朋億股份有限公司 · according to the latest report from ledinside, a division of the market...

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朋億 股份有限公司 NOVA TECHNOLOGY CORP. The Expert of manufacturing for facility equipment Commit to the sustainable development of Earth Stock Code6613

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Page 1: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

朋億股份有限公司NOVA TECHNOLOGY CORP.

The Expert of manufacturing

for facility equipmentCommit to the sustainable

development of Earth

Stock Code:6613

Page 2: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Summary Outline

Company Introduction

Operations Overview

Future Prospects

Competitive Advantage

Development Perspectives

2

Page 3: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Disclaimer

This newsletter is the main and objective factor of the company at the

time of the briefing. It summarizes and evaluates the past, present and

future operations. It contains forward-looking statements which will be

affected by risks, uncertainties and inferences. Some will exceed ours.

Outside the control, the actual conclusion may be very different from

these forward-looking statements.

The information provided (including views on the future) does not express

or guarantee the accuracy, completeness and reliability of the information,

express or implied; nor does it represent the complete description of the

Company, the industry conditions and subsequent major developments.

We do not guarantee the correctness of the data and is not responsible for

updating or amending the contents of this newsletter.

3

Page 4: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Chin-Li LiangChairman

Charly HsuGeneral Manager

June, 1997Establishment Date

Dec, 2017TPEx-listed Date

NTD$399,280,000 (Paid-in capital till end of Dec.2018)Capital Amount

10F-1, No.76, Sec. 2, Jiafeng S. Rd., Zhubei City, Hsinchu CountyAddress

1.High-tech plants factory equipment R&D and manufacturing

2.Water, gas, and chemical supply system integration services.

3.Waste reduction and recycling, energy conservation and

environmental protection system.

4.Water resources development and recycling integration service.

Product

160 in headquarters / total 441 in the GroupNo. of employee

Company Introduction-Basic Information

4

Page 5: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Shanghai WinmaxTechnology Corp.

Founded in 2004 Capital: US$4,890 K

Winmega Technology Corp.

Founded in 2014 Capital: NTD$30,000 K

Suzhou WinmaxTechnology Corp.

Founded in 2016 Capital: US$1,000 K

Novatech E&C (S.G. )Founded in 2016 Capital: SGD$1,000 K

Nova Technology Corp. 29%

Revenue % in 2018

58%

1%

10%

2%

Company Introduction-Business Scale

5

Page 6: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

High purity chemical supply and dispensing

system

Waste stripper and waste solventsrecycle system

Special gas supply system

Green energy& Environmental

protection systemIntegrated

WetProcess

equipment

Five Core Products

A+B+C D+E

BusinessScope

High-Tech Process EquipmentHigh-Tech Process

EngineeringEnvironmental Protection

High-tech industrial water, gas andchemical process supply system equipment manufacturing, trading, construction installation and testing.

High-tech industrial water, gas and chemical process supply system design.

Wastewater, waste gas and waste chemical recycling and reuse of equipment in high-tech industries.

Revenue %

in 201860% 34% 5%

Revenue %

in 201744% 37% 17%

Company Introduction-Main Products

6

Page 7: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Company Introduction-Sales Analysis

2018 Revenue by Area

Taiwan China Others

756,681 3,755,299 354,723

Total : 4,866,703 (Unit: NT$ thousand)

2017 Revenue by Area

Taiwan China Others

982,585 2,237,338 122,619

Total : 3,342,542 (Unit: NT$ thousand)

16

%

29

%

77

%

7

%

67

%

4

%

7

YOY

68%

Page 8: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Unit NT$ thousand

%2016 2017 2018

Revenue 1,240,615 1,749,384 3,125,591

Percentage of

Revenue

64%

47%

YOY

41%

Company Introduction-Main Customers

8

52% YOY

79%

Page 9: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Unit NT$ thousand

%2016 2017 2018

Revenue 1,286,801 1,359,390 1,480,762

Percentage of

Revenue

30%

48%

YOY

6%

Company Introduction-Main Customers

9

41%

YOY

9%

Page 10: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

10

Operations Overview-

Group Revenue VS EPS after Tax

446,567

673,987

1,144,529

386,289

890,045

561,436 751,200

1,139,861

1,285,258

1,599,295

1,061,959

920,191

0.88

3.42

4.09

1.44

4.42

2.91 2.77

2.52

7.08

3.91

2.99

0.00

1.00

2.00

3.00

4.00

5.00

6.00

7.00

8.00

0

200,000

400,000

600,000

800,000

1,000,000

1,200,000

1,400,000

1,600,000

1,800,000

2016/Q1 2016/Q2 2016/Q3 2016/Q4 2017/Q1 2017/Q2 2017/Q3 2017/Q4 2018/Q1 2018/Q2 2018/Q3 2018/Q4

Revenue (Unit NT$ thousand) EPS after Tax (Unit NT$)

4.97

Page 11: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Unit NT$ 2015 2016 2017 2018

EPS after Tax 6.62 9.83 15.07 16.5

Cash Dividend 3.5 6 1015(Waiting for

Shareholders to

Pass)

Stock Dividend 0.5 0 -

Operations Overview-Dividend Policy

11

0

2

4

6

8

10

12

14

16

18

2015 2016 2017 2018

EPS

Stock Dividend

Cash Dividend

EPS VS Cash Dividend VS Stock Dividend

Cash dividend rate is more than 50% for three consecutive years

Page 12: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Operations Overview-

Revenue from China Area

12

0

500,000

1,000,000

1,500,000

2,000,000

2,500,000

3,000,000

3,500,000

4,000,000

2014 2015 2016 2017 2018

revenue from China (Unit NT$ thousand)

Page 13: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Competitive Advantage

13

Hi-tech Enterprise certificate

Page 14: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Competitive Advantage

Patent & Copyright

Page 15: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

The National Brand Yushan Award

Page 16: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Future Prospect-China's Positive Expansion

of Wafer Fabrication

16

GCL

Xuzhou

2019

SiEn

Qingdao

12mm

2019

Silergy

Qingdao

12mm

2019

SMIC

Sourth

12mm

2019

Hua Hong

Wuxi

12mm

2019/H1

HSMC

Wuhan

12mm

2019

Tacoma

(2nd Period)

Huai'an

8,12mm

2019/Q4

UNIS

Nanjing

12mm

2020

Innotron

Hefei

12mm

2019

CR

MICRO

Chongqing

12mm

Samsung

(2nd Period)

Xi'an

12mm

2019

UNIS

Chengdu

12mm

2020

SMIC

Shaoxing

8mm

2020

參考資料:國泰證券研究報告-2018年半導體設備產業展望、市場資訊、ASML、聖暉整理

YMTC

(2nd Period)

Wuhan

12mm

2019

Company

Location

Wafer Size

Expected Trial Production

Schedule

DUET

Beijing

6mm

United Semi

(2nd Period)

Xiamen

12mm

2020

SMIC

Beijing

12 mm

2019

GTA

Shanghai

8mm

2019

AOSMD

Chongqing

12mm

Silan

Xiamen

12mm

2019

Zhongjing

Jiaxing

12mm

2019

HFC

Tientsin

8,12mm

2019

Page 17: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Source : http://www1.semi.org/en/semiconductor-equipment-sales-forecast-62-billion-2018-new-record-market-reset-2019-new-high-2020

Future Prospects-

Semiconductor Equipment Sales Forecast

17

SEMI, the global industry association representing the electronicsmanufacturing supply chain, reported that worldwide sales of newsemiconductor manufacturing equipment are projected to increase9.7 percent to $62.1 billion in 2018, exceeding the historic high of$56.6 billion set last year. The equipment market is expected tocontract 14.0 percent in 2019 but grow 27 percent to reach $670billion, an all-time high.

Page 18: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Source : SEMI Year-End Total Equipment Forecast

Future Prospect- Semiconductor Equipment Sales

Forecast

18

2019-2020 Semiconductor Equipment Sales Forecast

Page 19: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Future Prospect-

Unwavering in its drive to build a strong, self-sufficient semiconductor supply

chain, China plans more new fab projects than any other region in the world from

2017 to 2020, and its expansion of fab capacity recently picked up pace on the

strength of new foundry and memory projects from both domestic and foreign

o pa ies, a ordi g to SEMI’s 8 China semiconductor Silicon Wafer

Outlook report. Chi a’s i stalled fa apa it is fore ast to gro at a per e t CAGR from 2.3 million wafers per month (wpm) in 2015 to 4 million wpm in 2020,

faster than all other regions.

19Source: https://www.design-reuse.com/news/45377/china-semiconductor-silicon-wafer-outlook.html

Page 20: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Future Prospect-Chinese panel makers

continue to release new capacity

The global production capacity of small- and medium-sized AMOLED panels continues

to expand, and will reach 13.6 million m2 by 2018, an increase of 51.1% compared with

the previous year, says WitsView, a division of TrendForce. As Chinese panel makers

continue to release new capacity, the global capacity of small- and medium-sized

AMOLED panels may double to 27.3 million m2 in 2021.

Chi ese pa el akers’ i est e t i e AMOLED pa el apa it is o the rise, due to the high demand for AMOLED panels from branded Chinese manufacturers coupled

ith the go er e t's supporti g poli . For e a ple, BOE’s first Ge 6 fa of fle i le AMOLED panel has entered mass production in Chengdu at the end of 2017. Tianma

and Visionox also expect the mass production of flexible AMOLED panel in their Gen 6

fabs in 2018. In the next few years, both Everdisplay Optronics (EDO) and China Star

Optoelectronics Technology (CSOT) have also put forward plans for AMOLED panel

production. It is estimated that the production capacity of small- and medium-sized

AMOLED panels in China will contribute to 37% of the global capacity in 2021, up from

16% in 2018. Meanwhile, the proportion of capacity in South Korea will be 53% in

2021, down from 81% in 2018.

20https://press.trendforce.com/press/20180621-3119.html

Page 21: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Future Prospect-Global Market Shares Of

Smartphone Display Rechnologies

21

https://www.witsview.com/2019/02/23/trendforce-says-rising-demand-will-help-the-ltps-market-reach-a-healthy-equilibrium-in-2019

Page 22: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

Future Prospect- Chinese LED Forecast

22

659

768

2017 2018 2019 2020 2021

According to the latest report from LEDinside, a division of the market research firmTrendForce, 2018 Chinese LED Chip and Package Industry Market Report, ChineseLED package market scale is RMB 65.9 billion in 2017 and it is expected to reach RMB76.8 billion in 2021, according to LEDinside. Major growth momentum include lighting,digital display, automotive lighting and architectural / landscape lighting.

資料來源 LEDinside 20180620https://www.ledinside.com/intelligence/2018/6/ledinside_chinese_led_package_market_scale_will_reach_rmb_76_8_billion_in_2021

Unit millon/RMB

Page 23: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

23

Water Resources

Development

Resource

Technology for

Waste Material

Industry-University

Cooperative

Combining the advantages of foreign technology and engineering experience, developing desalination and recycling water markets.

Inheriting the experience of the science park and jointly developing new technologies and methods with domestic schools.

Recover and reuse valuable substances in waste water.

Development Perspectives-Environmental & Green Energy System Integration Expert

Page 24: 朋億股份有限公司 · According to the latest report from LEDinside, a division of the market research firm TrendForce, 2018 Chinese LED Chip and Package Industry Market Report,

The Expert of manufacturing

for facility equipmentCommit to the sustainable

development of Earth

Stock Code:6613