alcatel drie operation manual -...

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1 of 1 Alcatel 601E DRIE (Deep Reactive Ion Etcher) Operation Manual Description: The Alcatel 601E utilizes the Bosch process to provide deep etches into silicon substrates. With proper substrate preparation and handling the system can completely etch through the silicon. Current configuration is for 100 mm silicon wafers with a single flat. After a substrate has been manually loaded into the Loadlock all transfer and processing is completed under automatic computer control.

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Alcatel601EDRIE(DeepReactiveIonEtcher)OperationManual

Description:

TheAlcatel601EutilizestheBoschprocesstoprovidedeepetchesintosiliconsubstrates.Withpropersubstratepreparationandhandlingthesystemcancompletelyetchthroughthesilicon.Currentconfigurationisfor100mmsiliconwaferswithasingleflat.AfterasubstratehasbeenmanuallyloadedintotheLoadlockalltransferandprocessingiscompletedunderautomaticcomputercontrol.

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Safety:1. Beforeoperatingthistool,usersmustbetrainedandcertifiedbyLabstaff.2. MakesurethatasubstrateisloadedandtheVacuumLoadlocklidisdownbefore

startinganyprocess3. ARedAlarmstatuslightindicatesthesystemhas/hadaconditionthatmaynot

allowprocessing.Theusershouldusecautionuntilthecauseofthealarmisdetermined

4. IftheAlarmwillnotremainoffafteracknowledgingcontactthestaffatthephonenumberlistedbelow.

5. IfGreenOnstatusindicatorisoffandRedstopstatusindicatorisondonotattempttostart.DiscontinueusingthesystemandcontacttheNCNCstaff

EmergencyMachineOff(EMO)

UsetheEMOButtononlyifthereisasafetyhazardorserioussystemfailure.Ifthereiswateronthefloorbetweenyouandthesystemleaveandcontactthelabstaff.

1. PushRedEMO(EmergencyMachineOff)button2. CallNCNCstaff

a. LabPhone 2‐9831

EMOBUTTON

(GUI)Graphical

UserInterfacecandisplay

detailedSystem

Status

ControlButtonsandStatus

Indicators

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SystemOperation

InitialSystemChecks:

1. Checkthelogbooktoverifysystemcondition.IfsystemisdownandwasnotnotedintheNCNCmailpleasesendanE‐Mailupdatingthestaffandusergroup.

2. Notethealarmstatus.3. Verifythatsystemchambervacuumisinthex.x‐6mBarrange.4. Loadlockshouldbevented.5. OpenLoadlockandcheckforsubstrate.

GUI(GraphicalUserInterface)

1. ProvidesVideodisplayofControlComputerSensorandStatusinformation,functionwindowsanddatainputfields.

OpenLoadlock

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PrepareforEtching

1. SelectUserButtonusingTrackballandleftclickkey.(seeAppendix)

2. UsingTrackballandleftclickkeySelectLogintoopenLoginWindow.

UserButton

LoginButton

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3. UsingTrackballandKeyboardEnteryourusernameandpasswordthenclickOK.

4. UseTrackballtoopenAlarmscreenifactive.5. RecordanyalarmothertheHeaterstandbymessageintheLogbook.6. PleasenotifyDanHaskell4‐6587ofallalarmsotherthanHeaterstandby.7. AcknowledgetheAlarm(s).8. WaitoneminuteifAlarmremainsoff,systemcanbeusedforprocess.9. IfAlarmreturns,Logoffandplaceamachinedownnotificationonthesystem.

RecordthealarmmessagetextinthelogbookandE‐mailNCNCthatthesystemisdown.

10. IfnoactivealarmsarepresentopentheLoadlockandplacesubstratewithoneflatorientedtothelocatorscrews.

SubstrateLoaded

UserName

Password

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11. CloseLoadlockLidandproceed.

SelectRecipe

1. UsingTrackballselectGO!Process.

ClosedLoadlock

ProcessSelectionWindowButton

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2. UsingTrackballSelectthedropdownlist.3. ScrollthroughthelistandclickondesiredProcess.

4. EnableDatalogging“recommended”.

EtchSubstrate

1. SelectGO!RunbuttontostarttheProcess.2. ThescreenwillchangetotheProcessControldisplay.

BlueIndicatesSelectedProcess

Dataloggingshowndisabled

Run/StartButton

RecipeStepsofSelectedProcess

DropDownList

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3. SystemwillpumpdowntheLoadlockthentransportthewaferintotheProcessChamber.

4. MonitorHeliumflowandtemperatureforatleast2minutesbeforeleaving.Heliummayriseto10sccmatthebeginningofthestepbutshouldsettletobelow3sccminthefirstminuteofflow.HeliumFlowsover3sccmcancauseprocessshifts.ThesystemshouldgenerateaWarningandanAlarmthatshouldhaltprocessiftheHeliumflowsexceed10sccm.

5. ObservetheProcessControlscreenforatleast2minutesbeforeleavingthesystem.6. VerifythatsensordisplaysarereachingrecipeSetpointsandnoAlarmshave

occurred.

Processelapsedtime

HeliumFlowSensorValue

CurrentStepField

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AfterEtchisComplete

1. WhenallprocessstepsarecompletethesystemwillplacethesubstrateintheLoadlock.TheLoadlockisventedtoAtmospherethenanEndofprocesswindowwillbedisplayed.

2. OpenLoadlockandremovesubstrate.3. Inspectthesubstratefordamage.Ifanybreakageorpiecesaremissingdiscontinue

usingthesystem.Logoffandplaceasystemdownnotificationonthesystem.SendE‐mailnotificationtoNCNCgivingthesystemstatus.

4. CloseEndofProcessWindow.5. IflastwaferLogoff.6. CloseLoadlocklidbeforeleavingsystem.7. UpdateLogbook.

CloseEndofprocessbutton

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APPENDIX:

Trackball:

1. M1isequivalenttoLeftMouseButton.2. M3isequivalenttoRightMouseButton.3. RollingTrackballshouldmoveindicatorarrowonscreen.

FrontControlPanel:

1. StopButton(RedIndicator)lampshouldbeoff.Donotpressbutton,unusedduringnormaloperation.

2. StartButton(greenindicator)shouldbeonduringnormaloperation.IfGreenindicatorisoffdonotattempttorestartsystem.

3. EmergencyStopPushbutton.OnlyusedinEmergenciesremovesElectricalpowerfromthesystem.

4. AlarmIndicator(Red)activewhensystemisnotreadytorunaprocess.

M1

M3

Trackball

EmergencyStop

Pushbutton

StartButton(GreenIndicator)

StopButton(RedIndicator)

AlarmIndicator

(red)

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UserInterfaceSystemScreen:

1. RedindicatesInactiveorClosed.GreenindicatesActiveorOpen.2. TimeandDatefieldsareactiveonallpages.3. LoadlockPressuredisplay.OnlyattempttoopenwhendisplayreadsAtm.4. SourceRFStatusfielddisplayspowerdeliveredvs.powerreflected.5. ProcessChamberHighVacuumSensordisplayssystembasepressure.During

processtheassociatedIsolationValvewillcloseandthesensordisplaygoestooff.

LoadlockPressure

TimeandDateDisplay

SourceRF

StatusDisplay

ProcessChamberHigh

VacuumSensorDisplay

ProcessChamberHighVacuum

SensorIsolationValve

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6. LoadlockhasnoLidclosedorwaferpresentsensors.7. ManometerSensorFielddisplaysChamberpressureduringProcesssteps.8. VATValvecanisolatethechamberormovetocomputercontrolledpositionto

varychamberpressure.9. LoadlockTurboPumpStatusDisplayGreenindicatesonandatoperatingspeed.

ThistypicallywillgoRedbrieflyduringLoadlockpumpdown.10. LoadlockRoughingPumpGreenindicatesonandproperpressurelevelto

supporttheTurboPump.11. SubstrateHolderRFStatusfielddisplayspowerdeliveredvs.powerreflected

andBiasvoltagedeveloped.

VATValve

LoadlockRoughing

PumpStatusDisplay

LoadlockTurboPumpStatusDisplay

SubstrateHolderRF

PowerStatusField

LoadlockManometerSensor

Field

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12. WaferIcondisplayslastexpectedplacementposition.WhensystemisinidlemodeWaferIconisshowninLoadlock.

13. ProcessTurboPumpstatusDisplayshouldremainGreen.DuringnormaloperationRedisanAlarmcondition.

14. TurboNitrogenValveisonlyopenedusedduringmaintenance.15. ProcessTurboPumpIsolationvalveshouldremainopen(Green)duringnormal

operation.16. Processchamberroughingpumpprovidesroughvacuumpumpingduring

systemstartup.TypicallythechamberroughpumpprovidesexhaustvacuumfortheProcessTurbopump.

WaferIconshownasYellowRectangle

ProcessChamberTurboPumpStatusDisplay

ProcessChamberTurboPumpIsolationValve

ProcessChamberRoughingPumpStatus

Display

TurboNitrogenValve

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17. LowerSubstrateHolderVacuumValvecontrolsVacuumsupplytoLowerSubstrateHolderAssembly

18. HeVacuumValveactivatestopumpHeliumfrombacksideoftheSubstratebeforeclampisreleased.

19. ProcessChamberTurboBypassValveonlyusedduringmaintenance.20. SubstrateHolderTemperatureSensorDisplay21. HeSupplyValvedeliverstheMassFlowControlleroutputtotheBacksideofthe

substrate

HeSupply

Valve

LowerSubstrateHolder

VacuumValve

HeVacuumValve

ProcessChamber

TurboBypassValve

SubstrateHolder

TemperatureDisplay

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22. LoadlockN2valve.SuppliesN2duringLoadlockventtoAtmosphere.23. LoadlockVacuumValveusedtopumpLoadlockforsubstrateVacuumtransport.

Valveisclosed(red)whenLoadingorUnloadingLoadlockatatmosphericpressure.

24. HeMFC(MassFlowController)displaysHeflow.IfHeflowreadingsexceed3sccmexpectprocessshifts.Flowsabove10sccmshouldgenerateawarningoralarm

25. HePressuresensor.NormalpressureshouldmatchrecipeSetpointof1.0E‐1mBar.

LoadlockN2Valve

LoadlockVacuumValve

HeMFC(MassFlowController)Flowdisplay

HePressureSensorDisplay

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26. MachineOperatingMode,shouldalwaysbeinLocal.27. ProcessLibraryisassignedtouserlistedhere.28. UserLogDisplayliststheUserthatispresentlyloggedin.29. CommunicationstatusdisplaysstatusofthelinkbetweentheUserinterfaceand

the(PLC)SystemControlComputer

Machine

OperatingMode

ProcessLibrary

UserLog

Display

Communication

Status

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ProcessStatusScreen:

1. PumpingStatusField.TrianglesshouldremainGreenindicatingpumpsareonduringprocesssteps.

2. Elementarymoves.RedindicatestheRobothascompletedthesubstratemovementindicatedbythetext

3. ProcessStatusField.YellowTriangleindicatesactivesystemcontroltomatchRecipestepvalues

4. ThermalizationStatusField.YellowTriangleindicatesactivesystemcontroltomatchRecipeSetpoints.ThermalizationSetpointsremainactiveafterstepiscompleteuntilfinishofprocessrecipe.

5. TemporizationStatusField.RedTriangleindicatesthestepDuration(timerhascompleted).

PumpingStatusElementaryMovesStatus

ProcessStatusField

TemporizationStatusField

ThermalizationStatusField

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6. ProcessPressure.TurquoiseFieldindicatessensorvalue.ThispressureisaresultoftheVATvalvepositionandtheamountofgasflowingintotheprocesschamber.ExpecttoseevaryingvaluesduringtheBoschEtchProcess.

7. RecipeGasFlowSetpointsaredisplayedinYellowfields.8. GasFlowSensorDisplaysareTurquoise.9. RFreflectedpowerdisplay.Boschprocesschangesvariablesfasterthansystem

canrespond.Varyinglevelsarenormal.10. SubstrateVoltage.ThisvoltagevarieswithSubstrate,RFpower,Chamber

pressureandGas

ProcessPressure

RecipeGasFlowSetpoints

GasFlowSensorDisplay

SubstrateVoltage

RFreflectedpowers

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11. StopProcessbutton.Abortsallprocessstepsthenremoveswaferimmediatelyfromthechamber

12. Step.HaltsstepinprogressandstartsnextstepintheRecipe.13. Step(resume).ResumesastopduetoanAlarm.Resumesastepthatwasbeing

held.14. Step(hold).TherecipeprocesstimeorDurationSetpointisignored.Thesystem

willcontinueruntheactivestepwithnoregardtotimeelapsed.Becarefulifthisbuttonispushedduringaprocessstepdon’tleavesystemunattended,itwillcontinuetoetch.

Step

(hold)

Step

(resume)

StepStop

Process