:

:

12

12

1.2.4.

3.5.*

*

UV-LIGAUV-LIGA()

*XLIGA[1]LIGAUVUV-LIGA[2]Lorenz[3]UV-LIGA(a pinion-wheel set)SU-8860um60um3mm220umUV-LIGA

*Huang[4]UV-LIGASU-8UV-LIGA

*(a)(b)(c)(d)PRAgTiSiNi1.1.(a) : (E-beam Evaporator)Ti-AgTiAg500 Ag1000 (b) : SU8-50500um

*(c) : (d) : NMPSU8(a)(b)(c)(d)PRAgTiSiNi

1.

*(2.)2.6mm()4mm

*(POM)(3.)SEM(Scanning Electric Microscopic)3.(a)6mm (b)6mm

*(c)4mm(d)4mm3.SEM(4.)

*(a)6 mm(b)4 mm4.undercut

*1.(sloped sidewall angle)unit :mmSiPR

Mask Design DiameterPhotoresiststructureElectroforming structure

gear64.0646.0304.0845.9874.042gear42.44.0202.4133.9712.373

*3.1(Lithography)(mask);,(visible)(near ultravioletUV)(mid UVMUV)(deep UVDUV)(vacuum UVVUV)(Extreme UVEUV) X-ray 5.

*5. photolithography5~50m

*4 5 2.I-line(365nm)2.

Light SourceWavelengthResolutionResolutionEnhancementTechniqueG-Line436nm>350nmI-line365nm350nm~300nm350nm~250nmKrF Laser248nm250nm~180nm250nm~130nmArF Laser193nm180nm~130nm180nm~100nmF2 Laser157nm130nm~70nm130nm~50nmSoft X-ray13.6nm

*3.2.[5]6.UV[5]

* (0<

*2.3. Fresnel diffraction

Fresnel diffraction[5](3)UV Fresnel

(4)(5)

*( )Fresnel number(4)(5) (airgap)()365nm 0.2(sidewall)7.

*7. 0.2[5]Fresnel diffractionRRR=0

*3.1Anti-reflection coatingPRSi8.8.a.(TiNSiO2Si)

b.

c.

*3.2 bottom anti-reflective coating BARC[7]TiNSiO2Si3.3.

TiNPECVD deposited(reflectivity : 0.83) Chemistry: SiO2APCVD and LPCVD process (reflectivity : 0.3)Chemistry: SiSi wafer(reflectivity : 0.5)

*3.3L9903.AB(um)C(mJ/cm2)D(um)

ATiNSiSiO2B1050100C400450500D300400500

*4.L9

L9A.B.C.D.1TiN104003002TiN504504003TiN1005005004Si104505005Si505003006Si1004004007SiO2105004008SiO2504005009SiO2100450300

*3.49.Si(Si-G10D450H500)

:500rpm 10,550rpm30:4-6, 95:0.5-1,95

:508um

*

10.(TiN-G50D450H300)

*

11.(SiO2-G10D500H400)

*

12.(SiO2-G100D450H300)

*

*

[1] W. Menz, The LIGA technique, Proc. IEEE Workshop on MEMS (1991) pp. 69-73.[2] A. Del Campo, and C. Greiner, SU-8: A photoresist for high-aspect-ratio and 3D submicron lithography, Journal of Micromechanics and Microengineering 17 (2007) pp. R81-R95.[3] H. Lorenz, M. Despont, P. Vettiger, P. Renaud, Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist, Microsystem Technologies 4 (1998) pp. 143-146.[4] M.S Huang, C.J Li, J.C Yu, Y.M Huang, L.C Hsieh, Robust parameter design of micro-injection molded gears using a LIGA-like fabricated mold insert , Journal of Materials Processing Technology(2009) pp. 5690-5701.[5] W.J Kang, Erik Rabe, Stefan Kopetz and Andreas NeyerNovel exposure methods based on reflection and refraction effects in the field of SU-8 lithography, JOURNAL OF MICROMECHANICS AND MICROENGINEERING(2006) pp.821-831.[6] Eugene H 1998 Optics 3rd edn (Reading, MA:Addison-Wesley)[7] Byung-Hyuk Jun, Sang-Soo Han, Kyong-Sub Kim, Joon-Sung Lee ,Zhong-Tao Jiang , Byeong-Soo Bae, Kwangsoo No, Dong-Wan Kim, Ho-Young Kang, and Young-Bum Koh, Titanium oxide film for thebottom antireflective layer in deep ultraviolet lithography, Applied Optics, Vol.36 (1997) pp.1482-1486.

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