1

1. PCB PCB(Printed Circuit Board) . PCB Ink Screen Print Ink Film Liquid Pattern . ED(Electro Deposit) . PCB PWB(Printed Wiring Board) . .PCB . PCB (Glass Fiber) 50% . PCB Soldering

Board 230260 . , . Speed PCB (Characteristic Impedance) . (RF: Radio Frequency) PCB . PCB (Passive Component). (Active Component) . PCB (Density) HDI(High Density Interconnection) Technology PCB .

PCB (Fine Pattern), (Small Hole), (High Layer) Laser Hole PCB Micro Via Build Up Technology TypeProductKey TechnologyInternetNetworkingOptical CarrierImpedanceHigher LayerHand Held ProductMobile PhoneDigital Video CameraPCMicro ViaBuild Up TechnologyPackage SubstrateBGACSPMCPFine LineReliability PCB Internet . Hand Held Product, Package Substrate .1-1. PCB . CDMA

(2000) PCB 2 (1 ) (2001) 1 . PCB Laser Micro Via Build up .

Package Substrate BGA(Ball Grid Array) CSP(Chip Scale Package) Chipac 2 . , 100 . 2. PCB PCB .

PCB . PCB PCB . 10 PCB . .

1. 2. IPC 3. 4. BASE MATERIAL 5. 6. PCB 7. (LPC) 8. HOLE 9. 10. (FINISH) 2-1. . Paper/Phenol TV, Audio Glass/Epoxy28, , , FAX, /PolyimideTeflon, , Game, , , PCB Grade . , Hand Held PCB .

Multi Media . Market , Consumer Electronics, Computer Business , , , Industrial Electronics and Instrument, 6 .2-2. IPC PCB, Connector, Cable, Package, Assembly The Institute for Interconnecting and Packaging Electronics Circuits .IPC 4 . PCB .CLASS 1CONSUMER PRODUCTS Test PCBCLASS 2GENERAL INDUSTRIAL SPC/SQC PCBCLASS 3HIGH PERFORMANCE INDUSTRIAL SPC/SQC PCBCLASS 4HIGH RELIABILITY PCB. Test .2-3.

PCB . PCB Rigid Type Flexible Type 2 Rigid-Flexible Type .

Rigid PCB Flexible 4 Rigid Type PCB . Printer head Connector .

Rigid-Flex Compact , NEC Note PC, SONY DVC , Assembly . Hand held Product . PCBASSYRIGIDXPCFR-4POLYIMIDE 10%FLEXPOLYESTERPOLYIMIDE LCD 20%RIGID-FLEXPOLYIMIDEFR-4HAND HELD 5% Rogers Bend Flex Rigid Flex PCB ASSY .

TCP(Tape Carrier Package) Flexible Polyimide COF(Chip On Flex) Flex Board Bare Chip Direct .Tessera BGA Flexible Substrate , Bare Chip CSP(Chip Scaled Package) Flexible Silicon Substrate Dimensional Mismaching .

Flexible System Design Engineer .

2-4. BASE MATERIAL

PCB . , , . SMC Reflow CPU Clock Herz RF(Radio Frequency) . 3 .

Tg( ) 150 High Performance . Teflon .

1MHz1GHz FR-4 Polyimide , 3MHz3GHz 4.24.4 BT, 30MHz10GHz 3.73.9 BT, Cyanate Ester, PPO, Polyester, PPE .

300MHz300GHz PTEE .2-5.

PCB . Note PC, , , PDA Hand Held Product . PCB 8 .

, FAX, , .

4 , , , 6, Note PC PDA, Workstation 8 .

CDMA TYCOM Mini Computer 10, 12 Back Panel IC Test Probe 12 18,

40 Main Frame . 0.31.2mmIC Card, Camcorder, HHP, Pager, Note PC 1.6mmComputer, Audio, Video 2.46.0mmBack Panel, Burn in Board, IC Test Probe Board, Super Computer 2-6. PCB PCB 1.6mm . IC Card, , Pager, Note PC . .2-5. 48 0.1mm . Prepreg 1 , .

SLC Build up PCB Prepreg . .

Data 0.8t 5.3%, 0.811.6t 74.6%, 1.612.30t 12.5%, 2.3t 7.6% Share .2-7. (LPC) SMT DIP Type Package Pin Pin 0.1 (100 Mil), (Line Per Channel) . LPC .2-7.

2-8. HOLE Hole . SMT Hole Via .IPC Technology Roadmap Hole Size .

PCB Hole . Hole PCB Blind Buried Hole . , Via Via .

Hole . Hole Drill Bit Hole Blind Hole Hole .

PCB Hole , PCB Hole . BGA Cost Drill , Solder Mask, .

Hole Bit . Laser Hole ESL SUMITOMO(LUMONICS) . MATSUSHITA ALIVH , CO2 Laser . 0.20mm Laser Bit .Laser IBM SLC(Surface Laminar Circuit) Photo Via CYCONEX DYCOSTRATE Plasma Hole Buried Blind Hole . Build up PCB Bit Hole .

2-9.

PCB , Substractive Additive .Substractive PCB Etching , Additive PCB .

Semi-Additive Process .Additive . Fine Pattern . Direct Plate Short Process , Hole Panel Pattern . .2-10. (FINISH)

PCB . Solder Solderability , Bare Board Shelf Life . Etching Resist Tin/Lead 25 Dry Film Tenting/Etching Process Flux Coating . Pre Flux .

SMOBC(Solder Mask On Bare Copper) Tin/Lead Reflow HAL(Hot Air Leveler) . HAL 20mil pitch Fine Pitch SMC Pad Solder Coating OSP(Organic Solderability Preservative) Organic Finish . . 2 Reflow Benzimidazole Type Organic Finish TAMURA, SANWA, SHIKOKU , (TAMURA) ENTHONE ENTEK 106 PLUS .OSP PCB Set .PCB ;- , - HAL Utility Cost Maintenance - - Fine Pitch Solder Bridge - HAL PCB - PCB Yield SET ;- SMC Pad Coplanarity - HAL Board ASSY - PCB SIR - Solder Open, Short Yield 2-10. Process Benefits ComparisonComparisonHASLOSPImmersion GoldMatte TinSurface CoplanarityPoorBestBestGoodHole CompensationRequired0.002-0.003 in.Not RequiredNot RequiredRequired0.002-0.003 in.Fine Pitch Quality(0.020in. or less)PoorBestBestGoodSurface Contrast(Assembly)PoorSolder/SolderBestSolder/CopperBestSolder/GoldGoodSolder/TinSolder Volume(Assembly)Not PredictablePredictablePredictablePredictableEnvironmental HazardHigh (Pb)Low(Water-based)Medium(Ni)Medium(Ni)Thermally StressedYesNoNoNoElectrical Contact UseFairPoorGoodFairPCB Shop Gold ContactMaskingYes(Difficult)Not RequiredNot PossibleSelective PlatePossibleCost of Surface FinishStandard(1)Lowest(0.2-0.3)Highest(1.5-2)Standard(0.9-1)Grounding InsulatorNoYesNoNoReflow Under Solder MaskNoNoNoPossibleMicrowaveFairBestLess than 2 GHzLess than 2 GHzWire BondNoNoYesNoShelf Life (Typical)12 months12 months(Process Dependent)Testing Required12 monthsAvailabilityYesYesYesLimitedCost of Surface FinishStandard(1)Lowest(0.2-0.3)Highest(1.5-2)Standard(0.9-1) Table Immersion Gold Copper 0.05 LCD , Solder Mask .COB(Chip On Board) BGA(Ball Grid Array) Wire Bonding (Pure Gold), Autocatalytic Type 0.3 .3. PCB PCB .

:* (PCB ) Paper/Phenol, Glass/Epoxy, Composite, Polyimide film * Solder resist ( (Short) Coating()):* Photo resist ('' Solder Resist '' )'' ( . Screen'')

Drill bit (Via'', '' Drill )

Router bit ( )

. . . () 5 () .

1cm 1.4kg . 1cm 500g . 0.2mm 10g .

. , .

Flexible PCB Polyimide Film

(3-1-2). Polyimide Film 3 2 . .3-1. (CCL) 3-1-1 Rigid() . ( 10 ) .

(paper), (Glass Cloth) .

sheet . (XY) .

, (Z) XY 10 .3-3-1. Glass/Epoxy (1)

A. Glass/epoxy Glass Epoxy (, ) .- Grade FR-4 (NEMA) Tg () FR-5( FR-5 ) .- () Grade (G-10, G-11), .Glass/Epoxy PCB , Paper/Phenol CEM-3 . PCB . , Computer Glass/Polyimide Tg Epoxy .

Package Ceramic Glass/Epoxy .3-3-4. MCL-E-679 MCL-E-679( Tg Epoxy)MCL-E-67( Epoxy)TgTMA173183120135DMA205215150160 Peel( 18 ) kN/m1.391.692000.550.17 () GPa21252023200570.51.5 PCT-4 hr%0.300.71PCT-8 hr0.480.895% TGA340360300320 . () 5 () . 1cm 1.4kg . 1cm 500g . 0.2mm 10g . . , .

Flexible PCB Polyimide Film (3-1-2). Polyimide Film 3 2 .

3-2. , . 3-2 .

, Roll (/) . Prepreg . Prepreg . B-stage .

Prepreg stainless (180 ) . C-stage .

B-stage Prepreg , .

3-2-1. , Prepreg, Shield () '', '' Prepreg . Prepreg .

'' (3-2-1). Mass Lamination Premulti

Shield . .3-3. 3-1 . 3-3-1. Paper/Phenol PhenolGlass/Epoxy GlassEpoxy, Composite Epoxy PolyimideBT , PPO Flexible -PolyimideFlexibleFlex-Rigid PCB 3-3-2. Material TypeTgDielectric ConstantPropagationdelay ps/in.Percent ofH2Oabsorption(%)Copper peel strengthresinw/E-glasslb/in.2@25lb/in.2@200Standard FR-41353.64.41780.1111.05.7High-performance FR-41802.0-3.63.9-4.41680.04-0.209.0-11.07.5-7.9Polyimide2203.44.31760.358.58.0BT1953.14.01700.408.75.2Cyanate Ester2402.83.71630.398.06.3Silicon-carbon1902.63.41560.025.05.0PTFE162.12.51340.0110.08.0 3-3-3. Material typeCTE ppm/DielectricconstantDensityDielectric constant with cyanate esterPropagationdelay ps/in.E-glass5.046.22.583.7163S-glass2.345.22.463.5159D-glass2-33.82.143.2151Quartz0.543.82.503.2151Aramid-4.004.11.443.4157PTFE0.102.11.462.4132B.

1). Press

Press Maker . Epoxy 175~185 90~120, 20~40kgf/ , () .

Tg .

2).

- 4~6 0.2 () . 0.2 0.12 , 0.21 (Single Ply). Cost Down , , Drill , (), . .3). /

. 4, 6 .

10 PCB FR-4 FR-5( FR-5 ) 3-3-2. Glass/Epoxy (2)

PCB 20 Glass/Polyimide Glass/Epoxy(FR-4) FR-4 base , . .

FR-4

FR-4 UL94V-0 () Brom Bisphenol A Epoxy () . Europe Dibenzolane Halogen Antimon .Matsushita R-1566 Glass/Epoxy . Plastic (), , , . 1 .

1) Brom Halogen ,2) Antimon ,3) Phosphorus (/) ,4) ,5) - Matsushita Halogen Antimon .2) FR-4

PCB engine PCB Chip . Cycle, Crack . R-1766M TSOP Flip Chip . Drill Package 8~9ppm .3) FR-4

, Drill Land , , (CAF), Aspect Through Hole .

170 Tg FR-4 , PCB .

R-1766T , Bow () .[Keyword]

Brom Epoxy

UL94V-0 TBBA(Tetra Bromo-Bisphenyel A) Bis phenol A epoxy . Deca-Bromo-Diphenyl-Ether TBBA Brom .

Matching X,Y . /chip on board 12ppm (R1766M) 9ppm package .

Tg , , .Brom epoxy Brom .Non-Halogen .3-3-3. Composite (1)A. Composite 2 CEM-1CEM-3 . 3-3-5 .

CEM-1 CEM-3 glass . CEM-1 CEM-3 .

CEM-1 Paper/Phenol (FR-1) . FR-1 CEM-1 . CEM-3 CEM-1 Glass/Epoxy(FR-4) FR-4 .

glass .

CEM-3 through hole FR-4 . CEM-1 , Tuner

CEM-3 . CEM-3 merit 0.8 0.6 FR-4 .

CEM-1, CEM-3 MLB build-up CEM-3 core . B.

CEM-3 FR-4 FR-4 glass FR-4 .

(Bow) . . , Pattern ,

1) .2) (, SR ).- . CEM-3 FR-4 2 scale factor . . C. /

CEM-3 FR-4 OA, FA , , , game .CEM-3 FR-4 FR-4 .

glass epoxy 88 FR-4:CEM-3/68:32% 9192 CEM-3 FR-4 , 97 .

FR-4 , 0.6 CEM-3 . CEM-3 silver paste TH , paste TH . CEM-1Paper Glass Cloth Epoxy CEM-3Glass Glass Cloth Glass ClothGlass ClothPaper (5 )Glass + Filler (3 )Glass Cloth Glass Cloth 3-3-5. Composite 3-3-4. Flexible

Flexible PCB( FPC) , , . , FPC .

FPC polyester( PET) polyimide film( PI) . () FPC . () , .

TAB(Tape Automated Bonding) fine pattern () low profile ( ) . fine pattern 18, 12, 9 () .. cover lay base film PI, PET film Solder Resist ink . (: ) , .

base film, , 3 FPC . 2 FPC B. - FPC , , . , . , FPC .- LCD film FPC . LCD FPC pitch . LCD film FPC . PI , . , LSI , , , .

noise noise shield ground noise distortion strip ) impedance control .C. /

FPC Camera, FDD, Thermal Head . HDDFDDprinter, , Oil .

. Pattern Fine, Through Hole () LCD , .

FPC FPC , , .3-3-5.

Computer . PCB () . (1) PCB .(V: m/s)=KC/ (1)(K: , C: , : ) .

.

, .

(2) . = 27.3f/Ctan (2)(f: , C: , : , tan: )B. /

.

FR-4 , device FR-4 .

, mother board FR-4 Device 3-3-6. Prepreg

Prepreg bonding sheet .

prepreg core press PCB .

prepreg press core , Through hole .

via hole core (), , .

PC package PCB Fine Line . PCB Prepreg Glass Cloth , , () .

PCB Build-up Prepreg .

- Prepreg , Laser . , Prepreg .B. /

PCB fine line .

1-ply() prepreg .

PC package , .[Keyword]

PCB Press Tg, , , .

Prepreg Press (3-3-3).

() (Gel Time) . . Press .

Build-up prepreg 3-3-6 .

- GMPL-255 epoxy base prepreg. CCL-ML195 BT resin base BT resin , migration . - .

3-3-7. PCB

, 3-3-73-3-8 .

PCB , , FPC Chip TAB, BGA, CSP 150 fine 20 .

, foil crack HTE (3EC-), (170) (anneal) Super HTE(3EC-HTE), Etching Low Profile (VLP), 9 (UTC) .

, (MR500, MR600) . .

Laser Hole Drill .2) press .3) . - Tg , Mitsui Tg 200 .B.

12 VLP 9 . 9 Carrier() . Epoxy Film . Prepreg .

C. /

, Note PC Fine BVH BGA, CSP Plastic Package . 12 9 . Laser micro via PCB . PCB maker micro via .[Keyword]

* Micro viaIPC 150 via hole micro via . Hole drilling photo, Laser, Plasma Laser . 130 PCB Laser .

* TgGlass (). . Chip Tg Tg film . Mitsui (blend) Tg .

* UTC- 30 package . Mitsui 5 UTC , UTC .

3-3-8. Glass Cloth

Glass cloth PCB , , () .

Glass cloth E-glass 5~9 () () (), () () .

Cloth Prepreg Sheet , press PCB . Cloth 60, 100, 200 .

(), glass . 100 (), 200 () .Glass glass cloth maker glass E-glass PCB , glass .

cloth Water Jet cloth () glass cloth . glass cloth , .B. /

3~4% Cloth .

PCB Note Book PC, Video Camera Cloth cloth Cloth . , . PC .

Glass Cloth 10% [Keyword]

Glass

, PCB , . glass cloth glass .

glass glass T-glass glass D-glass PCB () (cloth) PCB . PCB glass glass , , . glass NE-glass . NE-glass . aramid NE-glass , .4.PCB

4-1. Solder Resist, Symbol Mark( ),

PCB 1)'' , 2)Via , 3) . PCB .4) Solder resist 5) Symbol mark 6) PCB .4-1-1. Solder Resist (4-1-1)"Solder" "" . "Resist" ", " . Resist " " . "Etching resist" '' ('' ), " .

PCB '' '' "/" . . PCB IC, ( ) PCB . ( Solder bridge ). . solder bridge , Land( ) Mask() resist solder resist solder mask .

4-1-2 Symbol Mark( ) (4-1-2) ' ' PCB , '' .

4-1-3 (4-1-3)PCB PCB . PCB , PCB . , (Terminal) . . '' .

4-2. (Panel)

PCB 10mm10mm, 500mm500mm . . '' . '' 1 . '' .

1,000mm1,000mm 1,000mm1,200mm ( 20mm ). . '' - 1/2, 1/3, 1/4 510610, 510510, 510405, 510340( mmmm) .4-3 PCB 4-3-1 PCB . "'' ". ''. 4-3-2 . ' ' '' (spray) . ' ' '' . .'' 'Additive' . '' '' Additive . Additive "add" . (Additive ) Paste Screen .

4-3-1. '' '' Subtractive (Subtractive subtract ).

Fine pattern '' Side etching (4-3-2).

Side etching etching resist .

Etching . 4-4. PCB

4-4-1 PCB . '' via

Via plated through hole/ ( PTH) .

PTH / . via . , PTH . . PTH via " paste" via .

paste paste screen via .

via paste "Silver through hole" .

pasate . '' etching resist , ,

via .

PTH etching

"/Tenting " .

'' etching resist "dry film" .

Dry film resist '' .

'' PTH '' resist pattern etching . via dry film .

'' ( ).

4-4-2. Via (PTH )4-5.

4-5-1 PCB( MLB: Multi-Layer Board) . (T/C:Thin Core) , ''() , prepreg .

MLB '' via '' . () "Registration" .

Registration MLB ,prepreg () MLB .

pin lamination mass lamination . Pin lamination 4-5-2 () '' pin .

mass lamination pin , '' , .

Through hole '' pin lamination ,

Mass lamination X '' .

4-5-2. (MLB) 4-6. (Via )

4-6-1. Via (Through via, Blind via, Buried via)

via hole 2 . . via . 4-6-1(a) 1 #1 #2 A B . #3 #4 A B . . via via . #1 #2 1 4 a #3 #4 3 b, c, d . via via . via 4-6-1(b) 3 . 4 .

Via P 1(L1) 2(L2) via hole 1 4 . (through hole, through via) .

Via Q L1-L2 via hole L1 L2 .

L1 via via . via Blind via" .

Via R L2 L3 via 4 .

via Buried via" .4-6-1(a) a , b, d blind via, c buried via .

hole (4-6-1(b) via P

L3, L4 via via ).

4-6-1. via4-6-2. Land, Land , Land

via via via .

land .

4-6-2 .

Via land via , via .

registration . Via 'Annular ring" .

annular ring via via ( 1). annular ring .

annular ring ( land ) ( 2).

annular ring via . , via land .

1. photo tool . 2. , land . via land .

4-6-2. Via Land4-6-3. Via

.

1) pitch (Fine pitch, 3).2) via (Small via)3) blind via, buried via .4) . . .

fine via , blind via, buried via .

landless through hole via land . Land via via registration .

3. Fine pitch line/space . line/space 100 100 .4-6-4. Via hole Via via hole via hole . 4-6-3 hole punching via hole . 4-6-1 .PunchingDrill Photo ViaLaser Viavia size 0.7mm 0.3mm 0.2mm - batch type batch viavia blind/buried viablind/buried via 4-6-1. Via hole Punching hole hole pitch hole via hole .Drill via hole . Via , glass drill bit , tungsten carbide . . via . resin smear .

Hole drill via . Photo via laser via 0.1mm via hole . Buried/blind via .

4-6-3. via 4-6-5. Via hole 4-6-4 via hole . via hole . . via . via hole . via through hole.

through hole 4-6-4(a) through hole 4-6-4(b) . via hole palladium . () () . () base . full additive . via hole paste through hole .

4-6-4(c) .

paste screen via hole (d) . via know how . paste paste paste .

4-6-4. Via hole 5. PCB

5-1.

5-1-1. (Press)

(Press)

, (Prepreg), .PCB ' ' 5-1-1 Hydraulic() Autoclave() .

5-1-1. Hydraulic () Silicon Gum () -650mmHg . Autoclave Bag . . -650mmHg 8~10kg/cm2 .

5-1-1 .5-1-1. Press Hydraulic Autoclave (Pump)(Pump) (N2, CO2) , , Heater, , Heater Heater RadiatorFan seal Press B. MLB

()

MLB 3 .

(1) (2) Prepreg (3) 5-1-3 .

(mm) ()0.10.20.30.40.50.60.8mm 18, 35, 70* ST (Single Treatment)DT (Double Treatment)* Treatment , 0.81.01.21.62.00.8mm 2) Prepreg 5-1-2. 5-1-3. Prepreg (mm)(%) (mm)0.06Pin LaminationMass Lamination70620.060.050.10Pin LaminationMass Lamination53420.100.090.15Pin LaminationMass Lamination52420.150.140.18Pin LaminationMass Lamination45420.180.173) Prepreg MLB 5-3 prepreg . , 5-4 .

(b) A, B 70 prepreg 2x(0.070.07)0.28mm prepreg 0.28mm .[]0.10mm0.18mm0.28mm0.15mm2 0.30mm0.10mm3 0.30mm 5-1-4. Prepreg prepreg prepreg slipping, prepreg () , prepreg .

C. MLB 5-5 4 ( ) .

5-1-5. PCB 5-1-6 () . (a) (b) . 5-1-3 Pepreg (a) .

5-1-6. Prepreg 5-3 (R/C:Resin Content) . 5-1-7 (a) (b) Prepreg(PP) 1 30 0.12mm(0.034) .

5-1-7. MLB . (Through hole , Patterning, Solder Resist ) 1.6 +0.1/-0.2mm( 0.3mm) .5-1-2.

(Build Up)

PCB 4 5 5-1-8 5-1-9 () .

5-1-8. Mass Lamination Pin Lamination[] 1) Mass Lamination Pin Lamination 2) 5-1-3.(c) 4 Guide Pin 4 4 Guide Pin .Pin Lamination , , , Prepreg, () Film, Dummy Cushion() Guide Hole .

5-1-9. Build up Mass Lamination Pin Lamination Guide Pin Mass Lamination . 1) Press Slipping( )2) Resin Prepreg Slipping. Slipping (, Guide Post ) 3, 4 Pin Lamination .B. Glass epoxy (FR-4) 5-10 . prepreg , , , , , program

5-1-10. Glass Epoxy Program (Press Schedule) .1) ( ) 120130 . . 130/2030 .2) ()1.02.0/(130170) .3) ()FR-4 160/30 . Press 170180/7090 .4) ()510kg/cm2-510 (3040kg/cm2) slip , distortion .5) () void () .6) press .7) Press , press programming (), (), profile .5-1-3. A. Glass epoxy Anchor 5-1-11 prepreg .

5-1-11. 5-1-4 . (CuO, CuO2) epoxy , Haloing(Pink ring/Red eye) . 5-1-12 through hole .5-1-4. /NaClO2, NaOH, Na3PO4 70~90 . . .Epoxy .Brown (Red)NaClO2, NaOH, Na3PO4 . (). . Brown . haloing . . . haloing .DT (Double Treatment) () .Pattern .Micro Etching - Micro etching chelate etching .5-1-12. Through Hole

5-2.

5-2-1.

A. PCB 5 .1) Drilling: Drilling : Bit: , PCB ( ): Glass Epoxy / .Drill PCB 5-2-1 .5-2-1. PCB Drill (:mm)PCB Drill 0.10.150.20.30.40.220.821.624-61.6 224-61.6 324-6: .: , drill .: , step , drill .: .2) Punching: Press : Punching pin (): PCB ( ): Paper/Phenol / . 3) Laser: Laser (YAG, CO2, Eximer): Alumina, Polyimide film taper .4) Etching (): , Etching : taper .

5) Beam, PCB punching drilling , Laser (1) (cost minimum), (production maximum), (profit maximum)(2) PCB .

5-2-1. PCB Hole 2) (1) (Stacking: ) 2~4 Entry Board, Backup Board Taping( ) Pin(Stacking Pin) 5-2-2 . Stacking Pin Hole . Stacking Taping Stacking .

5-2-2. PCB Hole StackingEntry board Aluminum PCB , burr () , hole , hole () drill entry board aspect . pi 0.1~0.2mm . Entry board . Aluminum 0.1~0.2mm, phenol 0.3~0.5mm .(2) Drill spindle() . = drill drill . Resin smear . smear .

, Drill () V=160~180m/min., V=200m/min. . Smear . () .(3) (: Chip Load)

Drill 1 Drill Torque( ), Thrust( ) . Drill () () () Thrust() .

(4) Backup Board PCB Drill () Entry Board Aspect drill . Drill .

(5) / Drill . Double Drilling Step Drilling.Double Drilling 2 Drill , , () Drill (Guide Hole) , Drill . Drill Drill .

Step Drilling Cycle . Drill drill .(6) PCB Drill . PCB Torque, Thrust ( ) . ( Ounce ) .

, .

PCB ( Polyimide Epoxy) Drill Smear Glass Polyimide Drill Smear .C. 5-2-3 diamond ( ) . Drill () () (), (: ) .

PCB Glass Cloth Epoxy 5-2-4 , () Ceramics(Alumina) . Ceramics Ceramics . . Glass Cloth Epoxy

K .

K -glass () .D. PCB Drill

5-2-5 PCB hole Drill Straight Shank ( ) 3.175mm Dril Roomer Type() Drill. Roomer Drill Shank Drilling Machine (Collet: ) NC() Hole Drill Machine Drill. 38.1mm Drill Solid Type.

Drill Straight Type Drill. Twist 30 . , Glass Epoxy PCB PCB Smear Under-cut Type .E. Drill Hole 5-2-6 drill (Under-cut type ) . Drill drill bit [Shank] drill [], [ (: Point)] . () .

1) Twist Angle ( )Twist Twist Torque . Twist Pump . . Aluminum Twist , Twist .

2) Relief Angle () Relief Angle Thrust( ) . Relief . () Drill . , 8~10, PCB Drill 15~20 . F. PCB Hole Drilling Machine

1) Pin hole .

motor Z . Spindle 12,000rpm .

2) Z Collet() Jack Hole Drill . NC() () . Hole .3) NC X-Y spindle Z . drill 1/8inch Shank Roomer Type Drill. Spindle 2~6 Set .

, 300hits/min . Spindle 80,000~120,000rpm, Z 12,000~27,000mm/min, X-Y 25,000mm/min .

table motor AC, encoder feed back closed loop .

Drill chucking Auto Tool Changer(ATC) station 20 cartridge 150 . work station sub-table , .

NC program NC data /() step software .G. Drill Hole

PCB Drill Hole , .

1) Epoxy Smear ( )2) Hole Hole 3) Hole 4) Pink Ring ( , )5) 6) (Burr), Nail Head ( )7) Drill hole hole aspect (Hole /) Drill , Drill Drill Hole .5-2-2.

A. Router

PCB Press (Blanking: ) Router Routing . Router Lot . , .

Router Endmill . Router .

Router . 5-2-16 Diamond Router .

5-2-10. Diamond Router EndmillRouter NC . Drilling Radial Drill , .

Spindle Pressure Foot .B. PCB PCB Router(, ) .

- Slot : Long Hole Drill, Router Endmill ( Press Register Mark ): cutter, Left Twist Endmill- : Cutter (Bevel Cutter)- V : V cutter (Side Cutter)- Trimming: Trimming Cutter, Diamond Router Endmill- : CutterC. Press ()

PCB Blanking PCB Hole Punching .Press - .

() Press (), . Step .

Punching Paper-Phenol Paper-Epoxy PCB . Blanking Glass Epoxy .

2.0mmt , hole 1.6mmt pi 0.7mm . pin Pitch 1.78mm .

Press . Pattern hole pin (CCD Camera, X ), Glass , Paper-Phenol Paper-Epoxy . , , . 60~80 10 .

() ( ) . Press 2 . = PCB (): Paper-phenol=8~12kg/ (, 50~60%)Glass-epoxy=40~50kg/

2) Hole Hole PWB Hole () Punch 80~90% . Punch, , , Punch Die Hole Clearance, . Hole 5-2-11 (Dish Hall) . .

() .

Hole , Hole Punch Die Hole Clearance (5-2-12 ) 0.05~0.1mm() .

Punch , (: ) .

5-2-11. Punching Hole

5-2-12. Punch-Die Clearance5-3.

5-3-1.

PCB , , , . Through Hole , Through Hole PCB .

PCB Etching Resist (- ), (Bonding) Nickel .5-3-2.

() Ion .

1) , 2) .5-3-1 .

5-3-1. () () .

, () () Ion .

. () , , () Ion .

.

Ion Cathode .

() () () , .

, . 5-3-1 .5-3-1. pH () ( Anode) () , A. .

1) () 2) 3) 4) 5) , , Ion , , pH .

. Levelling, , . (Anode) (Cathode) Faraday .

, () . 1 gram () 1 Faraday(F) 96487 coulomb . 1 coulomb 1 A 1 .

I Ampere t m(g) m = KItK 1 coulomb g .

1 F 1g 63.57 / 2 = 31.8g Cathode , Anode Cu2+ .B.

() Ion Cathode Anode Ion . .

1) .2) .3) Pin Hole .4) .5) , .

, , .

1) Formalin Alkali . Cu2++2e-Cu02HCHO+4OH-2HC00-+H2+2H2O+2e-Cu2++2HCHO+4OH-Cu0+2HCOO-+H2+2H2O2) Nickel , , Alkali (Phosphorus) Natrium (Boron) P B Ni . Ni-P() , Ni-B PCB . Nickel Ni2++2eNi0H2PO2-+H2OH2PO3-+2H++2eNi2++H2PO2-+H2ONi0+H2PO3-+2H+ 5-3-2 , , , . , pH, . Ion , , Ion NaH2PO2, KH2PO2NaBH4, KBH4, Hydrazine,Formalin ()Alkali , Ion , , AmmoniaEthylenediamine()Pyrophosphate( ) EDTA PH pH PH pH , Ion 5-3-2. 5-3-3.PCB

PCB , , , . Through Hole .

Through Hole PCB Subtractive Additive .

Subtractive () , Through Hole .

Through Hole 25 Etching Resist Solder Dry Film Laminate() Etching . Additive Semi-Additive, Full-Additive, Partly-Additive Semi-Additive , , 2~3 , . Etching fine pattern .

Full-Additive Resist .

, Through Hole Through Hole, Blind Hole .

, .Partly-Additive , Resist Etching . Solder Resist Through Hole .

Through Hole Through Hole .5-3-4. PCB

PCB Drilling Through Hole .

Drilling Through Hole .

Void, Blow Hole, Through Hole () Hole Cleaning (5-3-3 ).5-3-3.

Desmear

PCB Drilling (Smear) Hole Desmear .

PCB Drilling Smear PCB , Through Hole Smear Desmear .

Desmear Chrome , , Plasma Desmear Manganate() 3 .

1) MLB Conditioner . Epoxy (: ). () .2) MLB Oxidizer(Etching)

Alkali () . Smear . Microporous( ) Catalyst() . .

3) MLB Neutralizer() ,Through Hole 2 Manganese .B.

Through Hole () () .

1)Cleaner Conditioner

, , Etching Etching .Cleaner Through Hole .

Conditioner Through Hole Catalyst . smear Through Hole glass Catalyst Void . Conditioner Glass Catalyst . 2) Soft Etching

Etching( 1), . Conditioning .Etching , - () .

3) Catalyst Pre-Dip

Catalyst Pre-Dip . Pre-Dip Catalyst Catalyst Natrium . Pre-Dip Catalyst .4) Catalyst (Activation) Catalyzation . . Catalyst Palladium - .Colloid() 50~300 Pd-Sn Sn-rich Pd-Sn . Colloid Sn Accelerator . Catalyst Palladium- Alkali .

5) Accelerator Pd-Sn Colloid . Accelerator PCB Catalyst Catalyst . Accelerator Conditioner .C. PCB 3 .1) Low Copper (Panel ) 0.30.52) Heavy Copper ( ) 1.52.03) Heavy Copper (Additive) 2025

5-3-2. Subtractive Through Hole Additive (, , ) .Subtractive (5-3-2) Through Hole . () , .

Through Hole (, Glass ) .

2) () .

3) PCB . Additive Thick () . , (), Gas () (: ) . Additive , , . Soda, Soda, Soda .PCB 5-3-4 .

, , (Chelate) Rochelle , EDTA, -, Alkali (pH) Natrium .

, , , Biphyridine .5-3-4. Low Copper Heavy CopperAdditiveEDTAFormalin Soda pH 10g/l-10ml/l13.0 () ()20~250.3/2010g/l40g/l10ml/l12.8 45~502/2010g/l30g/l5ml/l12.0 703~5/205-3-5.

PCB Through Hole .Subtractive 5-3-2 3 Panel , Pattern .Through Hole .

(: Throwing Power), Through Hole 2) (, , , )3) Levelling PCB Pyrophosophate( ) 1970 Pyrophosophate 1980 .Pyrophosophate Alkali PCB Through Hole . Pyrophosophate , , , , Dry Film . Pyrophosophate .

1) ( : Throwing power) PCB , Through Hole () . Final Etching Etchant Over Etching Fine Pattern .Pyrophosophate () () , . . Asbestos() PCB , () . 2) Through Hole PCB . PCB Through Hole Through Hole Stress . 5-3-3(a) Z .Through Hole Stress Corner Crack Barrel() Crack . 5-3-3(b) Through Hole . , , Resist

3)Levelling Through Hole Levelling () () () Hole Levelling Hole .

B. Pyrophosophate()Pyrophosophate 5-3-5 Pyrophosophate Pyrophosophate Kalium .Pyrophosophate Pyrophosophate Kalium Pyrophosophate . Pyrophosophate Alkali Resist , . Pyrophosophate Alkali Anode Bag .5-3-5. Pyrophosophate Pyro (g/l)Pyro (g/l)P(P2O74-/Cu2+) (g/l)Ammonia(28%)(ml/l) pH(25)(g/l)85(80~95)375(300~400)7.8(7.5~8.2)3.0(2.0~5.0)8.6(8.4~8.8)0~9090(80~100)375(300~400)7.5(7.0~8.0)3.0(2.0~5.0)8.8(8.4~9.0)0~9095(90~100)375(300~400)7.2(7.0~7.5)3.0(2.0~5.0)8.8(8.4~9.0)0~90Anode(A/dm2) ()1.5(1.0~2.0)55(50~55)Cathode Rocker2.5(1.5~3.5)55(50~55)Cathode Rocker5.0~10.055(50~55)Cathode Rocker5-3-6.Solder

Solder - Connector Lead Frame PCB Through Hole ( Etching Resist) .PCB Solder 60%, 40% Solder Solder .

Solder Solder FPC .PCB Solder 1970 (Boron Fluorine) 1980 .PCB Through Hole Solder Etching Resist , Fusing . Throwing Power , Pin Hole , Sn-Pb , ()( ) Outgassing .

Etching Resist Solder Tenting(Dry Film) (, Ink) .

Fusing Sn60%-Pb40% () Solder 7~10 .

5-3-7 Solder . Solder Sn(-0.130V) Pb(-0.126V) ( 2 ) .5-3-7. Solder Sn2+(g/l)Pb(g/l)(g/l)(g/l)* AnodeAnode Bag(A/dm2) ()()15(12~20)10(8~14)400(350~500)25(15~)Pepton5(2~7)g/lSn:Pb=60:40 P.P2.0(1.0~2.0)24(16~38)Cathode Rocker16(14~18)11(9~13)140(120~180)15(15~20)Sn:Pb=60:40P.P2.0(1.0~3.0)20(15~25)Cathode Rocker () Solder . .PCB Solder Etching Resist , Fusing Solder Through Hole PCB , Solder Through Hole(SMOBC) . , , Solder Solder . 5-3-7.

PCB Connector , , . Nickel . Nickel Nickel 36, 11.5 .

A. Nickel Nickel 5-3-8 . Watt . . Nickel, () Nickel .B. , , . .

* Cyan Alkali , Alkali

* No Cyan Cyan Ion () . Cyan Alkali. PCB pin hole . 3545% . Ni Co , . () pulse .

Bonding, . 5-3-8.

Direct Plating

1960 PCB Through Hole , PCB . , , , Full Additive PCB . , Formalin , Chelate EDTA Europe . Direct Plating(DP) . DP Process 13~14% 500 DP Process Europe DP Process .

DP Process PCB Maker .

PCB Maker DP Process , , Through Hole , , .DP Process Conveyer .B. DP Process

PCB Direct Plating Palladium, Polymer, Carbon Graphite .Palladium Catalyst Pd-Sn Colloid Tin Free Pd . DP Process Pd-Sn Colloid .1)DP process Pd-Sn Colloid DP process 5-3-10 .

cleaner, conditioner , Pd-Sn Colloid , Ion Accelerator Colloid Sn2+ () Ion . covering .

2)DP process DP Process PCB Maker Process DP Process , Aspect Through hole Covering . DP Process Process.C. Nickel,

PCB , PCB SMT COB(Chip On Board) , MCM .Through hole . PCB . Hot Air Leveler(HAL) , Pre-Flux, Solder Pre-Coat , Nickel .

Nickel Pad COB COB Bonding (0.05~0.1) Wire Bonding Plasma Cleaning Wire Bonding

SMT COB . PCB Nickel 5-3-11 .

5-4. Pattern 5-4-1. Dry Film Photo Resist(DFR) . DFR 5-4-1 Cover Film/Photo Resist()/Carrier Film 3 . Cover Film Resist Laminate ().Carrier Film Laminate Resist Roll Mask Laminate Resist Film Laminate . Film Cover Film Polyethylene Film, Carrier Film Polyester film .

(Etching) . 5-4-2 . 5-4-3 Through Hole Tenting .Resist . .2030 4050 tenting, DFR Alkali , () .

5-4-2. ()

(/) Dry Film Lamination . Resist (, , , , ) () . .

(1) Buff Role (2) () A. Brush scrub B. Jet scrub (Honing/)(3) Belt sander (1),(2) . Soft Etching ( Ammonium, -) .

(: ) PCB Lamination . 5-4-1 .5-4-1.

B. 1) Buff Roll ( )Buff roll Scotch Brite VFSF (#320#600) . Scotch Brite SF(#600) 2() , () 5-4-4 . () .

2) Brush Scrub

. 5-4-5 .

3) Jet Scrub Jet Through Hole . Brush Scrub . 5-4-6 .4) . . - Etching . . 5-4-7 .

C. Dry Film

Dry Film 0.31.0 . 0.3 . 1.0 Dry Film Etching (Tenting ) ( ) .

2) Resist Pattern

(1) Buff Roll Jet Scrub Resist , Jet Scrub .(2) Buff Roll Jet Scrub Resist 5-4-8 . Jet Scrub Resist . Resist Line . Jet Scrub () .

5-4-3. Dry Film LaminateA. Lamination Lamination Dry Film Dry Film .Lamination 5-4-2 .5-4-2. Laminate

B. Laminate

Laminate Dry Film . - Laminator (Roll , Roll , )- (Roll , , , )- Dry Film (Dry film , ) (: ) Dry Film () , Resist Pattern 5-4-10 () . Glass air void() . , Dry Film .

Laminate

Dry film laminate roll /, laminate , laminate ( ) .Laminate laminate , laminate roll laminate .Dry film laminate .

2) Dry Film

Dry Film . Laminate Dry Film .5-4-4.

Mask Film Resist , Resist . Resist Resist (, ) . () (). (Contrast) .

. (5-4-11) . Lamp .

Metal Halide Lamp . Resist 365nm 405nm .

405nm . 365nm Carrier Film (PET) Resist (5-4-12).

Resist (5-4-13) Monomer() 3 () (5-4-14).

Resist ( ) . Resist . A., B., C. .

resist () . Step Tablet .

Step Tablet Gray Scale Step Mask Film. Step (5-4-3). , Step .

B. Line Space Pattern Mask , Line ( Space) .

Line/Space 1/1 5 Line ( Space) Pattern .

(5-4-16) Line ( Space) (5-4-17).

C. () mask line( space) . 5-4-18 100 line mask (plot) .

(space ) . 100 60mJ/ .

5-4-5. Resist Resist . Alkali Resist 5-4-4 .

(1) , (2) (), (3) 3 5-4-19 .

Alkali Dry Film (Emulsion) . Alkali Binder Polymer . Binder Polymer (5-4-20). Emulsion () () Emulsion () .

. Line () () . (Resist , Break Point: B.P.) . B.P. 1.5 (5-4-21 ).

. Alkali , Resist Na ( Side Wall).

Na Ion . .

R - COO-Na+ + H2O R - COOH + NaOH . (4-22 ).

Na2CO3

1% resist . Resist Na2CO3 , .

b. Resist

resist . () PH .5-4-6. Etching

Etching

Etching Etching Resist - .

Fine Pattern Etching System (Etching + Process) . Etching (Etchant) .

1). Resist 2). , 3). ,

PCB Etching 2 , 2 , Alkali Etching - Etching .B. Etching

2

2 (CuCl22H2O) 2 .

2 .

Cu + CuCl2 2CuCl

Etching 2 1 (5-4-23, 24 ).

1 etching 1 .

. .

2CuCl + 2HCl + H2O2 2CuCl2 + 2H2O

2 .

A. B. etching C. ( 130g/l) D. Etching E. 2) 2 2(FeCl3) 40Baume( ) (FeCl3 = 37%, = 1.38) . . 2 Colloid() .

FeCl3 + 3H2O Fe(OH)3 + 3HCl

(5% ) . 2 .

Cu + 2FeCl3 CuCl2 + 2FeCl2

Cu + FeCl3 CuCl + FeCl2Cu + CuCl2 2CuClEtching FeCl3 + CuCl FeCl2 + CuCl2 2 .

- - Etching factor - Etching (2025/)- (4060g/l)- - Etching ( )

3) Alkali Etching (Alkaline Etchant) Ammonium () Alkali . Alkaline Etchant 5-4-7 .

5-4-7. Alkaline Etchant

Alkaline Etchant .

Cu + Cu(NH3)4Cl2 2Cu (NH3)2Cl

(I) Etching Tetra Ammonium (II) .

() Ammonium Ammonia Spray . .

4Cu(NH3)2Cl + 4NH4Cl + 4NH4OH + O2 4Cu(NH3)4Cl2 + 6H2O

Ammonium Ammonia Etching . Alkaline Etchant Solder resist resist .Alkaline Etchant .

- Etching solder, - Etching (3545/)- Etching factor - (135170 g/l), - - Ammonia - Sludge() - 4) - Etching

Etching . - Etching 5-4-8 .

5-4-8. - Etching 50wt%-H2O298wt%-H2SO4Cu10~12% by vol18~20% by vol22~45g/l - Etching .

Cu + H2O2 + H2SO4 CuSO4 + 2H2O

ion .

2H2O2 2H2O + O2 Etching . - Etching .

Etching (CuSO45H2O) Closed System Etching - - etching - Solder - Etching

5-4-7. Pattern Pattern Resist (2 ) Etching (Solder ) . 5-4-25 Pattern , Pattern , Solder .

5-4-25. Pattern A. Pattern pattern resist (:), , . pattern pattern , . pattern resist , resist . 1) resist . . , .2) Soft Etching Soft Etching Etching Pattern . Soft Etching .- - - - 3) Pattern Pattern Pattern . Panel .- - Rack control- - - - (, , , )- pattern pattern - resist - ,() pattern Pattern . . 5-4-9 .

4) Solder Solder , Control , Etching Solder .Solder () () () . Peptone Non-Peptone . Non- . Pb Free . 5-4-10 .

A. Alkali Resist Alkali Batch Type, () Counter, pH , Alkali () Over Flow . COD, BOD .

Alkali ( Lifting Point: L.P. ) 5-4-27, 5-4-28 . . resist () () resist . () () . , roll filter

. Alkali (5-4-29 ). . . . . Beaker Test .Alkali Vinyl(Vinyl Chloride) 50 . Zone SUS . Alkali .Alkali 5-4-30 .

5-4-30. Alkali 5-4-9.

PCB , Fine . Resist DFR . 30 DFR line/space 20/20 .

Mini-Via Hole PCB Mini-Via Hole DFR .

Pattern DFR .5-5. Solder Resist 5-5-1. Solder Resist Solder resist solder mask solder bridge - . Solder resist pattern - - .5-5-2. Solder resist Solder Resist - -Solder Resist 5-5-1 .

5-5-1. Solder Resist Solder Resist [PCB ()] [ ] [ ] [Solder Resist ] 4 . Screen [ ] [ ] . UV . (Photo Resist) [ ] (Screen - Curtain Coat - Spray Coat) . SR Mask Film . [ ] /UV . Screen - , . Solder Resist Solder Bridge . [ Resist] [] . .A. Screen (Screen Frame) stencil Ink Resist . Ink Gum Squeegee Ink . Screen 5-4-2 Ink Gum Squeegee Screen Stencil Silk Silk Screen . Ink , , , Ink . screen PCB .

5-5-2. Screen Screen 5-5-3 Solder Resist - . .1) Ink2) Screen frame: , Screen , Resist 3) Squeegee4) Screen

5-5-3. Screen 1) Ink Solder Resist . Mask . () Epoxy Resin Filler, (), Levelling , () . (5-5-4. ).- - (UV) UV Ink 135 10 Epoxy Resin () . Epoxy Resin Ink 1 2 . Ink . 1 Shelf Life () . Ink (Ir) Conveyer .

5-5-4. Ink UV Ink UV ink J(Joule) (: ) ink acryl() . UV ink 1 . Screen ink , , . screen ( , ) . ink Thixotropy . ink () filler , levelling 2) Screen Screen -- . Mask Pattern - . . Aluminium . Tension . Em . (--Ink ) . Nylon, Polyester, Stainless . , () Ink (Opening) . Mesh . 1-Inch . . , Mesh , . Solder Resist 180 Mesh 250 Mesh . Mesh ( 5-5-5. ).Screen . Mm Squeegee . Tension . Tension . Squeegee , . Tension (Gap) . - . Normal , Bias . Bias 22.5, 30, 45 .Screen () () Micron () . () Mesh .

5-5-5. Screen Polyester Mask .Screen ink Resist . Mask Film , . PVA(Polyvinyl Alcohol) (Diazo) . 5-5-6 , , . . Film , . () Film Screen , Resist Pattern .

5-5-6. , , 3) Squeegee Stencil Ink Squeegee Gum . Gum Polyurethane . Gum , Gum Blade (, ) . ''(-) D 60 90 . Solder Resist 70 . Pattern . Gum Ink (Monomer) () . Squeegee Gum . Sharp() . Gum Ink .4) , , . . . Pin CCD Camera . Mark PCB .C. , Solder Resist Pattern . Photo Resist Resist . Film Tack Free ( ) Dry Film Type Photo Resist Type . Alkali . Alkali Photo Resist .1) Dry Film Type Photo Resist ( 5-5-7)75, 100 Resist Film . Polyester Film Resist () Cover Film 3 . Dry Film Laminator Laminator Laminate . '' Resist . - Chamber Resist Film Laminate . Photo Resist Maker . Film Type Resist Via Through Hole Tenting .

5-4-7. Dry Film Resist Laminator 2) Photo ResistDry Film . '' . Photo Resist Mask Film Tack Free / Resist . Resist (/// ) . Resist / Solder Resist 2 . Resist '' (Open Mesh), Roll Coat, Curtain Coat, Spray Coat . (Screen ) '' . '' Mask Pattern . TH Solder Resist Resist . . . Resist Solder Resist .(Roll Coat) Roll Roll Solder Resist . Screen Solder Resist TH( TH) Solder Resist Line Speed .(Curtain Coat) ( 5-5-8 ) Solder Resist '' . Resist () Ink ( 5-5-11 ). Resist

5-4-8. Curtain Coater (Spray Coat) ( 5-5-9 5-5-10 )Solder Resist Ink Spray . Spray (1)Air Spray, (2)Airless Spray, (3)Bell Spray .Air Spray Solder Resist Ink Spray Nozzle . , () , .

Airless Spray Air Assist Airless Spray( ) Solder Resist Ink () . Assist Air Spray . Bell Spray Rotor() Solder Resist Ink . () . Shaping Air . Spray Coat . () Spray Air . Solder Resist Solder Resist .- Resist . Resist (Screen ,Roll Coat) . ( ) Solder Trap( ) . Solder Ball .- () Resist Resist () Resist Resist . () Pad Solder . Maker .- TH '' Resist Resist . Resist . Solder Resist . Resist .- Solder Resist Dam() Fine Pitch SMD Pad Solder Resist Dam .Photo Resist () . Solder Resist Dam (0.15Mm) Resist , Photo Resist Resist Solder Resist Dam () . .- Solder Resist Solder Resist () . Buff( ) , () , , Soft Etching () , . . Buff Overhang , () .5-5-3. Marking , , Pin . Screen . Marking Ink Solder Resist Ink . Ink . Marking , . , Screen . Via Hole . PCB .Marking Screen . Screen () . ink .5-6. (Finish)5-6-1. lead pitch pitch(2.540.05) PCB pitch PCB solder bridge wetting soldering , . . PCB .- Solderability Solder - Aging Solderability - Reflow Solderability - Flux - Cream Solder - - Pad - Migration 5-6-2. PCB HASL(Hot Air Solder Leveling) PCB , . HASL, OSP(Orgainc Solderability Preservatative) Coating Ni/Au , Pd , Ag .- HASL (Hot Air Solder Leveling) Solder Hot Air Pcb Pad Hole Solder Coating , Flux , Hasl Solder Cream Solder , Reflow Solder Bridge Pitch SMC . Multiple Soldering . 2004 (Eu Directive) Finish .- OSP (Organic Solderability Preservative) CoatingOSP Type OSP OSP . Type OSP Preflux , Rosin Ester Roll Coating, PCB CFC Flux . OSR Imidazole, Benzotriazole, Benzimidazole Pad Hole . Imidazole Benzotriazole OSP Reflow Mixed Surface Mount Technology .OSP Benzimidazole OSP Pad , Flux , Solderability .- Nickel/Gold , . PCB (TAB) . 0.31.27 35 Nickel . soldering Hot Solder Fine Pitch OSP soldering . Solder Bath 35% Gold Embrittle Solder Joint 0.2 . Soldering Soldering Nickel Nickel . Soldeing Nickel . Nickel Nickel (phosphor) 310% Solderability . . 2 . . Nickel 0.020.05 . . Immersion Gold . Electroless Gold 0.51.0 . Package Wire Bonding . Auto-Catalytic()- Gold Salt Cyan - DMAB SBH - - - Solder Mask - Gold Salt - THio, Ascorbic - - Substitution()- Golde Salt Cyan \Nickel 0.030.05 0.2 0.5 Nickel - 5-6-1.

Pd

. . .

Soldering Ni-P P() Au/Ni Nickel .

Hardness 250290HV Nickel (Copper) Key Pad . Immersion Gold Wire Bonding .

Gold 230 Solder Bath 3.0/sec Pd 0.35/sec . Ag

Ag 0.070.1 Organic Molecular Layer Migration .

, Aging Soldering , Flux Solder Paste , .

Organic Molecular Layer Migration .

Ag . , . (Immersion Tin)

Soldering . White Tin( Gray Tin) 1 Soldering .Cu6Sn5 Sn (White Tin)Cu0 + Sn+2Cu3Sn Sn (Gray Tin) Gray Tin White Tin .

White Tin Orano Metalic Film Coating (Ormecon) .

Process Hot Solder Fine Pitch 2 Reflow Solderability .6. ,

PCB , PCB .

PCB "" "" ") . - . .

. PCB - PCB . - .

3 .

-()- . 6-1 PCB . JIS [ ] JIS C 6486 (), . JPCA JPCA , [ ] JPCA-01 (PCB) ANSI IPC [ ] IPC-A-600 () ASTM [ ] JASTM D 635 () MIL [ ] MIL-STD-202 - UL [ ] UL-94 BS [ ] BS 9461 DIN [ ] DIN 40802 6-1. PCB

ISO IEC .[ ] IEC PUB-6 UL, IEC, JIS, JPCA, MIL . () () () () 6-1. ()

PCB . () . , . test probe () . fixture () - . 6-1-1 6-1-2 , 6-2 .Bare board .

(1) Fine pitch pad QFP footprint() pitch 0.5mm pitch, TCP lead pitch 0.25mm 0.2mm . fine pitch . (Camera ) probe pin (), gum .(2) bare board 100% probing . . bare board test .

(3) -, probe pin . lot - 100% . .

(4) CAD/CAM Data Link () data . Data Link AOI() .6-1-1. - ( , - ) , pin hole- () / clearance hole .

.

(6-1-3 ). CCD Camera Laser () . 2 .

PCB PCB CAD (6-1-4 ).6-2. '' . PCB solder resist , pad , , -, , marking , , , () delamination( ), , , , HAL solder , pit() . 2 . 6-19 6-3, 6-20 6-4, 6-21 6-5, 6-22 6-6, 6-23 (JIS C 5014) . feedback .