

来至 5/4T SDH响应讯息所显示之指示。若可能的，将探头定位在可获得来自经 3/4T SDH 反射至底面而产生

底面回波讯号的位置处。在直接位于 SDH 正上方之划片槽处于索引条上标记数位 10。

B-464.4 Notch Indication. Position the search unit for the maximum opposite surface notch indication. Mark

the number 8 on the indexing strip at the scribe line, which is directly above the notch. 槽口指示。将探头定位在可

获得来自槽口下表面折折射波讯号所显示之最大指示处。在直接位于 SDH正上方之划片槽处于索引条上标记

数位 8。

B-464.5 Index Numbers. The numbers on the indexing strip indicate the position directly over the reflector in

sixteenths of the V-path. 索引号。索引条上的数字用于表示直接位于十六分之一 V-声程中之反射体正上方位置

处。

Figure B-464 Position Depth and Beam Path

图 B-464 位置深度和波束声程

Position depth 位置深度 Position beam path 位置波束声程

B-464.6 Depth. The depth from the examination surface to the reflector is T at 8, 3/4T at 6 and 10, 1/2T at 4, 1/4T at 2, and 0 at 0. Interpolation is possible for smaller increments of depth. The position marks on the indexing strip may be corrected for the radius of the hole if the radius is considered significant to the accuracy of reflector’s location.

深度。从检测面到反射体的深度(T) ，在标记号 8处为 T，在标记号 6和 10处为 3/4T，在标记号 4处为

1/2T，在标记号 2处为 1/4T，在标记号为 0处即表示检测面，对较小的深度增量可采用插值。若半径被视为

会影响反射体位置的准确性时，则索引条上的位置标记可以针对孔半径进行修正。

B-465 CALIBRATION CORRECTION FOR PLANAR REFLECTORS PERPENDIC-ULAR TO THE EXAMINATION SURFACE AT OR NEAR THE OPPOSITE

SURFACE (SEE FIGURE B-465) B-465 用于垂直于检测面或近底面之平面形反射体的

校准校正(见图 B-465)

A 45 deg angle beam shear wave reflects well from a corner reflector. However, mode conversion and redirection of reflection occurs to part of the beam when a 60 deg angle beam shear wave hits the same reflector. This problem also exists to a lesser degree throughout the 50 deg to 70 deg angle beam shear wave range. Therefore, a correction is

required in order to be equally critical of such an imperfection regardless of the examination beam angle. 一种 45º斜

Reflectors moved into beam

已移动到反射体中之波束

束切变波可从一个角反射体得到良好的反射；然而，当 60º波束切变波射到相同的反射体时，部分波束会产生

模式转换和反射方向的改变。在 50º至 70º之斜束切变波范围内也都存在着较小程度的此问题，为求对这类缺

陷有等同的准则，因此，无论检查光束角度如何，都需进行矫正。

B-465.1 Notch Indication. Position the search unit for maximum Amplitude from the notch on the opposite sur-

face. Mark the peak of the indication with an “X” on the screen. 槽口讯号。将探头定位在可获得来自底面槽口反射

波讯号所显示之最大振幅处。在屏幕上以“X”标记该指示之峰值。

B-465.2 45 deg vs. 60 deg. The opposite surface notch may give an indication 2 to 1 above DAC for a 45 deg shear wave, but only 1/2 DAC for a 60 deg shear wave. Therefore, the indications from the notch shall be considered

when evaluating reflectors at the opposite surface. 45º对 60º。底面槽口采用 45º切变波进行检测时，可获得比

DAC 高出 1 倍的讯号，但是若采用 60º之切变波时则仅能获得 DAC 的一半。因此，在评估背反射体时，应顾

及来至槽口的讯号。

Figure B-465 Planar Reflections

图 B-465 平面形反射体

B-466 BEAM SPREAD (SEE FIGURE B-466) 波束展开度(见图 B-466)

Measurements of beam spread shall be made on the hemispherical bottom of round bottom holes (RBHs). The half maximum Amplitude limit of the primary lobe of the beam shall be plotted by manipulating the search unit for meas-

urements on reflections from the RBHs as follows. 应在圆底孔(RBH)之半球形底部上进行波束展开度测定。应藉

由探头的操作对来自于如下 RBH 反射体上所进行之测定来绘制主波瓣半波高最大振幅范围。

B-466.1 Toward 1/4T Hole. Set the maximum indication from the 1/4T RBH at 80% of FSH. Move search unit

toward the hole until the indication equals 40% of FSH. Mark the beam center line “toward” position on the block. 移

向 1/4T 孔。将来至 1/4T RBH 之最大讯号高度设定为满屏的 80％。朝该孔移动探头，直到讯号高度降低到满

屏的 40％。在试块上标记出波束中心线"往前移"之位置。

B-466.2 Away From 1/4T Hole. Repeat B-466.1, except move search unit away from the hole until the indica-

tion equals 40% of FSH. Mark the beam center line “away” position on the block. 移离 1/4T 孔。除将探头从该孔讯

号高度为满屏的 80％移至该孔讯号高度降低到满屏的 40％以外，重复 B-466.1之操作。在试块上标记出波束

中心线"往后移"的位置移离 1/4T 孔。重复 B-466.1，除将探头从该孔讯号高度为满屏的 80％移至该孔讯号高

度降低到满屏的 40％以外。在试块上标记出波束中心线"往后移"的位置。

B-466.3 Right of 1/4T Hole. Reposition the search unit for the original 80% of FSH indication from the 1/4T RBH. Move the search unit to the right without pivoting the beam toward the reflector until the indication equals 40%

of FSH. Mark the beam center line “right” position on the block.25 1/4T 孔向右移。重新将探头定位在原 1/4T RBH

满屏 80％处。将探头向右移动，而不将波束轴转向反射体，直到讯号高度降低到满屏的 40%。在试块上标记

出波束中心轴线“向右移”的位置。

B-466.4 Left of 1/4T Hole. Repeat B-466.3, except move the search unit to the left without pivoting the beam

toward the reflector until the indication equals 40% of FSH. Mark the beam center line “left” position on the block.25

1/4T 孔之左移值。除将探头向左移动且不将波束轴转向反射体下，从该孔讯号高度为满屏的 80％移至该孔讯

号高度降低到满屏的 40％以外，重复 B-466.3之操作。将光束中心线“向左移”之位置标记在试块上。

Figure B-466 Beam Spread

图 B-466 波束展开度

B-466.5 1/2T and 3/4T Holes. Repeat the steps in B-466.1 through B-466.4 for the 1/2T and 3/4T RBHs.

1/2T 和 3/4T孔。对 1/2T 和 3/4T RBH 重复 B-466.1至 B-466.4中之步骤。

B-466.6 Record Dimensions. Record the dimensions from the “toward” to “away” positions and from the

“right” to “left” positions marked on the block. 记录尺寸。将从“前移”到“后移”之位置尺寸和“向右移”到

“向左移”之位置尺寸进行记录并标记在试块上。

B-466.7 Perpendicular Indexing. The smallest of the three “toward” to “away” dimensions shall not be ex-

ceeded when indexing between scans perpendicular to the beam direction. 垂直索引法。当在扫描垂直于波束方向

之间进行索引时，不应超过三个“往前移”到“往后移”尺寸中的最小值。

B-466.8 Parallel Indexing. The smallest of the three “right” to “left” dimensions shall not be exceeded when

indexing between scans parallel to the beam direction. 平行索引法。当在扫描平行于波束方向之间进行索引时，

不应超过三个“向右移”到“向左移”尺寸中的最小值。

B-466.9 Other Metal Paths. The projected beam spread angle determined by these measurements shall be used

to determine limits as required at other metal paths. 其他金属声程。以这些测量所确定之投影波束展开度应用于其

他金属声程所要求之展开度范围之确认上。

NOTE: If laminar reflectors are present in the basic calibration block, the beam spread readings may

be affected; if this is the case, beam spread measurements must be based on the best available readings. 注：若标准校

准试块中有层状反射体的存在可能会对波束展开度读数产生影响；若有此情况，波束展开度之测量须以最佳

可用之读数为取舍基准。

NONMANDATORY APPENDIX C GENERAL

TECHNIQUES FOR STRAIGHT BEAM CALIBRATIONS

非强制性附录 C 直束波之通用校准技术

C-410 SCOPE 适用范围

This Appendix provides general techniques for straight beam calibration. Other techniques may be used. 本附录提

供了直束波通用校准技术。非在本附录中之其他技术亦可采用。

C-460 CALIBRATION 校准

C-461 SWEEP RANGE CALIBRATION26 (SEE FIGURE C-461)

扫描范围校准(见 C-461)

C-461.1 Delay Control Adjustment. Position the search unit for the maximum first indication from the 1/4T

SDH. Adjust the left edge of this indication to line 2 on the screen with the delay control. 藉由延时控制旋钮所进行

之调整。将探头定位于来至 1/4T SDH 之最大第一次讯号处。藉由延时控制旋钮将该讯号的左前缘调整到屏幕

上的第 2行。

C-461.2 Range Control Adjustment. Position the search unit for the maximum indication from 3/4T SDH. Ad-

just the left edge of this indication to line 6 on the screen with the range control. 藉由范围控制旋钮所进行之调整。

将探头定位于来至 3/4T SDH 之最大讯号处藉由范围控制旋钮将该讯号的左前缘调整到屏幕上的第 6行。

C-461.3 Repeat Adjustments. Repeat the delay and range control adjustments until the 1/4T and 3/4T SDH in-

dications start at sweep lines 2 and 6. 反复调整。藉由延时和范围控制旋钮反复进行调整，直到来至 1/4T 和 3/4T

SDH 之讯号从扫查线 2和 6 开始。

C-461.4 Back Surface Indication. The back surface indication will appear near sweep line 8. 底面回波讯号。

底面回波讯号将出现在扫查线 8 附近。

C-461.5 Sweep Readings. Two divisions on the sweep equal 1/4T. 扫查读数。在扫查上之两组读数(延时与

范围)均等于 1/4T。

Figure C-461 Sweep Range

图 C-461 扫查范围

C-462 DISTANCE–AMPLITUDE CORRECTION (SEE FIGURE C-462) 距离-振幅校正

(参见图 C-462)

The following is used for calibration from either the clad side or the unclad side: 下列步骤可用在堆焊层侧或非

堆焊层侧之距离-振幅校准上：

(a) Position the search unit for the maximum indication from the SDH, which gives the highest indication.

Delay 延时

Range范围

Reflectors moved

into beam已移动到

反射体中之波束

Staggered holes will be used

for straight beam calibration. 用于直线校准之交错布置孔

将探头定位在能获得来至 SDH回波所给出的最大讯号处。

(b) Adjust the sensitivity (gain) control to provide an 80% (±5%) of FSH indication. This is the primary

reference level. Mark the peak of this indication on the screen. 藉由控制旋钮对灵敏度(增益)进行调整，以使该讯

号达到 FSH 的 80％(±5％)，并以此作为首要参照电平。将该讯号峰值标记在屏幕上。

(c ) Position the search unit for maximum indication from another SDH. 将探头定位在能获得来至第二

个 SDH 回波之最大讯号处。

(d) Mark the peak of the indication on the screen. 将该讯号之峰值标记在屏幕上。

(e ) Position the search unit for maximum indication from the third SDH and mark the peak on the screen.

将探头定位在能获得来至第三个 SDH回波之最大讯号处，并将该讯号峰值标记在屏幕上。

(f ) Connect the screen marks for the SDHs and extend through the thickness to provide the distance–Am-

plitude curve. 联接在屏幕上之各 SDH 峰值标记，并延伸到整个厚度，从而绘出距离 - 振幅曲线。

Figure C-462 Sensitivity and Distance–Amplitude Correction

图 C-462 灵敏度和距离 - 振幅校正

Sensitivity 灵敏度

NONMANDATORY APPENDIX D EXAMPLES OF

RECORDING ANGLE BEAM EXAMINATION DATA 分强制性附录 D 记录斜束波检测数据之示例

D-410 SCOPE 适用范围

This Appendix provides examples of the data required to dimension reflectors found when scanning a weld and de-scribes methods for recording angle beam examination data for planar and other reflectors. Examples are provided for when Amplitude-based identification is required and dimensioning is to be performed for length only and for length

and through-wall dimensions. 当扫描焊缝时为使反射体形成所需尺寸之数据于本附录中提供了示例，并阐述了

用于记录平面和其他反射体的斜束波检测数据的方法。仅针对长度进行尺寸测定或既测定长度又测定整个壁

厚尺寸时所需之振幅高度提供了鉴定实例。

D-420 GENERAL 通则

Distance-Amplitude 距离 -振幅


Referencing Code Sections provide several means of identifying reflectors based upon indication Amplitude. These indications, in several Codes, must be interpreted as to their reflector’s identity (i.e., slag, crack, incomplete fusion, etc.) and then evaluated against acceptance standards. In general, some percentage of the distance–Amplitude correc-tion (DAC) curve or reference level Amplitude for a single calibration reflector is established at which all indications must be investigated as to their identity. In other cases, where the Amplitude of the indication exceeds the DAC or the reference level, measurements of the indication’s length may only be required. In other referencing Code Sections, measuring techniques are required to be qualified for not only determining the indication’s length but also for its larg-

est through-wall dimension. 引用规范章节提供了几种基于讯号振幅来鉴别反射体的方法。在几个规范中，这些

讯号必须被解释为反射体的识别分类(即夹渣、裂纹、未完全溶合等)，然后根据允收准则进行评估。一般来

说，若用于单个校准反射体之距离 - 振幅校正(DAC)曲线仅是其中之若干百分比或参照电平振幅之若干百分比

时，则在此若干百分比中之所有显示必须对其识别分类进行评估。在其他情况下，若讯号振幅超过 DAC 或振

幅强度之参照电平时，则仅需对讯号长度进行测量。在其他引用规范章节中，测量技术必须符合条件，不仅

可确定所显示讯号之长度，还要对其整个壁厚中之最大高度尺寸进行确认。

D-470 EXAMINATION REQUIREMENTS 检测要求

A sample of various Code requirements will be covered describing what should be recorded for various indications.

对宜进行记录之各种指示在相应不同规范中之示例将给出有关地介绍与描述。

D-471 REFLECTORS WITH INDICATION AMPLITUDES GREATER THAN 20%

OF DAC OR REFERENCE LEVEL 具有讯号振幅大于振幅距离曲线或参照电平之

20％的反射体

When the referencing Code Section requires the identification of all relevant reflector indications that produce indi-

cation responses greater than 20% of the DAC (20% DAC27) curve or reference level established in T-463 or T-464, a

reflector producing a response above this level shall be identified (i.e., slag, crack, incomplete fusion, etc.). 当引用规

范章节对所有会产生大于 DAC(20％ DAC)曲线 20％、或高出 T-463或 T-464中所绘制参照电平 20％之相关反

射体讯号要求进行鉴定时，则应对所有能产生在此参照电平以上之反射体应进行识别分类(如夹渣、裂纹、未

完全溶合等)。

D-472 REFLECTORS WITH INDICATION AMPLITUDES GREATER THAN THE

DAC CURVE OR REFERENCE LEVEL 具有讯号振幅比 DAC曲线或参照电平更大的反

射体

When the referencing Code Section requires the length measurement of all relevant reflector indications that pro-duce indication responses greater than the DAC curve or reference level established in T-463 or T-464, indication length shall be measured perpendicular to the scanning direction between the points on its extremities where the Am-

plitude equals the DAC curve or reference level. 当引用规范章节对会产生大于在 T-463或 T-464中所绘制 DAC

曲线或参照电平之所有相关反射体讯号要求对其长度进行测量时，时，反射体讯号长度应以垂直于在振幅等

于 DAC 曲线或四分之一参照电平之各点间的扫描方向上进行测量。

D-473 FLAW SIZING TECHNIQUES TO BE QUALIFIED AND DEMONSTRATED

需要鉴定和演示之伤测定技术

When flaw sizing is required by the referencing Code Section, flaw sizing techniques shall be qualified and demon-strated. When flaw sizing measurements are made with an Amplitude technique, the levels or percentage of the DAC

curve or reference level established in the procedure shall be used for all length and through-wall measurements. 当引

用规范章节需要所有相关反射体之长度尺寸时，伤测定技术应进行鉴定并演示。当伤采用振幅技术进行测量

时，应在所有长度和整个壁厚高度之测量中采用在规程中所绘制之DAC 曲线或参照电平或取两者中之百分比

来进行测量。

D-490 DOCUMENTATION 文件

Different Sections of the referencing Codes may have some differences in their requirements for ultrasonic exami-nation. These differences are described below for the information that is to be documented and recorded for a particular reflector’s indication. In illustrating these techniques of measuring the parameters of a reflector’s indication responses,

a simple method of recording the position of the search unit will be described. 引用规范在不同章节处在其所相应之

超声波检测要求可能会有些差异。以下将这些差异进行描述，以便为特定反射体之信息进行文件化和记录。

在阐述测量反射体讯号灵敏度参数之这些技术时，将描述探头位置的合宜记录方法。

Ultrasonic indications will be documented by the location and position▲ of the search unit. A horizontal weld as

shown in Figure D-490 has been assumed for the data shown in Table D-490. All indications are oriented with their long dimension parallel to the weld axis. The search unit’s location, X, was measured from the 0 point on the weld axis to the center line of the search unit’s wedge. The search unit’s position, Y, was measured from the weld axis to the sound beam’s exit point of the wedge. Y is positive upward and negative downward. Search unit beam direction is usu-

ally 0 deg, 90 deg, 180 deg, or 270 deg. 可藉由探头的移动 (纵向和横向)与量测来记录超声波讯号。如图 D-490

所示之水平焊缝，假设已在表 D-490中所示之数据中；所有讯号都以其长度尺寸平行焊接轴线取向。探头之

纵向位置 X是从在焊接轴上之 0点测量至探头接收器中心线。探头之横向位置 Y 是从焊缝轴测量到接收器之

波束入射点。 Y 朝上为正，朝下为负。探头波束方向通常为 0º、90 º、180 º或 270 º。

▲ 于此处将”position”解读为量测

D-491 REFLECTORS WITH INDICATION AMPLITUDES GREATER THAN 20%

OF DAC OR REFERENCE LEVEL 具有讯号振幅大于 DAC或参照电平 20％的反射

体

When the referencing Code Section requires the identification of all relevant reflector indications that produce reflector responses greater than 20% of the DAC curve or reference level, position the search unit to give the maximum

Amplitude from the reflector. 当引用规范章节对所有会产生大于 DAC 曲线或参照电平 20％之相关反射体讯号要

求进行识别时，将探头定位在能获得来至反射体所给出之最大振幅处。当引用规范章节对反射体响应讯号产

生大于 DAC 曲线或参照电平 20％的所有相关反射体指示要求进行识别时，将探头定位在能获得来至反射体所

给出之最大振幅处。

(a) Determine and record the maximum Amplitude in percent of DAC or reference level. 以 DAC 或参照

电平的百分比对最大振幅进行推定并记录。

(b) Determine and record the sweep reading sound path to the reflector (at the left side of the indication on

the sweep). 推定并记录反射体扫查声程(在扫查讯号之左前缘处)之读数。

(c ) Determine and record the search unit location (X) with respect to the 0 point. 推定并记录探头相对于

0点的位置(X)。

(d) Determine and record the search unit position (Y) with respect to the weld axis. 推定并记录录探头相

对于焊接轴的位置(Y)。

(e ) Record the search unit beam angle and beam direction. 记录探头之波束角度和波束方向。

Figure D-490 Search Unit Location, Position, and Beam Direction

图 D-490 探头之移动 (纵向和横向)、量测和波束方向

A data record is shown in Table D-490 for an indication with a maximum Amplitude of 45% of DAC as Weld

1541, Indication 1. From its characteristics, the reflector was determined to be slag. 如表 D-490中之焊缝编号

1541，号讯编号 1在具有最大振幅为 DAC 之 45％下所记录之讯号数据，从其特性来看，该反射体被确定为夹

渣。

180

Weld axis 焊缝轴线 Position位置

Location 位置

0

+X

+Y

-Y 0

90 270

Beam direction 波束方向(deg)

D-492 REFLECTORS WITH INDICATION AMPLITUDES GREATER THAN THE

DAC CURVE OR REFERENCE LEVEL 具有讯号振幅比 DAC曲线或参照电平更大

的反射体

When the referencing Code Section requires a length measurement of all relevant reflector indications that pro-duce indication responses greater than the DAC curve or reference level whose length is based on the DAC curve or

reference level, do the recording in accordance with D-491 and the following additional measurements. 当引用规范章

节要求对所有会产生大于 DAC 曲线或或参照电平之相关反射体讯号进行长度测量时，其中该讯号长度是以

DAC 曲线或参照电平为依据所确定的，并按照 D-491进行纪录并进行以下附加测量：

(a) First move the search unit parallel to the weld axis to the right of the maximum Amplitude position un-

til the indication Amplitude drops to 100% DAC or the reference level. 首先以平行于焊接轴线之方式将探头朝最大

振幅位置的右前缘移动，直到讯号振幅降至 100％DAC 或参照电平。

(b) Determine and record the sound path to the reflector (at the left side of the indication on the sweep). 推

定并记录至反射体的声程(扫查在线讯号的左前缘)。

(c ) Determine and record the search unit location (X) with respect to the 0 point. 推定并记录探头相对于

0点的位置(X)。

(d) Determine and record the search unit position (Y) with respect to the weld axis. 推定并记录录探头相

对于焊缝轴线的位置(Y)。

(e ) Next move the search unit parallel to the weld axis to the left passing the maximum Amplitude position

until the indication Amplitude again drops to 100% DAC or the reference level. 仍以平行于焊接轴线之方式将探头

朝最大振幅位置的左前缘移动，直到讯号振幅再次降至 100％DAC或参照电平。

(f ) Determine and record the sound path to the reflector (at the left side of the indication on the sweep). 推

定并记录反射体的声程(在扫查在线讯号的左前缘侧)。

(g) Determine and record the search unit location (X) with respect to the 0 point. 推定并记录探头相对于

0点的位置(X)。

(h) Determine and record the search unit position (Y) with respect to the weld axis. 推定并记录探头相对

于焊接轴线的位置(Y)。

(i ) Record the search unit beam angle and beam direction.记录探头的波束角度和波束方向。

(j ) A data record is shown in Table D-490 for an indication with a maximum Amplitude of 120% of DAC as Weld 685, Indication 2, with the above data and the data required in D-491. From its characteristics, the reflector was determined to be slag and had an indication length of 0.7 in.. If the indication dimensioning was done using SI

units, the indication length is 18 mm. 如表 D-490中之焊缝编号 685，号讯编号 2在具有最大振幅为 DAC 之

120％下所记录之讯号数据，从其特性来看，该反射体被确定为夹渣且讯号长度为 0.7 in.。若采用 SI 单位进行

讯号尺寸标注时，则讯号长度为 18 mm。

D-493 REFLECTORS THAT REQUIRE MEASUREMENT TECHNIQUES TO BE

QUALIFIED AND DEMONSTRATED 需进行评定和演示之反射体测量技术

Table D-490 Example Data Record

表 D-490 数据记录示例

Weld No.

焊缝编号 Ind. No.

Maximum最

大 DAC, %

Sound Path 声

程, in. (mm)

Loc. (X), in.

(mm)

Pos. (Y), in.

(mm)

Calibration

Sheet 校准片

Beam Angle and Beam

Direction 波束角度和波束

方向, deg

Comments and Status 注解和状态

1541 1 45 1.7 (43.2) 4.3 (109.2) −2.2 (−55.9) 005 45 (0) Slag 夹渣

1685 2 120 2.4 (61.0) 14.9 (378) 3.5 (88.9) 016 60 (180) Slag 夹渣

100 2.3 (58.4) 15.4 (391) 3.6 (91.4) Right end 右端

100 2.5 (63.5) 14.7 (373) 3.7 (94.0) Left end 左端

Length 长度= 15.4 in. − 14.7 in. = 0.7 in. (391

mm − 373 mm = 18 mm)

1967 3 120 4.5 (114.3) 42.3 (1 074) −5.4 (−137.2) 054 45 (0) Slag 夹渣

20 4.3 (109.2) 41.9 (1 064) −5.2 (−132.1) Minimum depth position 最小深度位置

20 4.4 (111.8) 41.6 (1 057) −5.4 (−137.2) Left end 左端

20 4.7 (119.4) 42.4 (1 077) −5.6 (−142.2) Maximum depth position 最大深度位置

20 4.6 (116.8) 42.5 (1 080) −5.5 (−139.7) Right end 右端

Length 长度= 42.5 in. − 41.6 in. = 0.9 in. (1

080 mm − 1 057 mm = 23 mm)

Through-wall dimension 整个壁厚之高度 =

(4.7 in. − 4.3 in.)(cos 45 deg) = 0.3 in.

[(119.4 mm − 109.2 mm)(cos 45 deg) = 7.2

mm)]

GENERAL NOTE: Ind. No. = Indication Number 号讯编号; Loc. (X) = Location along X axis 纵轴线位置; Pos. (Y) = Position (Y) from weld center line 离开焊缝轴线之位置;

Beam Direction is towards 0, 90, 180, or 270 (see Figure D-490) 波束方向朝向 0º、90º、180º，或 270º

When the referencing Code Section requires that all relevant reflector indication length and through-wall dimensions be measured by a technique that is qualified and demonstrated to the requirements of that Code Section, the measurements of D-491 and D-492 are made with the additional measurements for the through-wall dimension as listed below. The measurements in this section are to be done at Amplitudes that have been qualified for the length and through-wall measurement. A 20% DAC or 20% of the reference level has been assumed qualified for the purpose of this illustration instead of the 100% DAC or reference level used in D-492. Both length and through-wall determinations are illustrated at 20% DAC or the 20% of the reference level. The reflector is located in the first leg of the sound path

(first half vee path). 当引用规范章节要求所有相关反射体之讯号长度和透壁高度尺寸要以一种符合该规范章节要求且已鉴定和演示过之技术进行测量时，

在 D-491和 D-492的测量同时将按下列步骤辅助透壁高度尺寸之量测。在本节中所进行之测量是在已经通过长度和通过透壁高度测量鉴定的振幅下来进

行的。为此假定以鉴定认可之 20％的 DAC 或参照电平的 20％来取代在 D-492中所采用之 100％DAC 或参照电平。长度和透壁高度测定都是在 20％DAC

或参照电平的 20％下显示的。反射体位于前半声程(V 声程的前半段)中。

(a) First move the search unit toward the reflector and scan the top of the reflector to determine the lo-cation and position where it is closest to the sound beam entry surface (minimum depth) and where the Amplitude

falls to 20% DAC or 20% of the reference level. 首先将探头朝向反射体之方向移动并扫查反射体的顶部，以确

定振幅在降至 20％DAC 或参照电平的 20％之当下离声束入射面(最小深度)最近之纵向和横向位置。

(b) Determine and record the sound path to the reflector (at the left side of the indication on the sweep).

推定并记录反射体之声程(扫在线讯号之左前缘侧)。

(c ) Determine and record the search unit location (X) with respect to the 0 point. 推定并记录探头与 0

点间之相对位置(X)。

(d) Determine and record the search unit position (Y) with respect to the weld axis. 推定并记录探头相

对于焊接轴线之位置(Y)。

(e ) Next move the search unit away from the reflector and scan the bottom of the reflector to determine the location and position where it is closest to the opposite surface (maximum depth) and where the Amplitude falls

to 20% DAC or 20% of the reference level. 接下来将探头从反射体移开并扫查反射体的底部，以推定振幅在降

至 20％DAC 或参照电平的 20％时离相对表面(最大深度)最近之纵向和横向位置。

(f ) Determine and record the sound path to the reflector (at the left side of the indication on the sweep).

确定并记录反射体之声程(扫查在线讯号之左前缘侧)。

(g) Determine and record the search unit location (X) with respect to the 0 point. 推定并记录关于 0点

的搜索单元位置(X)。

(h) Determine and record the search unit position (Y) with respect to the weld axis. 推定并记录探头与

焊接轴线间之相对位置(Y)。

(i ) Record the search unit beam angle and beam direction. 记录焊接轴线之波束角度和波束方向。

A data record is shown in Table D-490 for an indication with a maximum Amplitude of 120% of DAC as Weld 1967, Indication 3, with the above data and the data required in D-491 and D-492 for length at 20% DAC or 20% of the reference level. From its characteristics, the reflector was determined to be slag and the indication had a length of 0.9 in. If the dimensioning was done using SI units, the indication length is 23 mm and the through wall

dimension 7 mm. 如表 D-490中之焊缝编号 1967，号讯编号 3在具有最大振幅为 DAC 之 120％下所记录之

讯号数据及在 20％ DAC 或参照电平的 20％处具有上述数据和 D-491和 D-492所要求的数据之长度，从其

特性来看，该反射体被确定为夹渣且讯号长度为 0.9 in.。若采用 SI 单位进行尺寸标注时，则讯号长度为 23

mm且透壁高度为 7 mm。

NONMANDATORY APPENDIX E COMPUTER-

IZED IMAGING TECHNIQUES

强制性附录 E 计算器成像处理技术

E-410 SCOPE 适用范围

This Appendix provides requirements for computer imaging techniques. 本附录对计算器成像技术提供了有

关要求。

E-420 GENERAL 通则

Computerized imaging techniques (CITs) shall satisfy all of the basic instrument requirements described in T-431 and T-461. The search units used for CIT applications shall be characterized as specified in B-466. CITs shall

be qualified in accordance with the requirements for flaw detection and/or sizing that are specified in the referenc-

ing Code Section. 计算器化成像技术(CIT)应满足 T-431和 T-461中所描述之所有仪器的基本要求。被采用于

CIT 应用上之探头应具有符合 B-466之特征。 CIT 应按照引用规范章节所规定之缺陷检测和/或测定要求进

行鉴定。

The written procedure for CIT applications shall identify the specific test frequency and bandwidth to be uti-lized. In addition, such procedures shall define the signal processing techniques, shall include explicit guidelines for image interpretation, and shall identify the software code/program version to be used. This information shall also be included in the examination report. Each examination report shall document the specific scanning and imaging pro-

cesses that were used so that these functions may be accurately repeated at a later time if necessary. 用于 CIT 应用

之书面规程应确定所要采用的具体检测频率和带宽，此外，此类规程应对讯号处理技术给出规定，其中应

包括图像解释的明确指导，并标识所要采用之软件代码/规程版次，且此类信息也应包括在检测报告中。每

份检测报告都应记录所采用之特定扫描和成像过程，以便在以后在有必要时可准确地重复这些功能。

The computerized imaging process shall include a feature that generates a dimensional scale (in either two or three dimensions, as appropriate) to assist the operator in relating the imaged features to the actual, relevant dimen-sions of the component being examined. In addition, automated scaling factor indicators shall be integrally included

to relate colors and/or image intensity to the relevant variable (i.e., signal Amplitude, attenuation, etc.). 计算器化的

成像过程应包括产生维度缩放(就所适用之二维或三维)的特征，以协助操作者在成像特征与实际之间的关

系上了解所检测物项之相关尺寸。此外，应将自动缩放系数指示器集成在一起，以显示与相关变量(即讯号

幅度，衰减等)有关的阶彩和/或图像强度。

E-460 CALIBRATION 校准

Calibration of computer imaging systems shall be conducted in such a manner that the gain levels are opti-mized for data acquisition and imaging purposes. The traditional DAC-based calibration process may also be re-

quired to establish specific scanning and/or flaw detection sensitivity levels. 计算器成像系统之校准应以增益电

平优化的方式进行，以便用于数据采集和成像目的。也可能需要惯用的 DAC基准校准方法来建立特定扫查

和/或缺陷探测灵敏度。

For those CITs that employ signal processing to achieve image enhancement (SAFT-UT, L-SAFT, and broad-band holography), at least one special lateral resolution and depth discrimination block for each specified examina-tion shall be used in addition to the applicable calibration block required by Article 4. These blocks shall comply

with J-431. 对于采用讯号处理以达到图像增强(SAFT-UT，L-SAFT 和宽带全息照相术)之那些 CIT 应用，除

第 4章所需之适用校准试块之外，对每一指定检测至少还应采用一个专用横向分辨率试块和深度鉴别度试

块，而这些试块应符合 J-431要求。

The block described in Figure E-460.1 provides an effective resolution range for 45 deg and 60 deg search units and metal paths up to about 4 in. (100 mm). This is adequate for piping and similar components, but longer path lengths are required for reactor pressure vessels. A thicker block with the same sizes of flat-bottom holes, spac-ings, depths, and tolerances is required for metal paths greater than 4 in. (100 mm), and a 4 in. (100 mm) minimum distance between the edge of the holes and the edge of the block is required. These blocks provide a means for de-

termining lateral resolution and depth discrimination of an ultrasonic imaging system. 在图 E-460.1中所述块提供

了 45度和 60度探头和高达约 4 in. (100 mm)金属声程的有效分辨率范围，这对于管道和类似物项是足够

的，但对反应堆压力容器则需要更长的声程。对于一个具有相同尺寸的平底孔、厚度、深度和公差之较厚

试块，则需要有大于 4 in. (100 mm)金属声程和试块各孔边缘之间有 4 in. (100 mm)的最小距离。这些块提供

了一种可用于确定超声成像系统之横向分辨率和深度鉴别度偏差测量法。

Lateral resolution is defined as the minimum spacing between holes that can be resolved by the system. The holes are spaced such that the maximum separation between adjacent edges of successive holes is 1.000 in. (25.40 mm). The spacing progressively decreases by a factor of two between successive pairs of holes, and the minimum spacing is 0.015 in. (0.38 mm). Depth discrimination is demonstrated by observing the displayed metal paths (or the depths) of the various holes. Because the hole faces are not parallel to the scanning surface, each hole displays a range [about 0.1 in. (2.5 mm)] of metal paths. The “A” row has the shortest average metal path, the “C” row has the

longest average metal path, and the “B” holes vary in average metal path. 横向分辨率被定义为系统所能分辨之

最小孔间距。这些孔被间隔开来，以使各相邻孔边缘间具有 1.000 in. (25.40 mm)的最大分隔距离。间隔通

过连续孔对与最小间距间为 0.015 in. (0.38 mm)之间的两因素而递减。通过观察各种孔所显示之金属声程(或

深度)来证明深度鉴别度。由于孔面不平行于扫查表面，因此各孔均显示出其各自的金属声程范围[约 0.1 in.

(2.5 mm)]。 “A”行孔具有最短的平均金属声程，“C”行孔则具有最长的平均金属声程，且“B”行孔在

平均金属声程上变化。

Additional blocks are required to verify lateral resolution and depth discrimination when 0 deg longitudinal wave examination is performed. Metal path lengths of 2 in. and 8 in. (50 mm and 200 mm), as appropriate, shall be provided as shown in Figure E-460.2 for section thicknesses to 4 in. (100 mm), and a similar block with 8 in. (200

mm) metal paths is needed for section thicknesses over 4 in. (100 mm). 当进行 0度纵波检查时，需要追加另一

块试块以作为横向分辨率和深度鉴别度之验证。在截面厚度 ≦ 4 in. (100 mm)时，应如图 E-460.2所示提供

所适用之 2 in.和 8 in. (50 mm 和 200 mm)金属声程，以及具有 8 in. (200 mm)金属声程之类似试块则需超过 4

in. (100 mm)的截面厚度。当进行 0度纵波检查时，需要追加另一块试块以作为横向分辨率和深度鉴别度之

验证。在截面厚度 ≦ 4 in. (100 mm)时，应如图 E-460.2所示提供所适用之 2 in.和 8 in. (50 mm 和 200 mm)

金属声程，以及具有 8 in. (200 mm)金属声程之类似试块则需超过 4 in. (100 mm)的截面厚度。

E-470 EXAMINATION 检测

E-471 SYNTHETIC APERTURE FOCUSING TECHNIQUE FOR ULTRASONIC

TESTING (SAFT-UT) 用于超声波测试之合成孔径聚焦技术（SAFT-UT）

The Synthetic Aperture Focusing Technique (SAFT) refers to a process in which the focal properties of a large-aperture focused search unit are synthetically generated from data collected while scanning over a large area using a small search unit with a divergent sound beam. The processing required to focus this collection of data is a three-dimensional process called beam-forming, coherent summation, or synthetic aperture processing. The SAFT-UT process offers an inherent advantage over physical focusing processes because the resulting image is a full-vol-ume, focused characterization of the material volume being examined. Traditional physical focusing processes pro-

vide focused data over only the depth of the focus zone of the transducer. 合成光圈聚焦技术（SAFT）是指采用

具有扩散声束之小型探头在大面积进行扫查时可从所收集到之数据加以合成并生成大光圈聚焦探头之聚焦

特性的过程。集中此数据集之所需处理是一种称之为波束形成、相干累加或合成光圈加工的三维制作法。

SAFT-UT 过程比物理聚焦过程提供了其固有的优势，因为其所得到之图像是受检测物项额的满量聚焦特

征。惯用物理聚焦工艺所提供之聚焦数据仅涵盖换能器聚焦区域的深度。

For the typical pulse-echo data collection scheme used with SAFT-UT, a focused search unit is positioned with the focal point located at the surface of the material under examination. This configuration produces a divergent ul-trasonic beam in the material. Alternatively, a small diameter contact search unit may be used to generate a diver-gent beam. As the search unit is scanned over the surface of the material, the A-scan record (RF waveform) is digit-ized for each position of the search unit. Any reflector present produces a collection of echoes in the A-scan rec-ords. For an elementary single-point reflector, the collection of echoes will form a hyperbolic surface within the data-set volume. The shape of the hyperboloid is determined by the depth of the reflector and the velocity of sound in the material. The relationship between echo location in the series of A-scans and the actual location of reflectors within the material makes it possible to reconstruct a high-resolution image that has a high signal-tonoise ratio. Two

separate SAFT-UT configurations are possible: 对于与 SAFT-UT 一起使用的典型脉冲回波数据采集方案，聚

焦探头焦点聚焦在被检测材料表面，此配置在材料中将产生扩散声束；或者，可采用小直径接触式探头来

产生扩散波束，此时随着探头在材料表面上所进行之扫查移动，A-扫描记录（RF波形）被数位化以用于

SAFT-UT 探头的每个位置。任何反射体都会在 A-扫描记录中产生一个回波集合体。对于单体单点反射

体，回波集合体将在数据集内形成双曲面，而双曲面的形状是由反射体的深度和物项中的声速所决定。 A

系列扫描中的回波位置与物项内反射体的实际位置间的相互关系使得具有高信噪比的高分辨率图像可以重

构。以下两种单独的 SAFT-UT 配置是可行的：

(a) the single-transducer, pulse-echo configuration; and单换感器，脉冲回波配置；和

(b) the dual-transducer, tandem configuration (TSAFT). 双换能器，串行配置（TSAFT）。

In general, the detected flaws may be categorized as volumetric, planar, or cracks. Flaw sizing is normally per-formed by measuring the vertical extent (cracks) or the cross-sectional distance (volumetric/planar flaws) at the –6 dB levels once the flaw has been isolated and the image normalized to the maximum value of the flaw. Multiple images are often required to adequately categorize (classify) the flaw and to characterize the actual flaw shape and size. Tandem sizing and analysis uses similar techniques to pulse-echo, but provides images that may be easier to

interpret. 一般上来说，所检测到之缺陷可被分类为体积、平面或裂纹；一旦缺陷已被隔离且图像标准化为

缺陷的最大值之后，可通过将增益降低 6dB 的垂直范围（裂纹）或横截面距离（体积/平面伤）来进行缺陷

尺寸量测，此方法经常需要多个图像来对缺陷进行适当地归类（分类）并对缺陷的实际形状和大小作出描

述；但若采用类似脉冲回波技术所进行的串行测量和分析，则可提供更容易解释的图像。

The location of indications within the image space is influenced by material thickness, velocity, and refracted angle of the UT beam. The SAFT algorithm assumes isotropic and homogeneous material; i.e., the SAFT algorithm requires (for optimum performance) that the acoustic velocity be accurately known and constant throughout the ma-

terial volume. 图像空间内的指示位置受到材料厚度、声速和UT 波束折射角的影响。 SAFT 算法假定各向同

性均质材料，即，SAFT 算法要求（为获得最佳性能）声速在整个材料范围中为已知之常数。

Lateral resolution is the ability of the SAFT-UT system to distinguish between two objects in an x-y plane that is perpendicular to the axis of the sound beam. Lateral resolution is measured by determining the minimum spacing between pairs of holes that are clearly separated in the image. A pair of holes is considered separated if the signal

Amplitude in the image decreases by at least 6 dB between the peak signals of two holes. 侧向分辨率是 SAFT-UT

系统对同时在 x-y平面中垂直于声束轴线之两物项间所具有的鉴别区分能力。横向分辨率是藉由图像中清

晰分隔孔对间的最小间距测量而确定的。若图像中两孔的讯号振幅峰值之间降低至少 6dB，则可视为是一

对分开的孔。

Depth resolution is the ability of a SAFT-UT system to distinguish between the depth of two holes whose axes are parallel to the major axis of the sound beam. Depth resolution is measured by determining the minimum differ-

ence in depth between two holes. 深度分辨率是 SAFT-UT 系统在两孔轴线平行声束长轴线下对两孔深度间所

具有的鉴别区分能力。深度分辨率可藉由对两孔间的深度差异所进行之测量来予以确认。

The lateral resolution for a SAFT-UT system is typically 1.5 wavelengths (or better) for examination of wrought ferritic components, and 2.0 wavelengths (or better) for examination of wrought stainless steel compo-

nents. The depth resolution for these same materials will typically be 0.25 wavelengths (or better). SAFT-UT 系统

用于检测锻造铁素体物项时，其横向分辨率通常为 1.5Å 波长（或更好），和用于检测锻造不锈钢物项的波

长为 2.0Å （或更好）。这些相同材料的深度分辨率通常为 0.25Å 波长（或更好）。

E-472 LINE-SYNTHETIC APERTURE FOCUSING TECHNIQUE (L-SAFT) 线性

合成光圈聚焦技术（L-SAFT）

The Line Synthetic Aperture Focusing Technique (L-SAFT) is useful for analyzing detected indications. L-SAFT is a two-dimensional process in which the focal properties of a large-aperture, linearly focused search unit are synthetically generated from data collected over a scan line using a small search unit with a diverging sound beam. The processing required to impose a focusing effect of the acquired data is also called synthetic aperture processing. The L-SAFT system can be operated like conventional UT equipment for data recording. It will function with either single or dual-element transducers. Analysis measurements, in general, are performed to determine flaw size, vol-ume, location, and configuration. To decide if the flaw is a crack or volumetric, the cracktip-diffraction response offers one criterion, and the superimposed image of two measurements made using different directions of incidence

offers another. 线性合成光圈聚焦技术（L-SAFT）可用于分析所检测到之指示。 L-SAFT 是一种二维加工处

理方法，其采用具有扩散声束的小型探头通过扫描线将所收集之数据即成为大光圈线性聚焦探头的焦点特

性。此种将所获取数据聚集为聚焦效果所需的加工法也称为合成孔径处理法。 L-SAFT 系统可以像惯用超

声波检测设备一样进行数据记录，同时 L-SAFT 系统具有单晶体或双晶体换能器的功能。一般来说，分析

测量是为确定缺陷之尺寸、体积、位置和配置而进行的。为判定缺陷是裂纹还是块状，应针对裂纹尖端衍

射灵敏度制定出一个准则，并从不同的入射方向进行两次测量并将所获得之单一图像予以累加合成以提供

了另一个准则。线性合成光圈聚焦技术（L-SAFT）可用于分析所检测到之指示。 L-SAFT 是一种二维加工

处理方法，其采用具有扩散声束的小型探头通过扫描线将所收集之数据即成为大光圈线性聚焦探头的焦点

特性。此种将所获取数据聚集为聚焦效果所需的加工法也称为合成孔径处理法。 L-SAFT 系统可以像惯用

超声波检测设备一样进行数据记录，同时 L-SAFT 系统具有单晶体或双晶体换能器的功能。一般来说，分

析测量是为确定缺陷之尺寸、体积、位置和配置而进行的。为判定缺陷是裂纹还是块状，应针对裂纹尖端

衍射灵敏度制定出一个准则，并从不同的入射方向进行两次测量并将所获得之单一图像予以累加合成以提

供了另一个准则。

All constraints for SAFT-UT apply to L-SAFT and vice versa. The difference between L-SAFT and SAFT-UT

is that SAFT-UT provides a higher resolution image than can be obtained with L-SAFT. SAFT-UT 的所有限制条

件亦适用于 L-SAFT，反之亦然。 L-SAFT 和 SAFT-UT 之间的区别在于：SAFT-UT比 L-SAFT 提供了更高

的图像分辨率。SAFT-UT 的所有限制条件亦适用于 L-SAFT，反之亦然。 L-SAFT 和 SAFT-UT 之间的区别

在于：SAFT-UT 比 L-SAFT 提供了更高的图像分辨率。

E-473 BROADBAND HOLOGRAPHY TECHNIQUE 全息照相技术

The holography technique produces an object image by calculation based on data from a diffraction pattern. If the result is a two-dimensional image and the data are acquired along one scan, the process is called “lineholog-raphy.” If the result is a two-dimensional image based upon an area scanned, then it is called “holography.” For the special case of applying holography principles to ultrasonic testing, the image of flaws (in more than one dimen-sion) can be obtained by recording the Amplitude, phase, and time-of-flight data from the scanned volume. The ho-lography process offers a unique feature because the resulting image is a one or two dimensional characterization of

the material. 全息照相技术可藉由衍射图案数据将之进行运算以进而产生物项图像，若所得结果是二维图

像，并且沿一个扫查方向所获得的数据，则该方法被称之为“线性全息照相技术”，若结果是扫描一个平

面区域的二维图像，则称之为“全息照相技术”。在将全息原理应用于超声波检测的特殊情况下，可从扫

描体积中所记录之振幅、相位和时差等数据来获得瑕疵（多于一个维度）的图像。全息照相技术之所以有

其独特性能乃在于其所获得之最终图像是材料的一维或二维特征。

This technique provides good resolution in the axial direction by using broadband search units. These search units transmit a very short pulse, and therefore the axial resolution is improved. The maximum bandwidth may be

20 MHz without using filtering, and up to 8 MHz using an integrated filter. 此技术可藉由宽带探头的采用而在轴

向上提供良好的分辨率，其原因是这些探头可发射出非常短的脉冲，因此相对提高了轴向分辨率。在不采

用滤波器下，其最大带宽可为 20MHz，且在采用集成滤波器时可达 8MHz。

Figure E-460.1 Lateral Resolution and Depth Discrimination Block for

45 deg and 60 deg Applications

图 E-460.1 作为 45º和 60º应用之横向分辨率试块和深度鉴别度试块

GENERAL NOTES: 总则

(a) View rotated for clarity. 为了清晰起见而旋转视图

(b) Insonification surface is shown at bottom. 在底部处所显示之声透射面。

(c) Tolerances: decimals: 0.XX = ±0.03; 0.XXX = ±0.005; angular: ±1 deg. 公差：小数点：0.XX = ±0.03；

0.XXX = ±0.005；角度：±1º

1.250 in. (31.25 mm)

0.750 in. (19.05 mm)

0.266 in. (6.76 mm)

0.500 in. (12.7 mm)

0.375 in. (9.53 mm) 0.313 in. (7.95 mm)

0.281 in. (7.14 mm)

All hole diameters

0.250 in. (6.35 mm)

A8 A7 A6 A5 A4 A3 A1 A2

B7 B6 B5 B4 B3

B2 B1 C8 C7 C6 C5 C4 C3

1.250 in. (31.75 mm)

2.000 in. (50.80 mm)

2.500 in. (63.50 mm)

2.875 in. (73.03 mm)

3.187 in. (80.95 mm)

3.469 in. (88.11 mm)

3.734 in. (94.84 mm)

6 in. (150 mm) Detail 1

1 in. (25 mm)

See detail 1

8 in. (200 mm) 2-3/4 in. (69 mm)

2 in. (50 mm)

See detail 1

45 deg

1 in. (25 mm)

2-1/2 in. (65 mm)

10 in. (250 mm)

1.750 in (44.45 mm)

3-1/2 in (89 mm)

Figure E-460.1 Lateral Resolution and Depth Discrimination Block for 45 deg and 60 deg Applications (Cont'd) 图 E-460.1 作为 45º和 60º应用之横向分辨率试块和深度鉴别度试块 (续)

GENERAL NOTES (CONT'D): 总则(续)

(d) Hole identification: 孔字符：

(1) Engrave or stamp as shown with the characters upright when the large face of the block is up. 当试块大表

面朝上时，如图所示在孔的正上方镌刻或打印孔字符。当试块大表面朝上时，如图所示在孔的正上方镌刻或打印

孔字符。

(2) Nominal character height is 0.25 in. (6 mm). 标称字符高度为 0.25 in. (6 mm)。标称字符高度为 0.25 in.

(6 mm)。

(3) Start numbering at the widest-spaced side. 在间距最宽侧开始编号。在间距最宽侧开始编号。

(4) Label row of eight holes A1–A8. 八个孔(A1 至 A8)的字符行。八个孔(A1 至 A8)的字符行。

(5) Label diagonal set of seven holes B1–B7. 7 个孔(B1 至 B7)的字符对角线组。

(6) Label remaining six holes C3–C8. 剩余 6 孔标记为 C3 至 C8 字符。

(e) Hole spacing: minimum 0.010 in. (0.25 mm) material between hole edges. 孔间距：孔边缘之间至少有 0.010

in. (0.25 mm)之材料存在。孔间距：孔边缘之间至少有 0.010 in. (0.25 mm)之材料存在。

(f) Hole depths: 30 deg face: 1.000 in. (25.40 mm); 45 deg face: 1.750 in. (44.45 mm). 孔深度：30 度面：1.000 in.

(25.40 mm); 45 度面：1.750 in. (44.45 mm)。

(g) Drawing presentation: holes are shown from drilled face of block. 图示：以试块钻孔面之投影图做为孔图示。

(h) Hole ends to be flat and parallel to drilled surface within 0.001 in. (0.03 mm) across face of hole. 孔端是平的且

与孔与孔间之平行度在从钻孔表面进行量测时要在 0.001 in. (0.03 mm)之内。

(i) Maximum radius between side and face of hole is 0.005 in. (0.13 mm). 底面和孔切削面间之最大半径为 0.005

in. (0.13 mm)。底面和孔切削面间之最大半径为 0.005 in. (0.13 mm)。

Analysis measurements, in general, are performed to obtain information on size, volume, location, and config-uration of detected flaws. The results of the holography measurements per scan line show a two-dimensional image of the flaw by color-coded display. The size of flaws can be determined by using the 6 dB drop in the color code. More information on the flaw dimensions is obtained by scans in different directions (i.e., parallel, perpendicular) at different angles of incidence. To decide if the flaw is a crack or a volumetric flaw, the crack tip technique offers one criterion and comparison of two measurements from different directions of incidence offers another. Measurement results obtained by imaging techniques always require specific interpretation. Small variations in material thickness, sound velocity, or refracted beam angle may influence the reconstruction results. The holography processing calcu-

lations also assume that the velocity is accurately known and constant throughout the material. 一般上来说，之所

以执行分析测量是为获得与所检测到之缺陷的尺寸、体积、位置和配置等有关变量的倒数。每扫描线的全

息测量结果以彩阶方式来显示缺陷的二维图像。瑕疵大小能藉由采用降低 6 dB 的颜阶代码来进行确认，缺

陷尺寸的更多变量倒数是藉由从不同方向（即平行，垂直）以不同的入射角进行扫描来获得的。为判定缺

陷是裂纹还是块状缺陷，用裂纹尖端部技术制定出一个准则，并对来自不同入射方向所获得两个测量结果

进行比较以提供另一个准则。通过成像技术所获得之测量结果总是需要具体的解释，在材料厚度、声速或

折射光束角度中的细小变化可能对再现性结果造成影响。全息处理运算同样假设声度在整个材料范围中是

一个已知的常数。

E-474 UT-PHASED ARRAY TECHNIQUE UT相控阵技术

The UT-Phased Array Technique is a process wherein UT data are generated by controlled incremental varia-tion of the ultrasonic beam angle in the azimuthal or lateral direction while scanning the object under examination. This process offers an advantage over processes using conventional search units with fixed beam angles because it acquires considerably more information about the reflecting object by using more aspect angles in direct impinge-

ment. UT 相控阵技术是一种工艺程序，其中 UT数据是在扫描被检测物项之同时在方位角或横向上通过可

控波束角度增量的变化而产生的。与采用具有固定波束角度之惯用探头相比，此方法比较具有优势，其原

因在采用更多入射角以获取更多有关反射物体的信息。

Each phased array search unit consists of a series of individually wired transducer elements on a wedge that are activated separately using a pre-selectable time delay pattern. With a linear delay time between the transmitter pulses, an inclined sound field is generated. Varying the angle of refraction requires a variation of the linear distri-bution of the delay time. Depending on the search unit design, it is possible to electronically vary either the angle of incidence or the lateral/skew angle. In the receiving mode, acoustic energy is received by the elements and the sig-

nals undergo a summation process utilizing the same time delay pattern as was used during transmission. 每一个相

控阵探头由楔块上之一系列单独连接的换能器芯片所组成，这些芯片采用预先选定之时间延时模式各自启

动。利用各发射脉冲之间所具有的线性延时时间来产生一个倾斜声场。折射角度变化可藉由改变延时时间

的线性分配量来获得，按探头之设计，可用电子方式来改变入射角或横向/倾斜角度，且在接收模式中，声

能被芯片所接收，并利用与传输期间相同的时间延时模式将所有讯号经受累加处理。

Flaw sizing is normally performed by measuring the vertical extent (in the case of cracks) or the crosssectional distance (in the case of volumetric/planar flaws) at the 6 dB levels once the flaw has been isolated and the image normalized. Tandem sizing and analysis uses techniques similar to pulse-echo but provides images that are easier to interpret since specular reflection is used for defects oriented perpendicular to the surface. For cracks and planar defects, the result should be verified using crack-tip-diffraction signals from the upper and lower ends of the flaw, since the phased array approach with tomographic reconstruction is most sensitive to flaw tip indications and is able to give a clear reconstruction image of these refraction phenomena. As with other techniques, the phased array pro-

cess assumes isotropic and homogeneous material whose acoustic velocity is constant and accurately known. 一旦

缺陷已被隔离且图像在标准化后，通常可通过将增益降低 6dB 的垂直范围（裂纹）或横截面距离（体积/平

面伤之情况下）来进行缺陷尺寸测定；但若采用类似脉冲回波技术所进行的串行测量和分析时，因镜面式

反射波可用于与检测面成垂直取向之缺陷，因此可提供更容易解释的图像。对于裂纹和平面缺陷，应采用

来自裂纹上下端部之衍射讯号来验证结果，因具有层析成像再现性之相控阵法对瑕疵尖端部之指示最为灵

敏，所以能够将这些折射现象给出清晰的再现图像。与其他技术一样，相控阵方法也是假定声度在整个材

料范围中是一个已知的常数。

Sectorial scans (S-scans) with phased array provides a fan-like series of beam angles from a single emission point that can cover part or all of a weld, depending on search unit size, joint geometry, and section thickness. Such a series of beam angles can demonstrate good detectability of side-drilled holes because they are omnidirectional reflectors. This is not necessarily the case for planar reflectors (e.g., lack of fusion and cracks) when utilizing line scanning techniques where the beam could be misoriented to the point they cannot be detected. This is particularly

true for thicker sections when using single line scanning techniques. 具有相控阵之扇形扫描（S扫描）中之单工

发射点将根据探头之尺寸、接头几何形状和截面厚度，以提供可含盖部分或全部焊缝之各波束角度的扇形

系列。此一系列波束角度可演示出对侧横孔的良好可检测性，因它们是全指向式的反射体。当采用线扫查

技术时，由于其中波束可能被错误地取向到它们不能检测到的点，因此平面型反射体（例如，熔合不良和

裂纹）就不一定是这种情况，尤其对较厚截面更是如此。

E-475 UT-AMPLITUDE TIME-OF-FLIGHT LOCUS-CURVE ANALYSIS TECH-

NIQUE 震幅时差曲线分析超声波检测技术

The UT-Amplitude time-of-flight locus-curve analysis technique utilizes multiple search units in pulse-echo, transmitter-receiver, or tandem configuration. Individually selectable parameters control the compression of the A-scan information using a pattern-recognition algorithm, so that only the relevant A-scan Amplitudes are stored and

further processed. 振幅时差曲线分析超声波检测技术在脉冲回波、发射器接收器或串接配置中使用复合式

探头，采用可单独供选择的各项参数模式识别算法来控制 A-扫描信息的压缩，以使只有与 A-扫描振幅有相

关的数据被存储和进一步处理。

The parameter values in the A-scan compression algorithm determine how many pre-cursing and how many post-cursing half-wave peaks must be smaller than a specific Amplitude, so that this largest Amplitude is identified as as relevant signal. These raw data can be displayed in B-, C-, and D-scan (side, top, and end view) presentations, with selectable color-code increments for Amplitude and fast zoom capabilities. This operating mode is most suita-ble for detection purposes. For discrimination, a two dimensional spatial-filtering algorithm is applied to search for

correlation of the time-of-flight raw data with reflector-typical time-of-flight trajectories. 在 A-扫描压缩算法中之

参数值决定了多少先出现和多少后出现的半波峰必须小于一个特定振幅，因此这个最大振幅被识别为相关

讯号。这些首要数据可显示在 B-、C-和 D扫描（侧视、上视和上视图）演示中，并具有可用于振幅和快速

缩放功能的可选颜阶代码增量，而此操作模式视最能满足检测目的。为了区分，可透过二维空间滤波算法

之应用来对具有反射体典型时差轨迹之时差首要数据进行扫查以验证识别率。

Tandem sizing and analysis uses techniques similar to pulse-echo but provides images that may be easier to interpret since the specular reflections from flaws oriented perpendicular to the surface are used. For cracks and pla-nar flaws, the results should be verified with crack-tip-diffraction signals from the upper and lower end of the flaw since the acoustic parameters are very sensitive to flaw tip indications and a clear reconstruction image of these re-

fraction phenomena is possible with this technique. 串接尺寸测定和分析采用了类似于脉冲回波的技术，但它

能提供可更容易解释的图像，因它采用了来至瑕疵与检测表面成垂直定向的镜面反射。对于裂纹和平面缺

陷，应使用裂纹尖端部之衍射讯号来验证结果，因为裂纹尖端衍射讯号来自缺陷的上和下端部，因这种方

法对来至对缺陷尖端部指示的声学参数特别灵敏，并且所以能够将这些折射现象给出清晰的再现图像。

The location of indications within the image space is influenced by material thickness and actual sound veloc-ity (i.e., isotropic and homogeneous material is assumed). However, deteriorating influences from anisotropic mate-

rial (such as cladding) can be reduced by appropriate selection of the search unit parameters. 图像空间内的指示位

置受材料厚度和实际声程的影响（即假设材料式各向同性的）；然而对来自各向异性材料（例如堆焊层）

的衰减影响，可以通过适当地选用探头参数来降低所受影响之程度。

E-476 AUTOMATED DATA ACQUISITION AND IMAGING TECHNIQUE 自动数

据采集和成像技术

Automated data acquisition and imaging is a multichannel technique that may be used for acquisition and anal-ysis of UT data for both contact and immersion applications. This technique allows interfacing between the calibra-tion, acquisition, and analysis modes; and for assignment of specific examination configurations. This technique utilizes a real-time display for monitoring the quality of data being collected, and provides for display of specific Amplitude ranges and the capability to analyze peak data through target motion filtering. A cursor function allows scanning the RF data one waveform at a time to aid in crack sizing using tip-diffraction. For both peak and RF data,

the technique can collect, display, and analyze data for scanning in either the axial or circumferential directions. 自

动数据采集和成像是一种多通道技术，可用于采集和分析接触和液浸应用中的超声波检测数据。本技术允

许在校准、采集和分析模式之间采用连接器，和用于各特定检测配置的作业分配。该技术利用实时显示来

监控正在收集的数据质量，并提供特定振幅范围的显示及具有通过目标运动模块所滤波过之峰值数据进行

分析的能力。光标功能可在一次扫查中仅针对一个波形的 RF数据，以有助于采用尖端部衍射的裂纹尺寸

测定。本技术能对在纵向或环向上扫查时之峰值和RF数据进行收集、显示和分析。

This technique facilitates detection and sizing of both volumetric and planar flaws. For sizing volumetric flaws, Amplitude-based methods may be used; and for sizing planar flaws, the crack-tip-diffraction method may be used. An overlay feature allows the analyst to generate a composite image using several sets of ultrasonic data. All

data displayed in the analyze mode may be displayed with respect to the physical coordinates of the component. 此

等技术有助于块状和平面型缺陷的检测和尺寸测定。为确定块状缺陷尺寸，可采用基准振幅法，并为了确

定平面缺陷尺寸，可采用裂纹尖端部衍射法。此技术之迭加功可让分析人员采用几组超声波数据来生成合

成图像。所有以分析模式所显示之数据都可相对于物项的实际坐标来进行显示。

Figure E-460.2 Lateral and Depth Resolution Block for 0 deg Applications

图 E-460.2 作为 0º应用之横向和深度分辨率试块

8 in. (200 mm)

2 in. (50 mm)

7-1/2 in. (188 mm)

S T U V W X

Y

L K M N O P Q R

A B C D E

F G H I J

Scanning Surface扫描面

4 in. (100 mm)

General tolerances ±0.010 in. and ±1 deg (±0.25 mm and ±1 deg) 一般公差为± 0.010 in. 和 ± 1 deg（±0.25 mm 和±1 deg）

7.5 in. (188 mm)

NONMANDATORY APPENDIX G ALTERNATE

CALIBRATION BLOCK CONFIGURATION

非强制性附录 G 替代校准试块之构造

G-410 SCOPE 适用范围

This Appendix provides guidance for using flat basic calibration blocks of various thicknesses to calibrate the examination of convex surface materials greater than 20 in. (500 mm) in diameter. An adjustment of receiver gain may be required when flat calibration blocks are used. The gain corrections apply to the far field portion of the

sound beam. 本附录对采用各种厚度之平面基准校准试块对大于 20 in. (500 mm)直径的凸面材所进行之校准

提供了检测指南。当采用平面校准试块时，可能需要以增益旋钮对接收器进行调整。增益校正适用于声束

的远场部分。

G-460 CALIBRATION 校准

G-461 DETERMINATION OF GAIN CORRECTION 增益校正之确认

To determine the required increase in gain, the ratio of the material radius, R, to the critical radius of the trans-

ducer, 𝑅𝑐, must be evaluated as follows. 为确认在增益上之所需增量，材料半径R 与换能器之临界半径𝑅𝑐的

比值必须按如下进行评估：

(a) When the ratio of 𝑅 𝑅𝑐⁄ , the radius of curvature of the material R divided by the critical radius of the transducer 𝑅𝑐 from Table G-461 and Figure G-461(a), is equal to or greater than 1.0, no gain correction is re-

quired. 当材料曲率半径 R 除以表 G-461和图 G-461（a）中所示之换能器临界半径𝑅𝑐的比值𝑅 𝑅𝑐⁄ ≧ 1.0

时，则不需进行增益校正。

(b) When the ratio of 𝑅 𝑅𝑐⁄ is less than 1.0, the gain correction must be obtained from Figure G-

461(b). 当𝑅 𝑅𝑐⁄ 之比值 < 1.0时，则必须从图 G-461（b）获得增益校正值。

(c ) Example. Material with a 10 in. (250 mm) radius (R) will be examined with a 1 in. (25 mm) diame-

ter 2.25 MHz boron carbide faced search unit using glycerine as a couplant. 例子。用 1 in. (25 mm)直径、

2.25MHz频率、有碳化硼保护面之探头并采用甘油作为耦合剂来检测具有 10 in. (250 mm)半径（R）的材

料。

(1) Determine the appropriate transducer factor, 𝐹1 from Table G-461; 𝐹1 = 92.9. 确认表 G-461

中所适用之换能器系数𝐹1；经确认后之𝐹1 = 92.9。

(2) Determine the 𝑅𝑐 from Figure G-461(a); 𝑅𝑐 = 100 in. (2 500 mm). 确定图 G-461（a）中的

𝑅𝑐；经确认后之𝑅𝑐 = 100 in. (2 500 mm)。

(3) Calculate the R /𝑅𝑐 ratio; 10 in./100 in. = 0.1 (250 mm/2 500 mm = 0.1). 计算 R /𝑅𝑐比；R

/𝑅𝑐 = 10 in. /100 in. = 0.1 (250 mm/2 500 mm = 0.1) 。

(4) Using Figure G-461(b), obtain the gain increase required; 12 dB. 从图 G-461（b）可知所需

增益为 12 dB。

This gain increase calibrates the examination on the curved surface after establishing calibration sensitivity on

a flat calibration block. 在平校准试块上建立校准灵敏度后，以此增益增量校准在该曲面上之检测。

(d) Welds in Materials With Diameters 20 in. (500 mm) and Less. The basic calibration block shall be curved for welds in materials with diameters 20 in. (500 mm) and less. A single curved basic calibration block may be used to calibrate the examination on surfaces in the range of curvature from 0.9 to 1.5 times the basic calibration block diameter. For example, an 8 in. (200 mm) diameter curved block may be used to calibrate the examination on surfaces in the range of curvature from 7.2 in. to 12 in. (180 mm to 300 mm) diameter. The curvature range from

0.94 in. to 20 in. (24 mm to 500 mm) diameter requires six block curvatures as indicated in Figure T-434.1.7.2 for

any thickness range as indicated in Figure J-431. 在具有直径 ≦ 20 in. (500 mm)之材料中的焊缝。基本试块用

于校准具有直径 ≦ 20 in. (500 mm)之材料材料中的焊缝时，其外观应弯曲成弧形状。一个单弯弧形标准校

准试块可对在曲面直径范围为标准校准试块直径的 0.9到 1.5倍内之曲面上所执行的检测进行校准。例如，

直径为 8 in. (200 mm)的弧形试块可对在曲率直径为 7.2 in. 至 12 in. (180 mm 至 300 mm) 范围内之曲面上所

执行的检测进行校准。如图 J-431所示，在直径为 0.94 in. 至 20 in. (24 mm 至 500 mm)的曲率范围内，对于

任何厚度范围需要六个如图 T-434.1.7.2所示之弧形试块。

(e ) Retention and Control. All basic calibration blocks for the examination shall meet the retention and

control requirements of the referencing Code Section. 保存和管制。用于检测之所有标准校准试块应符合规范

章节的保存和管制要求。

Table G-461 Transducer Factor 𝑭𝟏 for Various Ultrasonic Transducer

Diameters and Frequencies

表 G-461 用于各种不同直径和频率超声波换能器系数之换能器𝑭𝟏

U.S. Customary Units

Transducer Diameters 换能器直径, in.

Frequency 频率, MHz 0.25 0.5 0.75 1.0 1.125

𝐹1, in.

1.0 2.58 10.3 23.2 41.3 52.3

2.25 5.81 23.2 52.2 92.9 118

5.0 12.9 51.2 116 207 262

10.0 25.8 103 232 413 523

SI Units Transducer Diameters 换能器直径, mm

Frequency 频率, MHz 6.4 13 19 25 29

𝐹1, mm

1.0 65.5 262 590 1 049 1 328

2.25 148 590 1 327 2 360 2 987

5.0 328 1 314 2 958 5 258 6 655

10.0 655 2 622 5 900 10 490 13 276

Figure G-461(a) Critical Radius, 𝑹𝒄 , for Transducer/Couplant Combinations

图 G-461（a）用于换能器/耦合剂组合之临界半径𝑹𝒄

Curve曲线 Couplant 耦合剂 Transducer Wearface shield感器表面磨损保护膜

A Motor oil or water油类或水 Aluminum oxide or boron carbide氧化铝或碳化硼

B Motor oil or water油类或水

Glycerine or syn. ester甘油或类似酯物

Quartz 石英

Aluminum oxide or boron carbide氧化铝或碳化硼

C

D E


Motor oil or water 油类或水


Quartz 石英

Plastic塑料

Plastic塑料

1,000 (25 000)

500 (12 500)

200 (5 000)

100 (2500)

50 (1 250)

20 (500)

10 (250)

5 (125)

2 (50)

1 (25)

0.5 (13) 0 2.0 5.0 10 20 50 100 200 500

Cri

tica

l R

ad

ius,

𝑹𝒄, in

. (m

m)

临界

半径

Transducer Factor, 换能器系数 𝑭𝟏

https://www.google.com.tw/url?sa=t&rct=j&q=&esrc=s&source=web&cd=2&cad=rja&uact=8&ved=0ahUKEwiGvYbkjcfTAhXEXLwKHfz2AT4QFggtMAE&url=http%3A%2F%2Fdictionary.reverso.net%2Fenglish-definition%2Fwear%2520face%2520shield&usg=AFQjCNEXNEO9kofW_0VTP5zDF_Ylhj1Bwg&sig2=AIdHQawC8fKEKibBZ8_A5A

Figure G-461(b) Correction Factor (Gain) for Various Ultrasonic Examination Parameters

图 G-461（b）用于各种各样超声波检查参数之校正系数（增益）

NONMANDATORY APPENDIX I EXAMINATION OF

WELDS USING ANGLE BEAM SEARCH UNITS

非强制性附录 I 采用斜束波检测装置所进行之焊缝检测


This Appendix describes a method of examination of welds using angle beam search units.本附录对采用斜束

波检测装置检缝焊缝的方法给出了相关描述。

I-470 EXAMINATION 检测

I-471 GENERAL SCANNING REQUIREMENTS 通用扫查要求

Three angle beams, having nominal angles of 45 deg, 60 deg, and 70 deg (with respect to a perpendicular to the examination surface), shall generally be used. Beam angles other than 45 deg and 60 deg are permitted provided the measured difference between angles is at least 10 deg. Additional t /4 volume angle beam examination shall be conducted on the material volume within 1/4 of the thickness adjacent to the examination surface. Single or dual element longitudinal or shear wave angle beams in the range of 60 deg through 70 deg (with respect to perpendicu-

lar to the examination surface) shall be used in this t /4 volume. 通常采用具有 45º、60º和 70º（相对于检测表面

的垂直线）标称角度的三个斜束波，然，只要角度间之差异至少为 10º，则也允许采用 45º和 60º以外的波

Corr

ecti

on

Fact

or

(dB

) 修

正系

数

束角度。应对邻近检测表之厚度的 1/4内的材料范围进行附加的 t / 4体积斜束波检测，且应采用 60º至 70º

（相对于检测表面的垂直线）范围内单晶体或双晶体的纵波或斜束切变波。

I-472 EXCEPTIONS TO GENERAL SCANNING REQUIREMENTS 一般扫查要求

之例外工况

Other angles may be used for examination of: 其他角度之斜束波可用于检测：

(a) flange welds, when the examination is conducted from the flange face; 当从法兰面进行检查时之

法兰焊缝；

(b) nozzles and nozzle welds, when the examination is conducted from the nozzle bore; 当从接管孔进

行检测时之接管和接管焊缝；

(c ) attachment and support welds; 连接件和支撑焊缝；

(d) examination of double taper junctures. 双锥形接合处之检测。

I-473 EXAMINATION COVERAGE 检测范围

Each pass of the search unit shall overlap a minimum of 50% of the active transducer (piezoelectric element)

dimension perpendicular to the direction of the scan. 在探头之每次通扫查移动行程之间应至少有垂直于扫描方

向之有效换能器（压电组件）尺寸的 50％覆盖重迭量。

NONMANDATORY APPENDIX J ALTERNATIVE

BASIC CALIBRATION BLOCK 非强制性附录 J 替代性标准校准试块

J-410 SCOPE 适用范围

This Appendix contains the description for an alternative to Article 4, T-434.2 for basic calibration blocks used for distance–amplitude correction (DAC) calibration techniques.

J-430 EQUIPMENT 设备

J-431 BASIC CALIBRATION BLOCK 标准校准块

The basic calibration block(s) containing basic calibration reflectors to establish a primary reference response of the equipment and to construct a distance–amplitude correction curve shall be as shown in Figure J-431. The basic

calibration reflectors shall be located either in the component material or in a basic calibration block. 包含标准校准

反射体之的标准校准试块建立设备的首要参照电平并构建距离振幅校正曲线应如图 J-431所示。标准校准

反射体应位于组件材料中或标准校准试块中。

J-432 BASIC CALIBRATION BLOCK MATERIAL

(1) Block Selection. The material from which the block is fabricated shall be from one of the following:

试块选择。制造试块的材料应为以下其中之一：

(2) nozzle dropout from the component; 从物项剩余料切割下来之接管：

(3) a component prolongation; 物项所预留之长度段

(4) material of the same material specification, product form, and heat treatment condition as the mate-

rial to which the search unit is applied during the examination. 材料规格、产品形式、热处理条件均与检检测期

间探头所要扫查之材料相同。

(b) Clad. Where the component material is clad and the cladding is a factor during examination, the block shall be clad to the component clad nominal thickness ±1/8 in. (3 mm). Deposition of clad shall be by the same method (i.e., rollbonded, manual weld deposited, automatic wire deposited, or automatic strip deposited) as used to clad the component to be examined. When the cladding method is not known or the method of cladding used on the component is impractical for block cladding, deposition of clad may be by the manual method. When the parent ma-terials on opposite sides of a weld are clad by either different P-, A-, or F-numbers or material designations or meth-ods, the calibration block shall be clad with the same P-, A-, or F-numbers or material designations using the same method used on the side of the weld from which the examination will be conducted. When the examination is con-ducted from both sides of the weld, the calibration block shall provide for calibration for both materials and meth-ods of cladding. For welds clad with a different material or method than the adjoining parent materials, to 1.5 times the basic calibration block diameter. Alternatively, a flat basic calibration block may be used provided the minimum convex, concave, or compound curvature radius to be examined is greater than the critical radius determined by Ar-ticle 4, Nonmandatory Appendix A. For the purpose of this determination, the dimension of the straight or angle beam search units flat contact surface tangent to the minimum radius shall be used instead of the transducer diame-

ter in Table A-10. 堆焊。在检测期间，物项材料被堆焊和堆焊层是一种因素的情况下，该试块应被堆焊到物

项堆焊标称厚度的±1/8 in. (3 mm)。堆焊的沉积应采用与用于待检测物项的相同堆焊方法（即辊压、手工

焊接沉积，自动焊丝沉或自动带状电极焊接法）。当堆焊层方法是未知的或者物项所采用之堆焊方法对产

生块状堆焊层是不切实际时，则堆焊层之堆积物可采用手工方法。当在焊缝两侧母材以不同的P-No.、A-

No.、F-No.、材料号或方法进行堆焊时，校准试块应由相同的P-No.、A-No.、F-No.、采用与待检测焊缝侧

具有相同堆焊方法之材料号。当从焊缝两侧进行检测时，校准试块应同时具有对材料和堆焊方法提供校准

之功能。对具有不同于相邻母材之材料或方法之堆焊层，该堆焊层厚度沉积至表准校准块直径的1.5倍，或

者，只要所要检测之的最小凸、凹或复合曲率半径大于由第4章非强制性附录A所确定之临界半径，亦可采

用平标准校准试；为确定此目的，直束波或斜束波探头应采用与最小半径相切的平面式接触面，而非表A-

10中所示之换能器直径。

(c) Heat Treatment. The calibration block shall receive at least the minimum tempering treatment required

by the material specification for the type and grade and a postweld heat treatment of at least 2 hr. 热处理。校准试

块应至少承受材料技术规格书中对材料类型和等级所要求之最低回火处理以及至少两小时的焊后热处理。

(d) Surface Finish. The finish on the surfaces of the block shall be representative of the surface finishes of

the component. 表面处理。在试块表面上之光洁度应能代表受检测物项扫查面上的光洁度。

(e) Block Quality. The calibration block material shall be completely examined with a straight beam search unit. Areas that contain indications exceeding the remaining back reflection shall be excluded from the beam paths

required to reach the various calibration reflectors. 试块质量。校准试块材料应采用直束波探头进行全面性检

测。应使包含超出其剩余背反射之指示区域不能在各种校准反射体所需声程中出现。

J-433 CALIBRATION REFLECTORS 校准反射体

(a) Basic Calibration Reflectors. The side of a hole drilled with its axis parallel to the examination surface is the basic calibration reflector. A square notch shall also be used. The reflecting surface of the notches shall be per-

pendicular to the block surface. See Figure J-431. 标准校准反射体。具有轴线平行于检测表面之钻孔侧即是标

准校准反射体，其中也应采用方形槽口，而槽口的反射面应垂直于试块表面(见图J-431)。

(b) Scribe Line. A scribe line as shown in Figure J-431 shall be made in the thickness direction through the

in-line hole center lines and continued across the two examination surfaces of the block. 划线。如图J-431所示，

划痕线应通过成一直线之各孔中心线沿厚度方向制成，并延伸穿过试块的两个检侧表面。

(c) Additional Reflectors. Additional reflectors may be installed; these reflectors shall not interfere with es-

tablishing the primary reference. 附加反射体。可以辅助设置其他反射体，但这些反射体不应对建立首要参照

电平所有干扰。

(d) Basic Calibration Block Configuration. Figure J-431 shows block configuration with hole size and loca-tion. Each weld thickness on the component must be represented by a block having a thickness relative to the com-ponent weld as shown in Figure J-431. Where the block thickness ±1 in. (25 mm) spans two of the weld thickness ranges shown in Figure J-431, the block’s use shall be acceptable in those portions of each thickness range covered by 1 in. (25 mm). The holes shall be in accordance with the thickness of the block. Where two or more base mate-rial thicknesses are involved, the calibration block thickness shall be sufficient to contain the entire examination

beam path. 标准校准试块配置。图J-431显示了具有孔尺寸和位置的标准校准试块配置。如图J-431所示，物

项上的每一焊缝厚度都必须有由一个与物项焊缝厚度相应的试块来作为代表。当试块以块体厚度±1英寸

（25毫米）之长度跨在图J-431所示的两个焊接厚度范围的情况下，则该试块可适用于为1 in. (25 mm)所涵

盖的每种厚度范围的部分中，然，孔配置应与试块厚度相应。当涉及两个或多个母材厚度时，校准试块厚

度应足以包含整个检测波束声程。

(e) Welds in Materials With Diameters Greater Than 20 in. (500 mm). For examination of welds in materi-als where the examination surface diameter is greater than 20 in. (500 mm), a single curved basic calibration block may be used to calibrate the straight and angle beam examinations on surfaces in the range of curvature from 0.9 to 1.5 times the basic calibration block diameter. Alternatively, a flat basic calibration block may be used provided the minimum convex, concave, or compound curvature radius to be examined is greater than the critical radius deter-mined by Article 4, Nonmandatory Appendix A. For the purpose of this determination, the dimension of the straight or angle beam search units flat contact surface tangent to the minimum radius shall be used instead of the transducer

diameter in Table A-10. 在直径大于20 in. (500 mm)之材料中的焊缝。对检测面直径大于20 in. (500 mm)之材

料中的焊缝进行检测时，若采用单弯弧形标准校准试块时，对在曲面范围为标准校准试块直径的0.9到1.5倍

内之曲面上所执行的直束波和斜束波检测进行来校准，或者，只要所要检测之的最小凸、凹或复合曲率半

径大于由第4章非强制性附录A所确定之临界半径，亦可采用平标准校准试；为确定此目的，直束波或斜束

波探头应采用与最小半径相切的平面式接触面，而非表A-10中所示之换能器直径。

(f) Welds in Materials With Diameters 20 in. (500 mm) and Less. The basic calibration block shall be curved for welds in materials with diameters 20 in. (500 mm) and less. A single curved basic calibration block may be used to calibrate the examination on surfaces in the range of curvature from 0.9 to 1.5 times the basic calibra-tion block diameter. For example, an 8 in. (200 mm) diameter curved block may be used to calibrate the examina-tion on surfaces in the range of curvature from 7.2 in. to 12 in. (180 mm to 300 mm) diameter. The curvature range from 0.94 in. to 20 in. (24 mm to 500 mm) diameter requires six block curvatures as indicated in Figure T-

434.1.7.2 for any thickness range as indicated in Figure J-431. 在具有直径 ≦ 20 in. (500 mm)之材料中的焊缝。

基本试块用于校准具有直径 ≦ 20 in. (500 mm)之材料材料中的焊缝时，其外观应弯曲成弧形状。一个单弯

弧形标准校准试块可对在曲面直径范围为标准校准试块直径的0.9到1.5倍内之曲面上所执行的检测进行校

准。例如，直径为 8 in. (200 mm)的弧形试块可对在曲率直径为7.2 in. 至12 in. (180 mm 至 300 mm) 范围内之

曲面上所执行的检测进行校准。如图J-431所示，在直径为0.94 in. 至20 in. (24 mm 至 500 mm)的曲率范围

内，对于任何厚度范围需要六个如图T-434.1.7.2所示之弧形试块。

(g) Retention and Control. All basic calibration blocks for the examination shall meet the retention and con-

trol requirements of the referencing Code Section. 保存和管制。用于检测之所有标准校准试块应符合规范章节

的保存和管制要求。

Figure J-431 Basic Calibration Block

图 J-431 基准校准试块

Weld Thickness 焊缝厚度

t, in. (mm)

Basic Calibration Block Thickness 标准校准试块厚度

T, in. (mm)

Side Drilled Hole Diameter侧横孔直径,

in. (mm) [Note (3)]

Round Bottom Hole Diameter圆底孔直径, in. (mm) [Note (3)]

and [Note (6)]

Over 2 through 4 (50 through 100) 3 or t (75 or t) 3/16 (5) 3/8 (10)






Over 14 (350) t ± 1 (t ± 25) [Note (2)] [Note (2)]

Figure J-431 Basic Calibration Block (Cont'd) 图 J-431 基准校准试块(续) NOTES: 注：

(1) Minimum dimensions. 最小尺寸。

(2) For each increase in weld thickness of 2 in. (50 mm) or fraction thereof over 14 in. (356 mm), the hole diameter

shall increase 1/16 in. (1.5 mm). 超过 14 in. (356 mm)时，焊缝厚度每增加 2 in. (50 mm) 或无法被 2 in. (50 mm)整除之余数，孔径都应相应增加 1/16 in. (1.5 mm)。

(3) The tolerances for the hole diameters shall be ±1/32 in. (0.8 mm); tolerances on notch depth shall be +10 and

−20% (need only be held at the thinnest clad thickness along the reflecting surface of the notch); tolerance on hole location

through the thickness shall be ±1/8 in. (3 mm); perpendicular tolerances on notch reflecting surface shall be ±2 deg toler-

ance on notch length shall be ±1/4 in. (±6 mm). 孔径公差应为±1/32 in. (0.8 mm)；槽口深度公差应是+10和-20％（仅沿着槽

口反射面之最薄堆焊层厚度处才需保持）；在规块厚度中之孔位置公差应在±/8 in. (3 mm)范围内；在槽口长度上之槽口反射面垂直公差应为±2度公差应为±1/4英寸（±6毫米）。

(4) Clad shall not be included in T. 堆焊层不应包含在 T 中.

(5) Subsurface calibration holes 1/8 in. (3 mm) (maximum) diameter by 1-1/2 in. (38 mm) deep (minimum) shall be

drilled at the clad-to-base metal interface and at 1/2 in. (13 mm) increments through T/4 from the clad surface, also at 1/2

in. (13 mm) from the unclad surface and at 1/2 in. (13 mm) increments through T/4 from the unclad surface. In each case,

the hole nearest the surface shall be drilled at T/2 from the edge of the block. Holes at 1/2 in. (13 mm) thickness increments

from the near surface hole shall be drilled at 1 in. (25 mm) minimum intervals from T/2. 在堆焊层与母材金属界面处和离堆

焊面每 1/2 in. (13 mm)增量至 T / 4处之各次面校准孔的钻孔直径和钻孔深度分别为 1/8 in. (3 mm)（最大）、1-1/2 in. (38 mm)

（最小）的，上述各次面校准孔也可在离无堆焊表面之每 1/2 in. (13 mm)增量至 T / 4处钻孔。在每种情况下，最靠近表面的孔应在离规块边缘 T/2处开始钻孔。从近表面孔至 T/2所钻出之各孔间应至少保持 1 in. (25 mm)的最小间隔。

(6) Round (hemispherical) bottom holes shall be drilled only when required by a Referencing Code Section for

beam spread measurements (see T-434.1) and the technique of B-60▲

is used. The round bottom holes may be located in

the largest block in a set of basic calibration blocks, or in a separate block representing the maximum thickness to be exam-

ined. 仅当引用规范章节需求作为波束扩展度测量（见 T-434.1）并使用 B-60技术时才需钻圆（半球形）底孔。圆底孔可位于

一组标准校准试块中之最大块中，或者在表示待检测最大厚度的那一块中。

▲ASTM B60 Withdrawn 1943, replaved by B584 Standard Specification for Copper Alloy Sand Castings for

General Applications

(7) T/2 hole may be located in the opposite end of the block. T/2孔可以位于图示试块钻孔面的另一端。

NONMANDATORY APPENDIX K RECORDING

STRAIGHT BEAM EXAMINATION DATA FOR PLANAR RE-

FLECTORS 非强制性附 K 记录平面反射体之直束波检测数据

K-410 SCOPE 适用范围

This Appendix describes a method for recording straight beam examination data for planar reflectors when am-

plitude based dimensioning is to be performed. 本附录描述了当以振幅基准来标示尺寸时，用于记录平面反射

体之直束波检测数据的方法。

K-470 EXAMINATION 检测

K-471 OVERLAP 重迭率

Obtain data from successive scans at increments no greater than nine-tenths of the transducer dimension meas-ured parallel to the scan increment change (10% overlap). Record data for the end points as determined by 50% of

DAC. 以不超过换能器之九分之一尺寸与扫查增量变化（10％重迭）下进行连续扫查测量所获得之数据。

以 DAC 的 50％确认各端点的记录数据。

https://www.astm.org/Standards/B584.htm

K-490 RECORDS/DOCUMENTATION 记录/文件

Record all reflectors that produce a response equal to or greater than 50% of the distance–amplitude correction (DAC). However, clad interface and back wall reflections need not be recorded. Record all search unit position

and location dimensions to the nearest tenth of an inch. 记录所有产生灵敏度 ≧ 50％距离 - 振幅校正（DAC）

的反射体。然而，堆焊层界面和背反射是不需要记录的。记录所有探头之位置和位置维度，经度到到 0.1

in.。

NONMANDATORY APPENDIX L TOFD SIZING

DEMONSTRATION/DUAL PROBE — COMPUTER IMAGING

TECHNIQUE 非强制性附录 L TOFD 尺寸测定演示/双探头 - 计算器成像技术

L-410 SCOPE 适用范围

This Appendix provides a methodology that can be used to demonstrate a UT system’s ability to accurately de-termine the depth and length of surface machined notches originating on the examination surface from the result-ing diffracted signals when a nonamplitude, Time of Flight Diffraction (TOFD), dual probe, computer imaging

technique (CIT) is utilized and includes a flaw classification/sizing system. 本附录提供了一种方法，而此方法

是当利用非振幅，时差衍射（TOFD），双探头（TOFD）计算器成像技术（CIT）时，用来证实超音波检

测系统是否能够准确地确定来自在检测表面上机加工所开之槽口深度和长度的衍射讯号，其中包括有缺陷

分类/尺寸测定系统。

L-420 GENERAL 通则

Article 4 requirements apply except as modified herein. 除非经本附录所修订，否则运用第 4章之规定。

L-430 EQUIPMENT 设备

L-431 SYSTEM 系统

System equipment [e.g., UT unit, computer, software, scanner(s), search unit(s), cable(s), couplant, encoder (s),

etc.] shall be described in the written procedure. 系统设备[例如超声波检测装置、计算器、软件、扫查器、探

头、电缆、耦合剂、编码器等] 应在书面规程中给出描述。

L-432 DEMONSTRATION BLOCK 演示试块

(a) The block material and shape (flat or curved) shall be the same as that desired to demonstrate the system’s

accuracy. 试块材料和形状（平面或弧形）应与验证系统精度所要求的相同。

(b) The block shall contain a minimum of three notches machined to depths of T/4, T/2, and 3T/4 and with lengths (L) and, if applicable, orientation as that desired to demonstrate the system’s sizing accuracy. See Figure L-

432 for an example. 该试块应至少包含三个机加工深度至T/4，T/2和3T/4的槽口，如果适用时，亦包含为确

定系统尺寸测定精度所需的长度（L）和取向。图例参见图L-432。

Additional notches may be necessary depending on: 可能需要的其他槽口将取决于下列因素：

(1) the thickness of the block; 试块的厚度；

(2) the number of examination zones the block thickness is divided into; 试块厚度共分为多少个检

测区段；

(3) whether or not the zones are of equal thickness (for example: three zones could be broken into a

top 1/3, middle 1/3, and bottom 1/3 vs. top 1/4, middle 1/2, and bottom 1/4); and各区段是否具有相同的厚度（例

如：三个区段可以分为顶部1/3，中间1/3和底部1/3对顶部1/4，中间1/2，和底部1/4）；和

(4) the depths desired to be demonstrated. 期望被证实之深度。

(c ) Prior to machining the notches, the block material through which the sound paths must travel shall be ex-amined with the system equipment to ensure that it contains no reflectors that will interfere with the demonstration.

在槽口加工之前，应先对波束在试块材料中之传输声程须采用系统设备进行检测，以确保其中不含有会干

扰演示的反射体。

L-460 CALIBRATION 校准

L-461 SYSTEM 系统

The system shall be calibrated per the procedure to be demonstrated. 系统应遵照所要求之演示规程进行校

准。

L-462 SYSTEM CHECKS 系统校对

The following checks shall be performed prior to the demonstration: 演示前应进行如下校对：

(a) Positional Encoder Check. The positional encoder shall be moved through a measured distance of 20 in. (500 mm). The system read-out shall be within 1% of the measured distance. Encoders failing this check shall be

re-calibrated and this check repeated. 位置编码器校对。位置编码器应移动20 in. (500 mm)的测量距离。系统

读数应在实际测量距离的1％以内。编码器未通过此校对时，应在重新校准后重复此校对。

(b) Thickness Check. A free-run shall be made on the measuring block. The distance between the lateral wave and first back-wall signal shall be +0.02 in. (0.5 mm) of the block’s measured thickness. Set-ups failing this check shall have the probe separation distance either adjusted or its programmed value changed and this check re-

peated. 厚度校对。应在测量试块上自由运行。横波和第一次底面回波讯号之间的距离应为试块量厚度的

+0.02 in. (0.5 mm)。无法进行此检查的设置应使探头分离距离进行调整或其编程值更改，并重复此检查。

L-470 EXAMINATION 检测

The demonstration block shall be scanned per the procedure and the data recorded. 演示试块应按照规程进行

扫描并记录数据。

Demonstrations may be performed utilizing: 可采用下列技术进行演示：

(a) D-scan (non-parallel scan) techniques D-扫查（非平行扫查）技术

(b) B-scan (parallel scan) techniques B-扫查（平行扫查）技术

(c ) D-scan (non-parallel scan) techniques with the notches offset by varying amounts to either side of

being centered. 通过在中心每侧以不同槽口偏移量之D-扫查（非平行扫查）技术。

L-480 EVALUATION 评估

L-481 SIZING DETERMINATIONS 尺寸测定

The depth of the notches from the scanning surface and their length shall be determined per the procedure to be

demonstrated. 扫查表面的槽口深度及其长度应按照所要演示之规程确定

L-482 SIZING ACCURACY DETERMINATIONS 尺寸精度测定

Sizing accuracy (%) shall be determined by the following equations: 尺寸测定精度（％）应由下列所示公式

进行确定：

(a) Depth: 深度

[(𝐷𝑑 − 𝐷𝑚) 𝐷𝑚⁄ ] x100

(b) Length: 长度

[(𝐿𝑑 − 𝐿𝑚) 𝐿𝑚⁄ ] x100

where: 其中

𝐷𝑑 and 𝐿𝑑 are the notches’ depth and lengths, respectively, as determined by the UT system being

demonstrated, and 𝐷𝑑和𝐿𝑑 分别是由波声波检测系统所确定之槽口深度和长度，以及

𝐷𝑚 and 𝐿𝑚 are the notches’ depth and lengths, respectively, as determined by physical measure-

ment (i.e., such as replication) D_m和 L_m分别是通过实际测量（即复制）所确定之槽口深度和长度

NOTE: Use consistent units. 注意：使用一致的单位。

Figure L-432 Example of a Flat Demonstration Block Containing Three Notches

图 L-432 平面演示试块(含有三个槽口) 示例

GENERAL NOTE: Block length and width to be adequate for UT System Scanner. 注：试块长度和宽度适用于波声波检系统扫

描仪。

L-483 CLASSIFICATION/SIZING SYSTEM 分类/尺寸测定系统

L-483.1 Sizing Classification. Flaws shall be classified as follows: 分类。缺陷应分类如下：

(a) Top-Surface Connected Flaws. Flaw indications consisting solely of a lower-tip diffracted signal and with an associated weakening, shift, or interruption of the lateral wave signal, shall be considered as extending

to the topsurface unless further evaluated by other NDE methods. 与顶表面连接之缺陷。仅由低尖端部衍射讯

号和具有相关的衰减、偏移或横向波讯号中断所组成的缺陷指示除非通过其他NDE方法进一步评估，否则

应被视为已延伸至顶面。

Notch Details 槽口详图

Exami nation Surface 检测表面

Max. of 1/4 of UT wave-length

Max. 0.20 in. (5 mm)

(b) Embedded Flaws. Flaw indications with both an upper and lower-tip diffracted signal or solely an uppertip diffracted signal and with no associated weakening, shift, or interruption of the back-wall signal shall be

considered embedded. 嵌入式缺陷。对具有上和下尖端部衍射讯号或单独上限衍射讯号且无相关的衰减、偏

移或或底面回波讯号中断之缺陷指示应被视为是嵌入式缺陷。

(c ) Bottom-Surface Connected Flaws. Flaw indications consisting solely of an upper-tip diffracted sig-nal and with an associated shift of the backwall or interruption of the back-wall signal, shall be considered as ex-

tending to the bottom surface unless further evaluated by other NDE methods. 与底面连接之缺陷。除非通过其

他无损检测方法来作进一步评估，否则仅仅由顶端部衍射讯号所引起之缺陷指示以及具有底面回波讯号的

相关偏移或底面回波讯号中断之缺陷指示都被认为是已延伸到底面。

L-483.2 Flaw Height Determination. Flaw height (thru-wall dimension) shall be determined as follows: 缺

陷高度测定。缺陷高度（通孔尺寸）应按如下方式确定：

(a) Top-Surface Connected Flaws. The height of a topsurface connected flaw shall be determined by

the distance between the top-surface lateral wave and the lower-tip diffracted signal. 与顶表面连接之缺陷。应由

顶表面横波和下端部衍射讯号之间的距离来确定与顶面连接之缺陷高度。

(b) Embedded Flaws. The height (h) of an embedded flaw shall be determined by: 嵌入式缺陷。嵌入

缺陷之高度（h）应由下列给出确定：

(1) the distance between the upper-tip diffracted signal and the lower-tip diffracted signal , or, 上

端部衍射讯号和下端部衍射讯号之间的距离，或

(c ) the following calculation for flaws with just a singular upper-tip diffracted signal: 以下仅用于具有

上端部衍射讯号之瑕疵计算：

1 2

2 22d ph c t t s d

Where 其中

c = longitudinal sound velocity纵向声速

d = depth of the flaw below the scanning surface 在扫查面下方之缺陷深度

s = half the distance between the two probes’ index points 两探头入射索引点间之距离

的一半

𝑡𝑑 = the time-of-flight at depth d 在深度 d处之时差

𝑡𝑝 = the length of the acoustic pulse 声脉冲的长度

NOTE: Use consistent units. 注意：需使用一致的单位。

(d) Bottom-Surface Connected Flaws. The height of a bottom-surface connected flaw shall be deter-

mined by the distance between the upper-tip diffracted signal and the back-wall signal. 与底面连接之缺陷。应由

上端部衍射讯号与底面回波讯号之间的距离来确定与底面连接之缺陷高度。

L-483.3 Flaw Length Determination. The flaw length shall be determined by the distance between end fit-ting hyperbolic cursurs or the flaw end points after a synthetic aperture focusing technique (SAFT) program has

been run on the data. 疵长度量测。在数据经由合成光圈聚焦技术（SAFT）程序之运行后，应由端接双曲线

光标或缺陷端点之间的距离来确定瑕疵长度。

L-490 DOCUMENTATION 文件

L-491 DEMONSTRATION REPORT 演示报告

In addition to the applicable items in T-492, the report of demonstration shall contain the following information: 除了 T-492

中所适用之项目外，演示报告还应包含以下信息：

(a) computerized program identification and revision; 计算器程序标识符和修订版次；

(b) mode(s) of wave propagation used; 波的传播方式；

(c ) demonstration block configuration (material, thickness, and curvature); 演示试块之配置（材质，厚

度和曲率）；

(d) notch depths, lengths, and, if applicable, orientation (i.e., axial or circumferential); 槽口深度，长

度，以及如果适用时的方向（即轴向或周向）；

(e ) instrument settings and scanning data; 仪器之设置和扫查数据

(f ) accuracy results. 演示结果之精度。

NONMANDATORY APPENDIX M GENERAL TECH-

NIQUES FOR ANGLE BEAM LONGITUDINAL WAVE CALI-

BRATIONS

非强制性附录 M 斜束纵波校准之通用技术

M-410 SCOPE 适用范围

This Appendix provides general techniques for angle beam longitudinal wave calibration. Other techniques may be used.

The sweep range may be calibrated in terms of metal path, projected surface distance, or actual depth to the reflector. The p ar-

ticular method may be selected according to the preference of the examiner. 本附录对斜束纵波校准提供了通用技术，对不

在本附录中之其他技术亦可采用。扫查范围可根据金属声程，投影表面距离或反射体的实际深度进行校准，亦可以根

据检侧者之个人偏好来选用特定方法。

Angle beam longitudinal wave search units are normally limited to 1/2V-path calibrations, since there is a substantial loss in

beam energy upon reflection due to mode conversion. 斜束纵波探头通常被限制在 1/2 V-声程校准，因为由于模式转换而

导致反射波束能量造成大量的损失存。

M-460 CALIBRATION 校准

M-461 SWEEP RANGE CALIBRATION 扫查范围校准

M-461.1 Side-Drilled Holes (See Figure M-461.1) 侧横孔孔（见图 M-461.1）

NOTE: This technique provides sweep calibration for depth. 注：此技术用于深度之扫查校准。

M-461.1.1 Delay Control Adjustment. Position the search unit for the maximum indication from the

1/4T side-drilled hole (SDH). Adjust the left edge of this indication to line 2 on the screen with the delay control. 延

时控制调整。将探头定位在可获得来至 1/4T 侧横孔（SDH）的最大回波讯号处。以延时控制旋钮将该讯号

之左前缘调整至屏幕上之线 2处。

M-461.1.2 Range Control Adjustment.23 Position the search unit for the maximum indication from

the 3/4T SDH. Adjust the left edge of this indication to line 6 on the screen with the range control. 范围控制调整。

将探头定位在可获得来至 3/4T SDH 的最大回波讯号处。以范围控制将旋钮将该讯号之左前缘调整至屏幕上

之线 6处。

M-461.1.3 Repeat Adjustments. Repeat delay and range adjustments until the 1/4T and 3/4T SDH

indications start at sweep lines 2 and 6. 反复调整。反复进行延时和范围调整，直到 1/4T 和 3/4T SDH 之回波

讯号从扫查线之线 2和线 6开始。

M-461.1.4 Sweep Readings. Two divisions on the sweep now equal 1/4T. 扫描读数。在扫查上之两

标度现在都等于 1/4T。

M-461.2Cylindrical Surface Reference Blocks (See Figure M-461.2). 圆柱形表面参考试块（见图 M-

461.2）。

NOTE: This technique provides sweep calibration for metal path. 注：本技术为金属声程提供了扫

描校准。

M-461.2.1 Delay Control Adjustment. Position the search unit for the maximum indication from the 1 in. (25 mm) cylindrical surface. Adjust the left edge of this indication to line 5 on the screen with the delay con-

trol. 延时控制调整。将探头定位在可获得来至该 1 in. (25 mm) 圆柱形表面的最大回波讯号处。以延时控制

旋钮将该讯号之左前缘调整至屏幕上之线 5处。

M-461.2.2 Range Control Adjustment. Position the search unit for the maximum indication from the 2 in. (50 mm) cylindrical surface. Adjust the left edge of this indication to line 10 on the screen with the range con-

trol. 范围控制调整。将探头定位在可获得来至该 2 in. (50 mm)圆柱形表面的最大回波讯号处。以范围控制

将旋钮将该讯号之左前缘调整至屏幕上之线 10处。

M-461.2.3 Repeat Adjustments. Repeat delay and range control adjustments until the 1 in. (25 mm)

and 2 in. (50 mm) indications start at sweep lines 5 and 10. 反复调整。反复进行延时和范围调整，直到来至 1

in. (25 mm) 和 2 in. (50 mm)圆柱形表面的回波讯号从扫描线之线 5和线 10开始。

Figure M-461.1 Sweep Range (Side-Drilled Holes)

图 M-461.1 扫查范围（侧横孔）

Figure M-461.2 Sweep Range (Cylindrical Surfaces)

图 M-461.2 扫查范围（圆柱形表面）

Range

0 2 4 6 8 10 0 2 4 6 8 10

Reflectors moved



Range 范围

Delay 延时

Range 范围 Delay 延时

M-461.2.4 Sweep Readings. The sweep now represents 2 in. (50 mm) of sound path distance. 扫查读

数。扫查现在相当于 2 in. (50 mm)的声程距离。

M-461.3 Straight Beam Search Unit and Reference Blocks (See Figure M-461.3). 直束波探头和参考试

块（参见图 M-461.3）

NOTE: This technique provides sweep calibration for metal path. 注：本技术为金属声程提供了扫

查校准。

M-461.3.1 Search Unit Placement. Position a straight beam search unit on a 1 in. (25 mm) thick ref-

erence block so as to display multiple back-wall indications. 探头定位。在 1 in. (25 mm)厚的参考块上可显示多

底面回波讯号处，即是直束波探头之定位处。

M-461.3.2 Delay Control Adjustment. Adjust the left edge of the first back-wall indication to line 5

on the screen with the delay control. 延时控制调整。以延时控制旋钮将第一次底面回波讯号之左前缘调整到

屏幕上的线 5处。

M-461.3.3 Range Control Adjustment. Adjust the left edge of the second back-wall indication to

line 10 on the screen with the range control. 范围控制调整。以范围控制旋钮将第二个底面回波讯号之左前缘

调整到屏幕上的线 10处。

M-461.3.4 Repeat Adjustments. Repeat delay and range control adjustments until the 1 in. (25 mm)

and 2 in. (50 mm) indications start at sweep lines 5 and 10. 反复调整。反复进行延时和范围控制调整，直到来

至 1 in. (25 mm) 和 2 in. (50 mm)圆柱形表面的回波讯号从扫描线之线 5和线 10开始。

Figure M-461.3 Sweep Range (Straight Beam Search Unit)

图 M-461.3 扫查范围（直束波探头）

M-461.3.5 Final Delay Adjustment. Remove the straight beam search unit from the coaxial cable and connect the angle beam search unit to the system. Position the search unit for the maximum indication from the 2 in. (50 mm) cylindrical surface. Adjust the left edge of this indication to line 10 on the screen with the delay control.

最终延时调整。从同轴电缆上拆下直束波探头，并将斜束波探头连接到系统上。移动探头直到系统可找出

来至 2 in. (50 mm)圆柱形表面中的最大回波讯号。以延时控制旋钮将该讯号之左前缘调整至屏幕上之线 10

处。

Range 范围

Delay 延时 Delay 延时

M-461.3.6 Sweep Readings. The sweep now represents 2 in. (50 mm) of sound path distance. 扫查读

数。扫查现在相当于 2 in. (50 mm)的声程距离。

M-462 DISTANCE–AMPLITUDE CORRECTION (DAC) (SEE FIGURE M-462)

距离振幅校正（DAC）（见图 M-462）

(a) Position the search unit for maximum response from the SDH that gives the highest amplitude. 定位将

探头定位仔可获得来至能给出SDH最大灵敏度之最大幅度处。

(b) Adjust the sensitivity (gain) control to provide an indication of 80% (±5%) of full screen height. This is

the primary reference level. Mark the peak of this indication on the screen. 用灵敏度（增益）控制旋钮将讯号调

整到满屏高度的80％（±5％）处，并以此作为首要参照电平。标记出该讯号之峰值。

(c ) Position the search unit for maximum response from another SDH and mark the peak of the indication

on the screen. 将探头定位在能获得来自第二个SDH所显示之最大灵敏度处，并在屏幕上标记出该讯号之峰

值。

(d) Position the search unit for maximum response from the third SDH and mark the peak on the screen. 将

探头定位在能获得第三个SDH所显示之最大振幅处，并在屏幕上标出第三个SDH的峰值，并在屏幕上标记

出该讯号之峰值。

(e ) Connect the screen marks of the SDHs to provide the DAC curve. 连接在屏幕所标记之各SDH峰值点

以制作出DAC曲线。

Figure M-462 Sensitivity and Distance–Amplitude Correction

图 M-462 灵敏度和距离幅度校正

NONMANDATORY APPENDIX N TIME OF

FLIGHT DIFFRACTION (TOFD) INTERPRETATION

非强制性附录 N 时差衍射(TOFD)解说

N-410 SCOPE 适用范围

This Appendix is to be used as an aid for the interpretation of Time of Flight Diffraction (TOFD) ultrasonic images. Diffraction is a common ultrasonic phenomenon and occurs under much broader conditions than just longi-tudinal-longitudinal diffraction as used in typical TOFD examinations. This interpretation guide is primarily aimed at longitudinal-longitudinal diffraction TOFD setups using separated transducers on either side of the weld on a

plate, pipe, or curved vessel. Other possibilities include: 本附录将作为解释时差衍射(TOFD)超声波图像的辅助

Reflectors moved



Reflectors moved into beam

已移动到反射体中之波束

(a) Sensitivity 灵敏度 (b) Distance Amplitude 距离振幅


手段。衍射是一种常见的超声现象，并且在比在典型 TOFD 检测中仅采使用之纵向纵波衍射更广泛的条件

下发生。本解释主要是在板，管或弧形状容器上之焊缝两侧采用各自独立的换能器下给出纵向纵波衍射

TOFD 设置指南。其他可能性包括有：

(a) shear-shear diffraction S-S波衍射

(b) longitudinal-shear diffraction L-S波衍射

(c ) single transducer diffraction (called “back diffraction” or the “tip-echo method” ) 具有两个Bahtinov

mask (Bahtinov蔽光框)和四晶体之单一整体换能器衍射 [称之为“背衍射(亦称四波法，如下图示)”或“尖

端部回波法”]

(d) twin transducer TOFD with both transducers on the same side of the flaw/weld 双换能器时差衍

射，具有两个位于缺陷/焊缝同一侧之换能器

(e ) complex inspections, e.g., nozzles 复杂的检测，例如接管

Bahtinov mask

晶体所发出之波束

N-420 GENERAL 通则

N-421 TOFD IMAGES — DATA VISUALIZATION 时差衍射图像数据可视化

(a) TOFD data is routinely displayed as a grayscale image of the digitized A-scan. Figure N-421(a) shows

the grayscale derivation of an A-scan (or waveform) signal. 时差衍射数据通常以数字化A-扫描灰度图像显示。

图N-421(a)示出了A-扫描(或波形)讯号的灰度推导。

(b) TOFD images are generated by the stacking of these grayscale transformed A-scans as shown in Figure N-421(b). The lateral wave and backwall signals are visible as continuous multicycle lines. The midwall flaw shown consists of a visible upper and lower tip signal. These show as intermediate multicycle signals between the

lateral wave and the backwall. 如图N-421(b)所示，TOFD图像是由这些灰度变换的A-扫描迭加而产生的。横

波和底面回波讯号可见的是连续多轮线。中间层缺陷由可见的上尖端部和下尖端部讯号组成来显示，这些

显示即是横波和背反射之间的中间层多轮讯号。

(c ) TOFD grayscale images display phase changes, some signals are white-black-white; others are black-white-black. This permits identification of the wave source (flaw top or bottom, etc.), as well as being used for flaw sizing. Depending on the phase of the incident pulse (usually a negative voltage), the lateral wave would be posi-tive, then the first diffracted (upper tip) signal negative, the second diffracted (lower tip) signal positive, and the backwall signal negative. This is shown schematically in Figure N-421(c). This phase information is very useful for signal interpretation; consequently, RF signals and unrectified signals are used for TOFD. The phase information is used for correctly identifying signals (usually the top and bottom of flaws, if they can be differentiated), and for de-

termining the correct location for depth measurements. TOFD灰度图像显示相位变化，有些讯号为白色-黑色-白

色的阴影，而其它的则是黑色-白色-黑色的阴影(因线条间隔很紧密，所以在视觉上将它们整合成一个单一

的图像)，因此藉由这些阴影线便能识别波源(缺陷顶部或底部等)，以及用于缺陷尺寸量测。根据入射脉冲

相位(通常为负电压)，横波设定为正，因此第一次衍射(上尖端部)信号为负、第二个衍射(下尖端部)讯号为

正、背反射信号为负，这在图N-421(c)中给了示意性图例。此相位信息对于讯号解释来说是非常有用，因

此，TOFD所采用的是RF(射频)讯号和未校正过的识别讯号，且此相位信息可准确地识别讯号(若缺陷可被

区分时，通常是在顶端部和底部)，并且可用来确定深度测量时的正确位置。

(d) An actual TOFD image is shown in Figure N-421(d), with flaws. The time-base is horizontal and the axis of motion is vertical [the same as the schematic in Figure N-421(c)]. The lateral wave is the fairly strong multi-cycle pulse at left, and the backwall the strong multicycle pulse at right. The flaws show as multicycle gray and white reflections between the lateral and backwall signals. The scan shows several separate flaws (incomplete fu-sion, porosity, and slag). The ultrasonic noise usually comes from grain reflections, which limits the practical fre-quency that can be used. TOFD scans may only show the lateral wave (OD) and backwall (ID), with “noise.” There is also ultrasonic information available past the backwall (typically shear wave diffractions), but this is generally

not used. 具有缺陷的一种实际TOFD图像如图N-421(d)所示，其中时基轴是水平方向，移动轴是垂直方向[这

与图N-421(c)中的原理图是相同的)。在最左侧之横波是相当强的多周期脉冲，且最右侧是底部强多周期脉

冲。在横向波和背反射讯号间以多周期灰阶和白色反射波来显示这些缺陷。在扫查中显示了几种单独的缺

陷(未完全溶合，气孔和夹渣)。超声波噪声通常来自晶粒的反射波，这现象限制了实际可用频率。 TOFD扫

描只能显示具有“噪声”之横向波[OD-检测面(外径)]和底部回波[ID-检测面之相对面(内径)]。通过内径的

超声信息(通常是切变波衍射)有用的，但通常还是不被采用。

Figure N-421(a) Schematic Showing Waveform Transformation Into Grayscale

图 N-421(a) 显示波形转换成灰阶之示意图

N-450 PROCEDURE 规程

N-451 MEASUREMENT TOOLS 测量工具

TOFD variables are probe spacing, material thickness, sound velocity, transducer delay, and lateral wave transit and backwall reflection arrival time. Not all the variables need to be known for flaw sizing. For example, cal-ibration using just the lateral wave (front wall or OD) and backwall (ID) signals can be performed without knowing

the transducers delay, separation▲, or velocity. The arrival time, Figure N-451, of the lateral wave (𝑡1) and the back-

wall signal (𝑡2) are entered into the computer software and cursors are then displayed for automated sizing. 探头间

距、材料厚度、声速、换能器延时、横向波传输和背反射波到达时间等均是 TOFD 之变量。并不是所有的

变量都为缺陷大小测定时所需要了解的。例如，可在不知道换能器延时、分割数或速度的情况下执行仅采

用横向波(前壁或 OD)和底波(ID)讯号的校准。横向波(𝑡1)到达时间和背反射讯号(𝑡2)被输入到计算器软件

中，然后显示光标以进行自动调整(如图 N-451所示)。

▲Segment image into two or three regions using geodesic distance-based color segmentation

Amplitude 振幅

Figure N-421(b) Schematic Showing Generation of Grayscale B-Scan From Multiple A-Scans

图 N-421(b) 从多次的 A-扫查讯息来生成可显示之灰阶 B-扫查的示意图

Figure N-421(c) Schematic Showing Standard TOFD Setup and Display With Waveform and

Signal Phases

图 N-421(c) 显示标准 TOFD设置和显示波形与讯号相位的示意图

Figure N-421(d)TOFD Display With Flaws and Displayed A-Scan

图 N-421(d) 具有缺陷的 TOFD显示和所显示之 A-扫描

GENERAL NOTE: Time is horizontal and the axis of motion is vertical. 通注：时间轴是水平的，移动轴是垂直的。

N-452 FLAW POSITION ERRORS 缺陷位置误差

Flaws will not always be symmetrically placed between the transmitter and receiver transducers. Normally, a single pair of transducers is used, centered on the weld axis. However, multiple TOFD sets can be used, particularly on heavy wall vessels, and offsets are used to give improved detection. Also, flaws do not normally occur on the weld centerline. Either way, the flaws will not be positioned symmetrically, Figure N-452(a) and this will be a

source or error in location and sizing. 缺陷并非总是被放置在对称发射器和接收器换能器之间。通常，采用一

对换能器，以焊缝轴线为中心，然而，也可采用多组TOFD组 (特别是在厚壁容器上)，并采用偏移技术来

改善检测的精准度；此外，在焊缝中心在线通常是不会发生缺陷的，总之，这些缺陷位置不会以对称于焊

缝中心线之方式布置的[(见图 N-452(a)]，这也就是在位置和尺寸测定上产生误差的由来。

There will be positional and sizing errors associated with a noncentered non-centered flaw, as shown in Figure N-452(b). However, these errors will be small, and generally are tolerable since the maximum error due to off-axis position is less than 10% and the error is actually smaller yet since both the top and bottom of the flaw are offset by similar amounts. The biggest sizing problems occur with small flaws near the backwall. Exact error values will de-

pend on the inspection parameters. 如图 N-452(b)所示，不在中心线处之缺陷会为位置和尺寸在测定时带来误

差。然而，这些误差通常是可以忍受的小误差，由于缺陷位置偏离轴线所导致之最大误差小于 10％，且在

实际上之误差会更小，此现象之主因在于缺陷顶端部和底端部都以相似的偏置量而被偏移了。尺寸测定上

之最大问题是发生在底部附近的小缺陷。精确的误差值将取决于这些检测参数。

N-453 MEASURING FLAW LENGTH 缺陷长度测量

Flaw lengths parallel to the surface can be measured from the TOFD image by fitting hyperbolic cursors to the

ends of the flaws (see Figure N-453). 通过将双曲线光标拟合到缺陷的末端，可从 TOFD 图像来对裂纹长度之

取向与表面相平行下进行长度测量(见图 N-453)。

N-454 MEASURING FLAW DEPTH 缺陷深度测量

Incomplete fusion at root

根部处溶合不良

Porosit 氣孔

Incomplete sidewall fusion

与坡口面间的溶合不良

Slag 夹渣

Flaw height perpendicular to the surface can be measured from the TOFD image by fitting cursors on the top and bottom tip signals. The following are two examples of depth measurements of weld flaws in a 1 in. (25 mm) thick plate. Figure N-454(a) is midwall lack of fusion and Figure N-454(b) is a centerline crack. Note that TOFD signals are not linear, so midwall flaws show in the upper third region of the image. It is possible to linearize the

TOFD scans by computer software. 来对可与表面成垂直取向之缺陷根据在将光标拟合到TOFD图像中之顶端

部和底端部讯号来进行缺陷高度测定。以下是在 1 in. (25 mm)厚板上中之各焊缝缺陷进行深度测量的两个

例子。图 N-454(a)示出中间层处的不完全溶合，而图 N-454(b)所示的是中心线裂纹。请注意，TOFD讯号

不是线性的，因此中间层处之缺陷高度显示在图像之第三区上部；可以通过计算器软件将TOFD扫描予以

线性化。

Figure N-451 Measurement Tools for Flaw Heights

图 N-451 缺陷高度之测量工具

N-480 EVALUATION 评估

This section shows a variety of TOFD images and the interpretation/explanation. Unfortunately, there are sig-nificant variations amongst flaws and TOFD setups and displays, so the following images should be used as a guide only. Evaluator experience and analysis skills are very important as well. 本节对各种不同的 TOFD 图像和解释/说明给出

了介绍。不幸的是，缺陷和 TOFD 设置和显示之间存在显著差异，因此以下图像仅作为参考。评估员的经验和分析技巧也是很重

要的。

N-481 SINGLE FLAW IMAGES 单张缺陷图像

(a) Point flaws [Figure N-481(a)], like porosity, show up as single multicycle points between the lateral and backwall signals. Point flaws typically display a single TOFD signal since flaw heights are smaller than the ring-down of the pulse (usually a few millimeters, depending on the transducer frequency and damping). Point flaws

usually show parabolic “tails” where the signal drops off towards the backwall. N-481(a)点状缺陷[图N-

481(a)]，如气孔，在横向和背反射讯号之间显示为多轮单点。由于缺陷高度小于脉冲振铃信号(通常为几毫

米，取决于换能器频率和阻尼)，因此点状缺陷通常以单个TOFD信号显示。点状缺陷通常显示拋物线“尾

巴”，且此尾巴讯号朝底部信号向后壁垂落。

(b) Inside (ID) far-surface-breaking flaws [Figure N-481(b)] shows no interruption of the lateral wave, a

signal near the backwall, and a related interruption or break of the backwall (depending on flaw size). 较长之内部

(ID)近坡口面开口性缺陷(图N-481(b))显示了横向波在近底部之前不产生中断的一种讯号，和一种近底部讯

Cursors Build-in

內置光標

𝑡1,𝑡2 𝑑1,𝑑2 and h are automatically

calculat ed 𝑡1 ,𝑡2轉換成𝑑1 ,𝑑2且自動計

算出 h

号和一种相应中断或下降的底部讯号(取决于缺陷尺寸)。

(c ) Near-surface-breaking flaws [Figure N-481(c)] shows perturbations in the lateral wave. The flaw breaks the lateral wave, so TOFD can be used to determine if the flaw is surface-breaking or not. The lower signal can then be used to measure the depth of the flaw. If the flaw is not surface-breaking, i.e., just subsurface, the lateral wave will not be broken. If the flaw is near-subsurface and shallow (that is, less than the ringing time of the lateral wave or a few millimeters deep), then the flaw will probably be invisible to TOFD. The image also displays a number of

signals from point flaws. 延伸外表面(OD)之近坡口面处开口性缺陷[图N-481(c)]显示在横波中所产生的微

扰，也就是说缺陷会截断横波，因此TOFD可用来于确定缺陷是否是表面开口型缺陷，然后可采用频率较低

的讯号来测量缺陷深度。若缺陷不是开口性缺陷，即仅在次表面之下，那横波是不会被破坏的。若缺陷是

近次表并且距表面很浅(即，小于横波的振铃时间或几毫米深)时，则缺陷可能不会在TOFD图像中被显示出

来。图N-481(c)所示图像还显示了来自点状缺陷的若干讯号。

Figure N-452(a) Schematic Showing the Detection of Off-Axis Flaws

图 N-452(a) 探知偏离轴线缺陷之示意图

Figure N-452(b) Measurement Errors From Flaw Position Uncertainty

图 N-452(b) 因缺陷位置不确定度所导致之测量误差

Flaw Position Uncertainty 缺陷位置不确定度

GENERAL NOTE: In practice, the maximum error on absolute depth position lies below 10%. The error on height estimation of

internal (small) flaws is negligible. Be careful of small flaws situated at the backwall. 通则：在实际上，在绝对深度位置上之最大误差

在 10％以下。内部(小)缺陷的高度测定误差可忽略不计。对位于底部处之小缺陷需特别关注。

(d) Midwall flaws [Figure N-481(d)] show complete lateral and backwall signals, plus diffraction signals from the top and bottom of the flaw. The flaw tip echoes provide a very good profile of the actual flaw. Flaw sizes can be readily black-white, while the lower echo is black-white-black. Also note the hyperbolic curve that is easily visible at the left end of the top echo; this is similar to the effect from a point flaw [see N-481(a)] and permits accu-

rate length measurement of flaws [see N-450(a)]. 中间层缺陷[图N-481(d)]会以完整的横向和背反射讯号以及来

自缺陷顶端部和底端部的衍射讯号号显示。缺陷尖端部回波提供了非常好的实际缺陷轮廓。缺陷尺寸可容

易地转换成黑-白色，而较低的回波则是黑-白-黑色，还要注意在顶部部回波左前端很容易看到的双曲线，

这与点状缺陷的影响效应极为相似[见N-481(a)]，并此得能精确地测定缺陷长度[见N-450(a)]。

S S

Transmitter 发射器 Receiver 接收器

t0

t1 t2

Transmitter 发射器 Receiver 接收器

If a midwall flaw is shallow, i.e., less than the transducer pulse ring-down (a few millimeters), the top and bottom tip signals cannot be separated. Under these circumstances, it is not possible to differentiate the top from the bottom of the flaw, so the evaluator can only say that the flaw is less than the ringdown distance (which depends

on transducer frequency and damping, etc.). 若中间层缺陷较浅时 [即小于换能器脉冲衰减(几毫米)]，则该缺陷

之顶部和底部之尖端信号无法在屏幕上被独立显示出来，在此情况下，是无法区分缺陷的顶端部与底端

部，因此判定者只能说缺陷小于振铃距离(取决于换能器频率和阻尼等)。

(e ) Lack of root penetration [see Figure N-481(e)] is similar to an inside (ID) far-surface-breaking flaw [see N-481(b)]. This flaw gives a strong diffracted signal (or more correctly, a reflected signal) with a phase inversion from the backwall signal. Note that whether signals are diffracted or reflected is not important for TOFD characteri-zation; the analysis and sizing is the same. Also note even though there is a perturbation of the backwall signal, the backwall is still visible across the whole flaw. This material also shows small point flaws and some grain noise, which is quite common. TOFD typically overemphasizes small point flaws, which are normally undetected by con-

ventional shear wave pulse-echo techniques. 根部熔透不良[见图N-481(e)]之特征类似于较长之内部(ID)近坡口

面开口性缺陷[见N-481(b)]，此类缺陷从背反射讯号中提供了具有相位反转的强衍射讯号(或更准确地说是

反射信号)。注意，讯号到底是衍射还是反射就TOFD示性来说不是一种很重要的课题，因衍射或反射讯号

在分析和尺寸测定效果上都是一样的，尚须注意到，即使有背反射讯号的振铃，但在底部处仍然可看到整

个缺陷，而这种缺陷讯号也常显示出小点状缺陷和一些晶粒噪声。 TOFD对在惯用切变波脉冲回波技术无

法检测到之小点状缺陷特别具有优势。

Figure N-453 TOFD Image Showing Hyperbolic “Tails” From the Ends of a Flaw Image Used to

Measure Flaw Length从用于测定缺陷长度之缺陷图像末端所显示之双曲线“尾巴” TOFD 图像

(f ) Concave root flaws [see Figure N-481(f)] are similar to lack of root penetration. ▲ The top of the concave root flaws [see Figure N-481(f)] is visible in the TOFD image, as well as the general shape. The backwall signal

shows some perturbation as expected. 在TOFD图像中可看见根部内缺陷 [见图N-481（f）] 之顶端部和缺陷的

整个形状。如所预期的那样背反射讯号显出某程度的微扰。

▲根部内凹缺陷在以任何无损检测技术所产生之波形上完全与根部熔透不良是完全不同波形

显示，怎会是类似的呢？，除非ASME编写者在其本身之技术操作和判定上出了大问题。

(g) Sidewall lack of fusion [see Figure N-481(g)] is similar to a midwall flaw [see N-481(d)] with two dif-ferences. First, the flaw is angled along the fusion line, so TOFD is effectively independent of orientation, which is not a problem for TOFD. Second, the upper flaw signal is partly buried in the lateral wave for this particular flaw. In this instance, the upper tip signal is detectable since the lateral wave signal amplitude is noticeably increased.

However, if this were not the case, then the evaluator would be unable to accurately measure the flaw depth. 坡口面

溶合不良[见图N-481（g）] 在其所显示之图像中除有两种差异外，其余有点类似于中间层缺陷[见N-481

（d）]；首先，缺陷沿溶合线被角度化，所以TOFD有效地独立于取向，且这对于TOFD来说并不是一个问

题；第二，对此特定缺陷，上尖端部瑕疵讯号被局部地内埋在横向波中的情况下，此时由于横波讯号在相

对上具有有较高的振幅，因此即使在这种情况还是可检测到上尖端部瑕疵讯号，但，若不是如此，那么判

朝底部下垂

定者将无法准确地测量到缺陷深度。

Figure N-454(a)TOFD Image Showing Top and Bottom Diffracted Signals From Midwall Flaw

and A-Scan Interpretation显示来至中间层缺陷和 A-扫描解释之顶部和底部衍射讯号的 TOFD 图像

Figure N-454(b) TOFD Image Showing Top and Bottom Diffracted Signals From Centerline

Crack and A-Scan Interpretation

图 N-454（b） TOFD 图像显示来至中心线处之裂纹和 A-扫描解释的顶部和底部衍射讯号

横波缺陷顶端部回波缺陷底端部回波

检测表面相对侧之回波

0 .43

0 .59

0.43 in. (11 mm)

0.59 in. (15 mm)

0 .43 0.59

Figure N-481(a) Schematics of Image Generation, Scan Pattern, Waveform, and TOFD Dis-

play Showing the Image of the Point Flaw图像生成、扫查模式、波形显示点状缺陷之 TOFD 显像的示意

图

(h) Porosity [see Figure N-481(h)] appears as a series of hyperbolic curves of varying amplitudes, similar to the point flaw [see N-481(a)]. The TOFD hyperbolic curves are superimposed since the individual porosity pores are closely spaced. This does not permit accurate analysis, but the unique nature of the image permits characteriza-

tion of the signals as “multiple small point flaws,” i.e., porosity. 气孔[见图N-481（h）]以一系列具有不同振福的

双曲线，且以类似于点状缺陷[见N-481（a）]之型态显示。因各单独气孔之间是以极细密的间隔相互地被

隔开，因此 TOFD双曲线是迭加的，在此情况下是无法运用在精确分析上的，但图像的独特性质可将信号

表征为“多个小点状缺陷”(即气孔)。

(i ) Transverse cracks [see Figure N-481(i)] are similar to a point flaw [see N-481(a)]. The TOFD scan dis-plays a typical hyperbola. Normally, it would not be possible to differentiate transverse cracks from near-surface

porosity using TOFD; further inspection would be needed. 横向裂纹[见图N-481（i）]所产生之图像有点类似于

点状缺陷[见N-481（a）]。由于 TOFD扫查所显示的是一种典型的双曲线，因此在一般条件，想利用TOFD

来区分横向裂缝和近表面气孔是一件不可能的技术，因此需透过其他方法做进一步地检测。

(j ) Interpass lack of fusion [see Figure N-481(j)] shows as a single, high amplitude signal in the midwall region. If the signal is long, it is easily differentiated from porosity or point sources. It is not possible to distinguish the top and bottom, as these do not exist as such. Note the expected phase change from the lateral wave. Interpass

lack of fusion signals are generally benign. 层间溶合不良[见图N-481（j）]在中间区域以单一高振幅讯号模式

显示。若讯号较长，则与气孔或点状缺陷间的差异就比较容易区分开来，由于此类缺陷不存在着所谓的顶

部和底部，因此要作出顶部和底部区分是一件不可能的事。注意所预期的横波相变。层间溶合不良通常多

可获得不错的讯号。

N-482 MULTIPLE FLAW IMAGES 具有多种缺陷之图像

TOFD images of flawed welds contain four flaws each. 有缺陷焊缝之 TOFD图像，其中包含了具有四种缺

陷之各焊缝。

N-482.1 Plate 1 [Figure N-482(a)]. Figure N-482(a) clearly illustrates the significant advantages of

TOFD (midwall flaw detection, flaw sizing), the limitations due to dead zones, and that 板 1 [图 N-482（a）]。

图 N-482（a）清楚地说明了 TOFD 的显著优点（中间层缺陷检测，缺陷尺寸），以及起因于死区和如下所

示的限制因素，

A-scan

3.1

8.2

横波检测表面相对侧之回波

指示

(a) the sidewall incomplete fusion shows up clearly, as does the slag. 坡口面溶合不良跟夹渣都可

清楚地显示出来。

(b) the incomplete fusion at the root was not easily detected, though it did disturb the backwall. This is not surprising in the backwall dead zone due to a shear-shear diffracted wave. This example illustrates the poten-

tial value of using information later in the time base, but this is outside the scope of this interpretation manual. 在根

部处的溶合不良是不容易被检测到，由于双切变衍射波在底部所导致死区，因此尽管根部溶合不良会对底

部讯号产生干扰，但这绝非是意外。此示例说明了在时基之后所采用之信息的潜在价值，但这不在本解释

手册的范围之内。

(c ) the root crack is not visible at all due to the backwall dead zone. 所有在底部死区所产生的根

部裂纹事不可见。

N-482.2 Plate 2 [Figure N-482(b)]. Figure N-482(b) shows that: 板 2 [图 N-482（b）]。图 N-482

（b）证明了：

(a) all four flaws are detectable 所有四种缺陷都是可检测的所有四种缺陷都是可检测的

Figure N-481(b) Schematics of Image Generation, Flaw Location, and TOFD Display Showing

the Image of the Inside (ID) Surface-Breaking Flaw示意图，以用于展示图像生成、缺陷位置和显示

内部（ID）近坡口面开口性缺陷缺陷的 TOFD图像

(a) the incomplete fusion at the root shows up clearly in this scan because it is deeper. Both the

backwall perturbation and the flaw tip signals are clear. 根部未熔透因其深度已近于底面，因此在这种扫描中显

得很清楚。底壁微扰和缺陷尖端部信号均清晰。根部未熔透因其深度已近于底面，因此在这种扫描中显得

很清楚。底壁微扰和缺陷尖端部信号均清晰。

(b) the crown toe crack is clearly visible, both by complete disruption of the lateral wave and by the bottom tip signal. Both the incomplete fusion at the root and crown toe crack are identifiable as surface breaking by

the disruption of the lateral wave and backwall signal, respectively. 通过横波的完全中断和底部尖端部信号，可

以清楚地看到焊冠趾部裂纹。根部未熔透和焊冠趾部裂纹处可分别通过横波的中断和背反射信号而识别为

表面开口。

Figure N-481(c) Schematics of Image Generation, Flaw Location, and TOFD Display Showing the

Image of the Outside (OD) Surface-Breaking Flaw图像生成、缺陷位置和显示延伸外表面(OD)之近

坡口面处开口性缺陷的 TOFD 图像示意图

Figure N-481(d) Schematics of Flaw Location, Signals, and TOFD Display Showing

the Image of the Midwall Flaw 缺陷位置、信号和以 TOFD图像展示中间层缺陷图像之示意图

(c ) the porosity is visible as a series of signals. This cluster of porosity would be difficult to charac-

terize properly using the TOFD scan alone, since it could be identified as slag or a planar flaw. 气孔是一系列可见

信号。仅采用TOFD扫查很难适当地描述此类聚集气孔的特征，因为它可能被识别为夹渣或平面型缺陷。

(d) the incomplete sidewall fusion is clearly visible and could be easily sized using cursors. 近坡口

面之不完熔透是清晰可见的，并且可藉由光目标采用就可容易地定出尺寸。近坡口面之不完熔透是清晰可

见的，并且可藉由光目标采用就可容易地定出尺寸。

Surface-breaking flaw延伸至外表面之近坡口面开口性缺陷

1

2

1

2

3

4

Figure N-481(e) Schematics of Flaw Location and TOFD Display Showing the Image of the Lack

of Root Penetration示意图，以用于表示缺陷位置和以 TOFD 图像展示根部熔透不良之图像

Figure N-481(f) Schematics of Flaw Location and TOFD Display Showing the Image of the Con-

cave Root Flaw示意图，以用于表示缺陷位置和以 TOFD 图像展示根部内凹缺陷显示图像

N-483 TYPICAL PROBLEMS WITH TOFD INTERPRETATION

具有 TOFD 解释的典型问题

TOFD images can be corrupted by incorrect setups or other problems such as electrical noise. The following im-ages were all made on the same plate to show some of the typical problems that can occur. Starting first with an

acceptable scan, and then subsequent scans made to show various corruptions of this image. TOFD 图像可能因不

正确的设置或其他问题（如电气噪声）而引起错误。以下图像全部在同一张板上制作，以显示可能发生的

一些典型问题。首先使用可接受的扫查，然后进行后续不正确设置扫查，以显示各种错误的图像。

(a) Acceptable Scan [Figure N-483(a)]. The gain and gate setting are reasonable, and the electrical noise is

minimal. 可接受扫描[图N-483（a）]，即增益和选通电路设置都是适当的且电噪声最小。

(b) Incorrect Low Gain Setting [Figure N-483(b)]. The lateral wave and some of the diffracted signals are

1

2

3

starting to disappear. At yet lower gain levels, some of the diffracted signals would become undetectable. 低增益设

置不正确[图N-483（b）]。横波和一些衍射讯号开始消失，且在更低的增益水平下，一些衍射讯号将变为

无法显示检测图像的失能讯号。

Figure N-481(g) Schematic of Flaw Location, TOFD Display Showing the Image of the Midwall

Lack of Fusion Flaw, and the A-Scan

以 TOFD 图像展示中间层溶合不良缺陷之图像显示位置以及 A-扫描图像的示意图

Figure N-481(h) Schematic of Flaw Location and TOFD Display Showing the Image of the

Porosity 以 TOFD 图像展示气孔缺陷在图像中的位置

(c ) Incorrect High Gain Setting [Figure N-483(c)]. The noise level increases to obscure the diffracted sig-nals; this can lead to reduced probability of detection, and poor sizing. High noise levels can also arise from large

grains. In this case, the solution is to reduce the ultrasonic frequency. 不正确的高增益设置[图N-483（c）]。噪声

电平增加而掩盖了衍射讯号，这可能导致可检测性的降低，而且不容易定尺寸，另，大晶粒也可能产生高

噪声；在此情况下，解决方案就是降低超声频率。

1

2

3

Figure N-481(i) Schematic of Flaw Location and TOFD Display Showing the Image of

the Transverse Crack 以 TOFD 图像展示横向裂纹图像中之缺陷位置的示意图

(d) Correct gate settings are critical, because TOFD A-scans are not that easy to interpret since there are multiple visible signals. As a minimum, the gates should encompass the lateral wave and longitudinal wave back-wall signal; the gate can extend to the shear wave backwall, if required. Typically, the best signal to use as a guide is the first (longitudinal wave) backwall, since it is strong and always present (assuming the transducer separation is reasonably correct). The following figures show examples of incorrect gate positioning, which will inherently lead

to poor flaw detection. 正确的选通电路设置是至关重要的，因为TOFD A 扫查对多种可见信号不易做出解

释，但至少应该包括横波和纵波背反射讯号；在应用上若有需要时，可将选通电路延伸到切变波背反射。

通常，用作最佳讯号导波的是第一（纵向波）背反射波，因它是强而有效的讯号且一定会在屏幕上显示

（假设换能器分离是合理正确的）。以下图示出了几个不正确选通电路配置的示例，这将实质地导致较差

的探伤能力。正确的选通电路设置是至关重要的，因为TOFD A 扫查对多种可见信号不易做出解释，但至

少应该包括横波和纵波背反射讯号；在应用上若有需要时，可将选通电路延伸到切变波背反射。通常，用

作最佳讯号导波的是第一（纵向波）背反射波，因它是强而有效的讯号且一定会在屏幕上显示（假设换能

器分离是合理正确的）。以下图示出了几个不正确选通电路配置的示例，这将实质地导致较差的探伤能

力。

The first example, Figure N-483(d)(1), shows the gate set too early, the lateral wave is visible, and the

backwall is not. Any inside (ID) near-backwall flaws will be missed. 第一次例子[如图 N-483（d）（1）] 显示了

选通电路设置太早，横波虽然是可见的，但背反射波却无法得见，因此任何近底部处之内部（ID）缺陷都

将无法在图像上被显示出来。

The second example, Figure N-483(d)(2), shows the gate set too late. The lateral wave is not visible. The first signal is the backwall, and the second signal is the shear wave backwall. With this setup, all the outside

(OD) nearsurface flaws will be missed. 第二个例子[如图 N-483（d）（2）]所示，选通电路设置太晚了，致使

横波不可见。第一次信号是背反射波，第二个信号是切变背反射波。若按此种方式设置，所有的延伸至外

表面（OD）之次表面缺陷都将无法在图像上被显示出来。

The third example, Figure N-483(d)(3), is with the gate set too long. Though this is not technically in-correct, the image will show the diffracted backwall shear-shear wave signal. These S-S waves may show additional and confirmatory information. The diffracted shear waves show the porosity more clearly than the diffracted longi-tudinal waves and there is a strong mode-converted signal that occurs just before the shear wave gate, which could cause interpretation problems. Normally, the gate is set fairly short to enclose only the lateral wave and the longitu-

dinal wave backwall to clarify interpretation. 第三个例子 [如图 N-483（d）（3）]所示，选通电路设置的时间

太长。虽然这在技术上并不是一种错误的，但在图像中则会显示出底部 S-波的衍射讯号，而这些 S-S波可

能会显示额外的和确证讯息。衍射切变波说明了它比衍射纵波具有提供更清晰气孔图像的能力，并且只在

切变波选通电路之前出现强模式转换讯号，这可能导致图像会产生解释上的问题。通常，选通电路设置调

得相当短，以使只包络横波和纵波背反射以得到阐明解释。第三个例子 [如图 N-483（d）（3）]所示，选

通电路设置的时间太长。虽然这在技术上并不是一种错误的，但在图像中则会显示出底部双切变波的衍射

讯号，而这些 S-S波可能会显示额外的和确证讯息。衍射切变波说明了它比衍射纵波具有提供更清晰气孔

图像的能力，并且只在切变波选通电路之前出现强模式转换讯号，这可能导致图像会产生解释上的问题。

通常，选通电路设置调得相当短，以使只包络横波和纵波背反射以得到阐明解释。

(e ) Incorrect (too far apart) transducer separation [Figure N-483(e)] results in the backwall signal becom-

ing distorted, the lateral wave becomes weaker, and some of the diffracted signal amplitudes drop. 换能器与受检

物项中心点间的距离不正确（距离太远）[见图N-483（e）] 会导致背反射讯号变形、横波变弱和部分衍射

讯号振幅高度下降。

(f) Incorrect (too close together) transducer separation [Figure N-483(f)] results in the lateral waves be-

coming stronger, and the backwall weaker. Again, the TOFD image of the flaws is poor. 换能器与受检物项中心点

间的距离不正确（太靠近）[图N-483（f）]会导致横波变强、背反射变弱；此外，缺陷的TOFD图像也很

差。换能器与受检物项中心点间的距离不正确（太靠近）[见图N-483（f）]会导致横波变强、背反射变弱；

此外，缺陷的TOFD图像也很差。

(g) If the transducers are not centered on the weld [Figure N-483(g)], the diffracted signal amplitudes will

decline to the point where flaw detection is seriously impaired. 若换能器对没有对称于焊缝轴线放置[见图N-483

（g）]，则衍射讯号振之幅高度将严重地下降到无法履行探伤的程度。

( h) Noise levels [Figure N-483(h)] can seriously impair TOFD interpretation. Noise can come from a num-ber of sources such as electrical, ultrasonic, grains, and coupling. Typically, ultrasonic and grain noise appears uni-versally across the TOFD image. Electrical noise appears as an interference pattern, depending on the noise source. Once the occurrence of the electrical noise increases beyond a certain point, interpretation becomes essentially im-

possible. 噪声水平[图N-483（h）]能严重到对TOFD解读造成影响。噪声可能来自许多来源，如电、超声

波、晶粒和耦合。通常，超声波和晶粒噪声全面地出现在整个TOFD图像。根据噪声源，电噪声以干扰图案

显现。一旦所出现之电噪声增加到超过本底噪声(noise floor)▲，则解释在基本上是不可能的。

▲Telecommunication systems strive to increase the ratio of signal level to noise level in order to ef-

fectively transmit data. In practice, if the transmitted signal falls below the level of the noise (often designated as the noise floor) in the system, data can no longer be decoded at the receiver.

Figure N-481(j) Schematics of Image Generation, Flaw Location, and TOFD Display

Showing the Image of the Interpass Lack of Fusion 示意图，以显示缺陷位置、信号

并以 TOFD 图像表示层间溶合不良之图像

B

Transmitter 发射器 Transmitter 发射器

Lateral横向

Reflected

反射

Back wall底部

Reflection

反射波

Figure N-482(a) Schematic of Flaw Locations and TOFD Image Showing the Lateral Wave,

Backwall, and Three of the Four Flaws 缺陷位置和显示横向波、背反射和四种缺陷中之其中三种的

TOFD 图像示意图


(a) Root crack (right): ~ 1.6 in. (40 mm) to 2.5 in. (64 mm) from one end. 根部裂纹(在右边)：从一端约为1.6 in. (40 mm)处至

2.5 in. (64 mm) 。

(b) Incomplete sidewall fusion (mid-left): ~ 4 in. (100 mm) to 5 in. (125 mm). 近坡面处之溶合不良（在左中央处）：约为4 in.

(100 mm)至5 in. (125 mm)。

(c ) Slag: ~ 6.4 in. (163 mm) to 7.2 in. (183 mm). 夹渣：约为6.4 in. (163 mm)至7.2 in. (183 mm)。

(d) Incomplete fusion at root (left): ~ 9.3 in. (237 mm) to 10.5 in. (267 mm). 根部溶合不良（在左边）：约为9.3 in. (237 mm)至

10.5 in. (267 mm)。

2 – Incomplete sidewall fusion

两个近坡口面的溶合不良 3 – Slag

三个夹渣

4 – Incomplete fusion at root

四个根部溶合不良

Figure N-482(b) Schematic of Flaw Locations and TOFD Display Showing the Lateral Wave,

Backwall, and Four Flaws 缺陷位置和显示横向波、背反射和四种缺陷的 TOFD图像示意图


(a) Incomplete fusion at root (left): ~ 0.6 in. (15 mm) to 1.8 in. (45 mm) from one end. 根部溶合不良（在左边）：从一端约为约

为90.6 in. (15 mm) 处至 1.8 in. (45 mm)。

(b) Toe crack (top left): ~ 3 in. (80 mm) to 4 in. (100 mm). 焊缝趾部裂纹（在顶部之左边）：约为3 in. (80 mm) 至 4 in. (100

mm)

(c ) Porosity: ~ 5.5 in. (140 mm) to 6.25 in. (160 mm). 气孔：约为5.5 in. (140 mm) 至 6.25 in. (160 mm)。

(d) Incomplete sidewall fusion (upper right): ~ 8 in. (200 mm) to 9.25 in. (235 mm). 近坡面处之溶合不良（在右上角）：约为8

in. (200 mm) 至 9.25 in. (235 mm)

1 – Incomplete fusion at root

1 个根部溶合不良

2 – Toe crack

2 个焊缝趾部裂纹

3 – Porosity

3 个气孔气孔 4 – Incomplete sidewall fusion

4 个近坡口面的溶合不良

Figure N-483(a) Acceptable Noise Levels, Flaws, Lateral Wave, and Longitudinal Wave Backwall

可接受的噪声水平、缺陷、横波和纵向背波

Figure N-483(b) TOFD Image with Gain Too Low TOFD 图像之增益太低

OD surface-breaking flaw外表面开口性缺陷

Lateral wave 横波

Buried flaw内埋缺陷

Backwall背反射

Region of porosity – often diffi-

cult to detect 气孔群 - 通常难以

检测到

Near surface flaw

近表面缺陷

Signals becoming invisible

in this area. 讯号在此区

域变得不可见

Figure N-483(c) TOFD Image With Gain Set Too High TOFD 图像之增益设置太高

Figure N-483(d)(1) TOFD Image With the Gate Set Too Early TOFD 图像之选通电路设置太早

Lateral wave 横波

Signals becoming confused

in this area. 讯号在这个

地区变模糊

Figure N-483(d)(2) TOFD Image With the Gate Set Too Late TOFD 图像之选通电路设置太晚

Figure N-483(d)(3) TOFD Image With the Gate Set Too Long TOFD 图像之选通电路设置太长

Lateral wave 横波

L-wave backwall signal

L-波背反射讯号

S-wave backwall signal

S-波背反射讯号

S-wave backwall signal

S-波背反射讯号

L-wave backwall signal

L-波背反射讯号

Figure N-483(e) TOFD Image With Transducers Set Too Far Apart

带换能器的 TOFD图像设置相隔太远

Figure N-483(f) TOFD Image With Transducers Set Too Close Together

带有换能器的 TOFD 图像设置太近

Distorted L-wave backwal

扭曲的 L-背反射波

Strong lateral wave

强横波

Weak L-wave backwall signal

弱 L-背反射波

Figure N-483(g) TOFD Image With Transducers not Centered on the Weld Axis

换能器对不对称焊接轴线放置时之 TOFD图像

Figure N-483(h) TOFD Image Showing Electrical Noise Interference

有电噪声干扰显示之 TOFD 图像

NONMANDATORY APPENDIX O TIME OF FLIGHT

DIFFRACTION (TOFD) TECHNIQUE — GENERAL EXAMI-

NATION CONFIGURATIONS 非强制性附录 O 时差衍射(TOFD)技术通用检测配置

O-410 SCOPE 适用范围

This Appendix describes general weld examination configurations for the Time of Flight Diffraction (TOFD)

technique. 本附录旨在对时差衍射(TOFD)技术的通用焊缝检测配置提供有关介绍。

O-430 EQUIPMENT 设备

O-432 SEARCH UNITS 探头

Tables O-432(a) and O-432(b) provide general search unit parameters for specified thickness ranges in ferritic

welds. For austenitic or other high attenuation materials, see T-451. 表 O-432(a)和 O-432(b)对在铁素体焊缝中所

规定之厚度范围提供了通用探头参数，至于奥氏体或其他高衰减材料，请参见 T-451。

O-470 EXAMINATION 检测

For thicknesses approaching 3 in. (75 mm), the beam divergence from a single search unit is not likely to pro-vide sufficient intensity for good detection over the entire examination volume. Therefore, for thickness 3 in. (75 mm) and greater, the examination volume should be divided into multiple zones. Table O-470 provides general

guidance on the number of zones to ensure suitable volume coverage. 当厚度接近 3 in. (75 mm)时，仅靠单个探

头的波束扩散度是无法在整个检测体积下提供足够强度以获得良好的检测结果。因此，在厚度 ≧ 3 in. (75

mm)时，检测体积应分割为多个区段。表O-470 对有关为确保相当体积覆盖度之相应区段数提供了通用指

南。

Examples of the search unit layout and approximate beam volume coverage are provided in Figure O-470(a)

through Figure O-470(d). 在图 O-470(a)至图 O-470(d)中为探头布置和近似波束体积覆盖度提供了示例。

Table O-432(a) Search Unit Parameters for Single Zone Examinations Up to 3 in. (75 mm) 表 O-432(a) 对厚度 ≦ 3 in. (75 mm)单区段检测下所采用之通用探头参数

Thickness 厚度, t, in. (mm) Nominal Frequency 标称频率, MHz Element Size换能器尺寸, in. (mm) Angle扩展角度, deg

< 0.5 (< 13) 10 to 15 0.125 to 0.25 (3 to 6) 60 to 70

0.5 to < 1.5 (13 to < 38) 5 to 10 0.125 to 0.25 (3 to 6) 50 to 70

1.5 to < 3 (38 to < 75) 2 to 5 0.25 to 0.5 (6 to 13) 45 to 65

Table O-432(b)Search Unit Parameters for Multiple Zone Examinations Up to 12 in. (300 mm)

Thick

表 O-432(a)厚度 ≦ 12 in. (300 mm)多区段检测下所采用之通用探头参数

Nominal Wall标称厚度, in. (mm) Nominal Frequency 标称频率, MHz Element Size换能器尺寸, in. (mm) Angle扩展角度, deg

< 1.5 (< 38) 5 to 15 0.125 to 0.25 (3 to 6) 50 to 70

1.5 to 12 (38 to 300) 1 to 5 0.25 to 0.5 (6 to 12.5) 45 to 65

Table O-470 Recommended TOFD Zones for Butt Welds Up to 12 in. (300 mm) Thick

表 O-470 在接焊缝厚度 ≦ 12 in. (300 mm)下所推荐 TOFD 区段数

Thickness 厚度, t, in. (mm) Number of Zones [Note (1)]

区段数[见注(1)] Depth Range深度范围

Beam Intersection (approx.) 波束交点(近似值)

< 2 (< 50) 1 0 to t 2/3 t

2 to < 4 (50 to < 100) 2 0 to t /2 2/3 t

t /2 to t 5/6 t

4 to < 8 (100 to < 200) 3 0 to t /3 2t /9

t /3 to 2t /3 5t /9

2t /3 to t 8t /9

8 to 12(200 to 300) 4 0 to t /4 t /12

t /4 to t /2 5t /12

t /2 to 3t /4 8t /12

3t /24 to t 11t /12

NOTE: 注：

(1) Multiple zones do not have to be of equal height. 在多区段中之各区段间之高度不必等高。

Figure O-470(a) Example of a Single Zone TOFD Setup单区段 TOFD 设置示例

Figure O-470(b) Example of a Two Zone TOFD Setup (Equal Zone Heights)

双区段 TOFD设置示例（等于区段高度）

Zone 1

Zone 1

Zone 2

Probe 2 Probe 1 Probe 1 Probe 2

Figure O-470(c) Example of a Three Zone TOFD Setup (Unequal Zone Heights With Zone 3 Ad-

dressed by Two Offset Scans) 三区段 TOFD设置示例（其中具有区段 3由两个偏移扫查处理的不等区

段高度）

Figure O-470(d) Example of a Four Zone TOFD Setup (Equal Zone Heights) 四区段 TOFD设置示

例（等于区段高度）

Probe 4 Probe 3 Probe 2 Probe 1 Probe 1 Probe 2 Probe 4 Probe 3

Zone 1

Zone 2

Zone 3

(2 offset scans)

Probe 4 Probe 3 Probe 2 Probe 1 Probe 1 Probe 2 Probe 3 Probe 4

Zone 1

Zone 2

Zone 3

Zone 4

NONMANDATORY APPENDIX P PHASED ARRAY

(PAUT) INTERPRETATION

非限制性附录 P 相阵控（PAUT）解释

P-410 SCOPE 适用范围

This Nonmandatory Appendix is to be used as an aid for the interpretation of Phased Array Ultrasonic Testing (PAUT) images.28 The flaw signal interpretation methodology using PAUT is very similar to that of conventional ultrasonics; however, PAUT has improved imaging capabilities that aid in flaw signal interpretation. This interpre-

tation guide is primarily aimed at using shear wave angle beams on butt welds. Other possibilities include 此非限制

性附录将用做相阵控超声波测试（PAUT）图像解释之辅助。采用 PAUT 之缺陷讯号解释法非常类似于惯

用超声学；然而，PAUT 具有改善的成像能力，有助于缺陷讯号之解释。此指南主要是针对对接焊缝采用

切变斜束波。其他可能性包括有：

(a) longitudinal waves 纵波

(b) zero degree scanning零度扫描

(c ) complex inspections, e.g., nozzles, fillet welds 复杂的检查，例如接管和角焊缝

P-420 GENERAL 通則

P-421 PAUT IMAGES — DATA VISUALIZATION PAUT 圖像 - 數據可視化

PAUT data is routinely displayed using a rainbow color palette, with the range of colors representing a range of signal amplitude. Generally, “white” represents 0% signal amplitude, “blue” (or lighter colors) represents low

amplitudes, and “red” (or darker colors) represents above reject signal amplitude (see Figure P-421-1). 使用具有以

顏色範圍代表訊號振幅範圍之彩虹調色板來顯示 PAUT慣用數據。通常，“白色”表示 0％的訊號振幅，

“藍色”（或較淺的顏色）表示低振幅，“紅色”（或較暗的顏色）表示上述可拒收之訊號振幅（見圖 P-

421-1）。

(a) PAUT has the ability to image the data in the same format as conventional ultrasonics – A-scans,

and time or distance encoded B-scan, D-scan, and C-scans. (See Figure P-421-2.) PAUT能夠以與惯用超聲波 A-

掃查相同的格式，以及編碼過的B-掃查、D掃查和C掃查的時間或距離進行圖像成像（見圖 P-421-2）。

NOTE: The examples shown here are not necessarily typical of all defects due to differences in

shape, size, defect orientation, roughness, etc. 注意：由於形狀、尺寸、缺陷取向和粗糙度等因素存在著各自的

差異性，因此此處所顯示之示例不一定是所有缺陷的典型代表。

(b) The PAUT primary image displays are an E-scan or S-scan, exclusive to the PAUT technique. Both the E-scan and S-scan display the data in a 2D view, with distance from the front of the wedge on the X-axis, and depth on the Y-axis. This view is also considered an “end view.” E-scans and S-scans are composed of all of the A-scans (or focal laws) in a particular setup. The A-scan for each beam (or focal law) is available for use in flaw sig-

nal interpretation. PAUT主圖像顯示是 PAUT技術專用的 E-掃查或 S-掃查。 E-掃查和 S-掃查均以 2D視圖顯

示數據，其中來至楔塊前端的距離顯示在 X軸上而深度則顯示在Y軸上。此視圖也被視為是一種“端視

圖”。E-掃查和 S-掃查由特定設置中之所有 A-掃描（或焦點定律）所組成。每一波束的A-掃描( 或焦點定

律）可用於缺陷訊號的解釋。

(c ) An E-scan (also termed an electronic raster scan) is a single focal law multiplexed, across a group of active elements, for a constant angle beam stepped along the phased array probe length in defined increments.

Figure P-421-3 shows an example of an E-scan. E-掃查（也稱為電子光柵掃查）是經過一組多路復用有源元件

的單一焦點定律，以用於沿著相控陣探頭長度方向以限定增量步進的一種恆定角度波束。圖 P-421-3顯示

了 E-掃查的示例。

(d) An S-scan (also termed a Sector, Sectorial, Swept Angle, or Azimuthal scan) may refer to either the

beam movement or the data display (see Figure P-421-4). S-掃查（也稱為扇形面、扇形、掃查角或方位角掃

查）指的是波束移動或數據顯示（參見圖 P-421-4）。

P-450 PROCEDURE 規程

P-451 MEASUREMENT TOOLS 測量工具

PAUT instruments typically have flaw sizing aids contained within the software. These sizing aids are based on using multiple sets of horizontal and vertical cursors overlaid on the various image displays. PAUT instruments rely on the accuracy of the user input information (such as component thickness) and calibration to accurately dis-

play flaw measurements and locations. PAUT儀器通常在軟件中包含有缺陷定尺寸輔助設備。這些定尺寸輔助

設備是以在顯示器上能覆蓋各種不同圖像之多組水平和垂直光標的採用為基礎。 PAUT儀器有賴於用戶在

輸入信息（例如部件厚度）時和校準上的準確性，以準確地顯示缺陷的測量結果和位置。

P-452 FLAW SIZING TECHNIQUES 缺陷尺寸測定技術

Flaw sizing can be performed using a variety of industry accepted techniques, such as amplitude drop (e.g., -6 dB Drop) techniques and/or tip diffraction techniques. Different flaw types may require different sizing techniques.

缺陷尺寸可彩用各種工業上可接受之技術進行，例如降低振幅強度（例如，降低 6dB）技術和/或尖端部衍

射技術。不同的缺陷類型可能需要不同的尺寸測定技術。

P-452.1 Flaw Length. Flaw lengths parallel to the surface can be measured from the distance encoded D or C-scan images using amplitude drop techniques by placing the vertical cursors on the extents of the flaw dis-

played on the D or C-scan display. Figure P-452.1 shows an example of cursors used for length sizing. 瑕疵長度。

時，可從編碼過之 D-或 C-掃查圖像透過降低振幅強度技術的採用將垂直光標放置在 D-或 C-掃查顯示屏上所

顯示的缺陷距離範圍內來測定平行於表面的裂紋長度。圖 P-452.1 顯示了將光標用於長度測定的示例。

P-452.2 Flaw Height. Flaw height normal to the surface can be measured from the B-, E-, or S-scan im-

ages using amplitude drop or tip diffraction techniques. 缺陷高度。可採用降低振幅強度或尖端部衍射技術從

B-，E-或-S掃描圖像對與表面垂直的缺陷進行高度測定。

(a) Using amplitude drop techniques, the horizontal cursors are placed on the displayed flaws upper and lower extents. Figure P-452.2-1 shows an example of cursors used for height sizing with the amplitude

drop technique. 採用降低振幅強度技術，將水平光標放置在所顯示之缺陷上下範圍上。圖 P-452.2-1顯示了

將光標應用在以降低振幅強度技術測定高度尺寸的示例。

(b) Using tip diffraction techniques the horizontal cursors are placed on the upper and lower tip signals of the displayed flaw. Figure P-452.2-2 shows an example of cursors used for height sizing with the tip dif-

fraction technique. 使用尖端部衍射技術，將水平光標放置在所顯示缺陷的上下尖端訊號上。圖 P-452.2-2顯

示了將光標應用在以尖端部衍射技術測定高度尺寸的示例。

P-480 EVALUATION 評估

This section shows a variety of PAUT images and the interpretation/explanation. There are significant varia-tions amongst flaws and PAUT setups and displays, so the following images should be used as a guide only. Evalu-

ator experience and analysis skills are very important as well.本節展示了各種 PAUT圖像和其解釋/註釋。缺陷

隨著 PAUT設置而在其所顯示之結果間有著顯著差異，因此以下圖像僅作為參考。此外，判定員的經驗和

分析技巧也是很重要的。

Figure P-421-1 Black and White (B&W) Version of Color Palette

調色板的黑白（B＆W）版號

Blue (light) 藍(亮) Red (dark) 紅（暗）

P-481 I.D. (INSIDE DIAMETER) CONNECTED CRACK

I.D.（內徑）表面上之連接裂紋

These typically show multiple facets and edges visible in the A-scan and S-scan. There is a distinct start and stop on the A-scan, and a significant echodynamic travel to the signal as the probe is moved in and out from the weld (if the crack has significant vertical extent). The reflector is usually detectable and can be plotted from both sides of the weld. The reflector should plot to the correct I.D. depth reference or depth reading, as shown in Figure

P-481. 這些多個可見的面和邊緣通常顯示在A-掃查和 S-掃查中，其中 A掃查有明顯的啟動和停止，並且

當探頭移入和退出焊縫，若裂紋具有顯著的垂直範圍，則會有一個明顯的回波動態光標移動到訊號處。反

射體通常是可檢測的，並分別可從焊縫的兩側將該反射體區分出來。反射體宜如圖 P-481繪至正確的 I.D.

深度基準或深度讀數。

Figure P-421-2 Scan Pattern Format 掃查圖案格式

P-481.1 Lack of Sidewall Fusion. LOF (Lack of Fusion) plots correctly on the weld fusion line, either through geometrical plotting or via weld overlays. There may be a significantly different response from each side of

0% 100% Signal Amplitude Response訊號振幅靈敏度

Top (C) view 上视图（C）

Index axis 定位轴

D-scan (side view 侧视图)

B-scan (end view 端视图)

Ult

raso

un

d

Depth

深度

Ult

raso

und

超声

波

the weld. LOF is usually detected by several of the angles in an S-scan from the same position. The A-scan shows a

fast rise and fall time with short pulse duration indicative of a planar flaw. There are no multiple facets or tips. 坡口

溶合不良。可以通過幾何形狀之劃分或憑藉焊縫覆蓋度以將 LOF（溶合不良）正確地分配在焊縫溶合線

上。從焊縫每側所得的相應響應度可能有著顯著不同的。 LOF通常由相同位置的 S-掃查中以幾個不同角度

的掃查下所檢測出來。 A-掃查以具有短脈衝持續時間的快速上升和下降時間之技術來顯示平面缺陷。此類

缺陷在掃查過程中不會產生多個面或尖端部的響應訊號。

Skewing the probe slightly does not produce multiple peaks or jagged facets as in a crack. There may be mode-converted multiple signals that rise and fall together and maintain equal separation. Figure P-481.1 shows

an example. 將探頭稍微时滞，也不會像裂紋那樣產生多個峰值或鋸齒狀的小平面，但可能因模式轉換而存

在著一起上升和下降並保持相等間隔的多個訊號。圖 P-481.1顯示了一個例子。

Figure P-421-3 Example of an E-Scan Image Display E-掃描圖像顯示示例

P-481.2 Porosity. Porosity shows multiple signal responses, varying in amplitude and position. The sig-nals plot correctly to the weld volume. The signals’ start and stop positions blend with the background at low ampli-tude. The A-scan slow rise and fall time with long pulse duration is indicative of a non-planar flaw. Porosity may or may not be detected from both sides of the weld, but should be similar from both sides. Figure P-481.2 shows an

example of porosity. 氣孔。氣孔顯示多個訊號響應、振幅和位置不同。這些訊號正確地分配至各自相應的焊

縫體積中。這些訊號的起始和停止位置與低振幅干擾噪聲交融在一起。A-掃查以具有長脈衝持續時間的緩

慢上升和下降時間技術來顯示非平面缺陷。從焊縫的兩側可能檢測到也可能不會檢測到氣孔，但兩側應該

類似。圖 P-481.2 顯示了氣孔的一個例子。

P-481.3 O.D. (Outside Diameter) Toe Crack. Toe cracks typically show multiple facets and edges visi-ble in the A-scan and S-scan. There is significant echodynamic travel to the signal as the probe is moved in and out from the weld. The reflector is usually detectable and can be plotted from at the correct O.D. depth reference line or depth reading. Normally, toe cracks are best characterized on S-scans and lower angle E-scan channels. Figure P-

481.3 shows an example. O.D. （外徑）表面上之焊趾裂紋。此類焊趾裂紋通常以多個可見的面和邊緣顯示

在 A-掃察和 S-掃查中。當探頭移入和退出焊縫時，則會有一個明顯的回波動態光標移動到訊號處。反射體

通常是可檢測的，並可從正確的O.D. 深度基準線或深度讀數探查出此反射體。通常，焊趾裂紋的最佳特徵

出現在 S-掃查和較小角度的 E-掃查通道上。圖 P-481.3顯示了一個例子。

P-481.4 (Incomplete Penetration). Incomplete Penetration (IP) typically shows high amplitude signals

Time or distance (surface path)

时间或距离（表面声程）

Depth

深度

with significant echodynamic travel or travel over the I.D. skip line. IP will typically respond and plot from both sides of the weld in common weld geometries near centerline reference indicators. Generally, IP is detected on all channels, with highest amplitude on a high angle E-scan. The A-scan shows a fast rise and fall time with short pulse

duration indicative of a planar flaw. Figure P-481.4 shows an IP signal. （不完全熔透）。不完全熔透（IP）通

常以具有顯著回波動態光標游動或在內徑转移線兩側快速交替傳輸之高振幅訊號方式來顯示。 IP通常將在

中心參考指示器附近的常見焊縫幾何中對焊縫的兩側進行響應和劃分。通常，在所有通道上所檢測到之

IP，在一高角度 E-掃描中具有最高的振幅。 A-掃查以具有短脈衝持續時間的快速上升和下降時間之技術來

顯示平面缺陷。圖 P-481.4顯示了 IP訊號。

Note that IP must be addressed relative to the weld bevel. For example, a double V weld will have IP in the midwall, whereas a single V bevel will be surface-breaking. However, the rise-fall time of the signal is simi-lar to that for toe cracks and other root defects. This requires extra care on the part of the operator. Note that incom-

plete penetration can look similar to surface lack of sidewall fusion. 請注意，IP必須相對於焊縫坡口面進行尋

址。例如，雙 V-焊縫的 IP將位於中間段，而單 V坡口則即為外表面。然而，IP訊號的上升-下降時間是與

焊趾裂紋和其他根部缺陷相類似的。這需要操作員予以小心地觀察與判定。注意，不完全熔透看起來可能

會類似於表面坡口面處的溶合不良。

P-481.5 Slag. Slag typically shows multiple facets and edges visible in the A-scan and S-scan. The A-scan shows a slow rise and fall time with long pulse duration, indicative of a non-planar flaw. Typically slag shows lower amplitude than planar flaws, and may be difficult to distinguish from porosity, or from some smaller planar defects. Slag is typically detectable from both sides, can be plotted from both sides of the weld and is often best characterized using an S-scan. A slag reflector will typically plot to the correct depth area and reference lines that

coincide to the weld volume. Figure P-481.5 shows an example. 夾渣。夾渣通常以多個可見的面和邊緣顯示在

A-掃查和 S-掃查中。 A-掃查以具有長脈衝持續時間之上升和下降時間來顯示非平面缺陷。典型夾渣所顯示

的振幅低於平面缺陷，並且可能難以與氣孔區分開，或者與某些較小的平面缺陷區分開。夾渣通常由兩側

都是可检测的，並可從焊縫的兩側區分出來，並且通常透過 S-掃查的採用來獲得最好的鑑別率。通常將夾

渣反射體繪至與焊接體積重合的正確深度範圍和各參考線中。圖 P-481.5顯示了一個例子。

Figure P-421-4 Example of an S-Scan Image Display

S-掃描圖像顯示示例

Depth

深度

Time or distance (surface path)

时间或距离（表面声程）

Figure P-452.1 Flaw Length Sizing Using Amplitude Drop Technique and the Vertical Cursors

on the C-Scan Display 採用震幅降低技術和 C-掃查顯示屏上的垂直光標進行缺陷長度尺寸測定

Figure P-452.2-1 Scan Showing Flaw Height Sizing Using Amplitude Drop Technique and the

Horizontal Cursors on the B-Scan Display 採用震幅降低技術和 B-掃查顯示屏上的水平光標以顯示缺

陷高度尺寸的測定掃查圖像

Figure P-452.2-2 Flaw Height Sizing Using Top Diffraction Technique and the Horizontal Cur-

sors on the S-Scan Display 採用頂端部衍射技術和 S-掃查顯示屏上的水平光標以顯示缺陷高度尺寸的

測定掃查圖像

GENERAL NOTE: The two arrows in the A-scan at left show the relevant signals for measurement. 總注：在左側 A-掃查

中的兩個箭頭指出用於測量的相關訊號。

Figure P-481 S-Scan of I.D. Connected Crack I.D.連接裂紋之D-掃查

Half Vee path showing

l.D. surface connected crack显示 l.D.表面连接裂纹之半 V-声程

Figure P-481.1 E-Scan of LOF in Midwall 在中間段鄰近坡口面周圍之不全熔透的 E-掃查圖像

Figure P-481.2 S-Scan of Porosity, Showing Multiple Reflectors

氣孔以多個反射體顯示之 S-掃查圖像

Half Vee path or l.D.

半 V-声程或内径

Full Vee path or O.D. 全 V-声程或外径

One-and-a-half Vee

paths or l.D. 1.5 个 V-声程或内径

Full Vee path or O.D.

全 V-声程或外径

Half Vee path or l.D. 半 V-声程或内径

Figure P-481.3 O.D. Toe Crack Detected Using S-Scan 採用 S-掃查所檢測到之外徑焊趾裂紋圖像

Figure P-481.4 IP Signal on S-Scan, Positioned on Root 在 S-掃查上所顯示的根部夾渣訊號圖示

Full Vee path or O.D. 全 V-声程或外径

Half Vee path or l.D. 半 V-声程或内径

Figure P-481.5 Slag Displayed as a Midwall Defect on S-Scan 在 S掃描中以中間段缺陷顯示之夾渣

NONMANDATORY APPENDIX Q EXAMPLE OF

A SPLIT DAC CURVE 非限制性附錄 Q 分離式 DAC 曲線的示例

Q-410 SCOPE 適用範圍

This Appendix provides an example of a split DAC curve when a single DAC curve, for the required distance

range, would have a portion of the DAC fall below 20% of full screen height (FSH). See Figure Q-410. 當在所需距

離範圍內，將單一DAC曲線的一部分分离以降至滿屏高度（FSH）的 20％以下時本附錄提供了分離式

DAC曲線的示例。參見圖 Q-410。

Q-420 GENERAL 總則

Q-421 FIRST DAC 第一條 DAC

Create a DAC curve as normal until a side-drilled hole (SDH) indication peak signal falls below 20% of FSH.

See Figure Q-421. 在正常情況下創建DAC曲線，直到側橫（SDH）指示峰值訊號低於 FSH的 20％。見圖

Q-421。

Q-422 SECOND DAC 第二條 DAC

Starting with a SDH position prior to the reflector response that falls below 20% of FSH, set the gain so that this response is 80% ± 5% of FSH. Record the reference level gain setting for this second portion of the DAC curve. Mark the peaks of the remaining SDH indications on the screen and connect the points to form the second DAC

curve. See Figure Q-422. 從反射體響應降至 20％滿屏高度之前的側橫孔位置開始，調整增益設置直到該訊號

響應為 FSH的 80％±5％，並將該增益設置記錄下來以作為第二條DAC曲線之參照電平增益設置。在屏幕

上標記出所剩的其他 SDH 指示峰值，並連接這些點以形成第二條DAC曲線。參見圖 Q-422。

Half Vee path or l.D.

半 V-声程或内径

Q-423 NOTCH REFLECTORS 槽口狀反射體

This technique can also be used for notch reflectors. 本技術也可用於槽口狀反射體。

Figure Q-410 Distance–Amplitude Correction 距離-幅度校正

Figure Q-421 First DAC Curve 第一條 DAC曲線

Falls below 20% FSH降至 20％满屏高度以下降至 20％满屏高度以下

Reflectors moved into

beam 已移动到反射体中之波束

Reflectors moved into

beam已移动到反射体中之波束

80%

10

5

10

42 dB 80%

20%

10 5

5 10

Figure Q-422 Second DAC Curve 第二條 DAC曲線

NONMANDATORY APPENDIX R STRAIGHT

BEAM CALIBRATION BLOCKS FOR RESTRICTED ACCESS

WELD EXAMINATIONS 非強制性附錄 R 在禁止進入區域內進行焊

縫檢測所需之直束波較準試塊

R-410 SCOPE 適用範圍

This Appendix is to be used as an aid for the fabrication of calibration blocks used for straight beam examina-tions of welds that cannot be fully examined from two directions using the angle beam technique (e.g., corner and

tee joints) per T-472.2. 當按 T-472.2採用斜束波技術（例如偶角和 T-接頭）從兩個方向無法完成焊縫檢測，

而需採用直束波檢測法時，本附錄提供了製作校準試塊上所需之相關輔助性訊息。

R-420 GENERAL 總則

When using standard angle beam calibration blocks for the straight beam calibration of restricted access weld examinations (Figure T-434.2.1), these blocks typically do not provide an adequate distance range that encompasses the volume to be examined. When this occurs a second calibration block shall be fabricated from thicker material, with the same sized reference reflectors per T-434.2.1, spaced over the distance range that ensures examination vol-

ume coverage. 當使用標準斜束波校準試塊作為進行禁止進入區域內之直束波焊縫檢測的校準（圖 T-

434.2.1）時，這些試塊通常無法提供包含所要檢測體積的足夠距離範圍；當發生此情況時，第二個校準試

塊應由較厚的材料所製成，但其中參考反射體須按 T-434.2.1之規定，使參考反射體在整個距離範圍內具有

相同的尺寸與間隔，以確保檢測體積的有效距離。

R-430 EQUIPMENT 設備

Reflectors moved into beam已移动到反射

体中之波束

42 dB 52 dB

R-434 CALIBRATI ON BLOCKS 校準試塊

(a) Corner Weld Example. Figure R-434-1 is an example of the calibration block configuration for a

straight beam examination of a corner weld. 偶角焊縫示示例。圖 R-434-1是用於偶角焊縫束波檢測所需校準

試塊構造的一種示例。

(b) Tee Weld Example. Figure R-434-2 is an example of the calibration block configuration for a straight

beam examination of a tee weld. T-型焊縫示例。圖 R-434-2是用於 T-形焊縫直束波檢測所需校準試塊構造的

一種示例。T-型焊縫示例。圖 R-434-2是用於 T-形焊縫直束波檢測所需校準試塊構造的一種示例。

Figure R-434-1 Corner Weld Example 偶角焊縫示例

GENERAL NOTES: 通住：

(a) The top illustration shows the weld details for the determination of the volume of interest (VI). The

calibration block does not require a weld unless required by the referencing Code Section or T-451. 上圖例顯

示了用於被檢測體積（VI）測定的焊縫細節。除非引用規範章節或 T-451有要求時，否則校準試塊不

需要有焊縫。

(b) Block details and tolerances are the same as that required for standard calibration blocks per T-434.2.

試塊細節和公差是與在 T-434.2中的標準校準試塊具有相同要求。

ST beam exam surface ST梁检测面

Distance range距离范围 , DR

Volume of interest 受检测之体积, VI

Three (3) side-drilled holes, SDHs, spaced over the range of the volume of interest, VI. 在整个被检测范围内(VI)以等间隔分开的三（3）个侧横孔(SDHs)。

SDHs Ø based on weld thicknes, t.

基于焊缝厚度(t)之测横孔直径

Figure R-434-2 Tee Weld Example T-型焊縫示例

GENERAL NOTES: 通住：通住：

(a) The top illustration shows the weld details for the determination of the volume of interest (VI). The cali-

bration block does not require a weld unless required by the referencing Code Section or T-451. 上圖例顯示了用於

被檢測體積（VI）測定的焊縫細節。除非引用規範章節或 T-451有要求時，否則校準試塊不需要有焊縫。

(b) Block details and tolerances are the same as that required for standard calibration blocks per T-434.2. 試塊

細節和公差是與在 T-434.2中的標準校準試塊具有相同要求。

ARTICLE 5 ULTRASONIC EXAMINATION METHODS

FOR MATERIALS

第五章用於材料之超聲檢測法

T-510 SCOPE 適用範圍

This Article provides or references requirements, which are to be used in selecting and developing ultrasonic examination procedures for parts, components, materials, and all thickness determinations. When SA, SB, and SE documents are referenced, they are located in Article 23 The referencing Code Section shall be consulted for spe-

cific requirements for the following: 本章提供或論及了用於各種物項和所有厚度測定之超聲檢測選用和編制

ST beam exam surface ST梁检测面

Distance range距离范围 , DR

Volume of interest 受检测之体积, VI

Three (3) side-drilled holes, SDHs, spaced over the range of the volume of interest, VI. 在整个被检测范围内(VI)以等间隔分开的三（3）个侧横孔(SDHs)。

SDHs Ø based on weld thicknes, t. 基于焊缝厚度(t)之测横孔直径

規程上的各項要求。當 SA，SB和 SE等技術規格說明文件被引用時，它們列在第 23章中。有關以下具體

要求，請參考引用規範章節：本章提供或論及了用於各種物項和所有厚度測定之超聲檢測選用和編制規程

上的各項要求。當 SA，SB和 SE等技術規格說明文件被引用時，它們列在第 23章中。有關以下具體要

求，請查阅相應引用規範章節

(a) personnel qualification/certification requirements; 人員資格/認證要求；

(b) procedure requirements/demonstration, qualification, acceptance; 規程各項要求/演示，規程起用

資格，規程的可接受性；

(c) examination system characteristics; 檢測系統特性；

(d) retention and control of calibration blocks; 校準試塊之保存和管控；

(e) extent of examination and/or volume to be scanned; 所要掃查之檢測範圍和/或體積；

(f) acceptance standards; 允收準則；

(g) retention of records, and記錄保存，以及

(h) report requirements. Definitions of terms used in this Article are contained in Article 1, Mandatory

Appendix I, I-121.2, UT — Ultrasonics. 報告各項要求。本章所用術語之定義載於第 1章，強制性附錄 I，I-

121.2，UT - 超聲波。

T-520 GENERAL 總則

T-521 BASIC REQUIREMENTS 基本要求

The requirements of this article shall be used together with Article 1, General Requirements. 本章之規定應與

第一章通用要求一起併用。

T-522 WRITTEN PROCEDURE REQUIREMENTS 書面規程要求

T-522.1 Requirements. Ultrasonic examination shall be performed in accordance with a written procedure, which shall, as a minimum, contain the requirements listed in Table T-522. The written procedure shall establish a

single value, or range of values, for each requirement. 要求。超聲檢測應按照書面規程進行，其中至少應包含

表 T-522中所列出的要求。書面規程應為每項要求分別建立單一值或各項值的範圍。

T-522.2 Procedure Qualification. When procedure qualification is specified by the referencing Code Sec-tion, a change of a requirement in Table T-522 identified as an essential variable from the specified value, or range of values, shall require requalification of the written procedure. A change of a requirement identified as a nonessen-tial variable from the specified value, or range of values, does not require requalification of the written procedure. All changes of essential or nonessential variables from the value, or range of values, specified by the written proce-

dure shall require revision of, or an addendum to, the written procedure. 規程啟用資格。當相關引用規範章節做

出規程鑑定之要求時，在表 T-522中指定為重要變數之要求，若其中之具體值或值的範圍產生變更時，則

應重新鑑定書面規程。被視為是非重要變數的具體值或值的範圍在產生變更時，書面規程是不需要重新鑑

定的。由書面規程所規定的值或值的範圍，不管是重要或非重要變量的所有變更，都應要求書面規程進版

或補遺。

T-530 EQUIPMENT 設備

T-531 INSTRUMENT 儀器

A pulse-echo type of ultrasonic instrument shall be used. The instrument shall be capable of operation at fre-quencies over the range of at least 1 to 5 MHz, and shall be equipped with a stepped gain control in units of 2.0 dB

or less. If the instrument has a damping control, it may be used if it does not reduce the sensitivity of the examina-tion. The reject control shall be in the “off” position for all examinations unless it can be demonstrated that it does

not affect the linearity of the examination. 應採用脈衝回波型超聲波儀器。該儀器應能在至少 1至 5 MHz範圍

內的頻率下工作，並應配備有 2.0 dB或更小單位的步進式增益控制旋鈕。若儀器具有阻尼控制功能時，在

儀器不會降低檢測靈敏度之先決條件下即可應用。就所有檢測來說，带阻滤波控制器應處於"關閉"位置，

除非可資證明其不會對檢測線性造成影響。

T-532 SEARCH UNITS 掃查裝置

The nominal frequency shall be from 1 MHz to 5 MHz unless variables such as production material grain struc-ture require the use of other frequencies to assure adequate penetration or better resolution. Search units with con-

toured contact wedges may be used to aid ultrasonic coupling. 標稱頻率應為 1 MHz至 5 MHz，除非諸如產品材

料晶粒結構之變數需要採用到其他頻率以確保足夠的穿透率或更好的分辨率。掃查裝置可採用具有輪廓相

配之接觸楔塊以有效提升超聲波耦合率。

T-533 COUPLANT 耦合劑

T-533.1 General. The couplant, including additives, shall not be detrimental to the material being examined.

通則。耦合劑 (包括其中之任何添加劑) 應不會對被檢測材料造成不利影響。

T-533.2 Control of Contaminants. 污染物之管控

(a) Couplants used on nickel base alloys shall not contain more than 250 ppm of sulfur. 用於鎳基合

金之偶合劑，其硫含量不應超過 250ppm。

(b) Couplants used on austenitic stainless steel or titanium shall not contain more than 250 ppm of

halides (chlorides plus fluorides). 用於奧氏體不銹鋼或鈦的偶合劑，其滷化物含量（氯化物和氟化物）不應

超過 250ppm。

T-534 CALIBRATION BLOCK REQUIREMENTS

The material from which the block is fabricated shall be of the same product form, material specification or equivalent P-Number grouping, and heat treatment as the material being examined. For the purposes of this para-graph, P-Nos. 1, 3, 4, 5A through 5C, and 15A through 15F materials are considered equivalent. The finish on the scanning surface of the block shall be representative of the scanning surface finish on the material to be examined. 製造試塊之材料應與待檢測材料具有相同的產品形式、材料規格或等效 P-No.分組和熱處理。本節之目的是

將 P-No.1、3、4、5A至 5C、15A 至 15F等材料視為是等效的材料。在試塊掃表面上之光潔度應能代表受

檢測材料掃查面上的光潔度。

T-534.1 Tubular Product Calibration Blocks. 管狀產品之校準試塊

(a) The calibration reflectors shall be longitudinal (axial) notches and shall have a length not to exceed 1 in. (25 mm), a width not to exceed 1/16 in. (1.5 mm), and depth not to exceed 0.004 in. (0.10 mm) or 5% of the

nominal wall thickness, whichever is larger. 校準反射體應為縱向（軸向）槽口，且應具有不超過 1 in. (25 mm)

的長度，不超過 1/16 in. (1.5 mm)之寬度，和不超過 0.004 in. (0.10 mm)或 5％標稱壁厚（以較大者為準）之

深度。

(b) The calibration block shall be long enough to simulate the handling of the product being examined

through the examination equipment. 校準試塊應具有足夠的長度，以模擬待檢測產品通過檢測設備時所進行

的裝卸/運輸處理過程。

T-534.2 Casting Calibration Blocks. Calibration blocks shall be the same thickness ±25% as the casting to

be examined. 鑄件之校準試塊。校準試塊之厚度應與被檢測鑄件具有相同厚度的±25％內。

T-534.3 Bolting Material Calibration Blocks and Examination Techniques.29 Calibration blocks in ac-

cordance with Figure T-534.3 shall be used for straight beam examination. 螺栓材料校準試塊和檢測技術。符

合圖 T-534.3之校準試塊應用於直束波檢測。

Table T-522 Variables of an Ultrasonic Examination Procedure

表 T-522 超聲波檢查規程之各項變數

Requirement 要求項目 Essential Vari-

able重要變數

Nonessential Varia-

ble非重要變數

Material types and configurations to be examined, including thickness dimensions and product

form (castings, forgings, plate, etc.) 所要檢測之材料類型和幾何形狀，其中包括了厚度尺寸

和產品形式（鑄件、鍛件、板材等）

X . . .

The surfaces from which the examination shall be performed應進行檢測之表面 X . . .

Technique(s) (straight beam, angle beam, contact, and/or immersion) 技術（直束波、斜束波、接觸和/或液浸）

X . . .

Angle(s) and mode(s) of wave propagation in the material波束在材料中的傳輸角度和模式 X . . .

Search unit type(s), frequency(ies), and element size(s)/shape(s) 掃查裝置之類型、頻率和換能

器之大小/形狀

X . . .

Special search units, wedges, shoes, or saddles, when used特設掃查裝置、楔塊、襯墊或襯塊

(當採用時)

X . . .

Ultrasonic instrument(s) 超聲波儀器 X . . .

Calibration [calibration block(s) and technique(s)] 校準[校準試塊和技術] X . . .

Directions and extent of scanning掃查方向和範圍 X . . .

Scanning (manual vs. automatic) 掃描（手動或自動） X . . .

Method for sizing indications 指示尺寸之測定方法 X . . .

Computer enhanced data acquisition, when used計算機增強數據採集(當採用時) X . . .

Scan overlap (decrease only) 掃查重迭率(僅減少時) X . . .

Personnel performance requirements, when required人員資格要求(當有要求時) X . . .

Personnel qualification requirements 人員資格要求 . . . X

Surface condition (examination surface, calibration block) 表面狀況(檢測面，校準試塊) . . . X

Couplant: brand name or type耦合劑：品牌名稱或類型 . . . X

Post-examination cleaning technique檢測後之清潔技術 . . . X

Automatic alarm and/or recording equipment, when applicable自動警报器和/或記錄設備(如適

用時)

. . . X

Records, including minimum calibration data to be recorded (e.g., instrument settings) 記錄，包

括所要記錄之最小校準資料(例如儀器設置關鍵幀)

. . . X

T-560 CALIBRATION 校準

T-561 INSTRUMENT LINEARITY CHECKS 儀器線性校對

The requirements of T-561.1 and T-561.2 shall be met at intervals not to exceed three months for analog type

instruments and one year for digital type instruments, or prior to first use thereafter. 對模擬型儀器和數位式儀器

之校對週期，應滿足其所相應之 T-561.1和 T-561.2的要求，且分別為不小於三個月和一年，或在第一次使

用儀器之前即應進行校準。

T-561.1 Screen Height Linearity. The ultrasonic instrument’s (excludes instruments used for thickness

measurement) screen height linearity shall be evaluated in accordance with Mandatory Appendix I of Article 4. 屏

幕高度線性度。超聲波儀器（不包括用於厚度測定之儀器）屏幕高度線性度應根據第 4章的強制性附錄 I

進行評估。

T-561.2 Amplitude Control Linearity. The ultrasonic instrument’s (excludes instruments used for thick-ness measurement) amplitude control linearity shall be evaluated in accordance with Mandatory Appendix II of Ar-

ticle 4. 振幅控制線性度。超聲波儀器（不包括用於厚度測定之儀器）振幅控制線性度應根據第 4章之強制

性附錄 II 進行評估。

T-562 GENERAL CALIBRATION REQUIREMENTS 通用校準要求

T-562.1 Ultrasonic System. Calibrations shall include the complete ultrasonic system and shall be per-

formed prior to use of the system in the thickness range under examination. 超聲波系統。校準應包括完整的超聲

波系統，且應在系統使用之前在所檢測之厚度範圍內進行校準。

T-562.2 Calibration Surface. Calibrations shall be performed from the surface (clad or unclad; convex or

concave) corresponding to the surface of the material from which the examination will be performed. 校準面。校

準應從與進行檢測的材料表面相對應的表面（堆焊層或未對層；凸面或凹面）進行。

T-562.3 Couplant. The same couplant to be used during the examination shall be used for calibration. 耦合劑。在檢測期間所採用之耦合劑應與應用於校準的相同。

T-562.4 Contact Wedges. The same contact wedges to be used during the examination shall be used for

calibration. 接觸楔塊。在檢測期間所採用之接觸楔塊應與將用於校準的相同。

T-562.5 Instrument Controls. Any control, which affects instrument linearity (e.g., filters, reject, or clip-ping), shall be in the same position for calibration, calibration checks, instrument linearity checks, and examination. 儀器控制旋鈕。任何影響儀器線性度（例如濾波器、帶阻濾波器或消波器）的控制旋鈕都應處於相同的位

置進行校準、校準校對、儀器線性校對和檢測。

T-562.6 Temperature. For contact examination, the temperature differential between the calibration block

and examination surfaces shall be within 25°F (14°C). 溫度。應用於於接觸檢測時，校準試塊和檢測面之間的

溫差應在 5°F (14°C) 5°F (14°C)以內。

For immersion examination, the couplant temperature for calibration shall be within 25°F (14°C) of

the couplant temperature for examination. 用於液浸式檢測時，校準耦合劑與檢測耦合劑之間的溫差應在 5°F

(14°C) 5°F (14°C)之內。

T-563 CALIBRATION CONFIRMATION 校準確認

T-563.1 System Changes. When any part of the examination system is changed, a calibration check shall be made on the calibration block to verify that distance range points and sensitivity setting(s) satisfy the requirements

of T-563.3. 系統變動。當檢測系統之任何部分更動時，應在校準是塊上進行校準校對，以驗證距離範圍各

點和靈敏度設置是否滿足 T-563.3的要求。

T-563.2 Calibration Checks. A calibration check on at least one of the reflectors in the calibration block or a check using a simulator shall be performed at the completion of each examination or series of similar examina-tions, and when examination personnel (except for automated equipment) are changed. The distance range and sen-

sitivity values recorded shall satisfy the requirements of T-563.3. 校準校對。在每次檢測或一系列類似檢測完成

之後，以及檢查人員更換時（自動化設備除外），應進行校準試塊中至少一個反射體的校準校對或採用模

擬試件的校對。所記錄之距離範圍和靈敏度值應滿足 T-563.3的要求。

NOTE: Interim calibration checks between the required initial calibration and the final calibration check may be performed. The decision to perform interim calibration checks should be based on ultrasonic instru-ment stability (analog vs. digital), the risk of having to conduct reexaminations, and the benefit of not performing

interim calibration checks. 注意：可在首次校準和最進一次校準之間執行所需的臨時校準。決定是否執行臨

時校準校對應根據超聲儀器的穩定性(模擬與數位)、進行再檢測的風險，以及不進行臨時校準校對的好處

來確認。

T-563.2.1 Simulator Checks. Any simulator checks that are used shall be correlated with the original calibration on the calibration block during the original calibration. The simulator checks may use different types of calibration reflectors or blocks (such as IIW) and/or electronic simulation. However, the simulation used shall be identifiable on the calibration sheet(s). The simulator check shall be made on the entire examination system. The entire system does not have to be checked in one operation; however, for its check, the search unit shall be con-nected to the ultrasonic instrument and checked against a calibration reflector. Accuracy of the simulator checks

shall be confirmed, using the calibration block, every three months or prior to first use thereafter. 模擬試件校對。

在最初校準過程中所使用之任何模擬試件校對應與校準試塊上之最初校準相關連。模擬件校對可採用不同

類型的校準反射體或規塊（例如 IIW）和/或電位模擬。然而，在校準單上所採用之模擬方式應可視為是相

同的。模擬試件校對應在整個檢測系統上進行。整個系統不需在一次操作中進行單獨性地校對，然而，校

進行此類一次操作的單獨性校對時，則將掃查裝置應連接到超聲波儀器並對校準反射體進行校對。模擬試

件之校對準確性應每三個月或在首次使用之前採用校準試塊進行確認。

Figure T-534.3 Straight Beam Calibration Blocks for Bolting

圖 T-534.3 用於螺栓的直束波校準試塊

(a) Block A

Nomenclature 專門用語

d = bolt* diameter螺栓直徑

D = calibration block diameter校準試

塊直徑

𝐷ℎ = flat-bottom hole diameter平底孔

直徑

l = bolt length螺栓長度

L = calibration block length校準試塊

長度

𝐿ℎ = flat-bottom hole length平底孔長

度

*“bolt” refers to the material to be ex-

amined (bolting) “螺栓”是指要檢測

的材料（螺栓）

(b) Block B

(c) Block C

Calibration Block Designation

校準試塊組號

Flat-Bottom Hole Depth, 𝐿ℎ

平底孔深度

A

B

C

1.5 in. (38 mm)

0.5 in. (13 mm)

0.5 in. (13 mm)

Diameter of Bolting Material to be Examined

待檢測螺栓材料之直徑, d

Calibration Block Diame-

ter校準試塊直徑, D

Flat-Bottom Hole Diameter

平底孔直徑, 𝐷ℎ

Up to 1 in. (25 mm)

Over 1 in. (25 mm) to 2 in. (50 mm)

Over 2 in. (50 mm) to 3 in. (75 mm)

Over 3 in. (75 mm) to 4 in. (100 mm) Over 4 in. (100 mm)

d ±d/4

d ±d/4

d ±d/4

d ±d/4 d ±1 in. (25 mm)

1/16 in. (1.5 mm)

1/8 in. (3 mm)

3/16 in. (5 mm)

5/16 in. (8 mm) 3/8 in. (10 mm)

GENERAL NOTE: A tolerance of ±5% may be applied. 通注：可應用公差為±5％。

T-563.3 Confirmation Acceptance Values. 認可值確認

T-563.3.1 Distance Range Points. If any distance range point has moved on the sweep line by more than 10% of the distance reading or 5% of full sweep (whichever is greater), correct the distance range calibration and note the correction in the examination record. All recorded indications since the last valid calibration or calibra-

tion check shall be reexamined and their values shall be changed on the data sheets or re-recorded. 距離範圍各

點。若任何距離範圍點在掃查描線上已經移動超過距離讀數的 10％或整個掃查範圍的 5％（以較大者為

準）時，則應對距離範圍校準進行校正，並在檢測記錄表上註解此校正訊息，應對自上次有效校准或校準

校對以來之所有記錄在案的指示重新進行檢測，並在數據單上更改其值或重新記錄。

T-563.3.2 Sensitivity Settings. If any sensitivity setting has changed by more than 20% or 2 dB of its amplitude, correct the sensitivity calibration and note the correction in the examination record. If the sensitivity set-ting has decreased, all data sheets since the last valid calibration or calibration check shall be marked void and the area covered by the voided data shall be reexamined. If the sensitivity setting has increased, all recorded indications

D/4

l/8

l/2

𝐿ℎ (typ)

𝐷ℎ

(typ)

since the last valid calibration or calibration check shall be reexamined and their values shall be changed on the data

sheets or re-recorded. 靈敏度設置關鍵幀。如果任何靈敏度所設定之振幅變化超過 20％或 2 dB，則應靈敏度

校準進行校正，並在檢測記錄表上註解此校正訊息。若降低靈敏度設定，應對自上次有效校准或校準校對

以來之所有數據單都將被標記為無效，並對無效數據所覆蓋之區域重新進行檢測。如果靈敏度設定有所增

加，則應對自上次有效校准或校準校對以來之所有記錄在案之指示重新進行檢測，並在數據單上重新記錄

其新的值。

T-564 CASTING CALIBRATION FOR SUPPLEMENTARY ANGLE BEAM EX-

AMINATIONS 作為斜束波檢測輔助之鑄件校準

For supplementary angle-beam examinations, the instrument gain shall be adjusted during calibration such that the indication from the side-drilled hole producing the highest amplitude is 80% ± 5% of full screen height. This

shall be the primary reference level. 為達到輔助斜束波檢測目的，儀器增益應在校準過程中進行調整，以使

來至側橫孔之訊號能產生滿屏高度 80％±5％的最高振幅。這便是首要參照電平。

T-570 EXAMINATION 檢測

T-571 EXAMINATION OF PRODUCT FORMS 各類產品形式之檢測

T-571.1 Plate . Plate shall be examined in accordance with SA-435/SA-435M, SA-577/SA-577M, SA-

578/SA-578M, or SB-548, as applicable, except as amended by the requirements elsewhere in this Article. 板材。

除非經本章之其他規定所修正過，否則板材應按照 SA-435/SA-435M、SA-577/SA-577M、SA-578/SA-578M

或 SB-548之要求進行檢測。

T-571.2 Forgings and Bars. 鍛件和棒材

(a) Forgings and bars shall be examined in accordance with SA-388/SA-388M or SA-745/SA-

745M, as applicable, except as amended by the requirements elsewhere in this Article. 除非經本章之其他規定所

修正過，否則鍛件和棒材應按照 SA-388SA-388M或 SA-745SA/745M之要求進行檢測。

(b) All forgings and bars shall be examined by the straight-beam examination technique. 所有鍛

件和棒材均應運用直束波檢測技術來進行檢測。

(c) In addition to (b), ring forgings and other hollow forgings shall also be examined by the angle-beam examination technique in two circumferential directions, unless wall thickness or geometric configuration

makes angle-beam examination impractical. 除（b）之外，除非壁厚或幾何結構致使不法進行得斜束波檢測，

否則環形鍛件和其他空心鍛件還應藉由斜束波檢測技術以在兩個圓周方向進行檢測。

(d) In addition to (b) and (c), ring forgings made to fine grain melting practices and used for vessel

shell sections shall be also examined by the angle-beam examination technique in two axial directions. 除（b）和

（c）之外，經細晶粒處理且用於容器殼部件之環形鍛件還應在兩個軸向上進行斜束波檢測。

(e) Immersion techniques may be used. 可採用液浸技術。

T-571.3 Tubular Products. Tubular products shall be examined in accordance with SE-213 or SE-273, as

applicable, except as amended by the requirements elsewhere in this Article. 各類管狀產品。除非經本章之其他

規定所修正過，否則各類管狀產品應按照所適用之 SE-213或 SE-273進行檢測。

T-571.4 Castings. Castings shall be examined in accordance with SA-609/SA-609M, except as amended

by the requirements elsewhere in this Article. 鑄件。除非經本章之其他規定所修正過，否則鑄件應按照 SA-

609/SA-609M進行檢測。

(a) For straight-beam examinations, the sensitivity compensation in paragraph 8.3 of SA-609/SA-

609M shall not be used. 在進行直束波檢測時，不應採用 SA-609/SA-609M第 8.3段的靈敏度補償。在直束波

檢測期間或鑄件檢測面與底面間之夾角超過 15度的鑄件或鑄件區域進行輔助斜束波檢測時，背反射是不存

在的。

(b) A supplementary angle-beam examination shall be performed on castings or areas of castings where a back reflection can not be maintained during straight-beam examination, or where the angle between the

front and back surfaces of the casting exceeds 15 deg. 在直束波檢測期間或鑄件檢測面與底面間之夾角超過 15º

的鑄件或鑄件區域進行輔助斜束波檢測時，背反射是不存在的。

T-571.5 Bolting Material. Bolting material shall be examined in accordance with SA-388/SA-388M, ex-

cept as amended by the requirements elsewhere in this Article. 锚固材料。除非經本章之其他規定所修正過，否

則锚固材料應按照 SA-388/SA-388M進行檢測。

(a) Bolting material shall be examined radially prior to threading. Sensitivity shall be established using the indication from the side of the hole in calibration block A at radial metal paths of D /4 and 3D /4. The in-strument gain shall be adjusted such that the indication from the D /4 or 3D /4 hole (whichever has the highest indi-cation amplitude) is 80% ± 5% of full screen height (FSH). This shall be the primary reference level. A distance–amplitude correction (DAC) curve shall be established using the indications from the D /4 and 3D /4 holes and shall

be extended to cover the full diameter of the material being examined. 在車製螺紋之前，螺栓材料應進行徑向檢

查。應在D/4和 3D/4的徑向金屬聲程上採用來自 A組校準試塊中孔側面之指示來建立靈敏度。應藉由增益

旋鈕來對儀器進行調整，以使來至 D/4或 3D/4孔（以指示之最高振幅為準）的訊號為滿屏高度（FSH）的

80％±5％，並以此作為首要參照電平。應採用來至D/4和 3D/4孔的指示來建立距離-振幅校正（DAC）曲

線，且曲線應延伸至足以涵蓋被檢測材料的整個直徑範圍。

(b) Bolting material shall be examined axially from both end surfaces, either before or after thread-ing. The instrument gain shall be adjusted such that the indication from the flat-bottom hole producing the highest indication amplitude, is 80% ± 5% FSH. This shall be the primary reference level. A DAC curve shall be estab-lished using the indications from the three flat-bottom holes and shall be extended to cover the full length of the ma-terial being examined. If any flat-bottom hole indication amplitude is less than 20% FSH, construct two DAC lines using calibration blocks A and B, and calibration blocks B and C and record the gain setting necessary to adjust the

highest indication amplitude for each DAC to 80% ± 5% FSH. 在車製螺紋之前或之後，螺栓材料應從兩端面進

行軸向檢測。應藉由增益旋鈕來對儀器進行調整，以使來至平底孔之指示足以產生為滿屏高度 80％±5％的

最高指示振幅，並以此作為首要參照電平。應採用來至三個平底孔的指示來建立DAC曲線，且曲線應延伸

至足以涵蓋被檢測材料的全個長度範圍。若有任何平底孔訊號振幅小於 20％FSH時，則採用 A組和 B組校

準試塊且藉由 A組和B組校準試塊來分別構建兩條 DAC曲線，並將每一條 DAC最高訊號振幅調整至

80％ ±5％FSH 時所需的增益設定予以記錄下來。

(c) Immersion techniques may be used. 可採用液浸技術。

T-572 EXAMINATION OF PUMPS AND VALVES 泵和閥之檢測

Ultrasonic examination of pumps and valves shall be in accordance with Mandatory Appendix I. 泵和閥門的

超聲檢測應符合強制性附錄 I之規定。

T-573 INSERVICE EXAMINATION 在役檢測

T-573.1 Nozzle Inner Radius and Inner Corner Region. Inservice examination of nozzle inner radii and

inner corner regions shall be in accordance with Mandatory Appendix II. 接管內半徑和內角偶區域。接管內半徑

和內角偶區域之在役檢測應符合強制性附錄 II之規定。

T-573.2 Inservice Examination of Bolting. Inservice examination of bolting shall be in accordance with

Man- datory Appendix IV. 锚固件之在役檢測。锚固件之在役檢測應符合強制性附錄 IV之規定。

T-573.3 Inservice Examination of Cladding. Inser vice examination of cladding, excluding weld metal

overlay cladding, shall be in accordance with SA-578/ SA-578M. 堆焊層之在役檢測。不包括焊縫金屬堆焊層之

純堆焊層在役檢測應符合 SA-578/SA-578M之規定。

T-574 THICKNESS MEASUREMENT 厚度測量

Thickness measurement shall be performed in accordance with SE-797, except as amended by the require-

ments elsewhere in this Article. 除非經本章之其他規定所修正，否則厚度測量應按照 SE-797進行。

T-577 POST-EXAMINATION CLEANING 檢測後之清潔


evaluation and documentation using a process that does not adversely affect the part. 當規程要求進行檢後後清潔

時，宜在評估和記錄文件完成之後儘快進行清潔，並採用不會對物項產生不利影響的清潔法。

T-580 EVALUATION 評估

For examinations using DAC calibrations, any imperfection with an indication amplitude in excess of 20% of DAC shall be investigated to the extent that it can be evaluated in terms of the acceptance criteria of the referencing

Code Section. 採用 DAC校準之檢測，應對任何具有指示振幅超過 20％DAC之缺陷範圍進行進一步地細

探，以便可根據相應引用規範章節的允收準則進行評估。

T-590 DOCUMENTATION 文件資料

T-591 RECORDING INDICATIONS 記錄指示

T-591.1 Nonrejectable Indications. Nonrejectable indications shall be recorded as specified by the refer-

encing Code Section. 不可拒收之指示。不可拒收之指示應按照相應引用規範章節之規定進行記錄。

T-591.2 Rejectable Indications. Rejectable indications shall be recorded. As a minimum, the type of indi-

cation (i.e., crack, lamination, inclusion, etc.), location, and extent (i.e., length) shall be recorded. 可拒收之指示。

應記錄可拒收之指示，其中至少應記錄指示的類型（即裂紋、夾層、夾渣等）、位置和範圍（即長度）。

T-592 EXAMINATION RECORDS 檢測記錄

For each ultrasonic examination, the following information shall be recorded: 對每次超聲檢測都應記錄以下

信息：

(a) procedure identification and revision規程編號和版次

(b) ultrasonic instrument identification (including manufacturer’s serial number) 超聲儀器識別碼（含

製造商之序列號）

(c) search unit(s) identification (including manufacturer’s serial number, frequency, and size) 掃查裝置

之識別瑪（包括製造商的序列號、頻率和大小）

(d) beam angle(s) used所採用之波束角度

(e) couplant used, brand name or type 所採使之耦合劑品牌名稱或類型

(f) search unit cable(s) used, type and length所採使之掃查裝置電纜類型和長度

(g) special equipment, when used (search units, wedges, shoes, automatic scanning equipment, recording

equipment, etc.) 所採使之專設設備（掃查裝置、楔塊、襯墊、自動掃查設備、記錄設備等）

(h) computerized program identification and revision, when used所採使之計算機程式識別碼和版次

(i) calibration block identification校準試塊識別碼

(j) simulation block(s) and electronic simulator(s) identification, when used 模擬試塊和電子模擬器(當

採用時)之識別碼

(k) instrument reference level gain and, if used, damping and reject setting(s) 儀器之參考電平增益，

和若採用時之阻尼和带阻滤波器設置

(l) calibration data [including reference reflector(s), indication amplitude(s), and distance reading(s)] 校

準數據，包括參考反射體、指示振幅和距離讀數

(m) data correlating simulation block(s) and electronic simulator(s), when used, with initial calibration模

擬試塊和具有起始校準電子模擬器(當採用時)有關之數據

(n) identification of material or volume scanned材料或掃查體積之識別號

(o) surface(s) from which examination was conducted, including surface condition 進行檢測之表面，

包括表面狀況

(p) map or record of rejectable indications detected or areas cleared所檢測到之可拒收指示或缺陷已清

除區域的圖示或記錄

(q) areas of restricted access or inaccessible areas 禁止進入區域或無法接近之範圍

(r) examination personnel identity and, when required by referencing Code Section, qualification level

檢測者之識別碼，並當為相應引用規範章節所要求時之資格等級

(s) date of examination檢測日期

Items (b) through (m) may be included in a separate calibration record provided the calibration record identifica-

tion is included in the examination record. 項目（b）至（m）可以被包括在單獨的校準記錄中，只要在校準記

錄中標注該項已被包括在檢測記錄中。

T-593 REPORT 報告

A report of the examinations shall be made. The report shall include those records indicated in T-591 and T-

592. The report shall be filed and maintained in accordance with the referencing Code Section. 應當提交檢測報

告，且報告內容至少應包括 T-591和 T-592中所記載的那些記錄項目。報告應根據相應引用規範章節之要

求進行歸檔和保存。

T-594 STORAGE MEDIA 貯存介質

Storage media for computerized scanning data and viewing software shall be capable of securely storing and

retrieving data for the time period specified by the referencing Code Section. 用於計算機化掃查數據和查看軟件

的貯存介質應具有在引用規規範章節指定的期間內安全地被貯存和檢索數據的能力。

MANDATORY APPENDIX I ULTRASONIC EXAMINA-

TION OF PUMPS AND VALVES 強制性附錄 I 泵和閥門的超聲檢

測

I-510 SCOPE 適用範圍

This Appendix describes supplementary requirements to Article 5 for ultrasonic examination of welds or base

material repairs, or both, in pumps and valves. 本附錄對以第 5章作為在泵和閥門中的焊縫或泵殼/閥體之母材

(應含阀门之閥座和閥盤)返修或兩者之超聲檢測補充要求提供了有關訊息上的描述。

I-530 EQUIPMENT 設備

I-531 CALIBRATION BLOCKS 校準試塊

Calibration blocks for pumps and valves shall be in accordance with Article 4, Nonmandatory Appendix J. 泵和

閥門的校準試塊應符合第 4章非強制性附錄附錄 J之要求。

I-560 CALIBRATION 校準

I-561 SYSTEM CALIBRATION 系統校準

System calibration shall be in accordance with Article 4, T-463 exclusive of T-463.1.1. 系統校準應符合第 4章

T-463之規定，但其中不包括 T-463.1.1條。

I-570 EXAMINATION 檢測

The examination shall be in accordance with Article 4, T-470. 檢測應符合第 4章 T-470的規定。

MANDATORY APPENDIX II INSERVICE EXAMINA-

TION OF NOZZLE INSIDE CORNER RADIUS AND INNER

CORNER REGIONS 強製附錄 II 接管內隅角半徑範圍和內角隅區域的在役檢測

II-510 SCOPE 適用範圍

This Appendix describes supplementary requirements to Article 5 for inservice examination of nozzle inside

corner radius and inner corner regions. 本附錄對以第 5章作為接管角偶半徑範圍和內角偶區域的在役檢測補

充要求給出了介紹。

II-530 EQUIPMENT 設備

II-531 CALIBRATION BLOCKS 校準試塊

Calibration blocks shall be full-scale or partial-section (mockup) nozzles, which are sufficient to contain the

maximum sound beam path, examination volume, and calibration reflectors. 校準試塊應為接管之尺寸或足以涵

蓋最大聲程、檢測體積和校準反射體的接管其中一段（實體模型）。

II-531.1 General. The general calibration block requirements of Article 4, T-434.1 shall apply. 通則。應

採用第 4章 T-434.1的泛用校準試塊要求。

II-531.2 Mockups. If sound beams only pass through nozzle forgings during examinations, nozzle mockups may be nozzle forgings, or segments of forgings, fixed in structures as required to simulate adjacent vessel surfaces. If sound beams pass through nozzle-to-shell welds during examinations, nozzle mockups shall contain

nozzle welds and shell components of sufficient size to permit calibration. 模型。如果聲束在檢測期間僅通過接

管鍛件，則接管實體模型可以是整個接管鍛件或鍛件的其中一段，而模型需被固定在所需的結構中，以模

擬與接管相鄰之容器面。如果聲束在檢測期間通過接管與殼體之連接焊縫，接管模型應包含接管焊縫和殼

體部件應具有可供進行校準之足夠尺寸。

II-531.3 Thickness. The calibration block shall equal or exceed the maximum component thickness to be

examined. 厚度。校準試塊應≧待檢測物項之最大厚度。

II-531.4 Reflectors. The calibration block shall contain a minimum of three notches within the examina-tion volume. Alternatively, induced or embedded cracks may be used in lieu of notches, which may also be em-ployed for demonstration of sizing capabilities when required by the referencing Code Section. Notches or cracks

shall meet the following requirements: 反射體。校準試塊在檢測體積內應至少包含三個槽口，或者，可採用

誘發型或嵌入式裂紋來取替槽口，在相應引用規章節要求時這些裂紋也可以用於演示尺寸測定能力。槽口

或裂紋應符合下列要求：

(a) Notches or cracks shall be distributed radially in two zones with at least one notch or crack in each zone. Zone 1 ranges between 0 deg and 180 deg (±45 deg) and Zone 2 is the remaining two quadrants, cen-

tered on the nozzle’s axis. 槽口或裂紋應分佈在兩個區域中，每個區域至少有一個槽口或裂紋。區域 1的範圍

在 0º和 180º（±45º）之間，區域 2則是其餘的兩個像限，且各象限是以接管軸線為中心的。

(b) Notches or cracks shall be placed within the nozzle inner radii examination volume and ori-

ented parallel to the axial plane of the nozzle; the orientation tolerance is ±2 deg. 槽口或裂紋應放置在接管內半徑

檢測體積內，並平行於接管的軸向平面，且方位公差為±2º。

(c) Notch or crack lengths shall be 1 in. (25 mm) maximum. Nominal notch widths shall be 1/16

in. (1.5 mm). 槽口或裂紋之最大長度應為 1 in. (25 mm) 。標稱槽口寬度應為 1/16 in. (1.5 mm)。

(d) Notch or crack depths, measured from the nozzle inside surface, shall be: 從接管內表面所測

量到之槽口或裂紋深度應為：

(1) Reflector No. 1 — 0.20 in. to 0.35 in. (5 mm to 9 mm) 反射體 1號：0.20 in. 至 0.35

in. (5 mm 至 9 mm)

(2) Reflector No. 2 — 0.35 in. to 0.55 in. (9 mm to 14 mm) 反射體 2號： 0.35 in. 至 0.55

in. (9 mm 至 14 mm)

(3) Reflector No. 3 — 0.55 in. to 0.75 in. (14 mm to 19 mm) 反射體 3號：0.55 in. 至 0.75

in. (14 mm 至 19 mm)

II-560 CALIBRATION 校準

II-561 SYSTEM CALIBRATION 系統校準

System calibration shall be in accordance with Article 4, T-463 exclusive of T-463.1.1. 除 T-463.1.1以外，系

統校準應符合第四章 T-463之規定。

II-570 EXAMINATION 檢測

The general examination requirements of Article 4, T-471 shall apply. 應運用第四章 T-471的泛用檢測要

求。

MANDATORY APPENDIX III GLOSSARY OF TERMS

FOR ULTRASONIC EXAMINATION 強制性附錄 III 超聲波檢查術

語詞彙表

Deleted; terms and definitions in this Appendix have been incorporated into Article 1, Mandatory Appendix I,

I-121.2. 已刪除，在本附錄中之術語和定義已被納入到第 1章，強制性附錄 I，I-121.2中。

MANDATORY APPENDIX IV INSERVICE EXAMINA-

TION OF BOLTS 強制性附錄 IV 螺栓之在役檢測

IV-510 SCOPE 適用範圍

This Appendix describes supplementary requirements to Article 5 for inservice examination of bolts. 本附錄對

以第 5章作為螺栓在役檢測的補充要求給出了相關介紹。

IV-530 QUIPMENT 設備

IV-531 CALIBRATION BLOCKS 校準試塊

Calibration blocks shall be full-scale or partial-section bolts, which are sufficient to contain the maximum sound

beam path and area of interest, and to demonstrate the scanning technique. 校準試塊應為整根或部分螺栓所製

成，其長度應滿足在演示掃查技術時所需的最大聲程和被檢測範圍。

IV-531.1 Material. The calibration block shall be of the same material specification, product form, and

surface finish as the bolt(s) to be examined. 材料。校準試塊所採用之材料應與待檢測螺栓具有相同的材料規

格，產品形式和表面光潔度。

IV-531.2 Reflectors. Calibration reflectors shall be straight-cut notches. A minimum of two notches shall be machined in the calibration standard, located at the minimum and maximum metal paths, except that notches

need not be located closer than one bolt diameter from either end. Notch depths shall be as follows: 反射體。校準

反射體應為垂直切向槽口。在校準標準中，在最小和最大金屬聲程處至少要加工兩個槽口，且槽口不應位

於距螺栓兩端為一個螺栓直徑的間距範圍內。槽口深度應如下：

Bolt Size 螺栓尺寸 Notch Depth [Note (1)] 槽口深度[見注（1）]

Less than 2 in. (50 mm) 小於 2 in. (50 mm) 1 thread depth 等於螺紋深度

2 in. (50 mm) and greater, but less than 3 in. (75 mm) 3 in. (75 mm)≦螺

栓尺寸<3 in. (75 mm) 5/64 in. (2.0 mm)

3 in. (75 mm) and greater ≧3 in. (75 mm) 3/32 in. (2.5 mm)

NOTE:注：

(1) Measured from bottom of thread root to bottom of notch. 從螺紋根部測量到槽口底部

As an alternative to straight-cut notches, other notches (e.g., circular cut) may be used provided the

area of the notch does not exceed the area of the applicable straightcut notches required by this paragraph. 只要其

它槽口的面積不超過本段所要求之適用垂直切向槽口面積，則可採用其它槽口（例如，圓形切口）來取代

垂直切向槽口。

IV-560 CALIBRATION 校準

IV-561 DAC CALIBRATION DAC校準

A DAC curve shall be established using the calibration reflectors in IV-531.2. The sound beam shall be directed toward the calibration reflector that yields the maximum response, and the instrument shall be set to obtain an 80% of full screen height indication. This shall be the primary reference level. The search unit shall then be manipulated, without changing instrument settings, to obtain the maximum responses from the other calibration reflector(s) to generate a DAC curve. The calibration shall establish both the sweep range calibration and the distance–amplitude

correction. 應採用 IV-531.2中的校準反射體來建立DAC曲線。聲束應朝向能產生最大靈敏度響應的校準反

射體，且儀器應設置為能獲得滿屏高度訊號的 80％，且這就是首要參照電平。然後在不改變儀器設置的情

況下操作掃查裝置，以獲得來自其他校準反射體之最大訊號響應以產生 DAC曲線。此校準應同時建立掃查

範圍校準和距離-振幅校正。

IV-570 EXAMINATION 檢測

IV-571 GENERAL EXAMINATION REQUIREMENTS 泛用檢測要求

The general examination requirements of Article 4, T-471 shall apply. 應用用第四章 T-471的泛用檢測要

求。

ARTICLE 6 LIQUID PENETRANT EXAMINA-

TION 第六章液渗透检测


When specified by the referencing Code Section, the liquid penetrant examination techniques described in this Article shall be used. In general, this Article is in conformance with SE-165, Standard Test Method for Liquid Pen-

etrant Examination. This document provides details to be considered in the procedures used. 当引用规范章节指

定时，应采用本章所述的液渗透检查技术。一般来说，本章是与 SE-165液渗透检测标准测试方法相一致

的。本文件对所采用之规程提供了所需考虑细节。

When this Article is specified by a referencing Code Section, the liquid penetrant method described in this Arti-cle shall be used together with Article 1, General Requirements. Definitions of terms used in this Article appear in

Article 1, Mandatory Appendix I, I-121.3, PT — Liquid Penetrants. 当本章由引用规范章节指定时，本章所述之

液渗透剂方法应与第 1章通则要求一起并用。为本章中所采用术语定义请见第 1章、强制性附录 I第 I-

121.3节之 PT - 液渗透剂。


The liquid penetrant examination method is an effective means for detecting discontinuities which are open to the surface of nonporous metals and other materials. Typical discontinuities detectable by this method are cracks,

seams, laps, cold shuts, laminations, and porosity. 液渗检测方法是用于检测对非多孔性金属和其它材料之表面

开放不连续性的有效方法。通过该方法可检测典型的不连续性(诸如裂纹、裂缝、軋機所引起之折痕/冷接紋

/夾層、气孔)。

In principle, a liquid penetrant is applied to the surface to be examined and allowed to enter discontinuities. All excess penetrant is then removed, the part is dried, and a developer is applied. The developer functions both as a blotter to absorb penetrant that has been trapped in discontinuities, and as a contrasting background to enhance the visibility of penetrant indications. The dyes in penetrants are either color contrast (visible under white light) or fluo-

rescent (visible under ultraviolet light). 在原则上，液渗法是将液渗透剂施加到待检测表面以让渗透剂渗入

不连续性，然后除去所有过量的渗透剂、物项是干燥的，并施加显影剂。显影剂既可作为作吸收剂以将不

连续中之渗透剂吸附出来，又可作为对比物项底色以增强渗透剂指示的可见性。在渗透剂中之染料是颜色

反差(在白光下可见)或荧光(在黑光下可见)。

T-621 WRITTEN PROCEDURE REQUIREMENTS 书面规程之要求

T-621.1 Requirements. Liquid penetrant examination shall be performed in accordance with a written proce-dure which shall as a minimum, contain the requirements listed in Table T-621.1. The written procedure shall estab-

lish a single value, or range of values, for each requirement. 液渗透检测应按照书面规程进行，书面规程应至少

包含表 T-621.1中所列之要求。书面规程应为每一要求建立单一值或一系列值。

T-621.2 Procedure Qualification. When procedure qualification is specified by the referencing Code Section, a change of a requirement in Table T-621.1 identified as an essential variable shall require requalification of the written procedure by demonstration. A change of a requirement identified as a nonessential variable does not re-quire requalification of the written procedure. All changes of essential or nonessential variables from those specified

within the written procedure shall require revision of, or an addendum to, the written procedure. 规程鉴定。当参

引用规范章节对规程提出鉴定要求时，在表 T-621.1中所示之重要变数若产生改变时，书面规程应通过演

示重新鉴定。被指定为非必要变数之改变，对书面规程并不要求重新鉴定。对书面规程中所规定之主要或

非主要变数有所更改时，都应对要求书面规程进行修订或补遗。

T-621.3 Minimum and Maximum Step Times. The written procedure shall have minimum and maximum

times for the applicable examination steps listed in Table T-621.3. 各检测步骤之最短和最长时间。在书面规程

中应有表 T-621.3中有关各检测步骤所适用之最短和最长时间。


The term penetrant materials, as used in this Article, is intended to include all penetrants, emulsifiers, solvents or cleaning agents, developers, etc., used in the examination process. The descriptions of the liquid penetrant classi-

fications and material types are provided in SE-165 of Article 24. 在本文中所采用之渗透材料术语旨在包括在

检设过程中采用到之所有渗透剂、乳化剂、溶剂或清洁剂、显影剂等。液体渗透剂等级划分和其材料类型

摘要见第 24章 SE-165。


T-641 CONTROL OF CONTAMINANTS 污染元素之控制

The user of this Article shall obtain certification of contaminant content for all liquid penetrant materials used on nickel base alloys, austenitic or duplex stainless steels, and titanium. These certifications shall include the pene-trant manufacturers’ batch numbers and the test results obtained in accordance with Mandatory Appendix II of this

Article. These records certifications shall be maintained as required by the referencing Code Section. 当所采用之

材料是镍基合金、奥氏体或双相不锈钢和钛金属时，对这些材料可能造成污染之成分，用户本章应取得所

有液渗透材料之证明书，在这些证明书中应包括渗透剂制造商批号和根据本章之强制性附录 II所进行之测

试结果记录，且这些证明书应根据引用规范章节之要求予以保存。

T-642 SURFACE PREPARATION 表面制备

(a) In general, satisfactory results may be obtained when the surface of the part is in the as-welded, as-rolled, as-cast, or as-forged condition. Surface preparation by grinding, machining, or other methods may be neces-

sary where surface irregularities could mask indications. 在大多数情况下，当物项表面处于焊态、轧制状态、

铸态或锻造状态时，就可获得符合要求的结果。如表面不规则性对不连续性指示可能造成遮障时，则通过

研磨、机加工或其他表面制备方法可能是必要的。

(b) Prior to each liquid penetrant examination, the surface to be examined and all adjacent areas within at least 1 in. (25 mm) shall be dry and free of all dirt, grease, lint, scale, welding flux, weld spatter, paint, oil, and other

extraneous matter that could obscure surface openings or otherwise interfere with the examination. 在每次液渗透

检测之前，待检测表面和在至少为 1 in. (25 mm)之所有相邻区域内应是干燥的，并且没有任何污垢、油

脂、棉屑、焊渣、焊剂、焊接飞溅物、油漆、油、其他对表面开口可能造成遮蔽或以其他方式干扰检测之

外来物质。

(c ) Typical cleaning agents which may be used are detergents, organic solvents, descaling solutions, and

paint removers. Degreasing and ultrasonic cleaning methods may also be used. 可采用除垢剂、有机溶剂、除莠

剂和除漆剂来作为典型的清洁剂；也可以采用脱脂和超声波洗净法。

(d) Cleaning solvents shall meet the requirements of T-641. The cleaning method employed is an important

part of the examination process. 清洗剂应符合 T-641之要求。所采用之清洗方法是检测过程的重要部分。

NOTE: Conditioning of surfaces prior to examination as required in (a) may affect the results. See SE-165,

Annex A1. 注意：按(a)所要求之检测前表面制备可能会对结果造成影响，关于表面制备之预防措施见 SE-

165之附件 A1。

T-643 DRYING AFTER PREPARATION 制备后之干燥作业

After cleaning, drying of the surfaces to be examined shall be accomplished by normal evaporation or with forced hot or cold air. A minimum period of time shall be established to ensure that the cleaning solution has evapo-

rated prior to application of the penetrant. 清洗后，待检测表面之干燥方式应通过室温蒸发或用强制热对流或

冷空气进行。应建立最短干燥时间以确保清洗剂在应用渗透剂之前已蒸发制可接受状态(目检视干燥的)。

Table T-621.1 Requirements of a Liquid Penetrant Examination Procedure

表 T-621.1 液渗透检测规程之要求

Requirement 要求事项 Essential Variable

主要变数


非主要变数

Identification of and any change in type or family group of penetrant materials including

developers, emulsifiers, etc. 渗透剂材料(包括显影剂，乳化剂等)在类型识别上或

在同一厂牌系列组中的任何更迭。

X …

Surface preparation (finishing and cleaning, including type of cleaning solvent) 表面制备(加工和清洗，其中包括有清洗剂的类型)

X …

Method of applying penetrant 渗透剂所采用之方法 X …

Method of removing excess surface penetrant 多余表面渗透剂的去除方法 X … Hydrophilic or lipophilic emulsifier concentration and dwell time in dip tanks and agita-

tion time for hydrophilic emulsifiers亲水性或亲脂性乳化剂之浓度、在浸泡筒中的

滞留时间和亲水乳化剂的搅拌时间

X …

Hydrophilic emulsifier concentration in spray applications 亲水性乳化剂在喷雾应用中

之浓度 X …

Method of applying developer显影剂之施加方法 X …

Minimum and maximum time periods between steps and drying aids 在步骤和干燥助剂之间的最短和最长时间周期

X …

Decrease in penetrant dwell time 减少滞留时间 X …

Increase in developer dwell time (Interpretation Time) 在解释期间所增加之显影剂滞

留时间 X …

Minimum light intensity 最小照明度 X …

Surface temperature outside 40°F to 125°F (5°C to 52°C) or as previously qualified Per-

formance demonstration, when required表面温度不在 40°F至 125°F(5°C至 52°C)

范围内或不按先前所鉴定认可之性能演示(当要求时)

X …

Personnel qualification requirements 人员资格认可要求 … X

Materials, shapes, or sizes to be examined and the extent of examination 待检测材料、

形状、尺寸和检测范围 … X

Post-examination cleaning technique检测后之清理技术 … X

Table T-621.3 Minimum and Maximum Time Limits for Steps in Penetrant Examination Pro-

cedures

表 T-621.3 在渗透检测规程中用于每一步骤之最短和最长时间变数限制

Procedure Step 规程步骤 Minimum 最短 Maximum

最长

Drying after preparation制备后之干燥作业 (T-643)

Penetrant dwell渗透滞留时间 (T-672)

X

X

. . .

X

Penetrant removal water washable/solvent removable以水洗去除渗透剂或溶剂 (T-

673.1/T-673.3) . . . . . .

Penetrant removal with lipophilic emulsifier用亲脂性乳化剂去除渗透剂 [T-673.2(a)] X X

Penetrant removal with hydrophilic emulsifier 用亲水性乳化剂去除渗透剂 [T-673.2(b)]

Prerinse预清洗

Immersion浸泡

Water-emulsifier spray 喷雾型水性乳化剂喷洒

Water immersion or spray post-rinse液浸或喷洒后冲洗

. . .

. . .

. . .

. . .

X

X

X X

Drying after penetrant removal 渗透剂去除后之干燥作业(T-674)

Solvent removal penetrants 用溶剂去除渗透剂

Water washable and post-emulsifiable penetrants亲水和后乳化性渗透剂

. . .

. . .

X

X

Developer application显影剂应用程序 (T-675) . . . X

Developing and interpretation time显影和解释时间 (T-675.3 and T-676) X X

T-650 TECHNIQUE 技术


Either a color contrast (visible) penetrant or a fluorescent penetrant shall be used with one of the following

three penetrant processes: 应采用具有以下三种渗透作用之一的色比(可见)渗透剂或荧光渗透剂：

(a) water washable 亲水型

(b) post-emulsifying 后乳化型

(c ) solvent removable 溶剂型

The visible and fluorescent penetrants used in combination with these three penetrant processes result in six

liquid penetrant techniques. 可见和荧光渗透剂结合这三种渗透作用可产生六种液渗透技术。

T-652 TECHNIQUES FOR STANDARD TEMPERATURES 用于标准温度之技术

As a standard technique, the temperature of the penetrant and the surface of the part to be processed shall not be below 40°F (5°C) nor above 125°F (52°C) throughout the examination period. Local heating or cooling is per-mitted provided the part temperature remains in the range of 40°F to 125°F (5°C to 52°C) during the examination. Where it is not practical to comply with these temperature limitations, other temperatures and times may be used,

provided the procedures are qualified as specified in T-653. 作为标准技术，渗透剂和待处理物项之表面温度在

整个检测期间不应低于 40°F (5°C)，也不应高于 125°F (52°C)，只要在检测期间物项温度保持在 40°F至

125°F (5°C 至 52°C)范围内，则允许局部加热或冷却。当这些温度限制是不可行时，而其他温度和时间规程

已按 T-653之规定认可时，则可采用该规程。

T-653 TECHNIQUES FOR NONSTANDARD TEMPERATURES 用于非标准温度之技术

When it is not practical to conduct a liquid penetrant examination within the temperature range of 40°F to 125°F (5°C to 52°C), the examination procedure at the proposed lower or higher temperature range requires qualifi-

cation of the penetrant materials and processing in accordance with Mandatory Appendix III of this Article. 当在

40°F至 125°F (5°C 至 52°C)温度范围内进行液渗透检测是不可行时，在较低或较高温度范围下之渗透剂材

料检测规程已被本章强制性附录 III所认可，则可采用该渗透剂材料。

T-654 TECHNIQUE RESTRICTIONS 技术限制

Fluorescent penetrant examination shall not follow a color contrast penetrant examination. Intermixing of pen-etrant materials from different families or different manufacturers is not permitted. A retest with water washable

penetrants may cause loss of marginal indications due to contamination. 色比渗透检测后不应跟着又作荧光渗透

检测；不同系列或不同制造商的渗透材料不允许混用。水洗型渗透剂之再检测可能因渗透剂材料造成表面

不连续开口堵塞而导致微细指示能力的丧失。


Light meters, both visible and fluorescent (black) light meters, shall be calibrated at least once a year or when-ever the meter has been repaired. If meters have not been in use for one year or more, calibration shall be done be-

fore being used. 亮度计 [包括可见光和荧光 (黑色 )亮度计] 应至少每年校准一次，或每当修理亮度计时即进

行校准。如亮度计在一年或一年以上未曾采用过，则应在采用前进行校准。


T-671 PENETRANT APPLICATION 施加渗透剂

The penetrant may be applied by any suitable means, such as dipping, brushing, or spraying. If the penetrant is applied by spraying using compressed-air-type apparatus, filters shall be placed on the upstream side near the air inlet to preclude contamination of the penetrant by oil, water, dirt, or sediment that may have collected in the lines.

渗透剂可藉由任何适当方式(诸如浸泡、涂刷或喷涂) 进行施加。如采用压缩空气喷雾型渗透剂装置时，则

应将过滤器放置在靠近压缩空气入口的上游侧，以防止渗透剂可能被聚集在管道中之油、水、污垢或堆积

物所污染。

T-672 PENETRATION (DWELL) TIME 渗透 (滞留 )时间

Penetration (dwell) time is critical. The minimum penetration time shall be as required in Table T-672 or as qualified by demonstration for specific applications. The maximum dwell time shall not exceed 2 hr or as qualified by demonstration for specific applications. Regardless of the length of the dwell time, the penetrant shall not be al-lowed to dry. If for any reason the penetrant does dry, the examination procedure shall be repeated, beginning with

a cleaning of the examination surface. 渗透 (滞留 )时间是至关重要的。最短渗透时间应符合表 T-672之要求

或通过特定应用之演示来予以验证。最长滞留时间不应超过 2小时，或根据特定应用所认可之演示时间；

不管滞留时间如何，都不允许渗透剂在显影前产生干燥现象。不管是任何原因导致渗透剂干燥，则应从检

测表面清理开始重复进行检测程序。

T-673 EXCESS PENETRANT REMOVAL 过量渗透剂之去除

After the specified penetration (dwell) time has elapsed, any penetrant remaining on the surface shall be re-

moved, taking care to minimize removal of penetrant from discontinuities.在所指定之渗透 (滞留 )时间到达之

后，应去除表面上任何剩余的渗透剂，但亦应尽量不要将不连续处之渗透剂给去除掉。

T-673.1 Water-Washable Penetrants. Excess waterwashable penetrant shall be removed with a water spray. The water pressure shall not exceed 50 psi (350 kPa), and the water temperature shall not exceed 110°F

(43°C). 亲水型渗透剂。应用喷水器除去过量之亲水型渗透剂。水压不得超过 50 psi (350 kPa)，水温不得超

过 110°F (43°C)。

T-673.2 Post-Emulsification Penetrants 后乳化型渗透剂

(a) Lipophilic Emulsification. After the required penetrant dwell time, the excess surface penetrant shall be emulsified by immersing or flooding the part with the emulsifier. Emulsification time is dependent on the type of emulsifier and surface condition. The actual emulsification time shall be determined experimentally. After emulsification, the mixture shall be removed by immersing in or rinsing with water. The temperature and pressure

of the water shall be as recommended by the manufacturer. 亲脂型乳化剂。到达所需渗透滞留时间后，过量表

面渗透剂应采用具有乳化剂之溶液来浸泡物项或在物项表面上溢流，以使之产生乳化作用。乳化时间取决

于乳化剂类型和表面状况。实际乳化时间应通过实验确定。乳化后，应浸泡在水中或用水冲洗除去乳化剂

中之混合物。水温度和压力应遵照制造商之建议。

(b) Hydrophilic Emulsification. After the required penetrant dwell time, the parts may be prerinsed with water spray o r d irectly imm ersed or directly immersed or sprayed with an emulsifier–water mixture. A pre-rinse allows removal of excess surface penetrant from examination objects prior to the application of hydrophilic emulsifiers. Hydrophilic emulsifiers work by detergent action. For immersion applications, examination objects must be mechanically moved in the emulsifier bath or the emulsifier must be agitated by air bubbles, so that with either method, the emulsifier comes in contact with the penetrant coating. With immersion, the concentration of the emulsifier– water bath shall be as recommended by the manufacturer. For spray applications, all part surfaces shall be uniformly sprayed with an emulsifier–water mixture. With spray applications, the emulsifier concentration shall be in accordance with the manufacturer’s recommendations, but shall be no greater than 5%. The final step after emulsification is a water immersion or a water spray post-rinse to remove the emulsified penetrant. All dwell times should be kept to a minimum and shall be not more than 2 min unless a longer time is qualified on a specific part. The pressures (water-emulsifier and water spray) and temperatures (water and emulsifier) shall be in accordance

with the requirements for water-washable penetrants. 亲水型乳化剂。达到所需渗透滞留时间后，可用喷水器

预冲洗所述物项，或者直接用乳化剂加水之混合物来进行浸泡或喷洒。预清洗可在正式施加亲水性乳化剂

之前先去除被检测物项表面之过量渗透剂。亲水性乳化剂是通过洗涤剂来产生作用的。用浸泡方式时，被

检测物项须在乳化混合物浴槽中以机械方式进行移动，或者乳化混合物必须运用气泡来进行搅拌，不管采

用任一种方法，乳化剂都与渗透混合物相接触。浸泡时，乳化剂与水之配比浓度应遵照制造商的建议。对

于喷雾应用，所有物项表面应均匀喷洒乳化剂 - 水混合物。用喷洒方式时，乳化剂浓度应符合制造商的建

议，但绝不应大于 5％。乳化后之最后步骤是液浸或用水冲洗以除去已乳化渗透剂。除非在特定物项上有

更长的时间，否则所有滞留时间应保持最短且不应超过 2分钟。压力 (亲水型乳化剂和水喷洒 )和温度 (水

和乳化剂 )应符合亲水型渗透剂之要求。

NOTE: Additional information may be obtained from SE-165.

注：可从 SE-165获得其他之相关信息。

T-673.3 Solvent Removable Penetrants. Excess solvent removable penetrants shall be removed by wip-ing with a cloth or absorbent paper, repeating the operation until most traces of penetrant have been removed. The remaining traces shall be removed by lightly wiping the surface with cloth or absorbent paper moistened with sol-vent. To minimize removal of penetrant from discontinuities, care shall be taken to avoid the use of excess solvent. Flushing the surface with solvent, following the application of the penetrant and prior to developing, is prohibited.

溶剂型渗透剂之去除。应先以布或吸湿纸张擦拭，以除去过量溶剂型渗透剂，并重复操作直到大部分渗透

剂已被移走，所剩余的痕迹再用浸有溶剂的布或吸水纸轻轻擦拭表面来除去。在擦拭过程中，为尽量减少

不连续中之渗透剂亦被清除掉，应注意避免采用过量的溶剂。在施加渗透剂之后和显影之前禁止采用溶剂

冲洗表面。

Table T-672 Minimum Dwell Times 表 T-672 最短滞留时间

Material材料 Form成型方式 Type of Discontinuity

不连续性之类型

Dwell Times [Note (1)], (minutes)

最短滞留时间(见注 1)

Penetrant 渗透时间

Aluminum, magnesium, steel, brass and bronze,

titanium and hightemperature alloys铝、镁、

钢、黄铜、青铜、钛和高温合金

Castings and welds铸件和焊缝

Cold shuts, porosity, lack of fusion,

cracks (all forms) 冷断、气孔、熔

填量不足、裂纹 (所有形式 )

5

Wrought materials — extrusions,

forgings, plate锻造材料 - 挤压

件、锻件、板材

Laps, cracks 折痕、裂纹 10

Carbide-tipped tools硬质合金工具 Brazed or welded钎焊或焊接 Lack of fusion, porosity, cracks熔填量不足、气孔、裂纹

5

Plastic塑料

Glass玻璃

Ceramic陶瓷

All forms所有形式



Cracks裂纹

Cracks裂纹

Cracks裂纹

5 5 5

NOTE:

(1) For temperature range from 50°F to 125°F (10°C to 52°C). For temperatures from 40°F (5°C) up to 50°F (10°C), minimum penetrant

dwell time shall be 2 times the value listed. 适用于 50°F至 125°F (10°C 至 52°C)的温度范围。40°F (5°C)到 50°F (10°C)之温度时，最小

渗透滞留时间应为表列值的 2倍。

T-674 DRYING AFTER EXCESS PENETRANT REMOVAL

除去过量渗透剂之后的干燥作业

(a) For the water washable or post-emulsifying technique, the surfaces may be dried by blotting with clean ma-

terial or by using circulating air, provided the temperature of the surface is not raised above 125°F (52°C). 对亲水

型或后乳化型技术而言，可用清洁的吸水材料吸干；或可藉由循环空气来干燥表面，但前提条件是表面温

度不得超过 125°F (52℃ )。

(b) For the solvent removable technique, the surfaces may be dried by normal evaporation, blotting, wiping, or

forced air. 就溶剂去除型技术而言，可用正常蒸发、吸干、擦拭或强制空气等方法来干燥表面。

T-675 DEVELOPING 显像

The developer shall be applied as soon as possible after penetrant removal; the time interval shall not exceed that established in the procedure. Insufficient coating thickness may not draw the penetrant out of discontinuities;

conversely, excessive coating thickness may mask indications. 在除去渗透剂后，应尽快地施加显影剂，其时间

http://terms.naer.edu.tw/detail/411162/?index=2

间隔不得超过规程中所规定的时间间隔。显影剂涂层厚度不足时，可能无法从不连续中汲出渗透剂，相反

地，过度涂层厚度又可能遮盖掉指示。

With color contrast penetrants, only a wet developer shall be used. With fluorescent penetrants, a wet or dry

developer may be used. 色比渗透剂应仅采用干式显影剂，但采用荧光渗透剂时，则可用干式或干式显影

剂。

T-675.1 Dry Developer Application. Dry developer shall be applied only to a dry surface by a soft brush, hand powder bulb, powder gun, or other means, provided the powder is dusted evenly over the entire surface being

examined. 干式显影剂应用。干式显影剂只能通过软刷、手持喷粉球、粉末枪、或其他可将粉末均匀撒在

整个受检测表面上之方式将粉末施加到干燥表面。

T-675.2 Wet Developer Application. Prior to applying suspension type wet developer to the surface, the

developer must be thoroughly agitated to ensure adequate dispersion of suspended particles.湿式显影剂应用。在

将悬浮型湿显影剂施加到表面之前，须充分搅动显影剂以确保悬浮颗粒能适当地散开。

(a) Aqueous Developer Application. Aqueous developer may be applied to either a wet or dry surface. It shall be applied by dipping, brushing, spraying, or other means, provided a thin coating is obtained over the entire surface being examined. Drying time may be decreased by using warm air, provided the surface temperature of the

part is not raised above 125°F (52°C). Blotting is not permitted. 施加水性显影剂。含水显影剂可以施加到湿式

或干式表面上。它应以浸泡、刷涂、喷涂、或其他可在整个被检测表面上获得薄涂层的方式施加水性显影

剂。如物项表面温度不超过 125°F (52°C )，则可用热空气来减少干燥时间。不允许采用吸干法。

(b) Nonaqueous Developer Application. Nonaqueous developers shall be applied by spraying, except where safety or restricted access preclude it. Under such conditions, developer may be applied by brushing. For wa-terwashable or post-emulsifiable penetrants, the developer shall be applied to a dry surface. For solvent removable penetrants, the developer may be applied as soon as practical after excess penetrant removal. Drying shall be by

normal evaporation. 施加非水性显影剂。非水性显影剂应通过喷洒施用，除非在安全或可接性受限制而受到

妨碍之条件下，方可以采用刷涂方式来施加显影剂；至于水洗型或后乳化渗透剂，显影剂应施用于干燥表

面。对于溶剂型渗透剂，显影剂可在过量渗透剂除去后尽快施用，并应以正常蒸发方式进行干燥。

T-675.3 Developing Time. Developing time for final interpretation begins immediately after the applica-

tion of a dry developer or as soon as a wet developer coating is dry. 最终解释之显影时间在施加干式显影剂之后

或一旦湿式显影剂涂层干燥后即开始计算。

T-676 INTERPRETATION 解释

T-676.1 Final Interpretation. Final interpretation shall be made not less than 10 min nor more than 60 min after the requirements of T-675.3 are satisfied. If bleed-out does not alter the examination results, longer periods are permitted. If the surface to be examined is large enough to preclude complete examination within the prescribed or

established time, the examination shall be performed in increments. 最终解释。应在满足 T-675.3要求后，在 10

至 60分钟之范围内完成最终解释。如渗出过程不会改变检测结果，则允许有更长的最终解释时间。如所要

检测之表面太大，以致无法在规定或鉴定之时间内完全检测时，则应将表面分成几个区段，以逐次进行各

分段之检测。

T-676.2 Characterizing Indication(s). The type of discontinuities are difficult to evaluate if the penetrant diffuses excessively into the developer. If this condition occurs, close observation of the formation of indication(s)

during application of the developer may assist in characterizing and determining the extent of the indication(s). 特

征指示。如果渗透剂过度扩散到显影剂中，则不连续性的类型难以评估。如果发生这种情况，在施加显影

剂期间密切观察指示的形成过程以助于判定指示的特征和其程度。

T-676.3 Color Contrast Penetrants. With a color contrast penetrant, the developer forms a reasonably uniform white coating. Surface discontinuities are indicated by bleed-out of the penetrant which is normally a deep red color that stains the developer. Indications with a light pink color may indicate excessive cleaning. Inadequate cleaning may leave an excessive background making interpretation difficult. Illumination (natural or supplemental white light) of the examination surface is required for the evaluation of indications. The minimum light intensity shall be 100 fc (1 000 lx). The light intensity, natural or supplemental white light source, shall be measured with a

white light meter prior to the evaluation of indications or a verified light source shall be used. Verification of light

sources is required to be demonstrated only one time, documented, and maintained on file. 色比渗透剂。当采用

色比渗透剂时，显影剂应形成相当均匀的白色涂层；表面不连续性由汲出之渗透剂来表示，渗透剂通常是

深红色，其可在显影剂中产生着色效应，如指示呈淡粉红色，这可能表示清洗过度。清洗不足时，则可能

留下太深的物项底色，致使解释难以进行。为对指示进行评估，被检测表面应至少有 100 fc (1000 lx )之照

明 (自然或辅助白光 )强度。在评估指示之前应采用白光计对光强度(自然或辅助白光源)进行测量或采用经

验证过之光源。需演示时，才要进行一次光源验证，且验证文件应存盘保存。

T-676.4 Fluorescent Penetrants. With fluorescent penetrants, the process is essentially the same as in T-676.3, with the exception that the examination is performed using an ultraviolet light, called black light. The exami-

nation shall be performed as follows: 荧光渗透剂。荧光渗透剂之检测过程，除需采用称为黑光灯进行检测

外，否则在基本上是与 T-676.3相同的。检测应按如下进行：

(a) It shall be performed in a darkened area. 应在黑暗处进行。

(b) Examiners shall be in a darkened area for at least 5 min prior to performing examinations to enable

their eyes to adapt to dark viewing. Glasses or lenses worn by examiners shall not be photosensitive. 检测人员在

进行检测前应至少在黑暗处逗留 5分钟，以使其眼睛适应在黑暗环境中进行观察。检测人员所佩戴眼镜或

镜片不应具有光致变色之特性。

(c ) Black lights shall achieve a minimum of 1000 μW/cm2 on the surface of the part being examined

throughout the examination. 在整个检测过程中，黑光灯在被测检测物项之表面上最小需达到 1000 μW/cm2。

(d) Reflectors and filters should be checked and, if necessary, cleaned prior to use. Cracked or broken

filters shall be replaced immediately. 如有必要时，反射器和过滤器在采用前应进行校对并清洁之。有裂纹或

破裂之过滤器应立即更换。

(e ) The black light intensity shall be measured with a black light meter prior to use, whenever the light’s power source is interrupted or changed, and at the completion of the examination or series of examinations.

黑光灯应在采用前、在光源电源中断或改变时，以及在完成检测或系列检测时，都应用黑光计进行强度测

量。

T-677 POST-EXAMINATION CLEANING 检测后之清洁


Evaluation and Documentation using a process that does not adversely affect the part. 当规程要求检测后需进行

清洁时，应在完成评估和记录后尽快采用不会对物项造成不利影响的方法进行。


(a) All indications shall be evaluated in terms of the acceptance standards of the referencing Code Section.

所有指示应根据引用规范章节之接受标准则进行评估。

(b) Discontinuities at the surface will be indicated by bleed-out of penetrant; however, localized surface

irregularities due to machining marks or other surface conditions may produce false indications. 表面不连续性由

汲出之渗透剂来表示，然而，由于加工痕迹或其它表面条件所导致之局部表面不规则性有可能产生错误指

示。

(c ) Broad areas of fluorescence or pigmentation which could mask indications of discontinuities are unac-

ceptable, and such areas shall be cleaned and reexamined. 可能对不连续性指示产生遮盖效应之大面积荧光或

色素淀积是不可接受的，这些区域应予以清洁并重新检测。


T-691 RECORDING OF INDICATIONS 指示纪录

T-691.1 Nonrejectable Indications. Nonrejectable indications shall be recorded as specified by the refer-

encing Code Section. 指示记录 T-691.1不可拒收指示。不可拒收指示应按照引用规范章节的规定进行记

录。T-691.2。

T-691.2 Rejectable Indications. Rejectable indications shall be recorded. As a minimum, the type of indi-

cations (linear or rounded), location and extent (length or diameter or aligned) shall be recorded. 可拒收指示。可

拒收指示应至少记录指示之类型 (线性或圆形)、位置和范围 (长度或直径或线型指示)

T-692 EXAMINATION RECORDS 检测记录 For each examination, the following information shall be recorded: 每次检测应记录以下信息：

(a) the requirements of Article 1, T-190(a); 第 1章 T-190 (a)之要求；

(b) liquid penetrant type (visible or fluorescent); 渗透剂类型 (可见或荧光)； (c) (d)根据 T-691所绘

制分布图或记录；

(c ) type (number or letter designation) of each penetrant, penetrant remover, emulsifier, and developer

used; 每种渗透剂、渗透剂去除剂、乳化剂和所用显影剂的类型 (数字或字母名称)；

(d) map or record of indications per T-691;

(e ) material and thickness, and; 材料和厚度，和；

(f) lighting equipment. 照明设施。

MANDATORY APPENDIX I GLOSSARY OF TERMS FOR

LIQUID PENETRANT EXAMINATION 强制性附录 I 液体渗透检查术语汇编

Deleted; terms and definitions in this Appendix have been incorporated into Article 1, Mandatory Ap-

pendix I, I-121.3. 已删除；术语和定义已纳入第 1章，强制性附录 I，I-121.3中。

MANDATORY APPENDIX II CONTROL OF CONTAMI-

NANTS FOR LIQUID PENETRANT EXAMINATION 强制性附录 II 液渗透检测之污染元素控制


This Appendix contains requirements for the control of contaminant content for all liquid penetrant materials

used on nickel base alloys, austenitic stainless steels, and titanium. 本附录对镍基合金、奥氏体不锈钢和钛所采

用之所有液体渗透剂材料之污染元素含量提供了相关控制要求。

II-640 REQUIREMENTS 要求项目

II-641 NICKEL BASE ALLOYS 镍基合金

When examining nickel base alloys, all penetrant materials shall be analyzed individually for sulfur content in accordance with SE-165, Annex 4. Alternatively, the material may be decomposed in accordance with SD-129 and

analyzed in accordance with SD-516. The sulfur content shall not exceed 1% by weight. 当对镍基合金进行检测

时，所有渗透剂材料应按附录 4之 SE-165个别针对硫含量进行分析其；亦可按 SD-129先将材料予以分

解，再遵照 SD-516进行分析。硫含量不应超过重量的 1％。

II-642 AUSTENITIC OR DUPLEX STAINLESS STEEL AND TITANIUM

奥氏体、双相不锈钢或钛

When examining austenitic or duplex stainless steel and titanium, all penetrant materials shall be analyzed indi-vidually for halogens content in accordance with SE-165, Annex 4. Alternatively, the material may be decomposed and analyzed in accordance with SD-808 or SE-165, Annex 2 for chlorine and SE-165, Annex 3 for fluorine. The

total halogens content shall not exceed 1% by weight. 当对奥氏体、双相不锈钢或钛进行检测时，所有渗透剂

材料应按附录 4之 SE-165个别针对卤素含量进行分析；材料亦可按 SD-808 来进行分解和分析；而 SE-165

之附件 2和 SE-165之附件 3可用于氟含量之分析上。总卤素含量不应超过重量的 1％。

II-690 DOCUMENTATION 文件

Certifications obtained on penetrant materials shall include the penetrant manufacturers’ batch numbers and the test results obtained in accordance with II-640. These records shall be maintained as required by the referencing

Code Section. 渗透材料所取得之证书，其内容应包括渗透剂制造商之批号和根据 II-640所获得之试验结

果。这些记录应按引用规范章节之要求进行归档与保存。

MANDATORY APPENDIX III QUALIFICATION TECH-

NIQUES FOR EXAMINATIONS AT NONSTANDARD TEM-

PERATURES 强制性附录 III 非标准温度下所认可之检测技术


When a liquid penetrant examination cannot be conducted within the standard temperature range of 40°F to

125°F (5°C to 52°C), the temperature of the examination shall be qualified in accordance with this Appendix. 当液

渗透检测不在 40°F至 125°F (5°C至 52°C)之标准温度范围内进行时，则实际检测温度范围应按本附录进行

鉴定。

III-630 MATERIALS 材料

A liquid penetrant comparator block shall be made as follows. The liquid penetrant comparator blocks shall be made of aluminum, ASTM B209, Type 2024, 3/8 in. (9.5 mm) thick, and should have approximate face dimensions of 2 in. × 3 in. (50 mm × 75 mm). At the center of each face, an area approximately 1 in. (25 mm) in diameter shall be marked with a 950°F (510°C) temperature indicating crayon or paint. The marked area shall be heated with a blowtorch, a Bunsen burner, or similar device to a temperature between 950°F (510°C) and 975°F (524°C). The specimen shall then be immediately quenched in cold water, which produces a network of fine cracks on each face.

液渗透比较规块应如下制备：液渗透比较规块应由ASTM B209，2024型铝合金所制成，其厚度为 3/8 in.

(9.5 mm)，且表面尺寸应近似于 2 in. × 3 in. (50 mm × 75 mm)。在每一面之中心处，以标示 950°F (510℃)之

测温笔或温度指示剂标记出约 1 in. (25 mm)直径的区域，采用喷灯、本生灯或类似装置将该标记区域加热

到 950°F 950°F (510°C)和 975°F (524°C)之间，然后立即将该试样放入冷水中骤冷，以使每一面上均产生网

状细裂纹。

The block shall then be dried by heating to approximately 300°F (149°C). After cooling, the block shall be cut in half. One-half of the specimen shall be designated block “A” and the other block “B” for identification in subse-quent processing. Figure III-630 illustrates the comparator blocks “A” and “B.” As an alternate to cutting the block in half to make blocks “A” and “B,” separate blocks 2 in. × 3 in. (50 mm × 75 mm) can be made using the heating and quenching technique as described above. Two comparator blocks with closely matched crack patterns may be

used. The blocks shall be marked “A” and “B.” range. The indications of cracks shall be compared between blocks “A” and “B.” If the indications obtained under the proposed conditions on block “B” are essentially the same as ob-tained on block “A” during examination at 40°F to 125°F (5°C to 52°C), the proposed procedure shall be consid-ered qualified for use. A procedure qualified at a temperature lower than 40°F (5°C) shall be qualified from that

temperature to 40°F (5°C). 然后再将该试样加热至约 300°F (149℃)附近进行干燥，待冷却后，将该试样切

成两半；为在往后操作上便于区别，如图 III-630之说明将其中一半标记为“A”块，而另一半则标记为

“B”块。；另一种法是先将上述试样切成两半并分别标记为A和“B”块，然后再依上述程序(加热和骤

冷)制作出对称网状细裂纹。如在拟定温度条件下之让“B”块之指示与“A”块在 40°F至 125°F (5°C至

52°C)试验期间所获得之指示结果在本质上是相一致的话，则该拟定规程应被视为是具有采用认可资格；以

低于 40°F (5°C)之认可规程即具有该温度至 40°F (5°C)的采用资格。

III-640 REQUIREMENTS 要求事项

III-641 COMPARATOR APPLICATION 比较规块应用

III-641.1 Temperature Less Than 40°F (5°C). If it is desired to qualify a liquid penetrant examination pro-cedure at a temperature of less than 40°F (5°C), the proposed procedure shall be applied to block “B” after the block and all materials have been cooled and held at the proposed examination temperature until the comparison is com-pleted. A standard procedure which has previously been demonstrated as suitable for use shall be applied toblock “A” in the 40°F to 125°F (5°C to 52°C) temperature range. The indications of cracks shall be compared between blocks “A” and “B.” If the indications obtained under the proposed conditions on block “B” are essentially the same as obtained on block “A” during examination at 40°F to 125°F (5°C to 52°C), the proposed procedure shall be con-sidered qualified for use. A procedure qualified at a temperature lower than 40°F (5°C) shall be qualified from that

temperature to 40°F (5°C). 温度低于 40°F (5°C)时。如渗透检测规程期望能在低于 40°F (5°C)的温度下被认

可，则要等到“B”块和所有材料已经冷却并保持在所提出之拟用检测温度直到比对完成。先前已经证明

适用于在 40°F至 125°F (5°C至 52°C)标准规程之温度范围应用于“A”块。如“B”块在所拟议温度之条

件下能与“A”块在 40°F至 125°F (5°C至 52°C)试验期间所获得之指示结果在本质上是相一致的话，则该

拟定规程应被视为是具有采用认可资格的；以低于 40°F (5°C)之认可规程即具有该温度至 40°F (5°C)的采

用资格。

III-641.2 Temperature Greater Than 125°F (52°C). If the proposed temperature for the examination is above 125°F (52°C), block “B” shall be held at this temperature throughout the examination. The indications of cracks shall be compared as described in III-641.1 while block “B” is at the proposed temperature and block “A” is

at the 40°F to 125°F (5°C to 52°C) temperature range. 温度高于 125°F (52°C)时。如拟议检测温度高于 125°F

(52°C)时，则在整个检测过程中“B”块应保持在该温度。应如 III-641.1所述应将处于拟议温度之“B”块

与处于 40°F至 125°F (5°C至 52°C) 之“A”块进行裂纹指示比对。

To qualify a procedure for temperatures above 125°F (52°C), the upper and lower temperature limits shall be established and the procedure qualified at these temperatures. [As an example, to qualify a procedure for the tem-

perature range 126°F (52°C) to 200°F (93°C)?, the capability of a penetrant to reveal indications on the comparator

shall be demonstrated at both temperatures.] 为使温度高于 125°F (52°C)之规程被认可，因此应拟定上限和下

限温度，并在这些温度下鉴定合格。 [例如，对 125°F (52°C)至 200°F (93°C)温度范围内之规程进行鉴定

时，应分别在 126°F (52°C)和 200°F (93°C)下确定渗透剂在比较规块上显示指示的能力。

Figure III-630 Liquid Penetrant Comparator

图 III-630 液体渗透剂比较规块

GENERAL NOTE: Dimensions given are for guidance only and are not critical. 通注：给定尺

寸仅供参考，并非关键值。

III-641.3 Alternate Techniques for Color Contrast Penetrants. As an alternate to the requirements of III-641.1 and III-641.2, when using color contrast penetrants, it is permissible to use a single comparator block for the

standard and nonstandard temperatures and to make the comparison by photography. 色比渗透剂之另一种技

术。当采用色比渗透剂时，允许在标准和非标准温度下采用单个比较规块，且通过照相术所进行之比对技

术可作为 III-641.1和 III-641.2要求之替代技术。

(a) When the single comparator block and photographic technique is used, the processing details (as applicable) described in III-641.1 and III-641.2 apply. The block shall be thoroughly cleaned between the two pro-cessing steps. Photographs shall be taken after processing at the nonstandard temperature and then after processing at the standard temperature. The indication of cracks shall be compared between the two photographs. The same

criteria for qualification as III-641.1 shall apply. 当采用单个比较规块和照相术时，在适用情状下，则可采用

III-641.1和 III-641.2中所述之处理细节。在两次处理步骤之间，应将规块彻底清理干净。先对非标准温度

下所处理之结果进行照片，然后在将标准温度下所处理之结果进行照片，且两张照片间之裂纹迹象应按 III-

641.1 鉴定准则进行比对。

(b) Identical photographic techniques shall be used to make the comparison photographs. 制作比对照

片石应采用相同的照相术。

Scribe line

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Article 7 Magnetic Particle Examination 第 7章磁粉检测

T-710 SCOPE 适用范围当

When specified by the referencing Code Section, the magnetic particle examination techniques described in this Article shall be used. In general, this Article is in conformance with SE-709, Standard Guide for Magnetic Par-

ticle Examination. This document provides details to be considered in the procedures used. 引用规范章节作出磁

粉检测要求时，则应使用本章所述之磁粉检测技术。概言之，本章符合 SE-709磁粉检测标准指南。本文件

对所采用规程提供了所需顾及之细节。

When this Article is specified by a referencing Code Section, the magnetic particle method described in this Article shall be used together with Article 1, General Requirements. Definition of terms used in this Article are in

Article 1, Mandatory Appendix I, I-121.4, MT — Magnetic Particle Examination. 当本章由引用规范章节所指定

时，在本章中所描述之磁粉检测方法应与第 1章中之总则一起并用；在本章中所采用之术语被定义在第 1

章，强制性附录 I里的 I-121.4段落中(MT-磁粉检测)。

T-720 GENERAL 总则

The magnetic particle examination method is applied to detect cracks and other discontinuities on the surfaces of ferromagnetic materials. The sensitivity is greatest for surface discontinuities and diminishes rapidly with in-creasing depth of discontinuities below the surface. Typical types of discontinuities that can be detected by this

methods are cracks, laps, seams, cold shuts, laminations. 磁粉检测方法可用于检测磁型材料表面和近表面之裂

纹和替代不连续性，其灵敏度对表面上上之不连续性最大，并随着不连续性具表面间之距离的增加而相对

减弱。可用此方法可判定不连续之典型类型是龟裂、搭接、裂缝，以及轧机所引起之折痕/冷接纹封还是夹

层。

In principle, this method involves magnetizing an area to be examined, and applying ferromagnetic particles (the examination’s medium) to the surface. Particle patterns form on the surface where the magnetic field is forced out of the part and over discontinuities to cause a leakage field that attracts the particles. Particle patterns are usually

characteristic of the type of discontinuity that is detected. 就一般而言，本方法所涉及之范围包括了磁化受检

测区域，并且将铁铁粉(检测介质)施加到表面，由于在不连续处之磁场将在物项中形成漏磁效应，因此可

在表面上形成不连续性之铁粉图案。铁粉图案通常代表着所检测到之不连续性类型的特征。

Whichever technique is used to produce the magnetic flux in the part, maximum sensitivity will be to linear discontinuities oriented perpendicular to the lines of flux. For optimum effectiveness in detecting all types of dis-continuities, each area is to be examined at least twice, with the lines of flux during one examination being approxi-

mately perpendicular to the lines of flux during the other. 无论是采用哪种技术都是能在物项中产生磁通，对

取向垂直于磁力线之线型不连续性将会获得最大灵敏度。为使所有类型之不连续性获得最佳检测结果，因

此对每一受检区域至少要检测两次，在一次检测期间之两检测取向的磁力线应大致垂直。

T-721 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

T-721.1 Requirements. Magnetic particle examination shall be performed in accordance with a written procedure, which shall, as a minimum, contain the requirements listed in Table T-721. The written procedure shall

establish a single value, or range of values, for each requirement. 规程鉴定。当引用规范章节对书面规程要求

须进行鉴定，且在表 T-721中所列之重要变量确定被更改时，则需通过演示以重新认可书面规程，在书面

规程中被列为非重要变量，若有所更动是不需重新被认可的。对书面书面规程中所规定之重要或非重要变

量的所有更改都应要求对书面程序进行修订或补遗。

T-721.2 Procedure Qualification. When procedure qualification is specified by the referencing Code Sec-tion, a change of a requirement in Table T-721 identified as an essential variable shall require requalification of the

written procedure by demonstration. A change of a requirement identified as a nonessential variable does not re-quire requalification of the written procedure. All changes of essential or nonessential variables from those specified

within the written procedure shall require revision of, or an addendum to, the written procedure. 规程鉴定。当引

用规范章节要求规程鉴定，且表 T-721中之重要变量有所改变时，应通过演示以重新鉴定书面规程。非重

要变量上的改变，书面规程是不需重新鉴定的。所有重要或非重要变量若有所变更时，书面规程都应进行

修订或补遗。


A suitable and appropriate means for producing the necessary magnetic flux in the part shall be employed,

using one or more of the techniques listed in and described in T-750. 能在物项中产生所需磁通之适宜专用装

置，应采用在 T-750中所列出和描述之一种或多种技术。

T-731 EXAMINATION MEDIUM 检测介质

The finely divided ferromagnetic ferrous particles used for the examination shall meet the following require-

ments. 用于鉴测之亚铁粉粒应满足以下要求。

(a) Particle Types. The particles shall be treated to impart color (fluorescent pigments, nonfluorescent pigments, or both) in order to make them highly visible (contrasting) against the background of the surface being

examined. 粉粒类型。为使被检测表面物项底色具有高反差(对比)，粉粒应进行颜色处理(荧光颜料，非荧

光颜料或两者)。

(b) Particles. Dry and wet particles and suspension vehicles should be in accordance with SE-709. 磁

粉。干湿磁粉和悬浮载体应符合 SE-709之规定。

(c) Temperature Limitations. Particles shall be used within the temperature range limitations set by the manufacturer of the particles. Alternatively, particles may be used outside the particle manufacturer’s recommenda-

tions providing the procedure is qualified in accordance with Article 1, T-150 at the proposed temperature. 温度限

制。磁粉应在粉粒制造商所设定之温度限度内使用，或只要在所提出之温度下能按第 1章 T-150进行鉴定

合格，磁粉检测即可在粉粒制造商所建议之温度限度外使用。


T-741 SURFACE CONDITIONING 表面处理

T-741.1 Preparation. 表面制备

(a) Satisfactory results are usually obtained when the surfaces are in the as-welded, as-rolled, as-cast, or as-forged conditions. However, surface preparation by grinding or machining may be necessary where sur-

face irregularities could mask indications due to discontinuities. 当表面处于焊态、轧制状态、铸态或锻造状态

时，通常都能获得满意的结果。然而，若因表面不规则性会对不连续性指示造成遮盖，则表面通过研磨或

机械加工制备是有其必要性的。

(b) Prior to magnetic particle examination, the surface to be examined and all adjacent areas within at least 1 in. (25 mm) shall be dry and free of all dirt, grease, lint, scale, welding flux and spatter, oil, or other extra-

neous matter that could interfere with the examination. 在进行磁粉检测之前，对待检测表面和所有相邻区域

(至少 1英寸(25毫米))应进行检查，以确定是干燥的、无任何污垢、油脂、棉绒、锈皮、焊剂和焊接飞

溅物、油，或替代会干扰检测的外来物质。

(c) Cleaning may be accomplished using detergents, organic solvents, descaling solutions, paint re-

movers, vapor degreasing, sand or grit blasting, or ultrasonic cleaning methods. 清洁可透过清洗剂、有机溶剂、

除莠剂、去漆剂、蒸气脱脂、喷砂或超声波清洗方法来完成。

(d) If nonmagnetic coatings are left on the part in the area being examined, it shall be demonstrated that indications can be detected through the existing maximum coating thickness applied. When AC yoke technique

is used, the demonstration shall be in accordance with Mandatory Appendix I of this Article. 如果在被检测区域

之物项上留有非磁性涂层，应证实现有涂层中的最大厚度可被检测。使用交流磁轭技术时，其演示应符合

本章附录 I 之要求。

Table T-721 Requirements of a Magnetic Particle Examination Procedure

表 T-721 磁粉检测规程之要求

Requirement 必要条件 Essential Variable

重要变量

Nonessential Varia-

ble非重要变量

Magnetizing technique磁化技术 X …

Magnetizing current type or amperage outside range specified by this Article or as pre-

viously qualified超出本章规定或以前所鉴定认可范围之励磁电流类型或安培数 X …

Surface preparation表面处理方式 X …

Magnetic particles (fluorescent/visible, color, particle size, wet/dry) 磁粉(荧光/色差、

颜色、粒度、湿/干) X …

Method of particle application磁粉之施加方法 X …

Method of excess particle removal过量磁粉之去除方法 X …

Minimum light intensity，最低照明强度 X …

Existing coatings, greater than the thickness demonstrated使用非磁性表面对比度增

强剂时 X …

Nonmagnetic surface contrast enhancement, when utilized 现有涂层大于演示厚度 X …

Performance demonstration, when required技能演示(需要时) X …

Examination part surface temperature outside of the temperature range recommended

by the manufacturer of the particles or as previously qualified检测物项表面温度在

制造商所推荐之磁粉温度范围之外或先前所鉴定认可之外

X …

Shape or size of the examination object 检测物项之形状或大小 … X

Equipment of the same type相同类型之设备 … X

Temperature (within those specified by manufacturer or as previously qualified) 温度(制造商指定或先前所鉴定认可之限定温度范围内)

… X

Demagnetizing technique消磁技术 … X

Post-examination cleaning technique检测后之清洁技术 … X

Personnel qualification requirements 人员资格要求 … X

T-741.2 Nonmagnetic Surface Contrast Enhancement. Nonmagnetic surface contrasts may be applied by the examiner to uncoated surfaces, only in amounts sufficient to enhance particle contrast. When nonmagnetic surface contrast enhancement is used, it shall be demonstrated that indications can be detected through the enhance-

men t. Thickness measurement of this nonmagnetic surface contrast enhancement is not required. 非磁性表面对

比度增强剂。非磁性表面对比度增强剂可由检测者施加到无涂层之表面上，其施加量足以提高磁粉对比度

即可。当使用非磁性表面对比度增强剂时，应证明检测可通过增强剂，以显示具有实质检测能力。对非磁

性表面对比度增强剂之厚度不需进行测定。

NOTE: Refer to T-150(a) for guidance for the demonstration required in T-741.1(d) and T-741.2.

注：有关 T-741.1(d)和 T-741.2中所要求之演示指南，可见 T-150(a)。

T-750 TECHNIQUE 技术


One or more of the following five magnetization techniques shall be used: 应采用下列五种磁化技术中的

一种或多种：

(a) prod technique 触极技术

(b) longitudinal magnetization technique 纵向磁化技术

(c) circular magnetization technique 环向磁化技术

(d) yoke technique 磁轭技术

(e) multidirectional magnetization technique 多向磁化技术

T-752 PROD TECHNIQUE 触极技术

T-752.1 Magnetizing Procedure. For the prod technique, magnetization is accomplished by portable prod type electrical contacts pressed against the surface in the area to be examined. To avoid arcing, a remote control switch, which may be built into the prod handles, shall be provided to permit the current to be applied after the

prods have been properly positioned. 磁化规程。触极技术可用携带式触极压在待检测区域上之表面来实现磁

化。为避免产生电弧，所采用之触极设备应配备一个内置在制动手柄中之远程控制开关，以便触极在正确

定位后才启动磁化电流。

T-752.2 Magnetizing Current. Direct or rectified magnetizing current shall be used. The current shall be 100 (minimum) amp/in. (4 am p/mm ) to 125 (maximum) amp/in. (5 amp/mm) of prod spacing for sections 3/4 in. (19 mm) thick or greater. For sections less than 3/4 in. (19 mm) thick, the current shall be 90 amp/in. (3.6 amp/mm)

to 110 amp/in. (4.4 amp/mm) of prod spacing. 磁化电流。应采用直流或整流磁化电流。截面厚度 ≧ 3/4 in.

(19 mm) 时，触极之每单位间隔(in. 或 mm)之电流应在 100 amp/in. (4 amp/mm)至 125 amp/in. (5 amp/mm) 之

间。截面厚度小 3/4 in. (19 mm) 时，触极之每单位间隔(in. 或 mm)之电流应在 90 amp/in. (3.6 amp/mm)至

110 amp/in. (4.4 amp/mm)之间。

T-752.3 Prod Spacing. Prod spacing shall not exceed 8 in. (200 mm). Shorter spacing may be used to ac-commodate the geometric limitations of the area being examined or to increase the sensitivity, but prod spacings of less than 3 in. (75 mm) are usually not practical due to banding of the particles around the prods. The prod tips shall be kept clean and dressed. If the open circuit voltage of the magnetizing current source is greater than 25 V, lead, steel, or aluminum (rather than copper) tipped prods are recommended to avoid copper deposits on the part being

examined. 触极间距。触极间距不应超过 8 in. (200 mm)。可用较小间距来适应被检测区域知几何限制或提

高灵敏度，但因触极之磁束带因素，所以触极间隔小于 3 in. (75 mm)时，通常是无法实践的。触极端应保

持清洁和光滑。若磁化电源电压大于 25V，则推荐使用铅、钢或铝等所制成之尖形触极，为避免在接触表

面上造成铜的堆积物，不应采用铜基材料所制成之触极。

T-753 LONGITUDINAL MAGNETIZATION TECHNIQUE 纵向磁化技术

T-753.1 Magnetizing Procedure. For this technique, magnetization is accomplished by passing current through a multi-turn fixed coil (or cables) that is wrapped around the part or section of the part to be examined. This

produces a longitudinal magnetic field parallel to the axis of the coil. 磁化方法。本技术是将电流通过缠绕在待

检测物项之部分或部分周围的多匝固定式预制线圈(或多个电缆)来实现磁化的，此种做法可在平行于线圈

轴方向上产生纵向磁场。

If a fixed, prewound coil is used, the part shall be placed near the side of the coil during inspection. This

is of special importance when the coil opening is more than 10 times the cross-sectional area of the part. 若采使固

定预缠绕线圈，则在检测期间，该物项应放置在线圈侧面附近，且当线圈开口大于物项横截面积的 10倍时

尤其重要的。

T-753.2 Magnetic Field Strength. Direct or rectified current shall be used to magnetize parts examined by this technique. The required field strength shall be calculated based on the length L and the diameter D of the part in accordance with (a) and (b), or as established in (d) and (e), below. Long parts shall be examined in sections not to exceed 18 in. (450 mm), and 18 in. (450 mm) shall be used for the part L in calculating the required field strength.

For noncylindrical parts, D shall be the maximum cross-sectional diagonal. 场强。由此技术所检测知物项应采

直流或整流电流来进行磁化。所需磁场场强应根据(a)和(b)之长度 L和直径D计算，或根据下列(d)和(e)来

确定。长的物项应以检测间隔不超过 18 in. (450 mm) 来进行检测，在计算所需磁场场强时应使用 18 in. (450

mm) 来作为长度 L之基准；至于非圆柱形部分，D应为最大横截面对角线。

(a) Parts With L/D Ratios Equal to or Greater Than 4 . The magnetizing current shall be within 10% of

the ampere-turns’ value determined as follows: 物项之 L/D 比值 ≧ 4时，励磁电流应在如下所确定之安匝数

的 10％范围内：

Amper-turns 安匝数 = 35,000 [(𝐿 𝐷⁄ ) + 2]⁄

For example, a part 10 in. (250 mm) long × 2 in. (50 mm) diameter has an L /D ratio of 5. There-

fore, 例如，工作长度 10 in. (250 mm)长 × 2 in. (50 mm)直径，其 L / D 比为 5，因此，

35,000 [(𝐿 𝐷⁄ ) + 2]⁄ = 5000 Amper-turns安匝数

(b) Parts With L/D Ratios Less Than 4 but Not Less Than 2 . The magnetizing ampere-turns shall be

within 10% of the ampere-turns’ value determined as follows: L / D 比小于 4但不小于 2之物项，其磁化电流

匝数应如下所确定之安匝数的 10％范围内：

Amper-turns 安匝数 = 45,000 (𝐿 𝐷⁄ )⁄

(c) Parts With L/D Ratios Less Than 2. Coil magnetization technique cannot be used. L / D 比小于 2

之物项，则不能使用线圈磁化技术。

(d) If the area to be magnetized extends beyond 9 in. (225 mm) on either side of the coil’s center, field

adequacy shall be demonstrated using a magnetic field indicator or artificial flaw shims per T-764. 如果所要磁化

之区域在线圈中心的任一侧上延伸超过 9 in. (225 mm)，则应按 T-764采用磁场指示器或具有手动伤之试片

来证明场强的充足性。

(e) For large parts due to size and shape, the magnetizing current shall be 1200 ampere-turns to 4500 ampere-turns. The field adequacy shall be demonstrated using artificial flaw shims or a pie-shaped magnetic field indicator in accordance with T-764. A Hall-Effect probe gaussmeter shall not be used with encircling coil magneti-

zation techniques. 对于大型物项，因其尺寸和状形因素，致使励磁电流应在 1200安培匝至 4500 安培匝

间。磁场充足性应采用具有手动伤之试片或按 T-764采用饼式磁场指示器来进行鉴定。霍尔效应高斯探头

不应与环形线圈磁化技术一起使用。

T-753.3 Magnetizing Current. The current required to obtain the necessary magnetizing field strength shall be determined by dividing the ampere-turns obtained in steps T-753.2(a) or T-753.2(b) by the number of turns

in the coil as follows: 磁化电流。为获得必要磁化场强所需之电流应通过步骤 T-753.2(a)或 T-753.2(b)中获

得的安匝数除以如下线圈匝数来确定：

Amper (meter reading) = Amper – turns/turns 安培(表读数)= 安培 - 匝数/圈

For example, if a 5-turn coil is used and the ampere-turns required are 5000, use 例如，如果使用 5

匝数之线圈并且所需的安培圈为 5000时，应使用

(5000/5) = 1000 ampers 安培 (± 10%)

T-754 CIRCULAR MAGNETIZATION TECHNIQUE 环向磁化技术

T-754.1 Direct Contact Technique 直接接触技术

(a) Magnetizing Procedure. For this technique, magnetization is accomplished by passing current through the part to be examined. This produces a circular magnetic field that is approximately perpendicular to the

direction of current flow in the part. 磁化方法。本技术是将电流通过待检测物项，且在大致垂直于电流方向

实现环向磁场的一种技术。

(b) Magnetizing Current. Direct or rectified (half-wave rectified or full-wave rectified) magnetizing

current shall be used. 磁化电流。应使用直流或整流(半波整流或全波整流)励磁电流。

(1) The current shall be 300 amp/in. (12 A/mm) to 800 amp/in. (31 A/mm) of outer diameter. 电

流/外径比应在 300 amp/in. (12 A/mm)至 800 amp/in. (31 A/mm)之间。

(2) Parts with geometric shapes other than round with the greatest cross-sectional diagonal in a

plane at right angles to the current flow shall determine the inches to be used in (1) above. 非圆形几何形状物项

应以垂直于电流方向之平面中具有最大横截面的对角线来确定上述(1)中采用之外径尺寸。

(3) If the current levels required for (1) cannot be obtained, the maximum current obtainable shall

be used and the field adequacy shall be demonstrated in accordance with T-764. 若无法获得(1)所需的电流水

平，应对可达到之采用最大电流按 T-764进行演示以证实该电流具备有所需磁场充分性。

T-754.2 Central Conductor Technique. 中心导体技术

(a) Magnetizing Procedure. For this technique, a central conductor is used to examine the internal sur-faces of cylindrically or ring-shaped parts. The central conductor technique may also be used for examining the out-side surfaces of these shapes. Where large diameter cylinders are to be examined, the conductor shall be positioned close to the internal surface of the cylinder. When the conductor is not centered, the circumference of the cylinder shall be examined in increments. Field strength measurements in accordance with T-764 shall be used, to determine the extent of the arc that may be examined for each conductor position or the rules in (c) below may be followed.

Bars or cables, passed through the bore of a cylinder, may be used to induce circular magnetization. 磁化方法。

此种技术是利用中心导体来检测空心圆柱形或环形物项的内表面。中心导体技术亦可用于检测这些形状的

外表面。在检测大直径空心圆柱时，导体应放置在靠空心圆柱的内表面。当导体不居中时，应对圆柱体之

整个圆周逐步进行检测。应采用 T-764之磁场指示器进行测定，以确定在每一导体位置所能检测的弧长范

围，或者采用如下(c)之规则，用棒或电缆通过圆柱体内孔，以感应的方法产生环向磁化强度。

(b) Magnetizing Current. The field strength required shall be equal to that determined in T-754.1(b) for a single-turn central conductor. The magnetic field will increase in proportion to the number of times the central conductor cable passes through a hollow part. For example, if 6000 amperes are required to examine a part using a single pass central conductor, then 3000 amperes are required when 2 passes of the through-cable are used, and 1200 amperes are required if 5 passes are used (see Figure T-754.2.1). When the central conductor technique is used, magnetic field adequacy shall be verified using a magnetic particle field indicator in accordance with T-764.

磁化电流。所需场强应等于 T-754.1(b)中为单匝中心导体所确定之磁化强度。磁场将与穿过中空部分的中心

导体电缆数成比例地增加。例如，若采用单通中心导体检侧物项需要 6000安培，则在采用 2通过电缆时需

要 3000安培，如果采用 5通路则需要 1200安培(见图 T- 754.2.1)。当采用中心导体技术时，应采用符合 T-

764之磁场指示器来校准磁场的充足性。

(c) Offset Central Conductor. When the conductor passing through the inside of the part is placed against an inside wall of the part, the current levels, as given in T-754.1(b)(1) shall apply, except that the diameter used for current calculations shall be the sum of the diameter of the central conductor and twice the wall thickness. The distance along the part circumference (exterior) that is effectively magnetized shall be taken as four times the diameter of the central conductor, as illustrated in Figure T-754.2.2. The entire circumference shall be inspected by

rotating the part on the conductor, allowing for approximately a 10% magnetic field overlap. 偏置中心导体。当

将物项内部导体偏心放置在靠物项壁侧时，应采用 T-754.1(b)(1)中所给出之电流水平，但用于电流计算之

直径应为中心导体直径和两倍壁厚的和。如图 T-754.2.2 所示，沿着物项圆周(外部)之有效磁化弧长间距应

取为中心导体直径的四倍，整个圆周应藉由物项的旋转导来逐次进行检测，其中每一检测间距间允许有约

10％的磁场重迭。

T-755 YOKE TECHNIQUE 磁轭技术

For this technique, alternating or direct current electromagnetic yokes, or permanent magnet yokes, shall be

used. 对于这种技术，应采用交流或直流电磁轭或永磁轭。

Figure T-754.2.2 The Effective Region of Examination When Using

an Offset Central Conductor 图 T-754.2.2 使用偏心中心导体时之有效检测区域

Central conductor

中心导体 Effective region

有效区域 4d

d

T-756 MULTIDIRECTIONAL MAGNETIZATION TECHNIQUE 多向磁化技术

T-756.1 Magnetizing Procedure. For this technique, magnetization is accomplished by high amperage power packs operating as many as three circuits that are energized one at a time in rapid succession. The effect of these rapidly alternating magnetizing currents is to produce an overall magnetization of the part in multiple direc-tions. Circular or longitudinal magnetic fields may be generated in any combination using the various techniques

described in T-753 and T-754. 磁化方法。对于这种技术是由可同时操作多达三个电路之高电流电源组所组

成的，并通过快速交替操作这些电路，以使这些快速交变的磁化电流作用可在多方向上产生该物项的总磁

化。可采用在 T-753和 T-754中所述各类不同技术之任何组合来产生环向或纵向磁场。

T-756.2 Magnetic Field Strength. Only three phase, full-wave rectified current shall be used to magnetize the part. The initial magnetizing current requirements for each circuit shall be established using the previously de-scribed guidelines (see T-753 and T-754). The adequacy of the magnetic field shall be demonstrated using artificial flaw shims or a pie-shaped magnetic particle field indicator in accordance with T-764. A Hall-Effect probe gauss-meter shall not be used to measure field adequacy for the multidirectional magnetization technique. An adequate field shall be obtained in at least two nearly perpendicular directions, and the field intensities shall be balanced so that a strong field in one direction does not overwhelm the field in the other direction. For areas where adequate field strengths cannot be demonstrated, additional magnetic particle techniques shall be used to obtain the required

two-directional coverage. 场强。只有三相全波整流电流可用于磁化物项。对各电路之首要磁化电流要求应

使用前述指南(见 T-753和 T-754)来进行制定，且对磁场充分性应以具有手动伤之试件或按 T-764之饼形磁

场指示器来进行鉴定。霍尔效应高斯换能器不应用来测定多向磁化技术之磁场是否具有足够充分性的确定

上。在至少两个几乎垂直的方向上应获得足够的磁力场，并且两场磁力场应是相互平衡的，以使在一个方

向上的场强不会对另一个方向上之场强产生覆盖效应，对于不足以显示足够场强之区域，应使用替代磁粉

技术来获得所需的双向覆盖率。

Figure T-754.2.1 Single-Pass and Two-Pass Central Conductor Technique 图 T-754.2.1 单通和双通中心导体技术

Single-turn Central Conductor

Technique单匝中央导体技术 Two-turn Central Conductor

Technique双匝中央导体技术


T-761 FREQUENCY OF CALIBRATION 校准频率

T-761.1 Magnetizing Equipment. 磁化设备

(a) Frequency. Magnetizing equipment with an ammeter shall be calibrated at least once a year, or whenever the equipment has been subjected to major electric repair, periodic overhaul, or damage. If equipment has

not been in use for a year or more, calibration shall be done prior tofirst use. 频率。具有电流表之磁化设备应至

少每年进行一次校准，或每当设备进行重大电气修理，定期检修或因损坏而更换物项时均应进行校准。如

果设备未使用一年或更长时间，则应在首次使用前进行校准。

(b) Procedure. The accuracy of the unit’s meter shall be verified annually by equipment traceable to a national standard. Comparative readings shall be taken for at least three different current output levels encompass-

ing the usable range. 方法。仪表单位精度应每年通过符合国家标准的设备进行校准。对在可用范围内之不

同电流输出电平，应至少进行三个比较读数。

(c) Tolerance. The unit’s meter reading shall not deviate by more than ±10% of full scale▲

, relative

to the actual current value as shown by the test meter. 容差。相对于测定仪表所示的实际电流值，仪表读数不

应超出满量程的±10％。

▲ In digital systems, a signal is said to be at digital full scale when it has reached the maximum

(or minimum) representable value.

T-761.2 Light Meters. Light meters shall be calibrated at least once a year or whenever a meter has been

repaired. If meters have not been in use for one year or more, calibration shall be done before being used. 亮度

计。亮度计应每年至少校准一次或返修后即进行校准。如果仪表未使用一年或更长时间，则在使用前应先

进行校准。

T-762 LIFTING POWER OF YOKES 磁轭之提升力

(a) The magnetizing power of yokes shall be verified prior to use each day the yoke is used. The magnetiz-ing power of yokes shall be verified whenever the yoke has been damaged or repaired.

(b) Each alternating current electromagnetic yoke shall have a lifting power of at least 10 lb. (4.5 kg) at the

maximum pole spacing that will be used. 每一交流电磁轭在所要采用之最大极距下应至少有 10 lb. (4.5 kg)的

提升力。

(c) Each direct current or permanent magnetic yoke shall have a lifting power of at least 40 lb. (18 kg) at the

maximum pole spacing that will be used. 每个直流磁轭或永磁轭在所要采用之最大极距下应至少有 40 lb. (18

kg)的提升力。

(d) Each weight shall be weighed with a scale from a reputable manufacturer and stenciled with the applica-ble nominal weight prior tofirst use. A weight need only be verified again if damaged in a manner that could have

caused potential loss of material. 每一标称秤锤应由信誉良好之制造商所过秤，并在进行秤重和在第一次是

用前标上标称重量。若出现可能导致材料潜在损失之损坏，标称秤锤重量仅需要再次验证即可。

T-763 GAUSSMETERS 高斯探头

Hall-Effect probe gaussmeters used to verify magnetizing field strength in accordance with T-754 shall be cali-brated at least once a year or whenever the equipment has been subjected to a major repair, periodic overhaul, or

damage. If equipment has not been in use for a year or more, calibration shall be done prior tofirst use. 用于按 T-

754来验证磁化场强度之霍尔效应高斯探头应每年至少校准一次、或者每当设备进行大修理后、定期检修

或损坏送修后都应进行校准。如果设备未使用一年或更长时间，则应在首次使用前进行校准。

T-764 MAGNETIC FIELD ADEQUACY AND DIRECTION 磁场充分性和方向性

T-764.1 Application. The use of magnetic field indicators, artificial shims, or Hall-Effect tangential-field

probes are only permitted when specifically referenced by the following magnetizing techniques: 应用。仅当由以

列磁化技术所特别引用时，才能使用磁场指示器、有手动伤之试片或霍尔效应之切向场探头对磁场的正确

适当性和方向性进行确认：

(a) Longitudinal 纵向磁化技术(T-753)

(b) Circular (T-754) 环向磁化技术(T-753)

(c) Multidirectional (T-756) 多向磁化技术(T-756)

T-764.2 Magnetic Field Adequacy. The applied magnetic field shall have sufficient strength to produce satisfactory indications, but shall not be so strong that it causes masking of relevant indications by nonrelevant ac-cumulations of magnetic particles. Factors that influence the required field strength include the size, shape, and ma-terial permeability of the part; the technique of magnetization; coatings; the method of particle application; and the type and location of discontinuities to be detected. When it is necessary to verify the adequacy of magnetic field

strength, it shall be verified by using one or more of the following three methods. 磁场充分性。所施加的磁场应

具有足够的强度以产生令人满意的指示，但不应强到足以导致无关磁粉的积聚而屏蔽了相关指示。影响所

需场强之因素包括有物项尺寸、形状和材料的导磁率、磁化技术、涂层、瓷粉之施加方法，以及所要检测

之不连续姓类型和位置。当需要验证场强的适当性时，应使用以下三种方法中中之其中一种或多种来进行

验证。

(a) Pie-Shaped Magnetic Particle Field Indicator. The indicator, shown in Figure T-764.2(a), shall be positioned on the surface to be examined, such that the copperplated side is away from the inspected surface. A suitable field strength is indicated when a clearly defined line (or lines) of magnetic particles form(s) across the cop-per face of the indicator when the magnetic particles are applied simultaneously with the magnetizing force. When a clearly defined line of particles is not formed, the magnetizing technique shall be changed as needed. Pie-type indi-

cators are best used with dry particle procedures. 饼形磁场指示器。图 T-764.2(a)所示之指示器应位于被检测

表面上，且使镀铜面远离被检测表面。当同时施加磁粉与磁化力时，当在指示器的铜面上形成清楚的磁粉

规定线(或多条线)时，即表示具有适当的场强。当没有形成清晰的磁粉规定时，应根据需要改变磁化技

术。饼形指示剂最适用于干磁粉作法。

(b) Artificial Flaw Shims. One of the shims shown in Figure T-764.2(b)(1) or Figure T-764.2(b)(2) whose orientation is such that it can have a component perpendicular to the applied magnetic field shall be used. Shims with linear notches shall be oriented so that at least one notch is perpendicular to the applied magnetic field. Shims with only circular notches may be used in any orientation. Shims shall be attached to the surface to be exam-ined, such that the artificial flaw side of the shim is toward the inspected surface. A suitable field strength is indi-cated when a clearly defined line (or lines) of magnetic particles, representing the 30% depth flaw, appear (s) on the shim face when magnetic particles are applied simultaneously with the magnetizing force. When a clearly defined line of particles is not formed, the magnetizing technique shall be changed as needed. Shim-type indicators are best

used with wet particle procedures. 手动伤试件。应使用图 T-764.2(b)(1)或图 T-764.2(b)(2)所示试件之其中一

种，并让其取向垂直于所施加磁场的分向量。具有线性缺口之试件定向应至少使一个缺口垂直于所施加的

磁场。仅具有圆形槽口的试件可适用于任何方向的磁场力。试件应贴附到待检测表面，以使得试件之手动

伤侧朝向被检测表面，当磁粉与磁化力同时施加时，表示 30％深度缺陷的清晰磁粉规定线(或多条线)出现

在试件表面上时，即表示具有适当的场强。当没有形成清晰的磁粉规定线时，应根据需要改变磁化技术。

试件型指示器最适用于湿磁粉检测方法。

NOTE: The circular shims shown in Figure T-764.2(b)(2) illustration (b) also have flaw depths less

and greater than 30%. 注释：在图 T-764.2(b)(2)中示例(b)所示之圆形试件，亦具有小于和大于 30％的缺陷

深度。

Figure T-764.2(a) Pie-Shaped Magnetic Particle Field Indicator

图 T-764.2(a)饼形磁粉磁场指示器

Eight low carbon steel pipe sections furnce brazed together and

copper plated由八块镀铜低碳钢管切片钎接在一起

3/4 in. to 1 in.

(19 mm to 25 mm)

(c) Hall-Effect Tangential-Field Probe. A gaussmeter and Hall-Effect tangential-field probe shall be used for measuring the peak value of a tangential field. The probe shall be positioned on the surface to be examined, such that the maximum field strength is determined. A suitable field strength is indicated when the measured field is within the range of 30 G to 60 G (2.4 kAm – 1 to 4.8 kAm−1) while the magnetizing force is being applied. See Arti-

cle 7, Nonmandatory Appendix A. 霍尔效应切向场探头。应使用高斯计和霍尔效应切向场探头来测量表面磁

场的峰值。探头应位于待检测表面上，以确定最大场强。当对所施加磁化力进行测量，且被测得之场强在

30G至 60G(2.4 kAm至 4.8 kAm−1) 范围内时，即表示具有适当的场强，见非强制性附录A第 7章。

Figure T-764.2(b)(1) Artificial Flaw Shims

图 T-764.2(b)(1) 手动伤试件

GENERAL NOTE: Above are examples of artificial flaw shims used in magnetic particle inspec-

tion system verification (not drawn to scale). The shims are made of low carbon steel (1005 steel foil).

The artificial flaw is etched or machined on one side of the foil to a depth of 30% of the foil thickness.

通注：以上是用于磁粉检测系统验证(未按比例绘制)之手动伤试件示例。试件由低碳钢(1005钢

薄片)所制成。在薄片的一侧上蚀刻或机械加工出手动伤，其深度达到薄片厚度的 30％。

T-764.3 Magnetic Field Direction. The direction(s) of magnetization shall be determined by particle indi-cations obtained using an indicator or shims as shown in Figure T-764.2(a), Figure T-764.2(b)(1), or Figure T-

764.2(b)(2). When a clearly defined line of particles are not formed 磁场方向。磁化方向应以通过图 T-

764.2(a)，图 T-764.2(b)(1) 指示器或图 T-764.2(b)(2) 手动伤试件所获得之磁粉指示来决定的。

(a) in the desired direction, or 在所要的方向上，或

(b) in at least two nearly perpendicular directions for the multidirectional technique 至少在两个相

互垂直的多方向技术

the magnetizing technique shall be changed as needed. 应按实际所需改变磁化技术。

T-765 WET PARTICLE CONCENTRATION AND CONTAMINATION

湿磁粉浓度和污染

Wet Horizontal Units shall have the bath concentration and bath contamination determined by measuring its set-tling volume. This is accomplished through the use of an ASTM Test Method D 96 pear-shaped centrifuge tube with a 1-mL stem (0.05-mL divisions) for fluorescent particle suspensions or a 1.5-mL stem (0.1-mL divisions) for nonfluorescent suspensions. Before sampling, the suspension should be run through the recirculating system for at least 30 min to ensure thorough mixing of all particles which could have settled on the sump screen and along the

sides or bottom of the tank. 湿法卧式单位应具有对其沉降容积进行测定时所确定之槽浓度和槽污染，此可

藉由 ASTM D 96(在 2000年已被撤销) 原油中水和沈淀物之离心测定法来实现，其中对荧光磁粉悬浮液是

用 1 mL母体(0.05 mL分度)之梨形管来测定的，而非荧光磁粉悬浮液则采用 1.5 mL (0.1mL分数)的梨形管

来对其沉降容积进行测定。在对悬浮液进行取样之前，悬浮液应先以再循环系统至少运行 30分钟，以确保

所有会在水槽筛网并沿着槽边角或底部沉淀的磁粉得以充分混合。

T-765.1 Concentration. Take a 100-mL portion of the suspension from the hose or nozzle, demagnetize and allow it to settle for approximately 60 min with petroleum distillate suspensions or 30 min with water-based suspensions before reading. The volume settling out at the bottom of the tube is indicative of the particle concentra-

tion in the bath. 浓度。从软管或接管取出 100 mL的悬浮液，消磁，并在读取读数之前让其先在石油脑悬

浮液中沉降约 60分钟，或在水基悬浮液中沉淀 30分钟。在管底处所沉析的量即表示槽中的磁粉浓度。

T-765.2 Settling Volumes. For fluorescent particles, the required settling volume is from 0.1 to 0.4 mL in a 100 mL bath sample and from 1.2 to 2.4 mL per 100 mL of vehicle for nonfluorescent particles unless otherwise

specified by the particle manufacturer. Concentration checks shall be made at least every eight hours. 沉降量。除

非磁粉制造商另有规定，否则荧光磁粉在 100 槽样品中所需的沉降量为 0.1至 0.4mL，而非荧光磁粉在每

100mL载体中为 1.2至 2.4mL。浓度检测应至少每八小时进行一次。

T-765.3 Contamination. Both fluorescent and nonfluorescent suspensions shall be checked periodically for contaminants such as dirt, scale, oil, lint, loose fluorescent pigment, water (in the case of oil suspensions), and particle agglomerates which can adversely affect the performance of the magnetic particle examination process. The

test for contamination shall be performed at least once per week. 污染。荧光和非荧光悬浮液应定期校对污染

物，如污垢、铁锈、油，棉屑、不稳定荧光颜料、水(在油悬浮液的情况下)和对磁粉检测过程产生不利地

影响之磁粉聚物，污染测试应至少每周进行一次。

(a) Carrier Contamination. For fluorescent baths, the liquid directly above the precipitate should be examined with fluorescent excitation light. The liquid will have a little fluorescence. Its color can be compared with a freshly made-up sample using the same materials or with an unused sample from the original bath that was re-tained for this purpose. If the “used” sample is noticeably more fluorescent than the comparison standard, the bath

shall be replaced. 载体污染。对荧光槽，沉淀物正上方之液体宜用荧光激发光线进行校对，该层液体会有

稍许荧光，其颜色可与使用相同材料之新鲜槽液样品或与为此目的而所保留之首要槽液的未使用样品进行

比较，若已用过样品比与之相比之标准相对发出更多荧光，则应倒回槽液中。

(b) Particle Contamination. The graduated portion of the tube shall be examined under fluorescent excitation light if the bath is fluorescent and under visible light (for both fluorescent and nonfluorescent particles) for striations or bands, differences in color or appearance. Bands or striations may indicate contamination. If the total volume of the contaminates, including bands or striations exceeds 30% of the volume magnetic particles, or if

the liquid is noticeably fluorescent, the bath shall be replaced. 磁粉污染。若體槽本體發出螢光，並在可見光下

(對於螢光和非螢光顆粒)，對條紋、光帶在顏色上之差異或外觀等進行校對，而試管之刻度部位則應在螢

光激發光線下進行檢測。光帶或條紋可預示污染。污染物(包括帶或條紋)總量若超過磁粉量的 30％，還是

液體比常規發出更顯著的螢光時，則應倒回槽液中。

T-766 SYSTEM PERFORMANCE OF HORIZONTAL UNITS 卧式装置之系统性能

The Ketos (Betz) ring specimen (see Figure T-766.1) shall be used in evaluating and comparing the overall per-formance and sensitivity of both dry and wet, fluorescent and nonfluorescent magnetic particle techniques using a

central conductor magnetization technique. 对干和湿磁粉之总体性能和灵敏度进行评价和比较时应采用

Ketos(Betz)环试样(见图 T-766.1)，而荧光和非荧光磁技术则使用中心导体磁化技术。

Figure T-764.2(b)(2) Artificial Flaw Shims

图 T-764.2(b)(2) 手动伤试件

(a) Ketos (Betz) Test Ring Material. The tool steel (Ketos) ring should be machined from AISI 01 mate-rial in accordance with Figure T-766.1. Either the machined ring or the steel blank should be annealed at 1,650°F (900°C), cooled 50°F (28°C) per hour to 1,000°F (540°C) and then air cooled to ambient temperature to give com-parable results using similar rings that have had the same treatment. Material and heat treatment are important varia-bles. Experience indicates controlling the softness of the ring by hardness (90 to 95 HRB) alone is insufficient. Ke-

tos(Betz)试验环材料。工具钢(Ketos)环应以 AISI 01材料并按图 T-766.1加工而成。加工环或钢坯应在

Shim Thickness 0.002 in. (0.051 mm) Shim

Type CX-230 Shim Thickness 0.004 in. (0.102 mm) Shim

Type CX4-430

Shim Type 3C2-234 Shim Thickness

0.002 in. (0.05 mm)

Shim Type CX-230 Shim Type CX-430

Shim Type 3C4-234 Shim Thickness

0.004 in. (0.102 mm)

试件厚度之 30%，槽深 0.0012

in. (0.030 mm)

试件厚度：0.004 in. (0.10 mm)

槽深试件厚度试件厚度 30% ，其深度等

于 0.0012 in. (0.030 mm)

外环圈之槽深：20%，0.0004 in.

(0.10 mm)

中环圈之槽深：30%，槽深试件厚

度试件 0.0006 in. (0.015 mm)

外环圈之槽深：40%，0.0008 in.

(0.020 mm)

1650°F(900℃)，然后以每小时 50°F(28℃)之冷却速率冷却至 1000°F(540℃)，最后让其空冷至环境温度的方

式进行退火处理，以获得具有相同处理之相似环的类似结果。材料和热处理是属重要变量的，因经验指

出，若单独以硬度(90至 95HRB)作为控制变量时，通常会造成环的韧性不佳。

(b) Using the Test Ring. The test ring (see Figure T-766.1), is circularly magnetized with full-wave recti-fied AC passing through a central conductor with a 1 in. to 1-1/4 in. (25 mm to 32 mm) diameter hole located in the ring center. The conductor should have a length greater than 16 in. (400 mm). The currents used shall be 1400, 2500, and 3400 amps. The minimum number of holes shown shall be three, five, and six, respectively. The ring edge should be examined with either black light or visible light, depending on the type of particles involved. This test shall be run at the three amperages if the unit will be used at these or higher amperages. The amperage values stated shall not be exceeded in the test. If the test does not reveal the required number of holes, the equipment shall be taken out of service and the cause of the loss of sensitivity determined and corrected. This test shall be run at

least once per week. 试验环之用法。是将一个具有 1 in.至 1-1/4 in. (25 mm 至 32 mm)孔直径之中心导体穿过

试验环(见图 T-766.1)的中心，并导通全波整流电流以进行试验环的环向磁化。导体长度应大于 16 in. (400

mm)。所使用之电流应为 1400、2500和 3400安培。所示最小孔代码号依次为 3、5和 6。环边宜按所涉及

之磁粉类型在所相应之黑光或可见光下进行检测。如果该装置将以这些或更高的电流强度使用，则该试验

应以前述之三种电流强度分别运行，且在试验过程中不应超过所述的安培数值，如试验结果没有显示所需

的孔代码号，则设备应停止使用，并在确定灵敏度之降低原因后加以调整。该试验至少每周应进行一次。


T-771 PRELIMINARY EXAMINATION 初步检测

Before the magnetic particle examination is conducted, a check of the examination surface shall be conducted to locate any discontinuity surface openings which may not attract and hold magnetic particles because of their

width. 在应用磁粉检测之前，应对待检测表面进行检测，以对那些会导致磁粉无法吸附和聚集之任何开口

性表面不连续性的宽度给出适当地定位。

T-772 DIRECTION OF MAGNETIZATION 磁化方向

At least two separate examinations shall be performed on each area. During the second examination, the lines of magnetic flux shall be approximately perpendicular to those used during the first examination. A different tech-

nique for magnetization may be used for the second examination. 对每一检测区域应至少分别进行两次。在第

二次检测期间之磁力线应与第一次检测期间所形成之磁力线大致相互垂直，并可将不同磁化技术用在第二

次之检测上。

T-773 METHOD OF EXAMINATION 检测方法

The ferromagnetic particles used in an examination medium can be either wet or dry, and may be either fluo-

rescent or nonfluorescent. Examination(s) shall be done by the continuous method. 在检测介质中使用的铁磁粉

可以是湿的或干的，并且可以是荧光或非荧光的。检测应采用连续方法进行。

(a) Dry Particles. The magnetizing current shall remain on while the examination medium is be-

ing applied and while any excess of the examination medium is removed. 干磁粉。在施加检测介质时以及

在移除任何多余的检测介质时，磁化电流应保持开启。

(b) Wet Particles. The magnetizing current shall be turned on after the particles have been ap-

plied. Flow of particles shall stop with the application of current. Wet particles applied from aerosol spray cans may be applied before and/or after magnetizing current is applied. Wet particles may be applied dur-ing the application of magnetizing current if they are not applied directly to the examination area and are

allowed toflow over the examination area or are applied directly to the examination area with low veloci-

ties insufficient to remove accumulated particles. 湿磁粉。在施加磁粉后，应打开磁化电流。磁粉流动应

随着电流的施加而停止。由喷雾罐所喷洒之湿磁粉可在施加磁化电流之前和/或之后施加。若湿磁粉不直接

施加到检测区域并且允许其在检测区域上流动或者以不足以移除累积磁粉的低速度直接施加到检测区域上

时，即可在施加磁化电流期间施加湿颗粒。

T-774 EXAMINATION COVERAGE 检测涵盖范围

All examinations shall be conducted with sufficient field overlap to ensure 100% coverage at the required sen-

sitivity (T-764). T-774所有检测应在足够的磁场重迭下进行，以确保在所需灵敏度(T-764)下被检测区域能

百分百地被涵盖住。

T-775 RECTIFIED CURRENT 整流电流

(a) Whenever direct current is required rectified current may be used. The rectified current for mag-netization shall be either three-phase (full-wave rectified) current, or single phase (half-wave rectified)

current. 每当需要直流电时，可以采用整流电流。磁化用之整流电流应为三相(全波整流)电流或单相(半波

整流)电流。

(b) The amperage required with three-phase, full-wave rectified current shall be verified by measur-

ing the average current. 三相全波整流电流之所需安培数应通过测量平均电流来验证。

(c) The amperage required with single-phase (halfwave rectified) current shall be verified by measuring

the average current output during the conducting half cycle only. 所需之单相半波整流电流安培数应藉由对仅

在导电半周期期间之平均输出电流进行测量来验证。

(d) When measuring half-wave rectified current with a direct current test meter, readings shall be multiplied by two. 用直流电流表测量半波整流电流时，其读数应乘以 2。

T-776 EXCESS PARTICLE REMOVAL 过量磁粉去除

(a) Accumulations of excess dry particles in examinations shall be removed with a light air stream from a bulb or syringe or other source of low pressure dry air. The examination current or power shall be maintained while

removing the excess particles. 在检测中对过量干磁粉的累积应用来自球管或气枪或其它低压干燥空

气源的微弱气流除去。在去除多余磁粉的同时仍应保持所需的检测电流或功率。

T-777 INTERPRETATION 解释

The interpretation shall identify if an indication as false, nonrelevant, or relevant. False and nonrelevant indica-tions shall be proven as false or nonrelevant. Interpretation shall be carried out to identify the locations of indica-

tions and the character of the indication. 解释应确定指示是否为假指示、不相关指示或相关指示。假指示和

不相关指示应被证明为假的或不相关的。应进行解释，以确定指示的位置和指示的特征。

T-777.1 Visible (Color Contrast) Magnetic Particles. Surface discontinuities are indicated by accumula-tions of magnetic particles which should contrast with the examination surface. The color of the magnetic particles shall be different than the color of the examination surface. Illumination (natural or supplemental white light) of the examination surface is required for the evaluation of indications. The minimum light intensity shall be 100 fc (1 000 lx). The light intensity, natural or supplemental white light source, shall be measured with a white light meter prior to the evaluation of indications or a verified light source shall be used. Verification of light sources is required to be

demonstrated only one time, documented, and maintained on file. 色差(对比度)磁粉。表面不连续性是通过磁粉

的累积，以及所累积磁粉与检测表面所形成的色差对比来表示的，为此磁粉颜色应不同于与受检测表面之

颜色。评估指示时，要求检测表面须有一定的照明度(自然光线或辅助白光)，最小照明度应为 100 fc (1 000

lx)。照明度(自然光线或辅助白光)应在评估指示前使用白光测光计进行测量或使用经验证过的光源。光源

验证只需要证明一次，证明文件归档保存。

T-777.2 Fluorescent Magnetic Particles With Black Light. With fluorescent magnetic particles, the pro-cess is essentially the same as in T-777.1, with the exception that the examination is performed using an ultraviolet

light (i.e., nominal 365 nm), called black light. The examination shall be performed as follows: 用黑光激发之荧光

磁粉。除了使用黑光灯(即，标称 365nm)来进行检测外，荧光磁粉检测步骤基本上是与 T-777.1中的相同。

检测应按执行如下：


Figure T-766.1 Ketos (Betz) Test Ring

图 T-766.1 Ketos(Betz)试验环

Hole 1 2 3 4 5 6 7 8 9 10 11 12 Diameter [Note (1)] 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8) 0.07 (1.8)

“D” [Note (2)] 0.07 (1.8) 0.14 (3.6) 0.21 (5.3) 0.28 (7.1) 0.35 (9.0) 0.42 (10.8) 0.49 (12.6) 0.56 (14.4) 0.63 (16.2) 0.70 (18.0) 0.77 (19.8) 0.84 (21.6)

(a) All dimensions are ±0.03 in. (±0.8 mm) or as noted in Notes (1) and (2). 所有尺寸之公差为±0.03 in. (±0.8 mm) 或如注(1)和(2)所示。

(b) In the in-text table, all dimensions are in inches, except for the parenthesized values, which are in millimeters. 在表格文本中，所有尺寸均以英寸

为单位，括号内以毫米为单位的值除外。

(c) Material is ANSI 01 tool steel from annealed round stock. 试验环之材料是采用退火圆坯料之 ANSI 01工具钢。

(d) The ring may be heat treated as follows: Heat to 1,400°F to 1,500°F (760°C to 790°C). Hold at this temperature for 1 hr. Cool to a minimum rate of

40°F/hr (22°C/h) to below 1,000°F (540°C). Furnace or air cool to room temperature. Finish the ring to RMS 25 and protect from corrosion. 试验环之热处

理(退火)如下：加热到 1,400°F 至 1,500°F(760°至 790°C)，在此温度下保持 1小时后，以 40°F/hr (22°C/h)之最小冷却速率冷却到 1,000°F (540°C)

以下，最后在炉冷或空冷至室温。将试验环经加工到 RMS 25之表面粗糙度等级以防止腐蚀。

NOTES:

(1) All hole diameters are ±0.005 in. (±0.1 mm.) Hole numbers 8 through 12 are optional. 注：(1)所有孔径公差为±0.005 in. (±0.1 mm.)。8至 12

孔编号是可选的。

(2) Tolerance on the D distance is ±0.005 in. (±0.1 mm). D距离之公差为±0.005 in. (±0.1 mm.)。

125

3/4 in. (19 mm) Type

5 in.

(125 mm)

1-1/4 in.

(32 mm)

7/8 in.

(22 mm)

1 2 3

4

5

6

7

8

9 10 11

12

(b) Examiners shall be in a darkened area for at least 5 min prior to performing examinations to enable their eyes to adapt to dark viewing. Glasses or lenses worn by examiners shall not be photochromic or

exhibit any fluorescence. 检测者在进行检测前应先在黑暗区域逗留至少 5分钟，以便眼睛适应在黑暗

中进行检测，且检测员所佩戴之眼镜或镜片不应是光致变色的或会发任何荧光颜色之镜片。

(c) Black lights shall achieve a minimum of 1000 μW/cm2 on the surface of the part being ex-

amined throughout the examination. 在整个检测过程中，黑色灯在被检测物项之表面上应至少达到

1000 μW/cm2。

(d) Reflectors, filters, glasses, and lenses should be checked and, if necessary, cleaned prior to

use. Cracked or broken reflectors, filters, glasses, or lenses shall be replaced immediately. 宜检测反射器、

滤光器，以及所配戴之眼镜和镜片，如有必要，在使用前进行清洁，若发现有裂纹或破损时应立即更

换。

(e) The black light intensity shall be measured with a black light meter prior to use, whenever the light’s power source is interrupted or changed, and at the completion of the examination or series of ex-

aminations. 黑光灯在使用前、光源电源中断或改变时、完成检测或一系列检测时，都应采用黑光计进

行黑光强度测量。

T-777.3 Fluorescent Magnetic Particles With Other Fluorescent Excitation Wavelengths. Al-ternatively to the requirements in T-777.2, the examinations may be performed using alternate wavelength light sources which cause fluorescence in specific particle coatings. Any alternate light wavelength light

sources and specific particle designations used shall be qualified30 in accordance with Mandatory Appendix

IV. The examination shall be performed as follows: 用替代荧光波长所激发之荧光磁粉。可作为 T-777.2

中所要求的另一种选择，可采用交替波长光源对特定磁粉涂层激发荧光以进行检测。任何所备用之波

长光源和特定磁粉名称应符合强制性附录 IV的要求。应按如下进行检测：


(b) Examiners shall be in a darkened area for at least 5 min prior to performing examinations to enable their eyes to adapt to dark viewing. Glasses or lenses worn by examiners shall not be photochromic or

exhibit any fluorescence. 检测者在进行检测前应先在黑暗区域逗留至少 5分钟，以便眼睛适应在黑暗

中进行检测，且检测员所佩戴之眼镜或镜片不应是光致变色的或会发任何荧光颜色之镜片。

(c) If the fluorescence excitation light source emits visible light intensities greater than 2 fc (20 Lx), the examiner shall wear fluorescence-enhancing filter glasses approved by the light source manufacturer

for use with that light source. 若荧光激发光源发出比 2 fc (20 Lx)可见光还强之照度时，检测者应佩戴由

光源制造商认可并适用于该光源的荧光增强滤光眼镜。

(d) The fluorescence excitation light source shall achieve at least the minimum light intensity

on the surface of the part throughout the examination as qualified in the tests of Mandatory Appendix IV. 荧

光激发光源应在整个检测过程中在物项表面上之亮度至少达到在强制性附录 IV的试验中所认可的最

小亮度。

(e) Reflectors, filters, glasses, and lenses should be checked and, if necessary, cleaned prior to

use. Cracked or broken reflectors, filters, glasses, or lenses shall be replaced immediately. 宜检测反射器、

滤光器，以及所配戴之眼镜和镜片，如有必要，在使用前进行清洁，若发现有裂纹或破损时应立即更

换。

(f) The fluorescence excitation light intensity shall be measured with a suitable fluorescence excitation light meter prior to use, whenever the light’s power source is interrupted or changed, and at the

completion of the examination or series of examinations.荧光激发光源在使用前、光源电源中断或改变

时、完成检测或一系列检测时，都应采用合适的亮度计对其所发出之荧光强度进行测量。

T-778 DEMAGNETIZATION 消磁

When residual magnetism in the part could interfere with subsequent processing or usage, the part shall

be demagnetized any time after completion of the examination. 当物项中之残余磁性会对后续加工或使

用上产生干扰时，则零件应在完成检测后的任何时间消磁。

T-779 POST-EXAMINATION CLEANING 检测后清洁 When post-examination cleaning is required, it should be conducted as soon as practical using a process

that does not adversely affect the part. 当需要检测后清洁时，应尽快使用不会对物项造成不利影响之方

法进行。


(a) All indications shall be evaluated in terms of the acceptance standards of the referencing Code

Section. 所有迹象应根据引用规范章节之接受准则进行评估。

(b) Discontinuities on or near the surface are indicated by retention of the examination medium. How-ever, localized surface irregularities due to machining marks or other surface conditions may produce false

indications. 表面上或近表面之不连续性是通过检测介质的滞留而显示的，然而，因加工痕迹或其它

表面状况所导致的局部表面不规则性可能会产生假指示。

(c) Broad areas of particle accumulation, which might mask indications from discontinuities, are pro-

hibited, and such areas shall be cleaned and reexamined. 大面积磁粉累积迹象可能会对不连续性产生遮

避效应，因此此现象是被禁止的，因此对对此类区域应进行清理并重新检测这些区域。


T-791 MULTIDIRECTIONAL MAGNETIZATION TECHNIQUE SKETCH

多向磁化技术示意图 A technique sketch shall be prepared for each different geometry examined, showing the part geometry,

cable arrangement and connections, magnetizing current for each circuit, and the areas of examination where adequate field strengths are obtained. Parts with repetitive geometries, but different dimensions, may be ex-amined using a single sketch provided that the magnetic field strength is adequate when demonstrated in ac-

cordance with T-756.2. 应为检测置备各种不同几何形状之技术示意图，以显示物项的几何形状、电

缆布置和连接方式、每个电路的磁化电流，以及能获得足够场强的检测范围。只要能按T-756.2对场

强的充分性提出证明时，对具有不同尺寸但几何形状相同之物项是可采用同一张示意图来进行检测

的。

T-792 RECORDING OF INDICATIONS 不连续性指示之记录

T-792.1 Nonrejectable Indications. Nonrejectable indications shall be recorded as specified by the

referencing Code Section. 不可拒收之指示。不可拒收之指示应按照引用规范章节之规定进行记录。

T-792.2 Rejectable Indications. Rejectable indications shall be recorded. As a minimum, the type

of indications (linear or rounded), location and extent (length or diameter or aligned) shall be recorded. 可拒

收指示。应记录可拒收指示，且至少应记录指示类型(线型或圆型)，位置和范围(长度、直径或线性排

列)。

T-793 EXAMINATION RECORDS 检测记录

For each examination, the following information shall be recorded: 对每次检测都应记录以下信息：

(a) the requirements of Article 1, T-190(a) 第 1章 T-190(a)之要求

(b) magnetic particle equipment and type of current 磁粉检测设备和电流类型

(c) magnetic particles (visible or fluorescent, wet or dry) 所采用之磁粉类型(色差或荧光，

湿或干)

(d) map or record of indications per T-792 根据 T-792所绘制之指示分布图或记录

(e) material and thickness 被检测物项之材料和厚度

(f) lighting equipment 照明设备

MANDATORY APPENDIX I MAGNETIC PARTICLE EX-

AMINATION USING THE AC YOKE TECHNIQUE ON

FERRITIC MATERIALS COATED WITH NONMAG-

NETIC COATINGS 强制性附录 I 采用交流磁轭技术对具有非磁

性涂层铁基材料所进行之磁粉检测


This Appendix provides the Magnetic Particle examination methodology and equipment requirements

applicable for performing Magnetic Particle examination on ferritic materials with nonmagnetic coatings. 本

附录对具有非磁性涂层铁基材料进行磁粉检测时所采用之磁粉提供了适用的检查方法和设备要求。

I-720 GENERAL 通则

Requirements of Article 7 apply unless modified by this Appendix. 采用第七章之规定，除非为本附

录所修改过之部分。

I-721 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

I-721.1 Requirements. Magnetic Particle examination shall be performed in accordance with a written procedure which shall, as a minimum, contain the requirements listed in Tables T-721 and I-721. The

written procedure shall establish a single value, or range of values, for each requirement. 要求。磁粒检查应

按照书面规程进行，书面规程至少应包含表 T-721和表 I-721中所列之要求项目，且书面规程应为每

种要求制定单一值或系列值之范围。

I-721.2 Procedure Qualification/Technique Validation. When procedure qualification is speci-fied, a change of a requirement in Table T-721 or Table I-721 identified as an essential variable from the specified value, or range of values, shall require requalification of the written procedure and validation of the technique. A change of a requirement identified as an nonessential variable from the specified value, or range of values, does not require requalification of the written procedure. All changes of essential or nonessential variables from the value, or range of values, specified by the written procedure shall require revision of, or an

addendum to, the written procedure. 规程认可鉴定和技术有效性验证。当指定规程须进行认可鉴定，

且 T-721或表 I-721中所列出重要变量之变动值超出指定值或系列值范围时，则应对书面规程和技术

有效性重新要求鉴定与验证。更改非重要变量时不需重新鉴定认可书面规程。由书面规程所规定之重

要或非重要变量对指定值或系列值范围的所有变化，都需对书面规程进行修订或补遗。

I-722 PERSONNEL QUALIFICATION 人员资格评定

Personnel qualification requirements shall be in accordance with the referencing Code Section. 人员资

格评定要求应符合引用规范章节之规定。

I-723 PROCEDURE/TECHNIQUE DEMONSTRATION 规程和技术演示

The procedure/technique shall be demonstrated to the satisfaction of the Inspector in accordance with the

requirements of the referencing Code Section. 规程和技术应按照引用规范章节之要求，向检验员取得

能令他满意地演示结果。

I-730 EQUIPMENT 设备

I-730.1 The magnetizing equipment shall be in accordance with Article 7. 磁化设备应符合第 7章

之规定。

Table I-721 Requirements of AC Yoke Technique on Coated Ferritic Component

表 I-721 在涂层铁基物项上用交流磁轭技术时之要求

Requirement 要求项目 Essential Variable

重要变量 Nonessential Variable

非重要变量

Identification of surface configurations to be examined, including coating materials, maximum qualified coating thick-

ness, and product forms (e.g., base material or welded surface) 待检测表面构造之识别，包括涂层材料、最大认可

涂层厚度和产品形式(例如母材或焊接表面)

X …

Surface condition requirements and preparation methods 表面状况要求和制备方法 X …

Manufacturer and model of AC yoke 交流磁轭之制造商和型号 X …

Manufacturer and type of magnetic particles 磁粉之制造商和类型 X …

Minimum and maximum pole separation 最小和最大极距 X …

Identification of the steps in performing the examination 检查执行步骤之确认 X …

Minimum lighting intensity and AC yoke lifting power requirements [as measured in accordance with Technique Qualifi-

cation (I-721.2)] 最小照明强度和交流磁轭提升力要求[按照 I-721.2 之技术认可程序进行测定]

X …

Methods of identifying flaw indications and discriminating between flaw indications and false or nonrelevant indications

(e.g., magnetic writing▲

or particles held by surface irregularities) 缺陷指示之识别方法以及缺陷指示与假指示或不

相关指示(例如，磁写作用或由于表面不规则性所造成的磁粉积聚)之间的鉴别方法

X …

Instructions for identification and confirmation of suspected flaw indications 对可疑缺陷指示之鉴别与确认说明 X …

Applicator other than powder blower 不同于吹粉器之洒粉器 X …

Method of measuring coating thickness 涂层厚度的测量方法 … X

Recording criteria 记录准则 … X

Personnel qualification requirements unique to this technique 具有此种特有技术之人员资格要求 … X

Reference to the procedure qualification records 可参考之规程认可记录 … X

▲Definition of false or nonrelevant indications: If two pieces of steel touch when one of them is in a magnetised condition, local poles are created at the areas of contact. If mag-

netic particles are then sprinkled on the surface, the local poles become visible as fuzzy lines.

I-730.2 When the dry powder technique is used, a compressed air powder blower shall be utilized for powder application in any position. Other applicators may be used if qualified in the same surface position as the examination object surface. Applicators qualified for the overhead position may be

used in any other position. Applicators qualified for the vertical position may be used in the horizontal and flat positions. 当使用干粉技术时，对任何

位置施加粉末时应采用压缩空气粉末吹喷器。此要在与检测对象相同的表面位置上鉴定认可，则其它的敷料器亦可采用。仰姿位置鉴定认可之

磁粉敷料器对任何替代位置而言都是被认可的。垂直位置鉴定认可之磁粉敷料器可用于水平和平面位置。

I-730.3 Magnetic particles shall contrast with the component background. 磁粉应与物项底色形成鲜明的对比。

I-730.4 Nonconductive materials such as plastic shim stock may be used to simulate nonconductive nonmagnetic coatings for procedure and

personnel qualification. 诸如塑料垫片那样的非导电材料，在规程和人员资格鉴定上可用此类材料来于模拟(取代)非导电非磁性涂层。

I-740 MISCELLANEOUS REQUIREMENTS 杂项要求

I-741 COATING THICKNESS MEASUREMENT 涂层厚度测量

The procedure demonstration and performance of examinations shall be preceded by measurement of the coat-ing thickness in the areas to be examined. If the coating is nonconductive, an eddy current technique or magnetic technique may be used to measure the coating thickness. The magnetic technique shall be in accordance with SD-1186, Standard Test Methods for Nondestructive Measurement of Dry Film Thickness of Nonmagnetic Coatings Applied to a Ferrous Base. When coatings are conductive and nonmagnetic, a coating thickness technique shall be used in accordance with SD-1186. Coating measurement equipment shall be used in accordance with the equipment manufacturer’s instructions. Coating thickness measurements shall be taken at the intersections of a 2 in. (50 mm) maximum grid pattern over the area of examination and at least one-half the maximum yoke leg separation beyond the examination area. The thickness shall be the mean of three separate readings within 1/4 in. (6 mm) of each inter-

section. 在方法演示和检测执行之前，应先测量待检测区域之涂层厚度。如果涂层是非导电的，则可以使用

涡流技术或磁粉技术来测量涂层厚度，其中磁性技术应符合 SD-1186《铁基材料上非磁性干涂层无损测量

方法》。當涂层具有导电性和非磁性时，应根据 SD-1186使用涂层厚度技术进行测定，且涂层测量设备应

按照设备制造商之说明书进行操作。涂层厚度测量应在检查区域上取最大格网为 2 in. (50 mm)之交叉点处

且最大极距至少有一半在检测区域外下进行。厚度应为在每一交点之 1/4 in. (6 mm)范围内所取三个位置读

数的平均值。

I-750 TECHNIQUE 技术

I-751 TECHNIQUE QUALIFICATION 技术鉴定

(a) A qualification specimen is required. The specimen shall be of similar geometry or weld profile and con-tain at least one surface crack no longer than the maximum flaw size allowed in the applicable acceptance criteria. The material used for the specimen shall be the same specification and heat treatment as the coated ferromagnetic material to be examined. As an alternative to the material requirement, other materials and heat treatments may be

qualified provided: 需要一块鉴定试样。试样应具有相似的几何形状或焊缝轮廓，并且至少有一个小于适用

允收准则所许可最大裂纹尺寸的表面裂纹。用于试样的材料应与要检测之涂层铁磁材料具有相同的规格和

热处理；只要替代材料和热处理合乎下列规定，即可作为所要求材料的另一种选择：

(1) The measured yoke maximum lifting force on the material to be examined is equal to or greater than the maximum lifting force on the qualification specimen material. Both values shall be determined with the

same or comparable equipment and shall be documented as required in (c). 待测材料上所测量到之磁轭最大提

升力等于或大于鉴定试样材料上的最大提升力。两者间的值应采用相同或类似的设备确定，并应按照(c)中

的要求进行记录。

(2) All the requirements of (b) through (g) are met for the alternate material. 替代材料满足(b)至(g)

的所有要求。

(b) Examine the uncoated specimen in the most unfavorable orientation expected during the performance of

the production examination. 在执行生产检测期间以所预期之最不利取向来检测未涂装样品。

(c) Document the measured yoke maximum lifting power, illumination levels, and the results. 记录所测得

知磁轭最大提升力、照度级别和结果。

(d) Measure the maximum coating thickness on the item to be examined in accordance with the require-

ments of I-741. 按 I-741 之规定测定待检测物项上的最大涂层厚度。

(e) Coat the specimen with the same type of coating, conductive or nonconductive, to the maximum thick-ness measured on the production item to be examined. Alternately, nonconductive shim stock may be used to simu-

late nonconductive coatings. 用相同类型之导电或不导电涂层将试样涂覆到在待检测生产项目上所需之最大

厚度，或采用非导电垫片来模拟非导电涂层。

(f) Examine the coated specimen in the most unfavorable orientation expected during the performance of the production examination. Document the measured yoke maximum lifting power, illumination level, and exami-

nation results. 在生产检测执行期间，以预期最不利的取向检测所涂覆之样品。记录所测量到之磁轭最大提

升力、照度级别和检查结果。

(g) Compare the length of the indication resulting from the longest flaw no longer than the maximum flaw size allowed by the applicable acceptance criteria, before and after coating. The coating thickness is qualified when the length of the indication on the coated surface is at least 50% of the length of the corresponding indication prior

to coating. 比较涂层前后，由最长缺陷所引起之指示长度不得超过适用允收准则所允许的最大缺陷尺寸。

当涂层表面上的指示长度至少为涂覆前之相应指示长度的 50％时，涂层厚度技术鉴定结果是合格的。

(h) Requalification of the procedure is required for a decrease in either the AC yoke lifting power or the illu-

mination level, or for an increase in the coating thickness. 当降低交流磁轭提升力或照度等级或增加涂层厚度

时，均需要重新执行本程序。

I-760 CALIBRATION 校准

I-761 YOKE MAXIMUM LIFTING FORCE 磁轭最大提升力

The maximum lifting force of the AC yoke shall be determined at the actual leg separation to be used in the examination. This may be accomplished by holding the yoke with a 10 lb. (4.5 kg) ferromagnetic weight between the legs of the yoke and adding additional weights, calibrated on a postage or other scale, until the ferromagnetic weight is released. The lifting power of the yoke shall be the combined weight of the ferromagnetic material and the

added weights, before the ferromagnetic weight was released. Other methods may be used such as a load cell. 交

流磁轭最大提升力应以实际极距之条件下来确定，以便在检测中使用。这可通过在轭脚之间用 10 lb. (4.5

kg) 磁性铁件让磁轭吸住，并用经邮资量表或替代磅秤校准之额外重物逐次增加到磁性铁件下，直到磁性铁

件不在为磁轭所吸附而落下之方式来达成测定，在磁性铁件落下之前，磁轭的提升力应为磁性铁件和所附

加重量的合计总重；除此之外，尚可利用替代方法(诸如测力器)来完成校准作业。

I-762 LIGHT INTENSITY MEASUREMENT 照明强度测量

The black light or white light intensity (as appropriate) on the surface of the component shall be no less than that used in the qualification test. An appropriate calibrated black light and/or white light meter shall be used for the tests. Minimum white light or black light intensities shall meet the requirements of T-777.1 or T-777.2 as applica-

ble. 物项表面上之黑光或白光强度(视情况而定)应不低于鉴定试验中所采用的黑光强度或白光强度。进行

照度测量时，应采用已校准过之适当黑光和/或白光照度计来进行测定。最小白光或黑光强度应符合相应所

适用之 T-777.1或 T-777.2的规定。

I-762.1 White Light. The white light intensity shall be measured at the inspection surface. The white light

intensity for the examination shall be no less than what was used in the qualification. 白光。白光强度应在检测

表面上进行测量。所检测到之白光强度应不低于鉴定中所使用的白光强度。

I-762.2 Black Light. The black light intensity shall be measured at the distance from the black light in the procedure qualification and at the same distance on the examination specimen. The black light intensity shall be no less than that used to qualify the procedure. In addition, the maximum white light intensity shall be measured as background light on the inspection surface. The background white light for the examination shall be no greater than

what was used in the qualification. 黑光。应在规程鉴定中对检测样品所采用之相同距离处来进行黑光强度

之测量。黑光强度应不小于鉴定定该规程时所运用之强度。此外，最大白光强度应是以检测表面上之基底

亮度为背景下所进行的测定值，且检测时的背景白光不应大于鉴定中使用之强度。

I-770 EXAMINATION 检测

(a) Surfaces to be examined, and all adjacent areas within at least 1 in. (25 mm), shall be free of all dirt,

grease, lint, scale, welding flux and spatter, oil, and loose, blistered, flaking, or peeling coating. 待检测表面以及

至少与其相邻的 1 in. (25 mm)所有范围内应毫无污垢、油脂、棉绒、锈皮、焊剂和焊接飞溅物、油，以

及松散、起泡、剥落或剥离之涂层。

(b) Examine the coated item in accordance with the qualified procedure. 按照鉴定认可规程检测已涂装

之物项。

I-780 EVALUATION 评估

If an indication greater than 50% of the maximum allowable flaw size is detected, the coating in the area of the

indication shall be removed and the examination repeated. 如果指示被检测到大于最大允许裂纹尺寸的 50％

时，则应去除指示区域中的涂层，并重复检测。

I-790 DOCUMENTATION 文件

I-791 EXAMINATION RECORD 检测记录

For each examination, the information required in the records section of T-793 and the following information

shall be recorded: 每次检测都应按 T-793所要求的、下列所示的信息进行记录：

(a) identification of the procedure/technique 规程/技术编号

(b) description and drawings or sketches of the qualification specimen, including coating thickness

measurements and flaw dimensions 鉴定试样之描述和图纸或示意图(包括所要测量之涂层厚度和缺陷尺寸)

(c ) equipment and materials used 所使用之设备和材料

(d) illumination level and yoke lifting power 照度等级和磁轭提升力

(e ) qualification results, including maximum coating thickness and flaws detected 鉴定结果，包括最

大涂层厚度和所检测到之缺陷

MANDATORY APPENDIX II -GLOSSARY OF TERMS FOR

MAGNETIC PARTICLE EXAMINATION

强制性附录 II - 磁粉检测术语

Deleted ; terms and definitio ns in this Appendi x have been incorpora ted into Artic le 1, Mandatory Appen-

dix I, I-121.4. 已删除；本附录中之首要术语和定义已被纳入到第 1章之强制性附录 I 第 I-121.4段落中。

MANDATORY APPENDIX III -MAGNETIC PARTICLE EX-

AMINATION USING THE YOKE TECHNIQUE WITH FLUO-

RESCENT PARTICLES IN AN UNDARKENED AREA

强制性附录 III – 对不明显区域采用磁轭技术之荧光磁粉检测法


This Appendix provides the Magnetic Particle examination methodology and equipment requirements applica-ble for performing Magnetic Particle examinations using a yoke with fluorescent particles in an undarkened area.

本附录为不明显区域在使用荧光磁粉磁轭技术进行磁粉检测时提供了所适用之检测方法和设备的要求。

III-720 GENERAL 通则

Requirements of Article 7 apply unless modified by this Appendix. 采用第七章之规定，除非为本附录所修

改过之部分。

III-721 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

III-721.1 Requirements. The requirements of Tables T-721 and III-721 apply. 要求。采用表 T-721

和 III-721之要求。

III-721.2 Procedure Qualification. The requirements of Tables T-721 and III-721 apply. 规程鉴

定。采用表 T-721和 III-721的要求。

III-723 PROCEDURE DEMONSTRATION

The procedure shall be demonstrated to the satisfaction of the Inspector in accordance with the requirements of the referencing Code Section.

Table III-721 Requirements for an AC or HWDC Yoke Technique With Fluorescent Particles

in an Undarkened Area 表 III-721 对不明显区域使用直流或半波直流荧光磁粉磁轭技术之要求

Requirement 要求项目 Essential Var-

iable重要变量

Nonessential

Variable非重要

变量

Identification of surface configurations to be examined and product forms (e.g., base material or welded

surface) 待检测表面外形标识和产品形式(例如，母材或焊接表面) X . . .

Surface condition requirement and preparation methods表面条件要求及制备方法 X . . .

Yoke manufacturer and model磁轭制造商和型号 X . . .

Particle manufacturer and designation磁粉制造商和牌号 X . . .

Minimum and maximum pole separation最小和最大磁距 X . . .

Identification of steps in performing the examination检测执行步骤鉴定 X . . .

Maximum white light intensity 最大白光强度 X . . .

Minimum black light intensity 最小黑光强度 X . . .

Personnel qualification requirements 人员资质鉴定要求 . . . X

Reference to the procedure qualification records 可参考之规程认可记录 . . . X

III-750 TECHNIQUE 技术

III-751 QUALIFICATION STANDARD 鉴定认可标准

A standard slotted shim(s) Artificial Flaw Shims as described in T-764.2(b) shall be used as the qualification

standard. 应以 T-764.2(b)所述之手动伤试件作为鉴定认可标准。


III-761 BLACK LIGHT INTENSITY MEASUREMENT 黑光强度测量

The black light intensity on the surface of the component shall be no less than that used in the qualification test.

物项表面上之黑光强度应不低于在鉴定试验时所采用的照度。

III-762 WHITE LIGHT INTENSITY MEASUREMENT 白光强度测量

The white light intensity on the surface of the component shall be no greater than that used in the qualification

test. 物项表面上之白光强度应不大于在鉴定试验时所采用的照度。

III-770 EXAMINATION 检测

The qualification standard Artificial Flaw Shims shall be placed on a carbon steel plate and examined in ac-cordance with the procedure to be qualified and a standard procedure that has previously been demonstrated as suit-able for use. The standard procedure may utilize a visible or fluorescent technique. The flaw indications shall be compared; if the indication obtained under the proposed conditions appears the same or better than that obtained

under standard conditions, the proposed procedure shall be considered qualified for use. 手动伤试件应放置在碳

钢板上，并按照以前已证明是适合使用的是鉴定认可之规程和标准做法进行检测。标准做法可采用色差或

荧光技术。应以手动伤试件指示器进行比对；若在所提出之条件下能比标准条件下获得等同或更佳的指示

显示，则拟定规程在使用上应视为已鉴定认可了。

III-777 INTERPRETATION 解释

For interpretation, both black and white light intensity shall be measured with light meters. 进行解释前，不

管是采用黑光还是白光，其照明强度都应以亮度计进行量测。


III-791 EXAMINATION RECORD 检测纪录

For each examination, the information required in T-793 and the following information shall be recorded: 每

次检测都应按 T-793所要求的、下列所示的信息进行记录：

(a) qualification standard Artificial Flaw Shims identification 手动伤试件识别号

(b) identification of the personnel performing and witnessing the qualification 执行、见证与授权之

人员的识别号

(c ) equipment and materials used 所使用之设备和材料

(d) illumination levels (white and black light) 所使用之照度等级(白光和黑光)

(e ) qualification results 资格鉴定结果

MANDATORY APPENDIX IV-QUALIFICATION OF ALTER-

NATE WAVELENGTH LIGHT SOURCES FOR EXCITA-

TION OF FLUORESCENT PARTICLES

制性附录 IV - 以具有替代波长之光源来激发荧光磁粉之技术鉴定


This Appendix provides the methodology to qualify the performance of fluorescent particle examinations using

alternate wavelength sources. 本附录为以替代波长之光源来激发荧光磁粉之检测提供了鉴定方法论。

IV-720 GENERAL 通则

Requirements of Article 7 apply unless modified by this Appendix. 采用第七章之规定，除非为本附录所修

改过之部分。

IV-721 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

IV-721.1 Requirements. The requirements of Table IV-721 apply to Written Procedure Requirements (T-

721.1) and when specified by the referencing Code Section to Procedure Qualification (T-721.2). 要求。当引用

规范章节要求规程鉴定时(T-721.2)，表 IV-721之规定适用于编制规程时之相应要求(T-721.1)。

IV-723 PROCEDURE DEMONSTRATION 规程演示

The procedure shall be demonstrated to the satisfaction of the Inspector in accordance with the requirements of

the referencing Code Section. 规程应按照引用规范章节之要求，向检验员取得能令他满意地演示结果。

IV-750 TECHNIQUE 技术

IV-751 QUALIFICATION STANDARD 鉴定认可标准

Slotted shim(s) 0.002 in. (0.05 mm) thick having 30% deep material removed as described in T-764.2(b) shall be used to qualify the alternate wavelength light source and specific particles. Shim(s) shall be tape sealed to a ferro-

magnetic object’s surface and used as described in T-764.2(b) with the notch against the object’s surface. 对替代

波长光源和特定磁粉进行鉴定时，应采用按 T-764.2(b)所述制作一个具有切槽深度为材料厚度 0.002 in.

(0.05 mm)] 之 30％的手动伤试件。试件应贴附到铁磁性物项表面并按 T-764.2(b)所述将缺口侧朝向物项表

面。

Table IV-721 Requirements for Qualifying Alternate Wavelength Light Sources for Excita-

tion of Specific Fluorescent Particles

表 IV-721 对激发特定荧光所需之替代波长光源的鉴定要求


重要变量 Nonessential Vari-

able非重要变量

Particle manufacturer and designation磁粉制造商和牌号 X . . .

Carrier (water or oil); if oil, manufacturer and type designation 载体(水或油)；如果是石油，

制造商和型号

X . . .

Alternate wavelength light source manufacturer and model 替代波长光源之制造商和型号 X . . .

Alternate wavelength light source meter, manufacturer, and model 替代波长光源亮度计之制

造商和型号

X . . .

Filter glasses (if needed) 滤波眼镜(如需要时) X . . .

Minimum alternative wavelength light intensity 最小替代波长之照明强度 X . . .

Qualification records 鉴定认可记录 . . . X

IV-752 FILTER GLASSES 滤波眼镜

If the alternative wavelength light source emits light in the visible portion of the spectrum (wavelength of 400 nm or longer), the examiner shall wear filter glasses that have been supplied by the manufacturer of the light source

to block the reflected visible excitation light while transmitting the fluorescence of the particles. 若替代波长光源

以可见光谱(400纳米或更短的波长)之方式发出光线时，检测人员应配戴由光源制造商所供应之滤波眼镜以

阻挡激发荧光磁粉时相应所生产的反射光。

IV-770 QUALIFICATION EXAMINATIONS 鉴定认可资格检测

IV-771 BLACK LIGHT INTENSITY 黑光强度检测

The black light intensity on the examination surface shall be adjusted by varying the distance or power so that it

has a minimum intensity of 1,000 μW/cm2 and a maximum intensity of 1,100 μW/cm2. 物项表面上之黑光强度，

可藉距离上或功率上的变化以使具有 1,000 μW/cm2至 1,100 μW/cm2间的可调范围。

IV-772 EXAMINATION REQUIREMENTS 检测要求

The examination parameters for the object chosen shall be determined by the rules of T-750 applicable to the object chosen and the method of magnetization. Any of the magnetizing techniques listed in T-751 may be used. The same indication(s) of the shim discontinuity(ies) shall be used for both black light and alternate wavelength

light examinations. 所选定物项之检测变数应以 T-750适用于所选定物项和磁化方法之要求进行确定。任何

列于 T-751之磁化技术出均可采用。以黑光灯和替代波长光照所进行之检测时应采用同一手动伤试件指示

器。

IV-772.1 Examination With Black Light. The qualification standard with the attached shim(s) artificial flaw shim(s) (see T-764.2(a)) shall be examined with the established parameters and specific particles in a darkened

area with black light illumination. The resulting particle indication(s) shall be photographed. 用黑光灯检测。采

用手动伤指示器[(见 T-764.2(b)]之鉴定标准应按所建立之变量在黑暗区域中对特定磁粉以黑光灯进行检测，

由此而所获得之磁粉指示应拍照存档。

IV-772.2 Examination With Alternate Wavelength Light. Using the same particle indication(s) exam-ined in IV-772.1, switch to the alternate wavelength light source and adjust the light intensity by varying the dis-tance or power, to establish particle indication(s) essentially the same as that (those) obtained with the black light above. The light intensity shall be measured with the alternative wave length light meter. The resulting particle indi-cation(s) shall be photographed using identical photographic techniques as used for the black light. However, cam-era lens filters appropriate for use with the alternate wavelength light source should be used for recording the indi-

cation(s), when required. 以替代波长光源所进行之检测。采用在 IV-772.1检测中相同的磁粉指示器，切换

到替代波长光源并藉由距离上或功率上的变化，以获得与上述黑光灯相同的实质指示。照明强度应与以适

用于该替代波长之亮度计进行测量。由此所产生之磁粉指示应采用与用于黑光拍照相同的摄影技术。然

而，当照片需用作指示之记录时，相机镜头采用之滤波器应与替代波长光源相配。

IV-773 QUALIFICATION OF ALTERNATE WAVELENGTH LIGHT SOURCE

AND SPECIFIC PARTICLES 替代波长光源和特定磁粉检测技术之限制

When the same particle indication(s) as achieved with black light can be obtained with the alternate wavelength light source, the alternate wavelength light source may be used for magnetic particle examinations. The alternate wavelength light source with at least the minimum intensity qualified shall be used with the specific particle desig-

nation employed in the qualification. 当替代波长光源具有与黑光灯相同的磁粉指示能力时，则替代波长光源

可应用在磁粉检测上。在应用限制上，对所用之特定磁粉牌号，波长光源之照度应至少为已认可之最小照

明强度。


IV-791 EXAMINATION RECORD 检测纪录

For each examination, the information required in T-793 and the following information shall be recorded: 每次

检测都应按 T-793所要求的、下列所示的信息进行记录：

(a) alternative wavelength light source, manufacturer, and model 替代波长光源之制造商和型号

(b) alternative wavelength light source meter, manufacturer, and model 适用于替代波长光源之亮度

计制造商和型号

(c ) filter glasses, when necessary 滤光镜片，必要时

(d) fluorescent particle manufacturer and designation 荧光磁粉之制造商和型号

(e ) qualification standard identification 鉴定标准之编号

(f) technique details 技术细节

(g) identification of the personnel performing and witnessing the qualification 执行、见证与授权之人

员的识别号(H)所使用之设备和材料

(h) equipment and materials used 替代波长之最小照明强度

(i) minimum alternate wavelength light intensity

(j) black light and alternative wavelength light qualification photos, exposure settings, and filters, if used

黑光灯和替代波长光源之认可照片、曝光设置和过滤器(如使用时)

MANDATORY APPENDIX V -REQUIRE-

MENTS FOR THE USE OF MAGNETIC RUB-

BER TECHNIQUES 强制性附录 V - 磁性橡胶技术之使用要求

V-710 SCOPE 适用范围

This Appendix provides the methodology and equipment requirements applicable for performing magnetic parti-cle examinations using magnetic rubber techniques in place of wet or dry magnetic particles. The principal applica-

tions for this technique are 本附录对以磁性橡胶检测技术来取代湿或干磁粉检测技术时提供了所适用的方法

和设备要求。这种技术之主要应用如下：

(a) limited visual or mechanical accessibility, such as bolt holes 当视觉或机械的可接近性受限制

时，如螺栓孔

(b) coated surfaces 涂层表面厚度亦超出惯用湿或干磁粉检测技术之检测能力范围时

(c ) complex shapes or poor surface conditions 复杂的几何形状或较差的表面状况时

(d) discontinuities that require magnification for detection and interpretation 为达到显示和能解释之

效益而需放大不连续性时

(e ) permanent record of the actual inspection 需成为实际检查之永久记录时

V-720 GENERAL REQUIREMENTS 通用要求

V-720.1 Requirements. Requirements of Article 7 apply unless modified by this Appendix. 要求。采用

第七章之规定，除非为本附录所修改过之部分。

V-720.2 Application. To accommodate the examination of a variety of surfaces, a liquid polymer contain-ing ferromagnetic particles is applied to the surface instead of conventional dry or suspended wet particles. During the cure time, the application of magnetizing fields cause the particles to migrate and form patterns at discontinui-ties. The polymer cures forming an elastic solid (e.g., a rubber replica) with indications permanently fixed on its

surface. 应用。为适应各种表面之检测，在应用时并非施加惯用的干磁粉或湿磁粉悬浮液，而是将含有铁

磁粉之液体聚合物施加到表面上。在硫化期间，由于磁化场作用致使铁磁粉产生移动效应进而在形式不连

续性之图案。硫化之聚合物形成一种富有弹性的固形物(例如，橡胶复制品)并将指示久地固定在其表面

上。

V-721 WRITTEN PROCEDURE REQUIREMENTS 书面规程要求

V-721.1 Requirements. Magnetic rubber techniques shall be performed in accordance with a written proce-dure that shall, as a minimum, contain the requirements listed in Table V-721. The written procedure shall establish

a single value, or range of values, for each requirement. 要求。磁性橡胶技术应按照书面规程进行，书面规程

至少应包含表 T-721和表 I-721中所列之要求项目，且书面规程应为每种要求制定单一值或系列值之范围。

V-721.2 Procedure Qualification. When procedure qualification is specified by the referencing Code Sec-tion, a change of a requirement in Table V-721 identified as an essential variable shall require requalification of the written procedure by demonstration. A change of a requirement identified as a nonessential variable does not re-quire requalification of the written procedure. All changes of essential or nonessential variables from those specified

within the written procedure shall require revision of, or an addendum to, the written procedure. 规程鉴定。当引

用规范章节要求规程鉴定，且表V-721中之重要变量有所改变时，应通过演示以重新鉴定书面规程。非重

要变量上的改变，书面规程是不需重新鉴定的。所有重要或非重要变量若有所变更时，书面规程都应进行

修订或补遗。

V-730 EQUIPMENT 设备

V-731 MAGNETIZING APPARATUS 磁化装置

A suitable means for producing the magnetic field orientation and strength in the part shall be employed, using direct or rectified current except where coatings are involved. Fields generated by alternating current electromag-netic yokes shall not be used except where nonmagnetic coatings are used on external surfaces. Gaussmeters or arti-

ficial shims shall be used for field strength and direction determination. 应采用能在物项中产生磁场取向和强度

的适用方法，至于是使用直流还是整流电流，则取决于所涉及之涂层。除非外表面涂层是非磁性涂料，否

则不应使用交流电磁轭所产生之磁场。在场强和方向测定上应采用高斯计或手动伤试件来进行量测。

V-732 MAGNETIC RUBBER MATERIALS 磁橡胶材料

The material shall be in the form of a vulcanizing polymer (rubber) liquid or semiliquid, containing ferromag-netic particles. The material shall be utilized at the temperature range as recommended by the manufacturer. When

demonstration is required, the temperature shall be recorded. 材料应为含有铁磁性粒子之硫化聚合物(橡胶)液

体或半流质。材料应在制造商所推荐之温度范围内应用。当需要演示时，应记录演示温度。

V-733 MAGNETIC FIELD STRENGTH 场强

A calibrated gaussmeter or artificial shims shall be used to determine the magnetic field strength and direction on surfaces to be examined. The gaussmeter device shall be equipped with both transverse and axial field probes. Dial or similar type calibrated meters of suitable range may be used, providing they are capable of making trans-verse and axial measurements. Values for G (kAm-1) or the use of artificial shims shall be in accordance with T-764.

应采用校准过之高斯计或手动伤试件来确定被检测表面上的场强和方向。高斯计应配配备横向和轴向磁场

侦测探头；刻度式或类似类型之已校准过仪表亦可采用，只要它们具有适用的量测范围且能进行横向和轴

向测量。若采用G(kAm-1)值或手动伤试件时，应符合 T-764之要求。

V-734 MAGNIFICATION 放大率

Replica viewing may be aided by the use of magnification. 可藉由将复制试样予以放大以辅助观察。

V-740 MISCELLANEOUS REQUIREMENTS 杂项要求

V-741 SURFACE PREPARATION 表面制备

(a) Prior to the magnetic particle examination, the surface(s) to be examined and adjacent areas within at least 1/2 in. (13 mm) of the area of interest shall be dry and free of all dirt, oil, grease, paint, lint, scale and welding flux, and other extraneous material that could restrict particle movement and interfere with the examination by pre-venting cure or extending the curing time. Nonmagnetic surface coatings need not be removed for techniques using

an alternating current electromagnetic yoke.在进行磁粉检测之前，对待检测表面和所有相邻区域(至少 1英寸

(25毫米))应进行检查，以确定是干燥的、无任何污垢、油、油脂、油漆、棉绒、锈皮、焊剂等，和可能

通过抑制硫化或延长硫化时间致使粉粒流动受限制并进而对检测带来干扰之其他外来物。若使用交流磁轭

技术，则不需去除非磁性表面涂层。

Table V-721 Requirements for the Magnetic Rubber Examination Procedure

表 V-721 磁橡胶检测规程之要求项目


重要变量 Nonessential Varia-

ble非重要变量

Magnetic Rubber Mix Formulations [Manufacturer’s name(s) for material of various viscosities

and recommended cure times] 磁橡胶混合配方[各种粘度和推荐硫化时间之材料制造商名称]

X —

Surface preparation 表面制备 X —

Magnetizing technique 磁化技术 X —

Field strength 场强 X —

Nonmagnetic coating thickness greater than previously qualified 非磁性涂层厚度大于之前所鉴定

认可的值

X —

Minimum cure time as recommended by the manufacturer 制造商所推荐之最小硫化时间 X —

Releasing agent 脱模剂 X —

Temperature range as specified by the manufacturer 制造商所规定之温度范围 X —

Performance demonstration, when required 技能演示(当需要时) X —

Number of fields and directions to be applied and magnetizing time for each direction 所要应用之

磁场数和方向以及在每一方向上之磁化时间

X —

Demagnetizing 消磁 — X

Personnel qualification requirements 人员资格要求 — X

Reference to the procedure qualification records 可参考之规程认可记录 — X

(b) When nonmagnetic coatings are left on the part in the area being examined, it shall be demonstrated with an alternating current electromagnetic yoke that the indications can be detected through the existing maximum

coating thickness per Article 7, Mandatory Appendix I. 当非磁性涂层留在被检测区域之物项上时，应按第 7

章(强制性附录 I)对现存最大涂层厚度以交流电磁轭验证技术来证实指示是可被检测到的。

V-742 TAPING AND DAMMING 贴扎和围偃

Tape, putty, plugs, and other suitable means shall be used to form dams or encapsulations that will provide a reservoir or containment to hold the liquid or semi-liquid polymer in contact with the area of interest during mag-netization and until curing is complete. The construction of the containment will depend on the geometry of the ma-

terial and the area of interest. Some examples are as follows: 应使用胶带、油灰、填料和其他合适之方式来构

成围偃或包封，以在磁化期间对与被检测区域接触之液体或半流聚合物提供一个类似储层或容器的容纳空

间，直至聚合物硫化完成。包封构造型式之主要形成因子是取决于材料和被检测区域的几何形状。有些例

子如下：

(a) Horizontal Through–holes. Place adhesive tape over one side of the hole, making a pinhole in the tape at the top of the hole for release of air during pouring. A cup, open on the top side and fabricated from heavy aluminum foil, may be attached with tape or putty to the opposite side of the hole to serve as a funnel during pour-

ing of the liquid polymer. 水平贯通孔。将胶带贴在孔的一侧，并在胶带顶部作出一个小排气孔，以便在施

加过程中得以排气，并用胶带或油灰将厚铝箔所制成之顶部开口型杯子附着到孔的相对侧，以作为液体聚

合物施加用漏斗。

(b) Flat Surface. Putty dams may be constructed around the area of interest to contain the liquid polymer

after pouring. 平面。将油灰涂带检测区域周围以构件一圈围偃，以便在浇注后容纳液体聚合物。

(c ) Inverted Surfaces. A putty reservoir may be placed beneath the examination area and pressure fill the area with liquid polymer allowing trapped air to escape by placing a small vent hole in the dam next to the area of interest. Inverted holes may be filled by pressure feeding the liquid polymer at the upper side of the dammed hole. Place a small tube, open at each end, next to the fill tube with one end at the same location as the end of the fill tube. Pressure feed until the polymer overflows from the second tube. Remove tubes when fill is completed and

plug access holes. 朝下之表面。可以在检测区域下方放置一个由油灰储所制成之贮存器，并将液体聚合物

加压填充至该区域，在被检测区域旁边之围偃中放置一个小倒空孔，以便排气。倒空孔可能会因从坝洞上

方加压输送液体聚合物而被先填满，为确认液体聚合物否已确实填充下，可在填充管附近加放一支每端都

打开的小管，并使其一端与填充管支末端位于相同的位置，在压力送料下，直到聚合物从第二支管子溢出

时，即表示填充完成。填充完成后拔下管子，堵住所有通孔。

V-743 RELEASE TREATMENT 脱模处理

Areas where the liquid polymer has been in contact with the examination or other surfaces may result in a tem-porary adhesion of the rubber. To avoid this condition, the area where the liquid polymer will be in contact shall be treated with a Teflon-type release agent prior to the application of the liquid polymer. The release treatment agent

shall not contain silicones. 液体聚合物与检测面或其他表面所接触之范围可能导致橡胶的暂时性粘附，为避

免这种情况发生，与液体聚合物会产生接触之所有区域应在施加液体聚合物之前用特氟龙型脱模剂处理。

脱模处理剂不应含有硅氧烷。

V-750 TECHNIQUES 技术

V-751 TECHNIQUES 技术

Magnetization techniques used are comparable to those described in T-750. Direct current electromagnetic

yokes are the preferred magnetizing device. 本附录所使用之磁化技术相当于 T-750中所述之那些技术。直流

电磁轭则是优选的磁化装置。

V-752 APPLICATION OF MAGNETIC FIELD 磁场施加

Flaws are displayed more vividly when a discontinuity is oriented perpendicular to the magnetic lines of force. Magnetism shall be applied in a minimum of two or more directions, where two of the magnetic lines of force are approximately perpendicular to each other and at least one of the lines of force are perpendicular to suspected dis-

continuities. 当不连续性之取向磁力线相垂直时，伤会有最佳的显示效果。磁力应至少施加两个或更多个

方向，其中两个磁力线彼此大致垂直，并且至少有一个力线垂直于可疑的不连续点。

V-760 CALIBRATION 校准

V-764 MAGNETIC FIELD ADEQUACY AND DIRECTION 磁场充分性和方向性

The field strength shall be measured using a gaussmeter. The area to be examined shall be checked in two di-rections by placing the gaussmeter probe in the hole or on the surface to be inspected and noting the field strength and direction of the magnetic field. Artificial flaw shims, as described in T-764.2(b), may also be used when acces-

sibility allows, to determine the field strength and direction of magnetization using wet or dry particles. 场强应使

用高斯计进行测量。将高斯计探头放置在孔或待检测表面上，在至少两个方向上进行检测及记录磁场的场

强和方向。如 T-764.2(b)中所述，当可达性允许使用湿颗粒或干颗粒确定磁化强度和磁化方向时，也可以使

用手动伤试件。

V-770 EXAMINATION 检测

V-773 APPLICATION OF LIQUID POLYMER-MAGNETIC PARTICLE MATE-

RIAL 液体聚合物-磁粉材料之应用

Following the initial steps of preparation, a freshly prepared polymer-magnetic particle mix shall be cast or molded into/onto the prepared area. The magnetic field, previously determined to have the required minimum field strength recommended by the polymer-particle manufacturer, shall be applied to the area of interest. A minimum of

two fields 90 deg apart shall be maintained for an equal amount of time during the cure time of the liquid polymer-particle mix used. When more than two fields are to be applied, a minimum time in the first direction shall be al-lowed before magnetization in the next direction is applied and the same minimum time used for each subsequent magnetization. The cure time applied to each direction shall be based on the mix’s cure time divided by the number

of magnetic fields applied. 在首要制备步骤之后，将当制备好之聚合物-磁粉混合物浇注或压注到所制备之

区域中(或上)。受检测区域所适之用应事先确定符合聚合物 - 磁粉制造商之推荐值。在所使用之液体聚合物

- 磁粉混合物的硫化时间内，至少在两个相互垂直区域内保持相同的时间。当需要施加两个以上的磁化时，

在第一次方向上之最小磁化时间后再施加下一个磁化方向，并且随后每个磁化都采用相同的最小磁化时

间。适用于每个方向的硫化时间应为混合物硫化时间除以所施加之总磁场数。

V-774 MOVEMENT DURING CURE 硫化期间之移动

During the cure time of the liquid polymer-particle mix, movement of the item shall be avoided to ensure indi-

cations are not distorted. 在聚合物-磁粉混合物的硫化时间内，应避免移动物品，以确保指示不会扭曲变

形。

V-776 REMOVAL OF REPLICAS 取下复制试样

Replicas shall be removed as soon as practical after cure by careful use of a tool or compressed air. Additional

time must be allowed if the polymer is not fully cured or sticks to the examination area. 在固化后应以工具或压

缩空气尽快地将复制试样小心地取下来。若聚合物尚未完全硫化或仍粘在检测区域，则让混合物再多点硫

化时间。

V-780 EVALUATION 评估

(a) All indications shall be evaluated in terms of the acceptance standards of the referencing Code Section.

所有指示应按引用规范章节之允收准则进行评估。Using Aspen Plus in Thermodynamics Instruction

(b) Following removal, the replicas shall be examined visually in order to detect any damage to the surface of the replica. When the area of interest shows damage or lack of fill or contact with the examination surface, the

examination shall be repeated. 取下后，应对复制试样表面上之任何损坏进行目视检查。当被检测区域显示

损害、填充不足或与检测面粘着时，应重新检测。

(c ) When dimensional data is required, an illuminating-magnifying device capable of making measurements

shall be used. 当需要尺寸数据时，应采用能进行测量之照明放大装置。

V-790 DOCUMENTATION 文件

V-793 EXAMINATION RECORDS 检测记录

For each examination, the following information shall be recorded: 对于每次检查都应记录以下信息：

(a) date of the examination 检测日期

(b) procedure identification and revision 规程编号和版本

(c ) magnetic rubber mix – manufacturer and identification 磁橡胶混合物之制造商和型号

(d) examination personnel, if required by the referencing Code Section 检测人员(如果引用规范章节

要求时)

(e ) map or record of indications for evaluation, per T-792 按照 T-792所绘制之指示分布图或评估

记录

(f) use, type and power of magnification 放大装置之用途、类型和放大倍数

(g) material and thickness 材料和厚度

(h) magnetic particle equipment and type of current 磁粉设备及电流类型

(i) gaussmeter; manufacturer, model, serial number, or artificial shims used 高斯计之制造商、型

号、序列号或手动伤试件

(j) field strength (if gaussmeter is used), duration and total time of application 场强(若采用高斯计

时)、在各方向上之磁化时间和总施加时间

(k ) when more than two fields are applied, number and sequencing of the applications 当施加两个以

上之磁场时，每一施加编号和顺序

(l) temperature 温度

NONMANDATORY APPENDIX A -MEASURE-

MENT OF TANGENTIAL FIELD STRENGTH

WITH GAUSSMETERS 非強制性附錄 A - 用高斯計測量表面場強

A-710 SCOPE 適用範圍

This Nonmandatory Appendix is used for the purpose of establishing procedures and equipment specifications

for measuring the tangential applied magnetic field strength. 本非強制性附錄旨在用於制定對表面施加磁場強

度測量上所需規程和設備技術條件。

A-720 GENERAL REQUIREMENTS 通用要求

Personnel qualification requirements shall be in accordance with Article 1. 人員資格要求應符合第 1章之規

定。

Gaussmeters and related equipment shall be calibrated in accordance with T-763. 高斯計和相關設備應按 T-

763之說明進行校準。

Definitions: standard terminology for magnetic particle examinations is presented in SE-1316. 定義：磁粉檢

測標準術語見於 SE-1316。

A-730 EQUIPMENT 設備

Gaussmeter having the capability of being set to read peak values of field intensity. The frequency response of

the gaussmeter shall be at least 0 Hz to 300 Hz. 被設定為具有讀取場強峰值能力之高斯計，其響應頻率應至少

為 0 Hz至 300 Hz。

The Hall-Effect tangential field probe should be no larger than 0.2 in. (5 mm) by 0.2 in. (5 mm) and should have a maximum center location 0.2 in. (5 mm) from the part surface. Probe leads shall be shielded or twisted to prevent reading errors due to voltage induced during the large field changes encountered during magnetic particle

examinations. 霍爾效應切向場探頭不應大於 0.2 in. (5 mm) x 0.2 in. (5 mm)，且中心位置與零件表面間之

最大間距宜為 0.2 in. (5 mm)。探頭導線應被屏蔽或捻绞，以防止在磁粉檢測期間碰上大場變期間所誘發之

電壓響應而造成的错误讀數。

A-750 PROCEDURE 程序

Care shall be exercised when measuring the tangential applied field strengths specified in T-764.2(c). The plane of the probe must be perpendicular to the surface of the part at the location of measurement to within 5 deg. This may be difficult to accomplish by hand orientation. A jig or fixture may be used to ensure this orientation is

achieved and maintained. 按 T-764.2(c)規定測量切向場強時應小心。探頭平面須與受測物項表面呈 90º±5度

內，但這對於手工定向來說確實是有難度的，因此須藉由夾具或治具來實現並確保該取向於量測期間能保

持穩定。

The direction and magnitude of the tangential field on the part surface can be determined by placing the Hall-Effect tangential field probe on the part surface in the area of interest. The direction of the field can be determined during the application of the magnetizing field by rotating the tangential field probe while in contact with the part until the highest field reading is obtained on the Gaussmeter. The orientation of the probe, when the highest field is obtained, will indicate the field direction at that point. Gaussmeters cannot be used to determine the adequacy of

magnetizing fields for multidirectional and coil magnetization techniques. 將霍爾效應切向場探頭置於受檢測物

項零件表面上以確定切向場方向和幅度；在探頭與受測物項相接觸之條件下，可在施加磁化場期間將探頭

略作旋轉，直到能在高斯計上獲得最高場讀數，此時，探頭的取向即表示在該點處的場方向。對多向和線

圈磁化技術之磁化場而言，高斯計是無法確定磁化場恰当性的。

Once adequate field strength has been demonstrated with artificial flaw shims, Gaussmeter readings may be used at the location of shim attachment on identical parts or similar configurations to verify field intensity and di-

rection. 一旦用手动傷試件證明具有足夠的場強時，高斯計讀數可在相同物項或類似配置上手动傷試件所放

置之位置處使用，以驗證場強和方向。

A-790 DOCUMENTATION/RECORDS 記錄文件

Documentation should include the following: 記錄文件應包括下列內容：

(a) equipment model and probe description; 設備型號和探頭描述;

(b) sketch or drawing showing where measurements are made; and 顯示測量位置之示意圖或詳

圖；

(c ) field intensity and direction of measurement. 場強和測量方向。

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