产品的热设计(thermal introduction)

8/17/2019 (Thermal Introduction)

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Introduction of Thermal

GGT/RE – Environment Test Team


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Primary Mechanic of Heat

Transfer

Thermal energy transport:cause y temperature di!erence" high T #$ lo% T

&onduction

Heat transferring y solid medium

&onvection Transferring energy et%een solid surface and 'uid

Mass transport

(atural )free* convection+orced convection

RadiationHeat transferring y electromagnetic %aves


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&onduction

+ourier,s -a%. #01 Δ T/Δ-

.: heat transfer rate1: cross#sectional area of heat 'u2

Δ T/Δ-: temperature gradient

0: thermal conductivity )3/m4*E25 1l 678

&u 798

Mylar 59


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&onvection

(e%tonian cooling -a%.c hc 1s )Ts – Ta*

.c: convection heat transfer rate

1s: surface area Ts: surface temperature of solid

Ta: tmperature of amient

hc: heat transfer coe;cient" f)'o% type"

ody geometry" physical property"temperature" velocity" viscosity


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Radiation

.a εσ1+:#6) Ts> – Ta>*

.a: radiation heat transfer rate

ε: emissivity" 8 ≦ ε ≦ σ: ?tefan#@oltAmann constant

1: surface area

+1-2

: vie% factor Ts: temperature of ody s

Ta: temperature of ody a


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Thermal Resistance

R B / IB: voltage Δ T: temperature di!erence

I: current .: heat

&onductionR4 Δ-/014

&onvection

Rs / hc1sRadiation

Ra )Ts – Ta* /εσ1+:#6) Ts> – Ta>*


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@asic &oncepts for (@ Thermal

Cesign

Thermal Cesign Target Thermal design must meet thermal spec5 of &PD"

all 4ey components )HCC" +CC" &C#RM"

P&M&I1


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Cesign

?ystem Thermal &oupling e!ect

Θ #a )T – Ta – Tsys* / Pcpu

Tsys: system temperature Psys Θ

ΣPiθi" )i: CR1M" &hipset" HCC" +CC" &C#

RM


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Cesign

Thermal ?olutions Passive thermal solution

1ctive thermal solution Hyrid thermal solution

RHE Remote Heat E2changer


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@asic &oncepts for (@ ThermalCesign

&haracteristic of a good passivecomponents ?preader plate connected to &PD should e as

large as possile

Temperature variation on spreader plate should eminimal

&haracteristic of a good active component 1ir inlet and outlet should e clearly deKned -ength of air passage through (@ should e small

to 4eep pressure drop lo%" 'o% rate high Possile reduce noise level of the fan Cesign must e capale of venting a portion of hot

air from (@ inside


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Important &omponents +or Thermal Cesi

Heat ?in4

Heat Pipe

+an TIM ) Thermal Interface Material*

&omination of aforementioned

components


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Heat ?in4

MaterialMaterial : 188 1L8L7 1C&6 &88

0)3/m4* : 678 68 6 79>

?peciKc gravity: 65N 65L 65N8 956ProductionCie#casting

E2truded

. #01Δ T/Δ-+in" . h1Δ TCie#casting" e2trusion" folder" stac4" soldering Kns


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Heat Pipe

@asic conKguration and characteristic

@asic speciKcationMaterial: copper

3or4ing 'uid: pure %ater

?tandard %or4ing temperature: 8J88℃

?iAe: ψ7" ψ>" ψ" ψL" ψ9

Typical heat pipe %ic4 structures+ier" mesh" groove" po%der

Typical modiKcation of heat pipe+lattening

@ending

Heat Plate


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+an

?tructure Rotator: magnetic lade" shaft ?tator: earing" %ire" stainless plate &ontrol circuit

Theory Type 12ial fan @lo%er fan

?election Total cooling reOuirementQ = Cp * m * Δ = ρ* Cp * C!" * Δ

Total system resistance / system characteristic curve ?ystem operating point


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+an

Parallel and series operation

1coustical noise level )d@* To achieve lo% noise should consider ?ystem impedance +lo% disturance +an speed and siAe Temperature rise Biration Boltage variation Cesign considerations


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TIM

Thermal Interface Material To reduce contact thermal resistance

et%een &PD die and thermal module

Important of TIMMaterial Barious material: silicon#ase" caron<

(on#phase change

Phase change

Pressure e!ect Pressure spec5 on &PD spec5 88psi


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Thermal Cesign Procedure

ClarifyClarify Thermal SpecificationThermal Specification

Design Thermal SolutionDesign Thermal Solution

Analytic Approach

!aluate Solution "erformance

#umerical Approach$periment Approach

%erify

Design Thermal SolutionDesign Thermal Solution

!aluate heat generation

Allo&a'le thermal resistance

Allo&a'le (esign space

!aluate Chassis heat (issipation

!aluate heat e$change area

!aluate fan flo& rate

"ass

)ail


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*nspect Structure+"ro(uction metho(+Cost,

-ecommen( Thermal Solution

Thermal Test in .or/ing Sample

Verify Overall System

Meeting Thermal Specification

Thermal Design 012

$amine an( 3o(ify

Thermal Solution

"ass

)ail


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Thermal Cesign Guides

#e$i%n %uide for thermal&'er. 0.2(


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Than4 ouQ


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Ker

Mesh

細絲

) 銅絲 * 螺旋

彈片

銅网


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(

(

(

(

? ?? ?

"#$%&'()

* Hall I& +,-./ (5?50 " 123456-789:

;?.@&A>旋&


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&+M)ft7/min*

?tatic pressure

?ystemresistance

curve

+ancurve

?ystemoperating

point


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5 Thermal Module

* Reserve space for thermalmodule )Intel recommendation*

&oppermine: N885mm Tualatin: N5mm

(orth%ood: 9L8mm

6*It should reserve a gap et%een

thermal module and top cover)4eyoard cover*


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5 Thermal Module

7* The gap et%een thermal modulee2it and (@ case vent should e

sealed %ell so the hot air couldn,t'o% ac4 to system5 If leave anopen gap along air 'o% path" it

%ill a!ect thermal e;ciency andacoustic noise5


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5 Thermal Module

>* The thermal module and &PDshould contact %ell5

a* The ma2 pressure of the thermalmodule on &PD is 88psi5 3ithin?PE&" e;ciency of thermal moduleincreases %ith pressure5

* It,s etter to K2 module on M/@ yfour scre%s )avoiding three scre%s*and spring design5


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65 +an

* +an inlet constraints: gap 7Jmmis needed5

7mm J 98 performance>mm J 8 performance

mm J 88 performance

6* &onKguration of air inlet = outlet

vents can ma4e dramatically 'o%resistanceS therefore high openrate is etter5


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65 +an

7* Con,t place loc4s )large I&s orconnector* near or elo% the fan

to a!ect air'o% induced into fan5

>* It is etter for K2ing fan yruer instead of metal scre%s toavoid viration5


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65 +an

* The fan space design has somerestrictions5

a* +or e;ciency and acoustic" the gapet%een Kns and fan lade should4eep a distance of - J 8 mm5

* The distance 3 is etter to 4eep aslarge as possile for good e;ciency5

c* +an lade should close to fan tonguefor etter e;ciency5


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75 P&M&I1 &ard

* Con,t place P&M&I1 on lo%er side ofM/@" near hotter I&s" and stac4ed up4ey components )HCC" &C#RM"

CBC" +CC


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75 P&M&I1 &ard

7* Cue to aforementioned solution"P&M&I1 should place near fan in

order to induce air'o% to cool5


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>5 0ey &omponents

* @ecause HCC" &C#RM" +CC thermal?P&E is lo%" these 4ey components

need to e placed in colder region5)1void placing them in the middle of thesystem and upon M/@ %ith hot I&s" and

stac4ing up each other*5

6* It,s etter to place +CC alone" not toput on/eneath &C#RM or HCC5


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5 Palm#Rest and Glid Pad

* It should avoid placing hotcomponents and I&s elo% palm#

rest and glid pad56* It should reserve a gap to ma4e a

thermal resistance et%een palm#

rest and the hot components or toadd a metal plate for spreadingheat5


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L5 -&C Inverter

It should reserve a gap et%een

Inverter and -&C cover to ma4e a

thermal resistance or to add a

metal plate for spreading heat5


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N5 @ottom case and Cimm

Coor* It should reserve a gap et%een I&chips and ottom case)gap $ 7mm isetter*5

6* It might have a large 1l#plate onottom case for spreading heat5

7* M/@ has a hole elo% fan in order toinduce air'o% under M/@5

>* It,s etter to place hotter chips onupper side of M/@5

* It should reserve a gap et%eenMemory chips and dimm door )gape $5mm is etter*5


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95 M/@ -ayout

* If there,s thermal issue of I&s" itshould reserve space for thermalsolutions

)E25 Con,t place higher components eside theseI&s" so it could put metal plate on I&s infuture*

6* Con,t place lo% temperature spec

I&s and components near hotterregion or high temperature spec I&sand components5


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5 thers

* It,s etter to use the thinner or phasechange TIM )thermal interface

material*E25 693 &PD)phase change* Po%erstrate 8589mm N℃

)phase change* T#pcm 856mm 97℃

T#pcm 858mm 9L℃

)phase change %ith 1l* T#mate 858mm 97℃

)non#phase change* T2 856mm 8℃

T2 85mm L℃


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5 thers

* Heat pipes on thermal module havesome restrictions

6* The thic4ness shouldn,t e less than

6mm %hen e made 'at57* The curve radius should e largerthan triple diameter at least %hen eended5

>* It might need some holes on ottomcase and side%all of (@ in order toinduce air'o% to dissipate heat5


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7Jmm

1ir'o%

+an

7mm J 98 performance

>mm J 8 performance

mm J 88performance


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+an

@loc4s

@ad

design


43/46

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44/46

?inglefan

Coule fan Parallel

&+

M

Pressure

Pressure

&+

M

?inglefan

Coule fan

?eries


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TIM: thermal interface material

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产品的热设计(thermal introduction)

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